JP2002009494A - Method and device for recognizing board of part mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time required for recognizing a board at a unit mounting equipment other than a first one while a high mounting precision is assured, related to a mounting system comprising a plurality of unit mounting equipments. SOLUTION: A controller 10 of a first unit mounting equipment 1A comprises a first correction data generating means 101 wherein a correction data for a part mounting position is generated based on a mark recognition actual survey for imaging a fiducial mark with a moving camera 7 attached to the head unit 1A, an adjustment data generating means 102 for generating the data from the correction data and a board position data acquired based on a board position recognition actual survey for imaging a specified part of a board P using board cameras 8 and 9 provided to a mounting equipment main body, and a storage means 103 where the adjustment data is stored. The controllers of other unit mounting equipments 1B-1D comprise a second correction data generating means 104 which generates a correction data based on the adjustment data and the board position data acquired based on the board position recognition actual survey.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting system having a plurality of unit mounters connected in series, and in each of the unit mounters, examines a positional displacement of a portion to be mounted on a substrate and detects a component corresponding thereto. The present invention relates to a board recognizing method and device for obtaining correction data of a mounting position.

[0002]

2. Description of the Related Art Conventionally, a board transfer means, a positioning means for stopping a printed circuit board to be mounted carried by the transfer means at a predetermined position, a mounting head unit having a nozzle member for picking up components, and 2. Description of the Related Art There is generally known a mounting machine that includes a component supply unit and stops a printed board at the predetermined position, and then mounts a component picked up from the component supply unit by the head unit on the printed board.

In recent years, in order to increase the speed, agility, and adaptability to product changeover of a mounting operation, a plurality of unit mounters (module mounters) are used to mount a large number of types of components on a printed circuit board. A modular mounting system designed to be performed in a distributed manner has also been developed.
That is, in this modular mounting system, a plurality of unit mounting machines are connected in series in the board conveying direction, so that several types of components are sequentially mounted on the printed circuit board by each unit mounting machine. . A transport line is constituted by the plurality of unit mounting machines, devices such as a loader and a cream solder printing machine disposed upstream thereof, and devices such as a reflow furnace and an unloader disposed downstream thereof. I have.

[0004]

By the way, in the above-mentioned mounting machine, the printed circuit board carried in by the board carrying means is positioned at a predetermined position by the positioning means. On the other hand, due to a shift in the relative position of the printed wiring pattern on the board, the mounted portion of the board (the component mounting location specified by the printed wiring pattern) may be slightly shifted from the normal position. In order to correct the component mounting position according to the displacement of the mounting portion of the board, a mark (fiducial mark) for recognizing the board is attached in advance to a plurality of locations on the printed board, and the head The unit is equipped with a camera for picking up marks, and prior to the mounting work, the camera is sequentially moved to the position corresponding to each mark, and images are picked up to detect the position of each mark. Obtaining the corrected amount has been conventionally performed.

[0005] In the above-mentioned modular mounting system, in order to secure mounting accuracy in all the unit mounting machines, each of the unit mounting machines is provided with an image of a fiducial mark by a camera mounted on the head unit as described above. The calculation of the correction amount based on this is performed.

However, it takes a considerable amount of time to sequentially move the camera mounted on the head unit to a plurality of mark positions on the substrate and to image each mark. Therefore, such a method is required for each unit mounting machine of the modular mounting system. If a work for the correction is performed, a large amount of time is spent for the work for the correction as a whole of the mounting system, which is a serious problem in reducing the tact time.

[0007] If the correction data obtained by the above-mentioned operation in the first unit mounting machine can be used in a unit mounting machine other than the first unit, it is advantageous for shortening the tact time. Since the situation of the displacement of the board with respect to the mounting machine body when stopped at the position differs for each unit mounting machine, it is not sufficient to simply use the correction data obtained from the first unit mounting machine as it is to other unit mounting machines. This leads to a decrease in mounting accuracy.

In view of such circumstances, the present invention significantly reduces the time required for the operation of recognizing a board in a unit mounting machine other than the head while ensuring high mounting accuracy in each unit mounting machine of the modular mounting system. It is an object of the present invention to provide a method and an apparatus for recognizing a substrate that can be shortened and work efficiency of the entire system can be improved.

