JP6353371B2 - Surface mounter and component mounting method - Google Patents

Description

  The technology disclosed in this specification relates to a surface mounting machine and a component mounting method.

  2. Description of the Related Art Conventionally, a transport conveyor that transports printed circuit boards, a component supply device that supplies electronic components, and a suction nozzle that sucks electronic components are provided, and electronic components sucked by the suction nozzle from the component supply device are transported by the transport conveyor. A surface mounter for mounting on a printed circuit board is known. In this type of surface mounter, for example, when the electronic component sucked by the suction nozzle is not good, the operation of discarding the electronic component may be performed by interrupting the mounting operation of the electronic component. When such an interrupting operation occurs in the mounting operation, a loss time associated with the interrupting operation occurs, and the mounting operation is delayed. For this reason, it is required to reduce the loss time associated with interruption work.

  Patent Document 1 below discloses a component mounting apparatus that efficiently performs a mounting operation when an interruption operation occurs in the mounting operation. In this component mounting apparatus, components are mounted in order on a mounting target using a plurality of component mounters, and the component mounting work executed by each component mounter is assigned when performing the component mounting work. Create an assignment program. And, when the mounting time fluctuates due to factors that have not been considered in advance during component mounting work, for example, due to component suction mistakes, it is efficient to modify the allocation program in consideration of the factors Execute component mounting work.

JP-A-8-18295

  However, in the component mounting apparatus disclosed in Patent Document 1, when the mounting time fluctuates, the mounting time of the component mounting work executed by each component mounting machine is equalized and minimized in consideration of the cause. The component mounting operation is efficiently executed by correcting the allocation program and suppressing the cycle time delay when viewing the entire line of the component mounting operation executed by each component mounting machine. For this reason, the total amount of time required for the component mounting work between the component mounting machines does not change before and after the modification of the allocation program, and the loss time due to factors that have not been considered in advance cannot be reduced.

  The technology disclosed in the present specification has been created in view of the above problems, and aims to reduce a loss time in a component mounting operation.

  The technology disclosed in the present specification includes a transport device that transports a substrate, a plurality of component supply devices that supply components, and a suction unit that sucks the components, and the suction unit is the plurality of component supply devices. Mounting on the substrate that has been picked up from one of the component supply positions of the plurality of component supply devices and transferred by the transfer device by moving between the transfer device and the transfer device A component mounting apparatus that performs a mounting operation to be mounted at a position; an interrupt working unit that is provided within a movement range of the suction unit, and that performs an interrupting operation that interrupts the mounting work by moving the suction unit; and suction of the component A control unit that controls the component mounting apparatus, and has a storage unit that stores order information related to the order and the mounting order of the components on the board. Is mounted at the mounting position on the substrate, and then the interrupting unit is configured to move the sucking unit to the interrupting work position of the interrupting working unit to perform the interrupting process, and the sucking unit includes the interrupting unit. Until the suction part reaches the mounting position by switching the suction order and the mounting order with respect to the movement path from the work position to the mounting position after the part is picked up at the component supply position. A search processing unit that executes a search process for searching for another travel route that is shorter than the travel route based on the order information, and the travel route of the suction unit from the travel route based on the order information. A change processing unit that executes a change process for changing to another movement route, and the search processing unit is configured to perform the interrupt process by the interrupt processing unit. If you row, executing the search process, the change processing unit, when the search processing section detects the other movement path by the search process, relates to a surface mounting apparatus that performs the changing process.

  When an interrupt work occurs in the mounting work, a loss time associated with the interrupt work occurs and the mounting work is delayed. In the surface mounting machine described above, when an interrupt operation occurs in the mounting operation, that is, when the interrupt processing unit executes the interrupt processing, the search processing unit switches the suction order and the mounting order so that the suction unit is placed at the mounting position. A search process is performed to search for another travel route in which the time required to reach is shorter than the travel route based on the order information. And when another movement path | route is detected, a change process part performs the change process which changes the movement path | route of an adsorption | suction part from the movement path | route based on order information to another movement path | route. For this reason, even if an interruption operation occurs, if another movement route is detected, the loss time in the component mounting operation is reduced compared to the case where the suction part is moved along the movement route based on the order information. can do. Note that the interrupting work referred to in this specification is not limited to a specific work, but includes various work performed by interrupting the part mounting work.

  In the surface mounting machine, the search processing unit may determine a length of time required for the suction unit to reach the mounting position based on a distance of the moving path.

  According to this configuration, it is possible to provide a specific determination method for the search processing unit to determine the length of time required for the suction unit to reach the mounting position in the search process.

  In the surface mounting machine, the component mounting apparatus includes a mounting unit on which a plurality of the suction units are mounted, the component supply device includes a plurality of the component supply positions, and the plurality of the suction units include , The component is sucked from each of the plurality of component supply positions of the component supply device and mounted on the plurality of mounting positions on the substrate, and the suction unit sucks the component in the order information. Information about a plurality of turns is included, and the search processing executed by the search processing unit changes the order of the turns between the plurality of turns. The first search process for searching for the other movement path by switching the suction order and the mounting order, and between the plurality of suction units and the plurality of component supply positions in one turn. At least one Wherein the second search processing to search for the other movement path by replacing the mounting order between the plurality of the mounting device on the substrate with interchanged adsorption sequence may contain.

  According to this configuration, a plurality of search processes, that is, the first search process and the second search process are performed as specific processes for searching the other movement route by switching the suction order and the mounting order. Therefore, the search accuracy of the other travel route can be improved as compared with the case where the specific process for searching for the other travel route is a single search process. For this reason, when the interruption work occurs in the mounting work, the other movement path is easily detected, and the loss time in the component mounting work can be effectively reduced.

  In the above surface mounting machine, the interruption working unit includes a discarding unit, and the control unit recognizes the suction state of the component sucked by the suction unit, and the suction recognized by the recognition unit. A determination processing unit that executes a determination process for determining whether or not the state is good, and the interrupting operation includes discarding the part that is not in the suction state to the discarding unit, and The processing unit may execute the interrupt processing when the determination processing unit determines that the suction state is not good in the determination processing.

  From the viewpoint of mounting accuracy of components on the substrate, it is not preferable to mount a component recognized as having a poor suction state on the substrate. According to the above configuration, by performing an interrupting operation for discarding a component recognized as being in an unsatisfactory state in the disposal unit as an interruption process, a new component can be attracted to the adsorption unit in which the component has been attracted. It can suppress and it can suppress that the mounting accuracy of the component with respect to a board | substrate falls. In addition, specific work can be provided for interrupt work.

  In the surface mounting machine, the search processing unit may determine the determination of the component that the determination processing unit determines that the suction state is not good in the determination processing when the interrupt processing unit executes the interrupt processing. The search process may be executed on the condition that the suction unit is not set to suck again immediately after the process.

