JP2020102637A - Mounting device of electronic component, mounting method, and manufacturing method of package component - Google Patents

Abstract

To provide a mounting device of an electronic component, which efficiently mounts, at high accuracy, the electronic component in each mounting region of a support substrate in which a mark, or the like for detecting a position is formed in each mounting region.SOLUTION: A mounting device 1 comprises: a stage part 20 that moves a stage 21 on which a support substrate W is mounted so that a plurality of mounting regions of the support substrate W is positioned in order at a constant mounting position; a mounting part 50 that individually moves first and second mounting heads mounted to a mounting region by holding each electronic component at a mounting position; a first recognizing part 22 that recognizes all of positions of the support substrate W on the stage 21; and a second recognizing part that recognizes the position of the electronic component held in the first and second mounting heads. The movement of the stage 21 and the first and second mounting heads are controlled on the basis of correction data of a movement position error of the stage 21 by a movement mechanism, position data of the support substrate W, and a position data of the electronic component.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to an electronic component mounting apparatus and mounting method, and a package component manufacturing method.

2. Description of the Related Art Conventionally, a manufacturing process of a semiconductor package using an interposer substrate (relay substrate) such as CSP (Chip Size Package) and BGA (Ball Grid Array) has been known. Apart from this, there is known a manufacturing process called a wafer level package (WLP) in which a semiconductor chip is packaged in a wafer state without being divided into semiconductor chips without using an interposer substrate. The WLP has an advantage that the semiconductor package can be thinned and the manufacturing cost can be reduced because the interposer substrate is not used.

In WLP, a fan-in-wafer level package in which a rewiring layer including I/O terminals of a semiconductor package is formed on a semiconductor chip so as not to overflow an area on a surface of a semiconductor chip on which electrode pads are formed. (Fan in-WLP:FI-WLP) is known. Further, in recent years, a fan-out wafer-level package (fan-WLP: FO-WLP) has been proposed in which a rewiring layer including an I/O terminal of a semiconductor package is formed by protruding from a region of a semiconductor chip. The FO-WLP can also be applied to a multi-chip package (Multi Chip Package: MCP) in which a semiconductor chip such as a RAM, a flash memory, and a CPU, and a plurality of types of electronic components such as a capacitor are mounted in one package. Has been attracting attention.

Here, the MCP is one in which a plurality of types of electronic components are mounted in one package, as described above. In such an MCP, the deviation of the mounting position of each electronic component mounted in the same package mutually affects the electrical characteristics of the package, and therefore high positional accuracy is required for mounting each electronic component. There is. In the semiconductor package manufacturing process performed using the interposer substrate described above, since alignment marks for position recognition are provided in each mounting area on the interposer substrate, the alignment mark is recognized for each mounting area and electronic parts are mounted. The positioning with a mounting area and the mounting method (hereinafter referred to as the local recognition method) are applied to realize the mounting with high position accuracy.

In the manufacturing process of FO-WLP, first, a plurality of semiconductor chips are mounted in a matrix on a supporting substrate in a spaced state, and then the gaps between the semiconductor chips are sealed with resin to integrate the plurality of semiconductor chips. By doing so, a pseudo wafer shaped like a wafer formed in a semiconductor manufacturing process is formed. A redistribution layer for forming I/O terminals is formed on this pseudo wafer. After the plurality of semiconductor chips are resin-sealed and integrated, the support substrate is peeled off and removed. However, when an MCP is manufactured by FO-WLP, since there is no image recognizable pattern that can be used for position recognition for each mounting area on which a semiconductor chip is mounted on the support substrate, the interposer substrate cannot be used. It is not practical to apply the local recognition method as used for the above.

If local recognition cannot be performed, the overall position of the supporting substrate can be recognized by recognizing the external position of the supporting substrate and the alignment mark indicating the position of the entire substrate, and each mounting on the supporting substrate can be performed by relying on the entire position of the supporting substrate. A method of mounting a semiconductor chip on the area (hereinafter referred to as a global recognition method) will be applied. In addition, the displacement of the mounting position of the semiconductor chip in the MCP is formed by the terminals of the semiconductor chip and the rewiring layer when a semiconductor chip having a standard electrode pad diameter (20 μm) and a formation pitch (35 μm) is considered. In order to secure a contact area with a terminal to be formed and to avoid contact with an adjacent terminal, it is desirable to suppress the thickness to ±5 μm or less.

However, when a mounting device for mounting a semiconductor chip on a substrate having an alignment mark for each mounting area such as an interposer substrate is set in the global recognition method and used as it is in the FO-WLP manufacturing process, the mounting accuracy is In this case, a mounting error exceeding ±5 μm occurred, and it was not possible to mount the semiconductor chip on the supporting substrate in which the alignment mark is not provided for each mounting region with high accuracy. Therefore, in the manufacturing process of the FO-WLP to which the global recognition method is applied, there is no mounting device capable of mounting the semiconductor chip with a positional accuracy of ±5 μm or less.

As long as the mounting accuracy is improved, it is conceivable to previously provide the support substrate used in the FO-WLP manufacturing process with alignment marks corresponding to the respective mounting regions and apply the local recognition method. However, the FO-WLP support substrate is peeled off from the pseudo wafer after the pseudo wafer is formed, and is not used as a product. Providing equipment and processes for forming marks for such a support substrate not only increases equipment cost, installation space for equipment, and the number of steps, but also increases the number of steps for mounting semiconductor chips in each mounting step. Therefore, the operation of recognizing the local mark is required, and the mounting process time of one semiconductor chip also increases. From this point of view, the application of the local recognition method increases the manufacturing cost of the semiconductor package and impairs the advantages of WLP.

Further, in order to cope with the mounting error of the semiconductor chip, a technique of forming the rewiring layer in consideration of the mounting error of the semiconductor chip has been proposed. In this technique, when the circuit pattern of the redistribution layer is exposed on the pseudo wafer, the mounting error (displacement from the ideal position) of each semiconductor chip on the pseudo wafer is individually measured in advance and the exposure is performed. When scanning the semiconductor laser beam for each semiconductor chip, the position information of each circuit pattern included in the drawing data is corrected based on the mounting error of the semiconductor chip to be exposed. This technique can be applied to a single chip package in which one semiconductor chip is incorporated in one semiconductor package. However, in the case of the MCP, since the drawing data of the circuit pattern is created for each package, when the relative positional deviation between the semiconductor chips in the same package occurs, the position information of the drawing circuit pattern is corrected. You can't do it just by doing.

Further, the mounting apparatus used in the FO-WLP manufacturing process is required to shorten the mounting time of the semiconductor chip. That is, the process of forming the redistribution layer on the pseudo wafer is usually performed collectively for one pseudo wafer, whereas the process of mounting the semiconductor chips on the support substrate is performed one semiconductor chip at a time. .. Considering these processing times, the semiconductor chip mounting process requires more time than the rewiring layer forming process, so that it is required to shorten the semiconductor chip mounting time. If only the mounting time is shortened, it is possible to apply a mounting apparatus having a plurality of mounting heads. However, simply applying a plurality of mounting heads further reduces the mounting accuracy of the semiconductor chip due to the influence of the movement error that occurs in each mounting head. As described above, the mounting apparatus used in the FO-WLP manufacturing process is required to achieve both improvement in mounting accuracy of electronic components such as semiconductor chips and reduction in mounting time.

JP, 2008-041976, A JP, 2009-259917, A International Publication No. 2007/072714 JP, 2013-058520, A

The problem to be solved by the present invention is to provide an electronic component such as a semiconductor chip in each mounting region with high accuracy and efficiency even in a supporting substrate in which a pattern such as a mark for position detection is not formed for each mounting region. An object of the present invention is to provide an electronic component mounting apparatus and a mounting method that enable good mounting, and a package component manufacturing method to which such a mounting method is applied.

An electronic component mounting apparatus according to an embodiment is a stage on which a support substrate having a plurality of mounting areas on which electronic components are mounted is placed, and the plurality of mounting areas are sequentially positioned at fixed mounting positions, A stage unit including a stage moving mechanism that moves a stage, first and second mounting heads that respectively hold the electronic component and mount the electronic component on the mounting area of the support substrate, and the first holding unit that holds the electronic component. A mounting unit that includes a mounting head moving mechanism that alternately moves the first and second mounting heads to the mounting position, and a first recognition unit that recognizes the entire position of the support substrate placed on the stage. A second recognition unit that recognizes the position of the electronic component held by the first or second mounting head, and a storage unit that stores correction data that corrects a movement position error of the stage caused by the stage movement mechanism. Based on the position data of the support substrate recognized by the first recognition unit, the position data of the electronic component recognized by the second recognition unit, and the correction data, And a control unit for controlling the movement of the mounting head.

An electronic component mounting method according to an embodiment obtains a movement position error of a stage on which a support substrate having a plurality of mounting areas on which an electronic component is mounted is mounted, and stores correction data for correcting the movement position error. The step of storing the supporting substrate on the stage, recognizing the entire position of the supporting substrate placed on the stage, and the step of recognizing the position of the supporting substrate. Correcting the movement of the stage based on the position data of the support substrate and the correction data, and moving the stage so that the plurality of mounting areas are sequentially positioned at a fixed mounting position; The second mounting head alternately receives the electronic component, recognizes the position of the electronic component held by the first or second mounting head, and determines the position based on the recognized position data of the electronic component. While correcting the movement of the first and second mounting heads, the first and second mounting heads are alternately moved to the mounting position, and the electronic components are mounted by the first and second mounting heads. And alternately mounting in the mounting areas sequentially positioned in the position.

A method of manufacturing a package component according to an embodiment includes a step of mounting an electronic component on each of the plurality of mounting regions in a support substrate having a plurality of mounting regions, and the electronic components mounted on the plurality of mounting regions at once. And forming a pseudo-wafer by encapsulating the pseudo-wafer, and forming a rewiring layer on the electronic part of the pseudo-wafer to manufacture a package part. The step of mounting the electronic component in the method of manufacturing a package component according to the embodiment obtains a movement position error of a stage on which the support substrate is placed, and stores correction data for correcting the movement position error in a storage unit. And a step of mounting the support substrate on the stage and recognizing the entire position of the support substrate mounted on the stage, and a position of the support substrate obtained by the position recognition step of the support substrate. Correcting the movement of the stage based on the data and the correction data, and moving the stage so that the plurality of mounting areas are sequentially positioned at a fixed mounting position, and first and second mounting The head alternately receives the electronic component, recognizes the position of the electronic component held by the first or second mounting head, and determines the first and second positions based on the recognized position data of the electronic component. While correcting the movement of the mounting head, the first and second mounting heads are alternately moved to the mounting position, and the electronic components are sequentially positioned at the mounting position by the first and second mounting heads. And alternately mounting in the mounting area.

It is a top view which shows the mounting apparatus of embodiment. It is a front view which shows the mounting apparatus of embodiment. It is a right side view which shows the mounting apparatus of embodiment. It is a top view which shows a part of mounting device of an embodiment with a dashed-two dotted line, and is a figure for explaining the carrying in/out state of a support substrate. It is a front view which abbreviate|omits a part of mounting apparatus of embodiment, Comprising: It is a figure for demonstrating the position recognition state of an electronic component. It is a block diagram showing a mounting device of an embodiment. It is a top view showing a wafer ring which supplies a semiconductor chip to a mounting device of an embodiment. FIG. 7B is a cross-sectional view of the wafer ring taken along line XX of FIG. 7A. It is a figure which shows the preparation process of the calibration process of the board|substrate stage in the mounting apparatus of embodiment. It is a figure which shows the calibration process of the board|substrate stage in the mounting apparatus of embodiment. FIG. 6 is a diagram for explaining a method of correcting the movement position error of the substrate stage in the mounting apparatus of the embodiment. 6A and 6B are diagrams for explaining a method of correcting the positional deviation of the support substrate in the mounting apparatus of the embodiment. It is a top view which shows an example of the electronic component mounted in one mounting area|region using the mounting apparatus of embodiment. FIG. 6 is a plan view showing a supporting substrate on which a semiconductor chip is mounted using the mounting apparatus of Example 1 and Comparative Example 1. It is a flowchart which shows the manufacturing process of the package components of embodiment.