[0009]

The invention according to claim 1 is
A plurality of unit mounters connected in series are provided, and in each unit mounter, components to be mounted are supplied by the mounting head unit while the substrate to be mounted transported by the substrate transport means is stopped at a predetermined position. In the component mounting system in which the components picked up from the unit are mounted on the substrate, prior to mounting the components on the substrate by the unit mounting machines, the displacement of the mounted portion of the substrate is checked and the position is determined accordingly. A board recognition method for obtaining correction data of a component mounting position, wherein in a head mounting unit of the plurality of units, a head unit is moved onto the substrate after the substrate is stopped at a predetermined position. Then, an actual measurement process for mark recognition is performed in which the board recognition mark attached to the board is imaged by an imaging unit equipped in the head unit. Based on this, the correction data of the component mounting position is obtained, and the actual measurement processing for the recognition of the substrate position is performed, in which the specific part of the substrate is imaged by the imaging means provided in the mounting machine main body. From the above, adjustment data according to the relative positional relationship between the mark and the specific portion of the substrate is obtained, and thereafter, in a unit mounting machine other than the head, after the substrate stops at a predetermined position, the specific portion of the substrate is mounted. Perform the actual measurement process for board position recognition to be imaged by the imaging means equipped on the machine body,
The correction data of the component mounting position is obtained based on the board position data obtained based thereon and the adjustment data obtained by the head unit mounting machine.

According to this method, in the first unit mounting machine, the actual measurement processing for mark recognition using the imaging means provided in the head unit and the actual measurement processing for board position recognition using the imaging means provided in the main body of the mounting machine are performed. However, since the actual measurement processing for substrate position recognition can be performed in parallel with the actual measurement processing for mark recognition, the time required for the processing does not increase. Then, with the correction data obtained based on the mark recognition actual measurement process, the component mounting position corresponding to the positional deviation of the mounted portion of the board is accurately corrected, and the correction data and the board position recognition actual measurement process are used. Adjustment data is obtained based on the obtained substrate position data.

In the unit mounters other than the head unit, only the actual measurement processing for board position recognition is performed as the actual measurement processing, and the actual measurement processing for mark recognition that takes time to move the head unit to the mark position or the like is omitted. As a result, while the processing time is shortened, the adjustment data obtained by the head unit mounting machine is effectively used, and the correction data is obtained based on the adjustment data and the board position data obtained by the actual measurement processing for board position recognition. Therefore, high mounting accuracy is secured.

[0012] In the method of the present invention, the correction data is obtained by taking an image of a mark attached to one or a plurality of places on the substrate by an image pickup means provided in a head unit and responding to a positional shift of a mounted portion based on the image. The board position data is obtained by calculating an amount corresponding to a positional shift of a specific portion of the board, and the adjustment data is obtained by calculating a deviation between the correction data and the board position data. It is preferable that an amount corresponding to the positional shift of the relative position of the mounted portion with respect to the specific portion of the substrate is obtained by the calculation (claim 2).

According to a third aspect of the present invention, there are provided a plurality of unit mounters connected in series.
Board transfer means, and positioning means for stopping the substrate to be mounted transferred by the board transfer means at a predetermined position,
In a component mounting system including a mounting head unit for mounting a component picked up from a component supply unit on the substrate, the component mounting system is provided at least in a head unit of a first unit mounting machine, and moves together with the head unit to move the substrate Mobile imaging means for imaging the board recognition mark attached to the, mounted on the mounting machine body of each unit mounting machine,
A stationary imaging means for imaging a specific portion of the substrate when the substrate is stopped at a predetermined position; and a component based on a mark recognition measurement process for imaging the mark by the movable imaging means in the head unit mounter. First correction data creating means for creating mounting position correction data, and board position data based on board position recognition actual measurement processing for imaging a specific portion of the board by the stationary imaging means in the top unit mounter. An adjustment data creating unit that creates adjustment data according to a relative positional relationship between the mark and the specific portion of the board from the board position data and the correction data; a storage unit that stores the adjustment data; In a unit mounter other than the above, the board position data is determined based on the board position recognition actual measurement processing in which the fixed image capturing means captures an image of a specific portion of the board. Seek data, in which a second correction data generation means for generating correction data based on the adjustment data read out from the substrate position data and said storage means.

According to this apparatus, the method according to the first aspect of the present invention is effectively executed.

