JP2009164530A - Surface mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and effectively improve production efficiency of a substrate by suitably controlling a component recognizing operation by a scan unit fitted to a head unit with simple constitution. <P>SOLUTION: The surface mounting equipment 1 according to the invention is equipped with the scan unit 8 which can move relatively to the head unit 6 as a means of imaging a component C sucked by a plurality of suction heads 20 that the head unit 6 has. A control unit 50 which controls the operation of the scan unit 8 allows the scan unit 8 to perform the component recognizing operation during movement of the head unit 6 on condition that a movement time Tp that the head unit 6 requires to move to a next supply place after a component C is sucked from a predetermined supply place in a component supply part 4 is longer than a time Ts that the scan unit 8 requires to move to installation places of all the suction heads 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface mounter that takes out a component from a component supply unit and mounts it on a substrate by a movable head unit including a plurality of suction heads that can suck the component.

  Conventionally, as shown in Patent Document 1 below, electronic components such as chip components and IC components supplied from a supply unit are taken out and transported by a component holding mounting head and mounted on a printed circuit board separated by a predetermined distance. In the electronic component mounting apparatus (surface mounting machine) to be (mounted), a scanning unit (detecting means) for checking the holding state by imaging the component held by the mounting head while moving relative to the head is provided. After the mounting head sucks and holds a predetermined number of parts from the supply unit and before mounting the parts on the printed circuit board, the scanning unit is moved with respect to the mounting head and the parts held by the heads are moved. In addition to imaging at once, the movement of the mounting head at the time of component mounting can be corrected in accordance with component adsorption deviation recognized based on the captured image. Are we.

Moreover, in the following Patent Document 2, in an electronic component mounting apparatus (surface mounter) including the same scan unit as described above, while some of the plurality of mounting heads are adsorbing components, The scanning unit is moved so as to pass below the part previously sucked by the mounting head, and the part is imaged.
JP 09-307297 A Japanese Patent Laid-Open No. 2005-236511

  By the way, for example, when a scanning component such as a package component called a BGA (Ball Grid Array) having a spherical protruding electrode (bump) on its lower surface is imaged by the scan unit, higher mounting accuracy is required. When imaging a component to be captured, since it is necessary to perform image processing with higher accuracy, it is inevitable that the time required for the processing will increase to some extent. For this reason, as in the above-mentioned Patent Document 1, when the component is recognized by the scan unit at a short time from when the mounting head picks up the component to when it is transported to the mounting point on the substrate, the component is recognized. Then, a series of operations such as imaging and image processing is not completed during the period, and there is a possibility that an extra waiting time occurs.

  Further, as in Patent Document 2, while a part of the mounting heads are picking up the parts, the scan unit moves below the other mounting heads on which the parts have been picked up first, and picks up the picked-up parts. In a surface mount machine configured in such a way, in order to prevent interference between the scan unit and the suction head (or parts sucked by it), the scan unit must be moved with higher accuracy, There arises a problem that operation control of a complicated scan unit is required. In particular, in the recent situation where the number of mounting heads tends to be increased for the purpose of improving the efficiency of mounting work, etc., and the interval between the mounting heads tends to become narrower as the density of components increases. The above problems become more prominent.

  The present invention has been made in view of the above circumstances, and by appropriately controlling the component recognition operation by the scan unit attached to the head unit with a simpler configuration, the production efficiency of the board can be simplified and It is an object to provide a surface mounter that can be effectively improved.

  In order to solve the above problems, the present invention is a surface mounter that takes out a component from a component supply unit and mounts it on a substrate by a movable head unit having a plurality of suction heads that can suck the component. A scanning unit that is attached to the head unit and picks up images while moving the parts sucked by the plurality of suction heads along the row of the heads, and a control unit that controls the operation of the scanning unit, The control means requires the movement of the head unit to move to the next supply location for a suction operation by another suction head after the component is sucked by a suction head from a predetermined supply location in the component supply unit. There is a condition that the time is the same as or longer than the time required for the scan unit to move across all the suction heads. When standing, the component recognition operation by the scanning unit is characterized in that is performed during movement of the head unit (claim 1).

