TWI791270B - Correction apparatus, correction method, and handler using the same - Google Patents
Correction apparatus, correction method, and handler using the same Download PDFInfo
- Publication number
- TWI791270B TWI791270B TW110131117A TW110131117A TWI791270B TW I791270 B TWI791270 B TW I791270B TW 110131117 A TW110131117 A TW 110131117A TW 110131117 A TW110131117 A TW 110131117A TW I791270 B TWI791270 B TW I791270B
- Authority
- TW
- Taiwan
- Prior art keywords
- detection
- operating
- program
- corrector
- operator
- Prior art date
Links
Images
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本發明有關一種以取像式檢知複數個作業器於複數個方向上之位置,利於補償校正複數個作業器之實際作業位置,而提高作業精準性之校正裝置及校正方法。 The present invention relates to a calibration device and a calibration method for detecting the positions of a plurality of operating devices in multiple directions by means of imaging, which is beneficial for compensating and correcting the actual operating positions of the plurality of operating devices and improving the accuracy of the operation.
在現今,作業機以作業機構(如移料機構或打印機構等)之作業器(如移料器或打印器等)於不同承置器(如料盤、載台、測試器或預溫盤等)對電子元件執行預設作業(如取放料作業或打印作業等)。舉一為移料機構之作業機構為例,移料機構具有複數個移料器,並位移至預設作業位置而執行複數個電子元件之取放料作業,由於電子元件日趨精密微小,因此,對於複數個移料器同步將複數個電子元件移入載台之複數個容置槽的作業位置精準度要求相當高;然移料機構於更換一批次複數個移料器、複數個移料器取放精度有異或移料器撞機等因素下,移料器之作業位置易發生異常;例如移料器因傾斜組裝,而導致複數個移料器之間距發生異常;例如移料器因裝配高度不足,導致取放料高度作業位置異常;前述異常狀態均使移料器無法精準取放電子元件,業者必須對移料機構之複數個移料器的作業位置精準度作一檢知校正。 Nowadays, the operating machine uses an operating device (such as a material transfer device or a printer, etc.) of an operating mechanism (such as a material transfer mechanism or a printing mechanism, etc.) etc.) Execute preset operations on electronic components (such as pick-and-place operations or print operations, etc.). Take the operating mechanism of the material shifting mechanism as an example. The material moving mechanism has a plurality of material shifters, and moves to the preset operating position to perform the pick-and-place operation of a plurality of electronic components. Since the electronic components are becoming more and more sophisticated, therefore, For multiple material shifters to simultaneously move multiple electronic components into the multiple accommodating slots of the carrier, the accuracy of the operation position is quite high; however, the material transfer mechanism is used to replace a batch of multiple material shifters and multiple material shifters. Due to factors such as differences in pick-and-place accuracy or collision of the material shifter, the working position of the material shifter is likely to be abnormal; Insufficient assembly height leads to abnormal working position of pick-and-place materials; the above-mentioned abnormal conditions make the material shifter unable to accurately pick and place electronic components, and the industry must check and correct the accuracy of the working positions of multiple material shifters in the material shifting mechanism .
本發明之目的一,提供一種校正裝置,以供校正複數個作業器之位置,校正裝置包含承具、第一位置校正器及第二位置校正器,承具為固定式配置,並於上方構成檢知區域,第一位置校正器裝配於承具之第一檢知位置,以供朝第一方向作側向取像位於檢知區域之作業器,而檢知作業器於第二方向上的位置,第二位置校正器裝配於承具之第二檢知位置,以供朝第二方向作側向取像位於檢知區域之作業器,而檢知作業器於第一方向上的位置;藉以取得複數個作業器之位置偏差值,進而利於補償校正複數個作業器之實際作業位置,進而提高作業精準性。 The first object of the present invention is to provide a calibration device for correcting the positions of a plurality of operating devices. The calibration device includes a support, a first position corrector and a second position corrector. The support is fixed and configured on the top. In the detection area, the first position corrector is installed at the first detection position of the support for lateral imaging of the operating device in the detection area in the first direction, and the detection of the operating device in the second direction Position, the second position corrector is assembled at the second detection position of the support, for taking lateral images of the operating device located in the detection area in the second direction, and detecting the position of the operating device in the first direction; In order to obtain the position deviation value of a plurality of operating devices, it is beneficial to compensate and correct the actual operating positions of a plurality of operating devices, thereby improving the operating accuracy.
