JP7350696B2 - Electronic component mounting equipment - Google Patents

Description

The present invention relates to an electronic component mounting apparatus.

Conventionally, a manufacturing process called wafer level package (WLP) has been known. WLP is a technology for forming a rewiring layer for providing I/O terminals in a wafer state without using an interposer substrate (relay substrate). Since WLP does not require an interposer substrate, it is possible to make the semiconductor package thinner and reduce manufacturing costs.

In WLP, fan-in wafer-level packages (fan in-WLP: FI-WLP) and fan-out wafer-level packages (fan out-WLP: FO-WLP) are known. FI-WLP forms a rewiring layer on a semiconductor chip so as not to protrude from the area on the surface of the semiconductor chip where electrode pads are formed. The FO-WLP forms a rewiring layer extending beyond the area of the semiconductor chip.

FO-WLP can also be applied to multi-chip packages (MCP), which have semiconductor chips such as RAM, flash memory, and CPU, and multiple types of electronic components such as diodes and capacitors mounted in one package. Therefore, it is attracting attention.

In the FO-WLP manufacturing process, first, multiple semiconductor chips are mounted on a substrate in a row and column at intervals, and then the gaps between the semiconductor chips are sealed with resin to integrate the multiple semiconductor chips. become In this way, a pseudo wafer is formed that is shaped like a wafer formed in a semiconductor manufacturing process. A rewiring layer for providing I/O terminals is formed on this pseudo wafer. After a plurality of semiconductor chips are resin-sealed and integrated, the substrate is peeled off and removed.

JP2019-29563A

In the WLP described above, deviations in the mounting positions of individual electronic components mounted in the same package mutually affect the electrical characteristics of the package. For this reason, high positional accuracy is required for mounting each electronic component. In a semiconductor package manufacturing process using an interposer substrate, alignment marks for position recognition are provided at each mounting position on the interposer substrate. For this reason, we have achieved mounting with high positional accuracy by recognizing alignment marks (hereinafter referred to as local marks) for each mounting position, positioning the electronic component at the mounting position, and mounting it. . A method in which the position of the mounting area of the electronic component is detected each time the electronic component is mounted when each electronic component is mounted at the mounting position on the board in this manner is called a local recognition method.

However, in WLP, the substrate on which electronic components are mounted is simply a plate made of silicon, metal, glass, or the like. Therefore, there is no portion that can be used as a local mark such as a circuit pattern at the mounting position of the electronic component on the board. Furthermore, as described above, the substrate may be peeled off and removed from the pseudo wafer. Therefore, if equipment and processes for forming local marks are provided for each mounting position on the board, equipment costs, equipment installation space, number of processes, etc. will increase. Furthermore, if the local mark is recognized every time an electronic component is mounted, the time required to mount one electronic component also increases.

To deal with this, WLP recognizes the overall position of the board by recognizing alignment marks (hereinafter referred to as global marks) that indicate the outline position of the board and the position of the entire board. A method of mounting electronic components on the mounting area on the board is applied. In this way, when electronic components are mounted at multiple mounting positions on a board, a single board position detection is used to mount the electronic components at multiple mounting positions on the board. , called the global recognition method.

Furthermore, in recent years, substrates used for WLP have become larger. When mounting on such a board, in order to increase production efficiency, a pair of mounting parts is provided, each mounting part handles a partial area that divides one board into two, and electronic components can be mounted in parallel. It is being done. In this case, accurate positioning is possible by correcting the mounting position of each mounting section for each partial region.

However, the mounting positions of the pair of mounting sections may be shifted from each other. Such a misalignment is undesirable considering that electronic components mounted on one board will be processed all at once in a later process. For example, the rewiring process is performed by coating a photosensitive material, exposing the photosensitive material, developing, etching, ion implantation, resist peeling, and the like. Therefore, if there is a shift in the mounting position of the electronic component, problems such as a shift in the position of the mask during exposure occur. In other words, all electronic components on the board must be accurately arranged at predetermined intervals in each of the vertical and horizontal directions.

In order to correct such misalignment, a pair of mounting parts mounts electronic components on each partial area of the board, and then the board is taken out and transferred to an external measuring instrument, and the external measuring equipment mounts the electronic components using a pair of mounting parts. The positional deviation of the electronic components was measured and corrections were made based on this positional deviation. However, preparing an external measuring device is costly, and production efficiency is not good because it takes time and effort to move the board to the external measuring device.

The present invention has been proposed in order to solve the above-mentioned problems, and it is an object of the present invention to provide an electronic component mounting apparatus that can efficiently mount electronic components without shifting over the entire mounting area. .

In order to achieve the above object, the electronic component mounting apparatus of the present invention includes a stage that supports a board on which the electronic component is mounted, and a stage that supports a board on which the electronic component is mounted, in a mounting area that includes a plurality of electronic component mounting positions. a first mounting section having a first mounting head for mounting at a mounting position; a first mounting head moving mechanism for moving the first mounting head; and a first mounting section for mounting the electronic component at the mounting position. a second mounting section having a second mounting head and a second mounting head moving mechanism for moving the second mounting head; a second mounting section that is movable together with the first mounting head and supported on the stage; a first recognition unit that recognizes the position of the substrate supported by the stage; a second recognition unit that is movable together with the second mounting head and recognizes the position of the substrate supported on the stage; a stage moving mechanism that moves the stage so that the first recognition unit and the second recognition unit can recognize a common mark on the stage; Recognition error correction data calculation for calculating recognition error correction data for correcting a recognition error between the first recognition unit and the second recognition unit based on the position of the common mark recognized by the recognition unit. and a correction section that corrects the positioning position of the electronic component relative to the mounting position by the first mounting head or the second mounting head based on the recognition error correction data.

According to the present invention, it is possible to provide an electronic component mounting apparatus that can efficiently mount electronic components without shifting over the entire mounting area.

FIG. 2 is a plan view showing a board on which electronic components are mounted according to an embodiment. FIG. 1 is a plan view showing a mounting apparatus according to an embodiment. It is a front view showing a mounting device of an embodiment. It is a right view showing the mounting device of an embodiment. FIG. 2 is an explanatory diagram showing a calibration board placed on a stage and a board recognition camera that images the calibration board. FIG. 7 is an explanatory diagram showing a state in which stage movement error correction data is acquired redundantly by the second recognition unit. FIG. 2 is a block diagram showing the configuration of a control device according to an embodiment. FIG. 3 is an explanatory diagram showing displacement of electronic components mounted on a board. FIG. 3 is a plan view showing a calibration board used for calibration. It is a flowchart which shows the mounting process of an electronic component by the mounting apparatus of embodiment.

Hereinafter, an electronic component mounting apparatus according to an embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing a board W on which electronic components t are mounted. FIG. 2 is a plan view showing the external appearance of the mounting apparatus 1, FIG. 3 is a front view of the mounting apparatus 1, and FIG. 4 is a right side view. FIG. 5 is an explanatory diagram showing the calibration board 71 placed on the stage and the board recognition camera 43f that images it. FIG. 6 is an explanatory diagram showing a state in which stage movement error correction data is acquired redundantly by the second recognition unit. FIG. 7 is a block diagram showing the control device 50 of the mounting apparatus 1. As shown in FIG. FIG. 8 is an explanatory diagram showing the displacement of the electronic component t mounted on the substrate W.

[Electronic components]
As shown in FIG. 1, an object to be mounted on a substrate W by the mounting apparatus 1 of this embodiment is an electronic component t. An example of the electronic component t is a semiconductor chip. However, the electronic component t is not limited to one type of semiconductor chip, but may be a plurality of types of semiconductor chips, or even a semiconductor chip, a diode, a capacitor, etc. The mounting apparatus 1 of this embodiment is an apparatus that can manufacture an MCP by mounting a plurality of types of electronic components t, including semiconductor chips, diodes, capacitors, etc., on a substrate W. Examples of MCP configurations include those that include multiple types of semiconductor chips, those that include one type of semiconductor chip and diodes, capacitors, etc., and those that include multiple types of semiconductor chips, diodes, capacitors, etc.

[substrate]
As shown in FIG. 1, the substrate W of this embodiment is a rectangular substrate used for forming a pseudo panel similar to a pseudo wafer, which is applied, for example, when manufacturing FO-PLP (fan out-Panel Level Package). . As the substrate W, a glass substrate, an organic substrate (such as a glass epoxy (FR-4) substrate), a silicon substrate, a metal substrate such as stainless steel, etc. can be used, but the present invention is not limited to these. Similar to the pseudo wafer used in the production of FO-WLP, a pseudo panel is a method in which electronic components such as multiple individualized semiconductor chips are arranged in a plane, and the arranged electronic components are sealed with resin. It is in a state where it is molded into a single plate shape. The substrate W is preferably a substrate used when manufacturing the MCP by the above-mentioned FO-PLP process, that is, a substrate on which a plurality of electronic components t such as semiconductor chips and capacitors are mounted in each mounting area. Of course, the substrate W may be a substrate used to form a pseudo wafer used in manufacturing FO-WLP.

One surface of the substrate W of this embodiment is a mounting surface ws on which a plurality of electronic components t are mounted. A mounting area MA is set on this mounting surface ws. The mounting area MA includes a plurality of mounting positions ap (indicated by dotted circles in FIG. 1) for individual electronic components t. Furthermore, the mounting area MA includes a first area MA1 and a second area MA2 (both areas indicated by a dashed line in FIG. 1). Therefore, the first area MA1 and the second area MA2 are each part of the mounting area MA.