  According to the present invention, while a head unit having a plurality of suction heads for picking up components moves to the next supply location in the component supply unit, imaging of components by the scan unit movable with respect to the head unit is performed. If it is determined that it is possible, while the head unit is moving, the scanning unit is configured to move the necessary distance and take an image of the parts sucked by the suction head. When a predetermined number of parts to be picked up at a time are picked up, a certain number of parts can be image-recognized by the scan unit and the picked-up state can be checked. Therefore, when transporting the picked-up components to the substrate, it is only necessary to perform image pick-up by the scan unit and determination of the pick-up state based on the image processing for only the parts that have not been picked up at that time. In addition, it is possible to effectively suppress the occurrence of an excessive waiting time without completing the above-described series of processing until the component is transported to the substrate, and it is possible to effectively improve the production efficiency of the substrate. .

  In addition, when a predetermined condition is satisfied, the scanning unit is moved across the installation portions of all the suction heads of the head unit to image the suction component, and if the condition is not satisfied, such an imaging operation is not performed. According to the above configuration, with simple control content that does not require complicated arithmetic processing or the like, imaging of the suction component properly while preventing interference between the scan unit and the suction head (or the component sucked by this) There is an advantage that the component can be mounted appropriately based on the suction state of the component examined from the image.

  When the suction failure of a component sucked by a suction head is found based on the image captured by the scan unit, the control means immediately detects the failure even if a component to be sucked by another suction head remains. It is preferable to execute control for discarding the parts (claim 2).

  According to this configuration, the head unit does not move in the apparatus while adsorbing a component whose adsorption state is unstable, and it is effective that the component adsorbed by the adsorption head falls into the apparatus. There is an advantage that can be prevented.

  It is also preferable that when the suction failure of the component is found based on the image picked up by the scan unit, the control means takes an image of the defective component again during the subsequent operation of the scan unit and checks the suction state ( Claim 3).

  In this way, when imaging with a scan unit is performed again on a component that has been identified as a suction failure, the component suction failure is erroneously determined due to an error on the part recognition side, and the component becomes useless. There is an advantage that it can be effectively prevented from being discarded.

  In addition, even when the above condition is satisfied, the control unit preferably stops the execution of the imaging operation by the scan unit when the number of suction parts to be imaged is equal to or less than a predetermined number. ).

  According to this configuration, there is an advantage that parts can be imaged more efficiently with a small number of scan unit operations.

  As described above, according to the surface mounter of the present invention, the component recognition operation by the scan unit attached to the head unit can be appropriately controlled with a simpler configuration, and the production efficiency of the board can be easily and effectively achieved. Can be improved.

  1 and 2 are views schematically showing a surface mounter 1 according to an embodiment of the present invention. As shown in FIGS. 1 and 2, a conveyor 2 is disposed on a base 10 of the surface mounter 1, and a printed board 3 (hereinafter simply referred to as a board 3) is conveyed by the conveyor 2. The substrate 3 stops at a predetermined mounting work position (a position indicated by a two-dot chain line in FIG. 1), and the substrate 3 stopped at the position is positioned and held by a clamp mechanism (not shown). In the following description, the conveyance direction of the substrate 3 by the conveyor 2 is the X-axis direction, the direction orthogonal to the X-axis on the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis and Y-axis (that is, the vertical direction). The description will proceed with the Z-axis direction.

  Component supply units 4 for supplying components are respectively provided on both sides of the base 10 in the Y direction, and each of these component supply units 4 is a multi-row tape arranged side by side in the X-axis direction. A feeder 5 is used. Each tape feeder 5 has a tape in which small pieces such as ICs, transistors, capacitors, resistors and the like are stored at predetermined intervals (supply pitch), a reel for deriving the tape, and the like. The reel is configured to intermittently feed out the tape as the components in the tape are picked up by the head unit 6.

  Above the base 10, a head unit 6 for conveying parts is provided. The head unit 6 is supported on the base 10 so as to be movable in the X-axis direction and the Y-axis direction, and can freely move over the substrate 3 positioned at the mounting work position and the component supply unit 4. It is configured as follows.

