JP3187774B2 - Surface mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to minute electronic components such as ICs, resistors, capacitors and the like (hereinafter referred to as chip components).
The present invention relates to a surface mounter for mounting a substrate on a substrate.

[0002]

2. Description of the Related Art Conventionally, such a surface mounter has X and Y axes perpendicular to each other, and an X-axis component member is movably mounted along a Y axis on a Y axis such as a rail. The mainstream is that a head on which a chip component is sucked and mounted on a shaft component member is movably provided along the X axis so that the head is moved in an XY plane.

In addition, a rotary head type for speeding up as shown in FIG. 15 has been proposed. That is, in this mounting machine, the chip components supplied from the feeder 22 are mounted on the substrate P by the rotary head 30 rotating in the direction of the arrow shown in the figure.

[0004]

In this type of mounting machine,
It is necessary to process a large number of substrates, and it is desired that the loading and unloading of the substrate by the transfer line and the mounting of components on the substrate be performed efficiently.

[0005] Further, in the above-described structure in which the head is provided so as to be movable in the X-axis direction on the X-axis member movable in the Y-axis direction, the head is moved in the Y-axis direction together with the X-axis member. Although it also moves in the axial direction, it is natural to adopt a structure in which the operation in the X-axis direction and the operation in the Y-axis direction are made independent in the mounting work in consideration of speeding up the operation in each of the X and Y axes. Yes, it seems simple and efficient.

Incidentally, in the rotary head type mounting machine shown in FIG. 15, the apparatus becomes large and the mechanism becomes complicated and expensive in order to cope with various kinds.

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a surface mounting machine which can further improve the efficiency of mounting work and is advantageous in terms of downsizing and the like.

[0008]

According to one aspect of the present invention, there is provided an apparatus for mounting a chip component supplied from a feeder on a substrate conveyed on a conveyance line. A first and second work stations for receiving a substrate from the transport line and holding the substrate in a state where components can be mounted thereon;
First and second component supply units disposed on both sides of the transfer line;
(A first head mounted on the board on the second work station) and a second head mounted on the board on the second work station by sucking a component from the second component supply unit. Claim 1).

According to this device, since two sets of heads and work stations are provided for a single transport line, high mounting efficiency is achieved by independent mounting operations of these.

In particular, in this device, the first and second
If the work stations are provided so as to be movable in the Y-axis direction orthogonal to the X-axis direction, and the first and second heads are respectively provided so as to be movable in the X-axis direction (claim 2), By increasing the speed of each work station, mounting efficiency can be further improved.

In this apparatus, preferably, the first and second X axes are arranged in parallel along the transport line,
The first and second heads are movably mounted on these X-axes, respectively, and first and second recognizing means for recognizing a suction state of a component sucked by the heads are provided. A first component supply unit, a first recognition unit, and a first work station are arranged from one side along one X axis, while a second component supply unit is arranged from the opposite side along the second X axis. Unit, the second recognizing means and the second work station are arranged, and the first component supply unit and the second work station are arranged so as to overlap each other in the X-axis direction. It is assumed that the first work stations are arranged so as to overlap in the X-axis direction (claim 3).

[0012] With this configuration, the suction state of the components can be recognized while each head is moving from the component supply unit onto the printed circuit board, so that the suction, recognition and mounting of the components can be performed efficiently. In addition, the first component supply unit and the second work station are arranged in the X-axis direction, and the second component supply unit and the first work station are arranged in the X-axis direction. The configuration in the direction becomes compact. Therefore, a rational configuration that achieves both improvement in mounting efficiency and space saving is achieved.

[0013]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a surface mounter according to the present invention,
FIG. 2 is a front view, and FIG. 3 is a side view.

In the illustrated surface mounter 1, reference numeral 2 denotes a base, and a transfer line L for transferring a substrate P in the direction indicated by an arrow (X-axis direction) is provided at the center of the base 2 in the width direction. Have been. The transfer line L is specifically constituted by a transfer device 3 (see FIG. 3).