  If it is set to suck again a component that has been recognized that the picked-up state of the component is not good, it is necessary to pick up and mount the component again through the same movement path, so that it is not necessary to execute a search process. According to the above configuration, the search process is performed on the condition that the component that is recognized as being in a poorly picked state is not set to be picked up again. This can suppress the loss time in the component mounting operation.

  In the surface mount machine, the interrupt working unit includes a base mark for correcting the position of the suction unit in the plate surface direction of the substrate, and moves with the suction unit to capture the base mark. The control unit includes a correction processing unit that executes a correction process for correcting the position of the suction unit based on an image captured by the mark imaging unit, Including imaging by the mark imaging unit, the interrupt processing unit may execute the interrupt processing at a preset time interval.

  According to this configuration, the base mark is imaged at a preset time interval, and the work of correcting the position of the suction part is performed as an interrupting work, so that the position accuracy of the suction part can be increased, thereby The mounting accuracy of components can be increased. In addition, specific work can be provided for interrupt work.

  Another technique disclosed in the present specification includes a transport device that transports a substrate, a plurality of component supply devices that supply components, and a suction unit that sucks the components, and the suction unit includes the plurality of components. By moving between the supply device and the transfer device, the component is picked up from one of the component supply positions of the plurality of component supply devices, and is transported by the transfer device. A component mounting apparatus that performs a mounting operation to be mounted at the mounting position, an interrupt working unit that is provided within a moving range of the suction unit, and that performs an interrupting operation to interrupt the mounting work and is performed on the suction unit; A component mounting method for mounting the component on the substrate in a surface mounting machine comprising: mounting the component at the mounting position on the substrate in the mounting operation; An interruption step of moving to the interruption work position of the cut-in work unit and performing the interruption work, and when performing the interruption step, the suction unit passes through the pick-up of the part at the component supply position from the interruption work position. By changing the order of picking up the components and the order of mounting the components on the board, the time required for the suction portion to reach the mounting position is changed to the order information. A search step for searching for another movement route that is shorter than the movement route based on the information, and when the search step is performed, the movement route of the suction unit is changed from the movement route based on the order information to the other movement route. A component mounting method.

  According to the technology disclosed in this specification, it is possible to reduce the loss time in the component mounting operation.

The top view of the surface mounting machine concerning Embodiment 1 Enlarged front view of the head unit viewed from the front Enlarged front view of the head unit viewed from the front when imaging the component sucked by the suction nozzle Block diagram showing the electrical configuration of the surface mounter Flow chart showing the flow of mounting work on one board Flow chart showing the flow of 1-turn suction mounting process Flow chart showing the flow of the movement path detection process Plan view showing the movement path of the head unit from the component supply position through the mounting position to the disposal position The top view which shows an example of the movement route based on order information, and other movement routes The top view which shows an example of the movement path | route according to the mounting order based on the order information in one turn The top view which shows an example of the movement path | route according to the mounting order based on the order information in one turn The top view of the surface mounting machine which concerns on the modification of Embodiment 1. The top view which shows an example of the movement path | route based on order information, and another movement path | route in the modification of Embodiment 1 Plan view of a surface mounter according to Embodiment 2 The block diagram which shows the electrical constitution of the surface mounting machine which concerns on Embodiment 2. FIG. Flow chart showing the flow of base mark imaging processing Plan view showing the movement path of the head unit from the component supply position through the mounting position to the imaging position The top view which shows an example of the movement route based on order information in Embodiment 2, and another movement route

(Overall configuration of surface mounter)
Embodiment 1 will be described with reference to the drawings. In this embodiment, the surface mounter 1 shown in FIG. 1 is illustrated. The surface mounter 1 mounts a base 10, a transport conveyor (an example of a transport device) 20 for transporting a printed board (an example of a board) S <b> 1, and an electronic component (an example of a part) E <b> 1 on the printed board B <b> 1. Component mounting apparatus 30 to be used, a plurality of feeder type supply apparatuses (an example of a component supply apparatus) 40A, 40B, 40C, and 40D for supplying electronic component E1 to component mounting apparatus 30, and electronic component E1 are discarded. And a discarding unit (an example of an interruption working unit).

  The base 10 has a rectangular shape in plan view and a flat upper surface. In addition, a backup plate (not shown) for backing up the printed circuit board B1 when the electronic component E1 is mounted on the printed circuit board B1 is provided below the transport conveyor 20 in the base 10. In the following description, the long side direction of the base 10 (left-right direction in FIG. 1) and the transport direction of the transport conveyor 20 are defined as the X-axis direction, and the short side direction of the base 10 (vertical direction in FIG. 1) is the Y-axis direction. The vertical direction of the base 10 (the vertical direction in FIG. 2) is taken as the Z-axis direction.

  The transport conveyor 20 is disposed at a substantially central position of the base 10 in the Y-axis direction, and transports the printed circuit board B1 along the transport direction (X-axis direction). The conveyor 20 includes a pair of conveyor belts 22 that circulate in the conveying direction. The printed circuit board B1 is set so as to be installed on both conveyor belts 22. In the present embodiment, the printed circuit board B1 is carried from one side (right side shown in FIG. 1) in the transport direction along the conveyor belt 22 to a work position on the base 10 (position surrounded by a two-dot chain line in FIG. 1). Then, after stopping at the work position and mounting the electronic component E1, it is carried out along the conveyor belt 22 to the other side (left side shown in FIG. 1).

  Feeder type supply devices 40A, 40B, 40C, and 40D are arranged at a total of four locations, two at a time along the X-axis direction on both sides (upper and lower sides in FIG. 1) of the conveyor 20. Hereinafter, the two feeder-type supply devices 40A and 40B arranged on the upper side of FIG. 1 are referred to as a first feeder-type supply device 40A and a second feeder-type supply device 40B in order from the left side of FIG. The two feeder-type supply devices 40C and 40D arranged on the lower side are referred to as a third feeder-type supply device 40C and a second feeder-type supply device 40D in order from the left side of FIG.

  Each feeder type supply device 40A, 40B, 40C, 40D has the same configuration, and each feeder type supply device 40A, 40B, 40C, 40D has a plurality of feeders 42 arranged side by side in a line. . Each feeder 42 includes a reel (not shown) around which a component supply tape (not shown) in which a plurality of electronic components E1 are accommodated, an electric delivery device (not shown) that draws the component supply tape from the reel, and the like. It has. Each feeder 42 has an end portion positioned on the conveyor 20 side arranged on the base 10 to be a component supply position P1, and the electronic components E1 are supplied one by one from the component supply position P1. It has become.

