CN101690444A - Method for sucking component and surface mounting machine - Google Patents
Method for sucking component and surface mounting machine Download PDFInfo
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- CN101690444A CN101690444A CN200880023143A CN200880023143A CN101690444A CN 101690444 A CN101690444 A CN 101690444A CN 200880023143 A CN200880023143 A CN 200880023143A CN 200880023143 A CN200880023143 A CN 200880023143A CN 101690444 A CN101690444 A CN 101690444A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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Abstract
In the method for sucking a component by means of a nozzle (21) of a surface mounting machine having a movable mounting head (20) equipped with the nozzle (21) for sucking a component, sucking a component from a component feeding section by negative pressure supplied to the nozzle (21), carrying the component above a substrate and mounting the component thereon, the time elapsing before the nozzle(21) arrives at the position for sucking the component is calculated, and negative pressure supply is started at the time retroacted from the arriving time by the settling time of negative pressure,i.e. the time (actual measurement value measured beforehand) required for settling the negative pressure after starting negative pressure supply to the nozzle (21).
Description
Technical field
The present invention relates to surface mounting apparatus, this surface mounting apparatus is adsorbed element with head by the installation that possesses the element suction nozzle and can move and is installed on the substrate from component feeding portion.
Background technology
From in the past, known have (for example patent documentation 1) by possessing element absorption and shaped like chips elements such as IC are adsorbed with head with suction nozzle and the installation that can move and being installed to surface mounting apparatus (hereinafter to be referred as " being fitting machine ") on the substrate from component feeding portion.
In this fitting machine, install move to head component feeding portion above after, this installations drops to the absorption height and position of regulation with head, and on the opportunity of regulation, the negative pressure of adsorbing usefulness by the element that is fed into the suction nozzle far-end is carried out the absorption of element.
The supply that suction nozzle is supplied with negative pressure is necessary to be set at opportunity is installing when arriving element absorption position (position of suction nozzle far-end and element butt or near the position of this position) with head effectively absorptive element such opportunity.If it is too early that the supply that suction nozzle is supplied with negative pressure begins opportunity, so, install till arriving the element absorption position with head during, can produce negative pressure by the meaningless problem that expends, in addition, also can cause the problem of the attraction fault of foreign matters such as dust.On the other hand, slow excessively if the supply of negative pressure begins opportunity, so, install arrive the element absorption position with head in, the negative pressure of being supplied with also is in an unsure state, thereby absorption failure that might generating device.In addition, bide one's time in the temporary transient grade of element absorption position, can produce problems such as required time that absorptive element uses is long when allowing for fear of the generation of described problem install with head.
Patent documentation 1: Japan Patent open communique spy open 2004-356604 number
Summary of the invention
The present invention does in view of described problem, its purpose is: meaningless the expending and the attraction of foreign matter etc. that can either suppress negative pressure can have appropriate stable negative pressure feeding can more conscientiously and more effectively carry out the absorption of element when arriving the element absorption position with head installing again.
For realizing described purpose, method for sucking component involved in the present invention is by to possessing element absorption with suction nozzle and the installation that can the move described suction nozzle supply negative pressure with head, the method for sucking component that element is adsorbed and is installed to the surface mounting apparatus on the described substrate from component feeding portion by described suction nozzle, wherein, obtain the some time of advent that described suction nozzle arrives the element absorption position of being hoped in advance, and according to described time of advent point set the supply that described suction nozzle is supplied with negative pressure and begin opportunity, to carry out element absorption by described suction nozzle.
The traceed back supply of returning to set negative pressure begins the method on opportunity as benchmark according to the time point that so suction nozzle is arrived the element absorption position, the supply that both suction nozzle can have been arrived the negative pressure before the element absorption position is reduced to necessary Min., can necessary negative pressure supply to the suction nozzle far-end when carrying out element absorption again appropriately.Therefore, both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc., can conscientiously and carry out the absorption of element effectively again by meaningless.