Hereinafter, an electronic component mounting apparatus and a mounting method of an embodiment will be described with reference to the drawings. The drawings are schematic, and the relationship between the thickness and the plane dimension, the ratio of the thickness of each portion, and the like may differ from the actual one. Unless otherwise specified, the terms indicating the up and down directions in the description indicate the relative directions when the mounting surface of the electronic component of the supporting substrate described below is on the top, and the terms indicating the left and right directions are particularly Unless otherwise specified, the direction is based on the front view of FIG.

[Configuration of mounting device]
1 is a plan view showing a configuration of a mounting apparatus for electronic components according to an embodiment, FIG. 2 is a front view of the mounting apparatus shown in FIG. 1, and FIG. 3 is a right side view of the mounting apparatus shown in FIG. In FIG. 1 and FIG. 2, of the transfer parts 40A and 40B arranged on the left and right of the mounting apparatus 1 and the transfer parts 40A and 50B arranged on the left and right, the transfer part 40A and the mounting part 50A on the left side are It is shown by a dotted line, and the transfer section 40B and the mounting section 50B on the right side are shown by solid lines. FIG. 4 is a diagram for explaining the loading/unloading state of the support substrate W, in which the left and right mounting parts 50A and 50B are indicated by alternate long and two short dashes lines in a plan view similar to FIG. FIG. 5 is a view for explaining the state of the recognition camera in the front view similar to FIG. 2, with the transfer section 40A and the mounting section 50A on the left side omitted. FIG. 6 is a block diagram showing the configuration of the mounting apparatus according to the embodiment. 7A and 7B are views showing a wafer ring for supplying a semiconductor chip as an electronic component. In these figures, the left-right direction is the X direction, the front-back direction is the Y direction, and the up-down direction is the Z direction with respect to the mounting apparatus 1.

The mounting apparatus 1 shown in FIGS. 1 to 6 has a component supply unit 10 for supplying electronic components such as a semiconductor chip t, a stage unit 20 including a stage 21 on which a support substrate W is mounted, and a stage 21. The substrate transfer unit 30 for loading and unloading the support substrate W, the pair of transfer units 40 for taking out the semiconductor chips t from the component supply unit 10, and the semiconductor chips t taken out by the pair of transfer units 40 are received by the stage 21. It is provided with a pair of mounting parts 50 mounted on the mounted support substrate W, and a control part 60 controlling the operation of each part.

The component supply unit 10 detachably holds the wafer ring 11 (FIGS. 7A and 7B) and the wafer ring 11 that holds the resin sheet S to which the semiconductor wafer T separated into individual semiconductor chips t is attached. , A wafer ring holder 12 movable in the XY directions by an XY moving mechanism (not shown), a first camera 13 for picking up an image of the semiconductor chip t stuck on the wafer ring 11, and a semiconductor chip t by the transfer section 40. And a push-up mechanism (not shown) that pushes up the semiconductor chip t to be taken out from the lower side of the wafer ring 11.

The push-up mechanism is fixedly provided at the take-out position of the semiconductor chip t by the transfer unit 40. The semiconductor chips t on the wafer ring 11 are sequentially positioned at the take-out position by the wafer ring holder 12. The first camera 13 is arranged right above the take-out position, and is for recognizing the chip position by imaging the semiconductor chip t positioned at the take-out position.

The component supply unit 10 further includes a wafer ring 11 replacement device (not shown). The exchanging device is provided with a storage portion (which is provided with a plurality of groove portions for accommodating the wafer ring 11 in the vertical direction, which is also referred to as a magazine) provided on the front surface side of the mounting apparatus 1 and a wafer ring transfer portion. The exchange device supplies an unused wafer ring 11 onto the wafer ring holder 12, stores the wafer ring 11 from which the semiconductor chips t have been taken out in a storage portion, and supplies a new wafer ring 11 to the wafer ring holder 12. To do.

The electronic components mounted on the support substrate W are not limited to one type of semiconductor chip t, and may be a plurality of types of semiconductor chips, or a semiconductor chip and a diode or a capacitor. The mounting apparatus 1 of the embodiment is preferably used when mounting a plurality of types of electronic components including a semiconductor chip, a diode, a capacitor, and the like on a support substrate W to manufacture an MCP. Examples of the configuration of the MCP include those provided with a plurality of types of semiconductor chips, those provided with one type of semiconductor chips and diodes, capacitors, etc., and those provided with a plurality of types of semiconductor chips, diodes, capacitors, etc.

The component supply unit 10 is not limited to the chip supply mechanism using the wafer ring 11 to which the individualized semiconductor wafer T is attached. A chip supply mechanism using a tape feeder or a tray, for example, can be applied to the component supply unit 10. A tape feeder supplies semiconductor chips t housed in each pocket of a carrier tape (also called an embossed carrier tape) in which concave (embossed) pockets are continuously formed on a tape-shaped resin sheet. It is a thing. The carrier tape is accommodated in a state in which a pocket accommodating the semiconductor chip t is covered with a cover tape from above and wound around a reel. The carrier tape is unwound from this reel, and while the cover tape is peeled off, each pocket is sequentially positioned at the take-out position of the semiconductor chip t.

When such a tape feeder is used, the semiconductor chips t may be alternately picked up by the left and right transfer parts 40A and 40B from one tape feeder, or two tape feeders may be arranged in parallel to each other. The transfer section 40A may pick up the semiconductor chip t from the left tape feeder, and the right transfer section 40B may pick up the semiconductor chip t from the right tape feeder. Further, it is also possible to configure a plurality of types of tape feeders accommodating semiconductor chips t of different types so that a plurality of types of semiconductor chips t can be selectively supplied. Such a configuration is effective when a plurality of types of semiconductor chips t are mounted on one support substrate W.

Further, both supply of the semiconductor chip t by the wafer ring 11 and supply of the semiconductor chip t by the tape feeder may be provided. Specifically, the tape feeder for the left transfer section 40A is arranged on the left side of the wafer ring holder 12, and the tape feeder for the right transfer section 40B is arranged on the right side. An XY transfer device is provided in each of the transfer units 40A and 40B, and the transfer units 40A and 40B are transferred to the take-out position for taking out the semiconductor chip t from the wafer ring 11 and the take-out position for taking out the semiconductor chip from the tape feeder. It is preferable that the nozzle 44 be movable.

The stage unit 20 includes a stage 21 on which the support substrate W having a plurality of mounting areas is placed, and an XY moving mechanism (not shown) that moves the stage 21 in the XY directions. The XY moving mechanism moves the stage 21 so that each mounting area of the support substrate W placed on the stage 21 is sequentially positioned at a certain mounting position described in detail later. The stage 21 is configured to be capable of sucking and holding the mounted support substrate W by a suction/suction mechanism (not shown). A second camera 22 for picking up an image of the support substrate W is arranged above the stage 21. The second camera 22 images, for example, a global mark provided on the support substrate W and recognizes the entire position of the support substrate W, and functions as a first recognition unit. The entire position of the support substrate W may be recognized by capturing an image of the outer shape of the support substrate W with the second camera 22.

The support substrate W placed on the stage 21 is a substrate used for forming a pseudo wafer applied at the time of manufacturing the FO-WLP, and is made of a glass substrate, a silicon substrate, a metal substrate such as stainless steel, or the like. The pseudo wafer is a state in which electronic components such as a plurality of individualized semiconductor chips are arranged in a plane, and the electronic components are resin-sealed to form a single plate. Therefore, the shape of the support substrate W used for forming the pseudo wafer is not limited to the circular shape, and may be a quadrangle or other polygonal shape, elliptical shape, or the like, and the shape is not particularly limited. Absent. The supporting substrate W is preferably a substrate used when manufacturing an MCP by the FO-WLP process as described above, that is, a substrate on which electronic components such as a plurality of semiconductor chips and capacitors are mounted in each mounting region.

The support substrate W has a plurality of mounting areas on which electronic components such as the semiconductor chip t are mounted. However, the plurality of mounting areas are virtually set on the support substrate W, and no mark or pattern indicating each mounting area is formed. The support substrate W may be provided with an alignment mark for global recognition that indicates the position of the entire substrate, but it is not provided with an alignment mark for local recognition that indicates the position of each mounting area. The global recognition method is a method of mounting electronic components in a plurality of mounting areas on a substrate by detecting the position of the substrate once when mounting electronic components in a plurality of mounting areas of a supporting substrate. Say that. The local recognition method refers to a method of detecting the position of the mounting area of the electronic component each time the electronic component is mounted when mounting the electronic component on each of the plurality of mounting areas on the support substrate.

The substrate transfer unit 30 includes a carry-in conveyor 31, a carry-out conveyor 32, a first transfer unit 33 that transfers the support substrate W between the carry-in conveyor 31 and the stage 21, and a stage 21 and the carry-out conveyor 32. A second transfer unit 34 that transfers the support substrate W, and a guide unit that is provided from the position where the carry-in conveyor 31 is arranged to the position where the carry-out conveyor 32 is arranged and movably supports the first and second transfer units 33, 34. And 35. The first and second transfer parts 33 and 34 are configured to be individually movable along the guide part 35 by a timing belt (neither shown) driven by a rotary motor. However, the driving of the transfer units 33 and 34 is not limited to the timing belt, and may be performed by another driving device such as a linear motor.

The first and second transfer parts 33 and 34 have the same configuration, and are movable parts 33a and 34a that move along the guide part 35 and horizontal parts that are vertically movable on the movable parts 33a and 34a. The arms 33b and 34b are provided with four suction nozzles 33c and 34c provided to the horizontal arms 33b and 34b so as to suck and hold the support substrate W from above. The suction nozzles 33c and 34c are fixed to the horizontal arms 33b and 34b so as to suck a blank portion of the outer edge portion of the support substrate W where the semiconductor chip t is not mounted.

The pair of transfer parts 40 are arranged such that the two transfer parts 40A and 40B are laterally inverted, and have the same configuration except that the two transfer parts 40A and 40B are laterally inverted. Have The configuration of the transfer section 40B on the right side will be described with reference to FIGS. 1, 2, and 3. The transfer section 40B includes an elevating device 41, an arm body 42 supported by the elevating device 41 so as to be vertically movable, a reversing mechanism 43 provided at the tip of the arm body 42, and a suction mechanism provided in the reversing mechanism 43. And a nozzle (transfer nozzle) 44. The lifting device 41 includes a rotation motor 45, and moves the arm body 42 up and down via a ball screw mechanism (not shown).

The reversing mechanism 43 is fixed to the side surface on the front side of the apparatus at the tip of the arm body 42, and has a rotation drive unit 46 provided with a rotation shaft extending in the Y direction penetrating the arm body 42, and a rotation shaft of the rotation drive unit 46. And an inversion arm 47 connected to the. The reversing arm 47 is reversed by 180 degrees in a locus that draws an arc on the upper side between a horizontal state in which the tip end portion faces the device left direction and a horizontal state in which the tip end portion faces the right direction. The suction nozzle 44 is attached to the reversing arm 47 so that the suction surface for vacuum-sucking the semiconductor chip t faces downward with the reversing arm 47 in a horizontal state in which the reversing arm 47 faces left. The transfer section 40A on the left side also has the same configuration except that the arrangement of each section is reversed horizontally.

