JP2021040127A - Mounting device of electronic components - Google Patents

Abstract

To provide a mounting device of electronic components which enables efficient mounting of electronic components over the entire mounting area without misalignment.SOLUTION: A mounting device includes: a stage movement mechanism that moves a stage 21 such that a board recognition camera 43f (first recognition unit and second recognition unit) that recognizes a position of a board W supported on the stage 21 can recognize a common mark (dot mark 72); a recognition error correction data calculation unit that calculates recognition error correction data for correcting a recognition error between the first recognition unit and the second recognition unit on the basis of a position of the common mark recognized by the first recognition unit and the second recognition unit; and a correction unit that corrects a positioning position of an electronic component t with respect to a mounting position by a first mounting head or a second mounting head on the basis of the recognition error correction data.SELECTED DRAWING: Figure 6

Description

The present invention relates to an electronic component mounting device.

Conventionally, a manufacturing process called a wafer level package (WLP) has been known. WLP is a technique for forming a rewiring layer for providing an I / O terminal in a wafer state without using an interposer substrate (relay substrate). Since the WLP does not require an interposer substrate, the semiconductor package can be made thinner and the manufacturing cost can be reduced.

In WLP, a fan-in-wafer level package (fan in-WLP: FI-WLP) and a fan-out wafer level package (fan out-WLP: FO-WLP) are known. The FI-WLP forms a rewiring layer on the semiconductor chip so as not to protrude from the region on the surface on which the electrode pad of the semiconductor chip is formed. The FO-WLP extends beyond the region of the semiconductor chip to form a rewiring layer.

FO-WLP can also be applied to a multi-chip package (Multi Chip Package: MCP) in which semiconductor chips such as RAM, flash memory, and CPU, and multiple types of electronic components such as diodes and capacitors are mounted in one package. Therefore, it is attracting attention.

In the FO-WLP manufacturing process, first, a plurality of semiconductor chips are mounted in a matrix on a substrate at intervals, and then the gaps between the semiconductor chips are sealed with a resin to integrate the plurality of semiconductor chips. To become. As a result, a pseudo wafer formed as if it were a wafer formed in a semiconductor manufacturing process is formed. A rewiring layer for providing an I / O terminal is formed on the pseudo wafer. After the plurality of semiconductor chips are resin-sealed and integrated, the substrate is peeled off and removed.

Japanese Unexamined Patent Publication No. 2019-29563

In the above-mentioned WLP, the deviation of the mounting position of each electronic component mounted in the same package mutually affects the electrical characteristics of the package. Therefore, high position accuracy is required for mounting each electronic component. Here, in the semiconductor package manufacturing process performed using the interposer substrate, alignment marks for position recognition are provided at each mounting position on the interposer substrate. Therefore, by recognizing the alignment mark for each mounting position (hereinafter referred to as the local mark), positioning the electronic component at the mounting position, and applying the mounting method, mounting with high position accuracy is realized. .. In this way, when the electronic components are mounted at the mounting positions on the board, the method of detecting the position of the mounting area of the electronic components each time the electronic components are mounted is called a local recognition method.

However, in WLP, the substrate on which the electronic components are mounted is simply a plate made of silicon, metal, glass, or the like. Therefore, there is no portion that can be used as a local mark such as a circuit pattern at the mounting position of the electronic component on the board. Further, as described above, the substrate may be peeled off from the pseudo wafer and removed. For this reason, if equipment and processes for forming a local mark are provided for each mounting position of the substrate, equipment costs, equipment installation space, number of processes, and the like will increase. Further, when the operation of recognizing the local mark is performed every time the electronic component is mounted, the time required for mounting one electronic component also increases.

In order to deal with this, WLP recognizes the overall position of the substrate by recognizing the outer position of the substrate and the alignment mark (hereinafter referred to as the global mark) indicating the position of the entire substrate, and recognizes the overall position of this substrate. A method of mounting electronic components in the mounting area on the board is applied. In this way, when mounting electronic components at a plurality of mounting positions on a board, a method of mounting the electronic components at a plurality of mounting positions on the board by detecting the position of the board once is used. , Called the global recognition method.

Further, in recent years, the size of the substrate used for WLP has increased. When mounting on such a board, in order to improve production efficiency, it is possible to provide a pair of mounting parts, each mounting part is in charge of a partial area divided into two parts on one board, and electronic components are mounted in parallel. It is done. In this case, the mounting position by each mounting portion is corrected for each partial region, so that accurate positioning becomes possible.

However, the mounting positions of the pair of mounting portions may deviate from each other. Such deviation is not preferable in consideration of the fact that the electronic components mounted on one substrate are collectively processed in a later process. For example, the rewiring step is performed by coating a photosensitive material, exposing the photosensitive material, developing, etching, ion implantation, resist peeling, and the like. Therefore, if the mounting position of the electronic component is deviated, the position of the mask during exposure may be deviated. That is, all the electronic components on the substrate need to be accurately arranged at predetermined intervals in each of the vertical and horizontal directions.

In order to correct such a deviation, after mounting electronic components in each partial region of the board by a pair of mounting parts, the board is taken out and transferred to an external measuring instrument, and mounted by a pair of mounting parts in the external measuring instrument. The misalignment of the electronic component was measured, and correction was performed based on this misalignment. However, preparing an external measuring instrument is costly, and it takes time and effort to move the substrate to the external measuring instrument, so that the production efficiency is not good.

The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component mounting device capable of efficiently mounting electronic components in the entire mounting area without shifting them. ..

In order to achieve the above object, the electronic component mounting device of the present invention has a stage for supporting a substrate on which the electronic component is mounted in a mounting area including a plurality of mounting positions of the electronic component, and the electronic component. A first mounting portion having a first mounting head to be mounted at a mounting position, a first mounting head moving mechanism for moving the first mounting head, and a first mounting portion for mounting the electronic component at the mounting position. A second mounting portion having 2 mounting heads, a second mounting head moving mechanism for moving the second mounting head, and a second mounting portion movably provided together with the first mounting head, and supported on the stage. A first recognition unit that recognizes the position of the board, a second recognition unit that is movably provided together with the second mounting head and recognizes the position of the board supported by the stage, and the above. A stage moving mechanism that moves the stage so that the first recognition unit and the second recognition unit can recognize a common mark on the stage, and the first recognition unit and the second recognition unit. Recognition error correction data calculation for calculating recognition error correction data for correcting a recognition error between the first recognition unit and the second recognition unit based on the position of a common mark recognized by the recognition unit. It has a unit and a correction unit that corrects the positioning position of the electronic component with respect to the mounting position by the first mounting head or the second mounting head based on the recognition error correction data.

According to the present invention, it is possible to provide a mounting device for electronic components that can be efficiently mounted without shifting the electronic components over the entire mounting area.

It is a top view which shows the substrate on which an electronic component is mounted according to an embodiment. It is a top view which shows the mounting apparatus of embodiment. It is a front view which shows the mounting apparatus of embodiment. It is a right side view which shows the mounting apparatus of embodiment. It is explanatory drawing which shows the calibration substrate mounted on the stage, and the substrate recognition camera which image | image | image | It is explanatory drawing which shows the state which the movement error correction data of a stage is acquired by the 2nd recognition part in duplicate. It is a block diagram which shows the structure of the control device of embodiment. It is explanatory drawing which shows the deviation of the electronic component mounted on the board. It is a top view which shows the calibration board used for calibration. It is a flowchart which shows the mounting process of the electronic component by the mounting apparatus of embodiment.

Hereinafter, the electronic component mounting device of the embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing a substrate W on which an electronic component t is mounted. FIG. 2 is a plan view showing the appearance of the mounting device 1, FIG. 3 is a front view of the mounting device 1, and FIG. 4 is a right side view. FIG. 5 is an explanatory view showing a calibration board 71 mounted on a stage and a board recognition camera 43f that captures an image of the calibration board 71. FIG. 6 is an explanatory diagram showing a state in which the movement error correction data of the stage is acquired in duplicate by the second recognition unit. FIG. 7 is a block diagram showing a control device 50 of the mounting device 1. FIG. 8 is an explanatory diagram showing the deviation of the electronic component t mounted on the substrate W.

[Electronic components]
As shown in FIG. 1, the target mounted on the substrate W by the mounting device 1 of the present embodiment is the electronic component t. An example of the electronic component t is a semiconductor chip. However, the electronic component t is not limited to one type of semiconductor chip, and may be a plurality of types of semiconductor chips, a semiconductor chip, a diode, a capacitor, or the like. The mounting device 1 of the present embodiment is a device capable of manufacturing an MCP by mounting a plurality of types of electronic components t including a semiconductor chip, a diode, a capacitor, and the like on a substrate W. Examples of the configuration of the MCP include those provided with a plurality of types of semiconductor chips, those provided with one type of semiconductor chip and a diode, a capacitor, and the like, and those provided with a plurality of types of semiconductor chips and a diode, a capacitor, and the like.

[substrate]
As shown in FIG. 1, the substrate W of the present embodiment is a rectangular substrate used for forming a pseudo panel according to a pseudo wafer, which is applied at the time of manufacturing, for example, FO-PLP (fan out-panel level package). .. As the substrate W, a glass substrate, an organic substrate (glass / epoxy (FR-4) substrate or the like), a silicon substrate, a metal substrate such as stainless steel, or the like can be used, but the substrate W is not limited thereto. The pseudo panel is similar to the pseudo wafer applied at the time of manufacturing the FO-WLP, in which electronic components such as a plurality of individualized semiconductor chips are arranged in a plane, and the arranged electronic components are sealed with a resin. It is in a state of being molded into a single plate. As the substrate W, a substrate used when manufacturing MCP by the above-mentioned FO-PLP process, that is, a substrate on which electronic components t such as a plurality of semiconductor chips and capacitors are mounted in each mounting region is preferable. Of course, the substrate W may be a substrate used for forming a pseudo wafer applied at the time of manufacturing the FO-WLP.

