JP2002026592A - Mounting device and mounting method for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device and mounting method for electronic parts capable of enlarging an application scope of a concurrent transfer of a plurality of parts to enhance mounting efficiency. SOLUTION: In a mounting method for electronic parts for concurrently picking up electronic parts P1, P2 by a transfer head provided with a plurality of nozzles 6b from a supply part of electronic parts to transfer them to a substrate, a pitch difference ΔP between a nozzle pitch Pn and a part pitch Pp is weighted based on allowable offset values d1, d2 indicating a position slippage amount allowable for each electronic part and is distributed to ΔP1, ΔP2, and then the transfer head is positioned. Thus, the pitch difference can rationally be distributed based on the allowable offset value of each part, and an application scope of a concurrent transfer of a plurality of parts can be enlarged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting electronic components on a substrate.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus, a transfer head is used to transfer electronic components from an electronic component supply unit in which a tape feeder for storing the electronic components in a taped state and a tray in which a large number of electronic components are stored on a plane are arranged. The components are picked up and transferred to the board. In recent years, due to a demand for improvement of mounting efficiency, a transfer head is provided with a plurality of component holding units such as suction nozzles, and a plurality of electronic components are simultaneously mounted in one mounting turn operation in which the transfer head makes one reciprocation between a supply unit and a substrate. Transport methods have been used. In this method, the arrangement pitch of the electronic components in the supply unit (hereinafter abbreviated as “component pitch”) and the arrangement pitch of the component holding units such as the nozzles of the transfer head (hereinafter abbreviated as “nozzle pitch”) match. Need to be.

However, in a general-purpose mounting apparatus for mounting various types of electronic components, the component pitch and the nozzle pitch often do not always completely match, so that the pickup operation is not hindered. A slight difference in pitch may be regarded as an allowable range, and the nozzle and the electronic component may be picked up without being completely aligned. In this case, conventionally, the transfer head is aligned with respect to one electronic component ignoring the pitch difference, or the position is corrected after equally distributing the pitch difference to each electronic component to correct the position. A method of performing pickup by a mounting head has been used.

[0004]

However, the above-described conventional method has the following disadvantages. That is, the electronic components that are simultaneously transferred are not necessarily the same type, and electronic components of different types may be picked up in a parallel state. If the type of electronic component is different, the value of the pitch difference allowed during the pickup operation is also different. For this reason, when the positioning is performed with one electronic component as a reference as described above, the pitch difference is allotted to the other electronic component. When the pitch difference is equally divided, the pickup of the electronic component having the stricter tolerance is unstable.
As described above, heretofore, in many cases, the simultaneous transfer of a plurality of parts has to be abandoned due to the pitch difference in many cases, and the application range is limited.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus and a mounting method capable of expanding the applicable range of simultaneous transfer of a plurality of components and improving mounting efficiency.

[0006]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for picking up and holding an electronic component from an electronic component supply unit by a component holding unit of a transfer head, and mounting the electronic component on a substrate. A mounting apparatus, comprising: a supply unit that supplies a plurality of electronic components in a juxtaposed state to a pickup position of the transfer head; and a plurality of component holding units that hold the electronic components, and a plurality of electronic components are simultaneously picked up from the supply unit. A transfer head for holding the electronic component at the pickup position, a pitch storage unit for storing pitch data indicating data of an arrangement pitch of the electronic components at the pickup position, and data of an arrangement pitch of the component holding unit, and a pick-up operation performed by the component holding unit. Offset data recording that stores permissible offset data indicating the permissible displacement between the component holder and the electronic component for each electronic component. And parts, and control means for controlling the position of the transfer head when the electronic component pick-up on the basis of the allowable offset data and the pitch data.

