JP5868210B2 - Mounting device, electronic component quality determination method, program, and board manufacturing method - Google Patents

Description

  The present technology relates to a technology such as a mounting apparatus for mounting an electronic component on a substrate.

  2. Description of the Related Art Conventionally, mounting apparatuses that mount electronic components such as resistors and capacitors on a substrate are widely known (see Patent Documents 1 and 2 below). In such a mounting apparatus, first, an electronic component arranged in the supply unit is sucked by a suction nozzle. Then, the suction nozzle that sucks the electronic component is moved onto the substrate, and the suction nozzle is lowered to mount the electronic component on the mounting substrate.

  The mounting apparatus needs to mount electronic components accurately on the substrate. Therefore, in general, an imaging unit that images an electronic component sucked by the suction nozzle is mounted on the mounting apparatus. The mounting device recognizes the suction position deviation of the electronic component with respect to the suction nozzle based on the image picked up by the imaging unit, performs position correction in consideration of the suction position deviation, and then mounts the electronic component on the substrate. To do. Further, the mounting apparatus recognizes the component state such as the shape and thickness of the component based on the image of the electronic component. When this component state is different from the assumed component state, the mounting device determines that the electronic component is a defective component or has picked up a different component and discards the electronic component. Execute.

  Generally, there are variations in the component state such as the shape and thickness of the electronic component. In order to eliminate the influence of such component state variations, an allowable range is often set in advance in the mounting apparatus by an operator. The mounting device determines from the image whether the component state such as the shape and thickness of the electronic component is within the allowable range. If the component state is within the allowable range, the mounting device determines that the electronic component is good. Mount the component on the board. On the other hand, if the component state is not within the allowable range, it is determined that the electronic component is a defective component or that a different component has been picked up, and processing such as discarding the electronic component is executed. To do.

JP2011-165946A (paragraph [0041] etc.) JP 2008-010497 A (paragraphs [0020] to [0026] etc.)

  However, in practice, it is difficult for the operator to set the allowable range, and if the allowable range is set to be small, electronic components that should be judged as non-defective products are discarded and the electronic components are wasted. On the other hand, if the allowable range is set large, an electronic component that is originally determined to be a defective product is mounted on the substrate, causing a quality defect of the substrate.

  In view of the circumstances as described above, it is an object of the present technology to provide a technology such as a mounting device that can accurately determine the quality of an electronic component.

The mounting apparatus according to the present technology includes a mounting unit, an imaging unit, and a control unit.
The mounting part holds electronic components and mounts them on a substrate.
The imaging unit images the electronic component held by the mounting unit.
The control unit analyzes the image of the electronic component imaged by the imaging unit to acquire the electronic component data, accumulates the electronic component data, and statistics the accumulated electronic component data. Then, a first allowable range is set based on the statistical result, and the quality determination of the electronic component based on the image of the electronic component is executed based on the first allowable range.

  In this mounting apparatus, based on a statistical result obtained by actually statistics of electronic component data, a first allowable range serving as a criterion for determining the quality of the electronic component is set. Therefore, this mounting apparatus can perform the pass / fail determination of the electronic component with high accuracy.

  In the mounting apparatus, the control unit may calculate a standard deviation of the accumulated data of the electronic component, and set the first allowable range based on the calculated standard deviation.

  Thereby, a 1st tolerance | permissible_range can be set appropriately.

  In the mounting apparatus, the control unit may calculate an average value of the accumulated data of the electronic component, and set the first allowable range based on the calculated average value.

  Thereby, a 1st tolerance | permissible_range can be set appropriately.

  In the mounting apparatus, the control unit has an allowable range that is both the first allowable range set based on a statistical result and the second allowable range set by an operator regardless of the statistical result. On the basis of this, the quality determination of the electronic component may be executed.

  Thereby, since two types of quality determination is performed for every electronic component, the precision of the quality determination of an electronic component can further be improved.

  In the mounting apparatus, when the determination result based on the determination based on the first allowable range and the determination result based on the second allowable range are opposite to each other, Depending on the set value set in advance, it may be determined whether the electronic component whose determination result is reversed is treated as a non-defective product or a defective product.

  As a result, the operator can arbitrarily select which one of the non-defective product and the defective product is handled as the non-defective product or the defective product by the set value.

  The mounting apparatus may further include a notification unit. In this case, when the determination result based on the determination based on the first permissible range and the determination result based on the second permissible range are reversed, the control unit performs the mounting apparatus. And that the determination result is reversed may be notified via the notification unit.

  Thereby, the operator can recognize from the notification from the notification unit that the determination result of pass / fail for a certain electronic component is reversed. Thereafter, the operator may determine the quality of the electronic component by a method such as visual inspection. Thereby, the quality of an electronic component can be determined more accurately by accurate determination by an operator.

  In the mounting apparatus, the control unit is configured to perform the electronic component based on a second allowable range set by an operator regardless of the statistical result until data of a predetermined number of the electronic components is accumulated. The pass / fail judgment may be executed.

  The mounting apparatus may further include one or a plurality of carrier tapes that can be attached to and detached from the mounting apparatus, each housing a plurality of electronic components of the same type supplied to the mounting unit. In this case, the control unit statistics the electronic component data for each carrier tape, and sets a first range as the first allowable range for each carrier tape based on a statistical result. Also good.

  For example, even if the electronic components are of the same type, there may be some deviation in size if the production lots are different. Thereby, even if it is an electronic component of the same type, there may be some deviation in size for each carrier tape. In this mounting apparatus, since the first range as the first allowable range is set for each carrier tape, it is possible to appropriately eliminate the influence of the deviation of the size of the electronic component for each production lot.

  In the mounting apparatus, the control unit performs overall statistics on electronic components of the same type accommodated in the different carrier tapes, and the first tolerance is set for each electronic component of the same type based on a statistical result. A second range as a range may be set, and the electronic component quality determination may be performed based on both the first range and the second range.

  Thereby, since two types of quality determination is performed for every electronic component, the precision of the quality determination of an electronic component can further be improved.

  In the mounting apparatus, when the determination result based on the determination based on the first range and the determination result based on the second range are opposite to each other, the control unit is previously set by the operator. Depending on the set value, it may be determined whether the electronic component whose determination result is reversed is handled as a non-defective product or a defective product.

  As a result, the operator can arbitrarily select which one of the non-defective product and the defective product is handled as the non-defective product or the defective product by the set value.

  When the mounting apparatus further includes a notification unit, the control unit reverses the determination result of the pass / fail in the determination result based on the determination based on the first range and the determination result based on the second range. In such a case, the mounting apparatus may be stopped and a notification that the determination result is reversed may be sent via the notification unit.

  The operator can recognize from the notification from the notification unit that the determination result is reversed. Thereafter, the operator may determine the quality of the electronic component by a method such as visual inspection. Thereby, the quality of an electronic component can be determined more accurately by accurate determination by an operator.

  In the mounting apparatus, the control unit determines whether or not a statistical result statistically determined for each carrier tape is within a predetermined range compared to a statistical result in which electronic components of the same type are generally statistically determined, If it is not within the predetermined range, the mounting apparatus may be stopped.

  If the statistical result for each carrier tape is significantly different from the statistical result for the same type of electronic components as a whole, and is not within the specified range, it is assumed that the carrier tape is a crossover. can do. As described above, when the carrier tape is hooked, the mounting apparatus is automatically stopped.

  The said mounting apparatus WHEREIN: The said control part may exclude the statistical result determined not to be in the said predetermined range from the whole statistics of the said electronic component of the same type.

  Thereby, it is possible to prevent, for example, inappropriate electronic component data due to a carrier tape misuse being reflected in the overall statistics of the same type of electronic component.

The electronic component quality determination method according to the present technology includes holding an electronic component mounted on a substrate.
The held electronic component is imaged.
Data of the electronic component is acquired by analyzing the captured image of the electronic component.
Data of the electronic component is accumulated.
The accumulated data of the electronic component is statistically analyzed.
A first allowable range is set based on the statistical result.
Based on the first permissible range, the quality determination of the electronic component based on the image of the electronic component is executed.

