JP5995307B2 - Recognition device, recognition method, program, and board manufacturing method - Google Patents

Description

  The present technology relates to a recognition device that recognizes the position of a recognition object such as a substrate, a recognition method, and a substrate manufacturing method.

  Conventionally, as a method for recognizing the position of a recognition target object such as a substrate, a method of recognizing the position of the recognition target object by imaging an alignment mark provided on the recognition target object with an imaging unit has been widely used. Yes.

  Japanese Patent Application Laid-Open No. 2004-259542 discloses a mounting apparatus that images an alignment mark provided at two locations on a substrate with an imaging unit from above and corrects a mounting position of an electronic component based on data obtained by the imaging unit. Is described.

JP 2002-076694 A (paragraphs [0002] to [0006] FIG. 12, FIG. 13 etc.)

  A device such as a mounting device has vibrations due to internal factors of the device (for example, vibration due to driving of the device) or vibrations due to external factors (for example, vibration due to driving of other devices, people, objects are close to the device) May vibrate due to vibrations caused by passing through.

  When the apparatus vibrates, the relative position between the imaging unit and the alignment mark is shifted when the imaging unit images the alignment mark. As a result, there is a problem in that an accurate alignment mark position cannot be obtained, and as a result, an accurate position of a recognition target such as a substrate cannot be recognized.

  In view of the circumstances as described above, an object of the present technology is to provide a technology such as a recognition device that can recognize an accurate position of a recognition target object even when vibration occurs.

The recognition apparatus according to the present technology includes an imaging unit and a control unit.
The imaging unit images an alignment mark provided on the recognition object.
The control unit images the alignment mark a plurality of times by the imaging unit, determines alignment mark positions in the plurality of captured images, calculates an average value of the determined alignment mark positions, and calculates The position of the recognition object is recognized according to the average value.

  In the recognition apparatus according to the present technology, the average value of the alignment mark positions acquired by imaging the alignment mark multiple times is used for position recognition of the recognition target object. Position can be recognized.

  In the recognition apparatus, the control unit determines the degree of variation in the alignment mark position based on the alignment mark position in the plurality of images, and determines the number of times the alignment mark is imaged according to the degree of variation. It may be variably controlled.

  There is a correlation between the vibration (amplitude) and the degree of variation of the alignment mark position in the multiple imaging. That is, when the vibration (amplitude) is large, the degree of variation in the alignment mark position is large, and when the vibration (amplitude) is small, the degree of variation in the alignment mark position is small. This recognition apparatus uses this relationship to execute a process of variably controlling the number of times the alignment mark is imaged in accordance with the degree of variation (that is, in accordance with the magnitude of vibration).

  In the recognition apparatus, the control unit may control the number of times the alignment mark is imaged so that the greater the degree of variation, the greater the number of times the alignment mark is imaged.

  This recognition apparatus can appropriately change the number of times the alignment mark is imaged according to the magnitude of vibration.

  The recognition device may further include a storage unit. In this case, the control unit stores the time when the plurality of images are captured and the degree of variation in the storage unit in association with each other, and the variation based on the time and the variation degree data. It is also possible to determine a time zone in which the degree of the image is large, and to control the number of times the alignment mark is imaged so that the number of times the alignment mark is imaged increases in the time zone in which the degree of variation is large.

  In this recognition device, the number of imaging of the alignment mark is increased in a time zone in which vibration is large in one day, and the number of imaging of the alignment mark is decreased in a time zone in which vibration is small.

  In the recognition apparatus, the control unit may image the alignment mark a plurality of times with a certain period by the imaging unit.

  Even if the alignment mark is imaged at a fixed period, random sampling is performed, and the average value of the alignment mark can be calculated as an accurate value.

  The said recognition apparatus WHEREIN: The said control part may image the said alignment mark in multiple times with a random period by the said imaging part.

  Thus, when the alignment mark is imaged at a random cycle, the randomness of random sampling is further improved, and the average value of the alignment mark can be calculated as a more accurate value.

  In the recognition apparatus, the control unit may capture the alignment mark multiple times with a random cycle by adding a random delay to the constant cycle.

The recognition method according to the present technology includes imaging the alignment mark provided on the recognition target object a plurality of times.
The alignment mark positions in the plurality of captured images are determined.
An average value of the determined alignment mark positions is calculated.
The position of the recognition object is recognized according to the calculated average value.

A program according to the present technology is stored in a recognition device.
Imaging the alignment mark provided on the recognition target object a plurality of times;
Determining alignment mark positions in a plurality of captured images;
Calculating an average value of the determined alignment mark positions;
Recognizing the position of the recognition object according to the calculated average value.