In addition, surface mounting apparatus involved in the present invention is by possessing element absorption with the suction nozzle and the installation head that can move with respect to the substrate that is mounted, element adsorbed from component feeding portion and be installed to surface mounting apparatus on the described substrate, it comprises: the negative pressure feeding unit, to the negative pressure of described suction nozzle feed element absorption usefulness; Control unit, negative pressure feeding or negative pressure that control is undertaken by described negative pressure feeding unit stop; Memory cell, storage is from beginning to supply with the stabilizing take of the regulation till described negative pressure to the negative pressure value of described suction nozzle is stablized; The time of advent arithmetic element, computing arrives time to go till the element absorption position from beginning element absorption action to described suction nozzle; The stand-by period arithmetic element is obtained from described time to go and is deducted the time that described stabilizing take draws, with as stand-by time; Wherein, described control unit at the time point that has passed through the described stand-by period, is controlled described negative pressure feeding unit, to begin the negative pressure feeding to described suction nozzle after element absorption action beginning.
According to this surface mounting apparatus, element is adsorbed from component feeding portion by the suction nozzle of installing with head, and follows installation to be installed on this substrate with respect to being mounted moving of substrate with head.In this element installation action, when absorptive element, by arriving the time to go till temporal calculation unitary operation suction nozzle arrives the element absorption position, according to this time to go and the stabilizing take that is stored in the memory cell, obtain stand-by period of negative pressure feeding by the stand-by period arithmetic element, that is to the time that begins to supply with till the negative pressure.Then, by control unit control negative pressure feeding unit, to begin that at the time point that has passed through the described stand-by period suction nozzle is supplied with negative pressure.Thus, when suction nozzle just arrives the element absorption position, just supply with the negative pressure that is stabilized in the pressure of being hoped at the suction nozzle far-end.Therefore, the supply that both suction nozzle can have been arrived element absorption position negative pressure before is reduced to necessary Min., can supply to the suction nozzle far-end with carrying out element necessary negative pressure of when absorption again appropriately, its result, both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc., can conscientiously and carry out the absorption of element effectively again by meaningless.
Description of drawings
Fig. 1 is the stereogram of surface mounting apparatus (using the surface mounting apparatus of method for sucking component involved in the present invention) involved in the present invention.
Fig. 2 is the front view of structure of the expression head assembly periphery of surface mounting apparatus.
Fig. 3 is the block diagram of formation of the controller of presentation surface fitting machine.
Fig. 4 is the flow chart of an example of the performed installation action control of expression controller.
Fig. 5 is the flow chart that the element of presentation graphs 4 adsorbs the subprogram of action control.
Embodiment
Utilize description of drawings preferred implementation of the present invention.
Fig. 1 and Fig. 2 are the figure that roughly represents surface mounting apparatus involved in the present invention (using the surface mounting apparatus of method for sucking component involved in the present invention), and Fig. 1 comes presentation surface fitting machine respectively with stereogram, Fig. 2 with front view.
As shown in these figures, surface mounting apparatus (below, abbreviate " fitting machine " as) pedestal 1 on dispose the conveyer belt 2 that substrate transferring is used, tellite P (being designated hereinafter simply as " substrate P ") on described conveyer belt 2 by conveyance, stop at the installation exercise position of regulation, and be positioned by scheming outer detent mechanism.In the following description, with the direction of conveyer belt 2 as X-direction, will be on horizontal plane with the direction of X-axis quadrature as Y direction, will describe as Z-direction with the direction of X-axis and Y-axis quadrature.
Be provided with the component feeding portion 4,5 that is used to supply with installation elements in the both sides of conveyer belt 2.The component feeding portion that is positioned at the device front side 4 upper edge X-directions in these component feeding portions 4,5 dispose the belt feeder 4a of multiple row.On each belt feeder 4a the strip that is wound on the reel is installed, this strip is accommodated scutellate chip components such as IC, transistor, capacitor, kept.Described strip from described reel discontinuous be sent under the state of element taking-up portion of feed appliance far-end, by head assembly 6 described later element is taken out.
On the other hand, be positioned in the component feeding portion 5 of device rear side and dispose feed disk 5a.Among this feed disk 5a, divide up and down multilayer to take in a plurality of dish T, taken in encapsulation type electronic components such as QFP, BGA among these a plurality of dish T, or large-scale element such as packaging connector.T pulled under the state of side of conveyer belt 2 at these dishes, and the element that will be accommodated among the dish T by head assembly 6 takes out.