According to a second aspect of the present invention, there is provided a method of mounting an electronic component, wherein the electronic component is picked up from a supply section of the electronic component by a component holding section of a transfer head, held, and mounted on a substrate. A step of supplying a plurality of electronic components to the pickup position of the transfer head in a side-by-side state in the supply unit; and a step of simultaneously transferring the plurality of electronic components from the pickup position of the supply unit by a transfer head including a plurality of component holding units. Picking up and holding, and moving a transfer head to transfer a plurality of electronic components to a substrate, wherein in the pick-up operation of the electronic components by the component holding unit, the arrangement of the electronic components at the pickup position The data of the pitch and the arrangement pitch of the component holding units in the transfer head, and the allowable displacement between the component holding unit and the electronic component are shown. And to control the position of the transfer head when the electronic component pick-up on the basis of the volume offset data.

According to the present invention, in the pick-up operation of the electronic component by the component holding unit, data of the arrangement pitch of the electronic component at the pickup position and the arrangement pitch of the component holding unit in the transfer head, the component holding unit and the electronic component, The pitch difference can be rationally distributed based on the allowable offset value of each component by controlling the position of the transfer head at the time of picking up the electronic component based on the allowable offset data indicating the allowable displacement of the component. Thus, the applicable range of simultaneous transfer of a plurality of parts can be expanded.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a partial cross-sectional view of an electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment, and FIG. 4 is an explanatory diagram of a pickup operation of the electronic component mounting method according to one embodiment of the present invention.

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In the center of the base 1 in FIG.
A transport path 2 is provided. The transport path 2 transports the substrate 3 and positions the substrate 3 at the electronic component mounting position. On both sides of the transport path 2, supply units 4 for electronic components are provided. A large number of tape feeders 5 are arranged in the supply section 4. The tape feeder 5 supplies the electronic component to the pickup position 5a. That is, in the supply unit 4, a plurality of electronic components are supplied to the pickup position of the transfer head in a juxtaposed state.

On both side ends of the upper surface of the base 1, Y-axis tables 8A and 8B are arranged in parallel.
An X-axis table 7 is installed on A and 8B. A transfer head 6 is mounted on the X-axis table 7, and by driving the X-axis table 7 and the Y-axis tables 8A and 8B, the transfer head 6 moves horizontally, and the chip moves from the pickup position 5a of the tape feeder 5 to the chip. Is picked up and mounted on the substrate 3. During the operation from the pickup to the mounting, the chip held by the nozzles of the transfer head 6 is imaged from below by the camera 9, and the amount of displacement of the transfer head 6 with respect to the nozzles is detected.

As shown in FIG. 2, the transfer head 6 is a multi-type transfer head provided with a plurality (two in this embodiment) of unit transfer heads 6a. The nozzle 6b of each unit transfer head 6a sucks and holds an electronic component. Therefore, the nozzle 6b of the unit transfer head 6a serves as a component holding unit, and the transfer head 6 picks up and holds a plurality of electronic components from the supply unit 4 at the same time.

Here, the arrangement pitch Pn of the nozzles 6b of the unit transfer head 6a is equal to the arrangement pitch Pp of the tape feeder 5.
When the transfer head 6 picks up a plurality of electronic components, a displacement occurs between the nozzle 6b of the transfer head 6 and the electronic components.

Next, the control system will be described with reference to FIG. In FIG. 3, a CPU 10 is an overall control unit, and performs operation control and calculation of each unit described below according to various programs stored in a program storage unit 11. The program storage unit 11 stores programs necessary for various operations and processes. The data storage unit 12 stores mounting data such as the type of chip mounted on the substrate 3 to be mounted and mounting coordinate data, and also includes a pitch storage unit 12a and an offset data storage unit 12b. Pitch storage unit 1
2a is the data of the arrangement pitch of the electronic components at the pickup position and each unit transfer head 6 in the transfer head 6.
The pitch data indicating the data of the arrangement pitch of the nozzles 6b is stored. The offset data storage unit 12b stores, for each electronic component, allowable offset data indicating an allowable displacement between the nozzle 6b and the electronic component in the pickup operation by the nozzle 6b of the unit transfer head 6a.