One surface of the substrate W of this embodiment is a mounting surface ws on which a plurality of electronic components t are mounted. A mounting area MA is set on this mounting surface ws. The mounting area MA includes a plurality of mounting positions ap (indicated by dotted circles in FIG. 1) of individual electronic components t. Further, the mounting region MA includes the first region MA1 and the second region MA2 (both are regions shown by the alternate long and short dash line in FIG. 1). Therefore, the first region MA1 and the second region MA2 are each a part of the mounting region MA.

The first region MA1 and the second region MA2 of the present embodiment are adjacent regions by dividing the mounting region MA into two equal parts. The mounting area MA, the first area MA1 and the second area MA2 are rectangular. In the example shown in FIG. 1, the first area MA1 and the second area MA2 are rectangular with short left and right sides and long top and bottom sides, respectively. The area. The individual electronic components t are mounted at mounting positions ap set in a matrix of a plurality of rows and a plurality of columns in the first region MA1 and the second region MA2. In the first region MA1 and the second region MA2 of the present embodiment, the row direction in which the mounting positions ap are arranged is the direction along the short side, and the column direction is the direction along the long side. The first region MA1 and the second region MA2 are adjacent to each other on their long sides.

The mounting area MA, the mounting position ap, the first area MA1, and the second area MA2 are virtually set on the mounting surface ws of the substrate W, and the mounting area MA, the mounting position ap, and the second area MA2. Marks and the like indicating the region MA1 of 1 and the region MA2 of the second region are not formed on the mounting surface ws. The mounting surface ws may be provided with an alignment mark for global recognition indicating the overall position of the substrate W, but is not provided with a mark for local recognition indicating the individual mounting position ap. In the following description, the mark broadly includes a reference target for recognizing a position, such as a dot mark, an alignment mark, a circuit pattern, and an outer shape of an electronic component t.

[Mounting device]
(Overview)
The configuration of the mounting device 1 of the present embodiment will be described with reference to FIGS. 2 to 7. The mounting device 1 is a device for mounting the electronic component t on the substrate W. In the following description, the direction in which the first region MA1 and the second region MA2 are arranged on the mounting surface ws of the electronic component t of the substrate W on the mounting device 1 is defined as the X direction, and is orthogonal to the X direction. The direction is the Y direction. Further, the direction orthogonal to the mounting surface ws is defined as the Z direction. In the present embodiment, the front is the side on which the first region MA1 and the second region MA2 are arranged side by side on the mounting surface ws, the X direction is the left-right direction, the Y direction is the front-rear direction, and the Z direction is the front. Vertical direction.

As shown in FIG. 2, the mounting device 1 includes a component supply unit 10, a stage unit 20, a transfer unit 30, a mounting unit 40, and a control device 50. The component supply unit 10 is a device that supplies the electronic component t. The stage unit 20 is a device including a stage 21 on which the substrate W is placed. The transfer unit 30 is a device for taking out the electronic component t from the component supply unit 10. The mounting unit 40 is a device that receives the electronic component t taken out by the transfer unit 30 and mounts it on the substrate W mounted on the stage 21. The component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40 are provided on the base unit 1a, which is a base installed on the installation surface. The control device 50 is a device that controls the operations of the component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40. The details of each part will be described below.

(Parts supply department)
The component supply unit 10 is a front portion on the base portion 1a and is arranged at the center in the X direction when viewed from the front. The component supply unit 10 includes a wafer ring 11, a ring holder 12, and a push-up mechanism (not shown). The wafer ring 11 is a member that holds the wafer sheet S that holds the electronic component t. The electronic component t is a semiconductor chip in which the semiconductor wafer T is fragmented.

A wafer ring 11 is detachably provided on the ring holder 12. Further, the ring holder 12 is provided so that the wafer ring 11 can be moved in the XY direction by an XY moving mechanism (not shown). The push-up mechanism is a mechanism for pushing up the electronic component t from the lower side of the wafer sheet S held by the wafer ring 11 when the electronic component t is taken out by the transfer unit 30. The push-up mechanism is fixedly provided at the take-out position of the electronic component t by the transfer portion 30.

Although not shown, the parts supply unit 10 includes a replacement device. The switching device supplies a new wafer ring 11 in which the electronic component t is held to the ring holder 12 from the storage unit in which the wafer ring 11 is stored, and the wafer ring 11 in which the removal of the electronic component t is completed is supplied to the storage unit. Store.

(Stage part)
The stage portion 20 is arranged at the center of the base portion 10a in the X direction behind the component supply portion 10 on the base portion 1a when viewed from the front. The stage unit 20 has a stage 21 and a stage moving mechanism 22. The stage 21 is a table that supports the substrate W. On the stage 21 of the present embodiment, a surface opposite to the mounting surface ws of the substrate W is placed. The stage moving mechanism 22 is a mechanism for moving the stage 21 in the XY directions. Although not shown, the stage moving mechanism 22 has a θ moving mechanism in the horizontal rotation direction. Further, the stage moving mechanism 22 has a linear encoder. As a scale of the linear encoder, it is preferable to use a glass scale having a small coefficient of thermal expansion as a measure against heat.

The mounting heads 43 (first mounting head 43A, second mounting head 43B) described later are on a straight line along the X direction within the moving range of the coordinate system for the stage 21 to move in the Y direction. , A mounting line BL positioned to mount the electronic component t is set (see FIG. 1). This mounting line BL can be centered in the Y direction of the stage 21. The stage moving mechanism 22 is controlled to move the stage 21 so that each line of the mounting position ap of the substrate W mounted on the stage 21 is sequentially positioned on the mounting line BL.

The stage moving mechanism 22 can move the largest substrate W mounted on the stage 21 in a range slightly larger (1 / 2X + α) than half of the dimension of the substrate W in the X direction in the X direction. Has a moving stroke. Further, the stage moving mechanism 22 has a moving stroke that can be moved in a range slightly larger (Y + α) than the dimension of the substrate W in the Y direction in the Y direction. The stage 21 is configured to be able to suck and hold the mounted substrate W by a suction and suction mechanism (not shown). By + α in the movement range in the X direction, the stage 21 can move so that the central portion of the stage 21 in the X direction overlaps. In this overlapping movement, one half of the stage 21 (left half when viewed from the front) and the other half (right half when viewed from the front) may overlap each other, or a stroke in which only one of them can overlap. The center of the stroke may be offset to have. The magnitude (amount of overlap) of + α in the moving range of the stage 21 in the X direction will be described later.

(Transfer section)
The transfer unit 30 includes transfer devices 30A and 30B, an intermediate stage 31, and a wafer ring holding device 32. The transfer devices 30A and 30B are arranged side by side in the X direction on the front portion on the base portion 1a with the component supply portion 10 interposed therebetween. The transfer devices 30A and 30B have the same configuration except that the left and right sides are reversed. Hereinafter, the configuration of the transfer device 30A on the left side will be described, and the description of the configuration of the transfer device 30B on the right side will be omitted.

As shown in FIGS. 2 to 4, the transfer device 30A includes a Y-direction moving device 33, a transfer head 37, and a wafer recognition camera 38. The Y-direction moving device 33 is a device that movably supports the Y-direction moving block 34 in the Y direction. The Y-direction moving device 33 extends from the front end portion of the base portion 1a to the vicinity of the center along the Y direction on the left side of the front portion of the base portion 1a. A support 35 is provided on the back surface of the Y-direction moving block 34 on the upper end side. The support 35 has a rectangular plate shape, and extends from the Y-direction moving block 34 in the right direction along the X direction. An X-direction moving body 36 is provided on the back surface side of the support 35. The X-direction moving body 36 is movably supported along the X-direction by an X-direction moving device (not shown).

The transfer head 37 is supported by an end portion of the X-direction moving body 36 on the component supply portion 10 side. The transfer head 37 has suction nozzles (transfer nozzles) 37a and 37b, Z-direction moving devices 37c and 37d, and reversing mechanisms 37e and 37f. The suction nozzles (transfer nozzles) 37a and 37b are connected to a pneumatic circuit (not shown) and are provided so as to be able to hold the electronic component t by negative pressure. The two suction nozzles (transfer nozzles) 37a and 37b are arranged in the X direction.

The Z-direction moving devices 37c and 37d are devices that individually move the suction nozzles 37a and 37b in the Z-direction. The reversing mechanism 37e and 37f are devices for individually reversing the suction nozzles 37a and 37b up and down. As a result, the suction nozzles 37a and 37b can selectively switch the postures of the suction nozzles 37a and 37b between a state in which the suction surface for sucking and holding the electronic component t faces downward and a state in which the suction surface faces upward. The suction nozzle 37a is assembled to the reversing mechanism 37e, and the reversing mechanism 37e is assembled to the Z-direction moving device 37c. Further, the suction nozzle 37b is assembled to the reversing mechanism 37f, and the reversing mechanism 37f is assembled to the Z direction moving device 37d. That is, the transfer head 37 has two suction nozzles that can be turned upside down.