The manufacturing method of the board | substrate which concerns on this technique includes imaging the alignment mark provided in the board | substrate several times.
The alignment mark positions in the plurality of captured images are determined.
An average value of the determined alignment mark positions is calculated.
The position of the substrate is recognized according to the calculated average value.
An electronic component is mounted on the board according to the recognized position of the board.

  As described above, according to the present technology, it is possible to provide a technology such as a recognition device that can recognize an accurate position of a recognition target object even when vibration occurs.

It is a front view showing a mounting device concerning a 1st embodiment of this art. It is a top view of the mounting apparatus shown in FIG. It is a block diagram which shows the structure of a mounting apparatus. It is a top view of a substrate. It is a flowchart which shows the process of a mounting apparatus. It is a figure which shows the relative positional relationship of an imaging part and an alignment mark. It is a figure which shows an example of the vibration waveform of a board | substrate and an imaging part. It is a figure which shows the waveform about the relative positional relationship of a board | substrate and an imaging part when a board | substrate and an imaging part vibrate with a waveform as shown in FIG. 8 is a diagram showing the relationship between the alignment mark position when the alignment mark is imaged five times at a period of 50 ms and the average value of the alignment mark position when the relative position of the substrate and the imaging unit changes in the waveform shown in FIG. It is. It is a flowchart which shows the process of the mounting apparatus which concerns on 2nd Embodiment. It is a flowchart which shows the process of the mounting apparatus which concerns on 3rd Embodiment. It is a flowchart which shows the process of the mounting apparatus which concerns on 4th Embodiment.

  Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

<First Embodiment>
[Configuration of Mounting Device 100 and Configuration of Each Part]
FIG. 1 is a front view showing a mounting apparatus 100 according to the first embodiment of the present technology. FIG. 2 is a top view of the mounting apparatus 100 shown in FIG. FIG. 3 is a block diagram illustrating a configuration of the mounting apparatus 100. FIG. 4 is a top view of the substrate 1.

  With reference to FIGS. 1 and 2, the mounting apparatus 100 includes a frame structure 10, a transport unit 15 that is provided on the frame structure 10 and transports the substrate 1 in the X-axis direction, and both sides of the transport unit 15. And a supply unit 20 that supplies the electronic component 3. The mounting apparatus 100 sucks the electronic component 3 supplied from the supply unit 20, mounts the sucked electronic component 3 on the substrate 1, and a head that moves the mounting head 30 in the XY direction. A moving mechanism 40. The mounting apparatus 100 includes an imaging unit 50 that images the alignment mark 2 (see FIG. 4) provided on the substrate 1 from above.

  With reference to FIG. 3, the mounting apparatus 100 further includes a control unit 5, a storage unit 6, a display unit 7, an input unit 8, an air compressor 33, a nozzle drive mechanism 43, and the like.

  The transport unit 15 includes a pair of guides 16 disposed along the X-axis direction and a pair of conveyors 17 provided closer to the center than the pair of guides 16. The transport unit 15 drives the pair of conveyors 17 to carry the substrate 1 and position it at a predetermined position, or to discharge the substrate 1 on which the electronic component 3 has been mounted.

  The supply unit 20 includes a plurality of tape feeders 21 arranged along the X-axis direction. The tape feeder 21 can be attached to and detached from the mounting apparatus 100. Each of the tape feeders 21 includes a carrier tape, a reel around which the carrier tape is wound, and a feeding mechanism that feeds the carrier tape by step feeding. The carrier tape contains electronic components 3 of the same type, such as resistors, capacitors, coils, and IC chips (ICs), for example. A supply window 22 is formed on the upper surface of the end of the tape feeder 21, and the electronic component 3 is supplied through the supply window 22.

  The frame structure 10 includes a base 11 provided at the bottom and a plurality of support columns 12 fixed to the base 11.

  The head moving mechanism 40 is spanned along the Y axis between the two X beams 41 spanned along the X axis direction on the upper portions of the plurality of support columns 12 and the two X beams 41. Y beam 42. In FIG. 2, the X beam 41 on the upper side and the Y beam 42 are indicated by a one-point difference line in order to display the drawing in an easy-to-see manner.

  The Y beam 42 is attached below the two X beams 41 so as to be movable in the X axis direction with respect to the X beam 41. The X beam 41 has an X axis drive mechanism for moving the Y beam 42 along the X axis direction, and the Y beam 42 is moved under the X beam 41 by driving the X axis drive mechanism. On the side, it is moved along the X-axis direction.

  A carriage 35 that holds the mounting head 30 is attached to the lower side of the Y beam 42. The carriage 35 is attached to the Y beam 42 so as to be movable in the Y axis direction. The Y beam 42 has a Y axis drive mechanism for moving the carriage 35 along the Y axis direction, and the carriage 35 is moved below the Y beam 42 by driving the Y axis drive mechanism. , And moved along the Y-axis direction.