The motor drive unit 13 includes the X-axis table 7,
The X-axis motor 16, the Y-axis motor 17, and the Z-axis motor 18 provided on the axis table 8A and the vertical movement table (not shown) of the transfer head 6 are driven. Image recognition unit 14
Detects the position of the electronic component held by the nozzle 6b of the transfer head 6 by performing image processing on the image data captured by the camera 9, and determines the relative displacement of the electronic component with respect to the nozzle 6b. Ask.

The correction amount calculating section 15 includes a pitch storing section 12a.
Based on the pitch data and the offset data stored in the offset data storage unit 12b and the offset data, an alignment correction amount for appropriately distributing the positional deviation caused by the difference between the nozzle pitch and the component pitch to each electronic component is calculated. . When picking up electronic components, the CPU 10
Performs the positioning of the transfer head based on the positioning correction amount. That is, the correction amount calculation unit 15 and the CPU 1
Numeral 0 is control means for controlling the position of the transfer head at the time of picking up the electronic component based on the pitch data and the allowable offset data.

The electronic component mounting apparatus is configured as described above, and the operation will be described below with reference to the drawings. In FIG. 1, a tape feeder 5 that supplies two different types of electronic components P1 and P2 is arranged adjacent to a supply unit 4, and the electronic components P1 and P2 are supplied in a side-by-side state at a pickup position 5a. (See FIG. 4). Thereafter, the mounting operation is started according to the mounting operation sequence. After the mounting operation starts, these electronic components P1, P2
Are simultaneously picked up by the two nozzles 6 b of the transfer head 6 and transferred to the substrate 3.

Prior to the pickup operation, the correction amount calculating section 15 calculates a position correction amount. That is, the pitch data and the offset data are read from the pitch storage unit 12a and the offset data storage unit 12b, the position correction amount is calculated by the following method, and then the pickup operation is performed.

This alignment correction will be described with reference to FIG. FIG. 4 shows two different electronic components P1 and P2 which are arranged next to each other and which are connected to two unit transfer heads 6a.
3 shows a state in which pickup is performed simultaneously by the nozzle 6b. FIG. 4A shows a state in which one nozzle 6b is aligned with the electronic component P1, and the component pitch P
p and the nozzle pitch Pn, the pitch difference ΔP (| P
p-Pn |).

The positioning of the transfer head 6 and the electronic components P1 and P2 when such a pitch difference ΔP exists will be described. FIG. 4B shows a state in which the pitch difference ΔP is divided into two positional deviation amounts ΔP1 and ΔP2. Here, a weighting coefficient is calculated based on an allowable offset value indicating an allowable positional deviation amount as a reference for distribution. , The pitch difference is multiplied by this weighting coefficient to determine the distribution amount. That is, when the pitch difference | Pp-Pn | is divided and assigned to two electronic components, the pitch difference is assigned to the electronic components of a type in which the positional deviation is allowed to be large to that extent.

Next, a calculation example of the weighting coefficient used here will be described. Assuming that the allowable offset values for the electronic components P1 and P2 are d1 and d2, the weighting factors n1 and n2 for the electronic components P1 and P2 are d1 / (d
1 + d2) and d2 / (d1 + d2). The amount obtained by multiplying these weighting factors by the pitch difference is used as the positional deviation amount ΔP1,
It corresponds to ΔP2. Of course, the condition that the simultaneous pickup is possible is that the displacement amounts ΔP1 and ΔP2 obtained in this way are smaller than the respective allowable offset values d1 and d2.

When picking up these electronic components P1 and P2, each nozzle 6b and electronic components P1 and P2 are picked up.
2 is the calculated positional deviation amount ΔP1, ΔP
The X-axis table 7 and the Y-axis tables 8A and 8B are controlled by the CPU 10 so as to be 2.