A program according to the present technology is stored in a mounting device.
Holding an electronic component mounted on a substrate;
Imaging the held electronic component;
Analyzing the captured image of the electronic component to obtain data of the electronic component;
Storing the electronic component data;
Statistics the accumulated electronic component data;
Setting a first tolerance range based on the statistical results;
A step of executing pass / fail judgment of the electronic component based on the image of the electronic component based on the first allowable range.

The manufacturing method of the board | substrate which concerns on this technique includes hold | maintaining the electronic component mounted on a board | substrate.
The held electronic component is imaged.
Data of the electronic component is acquired by analyzing the captured image of the electronic component.
Data of the electronic component is accumulated.
The accumulated data of the electronic component is statistics.
A first allowable range is set based on the statistical result.
Based on the first permissible range, the quality determination of the electronic component based on the image of the electronic component is executed.
The electronic component determined to be non-defective is mounted on the substrate.

  As described above, according to the present technology, it is possible to provide a technology such as a mounting device that can accurately determine the quality of an electronic component.

It is a front view showing a mounting device concerning a 1st embodiment of this art. It is a top view of the mounting apparatus shown in FIG. It is an enlarged view which shows the mounting head which a mounting apparatus has. It is a block diagram which shows the structure of a mounting apparatus. It is a flowchart which shows the process of a mounting apparatus (control part). It is a flowchart which shows the process of a mounting apparatus (control part). It is a figure which shows an example of distribution when the data of an electronic component are statistics. It is a figure which shows a 1005 type electronic component. It is a figure which shows a mode when the electronic component shown in FIG. 8 is attracted | sucked by the suction nozzle. It is a flowchart which shows the process of the mounting apparatus (control part) which concerns on other embodiment of this technique. It is a figure which shows the difference in distribution of the statistical data for every manufacturing lot. It is a flowchart which shows the process of the mounting apparatus (control part) which concerns on another embodiment of this technique.

  Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

<First Embodiment>
[Configuration of Mounting Device 100 and Configuration of Each Part]
FIG. 1 is a front view showing a mounting apparatus 100 according to the first embodiment of the present technology. FIG. 2 is a plan view of the mounting apparatus 100 shown in FIG. FIG. 3 is an enlarged view showing the mounting head 30 of the mounting apparatus 100. FIG. 4 is a block diagram illustrating a configuration of the mounting apparatus 100.

  As shown in these drawings, the mounting apparatus 100 is provided on the frame structure 10, the frame structure 10, the transport unit 15 that transports the substrate 1 in the X-axis direction, and the both sides of the transport unit 15. And a supply unit 20 for supplying the electronic component 2. Further, the mounting apparatus 100 sucks the electronic component 2 supplied from the supply unit 20 and mounts a mounting head 30 (mounting unit) having a plurality of suction nozzles 31 for mounting the sucked electronic component 2 on the substrate 1. And a head driving mechanism 40 for driving the head 30.

  In addition, the mounting apparatus 100 captures from the side the first imaging unit 51 that images an alignment mark (not shown) provided on the substrate 1 from above and the suction nozzle 31 that holds the electronic component 2. Second imaging unit 52 and a third imaging unit 53 that images the suction nozzle 31 holding the electronic component 2 from below via a mirror 54.

  With reference to FIG. 4, the mounting apparatus 100 further includes a control unit 5, a storage unit 6, a display unit 7, an input unit 8, an air compressor 33, a nozzle drive mechanism 46, and the like.

  The transport unit 15 includes a guide 16 disposed along the X-axis direction and a conveyor 17 provided closer to the center than the guide 16. The transport unit 15 drives the conveyor 17 to carry the substrate 1 and position it at a predetermined position, or to discharge the substrate 1 on which the electronic component 2 has been mounted.

  The supply unit 20 includes a plurality of tape feeders 21 arranged along the X-axis direction. The tape feeder 21 can be attached to and detached from the mounting apparatus 100. Each of the tape feeders 21 includes a carrier tape, a reel around which the carrier tape is wound, and a feeding mechanism that feeds the carrier tape by step feeding. A supply window 22 is formed on the upper surface of the end of the tape feeder 21, and the electronic component 2 is supplied through the supply window 22. The number of tape feeders 21 (carrier tapes) may be one, and the number of tape feeders 21 is not particularly limited.

  The carrier tape contains a plurality of electronic components 2 of the same type such as resistors, capacitors, coils, and IC chips (IC: Integrated Circuit). Here, even in the same type of electronic component 2, for example, there are different types of resistors such as 0603 type and 1005 type depending on the size. Thus, even if it is the same kind, the electronic component 2 from which a type differs is accommodated in a respectively different carrier tape. That is, the carrier tape accommodates a plurality of electronic components 2 of the same type and the same type.

  The carrier tape can accommodate, for example, about 5000 to 10000 electronic components 2 inside. The carrier tape can be attached to and detached from the tape feeder 21. When the electronic component 2 in the carrier tape is used up, the carrier tape is replaced with a new carrier tape by the operator. A spare carrier tape (tape feeder 21) is prepared in advance for the electronic component 2 that is used in a larger quantity than the other electronic components 2 on the substrate 1. The electronic component 2 is supplied from the carrier tape.

  The frame structure 10 includes a base 11 provided at the bottom and a plurality of support columns 12 fixed to the base 11.

  The head drive mechanism 40 is bridged along the Y axis between the two X beams 41 spanned along the X axis direction on the upper portions of the plurality of columns 12 and the two X beams 41. Y beam 42. In FIG. 2, the X beam 41 on the upper side and the Y beam 42 are indicated by a one-point difference line in order to display the drawing in an easy-to-see manner.

  The Y beam 42 is attached below the two X beams 41 so as to be movable in the X axis direction with respect to the X beam 41. The X beam 41 has an X axis drive mechanism 43 (see FIG. 4) for moving the Y beam 42 along the X axis direction, and the Y beam 42 is driven by the X axis drive mechanism 43. Is moved along the X-axis direction below the X-beam 41.

  A carriage 35 that holds the mounting head 30 is attached to the lower side of the Y beam 42. The carriage 35 is attached to the Y beam 42 so as to be movable in the Y axis direction. The Y beam 42 has a Y axis drive mechanism 44 (see FIG. 4) for moving the carriage 35 along the Y axis direction. The carriage 35 is driven by the Y axis drive mechanism 44. It is moved along the Y-axis direction below the Y beam 42.

  By driving the X-axis drive mechanism 43 and the Y-axis drive mechanism 44, the mounting head 30 provided on the lower side of the carriage 35 is moved along the X-axis and Y-axis directions. Examples of the X-axis drive mechanism 43 and the Y-axis drive mechanism 44 include a ball screw drive mechanism, a belt drive mechanism, and a linear motor drive mechanism.

  The mounting head 30 includes a turret 32 that is rotatably attached to the carriage 35, and a plurality of suction nozzles 31 that are attached to the turret 32 at equal intervals along the circumferential direction of the turret 32. In the present embodiment, the number of mounting heads 30 is one, but the number of mounting heads 30 may be two or more. Further, in the present embodiment, the number of suction nozzles 31 is 12 (see FIG. 2), but the number of suction nozzles 31 is not particularly limited. For example, the number of suction nozzles 31 may be one.

  The turret 32 is rotatable with an oblique axis as a central axis of rotation. The turret 32 is rotated about the axis as a central axis by driving a turret rotation mechanism 45 (see FIG. 4) of the head drive mechanism 40.

  The suction nozzle 31 is attached to the turret 32 so that the axis of the suction nozzle 31 is inclined with respect to the rotation axis of the turret 32.

  The suction nozzles 31 are each supported so as to be movable along the axial direction with respect to the turret 32. The suction nozzle 31 is supported so as to be rotatable with respect to the turret 32. The suction nozzle 31 is moved along the axial direction (vertical direction) at a predetermined timing by driving of the Z-axis drive mechanism 47 (see FIG. 4) of the nozzle drive mechanism 46. Further, the suction nozzle 31 is rotated around the axis at a predetermined timing by driving a nozzle rotating mechanism 48 (see FIG. 4).

  Among the plurality of suction nozzles 31, the suction nozzle 31 located at the lowest position (the suction nozzle 31 located on the rightmost side in FIGS. 1 to 3) has its axis line oriented in the vertical direction. Hereinafter, the position of the suction nozzle 31 whose axis is oriented in the vertical direction is referred to as an operation position. The suction nozzle 31 located at the operation position is sequentially switched by the rotation of the turret 32.

