CN102340980B - Mounting apparatus - Google Patents

Abstract

The invention provides a mounting apparatus, comprising: a base; a chip keep bench capable of keeping chip elements; an upward pushing device provided with a mechanism pushing up the chip elements kept on the chip keep bench from the lower part; a plurality of withdrawing head parts used for adsorbing the chip elements pushed up by the upward pushing device; a head part unit provided with a plurality of installing head parts receiving the chip elements from the withdrawing head parts and installing the chip elements onto a substrate; wherein, each mounting head part of the plurality of mounting head parts simultaneously receives the chip elements respectively absorbed by the withdrawing parts. Therefore, a mounting apparatus advantaged by shorter summation time required by delivering motion of the plurality of chip elements is provided.

Description

Fitting machine

Technical field

The present invention relates to fitting machine, particularly possess the fitting machine of the taking-up head that adsorbs the chip element above being pushed away by pushing-up device.

Background technology

All the time, the chip element above being pushed away by pushing-up device is adsorbed and the fitting machine of the taking-up head that can spin upside down as possessing, for example the known fitting machine that has Japan Patent No. 4016982 (hereinafter referred to as patent documentation 1) and Japanese Patent Publication communique JP No. 2004-103923 (hereinafter referred to as patent documentation 2) to record.

In above-mentioned patent documentation 1, disclose a kind of fitting machine, this fitting machine comprises: keep flip-chip (chip element) and in XY direction, movably keep platform (wafer maintenance platform), be arranged on the taking-up head of the thin slice mechanism for stripping (pushing-up device), the absorption flip-chip that keep platform below and receive flip-chip and be installed to the securement head substrate from taking out head.In the fitting machine of above-mentioned patent documentation 1, take out head and be provided with one.Therefore, can think and in the fitting machine of above-mentioned patent documentation 1, carry out the payment to this element to securement head after keeping the taking-up platform of a flip-chip, then carry out next flip-chip from keeping taking-up platform and the payment to securement head.

In addition, in above-mentioned patent documentation 2, disclose a kind of fitting machine, this fitting machine comprises: keep chip element and in XY direction movably element supply table (wafer maintenance platform), have absorption chip element taking-up suction nozzle element introduction part (withdrawing device) and have from element introduction part and receive chip element and be installed to the installation portion (head unit) of the lift-launch suction nozzle substrate.The fitting machine of above-mentioned patent documentation 2 is also same with the fitting machine of above-mentioned patent documentation 1, take out suction nozzle and be provided with one, therefore, can think and in this fitting machine, carry out after the taking-up of a chip element from element supply table to this element to the payment of carrying suction nozzle, then carry out the taking-up of next chip element from element supply table and to the payment of carrying suction nozzle.

In the fitting machine of above-mentioned patent documentation 1, owing to carrying out this flip-chip by each flip-chip from keeping taking-up action platform and this flip-chip to the payment action of securement head, therefore there is following problem: the needed total ascent time is moved in the payment of multiple flip-chips (chip element) to be increased.

In addition, in above-mentioned patent documentation 2, also owing to carrying out the taking-up of this chip element from element supply table action and this chip element by each chip element to the payment action of carrying suction nozzle, therefore there is following problem: the needed total ascent time is moved in the payment of multiple chip elements to be increased.

Summary of the invention

The object of the present invention is to provide compared with a kind of fitting machine with in the past the payment of multiple chip elements to move shorter fitting machine of needed total ascent time.

Fitting machine involved in the present invention comprises: pedestal, wafer keeps platform, can keep chip element, pushing-up device, has from below and pushes away and remain on the mechanism that described wafer keeps the chip element on platform, withdrawing device, has multiple taking-up heads, and described taking-up head has the suction nozzle for adsorbing the chip element above pushing away by described pushing-up device and the drive unit for spinning upside down, head unit, has for described chip element being received from described taking-up head and this chip element being installed to the multiple securement heads substrate, wherein, described withdrawing device comprises: the first withdrawing device that at least has a described taking-up head and can move on horizontal plane, the second withdrawing device that at least there is a described taking-up head and can move on horizontal plane independently with described the first withdrawing device, described fitting machine also comprises control device, described control device is controlled as follows: in the time that the taking-up head of the taking-up head from described the first withdrawing device and described the second withdrawing device is paid described chip element to described head unit, the suction nozzle that at least one that makes described the first withdrawing device and described the second withdrawing device is moved into the taking-up head of being located at described the first withdrawing device equates with the arrangement pitch of multiple securement heads of described head unit with the interval of being located between the suction nozzle of taking-up head of described the second withdrawing device, make each securement head of described multiple securement heads receive the described chip element that described multiple taking-up head adsorbs respectively simultaneously.

According to the present invention, compared with fitting machine in the past, the increase of needed total ascent time is moved in the payment that can suppress multiple chip elements.

Brief description of the drawings

Fig. 1 is the overall structure that represents the fitting machine of the first execution mode of the present invention vertical view of (wafer keeps platform to be arranged on element taking out the state of job position).

Fig. 2 is the overall structure that represents the fitting machine of the first execution mode of the present invention vertical view of (wafer keeps platform to be arranged on the state of wafer receiving position).

Fig. 3 is the integrally-built front view that represents the fitting machine of the first execution mode of the present invention.

Fig. 4 is the stereogram that represents the primary structure key element of the fitting machine of the first execution mode of the present invention.

Fig. 5 is the end view that represents the chip element delivery status of the fitting machine of the first execution mode of the present invention.

Fig. 6 is the front view that represents the chip element delivery status of the fitting machine of the first execution mode of the present invention.

Fig. 7 is the block diagram that represents the control system of the fitting machine of the first execution mode of the present invention.

Fig. 8 is the flow chart of the installation action of the fitting machine for the first execution mode of the present invention is described.

Fig. 9 is the integrally-built vertical view that represents the fitting machine of the variation of the first execution mode of the present invention.

Figure 10 is the integrally-built vertical view that represents the fitting machine of the second execution mode of the present invention.

Figure 11 is the end view that represents the chip element delivery status of the fitting machine of the second execution mode of the present invention.

Figure 12 is the integrally-built vertical view that represents the fitting machine of the 3rd execution mode of the present invention.

Figure 13 is the end view that represents the chip element delivery status of the fitting machine of the 3rd execution mode of the present invention.

Figure 14 is the end view that represents other delivery status of the chip element of the fitting machine of the 3rd execution mode of the present invention.

Embodiment

Below, based on brief description of the drawings embodiments of the present invention.

(the first execution mode)

Below with reference to Fig. 1 to Fig. 7, the structure of the fitting machine 100 to the first execution mode of the present invention describes.In addition, for specific direction relation, the suitable in the drawings XYZ rectangular axes that illustrate.X-direction is the direction parallel with horizontal plane, Y direction be on horizontal plane with the orthogonal direction of X-direction, Z-direction is and X-axis, Y-axis orthogonal direction respectively.

Fitting machine 100 is so-called compound fitting machines, and it can also install (assembling) to printed circuit board (PCB) P above from take out bare chip through the wafer W of cutting, and the potted element of being supplied by element supply device 160 etc. is installed on printed circuit board (PCB) P.Printed circuit board (PCB) P is an example of " substrate " of the present invention.

