JP2022165725A - Device mounting apparatus and device mounting method using the same - Google Patents

Abstract

To provide a device mounting apparatus and device mounting method which can accurately and collectively transfer a device to a mounting substrate being the transfer destination from a transfer source sheet.SOLUTION: A device mounting apparatus comprises: a roll; a table which can move in the horizontal direction and rotate around an axis in the vertical direction; a camera for roll which images the roll surface; a camera for table which images the table surface; and a control device. An adhesive sheet, a transfer source sheet, and a mounting substrate having a mount part being the transfer destination are placed on the table. The control unit acquires position information from an image of the device by the camera for roll, acquires position information from an image of the mount part by the camera for table and controls alignment between the roll and the table on the basis of the position information of the mount part and the device.SELECTED DRAWING: Figure 1

Description

The present invention relates to a device mounting apparatus and a device mounting method using the same.

Conventionally, when transferring a device such as a semiconductor device, the devices arranged in alignment on a transfer source sheet are picked up one by one and mounted on a transfer destination substrate (mounting substrate) (Patent Document 1). . However, for a product in which a large number of devices are aligned, such as a display device, if the devices are transferred one by one to the substrate, a problem arises in that the manufacturing period is lengthened. Therefore, in order to reduce the time required for transfer, a mounting method has been proposed in which a plurality of devices are adhered to an adhesive carrier, and the devices adhered to the carrier are collectively transferred to a destination substrate (Patent Document 2). 2-5).

Japanese Patent Application Laid-Open No. 2002-111289 JP 2018-26540 A Japanese Patent Application Publication No. 2019-521530 JP-A-2007-27693 JP 2013-183163 A

When multiple devices are transferred from the source sheet to the destination board via a carrier, the position of the carrier that mediates the transfer is controlled to catch the fine devices and release them on another board. The action of doing is required. Therefore, in order to actually operate the device, a high position control technique is required. This tendency becomes more pronounced as the size of the device and the arrangement interval become smaller.
When transferring using a pick-up device as disclosed in Patent Document 1, it is possible to position-control each device using a camera. However, when transferring devices collectively, it is not possible to adopt the position control as in Patent Document 1.
Further, for example, a large number of fine semiconductor devices having sides of about several tens of μm, such as micro LEDs (μLEDs), are arranged on the first substrate at intervals of several μm, and are mounted on a carrier having a size of several tens to several hundred mm. When primary transfer is performed on an adhesive sheet having a thickness of, for example, 0.3 mm attached to a carrier, and secondary transfer is performed on a second substrate having the same size, the pressing amount of the adhesive sheet attached to the carrier is, for example, several μm or less may be required. In such a case, the positional accuracy of the carrier with respect to the source substrate and the destination substrate is required to be ±2 μm or less.

The present invention has been made in view of the above, and uses a device mounting apparatus capable of accurately controlling the position of a device from a transfer source sheet to a transfer destination mounting substrate and transferring them all at once. The object is to provide a device mounting method.

A device mounting apparatus according to the present invention includes:
a cylindrical roll (2) rotatable about an axis of rotation (J);
a table (4, 14) having a table drive mechanism allowing horizontal movement and rotation about a vertical axis;
a roll camera (20) for imaging the surface of the roll (2);
table cameras (21, 22) for imaging the surface of the table (4);
a controller (80),
The tables (4, 14) include an adhesive sheet (1) to be attached to the roll (2), a transfer source sheet (3) having a device (C) on its surface, and a mount section to which the device (C) is transferred. A mounting substrate (13) having (T) on the surface is placed,
The control unit
Position of the device (C) by processing an image of the device (C) by the roll camera (20) in a state of being adhered to the adhesive sheet (1) adhered to the roll (2) get information,
Acquiring positional information of the mount portion (T) by processing an image of the mount portion (T) by the table cameras (21, 22) while the mount portion (T) is placed on the table (2);
The alignment between the roll (2) and the table (4, 14) is controlled based on the positional information of the mount (T) and the positional information of the device (C).

By using the device mounting apparatus having such a configuration, it is possible to accurately transfer the device C onto the mounting substrate 13 using the roll 2 to which the adhesive sheet 1 is attached as an intermediate medium.
Moreover, since the adhesive sheet 1 is attached to the surface of the roll 2, the adhesive sheet 1 can be easily replaced, and the surface of the roll 2 can maintain an appropriate adhesive force.

Further, the device mounting apparatus according to the present invention is
a first distance measuring device (6) for measuring the height of the mounting portion (T) of the mounting substrate (13) placed on the table (4, 14);
A second distance measuring device (7a, 7b) for measuring the distance between the table (4, 14) and the device (C) on the adhesive sheet (1) attached to the roll (2). It is characterized by

With such a configuration, when the device C is secondary-transferred onto the mounting board 13, it is possible to precisely control the pressing amount.

Further, the device mounting apparatus according to the present invention is
The roll (2) is characterized in that it is partially covered with the adhesive sheet (1).

With such a configuration, it is possible to easily calibrate the sensitivity of the roll camera 20 and maintain the distance measurement accuracy of the first distance measuring device 6 and the second distance measuring devices 7a and 7b. .

Further, the device mounting apparatus according to the present invention is
Said table (4, 14) is characterized by having a vacuum chuck.

With such a configuration, the adhesive sheet 1 can be easily attached to the roll 2 .

A device mounting method using a device mounting apparatus according to the present invention includes:
A step S1 of sticking the adhesive sheet (1) on the roll (2);
a step S2 of primarily transferring the device (C) on the transfer source sheet (3) to the adhesive sheet (1);
a step S3 of measuring the position of the device (C) on the adhesive sheet (1);
a step S4 of secondary transfer of the device (C) on the adhesive sheet (1) to the mounting substrate (13),
In step S3,
An image of the device (C) on the adhesive sheet (1) photographed by the roll camera (20) is processed to obtain position information of the device (C),
In step S4,
an image of the mounting portion (T) on the mounting substrate (13) photographed by the table camera (21) is processed to acquire positional information of the mounting portion;
Obtaining the height from the table (4, 14) to the mount portion (T) on the mounting board (13) by the first distance measuring device (6),
Acquiring the distance from the table (4, 14) to the device (C) on the adhesive sheet (1) attached to the roll (2) by the second distance measuring device (7a, 7b),
aligning the mounting board (13) placed on the table (4, 14) with respect to the roll (2) by collating the positional information of the device (C) with the positional information of the mounting portion;
Based on the proximity distance calculated from the height from the table (4, 14) to the mount part (T) and the distance from the table (4, 14) to the device (C), the device (C) and the Bringing the roll (2) close to the table (4, 14) so that it can come into contact with the mount part (T),
The device (C) is transferred to the mount (T) by relatively moving the tables (4, 14) while rotating the roll (2).

With such a configuration, it is possible to transfer from the transfer source sheet 3 to the mounting substrate 13 accurately and collectively through the adhesive sheet 1 attached to the roll 2, and the adhesive sheet 1 can be replaced. It is easy and the device C can be transferred to the mounting board 13 under appropriate conditions.

According to the present invention, it is possible to provide a device mounting apparatus and a device mounting method using this apparatus, which can accurately position-control devices from a transfer source sheet to a transfer destination mounting board and transfer the devices all at once. can be done.

FIG. 1A is a perspective view showing the main configuration of the device mounting apparatus 100, and FIG. 1B is a configuration diagram of the main components of the device mounting apparatus 100 and a control device 80 that controls them. . FIG. 2A is a plan view showing the transfer source sheet 3 on which the devices C are arranged before transfer. FIG. 2B is a plan view showing a mounting substrate (transfer destination substrate) 13 on which a transfer destination chip (mount portion) T is formed. FIG. 3A is a schematic diagram illustrating the relative positional relationship between the first table 4 and the roll 2 in each step of primary transfer, and FIG. FIG. 4 is a schematic diagram illustrating a relative positional relationship between a second table 14 and rolls 2; FIG. 4A is a perspective view showing the adhesive sheet 1 before being attached to the roll 2, and FIG. 4B is an enlarged cross-sectional view showing the adhesive sheet 1 fixed to the first table 4 by suction. 4(C) is a perspective view showing a state after the adhesive sheet 1 is attached to the roll 2, and FIG. 4(D) is a roll 2 to which a plurality of adhesive sheets 1 are attached and the first table. 4 is a sectional view showing 4. FIG. FIG. 5(A) is a schematic diagram showing a state immediately before primary transfer in which the first table 4 is relatively moved while rotating the roll 2 to which the adhesive sheet 1 is attached. (C) is a partially enlarged cross-sectional view schematically explaining how the device C is transferred to the adhesive sheet 1 by primary transfer. FIG. 6A is a schematic diagram showing a state immediately before secondary transfer in which the second table is relatively moved while rotating the roll 2, and FIGS. 6B and 6C are mounting substrates. 13 is an enlarged cross-sectional view schematically explaining how a device C is secondarily transferred onto a chip T on 13. FIG. 7A, 7B, and 7C are plan views showing an example in which three types of devices C are sequentially transferred onto a chip T on the mounting substrate 13. FIG. FIG. 8A is a schematic diagram showing a state in which the second camera 21 is installed above the first table 4, and FIG. FIG. 8C is an enlarged view schematically showing the field of view FL21. FIG. FIG. 9(A) is a plan view schematically showing an example of an image observed by the two second cameras 21 of the devices C arranged at an angle on the first table 4. FIG. 9B) is a schematic diagram showing the relationship between the second camera 21 and the first table 4, and FIG. 9C is a plan view schematically showing the field of view of the second camera 21 on the transfer source sheet 3. It is a diagram. FIG. 10A is a schematic diagram showing a state after the device C is transferred to the adhesive sheet 1 of the roll 2 by primary transfer, and FIG. 2 is a schematic diagram showing a preparatory stage for secondary transfer to the mounting substrate 13 on the table 14 of No. 2. FIG. FIG. 11 is a flowchart showing the overall flow of the device mounting method. FIG. 12 is a flowchart for explaining step S1 (adhesion of adhesive sheet) by disassembling it into more detailed steps. FIG. 13 is a flowchart for explaining step S2 of primarily transferring the device C from the transfer source sheet 3 to the adhesive sheet 1 attached to the roll 2. As shown in FIG. FIG. 14 is a flowchart for explaining the step S3 of measuring the position of the device C on the adhesive sheet 1 attached to the roll 2 and the step S4 of secondary transfer from the adhesive sheet 1 onto the chip T of the mounting board 13. FIG. be.

Embodiments of the present invention will be described below with reference to the drawings. However, none of the following embodiments provide a restrictive interpretation in identifying the gist of the present invention. Also, the same reference numerals are given to members of the same or similar type, and description thereof may be omitted.

(First Embodiment) -Device Mounting Apparatus-
FIG. 1A is a perspective view showing the main configuration of the device mounting apparatus 100, and FIG. 1B is a configuration diagram of the main components of the device mounting apparatus 100 and a control device 80 that controls them. .
The device mounting apparatus 100 includes a roll 2, a first table (surface plate) 4 on which a transfer source sheet 1 having a device C to be transferred is placed and which can be horizontally moved, and a transfer destination of the device C. A second table (surface plate) 14 on which the mounting substrate 13 is placed and which can move horizontally, a first camera 20, a second camera 21 and a third camera 22, and a control device 80 for controlling them. Prepare.

