JP6660524B2 - Component mounting device and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a board.

  The component mounting apparatus picks up the components housed in the pocket of the carrier tape that is pitch-fed by the tape feeder by suctioning them with a suction nozzle provided on a mounting head, and transfers the components to a substrate held at a mounting position. The component take-out position of the component that is pitch-fed by the tape feeder may shift when the tape feeder is replaced or a carrier tape is supplied. Therefore, when replacing the tape feeder, etc., the position of the pocket fed by the camera provided integrally with the mounting head is recognized from above, and the suction target position of the suction nozzle when suctioning the component at the component removal position. Is corrected, so-called teaching is performed (for example, see Patent Document 1).

  Some component mounting apparatuses include two sets of a component supply unit that supplies components by a plurality of tape feeders mounted in parallel, and two sets of mounting heads, each of which can independently mount components on a board. (See, for example, Patent Document 2). In such a component mounting apparatus, while the teaching is performed by one mounting head, the component mounting can be continued by the other mounting head.

JP, 2015-211055, A JP 2012-59798 A

  By the way, in the component mounting apparatus, vibration occurs due to the movement of the mounting head, and the magnitude (amplitude) of the vibration changes depending on the pattern in which the mounting head moves. However, in the component mounting apparatus of Patent Literature 2, when teaching is performed by one mounting head in a state where component mounting is continued by the other mounting head and large vibration is generated, the position of the pocket is erroneously recognized. There has been a problem that the suction target position may not be properly corrected.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can appropriately correct a suction target position at which a suction nozzle suctions a component in accordance with vibration generated in the component mounting apparatus. And

  In the component mounting apparatus of the present invention, a carrier tape having a pocket for storing a component is pitch-fed by a tape feeder, and the component stored in the pocket fed to a component pick-up position is suction-held by a suction nozzle. A component mounting apparatus for mounting on a board, wherein a pocket image pickup means for picking up an image of the pocket pitch-fed to the component pick-up position, and an image picked up by the pocket image pick-up means, wherein the pitch pick-up is performed to the component pick-up position. The suction target position calculation unit that calculates a suction target position that is a target at which the suction nozzle sucks the component housed in the pocket, and the calculation of the suction target position by the suction target position calculation unit are performed by the imaging. Whether to execute the first teaching calculated from one image, or to execute the plurality of captured images A teaching function setting unit that switches and sets whether to execute the second teaching calculated based on a predetermined statistical process, the position of the pocket that has been pitch-fed to the component take-out position, and the storage of the pocket. Vibration detecting means for detecting a relative vibration in which the position of the suction nozzle for sucking a component fluctuates relatively horizontally is provided, and when the relative vibration detected by the vibration detecting means is equal to or less than a predetermined value, the teaching function setting unit is provided. Is set to execute the calculation of the suction target position in the first teaching, and when the relative vibration detected by the vibration detection means is larger than a predetermined value, the teaching function setting unit performs the calculation of the suction target position in the first teaching. Set to be executed in the second teaching.

  According to the component mounting method of the present invention, the carrier tape having the pocket storing the component is pitch-fed by a tape feeder, and the component stored in the pocket fed to the component pick-up position is suction-held by a suction nozzle. A component mounting method for mounting the component on the substrate in a component mounting apparatus mounted on a substrate, wherein the pocket imaging step of imaging the pocket that is pitch-fed to the component pick-up position and the pocket imaging step are performed. A first teaching step of calculating, from a single image, a suction target position at which the suction nozzle sucks the component housed in the pocket fed to the component pick-up position by the suction nozzle, and the pocket imaging step Is repeated to perform a predetermined statistical process on a plurality of captured images, A second teaching step of calculating the arrival target position, the position of the pocket that is pitch-fed to the component take-out position, and the position of the suction nozzle that suctions the component housed in the pocket are relatively horizontal. And a vibration detection step of detecting a relative vibration that fluctuates.If the relative vibration detected in the vibration detection step is equal to or less than a predetermined value, the first teaching step is performed, and the detection is performed in the vibration detection step. If the relative vibration is larger than a predetermined value, the second teaching step is performed.

  According to the present invention, it is possible to appropriately correct the suction target position at which the suction nozzle sucks a component in accordance with the vibration generated in the component mounting apparatus.

FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention. Partial sectional view of a component mounting apparatus according to an embodiment of the present invention. FIG. 1B is an explanatory view of picking up a pocket, which is pitch-fed to a component take-out position of a tape feeder included in a component mounting apparatus according to an embodiment of the present invention, by a board recognition camera; FIG. FIG. 1 is a block diagram illustrating a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. (A) A diagram showing an example of a pocket picked-up image in a component mounting apparatus according to an embodiment of the present invention (b) Illustration of normal teaching (c) Illustration of vibration-resistant teaching FIG. 2A is a diagram illustrating an example of a component captured image in the component mounting apparatus according to an embodiment of the present invention; FIG. 5 is a diagram illustrating an example of a suction position shift amount in the component mounting apparatus according to the embodiment of the present invention; The figure which shows the example of the amplitude of relative vibration in the component mounting apparatus of one Embodiment of this invention. Flow chart of a component mounting method by a component mounting apparatus according to an embodiment of the present invention

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configurations, shapes, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting apparatus. In the following, corresponding elements in all the drawings are denoted by the same reference numerals, and redundant description will be omitted. In FIG. 1 and in a part to be described later, an X direction (horizontal direction in FIG. 1) of the substrate transport direction and a Y direction (vertical direction in FIG. 1) orthogonal to the substrate transport direction are defined as two axial directions orthogonal to each other in a horizontal plane. Is shown. In FIG. 2 and a part to be described later, a Z direction (a vertical direction in FIG. 2) is shown as a height direction orthogonal to a horizontal plane. The Z direction is a vertical direction when the component mounting apparatus is installed on a horizontal plane.