The left and right transfer parts 40A and 40B are located right above the pick-up mechanism (take-out position) with the suction surface of the suction nozzle 44 in a state where the reversing arm 47 is rotated so that the suction surface of the suction nozzle 44 faces downward. It is arranged in a positional relationship. For this reason, when the suction nozzles 44 of both the transfer units 40A and 40B are reversed so as to be positioned at the take-out position at the same time, the suction nozzles 44 (reversing arms 47) collide with each other. Therefore, the suction nozzle 44 is controlled so that the suction state in which the suction surface is inverted upward is set to the standby state, and the suction nozzle 44 is alternately moved from the standby state to the take-out position.

Similar to the pair of transfer units 40, the pair of mounting units 50 are two mounting units 50A and 50B having the same configuration, which are arranged in a horizontally inverted state. The configuration of the right mounting portion 50B will be described with reference to FIGS. 1, 2, and 3. The mounting portion 50B includes a support frame 51 having a gate shape in a side view, an X-direction moving block 52 movably supported on the support frame 51 along the X direction, and a left side surface of the X-direction moving block 52. A Y direction moving device 53 provided, a movable body 54 provided on the Y direction moving device 53 so as to be movable in the Y direction, and a mounting head 55 provided on the movable body 54 so as to be vertically movable. There is. At the lower end of the mounting head 55, a mounting tool 56 having a lower surface for holding the semiconductor chip t is provided. The mounting tool 56 can be replaced according to the type (especially size) of the semiconductor chip t. The mounting unit 50B may include an automatic changer for the mounting tool 56.

A metal material such as aluminum is generally used for the frame material of the mounting portion 50. However, the movement position of the mounting head 55 may be displaced due to the thermal expansion of aluminum or the like due to the heat generated by the driving unit. In order to minimize such positional displacement due to thermal expansion, it is preferable to use a composite material of a metal material such as aluminum and ceramics. Specifically, it is preferable that the main bodies of the X-direction moving block 52 and the Y-direction moving device 53 are made of a composite material of aluminum and ceramics or the like. Examples of the composite material of aluminum and ceramics include a composite material of aluminum and silicon carbide (SiC). With such a composite material, the coefficient of thermal expansion can be reduced to about 60% as compared with aluminum, for example.

Further, the thermal expansion amount of the frame material due to the operation of the device may be measured in advance, and this thermal expansion amount may be added to the correction data of the mounting head 55. The correction data due to the thermal expansion of the frame material of the mounting unit 50 is acquired as follows, for example. First, a target (not shown) for confirming the position of the mounting tool 56 is provided near the mounting tool 56 of the mounting head 55, and the position of the target positioned at the receiving position of the semiconductor chip t is set to a third camera described later. Recognize at 57. Next, the mounting head 55 is moved to the mounting position, and the position of the target at this time is recognized by the second camera 22. Such position recognition of the target is performed again after the mounting head 55 is moved from the receiving position to the mounting position a predetermined number of times. By such an operation, the amount of displacement of the mounting head 55 due to thermal expansion of the frame material due to the operation of the apparatus is acquired. The correction data based on the positional displacement amount of the mounting head 55 is taken into consideration when correcting the position of the mounting head 55, which will be described later.

The X-direction moving block 52 is mounted on the support frame 51 via the X-direction guide member 52a, and is movable in the X-direction by a ball screw mechanism (not shown) driven by a motor. The Y-direction moving device 53 includes a Y-direction guide member 53a that movably supports the movable body 54 in the Y direction, and a ball screw mechanism (not shown) driven by a motor, and moves the movable body 54 in the Y-axis direction. It is movable. Although not shown, the mounting unit 50B includes a moving device that moves the mounting head 55 in the vertical direction (Z direction). Known examples of vertical movement devices (movement guide means) include linear motion guides (LM guides) and cross roller guides, and any of these may be used. Of these, when the cross roller guide is used as the vertical guide means, the reproducibility of the horizontal position when repeatedly lowered to the same height position is higher than that when the LM guide is used, that is, It is characterized in that horizontal displacement is unlikely to occur. Further, the mounting head 55 includes a rotation direction (θ direction) correction mechanism (not shown). The mounting portion 50A on the left side has the same configuration except that the arrangement of each portion is horizontally reversed.

The mounting unit 50B receives the semiconductor chip t taken out from the component supply unit 10 by the transfer unit 40B from the suction nozzle 44, and mounts the received semiconductor chip t on the support substrate W placed on the stage 21. The same applies to the mounting unit 50A, in which the semiconductor chip t taken out from the component supply unit 10 by the transfer unit 40A is received from the suction nozzle 44, and the received semiconductor chip t is placed on the support substrate W placed on the stage 21. Implement. The mounting position at which the mounting tool 56 mounts the semiconductor chip t on the support substrate W on the stage 21 is set to a fixed position. Therefore, the movement of the stage 21 is controlled so that each mounting area on the support substrate W is sequentially positioned at the mounting position. Here, the fixed position is, for example, the center of the movable range of the stage 21 in the XY directions. The second camera 22 described above is arranged, for example, directly above the mounting position. Since FIG. 1 shows a state in which the stage 21 is located at the carry-in/carry-out position where the substrate carrier 30 carries in/carry out the support substrate W, the stage 21 moves from the center of the movable range to the rear side of the apparatus. It exists at a slightly displaced position.

The mounting position is not limited to the fixed position where the mounting tool 56 of the right mounting portion 50B mounts the semiconductor chip t on the support substrate W, and is the same for the left mounting portion 50A and the right mounting portion 50B. It is a fixed position. That is, the position where the left mounting portion 50A mounts the semiconductor chip t on the support substrate W is the same as the position where the right mounting portion 50B mounts the semiconductor chip t on the support substrate W. The semiconductor chips t are alternately mounted by the pair of mounting parts 50A and 50B at the mounting position.

Since each mounting region of the support substrate W is sequentially positioned at a fixed mounting position by the XY moving mechanism of the stage unit 20, the mounting tools 56 of the left and right mounting units 50A and 50B are attached to the suction nozzles of the transfer units 40A and 40B, respectively. The semiconductor chip t is moved from a position (reception position) for receiving the semiconductor chip t from 44 to a fixed mounting position. Below the movement path of these mounting tools 56, third cameras 57 for picking up images of the semiconductor chips t adsorbed and held by the mounting tools 56 from below are arranged. The third camera 57 is arranged below the movement path of the mounting tool 56 and above the wafer ring holder 12. The third camera 57 is installed on each of the moving path of the mounting tool 56 in the left mounting section 50A and the moving path of the mounting tool 56 in the right mounting section 50B. The third camera 57 functions as a second recognition unit.

The mounting apparatus 1 of the embodiment includes a control unit 60 as shown in FIG. The control unit 60 controls the operations of the component supply unit 10, the stage unit 20, the substrate transfer unit 30, the transfer unit 40, and the mounting unit 50 based on the information stored in the storage unit 61, and includes the semiconductor chip t. Electronic components are sequentially mounted on each mounting region of the support substrate W. The storage unit 61 also stores data for correcting the movement position error of the stage 21 obtained in the step of obtaining the movement position error of the stage 21 described below, and the movement of the stage 21 is controlled based on this correction data. It

[Operation of mounting equipment (mounting of electronic parts)]
Next, a mounting process of the electronic component such as the semiconductor chip t using the mounting apparatus 1 will be described. When only the global recognition method is applied when mounting electronic components such as the semiconductor chip t in each mounting area of the support substrate W, the position recognition of the mounting area is not performed, and therefore the positioning accuracy of the semiconductor chip t with respect to each mounting area is not performed. Will depend on the recognition accuracy of the global mark and the like of the support substrate W and the machining accuracy of the XY movement mechanism of the stage 21. However, it is practically impossible in terms of metalworking to finish a guide rail or the like for guiding the movement of the stage 21 with a precision of ±5 μm or less over a desired length. Furthermore, it is even more impossible to assemble a guide rail having a desired length to a metal frame or the like with a linearity of ±5 μm or less and a waviness. Therefore, the movement position error of the stage 21 is measured, and data for correcting the movement of the stage 21 is acquired (calibration).

{Step of obtaining moving position error (correction data) of stage 21 (calibration step)}
The data for correcting the moving position error of the stage 21 is acquired by using the calibration substrate 71 as shown in FIG. The calibration substrate 71 is, for example, a glass substrate on which dot marks 72 for position recognition are provided in a matrix at preset intervals. The dot marks 72 on the calibration substrate 71 are provided at intervals of 3 mm within a range of, for example, 300 mm length×300 mm width. The dot mark 72 is formed of a metal thin film or the like, and can be formed by using a film forming technique such as etching or sputtering. The diameter of the dot mark is 0.2 mm, for example. Such a calibration substrate 71 is accurately set on the stage 21. The method of setting the calibration substrate 71 is not particularly limited, but for example, the following method is used. Here, the calibration substrate 71 has the same size as the support substrate W, and the range in which the dot marks are provided is the same size as the range including all the mounting regions on the support substrate W.

(Set of calibration board 71)
The calibration substrate 71 as described above is set on the stage 21 manually by the operator. The calibration substrate 71 is set by placing the calibration substrate 71 on the stage 21 and then performing parallel adjustment of the calibration substrate 71 (adjustment in which the dot marks 72 are aligned in the XY directions). The parallel adjustment is performed by using the second camera 22 used for imaging the global mark on the support substrate W. First, on the calibration substrate 71 placed on the stage 21, for example, as shown in FIG. 8, the dot mark 72 located at the left front corner of the calibration substrate 71 is in the imaging field of view 22 a of the second camera 22. The position of the stage 21 is adjusted so that it becomes the center.

From this state, the stage 21 is moved toward the left side in the X direction at a low speed (a speed at which the dot mark 72 slowly flows within the visual field 22a of the camera 22). At this time, the operator monitors the image captured by the second camera 22 on the monitor, and if the position of the dot mark 72 captured by the second camera 22 shifts to the upper side or the lower side with respect to the image capturing visual field 22a, the stage is displayed. The movement of 21 is stopped, and the inclination of the calibration substrate 71 is manually adjusted in the direction of eliminating the deviation. The imaging visual field 22a in FIG. 8 shows an example of a state in which the position of the dot mark 72 appearing in the imaging visual field 22a gradually shifts to the lower side as the stage 21 moves.

After adjusting the inclination of the calibration substrate 71, the position of the stage 21 is adjusted so that the dot mark 72 located at the left front corner is in the center of the visual field 22a of the second camera 22, and the stage 21 is moved at a low speed. Move to the left side in the direction. Similarly, the operator monitors whether the position of the dot mark 72 is displaced on the monitor. When the position is displaced, the movement of the stage 21 is stopped and the inclination of the calibration substrate 71 is adjusted. Such an operation is repeated until the dot mark 72 located at the right front corner of the calibration substrate 71 is displayed on the monitor screen without coming off. If the dot marks 72 in the front left corner to the dot mark 72 in the right front corner can be adjusted so that the dot marks 72 can be captured within the visual field 22a of the camera 22, the setting of the calibration substrate 71 is completed. The movement of the stage 21 by the operator is performed by operating the touch panel and the joystick.

(Acquisition of movement position error (correction data) of stage 21)
Next, the position of the dot mark 72 of the calibration substrate 71 set on the stage 21 is sequentially detected by the method as described above, thereby obtaining the moving position error and the correction data based on the error. The dot mark 72 on the calibration substrate 71 is imaged, for example, as shown in FIG. 9, with the dot mark 72 located in the center of the calibration substrate 71 as the first dot mark (first dot mark) 72a to be imaged, and the dot The last dot mark 72n is performed while sequentially moving outward from the mark 72a in a spiral locus.

