KR20230138423A - Electronic component mounting device and mounting method - Google Patents

Abstract

The object of the present invention is to provide a mounting device and method for electronic components that enable mounting with high positional accuracy and improve throughput by having a mounting tool collectively receive a plurality of electronic components from a placement unit with high precision.
A mounting device 1 for an electronic component t according to an embodiment of the present invention includes a plurality of placement parts 31a and 31b and a placement part moving mechanism that moves one or both of the placement parts 31a and 31b ( 340), an imaging unit that captures images of the electronic components (t) arranged in the placement units (31a, 31b) and recognizes the horizontal orientation of each electronic component (t), and a plurality of placement units (31a, 31b) A plurality of mounting tools (43a, 43b) that hold the arranged electronic components (t) and mount them on the substrate (W), and a mounting tool moving mechanism (4) that moves the plurality of mounting tools (43a, 43b) at once; a positioning processing unit (53) that performs positioning processing to position the electronic component (t) placed in the placing units (31a, 31b) with respect to the mounting tools (43a, 43b) based on the recognition result of the imaging unit; The mounting tools 43a and 43b have a receiving processing unit 54 that executes batch receiving processing of the electronic components t.

Description

Mounting device and method for mounting electronic components {ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD}

The present invention relates to a mounting device and method for electronic components.

Conventionally, a manufacturing process called wafer level package (WLP) is known. WLP is a technology for forming a redistribution layer for providing I/O terminals in the wafer state without using an interposer substrate (relay substrate). Since WLP does not require an interposer substrate, the thickness of the semiconductor package can be reduced and the manufacturing cost can be reduced.

As WLP, fan in-wafer level package (fan in-WLP: FI-WLP) and fan out wafer level package (fan out-WLP: FO-WLP) are known. FI-WLP forms a redistribution layer on the semiconductor chip so that the area on the surface where the electrode pads of the semiconductor chip are formed is not protruded. FO-WLP protrudes from the area of the semiconductor chip to form a redistribution layer.

FO-WLP attracts attention because it can be applied to a multi-chip package (Multi Chip Package: MCP) in which multiple types of electronic components such as semiconductor chips such as RAM, flash memory, and CPU, and diodes and condensers are mounted in one package. I'm receiving it.

In the FO-WLP manufacturing process, first, a plurality of semiconductor chips are mounted on a substrate in a matrix form with gaps between them, and then the gaps between the semiconductor chips are sealed with resin to integrate the plurality of semiconductor chips. As a result, a pseudo wafer is formed similar to a wafer formed by a semiconductor manufacturing process. On this pseudo wafer, a rewiring layer for providing I/O terminals is formed. After the plurality of semiconductor chips are resin-sealed and integrated, the substrate is peeled and removed.

Patent Document 1: Japanese Patent Publication No. 2019-29563

In the WLP described above, misalignment of the mounting positions of individual electronic components mounted on the same package affects the electrical characteristics of the package. For this reason, high positional accuracy is required for mounting each electronic component. In addition, in order to improve throughput, which is the production volume per unit time, a transfer unit that takes out electronic components from a component supply unit such as a semiconductor wafer, tray, or carrier tape, and a mounting unit that receives the electronic components from the transfer unit and mounts them on the board are provided. It allows removal and mounting of parts to be carried out at the same time. Additionally, a pair of transfer units and a mounting unit are provided to mount electronic components in parallel.

In addition, simultaneous transport of a plurality of electronic components from a component supply unit to a mounting location is performed. Here, in order to transfer the electronic components taken out by the transfer unit to the mounting unit, they are temporarily placed in the placement unit.

When placing an electronic component on the placement unit, it is easy for a misalignment that occurs when the electronic component is taken out by the holding unit from the component supply unit, a movement error during transfer, or a misalignment in position or direction when the electronic component is separated from the holding unit. For this reason, deviations appear in the positions and directions of the electronic components placed in the arrangement section. Additionally, when the transfer unit takes out a plurality of electronic components from the plurality of holding units and attempts to place the electronic components in the plurality of placement units, differences in the positions and directions of the electronic components appear even among the plurality of placement units. In this state, if multiple mounting tools receive electronic components at once, deviations will occur in the positions and directions of the electronic components held by each mounting tool, and it will take time to determine the position when mounting each electronic component on the board. Otherwise, positioning accuracy deteriorates. Additionally, when the electronic component is small relative to the mounting tool, there are cases where the electronic component cannot be received by the mounting tool due to positional misalignment.

To deal with this, when a plurality of mounting tools receive electronic components from a placement unit, it is considered to individually align each mounting tool with the electronic components and receive them one by one. However, the task of aligning the mounting tool for each electronic component and receiving it individually takes time, which leads to a decrease in throughput.

Embodiments of the present invention have been proposed to solve the problems described above, and the purpose of the present invention is to enable mounting with high positional accuracy by having a mounting tool receive a plurality of electronic components in batches with high precision from a placement unit. The goal is to provide a mounting device and method for electronic components that can improve throughput.

In order to achieve the above object, an electronic component mounting device of the embodiment includes a plurality of holding units holding electronic components, a plurality of placement units for arranging the electronic components each held by the plurality of holding units, and the arrangement. a placement unit moving mechanism that moves the unit in the horizontal direction; an imaging unit that captures an image of the electronic component placed in the placement unit and recognizes a horizontal posture of the electronic component; and a plurality of electronic components placed in the placement unit. It has a plurality of mounting tools that hold each component and mount it on a board, a mounting tool moving mechanism that moves the plurality of mounting tools in batches, and a control device, wherein the control device is configured to operate based on a recognition result of the imaging unit. a positioning processing unit that executes positioning processing to position the electronic component arranged in the arrangement unit with respect to the corresponding mounting tool by moving the arrangement unit; and a plurality of positions that have been subjected to the positioning process in the mounting tool. has a receiving processing unit that executes batch receiving processing of the electronic components placed in the placing unit.

The electronic component mounting method of the embodiment includes a plurality of holding units holding electronic components, a plurality of placement units for arranging the electronic components each held by the plurality of holding units, and an arrangement for moving the placement units in the horizontal direction. A part moving mechanism, an imaging unit that captures an image of the electronic component arranged in the arrangement unit and recognizes a horizontal posture of the electronic component, and a plurality of the electronic components arranged in the arrangement unit are held and placed on a substrate. A method of mounting the electronic component, comprising: a mounting device for an electronic component having a plurality of mounting tools for mounting and a mounting tool moving mechanism for moving the plurality of mounting tools in batches, based on a recognition result of the imaging unit, Positioning processing for positioning the electronic component arranged in the arrangement part with respect to the corresponding mounting tool by moving the arrangement part, and moving the electronic component from the plurality of positioned arrangement parts to the mounting tool corresponding to each. Receiving processing is performed to receive parts in batches.

According to the embodiment of the present invention, the mounting tool can receive a plurality of electronic components in batches with high precision from the placement unit, thereby improving throughput along with mounting with high positional accuracy.