The second camera 21 (first table camera) and the third camera 22 (second table camera) are table cameras used for imaging the surfaces of the first table 4 and the second table 14. The first camera 20 is a roll camera used for imaging the surface of the roll 2 .
The field of view of the first camera 20 is mainly on the roll 2, the field of view of the second camera 21 is mainly on the first table 4, and the field of view of the third camera 22 is mainly on the second table 14. It is above. The first camera 20 mainly images the surface of the roll 2 or its stuck material, the second camera 21 mainly images the surface of the first table 4 or its load, and the third camera 22 mainly The surface of the second table 14 and its load can be imaged immediately. Both cameras are installed above the surfaces of the first table 4 and the second table 14 and do not interfere with the respective table driving mechanisms of the first table 4 and the second table 14 .

The roll 2 has a cylindrical shape with a circular cross section, and shafts 2S at both ends are supported by bearings (not shown) so as to be rotatable around its center (rotational axis J). The roll 2 can be moved up and down and rotated by a roll driving mechanism having a lifting mechanism and a rotating mechanism (not shown). Specifically, rotational motion is transmitted to the shaft 2S by a rotation mechanism, and the bearings supporting the shaft 2S of the roll 2 are movable in the vertical direction (the Z-axis direction in the figure) by the lifting mechanism. Therefore, the lifting mechanism can move the roll 2 in the vertical direction while maintaining the rotation axis J horizontally.
The roll drive mechanism is controlled by controller 80 . The position of the roll 2 in the Z-axis direction (vertical direction) by the lifting mechanism can be controlled by a common coordinate system (or absolute coordinates) owned by the control device 80 .
The rotation mechanism that enables rotation of the roll 2 can also be controlled by the control device 80, and the rotation angle can be controlled by a common coordinate system owned by the control device 80. FIG.

The first table 4 and the second table 14 can be translated in the direction of the rotation axis J (the X-axis direction in the figure) and the direction perpendicular to the rotation axis J (the Y-axis direction in the figure).
For example, by arranging a guide rail in the Y-axis direction in the drawing and moving the first table 4 and the second table 14 along the guide rail, the first table 4 and the second table 14 can be accurately moved in the Y-axis direction. table 14 can be moved. When the guide in the Y-axis direction is determined, a stage movable in the Y-axis direction is provided, and a moving mechanism in the X-axis direction is provided on this stage to horizontally move the first table 4 and the second table 14. It can be moved in the X-axis direction and the Y-axis direction.

Furthermore, the first table 4 and the second table 14 are configured to be rotatable around a rotation axis parallel to the Z-axis direction (vertical direction). For example, by providing a stage movable in the Y-axis direction with a rotating mechanism about the Z-axis, the stage can be configured to be rotatable about the Z-axis.

In this way, the first table 4 and the second table 14 each have a rotation mechanism that rotates around the Z axis for angle adjustment and a translation mechanism that translates in the Y direction (Y direction movement mechanism). and a transverse movement mechanism (X-direction movement mechanism) for moving in the X-direction.
The three motions, movement in two horizontally orthogonal axes (X-axis and Y-axis) and rotation about the vertical direction (Z-axis), are independently controlled.

These drive mechanisms can be driven by commands from the control device 80 .
For example, a servomotor or the like is used as a driving device for the rotation mechanism, the translational movement mechanism, and the transverse movement mechanism, so that the rotation angle, the amount of translational movement, and the amount of transverse movement can be accurately controlled.
The control device 80 can control all rotating mechanisms, translational movement mechanisms, and transverse movement mechanisms by using the common coordinate system of the device mounting apparatus 100 .

The first table 4 and the second table 14 can reciprocate between a position separated from the roll 2 in a direction parallel to the Y-axis and a position below the roll 2 by means of a translation mechanism.
A distance measuring device (displacement meter) 6 is provided above the movement path of the first table 4 and the second table 14 along the direction parallel to the Y-axis.
The distance measuring device 6 is preferably placed close to the center of the roll 2 in the X-axis direction so as not to interfere with the roll 2 . The measurement area of the distance measuring device 6 is set downward in the vertical direction.
The distance measuring device 6 can measure the distance between the distance measuring device 6 and the surfaces of the first table 4 and the second table 14. For example, a known displacement meter such as a sensor using a laser beam can be used. can be done. Further, the distance measuring device 6 can also measure the distance to the surface of the load placed on the first table 4 or the second table 14, and the distance to the surface of the load placed on the first table 4 or the second table 14 The height of the upper load can also be measured. For example, the distance measuring device 6 measures the film thickness of the adhesive sheet 1 placed on the first table, the film thickness of the transfer source sheet 3, the surface of the transfer source sheet 3 from the surface of the first table (or the surface of the device C). ) and the height from the surface of the second table 14 to the surface of the chip T on the mounted substrate 13 can be measured.

The distance measuring device 6 may be composed of a single sensor, or may be a one-dimensional array sensor in which sensors are arranged in a straight line for the purpose of improving accuracy.
Although the use of a two-dimensional array sensor in which the sensors are aligned on a two-dimensional plane as the distance measuring device 6 is not excluded, since the first table 4 and the second table 14 are provided with a moving mechanism, they can be arranged in a straight line. Aligned array sensors allow two-dimensional planar position detection.

Further, the first table 4 is provided with distance measuring devices 7a and 7b for measuring the distance between the first table 4 and the roll 2, as will be described later. Also, the second table 14 can be provided with distance measuring devices 7a, 7b for measuring the distance between the second table 14 and the roll 2. FIG.
The measurement areas of the distance measuring devices 7a and 7b are set vertically upward.
Known displacement gauges such as sensors using laser beams can be used as the distance measuring devices 7a and 7b.

As shown in FIG. 1B, the control device 80 includes an arithmetic unit that performs arithmetic processing, a storage device that stores control programs and data, and components and signals of the device mounting apparatus 100 controlled by the control device 80. An IO unit for input/output is provided.

The control device 80 receives image signals, which are output signals from the first camera 20, the second camera 21 and the third camera 22, performs image processing, and stores the processing results and the like in a storage device. It also receives output signals from the distance measuring device 6 and the distance measuring devices 7a and 7b, calculates various distances, and saves the calculation results in a storage device.
Further, the control device 80 controls the X-axis direction driving mechanism (transverse movement mechanism), the Y-axis direction driving mechanism (translational movement mechanism) and the rotation driving mechanism of the first table 4, and the X-axis direction driving mechanism of the second table 14. mechanism, the Y-axis drive mechanism and the rotary drive mechanism can be controlled and driven. Further, the control device 80 can control and drive the rotation driving mechanism and the lifting mechanism of the roller 2 .
The storage device stores a flow sequence (control program) for transferring the device C from the transfer base sheet 1 to the mounting substrate 13, and the control device 80 follows the flow sequence to create the first table 4, the second table 14 and the Roller 2 can be controlled.

Note that the first camera 20, the second camera 21, and the third camera 22 may be configured to be movable in a direction parallel to the rotation axis J of the roll 2 (X-axis direction). In that case, the control device 80 controls the moving devices of the first camera 20 , the second camera 21 and the third camera 22 .

FIG. 2A is a plan view showing the transfer source sheet 3 on which the devices C are arranged before transfer. FIG. 2B is a plan view showing a mounting substrate (transfer destination substrate) 13 on which a chip (mount portion) T to which the device C is transferred is formed. Alignment marks 5 for alignment are provided around the mounting substrate 13 . Examples of the chip T include wiring, connectors, switching elements, semiconductor elements, and the like.

A plurality of devices C are aligned and arranged at predetermined intervals in the orthogonal X-axis direction and Y-axis direction. That is, the plurality of devices C are arranged on lattice points, arranged at a constant pitch Cx in the X-axis direction, and arranged at a constant pitch Cy in the Y-axis direction.
Similarly, a plurality of chips T are aligned and arranged at predetermined intervals in the orthogonal X-axis direction and Y-axis direction. A plurality of devices T are arranged on lattice points, arranged at a constant pitch Tx in the X-axis direction and at a constant pitch Ty in the Y-axis direction.
Since the devices C are collectively transferred from the transfer source sheet 3 to the mounting substrate 13, Cx=nTx and Cy=mTy. However, n and m are natural numbers.

The first table 4 and the second table 14 are provided with chucking mechanisms, such as vacuum chucks. The first table 4 and the second table 14 can place and fix the transfer source sheet 3 and the mounting substrate 13, respectively, by a chucking mechanism.

The basic operation of the device mounting apparatus 100 will be described below with reference to the drawings.

FIG. 3 shows primary transfer in which the device C is transferred (transferred) from the transfer source sheet 3 to the adhesive sheet 1 on the roll 2, and secondary transfer in which the device C is transferred (transferred) from the adhesive sheet 1 on the roll 2 to the mounting board 13. FIG. 4 is an explanatory diagram showing an outline of next transfer;
FIG. 3A is a diagram for explaining the relative positional relationship between the first table 4 and the roll 2 in each step of primary transfer, and FIG. 2 is a diagram for explaining the relative positional relationship between the table 14 of No. 2 and the roll 2. FIG.
An outline of primary transfer and secondary transfer will be described below.

<Primary transfer>
The outline of the primary transfer will be described below in order of steps with reference to FIG. The main steps of primary transfer are as follows.
(1) The first table 4 is advanced toward the roll 2, moved to the transfer start position, and the roll 2 and the first table 4 are aligned.
(2) The roll 2 is lowered to a position where the adhesive sheet 1 attached to the roll 2 can contact the device C on the transfer source sheet 3 .
(3) Rotate the roll 2, move the first table 4 parallel in synchronization with the rotation of the roll 2, and transfer (transfer) the device C on the transfer source sheet 3 to the adhesive sheet 1 attached to the roll 2. to start.
(4) The devices C on the transfer source sheet 3 are transferred (transferred) row by row onto the adhesive sheet 1 attached to the roll 2 . After the transfer of all the devices C on the transfer source sheet 3 to the adhesive sheet 1 is completed, the rotation of the roll 2 and the movement of the first table 4 are stopped.
(5) Raise roll 2;
(6) Rotate the roll 2, move the first table 4, and return to the origin (return to the home position).
It should be noted that this indicates a relative positional relationship.
The roll 2 and the first table 4 may be brought closer or farther in the horizontal or vertical direction.
The relationship between the second table 14 and the roll 2 is the same.

<Secondary transfer>
The outline of the secondary transfer will be described below in order of steps with reference to FIG. 3(B). The main steps of secondary transcription are as follows.
(1) Advance the second table 14 toward the roll 2, move to the transfer start position, and perform alignment between the roll 2 and the second table 14;
(2) The roll 2 is lowered to a position where the device C adhered to the adhesive sheet 1 can come into contact with the chip T on the mounting board 13 .
(3) Rotate the roll 2, move the second table 14 in parallel in synchronization with the rotation of the roll 2, and transfer (transfer) the device C adhered to the adhesive sheet 1 to the chip T on the mounting substrate 13. to start.
(4) The devices C on the adhesive sheet 1 are transferred (transferred) to the chips T on the mounting board 13 row by row. After all the devices C on the adhesive sheet 1 have been transferred to the chips T, the rotation of the roll 2 and the movement of the second table 14 are stopped.
(5) Raise roll 2;
(6) Rotate the roll 2, move the second table 14, and return to the origin (return to the home position).
Main steps will be described in detail below.