As depicted in figs. 1 and 2, this fitting machine 100 comprises: pedestal 1; For printed circuit board (PCB) P being moved into or is taken out of the carrying device 2 of the installation exercise position of appointment; And for supplying the chip component supply department 3 of chip component.In addition, as shown in Figure 2 and Figure 4, fitting machine 100 comprises: installation portion 4, for installation elements on printed circuit board (PCB) P (bare chip or chip component); Wafer keeps platform 5, supports the wafer W of extracting out from wafer storage portion 170; Withdrawing device 6 takes out bare chip and is delivered to installation portion 4 from the wafer W that keeps platform 5 to support by wafer; Pushing-up device 7 pushes away this bare chip in the time utilizing withdrawing device 6 to take out bare chip from below; The movable camera 8 of position of components identification use was taken this bare chip before the taking-up that utilizes withdrawing device 6 to carry out bare chip is moved.Bare chip is an example of " chip element " of the present invention.

Carrying device 2 comprises: the carrying device main body of extending along the directions X of conveyance printed circuit board (PCB) P and the also not shown detent mechanism of location of lifting printed circuit board (PCB) P in this carrying device main body.Carrying device to the left with flat-hand position conveyance printed circuit board (PCB) P on X-direction almost, is fixed on the installation exercise position of appointment by printed circuit board (PCB) P location from Fig. 1 right side.In the first embodiment, on the conveyance path at the carrying device 2 and position (position of the printed circuit board (PCB) P in figure) that separates appointed interval in X-direction is made as respectively to installation exercise position.In addition, in the following description, the position of the conveyance direction upstream side of printed circuit board (PCB) P among installation exercise position is called to the first job position S1, the position in downstream is called to the second job position S2.

Chip component supply department 3 is arranged on the two ends of the front side of fitting machine 100.Chip component supply department 3 is for chip components such as supply transistor, resistance, capacitors.In chip component supply department 3, be for example disposed with belt feeder 161 element supply devices such as grade 160 along carrying device 2.Each belt feeder 161 comprises: be wound with the spool that keeps the material strip of the chip components such as transistor with appointed interval; Keep the holding member of spool; And extract material strip out and chip component is passed out to the element delivering mechanism etc. of the element supply position of belt feeder front end from spool.Belt feeder 161 is being installed under the state of chip component supply department 3, carries out in linkage the action of sending of chip component with fitting machine 100.That is, make the installation portion 4 of fitting machine 100 at element supply position pick-up chip element, and be accompanied by this and pick up next chip component is passed out to element supply position.In addition, the pallet (diagram is omitted) that is placed with the large-scale potted elements such as semiconductor packages also can be set, to replace belt feeder 161 in chip component supply department 3.In this case, directly pick up potted element from this pallet by installation portion 4.

Installation portion 4 is that bare chip or chip component are installed to the part on printed circuit board (PCB) P, the driver element that it is included on the top position of carrying device 2 respectively in (XY direction) in the horizontal direction two head units (being called the first head unit 41, the second head unit 42) movably and drives respectively them.

The first head unit 41 only can move as movable area using the region of the upper upstream side that mainly comprises the first job position S1 of pedestal 1 in this region, on the other hand, the second head unit 42 only can move as movable area using the region in the upper downstream that mainly comprises the second job position S2 of pedestal 1 in this region.These first head units 41 and the second head unit 42 have following structure (structure of the second head unit 42 is in parenthetic explanation).

As shown in Figure 3, the first head unit 41 (the second head unit 42) possesses two elements installations of arranging in X-direction head 41a and a video camera 41b (two elements are installed with head 42a and a video camera 42b).Element installation is an example of " securement head " of the present invention with head 41a and 42a.

The first head unit 41 (the second head unit 42) is installed adsorb the chip component of being supplied by belt feeder 161 and be installed to printed circuit board (PCB) P with head 41a (42a) by these elements and is gone up, and is installed with head 41a (42a) and adsorbed and utilize the bare chip that withdrawing device 6 takes out from wafer W and be installed on printed circuit board (PCB) P by element.Accordingly, the chip component such as transistor, capacitor and bare chip the two be installed on printed circuit board (PCB) P.In addition, the first head unit 41 (the second head unit 42) is before printed circuit board (PCB) P installation elements, utilize video camera 41b (42b) take printed circuit board (PCB) P upper with Datum identifier (diagram is omitted).Captured picture signal is exported to control device 11 described later from video camera 41b (42b), based on the position deviation of this image recognition printed circuit board (PCB) P, when mounted enforcing location drift correction.

The driver element of the first head unit 41 and 42 comprises: support component 43 and 44 is supported the first head unit 41 and the second head unit 42 movably respectively in X-direction; Fixed guide 45 and 46, the end face 100a that is arranged on fitting machine 100 is above also supported support component 43 and 44 movably respectively in Y direction; The travel mechanism's (diagram is omitted) being made up of linear motor, for making the first head unit 41 and the second head unit 42 move in X-direction with respect to support component 43 and 44; The travel mechanism's (diagram is omitted) being made up of linear motor, for moving independently respectively support component 43 and 44 in Y direction along fixed guide 45 and 46.

In addition, on pedestal 1 and in the movable area separately of the first head unit 41 and the second head unit 42, be provided with fixed cameras 9 and 10 for component recognition.Fixed cameras 9 and 10 is for example for possessing the video camera of the capturing element such as CCD or CMOS.Fixed cameras 9 and 10 is taken by the element installation head 41a of the first head unit 41 and the element of the second head unit 42 element with head 42a absorption is installed from downside, and its image signal output is arrived to control device 11 described later.

In addition, as shown in Figure 1, be releasably fixed with at the central portion of the front side of fitting machine 100 the wafer storage portion 170 that is accommodated with wafer W.Here, wafer storage portion 170 accommodates the many pieces of wafer W through cutting as shown in Figure 4.This wafer storage portion 170 comprises with upper and lower multilayer accommodates and keeps the shelf (rack) of roughly circular bracket Wh (with reference to Fig. 1) of wafer W and lifting to drive the driver element of this shelf.Wafer storage portion 170 is arranged on the wafer W of hope by the lifting of shelf the discrepancy height and position of the appointment that can come in and go out with respect to wafer maintenance platform 5.In addition, wafer keeps platform 5 to possess the discrepancy mechanism (diagram is omitted) of wafer W.This discrepancy mechanism can keep platform 5 front and back (Y-direction) mobile with respect to wafer, and has and possess bracket at far-end and hold the arm of mechanism.Discrepancy mechanism keeps platform 5 to be arranged under the state of wafer receiving position (with reference to Fig. 2) at wafer, can be retracted to wafer from wafer storage portion 170 and keep platform 5 being arranged on the wafer W (bracket Wh) of coming in and going out in the shelf of height and position by described arm, and wafer can be kept the wafer W on platform 5 to accommodate (putting back to) in shelf.

Each bare chip that is housed in the each wafer W in wafer storage portion 170 sticks on the wafer thin slice of film-form with (face up) state that faces up (circuit forming surface (with respect to the installed surface of printed circuit board (PCB) P) state upwards), is kept by bracket Wh via this wafer thin slice.

Wafer keeps platform 5 to have circular peristome at central portion, can keep the overlapping mode of peristome of platform 5 to keep bracket Wh with the peristome of the bracket Wh of maintenance wafer W and wafer.Accordingly, keep maintaining under the state of wafer W (bracket Wh) on platform 5 at wafer, can keep the below of platform 5 to push away bare chip by pushing-up device 7 described later from wafer.

Wafer keeps platform 5 to take out between job position (position shown in Fig. 1) and the wafer receiving position (position shown in Fig. 2) that is closely close to of wafer storage portion 170 removable along Y-direction on pedestal 1 at element.Particularly, wafer keep platform 5 by pedestal 1 along Y direction extend arrange a pair of fixed guide 51 is supported movably, by appointment driver element driving and move along fixed guide 51.Driver element comprises: extend abreast with fixed guide 51 and screw togather and be inserted in wafer and keep the ball-screw 52 in the nut portion of platform 5; For rotariling actuate the drive motor 53 of ball-screw 52.In addition, as shown in Figure 3, wafer keeps platform 5 by the lower position of carrying device 2, takes out between job position and described wafer receiving position and moves at described element.

