CN101690444B - Method for sucking component and surface mounting machine - Google Patents
Method for sucking component and surface mounting machine Download PDFInfo
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- CN101690444B CN101690444B CN2008800231437A CN200880023143A CN101690444B CN 101690444 B CN101690444 B CN 101690444B CN 2008800231437 A CN2008800231437 A CN 2008800231437A CN 200880023143 A CN200880023143 A CN 200880023143A CN 101690444 B CN101690444 B CN 101690444B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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Abstract
In the method for sucking a component by means of a nozzle (21) of a surface mounting machine having a movable mounting head (20) equipped with the nozzle (21) for sucking a component, sucking a component from a component feeding section by negative pressure supplied to the nozzle (21), carrying the component above a substrate and mounting the component thereon, the time elapsing before the nozzle (21) arrives at the position for sucking the component is calculated, and negative pressure supply is started at the time retroacted from the arriving time by the settling time of negative pressure, i.e. the time (actual measurement value measured beforehand) required for settling the negative pressure after starting negative pressure supply to the nozzle (21).
Description
Technical field
The present invention relates to surface mounting apparatus, this surface mounting apparatus adsorbs element with head through the installation that possesses the element suction nozzle and can move and is installed on the substrate from component feeding portion.
Background technology
From in the past, known have (for example patent documentation 1) through possessing element absorption and shaped like chips elements such as IC are adsorbed with head with suction nozzle and the installation that can move and being installed to the surface mounting apparatus (hereinafter to be referred as " being fitting machine ") on the substrate from component feeding portion.
In this fitting machine, install move to head component feeding portion above after, this installations drops to the absorption height and position of regulation with head, and on the opportunity of regulation, the negative pressure of adsorbing usefulness through the element that is fed into the suction nozzle far-end is carried out the absorption of element.
The supply that suction nozzle is supplied with negative pressure is necessary to be set at opportunity is installing when arriving element absorption position (position of suction nozzle far-end and element butt or near the position of this position) with head effectively absorptive element such opportunity.If it is too early that the supply that suction nozzle is supplied with negative pressure begins opportunity, so, install till arriving the element absorption position with head during, can produce negative pressure by the meaningless problem that expends, in addition, also can cause the problem of the attraction fault of foreign matters such as dust.On the other hand, slow excessively if the supply of negative pressure begins opportunity, so, install arrive the element absorption position with head in, the negative pressure of being supplied with also is in an unsure state, thereby absorption failure that might generating device.In addition, bide one's time in the temporary transient grade of element absorption position, can produce problems such as required time that absorptive element uses is long when letting for fear of the generation of said problem install with head.
Patent documentation 1: Japan Patent open communique spy open 2004-356604 number
Summary of the invention
The present invention does in view of said problem; Its purpose is: meaningless the expending and the attraction of foreign matter etc. that can either suppress negative pressure can have appropriate stable negative pressure feeding when arriving the element absorption position with head with can be more conscientiously and more effectively carry out the absorption of element installing again.
For realizing said purpose; Method for sucking component involved in the present invention is the method for surface mounting apparatus absorptive element; It is characterized in that: said surface mounting apparatus comprises that possessing element absorption uses head with suction nozzle and the installation that can move; Through said suction nozzle is supplied with negative pressure; Element is adsorbed from component feeding portion and be installed on the substrate by said suction nozzle, said surface mounting apparatus comprises also and is arranged on the installation that is used for said suction nozzle is supplied with negative pressure with the detection of negative pressure unit in the negative pressure feeding path of head that said method for sucking component may further comprise the steps; Obtain from beginning that said suction nozzle is supplied with the stabilizing take till the value stabilization of negative pressure to this negative pressure, and said stabilizing take is stored in the step in the included memory cell of said surface mounting apparatus; After obtaining the time of advent point that said suction nozzle arrives desirable element absorption position in advance; The supply that setting is supplied with negative pressure to said suction nozzle begins opportunity; From said time of advent trace back the back time point of the time quantum that is stored in the said stabilizing take the said memory cell of point begin to supply with negative pressure, and carry out the step that element adsorbs by said suction nozzle; Let negative pressure value in the said negative pressure feeding path of said detection of negative pressure monitoring units; Actual measurement is from beginning that said suction nozzle is supplied with the time negative pressure satisfies the stabilisation condition of stipulating to the detected value that is detected by said detection of negative pressure unit till; Obtain said stabilizing take according to the time of this actual measurement, and this stabilizing take is updated stored in the step in the said memory cell.