The first area MA1 and the second area MA2 of this embodiment are adjacent areas by dividing the mounting area MA into two equal parts. The mounting area MA, the first area MA1, and the second area MA2 are rectangular, and in the example shown in FIG. It is an area. The individual electronic components t are mounted at mounting positions ap set in a matrix of a plurality of rows and a plurality of columns within the first area MA1 and the second area MA2. In the first area MA1 and the second area MA2 of this embodiment, the row direction in which the mounting positions ap are lined up is a direction along the short side, and the column direction is a direction along the long side. The first area MA1 and the second area MA2 are adjacent to each other at their long sides.

Note that the mounting area MA, the mounting position ap, the first area MA1, and the second area MA2 are virtually set on the mounting surface ws of the substrate W. Marks indicating the first area MA1 and the second area MA2 are not formed on the mounting surface ws. The mounting surface ws may include alignment marks for global recognition indicating the overall position of the substrate W, but does not include marks for local recognition indicating individual mounting positions ap. In the following description, marks broadly include objects that serve as references for position recognition, such as dot marks, alignment marks, circuit patterns, and the outer shape of electronic components t.

[Mounting equipment]
(overview)
The configuration of the mounting apparatus 1 of this embodiment will be explained with reference to FIGS. 2 to 7. The mounting device 1 is a device that mounts an electronic component t onto a substrate W. In the following description, the direction in which the first area MA1 and the second area MA2 are lined up in a plane parallel to the mounting surface ws of the electronic component t of the board W on the mounting apparatus 1 is defined as the X direction, and the direction perpendicular to this Let the direction be the Y direction. Further, the direction perpendicular to the mounting surface ws is defined as the Z direction. In this embodiment, one side on the mounting surface ws where the first area MA1 and the second area MA2 are lined up left and right is the front, and when viewed from the front, the X direction is the left and right direction, the Y direction is the front and back direction, and the Z direction is the front. Vertical direction.

As shown in FIG. 2, the mounting apparatus 1 includes a component supply section 10, a stage section 20, a transfer section 30, a mounting section 40, and a control device 50. The component supply unit 10 is a device that supplies electronic components t. The stage section 20 is a device that includes a stage 21 on which the substrate W is placed. The transfer unit 30 is a device that takes out the electronic components t from the component supply unit 10. The mounting section 40 is a device that receives the electronic component t taken out by the transfer section 30 and mounts it on the substrate W placed on the stage 21. The component supply section 10, the stage section 20, the transfer section 30, and the mounting section 40 are provided on a base section 1a, which is a base mounted on an installation surface. The control device 50 is a device that controls the operations of the component supply section 10, the stage section 20, the transfer section 30, and the mounting section 40. The details of each part will be explained below.

(Parts supply department)
The component supply section 10 is disposed at the front part of the base section 1a and at the center in the X direction when viewed from the front. The component supply section 10 includes a wafer ring 11, a ring holder 12, and a push-up mechanism (not shown). The wafer ring 11 is a member that holds a wafer sheet S that holds electronic components t. The electronic component t is a semiconductor chip obtained by dividing the semiconductor wafer T into individual pieces.

The ring holder 12 is provided with the wafer ring 11 in a detachable manner. Further, the ring holder 12 is provided so that the wafer ring 11 can be moved in the XY directions by an unillustrated XY movement mechanism. The push-up mechanism is a mechanism that pushes up the electronic component t from below the wafer sheet S held by the wafer ring 11 when the electronic component t is taken out by the transfer section 30 . The push-up mechanism is fixedly provided at a position where the electronic component t is taken out by the transfer section 30.

Note that the component supply unit 10 includes a replacement device, although not shown. The exchange device supplies a new wafer ring 11 holding the electronic component t to the ring holder 12 from the storage section in which the wafer ring 11 is stored, and returns the wafer ring 11 from which the electronic component t has been removed to the storage section. Store it.

(Stage section)
The stage section 20 is arranged at the center of the base section 10a in the X direction, behind the component supply section 10 on the base section 1a, when viewed from the front. The stage section 20 includes a stage 21 and a stage moving mechanism 22. The stage 21 is a stand that supports the substrate W. In the stage 21 of this embodiment, the surface of the substrate W opposite to the mounting surface ws is placed. The stage moving mechanism 22 is a mechanism that moves the stage 21 in the XY directions. Although not shown, the stage moving mechanism 22 has a θ moving mechanism in the horizontal rotation direction. Furthermore, the stage moving mechanism 22 has a linear encoder. As a measure against heat, it is preferable to use a glass scale with a small coefficient of thermal expansion for the scale of the linear encoder.

Within the movement range in the Y direction of the coordinate system for moving the stage 21, and on a straight line along the X direction, mounting heads 43 (first mounting head 43A, second mounting head 43B), which will be described later, are mounted. , a mounting line BL is set to be positioned for mounting the electronic component t (see FIG. 1). This mounting line BL can be set at the center of the stage 21 in the Y direction. The stage moving mechanism 22 is controlled to move the stage 21 so that each row of mounting positions ap of the substrates W placed on the stage 21 is sequentially positioned on the mounting line BL.

The stage moving mechanism 22 can move the largest substrate W placed on the stage 21 in the X direction within a range slightly larger than 1/2 of the dimension of the substrate W in the X direction (1/2X+α). It has a moving stroke. Further, the stage moving mechanism 22 has a movement stroke that can move the substrate W in a range (Y+α) that is slightly larger than the dimension of the substrate W in the Y direction in the Y direction. The stage 21 is configured to be able to suction and hold the mounted substrate W by a suction suction mechanism (not shown). Note that +α in the movement range in the X direction allows the stage 21 to move so that the center portions of the stage 21 in the X direction overlap. In this overlapping movement, one half (the left half when viewed from the front) and the other half (the right half when viewed from the front) of the stage 21 may overlap with each other, or a stroke that allows only one of them to overlap may be used. The center of the stroke may be offset so that the stroke has an offset. The magnitude of +α (amount of overlap) in the movement range of the stage 21 in the X direction will be described later.

(Transfer Department)
The transfer unit 30 includes transfer devices 30A and 30B, an intermediate stage 31, and a wafer ring holding device 32. The transfer devices 30A and 30B are arranged side by side in the X direction on both sides of the component supply section 10 at the front portion of the base section 1a. The transfer devices 30A and 30B have the same configuration except that the left and right sides are reversed. Hereinafter, the configuration of the left transfer device 30A will be explained, and the description of the configuration of the right transfer device 30B will be omitted.

As shown in FIGS. 2 to 4, the transfer device 30A includes a Y-direction moving device 33, a transfer head 37, and a wafer recognition camera . The Y direction moving device 33 is a device that supports the Y direction moving block 34 so as to be movable in the Y direction. The Y-direction moving device 33 is provided on the front left side of the base portion 1a and extends along the Y direction from the front end of the base portion 1a to near the center. A support body 35 is provided on the back surface of the upper end side of the Y-direction moving block 34. The support body 35 has a rectangular plate shape, and extends from the Y-direction moving block 34 in the right direction along the X direction. An X-direction moving body 36 is provided on the back side of this support body 35. The X-direction moving body 36 is supported movably along the X-direction by an unillustrated X-direction moving device.

The transfer head 37 is supported by the end of the X-direction moving body 36 on the component supply section 10 side. The transfer head 37 includes suction nozzles (transfer nozzles) 37a, 37b, Z-direction moving devices 37c, 37d, and reversing mechanisms 37e, 37f. The suction nozzles (transfer nozzles) 37a and 37b are connected to a pneumatic circuit (not shown) and are provided so as to be able to hold the electronic component t using negative pressure. Two suction nozzles (transfer nozzles) 37a and 37b are lined up in the X direction.

The Z direction moving devices 37c and 37d are devices that individually move the suction nozzles 37a and 37b in the Z direction. The reversing mechanisms 37e and 37f are devices that individually revert the suction nozzles 37a and 37b vertically. Thereby, the suction nozzles 37a and 37b can selectively switch the posture between a state in which the suction surfaces for suctioning and holding the electronic component t face downward and a state in which the suction surfaces face upward. Note that the suction nozzle 37a is assembled to a reversing mechanism 37e, and the reversing mechanism 37e is assembled to a Z-direction moving device 37c. Further, the suction nozzle 37b is assembled to a reversing mechanism 37f, and the reversing mechanism 37f is assembled to a Z-direction moving device 37d. That is, the transfer head 37 has two suction nozzles that can be turned upside down.

The wafer recognition camera 38 is a device that faces the wafer sheet S held on the wafer ring 11 of the component supply section 10 and recognizes the position of the electronic component t on the wafer sheet S. The wafer recognition camera 38 is provided at the end of the X-direction moving body 36 on the component supply section 10 side, on a surface opposite to the surface on which the transfer head 37 is supported. When viewing the mounting apparatus 1 from the front, the transfer head 37 of the transfer device 30A on the left side is the first transfer head, and the transfer head 37 of the transfer device 30B on the right side is the second transfer head. be.