  The suction nozzle 31 is connected to an air compressor 33 (see FIG. 4). The suction nozzle 31 can suck or detach the electronic component 2 in accordance with the switching of the negative pressure and the positive pressure of the air compressor 33.

  The carriage 35 is provided with a first imaging unit 51 that images the alignment marks provided on the substrate 1 from above. In addition, a support unit 36 that supports the second imaging unit 52, the third imaging unit 53, and the mirror 54 is attached to the carriage 35. The first imaging unit 51, the second imaging unit 52, and the third imaging unit 53 are configured so that the carriage 35 and the mounting head are moved when the carriage 35 and the mounting head 30 are moved along the X-axis and Y-axis directions. 30 and move together.

  The second imaging unit 52 can image the suction nozzle 31 located at the highest position among the plurality of suction nozzles 31 (the suction nozzle 31 located on the leftmost side in FIGS. 1 to 3) from the side. It is placed in a possible position. The 3rd imaging part 53 is arrange | positioned in the position which can image the suction nozzle 31 located in the highest position among the several suction nozzles 31 via the mirror 54 from the lower side. Hereinafter, the position of the suction nozzle 31 imaged by the second imaging unit 52 and the third imaging unit 53 is referred to as an imaging position.

  The first imaging unit 51, the second imaging unit 52, and the third imaging unit 53 are configured by, for example, a CCD (Charge Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor), or the like.

  The control part 5 is comprised by CPU (Central processing Unit), for example. The control unit 5 executes various calculations based on various programs stored in the storage unit 6 and controls each unit of the mounting apparatus 100 in an integrated manner. The processing of the control unit 5 will be described in detail later.

  The storage unit 6 includes a nonvolatile memory in which various programs necessary for the control of the control unit 5 are stored, and a volatile memory used as a work area for the control unit 5. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

  The display unit 7 includes a liquid crystal display, an EL (Electro-Luminescence) display, and the like, and displays various data on the screen. The input unit 8 is constituted by, for example, a keyboard, a touch panel, etc., and inputs various instructions of the operator.

[Description of operation]
Next, the operation of the mounting apparatus 100 according to the present embodiment will be described. 5 and 6 are flowcharts showing processing of the mounting apparatus 100 (control unit 5).

  First, the control part 5 carries in the board | substrate 1 with the conveyor 17, and positions the board | substrate 1 in a predetermined position. Next, the control part 5 images the alignment marks (for example, two places) provided on the board | substrate 1 by the 1st imaging part 51, and recognizes the position of the board | substrate 1 based on the obtained image.

  Next, the control part 5 performs the adsorption | suction operation | movement of the electronic component 2 by the mounting head 30 (step 101). At this time, the control unit 5 first moves the mounting head 30 onto the supply unit 20 by driving the X-axis drive mechanism 43 and the Y-axis drive mechanism 44, and moves the suction nozzle 31 (operation position) of the tape feeder 21. It is located above the supply window 22.

  Next, the control unit 5 drives the Z-axis drive mechanism 47 to move the suction nozzle 31 located at the operation position downward, and the air compressor 33 switches the suction nozzle 31 to negative pressure. As a result, the electronic component 2 is sucked to the tip of the suction nozzle 31. When the electronic component 2 is sucked by the suction nozzle 31, the control unit 5 moves the suction nozzle 31 upward by the Z-axis drive mechanism 47.

  Next, the control unit 5 determines whether the suction nozzle 31 that has picked up the electronic component 2 has reached the imaging position (the leftmost position in FIGS. 1 to 3) (step 102). When the suction nozzle 31 that sucks the electronic component 2 has not reached the imaging position (NO in step 102), the control unit 5 determines whether all the electronic components 2 that are scheduled to be sucked are sucked by the suction nozzle 31. Determination is made (step 103). The electronic component 2 may be sucked by all the suction nozzles 31, or may be sucked by some of the suction nozzles 31 among the plurality of suction nozzles 31.

  When the electronic component 2 to be sucked remains in the suction nozzle 31 (NO in step 103), the control unit 5 controls the turret rotation mechanism 45 to rotate the turret 32 (step 104). When the turret 32 is rotated, the suction nozzle 31 located at the operation position is switched, and the suction nozzle 31 located at the imaging position is also switched.

  When the turret 32 is rotated and the suction nozzle 31 positioned at the operation position is switched, the control unit 5 then moves the suction nozzle 31 newly positioned at the operation position downward, and the tip of the suction nozzle 31 is moved. The electronic component 2 is adsorbed to (step 101). The electronic components 2 sucked by the plurality of suction nozzles 31 may all be the same type, some may be the same type, or all may be different types.

  In step 103, when all the electronic components 2 that are scheduled to be sucked are picked up by the suction nozzle 31 (YES in step 103), the control unit 5 rotates the turret 32 and picks up the suction position located at the imaging position. The nozzle 31 is switched (step 105). And the control part 5 determines whether the suction nozzle 31 which picked up the electronic component 2 reached | attained the imaging position (step 102).

  When the suction nozzle 31 that has picked up the electronic component 2 has reached the imaging position (YES in step 102), the control unit 5 controls the second imaging unit 52 and the third imaging unit 53 to control the electronic component 2. An image is taken (step 107). Here, for example, a case where the electronic component 2 is sucked to all the suction nozzles 31 is assumed. In this case, when the suction operation of half of the suction nozzles 31 of all the suction nozzles 31 is completed, the suction nozzle 31 that first completed the suction operation reaches the imaging position, and from this point, the electronic component 2 Imaging starts.

  When the electronic component 2 is imaged, the control unit 5 next acquires an image of the electronic component 2 from the second imaging unit 52 (an image obtained by imaging the electronic component 2 from the side), analyzes the image, Data of the electronic component 2 is acquired (step 108). Similarly, the control unit 5 acquires an image of the electronic component 2 captured by the third imaging unit 53 (an image obtained by capturing the electronic component 2 from below), analyzes the image, and analyzes the data of the electronic component 2. To get.

  The “data of the electronic component 2” is, for example, the thickness, length, width, etc. of the electronic component 2. When the electronic component 2 has a lead, a pin, a ball, etc. (for example, PLCC (Plastic leaded Chip Carrier), PGA (Pin Grid Array), BGA (Ball Grid Array)), The data includes the size of the lead, pin, and ball, the pitch, the amount of displacement, and the like.

  When the data of the electronic component 2 is acquired, the control unit 5 stores the acquired data of the electronic component 2 in the storage unit 6 and accumulates the data of the electronic component 2 (step 109). The control unit 5 manages the data of the electronic component 2 for each type of the electronic component 2. Therefore, the data of the electronic component 2 is accumulated for each type of the electronic component 2. For example, data of the electronic component 2 is managed separately for a 0603 type resistor and a 1005 type resistor.

  Next, the control part 5 determines whether the frequency | count that the data of the electronic component 2 was acquired and accumulate | stored is more than predetermined number about the electronic component 2 of the same type (step 110). This predetermined number of times is the minimum number of times required for taking statistics of the data of the electronic component 2 and is, for example, about 100 times. The number of times is not limited to 100, and can be changed as appropriate.

  When the number of times the data of the electronic component 2 is acquired and stored for the same type of electronic component 2 is less than the predetermined number (NO in step 110), the control unit 5 proceeds to the next step 114. In step 114, the control unit 5 does not relate to the first allowable range set based on the statistical result of the data of the electronic component 2 described later, but based on the second allowable range set in advance by the operator. Then, the pass / fail judgment of the electronic component 2 is executed.

  The second allowable range is set using an allowable rate α (%), for example, and is expressed as, for example, average value ± average value × α. The operator can set the second allowable range by setting the allowable rate α via the input unit 8 before the production of the substrate 1 is started. The quality determination of the electronic component 2 using the second allowable range is hereinafter referred to as normal determination.

  The second permissible range is set for each electronic component 2 of the same type. For example, the second permissible range is different for a 0603 type resistor and a 1005 type resistor. The second allowable range is typically set for various types of data of the electronic component 2 such as the thickness, length, and width of the electronic component 2. In the case where the electronic component 2 has a lead or the like, the second allowable range is typically set for the size, pitch, displacement amount, etc. of the lead, pin, and ball of the electronic component 2 respectively. Has been.

