JP2003152392A - Component attracting method and surface loading apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively load electronic components by alleviating an influence on tact time while the attraction displacement of the component is eliminated. SOLUTION: Marks provided at areas near tape feeder allocation areas are picked up by a moving camera 16 (imaging means) loaded on a head unit 5, and an arithmetic means 34 calculates a compensation value of the component attracting location of an attracting head based on location images of picked-up images. A control means 36 or the like compensates for the component attracting location by the attracting head based on the obtained compensation value and updates the compensation value by conducting a mark recognizing operation when imaging conductions (execution conditions) stored in a imaging condition data storing means 33 are satisfied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter for transporting and mounting electronic components such as ICs supplied by a component supply unit onto a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a movable head unit having a suction head for picking up a component is used to suck an electronic component such as an IC from a component supply section, and the component is positioned at a predetermined working position. A surface mounter (hereinafter, abbreviated as a mounter) that is transported to and mounted on a substrate is generally known.

In this type of mounting machine, for example, a large number of feeders for supplying components are arranged in parallel, and the suction head is configured to take out the components in a sucked state from each feeder. At this time, if the suction head (head unit) is relatively displaced with respect to the component taking-out position of each feeder due to a movement error of the head unit or the like, a situation such as a suction displacement or an inability to suction is caused,
This will hinder the subsequent mounting operation.

Therefore, conventionally, a mark is provided near each component pick-up position for each feeder, and the mark is photographed by a camera such as a CCD area sensor mounted on the head unit so that the head unit and the component pick-up position are identified. The relative displacement of the image is recognized, and if there is the displacement, the position of the head unit or the like is corrected, and then the component is sucked to prevent the suction displacement.

[0005]

According to the conventional mounting machine as described above, there is an advantage that the suction displacement of the components can be effectively eliminated and the mounting accuracy can be improved. There are drawbacks.

That is, since the mark recognition and correction processes as described above are required every time a component is picked up from each feeder, it takes a long time to pick up one component, which hinders reduction of the tact time. . Therefore, it is necessary to solve this point.

The present invention has been made in order to solve the above problems, and eliminates the suction deviation of components while reducing the influence on the tact time and efficiently mounting components. To provide a mounting machine.

[0008]

In order to solve the above-mentioned problems, a component suction method of the present invention uses a movable head unit having a suction head to pick up electronic components from a plurality of feeders arranged in a component supply section. A method of picking up a component by the suction head when sucking and mounting this component on a substrate at a predetermined working position, the mark being provided in the vicinity of the position where the feeder is arranged by the image pickup means mounted on the head unit. A mark recognition process for recognizing the position of the object is performed, and after this mark recognition process, the component suction position by the suction head is corrected based on the position of the mark obtained in this process, while the component suction operation is performed a plurality of times. The mark recognition processing is executed when a later predetermined execution condition is satisfied (claim 1).

That is, since each feeder is normally assembled in a state where it is positioned in the component supply section, there is little positional deviation of the feeder itself. Therefore, as described above, the position of the mark provided near the position where the feeder is arranged is It is possible to recognize an image, and erroneously control the shift of the image position of this mark as the shift between each feeder and the suction head. Therefore, by correcting the target movement position of the head unit based on the image position of the mark, the suction head can be accurately set to the component suction position of all feeders at a level comparable to the conventional configuration in which the mark is provided for each feeder. It is possible to move. Further, it is rare that the feeder suddenly moves or the error in moving the head unit increases significantly in a short time. Therefore, as described above, the mark recognition processing is executed only when the predetermined execution condition after the suction of a plurality of components is satisfied, so that the suction of the components is accurately performed without spending a lot of time for the processing. It becomes possible.

The execution conditions may be, for example, one for each mounted substrate, for each elapse of a set time, or for each predetermined number of parts (claim 2).

Further, the temperature change in the mechanical portion of the head unit may be checked, and when the change amount exceeds a specific value, the mark recognition process may be executed assuming that the execution condition is satisfied. ).