An X-axis extending in a direction along the transfer line is fixedly provided on at least one side of the transfer line L of the substrate on the base 2, and in the present embodiment, the transfer line L is An X1 axis 4A (first X axis) and an X2 axis 4B (second X axis) composed of two rails that are long in the X axis direction are laid in parallel to each other on the left and right sides of the sandwich. A head 5 for adsorbing chip components (not shown) and mounting them on the substrate P is mounted on the X1 axis 4A and the X2 axis 4B.
A and 5B (first and second heads) are movably supported in the X-axis direction.

Here, the structure of the support and drive system for the one head 5A will be described with reference to FIGS. FIG. 4 is a front view showing a state in which the X1 shaft 4A and the head 5A are removed, and FIG. 5 is a sectional view taken along line AA of FIG.

As shown in FIG. 5, the X1 shaft 4A is mounted above and below a frame 6 which is long in the X direction, and the head 5A is movably supported by the X1 shaft 4A. Under the head 5A, a plurality of (in this embodiment, 16 as shown in FIG. 2) suction nozzles 7 for vacuum-suctioning chip components are arranged and supported so as to be arranged in the X-axis direction. 5A is connected to a flexible U-shaped duct 8 for accommodating electric wiring, air pipes and the like.

Also, as shown in FIG.
A servomotor 9 is fixedly mounted at one end, and an output shaft of the servomotor 9 is connected to one end of a ball screw 10 extending horizontally in the X-axis direction. The other end of the ball screw 10 is rotatably supported by a bearing member 11.

A floating slider 12 is screwed to the ball screw 10 so as to be movable in the X-axis direction along the ball screw 10. The head 5A is attached to the floating slider 12.

Therefore, when the servo motor 9 is driven to rotate the ball screw 10 forward or backward, the floating slider 12 screwed to the ball screw 10 moves, and the head 5A moves along with the floating slider 12 along the X1 axis 4A. Reciprocates in the X-axis direction.

Although the structure of the supporting and driving system of one head 5A has been described above, the structure of the other head 5B is the same, so that the description thereof will be omitted.

On the other hand, as shown in FIG.
Work stations S1 and S2 (first and second work stations) that move during work are provided at positions outside the A and X2 axes 4B and point-symmetric with respect to the transport line L. ing. Each work station S1,
S2 is a Y perpendicular to the X1 axis 4A and the X2 axis 4B.
It slides on one axis 13A and Y2 axis 13B. Each of the work stations S1 and S2 is provided with substrate holding devices 14A and 14B for receiving and holding the substrate P on the transport line L.

Here, the configuration of one work station S1 will be described with reference to FIGS. FIG. 6 is a plan view of the work station S1, and FIG. 7 is a side view thereof.

The Y1 axis 13A is disposed on the left and right sides of the base 15 in parallel with each other, and the work station S1 is supported on the Y1 axis 13A so as to be movable along the Y axis.

The servo motor 1 is connected to one end of the base 15.
The output shaft of the servo motor 16 is connected to one end of a ball screw 17 extending horizontally in the Y-axis direction. The other end of the ball screw 17 is a bearing member 18
It is rotatably supported by.

A slider 19 is screwed to the ball screw 17 so as to be movable in the Y-axis direction along the ball screw 17, and a work station S1 is attached to the slider 19. Therefore, if the servomotor 16 is driven to rotate the ball screw 17 forward / reverse, the ball screw 17
The slider 19 that is screwed into the
9, the work station S1 attached to the Y1 axis 13
Reciprocates in the Y-axis direction along A. In the figure, reference numeral 20 denotes a flexible U-shaped duct for accommodating electric wiring and the like therein.

The above is one of the work stations S1
Has been described, but the other work station S
2 is the same as that described above, and a description thereof will be omitted.

A transfer device 21 for transferring a substrate P between the transfer line L and the work stations S1 and S2 is provided above the transfer line L. FIG.
As shown in FIG. 2, feeders 22A-1 (first component supply units) and 22A- for continuously supplying chip components (not shown) are provided on both sides of each of the work stations S1 and S2.
2, 22B-1 (second component supply unit) and 22B-2 are provided respectively. Further, between the feeder 22A-1 and the work station S1, and between the feeder 22B-2.
The component recognition cameras 86A and 86B (first and second imaging means) are arranged below the X axis between the work station S2 and the work station S2. During the upward movement, components adsorbed by the plurality of nozzles are continuously recognized based on the images captured by the cameras 86A and 86B.