  In the normal determination, the control unit 5 determines whether the data of the electronic component 2 acquired from the image of the electronic component 2 (acquired in step 108) is within the second allowable range. For example, the control unit 5 determines that the various electronic component 2 data such as the thickness, length, and width of the electronic component 2 are within the second allowable range set for each of the various electronic component 2 data. Determine. This normal determination may be performed based on parameters arbitrarily set by the operator among various parameters such as the above-described thickness, length, and width.

  When the data of the electronic component 2 is within the second allowable range (YES in step 114), the control unit 5 stores the electronic component 2 in the storage unit 6 as a normal component (non-defective product). (Step 115). Note that, typically, when all of the various electronic component 2 data are within the second allowable range set for each of the various electronic component 2 data, the control unit 5 typically selects the electronic component 2. Is treated as a normal part.

  On the other hand, when the data of the electronic component 2 is not within the second allowable range (NO in step 114), the control unit 5 stores the electronic component 2 in the storage unit 6 as a defective component. (Step 116). Note that, typically, when at least one of the various electronic component 2 data does not fall within the second allowable range set for each of the various electronic component 2 data, The electronic component 2 is handled as a defective component.

  In step 110, when the number of times the data of the electronic component 2 is acquired and stored for the same type of electronic component 2 is equal to or greater than the predetermined number (YES in step 110), the control unit 5 performs statistics on the data of the electronic component 2. Processing is executed (step 111).

  FIG. 7 shows an example of the distribution when the data of the electronic component 2 is statistics. The distribution of the data of the electronic component 2 (thickness, length, width, etc. of the electronic component 2) typically shows a curve close to a normal distribution curve as shown in FIG. In step 111, the control unit 5 calculates the average value μ of the distribution of the electronic component 2 data and the standard deviation σ based on such a distribution. The average value μ and the standard deviation σ are managed for each electronic component 2 of the same type. In addition, the average value μ and the standard deviation σ are respectively calculated for data of various electronic components 2 such as the thickness, length, and width of the electronic component 2.

  When the average value μ of the data distribution of the electronic component 2 and the standard deviation σ are calculated, the control unit 5 determines the first allowable value based on the calculated average value μ, the standard deviation σ, and (statistical result). A range is set (step 112). This first allowable range can be calculated by, for example, an average value μ ± β × standard deviation σ. Here, β is a numerical value preset by the operator, and is set to 3, for example. Note that the value of β is not limited to this, and values such as 4, 5, 6 may be used, and other values may be used.

  The first allowable range is set for each piece of data of the same type of electronic component 2. In addition, the first allowable range is set for data of various electronic components 2 such as the thickness, length, and width of the electronic component 2. In the case where the electronic component 2 has a lead or the like, the first allowable range is typically set for the size, pitch, positional deviation amount, etc. of the lead, pin, and ball of the electronic component 2, respectively. Has been.

  When the first allowable range is set, the control unit 5 performs pass / fail determination of the electronic component 2 based on the set first allowable range (determination based on statistical results) (step 113). At this time, the control unit 5 determines whether the data of the electronic component 2 acquired from the image of the electronic component 2 (acquired in step 108) is within the first allowable range.

  For example, the control unit 5 determines whether various electronic component 2 data such as the thickness, length, and width of the electronic component 2 are within the first allowable range set for each of the various electronic component 2 data. Determine. The determination based on the statistical result may be performed based on a parameter arbitrarily set by the operator among various parameters such as the above-described thickness, length, and width.

  When the data of the electronic component 2 is within the first allowable range (YES in step 113), the control unit 5 stores the electronic component 2 in the storage unit 6 as a normal component (non-defective product). (Step 115). Typically, when the various electronic component 2 data are all within the first allowable range set for each of the various electronic component 2 data, the control unit 5 causes the electronic component 2 to be stored. Treat as normal parts.

  On the other hand, when the data of the electronic component 2 is not within the first allowable range (NO in step 113), the control unit 5 stores the electronic component 2 in the storage unit 6 as a defective component. (Step 116). Typically, when at least one of the data of the various electronic components 2 is not within the first allowable range set for the data of the various electronic components 2, the control unit 5 The electronic component 2 is handled as a defective component.

  After performing the pass / fail determination of the electronic component 2, the control unit 5 proceeds to the next step 117 (see FIG. 6). In step 117, the control unit 5 determines whether all the electronic components 2 scheduled to be sucked are sucked by the suction nozzle 31. When the electronic component 2 to be sucked remains in the suction nozzle 31 (NO in step 117), the control unit 5 rotates the turret 32 again (step 104), and the tip of the suction nozzle 31 newly located at the operation position. The electronic component 2 is attracted to the part (step 101). Then, the control part 5 performs the process after step 102. FIG.

  When all the electronic components 2 scheduled to be sucked are sucked by the suction nozzle 31 (YES in step 117), the control unit 5 completes imaging of all the electronic components 2 sucked by the suction nozzle 31. (Step 118). When there is an electronic component 2 that has not been imaged (NO in step 118), the control unit 5 rotates the turret 32 to switch the electronic component 2 located at the imaging position (step 106), and is newly located at the imaging position. The captured electronic component 2 is imaged (step 107). Thereafter, the control unit 5 executes the processing after step 108.

  When imaging of all the electronic components 2 sucked by the suction nozzle 31 has been completed (YES in Step 118), the control unit 5 executes the mounting operation of the electronic components 2 (Step 119). In this case, the control unit 5 first moves the mounting head 30 (suction nozzle 31) onto the substrate 1. And the control part 5 aligns the position of the suction nozzle 31 located in an operation position, and the position of the board | substrate 1 in which the electronic component 2 is mounted.

  At the time of this alignment, the control unit 5 corrects the position of the suction nozzle 31 based on information such as the positional deviation amount and the angular deviation amount of the electronic component 2 with respect to the suction nozzle 31. Note that information such as the positional deviation amount and the angular deviation amount of the electronic component 2 can be obtained by analyzing an image captured by the second imaging unit 52 or the third imaging unit 53.

  When the position of the suction nozzle 31 and the position of the substrate 1 are aligned, the control unit 5 moves the suction nozzle 31 downward. Then, the control unit 5 switches the suction nozzle 31 from the negative pressure to the positive pressure by the air compressor 33. Thereby, the electronic component 2 is detached from the suction nozzle 31 and the electronic component 2 is mounted on the substrate 1.

  Next, the control unit 5 rotates the turret 32 to switch the suction nozzle 31 located at the operation position. Then, the control unit 5 aligns the position of the suction nozzle 31 newly located at the operation position with the position on the substrate 1. Then, the control unit 5 moves the suction nozzle 31 located at the operation position downward, and mounts the electronic component 2 sucked at the tip of the suction nozzle 31 on the substrate 1. In this way, the electronic components 2 sucked by the suction nozzle 31 are sequentially mounted on the substrate 1.

  In mounting the electronic component 2, only the electronic component 2 determined to be a normal component (non-defective product) in step 115 is mounted on the substrate 1, and the electronic component 2 determined to be a defective component in step 116 is discarded. .

  When the electronic component 2 sucked by the suction nozzle 31 is mounted on the substrate 1, the control unit 5 next determines whether all the electronic components 2 to be mounted on the substrate 1 are mounted (step 120). . When the electronic component 2 to be mounted remains on the substrate 1 (NO in step 120), the control unit 5 moves the mounting head 30 onto the supply unit 20 and sucks the electronic component 2 by the suction nozzle 31. (Step 101). When the mounting of the electronic component 2 is completed (YES in step 120), the substrate 1 is discharged by the conveyor 17, and the processing for one substrate 1 is completed.

[Action etc.]
In the mounting apparatus 100 according to the present embodiment, the first allowable range serving as a criterion for determining the quality of the electronic component 2 is set based on the statistical result obtained by actually statistics the data of the electronic component 2. Therefore, it is possible to accurately determine whether the electronic component 2 is good or bad.

  For example, the average values such as the actual thickness, length, and width of the electronic component 2 may be slightly different from the average values published by the manufacturer of the electronic component 2. In such a case, it may not be possible to appropriately determine whether or not the electronic component 2 is acceptable within an allowable range set in advance by the operator. On the other hand, the mounting apparatus 100 according to the present embodiment sets a first allowable range using the average value μ obtained by actually statistics of the data of the electronic component 2, and the first allowable range is set according to the first allowable range. The pass / fail judgment of the electronic component 2 is executed. Therefore, the quality of the electronic component 2 can be determined with high accuracy.