First, the operator operates the stage 21 and moves the calibration substrate 71 while looking at the monitor so that the first dot mark 72a becomes the center of the visual field of the camera 22. The central dot mark 72a is provided with an identification mark adjacent to the dot mark 72a so that it can be distinguished from the other dot marks 72. In FIG. 9, the dot mark 72a is indicated by a circle cross instead of indicating the adjacent mark. When the first dot mark 72a is positioned so as to be the center of the visual field of the camera 22, the operation of detecting the dot mark 72 is started. From this point onward, automatic control is performed by the control unit 60. The detection operation is started by the operator pressing (touching) a detection operation start button displayed on the touch panel.

When the operation of detecting the dot mark 72 is started, first, the first dot mark 72a is imaged. The captured image of the first dot mark 72a is processed by using a known image recognition technique, and the positional deviation of the dot mark 72 with respect to the center of the visual field of the camera 22 is detected. The detected positional deviation is stored in the storage unit 61 as information paired with the moving position (XY coordinate) of the stage 21. When the position detection of the central dot mark 72a is completed, the stage 21 is moved so as to position the next (second) dot mark 72 in the field of view of the camera according to the capturing order. In the example of FIG. 9, the second dot mark 72 is located to the left of the first dot mark 72a, so the stage 21 is moved to the right in the X direction by 3 mm.

The movement of the stage 21 is performed based on the reading value of the linear encoder provided in the XY movement mechanism of the stage 21. As a scale of the linear encoder, it is preferable to use a glass scale having a small thermal expansion coefficient as a measure against heat. When the movement of the stage 21 is completed, the positional deviation of the second dot mark 72 is detected in the same manner as the first dot mark 72a, and is stored in the storage unit 61 as information paired with the XY coordinate of the stage 21 at this time. Remembered. The imaging of the dot mark 72 is performed after the stage 21 is stopped and after waiting for a time sufficient for the vibration generated when the stage 21 is stopped to subside. Such an operation is performed for all the dot marks 72 on the calibration substrate 71, the movement position deviation data of the dot marks 72 corresponding to each position is acquired, and stored in the storage unit 61 as correction data.

(Acquisition of correction data due to thermal expansion of the supporting substrate W)
In order to improve the bondability of the die attach film used for bonding the semiconductor chip t, a heater may be provided on the stage 21 to heat the support substrate. In such a case, the temperature of the supporting substrate W is changed (increased) before and after being placed on the stage 21, so that the supporting substrate W is thermally expanded correspondingly. When the support substrate W thermally expands, even if the stage 21 and the mounting head 55 are moved with high accuracy, the mounting position is displaced by the amount by which the support substrate W extends.

Therefore, the thermal expansion amount of the support substrate W generated by the heating of the heater is grasped by measuring it in advance, and when the semiconductor chip t is mounted on the support substrate W, a coefficient (percentage) corresponding to the preliminarily grasped thermal expansion amount is calculated. ) Is preferably multiplied by the correction data to control the movement of the stage 21. At this time, the entire support substrate W does not always thermally expand uniformly due to factors such as the shape and arrangement of the heater and the structure of the stage 21, so the distribution of thermal expansion may also be comprehended. For example, the region on the support substrate W is divided into a plurality of lattice-shaped regions such as 10 rows×10 columns, and the amount of thermal expansion (displacement due to thermal expansion of each measurement point) is measured for each divided region. Then, the coefficient by which the correction data of the stage 21 is multiplied may be switched for each region.

Further, the thermal expansion amount of the support substrate W is measured at every predetermined elapsed time after the support substrate W is placed on the stage 21 until the thermal expansion of the support substrate W becomes saturated with respect to the temperature of the stage 21. Alternatively, a coefficient according to the amount of thermal expansion for each predetermined elapsed time may be obtained. At this time, a coefficient corresponding to the amount of thermal expansion may be obtained for each of the regions obtained by dividing the support substrate W into a plurality of regions. Then, when the semiconductor chip t is mounted, the coefficient corresponding to the elapsed time is switched for each elapsed time after the supporting substrate W is placed on the stage 21, and the correction data is multiplied by the coefficient to multiply the stage 21. To move. By doing so, the mounting of the semiconductor chip t on the support substrate W can be started without waiting for the thermal expansion of the support substrate W to become saturated with respect to the temperature of the stage 21. The semiconductor chip t can be mounted efficiently.

(Correction of movement position of stage 21)
When the stage 21 is moved, the movement position of the stage 21 is corrected by referring to the correction data obtained in the step of obtaining the movement position error of the stage 21. First, the stage 21 is moved in order to position the mounting area where the semiconductor chip t is first mounted on the support substrate W at the mounting position. At this time, the control unit 60 refers to the position information (XY coordinates) of the first mounting area stored in the storage unit 61 and the above-described correction data, and determines the correction value necessary when positioning the first mounting area at the mounting position. Select. The amount of movement of the stage 21 when the first mounting area is positioned at the mounting position is corrected by the selected correction value. When the stage 21 has a heater, it is preferable to multiply the correction data of the stage 21 by the coefficient based on the thermal expansion amount of the supporting substrate W described above.

FIG. 10 shows an example in which the mounting area (xi, yi) MA is moved to the mounting position P. When the mounting area MA is moved to the mounting position P as it is, and a positional deviation (Δni, Δmi) occurs based on the machining accuracy or the like, the positional deviation amount (Δni, Δmi) is obtained from the correction data, and the positional deviation of the stage 21 is calculated. The stage 21 is moved by adding a correction value (−Δni, −Δmi) for canceling the positional deviation to the movement amount. In this way, each mounting area on the support substrate W is sequentially positioned at the mounting position P. In the above example, since the correction data is acquired at 3 mm intervals, the mounting area does not always match the position where the correction data is acquired. Therefore, when the mounting area is located between the positions where the positional deviation of the dot mark 72 is acquired, the data of two adjacent positional deviations are linearly interpolated to approximately calculate the positional deviation data corresponding to the mounting area. And use it as a correction value.

The above-described step of acquiring the movement position error (correction data) of the stage 21 may be basically performed when the mounting apparatus 1 is operated, and the movement of the stage 21 may be controlled based on the measurement result. However, the stage 21 and the mounting head 55 may be incorporated with a heater or the like for assisting the mounting of the semiconductor chip t, and the temperature of each part of the apparatus may rise and the thermal expansion may reduce the mechanical accuracy. Further, as the mounting process of the semiconductor chip t by the mounting apparatus 1 progresses, heat generated by a motor or the like that moves the mounting head 55 may reduce the mechanical accuracy of each part of the apparatus. When the movement error due to such temperature rise is taken into consideration, the step of acquiring the movement position error (correction data) may be performed not only once when the apparatus is in operation. This can further improve the positioning accuracy of the semiconductor chip t and the like.

{Electronic component mounting process}
After the above-mentioned movement position error (correction data) of the stage 21 is acquired and the correction data is stored in the storage unit 61, a step of mounting electronic components such as the semiconductor chip t on the support substrate W is performed.

(1) Step of Loading Wafer Ring 11 First, an unused wafer ring 11 is loaded into the wafer ring holder 12 from a storage unit (not shown), and the wafer ring 11 is fixed onto the wafer ring holder 12.

(2) Support substrate W setting step (2-1: Supply of support substrate W)
The support substrate W carried on the carry-in conveyor 31 is suction-held by the first transfer unit 33 and placed on the stage 21 positioned at the carry-in/carry-out position. The first transfer unit 33 that has transferred the support substrate W to the stage 21 moves to the position of the carry-in conveyor 31 and stands by. During this operation, the second transfer unit 34 stands by at the position of the carry-out conveyor 32. The step (2) may be performed in parallel with the step (1) or may be performed individually.

The support substrate W is carried into the carry-in conveyor 31 from a loader (not shown). Like the wafer ring supply unit, the loader is provided with a magazine that can hold the supporting substrate W with a gap in the vertical direction so that the magazine can be moved up and down, and the supporting substrate positioned at the same height as the carrying level of the carry-in conveyor 31. W is pushed out by a pusher, pulled out by a chuck, or the like to be supplied onto the carry-in conveyor 31. An unloader having the same configuration as the loader is arranged on the unloading conveyor 32 side, and the supporting substrates W (supporting substrate W on which the semiconductor chips t are mounted) are sequentially stored in the magazine from the unloading conveyor 32.

(2-2: Global mark detection)
The global mark of the supporting substrate W placed on the stage 21 is detected, and the position of the supporting substrate W is recognized. For example, as shown in FIG. 11, among the four corners of the support substrate W, the global marks A, B, and C provided at three corners are sequentially moved below the second camera 22 to capture an image. The support substrate W is moved on the stage 21. The positions of the three global marks A, B, C are detected based on the respective captured images captured by the second camera 22, and the support substrate W of the support substrate W is detected based on the detected positions of the three global marks A, B, C. The positional shift in the XY direction and the positional shift in the θ direction are calculated. The displacement of the support substrate W can be obtained by various known methods, and the method is not particularly limited. An example of the method for detecting the positional deviation will be described below.

In FIG. 11, a solid line shows the supporting substrate W actually placed on the stage 21, and a two-dot chain line shows the supporting substrate W placed on the stage 21 without displacement. The support substrate W indicated by the chain double-dashed line is in an ideal position state, and at this time, the center of the support substrate W coincides with the center position O(x0, y0) of the stage 21.

First, the positions of the three marks A, B, and C provided on the support substrate W are detected by using a known image recognition technique, and the inclination θ1 of the line segment AB connecting the marks A and B with respect to the X direction and the mark B, The inclination θ (=(θ1+θ2)/2) of the supporting substrate W is obtained from the average value of the inclination θ2 of the line segment BC connecting C with respect to the Y direction. Next, the support substrate W is virtually rotated so that the inclination θ is eliminated with the center position O of the stage 21 as the rotation center. This state is shown by the dotted line in FIG. At this time, the moving amount (Δx1, Δy1) of the midpoint M1 (x1, y1) of the marks A and C positioned diagonally at this time is obtained. Then, a value (Δx1+Δx2, Δy1+Δy2) obtained by combining the calculated movement amount (Δx1, Δy1) and the difference (Δx2, Δy2) between the middle point M2 (x2, y2) after movement and the coordinate O is XY of the support substrate W. Calculated as the positional deviation in the direction.

When the positional deviation of the support substrate W on the stage 21 is calculated, the stage 21 is positioned so that the mounting area where the semiconductor chip t is first mounted on the supporting substrate W is positioned at the mounting position while correcting the positional deviation. To move. At this time, the movement of the stage 21 for positioning each mounting area at the mounting position is corrected by the data for correcting the positional deviation of the support substrate W and the correction data based on the moving position error of the stage 21 described above. When the moving mechanism of the stage 21 does not have the θ table as in the present embodiment, the tilt of the support substrate W is adjusted by adjusting the tilt of the semiconductor chip t to be mounted by the θ adjusting mechanism included in the mounting head 55. Will be corrected.

(3) Semiconductor chip t transfer step (3-1: position detection of semiconductor chip t)
When the wafer ring 11 is fixed to the wafer ring holder 12, the semiconductor chip t that is first taken out on the wafer ring 11 is positioned at the take-out position. The order of taking out the semiconductor chips t on the wafer ring 11 is stored in advance in the storage unit 61, and therefore the control unit 60 controls the movement of the wafer ring holder 12 in accordance with this order. Therefore, after the first semiconductor chip t is taken out, the pitch of the wafer ring holder 12 is moved based on the order stored in the storage unit 61. Generally, as shown by an arrow in FIG. 7A, the locus is moved along a locus for switching the movement direction for each row.

When the semiconductor chip t is positioned at the take-out position, the two alignment marks on the semiconductor chip t are imaged by the first camera 13. The imaging of the two alignment marks can be performed once if the two alignment marks can be simultaneously captured within the imaging field of view of the first camera 13, or may be performed twice. The position of the semiconductor chip t is detected based on the positions of the two alignment marks obtained from this captured image. When the position of the semiconductor chip t is deviated from the take-out position, the wafer ring holder 12 is moved so as to correct the position. The semiconductor chip t transfer step (3) may be performed in parallel with the supporting substrate W setting step (2) or may be performed individually.