  That is, a pair of fixed rails 9 extending in the Y-axis direction and a ball screw shaft 14 that is rotationally driven by a Y-axis servo motor 15 are disposed on the base 10 to support the head unit 6. The support member 7 is supported so as to be movable in the Y-axis direction along the fixed rail 9, and a nut portion 16 provided in the support member 7 is screwed with the ball screw shaft 14. The support member 7 is provided with a guide member 13 extending in the X-axis direction and a ball screw shaft 12 that is rotationally driven by the X-axis servo motor 11, and a nut portion that is screwed with the ball screw shaft 12. The head unit 6 having (not shown) is supported so as to be movable along the guide member 13 in the X-axis direction. Then, when the Y-axis servo motor 15 is operated and the ball screw shaft 14 is rotationally driven, the support member 7 is screw-fed to move integrally with the head unit 6 in the Y-axis direction, and the X-axis servo motor. The head unit 6 is configured to move in the X-axis direction with respect to the support member 7 when the ball screw shaft 12 is rotationally driven by operating 11.

  The head unit 6 is equipped with a plurality of suction heads 20 for sucking and holding the components. In this embodiment, the six suction heads 20 are arranged in a line in the X-axis direction. It is installed.

  These suction heads 20 are supported so as to be able to move in the Z-axis direction and rotate around the R-axis (head central axis) with respect to the main body of the head unit 6, and use a servo motor (not shown) as a drive source. The elevating drive mechanism and the rotary drive mechanism are respectively driven in the above directions.

  At the tip of each suction head 20, a component suction nozzle 20 a is provided. Each nozzle 20a is connected to a negative pressure supply means (not shown), and when a part is taken out from the part supply section 4, the negative pressure is supplied from the negative pressure supply means to the tip of the nozzle 20a. Is adsorbed.

  Further, the head unit 6 is provided with a scan unit 8 as a scanning imaging means that can move along the arrangement direction (X-axis direction) of the suction heads 20. A part sucked by each suction head 20 is imaged during its conveyance. 3 and 4 are diagrams showing a specific configuration of the scan unit 8. As shown in FIG. As shown in these drawings, the scan unit 8 includes, as main components, a camera body 25, a prism group 30 for guiding an image of the suction component C to the camera body 25, and illumination of the suction component C. It has the 1st and 2nd illumination body 41 and 43 for irradiating light, and the supporting member 40 for supporting these camera main bodies 25, the prism group 30, and the illumination bodies 41 and 43. As shown in FIG.

  The camera body 25 is constituted by a camera (one-dimensional camera) provided with a line sensor composed of a one-dimensional CCD image sensor or the like. Then, by moving the camera body 25 in the X-axis direction with respect to the head unit 6 together with the support member 40 in accordance with the driving of a servo motor 47 described later, a plurality of the suction holes 20 adsorbed to each of the suction heads 20. The parts can be sequentially imaged non-stop. It should be noted that imaging of the suction component by the camera body 25 can be performed when the scan unit 8 is moved in either the + X direction or the −X direction with respect to the head unit 6. 3 and 4, reference numeral 27 denotes a condenser lens of the camera body 25, and reference numeral 29 denotes a light receiving unit including a line sensor or the like.

  The support member 40 is attached to the head unit 6 via a mounting bracket 40a shown in FIG. A ball screw shaft 45 extending in the X-axis direction is disposed on the back side (+ Y side) of the head unit 6, and a nut portion (not shown) provided at the upper end of the mounting bracket 40 a is the ball screw shaft 45. Are screwed together. Then, as the ball screw shaft 45 is rotationally driven by a servo motor 47 for scanning operation (see FIG. 7), the entire scan unit 8 including the support member 40 is moved with respect to the head unit 6 in the X axis. It is designed to move in the direction. Note that the scan units 8 indicated by the solid line and the two-dot chain line in FIG. 2 indicate the scan units 8 at the ends of one side and the other side of the movable range S, respectively. Thus, the scanning unit 8 is driven between the both ends of the movable range S, so that the scanning unit 8 can be moved across the installation portions of all the suction heads 20.

  The prism group 30 includes three prisms including a first prism 31, a second prism 33, and a third prism 35, and each of these prisms is a support member positioned below the suction head 20. 40 are arranged so as to be aligned in the X-axis direction at the −Y side end.

  The first prism 31 is disposed so as to face the condenser lens 27 of the camera body 25, and reflects reflected images from the other second and third prisms 33 and 35 to the camera body 25. Light guide.