Pushing-up device 7 is by the wafer that is arranged on element and takes out job position is kept pushing away from its downside as the bare chip that takes out object among the wafer W on platform 5, thereby this bare chip is peeled off and lifting from wafer thin slice.

As shown in Figure 3 and Figure 4, this pushing-up device 7 comprises the upper push-rod (being called the first upper push-rod 71a, the second upper push-rod 71b) of a pair of path that is built-in with respectively distribution (diagram is omitted).This pushing-up device 7 is moved with respect to pedestal 1 by the drive unit drives of specifying on directions X., on pedestal 1, possess: the fixed guide 72 that extends and described pushing-up device 7 is supported movably along X-direction; Extend abreast with this fixed guide 72 and screw togather the ball-screw outside the figure in the nut portion that is inserted in pushing-up device 7; For rotariling actuate the drive motor (diagram is omitted) of this ball screw.By utilizing this drive motor to drive described ball screw, thereby pushing-up device 7 is moved along fixed guide 72.Because pushing-up device 7 is removable on directions X, thus for be supported on only can be mobile in the Y direction wafer keep the wafer W on platform 5, pushing-up device 7 can on push away bare chip arbitrarily.

The first upper push-rod 71a of pushing-up device 7 and the second upper push-rod 71b are driven by lifting respectively by the not shown actuator (cylinder etc.) of difference extending along the vertical direction.Namely, keep the peristome inner side of platform 5 to dispose under the state of these the first upper push-rod 71a or the second upper push-rod 71b at wafer, the first upper push-rod 71a or the second upper push-rod 71b by rising be urged to almost with wafer thin slice under the position of side contacts, be positioned the directions X position of desirable bare chip thereafter, afterwards, upper distribution by drive motor (diagram omit) thus from the first upper push-rod 71a or the second upper push-rod 71b, drive and push away bare chip upward.In addition, the first upper push-rod 71a and the second upper push-rod 71b can change thickness of upper distribution etc. according to the size etc. of the element as above pushing away object.For example, by the upper distribution that diameter differs from one another is arranged in the first upper push-rod 71a and the second upper push-rod 71b, can distinguish and use the first upper push-rod 71a or the second upper push-rod 71b according to the size of element etc.

The first upper push-rod 71a and the second upper push-rod 71b can be urged to by lifting the height and position of two-stage., can be when making wafer keep platform 5 to take out while moving between the wafer receiving position (with reference to Fig. 2) that job position (with reference to Fig. 1) is closely close to wafer storage portion 170 for avoiding and the lower position of the interference of wafer maintenance platform 5 at element, and keep platform 5 to be arranged in above pushing away between position of readiness and driven by lifting of being closely close at the lower surface of the peristome inner side of bracket Wh wafer W under the state that element takes out job position (with reference to Fig. 1) at wafer, upper distribution can be in the first upper push-rod 71a or the second upper push-rod 71b that are built in position of readiness position and keep at wafer platform 5 upper surface more above element on driven by lifting between push position.

Withdrawing device 6 adsorbs the bare chip above being pushed away by pushing-up device 7 and consigns to the first head unit 41 and the second head unit 42.

The top position that this withdrawing device 6 takes out job position by the driver element of specifying at element in the horizontal direction (XY direction) is upper mobile.This driver element has following structure.

, taking out job position at element is provided with: a pair of overhead fixed guide 61 that separates appointed interval setting and extend parallel to each other along Y direction in X-direction; Two ends are supported on respectively the framework component 62 extending on fixed guide 61 and along X-direction movably; Be arranged on and approach the position of fixed guide 61 and extend and screw togather respectively a pair of ball screw 63 in the nut part (diagram omit) that is inserted in framework component 62 two ends along Y direction; Rotarily actuate a pair of framework drive motor 64 of ball screw 63.

The second guide rail (diagram is omitted) that is provided with the first guide rail (diagram is omitted) that is fixed on its front side and extend along X-direction and is fixed on its rear side and extends along X-direction on framework component 62.On the first guide rail, withdrawing device 6 is supported movably, and on the second guide rail, video camera 8 is supported movably.And framework component 62 comprises: extend and screw togather the ball screw (diagram is omitted) in the nut part (diagram omit) that is inserted in withdrawing device 6 along X-direction; Rotarily actuate the drive motor 65 of this ball screw; Extend and screw togather the ball screw (diagram is omitted) in the nut part (diagram omit) that is inserted in video camera 8 along X-direction; Rotarily actuate the drive motor 66 of this ball screw.That is, by the running of each framework drive motor 64, framework component 62 is moved along fixed guide 61, the movement that is accompanied by this framework component 62 is moved withdrawing device 6 and video camera 8 integratedly in Y direction.

In addition, by the running of drive motor 65, withdrawing device 6 is moved along X-direction in the Y-direction forward position of framework component 62, and by the running of drive motor 66, video camera 8 is moved in the Y-direction rearward position of framework component 62 along X-direction.The top position that withdrawing device 6 and video camera 8 take out job position at element accordingly can be distinguished independently in the horizontal direction in (XY direction) mobile.

The movable area of withdrawing device 6 in XY direction and the first head unit 41 and the movable area of the second head unit 42 in XY direction partially overlap.Accordingly, as described later, can realize from withdrawing device 6 to the first head unit 41 and the second head unit 42 is paid bare chip.In addition, as shown in Figure 3, the driver element of withdrawing device 6, video camera 8 and above-mentioned they is positioned at the more below of the first head unit 41 and the second head unit 42 and their driver element.Therefore,, although each movable area of the movable area such as withdrawing device 6 and the first head unit 41 and the second head unit 42 partially overlaps as described above, withdrawing device 6 can not interfered mutually with the first head unit 41 and the second head unit 42.

Withdrawing device 6 comprises a pair of wafer head (being called the first wafer head 6a, the second wafer head 6b).The first wafer head 6a and the second wafer head 6b are an example of " taking-up head " of the present invention.

The first wafer head 6a and the second wafer head 6b are the drum type head that comprises respectively a pair of suction nozzle 6e of downward-extension.Specifically, as shown in Figure 4, on the framework component 6c of withdrawing device 6, be provided with the driving of arranging with appointed interval and pass through the drive motor outside figure respectively with respect to liftable two the bracket component 6d of this framework component 6c on directions X, be provided with described the first wafer head 6a and the second wafer head 6b in the inner side of these bracket components 6d, and this first wafer head 6a can be around the state lower support of the axle rotation parallel with X-axis on each bracket component 6d in difference with the second wafer head 6b.

The each a pair of suction nozzle 6e of the first wafer head 6a and the second wafer head 6b is arranged on upper and lower diametical position, wherein the suction nozzle 6e of a side towards under time opposite side suction nozzle 6e towards directly over.The drive motor 6f in the outside by being separately positioned on two stands parts 6d rotarilys actuate the first wafer head 6a and the second wafer head 6b (that is, spinning upside down driving), thereby the position of described a pair of suction nozzle 6e replaces mutually.Namely, in withdrawing device 6, the first wafer head 6a and the second wafer head 6b arrange adjacent to each other, and drive motor 6f is arranged on outside it across a pair of wafer head 6a, 6b.Drive motor 6f is an example of " drive unit " of the present invention.