[0015] In this apparatus, as the stationary imaging means, a first camera for imaging one corner of the board and a second camera for imaging an intermediate portion on one side of the board are provided in each unit mounting machine. It is preferable that it is provided on the mounting machine body (claim 4). With this configuration, the displacement of the substrate position in the X direction and the Y direction and the displacement of the angle can be accurately obtained based on the images captured by the two cameras.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 schematically show an example of a component mounting system. The component mounting system shown in this figure has a plurality of unit mounters (module mounters) arranged in series in the board transfer direction in order to increase the speed, agility, and adaptability to product type switching of the mounting work.
In the figure, it is composed of four unit mounting machines 1A to 1D.
An upstream device (not shown) such as a dispenser is provided on the upstream side of the component mounting system, while a downstream device (not shown) such as a reflow furnace is provided on the downstream side of the component mounting system. Is provided.

Each of the unit mounting machines 1A to 1D includes a mounting machine main body 2 composed of a base and a cover, and a board transport conveyor 3 arranged on the base of the mounting machine main body 2. A positioning device including a stopper 4 for stopping the printed circuit board P carried in by the conveyor 3 at a predetermined position, a component supply unit 5 disposed on both sides of the substrate transport conveyor 3, and an electronic device from the component supply unit 5 Head unit 6 for picking up parts and mounting them on printed circuit boards
And

Further, a moving camera 7 as a movable image pickup means which moves together with the head unit 6 to pick up a fiducial mark (a mark for board recognition; see FIG. 8) attached to the printed circuit board P. Are mounted on the head unit 6 of at least the first unit mounter 1A in the component mounting system, and in the example shown in the figure, each of the mounters 1A to 1A is mounted.
D head unit 6 is provided. Further, when the printed board P stops at a predetermined position, the first board camera 8 (first camera) and the second board camera 9 (second camera) serve as stationary imaging means for imaging a specific portion of the printed board P. Camera) is mounted on the mounting machine main body 2 of each of the mounting machines 1A to 1D.

Each of the cameras 7 to 9 is a unit mounting machine 1A.
To 1D, the controllers 10 of the unit mounters 1A to 1D can communicate with each other. Each of the controllers 10 controls various driving units provided in the unit mounting machines 1A to 1D and, when the printed board P is carried in and positioned at a predetermined mounting work position, the board 10 is mounted on the printed circuit board P prior to the mounting work. P
A board recognition process is performed to check the positional displacement of the mounted portion and obtain correction data of the component mounting position according to the displacement.

In particular, the controller 10 mounted on the head unit mounter 1A controls the driving of the head unit 6 and images the fiducial mark on the printed circuit board P with the moving camera 7 to check the position of the mark. First correction data creating means 101 for creating correction data of a component mounting position based on mark recognition actual measurement processing, and board position recognition actual measurement processing for imaging a specific part of the board by the first substrate camera 8 and the second substrate camera 9. An adjustment data creating unit 102 for creating adjustment data according to a relative positional relationship between the mark and the specific part of the board from the board position data and the correction data; And storage means 103 for storing.

The controller 10 mounted on the unit mounters 1B to 1D other than the first one is
And obtaining board position data based on a board position recognition actual measurement process of imaging a board specific portion by the second board camera 9;
A second correction data generation unit 104 that generates correction data based on the substrate position data and the adjustment data read from the storage unit 103 is included.

Referring to FIGS. 3 and 4, unit mounting machine 1
The structure of each part of (1A to 1D) will be specifically described.

The board conveying conveyor 3 in the unit mounting machine 1 is composed of a pair of belt type conveyors 3a, 3 parallel to each other.
The printed circuit board P can be transported while being supported on both sides by both conveyors 3a and 3b. A transport drive mechanism including a transport motor and a transmission mechanism (not shown) is provided for the substrate transport conveyor 3, and both conveyors 3a and 3b are synchronously driven in the substrate transport direction by the transport drive mechanism. It has become so.

One of the pair of conveyors is a movable conveyor 3a which can move in the direction of coming and going with respect to the other conveyor 3b, and the movable conveyor 3a is driven by a conveyor interval adjusting drive mechanism (not shown). Thereby, the interval between the conveyors 3a and 3b is adjusted according to the board width.

In order to stop the printed circuit board P carried by the conveyor 3 at a predetermined mounting work position,
A stopper 4 is provided at a predetermined position inside the conveyor 3. The stopper 4 can be displaced between a state of protruding above the conveyor 3 and a state of submerging below the conveyor, and is driven by a stopper driving unit 4a (shown in FIG. 5) composed of a cylinder or the like. Further, at the mounting operation position, a board holding device (not shown) including a push-up pin or the like for floating and holding the printed board stopped by the stopper from the conveyor 3 is provided. The apparatus and the apparatus constitute a substrate positioning apparatus.