  First, the component mounting apparatus 1 will be described with reference to FIGS. In FIG. 1, a first substrate transport mechanism 2A and a second substrate transport mechanism 2B extending in the X direction are provided at the center of the base 1a in a state of being arranged in parallel in the Y direction. The first substrate transport mechanism 2A and the second substrate transport mechanism 2B respectively transfer the first substrate 3A and the second substrate 3B carried in from the upstream to the mounting work position, and position and hold them. Hereinafter, the first substrate transport mechanism 2A and the second substrate transport mechanism 2B are simply referred to as “substrate transport mechanisms 2A and 2B” unless it is necessary to distinguish them. The substrates 3A and 3B are simply referred to as “substrates 3A and 3B”.

  A first component supply unit 4A and a second component supply unit 4B are arranged on the sides of the substrate transport mechanisms 2A and 2B, respectively. Hereinafter, the first component supply unit 4A and the second component supply unit 4B are simply referred to as “component supply units 4A and 4B” unless it is necessary to distinguish them for convenience. A plurality of tape feeders 5 are mounted on the component supply units 4A and 4B in parallel in the X direction. The tape feeder 5 feeds the carrier tape containing the components from the outside of the component supply units 4A and 4B in the direction toward the substrate transport mechanisms 2A and 2B (tape feeding direction), so that the components by the mounting head described below can be used. Supply the parts to the removal position.

  In FIG. 1, Y-axis beams 6 each having a linear drive mechanism are provided at both ends in the X direction on the upper surface of the base 1a. Between the two Y-axis beams 6, a first X-axis beam 7A and a second X-axis beam 7B, which are also provided with a linear drive mechanism, are respectively movably coupled in the Y direction. A first mounting head 8A is mounted on the first X-axis beam 7A so as to be movable in the X direction. A second mounting head 8B is movably mounted in the X direction on the second X-axis beam 7B. Each of the first mounting head 8A and the second mounting head 8B includes a plurality of suction units 8a to which suction nozzles 8b for sucking and holding the component D are mounted at lower ends (see also FIG. 2).

  The Y-axis beam 6 and the first X-axis beam 7A constitute a first head moving mechanism 9A that moves the first mounting head 8A in the X and Y directions. The Y-axis beam 6 and the second X-axis beam 7B constitute a second head moving mechanism 9B that moves the second mounting head 8B in the X and Y directions. Hereinafter, the first X-axis beam 7A and the second X-axis beam 7B are simply referred to as “X-axis beams 7A and 7B”, and the first mounting head 8A and the second mounting head unless it is necessary to distinguish them. 8B is simply referred to as “mounting heads 8A and 8B”, and the first head moving mechanism 9A and the second head moving mechanism 9B are simply referred to as “head moving mechanisms 9A and 9B”.

  The mounting heads 8A, 8B take out the components D from the component take-out positions of the tape feeders 5 mounted on the component supply units 4A, 4B by the suction nozzles 8b by the head moving mechanisms 9A, 9B, and send the components D to the board transport mechanisms 2A, 2B. It is transferred and mounted on the mounting points of the positioned substrates 3A and 3B.

  In FIG. 1, a first component recognition camera 10A is provided between the first component supply unit 4A and the first board transfer mechanism 2A. A second component recognition camera 10B is provided between the second component supply unit 4B and the second board transfer mechanism 2B. Hereinafter, the first component recognition camera 10A and the second component recognition camera 10B are simply referred to as “component recognition cameras 10A and 10B” unless it is necessary to distinguish between them. The component recognition cameras 10A and 10B image the component D held by the suction nozzles 8b of the mounting heads 8A and 8B when the mounting heads 8A and 8B that have taken out the component D from the component supply units 4A and 4B move upward. I do. The imaging result is subjected to recognition processing in the recognition processing unit 22 (see FIG. 4) of the control unit 20.

  In FIG. 1, on a plate 7a to which a first mounting head 8A is attached, a first substrate which is located on the lower surface side of the first X-axis beam 7A and moves integrally with the first mounting head 8A. The recognition camera 11A is mounted. On the plate 7a to which the second mounting head 8B is attached, a second board recognition camera 11B which is located on the lower surface side of the second X-axis beam 7B and moves integrally with the second mounting head 8B. It is installed. Hereinafter, the first board recognition camera 11A and the second board recognition camera 11B are simply referred to as “board recognition cameras 11A and 11B” unless it is necessary to distinguish them.

  The board recognition cameras 11A and 11B move above the boards 3A and 3B positioned on the board transport mechanisms 2A and 2B by moving integrally with the mounting heads 8A and 8B, and are provided on the boards 3A and 3B. An image of a substrate mark (not shown) is taken. Further, the board recognition cameras 11A and 11B move above the component take-out position of the tape feeder 5 by moving integrally with the mounting heads 8A and 8B, and image a carrier tape pocket to be described later. The imaging result is subjected to recognition processing in the recognition processing unit 22 (see FIG. 4) of the control unit 20.