本發明之目的二,提供一種校正裝置,更包含至少一高度校正器,高度校正器檢知位於承具之檢知區域的作業器於第三方向上的位置(作業高度位置),以取得高度位置偏差值,利於補償校正複數個作業器之實際作業高度位置,進而提高作業精準性。 The second object of the present invention is to provide a calibration device, which further includes at least one height calibrator. The height calibrator detects the position (working height position) of the operating device located in the detection area of the support in the third direction, so as to obtain the height position The deviation value is beneficial to compensate and correct the actual working height positions of multiple working devices, thereby improving the working accuracy.
本發明之目的三,提供一種校正裝置,更包含第一調整器及第二調整器,第一調整器及第二調整器裝配於承具,並各別承裝第一位置校正器及第二位置校正器,第一調整器及第二調整器依作業需求而分別調整第一位置校正器及第二位置校正器之裝配位置,進而提高校正作業精準性。 The third object of the present invention is to provide a calibration device, which further includes a first adjuster and a second adjuster. The position corrector, the first adjuster and the second adjuster respectively adjust the assembly positions of the first position corrector and the second position corrector according to the operation requirements, thereby improving the accuracy of the calibration operation.
本發明之目的四,提供一種校正方法,以供校正複數個作業器之位置,包含第一移載作業器程序、第一檢知程序、第二檢知程序及比對程序;第一移載作業器程序以移載複數個作業器於承具上方之檢知區域沿第一方向位移預設間距值;第一檢知程序以第一位置校正器於承具之第一檢知位置朝第一方向作取像式檢知複數個作業器於第二方向上之位置;第二檢知程序以第二位置校正器於承具之第二檢知位置朝第二方向作取像式檢知複數個作業器於第一 方向上之位置;比對程序以處理器接收第一檢知程序及第二檢知程序傳輸之複數個作業器位置資料,以分析複數個作業器於第一方向及第二方向上之位置,而取得複數個作業器之位置偏差值,並補償校正複數個作業器之實際作業位置,進而提高作業精準性。 The fourth object of the present invention is to provide a calibration method for correcting the positions of a plurality of operators, including the first transfer operator program, the first detection program, the second detection program and the comparison program; the first transfer The operator program is to move a plurality of operators to the detection area above the bearing and move the preset distance value along the first direction; the first detection program uses the first position corrector to move toward the first detection position of the bearing The position of a plurality of operating devices in the second direction is detected by imaging in one direction; the second detection program uses the second position corrector to perform image detection in the second direction at the second detection position of the support multiple operators in the first The position in the direction; the comparison program uses the processor to receive the position data of multiple operators transmitted by the first detection program and the second detection program, so as to analyze the positions of multiple operators in the first direction and the second direction, To obtain the position deviation value of multiple operating devices, and compensate and correct the actual operating positions of multiple operating devices, thereby improving the operating accuracy.
本發明之目的五,提供一種校正方法,更包含前置程序,前置程序係預設一位於檢知區域之作業器的中心位置作為校正初始位置,以供其他作業器以校正初始位置為基準位移預設間距值。 The fifth object of the present invention is to provide a calibration method, which further includes a pre-program. The pre-program presets the center position of an operator located in the detection area as the calibration initial position, so that other operators can use the calibration initial position as a reference Shift preset spacing value.
本發明之目的六,提供一種校正方法,更包含第二移載作業器程序及第三檢知程序,第二移載作業器程序以移載複數個作業器於承具之檢知區域沿第三方向位移預設高度值;第三檢知程序以高度校正器檢知複數個作業器於第三方向上之位置;比對程序以處理器接收第三檢知程序傳輸之複數個作業器位置資料,藉以取得複數個作業器之高度位置偏差值,並補償校正作業器之實際高度作業位置,進而提高作業精準性。 The sixth object of the present invention is to provide a calibration method, which further includes a second transfer operation device program and a third detection program, the second transfer operation device program is used to transfer a plurality of operation devices along the detection area of the bearing The preset height value is displaced in three directions; the third detection program uses the height corrector to detect the position of multiple operators in the third direction; the comparison program uses the processor to receive the position data of multiple operators transmitted by the third detection program , so as to obtain the height position deviation value of a plurality of operators, and compensate and correct the actual height and working position of the operators, thereby improving the operation accuracy.