The detection of the positional deviation of the semiconductor chip t positioned at the take-out position is not particularly limited and is performed according to various known methods. For example, the position of each alignment mark is detected from a captured image of two alignment marks provided at diagonal positions on the semiconductor chip t by using a known image recognition technique. The inclination of the line segment connecting the two marks is obtained from the obtained mark position, and the inclination is compared with the inclination of the line segment connecting the marks in the semiconductor chip t having no positional deviation stored in the storage unit 61 in advance. Then, the difference is detected as an inclination shift of the semiconductor chip t. Further, the difference between the actual position of the midpoint between the alignment marks and the position of the midpoint between the alignment marks of the semiconductor chip t which is stored in the storage unit 61 and has no misalignment is calculated as the misalignment of the semiconductor chip t in the XY directions. Ask as.

(3-2: Removal of semiconductor chip t)
The reversing mechanism 43 of the one (for example, left) transfer unit 40A is driven to reversely move the suction nozzle 44 in the standby state to the take-out position. Next, the elevating device 41 is driven to lower the suction nozzle 44 together with the arm body 42, and the suction surface of the suction nozzle 44 is brought into contact with the upper surface (electrode forming surface) of the semiconductor chip t. When the suction nozzle 44 comes into contact with the semiconductor chip t, the suction nozzle 44 sucks and holds the semiconductor chip t. The timing at which the suction force is applied to the suction nozzle 44 may be set to an appropriate timing before, at the same time as, or after the suction nozzle 44 contacts the semiconductor chip t.

When the suction nozzle 44 suction-holds the semiconductor chip t, the suction nozzle 44 is raised to the original height. At this time, a push-up mechanism (not shown) is operated in accordance with the rise of the suction nozzle 44 to assist the peeling of the semiconductor chip t from the resin sheet S. When the suction nozzle 44 holding the semiconductor chip t by suction rises to the original height, the reversing arm 47 is reversed to return the suction nozzle 44 to the standby state. In this state, the semiconductor chip t stands by with its lower surface (the surface opposite to the electrode formation surface) facing upward.

(3-3: Delivery of semiconductor chip t)
One (left side) mounting tool 56 is moved to a position immediately above the suction nozzle 44 in a standby state while holding the semiconductor chip t, that is, a receiving position. When the mounting tool 56 is positioned at the receiving position, the elevating device 41 is driven to raise the arm body 42, and the semiconductor chip t held by the suction nozzle 44 is transferred to the holding surface of the mounting tool 56. After passing the semiconductor chip t to the mounting tool 56, the suction nozzle 44 is lowered to the original height and is in a standby state. At the time of this transfer, the timing at which the suction suction force is applied to the mounting tool 56 is before or after the semiconductor chip t is in contact with the mounting tool 56, or after the contact (however, the suction nozzle 44 is lowered. Before starting), the timing may be set to an appropriate timing. The suction suction force of the suction nozzle 44 is released after the semiconductor chip t is transferred to the mounting tool and before the suction nozzle 44 starts descending.

(4) Mounting process of semiconductor chip t (4-1: movement and position detection of semiconductor chip t)
The mounting tool 56 that has received the semiconductor chip t moves toward the mounting position along a movement locus preset in the storage unit 61. The semiconductor chip t is held by the mounting tool 56 with the electrode formation surface (chip upper surface) facing downward. While the mounting tool 56 holding the semiconductor chip t is being moved to the mounting position, it is passed over the third camera 57. At this time, the movement of the mounting tool 56 is temporarily stopped on the third camera 57, and the two alignment marks of the semiconductor chip t are imaged by the third camera 57. The position of each alignment mark is detected from this captured image, and the position shift of the semiconductor chip t with respect to the mounting tool 57 is obtained based on the detected position. When the imaging is completed, the movement of the mounting tool 56 is restarted.

(4-2: Mounting of semiconductor chip t)
After the semiconductor chip t held by the mounting tool 56 is imaged, the mounting tool 56 is moved to the mounting position, and the semiconductor chip t is mounted on the mounting region on the support substrate W positioned at the mounting position. At this time, as a result of the position detection of the semiconductor chip t by the third camera 57, if the semiconductor chip t is displaced with respect to the mounting tool 56, the mounting tool 56 is corrected so as to correct the detected displacement. Is corrected and the mounting tool 56 is positioned at the mounting position. Further, when the inclination θ of the support substrate W is detected in the step (2-2), this inclination θ is also corrected by the mounting tool 56. After this, the mounting tool 56 is lowered to pressurize and mount the semiconductor chip t on a predetermined mounting region of the support substrate W.

The semiconductor chip t is bonded to the support substrate W by using the adhesive force of a die attach film (Die Attach Film: DAF) that is previously attached to the surface of the support substrate W or the lower surface of the semiconductor chip t. The semiconductor chip t may be bonded by providing a heater on the stage 21 and pressing the semiconductor chip t against the heated support substrate W. The heater may be built in the mounting tool 56. When the semiconductor chip t is pressurized for a preset time, the suction of the semiconductor chip t is released and the mounting tool 56 is raised to the original height. The mounting tool 56 that has completed mounting moves toward the receiving position.

In parallel with the operation of the mounting process of the semiconductor chip t described above, pitch feeding of the semiconductor chip t on the wafer ring 11 held by the wafer ring holder 12 (operation of positioning the semiconductor chip to be taken out next to the take-out position), Position detection of the semiconductor chip t (operation similar to (3-1) in step (3)) and removal of the semiconductor chip t by the suction nozzle 44 of the other (right side) transfer unit 40B ((in step (3) ( 3-2)), and the receiving of the semiconductor chip t by the mounting tool 56 of the other (right) mounting section 50B (operation similar to (3-3) in step (3)). ..

Simultaneously with moving the mounting tool 56 of the mounting unit 50A that has been mounted toward the receiving position, the mounting tool 56 of the other mounting unit 50B that has received the semiconductor chip t at the receiving position moves to the mounting position. To start. The stage 21 starts the pitch movement to position the next mounting area at the mounting position. The mounting tool 56 of the mounting unit 50B positioned at the mounting position performs the same operation as the mounting unit 50A (the same operation as (4-1) and (4-2) in the step (4)), and The chip t is mounted under pressure on a predetermined mounting region of the support substrate W. The mounting tool 56 that has completed mounting moves toward the receiving position.

The semiconductor chip t of the wafer ring 11 is eliminated by the receiving operation and the mounting operation of the semiconductor chip t by the mounting tool 56 of the mounting unit 50A and the receiving operation and the mounting operation of the semiconductor chip t by the mounting tool 56 of the mounting unit 50B. Alternately repeat until. That is, the suction nozzles 44 of the left and right transfer parts 40A and 40B alternately take out the semiconductor chips t, and the mounting tools 56 of the left and right mounting parts 50A and 50B alternately receive and mount the semiconductor chips t. .. In this way, the semiconductor chips t are alternately mounted on the two mounting portions 50A and 50B until the semiconductor chips t on the wafer ring 11 are used up.

Note that, as shown in FIG. 12 described later, when mounting a plurality of semiconductor chips t1 to t3 in one mounting area MA, after mounting the first semiconductor chip t1 as described above, components are mounted. The wafer ring 11 on which the second semiconductor chip t2 is mounted is set in the supply unit 10, and the support substrate W on which the first semiconductor chip t1 is mounted is set in the loader of the substrate transfer unit 30. Then, the second semiconductor chip t2 is sequentially mounted in each mounting area MA in which the first semiconductor chip t1 is mounted by performing the same operation as that described above. In this way, if the second semiconductor chip t2 is mounted on all the mounting areas MA on which the semiconductor chip t1 is mounted, the wafer in which the third semiconductor chip t3 is mounted on the component supply unit 10 is mounted. The ring 11 is set, the support substrate W on which the semiconductor chips t1 and t2 are mounted is set on the loader of the substrate transfer unit 30, and the third semiconductor chip t3 is mounted by the same operation. In this way, the plurality of semiconductor chips t1 to t3 are mounted in each mounting area MA of the support substrate W.

When mounting a plurality of semiconductor chips t1 to t3 in one mounting area MA, after mounting the first semiconductor chip t1 on all the support substrates W as described above, the semiconductor chips t1 to t3 are mounted on the second semiconductor chip t2. It is not limited to the switching mounting method. For example, it is possible to switch to the second semiconductor chip t2 after mounting the first semiconductor chip t1 on one support substrate W. The same applies to the third semiconductor chip t3, and after mounting the second semiconductor chip t2 on one support substrate W, switching to the third semiconductor chip t3 is performed. That is, a plurality of types of semiconductor chips t may be mounted in units of the support substrate W. In this case, since the support substrate W is not removed from the stage 21 until the semiconductor chips t of all types have been mounted on one support substrate W, the mounting accuracy of the semiconductor chips t of multiple types can be further improved. it can.

In the above-described method of mounting the semiconductor chips 1 of each type on all the supporting substrates W, the supporting substrate W on which the first type semiconductor chips t1 have been mounted is once carried out from the stage 21 and then the second type semiconductor chips t1. It is mounted again on the stage 21 when mounting t2. Therefore, the position of the support substrate W on the stage 21 is deviated between the mounting of the semiconductor chip t1 of the first type and the mounting of the semiconductor chip t2 of the second type, that is, the positional displacement. Although it may happen to be at the same position on the stage 21, it usually comes off. Although the position of the support substrate W is recognized by global recognition, there is a possibility that the recognition position of the support substrate W may shift due to factors such as recognition errors. Therefore, it can be considered that the relative position accuracy between the first product type and the second product type is reduced accordingly. On the other hand, when the first-type semiconductor chip t1 and the second-type semiconductor chip t2 are continuously mounted without removing the support substrate W from the stage 21, it is possible to prevent misalignment due to a recognition error. Therefore, it is possible to improve the relative positional accuracy between the first product type and the second product type.

The semiconductor chip t mounted on each of the plurality of mounting areas of the support substrate W is not limited to one type. It is also possible to divide one support substrate W into a plurality of regions and mount different types of semiconductor chips t in each region. For example, the semiconductor chips ta of type A may be mounted in the first area of the half of the support substrate, and the semiconductor chips tb of type B may be mounted in the second area of the other half. A semiconductor package of A type is manufactured from the first area in which the semiconductor chip ta of A type is mounted. B-type semiconductor packages are manufactured from the area where the B-type semiconductor chips tb are mounted.

In this case, since the A type semiconductor chip ta and the B type semiconductor chip tb have different circuit patterns of the rewiring layer formed in the subsequent process, the exposure patterns for rewiring formation also differ. Therefore, it may be more difficult to correct the mounting error of the semiconductor chips ta and tb in the exposure process. When the mounting apparatus and the mounting method of the embodiment are applied, it is possible to mount with high relative positional accuracy even between the A type semiconductor chip ta and the B type semiconductor chip tb. Therefore, it is possible to collectively perform the exposure processing on the area on which the A type semiconductor chips ta are mounted and the exposure processing on the area on which the B type semiconductor chips tb are mounted, thus improving the production efficiency. ..

When the A type semiconductor chips ta are mounted in the first area and the B type semiconductor chips tb are mounted in the second area, the sizes of the A type semiconductor chips ta and the B type semiconductor chips tb are different. For example, the mounting pitch of A type and the mounting pitch of B type may be different. In such a case, by switching the feed amount of the stage 21 between mounting the A type semiconductor chip ta and mounting the B type semiconductor chip tb, a plurality of types of semiconductor chips ta, tb Can be satisfactorily mounted on a plurality of regions of the support substrate W. Similarly, a combination of C-type and D-type semiconductor chips constituting the first multi-chip package is mounted on the first region of the support substrate W, and a second multi-chip package E is formed on the second region. You may make it mount the combination of the semiconductor chip of a kind and F kind. In any of these mountings, one type of semiconductor chip t may be mounted on a plurality of support substrates W, or a plurality of types of semiconductor chips may be mounted on a support substrate W basis. These specific mounting steps are as described above.