The intermediate stage 31 is a device on which electronic components t taken out by the suction nozzles 37a and 37b of the left and right transfer heads 37 are temporarily placed. The intermediate stage 31 is provided between the component supply section 10 and the stage section 20 on the base section 1a. The intermediate stage 31 includes mounting portions 31a to 31d. The placement parts 31a to 31d correspond to the two suction nozzles 37a and 37b of the transfer head 37 in the transfer device 30A, and the two suction nozzles 37a and 37b of the transfer head 37 in the transfer device 30B, respectively.

The wafer ring holding device 32 is a device that supplies and stores the wafer ring 11 in the ring holder 12 of the component supply section 10. As shown in FIG. 2, the wafer ring holding device 32 includes a surface of the support body 35 of the transfer device 30A on the side opposite to the surface on which the X-direction moving body 36 is provided, at the end on the component supply section 10 side; In other words, it is located at the front. The wafer ring holding device 32 has a support arm 32a and a chuck portion 32b. The support arm 32a is provided so as to be movable forward and backward in the X direction by an unillustrated X direction moving device such as an air cylinder. The chuck portion 32b is a member that grips the wafer ring 11, and is provided at the right end of the support arm 32a in the drawing. Further, the wafer ring holding device 32 can be moved in the Y direction by a Y direction moving device 33 provided with a support body 35. Such a wafer ring holding device 32 functions as a part of the above-mentioned exchange device. That is, the wafer ring 11 is gripped by the chuck part 32b, and the wafer ring 11 is supplied and stored in the storage part and the ring holder 12 (not shown) using the support arm 32a and the Y-direction moving device 33.

Such a transfer section 30 sequentially takes out electronic components t from the component supply section 10 and transfers them toward the mounting section 40 . When the electronic component t is mounted face-up on the substrate W, that is, with the electrode surface of the electronic component t facing upward, the transfer section 30 transfers the electronic component t taken out from the component supply section 10 via the intermediate stage 31. It is delivered to the mounting section 40. Further, when mounting the electronic component t face-down on a board, that is, with the electrode surface of the electronic component t facing down, the transfer unit 30 moves the electronic component t taken out from the component supply unit 10 to the suction nozzles 37a and 37b. The electronic component t is turned upside down and delivered to the mounting section 40 in a reversed state.

(Mounting section)
The mounting section 40 includes a first mounting section 40A and a second mounting section 40B. The first mounting section 40A and the second mounting section 40B have the same configuration except that the left and right sides are reversed. The first mounting section 40A and the second mounting section 40B are arranged in the X direction at the rear of the base section 1a so as to sandwich the stage section 20 therebetween. Hereinafter, only the configuration of the first mounting section 40A on the left side will be described, and a description of the configuration of the second mounting section 40B on the right side will be omitted.

The first mounting section 40A includes a support frame 41, a head support 42, a mounting head 43, and an imaging unit 44. The support frame 41 has a gate shape when viewed from the side, and is provided on the left side of the stage section 20 on the base section 1a along the Y direction (see FIG. 4). The head support body 42 is provided on the right side surface of the support frame 41 so as to be movable in the Y direction via a Y direction moving device 41a. The head support body 42 extends along the X direction to near the center of the base portion 1a.

The mounting head 43 is a device that mounts electronic components at a mounting position ap. Hereinafter, the mounting head 43 of the first mounting section 40A will be referred to as the first mounting head 43A, and the mounting head 43 of the second mounting section 40B will be referred to as the second mounting head 43B, and if the two are not to be distinguished, they will simply be referred to as the mounting head. 43. The mounting head 43 is provided on the front surface of the head support 42 so as to be movable in the X direction via an X direction moving device 42a. The mounting head 43 includes mounting tools 43a and 43b, Z-direction moving devices 43c and 43d, and an imaging unit 44. The mounting tools 43a and 43b are a pair of tools that hold the electronic component t and mount it on the board W. The mounting tools 43a and 43b are suction nozzles, are connected to a pneumatic circuit (not shown), and are provided so as to be able to hold the electronic component t using negative pressure. The mounting tools 43a and 43b are provided at the same spacing as the suction nozzles 37a and 37b of the transfer head 37.

The mounting tools 43a and 43b are provided with a window (not shown) at the end opposite to the part that attracts and holds the electronic component t. The window is made of a transparent member. Note that this member may be any member that can transmit light, and is not limited to being transparent. Thereby, the electronic component t held by the mounting tools 43a and 43b can be observed through the window. The mounting tools 43a and 43b are equipped with a rotation device (not shown), and can rotate the electronic component t held by suction within the XY plane.

Further, of the mounting tools 43a and 43b, a board recognition camera 43f as a recognition unit is attached to the mounting tool 43b located at the center side, that is, inside, of the base portion 1a. The substrate recognition camera 43f is provided movably together with the mounting head 43, and recognizes the position of the substrate W. More specifically, the substrate recognition camera 43f images an alignment mark (global mark) on the substrate W placed on the stage 21. In addition to the function of capturing an image, the board recognition camera 43f has a function of processing the captured image to recognize the position of a recognition target such as an alignment mark. Therefore, the substrate recognition camera 43f functions as a recognition unit for recognizing the position of the substrate W. Further, the board recognition camera 43f images a dot mark 72 on a calibration board 71, which will be described later. Furthermore, the board recognition camera 43f can recognize the mounting position ap where the electronic component t is mounted based on the recognized position of the board W. Hereinafter, the board recognition camera 43f of the first mounting section 40A will be referred to as a first recognition section, and the board recognition camera 43f of the second mounting section 40B will be referred to as a second recognition section. If there is no distinction between the two, it is simply referred to as a recognition unit.

The Z direction moving devices 43c and 43d are devices that individually move the two mounting tools 43a and 43b in the Z direction. A mounting head moving mechanism is constituted by the Y-direction moving device 41a, the X-direction moving device 42a, and the Z-direction moving devices 43c and 43d. A mechanism for moving the first mounting head 43A of the first mounting section 40A is called a first mounting head moving mechanism, and a mechanism for moving the second mounting head 43B of the second mounting section 40B is called a second mounting head. If there is no need to distinguish between the two, it is simply referred to as a mounting head moving mechanism.

The imaging unit 44 is a unit for imaging the electronic component t held by the mounting tools 43a and 43b. The imaging unit 44 has four chip recognition cameras 44a to 44d above the four placing parts 31a to 31d of the intermediate stage 31, corresponding to the four placing parts 31a to 31d.

The chip recognition cameras 44a to 44d can image the electronic components t placed on the mounting sections 31a to 31d, and the electronic components t held by the mounting tools 43a and 43b moved below the chip recognition cameras 44a to 44d. can be imaged through the windows of the mounting tools 43a and 43b.
Furthermore, the chip recognition cameras 44a to 44d have a function of processing the captured image and recognizing the position of the imaged object such as the electronic component t.

The chip recognition cameras 44a to 44d are supported movably in the XY directions in pairs by a pair of XY moving devices 44e and 44f. The pair of two chip recognition cameras (44a and 44b and 44c and 44d) are provided at the same spacing as the mounting tools 43a and 43b and the suction nozzles 37a and 37b. A pair of XY moving devices 44e and 44f are supported by a camera support frame 44g. The camera support frame 44g has a gate shape when viewed from the front, and extends in the X direction between the component supply section 10 on the base section 1a and the stage section 20. The camera support frame 44g is provided at the front end of the upper surface of the left and right support frames 41 in the mounting section 40 so as to span over the left and right support frames 41. The chip recognition cameras 44a to 44d are supported below the beam portion of the camera support frame 44g.

The mounting section 40 receives the electronic component t taken out from the component supply section 10 by the transfer section 30, and mounts the received electronic component t onto the substrate W placed on the stage 21. In this embodiment, the mounting tools 43a and 43b of the first mounting head 43A mount the electronic component t in the first area MA1, and the mounting tools 43a and 43b of the second mounting head 43B mount the electronic component t in the first area MA1. Electronic component t is mounted in area MA2. Mounting of the electronic component t by the first mounting head 43A and mounting of the electronic component t by the second mounting head 43B are performed in parallel.

As shown in FIG. 2, in a state where the stage 21 is located at the center in the X direction on the base portion 1a and the substrate W is supported at the center of the stage 21, the first mounting head 43A is placed on the stage 21 during mounting. The second mounting head 43B is arranged on one side of the stage 21 (on the left side in the figure), and the second mounting head 43B is arranged on the other side (on the right side in the figure) with respect to the stage 21. The movable range of the first mounting head 43A and the second mounting head 43B is divided into two by the center position of the base portion 1a in the X direction. As a result, the first mounting head 43A and its board recognition camera 43f cannot move beyond the center position of the base portion 1a into the movement area of the second mounting head 43B, The board recognition camera 43f cannot move beyond the center position of the base portion 1a into the movement area of the first mounting head 43A. Note that FIG. 5 shows the stage 21 and the board recognition camera 43f. FIG. 5 shows a calibration substrate 71, which will be described later, placed on the stage 21. The stage 21 is positioned at the center of its movement stroke in the X direction. Further, FIG. 5 shows that the first mounting head 43A and the second mounting head 43B are located at the left end of each movement range. Therefore, in FIG. 5, each board recognition camera 43f is depicted as being located at the left end of each movement range. In this embodiment, the movement range of the first mounting head 43A and the second mounting head 43B is limited by a physical mechanism. However, the movement range may be limited by program control.