  Also, setting the allowable range using the allowable rate α is difficult because it requires experience. On the other hand, in this embodiment, since the first allowable range is determined using the standard deviation σ obtained by statistics, the operator can easily set an accurate allowable range.

  As described above, according to the present embodiment, the quality determination of the electronic component 2 can be performed with high accuracy, so that the electronic component 2 that should be determined as a non-defective product is discarded and the electronic component 2 is wasted. This can be prevented. Moreover, in this embodiment, since it can prevent that the electronic component 2 which should be originally judged to be a defective product is mounted on the board | substrate 1, it prevents that the quality defect of a board | substrate will generate | occur | produce. Can do.

An example is given and the effect | action of this invention is demonstrated in more detail.
FIG. 8 is a diagram showing a 1005 type electronic component 2. FIG. 9 is a diagram illustrating a state when the electronic component 2 illustrated in FIG. 8 is sucked by the suction nozzle 31.

  In the description here, a comparison will be described in which the 1005 type electronic component 2 shown in FIG. 8 is determined to be good or bad based on normal determination and determination based on statistical results. In the quality determination of the electronic component 2, the quality is determined by the thickness determination of the electronic component 2.

  FIG. 9A shows a state in which the electronic component 2 is normally sucked by the suction nozzle 31 (thickness measurement: 0.5 mm), and FIG. A state of being sucked obliquely with respect to the suction nozzle 31 is shown (thickness measurement 0.7 mm). Further, FIG. 9C shows a case where the electronic component 2 is sucked vertically with respect to the suction nozzle 31 (thickness measurement: 1.0 mm), and FIG. 9D shows the electronic component. 2 shows a state in which 2 is adsorbed obliquely to the adsorption nozzle 31 (thickness measurement: 0.6 mm).

  First, the quality determination of the electronic component 2 by the normal determination will be described. In this case, an allowable range for the thickness is set by average value ± average value × allowable rate α. For example, the electronic component 2 shown in FIG. 8 has an average thickness of 0.5 mm. When the allowable rate is set to 30% by the operator, the allowable range is set to a range of 0.35 mm to 0.65 mm according to average value ± average value × allowable rate α = 50 mm ± 50 mm × 30%.

  When the allowable range is set in this way, in FIG. 9A, since the thickness measurement result is within the allowable range, it is determined that the electronic component 2 is a normal component. On the other hand, in FIGS. 9B and 9C, the thickness measurement result is out of the allowable range, so the electronic component 2 is determined to be a defective component. In FIG. 9 (D), since the electronic component 2 is attracted diagonally, the electronic component 2 is desired to be a defective component, but since the thickness measurement result is within the allowable range, the electronic component 2 is It is determined that it is a normal part.

  Next, the quality determination of the electronic component 2 based on the statistical result will be described. The statistics of the thickness of the electronic component 2 have a distribution as shown in FIG. The first allowable range serving as a criterion for pass / fail judgment can be calculated by, for example, an average value μ ± β × standard deviation σ. Here, it is assumed that the average value μ of the thickness of the electronic component 2 is 0.5 mm and the standard deviation σ is 0.02. Also assume that β is set to 3 by the operator. In this case, the first allowable range is μ ± βσ = 0.5 mm ± 3 × 0.02, which is 0.44 mm to 0.56 mm.

  When the allowable range is set in this way, in FIG. 9A, since the thickness measurement result is within the allowable range, it is determined that the electronic component 2 is a normal component. On the other hand, in FIG. 9B, FIG. 9C, and FIG. 9D, the thickness measurement result is outside the allowable range, so the electronic component 2 is determined to be a defective component. As described above, in the pass / fail determination based on the statistical result, the case of FIG. 9D, which has been determined as a normal part by the normal determination, can be determined as a defective part.

Second Embodiment
Next, a second embodiment of the present technology will be described. In the second embodiment, after data of a predetermined number of electronic components 2 is accumulated, for one electronic component 2, the quality determination of the electronic component 2 based on the statistical result and the quality determination of the electronic component 2 based on the normal determination are performed. Both are different from the first embodiment in that both pass / fail judgments are executed. Therefore, this point will be mainly described. In the description after the second embodiment, members having the same functions and configurations as those of the above-described first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  FIG. 10 is a flowchart showing a process of the mounting apparatus 100 (the control unit 5) according to the second embodiment of the present technology. The flowchart shown in FIG. 10 is basically the same as the flowchart shown in FIG. 5 except that step 215, step 216, step 218, and step 220 are added. In steps 217 to 220 in FIG. 10 and subsequent steps, processing similar to that in FIG. 6 is executed.

  In step 210, when the number of times the data of the electronic component 2 is acquired and stored for the same type of electronic component 2 is equal to or greater than the predetermined number (YES in step 210), the control unit 5 performs statistics on the data of the electronic component 2 Processing is executed (step 211). In step 211, the control unit 5 calculates the average value μ of the distribution of the electronic component 2 data and the standard deviation σ.

  When the average value μ of the data distribution of the electronic component 2 and the standard deviation σ are calculated, the control unit 5 determines the first allowable value based on the calculated average value μ, the standard deviation σ, and (statistical result). A range is set (step 212). When the first allowable range is set, the control unit 5 performs a pass / fail determination of the electronic component 2 based on the set first allowable range (determination based on statistical results) (step 213).

  When the data of the electronic component 2 is within the first allowable range (YES in step 213), the control unit 5 proceeds to the next step 215. In step 215, the control unit 5 performs the pass / fail determination of the electronic component 2 based on the second allowable range set in advance by the operator regardless of the statistics (normal determination). The second tolerance used in step 215 is typically the same as the second tolerance used in step 214, but may be different.

  In step 215, when the data of the electronic component 2 is within the second allowable range (YES in step 215), the control unit 5 determines that the electronic component 2 is a normal component (non-defective product) and stores the storage unit 6 (Step 219). In other words, the electronic component 2 determined to be OK in both the quality determination of the electronic component 2 based on the statistical result and the quality determination of the electronic component 2 based on the normal determination is treated as a normal component.

  In step 215, when the data of the electronic component 2 does not fall within the second allowable range (NO in step 215), the control unit 5 stores the electronic component 2 in the storage unit 6 as being a semi-normal component. (Step 220). That is, the electronic component 2 that is determined to be OK in the pass / fail determination of the electronic component 2 based on the statistical result and is determined to be NG in the pass / fail determination of the electronic component 2 by the normal determination is treated as a quasi-normal component.

  In step 213, when the data of the electronic component 2 does not fall within the first allowable range (NO in step 213), the control unit 5 proceeds to the next step 216, and based on the second allowable range, The pass / fail of the component 2 is executed (normal determination). The second tolerance used in step 216 is typically the same as the second tolerance used in step 214, but may be different.

  In step 216, when the data of the electronic component 2 is within the second allowable range (YES in step 216), the control unit 5 stores the electronic component 2 in the storage unit 6 as being a semi-defective component. (Step 218). That is, the electronic component 2 that is determined to be NG in the pass / fail determination of the electronic component 2 based on the statistical result and is determined to be OK in the pass / fail determination of the electronic component 2 by the normal determination is treated as a semi-defective component.

  In step 216, when the data of the electronic component 2 is not within the second allowable range (NO in step 216), the control unit 5 stores the electronic component 2 in the storage unit 6 as a defective component. (Step 217). In other words, the electronic component 2 that is determined to be NG in both the quality determination of the electronic component 2 based on the statistical result and the quality determination of the electronic component 2 based on the normal determination is treated as a defective component.

  The handling of the quasi-normal part and the quasi-defective part (the determination result based on the statistical result and the electronic component 2 in which the determination result by the normal determination is reversed) will be described. As described above, the quasi-normal component is the electronic component 2 that is determined to be OK in the pass / fail determination of the electronic component 2 based on the statistical result and is determined to be NG in the pass / fail determination of the electronic component 2 by the normal determination. . The semi-defective component is an electronic component 2 that is determined to be NG in the pass / fail determination of the electronic component 2 based on the statistical result, and that is determined to be OK in the pass / fail determination of the electronic component 2 by the normal determination.