The trace back supply of returning to set negative pressure begins the method on opportunity as benchmark according to the time point that so suction nozzle is arrived the element absorption position; Both can the supply that suction nozzle arrives the negative pressure before the element absorption position be reduced to necessary Min., can necessary negative pressure supply to the suction nozzle far-end when carrying out element absorption again appropriately.Therefore, both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc. by meaningless, again can be conscientiously and carry out the absorption of element effectively.
In addition; Surface mounting apparatus involved in the present invention comprises possessing element absorption with suction nozzle and can use head with respect to the installation that substrate moves; With head element is adsorbed from component feeding portion and be installed on the said substrate through this installation; It is characterized in that comprising: the negative pressure feeding unit, to the negative pressure of said suction nozzle feed element absorption usefulness; Control unit, negative pressure feeding or negative pressure that control is undertaken by said negative pressure feeding unit stop; The stabilizing take of memory cell, the storage regulation till stable from the negative pressure value that begins to supply with said negative pressure to said suction nozzle; The time of advent arithmetic element, computing arrives the time to go till the element absorption position from beginning element absorption action to said suction nozzle; The stand-by period arithmetic element is obtained from said time to go and is deducted the time that said stabilizing take draws, with as the stand-by period; The detection of negative pressure unit, the installation that detection is used for said suction nozzle is supplied with negative pressure is with the negative pressure value in the negative pressure feeding path of head; Through the time unit, actual measurement is from beginning that said suction nozzle is supplied with the time till negative pressure satisfies regulation to the negative pressure value that is detected by said detection of negative pressure unit the stabilisation condition; Wherein, Said control unit is after element absorption action beginning; At the time point that has passed through the said stand-by period; Control said negative pressure feeding unit, beginning negative pressure feeding to said suction nozzle, and according to said through the time unit actual measurement time obtain new said stabilizing take and be stored in the said memory cell.
According to this surface mounting apparatus, element is adsorbed from component feeding portion through the suction nozzle of installing with head, and follows installation to be installed on this substrate with respect to being mounted moving of substrate with head.In this element installation action; When absorptive element; Through arriving the time to go till temporal calculation unitary operation suction nozzle arrives the element absorption position; According to this time to go be stored in the stabilizing take in the memory cell, obtain stand-by period of negative pressure feeding by the stand-by period arithmetic element, that is to the time that begins to supply with till the negative pressure.Then, through control unit control negative pressure feeding unit, to begin that at the time point that has passed through the said stand-by period suction nozzle is supplied with negative pressure.Thus, when suction nozzle just arrives the element absorption position, just supply with the negative pressure that is stabilized in desirable pressure at the suction nozzle far-end.Therefore; Both can the supply that suction nozzle arrives the negative pressure before the element absorption position be reduced to necessary Min.; Can supply to the suction nozzle far-end with carrying out element necessary negative pressure of when absorption again appropriately; Its result both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc. by meaningless, again can be conscientiously and carry out the absorption of element effectively.
Description of drawings
Fig. 1 is the stereogram of surface mounting apparatus (using the surface mounting apparatus of method for sucking component involved in the present invention) involved in the present invention.
Fig. 2 is the front view of the peripheral structure of the expression head assembly of surface mounting apparatus.
Fig. 3 is the block diagram of formation of the controller of presentation surface fitting machine.
Fig. 4 is the flow chart of an example of the performed installation action control of expression controller.
Fig. 5 is the flow chart that the element of presentation graphs 4 adsorbs the subprogram of action control.
Embodiment
Utilize description of drawings preferred implementation of the present invention.
Fig. 1 and Fig. 2 are the figure that roughly representes surface mounting apparatus involved in the present invention (using the surface mounting apparatus of method for sucking component involved in the present invention), and Fig. 1 comes presentation surface fitting machine respectively with stereogram, Fig. 2 with front view.
Shown in these figure; Surface mounting apparatus (below; Abbreviate " fitting machine " as) pedestal 1 on dispose the conveyer belt 2 that substrate transferring is used; Tellite P (being designated hereinafter simply as " substrate P ") by conveyance, stops at the installation exercise position of regulation on said conveyer belt 2, and is positioned through scheming outer detent mechanism.In following explanation, with the direction of conveyer belt 2 as X-direction, will be on horizontal plane with the direction of X axle quadrature as Y direction, will describe as Z-direction with the direction of X axle and Y axle quadrature.