Even in such a case, the recognition of the global mark of the support substrate W may be performed once at the beginning, and the support substrate W is newly recognized when the region where the semiconductor chip t is mounted moves from the first region to the second region. It is not necessary to recognize the global mark of W. Further, when the support substrate W is heated by providing a heater on the stage 21, the correction of the stage 21 is performed by the first region in which the semiconductor chip t is mounted first and the second region in which the semiconductor chip t is mounted later. The data may be switched. By doing so, even when the amount of thermal expansion of the portion of the support substrate W corresponding to the second region is increased while the semiconductor chip ta of A type is mounted in the first region, it is possible to cope with it. Therefore, the mounting accuracy of the semiconductor chip t(tb) can be maintained with high accuracy. When mounting a plurality of types of semiconductor chips t in units of the support substrate W as described above, a chip supply mechanism using a tape feeder is used as the component supply unit 10 and a plurality of tape feeders corresponding to a plurality of types are installed. It should be set to.

The supporting substrate W on which the above-described one type of semiconductor chip t, or a plurality of types of semiconductor chips t1, t2, t3, semiconductor chips ta, tb, etc., have been mounted is sent to the following process, whereby the semiconductor package A package component such as That is, the support substrate W on which the semiconductor chips have been mounted is sequentially sent to the sealing step and the rewiring layer forming step. In the sealing step, the resin is filled in the gaps between the semiconductor chips mounted on the support substrate W, thereby forming a pseudo wafer. The pseudo wafer is sent to the rewiring layer forming step. In the rewiring layer forming step, a circuit forming step in the semiconductor wafer manufacturing process, that is, a step of applying a photosensitive material such as a resist material, an exposure and development step of the photosensitive material, an etching step, an ion implantation step, a resist stripping step Etc. are carried out, and a rewiring layer is formed on the semiconductor chip of the pseudo wafer by these steps. The pseudo wafer on which the rewiring layer is formed is sent to a dicing process, and the pseudo wafer is separated into individual pieces to manufacture a package component such as a semiconductor package.

As described above, in the method for manufacturing a package component of the embodiment, as shown in FIG. 14, the mounting step S1 of mounting the electronic component in each of the plurality of mounting regions of the support substrate W and the mounting process in the plurality of mounting regions are performed. A sealing step S2 for forming a pseudo wafer by collectively sealing electronic parts, a rewiring step S3 for forming a rewiring layer on the electronic parts of the pseudo wafer, and a package part by dicing the pseudo wafer. And a dicing step S4 for manufacturing. The rewiring layer forming step S3 includes the photosensitive material applying step S31, the photosensitive material exposing and developing step S32, the etching step S33, the ion implantation step S34, and the resist stripping step S35 as described above. The electronic component mounting step in the package component manufacturing method of the embodiment is performed based on the electronic component mounting method of the embodiment. In the method of manufacturing a package component of the embodiment, the electronic component mounted in each mounting region of the support substrate W may be one semiconductor chip t as described above, or may be a plurality of types of semiconductor chips or the same type. It may be a plurality of semiconductor chips. The type and number of electronic components are not particularly limited.

In the mounting apparatus 1 of the embodiment, the movement of the mounting tool 56 of the two mounting portions 50A and 50B is performed as a constant path from the receiving position of the semiconductor chip t to the mounting position, and the mounting of the two mounting portions 50A and 50B is performed. The mounting position by the tool 56 is a fixed position. Further, each mounting area of the support substrate W is sequentially positioned at the mounting position by the XY moving mechanism of the stage unit 20. At this time, the movement of the stage 21 by the XY movement mechanism of the stage unit 20 is corrected using the correction data based on the movement position error of the stage 21 acquired in advance. Therefore, the mounting error of the semiconductor chip t based on the movement error of the two mounting parts 50A and 50B and the movement position error of the stage 21 can be reduced as much as possible. In this way, the mounting time of the semiconductor chip t (tact time required for mounting one semiconductor chip t as the mounting apparatus 1) and the mounting accuracy of the semiconductor chip t by using the two mounting parts 50A and 50B are reduced. Can be achieved at the same time.

That is, since the mounting tools 56 of the two mounting units 50A and 50B only move on a fixed path from the receiving position of the semiconductor chip t to the mounting position, even if a movement error occurs, adjustment is performed once ( Calibration) can correct the positioning to the mounting position. Further, since the two mounting units 50A and 50B perform the mounting operation in the same mounting position, the mounting accuracy can be improved and the moving position of the mounting head can be adjusted as compared with the case of mounting in the individual mounting positions. (Calibration) can be performed in a short time.

In addition, since the moving position error of the stage 21 is corrected using the correction data, it is possible to move the stage 21 with a preset pitch with high accuracy, thereby increasing the positioning accuracy of the support substrate W to the mounting position of each mounting region. be able to. Therefore, a mounting accuracy of ±5 μm or less and a tact time of 0.6 seconds or less can be achieved at the same time. As a result, it is possible to accurately mount the electronic components including the semiconductor chip t on the support substrate W, which is not provided with the position detection mark for each mounting area, so that the mutual intervals become a predetermined interval. In addition, the electronic component including the semiconductor chip t can be mounted on the supporting substrate W with high productivity. That is, the tact time required for mounting the semiconductor chip t can be shortened by the alternate mounting by the two mounting parts 50A and 50B, and the mounting accuracy is improved by mounting at a common fixed position and correcting the movement error of the stage 21. The effect and the effect of preventing a decrease in productivity can be obtained.

For example, consider a case where two mounting heads mount the semiconductor chip at different fixed positions. In this case, it is necessary to adjust (calibrate) the movement positions of the two mounting heads to fixed positions. Usually, such adjustment is performed by using cameras arranged at respective fixed positions. If an error occurs when adjusting the coordinates between the cameras, the error appears as a mounting error between the two mounting heads.

Further, when the two mounting heads mount the semiconductor chips at different fixed positions, there are two positions where the semiconductor chips are mounted on the support substrate. Since the movement error differs depending on the place, it is necessary to measure the movement error at two points separately. For example, it takes about 3 hours to measure the movement error at one place. Specifically, when the movement error is measured at the measurement points set in a matrix at intervals of 3 mm on the support substrate of 300 mm×300 mm, the number of measurement points on the substrate is 300 mm/3 mm=100 points in the vertical direction, Lateral direction: 300 mm/3 mm=100 points, 100 points×100 points=10,000 points. If 2 seconds are required for measuring one point, 10,000 points×2 seconds=20000 seconds=about 5 hours and 33 minutes. It should be noted that the reason why two seconds are required for one measurement is that a waiting time of about a second or more is expected for the vibration generated when the stage is stopped to subside. Therefore, when the two mounting heads mount the semiconductor chips at different fixed positions, an extra setup time of about 5 hours and 30 minutes is required as compared with the mounting apparatus 1 of the embodiment. The production amount for this time is reduced.

If two cameras are used to perform measurements at two locations simultaneously in parallel, the measurement time can be approximately equal to that at one location. However, it is necessary to perform calibration to match the coordinate systems of the two cameras, and at that time, an error may occur. This causes a decrease in position accuracy. Moreover, since two cameras are required, the cost also increases.

Further, considering that the mounting head is moved to each mounting area without moving the stage 21 of the supporting substrate W and the correction data is created on the mounting head side, when the correction data is created on the substrate stage side. In comparison, a huge amount of correction data is required, and the time required for calibration becomes long. That is, the mounting head is different from the substrate stage in that the vertical movement mechanism is indispensable for mounting the semiconductor chip on the substrate. Therefore, when creating the correction data, it is necessary to consider not only the movement error due to the undulation of the XY moving device of the mounting head, but also the positional deviation in the XY directions due to the vertical movement of the mounting head.

Specifically, even if the frame (for example, the Y-axis moving device) that supports the mounting head is at the same position in the left-right direction, the movable body that supports the mounting head swings to the right and to the left. The horizontal position of the tip of the mounting head at the position lowered to the height at which the semiconductor chip t is mounted on the support substrate W on the stage 21 is greatly different from that in the case of movement. For this reason, not only meandering when the mounting head moves in the X direction or the Y direction, but also swinging of the movable body that supports the mounting head contributes to the mounting position shift. Therefore, even if the movement is less than 3 mm, which is the pitch of the dot marks 72 of the calibration substrate 71 described above, which does not cause a large movement error on the stage 21 side, it is large on the mounting tool on the mounting head side. A movement error (for example, 5 μm or more) may occur.

Therefore, when creating the correction data on the mounting head side, it is considered necessary to measure the movement position shift at intervals shorter than 3 mm, for example, at intervals of 1 mm pitch or the like. If the moving position shift is measured at a pitch of 1 mm in a moving range of 300 mm×300 mm, it is necessary to measure at 90,000 points at 300 points×300 points, and when measuring at a 3 mm pitch (10000 at a 3 mm pitch. The number of measurement points is 9 times larger than that of (dot). Therefore, the measurement time also becomes 9 times, and it takes 5 hours 33 minutes×9=49 hours 30 minutes. This is not practical.

Moreover, in addition to the swinging of the movable body, when there is undulation in the vertical direction on the substrate stage side, when mounting the semiconductor chip on the supporting substrate, the height position varies depending on the position on the supporting substrate. Become. If the movable body of the mounting head is tilted and the vertical movement direction of the mounting head is tilted with respect to the vertical direction, the mounting position will shift horizontally due to the height difference of the mounting surface (substrate surface). .. Taking this into consideration, the measurement of the correction data becomes more complicated, and more time is required to create the correction data. In addition, the correction accuracy itself may decrease.

From the above points, the mounting positions of the two mounting portions 50A and 50B are set to the same fixed position, and the stage 21 on which the support substrate W is mounted is moved so that each mounting region is sequentially positioned to the mounting position. It can be seen that the mounting apparatus 1 having the configuration for correcting the movement error of the stage 21 using the correction data is effective in achieving both improvement in mounting accuracy and reduction in tact time and high productivity.

As shown in FIG. 12, the mounting apparatus 1 of the embodiment mounts a plurality of types of semiconductor chips t1, t2, t3, etc. in one mounting area MA, or one or a plurality of types of semiconductor chips t and diodes. This is effective when mounting capacitors and the like. As described above, when a plurality of types of electronic components are mounted in one mounting area, there is a risk of relative displacement of the plurality of electronic components in one mounting area (package), so that one mounting It is not possible to apply a technique of correcting a mounting error applicable to a single chip package in which one semiconductor chip is incorporated in a region (package) at the time of exposure. Therefore, it is necessary to improve the positional accuracy itself when mounting a plurality of electronic components. In view of this point, the mounting apparatus 1 of the embodiment can improve the mounting accuracy of each electronic component including the semiconductor chip t, and therefore, even when mounting a plurality of electronic components in one mounting region, It is possible to relatively improve the positional accuracy of a plurality of electronic components in one mounting area.

{Correction of displacement by the pair of mounting parts 50}
When using the two mounting parts 50A and 50B, there is a possibility that a relative positional deviation occurs between the mounting tools 56 of the mounting parts 50A and 50B. For such a point, a camera is arranged below the mounting position, the positions of the mounting tools 56 positioned at the mounting position are detected, and the deviation of the relative positions of the mounting tools 56 is detected and corrected. Is effective. The fourth camera 23 shown in FIG. 4 is used to detect the relative positional deviation between the two mounting tools 56. The fourth camera 23 is attached upward to the front end of the stage 21. The fourth camera 23 images the mounting tool 56 positioned at the mounting position from below. When the fourth camera 23 captures an image, the stage 21 is moved to move the fourth camera 23 directly below the mounting position. The fourth camera 23 functions as a third recognition unit.