In addition, as shown in Figure 6, the suction nozzle 6e of the first wafer head 6a and the second wafer head 6b interval D 1 (arrangement pitch of X-direction) each other be equipped on element on the first head unit 41 install with interval D 2 each other of head 41a and be equipped on element on the second head unit 42 install with head 42a interval D 2 be each other same intervals.Accordingly, can install with two elements of head 41a or the second head unit 42 and install and use head 42a to pay two bare chips two of the first head unit 41 elements from two wafer heads (the first wafer head 6a and the second wafer head 6b) simultaneously.

Video camera 8 is for example for possessing the video camera of the capturing element such as CCD or CMOS.Video camera 8, take out bare chip from wafer W before, is taken as taking out the bare chip of object, and by its image signal output to control device 11.In addition,, when withdrawing device 6 is paid element to head unit, withdrawing device 6 moves to the position (element delivery position Y1) that approaches carrying device 2 most.Now, as shown in Figure 5, the mode overlapping with the Y-direction position of pushing-up device 7 with the Y-direction position Y2 of video camera 8 is determined the Y-direction position of pushing-up device 7.Accordingly, after carrying out the shooting of next element concurrently with the payment action of element, in the time carrying out the taking-up action of this next element, can make from paying element to head unit till taking out the amount of movement of the withdrawing device 6 of next element is Min. (from Y1Dao position, position Y2).

Fig. 7 represents the control system of this fitting machine 100 with block diagram.As shown in Figure 7, this fitting machine 100 comprises the control device 11 being made up of CPU and various memory, HDD etc.On this control device 11, be electrically connected with respectively (control valve of each lifting in the air flow circuit of cylinder that comprises drive motor 53, framework drive motor 64, drive motor 65, drive motor 66, drive motor 6f, other drive motors and upper push-rod 71a, 71b drives solenoid), video camera 8, the fixed cameras 9,10 etc. such as above-mentioned each drive motor, accordingly by the action of the control device 11 each portions of Comprehensive Control.In addition, on this control device 11, be electrically connected with the input unit outside figure, various information is inputted in the operation of operator based on this input unit, and also input comes from the output signal of the position detection unit such as encoder outside the figure being built in each drive motor.

Functional imperative as this control device 11 comprises: axle control part 11a, controls the driving of above-mentioned each drive motor or the driving solenoid of each control valve; Image processing part 11b, implements the processing of specifying to the picture signal that comes from each video camera (fixed cameras 9 and 10, video camera 41b, 42b etc.); I/O handling part 11c, controls the input of signal and the output of various control signals etc. that come from the transducer outside figure; Communication control unit 11d, control is communicated by letter with external device (ED); Storage part 11e, various programs or the various data such as storage installation procedure; Main operational part 11f, the above-mentioned each portion of Comprehensive Control also carries out various calculation process.

And this control device 11 is according to the each drive motor of predetermined program control etc., thereby control carrying device 2, wafer keeps platform 5, withdrawing device 6, pushing-up device 7, the first head unit 41 and the second head unit 42 etc.Accordingly, carry out wafer W with respect to the discrepancy of wafer storage portion 170, from wafer W, take out bare chip and utilize the first head unit 41 and a series of actions (element installation action) such as the second head unit 42 installation elements.

Then with reference to Fig. 8, the control of the element installation action that utilizes this control device 11 is described.

First,, in step S1, control device 11 passes through to control carrying device 2, thereby printed circuit board (PCB) P is moved in fitting machine 100.Then,, in step S2, control device 11 passes through to control carrying device 2, thereby printed circuit board (PCB) P is arranged to the first job position S1 and the second job position S2, and is fixed under this state.

Afterwards, in step S3, control device 11 keeps platform 5 by controlling wafer, thereby extracts wafer W out from wafer storage portion 170.Particularly, thus by the driving of drive motor 53 make wafer keep platform 5 move to wafer receiving position (with reference to Fig. 2).Then, by not shown discrepancy mechanism, wafer W (bracket Wh) being retracted to wafer from wafer storage portion 170 keeps platform 5.Then,, in step S4, the wafer W of extraction is fixed on to wafer and keeps on platform 5.Afterwards, keep platform 5 by controlling wafer, taken out job position (with reference to Fig. 1) thereby be arranged on element.

Now, control device 11 makes wafer keep platform 5 to move, so that the Y-direction position of bare chip of object and the Y-direction position consistency of the upper distribution at the first upper push-rod 71a center of described pushing-up device 7 and the upper distribution at the second upper push-rod 71b center are taken out in conduct among the bare chip in wafer W.

Wafer W is arranged on element and takes out after job position, and in step S5, control device 11 passes through to control video camera 8, thereby carries out the shooting as the bare chip of taking-up object.Particularly, thereby by driving framework drive motor 64 that framework component 62 is moved in Y direction, thereby and by driving drive motor 66 that video camera 8 is moved in X-direction.Accordingly video camera 8 is arranged on as the top position of the bare chip of taking-up object (absorption object).And, make video camera 8 take this bare chip.Control device 11 is obtained the position (position deviation) of bare chip according to captured view data.In this case, control device 11 makes video camera 8 once or continuously take multiple bare chips as required.

Then, in step S6, the shooting results of control device 11 based on video camera 8, controls pushing-up device 7, withdrawing device 6 and wafer and keeps platform 5, make pushing-up device 7 upper distribution, withdrawing device 6 suction nozzle 6e and move to the same position in XY plane as the bare chip that takes out object.Particularly, pushing-up device 7 is moved in X-direction, thereby and by driving drive motor 53 to make wafer keep platform 5 to move in Y direction.Accordingly, the first upper push-rod 71a of pushing-up device 7 or the second upper push-rod 71b are moved, so that the lower position of the upper distribution at center in the bare chip as taking-up object.In addition, thereby by driving framework drive motor 64 that framework component 62 is moved in Y direction, thereby and by driving drive motor 65 that withdrawing device 6 is moved in X-direction.Accordingly, make the first wafer head 6a or the second wafer head 6b move to the top position of bare chip.

And control device 11 makes upper distribution rise (by driving) from the first upper push-rod 71a or the second upper push-rod 71b according to the size of element etc., thereby corresponding bare chip is upwards pushed away from its downside.Now, make the far-end end face of upper push-rod 71a or 71b produce negative pressure and adsorb the wafer thin slice that keeps being pasted with bare chip on one side, from the distal face central portion of upper push-rod 71a or 71b, push to distribution on one side.On the other hand, the first wafer head 6a or the second wafer head 6b are declined, the negative-pressure adsorption of the leading section by suction nozzle 6e is because above being pushed away the bare chip of peeling off from wafer thin slice.Accordingly, from wafer W, take out bare chip.The above action of taking out bare chip from wafer W is implemented successively for the first wafer head 6a and the second wafer head 6b respectively, and on each suction nozzle 6e, absorption maintains bare chip respectively.

Then,, in step S7, control device 11 is carried out the control of paying bare chip from withdrawing device 6 to head unit.Particularly, thereby control device 11 makes withdrawing device 6 move to the element delivery position (approaching the position of carrying device 2 most) of appointment by controlling withdrawing device 6, thereby and makes the first head unit 41 (or second head unit 42) move to element delivery position by controlling installation portion 4.Accordingly at element delivery position, by setting up and down to withdrawing device 6 and the first head unit 41 (or second head unit 42).

In moving process till withdrawing device 6 and the first head unit 41 (or second head unit 42) are arranged on element delivery position, thereby control device 11 makes the first wafer head 6a and the second wafer head 6b rotation by controlling two drive motor 6f.Make to be accordingly adsorbed on the bare chip upset (upset is ventricumbent state) on each suction nozzle 6e, and decline by the each element installation head 41a (or each element installation head 42a of the second head unit 42) that makes the first head unit 41, thereby for installing by two elements of the first head unit 41, head 41a (or two elements installation head 42a of the second head unit 42) adsorbs described bare chip.Accordingly, can carry out the payment of (or second head unit 42) from withdrawing device 6 to the first head unit 41 together of two bare chips simultaneously.