That is, the layout configuration of this apparatus is such that the X1 axis 4A and the X2 axis 4B are disposed on both sides of the transfer line L of the substrate P, and from one side (the left side in the figure) along one X1 axis 4A. Feeder 22A-1, camera 8 for component recognition
6A, work station S1 and feeder 22A-
2, the feeder 22B-1, the component recognition camera 86B, the work station S2, and the feeder 22B-2 are arranged from the opposite side (the right side in the figure) along the other X2 axis 4B. ing. In particular, in the present embodiment, as shown in FIG.
-1 and the work station S2 are arranged so as to overlap in the X-axis direction, while the feeder 22B-1 and the work station S1 are arranged so as to overlap in the X-axis direction. It is compact.

Each of the feeders 22A-1, 22A-
2, 22B-1 and 22B-2 each include a plurality of rows of tape feeders 22.
2 are arranged in the X-axis direction. The structure of the tape feeder 22 and a portion to which the tape feeder 22 is attached are as shown in FIG. 8 which is a side view of the feeder assembly portion and FIG. 9 which is an enlarged side view.

That is, the main body of the tape feeder 22 comprises a front side feeder plate 23 and a rear side reel plate 24, and a reel 25 is rotatably mounted on the reel plate 24. A tape 26 containing the components is wound. The reel plate 24 is connected to the feeder plate 23 so that the reel 25 can be easily replaced.
And the feeder plate 23 is attached to a feeder installation portion of the base 2 by knock pins 27 and 28 and a mounting bracket 29.

The tape 26 has a tape main body 26a having a large number of component storage portions (not shown) opened upward at predetermined intervals, and a cover tape adhered to the upper surface of the tape main body 26a to cover each component storage portion. 26b, and
A chip component is stored in each of the component storage sections.

At the front end of the feeder plate 23, a component take-out portion 30 is provided. The tape 26 led out from the reel 25 is guided to the component take-out portion 30, where the cover tape 26b is taped. Body 26
a, and the chip component can be taken out. When the component is taken out, the head 5A (5B) is lowered to a predetermined height at the X-axis direction position corresponding to the component take-out part 30. Then, the chip component is sucked from the tape 26 by the suction nozzle 7 and is taken out.
Then, the tape feed-out mechanism is adapted to feed out the tape 26 by a fixed amount in accordance with the component pick-up operation. After the parts are taken out, the tape main body 26a is connected to the guide wall 31 provided at the front end of the feeder plate 23.
And discharged downward through the tape main body lead-out passage 32,
The cover tape 26 b includes guide rollers 33 and 34 and a take-up roller 35 disposed on the feeder plate 23.
It is discharged downward through.

The tape feeding mechanism includes a component pick-up unit 30
And a ratchet 37 connected to the sprocket 36. The sprocket 36 is adapted to engage with an engaging hole (not shown) provided in the tape 26. . A feed claw 38 and a stopper 39 are provided for the ratchet 37. Further, the input side of the ratchet 37 is connected to a ratchet driving mechanism, and the head 5A (5B) at the time of picking up parts is used.
The ratchet 37 is driven in accordance with the operation of.

The ratchet drive mechanism may be a mechanism that operates mechanically in conjunction with the head when the head is lowered to a predetermined height position. However, in this embodiment, in order to reduce the cycle time, a feeder plate is used. An air cylinder 40 is provided at 23, and the air cylinder 40 is connected to the input side of the ratchet 37 via a lever 41 and a link 42.

The air cylinder 40 is connected to a solenoid valve 43 provided on the base 2 via an air flow path. In the illustrated example, one knock pin 27 for attaching the feeder plate to the base 2 is also used as an air joint, and the air circulation hole 44 formed in the knock pin 27 is connected to the air cylinder 40 via the air passage 45 and the hose 46. At the same time, the knock pin engagement hole 47 of the base 2 is connected to the solenoid valve 43 via an air joint 48 and a hose 49 and the like.
The connection of the air circulation path to the air cylinder 40 is also achieved at the same time as the fitting of 7.

The solenoid valve 43 is driven in synchronization with the operation of the head by a control means (not shown) so that the ratchet 37 is driven during the lowering operation of the heads 5A and 5B so that the cycle time is shortened. Has become.

