JP5467370B2 - Component mounting method - Google Patents

Description

  The present invention relates to a component mounting method by a component mounting apparatus in which a component is sucked to each of a plurality of suction nozzles provided in a mounting head and mounted on a substrate.

  The component mounting apparatus includes a substrate positioning unit that positions a substrate, a component supply unit that supplies a component, and a mounting head that includes a plurality of suction nozzles. The mounting head sucks a plurality of components supplied from the component supply unit. Each nozzle is adsorbed and mounted on the substrate. In such a component mounting apparatus, the component adsorbed by the adsorption nozzle is not necessarily adsorbed in a good (normal) adsorption state, and the adsorbing nozzle adsorbs the end of the component, so that the component is in a normal posture. In some cases, the suction state with respect to the suction nozzle becomes poor. For this reason, conventionally, by picking up the parts sucked by each suction nozzle with a camera and performing image recognition based on the obtained image, the parts having a poor suction state with respect to the suction nozzle are detected, and the suction state is good. A component that is not defective is mounted on the board, but a component that is in a poorly picked state is not mounted on the substrate but discarded at a predetermined position, and a component that is in a poorly picked state is erroneously mounted on the substrate. There is no such thing.

  Here, as the timing of discarding a component with a poor suction state, two methods before and after mounting a component with a good suction state on the substrate can be considered, and any of the conventional methods has been adopted. There is also known one in which an operator can arbitrarily select which of the above two methods is to be employed (for example, Patent Document 1).

JP 2006-210722 A

  However, the former method has an advantage that there is no possibility that the component is accidentally dropped onto the substrate because the component that may be dropped from the suction nozzle due to a poor suction state is discarded first. On the other hand, there is a problem that the tact time may increase. On the other hand, the latter method is advantageous over the former in terms of tact time because the component is discarded after the component has been mounted, but the component to be discarded is dropped onto the board during component mounting. There was a risk of it. Here, if the component has been dropped onto the board and the operator has not noticed this, various problems may occur in the subsequent work on the board (for example, the component mounting work to be performed subsequently). There was also a risk that the substrate would become defective if it was made worse.

  Therefore, an object of the present invention is to provide a component mounting method capable of preventing a defective substrate from being generated due to a fall of a component while suppressing an increase in tact time.

The component mounting method according to claim 1, wherein a substrate positioning unit for positioning a substrate, a component supply unit for supplying a component, and a component supplied from the component supply unit are adsorbed to each of a plurality of suction nozzles. A component mounting method by a component mounting apparatus comprising: a mounting head that is mounted on a substrate positioned by a positioning unit; and an image recognition unit that performs image recognition by causing the imaging unit to capture a component sucked by a suction nozzle, A step of adsorbing a component to each of the plurality of adsorption nozzles, a step of causing the imaging unit to image each component adsorbed to each of the plurality of adsorption nozzles, and executing image recognition by the image recognition unit; Each component picked up by each image is picked up by the image pickup means, and image recognition by the image recognition means is executed. Based on the obtained image recognition result, the suction nozzle The process of detecting a component with a poor suction state, the step of mounting a component except the component with the detected suction state on the substrate, and the step of mounting a component with a component other than the component with a poor suction state on the substrate, The step of causing the image pickup means to pick up an image of the detected part having a poor suction state and recognizing the image by the image recognition means; A step of determining whether or not all components having a poor suction state remain sucked by the suction nozzle even after a component having a good suction state is mounted on the substrate based on the obtained image recognition result; including.

  The component mounting method according to claim 2 is the component mounting method according to claim 1, and is obtained by causing the imaging unit to image a component with a poor suction state and performing image recognition by the image recognition unit. Based on the image recognition result, if it is determined that all parts with a poor suction state are still sucked by the suction nozzle, all parts with a bad suction state are discarded and the suction state is poor. If it is determined that at least one of the parts has not been picked up by the suction nozzle, all the parts that have been picked up by the suction nozzle are discarded, and the part that has been picked up has dropped. A step of performing the notification.

  The component mounting method according to claim 3 is the component mounting method according to claim 2, wherein when notifying that the adsorbed component has dropped, the number of dropped components is also notified. I do.