The wafer recognition camera 38 is a device that faces the wafer sheet S held by the wafer ring 11 of the component supply unit 10 and recognizes the position of the electronic component t on the wafer sheet S. The wafer recognition camera 38 is provided at the end of the X-direction moving body 36 on the component supply portion 10 side, on a surface opposite to the surface on which the transfer head 37 is supported. The transfer head 37 of the transfer device 30A on the left side when the mounting device 1 is viewed from the front is the first transfer head, and the transfer head 37 of the transfer device 30B on the right side is the second transfer head. is there.

The intermediate stage 31 is a device for temporarily mounting the electronic components t taken out by the suction nozzles 37a and 37b of the left and right transfer heads 37. The intermediate stage 31 is provided between the component supply unit 10 and the stage unit 20 on the base unit 1a. The intermediate stage 31 includes mounting portions 31a to 31d. The mounting portions 31a to 31d correspond to the two suction nozzles 37a and 37b of the transfer head 37 in the transfer device 30A and the two suction nozzles 37a and 37b of the transfer head 37 in the transfer device 30B, respectively.

The wafer ring holding device 32 is a device that supplies and stores the wafer ring 11 in the ring holder 12 of the component supply unit 10. As shown in FIG. 2, the wafer ring holding device 32 is a surface of the end portion of the support 35 of the transfer device 30A on the component supply portion 10 side, which is opposite to the surface on which the X-direction moving body 36 is provided. That is, it is provided on the front surface. The wafer ring holding device 32 has a support arm 32a and a chuck portion 32b. The support arm 32a is provided so as to be able to move forward and backward in the X direction by an X-direction moving device (not shown) such as an air cylinder. The chuck portion 32b is a member that grips the wafer ring 11, and is provided at the tip of the support arm 32a in the right direction in the drawing. Further, the wafer ring holding device 32 can be moved in the Y direction by the Y direction moving device 33 provided with the support 35. Such a wafer ring holding device 32 functions as a part of the above-mentioned switching device. That is, the wafer ring 11 is gripped by the chuck portion 32b, and the wafer ring 11 is supplied and stored in the storage portion and the ring holder 12 (not shown) by the support arm 32a and the Y-direction moving device 33.

Such a transfer unit 30 sequentially takes out the electronic component t from the component supply unit 10 and transfers it toward the mounting unit 40. When the electronic component t is face-up mounted, that is, when the electronic component t is mounted on the substrate W with the electrode surface of the electronic component t facing up, the transfer unit 30 mounts the electronic component t taken out from the component supply unit 10 via the intermediate stage 31. It is handed over to the mounting unit 40. Further, when the electronic component t is face-down mounted, that is, when the electronic component t is mounted on the substrate with the electrode surface of the electronic component t facing down, the transfer unit 30 mounts the electronic component t taken out from the component supply unit 10 on the suction nozzles 37a and 37b. The electronic component t is turned upside down and delivered to the mounting unit 40 in a state of being turned upside down.

(Mounting part)
The mounting unit 40 has a first mounting unit 40A and a second mounting unit 40B. The first mounting portion 40A and the second mounting portion 40B have the same configuration except that the left and right sides are reversed. The first mounting portion 40A and the second mounting portion 40B are arranged side by side in the X direction behind the base portion 1a so as to sandwich the stage portion 20. Hereinafter, only the configuration of the first mounting unit 40A on the left side will be described, and the description of the configuration of the second mounting unit 40B on the right side will be omitted.

The first mounting portion 40A includes a support frame 41, a head support 42, a mounting head 43, and an imaging unit 44. The support frame 41 has a gate shape in a side view, and is provided on the left side of the stage portion 20 on the base portion 1a along the Y direction (see FIG. 4). The head support 42 is provided on the right side surface of the support frame 41 so as to be movable in the Y direction via the Y direction moving device 41a. The head support 42 extends along the X direction to the vicinity of the center of the base portion 1a.

The mounting head 43 is a device for mounting electronic components at the mounting position ap. Hereinafter, the mounting head 43 of the first mounting portion 40A is referred to as the first mounting head 43A, and the mounting head 43 of the second mounting portion 40B is referred to as the second mounting head 43B. Let it be 43. The mounting head 43 is provided on the front surface of the head support 42 so as to be movable in the X direction via the X direction moving device 42a. The mounting head 43 includes mounting tools 43a and 43b, Z-direction moving devices 43c and 43d, and an imaging unit 44. The mounting tools 43a and 43b are a pair of tools that hold the electronic component t and mount it on the substrate W. The mounting tools 43a and 43b are suction nozzles, which are connected to a pneumatic circuit (not shown) and are provided so as to be able to hold the electronic component t by negative pressure. The mounting tools 43a and 43b are provided at the same arrangement intervals as the suction nozzles 37a and 37b of the transfer head 37.

The mounting tools 43a and 43b are provided with a window (not shown) at an end opposite to the portion that attracts and holds the electronic component t. The window is made up of transparent members. It should be noted that this member may be any member as long as it can transmit light, and is not limited to being transparent. As a result, the electronic component t attracted and held by the mounting tools 43a and 43b can be observed through the window. The mounting tools 43a and 43b include a rotating device (not shown), and can rotate the suction-held electronic component t in the XY plane.

Further, among the mounting tools 43a and 43b, the board recognition camera 43f as a recognition unit is attached to the mounting tool 43b located on the center side of the base portion 1a, that is, inside. The board recognition camera 43f is provided so as to be movable together with the mounting head 43, and recognizes the position of the board W. More specifically, the substrate recognition camera 43f captures an alignment mark (global mark) of the substrate W mounted on the stage 21. In addition to the function of capturing an image, the substrate recognition camera 43f has a function of processing the captured image to recognize the position of a recognition object such as an alignment mark. Therefore, the substrate recognition camera 43f functions as a recognition unit for recognizing the position of the substrate W. Further, the substrate recognition camera 43f captures the dot mark 72 of the calibration substrate 71, which will be described later. Further, the substrate recognition camera 43f can recognize the mounting position ap on which the electronic component t is mounted based on the recognized position of the substrate W. Hereinafter, the board recognition camera 43f of the first mounting unit 40A will be referred to as the first recognition unit, and the board recognition camera 43f of the second mounting unit 40B will be referred to as the second recognition unit. When the two are not distinguished, it is simply a recognition unit.

The Z-direction moving devices 43c and 43d are devices that individually move the two mounting tools 43a and 43b in the Z-direction. The mounting head moving mechanism is composed of the Y-direction moving device 41a, the X-direction moving device 42a, and the Z-direction moving devices 43c and 43d. The mechanism for moving the first mounting head 43A of the first mounting portion 40A is the first mounting head moving mechanism, and the mechanism for moving the second mounting head 43B of the second mounting portion 40B is the second mounting head. If it is a moving mechanism and the two are not distinguished, it is simply a mounting head moving mechanism.

The image pickup unit 44 is a unit for taking an image of the electronic component t held by the mounting tools 43a and 43b. The image pickup unit 44 has four chip recognition cameras 44a to 44d corresponding to the four mounting portions 31a to 31d above the four mounting portions 31a to 31d of the intermediate stage 31.

The chip recognition cameras 44a to 44d can image the electronic components t mounted on the mounting portions 31a to 31d, and the electronic components t held by the mounting tools 43a and 43b moved below the chip recognition cameras 44a to 44d. Can be imaged through the windows of the mounting tools 43a and 43b.
Further, the chip recognition cameras 44a to 44d have a function of processing the captured image and recognizing the position of the image pickup target such as the electronic component t.

The chip recognition cameras 44a to 44d are supported by a pair of XY moving devices 44e and 44f so as to be movable in the XY direction in pairs. The two chip recognition cameras (44a and 44b and 44c and 44d) to be paired are provided at the same arrangement intervals as the mounting tools 43a and 43b and the suction nozzles 37a and 37b. The pair of XY moving devices 44e and 44f are supported by the camera support frame 44g. The camera support frame 44g has a portal shape when viewed from the front, and extends in the X direction between the component supply portion 10 on the base portion 1a and the stage portion 20. The camera support frame 44g is provided at the front end of the upper surface of the left and right support frames 41 in the mounting portion 40 so as to span the left and right support frames 41. The chip recognition cameras 44a to 44d are supported under the beam portion of the camera support frame 44g.

Such a mounting unit 40 receives the electronic component t taken out from the component supply unit 10 by the transfer unit 30, and mounts the received electronic component t on the substrate W mounted on the stage 21. In the present embodiment, the mounting tools 43a and 43b of the first mounting head 43A mount the electronic component t in the first region MA1, and the mounting tools 43a and 43b of the second mounting head 43B are the second. The electronic component t is mounted in the region MA2. The mounting of the electronic component t by the first mounting head 43A and the mounting of the electronic component t by the second mounting head 43B are performed in parallel.