  It is assumed that whether the quasi-normal component or the quasi-defective component is handled as a normal component or a defective component varies depending on the preference of the operator who uses the mounting apparatus 100. Therefore, it may be configured such that the operator can set in advance which of the quasi-normal part and the quasi-defective part is handled as a normal part or a defective part. This setting is performed by the operator inputting a set value via the input unit 8 before the production of the substrate 1 is started. Accordingly, the operator can arbitrarily select which of the normal component and the defective component the electronic component 2 whose pass / fail judgment result is reversed is treated as a set value.

  In this case, when a quasi-normal part or a quasi-defective part occurs, the control unit 5 determines the quasi-normal part or the quasi-defective part as either a normal part or a defective part according to a setting value set in advance by the operator. You only have to decide whether to handle it. Typically, quasi-normal parts and quasi-defective parts treated as normal parts are executed on the substrate 1, and quasi-normal parts and quasi-defective parts treated as defective parts are discarded.

  Another example of handling of quasi-normal parts and quasi-defective parts will be described. For example, when a quasi-normal component or a quasi-defective component occurs, the control unit 5 stops the mounting apparatus 100 and generates a sound from a sound generation unit (notification unit) (not shown) such as a buzzer, The operator is notified that a quasi-normal part or a quasi-defective part has occurred. The method of notifying the operator that a quasi-normal part or a quasi-defective part has occurred is not limited to a method using sound, and may be a method using light.

  Then, the control unit 5 captures the image of the electronic component 2 captured by the second imaging unit 52 (the image captured from the side of the electronic component 2) and the electronic component 2 captured by the third imaging unit 53. An image (an image obtained by imaging the electronic component 2 from the lower side) is displayed on the screen of the display unit 7.

  The operator recognizes the occurrence of a quasi-normal part or a quasi-defective part by listening to the sound from the sound generator. The operator visually recognizes the image of the electronic component 2 displayed on the display unit 7 or actually visually observes the electronic component 2 sucked by the suction nozzle 31. Thus, the operator determines whether the electronic component 2 determined to be a quasi-normal component or a quasi-defective component is to be handled as a normal component or a defective component.

  The mounting apparatus 100 may include a re-inspection unit (not shown) that precisely re-inspects quasi-normal parts and quasi-defective parts. For example, when a quasi-normal part or a quasi-defective part occurs, the control unit 5 re-inspects the quasi-normal part or the quasi-defective part by the re-inspection unit, and the quasi-normal part or the quasi-defective part according to the result of the re-inspection. Is to be treated as a normal part or a defective part. An example of the re-inspection unit is a high-precision camera.

  In the second embodiment, for one electronic component 2, both pass / fail determinations of the electronic component 2 based on the statistical result and the pass / fail determination of the electronic component 2 based on the normal determination are executed. The quality determination of the electronic component 2 can be executed.

<Third Embodiment>
Next, a third embodiment of the present technology will be described.
First, the basic concept of the mounting apparatus 100 according to the third embodiment will be described with reference to FIG. FIG. 11 shows the difference in the distribution of statistical data for each production lot. As shown in FIG. 11, even if the electronic components 2 are the same type, electronic components 2 having different production lots may have different statistical data distributions. In the example shown in FIG. 11, the two distributions have the same standard deviations σ and σ ′ but different average values μ and μ ′.

  In the third embodiment, processing such as statistics is executed for each carrier tape (not for each electronic component 2 of the same type) in order to eliminate the influence of such a distribution difference for each production lot. That is, even in the same type of electronic component 2, if the carrier tape is different, the production lot may be different, and the distribution of statistical data may be different. Therefore, in the mounting apparatus 100, statistical processing of the electronic component 2 is executed for each carrier tape.

  The basic processing of the third embodiment is the same as that in FIGS. 5 and 6, and here, the processing of the mounting apparatus 100 according to the third embodiment will be described with reference to FIG. 5.

  The control unit 5 images the electronic component 2 that has reached the imaging position (step 107), acquires the data of the electronic component 2 from the image of the electronic component 2, and accumulates the data of the electronic component 2 (step 108). 109). The control unit 5 manages the data of the electronic component 2 for each carrier tape. Accordingly, even if the electronic component 2 is the same type, the data of the electronic component 2 is managed separately if the carrier tape is different.

  For example, the same type of electronic component 2 may be supplied simultaneously with two carrier tapes. Further, when the electronic component 2 in the carrier tape is lost, the supply of the electronic component 2 is switched so that the electronic component 2 is supplied from a spare carrier tape that accommodates the same type of electronic component 2 as the carrier tape. Sometimes. In addition, when the electronic component 2 in the carrier tape is lost, the carrier tape may be replaced with a new carrier tape. For example, in such a case, even if the carrier tape contains the same type of electronic component, the data of the electronic component 2 is managed for each carrier tape.

  When the data of the electronic component 2 is accumulated, the control unit 5 determines whether the number of data acquisition and accumulation is equal to or greater than a predetermined number (step 110). The determination in step 110 is also determined for each carrier tape of the electronic component 2. That is, the control unit 5 determines whether the number of acquisitions and accumulations of data of the electronic component 2 on the same carrier tape is equal to or greater than a predetermined number.

  When the number of acquisition and accumulation of data of the electronic component 2 on the same carrier tape is less than the predetermined number (NO in step 110), the control unit 5 performs the pass / fail determination of the electronic component 2 by the normal determination (step). 114). On the other hand, when the data acquisition and accumulation count of the electronic component 2 on the same carrier tape is equal to or greater than the predetermined count (YES in step 110), the control unit 5 executes data statistical processing of the electronic component 2. In this statistical process, the control unit 5 calculates the average value μ of the data distribution of the electronic component 2 and the standard deviation σ for each carrier tape.

  When the average value μ of the data distribution of the electronic component 2 and the standard deviation σ are calculated, the control unit 5 determines the first allowable value based on the calculated average value μ, the standard deviation σ, and (statistical result). A range is set (step 112). The first allowable range is set for each carrier tape.

  When the first allowable range is set, the control unit 5 performs pass / fail determination of the electronic component 2 based on the set first allowable range (determination based on statistical results) (step 113).

  As described above, in the third embodiment, since processing such as statistics is executed for each carrier tape, an appropriate first allowable range in which the influence of the distribution difference for each production lot is eliminated is set. be able to.

  In the description of the third embodiment, the processing of the control unit has been described with reference to FIG. 5, but also in FIG. 10, statistical processing of data of the electronic component 2 may be executed for each carrier tape.

<Fourth embodiment>
Next, a fourth embodiment of the present technology will be described.
In the fourth embodiment, the pass / fail judgment based on the first range in which the data of the electronic component 2 is statistically set for each same carrier tape, and the data of the electronic component 2 is statistically overall for each electronic component 2 of the same type. Then, the pass / fail judgment of the electronic component according to the set second range is executed.

  FIG. 12 is a flowchart showing processing of the mounting apparatus 100 (control unit 5) according to the fourth embodiment. In the flowchart shown in FIG. 12, step 315 and step 316 are different from those in FIG. 10, but other parts are the same as those in FIG. In steps 317 to 320 in FIG. 12 and subsequent steps, processing similar to that in FIG. 6 is executed.

  The control unit 5 images the electronic component 2 that has reached the imaging position (step 307), acquires the data of the electronic component 2 from the image of the electronic component 2, and accumulates the data of the electronic component 2 (step 308). 309). The control unit 5 manages the data of the electronic component 2 for each carrier tape, and manages the data of the electronic component 2 for each type of the electronic component 2.

  For example, it is assumed that the electronic component 2 in the carrier tape is lost and the carrier tape is replaced with a new carrier tape. In this case, the control unit 5 adds the data of the electronic component 2 of the new carrier tape to the data of the electronic component 2 of the original carrier tape, and manages the data of the electronic component 2 of the same type as a whole. Further, the control unit 5 independently manages the data of the new electronic component 2 of the carrier tape independently of the data of the electronic component 2 of the original carrier tape.

  When the data of the electronic component 2 is accumulated, the control unit 5 determines whether or not the number of times the data of the electronic component 2 is acquired and accumulated is greater than or equal to a predetermined number (step 310). In this case, the control unit 5 determines whether or not the number of acquisition and storage times of the electronic component 2 on the same carrier tape is equal to or greater than a predetermined number.