The top of described pedestal 1 also is provided with the head assembly 6 that element is installed usefulness.
This head assembly 6 can move in certain scope along X-direction and Y direction, so that from component feeding portion 4,5 element is adsorbed and be installed on the substrate P.That is, dispose the support component 11 of head assembly 6 on pedestal 1, the support component 11 of this head assembly 6 can move along the guide rail 7 of Y direction.Head assembly 6 carries on described support component 11, and can move along the guiding parts 14 of X-direction.In addition, screw togather installation with support component 11, make support component 11 moving thus along Y direction by Y-axis servomotor 9 ball screw driven 8; Install by X-axis servomotor 15 ball screw driven 13 and head assembly 6, make head assembly 6 moving thus along X-direction.
Be equipped with on the described head assembly 6 and be used for element adsorbed and be installed to a plurality of installations on the substrate P with heads 20, in the present embodiment, 6 installations that are a shape are carried with the state that forms a line along X-direction with head 20.
It is the elevating mechanism of drive source that these installations are connected in Z axle servomotor with head 20, and be connected to R axle servomotor is the rotating mechanism (diagram is omitted) of drive source, so these are installed with head 20 and move along the vertical direction respectively with respect to head assembly 6 by the driving of described mechanism and rotate around central shaft (R direction of principal axis).
In addition, on the far-end of each installation with head 20 suction nozzle 21 that is used for absorptive element is installed.As shown in Figure 2, each suction nozzle 21 is connected with negative pressure feeding source 24 via electromagnetically operated valve 22 (only showing the electromagnetically operated valve corresponding with the suction nozzle 21 of part among the figure) and adjuster etc., when from each feed appliance 4a, 5a, taking out element, control based on described electromagnetically operated valve 22, negative pressure is fed into the far-end of suction nozzle 21, carries out the absorption of element thus.Suction nozzle 21 is installed in dismantledly to be installed with on the head 20, as required, suction nozzle 21 can exchange with suction nozzle 21 (other suction nozzles 21 inequality such as distal end shape, mouth hole shape, mouth aperture size) automatically with the exchange in the suction nozzle board that is accommodated in outside the figure that is located on the pedestal 1.
Also be provided with on the head assembly 6 and be used to discern the board-recognition camera 26 that is formed on the various marks on the substrate P.This camera 26 comprises camera main-body and the lighting device that possesses CCD area sensor etc., and the state that is directed downwards with its shooting is installed on the head assembly 6.Thus, this camera 26 is along with the mark of taking successively on the substrate P that moves of head assembly 6.
On the other hand, pedestal 1 is provided with and is used for the component recognition camera 17 that the element that adsorbing with head 20 is discerned is installed by each of head assembly 6.This component recognition camera 17 comprises camera main-body and the lighting device that possesses ccd line sensor etc., takes from its downside the element that is adsorbing with head 21 being installed by each.
Fig. 3 utilizes block diagram to represent to control the formation of the controller of this fitting machine.
Described operation processing unit 31 is in order to carry out a series of installation exercise that undertaken by the installation procedure that is stored in the installation procedure memory cell 32 that is to be moved in the fitting machine to a series of operation of being taken out of from substrate, the driving of described head assembly 6 grades is controlled in the concentrated area, and follows the processing such as various computings of described operation.For example, in this fitting machine, in the element installation action, before from component feeding portion 4,5, taking out element, individually set the supply that suction nozzle 21 is supplied with negative pressure and begin opportunity, afterwards by the negative pressure feeding of this control on opportunity each suction nozzle 21.Particularly, install with the present position of head 20 and be stored in aftermentioned stabilizing take data in the data storage cell 33 etc. according to each, respectively each suction nozzle 21 of computing to the stand-by period that it is begun to supply with till the negative pressure, control each electromagnetically operated valve 22 according to waiting time.Relevant this point describes in the back.In the present embodiment, described operation processing unit 31 is equivalent to control unit involved in the present invention, time of advent arithmetic element and stand-by period arithmetic element.
Described installation procedure memory cell 32 is unit of the storage installation procedure relevant with described a series of installation action.
