TWI769698B - Image taking apparatus and handler using the same - Google Patents

Image taking apparatus and handler using the same Download PDF

Info

Publication number
TWI769698B
TWI769698B TW110104733A TW110104733A TWI769698B TW I769698 B TWI769698 B TW I769698B TW 110104733 A TW110104733 A TW 110104733A TW 110104733 A TW110104733 A TW 110104733A TW I769698 B TWI769698 B TW I769698B
Authority
TW
Taiwan
Prior art keywords
electronic components
image capturing
conveyor
carrier
imaging
Prior art date
Application number
TW110104733A
Other languages
Chinese (zh)
Other versions
TW202232058A (en
Inventor
張原龍
Original Assignee
鴻勁精密股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鴻勁精密股份有限公司 filed Critical 鴻勁精密股份有限公司
Priority to TW110104733A priority Critical patent/TWI769698B/en
Application granted granted Critical
Publication of TWI769698B publication Critical patent/TWI769698B/en
Publication of TW202232058A publication Critical patent/TW202232058A/en

Links

Images

Landscapes

  • Microscoopes, Condenser (AREA)

Abstract

The present invention reveals an image taking apparatus, including a driving mechanism, a focusing mechanism, and an imaging mechanism. The driving mechanism has a moving member which includes a first transmission member. The moving member can move along a driving axis. The focusing mechanism has a supporting member which includes a second transmission member. The second transmission member is driven by the first transmission member, driving the supporting member to move. The imaging mechanism has at least one imaging device which is disposed on the supporting member. The supporting member can move the image device vertically to fit with the focus length. Therefore, image resolution can be improved.

Description

取像裝置及其應用之作業設備Image pickup device and operating equipment for its application

本發明提供一種可調整取像器之取像焦距,以提高取像品質之取像裝置。 The invention provides an image capturing device which can adjust the image capturing focal length of the imager to improve the image capturing quality.

在現今,電子元件日趨微小精密,如何使電子元件之接點與測試座之探針精準對位,著實相當重要;目前測試作業設備於機台設有具探針之測試座,並以壓接器將電子元件移載至測試座之上方,一配置於測試座側方之取像裝置,利用移動平台帶動取像器於固定取像作業高度作水平位移至電子元件與測試座之間,使取像器取像電子元件及測試座,以由取像資料判別電子元件之接點與測試座之探針是否相互對位,而供調整電子元件之擺置位置;惟,不同型式之電子元件,其應用之測試座型式、高度也不同,但取像裝置之移動平台僅能帶動取像器作水平位移,且於固定取像作業高度取像測試座,導致取像器之取像焦距無法因應不同高度之測試座而改變,易發生影像失焦模糊的情形,不僅影響取像器之取像品質,更加無法判斷電子元件之接點與測試座之探針是否精準對位,進而影響測試品質。 Nowadays, electronic components are getting smaller and more precise. It is very important to accurately align the contacts of the electronic components with the probes of the test seat. At present, the test operation equipment is equipped with a test seat with a probe on the machine table, and is crimped The electronic component is moved to the top of the test seat by the device, and an image pickup device is arranged on the side of the test seat. The moving platform is used to drive the image pickup device to horizontally displace between the electronic component and the test seat at a fixed image pickup height. The imager takes images of the electronic components and the test seat, so as to determine whether the contacts of the electronic components and the probes of the test seat are aligned with each other from the imaging data, so as to adjust the placement position of the electronic components; however, different types of electronic components , The type and height of the test stand used are also different, but the moving platform of the image acquisition device can only drive the image finder to move horizontally, and the test stand is taken at a fixed image acquisition height, resulting in the image finder. Depending on the height of the test seat, it is easy to cause the image to be out of focus and blurred, which not only affects the image acquisition quality of the viewfinder, but also cannot determine whether the contact of the electronic component and the probe of the test seat are accurately aligned, thus affecting the test. quality.

本發明之目的一,提供一種取像裝置,包含驅動機構、調焦機構及取像機構,驅動機構設有具第一傳動部件之移動具,並以移動具沿驅動軸線 位移,調焦機構設有具第二傳動部件之承載具,第二傳動部件供移動具之第一傳動部件驅動,使承載具位移作動,取像機構之至少一取像器裝配於承載具,並由承載具帶動位移至不同取像高度,以供調整取像器對不同物件之取像焦距;藉以可視物件之作業位置,利用驅動機構搭配調焦機構而調整取像機構對不同物件之取像焦距,以獲得清晰影像資料,進而提高取像品質。 The first object of the present invention is to provide an imaging device, which includes a driving mechanism, a focusing mechanism and an imaging mechanism. Displacement, the focusing mechanism is provided with a carrier with a second transmission component, and the second transmission component is driven by the first transmission component of the moving tool, so that the carrier is displaced and actuated, and at least one imager of the imaging mechanism is assembled on the carrier, It is driven by the carrier to move to different heights for taking images, so as to adjust the focal length of the image finder for different objects; in this way, the working position of the objects can be seen, and the driving mechanism and the focusing mechanism are used to adjust the capturing mechanism of the imaging mechanism for different objects. The image focal length can be obtained to obtain clear image data, thereby improving the image quality.

本發明之目的二,提供一種取像裝置,其驅動機構之移動具與調焦機構之承載具作平行配置,而可縮減取像裝置之整體高度,使取像裝置適用於狹小空間環境,進而提高使用效能。 The second objective of the present invention is to provide an imaging device, in which the moving part of the driving mechanism and the carrier of the focusing mechanism are arranged in parallel, so that the overall height of the imaging device can be reduced, so that the imaging device is suitable for a narrow space environment, and further Improve use efficiency.