<Affixing the adhesive sheet>
The device mounting apparatus 100 uses the roll 2 as an intermediate medium to transfer the device C on the transfer source sheet 3 and mount it on the chip T of the mounting substrate 13 .
The device C is once adhered to the surface of the roll 2, and the mounting substrate 13 is moved under the roll 2 while the device C is adhered. Implement on T.

In order to provide the surface of the roll 2 with adhesiveness, it is conceivable to configure the surface of the roll 2 with a material having adhesiveness.
However, if the device C is repeatedly adhered and peeled off on the adhesive surface of the roll 2, the adhesive surface of the roll 2 will become less adhesive due to contamination or the like. When the adhesive surface is contaminated, it is expected that the adhesiveness will recover to some extent by washing the adhesive surface, but it will be difficult to maintain the desired adhesiveness. If the desired adhesiveness cannot be secured, replacement of the roll 2 or reprocessing of the surface of the roll 2 is required.

Therefore, in the device mounting apparatus 100, the surface of the roll 2 is made of a metal such as stainless steel, and the adhesive sheet 1 is attached to the roll 2, instead of making the surface of the roll 2 itself adhesive.
When the adhesiveness of the adhesive sheet 1 is reduced, the adhesive sheet 1 on the roll 2 is peeled off, and then the surface of the roll 2 is washed, so that a new adhesive sheet 1 can be applied, and the desired adhesive strength can be obtained. can be maintained.
The step of attaching the adhesive sheet 1 to the surface of the roll 2 will be described below with reference to FIG.

FIG. 4 is a schematic diagram showing the process of attaching the adhesive sheet 1 to the cylindrical roll 2. As shown in FIG. FIG. 4A is a perspective view showing the adhesive sheet 1 before being attached to the roll 2, and FIG. 4B is an enlarged cross-sectional view showing the adhesive sheet 1 fixed to the first table 4 by suction. 4(C) is a perspective view showing a state after the adhesive sheet 1 is attached to the roll 2, and FIG. 4(D) is a roll 2 to which a plurality of adhesive sheets 1 are attached and the first table. 4 is a sectional view showing 4. FIG.

As shown in FIG. 4(A), the adhesive sheet 1 is placed on the first table 4 . After the adhesive sheet 1 is placed on the first table 4 , the adhesive sheet 1 is fixed by the chucking mechanism of the first table 4 in order to prevent the adhesive sheet 1 from shifting.

The roll 2 can rotate around a rotation axis J parallel to the X-axis in the drawing. In addition, the roll 2 can move up and down in the vertical direction (the Z-axis direction in the figure), and the vertical elevating mechanism controls the amount of descent of the roll 2 so that the surface of the roll 2 moves to the first table 4 . can be brought into contact with the adhesive sheet 1.
The amount of descent of the roll 2 (proximity distance between the roll 2 and the first table 4) is the distance between the surface of the roll 2 and the first table measured by the distance measuring devices 7a and 7b, the distance measuring device 6 may be determined by the controller 80 based on the film thickness of the pressure-sensitive adhesive sheet 1 measured by .

On the other hand, the first table 4 can move horizontally toward the roll 2 in the Y-axis direction in the figure.
With the surface of the roll 2 lowered to a position where it can come into contact with the adhesive sheet 1 on the first table 4, the roll 2 is rotated and moved in the Y-axis direction of the first table 4, thereby removing the adhesive sheet 1 from the edge. can be brought into contact with the surface of the roll 2 from the side E1 of the roll 2 and adhered thereto.

FIG. 4B is a cross-sectional view for explaining an example of a chucking mechanism that can be suitably employed in the first table 4. As shown in FIG. In order to prevent uneven expansion and contraction of the adhesive sheet 1 by the chucking mechanism, the first table 4 is provided with a porous ceramic plate 41 having a flat surface. The pressure-sensitive adhesive sheet 1 is vacuum-adsorbed to the porous plate by evacuating through.
The adhesive sheet 1 can have a laminated structure having an adhesive layer 1AL and a protective layer 1PL. The adhesive sheet 1 is chucked on the first table 4 so that the first table 4 and the protective layer 1PL are in contact with each other. The protective layer 1PL is chucked, separated between the adhesive layer 1AL and the protective layer 1PL, and the adhesive layer 1AL adheres to the surface of the roll 2. - 特許庁
Note that the chucking mechanism is not limited to the above.

The adhesive sheet 1 may further include a layer of cushioning material between the protective layer 1PL and the first table 4. As shown in FIG. When attaching the adhesive sheet 1 to the surface of the roll 2, the deformation of the adhesive sheet 1 can be reduced, and the adhesive sheet 1 can be attached to the surface of the roll 2 more uniformly.

The first table 4 is provided with distance measuring devices (displacement gauges) 7a and 7b, for example, position sensors using laser beams, so that the distance between the roll 2 and the first table 4 can be measured.
In FIG. 4A, the distance measuring devices 7a are installed on the side walls of both ends of the first table 4 in the X-axis direction, and the distance measuring devices 7b are installed on one end of the first table 4 in the Y-axis direction. Although an example in which the distance measuring devices 7a and 7b are installed on the side wall surface of is shown, the number and installation positions of the distance measuring devices 7a and 7b can be set as appropriate.

When the roll 2 approaches the first table 4, the distance between the roll 2 and the first table may be measured by the distance measuring device 7a. The distance measuring device 7a is installed on both side walls of the first table 4 in the Y-axis direction on the extension of the side E1, which is the adhesion start position of the adhesive sheet 1. It is also possible to measure the distance between the table 4 and the surface of the roll 2.
If the film thickness of the adhesive sheet 1 is obtained in advance, the roll 2 is moved to the first table 4 to a position where the surface of the roll 2 can contact the adhesive layer 1AL of the adhesive sheet 1 based on the measured distance. It can be lowered.
The film thickness of the adhesive sheet 1 placed on the first table 4 can be measured by the distance measuring device 6 . The distance measuring device 6 measures the distance between the distance measuring device 6 and the surface of the first table 4 and the distance between the distance measuring device 6 and the surface of the pressure-sensitive adhesive sheet 1 placed on the first table 4. It is possible to measure the film thickness of the adhesive sheet 1 from the difference in the distance of .

As will be described later, the film thickness of the adhesive sheet 1 attached to the roll 2 can be measured using the distance measuring device 7b or the distance measuring device 7a.
In this way, the distance measuring devices 7a and 7b can measure the height of the load attached to the roll 2, for example, from the surface of the roll 2 to the device C on the adhesive sheet 1 attached to the roll 2. Height can also be measured.

After that, the roll 2 is rotated while the first table 4 is moved in parallel so that the adhesive sheet 1 , especially the adhesive layer 1 AL is adhered to the surface of the roll 2 .
By adjusting the rotation speed of the roll 2 and the movement speed of the first table 4, the movement speed (tangential speed) of the surface of the roll 2 in contact with the adhesive sheet 1 in the Y-axis direction and the Y Axial movement speeds can be made equal.

While the surface of the roll 2 contacts the adhesive sheet 1 and presses the adhesive sheet 1, the roll 2 rotates and the first table 4 moves in the Y-axis direction, so that the adhesive sheet 1 touches the surface of the roll 2. Adhesive. The pressure with which the surface of the roll 2 presses the adhesive sheet 1 can be adjusted by the amount by which the surface of the roll 2 presses the adhesive sheet 1 .
The roll 2 is lowered in a direction parallel to the Z-axis, and from the position where the surface of the roll 2 just contacts the adhesive sheet 1, the roll 2 is further lowered by a predetermined amount (push amount), for example, 5 μm, and the adhesive sheet 1 can be pushed. can.
Thus, by using the distance measuring technique using the distance measuring devices 7a and 7b, it is possible to control the pressing amount with high accuracy, that is, control the pressing force.

Instead of lowering the roll 2, the first table 4 may be relatively raised in the Z-axis direction, or both the roll 2 and the first table 4 may be moved in the Z-axis direction. good.
An elevating mechanism may be provided on the first table 4 and controlled by the control device 80 .
Similarly, the second table 14 may be provided with an elevating mechanism and controlled by the control device 80 .

After sticking the adhesive sheet 1 to the surface of the roll 2, the roll 2 is raised and separated from the first table 4 as shown in FIG. 4(C).
It is also possible to move the first table 4 in the direction opposite to the process of FIG. 4(A) and rotate the roll 2 in the direction opposite to the process of FIG. 4(A) to return to the home position (origin return). is.

As shown in FIG. 4C, the surface of the roll 2 is partially covered with the adhesive sheet 1, and a part of the surface of the roll 2 is exposed. Since the distance measuring device 7b is installed on the side wall surface of one end of the first table 4 in the Y-axis direction, the surface of the adhesive sheet 1 is measured by measuring the distance with the distance measuring device 7b while the roll 2 is rotated. and the distance to the exposed surface of the roll 2 can be measured.
As a result, the step between the adhesive sheet 1 and the roll 2, that is, the thickness of the adhesive sheet 1 can be measured.
Furthermore, by monitoring the thickness of the adhesive sheet 1, the change over time of the adhesive sheet 1 can be observed. It is possible to know when the adhesive sheet 1 should be replaced. Further, it is also possible to measure the unevenness of the surface of the adhesive sheet with the distance measuring device 7b.

The distance measuring instruments 7a and 7b shown in FIGS. 4A and 4C can be installed on the first table 4 by appropriately setting the location and the number of the distance measuring instruments according to the purpose. It can be installed on the second table 14 as well.

Moreover, the surface state of the adhesive sheet 1 can be observed by the first camera 20 (see FIG. 1) capable of photographing the surface of the roll 2 . By monitoring dirt, haze, etc. of the adhesive sheet 1 with the first camera 20 and knowing the change over time of the adhesive sheet 1, it is also possible to know when to replace the adhesive sheet. In this case, it is possible to calibrate the sensitivity of the first camera 20 with the exposed surface (metallic surface) of the roll 2 as a reference for illuminance, and changes in the surface of the adhesive sheet 1 can be accurately known.
In addition, when an abnormality is observed in the pressure-sensitive adhesive sheet 1, it is possible to prevent the occurrence of defective products by issuing a warning not to perform the transfer.

FIG. 4(C) shows an example in which one adhesive sheet 1 is attached to the roll 2 .
A plurality of adhesive sheets 1 may be attached to the roll 2 in advance.
For example, as shown in FIG. 4D, when the transfer source sheet 3 has a length of 200 mm in the Y-axis direction (the direction perpendicular to the rotation axis of the roll 2), a roll 2 with a diameter of 250 mm is used. Three adhesive sheets 1a, 1b, and 1c can be pasted on the surface of 2 with an interval of about 60 mm.
By using three pressure-sensitive adhesive sheets 1, it is possible to extend the replacement cycle of the pressure-sensitive adhesive sheets 1 by three times.
Also, different devices may be adhered to each sheet. For example, three primary color (RGB) LEDs can be adhered to three adhesive sheets 1a, 1b, and 1c, respectively, and three types of (RGB) LEDs can be mounted on the display device.

Also in this case, a part of the surface of the roll 2 is exposed, so that it is possible to measure the film thickness of the pressure-sensitive adhesive sheet 1 and monitor the surface condition.