本發明之目的七,提供一種作業機,包含機台、至少一作業裝置、本發明校正裝置及中央控制裝置,至少一作業裝置配置於機台,並設有至少一承置器及至少一作業機構,至少一承置器供承置複數個電子元件,作業機構設有複數個作業器,以供對複數個電子元件執行預設作業;本發明校正裝置配置於機台,以供校正複數個作業器之位置;中央控制裝置以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 The seventh object of the present invention is to provide an operating machine, which includes a machine platform, at least one operating device, a calibration device of the present invention, and a central control device. Mechanism, at least one holder is used to support a plurality of electronic components, and the operating mechanism is provided with a plurality of operating devices for performing preset operations on a plurality of electronic components; The position of the operating device; the central control device controls and integrates the actions of each device to perform automated operations and achieve the practical benefit of improving operating efficiency.
10:機台 10: machine
20:作業裝置 20: Operating device
21:供料器 21: Feeder
22:收料器 22: Receiver
23:第一移料機構 23: The first material transfer mechanism
231:移動臂 231: mobile arm
232:變距單元 232: Variable pitch unit
2331:第一移料器 2331: The first shifter
2332:第二移料器 2332: Second shifter
2333:第三移料器 2333: The third shifter
2334:第四移料器 2334: The fourth shifter
2341:第一升降器 2341: First Lifter
2342:第二升降器 2342:Second lifter
2343:第三升降器 2343: Third lifter
2344:第四升降器 2344: Fourth lifter
24:測試器 24: Tester
25:第一載台 25: The first platform
26:壓接器 26: crimping device
27:第二載台 27: The second platform
28:第二移料機構 28: The second material transfer mechanism
29:測試室 29: Testing Room
30:校正裝置 30: Calibration device
31:承具 31: bearing
311:通孔 311: through hole
32:第一位置校正器 32: First position corrector
321:第一光源 321: The first light source
L1:第一檢知軸線 L1: the first detection axis
33:第二位置校正器 33: Second position corrector
331:第二光源 331: second light source
L2:第二檢知軸線 L2: The second detection axis
341:第一調整器 341: first adjuster
342:第二調整器 342: second adjuster
35:高度校正器 35: Altitude corrector
36:第三調整器 36: The third adjuster
圖1:本發明作業機之配置圖。 Fig. 1: Configuration diagram of the working machine of the present invention.
圖2:本發明移料機構之示意圖。 Figure 2: A schematic diagram of the material transfer mechanism of the present invention.
圖3:本發明校正裝置之俯視圖。 Figure 3: A top view of the calibration device of the present invention.
圖4:本發明校正裝置之側視圖。 Figure 4: Side view of the calibration device of the present invention.
圖5:本發明校正方法之流程圖。 Fig. 5: Flowchart of the calibration method of the present invention.
圖6:移料器位於檢知區域之校正初始位置的示意圖。 Figure 6: Schematic diagram of the corrected initial position of the material shifter in the detection area.
圖7:校正移料器於第一方向上的位置之示意圖。 Fig. 7: A schematic diagram of correcting the position of the material shifter in the first direction.
圖8:校正移料器於第二方向上的位置之示意圖。 Fig. 8: A schematic diagram of correcting the position of the material shifter in the second direction.