The displacement deviation of the two mounting tools 56 is detected with the mounting tool 56 holding the semiconductor chip t. Note that the misregistration may be detected using a dummy semiconductor chip manufactured for calibration. Further, the displacement of the mounting tool 56 may be detected using a suction hole of the mounting tool 56 or a mark formed on the holding surface of the mounting tool 56 without using the semiconductor chip. First, the mounting tool 56 is caused to hold the semiconductor chip t by the operation of the step (3) described above, the operation of the step (4-1) of the step (4) is performed to detect the positional deviation of the semiconductor chip t, and the detected position is detected. The misalignment is corrected and the mounting tool 56 is positioned at the mounting position (4-2). The semiconductor chip t held by the mounting tool 56 positioned at the mounting position is imaged by the fourth camera 23. The control unit 60 detects the position of the semiconductor chip t based on the image captured by the fourth camera 23, compares the position data with the regular position stored in the storage unit 61 in advance, and then the semiconductor chip t. The positional deviation of is detected. If the mounting tool 56 is not displaced in position, the semiconductor chip t can be positioned in the mounting position without displacement. When the positional deviation occurs, the positional deviation becomes the movement positional deviation of the mounting head 55.

Imaging of the semiconductor chip t positioned at the above-described mounting position and detection of positional deviation are performed on the mounting tools 56 of the left and right mounting portions 50A and 50B, respectively. The movement position shifts of both mounting tools 56 are compared, and if there is a difference, the movement position of the mounting tool 56 of the other mounting portion 50B is determined with the mounting tool 56 of the one mounting portion 50A as a reference. It is corrected by eliminating the difference. By doing so, it is possible to eliminate the occurrence of a mounting error caused by using the two mounting units 50A and 50B.

The positional deviation correction of the mounting tool 56 is not limited to aligning the moving position of the mounting tool 56 of the other mounting section 50B with the moving position of the mounting tool 56 of the one mounting section 50A described above. For example, both the left and right mounting tools 56 may be corrected so that the movement position is aligned with a predetermined reference mounting position. By doing so, the alignment accuracy can be improved. This is because, when the moving position of one mounting tool 56 is aligned with the moving position of the other mounting tool 56, the moving position itself of the one mounting tool 56 serving as a reference includes a certain amount of variation. Even if they appear to move to the same position, a deviation of 1 μm or 2 μm occurs due to a mechanical error or the like. When the other mounting tool is aligned with the position including such variation, it is difficult to align the moving position of the other mounting tool 56 with accuracy higher than the variation of the moving position of the one mounting tool 56. The positioning accuracy of the other mounting tool 56 with respect to the mounting position is worse than that of the one mounting tool 56. On the other hand, when the moving positions of both the mounting tools 56 are aligned with the reference mounting position, the reference mounting position itself does not include a positional variation. It is possible to perform alignment with the same degree of accuracy as for.

The movement position deviation of the mounting head 55 (mounting tool 56) is detected after the mounting operation is started when the posture of the mounting head 55 may be deformed due to, for example, heat generation of a motor. The presence/absence of displacement of the mounting head 55 may be detected every time or a set number of times of mounting. As a result, the mounting accuracy of the semiconductor chip t can be further improved. As described above, when a heater that assists in mounting (bonding) the semiconductor chip t is used, a movement position error may occur in the mounting head 55 due to thermal expansion (thermal deformation) due to heating of the heater. Also for such a point, it is effective to carry out the step of detecting the positional deviation by imaging the semiconductor chip t held by the mounting tool 56 with the fourth camera 23 at every preset timing. ..

In the above-described embodiments, the respective mounting areas of the support substrate W and the mounting tools 56 of the left and right mounting portions 50A and 50B are positioned at a fixed mounting position as a fixed mounting position. The fixed mounting position may be the same position that does not always change in the mounting apparatus 1, or may be a position whose setting can be changed according to conditions such as the size of the support substrate W, or at least the position. It is sufficient that the position is kept constant from the start of mounting of the electronic component to be mounted to the completion of mounting. When setting a fixed mounting position as a position where the setting can be changed, correction data for correcting the movement error of the stage 21 is acquired for each set position, and when the mounting position is changed, the movement error of the stage 21 is changed. It is advisable to switch the correction data used for the correction to the correction data corresponding to the mounting position whose setting has been changed.

Further, the correction data for correcting the movement error of the stage 21 may be acquired over the entire movable range of the stage 21, and the stage 21 moves at least when each mounting area on the support substrate W is positioned at the mounting position. It should be acquired within the range. Further, as the correction data for correcting the movement error of the stage 21, the actual measurement value of the movement position error of the stage 21 may be used, or the actual measurement value such as the correction value for canceling the movement position error may be processed. Well, the point is that the data is for correcting the movement error of the stage 21.

In the above-described embodiment, an example of face-down bonding is described in which the electrode formation surface (upper surface) of the semiconductor chip t faces downward, that is, the semiconductor chip t faces the upper surface of the support substrate W. The device and the mounting method are not limited to this. The same applies to the method of manufacturing the package component of the embodiment. In the mounting apparatus and the mounting method and the package component manufacturing method according to the embodiment, the electrode forming surface of the semiconductor chip t faces upward, that is, the lower surface of the semiconductor chip t (the surface opposite to the electrode forming surface) on the upper surface of the support substrate W. ) Is also applicable to face-up bonding. Furthermore, the mounting apparatus of the embodiment may be a combined apparatus for face-up bonding and face-down bonding.

When applied to face-up bonding, a transfer stage for temporarily mounting the semiconductor chip t is provided between the transfer section 40 and the mounting section 50. This is because the semiconductor chip t is supported on the wafer ring 11 with the electrode formation surface facing upward. The transfer nozzle 44 of the transfer unit 40 that holds the semiconductor chip t by suction must deliver the semiconductor chip t to the mounting unit 50 with the electrode formation surface facing upward. Since the electrode formation surface of the semiconductor chip t is adsorbed and held, the semiconductor chip t cannot be directly delivered to the mounting tool 56 of the mounting portion 50.

When applied to face-up bonding, instead of eliminating the reversing mechanism 43 of the transfer section 40, an XY moving mechanism that allows the transfer nozzle 44 to move in the XY directions is provided, and the transfer nozzle 44 is taken out from the position. And the delivery stage. The delivery stages are provided corresponding to the left and right transfer parts 40A and 40B, respectively. When it is applied to a combined device for face-up bonding and face-down bonding, the inverting mechanism 43 of the transfer section 40 is left as it is, and an XY moving mechanism is provided for moving the transfer stage and the transfer nozzle 44 in the XY directions. And When face-down bonding is performed, the semiconductor chip t is mounted by the same operation as that of the embodiment without using the delivery stage.

When face-up bonding is performed, after the semiconductor chip t is taken out by the transfer nozzle 44, the transfer nozzle 44 is placed on the delivery stage by the XY moving mechanism without inverting the transfer nozzle 44 by the reversing mechanism 43. To move. The semiconductor chip t is mounted on the delivery stage by the moved transfer nozzle 44. After that, the mounting tool 56 of the mounting unit 50 is moved onto the delivery stage to suck and hold the semiconductor chip t on the delivery stage. Since the semiconductor chip t is placed on the delivery stage with the electrode forming surface facing upward, the mounting tool 56 of the mounting unit 50 adsorbs the upper surface (electrode forming surface) of the semiconductor chip t, and the semiconductor chip t The lower surface (the surface opposite to the electrode formation surface) is mounted on the upper surface of the support substrate W. The specific mounting process of the semiconductor chip t is the same as that of the above-described embodiment.

Next, examples of the present invention and evaluation results thereof will be described.

(Example 1)
Using the mounting apparatus 1 of the above-described embodiment, the semiconductor chip was actually mounted on the support substrate under the following conditions. FIG. 13 shows a state in which the semiconductor chip t is mounted on the support substrate W. The target mounting accuracy was within ±5 μm, and the target takt time was within 0.6 seconds.
<Mounting conditions>
-Size of semiconductor chip t: 4 mm x 4 mm
・Mounting pitch (length x width): 36 mm x 36 mm
-Number of mounting (vertical x horizontal): 5 x 5 (25 in total)

As shown in FIG. 13, the odd-numbered semiconductor chips t are the left mounting portion 50A and the even-numbered semiconductor chips t are the right mounting portion 50B in the order of the numbers assigned to the semiconductor chips t, starting from the upper left. , Alternate implementation. The elapsed time from the removal of the first semiconductor chip t from the component supply unit 10 to the completion of mounting the last (25th) semiconductor chip t was 14.5 seconds. In this way, the mounting position deviation of the 25 semiconductor chips t mounted on the support substrate W was measured using the inspection device. The results are shown in Table 1. In Table 1, the mounting area number corresponds to the number of the semiconductor chip t in FIG. The circle mark in the column of used mounting head indicates the mounting head used for mounting. For example, the mounting area number "1" indicates that mounting is performed using the mounting head 55 on the left side. The misregistration column shows the misregistration amount of the semiconductor chip t in each mounting region in the X direction and the Y direction. The unit is micrometers [μm].

As shown in Table 1, the maximum value of the positional deviation of the semiconductor chip t in the X direction is 3.0 μm at the position of the mounting area number 15, and the minimum value is −1.8 μm at the position of the mounting area number 10. It was Further, the maximum value of the positional deviation in the Y direction was 2.0 μm at the position of mounting area number 7, and the minimum value was −0.8 μm at the position of mounting area number 19. It was confirmed that the mounting accuracy of each of the 25 semiconductor chips t was within the target ±5 μm. Since the time required for mounting was 14.5 seconds, the time required for mounting one semiconductor chip t was 14.5 seconds/25 pieces=0.58 seconds. Therefore, the tact time was 0.58 seconds, and it was possible to achieve the target within 0.6 seconds. It should be noted that the time required for mounting means the left mounting section that receives the first semiconductor chip t from the suction nozzle 44 of the left transfer section 40A that picks up the first semiconductor chip t from the component supply section 10. The mounting tool 56 of the mounting tool 56 of 50A moves to a position right above the mounting position and starts to descend, and the last (25th) semiconductor chip t is mounted on the supporting substrate W by the mounting tool 56 of the mounting section 50A on the left side. It is the time until the end of the climb to the original height. The tact time can be obtained by dividing this time by the number (25) of semiconductor chips mounted during this period.

(Comparative Example 1)
The semiconductor chip t was mounted on the support substrate W under the same conditions as in Example 1 except that the movement correction data of the stage on which the support substrate W was placed was not used. The mounting position deviation of the 25 semiconductor chips t mounted on the support substrate W was measured using an inspection device. The results are shown in Table 2.

As shown in Table 2, the maximum value of the positional deviation of the semiconductor chip t in the X direction is 19.5 μm at the position of the mounting area number 21, and the minimum value is −24.4 μm at the position of the mounting area number 10. It was Further, the maximum value of the positional deviation in the Y direction was 11.8 μm at the position of the mounting area number 3, and the minimum value was −11.7 μm at the position of the mounting area number 16. Therefore, it was confirmed that the mounting accuracy of the semiconductor chip t could not satisfy the target within ±5 μm. The takt time required for mounting one semiconductor chip t is 0.58 seconds, which is the same as that in the first embodiment.