  The second prism 33 is disposed at a position offset by a predetermined distance in the −X direction with respect to the first prism 31, and reflects an image of the lower surface of the component C sucked by the suction head 20, as shown in FIG. Then, the light is guided to the first prism 31. That is, when the first illuminating body 41 is turned on in a state where the second prism 33 is arranged below the suction head 20, the component sucked to the lower end (nozzle 20a) of the suction head 20 The image of the lower surface of C is emitted to the second prism 33 positioned below the C, and the image of the component C reflected by the second prism 33 is taken into the camera body 25 via the first prism 31. (Refer to the optical path V1 indicated by the one-dot chain line in the figure).

  The third prism 35 is disposed between the first prism 31 and the second prism 33, and reflects the image of the side surface of the component C sucked by the suction head 20, as shown in FIG. The light is guided to the prism 31. That is, the second illumination body 43 is turned on in a state where the third prism 35 is disposed on the side of the suction head 20 on the −Y side, so that the lower end portion (nozzle 20a) of the suction head 20 is turned on. The projected image of the side surface of the sucked component C is emitted to the third prism 35 located on the side, and the image of the component C reflected twice by the third prism 35 is passed through the first prism 31. Are taken into the camera body 25 (see the optical path V2 indicated by the one-dot chain line in the figure).

  Then, when the scan unit 8 is driven by the servo motor 47 and moves relative to the head unit 6, the first illumination body 41 or the second illumination body 43 is turned on as described above, and the lower surface or side surface of the component C is turned on. The operation of taking an image into the camera body 25 is sequentially executed corresponding to the position of each suction head 20 in the head unit 6 so that all the parts C sucked by each suction head 20 are imaged. It has become.

  Next, the control system of the surface mounter 1 configured as described above will be described with reference to the block diagram of FIG. As shown in FIG. 7, the surface mounter 1 has a built-in control unit 50 (corresponding to control means according to the present invention) for comprehensively controlling the operation of each part. The control unit 50 includes a well-known CPU, various memories (RAM and ROM), and the main functional elements include a main control unit 51, an image processing unit 52, a camera control unit 53, and an illumination control unit 54. And an axis control unit 55 and the like.

  The axis controller 55 controls the operation of the X-axis servo motor 11 and the Y-axis servo motor 15 for driving the head unit 6 and the servo motor 47 for driving the scan unit 8. .

  The illumination controller 54 controls operations such as lighting and extinguishing of the illuminators 41 and 43 provided in the scan unit 8.

  The camera control unit 53 controls the image capturing operation of the camera body 25 in the scan unit 8, and the image processing unit 52 captures an image captured by the camera body 25 and applies the image to the image. Predetermined image processing is performed.

  The main control unit 51 is responsible for the central function of the control unit 50 and executes various operations while exchanging various data with other functional elements (52, 53, 54, 55). Thus, the operations of the head unit 6 and the scan unit 8 are controlled in an integrated manner.

  Under the control of the control unit 50 configured as described above, the surface mounter 1 performs a component mounting operation, for example, as follows.

  When the mounting operation is started, first, the substrate 3 is carried to the mounting work position shown in FIG. Next, the head unit 6 moves above the component supply unit 4, and the component C is adsorbed and taken out by the respective adsorption heads 20 of the head unit 6 from a predetermined tape feeder 5 in the component supply unit 4. At this time, for example, as shown in FIG. 8, the head unit 6 takes out the necessary component C by each suction head 20 while appropriately moving between the tape feeders 5 in the component supply unit 4. Specifically, FIG. 8 shows a state in which the component C is sucked and taken out from the tape feeder 5 located at a distance from each other as indicated by reference numerals A1, A2, and A3. Note that, when possible, a plurality of suction heads 20 take out a part C from a plurality of tape feeders 5 at the same time as when taking out a part from the part supply location A1 or A3.