圖9:校正移料器於第三方向上的位置之示意圖。 Figure 9: Schematic diagram of correcting the position of the material shifter in the third direction.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱圖1~4,本發明作業機包含機台10、至少一作業裝置20、至少一本發明校正裝置30及中央控制裝置(圖未示出)。至少一作業裝置20配置於機台10,並設有至少一承置器及至少一作業機構,至少一承置器以供承置複數個電子元件,至少一作業機構設有複數個作業器,以供對複數個電子元件執行預設作業;本發明校正裝置30配置於機台10,以供校正作業機構之複數個作業器於複數個方向的位置;中央控制裝置以供控制及整合各裝置作動,以執行自動化作業。依作業需求,作業裝置20之承置器可為供料器、收料器、載台、測試器或預溫盤等,以供盛裝複數個電子元件;作業裝置20之作業機構可為移料機構、壓接機構或打印機構等,作業器可為移料器、壓接器或打印器等,不受限於本實施例。
In order to make your examiners have a better understanding of the present invention, hereby cite a preferred embodiment and cooperate with the drawings, and the details are as follows: Please refer to Figures 1 to 4, the operating machine of the present invention includes a
為清楚說明本案,本案所稱之第一方向或第二方向可為X方向或Y方向,本案實施例所述之第一方向為X方向,第二方向為Y方向,第三方向為Z方向;檢知軸線之方向相同於作業器之移動方向。 In order to clearly illustrate this case, the first direction or the second direction referred to in this case may be the X direction or the Y direction, the first direction described in the embodiment of this case is the X direction, the second direction is the Y direction, and the third direction is the Z direction ; The direction of the detection axis is the same as the moving direction of the operating device.
於本實施例,作業裝置20包含供料器21、收料器22、一為第一移料機構23之作業機構、測試器24、第一載台25、壓接器26、第二載台27及另一為第二移料機構28之作業機構、溫控機構(圖未示出)及測試室29。供料器21供盛裝複數個待測之電子元件;收料器22供盛裝複數個已測之電子元件;第一移料機構23與第二移料機構28之設計相同,茲舉第一移料機構23為例,第一移料機構23設有移動臂231、變距單元232及複數個為移料器之作業器,移動臂231帶動變距單元232及複數個移料器作X-Y方向位移及較大行程之Z方向位移,複數個移料器包含第一移料器2331、第二移料器2332、第三移料器2333及第四移料器2334,並以固定配置之第二移料器2332作為變距基準,第一移料器2331、第三移料器2333及第四移料器2334連接變距單元232,依作業需求,變距單元232驅動第一移料器2331、第三移料器2333及第四移料器2334以第二移料器2332為基準作X方向位移預設間距值而改變間距;又第一移料器2331、第二移料器2332、第三移料器2333及第四移料器2334分別連接第一升降器2341、第二升降器2342、第三升降器2343及第四升降器2344,以供作Z方向位移至預設高度作業位置而取放電子元件;因此,第一移料機構23以移動臂231帶動第一移料器2331、第二移料器2332、第三移料器2333及第四移料器2334於供料器21取出複數個待測之電子元件。
In this embodiment, the operating
測試器24包含電性連接之電路板及具探針之測試座,以供測試電子元件,第一載台25以供載送待測之電子元件作至少一方向位移,舉例第一載
台25可載送待測電子元件至測試器24之側方,舉例第一載台25可載送待測電子元件至測試器24之下方;於本實施例,第一載台25以供第一移料機構23之第一移料器2331、第二移料器2332、第三移料器2333及第四移料器2334移入複數個待測電子元件,並將複數個待測電子元件移載至測試器24之側方;壓接器26於第一載台25取出複數個待測之電子元件,以移載且下壓複數個待測電子元件於測試器24執行測試作業,測試室29罩置於測試器24之外部,於冷測作業時,以流體輸送管(圖未示出)輸送乾燥空氣至測試室29,溫控機構(圖未示出)於壓接器26設有溫控件,以供溫控電子元件,使電子元件於模擬日後使用環境溫度下執行測試作業;於完測後,壓接器26將複數個已測電子元件由測試器24移載至第二載台27;第二載台27載出複數個已測之電子元件,第二移料機構28於第二載台27取出複數個已測之電子元件,並依據測試結果,將複數個已測之電子元件輸送至收料器22而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,進而提升作業效能。
The
然,作業裝置20依作業需求,可僅配置第一移料機構23,以第一移料機構23於供料器21及收料器22移載待測電子元件及已測電子元件,亦無不可。作業裝置20依作業需求,可僅配置第一載台25,以第一載台25載送待測電子元件及已測電子元件,亦無不可。作業裝置20依作業需求,壓接器26可作單一方向或複數個方向位移,舉例壓接器26可搭配移料機構作動,移料機構將待測電子元件移入測試器24,壓接器26作單一方向位移僅執行下壓動作,亦無不可。作業裝置20依作業需求,於熱測作業時,測試室29內可配置鼓風機,以供吹送熱風,使測試室29之內部升溫,亦無不可。作業裝置20依作業需求,而配置預溫盤,以供預溫待測之電子元件。
However, the operating