(Example 2)
Using the mounting apparatus 1 of the above-described embodiment, the semiconductor chip was actually mounted on the support substrate under the following conditions. The target mounting accuracy was within ±5 μm.
<Mounting conditions>
-Size of semiconductor chip t: 4 mm x 4 mm
-Number of mounting (vertical x horizontal): 20 x 20 (400 total)
・Mounting pitch (vertical, horizontal): 6 mm

Similar to the first embodiment, the odd-numbered semiconductor chips t are the left mounting portions 50A and the even-numbered semiconductor chips t are the right mounting portions 50B in the order of the numbers of the semiconductor chips t, starting from the upper left mounting area. Then, they were mounted alternately. In this way, 48 semiconductor chips t were extracted from the 400 semiconductor chips t mounted on the support substrate W, and their mounting position deviations were measured using an inspection device. The results are shown in Table 3 as in Example 1.

(Example 3)
Using the mounting apparatus 1 of the above-described embodiment, the semiconductor chip was actually mounted on the support substrate under the following conditions. The target mounting accuracy was within ±5 μm.
<Mounting conditions>
・Size of semiconductor chip t: 1 mm x 1 mm
-Number of mounting (vertical x horizontal): 40 x 51 (2040 in total)
・Mounting pitch (vertical, horizontal): 3 mm

Similar to the first embodiment, the odd-numbered semiconductor chips t are the left mounting portions 50A and the even-numbered semiconductor chips t are the right mounting portions 50B in the order of the numbers of the semiconductor chips t, starting from the upper left mounting area. Then, they were mounted alternately. In this way, 48 semiconductor chips t were extracted from the 2040 semiconductor chips t mounted on the support substrate W, and their mounting position deviations were measured using an inspection device. The results are shown in Table 4 as in Example 1.

(Example 4)
Using the mounting apparatus 1 of the above-described embodiment, the first semiconductor chip and the second semiconductor chip were actually mounted on each mounting region of the support substrate under the following conditions. The target mounting accuracy was within ±5 μm.
<Mounting conditions>
-Size of the first semiconductor chip t: 4 mm x 4 mm
-Size of second semiconductor chip t: 1 mm x 1 mm
-Number of mounted first semiconductor chips t (length x width): 5 x 5 (25 in total)
-Number of mounted second semiconductor chips t (length x width): 5 x 5 (total 25)
-Mounting pitch of the first semiconductor chip (vertical, horizontal): 36 mm
-Gap between the first semiconductor chip and the second semiconductor chip: 0.5 mm

Similar to the first embodiment, the odd-numbered semiconductor chip t is the left-side mounting portion 50A and the even-numbered semiconductor chip t in the order of the numbers of the first semiconductor chip (chip A) t, starting from the upper left mounting area. At t, the mounting portion 50B on the right side is mounted alternately. Next, in order of the numbers of the second semiconductor chips (chips B) t, the odd-numbered semiconductor chips t are mounted on the left mounting portion 50A and the even-numbered semiconductor chips t are mounted on the right mounting portion 50B, which are mounted alternately. I did. In this way, a total of 50 mounting positions (first semiconductor chips: 25, second semiconductor chips: 25) mounted on the support substrate W were measured using an inspection device. As for the mounting position shift, the position shifts of the first and second semiconductor chips (chips A and B) and the relative positions of the first and second semiconductor chips (chips A and B) were measured. The results are shown in Table 5.

In the above-described embodiment, the support substrate W is not provided with the position detection mark for each mounting area and is described as being removed in the process of manufacturing the package component. However, the present invention is not limited to this. Absent. According to the mounting apparatus and the mounting method of the embodiment, for example, there is a position detection mark for each mounting area, and of course, even for a substrate used as a part of a package component, the position detection mark is used. Needless to say, it is possible to mount the semiconductor chip (electronic component) with high accuracy and efficiency.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are also included in the invention described in the claims and an equivalent range thereof.

DESCRIPTION OF SYMBOLS 1... Mounting device, 10... Component supply part, 11... Wafer ring, 12... Wafer ring holder, 13... 1st camera, 20... Stage part, 21... Stage, 22... 2nd camera, 23... 4th Camera, 30... Substrate transfer section, 40, 40A, 40B... Transfer section, 43... Inversion mechanism, 44... Adsorption nozzle, 47... Inversion arm, 50, 50A, 50B... Mounting section, 51... Support frame, 52... X Direction moving block, 53... Y direction moving device, 55... Mounting head, 56... Mounting tool, 60... Control section, 61... Storage section, W... Support substrate, t... Semiconductor chip.

The electronic component mounting apparatus of the embodiment is a stage on which a support substrate having a plurality of mounting areas on which electronic components are mounted is mounted, and the plurality of mounting areas are sequentially positioned at a fixed mounting position, A stage unit including a stage moving mechanism for moving the stage;
First and second mounting heads that respectively hold the electronic component and mount the electronic component in the mounting area of the support substrate, and the first and second mounting heads that hold the electronic component at the fixed mounting position. A mounting unit including a mounting head moving mechanism that moves alternately,
A first recognition unit that recognizes an entire position of the support substrate placed on the stage;
A second recognition unit for recognizing the position of the electronic component held by the first or second mounting head;
A storage unit for storing correction data for correcting a moving position error of the stage by the stage moving mechanism;
The stage that is moved to the certain mounting position based on the position data of the support substrate recognized by the first recognition unit, the position data of the electronic component recognized by the second recognition unit, and the correction data. And a control unit that controls the movement of the first and second mounting heads.

An electronic component mounting method according to an embodiment obtains a movement position error of a stage on which a support substrate having a plurality of mounting areas on which an electronic component is mounted is mounted, and stores correction data for correcting the movement position error. And the step of memorizing
Placing the support substrate on the stage, and recognizing the entire position of the support substrate placed on the stage;
While correcting the movement of the stage based on the position data of the support substrate and the correction data obtained by the position recognition step of the support substrate, so that the plurality of mounting areas are sequentially positioned at a fixed mounting position , Moving the stage,
The first and second mounting heads alternately receive the electronic component, recognize the position of the electronic component held by the first or second mounting head, and based on the recognized position data of the electronic component. The first and second mounting heads are alternately moved to the fixed mounting position while the movements of the first and second mounting heads are corrected by the first and second mounting heads. And alternately mounting the components in the mounting regions sequentially positioned at the fixed mounting position.

A method of manufacturing a package component according to an embodiment includes a step of mounting an electronic component on each of the plurality of mounting regions in a support substrate having a plurality of mounting regions, and the electronic components mounted on the plurality of mounting regions at once. A method of manufacturing a package component, comprising a step of forming a pseudo wafer by sealing with a sealant, and a step of producing a package component by forming a rewiring layer on the electronic component of the pseudo wafer,
The mounting process of the electronic component is
A step of acquiring a movement position error of the stage on which the support substrate is placed and storing correction data for correcting the movement position error in a storage unit;
Placing the support substrate on the stage, and recognizing the entire position of the support substrate placed on the stage;
While correcting the movement of the stage based on the position data of the support substrate and the correction data obtained by the position recognition step of the support substrate, so that the plurality of mounting areas are sequentially positioned at a fixed mounting position , Moving the stage,
The first and second mounting heads alternately receive the electronic component, recognize the position of the electronic component held by the first or second mounting head, and based on the recognized position data of the electronic component. The first and second mounting heads are alternately moved to the fixed mounting position while the movements of the first and second mounting heads are corrected by the first and second mounting heads. And alternately mounting the components in the mounting regions sequentially positioned at the fixed mounting position.

Claims (11)

A stage on which a support substrate having a plurality of mounting areas on which electronic components are mounted is placed, and a stage moving mechanism that moves the stage so that the plurality of mounting areas are sequentially positioned at fixed mounting positions. The stage part,
First and second mounting heads that respectively hold the electronic component and mount the electronic component in the mounting area of the support substrate, and the first and second mounting heads that hold the electronic component alternately at the mounting position. A mounting unit having a mounting head moving mechanism for moving the mounting head,
A first recognition unit that recognizes an entire position of the support substrate placed on the stage;
A second recognition unit for recognizing the position of the electronic component held by the first or second mounting head;
A storage unit for storing correction data for correcting a moving position error of the stage by the stage moving mechanism;
Based on the position data of the support substrate recognized by the first recognizing unit, the position data of the electronic component recognized by the second recognizing unit, and the correction data, the stage and the first and second An electronic component mounting apparatus comprising: a control unit that controls the movement of the mounting head. The mounting apparatus according to claim 1, wherein the mounting section mounts a plurality of the electronic components on the one mounting area of the support substrate. Furthermore, a third recognition unit is provided, which individually recognizes the positions of the first and second mounting heads positioned at the mounting position,
The control unit corrects the positional deviation between the first mounting head and the second mounting head based on the position data of the first and second mounting heads recognized by the third recognizing unit. The mounting apparatus according to claim 1 or 2. The mounting apparatus according to claim 3, wherein the control unit causes the third recognition unit to recognize the position data of the first and second mounting heads based on preset timing. Furthermore, a component supply unit that supplies the electronic component,
And a transfer unit including first and second transfer nozzles that receive the electronic component from the component supply unit and deliver the electronic component to the first or second mounting head, respectively.
5. The first and second mounting heads are moved along a constant path from a transfer position of the electronic component by the first and second transfer nozzles to the mounting position. The mounting apparatus according to item 1. The mounting apparatus according to claim 5, wherein the second recognition unit includes a pair of cameras arranged in a movement path of the first and second mounting heads. A step of acquiring a movement position error of a stage on which a support substrate having a plurality of mounting areas on which electronic components are mounted is acquired, and storing correction data for correcting the movement position error in a storage unit;
Placing the support substrate on the stage, and recognizing the entire position of the support substrate placed on the stage;
While correcting the movement of the stage based on the position data of the supporting substrate and the correction data obtained by the position recognizing step of the supporting substrate, so that the plurality of mounting regions are sequentially positioned at a fixed mounting position, Moving the stage,
The first and second mounting heads alternately receive the electronic component, recognize the position of the electronic component held by the first or second mounting head, and based on the recognized position data of the electronic component. While correcting the movement of the first and second mounting heads, the first and second mounting heads are alternately moved to the mounting position, and the electronic component is moved by the first and second mounting heads. And a step of alternately mounting in the mounting area sequentially positioned at the mounting position. The mounting method according to claim 7, wherein the mounting step includes a step of mounting a plurality of the electronic components in one of the mounting areas of the support substrate. Further, the positions of the first and second mounting heads positioned at the mounting position are individually recognized, and the first mounting head is based on the recognized position data of the first and second mounting heads. 9. The mounting method according to claim 7, further comprising a step of correcting a positional deviation between the second mounting head and the second mounting head. Forming a pseudo wafer by collectively mounting the electronic component mounted on each of the plurality of mounting areas on the support substrate having the plurality of mounting areas and the electronic components mounted on the plurality of mounting areas And a step of manufacturing a package component by forming a rewiring layer on the electronic component of the pseudo wafer,
The mounting process of the electronic component is
A step of acquiring a movement position error of the stage on which the support substrate is placed and storing correction data for correcting the movement position error in a storage unit;
Placing the support substrate on the stage, and recognizing the entire position of the support substrate placed on the stage;
While correcting the movement of the stage based on the position data of the supporting substrate and the correction data obtained by the position recognizing step of the supporting substrate, so that the plurality of mounting regions are sequentially positioned at a fixed mounting position, Moving the stage,
The first and second mounting heads alternately receive the electronic component, recognize the position of the electronic component held by the first or second mounting head, and based on the recognized position data of the electronic component. While correcting the movement of the first and second mounting heads, the first and second mounting heads are alternately moved to the mounting position, and the electronic component is moved by the first and second mounting heads. And a step of alternately mounting in the mounting areas sequentially positioned at the mounting position. The method of manufacturing a package component according to claim 10, wherein the mounting step of the electronic component includes a step of mounting a plurality of the electronic components in one mounting area of the support substrate.

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