1 is a plan view showing a mounting device according to an embodiment.
Fig. 2 is a front view showing the mounting device of the embodiment.
Fig. 3 is a right side view showing the mounting device of the embodiment.
Figure 4 is a front view (A) and left side view (B) showing the configuration of the arrangement portion.
Figure 5 is a block diagram showing the configuration of the control device.
Figure 6 is a flowchart showing the mounting process of electronic components using the mounting device of the embodiment.
Figure 7 is a flowchart showing the sequence of positioning of the placement part.
Fig. 8 is an explanatory diagram showing an example of positioning of an arrangement part.
Fig. 9 is an explanatory diagram showing an example of positioning of an arrangement part in a modified example.
Fig. 10 is an explanatory diagram showing an example of positioning of an arrangement part in a modification.

Hereinafter, a mounting device for electronic components of an embodiment will be described with reference to the drawings. In addition, the drawing is a schematic diagram, and the size and ratio of each part are exaggerated for ease of understanding.

The mounting device 1 is a device that mounts the electronic component t on the substrate W. 1 to 5, the mounting device 1 has a component supply section 10, a stage section 20, a transfer section 30, a mounting section 40, and a control device 50, and carries out electronic components. (t) is sequentially taken out from the component supply unit 10 by the transfer unit 30, delivered to the mounting unit 40 through the placement units 31a and 31b, and placed on the stage unit 20 by the mounting unit 40. ) is a device mounted on the substrate (W). In the following description, in FIG. 1, the direction in which the component supply unit 10 and the mounting unit 40 are arranged in the horizontal plane is referred to as the Y direction, and the direction orthogonal thereto is referred to as the X direction. Additionally, the direction perpendicular to the mounting surface of the substrate W is referred to as the Z direction. With the component supply unit 10 side facing the front, the X direction is left and right, the Y direction is front and back, and the Z direction is up and down when viewed from the front.

[Electronic parts]

As shown in FIG. 1, the object mounted on the substrate W by the mounting device 1 of this embodiment is an electronic component t. One example of an electronic component (t) is a semiconductor chip. However, the electronic component t is not limited to one type of semiconductor chip, and may include multiple types of semiconductor chips. It may be not only a semiconductor chip such as a logic element, a memory element, an imaging element, or a light emitting element, but also a resistor or a condenser.

[Board]

The substrate W of this embodiment is a rectangular substrate used for forming a pseudo panel equivalent to a pseudo wafer, which is applied, for example, in the production of a fan out-panel level package (FO-PLP). As the substrate W, a glass substrate, an organic substrate (glass/epoxy (FR-4) substrate, etc.), a silicon substrate, a metal substrate such as stainless steel, etc. can be used, but it is not limited to these. A pseudo panel is, in the same way as a pseudo wafer used in the manufacture of FO-WLP, by arranging a plurality of individual electronic components (t) such as semiconductor chips in a planar manner, and sealing the space between the arranged electronic components with resin to create a single panel. It is molded into a plate shape. The substrate W is preferably a substrate used when manufacturing an MCP by the above-described FO-PLP process, that is, a substrate on which a plurality of electronic components t such as semiconductor chips and condensers are mounted in each mounting area. Of course, the substrate W may be a substrate used for forming a pseudo wafer applied during the production of FO-WLP. Additionally, the substrate W for a display device such as micro LED or mini LED may be used.

[Mounting device]

(outline)

As described above, the mounting device 1 has a component supply section 10, a stage section 20, a transfer section 30, a mounting section 40, and a control device 50, as shown in FIG. 1 . The component supply unit 10 is a device that supplies electronic components t. The stage unit 20 is a device provided with a stage 21 on which the substrate W is placed. The transfer unit 30 is a device that takes out the electronic component t from the component supply unit 10 . The mounting unit 40 is a device that receives the electronic component t taken out by the transfer unit 30 and mounts it on the substrate W placed on the stage 21. The component supply unit 10, stage unit 20, transfer unit 30, and mounting unit 40 are provided on the base unit 1a, which is a base installed on the installation surface. The control device 50 is a device that controls the operations of the component supply unit 10, stage unit 20, transfer unit 30, and mounting unit 40.

The transfer unit 30 and the mounting unit 40 each have a pair configuration. The transfer unit 30 has a first transfer device 30A and a second transfer device 30B, and the mounting unit 40 has a first transfer device 30A and a second transfer device 30B. , it has a first mounting portion 40A and a second mounting portion 40B. Additionally, the first transfer device 30A has a first transfer head 37A, and the second transfer device 30B has a second transfer head 37B. Additionally, the first mounting portion 40A has a first mounting head 43A, and the second mounting portion 40B has a second mounting head 43B.

The first transfer device 30A and the first mounting portion 40A correspond to each other, and the second transfer device 30B and the second mounting portion 40B correspond to each other. Accordingly, the first transfer head 37A and the first mounting head 43A correspond, and the second transfer head 37B and the second mounting head 43B correspond. That is, the electronic component t taken out by the first transfer device 30A is transferred to the substrate W in the first mounting section 40A by the corresponding first transfer device 30A and the first mounting section 40A. It is installed in The electronic component t taken out by the second transfer device 30B is mounted on the substrate W in the second mounting section 40B by the corresponding second transfer device 30B and the second mounting section 40B. do. Hereinafter, details of each part will be explained.

(Parts Supply Department)

The component supply section 10 is a front portion on the base portion 1a and is disposed at the center of the X direction when viewed from the front. The parts supply unit 10 is equipped with a ring holder 12 and a pushing mechanism (not shown). The ring holder 12 holds the wafer ring 11. The wafer ring 11 is a member that holds the wafer sheet S. The wafer sheet S is a sheet on which a plurality of electronic components t are bonded. The electronic component (t) is a semiconductor chip in which the semiconductor wafer (T) is divided into individual pieces.

The ring holder 12 is provided so that the wafer ring 11 is removable. Additionally, the ring holder 12 is provided so that the wafer ring 11 can be moved in the XY direction by an XY moving mechanism (not shown). The pushing mechanism is a mechanism that pushes the electronic component (t) up from the lower side of the wafer sheet (S) held by the wafer ring (11) when the electronic component (t) is taken out by the transfer unit (30). The push-up mechanism is fixedly provided at the take-out position of the electronic component t by the transfer unit 30.

Additionally, the parts supply unit 10 is provided with an exchange device, although not shown. The exchange device supplies a new wafer ring 11 holding the electronic component t to the ring holder 12 from the storage portion where the wafer ring 11 is stored by the wafer ring holding device, and the electronic component ( The wafer ring 11 from which the extraction of t) has been completed is stored in the storage unit.

(Stage part)

The stage section 20 is disposed behind the component supply section 10 on the base section 1a and at the center of the base section 10a in the X direction when viewed from the front. The stage unit 20 has a stage 21 and a stage moving mechanism 22. The stage 21 is a stand that supports the substrate W. The stage 21 is configured to be able to attract and hold the placed substrate W by a suction and adsorption mechanism (not shown). The stage moving mechanism 22 is a mechanism that moves the stage 21 in the XY direction.