The component supply unit 5 includes a plurality of rows of tape feeders 5a.
Electronic components such as C, transistors, capacitors and the like are stored and held at predetermined intervals, and the tape held there is led out from the reel to the component take-out section. As the components are picked up by the head unit 6, the tape is intermittently fed by a ratchet type feeding mechanism. To be sent out.

The head unit 6 is arranged above the base of the mounting machine main body 2, and picks up a component from the component supply unit 5 so that the head unit 6 can be mounted on the printed board P at the mounting operation position. It is possible to move in the direction (conveying direction by the conveyor 3) and the Y-axis direction (the direction orthogonal to the X-axis on the horizontal plane).

That is, a pair of fixed rails 11 extending in the Y-axis direction and a ball screw shaft 12 driven to rotate by a Y-axis servo motor 13 are disposed on the base. A head unit support member 14 is arranged, and a nut portion (not shown) provided on the support member 14 is screwed to the ball screw shaft 12. A guide member 15 extending in the X-axis direction and a ball screw shaft 16 driven to rotate by an X-axis servomotor 17 are disposed on the support member 14, and the head unit 6 can be moved to the guide member 15. And a nut portion (not shown) provided in the head unit 6 is screwed to the ball screw shaft 16. The ball screw shaft 12 is rotated by the operation of the Y-axis servomotor 13 to move the support member 14 in the Y-axis direction, and the ball screw shaft 16 is rotated by the operation of the X-axis servomotor 17 to form the head unit. 6 moves in the X-axis direction with respect to the support member 14.

The head unit 6 is provided with one or a plurality of nozzle members 20 so as to be movable up and down and rotatable, and a Z-axis servo motor 21 for moving the nozzle members 20 up and down.
And an R-axis servo motor 22 for rotating the nozzle member 20
Is equipped. In addition, the elevation drive of the nozzle member 20 may be performed by an air cylinder.

Further, the head unit 6 is provided with a moving camera 7 made of a CCD or the like facing downward, for example, on a side portion of the nozzle member provided portion, so that the moving camera 7 moves integrally with the head unit 6. It has become.

On the other hand, a first board camera 8 and a second board camera 9 are fixedly installed at fixed positions in the mounting machine body 2, respectively. The first board camera 8 is arranged near the stopper 4 near the conveyor 3b so that the front end corner can be imaged when the printed board P is stopped at the mounting work position. The first is located near the conveyor 3b so that when the printed board P is stopped at the mounting work position, an image of an intermediate portion on one side thereof can be taken.
It is arranged at a position at a predetermined distance from the board camera 8. The two cameras 8 and 9 are mounted on the mounting machine main body 2 so that, for example, the above-described portion of the printed circuit board P can be imaged from above.
It is attached to the upper part of the ceiling.

In addition to the above, the mounting machine body 2 is also provided with a camera 23 for component recognition, and after the component is sucked by the nozzle member 20 of the head unit 6, the camera 23 picks up an image of the picked-up component. The displacement of the suction position and the like can be checked.

FIG. 5 shows the configuration of a controller 10 for processing signals from the cameras 7 to 9 and controlling various driving units.

In this figure, the controller 10
An arithmetic processing unit 25 composed of a PU or the like, a mounting program storage unit 26 for storing a mounting program,
A data storage unit 27 for storing various data for mounting components, etc .; and X-, Y-, Z-, and R-axis motors 13, 17, and 2 for driving the head unit 6 and the nozzle member 20.
It has a motor control unit 28 for controlling 1 and 22, an external input / output unit 29, an image processing unit 30, and a data communication unit 31.

The motor control unit 28 controls each motor 13,
The motors 13, 17, 21, and 22 are controlled based on signals from encoders provided in the controllers 17, 21, and 22 and target values provided from the arithmetic processing unit 25. The external input / output unit 29 is connected to various sensors 32 such as a sensor for detecting loading and unloading of the printed circuit board P as an input element, and is connected to a stopper driving unit 4a as an output element. In addition, a transport driving mechanism and a conveyor interval adjusting driving mechanism (not shown) are also connected to the external input / output unit 29.

The image processing section 30 includes a first board camera 8, a second board camera 9, a moving camera 7, and a component camera 2.
3 are connected, signals indicating images from these cameras are taken into the image processing unit 30, subjected to predetermined image processing, and then sent to the arithmetic processing unit 25. ing.