Then, in step S8, control device 11 makes the first head unit 41 move to fixed cameras 9 (being fixed cameras 10 when the second head unit 42) top, fixed cameras is taken be adsorbed on each element to install with the bare chip on head, and view data computing bare chip based on captured is installed the absorption deviation with head with respect to each element.

Then, in step S9, control device 11 is by the video camera 41b (42b) of the first head unit 41 (the second head unit 42), identification be fixed on printed circuit board (PCB) P on carrying device 2 with Datum identifier (diagram is omitted).Accordingly, control device 11 is identified the position deviation of printed circuit board (PCB) P with respect to carrying device 2.

And in step S10, control device 11, according to the position deviation of the absorption deviation of bare chip and printed circuit board (PCB) P, makes the first head unit 41 (the second head unit 42) move to the revised position of printed circuit board (PCB) P top.Then, make element install with head decline in the installation site of specifying, thereby bare chip is installed on printed circuit board (PCB) P.

Afterwards, in step S11, control device 11 judges whether the installation of all bare chips completes.While residue in addition as the bare chip of mounting object, return to step S5, continue installation action.

In addition, when the installation of all bare chips, in step S12, control device 11 is by controlling carrying device 2, thereby removes the fixing of printed circuit board (PCB) P.Then,, in step S13, control device 11 passes through to control carrying device 2, thereby printed circuit board (PCB) P is taken out of outside fitting machine 100.

Above the control of the element installation action being undertaken by control device 11 is illustrated, but the control shown in this flow process is the control example of element installation action the most basic while only bare chip being installed.Namely, when actual production printed circuit board (PCB) P, for production substrate P more efficiently, control device 11 is carried out a part that is kept multiple actions such as taking-up action and the installation action of head unit of the discrepancy action of platform 5 wafer W of carrying out, the bare chip that undertaken by withdrawing device 6 and pushing-up device 7 by wafer concurrently.For example, in this first execution mode, in the time paying bare chip from withdrawing device 6 to head unit or while utilizing head unit, to printed circuit board (PCB) P, bare chip is installed, the action that utilizes concurrently video camera 8 to take next installation elements.In addition, in the time successively bare chip being installed on multiple printed circuit board (PCB) P, return to step S1 from step S13, move into next printed circuit board (PCB) P implementation step S2, but in the time that wafer keeps also remaining bare chip in the wafer W on platform 5, skips steps S3 and S4.

In the first embodiment, as mentioned above, two elements installations of the first head unit 41 can receive with two elements installation head 42a of head 41a or the second head unit 42 chip element being adsorbed on respectively on the first wafer head 6a and the second wafer head 6b simultaneously, can once carry out accordingly the payment of two chip elements.Accordingly, when being undertaken by each chip element, to element, the action of paying chip element with head 41a or 42a is installed compared with, the increase of needed total ascent time is moved in the payment that can suppress multiple chip elements.

In addition, in the first embodiment, as mentioned above, the interval D 1 at the first wafer head 6a and the second wafer head 6bGe center (being only called below interval D 1) is made as with two elements of the first head unit 41 install with head 41a each other two elements installations of the interval D 2 at Ge center (being only called below D2) or the second head unit 42 with head 42a, the interval D 2 at Ge center (being only called below interval D 2) is identical each other.According to this structure, can be easy to, from two plates head 6a and 6b, two elements installation head 41a or two element installation head 42a are paid to chip element simultaneously.

In addition, in the first embodiment, about withdrawing device 6, two plates head 6a and wafer head 6b arrange adjacent to each other, and two drive motor 6f are arranged on outside across two plates head 6a and wafer head 6b.Therefore, owing to there is no drive motor between two plates head 6a and wafer head 6b, thereby can correspondingly dwindle the interval between two plates head 6a and wafer head 6b, therefore can be easy to make interval between two plates head 6a and wafer head 6b and the interval between the securement head of head unit to equate.

In addition, in the first embodiment, as mentioned above, by arrange with respect to pedestal 1 in the Y direction movably wafer keep platform 5, with respect to pedestal 1 pushing-up device 7 and with respect to pedestal 1 withdrawing device 6 movably on directions X movably on directions X, thereby need not make wafer keep platform 5 to move on directions X, just can carry out as taking out the bare chip of object and the contraposition of pushing-up device 7 and withdrawing device 6.Namely, owing to keeping platform 5 to move on directions X without making with respect to pushing-up device 7 and the large wafer of the flat Area comparison of withdrawing device 6, therefore can suppress fitting machine and increase at directions X.

In addition, in the first embodiment, as mentioned above, due to relatively removable in XY direction with respect to pushing-up device 7 withdrawing devices 6, thus different when fixing from pushing-up device 7 and withdrawing device 6, can inching pushing-up device 7 and the position of withdrawing device 6.Therefore, according to the first execution mode, the pushing-up device 7 while can suppression element taking-up and the position deviation of withdrawing device 6, thereby the bad generation of absorption that can suppression element.

In addition, in the first embodiment, wafer keeps platform 5 removable in the Y direction, and video camera 8 is also removable in the Y direction.Accordingly, when while carrying out the contraposition of this bare chip and video camera 8, keeping platform 5 and video camera 8 mode close to each other both are moved and carry out contraposition in order to take as taking out the bare chip of object with wafer.Therefore, according to this first execution mode, take with wafer that video camera is fixed in the Y direction and compare when only wafer keeps platform 5 to move and carries out the contraposition of video camera 8 and bare chip, can carry out at short notice contraposition.

In addition, in the first embodiment, as mentioned above, withdrawing device 6 is removable in the Y direction, and pushing-up device 7 is arranged in the Y direction regularly.Therefore, according to this first execution mode, compare withdrawing device 6 and pushing-up device 7 both sides structure movably in the Y direction, can carry out with cheap structure the contraposition of pushing-up device 7 for taking out bare chip and the Y-direction of withdrawing device 6.

In addition, in the first embodiment, as mentioned above, can with the action of paying bare chips from withdrawing device 6 to head unit 41,42 concurrently, or with utilize head unit 41,42 to printed circuit board (PCB) P install bare chip action concurrently, utilize video camera 8 to take and remain on the action that wafer keeps next bare chip being mounted on platform 5, can shorten accordingly the total ascent time that the payment of the shooting of next chip element and the installation of last element or chip element spends.

(variation of the first execution mode)

In the above-described first embodiment, the example that each first head unit 41 and the second head unit 42 is set respectively accordingly with the first job position S1 and the second job position S2 is illustrated, but shown in the fitting machine 200 of the variation of the first execution mode as shown in Figure 9, also can, by being supported on movably a head unit 202 on the framework component 201 extending along directions X, carry out installation exercise to the printed circuit board (PCB) P of the first job position S1 and the second job position S2.In addition, head unit 202 has the structure identical with described head unit 41 (or 42).