  The mounting head 30 provided on the lower side of the carriage 35 is moved along the XY direction by driving the X-axis drive mechanism and the Y-axis drive mechanism. Examples of the X-axis drive mechanism and the Y-axis drive mechanism include a ball screw drive mechanism, a belt drive mechanism, and a linear motor drive mechanism.

  The mounting head 30 includes a turret 32 that is rotatably attached to the carriage 35, and a plurality of suction nozzles 31 that are attached to the turret 32 at equal intervals along the circumferential direction of the turret 32.

  In the present embodiment, the number of mounting heads 30 is one, but the number of mounting heads 30 may be two or more. Further, in the present embodiment, the number of suction nozzles 31 is 12 (see FIG. 2), but the number of suction nozzles 31 is not particularly limited. For example, the number of suction nozzles 31 may be one.

  The turret 32 is rotatable with an oblique axis as a central axis of rotation. The turret 32 is rotated about the axis as a central axis by driving the turret rotation mechanism.

  The suction nozzle 31 is attached to the turret 32 so that the axis of the suction nozzle 31 is inclined with respect to the rotation axis of the turret 32.

  The suction nozzle 31 is supported so as to be movable along the axial direction with respect to the turret 32. The suction nozzle 31 is supported so as to be rotatable with respect to the turret 32. The suction nozzle 31 is moved along the axial direction (vertical direction) at a predetermined timing by the nozzle drive mechanism 43. Further, the suction nozzle 31 is rotated around the axis line at a predetermined timing by the nozzle drive mechanism 43.

  Among the plurality of suction nozzles 31, the suction nozzle 31 located at the lowest position (the suction nozzle 31 located on the rightmost side in FIGS. 1 to 2) has its axis line oriented in the vertical direction. Hereinafter, the position of the suction nozzle 31 whose axis is oriented in the vertical direction is referred to as an operation position. The suction nozzle 31 located at the operation position is sequentially switched by the rotation of the turret 32.

  The suction nozzle 31 is connected to an air compressor 33 (see FIG. 3). The adsorption nozzle 31 can adsorb or desorb the electronic component 3 according to the switching of the negative pressure and the positive pressure of the air compressor 33.

  The carriage 35 is provided with an imaging unit 50 that images the alignment mark 2 provided on the substrate 1 from above. The imaging unit 50 includes an imaging element such as a CCD sensor (CCD: Charge Coupled Device) or a CMOS sensor (CMOS: Complementary Metal Oxide Semiconductor), and an imaging lens that focuses light on an imaging surface of the imaging element. . The imaging unit 50 moves integrally with the carriage 35 and the mounting head 30 when the carriage 35 and the mounting head 30 are moved along the XY axis direction.

  Referring to FIG. 4, alignment mark 2 is provided in the vicinity of two corners (diagonals) on substrate 1. In the example shown in FIG. 4, the number of alignment marks 2 is two, but the number of alignment marks 2 may be one, or three or more. The alignment mark 2 may be disposed anywhere as long as it does not interfere with the mounting of the electronic component 3. Each alignment mark 2 provided on the substrate 1 is imaged a plurality of times by the imaging unit 50.

  The mounting apparatus 100 includes an imaging unit that images the suction nozzle 31 in a state where the electronic component 3 is held, in addition to the imaging unit 50 for imaging the alignment mark 2. For example, the imaging unit images the suction nozzle 31 in a state where the electronic component 3 is held from the side and / or the lower side. The image captured by the imaging unit is subjected to image processing by the control unit 5, and the suction position of the electronic component 3 with respect to the suction nozzle 31 is determined.

  The control part 5 is comprised by CPU (Central Processing Unit), for example. The control unit 5 is electrically connected to each part of the mounting apparatus 100, and comprehensively controls each part of the mounting apparatus 100 based on various programs stored in the storage unit 6. The processing of the control unit 5 will be described in detail later.

  The storage unit 6 includes a nonvolatile memory in which various programs necessary for the control of the control unit 5 are stored, and a volatile memory used as a work area for the control unit 5. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

  The display unit 7 includes a liquid crystal display, an EL (Electro-Luminescence) display, and the like, and displays various data on the screen. The input unit 8 is configured with, for example, a keyboard, a touch panel, and the like, and inputs an operator instruction.

[Description of operation]
Next, the operation of the mounting apparatus 100 according to the present embodiment will be described. FIG. 5 is a flowchart showing processing of the mounting apparatus 100.

  First, the control unit 5 of the mounting apparatus 100 loads the board 1 by the conveyor 17 and positions the board 1 at a predetermined position. Next, the control unit 5 moves the mounting head 30 in the XY direction by using the head moving mechanism 40, and the imaging unit 50 is located above one of the two alignment marks 2 provided on the substrate 1. Is moved (step 101). And the control part 5 transfers to the imaging operation which images the alignment mark 2 by the imaging part 50. FIG.