With this configuration, it is possible to effectively prevent the occurrence of the suction deviation caused by the movement error of the head unit due to the thermal expansion of the mechanical portion.

On the other hand, in the surface mounter of the present invention, a movable head unit having a suction head sucks electronic components from a plurality of feeders arranged in a component supply unit, and the components are placed at a predetermined working position. In a surface mounter for mounting on a substrate, a mark provided in the vicinity of a position where the feeder is disposed, an image pickup means mounted on the head unit and capable of picking up an image of the mark, and performing a predetermined mounting operation. Control means for controlling the drive of the head unit so as to execute a mark image pickup operation for picking up the mark by the image pickup means before picking up a component in a mounting operation
And a calculation unit that calculates a correction amount of the component suction position of the suction head based on the position of the mark imaged by the image pickup unit, and the control unit satisfies a predetermined execution condition after a plurality of component suction operations. When the mark is picked up, the mark image pickup operation is executed, and the component suction position by the suction head is corrected based on the correction amount obtained by the calculation means (claim 4).

According to such a surface mounter, it is possible to provide:
It is possible to automatically carry out the described component suction method. That is, during the mounting operation, the image pickup means mounted on the head unit images the mark provided in the vicinity of the position where the feeder is arranged, and the amount of correction of the component suction position by the suction head is calculated based on the image position of the mark. Then, the suction operation of the component by the head unit is controlled based on this correction amount. Then, when a predetermined execution condition is satisfied in a series of mounting operations, the above-described mark imaging operation is executed and a new correction amount is obtained.

In this surface mounter, execution condition storage means for storing a plurality of types of execution conditions for executing the mark imaging operation, and desired conditions are selectively read out from the execution conditions stored in the storage means. It is preferable that the control means is further provided with a setting means for setting, and the control means is configured to execute the mark imaging operation based on the execution condition set by the setting means (claim 5).

According to this structure, it is possible to switch the execution condition manually by an operator, such as for each mounted substrate, for each set time, or for each predetermined number of parts. Optimum mounting operation is possible according to the type of board.

Further, in this surface mounter, a temperature sensor for detecting the temperature of the mechanism portion for driving the head unit, and a temperature storage means for storing the temperature detected by the temperature sensor with the temperature at the start as an initial value. The control means is provided to compare the temperature detected by the temperature sensor with the temperature stored in the temperature storage means at a predetermined timing, and to execute the mark imaging operation when the difference exceeds a specific value. It is more preferable that the temperature storage means is configured so as to store the detected temperature at this time in an updated manner.

With this structure, it is possible to effectively correct the displacement of the suction position due to the thermal expansion of the mechanical portion, and it is possible to more accurately suction the components.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings.

1 and 2 schematically show an example of a mounting machine according to the present invention. In these figures, a conveyor 2 for conveying a printed circuit board is mounted on a base 1 of the mounting machine main body.
Are arranged, and the printed circuit board P is conveyed on the conveyor 2 and stopped at a predetermined mounting work position.

A component supply section 3 is arranged on each of the front and rear sides of the conveyor 2 (upper and lower sides in FIG. 1). A large number of feeders for supplying various kinds of components are arranged in the component supply unit 3, and in the example shown in the drawing, a large number of tape feeders 4 are fixed in parallel and in a state of being respectively positioned. Each tape feeder 4 has an IC,
The tape holding small pieces of electronic components such as transistors and capacitors at predetermined intervals is configured to be pulled out from the reel, and a feeding mechanism is provided at the tape feeding end. As the parts are picked up, the tape is delivered intermittently.

The tape feeder 4 will be described in some detail with reference to FIG. 3. The tape feeder 4 has a component take-out portion 21 at its tip (end on the conveyor side) and is rotatably provided at the rear end of the feeder. The tape 20 is drawn out from the supported reel and guided to the component take-out portion 21.

The tape 20 is composed of a tape body 20a and a cover tape 20b as shown in FIG. The tape body 20a has hollow component storage portions 20c which are open upward and are arranged at predetermined intervals.
Parts are stored in. On the other hand, the cover tape 20b is made of vinyl tape and is adhered to the upper surface of the tape body 20a so as to cover the opening of the component storage section 20c.