  When the number of acquisition and storage times of the electronic component 2 on the same carrier tape is less than the predetermined number (NO in step 310), the control unit 5 executes the pass / fail determination of the electronic component 2 by the normal determination (step 314). . On the other hand, when the acquisition and accumulation frequency of the electronic component 2 on the same carrier tape is equal to or greater than the predetermined number (YES in step 310), the control unit 5 executes the data statistical processing of the electronic component 2 (step 311). .

  In this statistical process, first, the control unit 5 calculates the average value μ and the standard deviation σ based on the data distribution of the electronic component 2 for each carrier tape. Further, the control unit 5 calculates the average value μ and the standard deviation σ based on the distribution of the entire data of the electronic component 2 of the same type.

  Next, the control unit 5 sets a first allowable range (step 312). In step 312, the control unit 5 sets two ranges as the first allowable range. The first range is set based on the average value μ calculated based on the data distribution of the electronic component 2 for each carrier tape and the standard deviation σ. The second range is set based on the average value μ calculated based on the distribution of the entire data of the electronic component 2 of the same type and the standard deviation σ. The first range and the second range can be calculated by, for example, an average value μ ± β × standard deviation σ.

  Next, the control part 5 performs the quality determination of the electronic component 2 based on the set 1st range (determination based on the statistical result for every carrier tape) (step 313).

  If the data of the electronic component 2 is within the first range (YES in step 313), the control unit 5 proceeds to the next step 315. In step 315, the control part 5 performs the quality determination of the electronic component 2 based on the 2nd range (determination based on the statistical result about the electronic component 2 whole of the same type).

  In step 315, when the data of the electronic component 2 is within the second range (YES in step 315), the control unit 5 determines that the electronic component 2 is a normal component (non-defective product) in the storage unit 6. Store it (step 319). That is, the electronic component 2 determined to be OK in both the quality determination of the electronic component 2 based on the statistical result for each carrier tape and the quality determination of the electronic component 2 based on the statistical result of the same electronic component 2 as a whole. Are treated as normal parts.

  In step 315, when the data of the electronic component 2 is not within the second range (NO in step 315), the control unit 5 stores the electronic component 2 in the storage unit 6 as being a semi-normal component. (Step 320). That is, it is determined that the electronic component 2 is acceptable based on the statistical result for each carrier tape, and is determined to be NG when the electronic component 2 is evaluated based on the statistical result of the electronic component 2 as a whole. The electronic component 2 is treated as a semi-normal component.

  In step 313, when the data of the electronic component 2 does not fall within the first range (NO in step 313), the control unit 5 proceeds to the next step 316. In step 316, the control part 5 performs the quality of the electronic component 2 based on the 2nd range (determination based on the statistical result about the electronic component 2 whole of the same type).

  In step 316, when the data of the electronic component 2 is within the second range (YES in step 316), the control unit 5 stores the electronic component 2 in the storage unit 6 as being a semi-defective component. (Step 318). That is, an electronic device that is determined to be NG in the pass / fail determination of the electronic component 2 based on the statistical result for each carrier tape, and that is determined to be OK in the pass / fail determination of the electronic component 2 based on the statistical result of the entire electronic component 2 of the same type. The part 2 is treated as a semi-defective part.

  In step 316, when the data of the electronic component 2 is not within the second range (NO in step 316), the control unit 5 stores the electronic component 2 in the storage unit 6 as a defective component. (Step 317). That is, the electronic component that is determined to be NG in both the quality determination of the electronic component 2 based on the statistical result for each carrier tape and the quality determination of the electronic component 2 based on the statistical result of the electronic component 2 as a whole of the same type 2 is treated as a defective part.

  The handling of the quasi-normal part and the quasi-defective part is the same as that in the second embodiment described above, and therefore the description thereof is omitted here.

  In 4th Embodiment, the quality determination of the electronic component 2 based on the statistical result for every carrier tape about one electronic component 2 and the quality determination of the electronic component 2 based on the statistical result as the electronic component 2 whole of the same type are carried out. Both pass / fail judgments are executed. Thereby, in 4th Embodiment, the quality determination of the electronic component 2 can be performed still more accurately.

  Here, it is expected that the statistical results (average value μ, standard deviation σ, etc.) for each carrier tape do not change significantly compared to the statistical results for the entire electronic component 2 of the same type. Therefore, when the statistical result for each carrier tape is greatly different from the statistical result for the entire electronic component 2 of the same type, it can be estimated that the carrier tape is misplaced.

  The carrier tape misplacement means that an operator mistakenly attaches a carrier tape different from the carrier tape to be originally attached to the mounting apparatus 100. In this case, an electronic component 2 that is different from the electronic component 2 that should originally be supplied from the carrier tape is supplied, and the wrong electronic component 2 is sucked by the suction nozzle 31.

  If the statistical result for each carrier tape is significantly different from the statistical result for the entire electronic component 2 of the same type, it can be used that it can be assumed that the carrier tape is mistaken.

  For example, the control unit 5 determines whether the statistical results (average value μ, standard deviation σ, etc.) for each carrier tape are within a predetermined range compared to the statistical results for the entire electronic component 2 of the same type. This predetermined range is appropriately set by the operator so that the carrier tape can be detected properly. When the statistical result for each carrier tape is not within a predetermined range as compared to the statistical result for the entire electronic component 2 of the same type, the control unit 5 determines that the carrier tape has been mistaken and mounted. The apparatus 100 is stopped. In the mounting apparatus 100, it is possible to appropriately detect the mistaking of the carrier tape.

  When the carrier tape is mistaken, the data of the electronic components 2 of different types is reflected in the statistics for the entire electronic components 2 of the same type. Therefore, when the statistical result for each carrier tape is not within a predetermined range compared to the statistical result for the entire electronic component 2 of the same type, the control unit 5 displays the statistical result for the entire electronic component 2 of the same type. May be excluded from statistical statistics. Thereby, it can prevent that the data of the electronic component 2 of a different type are reflected in the statistical result about the electronic component 2 whole of the same type.

<Various modifications>
The present technology is not limited to the above-described embodiment, and various modifications can be made.

In the example described above, the first allowable range (first range, second range) is set by the average value μ ± β × standard deviation σ using both the average value μ and the standard deviation σ. As explained. However, the present invention is not limited to this, and the first allowable range may be set using one of the average value μ and the standard deviation σ. For example, the first allowable range may be set using an average value μ based on statistics and an allowable rate α used in normal determination. In this case, the first allowable range can be calculated by the average value μ ± average value μ × allowable rate α. Even in such a case, the quality determination of the electronic component 2 can be executed with high accuracy.

  Further, for example, the control unit may execute a process of reflecting the statistical result in the normal determination in steps 114, 214, 215, 216, and 314. The second embodiment and the fourth embodiment may be combined. That is, the control unit 3 for one electronic component, that is, pass / fail determination based on the statistical result for each carrier tape, pass / fail determination based on the statistical result of the same electronic component 2 as a whole, and pass / fail determination based on the normal determination. One pass / fail decision may be performed.

