JP2016111152A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stabilize component mounting work by automatically, efficiently correcting a component mounting position of a tape feeder from a suction state of an electronic component by a suction nozzle.SOLUTION: The number of times where re-suction is executed since a suction state is determined as defective is counted for each defective mode. If a suction defect caused by a specific defective mode continuously occurs preset times, a reference mark of a feeder is automatically imaged and a suction position of an electronic component is corrected. In addition, an upper limit value for a count number is set for each defective mode and, when the number of the suction defects caused by the specific defective mode cumulatively reaches the upper limit value, the suction position may be corrected. Further, the count number for each defective mode is managed as a result value and, according to an occurrence frequency, the preset number of times or the upper limit value may be automatically increased or decreased.SELECTED DRAWING: Figure 3

Description

  The present invention provides a component mounting apparatus that automatically corrects the component suction position and stabilizes the component suction operation when the suction nozzle takes out the electronic component from the component supply device and mounts the electronic component on the board. About.

In the conventional component mounting device, the electronic component supplied from the component supply device is sucked by the suction nozzle attached to the mounting head that can move in the X-axis direction and the Y-axis direction, and the suction state of the component is once confirmed by the camera. Later, the substrate is moved to the mounting position and mounted on the substrate. At that time, if any abnormality is detected in the suction state of the component by the suction nozzle and it is determined that the mounting of the component is hindered, the component is discarded and the component is suctioned again. Also, if such an adsorption abnormality continues, there is a possibility that the feeder reference mark is physically deviated from the origin of the device. The image is picked up again, the component suction position is corrected, and the component is re-sucked.

JP 2008-124169 A

  However, there are various causes and symptoms of the component suction abnormality by the suction nozzle, and if all the abnormality is uniformly discarded, the component is wasted and the efficiency is low. For this reason, as described in the above-mentioned Patent Document 1, the number of occurrences of a suction abnormality with a light symptom such as a slight shift in the suction position is counted while re-sucking, and the mark is displayed when the number of times of abnormality exceeds the set number. A method is used in which the pickup position of the feeder is picked up by a camera and the pickup coordinates are corrected. However, this method alone is not sufficient as a response in the actual mounting process, and there is still room for improvement.

Therefore, the present invention has been made to solve the above-described problems. When a component suction abnormality occurs, the component suction by the suction nozzle is monitored automatically and efficiently for stable component suction. An object of the present invention is to provide a component mounting apparatus that can be used.

In order to solve the above-described problem, the invention according to claim 1 is a component mounting apparatus that sucks an electronic component supplied from a component supply device with a suction nozzle and mounts the electronic component on a circuit board. A suction determination unit that determines whether the suction state is good or bad from image data obtained by picking up the parts that have been picked up by the imaging device, and the number of times that the suction state is determined to be bad based on the determination result and re-sucks is counted for each failure mode. A recording unit and a correction unit that automatically captures the reference mark of the feeder and corrects the suction position of the electronic component when suction failure due to a specific failure mode occurs continuously for a set number of times. Features.

  According to the present invention, even when the suction state is determined to be poor based on the image processing result and re-suction is reached, the number of times is recorded for each failure mode, and the suction failure due to the specific failure mode is continuously generated a set number of times. Only in such a case, by automatically imaging the fiducial mark of the feeder and correcting the suction position of the electronic component, the component mounting operation can be stabilized by the minimum necessary correction processing.

Furthermore, the specific failure mode may be a failure due to a component adsorption position shift, and the position shift dimension may be within a set range. This eliminates minor misalignments that do not interfere with the mounting operation, and large symptom cases where the misalignment size is large and requires immediate imaging of the reference mark. Efficient operation is possible by limiting the number of symptoms to a level sufficient for adsorption. Therefore, it is desirable that the misalignment dimension to be counted is determined in advance within a set range from the set value A to B.

Further, the component mounting apparatus is configured to mount the electronic component supplied from the component supply apparatus on the circuit board by the suction nozzle, and from the image data obtained by imaging the component sucked by the suction nozzle with the imaging device Adsorption determination means for determining whether or not the adsorption state is good, means for counting and recording the number of times that the adsorption state is determined to be bad based on the determination result for each failure mode, and the upper limit of the count number for each failure mode in advance , And when the suction failure due to the failure mode reaches the upper limit value, the feeder reference mark may be automatically imaged to correct the suction position of the electronic component.