The transfer device 21 is shown in FIG. 10 which is a schematic front view, FIG. 11 which is an enlarged front view, FIG. 12 which is an enlarged side view, and FIG. 13 which is an enlarged bottom view. It has a simple structure.

That is, the transfer device 21 is connected to the transport line L
, A transfer claw unit 52 provided with transfer claws 53, 54, and 55 for transferring substrates, and this transfer claw unit 52 is fixed to the fixed frame 51.
And supporting means for movably supporting in the transport direction and the vertical direction, and driving means for each direction.

The transfer claw unit 52 includes a pair of claw mounting brackets 56 and 57 having a predetermined length in the transport direction.
And one bracket 56 is fixedly attached to the holding frame 58. The upper end of the other bracket 57 is screwed to a screw shaft 59 rotatably mounted on the holding frame 58 so that the distance between the other bracket 57 and the one bracket 56 can be adjusted according to the size of the substrate or the like. At the end of the screw shaft 59, a handle 60 for adjusting the interval is provided.

Each of the two brackets 56 and 57 is provided with a transfer claw 5 at three locations at predetermined intervals in the transport direction.
3, 54 and 55 are attached. On the other hand, the transport line L includes a position immediately before the work station S1, a position on the downstream side in the transport direction corresponding to the work station S1, and a position on the downstream side in the transport direction corresponding to the work station S2. Are provided with first, second, and third stoppers 61, 62, and 63, and cylinders 64, 65, and 66 that extend and retract the stoppers 61 with respect to the transport line L. Stoppers 61, 6
Sensors 67 for detecting a substrate are arranged before and after 2, 63 and at the downstream end position of the transport line, respectively (see FIG. 14). In order to achieve the operation described below, the distance between each of the transfer claws 53 to 55 is set to be equal to each of the stoppers 61 to 6.
3 are substantially equal to each other, but there are some manufacturing errors in these distances. In order to absorb the errors and reduce the shock, the transfer claws 53 to 55 use the springs 68 for the brackets 56 and 57. It is attached so that some movement can be elastically allowed through.

The supporting means and the driving means of the transfer device 21 include a first movable member 71 movably attached to the fixed frame 51 via a guide 70 in the transport direction, and a servo for driving the member 71. A transport direction driving mechanism including a motor 72, a pulley 73, a belt 74, and the like;
A second movable member 76 is attached to the first movable member 71 via a guide 75 so as to be able to move up and down, an elevating cylinder 77 for driving the member 76, and a second movable member 76. Movable member 79 movably mounted in the transport direction by a predetermined range via a guide 78
The transfer claw unit 52 is attached to this member 79. Reference numerals 80 and 81 denote stoppers for regulating the moving range of the third movable member 79.

A spring 82 is provided between the second and third movable members 76 and 79 to urge the third movable member 79 downstream of the movable range in the transport direction with respect to the second movable member 76. A dog 83 is provided on one of the members 76 and 79, and a sensor 84 is provided on the other.
Normally, the two members 76 and 79 are elastically maintained in a fixed positional relationship by a spring 82. In this state, the dog 83 and the sensor 84 are displaced. In the event of an abnormality in which the movement of the movable member 79 is prevented, the relative position of the two members 76 and 79 changes, and the dog 83 and the sensor 84 correspond to detect such an abnormal situation. . This is to ensure safety and reliability. When the abnormal situation is detected, the operation of the transfer device 21 is stopped, so that an overload is applied to the motor 72 or the like or the transfer claws 53 to 5
5 is prevented from being damaged.

Further, between the first and second members 71 and 76, the transfer claw unit 52 may unexpectedly descend and collide with the substrate when the operation of the elevating cylinder 77 is defective. A spring 85 is provided to urge the second member 76 to the raised position so as not to be in a raised position.

The operation of the surface mounter 1 according to the present embodiment will be described below.

When the transfer device 3 is driven to transfer the substrate P on the transfer line L in the direction of the arrow (left direction) in FIG. 1, and when the substrate P reaches the stopper in front of the first work station S1, The driving of the transport device 3 is stopped, the substrate P is moved to the work station S1 by the substrate transfer device 21, and is held by the substrate holding device 14A.