  In the present embodiment, each feeder type supply device 40A, 40B, 40C, 40D accommodates a different type of electronic component E1 for each feeder 42. Accordingly, for example, a certain type of electronic component E1 includes one feeder 42 in the first feeder type supply device 40A, one feeder 42 in the second feeder 40B, and one feeder in the third feeder type supply device 40C. 42 and one feeder 42 in the fourth feeder type supply device 40D.

  The component mounting apparatus 30 includes a pair of support frames 31 provided above the base 10 and feeder-type supply devices 40A, 40B, 40C, 40D, a head unit 32, and a head unit drive mechanism that drives the head unit 32. Consists of Each support frame 31 is located on both sides of the base 10 in the X-axis direction, and extends in the Y-axis direction. The support frame 31 is provided with an X-axis servo mechanism and a Y-axis servo mechanism that constitute a head unit drive mechanism. The head unit 32 can be moved in the X-axis direction and the Y-axis direction within a certain movable region by the X-axis servo mechanism and the Y-axis servo mechanism.

  The Y-axis servo mechanism is attached to each Y-axis guide rail 34Y extending in the Y-axis direction and attached to each Y-axis guide rail 34Y so as to extend in the Y-axis direction. A screwed Y-axis ball screw 36Y and a Y-axis servomotor 38Y attached to the Y-axis ball screw 36Y are provided. A head support 39 fixed to the ball nut is attached to each Y-axis guide rail 34Y so as to extend in the X-axis direction. When the Y-axis servo motor 38Y is energized and controlled, the ball nut advances and retreats along the Y-axis ball screw 36Y. As a result, the head support 39 fixed to the ball nut and the head unit 32 to be described below are connected to the Y-axis. It moves in the Y-axis direction along the guide rail 34Y.

  The X-axis servo mechanism is attached to the head support 39 in the form of an X-axis guide rail 34X (see FIG. 2) installed on the head support 39 so as to extend in the X-axis direction, and is not shown. An X-axis ball screw 36X into which a ball nut is screwed and a Y-axis servo motor 38X attached to the X-axis ball screw 36X are provided. A head unit 32 is movably attached to the X-axis guide rail 34X along its axial direction. When the X-axis servomotor 38X is energized and controlled, the ball nut advances and retreats along the X-axis ball screw 36X. As a result, the head unit 32 fixed to the ball nut moves along the X-axis guide rail 34X in the X-axis direction. Move to.

  The head unit 32 takes out the electronic component E1 supplied from the feeder type supply device 40 onto the base 10 and mounts it on the printed board B1. As shown in FIG. 2, the head unit 32 includes a first frame 32A and a second frame 32B that are disposed so as to sandwich the head support 39 in the Y-axis direction. A plurality of suction nozzles 62 that perform the mounting operation of the electronic component E1 are mounted in a row. As shown in FIG. 3, each suction nozzle 62 includes a head portion 62A that protrudes downward from the lower surface of the head unit 32, and a nozzle portion 62B provided at the tip of the head portion 62A. The lower end portion of the nozzle portion 62B in each suction nozzle 62 is a suction port that sucks the electronic component E1 by negative pressure.

  Each suction nozzle 62 can be rotated around its axis by an R-axis servomotor 38R (see FIG. 4) or the like. Each suction nozzle 62 can be moved up and down with respect to the first frame 32A of the head unit 32 by driving a Z-axis servomotor 38Z (see FIG. 4) or the like.

  In the following, the suction nozzle 62 provided in the head unit 32 moves between each feeder type supply device 40A, 40B, 40C, 40D and the transfer conveyor 20, so that each feeder type supply device 40A, 40B, 40C, The electronic component E1 is sucked by the suction nozzle 62 from any one of the component supply positions P1 of 40D and then mounted on the mounting position P2 on the printed circuit board B1 transported to the work position by the transport conveyor 20. A series of work up to this is referred to as mounting work. In the surface mounting machine 1, the mounting operation of the electronic component E1 is performed by driving the various servo motors 38X, 38Y, 38Z, and 38R. In this embodiment, it is assumed that the moving speed of the head unit 32 is constant.

  As shown in FIGS. 2 and 3, the head unit 32 is provided with a substrate recognition camera (an example of a mark imaging unit) C1. The board recognition camera C <b> 1 is fixed to the head unit 32 with the imaging surface facing downward, and is configured to move integrally with the head unit 32. Therefore, by driving the X-axis servo mechanism and the Y-axis servo mechanism described above, an image at an arbitrary position on the printed board B1 stopped at the work position can be taken by the board recognition camera C1.

  As shown in FIG. 2, the head support 39 is provided with a camera unit 39C extending downward. The camera unit 39C is fixed to the head support 39, and at the lower end thereof, the component side surface recognition is performed with the imaging surface facing the suction nozzle 62 side (one side in the Y-axis direction, the front side in FIG. 2). A camera (an example of an imaging unit) C2 is provided. When the head unit 32 moves in the X-axis direction and is positioned on the front side of the component side recognition camera C2 (the state shown in FIG. 3), the component side recognition camera C2 has the first frame of the head unit 32 in the Y axis direction. It is located between 32A and the second frame 32B. In this state, the component side recognition camera C2 captures an image of the side surface of the electronic component E1 sucked by the suction nozzle 62.

  As shown in FIGS. 2 and 3, a camera rail 32C extending along the X-axis direction is installed on the lower end portion of the second frame 32B of the head unit 32 on the surface directed toward the first frame 32A. Has been. The camera rail 32C is installed below the lower end of each suction nozzle 62, and a component bottom surface recognition camera C3 is movably attached to the camera rail 32C along its axial direction. The component bottom surface recognition camera C3 has its imaging surface facing upward, and the component bottom surface recognition camera C3 moves in the X-axis direction and is positioned below the suction nozzle 62 (the state shown in FIG. 3). An image of the bottom surface of the electronic component E1 adsorbed by the nozzle 62 is taken.

  The disposal unit 50 has a substantially box shape that opens upward, and is provided within the movement range of the head unit 32, specifically, between the transport conveyor 20 on the base 10 and the first feeder type supply device 40A. It has been. In this embodiment, when the suction state of the electronic component E1 sucked by the suction nozzle 62 is not good, the electronic unit E1 is moved to the disposal position of the disposal unit 50 by moving the head unit 32 above the disposal unit 50. An example of an interrupt work position) It is discarded at P3.

(Electrical configuration of surface mounter)
Next, the electrical configuration of the surface mounter 1 will be described with reference to FIG. The main body of the surface mounter 1 is entirely controlled by the control unit 70. The control unit 70 includes an arithmetic processing unit 71 configured by a CPU or the like. The arithmetic processing unit 71 includes a motor control unit 72, a storage unit 73, an image processing unit 74, an external input / output unit 75, a determination processing unit 76A, an interrupt processing unit 76B, a search processing unit 76C, and a change. The processing unit 76D, the display unit 77, and the input unit 78 are connected to each other.