The arithmetic processing unit 25 controls the drive mechanism for adjusting the conveyor interval according to the board size, controls the transfer drive mechanism for loading and unloading the printed circuit board P,
Control of the stopper drive unit 4a for the operation of the stopper 4 to be retracted during unloading is performed via the external input / output unit 29, and the head unit 6 and the nozzle member 20 during mounting work.
The control of each of the motors 13, 17, 21, 22 for the operation of is performed via the motor control unit 28. Further, a board recognition process for obtaining correction data of the component mounting position according to the positional shift of the mounted portion of the board is performed.

In particular, in the controller 10 provided in the head unit mounting machine 1A, the board processing is performed as shown in the flowchart of FIG. Correction data creation means 10
1 and the function as the adjustment data creating means 102, and the adjustment data is stored in the data storage means 27 (corresponding to the storage means 103 in FIG. 2). Further, in the controller 10 provided in the unit mounters 1B to 1D other than the head, the arithmetic processing unit 25 executes the board recognition process shown in the flowchart of FIG. It is configured to function as the correction data creation unit 104.

A data communication unit 31 is connected to the arithmetic processing unit 25, and the data communication unit 31 transmits and receives the adjustment data to and from another controller. Further, an external display unit 33 is connected to the arithmetic processing unit 25.

FIG. 6 is a flowchart showing a board recognition process performed by the controller 10 of the first unit mounter 1A. This process will be described with reference to FIG. The controller 10 first determines whether or not the board positioning for stopping the printed board P at the predetermined mounting work position has been completed (Step S1), and waits until the board positioning is completed. When the substrate positioning is completed, the actual measurement process for substrate position recognition and the actual measurement process for mark recognition are performed in parallel.

The actual measurement processing for substrate position recognition includes
The second two substrate cameras 8 and 9 image the front end corner and the middle of one side of the printed circuit board P to recognize the printed circuit board (step S2). The corresponding correction amounts Xp, Yp, θp (substrate position data) in the X, Y, and rotation directions are obtained (step S3).

That is, as shown in FIG. 8, the position of the corner portion of the printed circuit board P imaged by the first substrate camera 8 is different from the predetermined regular position in the X and Y directions. It is checked whether or not the position is shifted, correction amounts Xp and Yp corresponding to the position shift are obtained, and the positions of the corners of the printed circuit board P imaged by the first substrate camera 8 and the second substrate camera 9 are used. From the position of the intermediate portion of the one side of the printed circuit board P, it is checked how much the one side of the printed circuit board P is displaced in the rotational direction with respect to the X axis, and the correction amount corresponding to the deviation angle is determined. θp is determined.

As the mark recognition actual measurement processing performed in parallel with the board position recognition actual measurement processing, first, the head unit 6 is moved to the second fiducial mark of the two fiducial marks provided at the diagonal positions of the printed circuit board P. The first mark M1 is moved to a position corresponding to the first mark M1 (step S4), and the moving camera 7 images the first mark M1 and recognizes it (step S4).
5) Next, the head unit 6 is moved to a position corresponding to the second mark M2 (step S6), and the moving camera 7 takes an image of the second mark M2 and recognizes it (step S7). Then, based on the recognition of the first mark M1 and the second mark M2, X based on the displacement of the mounted portion is determined.
The correction amounts Xf, Yf, and θf (correction data of the component mounting position) in the direction, the Y direction, and the rotation direction are obtained (step S8).

That is, as shown in FIG. 8, the position of the first mark M1 imaged in a state where the mobile camera 7 has moved to the first mark imaging position (solid line in FIG. 8) is predetermined. X direction with respect to the normal position of the mark M1,
The amount of displacement in the Y direction is examined to determine the correction amounts Xf and Yf corresponding to the displacement, and the position of the first mark M1 and the position of the moving camera 7 for imaging the second mark. From the position of the second mark M2 imaged while moving to the position indicated by the two-dot chain line in FIG. 8, how much the line connecting the marks M1 and M2 deviates in the rotational direction with respect to the normal line. Inspection is performed to determine a correction amount θf corresponding to the deviation angle.

Processing in steps S2 and S3 and step S4
After the processing of S8 to S8, the correction amounts Xg, Yf, and θf corresponding to the correction data of the component mounting position and the correction amounts Xp, Yp, and θp corresponding to the substrate position data are used to calculate the correction amount Xg, the correction amount corresponding to the adjustment data. Yg and θg are calculated as follows (step S9).

Xg = Xf-Xp, Yg = Yf-Yp, θ
g = θf−θp The data of the correction amounts Xp, Yp, θp are stored.

In this flowchart, step S
4 to S8 are processing as the first correction amount creating means 10, and steps S2, S3 and S9 are adjustment data creating means 102.
Step S10 is the processing of the storage unit 103.