As described above, the movement range of the first recognition section and the second recognition section is limited by the area that bisects the top of the base section 1a. Therefore, even if one recognition section is moved, the mark existing in the area of the other recognition section cannot be recognized. Therefore, the same mark (common mark) cannot be recognized simply by moving the recognition unit. However, in this embodiment, the stage moving mechanism 22 can move the stage 21 so that the first recognition section and the second recognition section can recognize a common mark. That is, as described above, the stage 21 can be moved so that the central portions of the stages 21 in the X direction overlap. As the stage 21 moves, for example, the dot mark 72 in the first area MA1 corresponding to the movement range of the first recognition part of the calibration board 71 is transferred as a common mark to the second recognition part which is the second recognition part. can be moved to a position where the board recognition camera 43f of the mounting section 40B can take an image. In other words, the same dot mark 72 (common mark) can be imaged by the board recognition camera 43f of the first mounting section 40A and the board recognition camera 43f of the second mounting section 40B. As described above, the stage moving mechanism 22 moves the largest substrate W placed on the stage 21 in the X direction within a range slightly larger than half (1/2X+α) of the dimension of the substrate W in the X direction. It has a movement stroke that can be moved. The size of this +α is determined by the position of the dot mark 72 used as a common mark among the rows of dot marks 72 (rows along the Y direction) in the first area MA1 (see FIG. 1) on the calibration substrate 71. It can be determined according to the number of columns. For example, if there are dot marks 72 used as common marks in two rows located closer to the second region MA2 in the first region MA1, the dot marks 72 that are used as common marks are +α can be determined. (See FIG. 6) Based on the range of +α determined in this way, the stage moving mechanism 22 moves the stage 21 so that the first recognition unit and the second recognition unit can recognize the common mark. It can be moved.

More specifically, as shown in the area indicated by the dotted line in FIG. The stage 21 moves so that the board recognition camera 43f of the mounting section 40B can take an image. In FIG. 6, similarly to FIG. 5, both board recognition cameras 43f are located at the left end of their respective movement areas. However, in FIG. 6, the stage 21 moves to the second area MA2 side and the board recognition camera 43f of the second mounting section 40B is able to image the dot mark 72 in the first area MA1 indicated by the dotted line. It shows. For example, as shown in the area surrounded by the dotted line in FIG. 6, of the dot marks 72 in the first area MA1, the dot marks 72 in two rows near the second area MA2 can be imaged. Note that the movement of the stage moving mechanism 22 may allow the board recognition camera 43f of the first mounting section 40A to image the dot mark 72 in the second area MA2. In this case, for example, of the dot marks 72 in the second area MA2, two rows close to the first area MA1 may be imaged. Note that the number of columns is not limited to two, and there may be more than two columns, as long as at least one column can be imaged.

(Control device)
The configuration of the control device 50 will be explained with reference to the block diagram of FIG. The control device 50 is a device that controls the operations of the component supply section 10, the stage section 20, the transfer section 30, and the mounting section 40 based on control information stored in the storage section 56. The control device 50 can be configured by, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. That is, regarding the control of the component supply section 10, the stage section 20, the transfer section 30, and the mounting section 40, the control contents are programmed and executed by a processing device such as a PLC or a CPU.

The control device 50 includes a mechanism control section 51, an image processing section 52, a movement error correction data calculation section 53, a recognition error correction data calculation section 54, a correction section 55, a storage section 56, and an input/output control section 57. The mechanism control section 51 controls the operations of the component supply section 10, the stage section 20, the transfer section 30, and the mounting section 40. The image processing unit 52 converts image data from the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition cameras 44a to 44d into a format suitable for display on a display.

The movement error correction data calculation unit 53 calculates movement error correction data for correcting movement errors caused by movement of the stage 21. The movement error is an error caused by the accuracy of the guide rail that guides the movement of the stage 21, the accuracy of assembly to the metal frame, etc.

The recognition error correction data calculation unit 54 calculates the recognition error between the first recognition unit and the second recognition unit based on the position of the common mark recognized by the first recognition unit and the second recognition unit. Recognition error correction data for correction is calculated. Such a recognition error occurs because there is a misalignment between the coordinate system of the first recognition section of the first mounting section 40A and the coordinate system of the recognition section of the second mounting section 40B.

If there is such a shift, for example, the position of the electronic component t mounted in the first area MA1 shown in FIG. 8(A) and the electronic component t mounted in the second area MA2 shown in FIG. 8(B) may change. A shift d occurs at the position of the component t, as shown in FIG. 8(C). Although FIG. 8C only shows the deviation d in the Y direction, deviations in the X direction also occur. Data for correcting such recognition errors is recognition error correction data.

Further, as described above, the stage 21 moves in order to cause the first recognition unit or the second recognition unit to recognize the common mark. In this case as well, a movement error of the stage 21 may occur. The movement error correction data calculation unit 53 of the present embodiment performs movement error correction for correcting movement errors caused by overlapping movement across the first area MA1 and second area MA2 of the stage 21 for recognition of a common mark. Data is also calculated.

The movement error correction data can be calculated using the calibration board 71 having the dot marks 72 or the board W on which the electronic component t is mounted (which may be for a product or for testing). Specifically, the calibration substrate 71 is set on the stage 21. With the left and right board recognition cameras 43f stopped at predetermined positions, the stage 21 (calibration board 71) is pitch-moved in the arrangement of dot marks 72 within the range for which movement error correction data is desired to be obtained. Then, within the range, the positional deviation between the position of each dot mark 72 recognized by imaging by the board recognition camera 43f and the reference position (for example, the center of the imaging field of view) is determined, and based on this, the movement error correction data is calculated. Calculate. The same applies when electronic components t mounted on the substrate W are used instead of the dot marks 72 on the calibration substrate 71.

Further, the movement error correction data may include not only movement errors of the stage 21 but also movement errors of the board recognition camera 43f and the mounting heads 43A and 43B. In other words, when the movement error correction data calculation unit 53 calculates movement error correction data, it acquires movement error correction data not only for the stage 21 but also for the mounting heads 43A and 43B, and calculates movement errors during movement. It may be corrected. Similar to the movement error correction data of the stage 21, the movement error correction data of the mounting heads 43A and 43B can be obtained using the calibration board 71 having the dot marks 72 or the board W on which the electronic component t is already mounted. . Note that since the board recognition camera 43f is mounted on the mounting head 43, the movement error correction data of the board recognition camera 43f can be considered to be the same as the movement error correction data of the mounting head 43.

Specifically, the calibration substrate 71 is set on the stage 21 as described above. The stage 21 is fixed (stopped) at the origin position, and the mounting heads 43A and 43B (substrate recognition camera 43f) are moved in pitch according to the arrangement of the dot marks 72 within the range in which movement error correction data is desired to be obtained. Then, within the range, the positional deviation between the position of each dot mark 72 recognized by imaging by the board recognition camera 43f and the reference position (for example, the center of the imaging field of view) is determined, and based on this, the movement error is corrected. Calculate the data. This allows for even more accurate implementation. The same thing can be done when using the electronic component t already mounted on the board W in place of the dot mark 72 on the calibration board 71.

The correction unit 55 corrects the position of the electronic component t relative to the mounting position ap by the mounting head 43 based on the movement position error data and the recognition error correction data. In other words, the correction unit 55 performs the first mounting for positioning the electronic component t at the mounting position ap by the first mounting unit 40A and the second mounting unit 40B based on the movement position error data and the recognition error correction data. The coordinate movement amounts of the head 43A and the second mounting head 43B are corrected. This means correcting the target position that is the target positioning on the coordinates.

The storage unit 56 stores various types of information necessary for controlling the mounting apparatus 1. The information stored in the storage unit 56 includes operation programs for each part for mounting the electronic component t on the board W, movement position error data, recognition error correction data, coordinates of each mounting position ap, and mounting area MA. , coordinates of the positioning position, image data from the wafer recognition camera 38, substrate recognition camera 43f, chip recognition cameras 44a to 44d, position coordinates of recognized marks, etc. are also included.

Further, an input device 61 and an output device 62 are connected to the control device 50. The input device 61 is an input means such as a touch panel, joystick, switch, keyboard, mouse, etc. for an operator to operate the mounting apparatus 1 via the control device 50.

The output device 62 is an output means such as a display, a lamp, a meter, a speaker, a buzzer, etc., which makes information for confirming the state of the device recognizable to the operator. For example, images captured by the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition cameras 44a to 44d are displayed on a display and can be confirmed by the operator.

[Operation of mounting equipment]
Next, the operation of the mounting apparatus 1 will be explained with reference to FIGS. 9 and 10 in addition to FIGS. 1 to 8 described above.

[overview]
When only the global recognition method is applied when mounting electronic components such as the electronic component t on each mounting area of the board W, position recognition of each mounting position ap using local marks is not performed. Therefore, the positioning accuracy of the electronic component t with respect to each mounting position ap depends on the recognition accuracy of the global mark etc. on the substrate W, the machining accuracy of the stage moving mechanism 22 of the stage 21, etc.

However, in terms of metal processing, it is virtually impossible to finish the guide rails and the like that guide the movement of the stage 21 over a desired range with an accuracy of ±several μm or less. Moreover, it is even more impossible to assemble a guide rail having a desired length to a metal frame or the like with straightness and waviness of ± several μm or less. Therefore, the movement error correction data calculation unit 53 measures the movement position error of the stage 21, calculates movement error correction data for correcting the movement error of the stage 21, and stores this in the storage unit 56.