  The motor control unit 72 drives the X-axis servo motor 38X, the Y-axis servo motor 38Y, the Z-axis servo motor 38Z, and the R-axis servo motor 38R of each head unit 32 according to a mounting program 73A described later. Moreover, the motor control part 72 drives the conveyance conveyor 20 according to the mounting program 73A.

  The storage unit 73 includes a ROM (Read Only Memory) that stores a program for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. The storage unit 73 stores a mounting program 73A and various data 73B described below.

  Specifically, the mounting program (an example of order information) 73A stored in the storage unit 73 includes board information relating to the number of printed board B1 to be mounted and the number of electronic components E1 mounted on the printed board B1. Component information including the type, thickness, etc., mounting position information regarding the mounting position of the electronic component E1 on the printed circuit board B1, and the like.

  In the component information, the suction of the electronic component E1 such as which component supply position P1 from among the component supply positions P1 of the feeder-type supply devices 40A, 40B, 40C, and 40D is picked up in what order. Contains information about the order. The mounting position information includes information regarding the mounting order of the electronic components E1, such as the order in which the electronic components E1 are mounted with respect to the mounting position of the electronic component E1 on the printed circuit board B1.

  In the mounting program, the electronic nozzle is mounted on one printed circuit board to be mounted, with a series of operations from when the suction nozzle picks up a plurality of electronic components to mounting on the printed circuit board as one turn. Contains information about the multiple turns it takes to finish. Note that the order of picking up the electronic component E1, the mounting order of the electronic component E1, and the order of the plurality of turns based on the mounting program 73A described above are interrupted during the mounting work of the electronic component E1, such as disposal of the electronic component E1. If not, the head unit 32 (suction nozzle 64) that reciprocates between the component supply position P1 and the mounting position P2 is set in advance in the order in which the moving path is shortest in the plurality of turns.

  The various data 73B stored in the storage unit 73 includes data regarding the number and types of electronic components E1 held in the feeders 42 of the feeder-type supply devices 40A, 40B, 40C, and 40D. .

  An image processing unit (an example of a recognition unit) 74 is configured to capture image signals output from various recognition cameras C1, C2, and C3. In the image processing unit 74, analysis of the substrate image, analysis of the suction nozzle image, and analysis of the electronic component image are performed based on the captured image signals from the various recognition cameras C1, C2, and C3. . Further, the image processing unit 74, based on the imaging signals from the component side recognition camera C2 and the component bottom recognition camera C3, picks up the electronic component E1 sucked by the suction nozzle 62, specifically, the electronic component E1. The height position of the lower end, the suction angle of the electronic component E1 around the axis of the suction nozzle 62, the inclination angle of the electronic component E1 with respect to the suction port of the suction nozzle 62, and the like are recognized.

  The external input / output unit 75 is a so-called interface, and is configured to receive detection signals output from various sensors 75 </ b> A provided in the main body of the surface mounter 1. The external input / output unit 75 is configured to perform operation control on various actuators 75 </ b> B provided in the main body of the surface mounter 1 based on a control signal output from the arithmetic processing unit 71.

  The determination processing unit 76A determines whether or not the suction state of the electronic component E1 recognized by the image processing unit 74 is good. For example, with respect to the suction angle of the electronic component E1, an angle range in which the suction state is considered to be good is set in advance for each type of electronic component E1, and the suction angle of the electronic component E1 is within the angular range. It is judged that the adsorption state is good.

  The interrupt processing unit 76B moves the suction nozzle 62 to the discarding position P3 of the discarding unit 50 after mounting the electronic component E1 in a good suction state in the mounting operation of the electronic component E1 at the mounting position P2 on the printed circuit board B1. The electronic component E1 having an unsatisfactory suction state is discarded.

  The search processing unit 76C changes the suction order and the mounting order of the electronic components E1 on the movement path from the disposal position P3 to the mounting position P2 through the component supply position P1, so that the suction nozzle 62 can be changed. A search is made for another moving route in which the time required to reach the mounting position P2 is shorter than the moving route based on the mounting program 73A.

  The change processing unit 76D changes the movement path of the suction nozzle 62 from the movement path based on the mounting program 73A to the other movement path.

  The display unit 77 includes a liquid crystal display device having a display screen and displays the state of the surface mounter 1 on the display screen. The input unit 78 is composed of a keyboard or the like, and accepts input from the outside by manual operation.

(Operation mode of surface mounter)
In the surface mounter 1 of the present embodiment, during the automatic operation, the transport state in which the printed board B1 is transported by the transport conveyor 20 and the mounting state in which the electronic component E1 is mounted are alternately executed.

  In the surface mounting machine 1 of the present embodiment, the controller 70 sucks the plurality of electronic components E1 from the component supply position P1 by the suction nozzle 62 in the mounting operation, and then the head unit 32 is mounted on the printed board B1 at the mounting position P2. Before moving to, the suction state of the sucked electronic component E1 is recognized. In the present embodiment, when there is an electronic component E1 with a poor suction state, the control unit 70 does not have a good suction state after mounting the electronic component E1 with a good suction state on the mounting position P2 on the printed circuit board B1. The electronic component E1 is discarded in the disposal unit 50.

  In the surface mounter 1 of the present embodiment, it is assumed that the electronic component E1 in an unsatisfactory suction state is not set to suck the same type of electronic component E1 again immediately after being discarded. In the following, only the first feeder-type supply device 40A and the third feeder-type supply device 40C among the four feeder-type supply devices provided in the surface mounter 1 are used in the mounting operation of the electronic component E1. Will be described.

(Processing executed by the control unit in the mounting work for one board)
The surface mounter 1 according to the present embodiment has the above-described configuration and operation mode. Next, in the surface mounter 1, in the mounting work for one printed circuit board B1 stopped at the work position, the control unit 70 The processing to be executed will be described with reference to the flowchart shown in FIG. A series of processing shown below is basically executed by the control unit 70 based on the mounting program 73A described above.

  When the printed circuit board B1 is transported to the work position on the base 10 and the mounting operation is started, the control unit 70 first completes mounting of the electronic component E1 on one printed circuit board B1 stopped at the work position. Information regarding the picking order of the electronic components E1 of all the turns, information regarding the mounting order of electronic components, and information regarding the turn order (hereinafter, these pieces of information are collectively referred to as “order information”) from the storage unit 73. Read (S2).

  Next, the control part 70 specifies the order information in the next turn from the order information of all the turns read in S2 (S4). Therefore, in the process of S4 that is executed immediately after the control unit executes the process of S2, the control unit specifies information about the electronic component E1 suction order and information about the mounting order of the electronic component E1 in the first turn.