In addition, in the above-described first embodiment, withdrawing device 6 is set up in the Y direction movably, and pushing-up device 7 is set up in the Y direction regularly, but also withdrawing device 6 can be arranged in the Y direction regularly, and pushing-up device 7 is arranged in the Y direction movably.Accordingly, by pushing-up device 7 is moved in the Y direction, thereby can carry out the contraposition of pushing-up device 7 for taking out action and withdrawing device 6, by withdrawing device 6 is arranged in the Y direction regularly, thereby can make device (fitting machine), than withdrawing device 6 and pushing-up device 7, both are more cheap during in the Y direction for structure movably.In addition, also can by withdrawing device 6 and pushing-up device 7, both be configured to removable in the Y direction.According to this structure, fasten in the pass that keeps the Y-direction of platform 5 to move with wafer, with regard to withdrawing device 6 and pushing-up device 7, can adopt diversified move mode, its result, can improve the taking-up efficiency of bare chip.

(the second execution mode)

Then with reference to Figure 10 and Figure 11, the fitting machine 300 of the second execution mode of the present invention is described.In this second execution mode, to the example different from above-mentioned the first execution mode, the example that is provided with two withdrawing devices describes.

In the second execution mode, as shown in figure 10, be provided with two withdrawing devices (the first withdrawing device 301 and the second withdrawing device 302).The first withdrawing device 301 is identical with the withdrawing device 6 of above-mentioned the first execution mode with the second withdrawing device 302 structure separately.The first withdrawing device 301 be fixed on the front side of framework component 62 together with the second withdrawing device 302 and the figure that extended along X-direction outside fixed guide supported movably, and move respectively along this fixed guide.The driver element of the first withdrawing device 301 and the second withdrawing device 302 has following structure.

On framework component 62, be provided with the ball-screw (diagram is omitted) extending along X-direction.This ball screw is fixed on framework component 62.On the other hand, on the first withdrawing device 301, be provided with: screw togather and be inserted with the first hollow motor (diagram is omitted) that is connected in this first nut part under first nut part (diagram omit) of described ball screw and the state with described ball screw inleakage, in this external second withdrawing device 302, be provided with: screw togather and be inserted with the second hollow motor (diagram is omitted) that is connected in described the second nut part under second nut part (diagram is omitted) of described ball screw and the state with described ball screw inleakage.; rotarily actuate the first nut part by the first hollow motor; thereby the first withdrawing device 301 is moved along X-direction in the position of the front side of framework component 62; and rotarily actuate the second nut part by the second hollow motor, thereby the second withdrawing device 302 is moved along X-direction in the position of the front side of framework component 62.Accordingly, the top position that the first withdrawing device 301 and the second withdrawing device 302 take out job position at element in the horizontal direction (XY direction) is upper removable.

In addition, in the second execution mode, on the framework component 303 extending along directions X, be supported with along a movably head unit 304 of directions X.Framework component 303 is removable in the Y direction.By a head unit 304, install at the first job position S1 and the second job position S2.

As shown in figure 11, head unit 304 has four elements installation head 304a and video camera 304b.The element adjacent one another are of head unit 304 install with head 304a each other the interval D 1 between the interval D 3 at Ge center (being only called below interval D 3) and the interval D 1 of wafer head and the wafer head of the second withdrawing device 302 of the first withdrawing device 301 equate.Element installation is an example of " securement head " of the present invention with head 304a.

As the payment action of the chip element of the second execution mode, for example carry out after two elements of head unit 304 are installed the action with two chip elements of head 304a payment by the first withdrawing device 301 simultaneously, carry out, to remaining two elements of head unit 304, the action of paying two chip elements with head 304a is installed by the second withdrawing device 302 simultaneously.In addition, the first withdrawing device 301 and other structures of the second withdrawing device 302 are identical with the withdrawing device 6 of the first execution mode, and in addition, other structures of the fitting machine 300 of the second execution mode are identical with above-mentioned the first execution mode.

In addition, the effect of the second execution mode is identical with above-mentioned the first execution mode.

(variation of the second execution mode)

In the second execution mode, to being provided with a head unit 304, and the example of a head unit 304 being paid to the action of chip element successively by the first withdrawing device 301 and the second withdrawing device 302 is illustrated.Herein, when be provided with two head units (the first head unit 41 and the second head unit 42) as shown in above-mentioned the first execution mode time, also can be by respectively the first head unit 41 and the second head unit 42 being paid to action from the first withdrawing device 301 and the second withdrawing device 302, thus four chip elements can once be paid simultaneously.

(the 3rd execution mode)

Then with reference to Figure 12, Figure 13 and Figure 14, the fitting machine 400 of the 3rd execution mode of the present invention is described.In the 3rd execution mode, to the example different from above-mentioned the first execution mode that a withdrawing device 6 with two wafer heads is set, two examples with the withdrawing device of a wafer head are set and describe.

In the 3rd execution mode, as shown in Figure 12 and Figure 13, be provided with two withdrawing devices (the first withdrawing device 401 and the second withdrawing device 402).The first withdrawing device 401 is supported on movably on the fixed guide extending along X-direction in the front side of framework component 62 together with the second withdrawing device 402.The first withdrawing device 401 and the second withdrawing device 402, by utilizing the mechanism of the hollow motor same with above-mentioned the second execution mode, can move along X-direction independently of one another on the fixed guide of framework component 62.

In addition, the first withdrawing device 401 and the second withdrawing device 402 have respectively a wafer head 401a and 402a.

Specifically, wafer head 401a is the drum type head that comprises a pair of suction nozzle 401d of downward-extension.On the framework component 401b of the first withdrawing device 401, be provided with the liftable bracket component 401c with respect to this framework component 401b, wafer head 401a is being supported on this bracket component 401c around the state of the axle rotation parallel with X-axis.Wafer head 401a is arranged on the second withdrawing device 402 sides on bracket component 401c, by being arranged on the driving of drive motor 401e of opposition side of the second withdrawing device 402 sides on bracket component 401c, make wafer head 401a rotation, thereby the position of a pair of suction nozzle 401d replaces mutually.

Wafer head 402a is also similarly the drum type head of a pair of suction nozzle 402d that comprises upper downward-extension with above-mentioned wafer head 401a, it is being supported on the bracket component 402c on the framework component 402b that is liftably located at the second withdrawing device 402 around the state of the axle rotation parallel with X-axis.Wafer head 402a is arranged on the first withdrawing device 401 sides on bracket component 402c, by being arranged on the driving of drive motor 402e of opposition side of the first withdrawing device 401 sides on bracket component 402c, make wafer head 402a rotation, thereby the position of a pair of suction nozzle 402d replaces mutually.Namely, the wafer head 401a of the wafer head 402a of the second withdrawing device 402 and the first withdrawing device 401 is set to face with each other, and the drive motor 402e of the drive motor 401e of the first withdrawing device 401 and the second withdrawing device 402 is arranged on outside across wafer head 402a and 401a.Other structures of the fitting machine 400 of the 3rd execution mode are identical with above-mentioned the first execution mode.Wafer head 401a and wafer head 402a are examples of " taking-up head " of the present invention.

The 3rd execution mode comprise first head unit 420 and second head unit 421 this two head units same with the first execution mode.The structure of the first head unit 420 and the second head unit 421 is identical with the head unit 304 of the second execution mode, and each head unit 420,421 comprises respectively four elements installation head 420a, 421a and video camera 421b, 421b.In this example, with head 420a, the interval D 5 at Ge center (being only called below interval D 5) is equal each other in the element installation adjacent one another are of the first head unit 420.The second head unit 421 too.

As taking-up action and the payment action of the 3rd execution mode, first, the wafer head 402a of the wafer head 401a of the first withdrawing device 401 and the second withdrawing device 402 takes out respectively chip element (bare chip).Then, by least one of mobile the first withdrawing device 401 and the second withdrawing device 402, thereby the first withdrawing device 401 and the second withdrawing device 402 are moved to the delivery position of appointment.Here, in the 3rd execution mode, as shown in figure 13, control device (diagram omit) is controlled the first withdrawing device 401 and the second withdrawing device 402, equates with the element installation interval D 5 of head 420a or the element of the second head unit 421 installation interval D 5 of head 421a of the first head unit 420 with the interval (suction nozzle 401d with the interval D 4 at suction nozzle 402d Ge center, be only called interval D 4 below) that makes the wafer head 401a of the first withdrawing device 401 and the wafer head 402a Ge center of the second withdrawing device 402 at delivery position.