  Further, as described above, while the head unit 6 moves between the tape feeders 5 that are separated from each other in the component supply unit 4, imaging of the suction component C by the scan unit 8 is appropriately executed under predetermined conditions. Specifically, after a component is taken out by a suction head 20 from a predetermined supply location (for example, the tape feeder 5 located at the supply location A1 shown in FIG. 8) in the component supply unit 4, another suction head is used. The time required for the head unit 6 to move to the next supply location (for example, the tape feeder 5 at the supply location A2) for the suction operation by the 20 is over the movable range S (FIG. 2). If the condition that the time required for the movement (scan recognition required time) is the same as or longer than the time required for the movement is satisfied, the component recognition operation by the scan unit 8 is executed while the head unit 6 is moving, and the component C is imaged. It has come to be.

  On the other hand, the time required for moving the head unit 6 is shorter than the time required for scan recognition, as in the case where the head unit 6 moves from the component supply location A2 to A3 shown in FIG. If not, the part C is not imaged by the scan unit 8. In addition, although not shown in the example of FIG. 8, there are cases where the plurality of suction heads 20 of the head unit 6 continuously take out the part C from the same tape feeder 5. Since it does not hold, similarly, imaging of the part C by the scan unit 8 is not performed.

  In the above description, the “required movement time of the head unit 6” is a time when the head unit 6 is moving in the horizontal direction between two supply locations in the component supply unit 4. The time when the suction head 20 is moving up and down to suck the component C is not included. That is, if the scan unit 8 is operated while the suction head 20 is moving up and down, the scan unit 8 may interfere with the suction head 20 (or the component C sucked by the scan unit 8). By comparing the time required for moving the head unit 6 that does not include the time for moving the suction head 20 up and down with the time required for scanning recognition, it is determined whether or not the scan unit 8 is to be operated. Interference between the scan unit 8 and the suction head 20 is prevented.

  When the extraction of the component C from the component supply unit 4 and the imaging of a part of the component C are completed through the operations described above, the head unit 6 moves toward the substrate 3. Then, each suction head 20 of the head unit 6 moves up and down above each mounting point of the substrate 3, so that the component C sucked by the nozzle 20 a at the lower end is mounted on the substrate 3. Note that while the head unit 6 moves toward the substrate 3, the scan unit 8 operates in the same manner as described above, and imaging is performed on the component C for which imaging has not been performed.

  In addition, each component C is mounted on the substrate 3 by reflecting an adsorption deviation of each component C obtained by analyzing the image captured by the scan unit 8. That is, when the head unit 6 moves toward each mounting point on the substrate 3, the suction displacement of each component C examined in advance based on the captured image of the scan unit 8 (that is, sucked by each suction head 20). The amount of movement of the head unit 6 is appropriately corrected in accordance with the displacement of the component C from the normal position), etc., so that each component C is mounted on the substrate 3 appropriately.

  Next, specific contents of the control operation by the control unit 50 will be described with reference to the flowchart of FIG. When this flowchart is started, the control unit 50 first performs control to operate the conveyor 2 to carry the substrate 3 to the mounting work position shown in FIG. 1 and position it (step S1).

  Next, the control unit 50 performs control to suck and take out the component C from a predetermined location in the component supply unit 4 by the predetermined suction head 20 of the head unit 6 (step S3). Specifically, the head unit 6 moves above a predetermined tape feeder 5 located at, for example, the supply location A1 shown in FIG. 8 among the multiple rows of tape feeders 5 in the component supply unit 4, and this head unit. One or a plurality of components from the component supply unit 4 such that one or a plurality of the suction heads 20 out of the six suction heads 20 included in 6 are moved up and down while being positioned above the tape feeder 5. C is adsorbed and taken out.

  Next, the control unit 50 determines whether or not all the parts to be picked up at once (parts for one picking up group) are picked up by the entire head unit 6 including the six picking heads 20 (step S5). ), When it is determined NO and it is confirmed that the part C to be picked up still remains, the next supply place (for example, FIG. 8) in the part supply unit 4 for picking up the part C. Control for calculating the time required for the head unit 6 to move to the component supply location A2 shown in FIG. 5 (hereinafter such time is referred to as Tp) is executed.

  Specifically, the control unit 50 determines the position of the head unit 6 when the predetermined suction head 20 sucks the component C in step S3 and when another suction head 20 sucks the component C from the next supply location. Based on the position of the head unit 6, the section distance between these two positions (for example, the distance between sections Z 1 and Z 2 shown in FIG. 8) is calculated, and the section distance and the moving speed of the head unit 6 are calculated. Based on this, the required movement time Tp of the head unit 6 is calculated.