As described above, the distance from the distance measuring device 7b (or the surface of the first table 4) to the surface of the roll 2 can be measured from below the roll 2 by the distance measuring device 7b. Furthermore, by rotating the roll 2 around the central axis C, the distance from the adhesive sheet 1 attached to the roll 2 can be measured.
For example, even in the example shown in FIG. 4(D), the distance from the surface of the plurality of adhesive sheets 1a, 1b, 1c to the distance measuring device 7b and the distance of the roll 2 to which the plurality of adhesive sheets 1a, 1b, 1c are not attached. The distance from the surface to the distance measuring device 7b can be measured. Therefore, the film thickness of each of the plurality of adhesive sheets 1a, 1b, 1c can be measured.

Further, using the distance measuring device 7a, the distance from the distance measuring device 7a (or the surface of the first table 4) to the roll 2 and from the distance measuring device 7a (or the surface of the first table 4) to the adhesive sheet 1 may be configured to be measurable. However, in order to measure the distance from the distance measuring device 7a to the adhesive sheet 1, it is possible to move the first table 4 in the X-axis direction until the distance measuring device 7a is positioned below the adhesive sheet 1. There is a need to.

As shown in FIG. 4D, by setting the detection surfaces of the distance measuring instruments 7a and 7b and the surface of the first table 4 on the same plane, the distance from the distance measuring instruments 7a and 7b and the Needless to say, the distances from the surface of the first table 4 are equal.

<Primary transfer>
FIG. 5A is a schematic diagram showing a state immediately before primary transfer in which the first table 4 is relatively moved while rotating the roll 2 to which the adhesive sheet 1 is attached.
The transfer source sheet 3 on which the devices C are arranged is placed on the first table 4 .
FIGS. 5B and 5C are partially enlarged cross-sectional views schematically explaining how the device C is transferred to the adhesive sheet 1 by primary transfer.

As shown in FIG. 5A, the transfer source sheet 3 on which the devices C are aligned is placed on the first table. The transfer source sheet 3 is preferably placed using a transport robot, but may be placed manually by an operator.

Thereafter, alignment between the transfer source sheet 3 and the roll 2 can be performed by each drive mechanism of the first table 4 .
As shown in FIG. 2A, a plurality of devices C are aligned on the transfer source sheet 3, and the plurality of devices C are regularly arranged on lattice points. In order to primarily transfer the device C on the transfer source sheet 3 to the adhesive sheet 1 attached to the roll 2, the X-axis direction of the transfer source sheet 3 and the direction of the rotation axis J of the roll 2 shown in FIG. (X-axis direction in FIG. 5(A)) is aligned with the first table 4 .

The first table 4 includes a rotation mechanism that rotates the first table 4 around the Z-axis for angle adjustment, an X-direction movement mechanism (transfer direction movement mechanism) that moves parallel in the X direction, and a Y-direction movement mechanism that moves the first table 4 in the Y direction. and a Y-direction movement mechanism (transverse direction movement mechanism).
Due to the alignment of the transfer source sheet 3 on the roll 2 and the first table 4, the inclination of the first table 4 can be corrected by the rotation mechanism. Alignment is performed by controlling the driving mechanism of the first table 4 by the control device 80 .

Hereinafter, the flow of primary transfer of the device C to the adhesive sheet 1 will be specifically described.
As shown in FIG. 5A, the side E3 on the one end side of the transfer source sheet 3 on the first table 4 is arranged on the roll 2 side.
As shown in FIG. 5B, the roll 2 is rotated so that the side E1 of the adhesive sheet 1 faces downward. Then, the first table 4 is moved in the direction of arrow A (Y-axis direction) in FIG. do.
After that, the roll 2 is lowered so that the adhesive sheet 1 can come into contact with the device C on the transfer source sheet 3 . For example, the surface of the adhesive sheet 1 and the surface of the device C on the transfer source sheet 3 are leveled horizontally. Further, the horizontal level of the surface of the adhesive sheet 1 and the surface of the device C on the transfer source sheet 3 may be set so that the roll 2 is lowered by a predetermined distance, for example, 5 μm and the surface of the roll 2 is pushed into the adhesive sheet 1 .

Next, as shown in FIG. 5(C), the roll 2 is rotated in the arrow B direction, and the first table 4 is moved in the arrow C direction (Y-axis direction). At the contact portion between the surface of the adhesive sheet 1 and the device C, the tangential speed of the adhesive sheet 1 in the tangential direction (Y-axis direction) and the moving speed of the device C on the transfer source sheet 3 in the Y-axis direction are equal. , to adjust the rotational speed of the roll 2 and the translational speed of the first table 4 .
Due to the rotation of the roll 2 and the movement of the first table 4, the devices C on the transfer source sheet 3 are adhered to the adhesive sheet 1 row by row parallel to the rotation axis J and transferred.

<Secondary transfer>
FIG. 6A is a schematic diagram showing a state immediately before secondary transfer in which the second table is relatively moved while the roll 2 is rotated. A mounting substrate 13 having a chip T formed thereon is placed on the second table 14 .
6B and 6C are enlarged cross-sectional views schematically explaining how the device C is secondary-transferred onto the chip T on the mounting substrate 13. FIG.

As shown in FIG. 2B, a plurality of chips T are arranged on the mounting board 13 in a row, and the plurality of chips T are arranged regularly on grid points. The second table 14 is positioned so that the X-axis direction of the mounting board 13 shown in FIG. 2B and the direction of the rotation axis J of the roll 2 (the X-axis direction in FIG. 6A) are parallel. Make corrections.

The second table 14 includes a rotation mechanism that rotates the second table 14 around the Z-axis for angle adjustment, an X-direction movement mechanism (transfer direction movement mechanism) that moves parallel in the X direction, and a Y-direction movement mechanism that moves the second table 14 in the Y direction. and a Y-direction movement mechanism (transverse direction movement mechanism).
For the alignment of the roll 2 and the mounting substrate 13 on the second table 14, the inclination of the second table 14 can be corrected by the rotation mechanism. Further, a second table is provided for alignment (alignment) between the devices C aligned and adhered on the adhesive sheet 1 adhered to the roll 2 and the chips T aligned and arranged on the mounting substrate 13. The position of the mounting substrate 13 is corrected using the X-direction moving mechanism and the Y-direction moving mechanism 14 .
The alignment of the second table 14 is performed by controlling the drive mechanism of the second table 14 by the control device 80 in the same manner as the first table 4 .

Hereinafter, the flow of secondary transfer of the device C from the adhesive sheet 1 onto the mounting board 13 will be specifically described.
As shown in FIG. 6A, the side E13 of one end side of the mounting board 13 on the second table 14 is arranged on the roll 2 side.

As shown in FIG. 6B, the roll 2 is rotated so that the side E1 of the adhesive sheet 1 faces downward. Then, the second table 14 is moved in the direction of the arrow A (Y-axis direction) so that the rows of the chips T on the mounting substrate 13 to which the transfer is to be placed are positioned below the devices C closest to the side E1 of the adhesive sheet 1. move to Then, the roll 2 descends so that the surface of the device C can come into contact with the chip T on the mounting board 13 .
The amount of descent of the roll 2 (proximity distance between the roll 2 and the second table 14) depends on the distance between the roll 2 and the chip T placed on the second table 14, and the distance between the roll 2 and the device C from the surface of the roll 2. can be calculated from the distance to the surface of
The distance between the roll 2 and the chip T placed on the second table 14 can be measured by the distance measuring device 6, and the distance from the surface of the roll 2 to the surface of the device C can be measured by the distance measuring device 7b or the distance It can be measured by the measuring instrument 7a.
Also, the pushing amount may be taken into consideration for the amount of descent of the roll 2 .

Next, as shown in FIG. 6(C), the roll 2 is rotated in the direction of the arrow B in the drawing, and the second table 14 is moved in the direction of the arrow C in the drawing (Y-axis direction). At the contact portion between the device C and the chip T, the roll 2 is rotated so that the tangential speed of the device C in the tangential direction (Y-axis direction) and the moving speed of the chip T on the mounting substrate 13 in the Y-axis direction are equal. The speed and the horizontal movement speed (translational speed) of the second table 14 are adjusted.

Due to the rotation of the roll 2 and the movement of the second table 14, the devices C adhered to the adhesive sheet 1 come into contact with the surface of the chips T row by row parallel to the rotation axis J. FIG.
An adhesive layer is provided on the chip T, and the adhesive force of the adhesive layer on the chip T is greater than the adhesive force of the adhesive layer 1AL of the adhesive sheet 1. Therefore, the device C moves onto the chip T, and the secondary be transcribed.

The adhesive layer for transferring the device C onto the chip T may be formed on the chip T by applying an adhesive or a conductive adhesive.

Further, according to the example shown in FIG. 4D, it is also possible to transfer a plurality of types of devices C to the chip T on the mounting board 13 .
FIGS. 7A, 7B, and 7C are plan views showing an example in which three types of devices C are sequentially transferred onto the chip T on the mounting substrate 13. FIG.
As shown in FIG. 7A, the primary transfer and secondary transfer via the adhesive sheet 1a attached to the roll 2 cause the device C, for example, a red LED on the transfer source sheet 3 to be transferred onto the chip T of the mounting substrate 13. to be transcribed.
After that, as shown in FIG. 7B, primary transfer and secondary transfer via the adhesive sheet 1b attached to the roll 2 are performed to mount the device C', for example, a green LED on a different transfer source sheet 3'. 13 onto the chip T.
At this time, the device C' is a chip T different from the chip T on which the device C is transferred.
After that, as shown in FIG. 7(C), primary transfer and secondary transfer via the adhesive sheet 1c attached to the roll 2 are performed to transfer the device C'', for example, a blue LED, on a different transfer source sheet 3''. is transferred onto the chip T of the mounting board 13 .
At this time, the device C'' is a chip T different from the chip T on which the device C and the device C' are transferred. .

Since the devices C, C', C'' are regularly aligned with a pitch Cx in the X direction and a pitch Cy in the Y direction, the chip T to which the reference devices C, C', C'' are transferred is When one is determined, the chip T to transfer all the devices C, C', C'' is determined.
Three different types of devices C, C′, and C″ can be transferred to the chip T on the mounting substrate 13 by the manufacturing process described above.

In addition, as described above, the three adhesive sheets 1a, 1b, and 1c are adhered to the roll 2, and the devices C, C', and C'' are adhered to the rolls 2, respectively. Although three types of devices C, C', and C'' may be transferred, using the same adhesive sheet 1, primary transfer and secondary transfer are repeated a plurality of times, and devices C with different mounting substrates 13 are sequentially transferred. May be implemented.

<Alignment>
The procedure for accurate alignment of the device C will be described in detail below with reference to FIGS. 8 to 10. FIG.

FIG. 8A is a schematic diagram showing a state in which the second camera 21 is installed above the first table 4. FIG. The transfer source sheet 3 is fixed on the first table 4 by a chuck mechanism, and the second camera 21 can photograph the device C on the surface of the transfer source sheet 3 .
8B is a schematic diagram showing the field of view FL21 of the second camera 21 with respect to the transfer source sheet 3, and FIG. 8C is an enlarged diagram schematically showing the field of view of the second camera 21. FIG. For example, from the state shown in FIG. 8A, the first table 4 is moved in the Y direction to adjust the position so that the device C on the transfer source sheet 3 enters the field of view FL21 of the second camera 21. By doing so, the device C can be observed at a desired position.