(Transfer Department)

The transfer unit 30 has a first transfer device 30A, a second transfer device 30B, and an intermediate stage 31. The first transfer device 30A and the second transfer device 30B take out the electronic component t from the component supply unit 10 and place it on the intermediate stage 31 where the electronic component t is temporarily placed. do. The first transfer device 30A and the second transfer device 30B are arranged in a line in the The first transfer device 30A and the second transfer device 30B have the same configuration except that the left and right sides are reversed. Therefore, in cases where the two are not distinguished, it is simply referred to as the transfer unit 30. Hereinafter, when the mounting device 1 is viewed from the front, the configuration of the first transfer device 30A on the left will be described, and the description of the configuration of the second transfer device 30B on the right will be omitted.

As shown in FIGS. 1 to 3 , the first transfer device 30A has a Y direction movement device 33, a transfer head 37, and a wafer recognition camera 38. The Y-direction moving device 33 moves the transfer head 37, which takes out and holds the electronic component t from the component supply unit 10, between the position of the component supply unit 10 and the positions of the placement units 31a and 31b. Move from . The Y direction movement device 33 is a device that supports the Y direction movement block 34 supporting the transfer head 37 so that it can move in the Y direction. The Y direction movement device 33 is located on the left side of the front part of the base part 1a and extends along the Y direction from the front end of the base part 1a to the vicinity of the center. The transfer head 37 is supported on the Y direction movable block 34 via a support body 35 and an X direction movable body 36. The support body 35 is provided on the rear surface of the upper end side of the Y direction moving block 34. The support body 35 has a rectangular plate shape and extends from the Y direction movable block 34 to the right along the X direction. On the back side of this support body 35, an X-direction moving body 36 is provided. The X-direction moving body 36 is supported so as to be movable along the X-direction by an X-direction moving device (not shown).

The transfer head 37 is supported at the end of the X-direction moving body 36 on the component supply unit 10 side. Hereinafter, the transfer head 37 of the first transfer device 30A is referred to as the first transfer head 37A, and the transfer head 37 of the second transfer device 30B is referred to as the second transfer head 37B, and both are referred to as the first transfer head 37A. If no distinction is made, it is simply referred to as the transfer head 37. The transfer head 37 has suction nozzles 37a and 37b and Z-direction moving devices 37c and 37d. The suction nozzles 37a and 37b are holding parts that hold the electronic component t. The suction nozzles 37a and 37b are connected to a pneumatic pressure circuit (not shown), and can hold the electronic component t by negative pressure. The two suction nozzles (37a, 37b) are aligned in the X direction. The Z direction moving devices 37c and 37d are devices that individually move the suction nozzles 37a and 37b in the Z direction.

The wafer recognition camera 38 is a device that recognizes the position of the electronic component t on the wafer sheet S held by the wafer ring 11 of the component supply unit 10. The wafer recognition camera 38 is provided at the end of the

The intermediate stage 31 is a device where the electronic components t taken out by the suction nozzles 37a and 37b of the transfer head 37 are temporarily placed. The intermediate stage 31 is provided between the component supply unit 10 and the stage unit 20. The intermediate stage 31 is composed of a pair of a first intermediate stage 31A and a second intermediate stage 31B. The first intermediate stage 31A corresponds to the first transfer head 37A of the first transfer device 30A and the first mounting head 43A of the first mounting unit 40A. The second intermediate stage 31B corresponds to the second transfer head 37B of the second transfer device 30B and the second mounting head 43B of the second mounting unit 40B. The first intermediate stage 31A and the second intermediate stage 31B have the same configuration except that the left and right sides are reversed. Hereinafter, when no distinction is made between the first intermediate stage 31A and the second intermediate stage 31B, they are simply referred to as the intermediate stage 31. The intermediate stage 31 is provided with placement portions 31a and 31b. The two placement portions 31a and 31b of the first intermediate stage 31A correspond to the two suction nozzles 37a and 37b of the transfer head 37 in the first transfer device 30A. The two placement portions 31a and 31b of the second intermediate stage 31B correspond to the two suction nozzles 37a and 37b of the transfer head 37 in the second transfer device 30B. That is, the electronic component t held by the suction nozzle 37a is disposed in the placement portion 31a, and the electronic component t held by the suction nozzle 37b is disposed in the placement portion 31b.

As shown in FIG. 4, the placement unit 31a has a placement table 311 on which the electronic component t is placed, and the placement unit 31b has a placement table 312 on which the electronic component t is placed. has The mounting portions 31a and 31b are supported on a support 320 fixed to the base portion 1a. In this embodiment, one of the placement portions 31a and 31b is fixed. In addition, any one here means any one of the placement portions 31a and 31b corresponding to the mounting tools 43a and 43b (the mounting head 43 is common) that move together. If the corresponding mounting heads 43A and 43B are different, it becomes one of the respective placement portions 31a and 31b. In this embodiment, the placement part 31b is fixed, and the placement table 312 is fixed on the fixture 330 fixed on the support table 320. Fixed here means that the electronic component t is at least immovable during positioning in a mounted state.

On the other hand, the placement part 31a is provided to be movable in the horizontal direction (X direction, Y direction) by the placement part moving mechanism 340. The placement unit moving mechanism 340 has a guide unit 341, a slide unit 342, a drive unit 343, a guide unit 344, a slide unit 345, a drive unit 346, and a transmission unit 347. . As shown in FIG. 4(A), the guide portion 341 is a rail member supported by the support 320 and extending in the X direction. The slide part 342 is a block member provided to slide in the X direction along the guide part 341. The driving unit 343 is a member that moves the slide unit 345 in the X direction. The drive unit 343 in this embodiment is a VCM (voice coil motor).

As shown in FIG. 4B, the guide portion 344 is a rail member supported on the slide portion 342 and extending in the Y direction. The slide part 345 is a block member provided to be able to slide in the Y direction along the guide part 344. The drive unit 346 is a member that advances and retreats the slide unit 345 in the Y direction. The drive unit 346 in this embodiment is a VCM (voice coil motor). The transmission unit 347 is a plate body that is fixed to the slide unit 345 and transmits the driving force of the drive unit 346 to the slide unit 345 by contacting the drive shaft of the drive unit 346.

The placement table 311 is supported on the slide portion 345. For this reason, the electronic component t placed on the placement table 311 can be moved in the X and Y directions together with the placement table 311 by the placement unit moving mechanism 340. In the following description, the placement unit 31a provided with the placement unit moving mechanism 340 is referred to as the movable placement unit 31a.

(implementation department)

The first mounting portion 40A and the second mounting portion 40B of the mounting portion 40 have the same configuration except that the left and right sides are reversed. The first mounting portion 40A and the second mounting portion 40B are arranged in a row in the X direction at the rear of the base portion 1a with the stage portion 20 sandwiched between them. Hereinafter, only the configuration of the first mounting portion 40A on the left will be described, and the description of the configuration of the second mounting portion 40B on the right will be omitted.