As described above, the cause of the defect may be an enormous symptom in which accurate suction processing cannot be expected unless the feeder reference mark is imaged immediately and the suction position of the electronic component is corrected. In some cases, it may be sufficient to perform correction processing when it occurs continuously thereafter. From this point of view, it is also an efficient operation to provide an upper limit value for the number of failures for each cause of failure and to correct the suction position when the upper limit value is reached. This aspect differs from the case of claim 1 in that it is a correction target even when it does not occur continuously.

Next, the count number for each failure mode may be managed as an actual value, and the set number of times or the upper limit value may be automatically increased or decreased according to the occurrence frequency. It is assumed that the cause of the failure is biased while the component mounter is continuously operated, and it is considered that the initially set value and upper limit value for each failure mode may not be appropriate due to subsequent operation. In such a case, the determination is made based on the actual value for each failure mode. For example, for a mode with a high occurrence frequency, the upper limit value is set to a smaller value, and correction processing can be performed early.

With the above means, in the component supply device, when the suction nozzle picks up the electronic component and mounts it on the board, the component suction position can be automatically and efficiently corrected even if a component suction abnormality occurs. It can be stabilized.

It is a perspective view of the component mounting machine which concerns on implementation of this invention. 1 is a block diagram schematically showing a system configuration of the present invention. It is a top view which shows the components adsorption | suction part of the feeder used in the Example of this invention. It is an operation | movement flowchart in one Example of this invention.

First, a schematic configuration of the component mounter in the present invention will be described. FIG. 1 is a perspective view of the component mounter, in which two component mounters 10 are installed on a base 5. The component mounter 10 includes a component transfer device 20, a substrate transfer device 30, and a component supply device 40 as main devices.

The component transfer device 20 is disposed above the substrate transfer device 30 and the component supply device 40, and two Y-axis rails 27 are fixed in parallel to the ceiling side of the main body cover 12 along the Y-axis direction. A Y-axis slide 21 that is movable in the axial direction is provided. A screw shaft 28 connected to the output shaft of the Y-axis motor 22 is rotatably supported between the two Y-axis rails 27 via a bearing, and the screw shaft 28 is fixed to the Y-axis slide 21. It is screwed through. An X-axis motor 23 is installed on the Y-axis slide 21, and the X-axis slide 24 is moved in the X-axis direction by a screw shaft connected to the output shaft of the X-axis motor 23.

The X-axis slide 24 includes a mounting head 25 that sucks components and mounts them on a substrate, a mark camera 52 (FIG. 2) that images a reference mark 68 (FIG. 3) attached to the feeder 43, and a component suction state. A side camera 51 (FIG. 2) to be monitored is attached. The mounting head 25 holds a suction nozzle 16 (FIG. 2) for sucking parts.

The board | substrate conveyance apparatus 30 conveys a board | substrate to a X-axis direction, and is what is called a double conveyor type. The first transport device 31 and the second transport device 32 are configured such that a pair of conveyor belts (not shown) that support and transport the substrate on the device body 13 are opposed to each other.

The component supply device 40 is configured by arranging a plurality of feeders 43 side by side in the X-axis direction on the front portion of the main body cover 12 on the device main body 13, and each feeder 43 is set to be replaceable with the device main body 13. Yes. The feeder 43 includes a supply reel 42 that is detachably attached and a carrier tape 67 (FIG. 3) wound around the supply reel 42. The apparatus main body 13 is provided with a posture auxiliary member 14 for stabilizing the standing posture of the supply reel 42 when the feeder 43 is attached and detached.

Between the component supply device 40 and the substrate transport device 30, a parts camera 50 that images the component 64 (FIG. 3) sucked by the suction nozzle 16 at the component supply position 41 from below is installed. A reference mark 68 is provided in the vicinity of the component supply position 41 (FIG. 3) of the feeder 43. This reference mark 68 is read by the mark camera 52, and the attachment error of the feeder 43 to the apparatus main body 13 and the center of the cavity 65 are detected. The error with respect to the position can be corrected. A display device 1 is provided at the front of the component mounter 10.