Further, in this embodiment, the first recognition unit and the second recognition unit recognize the coordinates of a common mark, calculate the difference between the coordinates recognized by both, measure the recognition error, and correct the recognition error. Recognition error correction data is calculated and stored in the storage unit 56. Furthermore, in this embodiment, the stage 21 moves in order for the first recognition unit or the second recognition unit to recognize a common mark. The storage unit 56 also stores movement error correction data for correcting movement errors in the movement of the stage 21.

[calibration]
The calculation and storage of movement error correction data and the calculation and storage of recognition error correction data as described above are called calibration. First, a calibration operation performed before mounting the electronic component t will be explained. For this calibration, a calibration substrate 71 is used, as shown in FIGS. 5, 6, and 9. The calibration substrate 71 is, for example, a glass substrate on which dot marks 72 for position recognition are provided in a matrix at intervals of several mm (some dot marks 72 are omitted from illustration). ). Although the size of the calibration board 71 is not limited, it is approximately the same size as the largest board W to which the mounting apparatus 1 can be applied, and the area where the dot marks 72 are provided is It is preferable that the size is the same as the range including the mounting area MA on W. Note that the dot mark 72 is a mark for understanding the movement error of the stage 21, and does not necessarily correspond to the mounting position ap. Although the arrangement of the mounting positions ap is mainly based on the size of the electronic component t, it is preferable that the dot marks 72 be arranged at maximum intervals that can ensure the required accuracy. The shorter the interval between the dot marks 72, the more accurately the movement error can be grasped, but the more times recognition is required within a predetermined distance, the longer the time required for recognition. Further, the dot mark 72 is formed of a metal thin film or the like, and can be formed using a film forming technique such as etching or sputtering. Such a calibration substrate 71 is set on the stage 21. The method of setting the calibration board 71 is not particularly limited, but for example, by only moving the stage 21 in the X direction, all dot marks 72 in the movable range of the stage 21 in the same row along the X direction can be detected by the board recognition camera 43f. The position of the calibration substrate 71 on the stage 21 is adjusted so that it passes through the center of the imaging field of view V.

(Calculation of movement error correction data)
Next, the first recognition section and the second recognition section recognize the positions of each dot mark 72 on the calibration substrate 71 set on the stage 21 in the above-described method, and the movement error correction data calculation section 53 Calculate movement error correction data for the stage 21. That is, the board recognition camera 43f of the first recognition section and the board recognition camera 43f of the second recognition section recognize the position of the dot mark 72. Then, the movement error correction data calculation unit 53 calculates the movement error of the dot mark 72 and movement error correction data based on the movement error. At this time, the dot mark 72 is regarded as the mounting position ap, and the range where the dot mark 72 is provided is assumed to be the mounting area MA. Assume that the mounting area MA is divided into two parts, and the first area MA1 and the second area MA2 are as described above. Hereinafter, the calibration board 71 will also be simply referred to as a mounting area MA, a first area MA1, and a second area MA2.

Recognition of the dot mark 72 is performed by moving the calibration board 71 while the board recognition camera 43f of the first recognition section and the board recognition camera 43f of the second recognition section are stopped at predetermined positions. For example, as shown in FIG. 9, the image of the dot mark 72 on the calibration board 71 is taken from the dot mark 72 located at the left end of the rear part of the calibration board 71 (the side located on the rear side of the base part 1a) to the right side in the X direction. It starts moving in pitch units, which is the arrangement interval of the dot marks 72, and sequentially turns back toward the front part (the side located on the front side of the base part 1a).

At this time, among the dot marks 72 on the calibration board 71, the dot marks 72 provided in the first area MA1 are imaged by the board recognition camera 43f of the first recognition unit. Further, among the dot marks 72 on the calibration board 71, the dot marks 72 provided in the second area MA2 are imaged by the board recognition camera 43f of the second recognition unit.

Specifically, as shown in FIG. 9, for example, the first recognition is performed with the stage 21 positioned at the center of the movement stroke of the stage moving mechanism 22 in the XY directions (this position is referred to as the origin position). The substrate recognition camera 43f of the section is positioned at the center 71A of the dot mark group located on the calibration substrate 71 corresponding to the first area MA1. Further, the board recognition camera 43f of the second recognition unit is positioned at the center 71B of the dot mark group located on the calibration board 71 corresponding to the second area MA2. That is, with the center of the mounting area MA of the calibration board 71 positioned at the origin position of the stage 21, each board recognition camera 43f is placed at the center position of each of the first area MA1 and second area MA2 of the calibration board 71. position. Therefore, the two board recognition cameras 43f are positioned at the same position in the Y direction and at an interval corresponding to the interval (pitch) between the first area MA1 and the second area MA2 in the X direction. From this state, while keeping the XY positions of both board recognition cameras 43f stopped, the operator operates the stage moving mechanism 22 while looking at the display to mark the upper left dot of the dot mark group corresponding to the first area MA1. The calibration board 71 is moved so that the reference numeral 72 is located at the center of the imaging field of view V of the board recognition camera 43f of the first recognition unit. As a result, the upper left dot mark 72 of the dot mark group corresponding to the first area MA1 is located within the imaging field of view V of the board recognition camera 43f of the first recognition section. At this time, the upper left dot mark 72 of the dot mark group corresponding to the second area MA2 is positioned within the imaging field of view V of the board recognition camera 43f of the second recognition section. In each dot mark group corresponding to the first area MA1 and the second area MA2, the upper left dot mark 72 is the first dot mark 72.

Once the first dot mark 72 is positioned at the center of the imaging field of view V of the board recognition camera 43f, the detection operation of the dot mark 72 by both board recognition cameras 43f is started. From here on, the process is automatically controlled by the control device 50. The detection operation is started when the operator presses (touches) a detection operation start button displayed on the touch panel. When the detection operation of the dot mark 72 is started, the first dot mark 72 is first imaged. The captured image of the first dot mark 72 is processed using a known image recognition technique, and the positional shift of the dot mark 72 with respect to the center of the imaging field of view V of the board recognition camera 43f is detected. The detected positional deviation is stored in the storage unit 56 as information paired with the movement position (XY coordinates) of the stage 21. In this way, recognition of the position of the dot mark 72 includes image recognition, grasping the position, and detection of positional deviation.

When the position recognition of the first dot mark 72 is completed, the stage 21 moves in accordance with the movement order described above to position the next (second) dot mark 72 within the field of view of the camera. In the example of FIG. 9, the second dot mark 72 is located to the right of the first dot mark 72, so the stage 21 is moved one pitch to the left in the X direction.

The movement of the stage 21 is performed based on the reading value of a linear encoder provided in the XY movement mechanism (stage movement mechanism 22) of the stage 21. When the movement of the stage 21 is completed, the positional deviation of the second dot mark 72 is detected in the same manner as the first dot mark 72, and is stored in the storage unit 56 as information paired with the XY coordinates of the stage 21 at this time. be remembered. Such an operation is performed for the dot marks 72 in each target area by both board recognition cameras 43f, and the movement error of the dot marks 72 corresponding to the respective positions of all the dot marks 72 on the calibration board 71 is corrected. The data is calculated and stored in the storage unit 56. Once the movement error correction data of all the dot marks 72 on the above-mentioned calibration substrate 71 is calculated, the calibration substrate 71 is moved by +α in the X-direction stroke of the stage 21 using the stage moving mechanism 22, and the dot marks 72 existing in the region of +α are moved by the stage moving mechanism 22. The dot mark 72 is recognized by the substrate recognition camera 43f of the second recognition section, and movement error correction data for the +α area is further calculated and stored. As a result, for portions where the movement of the stage 21 can overlap, movement error correction data is also acquired for the expanded movement of the stage 21.

(Calculation of recognition error correction data)
Furthermore, the recognition error correction data calculation unit 54 calculates and obtains recognition error correction data. This recognition error correction data is calculated by recognizing a common mark by the first recognition unit and the second recognition unit and calculating the difference between the coordinates of the two.

For example, as shown by the dotted line in FIG. 9, among the dot marks 72 in the first area MA1, at least one dot mark 72 located within two rows near the second area MA2 is set as a common mark. In this embodiment, one selected dot mark 72 located within two columns is used as a common mark.

More specifically, as shown in FIG. 9, the board recognition camera 43f of the first recognition section is positioned at the center 71A of the dot mark group, and the board recognition camera 43f of the second recognition section is positioned at the center 71A of the dot mark group. The stage 21 is moved by the stage moving mechanism 22 while being positioned at the center 71B, and the dot mark 72 used as a common mark among the dot marks 72 in the first area MA1 is detected by the board recognition camera of the second recognition unit. It is recognized by moving it so that it is positioned at the center of the field of view of 43f. In other words, the area of the dot mark 72 recognized by the board recognition camera 43f of the second recognition unit is expanded, and the dot mark 72 that has already been recognized by the board recognition camera 43f of the first recognition unit is expanded, as shown in FIG. 72 is recognized twice. Then, for the common dot mark 72, the difference between the coordinates (X ₁ , Y ₁ ) recognized by the first recognition unit and the coordinates (X ₂ , Y ₂ ) recognized by the second recognition unit is calculated. , calculates recognition error correction data to correct this error. In this embodiment, the obtained difference is used as recognition error correction data.