The first mounting unit 40A has a support frame 41, a head support body 42, a mounting head 43, and an imaging unit 44. The support frame 41 is door-shaped when viewed from the side, and is provided along the Y direction on the left side of the stage portion 20 on the base portion 1a (see Fig. 3). The head support body 42 is provided on the right side of the support frame 41 to be movable in the Y direction via a Y direction movement device 41a. The head support body 42 extends along the X direction to near the center of the base portion 1a.

The mounting head 43 is a device that mounts the electronic component t on the substrate W. Hereinafter, the mounting head 43 of the first mounting portion 40A is referred to as the first mounting head 43A, and the mounting head 43 of the second mounting portion 40B is referred to as the second mounting head 43B, and both are referred to as the first mounting head 43A. If no distinction is made, it is simply referred to as the mounting head 43. The mounting head 43 is provided on the front surface of the head support body 42 to be movable in the X direction via an X direction moving device 42a. The mounting head 43 has mounting tools 43a and 43b, Z direction movement devices 43c and 43d, and an imaging unit 44. The mounting tools 43a and 43b correspond to the placement parts 31a and 31b, respectively, and are tools for holding the electronic components t placed in the placement parts 31a and 31b and mounting them on the substrate W. The mounting tools 43a and 43b are suction nozzles and are connected to a pneumatic pressure circuit (not shown) so that the electronic component t can be held by negative pressure. The mounting tools 43a and 43b are provided at the same arrangement interval as the suction nozzles 37a and 37b of the transfer head 37.

The mounting tools 43a and 43b are equipped with a rotation device (not shown), and can rotate the adsorbed and held electronic component t within the XY plane. That is, the mounting tools 43a and 43b enable positioning of the electronic component t in the θ direction.

Moreover, among the mounting tools 43a and 43b, a board recognition camera 43f as a recognition unit is attached to the mounting tool 43b located at the center side, that is, inside the base portion 1a. The board recognition camera 43f is provided to be movable together with the mounting head 43 and recognizes the position of the board W. More specifically, the substrate recognition camera 43f images the alignment mark of the substrate W placed on the stage 21. In addition to the function of capturing an image, this substrate recognition camera 43f has a function of processing the captured image to recognize the position of a recognition object such as an alignment mark. Therefore, the substrate recognition camera 43f functions as a recognition unit for recognizing the position of the substrate W.

The Z direction moving devices 43c and 43d are devices that individually move the two mounting tools 43a and 43b in the Z direction. The mounting tool moving mechanism 4 is comprised of the Y direction moving device 41a, the X direction moving device 42a, and the Z direction moving devices 43c and 43d (see Figure 1). The mechanism for collectively moving the mounting tools 43a and 43b of the first mounting head 43A in the first mounting section 40A is the first mounting tool moving mechanism 4A, and the second mounting section 40B ), the mechanism for collectively moving the mounting tools 43a and 43b of the second mounting head 43B is set to the second mounting tool moving mechanism 4B, and when the two are not distinguished, the mounting tool is simply moved. Use it as a mechanism (4).

The imaging unit 44 is a unit for imaging the electronic component t placed in the placement portions 31a and 31b. The imaging unit 44 has four chip recognition cameras 44a and 44b, two on each left and right, above the placement portions 31a and 31b of the intermediate stage 31, corresponding to the placement portions 31a and 31b.

That is, the chip recognition camera 44a can capture an image of the electronic component t placed on the placement unit 31a, and the chip recognition camera 44b can capture an image of the electronic component t placed on the placement unit 31b. This is an imaging unit that can capture images. Additionally, the chip recognition cameras 44a and 44b have a function of processing captured images and recognizing the posture of an imaging object such as an electronic component t. The posture referred to here includes the position in the XY plane and the angle (θ) of the horizontal rotation direction.

The chip recognition cameras 44a and 44b are supported in a pair by a pair of XY movement devices 44e and 44f so that they can move in the XY direction. The two chip recognition cameras 44a and 44b, which form a group, are provided at the same arrangement interval as the mounting tools 43a and 43b and the suction nozzles 37a and 37b. A pair of XY movement devices 44e and 44f are supported on a camera support frame 44g. The camera support frame 44g is door-shaped when viewed from the front, and extends in the X direction between the component supply unit 10 and the stage unit 20. The camera support frame 44g is provided at the front end of the upper surface of the left and right support frames 41 in the mounting unit 40 by being placed on the left and right support frames 41. The chip recognition cameras 44a and 44b are supported below the beam portion of the camera support frame 44g.

This mounting unit 40 receives the electronic component t taken out from the component supply unit 10 by the transfer unit 30, and transfers the received electronic component t to the substrate W placed on the stage 21. Mount it on the table. Mounting of the electronic component t by the first mounting head 43A and mounting of the electronic component t by the second mounting head 43B are performed in parallel.

(controller)

The configuration of the control device 50 will be explained with reference to FIG. 5 . The control device 50 is a device that controls the operations of the component supply unit 10, stage unit 20, transfer unit 30, and mounting unit 40. The control device 50 has, for example, a processor that executes a program, a memory that stores various information such as programs and operating conditions, and a driving circuit that drives each element. Connected to the control device 50 is an input device 61 through which an operator inputs instructions and information necessary for control, and an output device 62 for checking the status of the device. The input device 61 may use a switch, touch panel, keyboard, mouse, or the like. The output device 62 can use a display device such as liquid crystal or organic EL.

The control device 50 has a mechanism control unit 51, a reference determination processing unit 52, a position determination processing unit 53, a receiving processing unit 54, and a storage unit 55. The mechanism control unit 51 controls the operations of the component supply unit 10, stage unit 20, transfer unit 30, and mounting unit 40. The reference decision processing unit 52 provides a reference for moving the mounting tool 43b in accordance with the posture of the electronic component t placed on the fixed placement portion 31b, based on the recognition result of the chip recognition camera 44b. Execute positioning processing. In addition, the posture of the electronic component t here is the position in the XY plane, and the movement of the mounting tool 43b is movement in the XY direction. The positioning processing unit 53 moves the placement unit 31a based on the recognition result of the chip recognition camera 44a, thereby moving the electronic component t placed on the placement unit 31a to the corresponding mounting tool ( Position determination processing for positioning 43a) is executed. The movement of the placement portion 31a in this positioning process for the mounting tool 43a is movement in the XY direction. In addition, in this embodiment, the positioning processing unit 53 executes positioning processing including the movement amount of the mounting tool by the reference determining processing. The receiving processing unit 54 causes the mounting tools 43a and 43b corresponding to each of the plurality of positioned placement units 31a and 31b to perform a batch receiving process for the electronic components t.

The storage unit 55 is a storage device that includes various types of memory (HDD: Hard Disk Drive, SSD: Solid State Drive, etc.) as a recording medium, a recording medium, and an external interface. The storage unit 55 stores various information necessary for controlling the mounting device 1. The information stored in the storage unit 55 includes the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition camera ( Image data from 44a, 44b), position coordinates, tilt, etc. of the recognized electronic component t are also included.