Be provided with the component feeding portion 4,5 that is used to supply with installation elements in the both sides of conveyer belt 2.The component feeding portion that is positioned at the device front side 4 upper edge X-directions in these component feeding portions 4,5 dispose the belt feeder 4a of multiple row.On each belt feeder 4a the strip that is wound on the reel is installed, this strip accommodates scutellate chip components such as IC, transistor, capacitor, keep.Passed out to from said reel discontinuous ground at said strip under the state of element taking-up portion of feed appliance far-end, through after the head assembly 6 stated element is taken out.
On the other hand, be positioned in the component feeding portion 5 of device rear side and dispose feed disk 5a.Among this feed disk 5a, divide up and down multilayer to take in a plurality of dish T, taken in encapsulation type electronic components such as QFP, BGA among these a plurality of dish T, or large-scale element such as packaging connector.T pulled under the state of side of conveyer belt 2 at these dishes, and the element that will be accommodated among the dish T through head assembly 6 takes out.
The top of said pedestal 1 also is provided with the head assembly 6 that element is installed usefulness.
This head assembly 6 can move in certain scope along X-direction and Y direction, so that from component feeding portion 4,5, element is adsorbed and be installed on the substrate P.That is, on pedestal 1, dispose the support component 11 of head assembly 6, the support component 11 of this head assembly 6 can move along the guide rail 7 of Y direction.Head assembly 6 carries on said support component 11, and can move along the guiding parts 14 of X-direction.In addition, screw togather installation with support component 11, make support component 11 moving thus along Y direction by Y axle servomotor 9 ball screw driven 8; Install by X axle servomotor 15 ball screw driven 13 and head assembly 6, make head assembly 6 moving thus along X-direction.
Be equipped with on the said head assembly 6 and be used for element is adsorbed and is installed to a plurality of installations on the substrate P with head 20, in this execution mode, 6 installations that are a shape are carried with the state that forms a line along X-direction with head 20.
These installations use head 20 to be connected in the elevating mechanism of Z axle servomotor as drive source; And be connected to R axle servomotor is the rotating mechanism (diagram is omitted) of drive source; So these are installed with head 20 and move along the vertical direction respectively with respect to head assembly 6 through the driving of described mechanism and rotate around central shaft (R direction of principal axis).
In addition, each is installed on the far-end with head 20 suction nozzle 21 that is used for absorptive element is installed.As shown in Figure 2; Each suction nozzle 21 is connected with negative pressure feeding source 24 via electromagnetically operated valve 22 (only showing the electromagnetically operated valve corresponding with the suction nozzle 21 of part among the figure) and adjuster etc.; When from each feed appliance 4a, 5a, taking out element; Based on the control of said electromagnetically operated valve 22, negative pressure is fed into the far-end of suction nozzle 21, carries out the absorption of element thus.Suction nozzle 21 is installed in dismantledly to be installed with on the head 20; As required, suction nozzle 21 can exchange with suction nozzle 21 (other suction nozzles 21 inequality such as distal end shape, mouth hole shape, mouth aperture size) with the exchange in the suction nozzle board that is accommodated in outside the figure that is located on the pedestal 1 automatically.
Also be provided with on the head assembly 6 and be used to discern the board-recognition camera 26 that is formed on the various marks on the substrate P.This camera 26 comprises camera main-body and the lighting device that possesses CCD area sensor etc., and the state that is directed downwards with its shooting is installed on the head assembly 6.Thus, this camera 26 is along with moving of head assembly 6 taken the mark on the substrate P successively.
On the other hand, pedestal 1 is provided with and is used for the component recognition camera 17 that the element that adsorbing with head 20 is discerned is installed by each of head assembly 6.This component recognition camera 17 comprises camera main-body and the lighting device that possesses ccd line sensor etc., takes from its downside the element that is adsorbing with head 21 being installed by each.
Fig. 3 utilizes block diagram to represent to control the formation of the controller of this fitting machine.