Each servomotor 9,15 of described X-axis of motor control unit 34 drive controlling and Y-axis, so that carrying out two dimension on the X-Y coordinate plane, moves head assembly 6, and each servomotor of drive controlling R axle and Z axle, so that each of head assembly installed with head 20 runnings.In addition, though omitted diagram, in each motor 9,15 etc., be separately installed with position information detecting unit such as encoder, motor control unit 34 is according to each motor of detection information Control of this positional information detecting unit.
Valve switch control unit 35 is each is installed with the suction nozzle 21 of head 20 to carry out the supply of negative pressure, the unit of the switching that stops by controlling described electromagnetically operated valve 22, and it carries out the control of described switching with head 20 to each installation.In the present embodiment, electromagnetically operated valve 22 and negative pressure feeding source 24 etc. is equivalent to negative pressure feeding means involved in the present invention.
Below, the installation action control of the element that is undertaken by described controller 30 according to Fig. 4 and Fig. 5 explanation.
Fig. 4 utilizes flow chart to represent a series of installation action control that substrate P is carried out.After the flow process of this flow chart begins, at first, operation processing unit 31 control conveyer belts 2, substrate P is moved into described installation exercise position, position, and make head assembly 6 move to the top of substrate P, make described board-recognition camera 26 take the reference mark (substrate fiducials) of being paid on substrate P and carry out the identification of substrate P by mark.That is, investigation head assembly 6 (each is installed with head 20) concerns with the relative position of substrate P.
Then, operation processing unit 31 makes head assembly 6 be configured to the top of component feeding portion 4,5, with head 20 element is taken out (step S3) by each installation from component feeding portion 4,5.Particularly, move to as the process above the belt feeder 4a of absorption object or the feed disk 5a successively with head 20 making to install, the lifting drive installation is with head 20, by in the suction nozzle 21 absorption strips or coil element in the T.At this moment, under possible situation, can simultaneously a plurality of elements be adsorbed to come from component feeding portion 4,5 with head 20 by a plurality of installations and be taken out.
After the absorption of element finished, operation processing unit 31 moved on the substrate P after the path movement of stipulating makes the top of head assembly 6 through component recognition cameras 17 by making head assembly 6.So, in this moves, making component recognition camera 17 each element of shooting, identification is adsorbed on each the adsorbed state of using the element on the head 20 (suction nozzle 21) is installed, when generating device adsorbs situation about departing from, the correction (step S5) when computing is installed.
After head assembly 6 (installing with head 20) arrived the initial installation site (coordinate) on the substrate P, operation processing unit 31, was installed to element on the substrate P with head 20 with regard to the lifting drive installation.Afterwards, make head assembly 6 move to next installation site successively, remaining absorptive element is installed to (step S7) on the substrate P.
After all absorptive elements with head assembly 6 like this are installed on the substrate P, operation processing unit 31 judges whether the installation of all elements of this substrate P finishes (step S9), when being judged as "No", return among the step S3, drive controlling head assembly 6 is to take out next element from component feeding portion 4,5.Relative therewith, when being judged as "Yes" in step S9, operation processing unit 31 makes head assembly 6 return the position of readiness of regulation, and drives conveyer belt 2 and take out of substrate P.Thus, finish a series of installation action of substrate P.
Fig. 5 represents the subprogram of the processing (element absorption) among the step S3 of above-mentioned flow process.In this is handled, at first, operation processing unit 31 is according to configuration (flow chart) data that are stored in substrate data in the data storage cell 33 and belt feeder 4a etc., and the installation when decision is installed with the target location of head 20 that is absorptive element is with the position (step S11) on X-axis, Y-axis, Z axle and the axial all directions of R of head 20.This target location is the position of suction nozzle far-end and element surface butt or near the position of this position.