FIG. 2 is a block diagram schematically showing the system configuration of the present invention. The component mounting machine 10 includes a control device 15, and the control device 15 includes a CPU 53 and a storage unit 54 that stores various data. Then, the control device 15 processes the image picked up by the mark camera 52 to calculate the amount of positional deviation of the substrate, etc., or judges pass / fail from the image of the suction state of the parts picked up by the parts camera 50 and the side camera 51. The image processing unit 55 having a function, the mounting head 25 is accurately positioned on the substrate corrected based on the processing result by the image processing unit 55, and the component 64 sucked and held by the suction nozzle 16 is set to the target position on the substrate. A positioning control unit 56 that controls the X-axis motor 23 and the Y-axis motor 22 is provided so that it can be accurately mounted. The control device 15 is connected to the component transfer device 20, the substrate transport device 30, and the component supply device 40 via the drive circuit 33, and further includes a mounting head 25 that holds the suction nozzle 16, a mark camera 52, A parts camera 50 and a side camera 51 are connected.

FIG. 3 is an enlarged view of the periphery of the component supply position 41 of the feeder 43 serving as the component supply apparatus 40 as viewed from above. The carrier tape 67 is formed with cavities 65 for accommodating components at regular pitch intervals, and the upper openings of the cavities 65 are usually covered with a top tape 61 affixed to the carrier tape 67, and the carrier tape 67 and the top tape 61 The part is taped. The carrier tape 67 is conveyed from right to left in FIG. 3, and the top tape 61 is peeled off from the carrier tape 67 before the component supply position 41 and is folded back onto the tape guide 63. As a result, the component 64 is exposed on the upper surface of the carrier tape 67 and the suction nozzle 16 can suck the component. The carrier tape 67 is fed out by a predetermined pitch by a motor (not shown) connected via a gear mechanism to a sprocket (not shown) that engages with the sprocket hole 66, and the parts 64 in the cavity 65 are fed into the feeder 43. The components are sequentially supplied to the component supply position 41.

The mounting head 25 moves in a plane with the component 64 at a predetermined relative position on the basis of the reference mark 68 on the tape guide 63 as a target, lowers the suction nozzle 16, moves up after sucking the component 64, and sucks the component. After the state is imaged by the parts camera 50 and the side camera 51, the component 64 is mounted on a predetermined substrate. When the component suction is finished, the feeder 43 feeds the carrier tape 67 by a predetermined pitch by the rotational drive of the sprocket fitted in the sprocket hole 66 to prepare for the next component suction.

The component mounter 10 is physically located at a relative position from a predetermined device origin to the reference mark 68 of the feeder 43 or from the reference mark 68 to the component 64 at the component supply position 41 due to some external factor such as vibration or shock. Deviation may occur. In such a case, the component suction by the suction nozzle 16 is deviated and cannot be accurately suctioned at the center position of the component 64. Therefore, in such a case, the component mounter 10 captures the reference mark 68 of the feeder 43 again.

The correction of the component suction position by imaging the reference mark 68 is performed by imaging the reference mark 68 provided on the tape guide 63 of the feeder 43 with the mark camera 52 and moving the mounting head 11 to the component supply position 41 at the center point. This is done by resetting the origin. Thereby, the position shift from the apparatus origin to the reference mark 68 can be eliminated. However, if the relative position from the reference mark 68 to the component 64 at the component supply position 41 is deviated, it cannot be resolved. Therefore, in preparation for such a case, the component is positioned near the component supply position 41 instead of the reference mark 68. A certain sprocket hole 66 is also imaged. Since the sprocket hole 66 is integrated with the carrier tape 67, the relative position of the sprocket hole 66 with respect to the cavity 65 in which the component 64 is housed is easily detected with high accuracy. Therefore, imaging of the reference mark 68 here is a concept including imaging of the sprocket hole 66 in the vicinity of the component supply position 41.