  Next, the control unit 70 executes suction mounting processing (one turn suction mounting processing) in one turn based on the order information specified in S4 (S6). When the suction mounting process in one turn is finished, the control unit 70 determines whether all the turns are finished, that is, whether the mounting work for one printed circuit board B1 is finished (S8).

  When the control unit 70 determines that all the turns have been completed in S8 (S8: YES), the mounting operation for one printed circuit board B1 is completed. When the control unit 70 determines that all the turns are not completed in S8 (S8: NO), the control unit 70 returns to S4. Therefore, in the process of S4 after the mounting work in the first turn is completed, the control unit 70 specifies information on the electronic component E1 suction order and information on the electronic component E1 mounting order in the second turn.

(1 turn suction mounting process)
Next, the one-turn suction mounting process executed by the control unit 70 in S6 will be described with reference to the flowchart shown in FIG. In the one-turn suction mounting process, the control unit 70 first sucks an unmounted electronic component E1 not mounted on the printed circuit board B1 from the component supply position P1 based on the order information (S12).

  Next, the control unit 70 images each electronic component E1 sucked in S12 with the component side recognition camera C2 and the component bottom recognition camera C3, and recognizes the suction state of each electronic component E1 from the captured image (S14). Next, the determination processing unit 76A of the control unit 70 determines whether the electronic component E1 recognized in S14 is good or bad, and whether there is an electronic component E1 with a poor suction state, that is, an electronic component E1 with poor suction. It is determined whether or not (S16). The process executed by the determination processing unit 76A of the control unit 70 in S16 is an example of the determination process.

  When it is determined in S16 that there is no electronic component E1 whose suction state is not good (S16: NO), that is, when it is determined that there is no electronic component E1 with poor suction, all the electronic components sucked in S12 E1 is mounted on the printed circuit board B1 based on the order information (S18), and the one-turn suction mounting process is completed.

  When the controller 70 determines that there is an electronic component with a poor suction state in S16, only the electronic component E1 that is determined to have a good suction state among the electronic components is printed on the printed circuit board B1 based on the order information. Mounting is performed at the mounting position P2 (S20). Next, the interrupt processing unit 76B of the control unit 70 moves the head unit 32 (suction nozzle 62) onto the disposal unit 50 (S22).

  Next, the interrupt processing unit 76B of the control unit 70 discards the electronic component E1 determined to be in an unsatisfactory state among the electronic components E1 to the disposal position P3 of the disposal unit 50 (S24), and proceeds to S26. Note that the processing executed in S22 and S24 by the interrupt processing unit 76B of the control unit 70 is an example of interrupt processing.

  Here, FIG. 8 shows a movement path (shown in FIG. 8) for the head unit 32 to which the respective suction nozzles 62 are mounted until it reaches the disposal position P3 through the mounting position P2 after sucking the parts at the parts supply position P1. An example is shown). In the example shown in FIG. 8, the controller 70 adsorbs the electronic component E1 at the component supply position P1 of the third feeder type supply device 40C, and then moves the head unit 32 onto the printed circuit board B2 so that the adsorbed state is good. The electronic component E1 is mounted at the mounting position P2, and then the head unit 32 is moved onto the discarding unit 50 to discard the electronic component E1 having a poor suction state at the discarding position P3.

  The continuation of the flowchart shown in FIG. 6 will be described. In S <b> 26, the control unit 70 determines whether or not the electronic component E <b> 1 with a poor suction state is set to suck the same type of electronic component E <b> 1 again immediately after being discarded. In this embodiment, since it is not set as mentioned above as mentioned above, the control part 70 judges that it is not set to adsorb | suck again by S26 (S26: NO), and transfers to S28. If such a setting is made, the control unit 70 determines that the suction is set again in S26 (S26: YES), and returns to S12.

  In S28, the control unit 70 changes the suction order of the electronic component E1 and the mounting order of the electronic component E1, so that the suction nozzle 62 sucks the electronic component E1 from the disposal position P3 to the component supply position P1, and then the mounting position P2. A movement route detection process is performed for detecting a movement route (hereinafter referred to as “another movement route”) in which the time required to reach is shorter than the movement route based on the order information. When the movement route detection process ends, the control unit 70 ends the one-turn suction mounting process. Hereinafter, the movement path from the disposal position P3 to the mounting position P2 after the electronic component E1 is sucked from the disposal position P3 to the mounting position P2 is simply referred to as “movement path”. .

(Movement route detection process)
Next, the movement detection process executed by the control unit 70 in S28 will be described with reference to the flowchart shown in FIG. In the movement path detection process, the search processing unit 76C of the control unit 70 first switches the turn order between the plurality of turns read in S2, thereby switching the suction order of the electronic component E1 and the mounting order of the electronic component E1. Thus, the other travel route is searched (S32), and the process proceeds to S34. Note that the process executed by the search processing unit 76C of the control unit 70 in S32 is an example of a first search process.

  Here, FIG. 9 shows an example of a travel route based on the order information and another travel route. For example, in the movement detection process executed in the suction mounting process in the first turn, based on the order information, the movement path follows the suction order of the electronic component E1 and the mounting order of the electronic component E1 in the second turn. In the example shown in FIG. 9, the moving path of the second turn according to the mounting order is indicated by a dashed arrow, and this moving path moves the electronic component E1 from the component supply position P1 of the third feeder type supply device 40C. It becomes a moving path to be adsorbed.

  On the other hand, by changing the order of the turns as described above, the next movement path can be changed to a movement path according to, for example, the suction order of the electronic component E1 and the mounting order of the electronic component E1 of the eighth turn. In the example shown in FIG. 9, the movement path of the eighth turn is indicated by a practical arrow, and this movement path moves the electronic component E1 from the component supply position P1 of the first feeder-type supply device 40A close to the disposal unit 50. It becomes a moving path to be adsorbed.

  In the example shown in FIG. 9, the movement path (solid arrow shown in FIG. 9) when the turn order is changed is more than the movement path (broken arrow shown in FIG. 9) based on the order information. The distance is shortened, and the time required for the head unit 32 (suction nozzle 62) to reach the mounting position P2 is also shortened.

  The continuation of the flowchart shown in FIG. 7 will be described. In S34, the control unit 70 determines whether or not the other movement route is detected in S32. When the control unit 70 determines that another movement route is detected in S32 (S34: YES), the control unit 70 proceeds to S40. If the control unit 70 determines in S32 that no other movement route is detected (S34: NO), the control unit 70 proceeds to S36.

  In S40, the change processing unit 76D of the control unit 70 changes the movement path of the head unit 32 (suction nozzle 62) in the next turn to the other movement path detected in S32, and proceeds to S36. In addition, the process which the change process part 76D of the control part 70 performs by S40 is an example of a change process.