[Operation of mounting device]

Next, the operation of the mounting device 1 will be explained with reference to FIGS. 6 to 8 in addition to FIGS. 1 to 5 above. Additionally, the mounting method of mounting the electronic component t in the following procedure is also an aspect of the present embodiment.

[Installation operation]

First, after the wafer ring 11, in which the electronic components t are supported through the wafer sheet S, is brought in, the process from the time the electronic components t supported by the wafer ring 11 are fully mounted is carried out. , the flowcharts of FIGS. 6 and 7 and the explanatory diagram of FIG. 8 are described. FIG. 6 shows the entire sequence of the packaging process for the electronic component t, and FIG. 7 shows the details of the sequence of the transfer process for the electronic component t in FIG. 6. Figure 8 shows an example of positioning in the placement portions 31a and 31b.

More specifically, FIG. 8 shows positioning for aligning the electronic components t disposed on the placement portions 31a and 31b and the mounting tools 43a and 43b, respectively. Figures 8 (A), (C), and (E) show positioning on the placement part 31a side, and Figures 8 (B), (D), and (F) show positioning on the placement part 31b side. It shows the appearance of . For ease of understanding, the electronic component t shows only its external appearance. The circles in the center are suction holes in the mounting portions 31a and 31b. Additionally, the mounting tools 43a and 43b are shown as dashed circles, and their centers are shown as intersections of orthogonal broken lines. Additionally, the centers of the placement portions 31a and 31b are represented by the intersection of orthogonal one-dot and chain lines, and the centers at the initial positions of the arrangement portions 31a and 31b are represented by the intersection of orthogonal two-dot and dash lines.

First, the electronic components t are taken out from the component supply unit 10 by the suction nozzles 37a and 37b of the first transfer head 37A, respectively, and placed on the placement units 31a and 31b located at the initial positions. are placed respectively. At this time, the electronic component t has a slightly reference posture (e.g., the direction along the reference axis as indicated by the dashed line in the arrangement portions 31a and 31b in FIG. 8 and the intersection point which is the center thereof). (t) The center of gravity may deviate from the correct posture.

8 (A) and (B) illustrate the electronic component t arranged in a misaligned state, and on the arrangement portions 31a and 31b, the center and central axis (indicated by a dashed-dotted line) In contrast, the direction and center of gravity position of each electronic component t are shifted.

In Fig. 8(A), the electronic component t is rotated slightly counterclockwise with respect to the initial position of the arrangement portion 31a in the figure, and its center of gravity is shifted to the right. Moreover, in FIG. 8(B), the electronic component t rotates clockwise with respect to the initial position of the arrangement portion 31b in the figure, and its center of gravity is shifted to the lower left.

In the present embodiment, from the state of (A) and (B) of FIG. 8, first, the mounting tool 43b corresponding to the placement portion 31b on the right side sets its center position to the placement portion 31b. It is moved to be positioned at the center position of the electronic component (t) placed in . FIG. 8(D) shows a state in which the mounting tool 43b is moved in the direction of the black arrow and aligned with the electronic component t on the fixing arrangement portion 31b.

The mounting tools 43a and 43b are supported on one head support body 42. For this reason, the mounting tools 43a and 43b move together. Therefore, as shown in FIG. 8(D), when the mounting tool 43b moves, the mounting tool 43a also moves in the same way.

FIG. 8C shows a state in which the mounting tool 43a moves in the direction of the black arrow (the amount of movement is the same as that of the mounting tool 43b) as the mounting tool 43b moves. The positions of the electronic component t on the mounting tool 43a and the placement portion 31a do not match. More specifically, the electronic component t disposed at a position offset from the center of the placement portion 31a is also displaced in the same way as the mounting tool 43a located directly above it. From this state, the mounting tool 43a moves due to the movement of the mounting tool 43b, and the mounting tool 43b is further shifted from the electronic component t on the placement portion 31a by this movement.

From the state in which the electronic component t and the mounting tool 43a are misaligned in this way, the electronic component t on the movable placement portion 31a is moved in the direction of the white arrow, as shown in FIG. 8(E). and aligns the position with the mounting tool 43a.

In FIG. 8(F), the mounting tool 43b is aligned with the arrangement part 31b in the same manner as in FIG. 8(D), regardless of the movement of the arrangement part 31a in FIG. 8(E). It indicates the status of .

(1) Carrying in of wafer ring (step S101)

First, as shown in FIG. 1, a new wafer ring 11 holding an electronic component t is loaded into the ring holder 12 from a storage portion (not shown), and the wafer ring 11 is placed in the ring holder 12. Fix it on the table. The wafer ring 11 positioned on the ring holder 12 is maintained with the wafer sheet S stretched by an expand mechanism (not shown) provided in the component supply unit 10.

(2) Set of substrates (step S102)

(Supply of substrate)

The substrate W held by a transfer robot (not shown) is supplied to the stage 21. The transfer robot, not shown, is provided with a transfer arm for placing and holding the substrate W, and carries the substrate W onto the stage 21 of the mounting device 1. After supplying the substrate W onto the stage 21, the transfer arm retracts from the mounting device 1. The supply process of the substrate W may be performed in parallel with the loading of the wafer ring 11, or may be performed separately.

(3) Transfer of electronic components (step S103)

(Removal of electronic components (step S201))

When the wafer ring 11 is held in the ring holder 12, the position of the electronic component t on the wafer sheet S is recognized by the wafer recognition camera 38, and the electronic component t is first extracted from the wafer ring 11. Part t is placed in the take-out position. Each time the electronic component t is taken out, the ring holder 12 moves the wafer ring 11 in pitch according to the order previously stored in the storage unit 55, and the electronic component t is sequentially moved to the take-out position. is located in

Directly above the electronic component t located in the take-out position, the suction nozzle 37a of the transfer head 37 of the first transfer device 30A is located. The Z-direction moving device 37c lowers the suction nozzle 37a, bringing the suction surface of the suction nozzle 37a into contact with the upper surface (electrode formation surface) of the electronic component t. If the suction nozzle 37a is in contact with the electronic component t, the suction nozzle 37a adsorbs and holds the electronic component t. If the suction nozzle 37a adsorbs and holds the electronic component t, the Z-direction moving device 37c raises the suction nozzle 37a, and removal of the electronic component t from the suction nozzle 37a is completed. . Then, the electronic component t to be taken out next is positioned at the take-out position. The suction nozzle 37b of the transfer head 37 of the first transfer device 30A moves directly above the electronic component t. The electronic component t is taken out using the suction nozzle 37b in the same way as the suction nozzle 37a. In this way, the adsorption and holding of the electronic components t by the suction nozzles 37a and 37b is performed sequentially for the electronic components t positioned sequentially. In addition, the electronic components t are taken out alternately by the first transfer device 30A and the second transfer device 30B.

(Mounting of electronic components (step S202))

The suction nozzles 37a, 37b of the transfer head 37 are located on the placement portions 31a, 31b of the intermediate stage 31. In this state, the suction nozzles 37a and 37b are lowered, and the electronic component t held by the suction nozzles 37a and 37b is placed on the placement portions 31a and 31b.