Then, operation processing unit 31 begins moving of head assembly 6 (installing with head 20) by control signal being exported to motor control unit 34, to carry out element absorption (step S13) by initial installation with head 20.In addition, operation processing unit 31 and step S13 be stand-by period (step S15) of beginning of computing negative pressure feeding concurrently, when being judged as when having passed through waiting time, just control signal is exported to valve switch control unit 35, so that electromagnetically operated valve 22 is switched to open state from closed condition, thus, beginning is to the negative pressure feeding (step S17, S19) of suction nozzle 21.The described stand-by period is obtained by following calculating: at first, according to from servomotor 9, the signal of the positional information detecting unit output of 15 grades, obtain the present position (X-axis of installing with head 20, Y-axis, each position on Z axle and the R direction of principal axis) that is in the present embodiment during the described target location of decision at that time installation with the position (coordinate) of head 20, wait computing that the time to go that arrives described target location with head 20 from this position is installed according to the drive condition of described installation procedure then, from this time to go, deduct afterwards be installed in this installation usefulness head 20 on the stabilizing take of the corresponding described negative pressure of suction nozzle 21.
That is, supply with the opportunity that the negative pressure feeding of negative pressure begins,, begin suction nozzle 21 supply negative pressure from trace back the back time point of described stabilizing take amount of the time point that arrives target locations with head 20 is installed by controlling as described above to each suction nozzle 21.
Then, judge to install whether to have arrived the target location,, make and install with head 20 risings (step S23) when being judged as (being "Yes" among the step S21) when arriving with head 20.Thus, element is removed from component feeding portion 4,5 with the state on the far-end that is adsorbed on suction nozzle 21, so, adsorb release by described installation with the element that head 20 carries out.
So install and carry out element absorption repeatedly with head 20 and move by each, finally in step S25, be judged as "Yes" after, with regard to process ends, and processing is moved on to processing (component recognition processing) among the step S5 of Fig. 4.
According to aforesaid surface mounting apparatus, when carrying out element absorption with head 20 by installation, time point owing to the described stabilizing take amount of tracing back back at the time point that arrives target locations with head 20 from installation, that is the negative pressure value from (by closed condition switch to open state from electromagnetically operated valve 22 after) after beginning to supply with negative pressure to the suction nozzle far-end of tracing back back satisfies the time point of the required time quantum of the stable condition of regulation, begin to supply with negative pressure, therefore, when suction nozzle 21 arrives the element absorption position, for example during just with the element surface butt, just supply with the negative pressure that is stabilized in authorized pressure at the far-end of suction nozzle 21 at the far-end of suction nozzle 21.Therefore, the supply to the negative pressure of suction nozzle 21 that arrives before the element absorption position can be reduced to necessary Min., can the necessary negative pressure of absorptive element supply to the suction nozzle far-end rightly when carrying out element absorption.Therefore, can eliminate the problem of this kind surface mounting apparatus in the past, that is the negative pressure that causes too early opportunity owing to the beginning of suction nozzle being supplied with negative pressure is expended and is attracted to problem such as foreign matter by meaningless, perhaps owing to the beginning of supplying with negative pressure is adsorbed failure or for avoiding this failure to produce problems such as stand-by time, can more conscientiously and more effectively be carried out the absorption of element after the unstable element that takes place of the negative pressure that causes late opportunity.
In the particularly described fitting machine, be equipped with a plurality of installations head 20 on the head assembly 6, and each suction nozzle 21 of installing with head 20 can exchange with the suction nozzle in the suction nozzle board, thereby can use the described suction nozzle 21 of a plurality of kinds, but, as mentioned above, in this fitting machine, because stabilizing take that in advance will be corresponding with each suction nozzle is as showing storage in data storage cell 33, by reading the stabilizing take corresponding with the kind of the actual suction nozzle that is used 21, the supply of control negative pressure begins opportunity, and therefore, suction nozzle 21 also can obtain effect as described above effectively even use arbitrarily.
In addition, above-mentioned surface mounting apparatus is the example of the preferred implementation of surface mounting apparatus (using the surface mounting apparatus of method for sucking component involved in the present invention) involved in the present invention, and its concrete formation (method for sucking component) can be carried out suitable change in the scope that does not break away from purport of the present invention.
For example, in the described execution mode, used the measured value that draws by test with stabilizing take, but can certainly use design load as negative pressure.