When moving the stage 21 to recognize such overlapping dot marks 72, the movement position of the stage 21 is corrected with reference to the movement error correction data obtained previously. In this way, the coordinates (X ₂ , Y ₂ ) recognized by the second recognition unit are stored in the storage unit 56 along with the recognition error correction data and the movement error correction data.

The calculation of the movement error correction data and the recognition error correction data described above is basically performed when the mounting apparatus 1 is operated, and the movement of the stage 21 may be controlled based on the measurement results. However, the stage 21 may include a heater or the like that assists in mounting the electronic component t. In such a case, there is a risk that the temperature of each part of the device will rise and mechanical accuracy will decrease due to thermal expansion. Further, as the mounting process of the electronic component t by the mounting apparatus 1 progresses, the mechanical accuracy of each part of the apparatus may be reduced due to heat generated by the motor of the moving apparatus for moving the mounting head 43, etc. When consideration is given to movement errors due to such temperature rise, the measurement is not limited to once when the device is in operation, but may be carried out periodically.

Further, after the electronic components t are mounted, at least one electronic component t among the electronic components t on the mounted board W may be used as a common mark. In this way, by recognizing the common mounted electronic component t by the first recognition unit and the second recognition unit, recognition error correction data may be acquired in the same manner as described above. That is, the common marks recognized by the first recognition section and the second recognition section include not only the dot mark 72 but also the electronic component t. Note that the position recognition of the electronic component t can be performed by relying on the mark if there is a distinguishable mark such as an alignment mark or a circuit pattern on the top surface of the mounted electronic component t. If a mark does not exist, it is possible to perform the determination by relying on the external shape of the electronic component t (which is also included in a type of mark). Furthermore, when the mounted electronic component t is used as a common mark, there is a possibility that mounting misalignment may occur between the first mounting section 40A and the second mounting section 40B due to individual differences. , such deviations can also be corrected.

[Mounting position correction]
The mechanism control unit 51 moves the stage so that the mounting positions ap virtually set on the substrate W placed on the stage 21 are sequentially positioned on the mounting line BL for each row of mounting positions ap along the X direction. control mechanism 22; At this time, a correction process in which the correction unit 55 corrects the moving position of the stage 21 will be described.

The correction unit 55 refers to the movement error correction data of the stage 21 and corrects the movement position of the stage 21 when positioning the row of the mounting position ap where the electronic component t is currently mounted on the mounting line BL. Note that when mounting in the second area MA2, the movement error correction data and recognition error correction data of the stage 21 are referred to, and when the row of the mounting position ap where the electronic component t is to be mounted this time is positioned on the mounting line BL. The moving position of the stage 21 may be corrected.

[Electronic component implementation]
The mounting of the electronic component t onto the substrate W after the above-described calibration will be described with reference to the flowchart of FIG. Note that FIG. 10 shows the process from when the wafer ring 11 is carried in until the end of mounting the electronic components t on the wafer ring 11.

(1) Carrying in the wafer ring (step S101)
First, as shown in FIG. 2, a new wafer ring 11 holding an electronic component t is carried into the ring holder 12 from a storage section (not shown), and the wafer ring 11 is fixed onto the ring holder 12. The wafer ring 11 positioned on the ring holder 12 is held in a state where the wafer sheet S is stretched by an expanding mechanism (not shown) included in the component supply section 10 .

(2) Setting the board (step S102)
(Substrate supply)
A substrate W held by a transport robot (not shown) is supplied to the stage 21. The transfer robot (not shown) is equipped with a transfer arm that places and holds the substrate W, and transfers the substrate W from the left side of the mounting apparatus 1 to the stage through the space under the gate of the support frame 41 of the first mounting section 40A. 21. After supplying the substrate W onto the stage 21, the transfer arm retreats from above the mounting apparatus 1. The step of supplying the substrate W may be performed in parallel with the loading of the wafer ring 11, or may be performed separately.

(Correction of board misalignment)
The global mark of the substrate W placed on the stage 21 is detected, and the position of the substrate W is recognized. For example, the positions of global marks provided at three of the four corners of the substrate W are imaged and detected using the substrate recognition camera 43f. Then, based on the detected positions of the three global marks, the positional deviation of the substrate W in the XY direction and the θ direction (horizontal rotation direction) is determined, and based on the correction data for correcting this positional deviation, the positional deviation of the stage 21 is determined. The stage moving mechanism 22 corrects the positional shift. Note that the storage unit 56 stores the relative positional relationship between the global mark and each mounting position ap, and the control device 50 determines the mounting position ap on the substrate W based on the position of the global mark. It is now possible to understand. By the way, one board recognition camera 43f cannot invade the other area. The stage 21 can also only move by half the substrate +α in the X direction. Therefore, the global marks at both ends of the board in the X direction are recognized by the board recognition cameras 43f in the respective regions. Note that when correcting the positional shift of the substrate W placed on the stage 21 as described above, the detected position of the global mark is corrected based on the movement error correction data and recognition error correction data described above. In this way, while correcting the positional deviation of the substrate W, the row of the mounting position ap to be mounted first is positioned on the mounting line BL set at the center position (origin position) of the stroke of the stage 21 in the Y direction. At this time, the center position of the substrate W in the X direction is positioned at the center position (origin position) of the stroke of the stage 21 in the X direction.

(3) Transferring electronic components (step S103)
(Removal of electronic components)
When the wafer ring 11 is held by the ring holder 12, the electronic component t to be taken out first on the wafer ring 11 is positioned at the take-out position. Each time an electronic component t is taken out, the ring holder 12 moves the wafer ring 11 by pitch according to the order stored in advance in the storage unit 56, and the electronic components t are sequentially positioned at the take-out position.

The suction nozzles 37a and 37b of the transfer head 37 of the transfer device 30A move directly above the electronic component t positioned at the take-out position. The Z-direction moving devices 37c and 37d lower the suction nozzles 37a and 37b, respectively, and bring the suction surfaces of the suction nozzles 37a and 37b into contact with the upper surface (electrode forming surface) of the electronic component t, respectively. When the suction nozzles 37a and 37b come into contact with the electronic component t, the suction nozzles 37a and 37b respectively suction and hold the electronic component t. Such suction and holding of the electronic components t by the suction nozzles 37a and 37b is performed sequentially for the electronic components t that are sequentially positioned. Further, such removal of the electronic components t is performed alternately by the transfer device 30A and the transfer device 30B.

The suction nozzles 37a and 37b of the transfer head 37 are positioned on the placement parts 31a and 31b of the intermediate stage 31. In this state, the suction nozzles 37a, 37b are lowered, and the electronic component t held by the suction nozzles 37a, 37b is placed on the placement parts 31a, 31b.

(Delivery of electronic parts)
When the electronic component t is placed on the placing parts 31a and 31b of the intermediate stage 31, the first mounting head 43A of the first mounting part 40A moves toward the intermediate stage 31, and the mounting tool 43a, After the mounting tools 43b are positioned above the mounting parts 31a and 31b and lowered to suction and hold the electronic component t, the mounting tools 43a and 43b are raised. As a result, the mounting tools 43a and 43b receive the two electronic components t at the same time. Here, in parallel with the delivery of the electronic component t, the transfer device 30B takes out the electronic component t and transfers the intermediate stage 31 similarly to the transfer device 30A.

(4) Mounting of electronic components (steps S104, S105)
(Position detection and movement of electronic components)
When the mounting tools 43a, 43b receive the electronic component t, the chip recognition cameras 44a, 44b of the imaging unit 44 arranged above the mounting parts 31a, 31b detect the electronic component t held by suction on the mounting tools 43a, 43b. is imaged. This imaging is performed through transparent members of the mounting tools 43a and 43b. Based on the images taken by the chip recognition cameras 44a and 44b, the position of the electronic component t held by the mounting tools 43a and 43b is detected.

Note that the position detection of the electronic component t may be performed on the mounting portions 31a and 31b. In this case, after the chip recognition cameras 44a and 44b take an image of the electronic component t, the mounting tools 43a and 43b suck and hold the electronic component t. When the chip recognition cameras 44a and 44b complete imaging of the electronic component t, the mounting tools 43a and 43b move onto the row of the mounting position ap in the mounting area MA of the board W positioned on the mounting line BL along the X direction. move toward

(Electronic component mounting)
The first mounting head 43 of the first mounting section 40A is first held by the mounting tool 43a on the mounting position ap where the electronic component t held by the mounting tool 43a is mounted among the mounting tools 43a and 43b. move to position the electronic component t. In this case, since the electronic component t held by the left mounting tool 43a is the first electronic component t to be mounted on the board W, the electronic component t held by the left mounting tool 43a is the most The mounting tool 43a is moved to the mounting position ap located on the left side, lowered to bring the electronic component t into contact with the board W, and then raised and removed from the mounting tool 43a. t is implemented.

Mounting is performed by bonding the electronic component t to the substrate W. This bonding is performed using the adhesive force of an adhesive sheet, die attach film (DAF), etc. that is attached in advance to the surface of the substrate W or the lower surface of the electronic component t. The electronic component t may be bonded by providing a heater on the stage 21 and pressurizing the electronic component t against the heated substrate W.