As shown in FIG. 2, in a state where the stage 21 is located at the center of the base portion 1a in the X direction and the substrate W is supported at the center of the stage 21, the first mounting head 43A at the time of mounting is mounted on the stage 21. On the other hand, the second mounting head 43B is arranged on one side (left side in the drawing), and the second mounting head 43B is arranged on the other side (right side in the drawing) with respect to the stage 21. The movable range of the first mounting head 43A and the second mounting head 43B is divided into two with the central position of the base portion 1a in the X direction as a boundary. As a result, the first mounting head 43A and its board recognition camera 43f cannot move beyond the central position of the base portion 1a to the moving region of the second mounting head 43B, and the second mounting head 43B and the second mounting head 43B cannot move. The substrate recognition camera 43f cannot move beyond the central position of the base portion 1a to the moving region of the first mounting head 43A. Note that FIG. 5 shows the stage 21 and the substrate recognition camera 43f. FIG. 5 shows how the calibration board 71, which will be described later, is mounted on the stage 21. The stage 21 is positioned at the center of the movement stroke in the X direction. Further, FIG. 5 shows how the first mounting head 43A and the second mounting head 43B are located at the left end of each movement range. Therefore, in FIG. 5, each substrate recognition camera 43f is drawn so as to be located at the left end of each movement range. In this embodiment, the range of movement of the first mounting head 43A and the second mounting head 43B is limited by a physical mechanism. However, the range of movement may be limited by the control of the program.

As described above, the moving range of the first recognition unit and the second recognition unit is limited by the region that divides the base unit 1a into two. Therefore, even if one recognition unit is moved, the mark existing in the area of the other recognition unit cannot be recognized. Therefore, the same mark (common mark) cannot be recognized only by moving the recognition unit. However, in the present embodiment, the stage moving mechanism 22 can move the stage 21 so that the first recognition unit and the second recognition unit can recognize the common mark. That is, as described above, the stage 21 can be moved so that the central portion of the stage 21 in the X direction overlaps. By moving the stage 21, for example, as a common mark, the dot mark 72 in the first region MA1 corresponding to the movement range of the first recognition unit of the calibration substrate 71 is designated as the second recognition unit, which is the second recognition unit. It can be moved to a position where the board recognition camera 43f of the mounting portion 40B of the above can be imaged. That is, the same dot mark 72 (common mark) can be imaged by the board recognition camera 43f of the first mounting unit 40A and the board recognition camera 43f of the second mounting unit 40B. As described above, the stage moving mechanism 22 sets the largest substrate W mounted on the stage 21 in a range slightly larger (1 / 2X + α) than half of the dimension of the substrate W in the X direction in the X direction. It has a moving stroke that can be moved. The size of this + α is such that the dot mark 72 used as a common mark is located in the row of dot marks 72 (rows along the Y direction) in the first region MA1 (see FIG. 1) on the calibration substrate 71. It can be determined according to the number of columns. For example, when there is a dot mark 72 used as a common mark in two columns located near the second area MA2 in the first area MA1, it is based on the length of the area surrounding the two columns in the X direction. + Α can be determined. (See FIG. 6) With the range of + α determined in this way, the stage moving mechanism 22 sets the stage 21 so that the first recognition unit and the second recognition unit can recognize the common mark. Can be moved.

More specifically, as shown by the dotted line in FIG. 6, the row of dot marks 72 (row along the Y direction) near the second region MA2 of the first region MA1 on the calibration substrate 71 is the second row. The stage 21 moves so that the board recognition camera 43f of the mounting portion 40B of the above can take an image. In FIG. 6, both substrate recognition cameras 43f are located at the left end of each moving region as in FIG. However, in FIG. 6, the stage 21 moves to the second region MA2 side, and the substrate recognition camera 43f of the second mounting portion 40B can image the dot mark 72 in the first region MA1 shown by the dotted line. Is shown. For example, as shown in the area surrounded by the dotted line in FIG. 6, among the dot marks 72 in the first area MA1, the dot marks 72 in the two rows close to the second area MA2 can be imaged. The movement of the stage moving mechanism 22 may allow the substrate recognition camera 43f of the first mounting unit 40A to image the dot mark 72 in the second region MA2. In this case, for example, among the dot marks 72 of the second region MA2, it is sufficient to enable imaging in two rows close to the first region MA1. The number of rows is not limited to two, and the number may be more than two, but at least one row may be imaged.

(Control device)
The configuration of the control device 50 will be described with reference to the block diagram of FIG. The control device 50 is a device that controls the operations of the component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40 based on the control information stored in the storage unit 56. The control device 50 can be configured by, for example, a dedicated electronic circuit, a computer operating with a predetermined program, or the like. That is, the control contents of the control of the component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40 are programmed and executed by a processing device such as a PLC or a CPU.

The control device 50 includes a mechanism control unit 51, an image processing unit 52, a movement error correction data calculation unit 53, a recognition error correction data calculation unit 54, a correction unit 55, a storage unit 56, and an input / output control unit 57. The mechanism control unit 51 controls the operations of the component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40. The image processing unit 52 converts the image data from the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition cameras 44a to 44d into a format suitable for display.

The movement error correction data calculation unit 53 calculates the movement error correction data for correcting the movement error caused by the movement of the stage 21. The movement error is an error caused by the accuracy of the guide rail that guides the movement of the stage 21, the accuracy of assembling to the metal frame, and the like.

The recognition error correction data calculation unit 54 determines the recognition error between the first recognition unit and the second recognition unit based on the positions of the common marks recognized by the first recognition unit and the second recognition unit. Calculate the recognition error correction data for correction. Such a recognition error occurs because there is a discrepancy between the coordinate system of the first recognition unit of the first mounting unit 40A and the coordinate system of the recognition unit of the second mounting unit 40B.

If there is such a deviation, for example, the position of the electronic component t mounted in the first region MA1 shown in FIG. 8 (A) and the electron mounted in the second region MA2 shown in FIG. 8 (B). As shown in FIG. 8C, a deviation d occurs at the position of the component t. In FIG. 8C, only the deviation d in the Y direction is shown, but the deviation in the X direction also occurs. The data for correcting such a recognition error is the recognition error correction data.

Further, as described above, the stage 21 moves in order for the first recognition unit or the second recognition unit to recognize the common mark. In this case as well, a movement error of the stage 21 may occur. The movement error correction data calculation unit 53 of the present embodiment corrects the movement error in the overlapping movement across the first region MA1 and the second region MA2 of the stage 21 for recognizing a common mark. Data is also calculated.

The movement error correction data can be calculated using the calibration substrate 71 having the dot mark 72 and the substrate W on which the electronic component t is mounted (whether it is for a product or for a test). Specifically, the calibration board 71 is set on the stage 21. With the left and right board recognition cameras 43f stopped at predetermined positions, the stage 21 (calibration board 71) is pitch-moved in the arrangement of the dot marks 72 within the range in which movement error correction data is desired to be acquired. Then, within the range, the positional deviation between the position of each dot mark 72 recognized by the imaging of the substrate recognition camera 43f and the reference position (for example, the center of the imaging field of view) is obtained, and based on these, the movement error correction data is obtained. Is calculated. The same applies to the case where the electronic component t already mounted on the substrate W is used instead of the dot mark 72 of the calibration substrate 71.

Further, the movement error correction data may include not only the movement error of the stage 21 but also the movement error of the substrate recognition camera 43f, the mounting heads 43A, and 43B. That is, when the movement error correction data calculation unit 53 calculates the movement error correction data, it acquires the movement error correction data not only for the stage 21 but also for the mounting heads 43A and 43B, and obtains the movement error during movement. It may be corrected. The movement error correction data of the mounting heads 43A and 43B can be acquired by using the calibration board 71 having the dot mark 72 and the board W on which the electronic component t is mounted, similarly to the movement error correction data of the stage 21. .. Since the board recognition camera 43f is mounted on the mounting head 43, the movement error correction data of the board recognition camera 43f can be regarded as the same as the movement error correction data of the mounting head 43.

Specifically, as described above, the calibration board 71 is set on the stage 21. The stage 21 is fixed (stopped) at the origin position, and the mounting heads 43A and 43B (board recognition camera 43f) are pitch-moved in the arrangement of the dot marks 72 within the range in which the movement error correction data is desired to be acquired. Then, within the range, the positional deviation between the position of each dot mark 72 recognized by the imaging of the substrate recognition camera 43f and the reference position (for example, the center of the imaging field of view) is obtained, and the movement error correction is performed based on these. Calculate the data. This enables even more accurate mounting. The same can be applied when the electronic component t already mounted on the substrate W is used instead of the dot mark 72 of the calibration substrate 71.

The correction unit 55 corrects the positioning position of the electronic component t with respect to the mounting position ap by the mounting head 43 based on the moving position error data and the recognition error correction data. That is, the correction unit 55 is the first mounting unit for positioning the electronic component t at the mounting position ap by the first mounting unit 40A and the second mounting unit 40B based on the moving position error data and the recognition error correction data. The amount of movement on the coordinates of the head 43A and the second mounting head 43B is corrected. This means correcting the target position, which is the target of positioning on the coordinates.

The storage unit 56 stores various types of information necessary for controlling the mounting device 1. The information stored in the storage unit 56 includes the operation program of each unit for mounting the electronic component t on the substrate W, the movement position error data, the recognition error correction data, the coordinates of each mounting position ap, and the mounting area MA. Coordinates, positioning position coordinates, image data from the wafer recognition camera 38, the substrate recognition camera 43f, the chip recognition cameras 44a to 44d, the position coordinates of the recognized mark, and the like are also included.

Further, an input device 61 and an output device 62 are connected to the control device 50. The input device 61 is an input means such as a touch panel, a joystick, a switch, a keyboard, and a mouse for the operator to operate the mounting device 1 via the control device 50.

The output device 62 is an output means such as a display, a lamp, a meter, a speaker, and a buzzer that makes information for confirming the state of the device in a state that can be recognized by the operator. For example, the images captured by the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition cameras 44a to 44d are displayed on the display and can be confirmed by the operator.

[Operation of mounting device]
Next, the operation of the mounting device 1 will be described with reference to FIGS. 9 and 10 in addition to FIGS. 1 to 8 above.