  In FIG. 2, the component supply units 4A and 4B are composed of a carriage 12 that can be attached to and detached from a base 1a on which a plurality of tape feeders 5 are previously mounted on a feeder base 12a. The carriage 12 holds a supply reel 14 that stores the carrier tape 13 holding the component D in a wound state. The carrier tape 13 pulled out from the supply reel 14 is mounted on the tape feeder 5. The tape feeder 5 feeds the carrier tape 13 at a pitch and supplies the component D stored in the pocket to the component pick-up position 5a by the suction nozzle 8b.

  Here, the imaging of the component D held by the suction nozzle 8b by the component recognition cameras 10A and 10B will be described. The suction nozzle 8b sucks the component D supplied to the component pick-up position 5a and moves above the component recognition cameras 10A and 10B (arrow a). Then, when the suction nozzle 8b moves the mounting heads 8A and 8B above the component recognition cameras 10A and 10B (from arrow a to arrow b), the component D held by the suction nozzle 8b is imaged. Thereafter, the mounting heads 8A and 8B move above the substrates 3A and 3B positioned on the substrate transport mechanisms 2A and 2B, and mount the component D at mounting points on the substrates 3A and 3B (arrow b). As described above, the component recognition cameras 10A and 10B serve as suction component imaging means for capturing the suction nozzle 8b that has suctioned the component D from below.

  In FIG. 3A, a pressing member 15 for guiding the carrier tape 13 from above is disposed above the tape feeder 5. The holding member 15 has an opening 15a located at the component take-out position 5a. FIG. 3B shows a state in which the carrier tape 13 near the component take-out position 5a is viewed from above, and the pressing member 15 is not shown. The base tape 13a of the carrier tape 13 is formed at regular intervals with a concave pocket 13b for accommodating the component D and a sprocket hole 13c with which a sprocket (not shown) for feeding the carrier tape 13 at a pitch is engaged. A cover tape 13d is adhered to the upper surface of the pocket 13b storing the component D.

  In FIG. 3A, the cover tape 13d is peeled off and folded at the edge 15b (peeling portion) of the opening 15a. Thereby, the upper part of the pocket 13b on the downstream side (the right side in FIG. 3A) including the component take-out position 5a is opened. Here, the imaging of the pocket 13b (hereinafter, referred to as “target pocket 13b *”) that has been pitch-fed to the component removal position 5a by the board recognition cameras 11A and 11B will be described. The board recognition cameras 11A and 11B are moved above the component pick-up position 5a by the head moving mechanisms 9A and 9B (arrow c), and image the target pocket 13b * at the component pick-up position 5a through the opening 15a. As described above, the board recognition cameras 11A and 11B serve as pocket image pickup means for picking up an image of the pocket 13b (the target pocket 13b *) fed at the pitch to the component take-out position 5a.

  As described above, the component mounting apparatus 1 uses the tape feeder 5 to feed the carrier tape 13 having the pocket 13b for accommodating the component D at a pitch, and the pocket 13b (the target pocket 13b *) pitch-fed to the component take-out position 5a. The components D stored in (1) are suction-held by the suction nozzle 8b and mounted on the substrates 3A and 3B.

  Next, a configuration of a control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 20 is an overall control device of the component mounting apparatus 1 and executes a processing program stored in the storage unit 21 to execute the board transport mechanisms 2A and 2B, the component supply units 4A and 4B, the mounting heads 8A and 8B, and the heads. It controls the moving mechanisms 9A and 9B and the display unit 23. The display unit 23 is a liquid crystal display for displaying various information.

  The storage unit 21 stores mounting data 21a, pocket image data 21b, component image data 21c, correction data 21d, suction position deviation amount data 21e, calculation result data 21f, and setting flag data 21g. Various data used for the correction are stored. The mounting data 21a is data such as the component type of the component D to be mounted and the mounting points on the boards 3A and 3B, and is stored for each type of board to be produced.

  The control unit 20 includes, as internal processing functions, a recognition processing unit 22, a mounting control unit 20a, a teaching control unit 20b, a suction target position calculation unit 20c, a suction position shift amount calculation unit 20d, a suction position shift amount calculation unit 20e, and a vibration determination unit. 20f and a teaching function setting unit 20g. The mounting control unit 20a corrects the suction target position based on the correction data 21d, the suction position shift amount data 21e, and the calculation result data 21f, and the board transport mechanisms 2A and 2B, the component supply units 4A and 4B, the mounting heads 8A, 8B, the component mounting operation is controlled by controlling each part of the head moving mechanisms 9A and 9B.

  In FIG. 4, the recognition processing unit 22 performs a recognition process on the imaging results of the component recognition cameras 10A and 10B and the board recognition cameras 11A and 11B. The board recognition cameras 11A and 11B move above the tape feeder 5 to image the target pocket 13b *. The imaging result is subjected to recognition processing by the recognition processing unit 22 and stored in the storage unit 21 as pocket image data 21b.

  Here, an example of a pocket captured image stored as the pocket image data 21b will be described with reference to FIG. In FIG. 5A, the imaged target pocket 13b * and the component D are displayed in the imaging field of view 11a of the board recognition cameras 11A and 11B. In the imaging visual field 11a, a center line 11x in the X direction and a center line 11y in the Y direction are displayed in an overlapping manner. In the example shown in FIG. 5A, the pocket center Cp of the target pocket 13b * and the component center Cd of the component D are located at the center of the imaging visual field 11a (the intersection of the center line 11x in the X direction and the center line 11y in the Y direction). Each matches.