  In S36, the search processing unit 76D of the control unit 70 changes the suction order between the plurality of suction nozzles 62 in one turn and also changes the mounting order between the plurality of mounting positions P2 on the printed circuit board B1. The other travel route is searched and the process proceeds to S38. The process executed by the search processing unit 76C of the control unit 70 in S36 is an example of a second search process.

  Here, FIG. 10 shows an example of a movement route according to the mounting order based on the order information in one turn. For example, when the electronic component E1 is not discarded to the discarding unit 50, the suction order of the electronic component E1 and the mounting order of the electronic component E1 in the turn in the next turn are indicated by broken-line arrows in FIG.

  In the example shown in FIG. 10, four electronic components E1 are sequentially sucked from one component supply position P1 of the first feeder type supply device 40A using four suction nozzles 62. At this time, among the four suction nozzles 62 to be used, the electronic components E1 are sucked in order from the suction nozzle 62 on the side closer to the component supply position P1, that is, in order from the suction nozzle 62 located on the left side in FIG. (See the numbers 1 to 4 attached to the four suction nozzles 62). After that, among the four mounting positions P2 on the printed circuit board B1, the mounting position P2 closer to the position of the head unit 32 immediately after the electronic component E1 is picked up, that is, the mounting position P2 positioned on the left side in FIG. The electronic component E1 is mounted (see the numbers 1 to 4 attached to the mounting position P2 in FIG. 10).

  FIG. 11 shows an example of the movement path when the order of sucking the electronic components E1 and the mounting order of the electronic components E1 in one turn are switched. For example, when the electronic component E1 is discarded to the discarding unit 50, the suction order of the electronic component E1 and the mounting order of the electronic component E1 in the turn in the next turn are indicated by solid arrows in FIG.

  In the example shown in FIG. 11, among the four suction nozzles 62 to be used, the electronic components E1 are sucked in order from the suction nozzle 62 on the side closer to the component supply position P1, that is, in order from the suction nozzle 62 located on the right side in FIG. (Refer to the numbers 1 to 4 assigned to the four suction nozzles 62 in FIG. 11). After that, among the four mounting positions P2 on the printed circuit board B1, the mounting position P2 closer to the position of the head unit 32 immediately after the electronic component E1 is picked up, that is, the mounting position P2 positioned on the right side in FIG. The electronic component E1 is mounted (see the numbers 1 to 4 attached to the mounting position P2 in FIG. 11).

  Since the suction nozzle 62 on the side close to the component supply position P1 is different between the case where the electronic component E1 is not discarded to the disposal unit 50 and the case where it is discarded to the disposal unit 50 as described above, the electronic component E1 is disposed in the disposal unit. When discarded to 50, the suction order is changed so that the moving path of the head unit 32 (suction nozzle 62) becomes shorter for the four suction nozzles 62 to be used. Furthermore, the position of the head unit 32 immediately after adsorbing the plurality of electronic components E1 differs between when the electronic component E1 is not discarded into the disposal unit 50 and when it is discarded into the disposal unit 50. When discarded to the discard unit 50, the mounting order is changed so that the movement path of the head unit 32 (suction nozzle 62) is shortened at the four mounting positions P2. Thus, when the electronic component E1 is discarded to the disposal unit 50, the moving path of the head unit 32 (suction nozzle 62) can be shortened by switching the suction order and the mounting order within one turn. .

  The continuation of the flowchart shown in FIG. 7 will be described. In S38, the control unit 70 determines whether or not the other movement route is detected in S36. When the control unit 70 determines that another movement route is detected in S38 (S38: YES), the control unit 70 proceeds to S42. If the control unit 70 determines in S38 that no other movement route has been detected (S38: NO), the control unit 70 ends the movement route detection process.

  In S42, the change processing unit 76D of the control unit 70 changes the movement path of the head unit 32 (suction nozzle 62) in the next turn to the other movement path detected in S36, and ends the movement path detection process. In addition, the process which the change process part 76D of the control part 70 performs by S40 is an example of a change process.

(Effect of Embodiment 1)
As described above, in the surface mounter 1 according to the present embodiment, when an interrupting operation occurs in the mounting operation, that is, when the interrupt processing unit 76B discards the electronic component E1, the search processing unit 76C performs the electronic component E1 suction sequence. In addition, by changing the mounting order of the electronic components E1, a search is made for another moving path in which the time required for the suction nozzle 62 to reach the mounting position P2 is shorter than the moving path based on the order information. When another movement route is detected, the change processing unit 76D changes the movement route of the suction nozzle 62 from the movement route based on the order information to another movement route. For this reason, even if the interruption work occurs, when another movement path is detected, the mounting operation of the electronic component E1 is performed as compared with the case where the suction nozzle 62 is moved along the movement path based on the order information. Loss time can be reduced.

  In this embodiment, for example, the electronic component suction order is switched between a plurality of surface mounters, which is different from the conventional technique that suppresses the cycle time delay when the entire line of the mounting operation is viewed. As described above, it can be executed in one surface mounter 1, and the loss time itself in the mounting operation of the electronic component E1 can be reduced. For this reason, there is no need to perform operations such as exchange of electronic components between a plurality of surface mounters.

(Modification of Embodiment 1)
A modification of the first embodiment will be described with reference to FIGS. 12 and 13. This modification differs in the arrangement of the component bottom surface recognition camera C4 provided in the surface mounting machine 101 and a part of the movement path of the head unit 32 (suction nozzle 62) in the mounting operation. Other configurations and the processes executed by the control unit 70 are the same as those in the first embodiment, and thus the description thereof is omitted.

  In this modification, as shown in FIG. 12, the two component bottom surface recognition cameras C4 are not provided in the head unit 32 but are provided on the base 10 of the surface mounter. Specifically, the two component bottom surface recognition cameras C4 are provided between the first feeder type supply device 40A and the second feeder type supply device 40B, and between the third feeder type supply device 40C and the fourth feeder type supply. Each is provided between the devices 40D.

  With such a configuration, in order to capture an image of the bottom surface of the electronic component E1 sucked by the suction nozzle 62, it is necessary to move the head unit to above the component bottom surface recognition camera C3. For this reason, in the example shown in FIG. 13, the movement path of the head unit 32 (suction nozzle 62) passes from the disposal position P3 through the component supply position P1 and then departs above the component bottom surface recognition camera C4 before mounting. This is a route to reach the position P2. In FIG. 13, similarly to FIG. 9, the movement route according to the mounting order is indicated by a dashed arrow, and the movement route when the turn order is changed is indicated by a practical arrow.

  In this modification, even if it is such a structure, as shown in the example of FIG. 13, the suction nozzle 62 is mounted by switching the electronic component E1 suction order and the mounting order of the electronic component E1. It is possible to search for another travel route in which the time required to reach the position P2 is shorter than the travel route based on the order information. For this reason, the loss time in the mounting operation of the electronic component E1 can be reduced.

