JP4515350B2 - Electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.

  In an electronic component mounting apparatus, a large number of parts feeders such as a tape feeder are provided, and in these parts feeders, a plurality of types of electronic components are supplied to a pickup position by a transfer head. When the production target product is switched, the parts feeders are rearranged and exchanged with other parts feeders.

  Arrangement operations such as rearrangement and replacement of the parts feeders have been performed according to feeder arrangement data created in advance prior to the conventional product type switching. This feeder arrangement data indicates the relationship between the type of electronic component stored in each part feeder and the part feeder arrangement. For this reason, in the parts feeder arrangement work, the operator needs to install the specified parts feeder at the specified position of the supply unit in accordance with the feeder arrangement data created in advance. It took time and effort. When there is an arrangement mistake in the arrangement work, there is a problem that an adsorption error or a mounting error may occur.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting method capable of easily arranging parts feeders and reducing suction errors and mounting errors.

The electronic component mounting method according to claim 1 is a mounting method of an electronic component that picks up an electronic component by a transfer head from a parts feeder arranged in parallel in a supply unit of the electronic component and mounts the electronic component on a substrate. A process for mounting each part feeder at an arbitrary position in the supply unit based on the type of electronic components required for mounting on the mounting target board during the setup change work accompanying the product type switching, and a part feeder by mounting the part feeder. The process of reading feeder data from the provided storage device, and the type of electronic parts stored in the parts feeder attached to the supply unit based on the read feeder data and the arrangement position of the parts feeder in the supply unit The data generation process, the generated feeder arrangement data, and the electronics required for mounting on the mounting target board A process of performing mounting work based on a mounting operation sequence created from mounting data that is the type of product and mounting coordinate data, and positional deviation of electronic parts unique to each parts feeder at the pickup position included in the read feeder data And a step of correcting the position of the transfer head based on the amount.

  According to the present invention, parts data representing the types of electronic parts stored in the parts feeder are stored in each part feeder, and the parts feeder is automatically generated by reading the parts data and arranging the parts feeder. It can be mounted at an arbitrary position, and the efficiency of arrangement work and the prevention of problems due to arrangement mistakes are realized.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of a control system of the electronic component mounting apparatus, and FIG. 3 is a flowchart of the electronic component mounting method. It is.

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed at the center of the base 1. The conveyance path 2 conveys the board 3 and positions the board 3 at the electronic component mounting position. On both sides of the conveyance path 2, electronic component supply units 4 are provided. The supply unit 4 is provided with a large number of tape feeders 5 which are parts feeders. The tape feeder 5 supplies chips as electronic components to the pickup position 5a. These tape feeders 5 are individually provided with a storage device 5b. As will be described later, each tape feeder stores feeder data such as a chip type and a learning value of a chip position shift amount unique to each tape feeder at the pickup position 5a. ing. Therefore, the storage device 5b of the tape feeder 5 is a component data storage means.

  A Y-axis table 8A and a slide guide 8B are arranged in parallel on both ends of the upper surface of the base 1, and an X-axis table 7 is installed on the Y-axis table 8A and the slide guide 8B. A transfer head 6 is mounted on the X-axis table 7, and the transfer head 6 moves horizontally by driving the X-axis table 7 and the Y-axis table 8 A, and picks up a chip from the pickup position 5 a of the tape feeder 5. And mounted on the substrate 3. During the operation from the pickup to the mounting, the chip picked up and held by the nozzle of the transfer head 6 by vacuum suction is imaged from below by the camera 9, and the amount of positional deviation with respect to the nozzle of the transfer head 6 is detected. The

  Next, the control system will be described with reference to FIG. In FIG. 2, a CPU 10 is an overall control unit, and performs operation control and calculation of each unit described below according to various programs stored in the program storage unit 11. The program storage unit 11 stores programs necessary for various operations and processes. The mounting data storage unit 12 stores mounting data such as the type of chip mounted on the substrate 3 to be mounted and mounting coordinate data. The feeder arrangement data storage unit 13 stores feeder arrangement data that associates the types of chips stored in the tape feeder 5 mounted in the supply unit with the arrangement position of the tape feeder 5 in the supply unit 4. The learned value storage unit 14 stores, for each tape feeder, a learned value of the amount of misalignment that occurs when a chip is picked up from each tape feeder 5, that is, the amount of misalignment of the chip unique to each tape feeder 5.

  The feeder arrangement data generation unit 15 automatically generates feeder arrangement data by associating the chip type data read from each tape feeder 5 with the mounting position of each tape feeder. The generated feeder arrangement data is stored in the feeder arrangement data storage unit 13.

  The learning value calculator 16 is a chip unique to each tape feeder at the pickup position based on the positional deviation amount data obtained by recognizing the image picked up by the camera 9 with the chip picked up from each tape feeder 5. The learning value of the amount of misalignment is calculated. The learned value obtained here is stored in the learned value storage unit 14 as data for each tape feeder 5.