  In the present invention, an increase in tact time is suppressed by discarding a component with a poor suction state after mounting a component with a good suction state on the substrate. By picking up the image of a part with a bad state (part to be discarded) and recognizing the image, and determining whether or not all the parts to be discarded remain sucked by the suction nozzle, If a part to be discarded is dropped while a good part is mounted on the board, it can be detected. If the operator can detect that the part to be discarded has been dropped, the operator can take measures such as removing the dropped part from the board. Even if it exists, it can prevent that a defective board | substrate will be produced by it.

The block diagram of the component mounting apparatus in one embodiment of this invention The flowchart which shows the advancing procedure of the component mounting method which mounts components in a board | substrate with the component mounting apparatus in one embodiment of this invention (A) (b) (c) (d) (e) The figure which shows the procedure which mounts components in a board | substrate with the component mounting apparatus in one embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. The component mounting apparatus 1 shown in FIG. 1 carries in and positions a substrate 2 sent from an upstream process side device (not shown) (for example, a solder printer or another component mounting device), and onto the positioned electrode 3 of the substrate 2. A series of operations including the mounting of the component (electronic component) 4 and the unloading of the substrate 2 on which the component 4 is mounted to an apparatus on the downstream process side (for example, another component mounting apparatus, an inspection machine, a reflow furnace, etc.) is repeatedly executed. Device.

In FIG. 1, a component mounting apparatus 1 is provided on a base (not shown), and includes a board transport path 11 as a board positioning means for transporting the board 2 and positioning it at a predetermined work position (position shown in FIG. 1). A plurality of parts feeders (for example, a tape feeder) 13 provided on a feeder base 12 on the table and serving as a component supply means for continuously supplying the components 4; an orthogonal coordinate type head moving robot 14 provided on the platform; A mounting head 16 provided with a plurality of (four in this case) suction nozzles 15 that are moved in a horizontal plane by the head moving robot 14 and that can be moved up and down and rotated about the vertical axis, and a substrate provided in the mounting head 16 A camera 17, a component camera 18 provided on the base, and a disposal box 19 in which the components 4 that cannot be mounted on the substrate 2 are discarded.

  In FIG. 1, the substrate transport path 11 is composed of a pair of belt conveyors extending in the horizontal direction, and transports the substrate 2 while supporting both ends of the substrate 2 from below. Each part feeder 13 is detachably attached to the feeder base 12 and supplies the component 4 to a component supply port 13p provided at an end portion on the substrate transport path 11 side.

  In FIG. 1, each suction nozzle 15 provided in the mounting head 16 vacuum picks up and picks up the component 4 supplied to the component supply port 13 p of each part feeder 13 and then positions the substrate 2 positioned by the substrate transport path 11. The part 4 is mounted on the substrate 2 by releasing the vacuum suction of the part 4 on the electrode 3 and releasing the part 4 from the suction nozzle 15. That is, the mounting head 16 mounts the component 4 supplied from the parts feeder 13 on the substrate 2 positioned by the substrate transport path 11 by sucking the component 4 to each of the plurality of suction nozzles 15.

  In FIG. 1, the substrate camera 17 has an imaging field of view directed downward, and when the substrate 2 is positioned at the working position by the substrate transport path 11, a substrate mark 2 m for detecting the position of the substrate 2 provided on the substrate 2. Is imaged from above.

  In FIG. 1, each component camera 18 has an imaging field of view facing upward, and is picked up by the suction nozzle 15 and picks up the component 4 located in the imaging field of view from below by moving the mounting head 16.

  The operation of positioning the substrate 2 by the substrate transport path 11 and positioning to the work position is controlled by the control device 30 (FIG. 1) provided in the component mounting apparatus 1 of the substrate transport path drive mechanism 31 (FIG. 1) including an actuator (not shown). Made by doing.

  The parts 4 are supplied to the parts supply port 13p by the parts feeders 13 by controlling the operation of a parts feeder drive mechanism 32 (FIG. 1) including an actuator (not shown) by the control device 30.

  The movement operation of the mounting head 16 in the horizontal plane direction is performed by the operation control of the robot drive mechanism 33 (FIG. 1) in which the control device 30 operates the head moving robot 14.

  The raising and lowering of the suction nozzle 15 with respect to the mounting head 16 and the rotation operation around the vertical axis are performed by the control device 30 controlling the operation of a nozzle drive mechanism 34 (FIG. 1) including an actuator (not shown). In the suction (pickup) and suction release (detachment) operations of the component 4, the control device 30 controls the operation of the suction mechanism 35 (FIG. 1) including an actuator (not shown) to supply the vacuum pressure into the suction nozzle 15. It is also done by releasing the supply of vacuum pressure.