  Further, the control unit 50 requires a time required for the scan unit 8 to move within the movable range S and recognize the suction component C from the internal storage unit or the like (hereinafter, such time is referred to as Ts). (Step S9) and whether the condition that the required movement time Tp of the head unit 6 calculated in step S7 is equal to or longer than the required recognition time Ts is satisfied (whether Tp ≧ Ts). Control to determine is executed (step S11).

  When it is determined YES here and it is confirmed that the required movement time Tp of the head unit 6 is equal to or longer than the required scan recognition time Ts, the control unit 50 immediately moves the scan unit 8 over the movable range S. By moving the part, the control for causing the scan unit 8 to image the part C sucked by the suction head 20 is executed (step S13). Thereby, while the head unit 6 is moving between the two supply locations in the component supply unit 4 (that is, during the required movement time Tp), the picked-up component C is imaged by the scan unit 8. . On the other hand, when it is determined NO in step S11 and it is confirmed that the required movement time Tp of the head unit 6 is smaller than the required scan recognition time Ts, the control unit 50 performs a component recognition operation on the scan unit 8. Returning to the process of step S3, the head unit 6 is moved to the next supply location in the component supply unit 4 and the control for sucking a new component C from there is executed.

  When the processing in step S13, that is, the processing for imaging the component C sucked by the predetermined suction head 20 by the scan unit 8, is completed, the control unit 50 takes the image data into the image processing unit 52. Therefore, by performing predetermined image processing, the suction state (suction displacement, etc.) of the component C is checked, and it is determined whether or not there is a component C whose suction state is to be defective based on the analysis result. Control is executed (step S15). If it is determined NO in this case and it is confirmed that there is no suction failure, the control unit 50 returns to the above step S3 again, and the new suction head 20 of the head unit 6 starts a new operation from the component supply unit 4. Control for picking up a component C is performed.

  On the other hand, when it is determined as YES in step S15 and it is confirmed that there is a suction failure, the control unit 50 executes control for discarding the component C determined as the suction failure (step S17). Specifically, the head unit 6 is moved toward an unillustrated disposal station or the like provided in the surface mounter 1, where a negative pressure is applied to a specific suction head 20 (a suction head 20 in which suction failure has occurred). By releasing the supply or the like, the part C determined to be defective in adsorption is dropped and discarded in the disposal station. Then, in order to suck again the same type of parts as the discarded part C, the process returns to step S3 and the parts suction operation is performed again.

  As a result of repeating the suction operation (step S3) of the part C several times in the process up to step S17 described above, YES is determined in the next step S5, and the suction of the part C for one suction group is performed. When it is confirmed that the head unit 6 has been completed, the control unit 50 starts control for moving the head unit 6 toward the substrate 3 (step S19). Control for imaging the recognition component is executed (step S21). That is, among the components C sucked by the respective suction heads 20 of the head unit 6, there are components C that have not yet been imaged by the scan unit 8 in the control operations so far. The scan unit 8 is operated to take an image of a non-recognized part (for example, the part C taken out from the last supply location in the part supply unit 4 corresponds to at least the unrecognized part).

  When the imaging of the unrecognized part in step S21 is completed, the control unit 50 determines whether there is a suction failure in the part based on the image captured from the scan unit 8 (step S23), and determines NO here. When it is confirmed that there is no suction failure, the head unit 6 is moved to above the substrate 3 and components C for one suction group sucked by the head unit 6 are sequentially mounted on the substrate 3. The control to perform is executed (step S25). That is, the components C for one suction group are sequentially mounted on the mounting points by moving the suction heads 20 on which the components C are sucked up and down appropriately above the corresponding mounting points on the substrate 3. On the other hand, if it is determined YES in step S23 and it is confirmed that there is a suction failure, the process returns to step S17 to discard the part C determined to be the suction failure, and then returns to step S3. A part of the same type as the part C is re-adsorbed.