In addition,, also can in installation action, survey stabilizing take, results measured is given updated stored as stabilizing take except execution mode is as described given stabilizing take the storage earlier as fixed value like that.At this moment, by installing at each on the negative pressure feeding path with head 20 B/P EGR Back Pressure Transducer EGR (detection of negative pressure unit) is set, by the negative pressure value in operation processing unit 31 these paths of supervision, after electromagnetically operated valve 22 is switched, according to the clock signal of the control of CPU for example usefulness (through the time unit), the time of satisfying through the force value of B/P EGR Back Pressure Transducer EGR till the stable condition of regulation gets final product.According to such formation (method), can improve the reliability of stabilizing take.Promptly, because stabilizing take can be invaded various conditions such as the intrusion situation of negative pressure feeding path, the running-active status in negative pressure feeding source 24 based on foreign matters such as dust through the time change, therefore, if as described above the measured value in the installation action is fed back (updated stored) as stabilizing take, then can improve the reliability of stabilizing take, its result can more suitably begin to supply with negative pressure to suction nozzle 21 opportunity.At this moment, also can get final product by surveying stabilizing take for several times, its mean value being fed back.
In addition, in the explanation of above-mentioned execution mode, the state of " satisfying the stabilisation condition " is meant that the value of negative pressure for example surpasses the state of the threshold value of regulation, or the state of the value stabilization of negative pressure in certain scope.
The present invention discussed above is summarized as follows.
Promptly, method for sucking component of the present invention is by to possessing element absorption with suction nozzle and the installation that can the move described suction nozzle supply negative pressure with head, the method for sucking component that element is adsorbed and is installed to the surface mounting apparatus on the described substrate from component feeding portion by described suction nozzle, wherein, obtain the some time of advent that described suction nozzle arrives the element absorption position of being hoped in advance, and according to described time of advent point set the supply that described suction nozzle is supplied with negative pressure and begin opportunity, to carry out element absorption by described suction nozzle.
The traceed back supply of returning to set negative pressure begins the method on opportunity as benchmark according to the time point that so suction nozzle is arrived the element absorption position, the supply that both suction nozzle can have been arrived the negative pressure before the element absorption position is reduced to necessary Min., can necessary negative pressure supply to the suction nozzle far-end when carrying out element absorption again appropriately.Therefore, both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc., can conscientiously and carry out the absorption of element effectively again by meaningless.
More specifically, described supply beginning is set by following mode opportunity: obtain in advance from beginning that described suction nozzle is supplied with the stabilizing take of negative pressure till the value stabilization of this negative pressure, from described time of advent trace back the back time point of time quantum of described stabilizing take of point begin to supply with negative pressure.
According to this method,, therefore, when carrying out element absorption, appropriate stable negative pressure feeding can be arranged at the suction nozzle far-end because when suction nozzle just arrived the element absorption position, the pressure of suction nozzle far-end was the stable negative pressure value of being hoped.
In addition, surface mounting apparatus involved in the present invention is by possessing element absorption with the suction nozzle and the installation head that can move with respect to the substrate that is mounted, element adsorbed from component feeding portion and be installed to surface mounting apparatus on the described substrate, it comprises: the negative pressure feeding unit, to the negative pressure of described suction nozzle feed element absorption usefulness; Control unit, negative pressure feeding or negative pressure that control is undertaken by described negative pressure feeding unit stop; Memory cell, storage is from beginning to supply with the stabilizing take of the regulation till described negative pressure to the negative pressure value of described suction nozzle is stablized; The time of advent arithmetic element, computing arrives time to go till the element absorption position from beginning element absorption action to described suction nozzle; The stand-by period arithmetic element is obtained from described time to go and is deducted the time that described stabilizing take draws, with as stand-by time; Wherein, described control unit at the time point that has passed through the described stand-by period, is controlled described negative pressure feeding unit, to begin the negative pressure feeding to described suction nozzle after element absorption action beginning.
According to this surface mounting apparatus, element is adsorbed from component feeding portion by the suction nozzle of installing with head, and follows installation to be installed on this substrate with respect to being mounted moving of substrate with head.In this element installation action, when absorptive element, by arriving the time to go till temporal calculation unitary operation suction nozzle arrives the element absorption position, according to this time to go and the stabilizing take that is stored in the memory cell, obtain stand-by period of negative pressure feeding by the stand-by period arithmetic element, that is to the time that begins to supply with till the negative pressure.Then, by control unit control negative pressure feeding unit, to begin that at the time point that has passed through the described stand-by period suction nozzle is supplied with negative pressure.Thus, when suction nozzle just arrives the element absorption position, just supply with the negative pressure that is stabilized in the pressure of being hoped at the suction nozzle far-end.Therefore, the supply that both suction nozzle can have been arrived element absorption position negative pressure before is reduced to necessary Min., can supply to the suction nozzle far-end with carrying out element necessary negative pressure of when absorption again appropriately, its result, both can avoid negative pressure to be expended and the generation of the attraction fault of foreign matter etc., can conscientiously and carry out the absorption of element effectively again by meaningless.