  Here, for example, when the alignment mark 2 is imaged by the imaging unit 50, the relative relationship between the imaging unit 50 and the alignment mark 2 due to the influence of vibration caused by an internal factor of the mounting apparatus 100 or the vibration caused by an external factor. The position may shift.

  FIG. 6 shows the relative positional relationship between the imaging unit 50 and the alignment mark 2. The left side of FIG. 6 shows a relative positional relationship between the imaging unit 50 and the alignment mark 2 when no vibration is generated. The right side of FIG. 6 shows the relative positional relationship between the imaging unit 50 and the alignment mark 2 when vibration occurs.

  Various causes can be considered as causes of the vibration of the mounting apparatus 100. For example, as a cause of vibration, when two mounting heads 30 are provided, the other mounting head 30 is driven when the imaging unit 50 on one mounting head 30 side images the alignment mark 2. Vibration (internal factor). Further, vibration due to driving of other devices such as a cream solder printing device, a print inspection device, a substrate inspection device, and a reflow processing device that form a mounting line for the substrate 1 together with the mounting device 100 can be considered (external factor). In addition, vibrations caused by people or objects passing near the mounting apparatus 100 or construction work being performed near the factory where the mounting apparatus 100 is disposed can be considered (external factor).

  FIG. 7 is a diagram illustrating an example of vibration waveforms of the substrate 1 and the imaging unit 50. FIG. 7 shows an example in which the substrate 1 vibrates with a frequency of 53 Hz and an amplitude of ± 0.01 mm, and the imaging unit 50 vibrates with a frequency of 73 Hz and an amplitude of ± 0.02 mm.

  FIG. 8 is a diagram illustrating a waveform regarding the relative positional relationship between the substrate 1 and the imaging unit 50 when the substrate 1 and the imaging unit 50 vibrate with a waveform as illustrated in FIG. 7. The waveform of the relative positional relationship between the substrate 1 and the imaging unit 50 is a composite waveform of the vibration waveform of the substrate 1 and the vibration waveform of the imaging unit 50.

  As shown in FIG. 6 (right side), FIG. 7 and FIG. 8, when the relative positional relationship between the imaging unit 50 and the alignment mark 2 is shifted due to the influence of vibration, the position of the alignment mark 2 is accurately recognized. I can't. Therefore, in the mounting apparatus 100 according to the present embodiment, processing for eliminating such influence of vibration is executed.

  Referring to FIG. 5 again, when the imaging unit 50 is moved above the alignment mark 2, the control unit 5 next acquires the number of imaging of the alignment mark 2 from the storage unit 6 (step 102). The number of times of imaging is stored in the storage unit 6 in advance. As the number of times of imaging the alignment mark 2 is increased, the accuracy of position recognition of the substrate 1 is increased. On the other hand, as the number of imaging is increased, the time of position recognition of the substrate 1 is extended.

  When the alignment mark 2 is imaged by the imaging unit 50, the time required for one imaging is typically about 50 ms. Therefore, a time of 50 ms is added every time the number of times of imaging is increased by one. Considering both the accuracy of position recognition of the substrate 1 and the time efficiency, the number of times of imaging is typically about 3 to 10 times. Note that the number of times of imaging is not limited to the range given here, and the number of times of imaging can be changed as appropriate. In addition, the number of times of imaging may be changeable by an operator inputting a value via the input unit 8.

  When the number of times of imaging has been acquired, the control unit 5 next controls the imaging unit 50 to image the alignment mark 2 (step 103). And the control part 5 acquires the image which imaged the alignment mark 2 from the imaging part 50, and determines the alignment mark position in an image (step 104).

  Next, the imaging unit 50 compares the current number of times of imaging the alignment mark 2 with the number of times of imaging acquired in step 102 (about 3 to 10 times). It is determined whether or not the acquired number of times of imaging has been reached (step 105).

  If the number of imaging has not been reached (NO in step 105), the control unit 5 returns to step 103 again and images the alignment mark 2. Then, the control unit 5 again determines the alignment mark position in the image (step 104), and determines whether or not the current number of times of imaging has reached the number of times of imaging acquired in step 102 (step 105).

  By such processing, imaging of the alignment mark 2 is repeated at a constant cycle (about 50 ms) until the number of imaging times is reached. Since the waveform of the relative position between the substrate 1 and the imaging unit 50 is actually an irregular waveform, random sampling can be appropriately performed even if the alignment mark 2 is imaged at a regular cycle.

  When the number of times of imaging has been reached (YES in step 105), the control unit 5 calculates an average value of the alignment mark positions based on a plurality (about 3 to 10) of alignment mark positions acquired.