The component take-out portion 21 of the tape feeder 4
The passage 2 whose top is covered by the tape protection member 23
2 is formed, and the tape 20 is pulled out from the reel.
Is guided under the tape protection member 23 along the passage 22. Then, the cover tape 2 is fed at the position of the engaging portion 24 formed on the tape protection member 23 while the tape 20 is being fed out according to the operation of the feeding mechanism.
When the component storage portion 20c reaches the position of the opening portion 25 formed in the tape protection member 23 after the 0b is peeled off, the component storage portion 20c is opened upward so that the component can be taken out. Has been done.

Incidentally, the component take-out position (component suction position) of the suction head 13 which will be described later in the opening portion 25 is constructed so as to be opened and closed by a slidable shutter member 26, which is interlocked with the feeding mechanism. The shutter member 26 is configured to slide so that a component can be taken out from the component storage portion 20c (the figure shows a state in which the shutter member 26 slides to a position where the component take-out position is opened). Exist).

As shown in FIGS. 1 and 2, a head unit 5 for mounting components is installed above the base 1.
This head unit 5 is in the X-axis direction (direction of the conveyor 2)
It is also possible to move in the Y-axis direction (direction orthogonal to the X-axis on the horizontal plane).

That is, the head unit supporting member 6 is movably arranged on the fixed rail 7 in the Y-axis direction on the base 1, and the head unit 5 serves as the guide member 8 in the X-axis direction on the supporting member 6. It is movably supported along. Then, the Y-axis servomotor 9 moves the support member 6 in the Y-axis direction via the ball screw 10, and X
The head servomotor 11 moves the head unit 5 in the X-axis direction via the ball screw 12.

A plurality of suction heads 13 for mounting components are mounted on the head unit 5. In this embodiment, eight suction heads 13 are arranged in a line in the X-axis direction. Each suction head 13 can move in the Z-axis direction (vertical direction) and rotate about the R-axis (nozzle center axis) with respect to the frame of the head unit 5, and ascend / descend drive means using a servo motor as a drive source. And is driven by the rotation driving means. Further, a nozzle 14 is provided at the lower end of each suction head 13, and when suctioning a component, a component is sucked by a suction force by a negative pressure from a negative pressure supply means (not shown) to the nozzle 14.

The head unit 5 is further equipped with a moving camera 16 (imaging means) composed of a CCD area sensor. The moving camera 16 images the board mark (fiducial mark) of the printed board P positioned at the mounting work position, and the position of the printed board P is recognized based on the image position during the mounting operation. When the position is deviated from the regular position, the correction value δ1 of the component mounting position (mounting position) is calculated accordingly.

On the other hand, at a predetermined position on the base 1 within the movable area of the head unit 5, there is further provided a fixed camera 15 for recognizing a component, which is composed of a CCD area sensor. The camera 15 images the component sucked by the suction head 13, and at the time of mounting operation, component recognition is performed based on the image, that is, whether or not the component is normally sucked is checked, and the normal operation is performed. The displacement of the center of the component with respect to the center of the nozzle of the suction head 13 in the case of suction is checked, and the correction value δ2 of the component mounting position is obtained accordingly.

Further, the suction head 1 is provided in each component supply unit 3.
A position mark 17 for correcting the component suction position according to No. 3 is provided. More specifically, a plurality of tape feeders 4 are arranged in the component supply unit 3 in a state in which the component suction positions are aligned in a line on a straight line L (see FIG. 3) parallel to the X axis. A position mark 17 is provided on the side of the arrangement position of each feeder 4.

The position mark 17 corresponds to the head unit 5
An image is picked up by the moving camera 16 mounted on the position of the suction mark 13 based on the image position of the position mark 17, and the displacement of the component suction position is indirectly checked, and the suction head 13 with respect to the component suction position is detected accordingly. The correction value δ3 of is obtained.