The Y-direction and X-direction positions of the first table 4 can be specified for a translational movement mechanism (Y-direction movement mechanism) and a transverse movement mechanism (X-direction movement mechanism). The first table 4 is moved in the Y direction and the X direction by the translational movement mechanism and the transverse movement mechanism, and the outermost row of the device C on the transfer source sheet 3 and its both ends (or one end), that is, the corner device C can be specified using an image processing technique for the image output from the second camera 21, and the position coordinates can be specified by the position control coordinates of the first table 4, for example. . The position coordinates (position information) of all the devices C can be specified based on the position coordinates (position information) of the devices C at the corners.
Instead of moving the first table 4 in the X direction, the second camera 21 may be moved in the X direction to specify the position coordinates of the device C at the corner.

In the example shown in FIG. 1A, the device mounting apparatus 100 has two second cameras 21 . Areas surrounded by two circles in FIG. 8(B) show examples of the field of view FL21 of the two second cameras 21 .
A plurality of devices C are observed in the field of view FL21 of the second camera 21. FIG. When transferring the devices C collectively, the method of recognizing the shape of each device C cannot correct the overall tilt.
The inclination can be detected from the arrangement of the plurality of devices C in the field of view FL21 of the second camera 21, and the inclination can be corrected by the rotation mechanism of the first table 4. FIG.

After the inclination of the arrangement of the devices C is corrected, the first table 4 is moved in the Y direction and the X direction while observing the surface of the transfer source sheet 3 with the second camera 21, and the device C is arranged. The position coordinates of the end of the row of the outermost edge of , that is, the corner, may be specified by, for example, the position control coordinates of the moving mechanism.
It is also possible to check the positions of the columns at both ends of the array of devices C in the Y-axis direction. As a result, the second camera 21 can confirm the position of the row of the devices C for first primary transfer and the position of the row of the devices C for the last primary transfer, and measure the farthest distance in the Y-axis direction.

Three types of tilt angle detection methods for detecting the tilt angle when the transfer source sheet 3 having the device C arranged thereon is tilted on the first table 4 will be described below.
Acquisition of an output image of the second camera 21 and the like and image processing (image analysis) are performed by the control device 80 .

(First angle detection method)
A first angle detection method is a method of detecting an inclination angle by image processing from the arrangement of the device C within the field of view of the second camera 21 . In this method, the tilt angle can be detected by a single second camera 21 . An example of angle detection using one second camera 21 will be described below.

FIG. 8C shows an example of an image obtained by observing the tilted devices C with the second camera 21 .
An image signal output from the second camera 21 is acquired by the control device 80, and a specific portion of the device C, for example, an edge or contour of the device C is detected by a known image recognition method. After that, an angle θ formed between a straight line (dotted line α in the drawing) connecting the specific portions and the X-axis direction or the Y-axis direction is calculated, and the tilt angle θ of the device C is detected.
In the two second cameras 21, the inclination angle θ may be calculated for each, and the average value may be obtained.

(Second angle detection method)
The second angle detection method is a method of processing the images of the device C of the two second cameras 21 installed separately in the X-axis direction and linking the image data to detect the tilt angle. By using the two second cameras 21, it is possible to identify a row of devices C arranged in a straight line in the X-axis direction and measure the displacement of the row in the Y-axis direction to measure the tilt. .
That is, the tilt angle of the array of devices C with respect to the X axis can be detected.
An example of angle detection using two second cameras 21 will be described below.

FIG. 9A is a plan view schematically showing an example of an image obtained by observing the devices C tilted and arranged on the first table 4 by the two second cameras 21. FIG. In FIG. 9A, two circles indicate fields of view FL21 of the two second cameras 21. In FIG.
In order to specify the arrangement of the devices C arranged on the same straight line, for example, the row of the devices C first adhered to the adhesive sheet 1, that is, the row of the devices C closest to the edge E3 of the transfer source sheet 3 is determined. Identify. As shown in FIG. 9A, the first table 4 is positioned so that the row of devices C closest to the edge E3 of the transfer source sheet 3 is within the field of view of the two second cameras 21. adjust.

For example, as shown in FIG. 8A, the first table 4 is moved in the Y direction from the state where the device C on the transfer source sheet 3 is positioned outside the field of view of the two second cameras 21 . The row of device C in which device C is first observed in the field of view FL21 of the two second cameras 21 can be identified as the row of device C closest to edge E3 of transfer source sheet 3. .

The inclination of the row of devices C closest to the side E3 is calculated by image processing the outputs from the two second cameras 21 .
Specifically, since the positions of the two second cameras 21 are fixed, the distance between the fields of view FL21 of the two second cameras 21, for example, the distance between the centers of the fields of view FL21 is known.
Edge detection or the like is performed by image recognition on each of the images output from the two second cameras 21, and a straight line α (dotted line α in the drawing) connecting the specific portions of the plurality of devices C can be obtained. Let L be the interval between the fields of view FL21 of the two second cameras 21, and the misalignment (displacement h) of the device C at a distance L can be detected from the relationship between the straight line α and the X axis.
The inclination angle (inclination angle with respect to the X-axis direction) θ of arrangement of the device C can be calculated using h, L, and the like.
The second angle detection method improves the detection accuracy of the tilt angle compared to the first angle detection method.

Note that the column of devices C to be specified is not limited to the column of devices C closest to the side E3.

(Third angle detection method)
A third angle detection method is a method of linking the second camera 21 and the moving mechanism of the first table 4 and processing the image of the second camera 21 to detect the tilt angle. A single second camera 21 identifies a row of devices C arranged in a straight line in the Y-axis direction, and it is possible to measure the tilt by measuring the displacement of the row in the X-axis direction. . That is, the tilt angle of device C with respect to the Y-axis can be detected.
Although the second angle detection method requires two second cameras 21, the third angle detection method improves detection accuracy even with one second camera 21. becomes possible.
An example of angle detection using one second camera 21 and the movement mechanism of the first table 4 will be described below.

FIG. 9B is a schematic diagram showing the relationship between the second camera 21 and the first table 4, and FIG. 9C schematically shows the field of view of the second camera 21 on the transfer source sheet 3. is a plan view shown in FIG.
First, as shown in FIG. 9B, the first table 4 on which the transfer source sheet 3 is placed is moved in the Y-axis direction.
Since the position of the second camera 21 is fixed, the field of view FL21 of the second camera 21 relatively moves over the transfer source sheet 3 in the opposite direction (-Y direction), as shown in FIG. 9C. ) will be scanned.
For example, the field of view FL21 of the second camera 21 moves from the field of view FL21-1 to the field of view FL21-2 in FIG. 9(C). Let D1 be the moving distance from the field of view FL21-1 to the field of view FL21-2.

The output image from the second camera 21 is processed, for example, by edge detection or the like, the devices C arranged in rows in the Y direction are specified, and a straight line α1 (indicated by a dotted line in the figure) connecting the devices C is obtained. be able to.

When the row of the devices C in the Y direction is tilted with respect to the Y axis, when the second camera 21 is moved in the Y direction, the devices C in the specified row in the Y direction are moved out of the field of view FL21. Move parallel to the axis.
If the specified Y-direction column falls within the range of the field of view FL21-2, the displacement h1 of the device C on the straight line α1 can be obtained from the image of the field of view FL21-2.
The tilt angle θ of the layout of the device C can be calculated using h1 and D1.

Note that this operation can be repeated. Let D2 be the distance from the field of view FL21-2 to the field of view FL21-3, and α2 ( dotted line), and the displacement h2 of the device C on the straight line α2 can be obtained from the image of the field of view FL21-3. be able to.

In this way, the first table 4 is moved in a direction perpendicular to the rotation axis J of the roll 2, and the field of view FL21 of the second camera 21 fixedly arranged above the first table 4 is transferred. It is possible to scan the sheet 3 and detect the tilt angle (the tilt angle with respect to the Y-axis direction) of the devices C arranged on the transfer source sheet 3 from the image output from the second camera 21 .
Alternatively, the tilt angle of the device C may be detected by the third angle detection method for each of the two second cameras 21, and the average value of the detected two tilt angles may be used as the tilt angle of the device C. good.

This third angle detection method is particularly effective when the devices C arranged on the transfer source sheet 3 are arranged longer in the direction parallel to the Y axis than in the direction parallel to the X axis. .
Also, both the second angle detection method and the third angle detection method detect the tilt angle using images of fields of view of the second camera 21 at different positions. In the second angle detection method, the intervals between the fields of view at different positions are fixed, whereas in the third angle detection method, the intervals between the fields of view at different positions can be freely set.

The first angle detection method, the second angle detection method, and the third angle detection method can be appropriately selected according to the arrangement of the devices C on the transfer source sheet 3 or the like.

Note that the above three types of angle detection methods may be combined as appropriate.
For example, when the tilt angle of the device C is large, the tilt angle of the device C is detected by the first angle detection method, and the tilt is corrected by rotating the first table 4 around the Z axis using a rotation mechanism. do. After that, the inclination angle can be detected with higher accuracy by the second angle detection method or the third angle detection method, and the inclination can be corrected by rotating the first table 4 by the rotation mechanism.

In addition, since the third angle detection method can substantially freely expand the range of the field of view FL21 of the second camera 21, the tilt angle of the row of devices C is detected by the third angle detection method. By repeating the operation of correcting the tilt by the rotation mechanism of the table 4 in step 1, the tilt angle of the row of devices C may be corrected with desired accuracy.

After correcting the tilt angle by the rotation mechanism of the first table 4, the position coordinates of the device C can be identified by executing the above-described position measurement method using the second camera 21. FIG. The specified position coordinates of the device C on the transfer source sheet 3 are stored in the storage device of the control device 80 as the position information of the device C before primary transfer (position information of the device C on the transfer source sheet 3). can do.

Note that the coordinates of the device C after the tilt angle correction are calculated by coordinate conversion such as a rotation matrix without measuring the position again after the tilt angle correction, and the position information of the device C before the primary transfer (transfer source sheet 3 It may be stored in the storage device of the control device 80 as position information of the device C above).

FIG. 10A is a schematic diagram showing a state after the device C is transferred to the adhesive sheet 1 of the roll 2 by primary transfer. A first camera 20 is installed above the roll 2 .
The first camera 20 captures an image of the device C on the adhesive sheet 1 to determine the distance between the devices C in the X-axis direction and the circumferential direction (or the arrangement pitch of the devices C), the distance between the farthest devices, the tilt etc. can also be checked.

The distance in the X-axis direction between the devices C (or the pitch in the X-axis direction of the devices C) can be measured by image processing technology on the image of the field of view of the first camera 20, and the distance in the circumferential direction between the devices C (or the pitch in the circumferential direction of the device C) is measured by image processing technology on the image of the field of view of the first camera 20 while considering the radius of the roll 2, or the movement in the circumferential direction while rotating the roll 2. It is possible to measure the image acquired by the first camera 20 by image processing technology while monitoring the distance.