The image pickup operation control of the board camera 17 and the image pickup operation control of the component camera 18 are performed by the control device 30 (FIG. 1). The image data obtained by the imaging operation of the substrate camera 17 and the image data obtained by the imaging operation of the component camera 18 are respectively sent to the control device 30, and image recognition processing is performed in the image recognition unit 30a (FIG. 1) of the control device 30. Is done. That is, the image recognition unit 30a of the control device 30 functions as an image recognition unit that performs image recognition by causing the component camera 18 serving as an imaging unit to image the component 4 sucked by the suction nozzle 15.

  Next, a component mounting method by the component mounting apparatus 1 having such a configuration will be described. For this purpose, the control device 30 first operates the substrate transport path 11 to receive and carry in the substrate 2 sent from the device on the upstream process side and position it at a predetermined work position (step shown in FIG. 2). ST1).

  After positioning the substrate 2 at the working position by the substrate transport path 11, the control device 30 moves the substrate camera 17 (the mounting head 16) above the substrate 2 and moves the substrate mark 2 m on the substrate 2 to the substrate camera 17. Make an image. Then, image recognition is performed in the image recognition unit 30a based on the obtained image data of the substrate mark 2m, and the positional deviation from the normal position of the substrate 2 on the substrate transport path 11 is calculated (step shown in FIG. 2). ST2).

  After calculating the positional deviation of the substrate 2 in step ST2, the control device 30 controls the operation of the robot drive mechanism 33 to operate the head moving robot 14 to move the mounting head 16 above the parts feeder 13, while moving the parts. The operation of the feeder drive mechanism 32 is controlled to supply the component 4 to the component supply port 13p of each part feeder 13. Then, the operation control of the nozzle drive mechanism 34 is performed, and the operation of the suction mechanism 35 is controlled by bringing the suction nozzle 15 into contact with the component 4 supplied to the component supply port 13p of the parts feeder 13 to thereby apply the suction nozzle 15 to the suction nozzle 15. Supplying vacuum pressure causes each suction nozzle 15 to suck (pick up) the component 4 (step ST3 shown in FIG. 2 and FIG. 3 (a)).

  When the control device 30 sucks the component 4 to each suction nozzle 15, the control device 30 moves the mounting head 16 so that each component 4 sucked by the suction nozzle 15 passes above the component camera 18. The part 4 is imaged. Based on the obtained image data, the image recognition unit 30a executes image recognition of each component 4 (step ST4 shown in FIG. 2 and FIG. 3B).

  That is, step ST3 is a step of sucking the component 4 to each of the plurality of suction nozzles 15. In step ST4, the component camera 18 images each component 4 sucked to each of the plurality of suction nozzles 15. This is a step of executing image recognition by the image recognition unit 30a of the control device 30 as image recognition means.

  In step ST4, the control device 30 performs image recognition of each component 4 sucked by each of the plurality of suction nozzles 15, and based on the result of the image recognition, the plurality of components 4 sucked by the suction nozzle 15. It is determined whether or not there is a defective suction state with respect to the suction nozzle 15 (that is, detection of the component 4 having a poor suction state) (step ST5 shown in FIG. 2).

  That is, step ST5 was obtained by causing the component camera 18 to image each component 4 sucked by each of the plurality of suction nozzles 15 and executing image recognition by the image recognition means (the image recognition unit 30a of the control device 30). This is a process of detecting the component 4 having a poor suction state with respect to the suction nozzle 15 based on the image recognition result.

  When the controller 30 determines in step ST5 that there is no component 4 with a poor suction state with respect to the suction nozzle 15 (no component 4 with a poor suction state is detected), the image executed for each component 4 Based on the recognition result, for each component 4 (all components 4 sucked by the suction nozzle 15), a positional shift (suction shift) with respect to the suction nozzle 15 is calculated (step ST6 shown in FIG. 2).

  After calculating the suction deviation for each component 4 in step ST6, the control device 30 moves the mounting head 16 and controls the operation of the nozzle drive mechanism 34, and controls each component 4 to the electrode 3 (this electrode) on the substrate 2. 3 is contacted with a solder printing machine disposed on the upstream process side of the component mounting apparatus 1), and the vacuum pressure to the suction nozzle 15 is controlled by controlling the operation of the suction mechanism 35. And the component 4 is mounted on the board 2 (step ST7 shown in FIG. 2).