  The motor drive unit 17 drives the X-axis motor 18, the Y-axis motor 19, and the head Z-axis motor 20 provided on the X-axis table 7, the Y-axis table 8 A, and the vertical movement table (not shown) of the transfer head 6. To do. The image recognition unit 21 detects the position of the chip held by the nozzle of the transfer head 6 by performing image processing on the image data captured by the camera 9, and calculates the relative positional deviation amount of the chip with respect to the nozzle. Ask.

  The data writing unit 22 and the data reading unit 23 write data to the storage device 5b provided in the tape feeder 5 attached to the supply unit 4 and read data from the storage device 5b. The feeder data written / read here is the above-described chip type data and learned value data of the amount of chip position deviation at the pickup position.

  The electronic component mounting apparatus is configured as described above, and the operation will be described along the flow of FIG. First, in the mounting operation, a setup change operation accompanying the product type change is performed, and the supply unit 4 rearranges the tape feeder 5 (ST1). At the time of this rearrangement, each tape feeder is mounted based only on data indicating the chip type necessary for mounting on the mounting target board. That is, the operator does not need to consider the mounting position in the supply unit 4 of the tape feeder that stores the chip type, and it is only necessary to mount the tape feeder in any order.

  By mounting the tape feeder, from the storage device 5b of each tape feeder 5, the data reading unit 23 causes the feeder data of each tape feeder, that is, the chip type stored in the tape feeder and the pick-up position of the tape feeder. The learning value of the specific positional deviation amount is read (ST2). The read chip type data is sent to the feeder arrangement data generation unit 15, where the feeder arrangement data is automatically generated (ST3). Thereby, each tape feeder 5 in the supply unit 4 is associated with the chip type, and a mounting operation sequence by the transfer head 6 is created by the CPU 10 based on the feeder arrangement data and the mounting data described above.

  Next, the mounting operation is started according to the created mounting operation sequence (ST4). At the start of the mounting operation, the position of the transfer head 6 at the time of pickup is corrected based on the learning value read from each tape feeder 5, and the chip picked up from the tape feeder 5 for each mounting operation is further captured by the camera 9. Recognizing and detecting the amount of misalignment of the chip with respect to the nozzle (ST5). Then, based on the position shift detection result, the learning value of the position shift amount is updated. That is, the learning value storage unit 14 always stores the updated learning value, and the position correction at the time of pickup is performed based on the learning value.

  If a part break occurs during the mounting operation (ST7), the learning value at that time is stored by the data writing unit 22 in the storage device 5b of the tape feeder 5 where the part break occurs (ST8). Thereby, the tape feeder 5 always stores the latest learning value. Then, the tape feeder 5 whose parts are cut is replaced with a new tape feeder 5. Thereafter, returning to ST2, the feeder data is read from the new tape feeder 5, and the same processing as described above is performed.

  Further, while the mounting is continued without causing any parts to be cut off, it is determined whether or not the scheduled mounting operation is completed (ST10). If the mounting is continued, the process returns to ST5 and the same mounting operation is continued. If the mounting is completed, the learning value at that time is stored in each tape feeder 5 of the supply unit 4 to update the learning value (ST11), and then the mounting operation is terminated. As a result, the tape feeder 5 always stores the updated learning value, and when the mounting operation is resumed next time, even when the tape feeder 5 is mounted on another mounting apparatus, the learning value unique to each tape feeder is stored. Can be read by the mounting apparatus. As a result, the mounting device can correct the position at the time of pick-up using this learning value, which greatly reduces problems such as pick-up mistakes caused by position shifts that occurred when switching the product type in the conventional mounting device. Can be reduced.

  According to the present invention, the part data representing the type of electronic parts stored in the parts feeder is stored in each part feeder, and the feeder arrangement data is automatically generated by reading this part data. In the feeder arrangement work, the operator only needs to mount the parts feeder at an arbitrary position, which can improve the efficiency of the arrangement work and eliminate errors due to arrangement errors, and is useful as a mounting method for mounting electronic components on a substrate. .

The top view of the mounting device of the electronic component of one embodiment of the present invention The block diagram which shows the structure of the control system of the mounting device of the electronic component of one embodiment of this invention The flowchart of the electronic component mounting method of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Substrate 4 Supply part 5 Tape feeder 5b Storage device 6 Transfer head 9 Camera 10 CPU
13 Feeder Arrangement Data Storage Unit 15 Feeder Arrangement Data Generation Unit 22 Data Writing Unit 23 Data Reading Unit

Claims (1)

An electronic component mounting method in which electronic components are picked up by a transfer head from a parts feeder arranged in parallel in the electronic component supply unit and mounted on a substrate. Mounting each part feeder at an arbitrary position of the supply unit based on the type of electronic component required for mounting, and loading the feeder data from a storage device provided in the part feeder by mounting the part feeder ; Generating the feeder arrangement data by associating the type of electronic component stored in the parts feeder mounted on the supply unit with the arrangement position of the parts feeder in the supply unit based on the read feeder data, and the generated feeder This is the placement data and the types of electronic components and mounting coordinate data required for mounting on the mounting target board. A step of performing a mounting operation based on a mounting operation sequence created by the mounting data, and a position of the transfer head based on a positional deviation amount of each electronic component specific to each parts feeder at the pickup position included in the read feeder data An electronic component mounting method comprising a step of performing correction.

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