[Overview]
When only the global recognition method is applied when mounting an electronic component such as an electronic component t in each mounting area of the substrate W, the position recognition of each mounting position a by the local mark is not performed. Therefore, the positioning accuracy of the electronic component t with respect to each mounting position a depends on the recognition accuracy of the global mark of the substrate W and the machining accuracy of the stage moving mechanism 22 of the stage 21.

However, it is practically impossible in metal processing to finish a guide rail or the like that guides the movement of the stage 21 with an accuracy of ± several μm or less over a desired range. Moreover, it is even more impossible to assemble a guide rail having a desired length to a metal frame or the like with straightness and swell of ± several μm or less. Therefore, the movement error correction data calculation unit 53 measures the movement position error of the stage 21, calculates the movement error correction data for correcting the movement error of the stage 21, and stores this in the storage unit 56.

Further, in the present embodiment, the first recognition unit and the second recognition unit recognize the coordinates of the common mark, obtain the difference between the coordinates recognized by both, measure the recognition error, and correct the recognition error. The recognition error correction data is calculated, and the storage unit 56 stores the data. Further, in the present embodiment, the stage 21 is moved so that the first recognition unit or the second recognition unit recognizes the common mark. The storage unit 56 also stores the movement error correction data for correcting the movement error in the movement of the stage 21.

[Calibration]
The calculation and storage of the movement error correction data and the calculation and storage of the recognition error correction data as described above are called calibration. First, the operation of calibration performed before mounting the electronic component t will be described. For this calibration, the calibration board 71 is used as shown in FIGS. 5, 6 and 9. In the calibration substrate 71, for example, dot marks 72 for position recognition are provided on a glass substrate in a matrix (matrix) at intervals of several mm (some dot marks 72 are not shown). ). The size of the calibration board 71 is not limited, but has the same size as the board W having the maximum size to which the mounting device 1 can be applied, and the range in which the dot mark 72 is provided is the board. It is preferable that the size is the same as the range including the mounting area MA on W. The dot mark 72 is a mark for grasping the movement error of the stage 21, and does not correspond to the mounting position ap. The arrangement of the mounting positions ap is mainly based on the size of the electronic component t, but it is preferable that the dot marks 72 are arranged at the maximum interval that can ensure the required accuracy. The shorter the interval between the dot marks 72, the more accurately the movement error can be grasped, but the more times the dot marks 72 are recognized within a predetermined distance, so that the time required for recognition becomes longer. Further, the dot mark 72 is formed of a metal thin film or the like, and can be formed by using a film forming technique such as etching or sputtering. Such a calibration board 71 is set on the stage 21. The method of setting the calibration board 71 is not particularly limited. For example, only by moving the stage 21 in the X direction, all the dot marks 72 in the movable range of the stage 21 in the same row along the X direction are the board recognition camera 43f. The position of the calibration substrate 71 on the stage 21 is adjusted so as to pass through the center of the imaging field of view V.

(Calculation of movement error correction data)
Next, the first recognition unit and the second recognition unit recognize the positions of the dot marks 72 of the calibration board 71 set on the stage 21 by the above method, and the movement error correction data calculation unit 53 determines. The movement error correction data of the stage 21 is calculated. That is, the board recognition camera 43f of the first recognition unit and the board recognition camera 43f of the second recognition unit recognize the position of the dot mark 72. Then, the movement error correction data calculation unit 53 calculates the movement error of the dot mark 72 and the movement error correction data based on the movement error. At this time, the dot mark 72 is regarded as the mounting position ap, and the range in which the dot mark 72 is provided is assumed to be the mounting area MA. The mounting area MA is divided into two, and the above-mentioned first area MA1 and second area MA2 are assumed. Hereinafter, the calibration board 71 is also simply referred to as a mounting region MA, a first region MA1, and a second region MA2.

The dot mark 72 is recognized by moving the calibration board 71 with the board recognition camera 43f of the first recognition unit and the board recognition camera 43f of the second recognition unit stopped at predetermined positions. As shown in FIG. 9, the image of the dot mark 72 on the calibration board 71 is taken from the dot mark 72 located at the left end of the rear part (the side located on the rear side of the base portion 1a) of the calibration board 71 to the right side in the X direction, for example. The movement is started in pitch units, which is the arrangement interval of the dot marks 72, and is sequentially folded back toward the front portion (the side located on the front portion side of the base portion 1a).

At this time, among the dot marks 72 on the calibration board 71, the dot marks 72 provided in the first region MA1 are imaged by the board recognition camera 43f of the first recognition unit. Further, among the dot marks 72 on the calibration board 71, the dot marks 72 provided in the second region MA2 are imaged by the board recognition camera 43f of the second recognition unit.

Specifically, for example, as shown in FIG. 9, the first recognition is performed with the stage 21 positioned at the center of the moving stroke of the stage moving mechanism 22 in the XY direction (this position is referred to as the origin position). The substrate recognition camera 43f of the unit is positioned on the calibration substrate 71 at the center 71A of the dot mark group located corresponding to the first region MA1. Further, the substrate recognition camera 43f of the second recognition unit is positioned at the center 71B of the dot mark group located on the calibration substrate 71 corresponding to the second region MA2. That is, with the mounting area MA center of the calibration board 71 positioned at the origin position of the stage 21, the board recognition cameras 43f are placed at the center positions of the first area MA1 and the second area MA2 of the calibration board 71. Position. Therefore, the two substrate recognition cameras 43f are positioned at the same position in the Y direction and at an interval corresponding to the interval (pitch) between the first region MA1 and the second region MA2 in the X direction. From this state, with the XY positions of both board recognition cameras 43f stopped, the operator operates the stage moving mechanism 22 while looking at the display, and the dot mark on the upper left of the dot mark group corresponding to the first region MA1. The calibration board 71 is moved so that the 72 is located at the center of the imaging field of view V of the board recognition camera 43f of the first recognition unit. As a result, the dot mark 72 on the upper left of the dot mark group corresponding to the first region MA1 is located within the imaging field of view V of the substrate recognition camera 43f of the first recognition unit. At this time, the dot mark 72 on the upper left of the dot mark group corresponding to the second region MA2 is located in the imaging field of view V of the substrate recognition camera 43f of the second recognition unit. In each dot mark group corresponding to the first region MA1 and the second region MA2, the upper left dot mark 72 becomes the first dot mark 72.

When the first dot mark 72 is positioned so as to be the center of the imaging field of view V of the substrate recognition camera 43f, the detection operation of the dot mark 72 by both substrate recognition cameras 43f is started. From this point onward, automatic control is performed by the control device 50. The detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel. When the detection operation of the dot mark 72 is started, the first dot mark 72 is first imaged. The image of the first dot mark 72 captured is processed by using a known image recognition technique, and the displacement of the dot mark 72 with respect to the center of the imaging field of view V of the substrate recognition camera 43f is detected. The detected positional deviation is stored in the storage unit 56 as information paired with the moving position (XY coordinates) of the stage 21. As described above, the position recognition of the dot mark 72 includes recognition by an image, grasping of the position, and detection of misalignment.

When the position recognition of the first dot mark 72 is completed, the stage 21 moves to position the next (second) dot mark 72 in the field of view of the camera according to the movement order described above. In the example of FIG. 9, since the second dot mark 72 is located to the right of the first dot mark 72, the stage 21 is moved one pitch to the left in the X direction.

The movement of the stage 21 is performed based on the reading value of the linear encoder provided in the XY movement mechanism (stage movement mechanism 22) of the stage 21. When the movement of the stage 21 is completed, the misalignment of the second dot mark 72 is detected in the same manner as the first dot mark 72, and the storage unit 56 stores the information as a pair with the XY coordinates of the stage 21 at this time. It will be remembered. Such an operation is performed on the dot marks 72 in each target area by both board recognition cameras 43f, and the movement error correction of the dot marks 72 corresponding to the respective positions of all the dot marks 72 on the calibration board 71 is performed. The data is calculated and stored in the storage unit 56. After the movement error correction data of all the dot marks 72 on the calibration board 71 is calculated, the stage movement mechanism 22 moves the calibration board 71 by + α in the X-direction stroke of the stage 21 and exists in this + α region. The dot mark 72 to be used is recognized by the substrate recognition camera 43f of the second recognition unit, and the movement error correction data in the + α region is further calculated and stored. As a result, for the portion where the movement of the stage 21 can overlap, the movement error correction data is acquired as much as the movement of the stage 21 is expanded.

(Calculation of recognition error correction data)
Further, the recognition error correction data calculation unit 54 acquires the recognition error correction data by calculating the recognition error correction data. This recognition error correction data is calculated by recognizing a common mark by the first recognition unit and the second recognition unit and obtaining the difference between the coordinates of the two.

For example, as shown by the dotted line in FIG. 9, among the dot marks 72 of the first region MA1, at least one dot mark 72 located in two rows close to the second region MA2 is used as a common mark. In the present embodiment, one selected dot mark 72 located in the two rows is used as a common mark.