Said operation processing unit 31 is in order to carry out a series of installation exercise that undertaken by the installation procedure that is stored in the installation procedure memory cell 32 that is to be moved in the fitting machine to a series of operation of being taken out of from substrate; The driving of said head assembly 6 grades is controlled in the concentrated area, and follows the processing such as various computings of said operation.For example, in this fitting machine, in the element installation action, before from component feeding portion 4,5, taking out element, individually set the supply that suction nozzle 21 is supplied with negative pressure and begin opportunity, afterwards by the negative pressure feeding of this control on opportunity each suction nozzle 21.Particularly; According to each install with the present position of head 20 and be stored in the data storage cell 33 after state stabilizing take data etc.; Each suction nozzle 21 of computing to the stand-by period that it is begun to supply with till the negative pressure, according to each electromagnetically operated valve 22 of waiting time control respectively.Relevant this point describes in the back.In this execution mode, said operation processing unit 31 is equivalent to control unit involved in the present invention, time of advent arithmetic element and stand-by period arithmetic element.
Said installation procedure memory cell 32 is unit of the storage installation procedure relevant with described a series of installation action.
Each servomotor 9,15 of said X axle of motor control unit 34 drive controlling and Y axle; So that carrying out two dimension on the X-Y coordinate plane, moves head assembly 6; And each servomotor of drive controlling R axle and Z axle, so that each of head assembly installed with head 20 runnings.In addition, though omitted diagram, in each motor 9,15 etc., be separately installed with position information detecting unit such as encoder, motor control unit 34 is according to each motor of detection information Control of this positional information detecting unit.
Valve switch control unit 35 is each is installed with the suction nozzle 21 of head 20 to carry out the supply of negative pressure, the unit of the switching that stops through controlling said electromagnetically operated valve 22, and it carries out the control of said switching with head 20 to each installation.In this execution mode, electromagnetically operated valve 22 and negative pressure feeding source 24 etc. is equivalent to negative pressure feeding means involved in the present invention.
Below, the installation action control of the element that is undertaken by said controller 30 according to Fig. 4 and Fig. 5 explanation.
Fig. 4 utilizes flow chart to represent a series of installation action control that substrate P is carried out.After the flow process of this flow chart begins; At first; Operation processing unit 31 control conveyer belts 2 are moved into said installation exercise position with substrate P, position; And make head assembly 6 move to the top of substrate P, make said board-recognition camera 26 take the reference mark (substrate fiducials) of being paid on substrate P and carry out the identification of substrate P by mark.That is, investigation head assembly 6 (each is installed with head 20) concerns with the relative position of substrate P.
Then, operation processing unit 31 makes head assembly 6 be configured to the top of component feeding portion 4,5, with head 20 element is taken out (step S3) through each installation from component feeding portion 4,5.Particularly, move to as the process above the belt feeder 4a of absorption object or the feed disk 5a successively with head 20 making to install, the up-down drive installation is with head 20, adsorbed in the strips or coiled the element in the T by suction nozzle 21.At this moment, under possible situation, can simultaneously a plurality of elements be adsorbed to come from component feeding portion 4,5 with head 20 through a plurality of installations and take out.
After the absorption of element finished, operation processing unit 31 moved on the substrate P after the path movement of stipulating makes the top of head assembly 6 through component recognition cameras 17 through making head assembly 6.So, in this moves, make component recognition camera 17 take each element, identification is adsorbed on each the adsorbed state with the element on the head 20 (suction nozzle 21) is installed, when generating device adsorbs situation about departing from, the correction (step S5) when computing is installed.
After head assembly 6 (installing with head 20) arrived the initial installation site (coordinate) on the substrate P, operation processing unit 31 was just gone up and down drive installation with head 20, and element is installed on the substrate P.Afterwards, make head assembly 6 move to next installation site successively, remaining absorptive element is installed to (step S7) on the substrate P.
After all absorptive elements with head assembly 6 like this are installed on the substrate P; Operation processing unit 31 judges whether the installation of all elements of this substrate P finishes (step S9); When being judged as " denying "; Return among the step S3, drive controlling head assembly 6 is to take out next element from component feeding portion 4,5.Relative therewith, when in step S9, being judged as " being ", operation processing unit 31 makes head assembly 6 return the position of readiness of regulation, and drives conveyer belt 2 and take out of substrate P.Thus, finish a series of installation action of substrate P.
Fig. 5 representes the subprogram of the processing (element absorption) among the step S3 of above-mentioned flow process.In this is handled; At first; Operation processing unit 31 is according to configuration (flow chart) data that are stored in substrate data and belt feeder 4a etc. in the data storage cell 33, and the installation of decision installation during with the target location of head 20 that is absorptive element is with the position (step S11) on X axle, Y axle, Z axle and the axial all directions of R of head 20.This target location is the position of suction nozzle far-end and element surface butt or near the position of this position.