(Imaging of electronic components (step S203))

By imaging the electronic component t placed in the placement portions 31a and 31b using the chip recognition cameras 44a and 44b of the imaging unit 44, the posture of the electronic component t is recognized. For example, the electronic component t placed on the movable placement unit 31a shown in FIG. 8(A) is imaged by the chip recognition camera 44a corresponding to the placement unit 31a. Additionally, the electronic component t placed on the fixed placement portion 31b shown in FIG. 8(B) is imaged by the chip recognition camera 44b corresponding to the placement portion 31b. Then, for example, the outline of the image of the electronic component t is taken out, and the positional coordinates of its center of gravity are recognized. Additionally, the direction θ from each reference direction of the electronic component t disposed in each of the arrangement portions 31a and 31b is also recognized.

(Determination of reference position (step S204))

The reference decision processing unit 52, based on the recognized posture of the electronic component t, sets the mounting tool 43b of the electronic component t to that of the electronic component t placed on the fixing arrangement portion 31b. A reference position determination process is performed to move the device according to the posture. For example, as shown in FIG. 8(D), the center of the mounting tool 43b is aligned with the position of the center of gravity of the electronic component t placed on the fixed arrangement portion 31b. At this time, as shown in FIG. 8C, the mounting tool 43a also moves along with the mounting tool 43b, but at this point, the center of the mounting tool 43a is at the movable placement portion 31a. It is shifted from the center of gravity of the arranged electronic component (t). Therefore, the amount of deviation of the mounting tool 43a becomes the amount of deviation of the electronic component t placed in the placement section 31b with respect to the center of the placement section 31b.

(Determination of placement unit position (step S205))

The positioning processing unit 53 moves the movable placement unit 31a to align the electronic component t placed on the placement unit 31a with the corresponding mounting tool 43a. For example, as shown in FIG. 8(E), the center of gravity of the electronic component t placed on the movable placement portion 31a is aligned with the center of the mounting tool 43a. At this time, as shown in FIG. 8(F), since only the movable arrangement part 31a moves, the positions of the mounting tools 43a and 43b and the fixed arrangement part 31b do not change.

As described above, the position of the mounting tool 43a is moving from the standard position through the standard determination process. The reference position at this time is the initial position center of the arrangement portion 31a, as indicated by the two-dot chain line in Fig. 8(E). Accordingly, the amount of movement of this arrangement unit 31a is the amount of deviation between the position of the center of gravity of the electronic component t on the arrangement unit 31a obtained by initially capturing the image and the position of the initial position center of the arrangement unit 31a, and the arrangement It is the sum of the center position of the portion 31b and the amount of deviation of the center of gravity of the electronic component t disposed on the arrangement portion 31b obtained by imaging. In this way, based on the electronic component t disposed on the fixed placement portion 31b, a corresponding mounting tool is installed for each electronic component t disposed on the placement portions 31a and 31b. (43a, 43b) are located. In addition, as described above, the positioning of the mounting tool 43a and the positioning portion 31a are not performed step by step, but each final target position and the corresponding movement amount are calculated, and then each is performed in parallel. You may move it to adjust its position. This is good because, as will be described later, as the number of arrangement portions 31a and 31b increases, the operating time is shortened.

(Batch receipt (step S206))

After the above-described positioning, the mounting tools 43a and 43b descend toward the electronic component t on the placement portions 31a and 31b, and after attracting and holding the electronic component t, the mounting tools 43a and 43b 43b) is raised. Thereby, the mounting tools 43a and 43b receive the two electronic components t as a batch. The mounting tools 43a and 43b can be received with their respective centers aligned with the center of gravity of the electronic component t through the above-described reference determination process and placement portion position determination process. Here, in parallel with the delivery of the electronic component t, the second transfer device 30B takes out the electronic component t and transfers it to the intermediate stage 31 in the same manner as the first transfer device 30A. It is done.

(4) Mounting of electronic components (steps S104, S105)

(detection and movement of electronic components)

When the mounting tools 43a and 43b receive the electronic component t, the mounting tools 43a and 43b move toward the substrate W. At this time, according to the direction from each reference direction of the electronic component t disposed in each of the arrangement portions 31a and 31b recognized in step S203, each electronic component t is moved by a rotation device (not shown). Adjust the direction by rotating it to the reference direction. That is, positioning of the electronic component t held by the mounting tools 43a and 43b in the θ direction is performed.

(Installation of electronic components)

The first mounting head 43A of the first mounting portion 40A first attaches the electronic component t held in the mounting tool 43a among the mounting tools 43a and 43b to the board recognition camera 43f. Based on the recognized position and direction of the substrate W, it moves to position the electronic component t held by the mounting tool 43a on the mounting position to be mounted. Then, the mounting tool 43a descends to bring the electronic component t into contact with the substrate W, releases the suction, and rises to separate the electronic component t from the mounting tool 43a, thereby making the electronic component t contact the substrate W. ), the electronic component (t) is mounted.

Mounting is performed by joining the electronic component t to the substrate W. This bonding is performed using the adhesive force of an adhesive sheet or die attach film (DAF) previously attached to the surface of the substrate W or the lower surface of the electronic component t. The joining of the electronic components t may be performed by providing a heater on the stage 21 and pressing the electronic components t against the heated substrate W.

Once the mounting using the mounting tool 43a is completed, the electronic component t held by the mounting tool 43b is placed on the next mounting position and mounted in the same manner as above. The first mounting head 43A, which has completed mounting the electronic component t using the mounting tools 43a and 43b, moves toward the intermediate stage 31.

Here, since the electronic component t is transferred by the first transfer device 30A in parallel with the mounting process of the electronic component t by the first mounting unit 40A, the first mounting head ( When 43A) moves onto the placement portions 31a and 31b of the intermediate stage 31, the electronic component t to be mounted next is placed on the placement portions 31a and 31b. Accordingly, the first mounting head 43A, which has moved onto the intermediate stage 31, immediately receives the electronic component t from the placement portions 31a and 31b and performs the mounting again. Thereafter, this operation is repeatedly performed until mounting of the electronic component t on one half area of the substrate W is completed.

Even while the electronic component t is being mounted using the mounting tools 43a and 43b of the first mounting head 43A, the placing portions 31a and 31a of the intermediate stage 31 are moved by the second transfer device 30B. At the stage where the transfer of the electronic component t to 31b) is completed, mounting of the electronic component t by the second mounting head 43B of the second mounting unit 40B begins. This operation is the same as the above-described process described in the example of the first mounting unit 40A. By the second mounting unit 40B, mounting of the electronic component t on the other half of the substrate W is repeatedly performed until completion.

The first mounting section 40A and the second mounting section 40B divide the area on the substrate W into two on the left and right (X direction), and each area is divided into two to mount the electronic component t. Therefore, the first mounting head 43A of the first mounting section 40A and the second mounting head 43B of the second mounting section 40B not only perform the above-described processes alternately, but also perform them in parallel. It may be possible. The above mounting operation is repeatedly performed for all mounting positions on the substrate W until mounting of the electronic component t is completed (NO in step S105).