校正裝置30以供校正作業機構之複數個作業器於複數個方向上的位置;校正裝置30包含承具31、第一位置校正器32及第二位置校正器33。
The
承具31為固定式配置,並於上方構成檢知區域;更進一步,承具31可為座體、板體或機台板;於本實施例,承具31為板體,其頂面為平面,並於上方構成一檢知區域;另於承具31開設至少一通孔311,通孔311由承具31之底面貫通至頂面,且相通至檢知區域。
The supporting
第一位置校正器32沿第一檢知軸線L1裝配於承具31之第一檢知位置,以供朝第一方向作側向取像位於檢知區域之作業器,而檢知作業器於第二方向上的位置;更進一步,第一位置校正器32裝配至少一第一光源,第一光源朝向作業器投射光束。於本實施例,第一位置校正器32為CCD,並沿第一檢知軸線L1裝配於承具31第一側之第一檢知位置,第一位置校正器32之中心位置對位於承具31之中心位置;第一位置校正器32於取像端裝配第一光源321,第一光源321以供朝第一方向投射光束,第一位置校正器32朝第一方向作側向取像作業器。
The
第二位置校正器33沿第二檢知軸線L2裝配於承具31之第二檢知位置,以供朝第二方向作側向取像位於檢知區域之作業器,而檢知作業器於第一方向上的位置;更進一步,第二位置校正器33裝配至少一第二光源,第二光源朝向作業器投射光束。於本實施例,第二位置校正器33為CCD,並沿第二檢知軸線L2裝配於承具31第二側之第二檢知位置,第二側相鄰第一側,第二位置校正器33之中心位置對位於承具31之中心位置;第二位置校正器33於取像端裝配第二光源331,第二光源331以供朝第二方向投射光束,第二位置校正器33朝第二方向取像作業器。
The
校正裝置30更包含第一調整器341及第二調整器342,第一調整器341及第二調整器342裝配於承具31,並各別承裝第一位置校正器32及第二位置校正器33,第一調整器341及第二調整器342依作業需求而分別調整第一位置校正器32及第二位置校正器33之裝配位置(如裝配高度位置),以提高校正作業準確性。於本實施例,第一調整器341裝配於承具31之第一側,以供架置及調整第一位置校正器32之裝配位置及高度;第二調整器342裝配於承具31之第二側,以供架置及調整第二位置校正器33之裝配位置及高度。
The
校正裝置30更包含至少一高度校正器35,高度校正器35檢知位於承具31之檢知區域的作業器於第三方向上的位置;高度校正器35可作接觸式或非接觸式檢知作業器於第三方向上的位置,舉例高度校正器35為反射型感測器,並裝配於承具31之通孔311下方,而作非接觸式檢知作業器於第三方向上的位置;舉例高度校正器35為導電型感測器,並裝配於承具31之頂面,而作接觸式檢知作業器於第三方向上的位置;於本實施例,高度校正器35為反射型感測器,並配置承具31之通孔311下方,高度校正器35可經通孔311由下向上朝檢知區域投射光束,並接收反射之光束。
The
校正裝置30更包含至少一第三調整器36,以供架置及調整高度校正器35之裝配位置及高度。
The
承上述,承具31可於頂面設有凹槽,並於凹槽之第一側面及第二側面分別裝配第一位置校正器32及第二位置校正器33,亦無不可;更進一步,於凹槽之底面開設通孔311,以供高度校正器35檢知作業器於第三方向上之位置(作業高度位置)。
In view of the above, the
請參閱圖2、5~9,本發明之校正方法包含第一移載作業器程序、第一檢知程序、第二檢知程序及比對程序。第一移載作業器程序以移載複數個作業器於承具31上方之檢知區域沿第一方向位移預設間距值;第一檢知程序以第一位置校正器32於承具31之第一檢知位置朝第一方向作側向取像式檢知作業器於第二方向上之位置;第二檢知程序以第二位置校正器33於承具31之第二檢知位置朝第二方向作側向取像式檢知作業器於第一方向上之位置;比對程序以處理器接收第一檢知程序及第二檢知程序傳輸之複數個作業器位置資料,以分析複數個作業器於第一方向及第二方向上之位置,而取得複數個作業器之位置偏差值,並補償校正複數個作業器之實際作業位置。
Please refer to Figures 2, 5-9, the calibration method of the present invention includes a first transfer operator program, a first detection program, a second detection program and a comparison program. The first transfer operation program is to transfer a plurality of operation devices to the detection area above the
本發明校正方法更包含第二移載作業器程序及第三檢知程序,第二移載作業器程序位於比對程序之前,並以移載複數個作業器於承具31上方之檢知區域沿第三方向位移預設高度值;接續第三檢知程序以高度校正器35檢知作業器於第三方向上之位置,比對程序以處理器接收第三檢知程序傳輸之複數個作業器位置資料,以取得複數個作業器之高度位置偏差值,並補償校正作業器之實際高度作業位置。然依作業需求及位置校正器之型式,第一移載作業器程序更包含第一微動手段,第一微動手段以作業器再沿第一方向作微動位移,以供第二檢知程序檢知作業器微動後之位置,以及供比對程序分析微動後之位置資料,亦可取得作業器於第一方向上之位置偏差值;第二移載作業器程序更包含第二微動手段,第二微動手段以作業器再沿第三方向作微動位移,以供第三檢知程序檢知作業器微動後之位置,以及供比對程序分析微動後之位置資料,亦可取得作業器於第三方向上之高度位置偏差值。
The calibration method of the present invention further includes a second transfer operator program and a third detection program, the second transfer operator program is located before the comparison program, and transfers a plurality of operators to the detection area above the