Then, operation processing unit 31 begins moving of head assembly 6 (installing with head 20) through control signal being exported to motor control unit 34, to carry out element absorption (step S13) by initial installation with head 20.In addition; Operation processing unit 31 and step S13 be stand-by period (step S15) of beginning of computing negative pressure feeding concurrently; When being judged as when having passed through waiting time, just control signal is exported to valve switch control unit 35, so that electromagnetically operated valve 22 is switched to open state from closed condition; Thus, begin negative pressure feeding (step S17, S19) to suction nozzle 21.The said stand-by period is obtained through following calculating: at first; According to signal from the positional information detecting unit output of servomotor 9,15 etc.; Obtain the installation of installing when determining said target location in the present position (each position on X axle, Y axle, Z axle and the R direction of principal axis) of head 20 that is this execution mode at that time position (coordinate) with head 20; Wait computing that the time to go that arrives said target location with head 20 from this position is installed according to the drive condition of said installation procedure then, from this time to go, deduct afterwards and be installed in the stabilizing take of this installation with the corresponding said negative pressure of the suction nozzle on the head 20 21.
That is, on the opportunity that the negative pressure feeding of supplying with negative pressure to each suction nozzle 21 through control as above-mentioned begins,, begin suction nozzle 21 supply negative pressure from trace back the back time point of said stabilizing take amount of time point with head 20 arrival target locations is installed.
Then, judge to install whether to have arrived the target location,, make and install with head 20 risings (step S23) when being judged as (being " being " among the step S21) when arriving with head 20.Thus, element is removed from component feeding portion 4,5 with the state on the far-end that is adsorbed on suction nozzle 21, so, adsorb release by said installation with the element that head 20 carries out.
So install and carry out element absorption repeatedly with head 20 and move by each, finally in step S25, be judged as " being " after, with regard to process ends, and processing moved on to the processing (component recognition processing) among the step S5 of Fig. 4.
According to aforesaid surface mounting apparatus; When carrying out element absorption with head 20 by installation; Because from time point with the head 20 arrival target locations time point of said stabilizing take amount that traces back back is installed, that is trace back back after begin to supply with negative pressure (after switching to open state from electromagnetically operated valve 22 by closed condition) to the time point of the required time quantum of the satisfied stable condition of stipulating of the negative pressure value of suction nozzle far-end, begins to supply with negative pressure; Therefore; When suction nozzle 21 arrives the element absorption positions, for example during just with the element surface butt, just supply with the negative pressure that is stabilized in authorized pressure at the far-end of suction nozzle 21 at the far-end of suction nozzle 21.Therefore, can the supply to the negative pressure of suction nozzle 21 that arrive before the element absorption position be reduced to necessary Min., can the necessary negative pressure of absorptive element supply to the suction nozzle far-end rightly when carrying out element absorption.Therefore; Can eliminate the problem of this kind surface mounting apparatus in the past; That is the negative pressure that causes too early opportunity owing to the beginning of suction nozzle being supplied with negative pressure is expended and is attracted to problem such as foreign matter by meaningless; Perhaps owing to fail or for avoid this failure produced problems such as stand-by time after the unstable element absorption that takes place of the negative pressure that causes late beginning opportunity of supplying with negative pressure, can be more conscientiously and more effectively carry out the absorption of element.
In the particularly said fitting machine, be equipped with a plurality of installations on the head assembly 6, and each suction nozzle 21 of installing with head 20 can exchange with the suction nozzle in the suction nozzle board with head 20; Thereby can use the said suction nozzle 21 of a plurality of kinds, but, as stated; In this fitting machine; Because in data storage cell 33, through reading the stabilizing take corresponding with the kind of the actual suction nozzle that is used 21, the supply of control negative pressure begins opportunity to stabilizing take that in advance will be corresponding with each suction nozzle as the table storage; Therefore, even use suction nozzle 21 arbitrarily also can obtain the effect of above-mentioned that kind effectively.
In addition; Above-mentioned surface mounting apparatus is the example of the preferred implementation of surface mounting apparatus (using the surface mounting apparatus of method for sucking component involved in the present invention) involved in the present invention, and its concrete formation (method for sucking component) can be carried out suitable change in the scope that does not break away from purport of the present invention.