Next, when the work station S1 moves to a predetermined work position, the servo motor 9 shown in FIG. 4 is driven to move the head 5A along the X1 axis 4A, and a plurality of suction nozzles supported by the head 5A. 7 is the feeder 22
A chip component supplied from A-1 (or 22A-2) is sucked. Then, after correction by image recognition based on image pickup by the component recognition camera 86A provided at a predetermined position on the base 2, the suction nozzle 7 transports the chip component to the work station S1.

On the other hand, the work station S1 is driven by the servomotor 16 shown in FIGS.
The substrate P moved along 3A and held by the substrate holding device 14A is also moved in the Y-axis direction at the same time.

As described above, as a result of the head 5A moving independently in the X-axis direction and the substrate P moving independently in the Y-axis direction, the suction nozzle 7 supported by the head 5A moves to an arbitrary position on the substrate P. Then, a plurality of (16 in this embodiment) chip components are mounted at predetermined positions on the substrate P.

When the above operation is repeated on the work station S1 and the mounting of the chip components is completed for, for example, half the area of the substrate P, the work station S1 moves on the Y axis in the direction of the transport line L, and the substrate holding device After the holding of the substrate P by 14A is released, the substrate P is transferred from the work station S1 to the work station S2 by the transfer device 21.

As described above, the work station S
At the same time as the substrate P is transferred to the work station S1, the next substrate P already transferred by the transfer device 3 and waiting at the stopper position in front of the work station S1 is transferred by the transfer device 21 to the work station S1.

Then, chip components are mounted on the substrate P in the remaining area in the same procedure as the operation in the work station S1, and at the same time, the work station S1 mounts the chip on the next substrate P. Chip components are mounted on half the area of the chip. In the work station S2, the feeder 22B-1 (or 2)
According to 2B-2), chip components are continuously supplied.

By repeating the above operations, the mounting operation of the chip components on the substrate P can be performed continuously. In this embodiment, the two operation stations S1 and S2 are used.
2, the mounting operation can be performed simultaneously, so that the operation time can be shortened and the efficiency can be further improved.

The transfer operation using the transfer device 21 is as follows.
This will be described in more detail with reference to FIG.

At the stage shown in FIG. 14 (a), the work stations S2 and S1
a and Pb are located, a new substrate Pc is located upstream of the work station S1, and stoppers 61 to 63 are located downstream thereof, and the transfer claw unit 52 is located upstream of the transport line L. It is in a state of being located above the side. When the work at each of the work stations S1 and S2 is completed from this state, the transfer claw unit 52 is lowered as shown by the arrow in FIG. The state is located upstream of Pa, Pb, and Pc. Then, as shown in FIG.
63 move downward, and the transfer claw unit 52
Advances to the downstream side, and the respective substrates Pa, Pb, Pc are simultaneously moved by the transfer claws 53 to 55, and the downstream side of the work station S2, the work station S2 and the work station S
1 respectively.

As shown in FIG. 14C, each of the substrates Pa, P
When b and Pc pass through the stoppers 61 to 63, the stoppers 61 to 63 are driven and protruded by the cylinders 64 to 66, and further, as shown in FIG.
When c reaches a predetermined forward position where it contacts the stoppers 63 and 62, the transfer claw unit 52 is raised. Then, as shown in FIG. 14E, each work station S2 and S1
The substrates Pb and Pc are located at the positions, and the mounting operation is performed respectively. During the mounting operation, the transfer claw unit 52 is retracted to the initial position, and the substrate Pa on the downstream side of the work station S2 is transferred to the transfer device. While being carried out by 3,
A new substrate Pd is loaded on the upstream side of the work station S1.

By repeating the operations shown in FIGS. 14 (a) to 14 (e), the transfer and transport of the substrate can be performed efficiently.

Further, the efficiency of the mounting work at each of the work stations S1 and S2 can be greatly improved. That is, since the X1 axis 4 and the Y1 axis 13A and the X2 axis 4B and the Y2 axis 13B which are independent from each other are used, the speed of the heads 5A and 5B and the substrate P moving along these can be increased.