More specifically, as shown in FIG. 9, the substrate recognition camera 43f of the first recognition unit is positioned at the center 71A of the dot mark group, and the substrate recognition camera 43f of the second recognition unit is located of the dot mark group. The stage 21 is moved by the stage moving mechanism 22 while being positioned at the center 71B, and the dot mark 72 used as a common mark among the dot marks 72 in the first area MA1 is used as the substrate recognition camera of the second recognition unit. It is recognized by moving it so as to be positioned at the center of the field of view of 43f. That is, the area of the dot mark 72 recognized by the board recognition camera 43f of the second recognition unit is expanded, and the dot mark already recognized by the board recognition camera 43f of the first recognition unit is as shown in FIG. 72 is recognized in duplicate. Then, for the common dot mark 72, the difference between the coordinates (X ₁ , Y ₁ ) recognized by the first recognition unit and the coordinates (X ₂ , Y ₂ ) recognized by the second recognition unit is obtained. , Calculate the recognition error correction data that corrects this error. In the present embodiment, the obtained difference is used as recognition error correction data.

When the stage 21 is moved in order to recognize the overlapping dot marks 72 in this way, the movement position of the stage 21 is corrected with reference to the previously obtained movement error correction data. In this way, the coordinates (X ₂ , Y ₂ ) recognized by the second recognition unit are stored in the storage unit 56 together with the recognition error correction data and the movement error correction data.

The calculation of the movement error correction data and the recognition error correction data described above is basically performed when the mounting device 1 is operated, and the movement of the stage 21 may be controlled based on the measurement result. However, the stage 21 may incorporate a heater or the like that assists in mounting the electronic component t. In such a case, the temperature of each part of the apparatus may rise and the mechanical accuracy may decrease due to thermal expansion. Further, as the mounting process of the electronic component t by the mounting device 1 progresses, the mechanical accuracy of each part of the device may decrease due to the heat generated by the motor or the like of the moving device that moves the mounting head 43. When considering the movement error due to such a temperature rise, the movement error may be performed not only once when the device is in operation but also periodically.

Further, after mounting the electronic component t, at least one of the electronic components t on the mounted substrate W may be used as a common mark. By recognizing the common mounted electronic component t by the first recognition unit and the second recognition unit in this way, the recognition error correction data may be acquired in the same manner as described above. That is, the common mark recognized by the first recognition unit and the second recognition unit includes not only the dot mark 72 but also the electronic component t. If there is a distinguishable mark such as an alignment mark or a circuit pattern on the upper surface of the mounted electronic component t, the position recognition of the electronic component t can be performed by relying on the mark. When there is no such mark, it is possible to rely on the outer shape of the electronic component t (which is also included in a kind of mark). Further, when the mounted electronic component t is used as a common mark, there is a possibility that a mounting deviation may occur between the first mounting portion 40A and the second mounting portion 40B due to individual differences. , Such a deviation can also be corrected.

[Correction of mounting position]
The mechanism control unit 51 moves the stage so that the mounting position ap virtually set on the board W mounted on the stage 21 is sequentially located on the mounting line BL for each row of the mounting position ap along the X direction. The mechanism 22 is controlled. At this time, the correction unit 55 will explain the correction process for correcting the moving position of the stage 21.

The correction unit 55 refers to the movement error correction data of the stage 21 and corrects the movement position of the stage 21 when the line of the mounting position ap on which the electronic component t is mounted this time is positioned on the mounting line BL. When mounting in the second region MA2, when the movement error correction data and the recognition error correction data of the stage 21 are referred to and the line of the mounting position ap on which the electronic component t is mounted this time is positioned on the mounting line BL. The moving position of the stage 21 may be corrected.

[Mounting of electronic components]
The mounting of the electronic component t on the substrate W after the above calibration will be described with reference to the flowchart of FIG. Note that FIG. 10 shows a process from the delivery of the wafer ring 11 to the completion of mounting the electronic component t of the wafer ring 11.

(1) Carrying in wafer ring (step S101)
First, as shown in FIG. 2, a new wafer ring 11 in which the electronic component t is held in the ring holder 12 is carried in from a storage portion (not shown), and the wafer ring 11 is fixed on the ring holder 12. The wafer ring 11 positioned on the ring holder 12 is held in a stretched state by the expanding mechanism (not shown) provided in the component supply unit 10.

(2) Board setting (step S102)
(Supply of board)
The substrate W held by the transfer robot (not shown) is supplied to the stage 21. The transfer robot (not shown) includes a transfer arm on which the board W is placed and held, and the board W is placed on the stage from the left side of the mounting device 1 through the space under the gate of the support frame 41 of the first mounting portion 40A. Carry it on 21. After supplying the substrate W onto the stage 21, the transport arm retracts from the mounting device 1. The process of supplying the substrate W may be performed in parallel with the loading of the wafer ring 11, or may be performed individually.

(Correction of board misalignment)
The global mark of the substrate W placed on the stage 21 is detected, and the position of the substrate W is recognized. For example, the positions of the global marks provided at the three corners of the four corners of the substrate W are captured and detected by using the substrate recognition camera 43f. Then, the positional deviation of the substrate W in the XY direction and the positional deviation in the θ direction (horizontal rotation direction) are obtained based on the detected positions of the three global marks, and the stage 21 is based on the correction data for correcting the positional deviation. The stage movement mechanism 22 corrects the misalignment. Here, the storage unit 56 stores the relative positional relationship between the global mark and each mounting position a, and the control device 50 stores the mounting position a on the substrate W based on the position of the global mark. You can grasp it. By the way, one substrate recognition camera 43f cannot enter the other region. The stage 21 can also move only half of the substrate + α in the X direction. Therefore, the global marks at both ends of the substrate in the X direction are recognized by the substrate recognition camera 43f in each region. When correcting the misalignment of the substrate W mounted on the stage 21 as described above, the detection position of the global mark is corrected based on the above-mentioned movement error correction data and recognition error correction data. In this way, while correcting the misalignment of the substrate W, the line of the mounting position ap to be mounted first is positioned on the mounting line BL set at the center position (origin position) of the Y-direction stroke of the stage 21. At this time, the center position of the substrate W in the X direction is positioned at the center position (origin position) of the stroke in the X direction of the stage 21.

(3) Transfer of electronic components (step S103)
(Removal of electronic parts)
When the wafer ring 11 is held by the ring holder 12, the electronic component t that is first taken out on the wafer ring 11 is positioned at the take-out position. Each time the electronic component t is taken out, the ring holder 12 moves the wafer ring 11 by pitch according to the order stored in advance in the storage unit 56, and the electronic component t is sequentially positioned at the take-out position.

The suction nozzles 37a and 37b of the transfer head 37 of the transfer device 30A move directly above the electronic component t positioned at the take-out position, respectively. The Z-direction moving devices 37c and 37d lower the suction nozzles 37a and 37b, respectively, and bring the suction surfaces of the suction nozzles 37a and 37b into contact with the upper surface (electrode forming surface) of the electronic component t, respectively. When the suction nozzles 37a and 37b come into contact with the electronic component t, the suction nozzles 37a and 37b suck and hold the electronic component t, respectively. Such suction and holding of the electronic components t of the suction nozzles 37a and 37b are sequentially performed for the electronic components t that are sequentially positioned. Further, such taking out of the electronic component t is alternately performed by the transfer device 30A and the transfer device 30B.

The suction nozzles 37a and 37b of the transfer head 37 are positioned on the mounting portions 31a and 31b of the intermediate stage 31. In this state, the suction nozzles 37a and 37b are lowered, and the electronic component t held by the suction nozzles 37a and 37b is placed on the mounting portions 31a and 31b.

(Delivery of electronic parts)
When the electronic component t is mounted on the mounting portions 31a and 31b of the intermediate stage 31, the first mounting head 43A of the first mounting portion 40A moves toward the intermediate stage 31, and the mounting tool 43a, The 43b is positioned above the mounting portions 31a and 31b, lowered to attract and hold the electronic component t, and then the mounting tools 43a and 43b are raised. As a result, the mounting tools 43a and 43b receive the two electronic components t at the same time. Here, in parallel with the delivery of the electronic component t, the transfer device 30B takes out the electronic component t and transfers the intermediate stage 31 in the same manner as the transfer device 30A.

(4) Mounting of electronic components (steps S104, S105)
(Position detection and movement of electronic components)
When the mounting tools 43a and 43b receive the electronic component t, the electronic component t attracted and held by the mounting tools 43a and 43b by the chip recognition cameras 44a and 44b of the imaging unit 44 arranged above the mounting portions 31a and 31b. Is imaged. This imaging is performed through the transparent members of the mounting tools 43a and 43b. Based on the captured images of the chip recognition cameras 44a and 44b, the positions of the electronic components t attracted and held by the mounting tools 43a and 43b are detected.

The position of the electronic component t may be detected on the mounting portions 31a and 31b. In this case, after the chip recognition cameras 44a and 44b take an image of the electronic component t, the mounting tools 43a and 43b suck and hold the electronic component t. When the imaging of the electronic component t by the chip recognition cameras 44a and 44b is completed, the mounting tools 43a and 43b are placed on the row of the mounting position ap in the mounting area MA of the substrate W positioned on the mounting line BL along the X direction. Move towards.

(Mounting of electronic components)
Among the mounting tools 43a and 43b, the first mounting head 43 of the first mounting portion 40A is first held by the mounting tool 43a on the mounting position ap on which the electronic component t held by the mounting tool 43a is mounted. Move to position the electronic component t. In this case, since the electronic component t held by the left mounting tool 43a is the electronic component t that is first mounted on the substrate W, it is the most among the rows of the mounting position ap positioned on the mounting line BL. By moving the mounting tool 43a onto the mounting position ap located on the left side, descending to bring the electronic component t into contact with the substrate W, and then ascending and detaching from the mounting tool 43a, the electronic component with respect to the substrate W t is implemented.