  In FIG. 4, the component recognition cameras 10A and 10B image the suction nozzle 8b that has sucked the component D from below. The imaging result is subjected to recognition processing by the recognition processing unit 22 and is stored in the storage unit 21 as component image data 21c.

  Here, an example of the component captured image stored as the component image data 21c will be described with reference to FIG. In FIG. 6 (a), the component D sucked by the suction nozzle 8b is displayed in the imaging field of view 10a of the component recognition cameras 10A and 10B. In the imaging visual field 10a, a center line 10x in the X direction and a center line 10y in the Y direction are displayed in an overlapping manner. The component captured image is captured when the nozzle center Cn of the suction nozzle 8b passes through the center of the imaging field of view 10a (the intersection of the center line 10x in the X direction and the center line 10y in the Y direction in FIG. 6A).

  In the following embodiment, the suction target position P, which is the target position when the suction nozzle 8b suctions the component D, is the component center Cd of the component D stored in the target pocket 13b *. That is, the pocket center Cp of the target pocket 13b * is the suction target position P. In FIG. 6A, the nozzle center Cn matches the component center Cd. That is, a state is shown in which the pocket center Cp of the target pocket 13b * (the component center Cd of the stored component D) matches the suction target position P and there is no suction position shift. Note that the suction target position P is not limited to the component center Cd of the component D, but is appropriately set according to the shape of the component D and stored in the mounting data 21a.

  In FIG. 4, the teaching control unit 20b controls the head moving mechanisms 9A and 9B, the recognition processing unit 22, and the board recognition cameras 11A and 11B to control the teaching work. The teaching operation is performed after a predetermined event, such as when the component mounting apparatus 1 is started, when the tape feeder 5 is replaced, or when the carrier tape 13 is supplied. The teaching operation is performed for the purpose of correcting the deviation of the suction target position P due to the deviation of the pitch feed of the carrier tape 13 in the tape feeder 5 which tends to occur after such an event.

  In FIG. 4, the target suction position calculating unit 20c calculates a target suction position P based on the stored pocket image data 21b in the teaching operation. That is, the suction target position calculation unit 20c calculates the pocket 13b (the target pocket) that is pitch-fed to the component pick-up position 5a from the pocket image data 21b (pocket captured image) captured by the board recognition cameras 11A and 11B (pocket capturing unit). 13b *), a suction target position P which is a target at which the suction nozzle 8b sucks the component D stored therein is calculated.

  In the teaching operation, the target pocket 13b * is imaged for each tape feeder 5 to be taught. That is, the board recognition cameras 11A and 11B provided integrally with one of the mounting heads 8A and 8B image the target pocket 13b * of the tape feeder 5 mounted on the one of the component supply units 4A and 4B. At this time, the other mounting heads 8A and 8B may be performing a component mounting operation.

  When the mounting heads 8A and 8B move during the component mounting operation, vibration occurs in the component mounting apparatus 1. This vibration propagates to the other mounting heads 8A, 8B and the other component supply units 4A, 4B via the head moving mechanisms 9A, 9B, but is generated in the mounting heads 8A, 8B and the component supply units 4A, 4B, respectively. The amplitude and phase of the oscillating vibration are usually different. Therefore, a relative vibration occurs in which the position of the target pocket 13b * of the tape feeder 5 and the position of the board recognition cameras 11A and 11B capturing the target pocket 13b * relatively change horizontally (X direction, Y direction). I do. The generated relative vibration varies depending on the operation state such as the moving speed of the mounting heads 8A and 8B during the component mounting operation, and the position of the imaging target tape feeder 5 in the component supply units 4A and 4B.

  When the amplitudes Vx and Vy of the relative vibrations are small, the suction target position calculation unit 20c executes the calculation of the suction target position P by normal teaching (first teaching) that calculates from one captured image. When the relative vibration amplitudes Vx and Vy are large, the suction target position calculation unit 20c calculates the suction target position P based on predetermined statistical processing such as averaging a plurality of captured images. This is executed by (second teaching). That is, in the vibration-resistant teaching, the suction target position calculation unit 20c captures a plurality of pocket captured images at predetermined capturing intervals by the board recognition cameras 11A and 11B and stores the captured pocket image data as pocket image data 21b. The target position P is calculated.

  Here, the normal teaching will be described with reference to FIG. In the imaging field of view 11a of the board recognition cameras 11A and 11B, the imaged target pocket 13b * is displayed by a solid line. The pocket center Cp of the target pocket 13b * is located at a position shifted from the center of the imaging visual field 11a.

  The suction target position calculation unit 20c extracts the pocket center Cp from the captured pocket image of the target pocket 13b *. Further, the suction target position calculation unit 20c calculates a shift amount of the extracted pocket center Cp from the center of the imaging visual field 11a as a correction value ΔXp in the X direction and a correction value ΔYp in the Y direction, and stores it as correction data 21d. 21 is stored. In the normal teaching, the extracted pocket center Cp becomes the suction target position P. The time required for normal teaching is shorter than the vibration-proof teaching for calculating the suction target position P from a plurality of images.

  Next, the vibration-proof teaching will be described with reference to FIG. In the vibration-proof teaching, the imaging of the target pocket 13b * is repeated a plurality of times, and the suction target position P is calculated based on the obtained plurality of images. In the example of FIG. 5C, the target pocket 13b * is imaged five times. In the imaging field of view 11a of the board recognition cameras 11A and 11B, the other four captured images indicated by dotted lines are superimposed on the target pocket 13b * imaged last (fifth) indicated by solid lines. .