FIG. 4 is a block diagram showing a control system of the mounting machine.

The mounting machine comprises a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, and a RAM that temporarily stores various data during the operation of the apparatus. It has a control unit 30 for

The control unit 30 is connected to the Y-axis servomotor 9, the X-axis servomotor 11, and driving means (elevating driving means, rotation driving means, etc.) for the suction heads 13 of the head unit 5, and the above-mentioned Camera 1
5, 16 are connected via an image processing device 18.

The control unit 30 includes a data list storage means 31, an unmounted component data storage means 32, an imaging condition data storage means 33 (execution condition storage means), a computing means 34,
It has a work procedure storage means 35 and a control means 36.

The data list storage means 31 stores a data list of components to be mounted on the board, and the unmounted component data storage means 32 extracts and stores data of actually mounted components from the data list. It is a thing.

The calculating means 34 determines the work procedure such as the mounting order in the mounting work so as to improve the mounting efficiency of the unmounted components, and the component mounting position is determined based on the images picked up by the cameras 15 and 16. Correction value δ
1, δ2 and the component suction position correction value δ3 are calculated, and the work procedure storage means 35 stores the work procedure and the correction values δ1 to δ3.

The image pickup condition data storage means 33 stores a plurality of image pickup condition data (execution conditions) for picking up an image of the position mark 17 by the moving camera 16, and operates an operation unit (setting means) not shown. Is selectively set by the calculation means 34, and the calculation means 34 determines the work procedure in consideration of the imaging conditions. For example, in this embodiment, it is possible to select three types of imaging conditions for each printed circuit board, for each elapse of a set time, and for each predetermined number of components.
It is set by the operation of the operation unit by the operator.

The control means 36 is the work procedure storage means 3
In order to execute the mounting work according to the working procedure stored in 5, the driving means for the servo motors 9 and 11 and the suction heads 13 of the head unit 5 are controlled, and the above-mentioned imaging conditions are satisfied during the mounting operation. Occasionally, the drive means is controlled so that the position mark 17 is imaged by the moving camera 16.

Next, the calculation means 3 of the control unit 30
The processing performed by 4 and the like will be described based on the flowchart of FIG.

When this flow chart starts, first, in step S1, the printed circuit board P on which the components have been mounted is carried out, and the printed circuit board P on which the components have not been mounted (target substrate) is carried in. At step S2, the mounted list is initialized. To be done.

Next, in step S3, the head unit 5 is moved onto the printed circuit board P and the component supply section 3, and the board mark (fiducial mark) and the position mark 17 are photographed by the moving camera 16. And
The position of each mark is obtained based on predetermined image processing,
A deviation between the position and the theoretical mark position is obtained, and a correction value δ1 of the component mounting position and a correction value δ3 of the component suction position are obtained and stored from this deviation.

In step S4, it is determined whether or not there is unmounted data. If there is unmounted data, the data of all unmounted components is searched to determine and store the work procedure such as the mounting order (step S5). ), And then the process proceeds to step S6.

In step S6, the set image pickup condition data is read out, and it is determined in step S7 whether the image pickup condition is satisfied. If it is determined that the imaging condition is not satisfied, the process immediately proceeds to step S11, the correction value δ3 is read, and then the suction head 13 takes out the component from the tape feeder 4.

On the other hand, when it is determined in step S7 that the execution condition is satisfied, the process proceeds to step S8,
Here, the correction data acquisition operation is executed to obtain the correction value δ3 of the component suction position again. That is, the head unit 5 moves onto the position mark 17, the moving camera 16 photographs the mark 17, and the correction value δ3 of the component suction position is obtained again based on the image, and the correction value δ3 is obtained. It is updated and stored (steps S8 to S1).
0).

In step S11, the head unit 5 is moved onto the component supply unit 3 and the component is taken out from the tape feeder 4 in a sucked state as the suction head 13 moves up and down. At this time, the stored correction value δ3 is read, and the suction position of the component is corrected by the suction head 13 based on the read correction value δ3, and then the component is sucked (step S12).