  When the processing of step S25 is finished and the component C for one suction group is completely mounted on the substrate 3, the control unit 50 determines whether all components to be mounted on the entire substrate 3 are mounted. (Step S27) Here, when it is determined as YES and it is confirmed that all the components are mounted, the conveyor 2 is operated to carry out control to carry the substrate 3 out of the apparatus (Step S29). On the other hand, if it is determined NO in step S27 and it is confirmed that the component C to be mounted still remains, the process returns to the processing after step S3, and a new component C is taken out from the component supply unit 4. The same process is repeated until all components are mounted on the board 3.

  In addition, after the unloading process of the substrate 3 in step S29 is completed, the control unit 50 determines whether or not the cumulative number of production up to the substrate 3 produced this time has reached a predetermined production scheduled number. (Step S31) When it is determined YES here and it is confirmed that the planned production number has been reached, a series of control flow is terminated. On the other hand, if it is determined NO in step S31 and it is confirmed that the substrate 3 to be produced still remains, the process returns to the processing after step S1 and the same mounting as described above is performed on the new substrate 3. Repeat the process.

  In the surface mounter 1 that takes out the component C from the component supply unit 4 and mounts it on the substrate 3 by the movable head unit 6 including a plurality of suction heads 20 that can suck the component C as described above, the head unit 6 and a scan unit 8 that picks up an image of the component C sucked by the plurality of suction heads 20 while moving along the row of the heads 20, and a control as a control means for controlling the operation of the scan unit 8. The unit 50 is provided, and under the control of the control unit 50, after the component C is adsorbed by the adsorbing head 20 from a predetermined supply location in the component supplying unit 4, the adsorbing operation by the other adsorbing head 20 is performed. Next, the time Tp required for moving the head unit 6 moving to the next supply location is determined so that the scan unit 8 is installed in all the suction heads 20. When the condition that the time Ts required to move across the section is the same as or longer than the time Ts is satisfied (YES in step S11 in FIG. 9), the component recognition operation by the scan unit 8 is performed as the movement of the head unit 6. According to the configuration of the above-described embodiment that is executed inside, there is an advantage that the component recognition operation by the scan unit 8 can be easily and appropriately controlled to effectively improve the production efficiency of the board 3.

  That is, according to the above-described embodiment, the head unit 6 including a plurality of suction heads 20 for picking up components can move relative to the head unit 6 while moving to the next supply location in the component supply unit 4. If it is determined that the part C can be imaged by the scan unit 8, the part C moved by a necessary distance while the head unit 6 is moving, and the part C sucked by the suction head 20 is imaged. Therefore, when a predetermined number of parts C (parts C for one suction group) to be picked up at a time are picked up by the head unit 6 as a whole, a certain number of parts C have already been put in the above-mentioned manner. An image can be recognized by the scan unit 8 to check the suction state. Therefore, when the sucked component C is transported to the substrate 3, only the component that has not been picked up at that time is picked up by the scan unit 8 and the suction state is determined based on the image processing. Therefore, it is possible to effectively suppress the occurrence of an additional waiting time without completing the above-described series of processes until the part C is transported to the board 3, thereby effectively improving the production efficiency of the board 3. Can be improved.

  Further, when a predetermined condition is satisfied, the scanning unit 8 is moved across the installation portions of all the suction heads 20 of the head unit 6 to image the suction component C. If the condition is not satisfied, such an imaging operation is performed. According to the above-described configuration, the interference between the scan unit 8 and the suction head 20 (or the component C sucked by this) is prevented with simple control contents that do not require complicated arithmetic processing or the like. However, there is an advantage that the picked-up component C can be properly imaged, and the component C can be properly mounted based on the picked-up state of the component C examined from the image.

  In the above embodiment, when a suction failure of the component C sucked by the suction head 20 based on the image captured by the scan unit 8 is found (YES in step S15 in FIG. 9), the other suction heads 20 are detected. Even if there is a remaining part to be picked up, the control (step S17) for immediately discarding the defective part C (the part C that has been picked up in step S19) is executed. The head unit 6 does not move in the apparatus (inside the mounting machine 1) while adsorbing the component C whose state is unstable, and the part C adsorbed by the adsorption head 20 falls into the apparatus. There is an advantage that can be effectively prevented.