  The suction target position calculation unit 20c extracts the pocket centers Cp (1) to Cp (5) from the target pocket 13b * imaged five times. Next, the suction target position calculation unit 20c calculates the center of gravity of the five pocket centers Cp (1) to Cp (5) as the suction target position P. Further, the suction target position calculation unit 20c calculates the amount of deviation of the calculated suction target position P from the center of the imaging field of view 11a as a correction value ΔXp in the X direction and a correction value ΔYp in the Y direction, and stores them as correction data 21d. It is stored in the unit 21.

  In the vibration-proof teaching, the influence of the relative vibration can be reduced by calculating the suction target position P by imaging the target pocket 13b * plural times. The number of times of imaging in the vibration-proof teaching is not limited to five, but may be increased or decreased as appropriate according to the state of the generated relative vibration. Further, the calculation of the suction target position P from the plurality of pocket centers Cp (1) to Cp (5) is not limited to a simple calculation of the center of gravity. It may be. That is, it is calculated based on predetermined statistical processing.

  Furthermore, the imaging intervals of the plurality of images of the target pocket 13b * need not be equal intervals, and the imaging intervals may be varied. In addition, if the image capturing interval (period) coincides with the period of the relative vibration, an erroneous correction value ΔXp, ΔYp may be obtained. Therefore, it is desirable that the image capturing interval is different from the period of the relative vibration. That is, in the vibration-resistant teaching (second teaching), it is preferable that the imaging intervals of a plurality of images captured by the board recognition cameras 11A and 11B (pocket imaging means) be set to be different from the cycle of the relative vibration.

  In FIG. 4, based on the stored component image data 21 c, the suction position shift amount calculation unit 20 d calculates the suction center 8 n of the suction nozzle 8 b that has sucked the component D from the component center Cd of the component D whose suction target position P is the suction target position P. The suction position shift amounts ΔXn and ΔYn, which are the shift amounts, are calculated. That is, the suction position shift amount calculation unit 20d determines the position (nozzle center Cn) at which the suction nozzle 8b has suctioned the component D from the images captured by the component recognition cameras 10A and 10B (suction component imaging means), as the suction target position P. Then, the suction positional deviation amounts ΔXn and ΔYn, which are the positional deviation amounts deviated from, are calculated.

  Here, the attraction position deviation amounts ΔXn and ΔYn will be described with reference to FIG. The nozzle center Cn of the suction nozzle 8b that suctions the component D is located at the center of the imaging field of view 10a of the component recognition cameras 10A and 10B. The component center Cd of the component D is shifted from the nozzle center Cn (the center of the imaging visual field 10a). The suction position shift amount calculation unit 20d extracts the component center Cd from the component captured image of the captured component D. Further, the suction position shift amount calculating unit 20d calculates the position shift amount in which the position of the extracted component center Cd is shifted from the center of the imaging visual field 10a (the nozzle center Cn) as the suction position shift amounts ΔXn and ΔYn. The amount data 21e is stored in the storage unit 21.

  In FIG. 4, a suction position shift amount calculation unit 20e calculates the amplitude Vx, Vy of the relative vibration and the average position shift amounts Mx, My by calculating the stored suction position shift amount data 21e. Here, the amplitudes Vx and Vy of the relative vibration will be described with reference to FIG. The graph in FIG. 7 shows the suction position deviation amount ΔYn in the Y direction in the same tape feeder 5 in time series for each component suction. The horizontal axis of the graph indicates a new component pickup from the left side (smaller number) to the right side (larger number). The section S (1,5) represents the first to fifth times of component pick-up of a total of five times.

  The suction position shift amount calculation unit 20e calculates the difference (range) between the maximum value and the minimum value of the suction position shift amount ΔYn in the target section S as the relative vibration amplitude Vy. In the example of FIG. 7, the amplitude Vy of the relative vibration in the Y direction Vy (Vy (1 , 5), Vy (6, 10), Vy (11, 15)). The amplitude Vy (1,5) of the relative vibration in the section S (1,5) is relatively small, and the amplitude Vy (6,10) of the relative vibration in the section S (6,10) and the section S (11,15) is obtained. The amplitude Vy (11, 15) of the relative vibration is relatively large. That is, the relative vibration generated in the section S (6, 10) and the section S (11, 15) is relatively large.

  Further, the suction position shift amount calculation unit 20e calculates an average of the suction position shift amounts ΔYn in the section S as an average position shift amount My. The suction position shift amount ΔYn or the average position shift amount My is used for correcting the suction target position P in the next component suction. In this example, before the sixth and eleventh component pick-ups, the average positional deviation amount My (1,5) of the section S (1,5) and the average positional deviation amount My (of the section S (6,10) respectively. The suction target position P is corrected using (6, 10). When the relative vibrations occurring in the section S (6, 10) and the section S (11, 15) are large, if the immediately preceding suction position deviation amount ΔYn is used to correct the suction target position P, the correction is excessively performed. Although there is a possibility, the influence of the relative vibration can be reduced by using the average displacement amount My.

  The section S is not limited to every five times and may be, for example, every three times or every ten times. Further, the amplitude Vy of the relative vibration is not limited to the range calculated from the plurality of suction position deviation amounts ΔYn, but may be a standard deviation calculated by statistically processing the plurality of suction position deviation amounts ΔYn. Good. Further, the section S may be set so as to be shifted and overlapped with the section S (1, 5), the section S (2, 6), and the section S (3, 7) for each component suction.