When the mounting by the mounting tool 43a is completed, the first mounting head 43A moves to position the electronic component t held by the mounting tool 43b on the mounting position ap to be mounted next. When the electronic component t held by the mounting tool 43b is positioned on the mounting position ap, the electronic component t is mounted on the mounting position ap by the same operation as the mounting tool 43a described above. The first mounting head 43A moves toward the intermediate stage 31 after the mounting of the electronic component t by the mounting tools 43a and 43b is completed.

Here, since the electronic component t is being transferred by the transfer device 30A in parallel with the mounting process of the electronic component t by the first mounting section 40A, the first mounting head 43A is placed on the intermediate stage 31. When the electronic component t is moved onto the mounting sections 31a and 31b, the electronic component t to be mounted next is placed on the mounting sections 31a and 31b. Therefore, the first mounting head 43A that has moved onto the intermediate stage 31 immediately receives the electronic component t from the mounting portions 31a and 31b, and performs the above-described mounting again. Thereafter, this operation is repeated until the electronic component t is completely mounted at the mounting position ap in the first area MA1.

Even while the electronic components t are being mounted by the mounting tools 43a and 43b of the first mounting head 43A, the electronic components t are placed on the mounting sections 31c and 31d of the intermediate stage 31 by the transfer device 30B. When the transfer is completed, the second mounting head 43B of the second mounting section 40B starts mounting the electronic component t. This operation is similar to the above-mentioned process explained in the example of the first mounting section 40A. The second mounting unit 40B repeatedly performs mounting of the electronic component t on the mounting position ap of the second area MA2 until the mounting is completed.

The first mounting section 40A and the second mounting section 40B divide the area on the substrate W into two equal parts left and right (in the X direction), and share the respective areas to mount the electronic component t. Therefore, the first mounting head 43A of the first mounting section 40A and the second mounting head 43B of the second mounting section 40B can perform the above-mentioned steps not only alternately but also in parallel. . When the mounting of one row (all horizontal widths of MA1 and MA2) on the mounting line BL is completed, the stage 21 is moved to change the row, and the row of the mounting position ap where the next mounting is to be performed is positioned on the mounting line BL, and the mounting is carried out. repeat. The above-described mounting operation is repeated until mounting of the electronic component t is completed for all mounting positions ap on the substrate W (NO in step S105).

(5) Replacing the board (unloading, loading) (steps S105, S106)
When the mounting of the electronic component t is completed for all the mounting positions ap on the board W (YES in step S105), the transfer section 30 and the mounting section 40 are temporarily stopped, and the mounting of the electronic component t is completed on the board W. is carried out from the stage 21, and a new substrate W is carried onto the stage 21 (step S106). The substrate W is unloaded from the stage 21 by a transport robot that is the same as or different from the above-mentioned transport robot (not shown).

(6) Wafer ring replacement (steps S107, S108)
By repeatedly mounting the electronic components t onto the substrate W as described above, if the electronic components t on the wafer ring 11 are no longer present (YES in step S107), the wafer ring 11 is replaced with a new wafer ring 11. (Step S108).

[Effect]
(1) The electronic component t mounting apparatus 1 of the present embodiment includes a stage 21 that supports a substrate W on which the electronic component t is mounted, a stage 21 that supports a substrate W on which the electronic component t is mounted, and a mounting area MA that includes a plurality of electronic component t mounting positions ap. A first mounting section 40A includes a first mounting head 43A for mounting an electronic component t at a mounting position ap, and a first mounting head moving mechanism for moving the first mounting head 43A, and a first mounting section 40A for mounting an electronic component t at a mounting position ap. A second mounting section 40B having a second mounting head 43B for mounting on the surface of the mounting head and a second mounting head moving mechanism for moving the second mounting head 43B, and a second mounting section 40B provided to be movable together with the first mounting head 43A. a first recognition unit that recognizes the position of the substrate W supported on the stage 21; and a second recognition unit that is movable together with the second mounting head 43B and recognizes the position of the substrate W supported on the stage 21. and a recognition unit.

Further, the mounting apparatus 1 includes a stage moving mechanism 22 that moves the stage 21 so that the first recognition section and the second recognition section can recognize a common mark on the stage 21; Recognition that calculates recognition error correction data for correcting a recognition error between the first recognition unit and the second recognition unit based on the position of a common mark recognized by the recognition unit and the second recognition unit It has an error correction data calculation section 54 and a correction section 55 that corrects the positioning position of the electronic component t with respect to the mounting position ap by the first mounting head 43A or the second mounting head 43B based on the recognition error correction data. .

In this way, the positioning position of the electronic component t with respect to the mounting position ap is corrected based on the recognition error correction data obtained by recognizing the common mark by the first recognition unit and the second recognition unit. Therefore, the deviation between the mounting position ap by the first mounting part 40A and the mounting position ap by the second mounting part 40B is eliminated, and the electronic component t can be accurately mounted on the entire board W without any deviation. Further, since it is not necessary to transfer the substrate W to an external measuring device to measure and correct the positional deviation, accurate mounting can be performed efficiently.

As a result, all the electronic components t on the substrate W are accurately arranged at predetermined intervals in the vertical and horizontal directions, so that there is no problem such as misalignment of the mask during exposure in the package manufacturing process. Inconveniences are prevented.

(2) The first mounting head 43A mounts the electronic component t at the mounting position ap of the first area MA1, which is one area that divides the mounting area MA into two, and the second mounting head 43B mounts the electronic component t in the mounting position ap of the first area The electronic component t is mounted at the mounting position ap in the second area MA2, which is the other area obtained by dividing MA into two.

When mounting is performed in the first area MA1 and second area MA2, which are divided into two parts of the common mounting area MA, by separate first mounting head 43A and second mounting head 43B, the deviation of the mounting position ap may occur. Although this is likely to occur, such a shift can be corrected in this embodiment. Therefore, for example, even when mounting on a wide mounting area MA of a large substrate W, the electronic components t can be mounted efficiently and accurately without shifting using the plurality of mounting sections.

(3) The first mounting head 43A is arranged on one side with respect to the stage 21, and the second mounting head 43B is arranged on the other side with respect to the stage 21. The second mounting head 43B is provided with a movable range divided into two, one side and the other side, and the substrate W is placed on the stage 21, with the first area MA1 on one side. and is supported such that the second area MA2 is located on the other side.

In this way, even if the movement range of the first recognition section that moves together with the first mounting head 43A and the second recognition section that moves together with the second mounting head 43B is limited, the movement of the stage 21 , it is possible to expand the recognition range of either the first recognition unit or the second recognition unit to recognize a common mark.

Expanding the movable range of the first mounting head 43A and the second mounting head 43B leads to an increase in the size of the apparatus, but in this embodiment, since the stage 21 side is moved, the increase in size can be suppressed. . In the present embodiment, the stage moving mechanism 22 moves the largest substrate W placed on the stage 21 in an overlapping manner, for example, in the X direction, the stage moving mechanism 22 moves the largest substrate W placed on the stage 21 in a direction that is slightly larger than half the size of the substrate W in the X direction. It has a movement stroke that can be moved within a range of (1/2X+α). Therefore, while suppressing the footprint of the mounting apparatus 1, an overlapping portion is provided, and the recognition error of the two recognition units is corrected by that amount, so that the mounting accuracy can be improved.

(4) It has a movement error correction data calculation unit 53 that calculates movement error correction data that corrects movement errors caused by movement of the stage 21, and the correction unit 55 is configured to calculate movement error correction data based on the recognition error correction data and the movement error correction data. Then, the positioning position of the electronic component t with respect to the mounting position ap is corrected.

Therefore, in order to recognize the common mark, the positioning position of the electronic component t relative to the mounting position ap is corrected, including the error caused by the movement of the stage 21, so that more accurate mounting is possible.

[Other embodiments]
Although the embodiment of the present invention and the modified example of each part have been described, this embodiment and the modified example of each part are presented as an example, and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention, and are also included in the invention described in the claims.

In the embodiment described above, the movement error correction data for correcting the movement error of the stage 21 may be acquired over the entire movable range of the stage 21, or at least each mounting area on the substrate W may be positioned at the mounting position. Sometimes, the information may be acquired within the range in which the stage 21 moves. Further, as the movement error correction data, the actual measured value of the movement error of the stage 21 itself may be used, or the actual measured value may be processed, such as a correction value that cancels the movement position error. In short, any data may be used as long as it is for correcting the movement position error of the stage 21. In addition, the recognition error correction data may be the actual measured values of the recognition errors of the first recognition unit and the second recognition unit, or may be processed values such as correction values that cancel out the recognition errors. Good too.

The correction unit 55 corrects the positioning position of the electronic component t with respect to the mounting position ap based on the movement position error data and the recognition error correction data, which means that the corrected position is corrected by correcting the coordinates of the mounting position ap. It also includes setting it as a positioning position. In addition, instead of correcting the movement error when moving the stage 21 to recognize a common mark, the correction value is corrected by adding a correction value based on the movement error correction data to the difference obtained as recognition error correction data. You may.

In the above embodiment, the common mark used when acquiring recognition error correction data is one dot mark 72 in two rows. However, the present invention is not limited to this, and a plurality of common marks may be used. In this case, the average value of the differences between the plurality of mark sets may be used as the recognition error correction data.