  In addition, when it is determined as YES in step S15 of FIG. 9 and the suction failure of the component C is confirmed, instead of the above configuration in which the defective component C is immediately discarded, for example, the head unit 6 that has finished sucking the component C At the time of a scanning operation performed during the movement to the substrate 3 (step S19), the defective part C may be imaged again to check (reconfirm) its suction state. Accordingly, there is an advantage that the component C can be effectively prevented from being discarded due to an erroneous determination on the side of recognizing the component C. That is, since there is a possibility that the suction failure of the component C may be erroneously determined due to an error on the part recognition side such as the scan unit 8 or the image processing unit 52, the scan unit 8 The determination of the suction state based on the imaging by the image processing and the image processing thereof is performed twice, thereby reducing the occurrence of the erroneous determination due to the error on the recognition processing side as described above, and the component C erroneously determined as the suction failure Can be effectively prevented from being discarded unnecessarily.

  In the above embodiment, the time Tp required for the head unit 6 to move to the next supply location in the component supply unit 4 is the time Ts required for the scan unit 8 to finish moving over the movable range S. When the above conditions are satisfied (in the case of YES in step S11 of FIG. 9), the scanning unit 8 is uniformly operated to image the suction component C. However, when the above conditions are satisfied However, when the number of parts C to be imaged is equal to or less than a predetermined number, for example, when the number of parts C that have not been picked up among the parts C sucked by the suction head 20 is one or less, the scan unit 8 may be configured not to execute the imaging according to 8. In this way, there is an advantage that the part C can be imaged more efficiently with a small number of scan unit 8 operations.

  In the above embodiment, the camera body 25 of the scan unit 8 is configured by a one-dimensional camera equipped with a line sensor or the like. However, the camera body 25 may be a two-dimensional camera equipped with a CCD area sensor or the like. In this case, it is possible to take non-stop images of the parts C sucked by the suction heads 20 by adopting the strobe lighting that instantaneously illuminates the parts C, as in the above embodiment. .

  In the above embodiment, the scan unit 8 is configured so that both the lower surface and the side surface of the suction component C can be imaged. However, the scan unit 8 may be capable of imaging only one of them.

It is a top view which shows roughly the surface mounting machine concerning one Embodiment of this invention. It is a front view of the surface mounter. It is a side view which shows schematic structure of a scan camera unit. It is a perspective view of the scan camera unit. It is a figure for demonstrating the advancing state of the optical path when the lower surface of an adsorption | suction component is imaged with the said scan camera unit. It is a figure for demonstrating the advancing state of the optical path when imaging the side surface of an adsorption | suction component with the said scan camera unit. It is a block diagram which shows the control system of the said surface mounting machine. It is explanatory drawing for demonstrating the timing which the said scan camera unit act | operates. It is a flowchart for demonstrating control operation | movement of the said surface mounting machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface mounter 3 Board | substrate 4 Component supply part 6 Head unit 8 Scan unit 20 Suction head 50 Control unit (control means)
A1, A2, A3 (parts) supply location C parts Tp Time required to move the head unit Ts Time required for scan recognition

Claims (4)

A surface mounter that takes out a component from a component supply unit and mounts it on a substrate by a movable head unit having a plurality of suction heads that can suck the component,
A scan unit that is attached to the head unit and that picks up an image while moving the parts sucked by the plurality of suction heads along the row of the heads;
Control means for controlling the operation of the scan unit,
The control means requires the movement of the head unit to move to the next supply location for a suction operation by another suction head after the component is sucked by a suction head from a predetermined supply location in the component supply unit. When the condition that the time is the same as or longer than the time required for the scan unit to move across all the suction head installation parts is satisfied, the component recognition operation by the scan unit is being moved. A surface mounting machine characterized by causing the machine to execute. The surface mounter according to claim 1,
When the suction failure of a component sucked by a suction head is found based on the image captured by the scan unit, the control means immediately detects the failure even if a component to be sucked by another suction head remains. A surface mounter that performs control for discarding a component. The surface mounter according to claim 1,
The control means, when a defective suction of a component is found based on an image captured by the scan unit, re-images the defective component and checks the suction state when the scan unit is subsequently operated. Mounting machine. In the surface mounting machine according to any one of claims 1 to 3,
The surface mounter according to claim 1, wherein the control unit stops execution of an imaging operation by the scan unit when the number of suction parts to be imaged is equal to or less than a predetermined number even when the condition is satisfied.

Images