  FIG. 9 shows the alignment mark position when the alignment mark 2 is imaged five times at a period of 50 ms and the average of the alignment mark positions when the relative position of the substrate 1 and the imaging unit 50 changes in the waveform shown in FIG. It is a figure which shows the relationship with a value.

  9 shows the alignment mark position and the average value of the alignment mark positions when the alignment mark 2 is imaged five times at a period of 50 ms with the timing of first imaging the alignment mark 2 as 0 seconds. Has been. In this case, the average value of the alignment mark positions is about -0.0033 mm.

  From the second stage onward in FIG. 9, the alignment mark position when the imaging start timing of the alignment mark 2 is shifted by 7 ms and the alignment mark 2 is imaged five times at a period of 50 ms and the average value of the alignment mark positions are shown. It is shown. When the imaging start timing of the alignment mark 2 is 7, 14, 21, and 28 ms, it can be seen that the average value of the alignment mark position is about 0.0020, −0.0013, 0.0015, and −0.0025 mm.

  When the absolute value of the average value of these alignment mark positions is taken and averaged, it is about 0.0021 mm. That is, no matter what timing the imaging of the alignment mark 2 is started, if the alignment mark 2 is imaged about five times, the deviation amount with respect to the alignment mark position (0 in this example) when no vibration is generated is The value is about 0.0021 mm.

  In this way, by using the average value of the alignment mark positions, it is possible to obtain a value close to the alignment mark position in a state where no vibration is generated as compared with the case where the alignment mark 2 is imaged only once. As the number of imaging of the alignment mark 2 and the number of samples at the alignment mark position are increased, the probability of approaching the alignment mark position in a state where no vibration is generated increases.

  FIG. 9 also shows the maximum and minimum values of the alignment mark position and the difference between the maximum and minimum values at each timing when the alignment mark 2 is imaged. FIG. 9 also shows the average value of these values.

  Referring to FIG. 5 again, when the average value of the alignment mark positions is calculated, the control unit 5 next determines whether all the alignment marks 2 on the substrate 1 have been imaged (step 107). If the imaging of all the alignment marks 2 has not been completed (NO in step 107), the control unit 5 returns to step 101 and moves the imaging unit 50 to a position above the alignment mark 2 to be imaged next. . Then, the control part 5 performs the process of step 102-step 107 similarly to the previous time. There is no particular limitation on the order of imaging the alignment mark 2.

  By such processing, the average value of the alignment mark positions for all the alignment marks 2 provided on the substrate 1 is calculated. In the present embodiment, since the number of alignment marks 2 is two, the average number of alignment mark positions to be acquired is two.

  When all the alignment marks 2 have been imaged (YES in step 107), the controller 5 recognizes the position of the substrate 1 based on the average value of the acquired alignment mark positions (step 108). At this time, for example, the control unit 5 corrects the amount of deviation in the XY direction of the mounting position data of the electronic component 3 based on one average value of the two acquired average values, The angle in the θ direction is corrected based on the angle. Further, the control unit 5 corrects the magnification of the mounting position data based on the distance between the two average values.

  In the mounting apparatus 100 according to the present embodiment, since the average value of the alignment mark positions acquired by imaging the alignment mark 2 a plurality of times is used for position recognition of the substrate 1, even when vibration occurs, the substrate 1 Accurate position can be recognized.

  If the position of the board | substrate 1 is recognized, the control part 5 will move the mounting head 30 on the supply part 20 next, and will adsorb | suck the electronic component 3 to the some suction nozzle 31. FIG. Thereafter, the control unit 5 moves the mounting head 30 onto the substrate 1 to mount the electronic component 3 sucked by the suction nozzle 31 on the substrate 1. In the present embodiment, the position of the substrate 1 can be accurately recognized even when vibration occurs, so that the electronic component 3 can be mounted at an accurate position on the substrate 1 even when vibration occurs. .

Second Embodiment
Next, a second embodiment of the present technology will be described. In the description after the second embodiment, members having the same configurations and functions as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  In the first embodiment described above, the case where the alignment mark 2 is imaged by the imaging unit 50 at a constant period (about 50 ms) has been described. On the other hand, the second embodiment is different from the first embodiment described above in that the alignment mark 2 is imaged at a random cycle by the imaging unit 50. Therefore, this point will be mainly described.

  FIG. 10 is a flowchart showing processing of the mounting apparatus 100 according to the second embodiment. The flowchart shown in FIG. 10 is the same as the flowchart shown in FIG. 5 except that steps 209 and 210 are added.

  The control unit 5 of the mounting apparatus 100 acquires the number of times the alignment mark 2 is imaged from the storage unit 6 (step 202), and the imaging unit 50 images the alignment mark 2 (step 203). Next, the control unit 5 determines the alignment mark position in the image (step 204), and determines whether or not the current number of times of imaging has reached the number of times of imaging acquired in step 202 (step 205).