FIG. 7 shows the unit mounters 1B to 1D other than the head unit.
2 is a flowchart illustrating a board recognition process performed by the controller 10 of FIG. Describing this process, the controller 10 first determines whether or not the board positioning for stopping the printed board P at the predetermined mounting work position has been completed (step S11), and waits until the board positioning is completed.

When the board positioning is completed, an actual measurement process for board position recognition using the two board cameras 8 and 9 is performed as in steps S2 and S3 in FIG. 6 (steps S12 and S1).
3), correction amounts Xp, Yp, θ corresponding to substrate position data
Find p. Next, the first machine (the first unit mounting machine 1)
Correction amounts Xg, Yg, θg corresponding to adjustment data from A)
Is read (step S14). Then, based on the correction amounts Xp, Yp, θp corresponding to the board position data and the correction amounts Xg, Yg, θg corresponding to the adjustment data, the correction amounts Xf, Yf, θf corresponding to the correction data of the component mounting position are obtained. The calculation is performed as follows (step S15).

Xf = Xg + Xp, Yf = Yg + Yp, θ
f = θg + θp According to the board recognition method as described above, it is possible to accurately perform the correction according to the positional deviation of the mounted portion of the printed circuit board, and to reduce the processing time in the unit mounting machines 1B to 1D other than the head. This operation will be specifically described below.

In the first unit mounting machine 1A, after the printed circuit board P is carried in and positioned at a predetermined mounting work position, the component mounting position is determined by the processing (steps S4 to S8) as the first correction data creating means 101. Correction amount Xf,
Yf and θf are obtained, and in the subsequent mounting operation, the component mounting is performed based on the correction amounts Xf, Yf, and θf and the correction amount obtained according to the shift of the component suction position based on component recognition by the component recognition camera 23. Position correction is performed with high accuracy.

Although such processing is the same as the conventional processing, according to the present invention, in addition to the processing as the first correction data generating means 101 at the time of board recognition, the adjustment data generating means 102
(Steps S2, S3, S9), the correction amounts Xp, Yp, θp and the component mounting position correction amounts Xf, Yf, θf corresponding to the board position data obtained based on the board position recognition actual measurement processing. Then, correction amounts Xg, Yg, and θg as adjustment data are obtained, and are used for board recognition in the unit mounting machines 1B to 1D other than the head.

That is, the correction amounts Xf, Yf, and θf obtained based on the recognition of the two fiducial marks M1 and M2 on the printed circuit board P are based on the positional deviation of the mounted portion of the printed circuit board P (the positional deviation of the printed wiring pattern). ), The positional displacement of the mounted portion includes two factors: a positional displacement of the printed circuit board P in a positioning state, and a positional displacement of the printed wiring pattern relative to the outer shape of the printed circuit board P. Among these, the displacement of the printed circuit board P changes for each of the unit mounting machines 1A to 1D, but the displacement of the relative position of the printed wiring pattern with respect to the outer shape of the printed circuit board P only changes depending on the printed circuit board. It does not change every 1D. Therefore, in the first unit mounting machine 1A, the correction amounts Xg, Yf, θf and the correction amounts Xp, Yp, θp are used to calculate the correction amounts Xg, Yg and θg are determined.

In this case, the actual measurement processing for substrate position recognition for obtaining the correction amounts Xp, Yp, θp is performed in the correction amounts Xf, Y
The processing is performed in parallel with the mark recognition actual measurement processing for obtaining f and θf, and is completed in a shorter time than the mark recognition actual measurement processing because there is no work of moving the camera unlike the mark recognition actual measurement processing. However, the time required for the recognition process does not increase.

Then, the unit mounters 1B to 1D other than the head unit
Then, the actual measurement processing for mark recognition is not performed, but only the actual measurement processing for substrate recognition using the substrate cameras 8 and 9 is performed as the actual measurement processing, and the correction amounts Xp and Y obtained based on the actual measurement processing are performed.
The correction amounts Xf, Y are calculated from p, θp and the correction amounts Xg, Yg, θg read from the top unit mounter 1A.
f and θf are obtained. In this case, the mark recognition actual measurement process includes moving, stopping, and moving the head unit 6 to the mark position.
Each process of capturing images of marks by the moving camera 7 is performed a plurality of times (twice in this embodiment) according to the number of marks to be recognized.
Since it is repeated, the actual measurement processing for board recognition can be performed in a short time using the board cameras 8 and 9 arranged at fixed positions, as compared with the case where a long time is required. Accordingly, the processing time is greatly reduced by omitting the measurement processing for mark recognition, and the correction amounts Xp, Y by the measurement processing for board recognition are greatly reduced.
Computation using the correction amounts Xg, Yg, and θg read from the top unit mounter 1A and the correction amounts X as accurately as when the mark recognition actual measurement process is performed.
f, Yf, and θf are obtained.