When the suction of the components by the suction head 13 is completed, the head unit 5 moves onto the fixed camera 15,
The components sucked by each suction head 13 are recognized (steps S13 and S14). Then, the center position of the component is obtained from each component image by predetermined image processing,
The displacement with respect to the center of the nozzle is checked, and the correction value δ2 of the component mounting position is obtained based on this displacement, and this correction value δ2 and the correction value δ1 previously obtained by the mark image recognition of the printed circuit board P are obtained. Then, the final correction value δ (ΔX, ΔY, Δθ) of the component mounting position is obtained (step S15).

Then, the correction value δ of the final component mounting position
Is calculated, the drive of the head unit 5 is controlled based on the correction value δ, so that each suction head 13
After the site mounting position of is corrected, the suction components are mounted on the printed circuit board P (step S16), and then the process returns to step S4.

When all the components to be mounted are mounted by repeating the processing of steps S4 to S16 (NO in step S4), this flowchart ends.

In the mounting machine of this embodiment as described above, the component suction position with respect to each tape feeder 4 is corrected based on the image recognition of one position mark 17 provided in each component supply unit 3, and Since the recognition processing of the position mark 17 is executed only when a predetermined execution condition is satisfied, it is possible to reduce the influence on the tact time while effectively eliminating the component suction deviation as in the conventional case. it can.

That is, since the respective tape feeders 4 are assembled while being positioned in the component supply section 3, the tape feeder 4 itself is not displaced, and the position mark 17 provided in the vicinity of the tape feeder as in the above embodiment is small. There is no problem even if the shift of the image position is assumed to be the relative shift between each tape feeder 4 and the head unit 5. Therefore, based on the image recognition of one position mark 17 provided in each component supply section 3 as described above, each tape feeder 4
The component suction position can be corrected at a level (accuracy) comparable to that of the conventional configuration, that is, a configuration in which a mark provided for each feeder is recognized as an image, while correcting the component suction position with respect to.

Further, the position of each tape feeder 4 and the moving amount of the head unit 5 hardly change in a short time, so that it is not necessary to always recognize the mark when the component is picked up and correct the component picking-up position. . Therefore, only when the predetermined execution condition is satisfied as in the above-described embodiment, the mark recognition process is executed to obtain the correction value δ3, and this value is simply updated to accurately correct the component suction position. You can

Therefore, according to the mounting machine of this embodiment,
Similar to the conventional mounter of this type, it is possible to effectively eliminate the component suction deviation and to reduce the influence on the tact time to efficiently mount the component.

The mounting machine described above is an embodiment of the surface mounting machine according to the present invention, and its specific configuration can be appropriately changed without departing from the gist of the present invention.

For example, in this embodiment, as the image pickup condition data, the image pickup condition can be selected from a total of three kinds of conditions for each printed circuit board, for each elapse of a set time, or for each predetermined number of parts. However, of course, it may be configured so that other imaging conditions can be set. For example, imaging condition data may be set for each specific type of component, each tape feeder at a specific position, and the like.

In this embodiment, for example, the operator manually selects the image pickup condition by operating the operation unit. However, for example, the optimum image pickup condition is automatically determined according to the mounted parts list or the like. May be selected.

Further, a temperature sensor for detecting the temperature of the mechanism portion for driving the head unit 5, for example, the support member 6 may be provided and the mark recognition processing may be executed based on the detected temperature. For example, the control unit 30 is provided with temperature storage means capable of storing the temperature detected by the temperature sensor, the temperature at the time of starting the mounting machine is stored in the temperature storage means, and the temperature sensor detects the temperature at a fixed timing. The temperature (actual temperature) is compared with the temperature stored in the temperature storage means, and when the difference exceeds a certain value, mark imaging processing is executed and the detected temperature (actual temperature) at that time is stored in the temperature. It may be configured to be stored in the means in an updated manner. That is, when the temperature change of the mechanical portion of the head unit 5 is equal to or more than a certain value, there is a high possibility that a movement error occurs in the head unit 5 due to thermal expansion of the mechanical portion. Therefore, when such a temperature change occurs, if the mark imaging process is executed to update the correction value δ3, it is possible to prevent the occurrence of the suction deviation due to the thermal expansion of the mechanical portion. It will be possible. In this case,
The temperature detection position is not limited to the support member 6 and may be another place, but it is preferable that the temperature of the portion that affects the movement error of the head unit 5 can be directly detected.