  If not reached (NO in step 205), the control unit 5 determines whether or not to add a delay to the imaging interval (step 209). The timing at which the delay is added may be a regular timing or a random timing. For example, when a total of six times of imaging are performed, a delay may be added before the second, fourth, and sixth imaging (periodic timing), before the third, and fourth imaging Delay may be added to (random timing).

  The timing at which the delay is added may be preset by the operator via the input unit 8. Alternatively, when the timing at which the delay is added is a random timing, the control unit 5 can be designed to automatically select the timing at random.

  When it is determined that a delay is added (YES in step 209), the control unit 5 executes a delay of the imaging interval (step 210). When the time taken for one imaging is 50 ms, the delay time is typically about 5 ms to 20 ms. The delay time may be a specified time or a random time.

  When the delay is executed, the control unit 5 returns to 203 again and images the alignment mark 2 by the imaging unit 50. If it is not time to add a delay (NO in step 209), the control unit 5 returns to step 203 without executing the process of adding a delay.

By such processing, the imaging cycle of the alignment mark 2 becomes random, the randomness of random sampling is further improved, and the average value of the alignment mark 2 can be calculated as a more accurate value.
<Third Embodiment>

  Next, a third embodiment of the present technology will be described. FIG. 11 is a flowchart showing processing of the mounting apparatus 100 according to the third embodiment. In the third embodiment, data of a plurality of alignment mark positions collected for calculating the average value of the alignment mark positions is applied to vibration detection.

  First, the control unit 5 of the mounting apparatus 100 acquires a plurality of alignment mark positions collected for calculating the average value of the alignment mark positions from the storage unit 6 (step 301). For example, in the example shown in the uppermost stage of FIG. 9, five alignment mark positions of −0.009921, −0.009335, 0.020895, −0.015229, and −0.002993 mm are acquired.

The process of step 301 is executed after a plurality of alignment mark positions for calculating the average value of the alignment mark positions are collected (after YES in step 105 in FIG. 5 and after YES in step 205 in FIG. 10). Is done.

  When the plurality of alignment mark positions are acquired, the control unit 5 next determines the degree of variation in the alignment mark positions based on the plurality of alignment mark positions (step 302). The degree of variation can be determined, for example, by obtaining the standard deviation of the alignment mark position.

  Here, there is a correlation between the relative vibration (amplitude) of the substrate 1 and the imaging unit 50 and the degree of variation in the alignment mark position in multiple imaging. That is, when the vibration (amplitude) is large, the degree of variation in the alignment mark position is large, and when the vibration (amplitude) is small, the degree of variation in the alignment mark position is small. The mounting apparatus 100 according to the third embodiment uses this relationship.

  When the degree of variation in the alignment mark position is determined, the control unit 5 next variably controls the number of times the alignment mark 2 is imaged (see step 102 in FIG. 5 and step 202 in FIG. 10) according to the degree of variation. To do. In this case, the control unit 5 controls the number of imaging of the alignment mark 2 so that the number of imaging of the alignment mark 2 increases as the degree of variation increases. In other words, the control unit 5 controls the number of imaging of the alignment mark 2 so that the number of imaging of the alignment mark 2 decreases as the degree of variation decreases. The number of times the alignment mark 2 is imaged is at least 3 times and at most about 10 times.

  When the number of imaging of the alignment mark 2 is changed, when the alignment mark 2 of the next substrate 1 is imaged, the alignment mark 2 is imaged with the changed number of imaging.

  Assuming that the number of times the alignment mark 2 has been imaged is the same, the greater the vibration, the more easily the average value of the alignment mark position takes an inaccurate value relative to the alignment mark position when no vibration has occurred. On the other hand, in this mounting apparatus 100, the greater the degree of variation in the alignment mark position (that is, the greater the vibration), the greater the number of times the alignment mark 2 is imaged. The value can be calculated as an accurate value.

  In addition, the number of times that the alignment mark 2 is imaged is reduced under a situation in which vibration that is easy to calculate as an average value of the alignment mark 2 is small. Thereby, the position recognition speed of the board | substrate 1 by the mounting apparatus 100 can be improved, As a result, the production efficiency of the board | substrate 1 can be improved. As described above, the mounting apparatus 100 can appropriately change the number of times the alignment mark 2 is imaged according to the magnitude of vibration.

<Fourth embodiment>
Next, a fourth embodiment of the present technology will be described. FIG. 12 is a flowchart showing processing of the mounting apparatus 100 according to the fourth embodiment.

  First, the control unit 5 of the mounting apparatus 100 acquires a plurality of alignment mark positions collected for calculating an average value of alignment mark positions from the storage unit 6 (step 401). For example, in the example shown at the top of FIG. 9, five alignment mark positions of -0.00921, -0.009335, 0.020895, -0.015229, and -0.002993 mm are acquired.