  FIG. 7 shows the suction position deviation amount ΔYn, the relative vibration amplitude Vy, and the average position deviation amount My in the Y direction as an example, but the suction position deviation amount ΔXn, the relative vibration amplitude Vx, and the average position deviation amount in the X direction. The same applies to Mx. That is, the suction position shift amount calculation unit 20e is an amplitude calculation unit that calculates the amplitudes Vx and Vy of the relative vibration based on the calculated plurality of suction position shift amounts ΔXn and ΔYn. Further, the suction position shift amount calculation unit 20e is an average suction position shift amount calculation unit that calculates the average position shift amounts Mx and My based on the calculated plurality of suction position shift amounts ΔXn and ΔYn. The calculated relative vibration amplitudes Vx, Vy and average positional deviation amounts Mx, My are stored in the storage unit 21 as calculation result data 21f.

  In FIG. 4, the vibration determination unit 20f determines whether the relative vibration is larger than a predetermined value based on the stored calculation result data 21f. The graph shown in FIG. 8 represents, in time series, the amplitude Vy of the relative vibration in the Y direction calculated for each section S of five component suctions. When the amplitude Vy of the relative vibration exceeds the predetermined vibration threshold Vty, the vibration determination unit 20f determines that the relative vibration is larger than the predetermined. FIG. 8 shows the relative vibration amplitude Vy and the vibration threshold Vty in the Y direction as an example, but the same applies to the relative vibration amplitude Vx and the vibration threshold Vtx in the X direction.

  When the amplitude Vy of the relative vibration is calculated, if an outlier in which the suction position deviation amount ΔYn suddenly fluctuates is mixed, a large amplitude Vy of the relative vibration is calculated, and the magnitude of the relative vibration is erroneously determined. There is a possibility. As a countermeasure, the vibration determination unit 20f determines that the relative vibration is larger than the predetermined value when the calculated relative vibration amplitude Vy continuously exceeds a predetermined vibration threshold value Vty (for example, continuously three times). You may. That is, when the calculated (detected) relative vibration amplitude Vy exceeds a predetermined amplitude (vibration threshold Vty) at a predetermined frequency, the vibration determination unit 20f determines that the detected relative vibration is larger than a predetermined value. Is also good.

  As described above, the component recognition cameras 10A and 10B, the recognition processing unit 22, the suction position shift amount calculation unit 20d, the suction position shift amount calculation unit 20e, and the vibration determination unit 20f determine whether the pocket 13b that has been pitch-fed to the component removal position 5a. (The center Cp of the pocket) and the position of the suction nozzle 8b (nozzle center Cn) for sucking the component D accommodated in the pocket 13b serve as a vibration detecting means for detecting a relative vibration that varies relatively horizontally. . The vibration detecting means is not limited to this as long as it can detect relative vibration. For example, an acceleration sensor may be installed on the mounting heads 8A and 8B, the component supply units 4A and 4B, the tape feeder 5, and the like to detect relative vibration.

  In FIG. 4, the teaching function setting unit 20g sets whether the suction target position calculation unit 20c executes the normal teaching or the vibration-resistant teaching according to the magnitude of the detected relative vibration. Specifically, when the vibration determining unit 20f determines that the relative vibration is larger than the predetermined value, the teaching function setting unit 20g sets the setting flag data 21g stored in the storage unit 21 to the vibration-resistant teaching. When the vibration determining unit 20f determines that the relative vibration is not larger than the predetermined value, the teaching function setting unit 20g sets the setting flag data 21g to the normal teaching. The suction target position calculation unit 20c executes normal teaching or vibration-resistant teaching with reference to the setting flag data 21g.

  That is, the teaching function setting unit 20g executes the calculation of the suction target position P by the suction target position calculation unit 20c by normal teaching (first teaching) calculated from one captured image, or captures the captured image. Whether to execute vibration-resistant teaching (second teaching) calculated from a plurality of images based on predetermined statistical processing is switched and set. More specifically, when the relative vibration detected by the vibration detecting means is equal to or less than a predetermined value, the teaching function setting unit 20g sets the calculation of the suction target position P to be performed by the normal teaching (first teaching). When the relative vibration detected by the vibration detecting means is larger than a predetermined value, the teaching function setting unit 20g sets the calculation of the suction target position P to be executed by vibration-resistant teaching (second teaching).

  Next, a component mounting method for mounting the component D on the boards 3A and 3B in the component mounting apparatus 1 will be described with reference to the flow of FIG. Here, it is assumed that teaching has been performed in the past and the correction data 21d has been stored. Further, it is assumed that the component mounting work has been executed in the past and the suction position shift amount data 21e and the calculation result data 21f are stored.

  In the component mounting operation, the components D supplied from the plurality of tape feeders 5 are sequentially mounted on the boards 3A and 3B. At this time, the suction position deviation amount data 21e is calculated in order and stored for each tape feeder 5. The teaching is performed for each tape feeder 5 at a predetermined timing during the component mounting operation. That is, the supply of the component D, the component mounting operation, and the teaching are complicated operations performed in parallel or sequentially by the plurality of tape feeders 5. The following is a simplified description of a flow limited to one tape feeder 5.