Further, in this embodiment, the mark 17 is provided on the side portion of the tape feeder 4 arranged in the component supply section 3, but the mark 17 may be arranged anywhere near the tape feeder 4. . For example, it may be provided between the tape feeders 4 arranged in parallel.

Further, in the present embodiment, the camera 16 including the CCD area sensor is used for recognizing the mark 17, but the camera including the CCD linear sensor may of course be used.

As a method of correcting the component suction position by the suction head 13, the component camera 20c of the tape 20 is imaged by the moving camera 16 every time the component is taken out from each tape feeder 4, and the position of the position mark 17 is taken. It is also possible to calculate the deviation between the suction head 13 and the component storage portion 20c (the center thereof) with reference to the above, obtain a correction value δ4 thereof, and add this to the correction value δ3 to correct the component suction position. .

The computing means 3 of the control unit 30 in this case
The processing performed by the CPU 4 etc. is obtained by modifying, for example, a part of the flowchart of FIG. 5 (specifically, step S of FIG. 5).
7 and S11 are replaced by the following steps S7 'and S11'. Further, the following steps S8 'to S10' are added. ) The processing is as follows.

That is, in step S7 of FIG. 5, the image pickup conditions of the tape feeder 4 are simultaneously determined (step S7 '), and when only the image pickup condition of the tape feeder 4 is satisfied, the component suction of the corresponding tape feeder 4 is performed. The head is moved to the position (step S8 '), and the moving camera 16 takes an image of the parts storage section 20c (step S8).
9 '). The contour of the concave portion of the component storage section 20c is determined from the image data, the center of gravity of the figure is determined from the contour, and this is used as the component suction position on the deep feeder 4. The correction value δ4 of the component suction position is calculated from the difference from the target position) and stored in the memory (step S10 '). Then, the process proceeds to step S11 '. Then, in step S11 ', the correction value δ3 and the correction value δ4 in the memory are read out,
The sum of these correction values δ3 and δ4 is used as the final suction position correction value.

If both the image pickup condition of the tape feeder 4 and the image pickup condition of the position mark 17 are not satisfied in step S7 ', the process proceeds to step S11', and if only the image pickup condition of the position mark 17 is satisfied. Step S
Go to 8. If both imaging conditions are satisfied, after performing steps S8 to S10, the above-described steps S8 'to S10' are performed, and then the process proceeds to step S11 '. The processing other than the above is the same as the flowchart in FIG.

Here, the imaging condition of the tape feeder 4 is, for example, immediately after the tape feeder 4 is replaced, before the first component is picked up from the tape feeder 4, or the component is picked up from the tape feeder 4 a predetermined number of times. It can be considered when

Further, a temperature sensor is provided in the vicinity of the component supply unit 3, and temperature storage means capable of storing the temperature detected by the temperature sensor is provided in the control unit 30.
When the temperature difference between the detected temperature of this sensor and the stored temperature is equal to or greater than a predetermined value (the initial value of the stored temperature is the detected temperature at startup, and thereafter, the detected temperature is set to be equal to or greater than the predetermined value. The image capturing condition may be satisfied. That is, when the tape expands and contracts greatly due to the temperature difference, an error may occur in the distance between the feed hole of the tape that meshes with the feed mechanism and the component supply unit 3. Therefore, according to the above configuration, It is possible to eliminate the shift of the component suction position due to such a phenomenon and more accurately perform component suction.