For example, in the said execution mode, used the measured value that draws through test with stabilizing take, but can certainly use design load as negative pressure.
In addition,, also can in installation action, survey stabilizing take, results measured is given updated stored as stabilizing take except as said execution mode, stabilizing take being given elder generation's storage as fixed value.At this moment; Through installing on the negative pressure feeding path with head 20 B/P EGR Back Pressure Transducer EGR (detection of negative pressure unit) is set at each; By the negative pressure value in operation processing unit 31 these paths of supervision; After electromagnetically operated valve 22 is switched, according to the for example clock signal of CPU control usefulness (through the time unit), the time of satisfying through the force value of B/P EGR Back Pressure Transducer EGR till the stable condition of regulation gets final product.According to such formation (method), can improve the reliability of stabilizing take.Promptly; Because stabilizing take can be invaded various conditions such as the intrusion situation of negative pressure feeding path, the running-active status in negative pressure feeding source 24 based on foreign matters such as dust through the time change; Therefore, if as above-mentioned, the measured value in the installation action is fed back (updated stored) as stabilizing take, then can improve the reliability of stabilizing take; Its result can more suitably begin to supply with negative pressure to suction nozzle 21 opportunity.At this moment, also can get final product through surveying stabilizing take for several times, its mean value being fed back.
In addition, in the explanation of above-mentioned execution mode, the state of " satisfying the stabilisation condition " is meant that the value of negative pressure for example surpasses the state of the threshold value of regulation, or the state of the value stabilization of negative pressure in certain scope.
The present invention discussed above is summarized as as follows.
Promptly; Method for sucking component of the present invention is through to possessing element absorption with suction nozzle and the installation that can the move said suction nozzle supply negative pressure with head; The method for sucking component that element is adsorbed and is installed to the surface mounting apparatus on the said substrate from component feeding portion by said suction nozzle; Wherein, Obtain the some time of advent that said suction nozzle arrives desirable element absorption position in advance, and begin opportunity, to carry out element absorption by said suction nozzle according to the supply that the said time of advent, point was set said suction nozzle supply negative pressure.
The trace back supply of returning to set negative pressure begins the method on opportunity as benchmark according to the time point that so suction nozzle is arrived the element absorption position; Both can the supply that suction nozzle arrives the negative pressure before the element absorption position be reduced to necessary Min., can necessary negative pressure supply to the suction nozzle far-end when carrying out element absorption again appropriately.Therefore, both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc. by meaningless, again can be conscientiously and carry out the absorption of element effectively.
More specifically; Said supply beginning is set by following mode opportunity: obtain in advance from beginning that the stabilizing take till the value stabilization of said suction nozzle supply negative pressure to this negative pressure is begun to supply with negative pressure at the time point of putting the time quantum of the said stabilizing take that traces back back from the said time of advent.
According to this method,, therefore, when carrying out element absorption, appropriate stable negative pressure feeding can be arranged at the suction nozzle far-end because when suction nozzle just arrived the element absorption position, the pressure of suction nozzle far-end was stable desirable negative pressure value.
In addition; Surface mounting apparatus involved in the present invention is through possessing element absorption with suction nozzle and can use head with respect to the installation that the substrate that is mounted moves; Element is adsorbed from component feeding portion and is installed to the surface mounting apparatus on the said substrate; It comprises: the negative pressure feeding unit, to the negative pressure of said suction nozzle feed element absorption usefulness; Control unit, negative pressure feeding or negative pressure that control is undertaken by said negative pressure feeding unit stop; The stabilizing take of memory cell, the storage regulation till stable from the negative pressure value that begins to supply with said negative pressure to said suction nozzle; The time of advent arithmetic element, computing arrives the time to go till the element absorption position from beginning element absorption action to said suction nozzle; The stand-by period arithmetic element is obtained from said time to go and is deducted the time that said stabilizing take draws, with as stand-by time; Wherein, said control unit at the time point that has passed through the said stand-by period, is controlled said negative pressure feeding unit, to begin the negative pressure feeding to said suction nozzle after element absorption action beginning.