In order to measure the movement distance of the roll 2 in the circumferential direction, the roll 2 may be provided with measurement marks formed at predetermined intervals, for example, rectangular protrusions or recesses protruding from the surface of the roll 2 .
The distance measuring device 7a may be configured to be able to measure the moving distance in the circumferential direction by counting the protrusions.
A linear encoder or a rotary encoder may be installed separately to measure the movement distance in the circumferential direction.

The distance between the furthest devices in the circumferential direction can be measured by image processing technology on the image acquired by the first camera 20 while monitoring the movement distance in the circumferential direction while rotating the roll 2. The distance between the farthest devices in the X-axis direction parallel to the rotation axis J is measured by image processing technology on the image acquired by the first camera 20 by configuring the first camera 20 to be movable in the X-axis direction. It is possible to Alternatively, it can be calculated from the measured distance and pitch between devices C in the X-axis direction and the number of devices C in the X-axis direction.

The tilt of the device C on the roll 2 can be measured by the first, second and third angle detection methods. In this case, in the third angle detection method, instead of moving the first table 4 in the Y direction, the roll 2 may be rotated around the rotation axis J.
In addition, when the tilt of a finite angle is confirmed, the mounting board 13 may be tilted with respect to the Y-axis direction or the X-axis direction when performing the secondary transfer to the mounting board 13 of the transfer destination.

Also, the relationship between the position of the device C on the roll 2 and the rotation angle of the roll 2 can be acquired. The basic relationship between the position and rotation angle of device C will now be described.
Let r be the distance from the rotation axis J of the roll 2 to the device C on the adhesive sheet 1, and ω be the rotation angle. When the arrangement pitch of the devices C on the transfer source sheet 3 is Cy, the arrangement pitch of the devices C in the circumferential direction on the adhesive sheet 1 of the roll 2 is also Cy. When the rotation angle Δω changes, it moves rΔω in the circumferential direction. In order to rotate the roll 2 by the rotation angle Δω and move the device C by one pitch on the adhesive sheet 1, Δω=Cy/r.
When Cy is smaller than r, n pitches, for example, 50 pitches can be moved on the adhesive sheet 1 of the roll 2 by setting Δω=nCy/r.
Conversely, it is possible to obtain the relationship of the rotation angle when the adhesive sheet 1 of the roll 2 is moved in the circumferential direction by n pitches.
However, the above relational expression between the rotation angle Δω and the pitch may be finely adjusted as appropriate.

Image processing is performed on the image output from the first camera 20, the number of devices C that have moved is counted, and the correlation between the number n of devices C that has moved or n times the pitch Cy and the rotation angle of the roll 2 is calculated. can be obtained. Alternatively, the first camera 20 can acquire the distance from the first detected device C to the last detected device C, that is, the relationship between the distance between the farthest devices C and the rotation angle.
Conversely, it is also possible to calculate the distance from the rotation axis J to the device C from the movement distance nCy of the device C in the circumferential direction and the amount of change in the rotation angle.
Correlation data between the rotation angle and the movement distance of the device C in the circumferential direction can be stored in the storage device of the control device 80 and used when transferring the device C to the mounting board 13 .

Further, by setting a reference (black arrow in FIG. 10A) in advance on the surface of the roll 2, the position of the row of the devices C on the adhesive sheet 1 can be specified by the angle (ω). The relationship between column positions and angles can be stored. Or the columns of devices C may be located by their circumferential distance from the reference and their relationship stored.

As for the position of the device C on the adhesive sheet 1 in the direction of the rotation axis J (X direction), the position of the device C in the X direction measured on the first stage 4 can be used.
Note that the first camera 20 may be used to actually measure the position of the device C in the X direction. For example, a guide rail may be provided in the X direction, and the driving device may move the first camera 20 along the guide rail in the X direction. By making the first camera 20 movable in the X direction, it is possible to recognize the image data of the device C captured by the first camera 20 and measure the position of the device C in the X direction. In this case, for example, both ends (or one end) of the row of devices C closest to the end side E1, that is, the positions of the devices C at the corners may be measured.
Note that the position of the camera is not limited to vertically upward and can be set as appropriate.

The positional coordinates (positional information) of all the devices C on the adhesive sheet 1 attached to the roll 2 are calculated from the inclination, the distance between the devices C, the pitch, etc. with the measured corner device C as the reference coordinate. can do. The calculated positional coordinates of the device C can be stored in the storage device of the control device 80 as the positional coordinates of the device C on the adhesive sheet 1 of the roll 2 .

The obtained correlation between the number of pitches of the device C on the adhesive sheet 1 or the step shape and the rotation angle of the roll 2 is stored in the storage device of the controller 80 . Therefore, the control device 80 determines the value of the rotation angle of the roll 2 in the X-axis direction row of the device C closest to the edge E1 of the adhesive sheet 1, and the value of the roll 2 in each X-axis direction row of the device C. You can know the value of the rotation angle.

FIG. 10B is a schematic diagram showing a preparatory stage for secondary transfer of the device C on the adhesive sheet 1 to the mounting board 13 on the second table 14 .
A third camera 22 is installed above the second table 14 . By image processing the image output from the third camera 22, the position information of the chip T on the mounting board 13 can be obtained.
For example, first, the inclination angle of the arrangement of the chips T is detected by the first, second, and third angle detection methods, and the inclination is corrected by the rotating mechanism of the second table 14 . After that, while observing the surface of the mounting substrate 13 with the third camera 22, the movement mechanism of the second table 14 in the Y direction and the X direction is used to move the outermost row of the array of the chips T and its edge. The positional coordinates (positional information) of the part, that is, the corner can be specified. The positional coordinates (positional information) of all the chips T can be specified from the positional coordinates of the chips T at the corners.
The position coordinates of all the chips T on the mounting board 13 placed on the second table 14 can be stored in the storage device of the control device 80 .

As shown in FIG. 2B, when an alignment mark 5 such as a cross is formed, the alignment mark 5 can be imaged by the third camera 22 and the tilt angle can be detected by the first angle detection method.
In addition, it is also possible to detect the inclination by the second angle detection method by capturing images of the alignment marks 5 formed on the edges of both sides of the mounting substrate 13 with the two third cameras 22 . is. The deviation (displacement h) of the alignment marks 5 in the Y-axis direction is calculated by image processing technology, and the tilt angle θ can be calculated using the distance W between the two alignment marks 5 and the displacement h.
However, in this case, it is necessary to set the interval between the two third cameras 22 to be equal to the interval between the alignment marks 5 formed on both sides of the mounting board 13 .

If the interval between the two third cameras 22 and the interval between the alignment marks 5 are not equal, first, one of the alignment marks 5 formed on both sides is imaged by the single third camera 22 . After that, the second table 13 is moved by the transverse movement mechanism (X-direction movement mechanism) of the second table 13, and the other facing alignment mark 5 is imaged by the other third camera 22, and the alignment mark 5 in the Y-axis direction (displacement h) is calculated by an image processing technique.
If the distance W between the two alignment marks 5 is known, the tilt angle θ can be calculated using the distance W and the displacement h.
If the distance W is unknown, the distance W between the two alignment marks 5 can be easily calculated from the distance between the two third cameras 22 and the movement distance of the second table 13 in the X-axis direction. can be done.
The position coordinates of the alignment mark 5 can be specified based on the control coordinates of the movement mechanism of the second table 13 .

When a complex circuit pattern or the like is formed on the surface of the mounting board 13 and image processing is difficult or advanced pattern recognition technology is required, the alignment marks 5 can be used to detect the tilt angle of the arrangement of the chips T. is possible.

Positional coordinates of all the chips T are obtained from the pitches Tx and Ty of the chips T and the arrangement information of the chips T (the number of chips in the X-axis direction and the number of chips in the Y-axis direction) using the positional coordinates obtained by measuring the alignment marks 5 as reference coordinates. can be calculated. The position coordinates of all the chips T on the mounting board 13 placed on the second table 14 thus acquired can be stored in the storage device of the control device 80 .

In addition, when an alignment mark exists on the transfer source sheet 3, the position coordinates of the device C may be obtained based on the alignment mark as described above.
However, since there is no alignment mark on the adhesive sheet 1 attached to the roll 2, it is necessary to obtain the position coordinates by the device C.

Note that the second camera 21 may be used instead of the third camera 22 without providing the third camera 22 .
By separately providing the second camera 21 and the third camera 22, correction of the tilt of the device C and identification of the coordinates of the device C and correction of the tilt of the chip T and identification of the coordinates of the chip T can be performed simultaneously. can proceed and the time required for transfer can be reduced. This contributes to improving the processing capability (throughput) of the device mounting apparatus 100 .

The storage device of the controller 80 stores the positional coordinates of the device C on the transfer source sheet 3, the positional coordinates of the device C adhered to the adhesive sheet 1 of the roll 2, and the positional coordinates of the chip T on the mounting board 13. ing.
Therefore, the control device 80 can specify the position of the chip T on the mounting substrate 13 to which the device C adhered to the adhesive sheet 1 is actually transferred (hereinafter referred to as transfer destination chip T).
Specifically, the positional coordinates of the chip T to be transferred on the mounting substrate 13 for the device C at the corner closest to the side E1 of the device C adhered to the adhesive sheet 1 (hereinafter referred to as the reference device C) are Specify

The devices C are aligned at a predetermined pitch, and the chips T are also aligned at a predetermined pitch. Therefore, by specifying the reference device C and the transfer destination chip T as the transfer destination, all the devices C on the adhesive sheet 1 can be transferred onto the chip T on the mounting substrate 13 as the transfer destination.

The controller 80 obtains the angle specifying the position of the reference device C on the surface of the roller 2 and controls the rotation drive mechanism of the roller 2 so that the reference device C is positioned below.
The control device 80 obtains the positional coordinates of the reference device C in the X-axis direction and the positional coordinates of the transfer destination chip T in the X-axis and Y-axis directions.
The control device 80 controls the elevating mechanism of the roller 2 to lower the roller 2 so that the reference device C can come into contact with the transfer destination chip T. FIG. Further, the roll 2 is additionally lowered by a distance corresponding to a predetermined pushing amount.

The control device 80 stores, as data, the rotation angle (or rotation time) required for the roller 2 to reach a predetermined constant tangential velocity from the stopped state. Further, the control device 80 stores as data the distance (or movement time) required for the second table 14 to reach the same moving speed as the tangential speed from a stopped state.
It should be noted that these data can be obtained in advance through experiments or the like.
The control device 80 adjusts the rotation angle of the roll 2 and the second table 14 so that the reference device C contacts the transfer destination chip T while the tangential speed of the roller 2 and the moving speed of the second table 14 in the Y direction are the same. set the position of the table 14 of

After that, the controller 80 controls the rotational drive mechanism of the roller 2 and the second rotation drive mechanism so that the speed of the device C on the adhesive sheet 1 in the Y-axis direction and the speed of the chip T on the mounting substrate 13 in the Y-axis direction are equal. It controls the Y-axis drive mechanism of the table 14 . As the roller 2 rotates, the devices C on the adhesive sheet 1 are transferred row by row onto the chips T on the mounting substrate 13 .

The control device 80 obtains the tilt angle of the device C adhered to the adhesive sheet 1 and the tilt angle of the chip to be transferred on the mounting substrate 13, and if necessary, rotates the rotation drive mechanism of the second table 14. may be controlled to rotate around the Z-axis direction to correct the tilt angle.