  In FIG. 9, the mounting control unit 20a corrects the suction target position P in the target pocket 13b * based on the correction data 21d, the suction position shift amount data 21e, and the calculation result data 21f (ST1), and removes the component D. The suction is performed by the suction nozzle 8b (ST2: component suction step). For correcting the suction target position P, for example, a correction value obtained by subtracting half of the suction position shift amounts ΔXn and ΔYn included in the suction position shift amount data 21e from the correction values ΔXp and ΔYp included in the correction data 21d is used. Is done. Further, the average positional deviation amounts Mx and My included in the calculation result data 21f may be used instead of the suction positional deviation amounts ΔXn and ΔYn. This makes it possible to prevent abnormal setting of the suction target position P due to outliers of the suction position deviation amounts ΔXn and ΔYn.

  Next, the mounting control unit 20a moves the suction nozzle 8b sucking the component D above the component recognition cameras 10A and 10B, and images the suction nozzle 8b sucking the component D from below (ST3: suction component imaging step). . The imaging result is subjected to recognition processing by the recognition processing unit 22 and stored as component image data 21c. Next, the suction position shift amount calculating unit 20d calculates the suction position shift amounts ΔXn and ΔYn from the image captured in the suction component imaging step (ST3) (ST4: suction position shift amount calculation step), and calculates the suction position shift amount. It is stored as data 21e.

  In FIG. 9, next, the suction position shift amount calculation unit 20e (amplitude calculation unit) determines the amplitude Vx of the relative vibration based on the plurality of suction position shift amounts ΔXn and ΔYn calculated in the suction position shift amount calculation step (ST4). , Xy and average positional deviation amounts Mx and My (ST5: amplitude calculation step). In the component suction step (ST2), the suction component imaging step (ST3), the suction position shift calculation step (ST4), and the amplitude calculation step (ST5), the relative vibration is detected (the amplitudes Vx and Vy of the relative vibration are calculated). ) This is the vibration detection step.

  Next, the vibration determination unit 20f determines whether the relative vibration is larger than a predetermined value based on the relative vibration amplitudes Vx and Vy calculated in the amplitude calculation step (ST5) (ST6: vibration determination step). For example, when the amplitude Vx, Vy of the relative vibration detected (calculated) in the vibration detecting step exceeds a predetermined amplitude (vibration threshold Vtx, Vty) at a predetermined frequency, the vibration determination unit 20f determines that the detected relative vibration is a predetermined value. Judge as larger.

  In FIG. 9, when it is determined that the relative vibration detected in the vibration determining step (ST6) is larger than a predetermined value (Yes), the teaching function setting unit 20g sets the setting flag data 21g to vibration-resistant teaching (ST7). If it is determined in the vibration determining step (ST6) that the relative vibration detected is not larger than the predetermined value (No), the teaching function setting unit 20g sets the setting flag data 21g to normal teaching (ST8).

  When the setting flag data 21g is set in (ST7) or (ST8), the teaching control section 20b determines whether it is time to execute teaching (ST9). If it is determined that it is not the timing for teaching (No in ST9), the process returns to ST1 and the next component D is mounted. If it is determined that the timing is for teaching (Yes in ST9), the teaching control unit 20b determines whether or not the setting flag data 21g is set to vibration-resistant teaching (ST10).

  In FIG. 9, when it is determined that the vibration-proof teaching is set (Yes in ST10), the teaching control unit 20b executes the vibration-proof teaching (ST11: a second teaching step). That is, when the relative vibration detected in the vibration detecting step is larger than the predetermined value, the teaching control unit 20b executes the second teaching step (ST11). In the second teaching process (ST11), the teaching control unit 20b repeats the pocket imaging process of imaging the pocket 13b (the target pocket 13b *) that has been pitch-fed to the component take-out position 5a, and repeats the pocket imaging process. Then, a predetermined statistical process is executed to calculate the suction target position P.

  If it is determined that vibration-free teaching has not been set (No in ST10), that is, if normal teaching has been set, teaching control unit 20b executes normal teaching (ST12: first teaching step). That is, when the relative vibration detected in the vibration detecting step is equal to or less than a predetermined value, the first teaching step (ST12) is executed. In the first teaching step (ST12), the teaching control unit 20b determines, from one image captured in the pocket imaging step, the components stored in the pocket 13b (the target pocket 13b *) that has been pitch-fed to the component removal position 5a. A suction target position P, which is a target at which D is sucked by the suction nozzle 8b, is calculated.

  In FIG. 9, when the suction target position P is calculated in the first teaching step (ST12) or the second teaching step (ST11), the suction target position calculation unit 20c then moves from the calculated suction target position P in the X direction. The correction value ΔXp and the correction value ΔYp in the Y direction are calculated (ST13: correction value calculation step) and stored in the storage unit 21 as correction data 21d. When the teaching and the calculation of the correction values ΔXp and ΔYp are completed in all the target tape feeders 5, the process returns to ST1 to mount the next component D.

  As described above, the component mounting apparatus 1 of the present embodiment feeds the carrier tape 13 on which the pocket 13b for storing the component D is formed by the tape feeder 5 with the tape feeder 5, and transfers the component D stored in the target pocket 13b *. It is mounted on the substrates 3A and 3B by suction and holding by the suction nozzle 8b. In the component mounting apparatus 1, the relative vibration detected by the vibration detecting means (the component recognition cameras 10A and 10B, the recognition processing unit 22, the suction position shift amount calculation unit 20d, the suction position shift amount calculation unit 20e, and the vibration determination unit 20f) is detected. If it is equal to or less than a predetermined value, the calculation of the suction target position P is performed by normal teaching (first teaching), and if the relative vibration detected by the vibration detecting means is larger than a predetermined value, the calculation of the suction target position P is performed by vibration-resistant teaching (second teaching). Teaching).