  Here, when mounting the component 4 on the substrate 2 in step ST7, the control device 30 corrects the positional deviation of the substrate 2 obtained in step ST2 and the adsorption deviation of the component 4 obtained in step ST6. 2, the position of the suction nozzle 15 is corrected (including rotation correction).

  When each component 4 is mounted on the substrate 2 in step ST7, the control device 30 determines whether all components 4 to be mounted on the substrate 2 have been mounted on the substrate 2 (step ST8 shown in FIG. 2). As a result, when the control device 30 determines that all the components 4 to be mounted on the substrate 2 have not been mounted on the substrate 2, the control device 30 returns to step ST3, and all the components 4 to be mounted on the substrate 2 are mounted on the substrate. If it is determined that the substrate 2 has been mounted, the substrate 2 is carried out to the downstream process apparatus by the substrate transport path 11 (step ST9 shown in FIG. 2).

  On the other hand, if it is determined in step ST5 that there is a component 4 with a poor suction state, the control device 30 calculates a suction deviation for the component 4 with a good suction state (not defective) (FIG. 2). Step ST10 shown in FIG. 2), and then, the component 4 having a good suction state is mounted on the substrate 2 (Step ST11 shown in FIG. 2 and FIG. 3C). As described above, step ST11 is a step of mounting the parts 4 (parts having a good suction state) 4 except the parts 4 having a bad suction state detected in step ST5 on the substrate 2. In FIG. 3, a part having a good suction state is indicated by reference numeral 4a, and a part having a poor suction state is indicated by reference numeral 4b.

  After mounting the component 4 with a good suction state on the substrate 2, the control device 30 moves the mounting head 16, and causes the component camera 18 to pick up the image of the component 4 with the poor suction state (part 4 to be discarded). Image recognition by the recognition unit 30a is executed (step ST12 shown in FIG. 2 and FIG. 3 (d)), and based on the result, all the parts 4 in the suction state (parts 4 to be discarded) are all placed in the suction nozzle 15. Judgment is made as to whether or not the adsorption remains (the adsorption state is maintained) (step ST13 shown in FIG. 2).

  If the control device 30 determines in step ST13 that all the parts 4 having a poor suction state are still sucked by the suction nozzle 15, the control device 30 moves the mounting head 16 above the disposal box 19, After the part 4 having a poor suction state is detached from the suction nozzle 15 and discarded, the part 4 is discarded (step ST14 and FIG. 3E shown in FIG. 2), and the process proceeds to step ST8. Then, the process returns to step ST3, and the component 4 is suctioned anew in order to mount the component 4 on the planned mounting position on the substrate 2 of the component 4 discarded in step ST14.

  That is, in step ST12, after the components 4 except the component 4 having a poor suction state are mounted on the substrate 2, the component camera 18 again picks up the component 4 having the poor suction state detected in step ST5, and image recognition means. The image recognition process is performed by the image recognition unit 30a of the control device 30. Further, in step ST13, the component camera 18 is again imaged by the component camera 18 having a poor suction state, image recognition is performed by the image recognition means (the image recognition unit 30a of the control device 30), and based on the obtained image recognition result. In this process, it is determined whether or not all the components 4 with the poor suction state are still sucked by the suction nozzle 15 even after the components 4 with the poor suction state are mounted on the substrate 2.

On the other hand, if the control device 30 determines in step ST13 that at least one of the components 4 in the suction state (parts 4 to be discarded) has not been sucked by the suction nozzle 15, the mounting head 16 is moved above the disposal box 19, the parts 4 that are in a state of being sucked by the suction nozzle 15 are removed from the suction nozzle 15, and all the parts 4 are discarded (see FIG. Step ST15 shown in FIG. 2), the mounting operation of the component 4 by the mounting head 16 is stopped (Step ST16 shown in FIG. 2). Then, an operator (not shown) of the component mounting apparatus 1 is notified via a notification device 40 (FIG. 1) such as a display device connected to the control device 30 that the component 4 to be discarded has dropped and the number of the dropped components 4. Notification is made (step ST17 shown in FIG. 2).

  When the control device 30 informs the operator that the component 4 to be discarded has dropped on the substrate 2 and the number of the dropped components 4, the control device 30 waits for the operation to be resumed by the operator (step ST18 shown in FIG. 2). When the operator is notified via the alarm device 40 that the component 4 to be discarded has dropped and the number of the dropped components 4, the operator takes out the substrate 2 from the component mounting apparatus 1 and drops the component 2 onto the substrate 2. 4 is removed, and then the restart operation switch 41 (FIG. 1) connected to the control device 30 is operated.