The mounting is performed by joining the electronic component t to the substrate W. This bonding is performed by utilizing the adhesive force of an adhesive sheet or a die attach film (Die Attach Film: DAF) previously attached to the surface of the substrate W or the lower surface of the electronic component t. The electronic component t may be joined by providing a heater on the stage 21 and pressurizing the electronic component t against the heated substrate W.

When the mounting by the mounting tool 43a is completed, the first mounting head 43A moves to position the electronic component t held by the mounting tool 43b on the mounting position ap to be mounted next. When the electronic component t held by the mounting tool 43b is positioned on the mounting position ap, the electronic component t is mounted on the mounting position ap by the same operation as the mounting tool 43a described above. The first mounting head 43A, which has completed mounting of the electronic component t by the mounting tools 43a and 43b, moves toward the intermediate stage 31.

Here, since the electronic component t is transferred by the transfer device 30A in parallel with the mounting process of the electronic component t by the first mounting unit 40A, the first mounting head 43A is the intermediate stage 31. When the electronic component t to be mounted next is moved onto the mounting portions 31a and 31b, the electronic component t to be mounted next is in a state of being mounted on the mounting portions 31a and 31b. Therefore, the first mounting head 43A that has moved onto the intermediate stage 31 immediately receives the electronic component t from the mounting portions 31a and 31b, and executes the above mounting again. After that, this operation is repeated until the mounting of the electronic component t with respect to the mounting position ap of the first region MA1 is completed.

Even while the electronic components t are being mounted by the mounting tools 43a and 43b of the first mounting head 43A, the transfer device 30B allows the electronic components t to be mounted on the mounting portions 31c and 31d of the intermediate stage 31. When the transfer is completed, the mounting of the electronic component t by the second mounting head 43B of the second mounting unit 40B is started. This operation is the same as the above-described step described in the example of the first mounting unit 40A. The second mounting unit 40B repeats the process until the mounting of the electronic component t with respect to the mounting position ap of the second region MA2 is completed.

The first mounting portion 40A and the second mounting portion 40B divide the region on the substrate W into two equal parts in the left-right (X direction), and share the respective regions to mount the electronic component t. Therefore, the first mounting head 43A of the first mounting portion 40A and the second mounting head 43B of the second mounting portion 40B can not only perform the above-mentioned steps alternately but also in parallel. .. After mounting one line on the mounting line BL (all widths of MA1 and MA2), move the stage 21 to change lines, and position the line at the mounting position ap for mounting next on the mounting line BL to mount. repeat. The above mounting operation is repeated until the mounting of the electronic component t is completed for all the mounting positions ap on the substrate W (NO in step S105).

(5) Substrate replacement (unloading, loading) (steps S105 and S106)
When the mounting of the electronic component t is completed for all the mounting positions ap on the substrate W (YES in step S105), the transfer section 30 and the mounting section 40 are temporarily stopped, and the board W on which the mounting of the electronic component t is completed is completed. Is carried out from the stage 21 and a new substrate W is carried on the stage 21 (step S106). The substrate W is carried out from the stage 21 by a transfer robot that is the same as or different from the transfer robot (not shown) described above.

(6) Wafer ring replacement (steps S107, S108)
By repeatedly mounting the electronic component t on the substrate W as described above, when the electronic component t on the wafer ring 11 disappears (YES in step S107), the wafer ring 11 is replaced with a new wafer ring 11. (Step S108).

[Action effect]
(1) The mounting device 1 for the electronic component t of the present embodiment has a stage 21 for supporting the substrate W on which the electronic component t is mounted in a mounting region MA including a plurality of mounting positions ap for the electronic component t, and the electronic component t. A first mounting portion 40A having a first mounting head 43A for mounting the first mounting head 43A and a first mounting head moving mechanism for moving the first mounting head 43A, and an electronic component t mounted at the mounting position ap. A second mounting portion 40B having a second mounting head 43B to be mounted on the mounting head and a second mounting head moving mechanism for moving the second mounting head 43B, and a second mounting portion 40B having the first mounting head 43A are movably provided. A second recognition unit that recognizes the position of the board W supported by the stage 21 and a second recognition unit that is movably provided together with the second mounting head 43B and recognizes the position of the board W supported by the stage 21. Has a recognition unit and.

Further, the mounting device 1 has a stage moving mechanism 22 for moving the stage 21 and a first one so that the first recognition unit and the second recognition unit can recognize a common mark on the stage 21. Recognition that calculates recognition error correction data for correcting the recognition error between the first recognition unit and the second recognition unit based on the position of the common mark recognized by the recognition unit and the second recognition unit. It has an error correction data calculation unit 54 and a correction unit 55 that corrects the positioning position of the electronic component t with respect to the mounting position ap by the first mounting head 43A or the second mounting head 43B based on the recognition error correction data. ..

In this way, the positioning position of the electronic component t with respect to the mounting position ap is corrected based on the recognition error correction data obtained by recognizing the common mark by the first recognition unit and the second recognition unit. Therefore, the deviation between the mounting position ap by the first mounting unit 40A and the mounting position ap by the second mounting unit 40B is eliminated, and the electronic component t can be accurately mounted on the entire substrate W without deviation. Further, since it is not necessary to move the substrate W to an external measuring instrument to measure and correct the positional deviation, accurate mounting can be performed efficiently.

As a result, all the electronic components t on the substrate W are accurately arranged at predetermined intervals in each of the vertical and horizontal directions, so that the position of the mask during exposure may shift in the package manufacturing process. Inconvenience is prevented.

(2) The first mounting head 43A mounts the electronic component t at the mounting position ap of the first region MA1, which is one region obtained by dividing the mounting region MA into two, and the second mounting head 43B is the mounting region. The electronic component t is mounted at the mounting position ap of the second region MA2, which is the other region obtained by dividing the MA into two.

When the common mounting area MA is divided into two parts, the first area MA1 and the second area MA2 are mounted by different first mounting heads 43A and second mounting heads 43B, the mounting position ap shifts. Although it is likely to occur, in the present embodiment, such a deviation can be corrected. Therefore, for example, even when mounting on a wide mounting area MA of a large substrate W, the electronic component t can be efficiently mounted by the plurality of mounting portions, and the electronic component t can be mounted accurately without deviation.

(3) The first mounting head 43A is arranged on one side with respect to the stage 21, and the second mounting head 43B is arranged on the other side with respect to the stage 21. The second mounting head 43B is provided with a movable range divided into two on one side and the other side, and the substrate W is on the stage 21 and the first region MA1 is on one side. Positioned and supported such that the second region MA2 is located on the other side.

As described above, even if the movement range of the first recognition unit that moves with the first mounting head 43A and the second recognition unit that moves with the second mounting head 43B is limited, the movement of the stage 21 causes the stage 21 to move. , The range that can be recognized by either the first recognition unit or the second recognition unit can be extended so that the common mark can be recognized.

Expanding the movable range of the first mounting head 43A and the second mounting head 43B leads to an increase in the size of the device, but in the present embodiment, the stage 21 side is moved, so that the increase in size can be suppressed. .. In the present embodiment, the stage moving mechanism 22 moves the largest substrate W mounted on the stage 21 in an overlapping manner, for example, slightly larger than half of the dimension of the substrate W in the X direction in the X direction. It has a movement stroke that can be moved in the range (1 / 2X + α). Therefore, while suppressing the footprint of the mounting device 1, the overlapping portion is provided, and the recognition error of the two recognition units is corrected by that amount, so that the mounting accuracy can be improved.

(4) The movement error correction data calculation unit 53 for calculating the movement error correction data for correcting the movement error caused by the movement of the stage 21 is provided, and the correction unit 55 is based on the recognition error correction data and the movement error correction data. Therefore, the positioning position of the electronic component t with respect to the mounting position ap is corrected.

Therefore, in order to recognize the common mark, the positioning position of the electronic component t with respect to the mounting position ap is corrected including the error caused by the movement of the stage 21, so that more accurate mounting is possible.

[Other Embodiments]
Although the embodiment of the present invention and the modification of each part have been described, the embodiment and the modification of each part are presented as an example, and the scope of the invention is not intended to be limited. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

In the above-described embodiment, the movement error correction data for correcting the movement error of the stage 21 may be acquired in the entire movable range of the stage 21, or at least each mounting area on the substrate W is positioned at the mounting position. Occasionally, it may be acquired within the range in which the stage 21 moves. Further, as the movement error correction data, the actual measurement value of the movement error of the stage 21 itself may be used, or the actual measurement value such as a correction value for canceling the movement position error may be processed. In short, the data may be any data for correcting the movement position error of the stage 21. Further, as the recognition error correction data, the actual measurement value itself of the recognition error of the first recognition unit and the second recognition unit may be used, or the actual measurement value such as the correction value for canceling the recognition error is processed. May be good.

The correction unit 55 corrects the positioning position of the electronic component t with respect to the mounting position ap based on the moving position error data and the recognition error correction data. It also includes the positioning position. Further, instead of correcting the movement error when moving the stage 21 to recognize the common mark, it is corrected by adding a correction value based on the movement error correction data to the difference obtained as the recognition error correction data. You may.

In the above embodiment, the common mark used when acquiring the recognition error correction data is one dot mark 72 in the two columns. However, the present invention is not limited to this, and a plurality of common marks may be used. In this case, the average value of the differences between the sets of a plurality of marks may be used as the recognition error correction data.