(5) Exchange of substrate (export, import) (steps S105, S106)

If the mounting of the electronic component t is completed for all mounting positions on the substrate W (YES in step S105), the transfer unit 30 and the mounting unit 40 are temporarily stopped, and the mounting of the electronic component t is completed. The completed substrate W is unloaded from the stage 21, and the new substrate W is loaded onto the stage 21 (step S106). The substrate W is unloaded from the stage 21 by the same or different transport robot as the transport robot (not shown) described above.

(6) Exchange of wafer ring (steps S107, S108)

As described above, by repeatedly mounting the electronic component t on the substrate W, when the electronic component t on the wafer ring 11 disappears (YES in step S107), the wafer ring 11 It is exchanged for a new wafer ring 11 (step S108).

[Action effect]

(1) The mounting device 1 for the electronic component t of the present embodiment includes a plurality of suction nozzles (holding portions) 37a, 37b that hold the electronic component t, and suction nozzles 37a, 37b. A plurality of arrangement parts 31a, 31b for arranging the electronic components t held respectively, a placement part moving mechanism 340 for moving the arrangement parts 31a in the horizontal direction, and arrangement parts 31a, 31b. chip recognition cameras (imaging units) 44a, 44b that capture images of the electronic components t placed in and recognize the horizontal posture of the electronic components t, and are disposed on a plurality of placement units 31a, 31b. A plurality of mounting tools 43a, 43b that each hold the electronic components t and mount them on the substrate W, and a mounting tool moving mechanism 4 that moves the plurality of mounting tools 43a, 43b at once. and a control device 50.

The control device 50 moves the placement unit 31a based on the recognition results of the chip recognition cameras 44a and 44b, thereby moving the electronic component t placed on the placement unit 31a to the corresponding mounting tool. Electronic components ( It has a receipt processing unit 54 that executes the batched receipt processing of t).

For this reason, for example, after positioning the mounting tool 43b on the electronic component t placed on the placement section 31b, and then positioning the placement section 31a on the mounting tool 43a, the mounting tools 43a and 43b ) can receive the plurality of electronic components t in the placement portions 31a and 31b in batches with high precision. Accordingly, there is no need for each mounting tool 43a, 43b to individually position and receive the electronic component t individually, thereby improving throughput and increasing productivity.

As described above, variations occur in the positions and directions of the electronic components placed in the placement unit. For example, regarding the position, a deviation of 100 μm to 200 μm occurs due to a misalignment with the suction nozzle when taking out the electronic component, a misalignment during movement, a misalignment when placing the electronic component, etc. Additionally, when the transfer unit takes out a plurality of electronic components from the plurality of holding units and attempts to place the electronic components in the plurality of placement units, differences in the positions and directions of the electronic components appear even among the plurality of placement units. In this state, if multiple mounting tools receive electronic components at once, deviations will occur in the positions and directions of the electronic components held by each mounting tool, and it will take time to determine the position when mounting each electronic component on the board. Otherwise, positioning accuracy deteriorates. In the present embodiment, each mounting tool 43a, 43b can be received collectively with each electronic component t in a positioned state, so there is no possibility that there will be a deviation in the position or direction of each received electronic component t. This leads to a reduction in positioning time during mounting and an improvement in positioning accuracy.

Moreover, especially when the electronic component is small, the part holding the electronic component of the mounting tool also becomes small, so if there is a positional misalignment, there are cases where the electronic component cannot be received by the mounting tool. Additionally, even if you are able to receive it, the risk of dropping it while moving increases. When the electronic component is an indicator such as a mini LED or micro LED, the pitch between the electronic components is also very narrow, so the holding portion needs to be made even smaller. Such cases where the gap between adjacent electronic components is narrow also occur in the mounting of MCP or the like. In this embodiment, before the plurality of electronic components t are collectively received by the mounting tools 43a and 43b, each electronic component t is positioned with respect to each mounting tool 43a and 43b, so that the receiving The possibility of a mistake or of the received electronic component t falling can be reduced.

(2) In this embodiment, among the plurality of placement parts 31a and 31b, one placement part 31b is fixed. Furthermore, based on the recognition result of the imaging unit, the control device 50 selects the mounting tool 43b corresponding to the fixed placement portion 31b among the plurality of mounting tools 43a and 43b to the fixed placement portion ( It has a reference decision processing unit 52 that performs reference decision processing to move the electronic component t disposed in 31b) according to the posture, and the positioning processing section 53 is configured to determine the position of the mounting tool 43b by the reference decision processing. Position determination processing is performed, including the movement amount.

For this reason, the electronic component t placed on the fixed placement portion 31b is used as a positioning target for the mounting tool 43b, and the mounting tool 43a is used as the electronic component t placed on the movable placement portion 31a. The position can be determined by using the part (t) as the positioning target. Since the fixed placement part 31b does not require the placement part moving mechanism 340, the structure can be simplified and the device cost can be reduced.

[Variation example]

The present embodiment is not limited to the above-described aspects and also includes the following modifications.

(1) All of the placement parts 31a and 31b may be provided with a placement part moving mechanism 340 so that they are movable in the horizontal direction. As a result, as shown in Figures 9 (A) and (B), the electronic components t arranged in each arrangement portion 31a and 31b are as shown in Figures 9 (C) and (D). , by moving each of the arrangement parts 31a and 31b, they can be positioned on the corresponding mounting tools 43a and 43b, and all of the electronic components t can be received at once. In this way, the throughput of the device can be improved and productivity can be increased.

(2) The number of mounting tools and corresponding placement parts that move together is not limited to two. It is okay to have 3 or more. For example, as shown in Figures 10 (A), (B), and (C), three mounting portions 31a, 31b, and 31n are provided, and one mounting portion 31b is fixed. As shown in FIG. 10(F), the mounting tool 43b is positioned on the electronic component t arranged in the placement portion 31b. At this time, as shown in FIGS. 10(D) and 10(E), the mounting tools 43a and 43n also move along the mounting tool 43b. As shown in FIGS. 10(G) and 10(H), the placement portions 31a and 31n are moved to position each electronic component t on the mounting tools 43a and 43n. Thereby, the three mounting tools 43a, 43b, and 43n can collectively receive the electronic components t from the three placement parts 31a, 31b, and 31n. Furthermore, for example, a placement part moving mechanism 340 is provided and movable in each of the three placement parts 31a, 31b, and 31n, and the electronic component t placed in each is moved to the three mounting tools 43a, 43b. , 43n), and the mounting tools 43a, 43b, and 43n may receive the electronic component t collectively. In this way, the throughput of the device can be improved and productivity can be increased.

(3) The transfer head 37 is provided with a reversal mechanism to invert the suction nozzles 37a and 37b, and the inverted electronic component t is transferred to the mounting tools 43a and 43b. 43b) may be configured so that it can be mounted. As a result, it can be configured as a device that can be used both for mounting by inversion without using the placement portions 31a and 31b and for mounting without inversion using the placement portions 31a and 31b.