Further, according to the present embodiment, the feeders 22A-1, 22A-2, 22 for supplying chip components are provided.
B-1 and 22B-2 are respectively X1 axis 4A and X2 axis 4B
, The surface mounter 1 can be configured to be small and compact while increasing the capacity of the feeders 22A-1, 22A-2, 22B-1, and 22B-2. Can be. Also, at the time of work, each feeder 22A-1, 22A-2, 22B-1, 22B-
2, the work stations S1 and S2 are located on the sides of the feeders 22A-1, 22A-2, 22B-1, and
The distance between the substrate 22B-2 and the substrate P is reduced, and the mounting time can be reduced.

[0061]

According to the first aspect of the present invention, since two sets of heads and work stations are provided for a single transport line, high mounting efficiency can be achieved by independent mounting operations. it can.

In particular, if each head is configured to be independently movable in the X-axis direction and each work station is independently movable in the Y-axis direction, the high-speed operation of each of the head and the work station is possible. , The mounting efficiency can be further increased.

Further, as described in claim 3, the first and second X axes are arranged along the transport line, and these X axes are arranged.
The first and second heads are movably mounted on the axis, respectively, and first and second recognition means are provided. The first component supply unit and the first component supply unit are arranged along one side along the first X axis. While the recognition means and the first work station are arranged, the second component supply unit, the second recognition means and the second work station are arranged from the opposite side along the second X axis, and the first work station is arranged. And the second work station are arranged in an overlapping manner in the X-axis direction,
If the second component supply unit and the first work station are arranged so as to overlap each other in the X-axis direction, the suction state of the components is recognized while each head moves from the component supply unit onto the printed circuit board. Therefore, the components can be efficiently sucked, recognized, and mounted, and the first component supply unit and the second work station can be moved in the X-axis direction by the second component supply unit and the first work station. And the work stations are overlapped in the X-axis direction, so that the configuration in the X-axis direction is compact. Therefore, both improvement of mounting efficiency and space saving can be rationally achieved.

[Brief description of the drawings]

FIG. 1 is a plan view of a surface mounter according to an embodiment of the present invention.

FIG. 2 is a front view of the surface mounter.

FIG. 3 is a side view of the surface mounter.

FIG. 4 is a front view showing the configuration of a head support and drive system.

FIG. 5 is a half sectional view of a portion taken along line AA of FIG. 4;

FIG. 6 is a plan view of a work station.

FIG. 7 is a side view of a work station.

FIG. 8 is a side view of a feeder portion.

FIG. 9 is an enlarged side view of a front end portion of the feeder.

FIG. 10 is a front view schematically showing a substrate transfer device.

FIG. 11 is an enlarged front view of the substrate transfer device.

FIG. 12 is an enlarged side view of the substrate transfer device.

FIG. 13 is an enlarged bottom view of the substrate transfer device.

FIGS. 14A to 14E are explanatory diagrams sequentially showing the operation of the substrate transfer apparatus.

FIG. 15 is a configuration diagram of an example of a conventional mounting machine.

[Description of Signs] 1 Surface mounter 4A X1 axis 4B X2 axis 5A, 5B Head 13A Y1 axis 13B Y2 axis 14A, 14B Substrate holding device L Transport line S1, S2 Work station

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (3)

(57) [Claims] An apparatus for mounting a chip component supplied from a feeder on a substrate transported on a transport line, comprising: a transport line for transporting the substrate in an X-axis direction; First and second work stations for holding the board in a state where components can be mounted;
First and second component supply units disposed on both sides of the transfer line;
A first head mounted on the board on the work station of the first work station and a second head mounted on the board on the second work station by sucking a component from the second component supply unit. Surface mounter. 2. A first and a second work station are provided so as to be movable in a Y-axis direction orthogonal to the X-axis direction, respectively, and the first and second heads are respectively movable in an X-axis direction. The surface mounter according to claim 1, wherein the surface mounter is provided. 3. A method according to claim 1, further comprising:
Are arranged in parallel with each other, and the first and second heads are movably mounted on these X axes, respectively, and the first and second heads respectively recognize the suction state of the components sucked by the respective heads. 2 is provided, and the first component supply unit and the first component supply unit are arranged from one side along the first X axis.
While the second component supply unit, the second recognition unit and the second work station are arranged from the opposite side along the second X-axis. The first component supply unit and the second work station are arranged so as to overlap each other in the X-axis direction, and the second component supply unit and the first work station are connected to each other by X.
3. The surface mounter according to claim 2, wherein the surface mounters are arranged so as to overlap in the axial direction.