When recognizing the position of the electronic component t as a common mark, the substrate recognition camera 43f as the first recognition unit and the substrate recognition camera 43f as the second recognition unit are used in the first region MA1 on the calibration board 71. It may be positioned at the center 71A of the dot mark group and the center 71B of the dot mark group of the second region MA2, that is, at the mounting position, respectively, and may be performed in the same manner as the acquisition of the recognition error correction data by the dot mark 72 described above. .. The mounting position is a preset fixed position on the mounting line BL. More specifically, the mounting position is set to the positions shown by reference numerals 71A and 71B in FIG. 9 with respect to the substrate W mounted in a normal positional relationship on the stage 21 positioned at the origin position, for example. ..

When recognizing the position of the dot mark 72 or the electronic component t as a common mark on the mounting line BL, the first recognition unit and the second recognition unit are not the center 71A and 71B of the dot mark group, but the dot mark. It may be arranged at a position closer to the origin position of the stage 21 than the centers 71A and 71B of the group. By doing so, the separation distance between the first recognition unit and the second recognition unit can be made shorter than half of the X-direction dimension of the substrate W, so that the X-direction stroke of the stage 21 The magnitude of + α in can be made as small as possible.

In the mounting device 1 of the above-described embodiment, an example of face-up mounting in which the electronic component t is mounted on the substrate W with the electrode forming surface facing upward has been mainly described, but the present invention is not limited to this, and the substrate is not limited to this. It can also be applied to face-down mounting in which the electronic component t is mounted on W with the electrode forming surface facing downward.

When face-down mounting is performed by the mounting device 1, the electronic components t taken out by the suction nozzles 37a and 37b of the transfer unit 30 are not placed on the intermediate stage 31, and the suction nozzles 37a are used by the reversing mechanisms 37e and 37f. , 37b is inverted upside down. In this state, the suction nozzles 37a and 37b are moved onto the intermediate stage 31, and the electronic component t is delivered from the suction nozzles 37a and 37b to the mounting tools 43a and 43b of the mounting unit 40.

Further, in the above-described embodiment, the electronic component t is held by the wafer sheet S with the electrode surface facing up, but the electronic component t is held by the wafer sheet S with the electrode surface facing down. Good. In this case, the transfer operation of face-up mounting and face-down mounting is switched. That is, when face-down mounting is performed by the mounting device 1, the electronic components t taken out by the suction nozzles 37a and 37b of the transfer unit 30 are placed on the intermediate stage 31 and face-up mounting is performed. Does not place the electronic component t on the intermediate stage 31, but reverses the suction nozzles 37a and 37b up and down by the reversing mechanisms 37e and 37f. In this state, the suction nozzles 37a and 37b are moved onto the intermediate stage 31, and the electronic component t is delivered from the suction nozzles 37a and 37b to the mounting tools 43a and 43b of the mounting unit 40.

In the above-described embodiment, an example in which two mounting tools 43a and 43b are provided on the mounting head 43 has been described, but the present invention is not limited to this, and the number of mounting tools is three or more even if it is one. It may be. Accordingly, the number of mounting portions 31a to 31d of the intermediate stage 31, the number of suction nozzles 37a and 37b of the transfer head 37, the number of Z-direction moving devices 37c and 37d, and the number of reversing mechanisms 37e and 37f are also set. .. However, as the number of mounting tools increases, the proximity interval becomes wider accordingly, so it is preferable to set according to the size of the substrate W on which the electronic component t is mounted. Considering the intermediate stage 31 and the transfer head 37, it is preferable to further consider the size of the electronic component t when setting.

Further, in the above-described embodiment, it has been described that the substrate W is removed in the process of manufacturing the package component, and the position detection mark (local mark) is not provided for each mounting position ap. It is not limited to. According to the mounting device and mounting method of the embodiment, for example, there is a position detection mark for each mounting area, and even for a substrate used as a part of a package component, of course, without relying on the local mark. It is possible to mount the electronic component t accurately and efficiently.

In the above-described embodiment, the stage 21 is fixed, and the mounting head 43 is mounted by moving on the mounting line BL in each of the two regions MA1 and the second region MA2. Then, at the time of mounting in the second region MA2, the recognition error was reflected by the correction of the mounting head 43. More specifically, with the X-direction center position of the substrate W positioned at the X-direction center position of the stage 21, the mounting head 43 was moved along the mounting line BL to mount the electronic component t. Not limited to that.

For example, the stage 21 may be moved when the electronic component t is mounted in the first region MA1 and when the electronic component t is mounted in the second region MA2. In this case, the stage 21, the first mounting head 43A, and the second mounting head 43B cooperate to mount. When mounting the electronic component t in the second region MA2, the substrate W is positioned at a position where the movement error and the recognition error are corrected by the movement of the stage 21. In the above aspect, since the electronic component t is taken out at one position, the mounting in the first region M1 and the second region M2 alternates. That is, it operates like mounting in the first area MA1, moving the stage, mounting in the second area MA2, moving the stage, and mounting in the first area MA1. Thereby, the same effect as the above-mentioned aspect can be obtained.

Further, the mounting positions when mounting the first mounting head 43A and the second mounting head 43B are fixed, and the stage 21 is moved and controlled so that the mounting tools 43a and 43b are sequentially positioned at the mounting positions. You may. This movement control moves so as to be corrected based on the movement error correction data and the recognition error correction data stored in the storage unit 56. In this case, since the mounting position of the mounting head 43 is fixed at the time of mounting, the movement error of the first mounting head 43A and the second mounting head 43B is limited to the movement error from the delivery of the electronic component t to the mounting line. Become. The movement error from the delivery to the mounting line is a fixed route, and the movement error of the mounting tool can be ignored because the distance is small, so that the mounting accuracy can be improved.

Further, in the procedure for mounting the electronic component t described with reference to FIG. 10, the mounting of the electronic component t on the entire mounting region MA of the substrate W is completed, and the substrate W is mounted before the electronic component t of the wafer is exhausted. Although the case of replacement has been described, there is a possibility that the electronic component t of the wafer will be exhausted before the mounting of the electronic component t on the entire mounting area MA of the substrate W is completed. In that case, when the electronic component t of the wafer is exhausted, the wafer ring 11 is replaced, and then the electronic component t is continuously mounted. That is, the flow of substrate replacement (steps S105 and S106) and wafer ring replacement (steps S107 and S108) may be interchanged.

1 Mounting device 1a Base part 10 Parts supply part 11 Waha ring 12 Ring holder 20 Stage part 21 Stage 22 Stage moving mechanism 30 Transfer part 30A, 30B Transfer device 31 Intermediate stage 31a to 31d Mounting part 32 Waha ring holding device 32a Support arm 32b Chuck unit 33 Y direction moving device 34 Y direction moving block 35 Support 36 X direction moving body 37 Transfer head 37a, 37b Suction nozzle 37c, 37d Z direction moving device 37e, 37f Reversing mechanism 38 Waha recognition camera 40 mounting Part 40A First mounting part 40B Second mounting part 41 Support frame 41a Y-direction moving device 42 Head support 42a X-direction moving device 43 Mounting head 43A First mounting head 43B Second mounting head 43a, 43b Mounting tool 43c, 43d Z-direction moving device 43f Board recognition camera 44 Imaging unit 44a to 44d Chip recognition camera 44e, 44f XY moving device 44g Camera support frame 50 Control device 51 Mechanism control unit 52 Image processing unit 53 Movement error correction data calculation unit 54 Recognition Error correction data calculation unit 55 Correction unit 56 Storage unit 57 Input / output control unit 61 Input device 62 Output device 71 Calibration board 72 Dot mark

Claims (4)

A stage that supports a substrate on which the electronic components are mounted and a stage that supports the board on which the electronic components are mounted
A first mounting unit having a first mounting head for mounting the electronic component at the mounting position and a first mounting head moving mechanism for moving the first mounting head.
A second mounting portion having a second mounting head for mounting the electronic component at the mounting position and a second mounting head moving mechanism for moving the second mounting head.
A first recognition unit that is movably provided together with the first mounting head and recognizes the position of the substrate supported by the stage.
A second recognition unit that is movably provided together with the second mounting head and recognizes the position of the substrate supported by the stage.
A stage moving mechanism for moving the stage so that the first recognition unit and the second recognition unit can recognize a common mark on the stage.
Recognition for correcting a recognition error between the first recognition unit and the second recognition unit based on the positions of common marks recognized by the first recognition unit and the second recognition unit. A recognition error correction data calculation unit that calculates error correction data,
Based on the recognition error correction data, a correction unit that corrects the positioning position of the electronic component with respect to the mounting position by the first mounting head or the second mounting head, and a correction unit.
An electronic component mounting device characterized by having. The first mounting head mounts the electronic component at a mounting position in the first region, which is one of the mounting regions divided into two.
The second mounting head mounts the electronic component at a mounting position in the second region, which is the other region obtained by dividing the mounting region into two.
The electronic component mounting device according to claim 1. The first mounting head is arranged on one side with respect to the stage.
The second mounting head is located on the other side of the stage.
The first mounting head and the second mounting head are provided with a movable range divided into two by the one side and the other side.
2. The substrate according to claim 2, wherein the substrate is supported on the stage so that the first region is located on one side and the second region is located on the other side. Electronic component mounting device. It has a movement error correction data calculation unit that calculates movement error correction data that corrects the movement error caused by the movement of the stage.
The correction unit according to claim 2 or 3, wherein the correction unit corrects the positioning position of the electronic component with respect to the mounting position based on the recognition error correction data and the movement error correction data. The electronic component mounting device described.

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