According to this surface mounting apparatus, element is adsorbed from component feeding portion through the suction nozzle of installing with head, and follows installation to be installed on this substrate with respect to being mounted moving of substrate with head.In this element installation action; When absorptive element; Through arriving the time to go till temporal calculation unitary operation suction nozzle arrives the element absorption position; According to this time to go be stored in the stabilizing take in the memory cell, obtain stand-by period of negative pressure feeding by the stand-by period arithmetic element, that is to the time that begins to supply with till the negative pressure.Then, through control unit control negative pressure feeding unit, to begin that at the time point that has passed through the said stand-by period suction nozzle is supplied with negative pressure.Thus, when suction nozzle just arrives the element absorption position, just supply with the negative pressure that is stabilized in desirable pressure at the suction nozzle far-end.Therefore; Both can the supply that suction nozzle arrives the negative pressure before the element absorption position be reduced to necessary Min.; Can supply to the suction nozzle far-end with carrying out element necessary negative pressure of when absorption again appropriately; Its result both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc. by meaningless, again can be conscientiously and carry out the absorption of element effectively.
In this structure, said memory cell is stored the said stabilizing take separately of the suction nozzle of a plurality of kinds, and said stand-by period arithmetic element basis and element adsorb the corresponding said stabilizing take of kind of employed suction nozzle, the said stand-by time of computing.
Promptly; Can be different from beginning to supply with after the negative pressure negative pressure value to the suction nozzle far-end time (stabilizing take) till stable because of the difference of mouth hole shape or mouth footpath size; But, in this structure, come to be stored in the stabilizing take corresponding in the memory cell in advance with each kind by the kind of each suction nozzle; According to the stabilizing take corresponding, obtain said stand-by time with the kind of employed suction nozzle.Therefore, no matter suction nozzle is arbitrary kind, the appropriate negative pressure feeding that is stabilized in desirable pressure can, suction nozzle be arranged when arriving the element absorption position.
Utilizability on the industry
As stated; The present invention is to negative pressure element being adsorbed also transfer to the useful invention of the surface mounting apparatus on the substrate through head assembly; It both can have been avoided, and negative pressure is meaningless to be expended and the generation of the attraction fault of foreign matter etc., again can be conscientiously and carry out the absorption of element effectively.
Claims (3)
1. a method for sucking component is the method for surface mounting apparatus absorptive element, it is characterized in that:
Said surface mounting apparatus comprises that possessing element absorption uses head with suction nozzle and the installation that can move; Through said suction nozzle is supplied with negative pressure; Element is adsorbed from component feeding portion and be installed on the substrate by said suction nozzle; Said surface mounting apparatus also comprises and is arranged on the installation that is used for said suction nozzle is supplied with negative pressure with the detection of negative pressure unit in the negative pressure feeding path of head
Said method for sucking component may further comprise the steps,
Obtain from beginning that said suction nozzle is supplied with the stabilizing take till the value stabilization of negative pressure to this negative pressure, and said stabilizing take is stored in the step in the included memory cell of said surface mounting apparatus;
After obtaining the time of advent point that said suction nozzle arrives desirable element absorption position in advance; The supply that setting is supplied with negative pressure to said suction nozzle begins opportunity; From said time of advent trace back the back time point of the time quantum that is stored in the said stabilizing take the said memory cell of point begin to supply with negative pressure, and carry out the step that element adsorbs by said suction nozzle;
Let negative pressure value in the said negative pressure feeding path of said detection of negative pressure monitoring units; Actual measurement is from beginning that said suction nozzle is supplied with the time negative pressure satisfies the stabilisation condition of stipulating to the detected value that is detected by said detection of negative pressure unit till; Obtain said stabilizing take according to the time of this actual measurement, and this stabilizing take is updated stored in the step in the said memory cell.
2. surface mounting apparatus comprises possessing element absorption with suction nozzle and can use head with respect to the installation that substrate moves, and with head element is adsorbed from component feeding portion and is installed on the said substrate through this installation, it is characterized in that comprising:
The negative pressure feeding unit is to the negative pressure of said suction nozzle feed element absorption usefulness;
Control unit, negative pressure feeding or negative pressure that control is undertaken by said negative pressure feeding unit stop;
The stabilizing take of memory cell, the storage regulation till stable from the negative pressure value that begins to supply with said negative pressure to said suction nozzle;
The time of advent arithmetic element, computing arrives the time to go till the element absorption position from beginning element absorption action to said suction nozzle;
The stand-by period arithmetic element is obtained from said time to go and is deducted the time that said stabilizing take draws, with as the stand-by period;
The detection of negative pressure unit, the installation that detection is used for said suction nozzle is supplied with negative pressure is with the negative pressure value in the negative pressure feeding path of head;
Through the time unit, actual measurement is from beginning that said suction nozzle is supplied with the time till negative pressure satisfies regulation to the negative pressure value that is detected by said detection of negative pressure unit the stabilisation condition; Wherein,
Said control unit is after element absorption action beginning; At the time point that has passed through the said stand-by period; Control said negative pressure feeding unit; Beginning negative pressure feeding to said suction nozzle, and according to said through the time unit actual measurement time obtain new said stabilizing take and be stored in the said memory cell.