Then, with above-mentioned the first execution mode similarly, from the wafer head 401a of the first withdrawing device 401 and the wafer head 402a of the second withdrawing device 402, two of the first head unit 420 elements are installed and are paid chip element with two elements installation head 421a of head 420a or the second head unit 421 simultaneously.

In the 3rd execution mode, as mentioned above, from the first withdrawing device 401 and the second withdrawing device 402 to the first head unit 420 or when the second head unit 421 pays chip element, at least one that makes the first withdrawing device 401 and the second withdrawing device 402 moves, and installs by head 421a interval D 5 each other identical so that two elements of the interval of the wafer head 401a of the first withdrawing device 401 and the wafer head 402a of the second withdrawing device 402 and the first head unit 420 are installed by interval D 5 each other of head 420a or two elements of the second head unit 421.According to this structure, utilize the wafer head 401a of the first withdrawing device 401 and the wafer head 402a of the second withdrawing device 402 that can move independently each other, four elements that the chip element of each wafer head can be consigned to simultaneously to head unit are installed two element installation heads with arbitrary neighborhood among head.

In addition, as shown in figure 14, in the 3rd execution mode, also can be configured to from the first withdrawing device 401 and the second withdrawing device 402 to the first head unit 420 or when the second head unit 421 pays chip element, at least one that makes as required the first withdrawing device 401 and the second withdrawing device 402 moves, so that installing, install with two times of head 421a interval D 5 each other or three times (integral multiple) with two elements of interval D 5 each other of head 420a or the second head unit 421 by two elements that the interval D 4 of the wafer head 402a of the wafer head 401a of the first withdrawing device 401 and the second withdrawing device 402 is the first head unit 420.Accordingly, utilize the wafer head 401a of the first withdrawing device 401 and the wafer head 402a of the second withdrawing device 402 that can move independently each other, four elements that the chip element that wafer head 401a, 402a can be kept respectively consigns to the first head unit 420 are simultaneously installed and are used any two of head 421a with four elements installations of any two or the second head unit 421 of head 420a.In addition, other effects of the 3rd execution mode are identical with above-mentioned the first execution mode.

In addition, should think that all contents of above-mentioned disclosed execution mode all just exemplify, and non-limiting.Scope of the present invention be can't help shown in the explanation of above-mentioned execution mode and by shown in the scope of the technical scheme suitable with summary of the invention, and it also comprises and the connotation of the scope equalization of described technical scheme and all changes within the scope of this.

For example, in the above-mentioned first to the 3rd execution mode, show the example that two or four element installation head is set as the head unit of installation portion 4, but the present invention is not limited to this, head unit can also comprise three or five above element installation heads.In addition, withdrawing device also can comprise three above taking-up heads.

In this case, in the above-described first embodiment, can be for example install on the basis with head 41a (42a) with the element that uniformly-spaced D2 arranges more than three the first head unit 41 (or second head unit 42) is upper, the first wafer head 6a and the second wafer head 6b of withdrawing device 6 is set with the integral multiple of the interval D 2 of head 41a (42a) taking the first wafer head 6a of withdrawing device 6 and the interval D 1 of the second wafer head 6b as described element installation.Accordingly, can install with head 41a (42a) or between them, exist even multiple elements two elements adjacent one another are and two elements installation head 41a (42a) that separate with head 41a (42a) are installed pay chip element simultaneously.This point, with in the second execution mode, in head unit 202,304, arrange more than three element install with the situation of head too.

In addition, in the above-described first embodiment, showing via withdrawing device 6 makes bare chip be adsorbed in the example on head unit 41,42, but the present invention on this basis, can also make suction nozzle 41a, the 42a of head unit 41,42 can arrive the wafer W on wafer maintenance platform 5, thereby head unit 41,42 just can directly not adsorb bare chip via withdrawing device 6.; also can be according to the kind of bare chip, select to carry out under ventricumbent state, keep bare chips by head unit 41,42 absorption via withdrawing device 6 and be installed to action on printed circuit board (PCB) P or not via withdrawing device 6 but under supine state directly absorption keep bare chip and be installed to the action on printed circuit board (PCB) P.Second and the 3rd execution mode too.

In this case, as shown in the above-mentioned first to the 3rd execution mode, when the movable range of the Y-direction of head unit is set to carrying device 2 and is closely close to, pushing-up device need to be arranged on to carrying device 2 and closely be close to, or pushing-up device is configured to removable so that this pushing-up device is movable to carrying device 2 is closely close in the Y direction.In addition, even as first execution mode etc., pushing-up device is in the time that element taking-up job position is fixed in the Y direction, also can take out job position by the movable range of the Y-direction of head unit being expanded to element, thereby head unit just can directly not adsorb bare chip via withdrawing device.

In addition, in the above-described first embodiment, as shown in Figure 5, Y-direction position Y2 with video camera 8 in the time that withdrawing device 6 is paid element to head unit 41,42 arranges (fixing in the Y direction) pushing-up device 7 with the mode that the Y-direction position of pushing-up device 7 overlaps, but the present invention is not limited to this.(fixing in the Y direction) pushing-up device 7 is set between the Y-direction position Y2 of the Y-direction position Y1 of withdrawing device 6 that, also can be in the time that element is paid and video camera 8 now.In this case, after carrying out the shooting of next element concurrently with the payment action of element, in the time carrying out the taking-up action of this next element, can make withdrawing device 6 and wafer keep platform 5 (taking-up object elements) to move in the Y direction and contraposition above pushing-up device 7 close to each otherly.Accordingly, can further shorten to head unit 41,42 and pay element till take out the time of next element.In addition, when the Y-direction translational speed of withdrawing device 6 keeps the translational speed of platform 5 to equate with wafer, pushing-up device 7 is arranged to (fixing in the Y direction) centre at position Y1 and position Y2.When the Y-direction translational speed of withdrawing device 6 is less than the translational speed of wafer maintenance platform 5, according to its speed difference, pushing-up device 7 is arranged on to the Y1 place, more close position, centre of position Y1 and position.

In addition, in the above-described first embodiment, show the example that uses ball screw to drive wafer maintenance platform 5, withdrawing device 6, pushing-up device 7, position of components identification video camera 8 etc., but the present invention is not limited to this, can also use other driving mechanisms such as linear motor.In addition, show the example that uses linear motor to drive to head unit 41,42, but the present invention is not limited to this, also can use ball screw to drive.Second, third execution mode too.

In addition, in the above-described first embodiment, show two wafer head 6a, 6b and the example of two the drive motor 6fs corresponding with them are respectively set in a withdrawing device 6, but the present invention is not limited to this., also can spin upside down and drive two (multiple) wafer head 6a, 6b by a drive motor.In this case, comparatively it is desirable to also drive motor is arranged on the outside of two wafer head 6a, 6b.The second execution mode too.

In addition, in the above-described first embodiment, keep platform 5 only removable in the Y direction to wafer, and withdrawing device 6 and pushing-up device 7 on directions X movably example be illustrated, but the present invention is not limited to this, it can be also removable in XY direction that wafer keeps platform 5.In this case, for example, when pushing-up device 7 is fixed in XY direction (when withdrawing device 6 is fixed), by making wafer keep platform 5 to move in directions X and Y-direction, thereby can make move to the extracting position being clipped by wafer head 6a, 6b and the pushing-up device 7 of withdrawing device 6 and take out action as the chip element that takes out object.Second, third execution mode too.