(Second Embodiment) -Device Mounting Method-
A device mounting method using the device mounting apparatus 100 will be described below.
11 to 14 are flow charts explaining each step of the device mounting method using the device mounting apparatus 100. FIG.
Details of the contents executed in each step, such as position measurement, are as described above.

FIG. 11 is a flowchart showing the overall flow of the device mounting method. Each step will be described below in the order of the flow.
Step S<b>1 is a process of attaching the adhesive sheet 1 to the roll 2 .
Step S<b>2 is a step of primarily transferring the device C to the adhesive sheet 1 .
Step S3 is a step of performing position measurement (acquisition of position coordinates) of the device C on the adhesive sheet 1 and the chip T on the mounting board 13 . Position measurement is as described above.
Step S<b>4 is a step of secondary transfer of the device C to the chip T on the mounting substrate 13 .

As shown in FIG. 11, after the adhesive sheet 1 is attached to the roll 2 (step S1), the device C is transferred to the chip T until the adhesive sheet 1 is replaced due to deterioration of the adhesiveness of the adhesive sheet 1 or the like. (Step S2, step S3, step S4) can be repeated.
Note that the number of repetitions is not limited to three.
Also, different types of devices C can be transferred onto the same mounting board 13 .
For example, in the example shown in FIG. 7, three types of devices C, C', and C'' are transferred to the same mounting board 13. FIG. Steps S<b>2 , S<b>3 , and S<b>4 can be repeated multiple times for the same mounting board 13 .

FIG. 12 is a flowchart for explaining step S1 (adhesion of adhesive sheet) by disassembling it into more detailed steps.
Hereinafter, each step will be described in order of flow with reference to FIG.
Step S1-1: The adhesive sheet 1 is set (placed) on the chucking mechanism of the first table 4. FIG. More specifically, the adhesive sheet 1 is set on the chucking mechanism (for example, the plate 41 for vacuum chuck) of the first table 4 . This work may be performed manually by an operator, or may be performed automatically by a conveying device.
Step S1-2: The adhesive sheet 1 is chucked (adsorbed).
Step S1-3: Turn on the start switch. Control of the transfer sequence by the controller 80 of the device mounting apparatus 100 is started. As noted above, each major component can be controlled by controller 80 . Further, the roll 2, the first table 4, the second table 14, etc. may be configured to calibrate the movable range and then return to the origin (home position).
The step of turning on the start switch is the same for other flows.
Step S1-4: The roll 2 is lowered to a position where the adhesive sheet 1 can be pasted so that the surface of the roll 2 can contact the adhesive sheet 1. By lowering the roll 2, the horizontal level of the surface of the roll 2 and the surface of the adhesive sheet 1 is aligned. For example, the horizontal levels of both surfaces may be the same, or the horizontal levels of both surfaces may be set in consideration of the amount of pushing. The same applies to the step of lowering the roll 2 below.
Note that the surface of the roll 2 is not in contact with the adhesive sheet 1 in this step.
Step S1-5: The first table 4 moves horizontally below the roll 2. In this step, the roll 2 is rotated so that the attachment start position of the adhesive sheet 1 of the roll 2 is on the first table 4 side. For example, a reference mark or a scale may be provided on the roll 2 where the end portion of the adhesive sheet 1 is to be adhered, and this may be used as the attachment start point. The fiducial marks can also serve as references for determining the circumferential position on the surface of the roll 2 .
Further, as shown in FIG. 4(D), when a plurality of adhesive sheets 1 are attached on the roll 2, the surface of the roll 2 on which the adhesive sheets 1 are not attached faces the first table 4 side.
Step S1-6: Start sticking (sticking) the adhesive sheet 1 onto the roll 2. The control device 80 starts controlling the adhesion operation of the roll 2 and the first table 4, rotates the roll 2, and moves the first table 4 horizontally. The roll 2 and the first table 4 are accelerated from a stopped state to make the horizontal speed of the first table 4 and the tangential speed of the roll 2 match. After that, the horizontal movement speed of the first table 4 and the rotation speed of the roll 2 are kept constant.
Step S1-7: The first table 4 moves horizontally in synchronization with the rotation of the roll 2, and the adhesive sheet 1 on the first table 4 comes into contact with the surface of the roll 2 in order from the edge, and sticks. be done.
Alternatively, the roll 2 and the adhesive sheet 1 may be stopped and brought into contact with each other, and then the roll 2 is rotated and the adhesive sheet 1 is moved horizontally. However, after the horizontal speed of the first table 4 and the tangential speed of the roll 2 are matched, the roll 2 and the pressure-sensitive adhesive sheet 1 are brought into contact with each other and adhered. Affixing is possible with the same tension.
Step S1-8: All the adhesive sheets 1 on the first table 4 are attached to the surface of the roll 2; The operation of adhering the adhesive sheet 1 to the roll 2 is completed. The rotation of the roll 2 and the movement of the first table 4 are stopped.
Step S1-9: The roll 2 rises to a position where it does not interfere with the movement of the first table 4.
Step S1-10: The first table 4 and the roll 2 move to the origin (home position) (origin return).

FIG. 13 is a flowchart for explaining step S2 of primarily transferring the device C from the transfer source sheet 3 to the adhesive sheet 1 attached to the roll 2. As shown in FIG.
Hereinafter, each step will be described in order of flow with reference to FIG.
Step S2-1: The transfer source sheet 3 is set (placed) on the chucking mechanism of the first table 4. FIG. Set (place).
This work may be performed manually by an operator, or may be performed automatically by a conveying device.
The devices C on the transfer source sheet 3 are set so as to be aligned in the X-axis and Y-axis directions of the first table 4 . However, if the arrangement of the devices C is tilted, it will be corrected in a later step.
Step S2-2: The transfer source sheet 3 is chucked (attracted). Chucking prevents the transfer source sheet 3 from moving unnecessarily in subsequent steps.
Step S2-3: Turn on the start switch.
Step S2-4: Move to the distance measurement position with respect to the first table 4 and the roll 2.
Distance measurement is possible with a distance measuring device 7 a provided on the first table 4 . The first table 4 moves so that the distance measuring device 7a is arranged below the rotation axis J of the roll 2 in the vertical direction.
Step S2-5: The distance between the first table 4 and the roll 2 is measured.
Also, in this step, the positions of the devices C on the transfer source sheet 3 (including the inclination of the arrangement of the devices C) are measured. As described above, the distance measurement can use the rangefinders 7a, 7b and the position measurement of the device C can use the second camera 21. FIG. The measurement results are saved in the storage device of the control device 80 . By moving the first table 4 in the Y-axis direction while imaging with the second camera 21, the primary transfer start position and the primary transfer end position of the device C in the Y-axis direction can be acquired.
Step S2-6: The first table 4 is moved horizontally, the roll 2 is rotated, and the adhesive sheet 1 is placed at a position where the adhesive sheet 1 adheres to the device C and primary transfer is possible (Fig. 3(A)(1)).
In this step, the roll 2 and the first table 4 are moved to a position for alignment. High-speed movement of the first table 4 contributes to an improvement in throughput.
Step S2-7: The adhesive sheet 1 attached to the roll 2 and the device C on the transfer source sheet 3 are aligned. Alignment can be performed based on the position of the device C to correct the tilt of the roll 2 with respect to the axis of rotation J. Preferably, the center of the adhesive sheet 1 in the X-axis direction and the center of the transfer source sheet 3 in the X-axis direction are aligned.
The situation after alignment can be confirmed by the second camera 21 .
When the arrangement of the devices C on the transfer source sheet 3 is tilted, the first table 4 is aligned so that the rows of the devices C on the transfer source sheet 3 in the X-axis direction are parallel to the rotation axis J of the roll 2 . is corrected using the rotation mechanism of
Step S2-8: The roll 2 descends so that the adhesive sheet 1 can come into contact with the device C on the transfer source sheet 3. In this step, the horizontal level of the surface of the adhesive sheet 1 and the surface of the device C on the transfer source sheet 3 is aligned. (See FIG. 3(A)(2)).
Note that the adhesive sheet 1 and the device C are not in contact with each other in this step.
Step S2-9: For primary transfer, horizontal movement of the first table 4 and rotation of the roll 2 are started from a state in which the first table 4 and the roll 2 are stationary. The horizontal moving speed of the first table 4 and the tangential speed of the roll 2 are matched. When the speeds match, the horizontal movement speed of the first table 4 and the rotation speed of the rolls 2 are maintained constant (they become constant speeds).
Step S2-10: By rotating the roll 2 and horizontally moving the first table 4 in synchronization with the rotation of the roll 2, the device C on the transfer source sheet 3 starts to stick to the adhesive sheet 1. (see FIG. 3(A)(3)).
Step S2-11: The devices C on the transfer source sheet 3 placed on the first table 4 are brought into contact with the adhesive sheet 1 on the roll 2 one by one in sequence or by a plurality of continuous rows, and are adhered.
The adhesive sheet 1 on the roll 2 and the device C on the transfer source sheet 3 are brought into contact with each other in a stopped state, and then the roll 2 is rotated and the first table 4 is horizontally moved. good too. However, after the horizontal speed of the first table 4 and the tangential speed of the roll 2 are matched, the pressure-sensitive adhesive sheet 1 and the device C are brought into contact with each other and are adhered. device C is adhered to. As a result, it becomes possible to adhere the device C to the adhesive sheet 1 with high positional accuracy.
Step S2-12: The transfer from the original transfer sheet 3 of the device C to the adhesive sheet 1 is completed, and the rotation of the roll 2 and the movement of the first table 4 are stopped (see FIG. 3(A) (4)).
The control device 80 determines the position of the row of the device C to which the first primary transfer is performed (the Y coordinate of the primary transfer start row) and the position of the row of the device C to which the last primary transfer is performed (the Y coordinate of the primary transfer end row). , the rotation angle of the roll 2 is calculated and stored in the storage device. Therefore, the horizontal movement of the first table 4 and the The start and stop of rotation of the roll 2 can be controlled.
Step S2-13: The rear roll 2 is lifted (see FIG. 3(A)(5)).
Step S2-14: The first table 4 and roll 2 move to the origin (home position) (return to origin) (see FIG. 3(A) (6)).

FIG. 14 is a flowchart for explaining the step S3 of measuring the position of the device C on the adhesive sheet 1 attached to the roll 2 and the step S4 of secondary transfer from the adhesive sheet 1 onto the chip T of the mounting board 13. FIG. be.
Hereinafter, with reference to FIG. 14, steps S3 and S4 will be described in order of the flow.
In order to utilize the result of step S3 in step S4, step S4 is executed after step S3, but step S3 and step S4 may proceed simultaneously.

<Device position measurement>
Step S3-1: Turn on the start switch.
Step S3-2: The roll 2 is lifted so that the device C on the adhesive sheet 1 attached to the roll 3 can be imaged by the first camera 20. FIG.
Step S3-3: The roll 2 stops at a position where the position of the device C on the adhesive sheet 1 can be measured by the first camera 20. FIG.
Step S3-4: Position measurement of the device C on the adhesive sheet 1 by the first camera 20 is started.
Step S3-5: Measure the position of device C.
By imaging the device C with the first camera 20 while rotating the roll 2 , the position of the device C can be sequentially measured in the circumferential direction on the adhesive sheet 1 . It is also possible to confirm whether or not the row of devices C is tilted with respect to the rotation axis J, and to measure the tilt angle when the tilt is confirmed.
The controller 80 associates the position of the device C with the rotation angle of the roll 2 or the distance in the circumferential direction and stores it in the storage device.
Also, if the tilt of the row of devices C with respect to the axis of rotation J is confirmed, the tilt angle is also stored in the storage device.
Step S3-6: Position measurement of device C ends.