  Next, the control unit 5 determines the degree of variation in alignment mark positions based on the plurality of alignment mark positions (step 402). Next, the control unit 5 associates the time when the images of the plurality of alignment marks 2 are taken with the degree of variation in the alignment mark position, and stores them in the storage unit 6 (step 403).

  Next, the control unit 5 determines whether one day has elapsed since the start of this process (step 404). When one day has not elapsed (NO in step 404), the control unit 5 returns to step 401 and acquires a plurality of alignment mark positions from the storage unit 6. Through such processing, data for one day indicating the time and the degree of variation (vibration) and the relationship are stored in the storage unit 6. In general, it is considered that the vibration in the daytime is larger than that in the night, and data indicating the relationship between the time and the vibration is stored in the storage unit 6.

  When one day has elapsed (YES in step 404), the control unit 5 determines a time zone in which the degree of variation (vibration) is large, based on data for one day of time and the degree of variation (vibration). (Step 405). Then, the control unit 5 variably controls the number of times of imaging (see step 102 in FIG. 5 and step 202 in FIG. 10) so that the number of times of imaging of the alignment mark 2 increases in the time zone where the degree of variation (vibration) is large. (Step 406).

  Thereby, the imaging | photography frequency of the alignment mark 2 is increased in the time slot | zone with a large vibration within one day, and the imaging | photography frequency of the alignment mark 2 is decreased in the time slot | zone with a small vibration. Thereby, according to the magnitude | size of a vibration, the imaging frequency of the alignment mark 2 can be changed appropriately.

  In the description here, the number of times of imaging corresponding to the time zone is set based on the data for one day of the time and the degree of variation (vibration). On the other hand, data of time and degree of variation (vibration) may be collected in units of one week or one month.

The control unit 5 may display data for one day (or more) indicating the relationship between the time and the degree of variation (vibration) on the screen of the display unit 7. The operator can recognize in which time zone the vibration is occurring by visually recognizing this data. In addition, when the mounting apparatus 100 is constantly oscillating regardless of the time zone, the operator can recognize the stationary vibration by looking at data displayed on the screen. In this case, the operator can recognize that the mounting apparatus 100 needs anti-vibration measures, and the operator can take anti-vibration measures on the mounting apparatus 100 based on such recognition.
<Various modifications>

  In the above description, the mounting apparatus 100 has been described as an example of the recognition apparatus according to the present technology. However, the recognition device is not limited to the mounting device 100. For example, the recognition device may be another device such as a cream solder printing device, a print inspection device, or a substrate inspection device. Typically, the recognition device may be any device as long as it is a device that performs position recognition using the alignment mark 2.

  In the above description, the substrate 1 is described as an example of the recognition object, but the recognition object is not limited to the substrate 1. Typically, the recognition target object may be any object as long as the object has the alignment mark 2. For example, in the mounting apparatus 100, the alignment mark 2 may be provided on the supply unit 20 (recognition target object) in order to recognize the supply position of the supply unit 20. Moreover, in order to recognize the position of the screen of a cream solder printing apparatus, the alignment mark 2 may be provided in a screen (recognition target object).

This technique can also take the following composition.
(1) an imaging unit that images an alignment mark provided on the recognition object;
The imaging unit images the alignment mark a plurality of times, determines alignment mark positions in the plurality of captured images, calculates an average value of the determined alignment mark positions, and calculates the calculated average value. And a control unit for recognizing the position of the recognition target object.
(2) The recognition device according to (1) above,
The control unit determines a degree of variation in the alignment mark position based on alignment mark positions in the plurality of images, and variably controls the number of times the alignment mark is imaged according to the degree of variation. apparatus.
(3) The recognition device according to (2) above,
The control unit controls the number of imaging of the alignment mark so that the number of imaging of the alignment mark increases as the degree of variation increases.
(4) The recognition device according to (3) above,
A storage unit;
The control unit associates and stores the time when the plurality of images are captured and the degree of variation in the storage unit, and the degree of variation is based on the time and the degree of variation data. A recognition apparatus that determines a large time zone and controls the number of imaging of the alignment mark so that the number of imaging times of the alignment mark increases in a time zone with a larger degree of variation.
(5) The recognition device according to any one of (1) to (4) above,
The said control part is a recognition apparatus which images the said alignment mark in multiple times with a fixed period by the said imaging part.
(6) The recognition device according to any one of (1) to (4) above,
The said control part is a recognition apparatus which images the said alignment mark in multiple times with a random period by the said imaging part.
(7) The recognition device according to (6) above,
The control unit is configured to add a random delay to a certain period to image the alignment mark a plurality of times at a random period.
(8) Image the alignment mark provided on the recognition object multiple times,
Determine the alignment mark position in the captured multiple images,
Calculate the average value of the determined alignment mark positions,
A recognition method for recognizing the position of the recognition object according to the calculated average value.
(9) In the recognition device,
Imaging the alignment mark provided on the recognition target object a plurality of times;
Determining alignment mark positions in a plurality of captured images;
Calculating an average value of the determined alignment mark positions;
Recognizing the position of the recognition object according to the calculated average value.
(10) Image the alignment mark provided on the substrate multiple times,
Determine the alignment mark position in the captured multiple images,
Calculate the average value of the determined alignment mark positions,
Recognizing the position of the substrate according to the calculated average value,
A method for manufacturing a substrate, wherein electronic components are mounted on the substrate in accordance with the recognized position of the substrate.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Alignment mark 3 ... Electronic component 5 ... Control part 6 ... Memory | storage part 15 ... Conveyance part 20 ... Supply part 30 ... Mounting head 50 ... Imaging part 100 ... Mounting apparatus