As described above, when the mounting work on the printed circuit board is sequentially performed by the plurality of unit mounting machines 1A to 1D while the accuracy of the board recognition is secured, the mounting work is performed by the second and subsequent unit mounting machines 1B to 1D before the mounting work. This reduces the time required for board recognition to be performed, and greatly reduces the tact time of the entire component mounting system.

The specific configuration of the method and the apparatus of the present invention is not limited to the above embodiment, but can be variously modified.

In the above embodiment, the moving camera 7 is provided in the head unit 6 of each of the unit mounting machines 1A to 1D. However, the moving camera 7 is provided only in the head unit 6 of the head unit mounting machine 1A. It may be. Yes, 2
If the mobile cameras 7 are also provided in the subsequent unit mounting machines 1B to 1D, for example, the printed circuit board P is removed for some reason after completing the mounting operation in the top unit mounting machine 1A, and so on. When it is unclear which printed circuit board the adjustment data (correction amounts Xg, Yg, θg) read from the unit mounter 1A is, it is moved by the second unit mounter 1B or the like. Correction amounts Xf, Yf, θ based on actual measurement processing for mark recognition using camera 7
It is also possible to obtain f.

The arrangement of the first and second board cameras 8 and 9 constituting the stationary image pickup means may be set so as to be compatible with printed boards P of various sizes, and may always be fixed at a fixed position. However, when the substrate size changes, the position of the second substrate camera 9 in the X direction may be changed accordingly. Further, the two board cameras 8 and 9 are arranged in the vicinity of the movable conveyor 3a, and when the position of the movable conveyor 3a is changed to adjust the conveyor interval according to the board size, the two board cameras 8 and 9 are accordingly moved. The position may be changed.

In the above-described embodiment, the two board cameras 8 and 9 take images of the corners and the middle of one side of the printed circuit board P, but take images of other specific parts of the board. You may. When the board specific part is a part capable of capturing an image from below, the board camera may be installed upward below the printed board in the mounting machine body.

In the above embodiment, the two board cameras 8 and 9 are provided as stationary imaging means. However, if the corner P of the printed board is imaged over a relatively wide range, one board camera 8 is provided. Can be used to obtain substrate position data (correction amounts Xp, Yp, θp).

In the above embodiment, the two fiducial marks M1 and M2 provided at diagonal positions of the printed circuit board are recognized as the mark recognition measurement processing performed by the leading unit mounter 1A. However, the correction amounts in the X and Y directions may be obtained by recognizing one fiducial mark. Alternatively, fiducial marks may be provided in three or more places on the printed circuit board in advance, and the correction amount may be obtained with higher accuracy based on recognition of these marks. If you do this,
Since the time required for the actual measurement process for mark recognition increases, the usefulness of omitting the actual measurement process for mark recognition in the second and subsequent unit mounting machines according to the present invention increases.

In the above embodiment, the top unit mounter 1A
The adjustment data (correction amounts Xg, Yg, θg) obtained in step (1) are stored in the storage unit 1 in the controller 10 of the unit mounting machine 1A.
03, the adjustment data may be stored in a storage means in the computer when a computer for controlling the entire mounting system is provided.

[0065]

As described above, according to the present invention, when a board is recognized by a head unit mounting machine among a plurality of unit mounting machines, a mark of a board to be mounted is imaged by an imaging means provided in a head unit. The correction data of the component mounting position is obtained based on the measurement processing for mark recognition to be performed, and the board position data obtained based on the measurement processing for board position recognition, in which a specific part of the board is imaged by the imaging means provided in the mounting machine body. When the adjustment data is obtained from the correction data and the board is recognized by a unit mounting machine other than the head, the board position data obtained based on the actual measurement processing for board position recognition and the adjustment data obtained by the head unit mounting machine are obtained. The correction data of the component mounting position is obtained based on the correction data. For this reason,
By omitting the actual measurement process for mark recognition in the unit mounters other than the top, the time required for board recognition can be greatly reduced, and the component mounting position can be corrected according to the displacement of the mounted part of the board. Data can be obtained with high accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating an example of a component mounting system including a plurality of unit mounting machines to which the present invention is applied.