In addition, in the above-described 3rd embodiment, show the example that a wafer head 401a (401b) is set respectively on the first withdrawing device 401 and the second withdrawing device 402, but the present invention is not limited to this, can also on the first withdrawing device 401 and the second withdrawing device 402, multiple wafer heads be set respectively.

The present invention described above is summarized as follows.

Fitting machine involved in the present invention comprises: pedestal; Wafer keeps platform, can keep chip element; Pushing-up device, has from below and pushes away and remain on the mechanism that described wafer keeps the chip element on platform; Multiple taking-up heads, for adsorbing the chip element above being pushed away by described pushing-up device; Head unit, has for described chip element being received from described taking-up head and this chip element being installed to the multiple securement heads substrate; Wherein, each securement head of described multiple securement heads receives the described chip element that described multiple taking-up head adsorbs respectively simultaneously.

In this fitting machine, as mentioned above, multiple securement heads can side by side receive the chip element being attracted to respectively on multiple taking-up heads, therefore can once carry out the payment of multiple chip elements.Therefore, and undertaken by each chip element paying compared with the situation of action of chip element to securement head, the increase of needed total ascent time is moved in the payment that can suppress multiple chip elements.

In fitting machine involved in the present invention, comparatively it is desirable to, arrangement pitch between each taking-up head of described multiple taking-up heads, at least in the time paying described chip element from described taking-up head to described head unit, identical with the arrangement pitch between each securement head of described multiple securement heads of described head unit.According to this structure, can be easy to, from multiple taking-up heads, multiple securement heads are side by side paid to chip element.

In the case, comparatively it is desirable to also comprise: withdrawing device, has described multiple taking-up head; Arrangement pitch between each taking-up head of described multiple taking-up heads that wherein, described withdrawing device has is identical with the arrangement pitch between each securement head of described multiple securement heads of described head unit.According to this structure, can be easy to, from multiple taking-up heads of withdrawing device, multiple securement heads are side by side paid to chip element.

In addition, there is the suction nozzle for adsorbing described chip element at described taking-up head, this taking-up head is by spinning upside down the described chip element upset that makes the absorption of described suction nozzle for upwards, described securement head is attracted on described suction nozzle by absorption and is reversed and receives the situation of this chip element from described taking-up head for described chip element upwards, and have in the structure of multiple taking-up heads at described withdrawing device, comparatively it is desirable to, described withdrawing device has two and takes out head as described multiple taking-up heads, and there is the drive unit for described taking-up head is spun upside down, described two are taken out head setting adjacent one another are, described drive unit is arranged on described two outsides of taking out head.According to this structure, owing to taking out between head and there is no drive unit at two, thereby can correspondingly dwindle two intervals of taking out between head, therefore can be easy to make securement head that two of withdrawing device take out interval between heads and head unit interval each other to equate.

In addition, have in the structure of multiple taking-up heads at described withdrawing device, comparatively it is desirable to, described withdrawing device comprises: the first withdrawing device that at least has a described taking-up head and can move on horizontal plane; The second withdrawing device that at least there is a described taking-up head and can move on horizontal plane independently with described the first withdrawing device; Wherein, at least one of described the first withdrawing device and described the second withdrawing device, in the time that the taking-up head of the taking-up head from described the first withdrawing device and described the second withdrawing device is paid described chip element to described head unit, be moved into arrangement pitch between each securement head of multiple securement heads of interval between the taking-up head of described the first withdrawing device and the taking-up head of described the second withdrawing device and described head unit identical.According to this structure, use the taking-up head of the first withdrawing device and the taking-up head of the second withdrawing device that can move independently each other, can pay to multiple securement heads of head unit the chip element of each taking-up head simultaneously.

In addition, have in the structure of multiple taking-up heads at above-mentioned withdrawing device, comparatively it is desirable to, described wafer keeps platform in orthogonal Y-direction, can moved on horizontal plane by the directions X of conveyance with described substrate with respect to described pedestal, described pushing-up device at least can move with respect to described pedestal on described directions X, and described withdrawing device at least can move with respect to described pedestal on described directions X.According to this structure, even if do not make wafer keep platform to move on directions X, by pushing-up device and withdrawing device are moved on directions X, also can carry out as taking out the element of object and the contraposition of pushing-up device and withdrawing device.Accordingly, due to without making the wafer that flat Area comparison is large keep platform to move on directions X, therefore can suppress fitting machine and increase on horizontal plane directions X.

In fitting machine involved in the present invention, comparatively it is desirable to, described wafer keep platform with respect to described pedestal described substrate by the directions X of conveyance on and in orthogonal Y-direction, can move on horizontal plane with described directions X.According to this structure, by making wafer keep platform to move in directions X and Y-direction, thereby can make the extracting position moving between taking-up head and the pushing-up device in withdrawing device as the chip element that takes out object take out action.

Claims (5)

1. a fitting machine, is characterized in that comprising:

Pedestal;

Wafer keeps platform, can keep chip element;

Pushing-up device, has from below and pushes away and remain on the mechanism that described wafer keeps the chip element on platform;

Withdrawing device, has multiple taking-up heads, and described taking-up head has the suction nozzle for adsorbing the chip element above being pushed away by described pushing-up device and the drive unit for spinning upside down;

Head unit, has for described chip element being received from described taking-up head and this chip element being installed to the multiple securement heads substrate; Wherein,

Described withdrawing device comprises: the first withdrawing device that at least has a described taking-up head and can move on horizontal plane; The second withdrawing device that at least there is a described taking-up head and can move on horizontal plane independently with described the first withdrawing device;

Described fitting machine also comprises control device, described control device is controlled as follows: in the time that the taking-up head of the taking-up head from described the first withdrawing device and described the second withdrawing device is paid described chip element to described head unit, the suction nozzle that at least one that makes described the first withdrawing device and described the second withdrawing device is moved into the taking-up head of being located at described the first withdrawing device equates with the arrangement pitch of multiple securement heads of described head unit with the interval of being located between the suction nozzle of taking-up head of described the second withdrawing device, make each securement head of described multiple securement heads receive the described chip element that described multiple taking-up head adsorbs respectively simultaneously.

2. fitting machine according to claim 1, is characterized in that:

The taking-up head setting adjacent one another are of described the first withdrawing device and described the second withdrawing device, described drive unit is arranged on the outside of the taking-up head of described the first withdrawing device and described the second withdrawing device.

3. fitting machine according to claim 1, is characterized in that:

It is identical that described control device makes at least one taking-up head at the taking-up head from described the first withdrawing device and described the second withdrawing device of described the first withdrawing device and described the second withdrawing device in the time that described head unit is paid described chip element, be moved into arrangement pitch between each securement head of multiple securement heads of interval between the taking-up head of described the first withdrawing device and the taking-up head of described the second withdrawing device and described head unit.

4. fitting machine according to claim 1, is characterized in that:

Described wafer keeps platform in orthogonal Y-direction, can moved on horizontal plane by the directions X of conveyance with described substrate with respect to described pedestal,

Described pushing-up device at least can move with respect to described pedestal on described directions X,

Described the first withdrawing device and described the second withdrawing device at least can move with respect to described pedestal on described directions X.

5. fitting machine according to claim 1 and 2, is characterized in that:

Described wafer keep platform with respect to described pedestal described substrate by the directions X of conveyance on and in orthogonal Y-direction, can move on horizontal plane with described directions X.