When recognizing the position of the electronic component t as a common mark, the board recognition camera 43f as the first recognition unit and the board recognition camera 43f as the second recognition unit are moved to the first area MA1 on the calibration board 71. The center 71A of the dot mark group in the second area MA2 and the center 71B of the dot mark group in the second area MA2, that is, the mounting positions may be positioned respectively, and the process may be performed in the same manner as the acquisition of recognition error correction data using the dot mark 72 described above. . Note that the mounting position is a preset fixed position on the mounting line BL. More specifically, the mounting positions are set at positions 71A and 71B in FIG. 9 with respect to the substrate W placed in a regular positional relationship on the stage 21 positioned at the origin position, for example. .

When recognizing the position of the dot mark 72 or the electronic component t as a common mark on the mounting line BL, the first recognition unit and the second recognition unit recognize the dot mark, not the center 71A, 71B of the dot mark group. It may be arranged at a position closer to the origin position of the stage 21 than the centers 71A and 71B of the group. By doing this, the distance between the first recognition section and the second recognition section can be made shorter than half the dimension of the substrate W in the X direction, so that the stroke of the stage 21 in the X direction can be reduced. The magnitude of +α in can be made as small as possible.

In the mounting apparatus 1 of the above-described embodiment, an example of face-up mounting in which the electronic component t is mounted on the substrate W with the electrode forming surface facing upward has been mainly described, but the present invention is not limited to this. It is also applicable to face-down mounting in which the electronic component t is mounted on W with the electrode forming surface facing downward.

When performing face-down mounting with the mounting apparatus 1, the electronic component t taken out by the suction nozzles 37a and 37b of the transfer section 30 is not placed on the intermediate stage 31, but is transferred to the suction nozzle 37a by the reversing mechanism 37e and 37f. , 37b upside down. In this state, the suction nozzles 37a, 37b are moved onto the intermediate stage 31, and the electronic component t is transferred from the suction nozzles 37a, 37b to the mounting tools 43a, 43b of the mounting section 40.

Further, in the embodiment described above, the electronic component t is held on the wafer sheet S with the electrode surface facing up, but even if the electronic component t is held on the wafer sheet S with the electrode surface facing down. good. In this case, the handing operations of face-up and face-down implementations are switched. That is, when performing face-down mounting with the mounting apparatus 1, the electronic component t taken out by the suction nozzles 37a and 37b of the transfer section 30 is placed on the intermediate stage 31, and when performing face-up mounting, the electronic component t is placed on the intermediate stage 31. In this case, the electronic component t is not placed on the intermediate stage 31, but the suction nozzles 37a and 37b are inverted vertically by the inverting mechanisms 37e and 37f. In this state, the suction nozzles 37a, 37b are moved onto the intermediate stage 31, and the electronic component t is transferred from the suction nozzles 37a, 37b to the mounting tools 43a, 43b of the mounting section 40.

In the embodiment described above, an example was explained in which the mounting head 43 was provided with two mounting tools 43a and 43b, but the number of mounting tools is not limited to this, and may be one, three or more. It may be. In accordance with this, the number of the placing parts 31a to 31d of the intermediate stage 31, the number of suction nozzles 37a and 37b of the transfer head 37, the number of Z direction moving devices 37c and 37d, and the number of reversing mechanisms 37e and 37f are also set. . However, as the number of mounting tools increases, the proximity distance becomes wider accordingly, so it is preferable to set it according to the size of the board W on which the electronic component t is mounted. When considering the intermediate stage 31 and the transfer head 37, it is preferable to set the size in consideration of the size of the electronic component t.

Furthermore, in the embodiment described above, it has been explained that the substrate W is removed during the manufacturing process of package components and that no position detection mark (local mark) is provided for each mounting position ap. It is not limited to. According to the mounting apparatus and the mounting method of the embodiment, for example, even for a board that has a mark for position detection in each mounting area and is used as a part of a package component, it is possible to do so without relying on local marks. It is possible to mount the electronic component t accurately and efficiently.

In the embodiment described above, the stage 21 is fixed, and the mounting head 43 moves on the mounting line BL to perform mounting in each of the two areas MA1 and second area MA2. Then, when mounting in the second area MA2, the recognition error is reflected by correction of the mounting head 43. More specifically, with the center position of the substrate W in the X direction positioned at the center position of the stage 21 in the X direction, the mounting head 43 was moved along the mounting line BL to mount the electronic component t. It is not limited to that.

For example, the stage 21 may be moved when the electronic component t is mounted on the first area MA1 and when the electronic component t is mounted on the second area MA2. In this case, the stage 21, the first mounting head 43A, and the second mounting head 43B cooperate to perform mounting. When mounting the electronic component t in the second area MA2, the stage 21 is moved to position the substrate W at a position where movement errors and recognition errors are corrected. Note that in the above embodiment, since the electronic component t is taken out at one position, the electronic component t is mounted alternately in the first area M1 and the second area M2. That is, the operations are as follows: mounting to the first area MA1, moving the stage, mounting to the second area MA2, moving the stage, and mounting to the first area MA1. Thereby, the same effects as the above embodiment can be achieved.

Furthermore, the stage 21 is controlled to move so that the mounting positions of the first mounting head 43A and the second mounting head 43B are fixed, and the respective mounting tools 43a and 43b are sequentially positioned at the mounting positions. You may. This movement control is performed so that the movement is corrected based on the movement error correction data and recognition error correction data stored in the storage unit 56. In this case, since the mounting position of the mounting head 43 is fixed during mounting, the movement error of the first mounting head 43A and the second mounting head 43B is limited to the movement error from the delivery of the electronic component t to the mounting line. Become. The movement error from the delivery to the mounting line becomes a fixed route, and the movement error of the mounting tool can be ignored because the distance is small, so the mounting accuracy can be improved.

In addition, in the procedure for mounting the electronic component t explained along with FIG. Although the case of replacement has been described, there is a possibility that the electronic component t on the wafer will be used up first before the electronic component t is completely mounted on the entire mounting area MA of the substrate W. In that case, when the electronic components t on the wafer run out, the wafer ring 11 is replaced, and then mounting of the electronic components t is continued. In other words, the flow of exchanging the substrate (steps S105, S106) and exchanging the wafer ring (steps S107, S108) may be reversed.

1 Mounting device 1a Base section 10 Component supply section 11 Wafer ring 12 Ring holder 20 Stage section 21 Stage 22 Stage movement mechanism 30 Transfer sections 30A, 30B Transfer device 31 Intermediate stages 31a to 31d Placement section 32 Wafer ring holding device 32a Support arm 32b Chuck part 33 Y direction moving device 34 Y direction moving block 35 Support body 36 X direction moving body 37 Transfer heads 37a, 37b Suction nozzles 37c, 37d Z direction moving devices 37e, 37f Reversing mechanism 38 Wafer recognition camera 40 Mounting Section 40A First mounting section 40B Second mounting section 41 Support frame 41a Y-direction moving device 42 Head support 42a X-direction moving device 43 Mounting head 43A First mounting head 43B Second mounting head 43a, 43b Mounting tool 43c, 43d Z direction moving device 43f Board recognition camera 44 Imaging units 44a to 44d Chip recognition cameras 44e, 44f XY moving device 44g Camera support frame 50 Control device 51 Mechanism control section 52 Image processing section 53 Movement error correction data calculation section 54 Recognition Error correction data calculation section 55 Correction section 56 Storage section 57 Input/output control section 61 Input device 62 Output device 71 Calibration board 72 Dot mark

Claims (4)

a stage that supports a board on which the electronic component is mounted in a mounting area that includes a plurality of electronic component mounting positions;
a first mounting section having a first mounting head for mounting the electronic component at the mounting position; and a first mounting head moving mechanism for moving the first mounting head;
a second mounting section having a second mounting head for mounting the electronic component at the mounting position; and a second mounting head moving mechanism for moving the second mounting head;
a first recognition unit that is movable together with the first mounting head and recognizes the position of the substrate supported by the stage;
a second recognition unit that is provided movably together with the second mounting head and recognizes the position of the substrate supported by the stage;
a stage moving mechanism that moves the stage so that the first recognition unit and the second recognition unit can recognize a common mark on the stage;
recognition for correcting a recognition error between the first recognition unit and the second recognition unit based on the position of a common mark recognized by the first recognition unit and the second recognition unit; a recognition error correction data calculation unit that calculates error correction data;
a correction unit that corrects the positioning position of the electronic component with respect to the mounting position by the first mounting head or the second mounting head based on the recognition error correction data;
An electronic component mounting device comprising: The first mounting head mounts the electronic component at a mounting position in a first area that is one area obtained by dividing the mounting area into two,
The second mounting head mounts the electronic component at a mounting position in a second area that is the other area obtained by dividing the mounting area into two.
The electronic component mounting apparatus according to claim 1, characterized in that: The first mounting head is arranged on one side with respect to the stage,
The second mounting head is arranged on the other side with respect to the stage,
The first mounting head and the second mounting head are provided with a movable range divided into two by the one side and the other side,
3. The substrate is supported by the stage such that the first region is located on the one side and the second region is located on the other side. Electronic component mounting equipment. a movement error correction data calculation unit that calculates movement error correction data for correcting movement errors caused by movement of the stage;
4. The correction unit corrects the positioning position of the electronic component relative to the mounting position based on the recognition error correction data and the movement error correction data. Mounting equipment for the electronic components described.

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