校正方法更包含前置程序,前置程序位於第一移載作業器程序之前,並預設一位於檢知區域之作業器的中心位置作為校正初始位置,以供其他作業器以校正初始位置為基準而位移預設間距值;例如以固定式作業器或第一支作業器作為預設之一作業器,校正初始位置可相同或相異承具31之中心位置;舉例預設之一作業器為固定式作業器,由於原點至承具31中心的距離為已知,並已知作業器之直徑,可將預設之固定式作業器由原點移動至承具31之中心,令固定式作業器之中心位置對位承具31之中心位置,即可以固定式作業器之中心位置(即承具31之中心)作為校正初始位置,以供其他作業器以固定式作業器之中心位置(即承具31之中心)為基準而位移預設間距值。
The calibration method further includes a pre-program. The pre-program is located before the first transfer operator program, and the center position of an operator located in the detection area is preset as the calibration initial position for other operators to calibrate the initial position as The reference is displaced by the preset spacing value; for example, the fixed operator or the first operator is used as a preset operator, and the initial position of the correction can be the same as or different from the center position of the
請參閱圖2、6,於本實施例,檢知第一移料器2331、第二移料器2332、第三移料器2333及第四移料器2334之實際作業位置;由於原點至承具31中心的距離為已知,並已知各移料器之直徑,前置程序以固定式之第二移料器2332作為預設基準之移料器,將第二移料器2332由原點移動至承具31之中心位置,且位於檢知區域,令第二移料器2332之中心對位承具31之中心位置,處理器分析判斷以第二移料器2332之中心位置(即承具31之中心位置)作為校正初始位置,而供第一移料器2331、第三移料器2333及第四移料器2334以校正初始位置為基準而位移預設間距值。
Please refer to Fig. 2, 6, in this embodiment, detect the actual operation position of the
請參閱圖2、7,以檢知第一移料器2331於第二方向(Y方向)上之位置為例,第一移載作業器程序以移動臂231帶動第一移料器2331於承具31上方之檢知區域沿第一方向(X方向)位移一預設間距值,由於第一移料器2331已作Z方向向下位移,使得第一移料器2331位於第一位置校正器32及第二位置校正器33的取像範圍,第一檢知程序以第一位置校正器32於承具31之第一檢知位置朝
第一方向取像第一移料器2331,亦即第一位置校正器32可由第一移料器2331之側方作取像,而取得具有第一移料器2331二邊緣距離之第一移料器Y方向取像資料,並將第一移料器Y方向取像資料傳輸至處理器(圖未示出),由於第一位置校正器32之中心位置對位於承具31之中心位置,比對程序之處理器接收第一檢知程序傳輸之第一移料器Y方向取像資料,可將第一位置校正器32之中心位置與第一移料器Y方向取像資料之中心位置作比對分析,以判別第一移料器2331於第二方向(Y方向)上之Y座標位置是否正確,若處理器分析第一移料器2331之Y座標位置異常,且為傾斜配置,處理器可經由運算取得第一移料器2331之Y方向偏差值,以利補償校正第一移料器2331之實際作業位置;因此,以上述方法,可依序取得第三移料器2333及第四移料器2334於第二方向(Y方向)上之位置(Y座標值)。
Please refer to Figures 2 and 7, taking the detection of the position of the
請參閱圖2、8,檢知第一移料器2331於第一方向(X方向)上的位置為例,由於第一移料器2331位於第一位置校正器32及第二位置校正器33的取像範圍,第二檢知程序以第二位置校正器33於承具31之第二檢知位置朝第二方向取像第一移料器2331,亦即第二位置校正器33可由第一移料器2331之另一側方作取像,而取得具有第一移料器2331另二邊緣距離之第一移料器X方向取像資料,並將第一移料器X方向取像資料傳輸至處理器(圖未示出),由於第二位置校正器33之中心位置對位於承具31之中心位置,比對程序之處理器接收第二檢知程序傳輸之第一移料器X方向取像資料,可將第二位置校正器33之中心位置與第一移料器X方向取像資料之中心位置作比對分析,以判別第一移料器2331於第一方向(X方向)上之X座標位置是否正確,若處理器分析第一移料器2331之X座標位置異常,且為傾斜配置,處理器可經由運算取得第一移料器2331之X方
向偏差值,以利補償校正第一移料器2331之實際作業位置;因此,以上述方法,可依序取得第三移料器2333及第四移料器2334於第一方向(X方向)上之位置(X座標值)。
Please refer to FIGS. 2 and 8 , the detection of the position of the
因此,於取得第一移料器2331、第三移料器2333及第四移料器2334之X-Y方向位置偏差值,並以第二移料器2332為基準,而分別調整補償第一移料器2331、第三移料器2333及第四移料器2334之實際作業位置。
Therefore, after obtaining the X-Y position deviation values of the
請參閱圖9,校正移料器於第三方向(Z方向)上的位置,以校正第一移料器2331之實際高度作業位置為例,第二移載作業器程序以移動臂231帶動第一移料器2331位移至承具31之檢知區域且位於通孔311之上方,並以第一升降器2341帶動第一移料器2331沿第三方向(Z方向)向下位移一預設高度值;由於高度校正器35為反射型感測器,並位於承具31之通孔311下方,且朝通孔311投射光束;第三檢知程序之高度校正器35對第一移料器2331作非接觸式投射光束,並接收第一移料器2331所反射之光束,且傳輸一訊號至處理器;比對程序以處理器分析高度校正器35所接收光束之反射距離值,加以判斷第一移料器2331於第三方向(Z方向)上之高度位置是否正確,並取得第一移料器2331於第三方向上之高度位置偏差值,以補償校正第一移料器2331之實際高度作業位置;因此,以上述方法,可依序取得第二移料器2332、第三移料器2333及第四移料器2334於第三方向(Z方向)上之高度位置偏差值,並補償校正實際高度作業位置,進而提高作業精準性。