In this structure, described memory cell is stored the described stabilizing take separately of the suction nozzle of a plurality of kinds, and described stand-by period arithmetic element is according to adsorbing the corresponding described stabilizing take of kind of employed suction nozzle, the described stand-by time of computing with element.
Promptly, can be different from beginning to supply with after the negative pressure negative pressure value to the suction nozzle far-end time (stabilizing take) till stable because of the difference of mouth hole shape or mouth footpath size, but, in this structure, come to be stored in the stabilizing take corresponding in the memory cell in advance by the kind of each suction nozzle with each kind, according to the stabilizing take corresponding, obtain described stand-by time with the kind of employed suction nozzle.Therefore, no matter suction nozzle is arbitrary kind, the appropriate negative pressure feeding that is stabilized in the pressure of hoping can when arriving the element absorption position, suction nozzle be arranged.
Utilizability on the industry
As mentioned above, the present invention is to element being adsorbed with negative pressure by head assembly and moving Be downloaded to the useful invention of surface mounting apparatus on the substrate, its both can avoid negative pressure meaningless expend and The generation of the attraction fault of foreign matter etc. can conscientiously and be carried out the absorption of element again effectively.
Claims (4)
1. method for sucking component, it is characterized in that: be by to possessing element absorption with suction nozzle and the installation that can move described suction nozzle supply negative pressure with head, the method for sucking component that element is adsorbed and is installed to the surface mounting apparatus on the described substrate from component feeding portion by described suction nozzle, wherein
Obtain the some time of advent that described suction nozzle arrives the element absorption position of being hoped in advance, and begin opportunity, to carry out element absorption by described suction nozzle according to the supply that the described time of advent, point was set described suction nozzle supply negative pressure.
2. method for sucking component according to claim 1 is characterized in that:
Described supply beginning is set by following mode opportunity: obtain in advance from beginning that described suction nozzle is supplied with the stabilizing take of negative pressure till the value stabilization of this negative pressure, from described time of advent trace back the back time point of time quantum of described stabilizing take of point begin to supply with negative pressure.
3. surface mounting apparatus by possessing element absorption with the suction nozzle and the installation head that can move with respect to the substrate that is mounted, is adsorbed element and is installed on the described substrate from component feeding portion, it is characterized in that comprising:
The negative pressure feeding unit is to the negative pressure of described suction nozzle feed element absorption usefulness;
Control unit, negative pressure feeding or negative pressure that control is undertaken by described negative pressure feeding unit stop;
Memory cell, storage is from beginning to supply with the stabilizing take of the regulation till described negative pressure to the negative pressure value of described suction nozzle is stablized;
The time of advent arithmetic element, computing arrives time to go till the element absorption position from beginning element absorption action to described suction nozzle;
The stand-by period arithmetic element is obtained from described time to go and is deducted the time that described stabilizing take draws, with as stand-by time; Wherein,
Described control unit at the time point that has passed through the described stand-by period, is controlled described negative pressure feeding unit, to begin the negative pressure feeding to described suction nozzle after element absorption action beginning.