(Embodiment 2)
The second embodiment will be described with reference to FIGS. 14 to 18. This embodiment is different from that of the first embodiment in a part of the configuration of the surface mounter 201 and the manner of the interrupt work performed in the mounting work of the electronic component E1. Other configurations and the processes executed by the control unit 70 are the same as those in the first embodiment, and thus the description thereof is omitted.

  In the surface mounter 201 according to the present embodiment, the disposal unit 50 is not provided on the base 10 as in the first embodiment, and as shown in FIG. Within the range of movement of the unit 32, a base mark (an example of an interrupting work unit) 150 having a substantially circular shape in plan view is provided. Specifically, the base mark 150 is provided between the transport conveyor 20 on the base 10 and the first feeder type supply device 40A.

  The base mark 150 is a mark for correcting the position of the head unit 32 (suction nozzle 62) in the plate surface direction (XY plane direction) of the printed circuit board B1. In this embodiment, as shown in FIG. 15, a correction processing unit 76E is further connected to the arithmetic processing unit 71 of the control unit 70.

  In the present embodiment, an image of the base mark 150 is captured by the substrate recognition camera C1, and the image processing unit 74 analyzes the captured image. The correction processing unit 76D corrects the position of the head unit 32 (suction nozzle 62) based on the analyzed image. In the present embodiment, it is set so that the base mark 150 is imaged at intervals of 3 minutes in the mounting operation of the electronic component E1. In FIGS. 17 and 18, the substrate recognition camera C1 is shown in the drawing for the sake of explanation.

  That is, the control unit 70 executes base mark imaging processing for periodically imaging the base mark 150 in the mounting operation of the electronic component E1. Here, the base mark imaging process executed by the control unit 70 will be described with reference to the flowchart shown in FIG. The arithmetic processing unit 71 of the control unit 70 includes a built-in timer, and when a preset time (3 minutes in the present embodiment) elapses in the mounting operation of the electronic component E1 (at a preset time interval), the control is performed. The interrupt processing unit 76B of the unit 70 first moves the head unit 32 (suction nozzle 62) to the imaging position (an example of the interrupt work position) P4 of the base mark 150 (S112), and proceeds to S114. Specifically, one of the four corners of the head unit 32 in plan view is moved above the base mark 150 (see FIG. 17).

  In the present embodiment, when the work of sucking the electronic component E1 or the mounting work of the electronic component E1 is being performed after 3 minutes have elapsed, the control unit 70, after the work is finished, 62) is moved to the imaging position P4 of the base mark 150.

  In S114, the interrupt processing unit 76B of the control unit 70 captures the base mark 150 by the substrate recognition camera C1, and the correction processing unit 76E of the control unit 70 detects that the head unit 32 (suction nozzle 62) is based on the captured image. Correct the position. Next, the control unit 70 executes the movement detection process described in the first embodiment and ends the base mark imaging process.

  Here, FIG. 17 shows a movement path (shown in FIG. 8) for the head unit 32 to which the respective suction nozzles 62 are mounted, from picking up components at the component supply position P1 to reaching the imaging position P4 through the mounting position P2. An example is shown). In the example shown in FIG. 17, the controller 70 sucks the electronic component E1 at the component supply position P1 of the third feeder type supply device 40C, and then moves the head unit 32 onto the printed circuit board B2 to move the electronic component E1. Since the above-mentioned three minutes have elapsed during the mounting operation after mounting at the mounting position P2, the head unit 32 is moved to the imaging position P4 on the base mark 150 after mounting the electronic component E1, and the base mark 150 is imaged. .

  FIG. 18 shows an example of the travel route based on the order information and the other travel routes in the present embodiment. For example, in the movement detection process executed in the suction mounting process in the fourth turn, based on the order information, the movement path follows the suction order of the electronic component E1 and the mounting order of the electronic component E1 in the fifth turn. In the example shown in FIG. 18, the movement path of the fifth turn according to the mounting order is indicated by a broken-line arrow, and this movement path moves the electronic component E1 from the component supply position P1 of the third feeder type supply device 40C. It becomes a moving path to be adsorbed.

  On the other hand, by changing the turn order as described above, the next movement path can be changed to a movement path according to, for example, the electronic component E1 suction order and the electronic component E1 mounting order of the ninth turn. In the example shown in FIG. 18, the movement path of the ninth turn is indicated by a practical arrow, and this movement path moves the electronic component E1 from the component supply position P1 of the first feeder type supply device 40A close to the base mark 150. It becomes a moving path to be adsorbed.

  In the example shown in FIG. 18, the movement path (solid arrow shown in FIG. 18) when the turn order is changed is more than the movement path (broken arrow shown in FIG. 18) based on the order information. The distance is shortened, and the time required for the head unit 32 (suction nozzle 62) to reach the mounting position P2 is also shortened.

(Effect of Embodiment 2)
According to the surface mounter 201 of this embodiment, the base mark 150 is imaged at a preset time interval (3 minutes in this embodiment) in the mounting operation of the electronic component E1, and the position of the head unit 32 (suction nozzle 62) is determined. Is performed as an interrupting operation, the positional accuracy of the head unit 32 (suction nozzle 62) can be increased, and thereby the mounting accuracy of the electronic component E1 on the printed circuit board B1 can be increased.

  In addition, in the present embodiment, as shown in the example of FIG. 18, the time required for the suction nozzle 62 to reach the mounting position P <b> 2 is changed in order by switching the electronic component E <b> 1 suction order and the mounting order of the electronic components E <b> 1. It is possible to search for another travel route that is shorter than the travel route based on the information. For this reason, the loss time in the mounting operation of the electronic component E1 can be reduced.

(Other embodiments)
The technology disclosed in this specification is not limited to the embodiments described with reference to the above description and the drawings, and for example, the following embodiments are also included in the technical scope.

(1) In each of the above embodiments, the electronic component disposal operation and the base mark imaging operation are illustrated as examples of the interruption operation in the electronic component mounting operation, but the present invention is not limited to this. For example, as an example of an interrupting operation in the electronic component mounting operation, an operation of cleaning the suction nozzle at a preset time interval may be performed. In this case, an interruption working unit for cleaning the suction nozzle may be provided within the movement range of the head unit (suction nozzle).

(2) In the first embodiment, the example in which the other movement route is searched by switching the suction order between the plurality of suction nozzles in one turn has been shown. The other movement path may be searched by switching the suction order between a plurality of component supply positions in a turn, or the suction order may be changed between a plurality of suction nozzles and between a plurality of component supply positions. You may search the said other movement path | route by replacing.