Please refer to Fig. 9, to correct the position of the material shifter in the third direction (Z direction), take the actual height operation position of the
231:移動臂 231: mobile arm
2331:第一移料器 2331: The first shifter
2332:第二移料器 2332: Second shifter
31:承具 31: bearing
32:第一位置校正器 32: First position corrector
33:第二位置校正器 33: Second position corrector
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110131117A TWI791270B (en) | 2021-08-23 | 2021-08-23 | Correction apparatus, correction method, and handler using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110131117A TWI791270B (en) | 2021-08-23 | 2021-08-23 | Correction apparatus, correction method, and handler using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI791270B true TWI791270B (en) | 2023-02-01 |
TW202309689A TW202309689A (en) | 2023-03-01 |
Family
ID=86688983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110131117A TWI791270B (en) | 2021-08-23 | 2021-08-23 | Correction apparatus, correction method, and handler using the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI791270B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201018636A (en) * | 2008-11-07 | 2010-05-16 | Mirae Corp | An apparatus for correcting position of a user tray and a test handler |
TW201622909A (en) * | 2014-12-26 | 2016-07-01 | Kawasaki Heavy Ind Ltd | Production system |
TW201710689A (en) * | 2015-09-10 | 2017-03-16 | Hon Tech Inc | Electronic part transportation correction method that enhances accuracy of parts transportation and testing quality |
TW201742809A (en) * | 2016-06-01 | 2017-12-16 | Seiko Epson Corp | Electronic component conveying apparatus and electronic component inspection apparatus capable of changing a holding operation according to the distance between the respective holding units |
WO2020128298A1 (en) * | 2018-12-17 | 2020-06-25 | Safran Aircraft Engines | Double corrector for asymmetrical mechanism compensation |
TW202043126A (en) * | 2019-05-29 | 2020-12-01 | 日商精工愛普生股份有限公司 | Electronic component handler and electronic component tester |
-
2021
- 2021-08-23 TW TW110131117A patent/TWI791270B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201018636A (en) * | 2008-11-07 | 2010-05-16 | Mirae Corp | An apparatus for correcting position of a user tray and a test handler |
TW201622909A (en) * | 2014-12-26 | 2016-07-01 | Kawasaki Heavy Ind Ltd | Production system |
TW201710689A (en) * | 2015-09-10 | 2017-03-16 | Hon Tech Inc | Electronic part transportation correction method that enhances accuracy of parts transportation and testing quality |
TW201742809A (en) * | 2016-06-01 | 2017-12-16 | Seiko Epson Corp | Electronic component conveying apparatus and electronic component inspection apparatus capable of changing a holding operation according to the distance between the respective holding units |