4. surface mounting apparatus according to claim 3 is characterized in that:
Described memory cell is stored the described stabilizing take separately of the suction nozzle of a plurality of kinds, and described stand-by period arithmetic element is according to adsorbing the corresponding described stabilizing take of kind of employed suction nozzle, the described stand-by time of computing with element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007175434A JP2009016498A (en) | 2007-07-03 | 2007-07-03 | Component suction method, and surface mounting machine |
| JP175434/2007 | 2007-07-03 | ||
| PCT/JP2008/059443 WO2009004868A1 (en) | 2007-07-03 | 2008-05-22 | Method for sucking component and surface mounting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101690444A true CN101690444A (en) | 2010-03-31 |
| CN101690444B CN101690444B (en) | 2012-03-14 |
Family
ID=40225925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800231437A Active CN101690444B (en) | 2007-07-03 | 2008-05-22 | Method for sucking component and surface mounting machine |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009016498A (en) |
| CN (1) | CN101690444B (en) |
| WO (1) | WO2009004868A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369949A (en) * | 2012-03-29 | 2013-10-23 | 株式会社日立高新技术仪器 | Electronic component installing device |
| CN105472962A (en) * | 2014-09-30 | 2016-04-06 | 韩华泰科株式会社 | Component adsorbing head and component adsorbing method using same |
| CN105794333A (en) * | 2013-10-21 | 2016-07-20 | 富士机械制造株式会社 | Method for mounting an electronic-component onto a substrate and electronic-component mounting machine |
| CN106465577A (en) * | 2014-09-26 | 2017-02-22 | 雅马哈发动机株式会社 | Component mounting device, surface mounting machine, and method for detecting adsorption height position |
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| JP5410864B2 (en) * | 2009-07-06 | 2014-02-05 | Ｊｕｋｉ株式会社 | Electronic component mounting equipment |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2802131B2 (en) * | 1990-01-08 | 1998-09-24 | 松下電器産業株式会社 | Electronic component mounting machine |
| JPH08298395A (en) * | 1995-04-26 | 1996-11-12 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting electronic device |
| CN1091341C (en) * | 1995-02-17 | 2002-09-18 | 松下电器产业株式会社 | Method and device for assambling electronic components |
| JP3339344B2 (en) * | 1997-01-17 | 2002-10-28 | 松下電器産業株式会社 | Electronic component mounting device |
| JPH1140989A (en) * | 1997-07-22 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| JP2001135991A (en) * | 1999-11-01 | 2001-05-18 | Juki Corp | Apparatus and method for attaching electronic component |
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2007
- 2007-07-03 JP JP2007175434A patent/JP2009016498A/en active Pending
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2008
- 2008-05-22 CN CN2008800231437A patent/CN101690444B/en active Active
- 2008-05-22 WO PCT/JP2008/059443 patent/WO2009004868A1/en active Application Filing
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369949A (en) * | 2012-03-29 | 2013-10-23 | 株式会社日立高新技术仪器 | Electronic component installing device |
| CN103369949B (en) * | 2012-03-29 | 2017-05-03 | 雅马哈发动机株式会社 | Electronic component installing device |
| CN105794333A (en) * | 2013-10-21 | 2016-07-20 | 富士机械制造株式会社 | Method for mounting an electronic-component onto a substrate and electronic-component mounting machine |
| CN105794333B (en) * | 2013-10-21 | 2018-12-21 | 株式会社富士 | The method and electronic components mounting machine that electronic component is installed on substrate |
| CN106465577A (en) * | 2014-09-26 | 2017-02-22 | 雅马哈发动机株式会社 | Component mounting device, surface mounting machine, and method for detecting adsorption height position |
| CN106465577B (en) * | 2014-09-26 | 2019-03-19 | 雅马哈发动机株式会社 | Element fixing apparatus, surface mounting apparatus and the detection method for adsorbing height and position |
| CN105472962A (en) * | 2014-09-30 | 2016-04-06 | 韩华泰科株式会社 | Component adsorbing head and component adsorbing method using same |
| CN105472962B (en) * | 2014-09-30 | 2020-06-19 | 韩华精密机械株式会社 | Component suction head and component suction method using the same |
| CN112514552A (en) * | 2018-08-01 | 2021-03-16 | Thk株式会社 | Sensing device of actuator and control system of actuator |
| CN112514552B (en) * | 2018-08-01 | 2022-06-24 | Thk株式会社 | Sensing device of actuator and control system of actuator |
| CN110099558A (en) * | 2019-05-07 | 2019-08-06 | 深圳市路远智能装备有限公司 | A kind of chip mounter picks up and attachment action plate grade implementation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101690444B (en) | 2012-03-14 |
| JP2009016498A (en) | 2009-01-22 |
| WO2009004868A1 (en) | 2009-01-08 |
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