(3) In each of the above embodiments, an example in which only the first feeder type supply device and the third feeder type supply device are used in the mounting operation has been described. However, regarding the feeder type supply device used in the mounting operation. Is not limited, and the number of feeder-type feeders used is not limited.

(4) In each of the above-described embodiments, the example in which the moving speed of the head unit is constant has been described. However, the moving speed of the head unit varies depending on the type of electronic component sucked by the suction nozzle. May be. Even in this case, since the other movement path is detected based on the time required for the suction nozzle to reach the mounting position, it is possible to reduce the loss time in the component mounting operation.

(5) In each of the above embodiments, the feeder-type supply device is exemplified as the component supply device for supplying the electronic component, but the present invention is not limited to this. For example, a tray-type component supply device in which a plurality of electronic components are placed on a tray may be used.

  Each embodiment has been described in detail above, but these are merely examples, and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

DESCRIPTION OF SYMBOLS 1,101,201 ... Surface mounter 10 ... Base 20 ... Conveyor (conveyor)
30 ... Component mounting device 32 ... Head unit (mounting part)
40A, 40B, 40C, 40D ... Feeder type supply device (component supply device)
50 ... Disposal part (interrupt work part)
62 ... Adsorption nozzle (adsorption part)
62A ... head unit 62B ... nozzle unit 70 ... control unit 73 ... storage unit 74 ... image processing unit (recognition unit)
73A ... Implementation program (order information)
76A ... Judgment processing unit 76B ... Interrupt processing unit 76C ... Search processing unit 76D ... Change processing unit 76E ... Correction processing unit 150 ... Base mark (interrupt working unit)
B1 ... Printed circuit board (board)
C1 ... substrate recognition camera (mark imaging unit)
C2 ... Component side recognition camera C3, C4 ... Component bottom recognition camera E1 ... Electronic component (component)
P1 ... Part supply position P2 ... Mounting position P3 ... Disposal position (interrupt work position)
P4 ... Imaging position (interrupt work position)

Claims (7)

A transfer device for transferring a substrate;
A plurality of parts supply devices for supplying parts;
A component having a suction unit that sucks the component, and the suction unit moves between the plurality of component supply devices and the transport device, so that any one of the component supply positions of the plurality of component supply devices A component mounting apparatus that performs a mounting operation for adsorbing the component from a supply position and mounting it on the mounting position on the substrate transported by the transport device;
An interrupting work unit provided within a moving range of the sucking unit, wherein the sucking unit is moved to perform an interrupting work to interrupt the mounting work;
A storage unit that stores order information related to the suction order of the components and the mounting order of the components on the board, and a control unit that controls the component mounting apparatus,
The control unit executes an interrupt process for performing the interrupting work by moving the suction unit to the interrupting work position of the interrupting work part after mounting the component at the mounting position on the substrate in the mounting work. By switching the suction order and the mounting order for the interrupt processing unit and the movement path from the suction work position to the mounting position after the suction of the component at the component supply position from the interrupt work position, A search processing unit that executes a search process for searching for another movement route in which the time required for the adsorption unit to reach the mounting position is shorter than the movement route based on the order information; and the movement route of the adsorption unit A change processing unit that executes a change process for changing from a movement route based on the order information to the other movement route,
The search processing unit executes the search processing when the interrupt processing unit executes the interrupt processing,
The change processing unit is a surface mounter that executes the change processing when the search processing unit detects the other movement path in the search processing.   The surface mounting machine according to claim 1, wherein the search processing unit determines a length of time required for the suction unit to reach the mounting position based on a distance of the moving path. The component mounting apparatus has a mounting portion on which a plurality of the suction portions are mounted,
The component supply device has a plurality of the component supply positions,
The plurality of suction units suck the components from each of the plurality of component supply positions of the component supply device and mount them on the plurality of mounting positions on the substrate,
The order information includes information about the turn a plurality of times, with the operation from the suction part sucking the component to mounting as one turn.
The search process executed by the search processing unit is a first search for searching for the other movement route by changing the order of the turns between the turns and changing the suction order and the mounting order. The mounting order is changed between a plurality of mounting positions on the substrate and at least one of a plurality of the suction portions and a plurality of the component supply positions in a single turn. The surface mounter according to claim 1, further comprising: a second search process for searching for the other movement path by replacing The interruption working unit includes a discarding unit,
The control unit is configured to execute a determination unit that recognizes a suction state of the component sucked by the suction unit and a determination process that determines whether the suction state recognized by the recognition unit is good. A processing unit,
The interrupting operation includes discarding the parts that are not in a good suction state to the disposal unit,
The surface mounting according to any one of claims 1 to 3, wherein the interrupt processing unit executes the interrupt processing when the determination processing unit determines that the suction state is not good in the determination processing. Machine.   When the interrupt processing unit has executed the interrupt processing, the search processing unit immediately after the determination processing, the suction unit for the component that the determination processing unit has determined that the suction state is not good in the determination processing The surface mounter according to claim 4, wherein the search process is executed on the condition that the setting is not set to attract again. The interruption working unit includes a base mark for correcting the position of the suction unit in the plate surface direction of the substrate,
It further includes a mark imaging unit that moves with the adsorption unit and images the base mark,
The control unit includes a correction processing unit that executes a correction process for correcting the position of the suction unit based on an image captured by the mark imaging unit,
The interrupting operation includes imaging the base mark with the mark imaging unit,
The surface mounter according to claim 1, wherein the interrupt processing unit executes the interrupt processing at a preset time interval. A conveyance device that conveys a substrate, a plurality of component supply devices that supply components, and an adsorption unit that adsorbs the components, and the adsorption unit moves between the plurality of component supply devices and the conveyance device In this way, the component mounting is performed such that the component is picked up from any one of the component supply positions of the plurality of component supply devices and mounted on the mounting position on the substrate transported by the transport device. An apparatus, an interrupt working unit provided within a moving range of the suction unit, and an interrupting work unit that performs an interrupting operation that interrupts the mounting operation by moving the suction unit, and a mounting order of the components and mounting of the components on the board A component mounting method for mounting the component on the substrate in a surface mounter including a storage unit in which order information regarding the order is stored ,
An interrupting step of performing the interrupting work by moving the suction part to the interrupting work position of the interrupting work part after mounting the component at the mounting position on the substrate in the mounting work;
When said interrupt step was carried out, the movement path from the suction unit is the interrupt working position until moved to the mounting position through the adsorption of the component at the component supply position, before Ki吸 Chakujunjo and before you A search step of searching for another movement route in which the time required for the suction unit to reach the mounting position is shorter than the movement route based on the order information by changing the mounting order;
When the search step is performed, a change step of changing the movement route of the suction unit from the movement route based on the order information to the other movement route;
A component mounting method comprising:

Images