  When the control device 30 detects that the operation of the resume operation switch 41 by the operator is performed while waiting for the resume operation in step ST18, the control device 30 proceeds to step ST8. Then, the process returns to step ST3, and the component 4 is sucked again in order to mount the component 4 on the planned mounting position on the substrate 2 of the component 4 discarded in step ST15.

  As described above, in the component mounting method using the component mounting apparatus 1 according to the present embodiment, the component 4 having a poor suction state is discarded after the component 4 having a good suction state is mounted on the substrate 2. In addition, after mounting the component 4 with a good suction state on the substrate 2, the image of the component 4 with the poor suction state (the component 4 to be discarded) is captured again and image recognition is performed (step ST 12). By determining whether or not all the scheduled components 4 are still attracted to the suction nozzle 15 (step ST13), the components scheduled to be discarded during the mounting of the component 4 having a good suction state on the substrate 2 If 4 has fallen, it can be found. If the operator can find out that the part 4 to be discarded has been dropped, the operator can take measures such as removing the dropped part from the board 2, so the part 4 to be discarded from the suction nozzle 15 during the mounting of the part 4. Even if the substrate falls, it can be prevented that a defective substrate is generated due to this.

  Further, in the component mounting method according to the present embodiment, if it is determined in step ST13 that at least one of the components 4 having a poor suction state has not been sucked by the suction nozzle 15, the suction nozzle 15 Since all the parts 4 to be discarded that have been sucked are discarded, the operator is notified that the parts 4 to be scrapped that have been sucked have been dropped (step ST17). The operator can know that the component 4 to be discarded has been dropped while the component 4 is mounted on the substrate 2 (that the component 4 has not been discarded in the disposal box 19). The procedure to remove from the top can be taken quickly. In addition, when notifying that the sucked part 4 (part 4 to be discarded) has dropped, the number of parts 4 that have fallen is also notified, so the operator has dropped. All of the components 4 can be reliably removed from the substrate 2.

  Provided is a component mounting method capable of preventing a defective substrate from being generated due to a fall of a component while suppressing an increase in tact time.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 4 Components 11 Board | substrate conveyance path (board | substrate positioning means)
13 Parts feeder (part supply means)
15 Adsorption nozzle 16 Mounting head 18 Component camera (imaging means)
30a Image recognition unit (image recognition means)

Claims (3)

A board positioning means for positioning the board, a component supply means for supplying a component, and a component supplied from the component supply means are attracted to each of a plurality of suction nozzles and mounted on the board positioned by the board positioning means. A component mounting method by a component mounting apparatus including a head and an image recognition unit that performs image recognition by causing the imaging unit to capture an image of the component sucked by the suction nozzle,
A step of adsorbing components to each of a plurality of adsorption nozzles;
A step of causing the image pickup means to pick up each component sucked by each of the plurality of suction nozzles and executing image recognition by the image recognition means;
Each component picked up by each of the plurality of suction nozzles is picked up by the image pickup means, and image recognition by the image recognition means is executed. Based on the obtained image recognition result, detection of a part having a bad suction state with respect to the suction nozzle is detected. A process of performing;
A process of mounting the parts except the detected poorly picked parts on the board;
A step of attaching a component excluding a component having a poor suction state to the substrate, and then causing the image recognition unit to pick up the image of the detected component having a poor suction state,
The parts with poor suction state are picked up again by the image pickup means and image recognition is performed by the image recognition means, and the suction state remains after the parts with good suction state are mounted on the substrate based on the obtained image recognition result. And a step of determining whether or not all defective components remain adsorbed by the adsorption nozzle.   The image pickup unit is caused to pick up again a component with a poor suction state, and image recognition by the image recognition unit is executed. Based on the obtained image recognition result, all the parts with a poor suction state are sucked by the suction nozzle. If it is determined that the parts with poor suction status are discarded, at least one of the parts with poor suction status is not picked up by the suction nozzle. 2. The component mounting method according to claim 1, further comprising a step of discarding all of the components that remain adsorbed by the nozzle and notifying that the adsorbed components have fallen.   The component mounting method according to claim 2, wherein when notifying that the sucked component has been dropped, the number of components dropped is also notified.

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