WO2020128298A1 (en) * | 2018-12-17 | 2020-06-25 | Safran Aircraft Engines | Double corrector for asymmetrical mechanism compensation |
TW202043126A (en) * | 2019-05-29 | 2020-12-01 | 日商精工愛普生股份有限公司 | Electronic component handler and electronic component tester |
Also Published As
Publication number | Publication date |
---|---|
TW202309689A (en) | 2023-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20180059176A1 (en) | Offline vision assist method and apparatus for integrated circuit device vision alignment | |
US6456062B2 (en) | Contact arm and electronic device testing apparatus using the same | |
JP4851361B2 (en) | Electronic circuit component mounting device | |
KR102535099B1 (en) | Testing apparatus and method of controlling testing apparatus | |
TWI741442B (en) | Correction device, correction method and working equipment for application thereof | |
TWI791270B (en) | Correction apparatus, correction method, and handler using the same | |
US20180356460A1 (en) | Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method | |
TWI775471B (en) | Correction apparatus, correction method, and handler using the same | |
TWI467197B (en) | An electronic component operating unit for an image capturing device, and a working device for its application | |
TWI777740B (en) | Correction apparatus, correction method, and handler using the same | |
TWI767736B (en) | Correction apparatus, correction method, and handler using the same | |
US7336087B2 (en) | Circuit board test device comprising contact needles which are driven in diagonally protruding manner | |
TWI545329B (en) | An electronic component operating device, a working method, and a working device for its application | |
TWI827063B (en) | Processing apparatus, detecting method and handler | |
TWI827351B (en) | Image acquiring and correcting method of electronic component | |
KR20220019369A (en) | Bonding apparatus and bonding method | |
KR20080108641A (en) | Apparatus for measuring and calibrating error of wafer prober | |
TW201619023A (en) | Correction unit of operation device and correction method thereof | |
TW202144755A (en) | Correction method for an operation device, correction device and operation equipment using the same | |
TWI794968B (en) | Sensing mechanism of supporter, processing device having the same, and processing machine having the same | |
TWI811770B (en) | Transmission mechanism, testing equipment, detecting method, and handler using the same | |
JP7011745B1 (en) | Device mounting device and device mounting method using it | |
TW202419346A (en) | Negative pressure detecting method | |
TWI769698B (en) | Image taking apparatus and handler using the same | |
TW202419347A (en) | Negative pressure detecting method |