<Secondary transfer>
Step S4-1: The mounting substrate 13 is set (placed) on the chucking mechanism of the second table 14. FIG. This work may be performed manually by an operator, or may be performed automatically by a conveying device.
The chips T on the mounting substrate 13 are set so as to be aligned in the X-axis and Y-axis directions of the second table 14 . However, if the arrangement of the chips T is tilted, it will be corrected in a later step.
If the device mounting apparatus 100 does not have the second table 14 but only the first table 4 , the first table 4 is used instead of the second table 14 . In this case, the second table 14 means the first table 4 and the third camera 22 means the second camera 21 in the following steps.
Step S4-2: The mounting substrate 13 is chucked (attracted).
Chucking prevents the mounting board 13 from moving unnecessarily in subsequent steps.
Step S4-3: Turn on the start switch.
Step S4-4: In order to measure the thickness of the mounting substrate 13 on the second table 14, the second table 14 is horizontally moved below the distance measuring device 6. FIG.
Step S4-5: The thickness of the mounting board 13 is measured. Specifically, the distance measuring device 6 installed above measures the distance between the distance measuring device 6 and the second table 14 and the distance between the distance measuring device 6 and the surface of the chip T provided on the mounting substrate 13. to measure From the difference between these distances, the distance from the surface of the second table 4 to the surface of the chip T on the mounting board 13, that is, the thickness of the mounting board 13 is measured.
Also, in this step, the positions of the chips T on the mounting board 13 (including the inclination of the arrangement of the chips T) are measured. As described above, the third camera 22 can be used to measure the position of the chip T, and the measurement results are stored in the storage device of the control device 80 . The secondary transfer position of the chip T can be acquired by horizontally moving the second table 14 while taking an image with the third camera 22 .
Also, the distance between the adhesive sheet 1 attached to the roll 2 and the second table 14 is measured by the distance measuring device 7b (or the distance measuring device 7a).
Each measured value is stored in the storage device of the control device 80 .
Step S4-6: In order to measure the distance between the second table 14 and the roll 2, the second table 14 moves horizontally below the roll 2. Specifically, the second table 14 moves so that the distance measuring device 7 a provided on the second table 14 is positioned below the rotation axis J of the roll 2 .
Step S4-7: The distance between the second table 14 and the roll 2 is measured.
The output of the distance measuring device 7a is input to the control device 80 and stored in the storage device of the control device 80. FIG.
Step S4-8: Move the second table 14 horizontally and rotate the roll 2 so that the device C adhered to the adhesive sheet 1 is adhered to the chip T on the mounting substrate 13, and secondary transfer is possible. The pressure-sensitive adhesive sheet 1 is placed at the position where the position is (see FIG. 3(B)(1)). The second table 14 is moved to a position where alignment with the roll 2 is possible.
The rotation angle of the roll 2 around the rotation axis J is adjusted so that the reference device C on the adhesive sheet 1 can be transferred to the transfer destination chip T on the mounting board 13 .
For example, as shown in FIG. 7, when a plurality of types of devices C are secondary-transferred onto a chip T, the chip T (transfer destination chip T) device C that transfers the reference device C (reference device C) Since they are different, the transfer chip T is specified, and the rotation angles and positions of the roll 2 and the second table 14 are adjusted so that the coordinates of the reference device C and the transfer destination chip T on the mounting board 13 match.
Step S4-9: The mounting board 13 is aligned so that the device C on the adhesive sheet 1 attached to the roll 2 is accurately adhered onto the chip T of the mounting board 13. FIG. Specifically, the positional coordinates of the device C acquired in step S3-5 and the positional coordinates of the chip T acquired in step S4-5 are collated, and the row of the device C in the X-axis direction and the X The drive mechanism of the second table 14 corrects the tilt angle and the positions in the X-axis direction and the Y-axis direction so that the rows in the axial direction become parallel and the devices C and the chips T overlap. In this way, the relative positional relationship between the roll 2 and the mounting board 13 can be determined and adjusted.
Step S4-10: Lower the roll 2 so that the device C on the adhesive sheet 1 can come into contact with the surface of the chip T (see FIG. 3(B) (2)).
The lowering distance of the roll 2 is determined by the distance between the roll 2 and the second table 14, the thickness of the mounting substrate 13 (the height from the surface of the second table 14 to the surface of the chip T), and the device C from the surface of the roll 2. It is calculated by the height to the surface of The controller 80 controls the lifting mechanism of the roll 2 based on the calculated amount of descent of the roll 2 to lower the roll 2 .
In consideration of further pushing, the pushing amount, for example, 5 μm may be added to the lowering amount.
Step S4-11: For secondary transfer, the horizontal movement of the second table 14 and the rotation of the roll 2 are started from the state in which the second table 14 and the roll 2 are stationary. The horizontal moving speed of the second table 14 and the tangential speed of the roll 2 are matched. When the speeds match, the horizontal movement speed of the second table 14 and the rotation speed of the roll 2 are maintained constant (they become constant speeds).
Step S4-12: By rotating the roll 2 and horizontally moving the second table 14 in synchronization with the rotation of the roll 2, the attachment of the device C on the mounting board 13 from the adhesive sheet 1 is started ( See FIG. 3(B)(3)). Since the adhesive force of the adhesive layer provided on the chip T is greater than the adhesive force of the adhesive layer 1AL of the adhesive sheet 1, the device C in contact with the adhesive layer on the chip T is transferred from the adhesive sheet 1 onto the chip T. be.
In this step, the devices C are brought into contact with the chips T on the mounting board 13 from the adhesive sheet 1 one by one, adhered, and transferred.
Step S4-13: The transfer of the device C on the adhesive sheet 1 of the roll 2 to the mounting board 13 on the second table 14 is completed, and the rotation of the roll 2 and the movement of the second table 14 are stopped (Fig. 3(B)(4)).
The control device 80 first determines the position (rotation angle) of the row of devices C on the roll 2 to be secondary-transferred, the position (Y-axis coordinate) of the row of chips T on the mounting board 13, and finally the secondary Since the position (rotation angle) of the row of devices C on the roll 2 to be transferred and the position (Y-axis coordinate) of the row of chips T on the mounting substrate 13 are recognized, the horizontal movement of the second table 14 and The start and stop of rotation of the roll 2 can be controlled.
Step S4-14: The roll 2 rises (see FIG. 3(B)(5)).
Step S4-15: The second table 4 and roll 2 move to the origin (home position) (return to origin) (see FIG. 3(B) (6)).

In this way, according to the overall flow shown in FIG. 11, the device C is primarily transferred from the original transfer sheet 3 to the adhesive sheet 1 of the roll 2, and then secondarily transferred from the adhesive sheet 1 to the mounting board 13. FIG.
As described above, the device C is mounted on the predetermined chip T on the mounting substrate 13 with high positional accuracy in order to organically combine the image from the camera and the distance measurement result from the distance measuring device to align the device C and the chip T. Furthermore, the pressing amount during transfer can be accurately controlled.

According to the device mounting apparatus of the present invention, the device can be accurately transferred onto the mounting board via the adhesive sheet attached to the roll. Furthermore, it becomes possible to easily cope with deterioration of the adhesive force of the adhesive sheet over time, and the industrial applicability is high.

100 Device mounting apparatus 1, 1a, 1b, 1c Adhesive sheet 1AL Adhesive layer 1PL Protective layer 2 Roll 2S Shafts 3, 3', 3'' Transfer source sheet 4 First table (surface plate)
5 alignment mark 6 distance measuring device (displacement meter)
7a, 7b distance measuring instrument (displacement meter)
13 Mounting substrate (transfer destination substrate)
14 Second table (surface plate)
20 First camera 21 Second camera 22 Third camera 41 Plate 42 Exhaust passage 80 Control device J Rotational axes E1, E3, E13 Sides FL21, FL21-1, FL21-2, FL21-3 Field of view C, C' , C'' Device Cx, Cy Pitch T Chip (mount part)
Tx, Ty Pitch

Claims (5)

a cylindrical roll (2) rotatable about an axis of rotation (J);
a table (4, 14) having a table drive mechanism allowing horizontal movement and rotation about a vertical axis;
a roll camera (20) for imaging the surface of the roll (2);
table cameras (21, 22) for imaging the surface of the table (4);
a controller (80),
The tables (4, 14) include an adhesive sheet (1) to be attached to the roll (2), a transfer source sheet (3) having a device (C) on its surface, and a mount section to which the device (C) is transferred. A mounting substrate (13) having (T) on the surface is placed,
The control unit
Position of the device (C) by processing an image of the device (C) by the roll camera (20) in a state of being adhered to the adhesive sheet (1) adhered to the roll (2) get information,
Acquiring positional information of the mount portion (T) by processing an image of the mount portion (T) by the table cameras (21, 22) while the mount portion (T) is placed on the table (2);
A device mounting apparatus for controlling alignment between said roll (2) and said table (4, 14) based on positional information of said mount (T) and positional information of said device (C). a first distance measuring device (6) for measuring the height of the mounting portion (T) of the mounting substrate (13) placed on the table (4, 14);
A second distance measuring device (7a, 7b) for measuring the distance between the table (4, 14) and the device (C) on the adhesive sheet (1) attached to the roll (2). 2. The device mounting apparatus according to claim 1, wherein: 3. The device mounting apparatus according to claim 1, wherein said roll (2) is partially covered with said adhesive sheet (1). 4. The device mounting apparatus according to claim 1, wherein said table (4, 14) has a vacuum chuck. A step S1 of sticking the adhesive sheet (1) on the roll (2);
a step S2 of primarily transferring the device (C) on the transfer source sheet (3) to the adhesive sheet (1);
a step S3 of measuring the position of the device (C) on the adhesive sheet (1);
a step S4 of secondary transfer of the device (C) on the adhesive sheet (1) to the mounting substrate (13),
In step S3,
An image of the device (C) on the adhesive sheet (1) photographed by the roll camera (20) is processed to obtain position information of the device (C),
In step S4,
an image of the mounting portion (T) on the mounting substrate (13) photographed by the table camera (21) is processed to acquire positional information of the mounting portion;
Obtaining the height from the table (4, 14) to the mount portion (T) on the mounting board (13) by the first distance measuring device (6),
Acquiring the distance from the table (4, 14) to the device (C) on the adhesive sheet (1) attached to the roll (2) by the second distance measuring device (7a, 7b),
aligning the mounting board (13) placed on the table (4, 14) with respect to the roll (2) by collating the positional information of the device (C) with the positional information of the mounting portion;
Based on the proximity distance calculated from the height from the table (4, 14) to the mount part (T) and the distance from the table (4, 14) to the device (C), the device (C) and the Bringing the roll (2) close to the table (4, 14) so that it can come into contact with the mount part (T),
3. The apparatus according to claim 2, wherein the device (C) is transferred to the mount portion (T) by relatively moving the tables (4, 14) while rotating the roll (2). A device mounting method for a device mounting apparatus.

Images