3. surface mounting apparatus according to claim 2 is characterized in that:
Said memory cell is stored the said stabilizing take separately of the suction nozzle of a plurality of kinds, and said stand-by period arithmetic element basis and element adsorb the corresponding said stabilizing take of kind of employed suction nozzle, said stand-by period of computing.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007175434A JP2009016498A (en) | 2007-07-03 | 2007-07-03 | Component suction method, and surface mounting machine |
| JP175434/2007 | 2007-07-03 | ||
| PCT/JP2008/059443 WO2009004868A1 (en) | 2007-07-03 | 2008-05-22 | Method for sucking component and surface mounting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101690444A CN101690444A (en) | 2010-03-31 |
| CN101690444B true CN101690444B (en) | 2012-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800231437A Active CN101690444B (en) | 2007-07-03 | 2008-05-22 | Method for sucking component and surface mounting machine |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009016498A (en) |
| CN (1) | CN101690444B (en) |
| WO (1) | WO2009004868A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5410864B2 (en) * | 2009-07-06 | 2014-02-05 | Ｊｕｋｉ株式会社 | Electronic component mounting equipment |
| JP6046362B2 (en) * | 2012-03-29 | 2016-12-14 | ヤマハ発動機株式会社 | Electronic component mounting device |
| EP3061331B1 (en) * | 2013-10-21 | 2017-09-06 | Fuji Machine Mfg. Co., Ltd. | Method for mounting an electronic-component onto a substrate and electronic-component mounting machine |
| CN106465577B (en) * | 2014-09-26 | 2019-03-19 | 雅马哈发动机株式会社 | Element fixing apparatus, surface mounting apparatus and the detection method for adsorbing height and position |
| JP6574953B2 (en) * | 2014-09-30 | 2019-09-18 | ハンファ精密機械株式会社 | Component adsorption head |
| JP6906158B2 (en) * | 2017-02-15 | 2021-07-21 | パナソニックＩｐマネジメント株式会社 | Parts mounting device and parts mounting method |
| JP7193062B2 (en) * | 2018-08-01 | 2022-12-20 | Thk株式会社 | Actuator sensing device and actuator control system |
| CN110099558A (en) * | 2019-05-07 | 2019-08-06 | 深圳市路远智能装备有限公司 | A kind of chip mounter picks up and attachment action plate grade implementation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1135158A (en) * | 1995-02-17 | 1996-11-06 | 松下电器产业株式会社 | Method and device for assambling electronic components |
| EP0854670A1 (en) * | 1997-01-17 | 1998-07-22 | Matsushita Electric Industrial Co., Ltd. | Electronic-parts mounting apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2802131B2 (en) * | 1990-01-08 | 1998-09-24 | 松下電器産業株式会社 | Electronic component mounting machine |
| JPH08298395A (en) * | 1995-04-26 | 1996-11-12 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting electronic device |
| JPH1140989A (en) * | 1997-07-22 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| JP2001135991A (en) * | 1999-11-01 | 2001-05-18 | Juki Corp | Apparatus and method for attaching electronic component |
-
2007
- 2007-07-03 JP JP2007175434A patent/JP2009016498A/en active Pending
-
2008
- 2008-05-22 CN CN2008800231437A patent/CN101690444B/en active Active
- 2008-05-22 WO PCT/JP2008/059443 patent/WO2009004868A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1135158A (en) * | 1995-02-17 | 1996-11-06 | 松下电器产业株式会社 | Method and device for assambling electronic components |
| EP0854670A1 (en) * | 1997-01-17 | 1998-07-22 | Matsushita Electric Industrial Co., Ltd. | Electronic-parts mounting apparatus |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2001-135991A 2001.05.18 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101690444A (en) | 2010-03-31 |
| WO2009004868A1 (en) | 2009-01-08 |
| JP2009016498A (en) | 2009-01-22 |
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