Now, a coping method when an abnormal suction of the component 64 is detected will be described with reference to the operation flowchart of FIG. First, according to the production program in which the component mounting procedure is set for each production board in advance, the control device 15 of the component mounting machine 10 moves the mounting head 25 holding the suction nozzle 16 to the component suction position of the feeder 43, The suction nozzle 16 is lowered to the component suction height, and the target component 64 is sucked (S401). Then, the suction nozzle 16 in a state where the component 64 is sucked is raised and moved in a plane to the sky of the parts camera 50. Here, the suction state of the component 64 is imaged from below by the parts camera 50 and from the side surface by the side camera 51 (S402).

The control device 15 determines whether or not the suction state is normal from the image processing result (S403), and when it is determined that there is an abnormality, discards the suctioned component 64 (S404) and determines the failure mode. (S405), if it is determined that the suction state is normal, the mounting head 25 is moved to the mounting position on the substrate, and the component 64 is mounted on the substrate (S430). The disposal of the component 64 (S404) is performed by moving the mounting head 25 to a predetermined disposal box (not shown) and releasing the suction state of the component.

The control device 15 first recognizes the suction state of the component 64 by image processing in the determination of the failure mode, compares it with an image template prepared in advance, determines which of the failure modes corresponds, and stores it. (S405). The failure mode referred to here means the type sorted according to the failure content. As general failure modes, there may be a suction deviation (XY position deviation, rotation deviation), component standing, no suction (sucking error, dropping during movement), component misplacement, and the like. In addition, even in the same XY position deviation, the range of the degree of deviation can be ignored, the range that needs to be dealt with in the case of continuous occurrence, or the range that should be dealt with immediately with a large deviation is another failure mode. It is desirable to treat as. For collation with an image template and determination of a failure mode, for example, techniques such as binarization processing and pattern search can be used as general image processing means.

The control device 15 determines a failure mode, and determines whether or not the failure mode is continuously generated as an important determination factor. In other words, if it occurs continuously, there is a cause that leads to the failure, so there is a high possibility that it will occur continuously thereafter. For this reason, it is appropriate to determine in advance how many times the failure occurs continuously for each failure mode and to correct the component suction position by imaging the reference mark 68, and to perform the correction when the number of times is reached. For example, the adsorption position shift may occur because vibration or impact is temporarily applied, so it is assumed that it has been repeated three times. If the component standing is large as a positional deviation but sudden elements cannot be denied, it has been repeated twice. In the case where there is no suction, it may be considered that an enormous abnormality is considered, and the fiducial mark 68 is imaged once. That is, if an appropriate number of times is set according to the content of the adsorption abnormality, more appropriate and flexible operation is possible.

The control device 15 prepares a counter (memory) for each failure mode (M1, M2,... Mn). When the failure first occurs, the failure mode counter is set to 1 and continuously generated. 1 is added each time (S407, S409, S411, S413), and the other failure mode counters are reset each time (S408, S410, S412, S414). As a result, the counter value is compared with the set value of the failure mode (S420), and when the values match, that is, when the set value of the failure mode is continuously reached, the reference mark 68 is imaged (S421). Otherwise, the process proceeds to the next component suction (S401). Thereby, the suction position correction by the imaging of the reference mark 68 can be automatically performed only when the suction failure due to the specific failure mode is continuously generated the set number of times.

As the failure mode, the failure due to the displacement of the suction position of the component 64 is the most common. As described above, it is also effective to distinguish the correspondence by the degree of displacement. For example, the misalignment dimension may be a predetermined set value A or more, or may be a predetermined set value A or more and a predetermined set value B or less. In the latter case, it is conceivable that the case where the predetermined set value B is exceeded is handled as another failure mode, and a rapid response is made as an enormous failure.

When the component suction position is corrected by imaging the reference mark 68, the control device 15 resets all the defective mode counters (S422), and prepares for the next suction abnormality, until the component placement is completed. The steps from S401) to component mounting (S430) are repeated (S423).

On the other hand, among the causes of defects, it is desired to correct the component suction position by imaging the reference mark 68 when a suction failure due to a specific failure mode occurs cumulatively a predetermined number of times even if they do not occur continuously. There may be cases. This is the case where the adsorption position shift occurs intermittently and the response is expected to be delayed if only the case where the position shift occurs continuously as described above. In that case, an upper limit value of the count number is set for each failure mode, and the component suction position is automatically corrected by imaging the reference mark 68 when the suction failure in the failure mode reaches the upper limit value. To do. Thereby, even if the same defect does not continuously occur, it is possible to quickly correct the component suction position even for the cumulative suction abnormality.