Claims (10)

An imaging unit for imaging the alignment mark provided on the recognition object;
The imaging unit images the alignment mark a plurality of times, determines alignment mark positions in the plurality of captured images, calculates an average value of the determined alignment mark positions, and calculates the calculated average value. accordance with the position of the recognition object; and a recognizing control unit,
The control unit determines a degree of variation in the alignment mark position caused by vibration generated in the recognition device based on the determined alignment mark positions in the plurality of images, and according to the degree of variation. A recognition device that variably controls the number of times the alignment mark is imaged . The recognition device according to claim 1 ,
The control unit controls the number of imaging of the alignment mark so that the number of imaging of the alignment mark increases as the degree of variation increases. The recognition device according to claim 2 ,
A storage unit;
The control unit associates and stores the time when the plurality of images are captured and the degree of variation in the storage unit, and the degree of variation is based on the time and the degree of variation data. A recognition apparatus that determines a large time zone and controls the number of imaging of the alignment mark so that the number of imaging times of the alignment mark increases in a time zone with a larger degree of variation. The recognition device according to claim 1,
The said control part is a recognition apparatus which images the said alignment mark in multiple times with a fixed period by the said imaging part. The recognition device according to claim 1,
The said control part is a recognition apparatus which images the said alignment mark in multiple times with a random period by the said imaging part. The recognition device according to claim 5 ,
The control unit is configured to add a random delay to a certain period to image the alignment mark a plurality of times at a random period. A storage unit;
An imaging unit for imaging the alignment mark provided on the recognition object;
The imaging unit images the alignment mark a plurality of times, determines alignment mark positions in the plurality of captured images, calculates an average value of the determined alignment mark positions, and calculates the calculated average value. accordance with the position of the recognition object; and a recognizing control unit,
The controller determines the degree of variation of the alignment mark position based on the alignment mark position in the plurality of images, and the greater the degree of variation, the greater the number of times the alignment mark is imaged. The number of times the alignment mark is imaged is controlled, the time when the plurality of images are captured and the degree of variation are stored in the storage unit in association with each other, and the time and the degree of variation data A recognition apparatus that determines a time period in which the degree of variation is large based on the control and controls the number of times the alignment mark is imaged so that the number of times the alignment mark is imaged increases in a time period in which the degree of variation is large . Image the alignment mark provided on the recognition object multiple times,
Determine the alignment mark position in the captured multiple images,
Calculate the average value of the determined alignment mark positions,
A recognition method by a recognition device for recognizing the position of the recognition object according to the calculated average value ,
Based on the determined alignment mark positions in the plurality of images, the degree of variation of the alignment mark position due to vibration generated in the recognition device is determined, and the alignment mark is determined according to the degree of variation. Recognition method for variably controlling the number of times of imaging . In the recognition device,
Imaging the alignment mark provided on the recognition target object a plurality of times;
Determining alignment mark positions in a plurality of captured images;
Calculating an average value of the determined alignment mark positions;
Recognizing the position of the recognition object according to the calculated average value ,
Based on the determined alignment mark positions in the plurality of images, the degree of variation of the alignment mark position due to vibration generated in the recognition device is determined, and the alignment mark is determined according to the degree of variation. A program for causing the recognition apparatus to execute a step of variably controlling the number of times of imaging . Image the alignment mark provided on the substrate multiple times,
Determine the alignment mark position in the captured multiple images,
Calculate the average value of the determined alignment mark positions,
Recognizing the position of the substrate according to the calculated average value,
According to the recognized position of the substrate, an electronic component is mounted on the substrate, and a substrate manufacturing method using a mounting apparatus,
Based on the determined alignment mark positions in the plurality of images, a degree of variation in the alignment mark position caused by vibration generated in the mounting apparatus is determined, and the alignment mark is determined according to the degree of variation. Manufacturing method for variably controlling the number of times of imaging .

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