This technique can also take the following composition.
(1) A mounting unit that holds electronic components and mounts on a substrate;
An imaging unit that images the electronic component held by the mounting unit;
Analyzing the image of the electronic component imaged by the imaging unit to acquire the data of the electronic component, storing the data of the electronic component, statistics the accumulated data of the electronic component, and based on the statistical result A control unit that sets a first allowable range and executes pass / fail determination of the electronic component based on the image of the electronic component based on the first allowable range.
(2) The mounting device according to (1) above,
The control unit calculates a standard deviation of the accumulated data of the electronic component, and sets the first allowable range based on the calculated standard deviation.
(3) The mounting apparatus according to (1) or (2) above,
The control unit calculates an average value of the accumulated data of the electronic component, and sets the first allowable range based on the calculated average value.
(4) The mounting device according to any one of (1) to (3),
The control unit, based on both of the first allowable range set based on a statistical result and the second allowable range set by an operator regardless of the statistical result, A mounting device that performs pass / fail judgment of components.
(5) The mounting device according to (4) above,
The control unit is preset by the operator when the determination result based on the determination based on the first allowable range and the determination result based on the second allowable range are reversed. A mounting apparatus that determines whether the electronic component whose determination result is reversed according to a set value is treated as a non-defective product or a defective product.
(6) The mounting apparatus according to (4) above,
A notification section;
The control unit stops the mounting apparatus when the determination result based on the determination based on the first allowable range and the determination result based on the second allowable range are reversed. And the mounting apparatus which notifies that the determination result became reverse via the said notification part.
(7) The mounting apparatus according to any one of (1) to (6) above,
The control unit performs pass / fail judgment of the electronic component based on a second allowable range set by the operator regardless of the statistical result until data of the predetermined number of electronic components is accumulated. Mounting device.
(8) The mounting apparatus according to any one of claims (1) to (7),
One or a plurality of carrier tapes that can be attached to and detached from the mounting apparatus, respectively containing a plurality of electronic components of the same type supplied to the mounting unit,
The said control part statistics the data of the said electronic component for every said carrier tape, and sets the 1st range as said 1st tolerance | permissible_range for every said carrier tape based on a statistical result. The mounting apparatus.
(9) The mounting device according to (8) above,
The control unit statistically analyzes the electronic components of the same type accommodated in the different carrier tapes as a whole, and based on the statistical result, the second allowable first range for each electronic component of the same type. A mounting apparatus that performs pass / fail determination of the electronic component based on both the first range and the second range.
(10) The mounting device according to (9) above,
The control unit sets a preset value set in advance by an operator when the determination result based on the determination based on the first range and the determination result based on the second range are reversed. In accordance with the mounting device, the electronic device whose determination result is reversed is determined to be handled as a non-defective product or a defective product.
(11) The mounting device according to (9) above,
A notification section;
The control unit stops the mounting apparatus when the determination result based on the determination based on the first range and the determination result based on the second range are reversed, and The mounting apparatus that notifies that the determination result is reversed via the notification unit.
(12) The mounting device according to any one of (9) to (11),
The control unit determines whether the statistical result statistically calculated for each carrier tape is within a predetermined range compared to a statistical result of the same type of electronic component as a whole, and is within the predetermined range. If not, the mounting device stops the mounting device.
(13) The mounting apparatus according to (12) above,
The control unit excludes a statistical result determined not to be within the predetermined range from the overall statistics of the electronic component of the same type.
(14) Hold electronic components mounted on the board,
Imaging the held electronic component,
Analyzing the captured image of the electronic component to obtain data of the electronic component,
Accumulating the electronic component data,
Statistics the electronic component data accumulated,
Set the first tolerance based on the statistical results,
An electronic component pass / fail determination method for executing pass / fail determination of the electronic component based on an image of the electronic component based on the first allowable range.
(15) In mounting equipment,
Holding an electronic component mounted on a substrate;
Imaging the held electronic component;
Analyzing the captured image of the electronic component to obtain data of the electronic component;
Storing the electronic component data;
Statistics the accumulated electronic component data;
Setting a first tolerance range based on the statistical results;
And a step of executing pass / fail judgment of the electronic component based on the image of the electronic component based on the first allowable range.
(16) Hold the electronic component mounted on the board,
Imaging the held electronic component,
Analyzing the captured image of the electronic component to obtain data of the electronic component,
Accumulating the electronic component data,
Statistics the electronic component data accumulated,
Set the first tolerance based on the statistical results,
Based on the first permissible range, the quality determination of the electronic component based on the image of the electronic component is executed,
A method for manufacturing a substrate, wherein the electronic component that is determined to be a non-defective product is mounted on the substrate.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Electronic component 5 ... Control part 6 ... Memory | storage part 7 ... Display part 8 ... Input part 15 ... Conveyance part 20 ... Supply part 30 ... Mounting head 31 ... Adsorption nozzle 32 ... Turret 51 ... 1st imaging part 52 ... Second imaging unit 53 ... Third imaging unit 54 ... Mirror 100 ... Mounting device

Claims (16)

A mounting part for holding electronic components and mounting them on a substrate;
An imaging unit that images the electronic component held by the mounting unit;
Analyzing the image of the electronic component imaged by the imaging unit to acquire the data of the electronic component, storing the data of the electronic component, statistics the accumulated data of the electronic component, and based on the statistical result A control unit that sets a first allowable range and executes pass / fail determination of the electronic component based on the image of the electronic component based on the first allowable range. The mounting apparatus according to claim 1,
The control unit calculates a standard deviation of the accumulated data of the electronic component, and sets the first allowable range based on the calculated standard deviation. The mounting apparatus according to claim 1,
The control unit calculates an average value of the accumulated data of the electronic component, and sets the first allowable range based on the calculated average value. The mounting apparatus according to claim 1,
The control unit, based on both of the first allowable range set based on a statistical result and the second allowable range set by an operator regardless of the statistical result, A mounting device that performs pass / fail judgment of components. The mounting apparatus according to claim 4,
The control unit is preset by the operator when the determination result based on the determination based on the first allowable range and the determination result based on the second allowable range are reversed. A mounting apparatus that determines whether the electronic component whose determination result is reversed according to a set value is treated as a non-defective product or a defective product. The mounting apparatus according to claim 4,
A notification section;
The control unit stops the mounting apparatus when the determination result based on the determination based on the first allowable range and the determination result based on the second allowable range are reversed. And the mounting apparatus which notifies that the determination result became reverse via the said notification part. The mounting apparatus according to claim 1,
The control unit performs pass / fail judgment of the electronic component based on a second allowable range set by the operator regardless of the statistical result until data of the predetermined number of electronic components is accumulated. Mounting device. The mounting apparatus according to claim 1,
One or a plurality of carrier tapes that can be attached to and detached from the mounting apparatus, respectively containing a plurality of electronic components of the same type supplied to the mounting unit,
The said control part statistics the data of the said electronic component for every said carrier tape, and sets the 1st range as said 1st tolerance | permissible_range for every said carrier tape based on a statistical result. The mounting apparatus. The mounting apparatus according to claim 8, wherein
The control unit statistically analyzes the electronic components of the same type accommodated in the different carrier tapes as a whole, and based on the statistical result, the second allowable first range for each electronic component of the same type. A mounting apparatus that performs pass / fail determination of the electronic component based on both the first range and the second range. The mounting apparatus according to claim 9, wherein
The control unit sets a preset value set in advance by an operator when the determination result based on the determination based on the first range and the determination result based on the second range are reversed. In accordance with the mounting device, the electronic device whose determination result is reversed is determined to be handled as a non-defective product or a defective product. The mounting apparatus according to claim 9, wherein
A notification section;
The control unit stops the mounting apparatus when the determination result based on the determination based on the first range and the determination result based on the second range are reversed, and The mounting apparatus that notifies that the determination result is reversed via the notification unit. The mounting apparatus according to claim 9, wherein
The control unit determines whether the statistical result statistically calculated for each carrier tape is within a predetermined range compared to a statistical result of the same type of electronic component as a whole, and is within the predetermined range. If not, the mounting device stops the mounting device. The mounting apparatus according to claim 12, wherein
The control unit excludes a statistical result determined not to be within the predetermined range from the overall statistics of the electronic component of the same type. Holds electronic components mounted on the board,
Imaging the held electronic component,
Analyzing the captured image of the electronic component to obtain data of the electronic component,
Accumulating the electronic component data,
Statistics the electronic component data accumulated,
Set the first tolerance based on the statistical results,
An electronic component pass / fail determination method for executing pass / fail determination of the electronic component based on an image of the electronic component based on the first allowable range. In mounting equipment,
Holding an electronic component mounted on a substrate;
Imaging the held electronic component;
Analyzing the captured image of the electronic component to obtain data of the electronic component;
Storing the electronic component data;
Statistics the accumulated electronic component data;
Setting a first tolerance range based on the statistical results;
And a step of executing pass / fail judgment of the electronic component based on the image of the electronic component based on the first allowable range. Holds electronic components mounted on the board,
Imaging the held electronic component,
Analyzing the captured image of the electronic component to obtain data of the electronic component,
Accumulating the electronic component data,
Statistics the electronic component data accumulated,
Set the first tolerance based on the statistical results,
Based on the first permissible range, the quality determination of the electronic component based on the image of the electronic component is executed,
A method for manufacturing a substrate, comprising mounting the electronic component determined to be a non-defective product on the substrate.

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