That is, according to the above-described method, the probability that the pitch difference between the nozzle 6b and the electronic component exceeds the allowable positional deviation amount of each electronic component and the occurrence of a malfunction at the time of pickup can be minimized. Can be applied simultaneously. In the present embodiment,
Although an example in which electronic components in a juxtaposed state are picked up from a tape feeder 5 arranged in parallel with the supply unit 4 is shown,
The form of the supply unit is not limited to this, and any form may be used as long as a plurality of parts are supplied in a juxtaposed state.

In the above embodiment, the component pitch Pp
However, in reality, even when tape feeders of the same type are arranged in parallel, there is a gap between the arrangement pitch on the drawing and the actual pickup position due to the unique instrumental difference of each tape feeder. Causes an error. Since this error can be handled as a unique value for the same tape feeder, this unique positional deviation amount is stored for each tape feeder, and the transfer head 6
If the position correction taking into account the amount of positional deviation is performed at the time of the position adjustment, the position adjustment can be performed with higher accuracy, and the trouble at the time of pickup can be further reduced.

Further, in the above embodiment, the example of the nozzle 6b for sucking and holding the electronic component by vacuum suction is shown as the component holding unit for holding the electronic component, but the component is held by mechanical chucking. There may be.
Even in this case, the occurrence of a pick-up error can be reduced by keeping the amount of displacement during chucking within the allowable range.

[0026]

According to the present invention, in the pick-up operation of the electronic component by the component holding unit, the data of the arrangement pitch of the electronic component at the pickup position and the arrangement pitch of the component holding unit in the transfer head, the component holding unit and the electronic device. Since the position of the transfer head at the time of electronic component pickup is controlled based on the allowable offset data indicating the allowable positional deviation amount with the component, the pitch difference is rationally distributed based on the allowable offset value of each component. And the applicable range of simultaneous transfer of a plurality of parts can be expanded.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 4 is an explanatory diagram of a pickup operation of the electronic component mounting method according to one embodiment of the present invention;

[Explanation of symbols]

 3 Substrate 4 Supply unit 5 Tape feeder 6 Transfer head 6a Unit transfer head 6b Nozzle 10 CPU 12a Pitch storage unit 12b Offset data storage unit 15 Correction amount calculation unit

Claims (2)

[Claims] An electronic component mounting apparatus for picking up an electronic component from a supply portion of the electronic component by a component holding portion of a transfer head, holding the electronic component, and mounting the electronic component on a substrate. A supply unit that supplies a pickup position of a mounting head, a transfer head that includes a plurality of component holding units that hold electronic components, and simultaneously picks up and holds a plurality of electronic components from the supply unit; A pitch storage unit that stores arrangement pitch data and pitch data indicating data of an arrangement pitch of the component holding unit, and an allowable offset indicating an allowable displacement between the component holding unit and the electronic component in a pick-up operation performed by the component holding unit. An offset data storage unit for storing data for each electronic component, and an offset data storage unit based on the pitch data and the allowable offset data. Mounting apparatus of electronic components, characterized in that a control means for controlling the position of the transfer head when the electronic component pick-up Te. 2. A method of mounting an electronic component, wherein the electronic component is picked up from a supply unit of the electronic component by a component holding unit of a transfer head, held, and mounted on a substrate, wherein a plurality of electronic components are juxtaposed in the supply unit. Supplying the electronic component to the pickup position of the transfer head in a state, picking up and holding a plurality of electronic components from the pickup position of the supply unit at the same time by using a transfer head having a plurality of component holding units; Moving the head to transfer a plurality of electronic components to the substrate, wherein in the pick-up operation of the electronic components by the component holding unit, the arrangement pitch of the electronic components at the pickup position and the component holding unit of the transfer head. Based on the arrangement pitch data and the allowable offset data indicating the allowable positional deviation amount between the component holding unit and the electronic component, Mounting method of electronic components and controlling the position of the transfer head when goods pickup.