(4) A camera is provided between the placement portions 31a and 31b to the stage 21 to capture images of the electronic components t held by the mounting tools 43a and 43b from below and to recognize the holding posture. You may do so. When the mounting tools 43a and 43b receive the electronic component t from the placement portions 31a and 31b, even if there is a change in the posture of the electronic component t, the change in posture can be corrected for mounting, thereby improving mounting accuracy. improves. In this case, as in (3) above, when the placement portions 31a and 31b are not used, the parts are exchangeable so that a camera (lower camera) is provided instead of the placement portions 31a and 31b. It's also good. By exchanging these parts, it is possible to secure space for inverting and transferring the electronic component t. Additionally, when parts are replaced, the configuration can be simplified and space can be saved, and the device can be constructed at low cost.

In addition, regardless of parts replacement, the transfer unit 30 is provided with placement units 31a, 31b and a lower camera, so a unit in which the placement units 31a, 31b retract and the lower camera advances can be adopted. there is. In this way, when the arrangement parts 31a, 31b and the lower camera are automatically switched, the switching operation becomes easy and the time during which the device is not in operation for switching can be shortened.

(5) In the above aspect, the mounting tools 43a and 43b were provided with a rotation device (theta drive mechanism) to enable positioning of the electronic component t in the theta direction. However, a θ drive mechanism may be provided in the placement portions 31a and 31b to enable positioning of the electronic component t placed on the placement tables 311 and 312 in the θ direction. As a result, the θ drive mechanism can be omitted from the mounting tools 43a and 43b, enabling weight reduction and simplification. As a result, vibration during movement and stop position error can be reduced, and speed can be increased. Additionally, mounting precision can be improved.

In addition, when the θ drive mechanism is provided in the mounting tools 43a and 43b, while moving the electronic component t from the placing parts 31a and 31b to the stage 21, Since correction in the θ direction can be made based on the recognition result of the direction of the electronic component t, correction can be made during movement time, and there is no need to secure time for separate correction, making it efficient. . In addition, when the mounting tools 43a and 43b receive the electronic component t, they are held based on the position of the center of gravity of the electronic component t, so that the position of the center of gravity and the center of rotation in the θ direction can be aligned. Therefore, even if correction is made in the θ direction, the position in the XY direction does not change. Since this does not change in the plurality of mounting tools 43a and 43b, displacement in the XY direction of the electronic component t in each mounting tool 43a and 43b due to rotation in the θ direction does not occur, so mounting accuracy deterioration can be suppressed. Additionally, the θ drive mechanism may be provided on both the mounting tools 43a and 43b and the placement portions 31a and 31b.

[Other Embodiments]

Although the embodiment of the present invention and modified examples of each part have been described, this embodiment and modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, changes, and combinations can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims.

1: Mounting device 1a: Base portion
2: Electronic component 4: Mounting tool moving mechanism
4A: First mounting tool moving mechanism 4B: Second mounting tool moving mechanism
10: parts supply part 10a: base part
11: wafer ring 12: ring holder
20: stage part 21: stage
22: Stage moving mechanism 30: Transfer unit
30A: transfer device 30B: transfer device
31: intermediate stage 31A: first intermediate stage
31B: second intermediate stage 31a, 31b, 31n: arrangement section
33: Y direction movement device 34: Y direction movement block
35: Support 36: X direction moving body
37: transfer head 37A: first transfer head
37B: Second transfer head 37a, 37b: Suction nozzle
37c, 37d: Z direction movement device 37e, 37f: reversal mechanism
38: wafer recognition camera 40: mounting unit
40A: first mounting portion 40B: second mounting portion
41: support frame 41a: Y direction moving device
42: Head support 42a: X direction moving device
43: Mounting head 43A: First mounting head
43B: Second mounting head 43a, 43b, 43n: Mounting tool
43c, 43d: Z direction movement device 43f: Substrate recognition camera
44: imaging unit 44a, 44b: chip recognition camera
44e, 44f: XY movement device 44g: Camera support frame
50: control device 51: mechanism control unit
52: Reference decision processing unit 53: Position decision processing unit
54: Receipt processing unit 55: Storage unit
61: input device 62: output device
311, 312: placement table 320: support base
330: Fixing stand 340: Placement moving mechanism
341, 344: Guide part 342, 345: Slide part
343, 346: driving unit 347: transmission unit

Claims (5)

a plurality of holding units that hold electronic components,
a plurality of placement units for arranging the electronic components each held by the plurality of holding units;
a placement unit moving mechanism that moves the placement unit in a horizontal direction;
an imaging unit that captures an image of the electronic component disposed in the placement unit and recognizes a horizontal posture of the electronic component;
a plurality of mounting tools that respectively hold the electronic components arranged in the plurality of arrangement sections and mount them on a board;
a mounting tool moving mechanism that moves a plurality of the mounting tools in batches;
controller
Including,
The control device is,
a positioning processing unit that performs positioning processing to position the electronic component placed in the placement unit with respect to the corresponding mounting tool by moving the placement unit based on the recognition result of the imaging unit;
A receiving processing unit that executes batch receiving processing of the electronic components placed in the mounting tool in the plurality of placement units that have undergone the positioning process.
A mounting device for electronic components, characterized in that it has a. The electronic component mounting device according to claim 1, wherein one of the plurality of arrangement portions is fixed. The method of claim 2, wherein the control device:
Based on the recognition result of the imaging unit, a reference decision process of moving the mounting tool corresponding to the fixed placement part among the plurality of mounting tools in accordance with the posture of the electronic component placed in the fixed placement part. It has a standard decision processing unit that executes,
The electronic component mounting device, wherein the positioning processing unit executes the positioning processing including the movement amount of the mounting tool by the reference determining processing. a plurality of holding units that hold electronic components,
a plurality of placement units for arranging the electronic components each held by the plurality of holding units;
a placement unit moving mechanism that moves the placement unit in a horizontal direction;
an imaging unit that captures an image of the electronic component disposed in the placement unit and recognizes a horizontal posture of the electronic component;
a plurality of mounting tools for holding the electronic components arranged in the plurality of arrangement sections and mounting them on a board;
Mounting tool moving mechanism for moving a plurality of the mounting tools at once
A mounting device for electronic components comprising: a method for mounting the electronic components,
Positioning processing for positioning the electronic component arranged in the arrangement unit with respect to the corresponding mounting tool by moving the arrangement unit based on the recognition result of the imaging unit;
Receiving processing to collectively receive the electronic components from the plurality of positioned placement units to the mounting tool corresponding to each.
A method of mounting electronic components, characterized in that carrying out. The method of claim 4, wherein one of the plurality of arrangement units is fixed,
Executing a reference determination process to move the mounting tool corresponding to the fixed arrangement part among the plurality of mounting tools according to the posture of the electronic component arranged in the fixed arrangement part,
A method of mounting an electronic component, wherein the position determination process is performed including the movement amount of the mounting tool by the reference determination process.

Images