[0067]

As described above, according to the present invention, the positional deviation of the feeder itself is small, and the position of the feeder and the moving amount of the head unit hardly change in a short time. A mark recognition process for picking up an image of a mark provided in the vicinity of the feeder by an image pickup means mounted on the head unit and recognizing its position is performed. After this mark recognition process, the component by the suction head is based on the position of the mark obtained by this process. While correcting the suction position,
Since the mark recognition process is executed when a predetermined execution condition is satisfied after a plurality of component suction operations, the component suction deviation can be satisfactorily resolved as in the conventional mounting machine of this type. However, the influence on the takt time can be reduced and the components can be mounted efficiently.

Particularly, if the temperature change in the mechanical portion of the head unit is checked and the mark recognition process is executed when the amount of change exceeds a specific value, the head unit moves due to thermal expansion of the mechanical portion. It is possible to prevent the occurrence of the suction deviation caused by the error.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of the overall structure of a surface mounter to which the present invention is applied.

FIG. 2 is a front view of a portion where a head unit of the surface mounter is supported.

FIG. 3 is a schematic perspective view showing the vicinity of a component take-out position of the tape feeder.

FIG. 4 is a block diagram showing a control system of the surface mounter.

FIG. 5 is a flowchart showing a process performed by a calculation unit of the control unit.

[Explanation of symbols]

2 conveyors 3 parts supply department 4 tape feeder 5 head unit 9 X-axis servo motor 11 Y-axis servo motor 16 moving camera 30 control unit 31 Data list storage 32 Unloaded data storage means 33 imaging condition data storage means (execution condition storage means) 34 Arithmetic means 35 work procedure storage means 36 Control means P printed circuit board

Claims (6)

[Claims] 1. A movable head unit having a suction head sucks electronic components from a plurality of feeders arranged in a component supply unit and mounts the components on a substrate at a predetermined working position. A component suction method using a suction head, comprising: a mark recognition process for recognizing the position of an image picked up by the image pickup means mounted on the head unit in the vicinity of the position where the feeder is arranged. While correcting the component suction position by the suction head based on the position of the mark obtained in this process, the mark recognition process is executed when a predetermined execution condition after a plurality of component suction operations is satisfied. A method for picking up parts, which is characterized in that 2. The component pick-up method according to claim 1, wherein the execution condition is any one of the mounted substrates, each elapse of a set time, or each predetermined number of components. Part suction method. 3. The component suction method according to claim 1, wherein a temperature change of a mechanical portion of the head unit is checked, and the mark recognition process is executed when the amount of change exceeds a specific value. Part suction method. 4. A surface mounter for picking up electronic components from a plurality of feeders arranged in a component supply unit by a movable head unit having a suction head and mounting the components on a substrate at a predetermined work position. In, a mark provided in the vicinity of the placement position of the feeder,
An image pickup means mounted on the head unit and capable of picking up an image of the mark, and performing a predetermined mounting operation, and a mark image pickup operation of picking up the mark by the image pickup means before picking up a component in this mounting operation. The control unit controls the drive of the head unit, and the calculation unit that calculates the correction amount of the component suction position of the suction head based on the image position of the mark imaged by the image pickup unit. When the predetermined execution condition after the component suction operation is satisfied, the mark image pickup operation is executed, and the component suction position by the suction head is corrected based on the correction amount obtained by the calculation means. A surface mounter characterized in that 5. The surface mounter according to claim 4, wherein an execution condition storage unit that stores a plurality of types of execution conditions for executing the mark imaging operation and an execution condition stored in the execution condition storage unit are desired. A surface mounter characterized by further comprising setting means for reading and setting conditions, wherein the control means executes a mark imaging operation based on the execution conditions set by the setting means. 6. The surface mounter according to claim 4, wherein a temperature sensor that detects a temperature of a mechanism portion that drives the head unit, and a temperature that stores a temperature detected by the temperature sensor with a temperature at start-up as an initial value. And a storage unit, and the control unit performs the mark imaging operation when the difference between the temperature detected by the temperature sensor at a predetermined timing and the temperature stored in the temperature storage unit becomes a specific value or more. The surface mounter is characterized in that the temperature storage means stores the detected temperature at this time in an updated manner.