  Accordingly, the suction target position P at which the suction nozzle 8b suctions the component D in the target pocket 13b * can be appropriately corrected in accordance with the relative vibration generated in the component mounting apparatus 1. That is, when the relative vibration is small, the time required for the teaching is reduced by executing the normal teaching, and when the relative vibration is large, the influence of the relative vibration can be reduced by executing the vibration-resistant teaching.

  The component mounting apparatus and the component mounting method of the present invention have an effect that, in accordance with the vibration occurring in the component mounting apparatus, the suction nozzle can appropriately correct the suction target position at which the suction nozzle sucks the component, This is useful in the field of component mounting where components are mounted on a board.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3A, 3B board 5 Tape feeder 5a Component extraction position 8b Suction nozzle 10A, 10B Component recognition camera (suction component imaging means, vibration detection means)
11A, 11B board recognition camera (pocket imaging means)
13 Carrier tape 13b Pocket D Component P Suction target position ΔXn, ΔYn Suction position shift amount

Claims (8)

A component mounting apparatus that feeds a carrier tape, in which a pocket for storing components is formed, with a tape feeder at a pitch, and suction-holds, by a suction nozzle, the component that is stored in the pocket that has been pitch-fed to a component pick-up position, and mounts the component on a substrate. So,
Pocket imaging means for imaging the pocket that has been pitch-fed to the component take-out position,
A suction target position calculation unit that calculates a suction target position that is a target at which the suction nozzle sucks the component housed in the pocket that is pitch-fed to the component removal position from an image captured by the pocket imaging unit; ,
The calculation of the suction target position by the suction target position calculation unit is performed by a first teaching that is calculated from the one captured image, or based on a predetermined statistical process from the plurality of captured images. A teaching function setting unit that switches and sets whether to execute the second teaching to be calculated,
Vibration detecting means for detecting relative vibration in which the position of the pocket fed to the component take-out position and the position of the suction nozzle for suctioning the component housed in the pocket are relatively horizontally varied. ,
When the relative vibration detected by the vibration detection means is equal to or less than a predetermined value, the teaching function setting unit sets the calculation of the suction target position to be performed in the first teaching,
The component mounting apparatus, wherein when the relative vibration detected by the vibration detecting means is larger than a predetermined value, the teaching function setting unit sets the calculation of the suction target position to be performed in the second teaching. The vibration detecting means,
Suction component imaging means for imaging the suction nozzle that has sucked the component from below,
A suction position shift amount calculation unit that calculates a suction position shift amount that is a position shift amount at which the position at which the suction nozzle sucks the component is shifted from the suction target position, from an image captured by the suction component imaging unit;
2. The component mounting apparatus according to claim 1, further comprising: an amplitude calculator configured to calculate an amplitude of the relative vibration based on the calculated plurality of suction position shift amounts. 3. The vibration detecting means,
3. The component mounting apparatus according to claim 1, wherein when the amplitude of the detected relative vibration exceeds a predetermined amplitude at a predetermined frequency, the detected relative vibration is determined to be larger than the predetermined amplitude.   4. The component mounting apparatus according to claim 1, wherein an imaging interval of a plurality of images captured by the pocket imaging unit in the second teaching is different from a cycle of the relative vibration. 5. In a component mounting apparatus in which a carrier tape in which a pocket for storing components is formed is pitch-fed by a tape feeder, and the component stored in the pocket, which is pitch-fed to a component pick-up position, is suction-held by a suction nozzle and mounted on a substrate. A component mounting method for mounting the component on the substrate,
A pocket imaging step of imaging the pocket that has been pitch-fed to the component take-out position,
Calculating, from a single image captured in the pocket imaging step, a suction target position at which the suction nozzle sucks the component accommodated in the pocket, which is pitch-fed to the component take-out position, by the suction nozzle; Teaching process,
A second teaching step of repeating the pocket imaging step, performing predetermined statistical processing on a plurality of captured images, and calculating the suction target position;
A position of the pocket that is pitch-fed to the component take-out position, and a vibration detection step of detecting a relative vibration in which the position of the suction nozzle that suctions the component housed in the pocket relatively changes horizontally. Including
When the relative vibration detected in the vibration detecting step is equal to or less than a predetermined value, the first teaching step is performed,
The component mounting method, wherein the second teaching step is performed when the relative vibration detected in the vibration detection step is larger than a predetermined value. The vibration detection step,
A suction component imaging step of imaging the suction nozzle from which the component is suctioned from below,
A suction position shift amount calculating step of calculating a suction position shift amount which is a position shift amount at which the position at which the suction nozzle sucks the component is shifted from the suction target position, from an image captured in the suction component imaging step;
6. The component mounting method according to claim 5, further comprising: an amplitude calculating step of calculating an amplitude of the relative vibration based on the plurality of suction position shift amounts calculated in the suction position shift amount calculation step. In the vibration detecting step,
7. The component mounting method according to claim 5, wherein when the amplitude of the detected relative vibration exceeds a predetermined amplitude at a predetermined frequency, it is determined that the detected relative vibration is larger than a predetermined amplitude.   The component mounting method according to any one of claims 5 to 7, wherein an imaging interval of the pocket imaging step repeatedly executed in the second teaching step is different from a cycle of the relative vibration.

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