FIG. 2 is a partial plan view of the component mounting system.

FIG. 3 is a schematic plan view of a unit mounting machine.

FIG. 4 is a schematic front view of the unit mounting machine.

FIG. 5 is a block diagram of a control system of the unit mounting machine.

FIG. 6 is a flowchart illustrating a board recognition process performed in the first unit mounting machine.

FIG. 7 is a flowchart illustrating a board recognition process performed in a unit mounter other than the head unit.

FIG. 8 is a diagram illustrating the operation of the board recognition process.

[Explanation of symbols]

 1A to 1D Unit mounting machine 2 Mounting machine main body 3 Conveyor for board transfer 4 Stopper 6 Head unit 7 Moving camera 8 First board camera 9 Second board camera 10 Controller 101 First correction data creating means 102 Adjustment data creating means 103 Storage Means 104 Second correction data creation means

Claims (4)

[Claims] A plurality of unit mounters connected in series, wherein each of the unit mounters has a substrate to be mounted conveyed by substrate conveying means stopped at a predetermined position, and In a component mounting system in which a component picked up from a component supply unit by a head unit is mounted on the substrate, prior to mounting the component on the substrate with each of the unit mounting machines, the positional displacement of the mounted portion of the substrate is determined. A board recognizing method for examining and obtaining correction data of a component mounting position corresponding thereto.First, in the first unit mounting machine of the plurality of units, after the board is stopped at a predetermined position, the head unit is replaced. An actual measurement process for mark recognition in which an image of a board recognition mark attached to the substrate by being moved onto the substrate is taken by an imaging means provided in a head unit. And the correction data of the component mounting position is obtained based on the obtained data, and the actual measurement processing for the board position recognition is performed, in which the specific part of the board is imaged by the image pickup means provided in the mounting machine body. From the correction data, adjustment data corresponding to the relative positional relationship between the mark and the specific portion of the board is obtained. After that, in the unit mounting machines other than the head, after the board is stopped at a predetermined position, the identification of the board is performed. Performs actual measurement processing for board position recognition in which a part is imaged by the imaging means provided in the mounting machine body, and based on the board position data obtained based on the board position data and the adjustment data obtained by the top unit mounting machine, the component mounting position. A board recognition method in a component mounting system, wherein correction data is obtained. 2. The correction data according to claim 1, wherein said correction data is a correction amount corresponding to a positional shift of a mounted portion based on an image of a mark attached to one or a plurality of positions of said substrate, taken by an image pickup means provided on a head unit. The board position data is obtained by calculating an amount corresponding to a position shift of a specific portion of the board, and the adjustment data is obtained by calculating a deviation between the correction data and the board position data. 2. The board recognition method in a component mounting system according to claim 1, wherein an amount corresponding to a positional shift of a relative position of the mounted portion with respect to a specific portion of the board is obtained. 3. A plurality of unit mounting machines connected in series, wherein each of the unit mounting machines stops a substrate carrying means and a substrate to be mounted carried by the substrate carrying means at a predetermined position. In a component mounting system including a positioning unit and a mounting head unit for mounting a component picked up from a component supply unit on the substrate, at least a head unit of a first unit mounting machine is mounted and moved together with the head unit. A movable imaging means for imaging a substrate recognition mark attached to the substrate, and a specific portion of the substrate mounted on a mounting machine body of each unit mounting machine when the substrate stops at a predetermined position. A fixed type image pickup means for picking up an image of the mark, and a component realization process based on a mark recognition measurement processing for picking up the mark by the movable image pickup means in the top unit mounter. First correction data creating means for creating correction data of the mounting position; and board position data based on actual measurement processing for board position recognition in which the stationary imaging means captures a specific portion of the board in the top unit mounter. An adjustment data creating unit that creates adjustment data according to a relative positional relationship between the mark and the specific portion of the board from the board position data and the correction data; and a storage unit that stores the adjustment data. Obtain board position data based on board position recognition actual measurement processing for imaging a specific part of the board by the stationary imaging means in the unit mounting machine other than based on the board position data and the adjustment data read from the storage means. And a second correction data generating means for generating correction data. . 4. A mounting apparatus for each unit mounting machine, wherein a first camera for imaging one corner of the substrate and a second camera for imaging an intermediate portion on one side of the substrate are provided as stationary imaging means. The board recognition device in the component mounting system according to claim 3, wherein the board recognition device is provided on a main body.