In FIG. 4, only when the same failure mode is continuously generated, counters other than the counters added in S407, S409, S411, and S413 are set in S408 and S410 in order to make the component suction position correction target by imaging the reference mark 68. , S412 and S414 are all reset (value zero is stored in the memory). However, in the case of this aspect, it is necessary to continue to count even if the failure mode does not occur once. Accordingly, every time the step is skipped without resetting the other counters and the component suction position is corrected by imaging the reference mark 68, only the counter in the defective mode needs to be reset.

Furthermore, since the actual value of the count number by failure mode is managed, the past transition can be utilized for the subsequent adsorption abnormality response. In other words, the occurrence frequency of failure modes is analyzed, and if there is a failure mode with a higher occurrence frequency, there is a high possibility that it will increase in the future. In such a case, it is effective to automatically increase or decrease the set value or the upper limit value of the failure mode in which the increase is expected. If there is a tendency in the failure mode that occurs depending on the environment and time zone in the field such as ambient temperature and humidity, it can also be determined in consideration of it.

As described above, the method of counting and dealing with the failure mode in the case of component adsorption has been described in the case of component adsorption from the feeder 43, but from a flat component tray (not shown) or the like. Component adsorption may be used. Moreover, although the case where the parts camera 50 and the side camera 51 are used for imaging the component adsorption state has been described, either one of the imaging devices may be used. Although it has been described on the assumption that the failure mode in the suction state is also divided into a number of modes, it may be divided into two types, for example, suction position shift (including part standing) and no suction. It is preferable that the failure mode is not complicated in consideration of the connection with the cause.

Although other preferred embodiments of the present invention have been described, the present invention is not limited to such specific embodiments, and various modifications and changes may be made within the scope of the gist of the present invention described in the claims. It goes without saying that is possible.

DESCRIPTION OF SYMBOLS 1 Display apparatus, 5 base, 10 component mounting machine, 11 mounting head, 12 main body cover, 13 apparatus main body, 14 attitude | position auxiliary member, 15 control apparatus, 16 adsorption nozzle, 20 component transfer apparatus, 21 Y-axis slide, 22 Y Axis motor, 23 X-axis motor, 24 X-axis slide, 25 Mounting head, 26 Nut, 27 Y-axis rail, 28 Screw shaft, 30 Substrate transport device, 31 First transport device, 32 Second transport device, 40 Component supply device 41 parts supply position 42 supply reel 43 feeder 50 parts camera 51 side camera 52 mark camera 61 top tape 63 tape guide 64 parts 65 cavity 66 sprocket hole (feed hole) 67 carrier tape , 68 Reference mark

Claims (4)

A component mounting device in which an electronic nozzle supplied from a component supply device is picked up by a suction nozzle and mounted on a circuit board, and the suction state is determined from image data obtained by imaging the component sucked by the suction nozzle with an imaging device. Suction determination means for determining the quality of the product, means for counting and recording the number of times that the suction state is determined to be re-adsorption based on the determination result for each failure mode, and suction failure due to a specific failure mode continuously A component mounting apparatus comprising: a correction unit that automatically captures a reference mark of a feeder and corrects a suction position of an electronic component when a set number of times occurs. 2. The component mounting apparatus according to claim 1, wherein the specific failure mode is a failure due to a component adsorption position shift, and the position shift dimension is within a set range. A component mounting device in which an electronic nozzle supplied from a component supply device is picked up by a suction nozzle and mounted on a circuit board, and the suction state is determined from image data obtained by imaging the component sucked by the suction nozzle with an imaging device. Set the upper limit of the number of counts for each failure mode, the suction determination unit that determines the quality of the product, the unit that counts and records the number of times that the suction state is determined to be defective based on the determination result, and the number of times it has been re-sucked A component mounting apparatus comprising: a correction unit that automatically images a feeder reference mark and corrects an electronic component suction position when the suction failure in the failure mode reaches an upper limit value. 4. The component mounting apparatus according to claim 1, wherein the count number for each failure mode is managed as an actual value, and the set number of times or the upper limit value is automatically increased or decreased according to the occurrence frequency. 5. .

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