本發明之目的三,提供一種作業設備,包含機台、供料裝置、收料裝置、作業裝置、本發明取像裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料容置器,以供容置至少一待作業電子元件;收料裝置配置於機台,並設有至少一收料容置器,以供容置至少一已作業電子元件;作業裝置配置於機台,並設有作業機構及輸送機構,作業機構供對電子元件執行預設作業,輸送機構供輸送電子元件;本發明取像裝置配置於機台,並設有驅動機構、調焦機構及取像機構,以供取像作業裝置之作業機構及電子元件;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The third object of the present invention is to provide an operation equipment, including a machine, a feeding device, a receiving device, an operating device, an imaging device of the present invention, and a central control device. The feeding device is arranged on the machine, and is provided with at least one supply a material container for accommodating at least one electronic component to be operated; the material receiving device is arranged on the machine table, and at least one material receiving container is provided for accommodating at least one electronic component that has been operated; the working device is arranged in The machine table is provided with an operating mechanism and a conveying mechanism. The operating mechanism is used for performing preset operations on the electronic components, and the conveying mechanism is used for conveying the electronic components; the imaging device of the present invention is arranged on the machine table, and is provided with a driving mechanism, a focusing mechanism and The imaging mechanism is used for the operating mechanism and electronic components of the imaging operation device; the central control device controls and integrates the actions of each device to perform automatic operations.

10:取像裝置 10: imaging device

111:馬達 111: Motor

112:螺桿螺座組 112: Screw screw seat group

113:移動具 113: Mobile

114:斜向導槽 114: Oblique guide groove

115:第一滑軌組 115: The first slide rail group

121:承載具 121: Carrier

1211:第一面 1211: The first side

1212:第二面 1212: Second side

122:滾輪 122: Roller

123:固定架 123:Fixed frame

1231:通孔 1231: Through hole

124:第二滑軌組 124: The second rail group

131:取像器 131: Viewfinder

1311:第一取像部 1311: The first imaging department

1312:第二取像部 1312: The second imaging department

14:連結板 14: Link Board

15:移動平台 15: Mobile Platforms

21:機台 21: Machine

22、22A:測試座 22, 22A: Test seat

23、23A:電子元件 23, 23A: Electronic components

24:輸送器 24: Conveyor

A:驅動軸線 A: Drive axis

B:取像軸線 B: take the image axis

L1:第一取像高度 L1: The first acquisition height

L2:第二取像高度 L2: Second acquisition height

30:機台 30: Machine

40:供料裝置 40: Feeding device

41:供料容置器 41: Feed container

50:收料裝置 50: Receiving device

51:收料容置器 51: Receiving container

60:作業裝置 60: Working device

611:電路板 611: circuit board

612:測試座 612: Test seat

62:第一拾取具 62: First Pickup

63:第一載台 63: The first stage

64、64A:壓接器 64, 64A: crimper

65:測試室 65: Test Room

651:流體輸送管 651: Fluid Delivery Tube

66:溫控件 66: Temperature control

67:第二載台 67: Second stage

68:第二拾取具 68: Second Pickup

圖1:本發明取像裝置之俯視圖。 FIG. 1 is a top view of the imaging device of the present invention.

圖2:本發明取像裝置之前視圖。 Figure 2: Front view of the imaging device of the present invention.

圖3:本發明取像裝置之使用示意圖(一)。 FIG. 3 is a schematic diagram (1) of the use of the imaging device of the present invention.

圖4:本發明取像裝置之使用示意圖(二)。 FIG. 4 is a schematic diagram (2) of the use of the imaging device of the present invention.

圖5:本發明取像裝置之使用示意圖(三)。 FIG. 5 is a schematic diagram of the use of the imaging device of the present invention (3).

圖6:係圖5之放大示意圖。 FIG. 6 is an enlarged schematic view of FIG. 5 .

圖7:本發明第一實施例之測試設備。 Fig. 7: Test equipment of the first embodiment of the present invention.

圖8:本發明第一實施例作業裝置之示意圖。 FIG. 8 is a schematic diagram of the working device according to the first embodiment of the present invention.

圖9:本發明第二實施例之測試設備。 Fig. 9: Test equipment of the second embodiment of the present invention.

圖10:本發明第二實施例作業裝置之示意圖。 FIG. 10 is a schematic diagram of the working device according to the second embodiment of the present invention.

圖11:本發明第三實施例之測試設備。 Fig. 11: Test equipment of the third embodiment of the present invention.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱圖1、2,本發明取像裝置10包含驅動機構、調焦機構及取像機構。 In order to make your examiners have a further understanding of the present invention, a preferred embodiment is hereby exemplified in conjunction with the drawings. The detailed description is as follows: Please refer to FIGS. 1 and 2. The imaging device 10 of the present invention includes a driving mechanism and a focusing mechanism. and imaging agencies.

驅動機構設有至少一可位移作動之移動具,移動具設有第一傳動部件;更進一步,驅動機構以驅動源驅動該移動具位移,即驅動源驅動該移動具沿驅動軸線A位移,驅動源可為壓缸、馬達或包含馬達及傳動組;移動具可為塊體、楔形塊或凸輪,第一傳動部件可為斜向導槽、楔形面、凸輪面或滾輪等,驅動軸線A可為線性軸線或旋轉軸線,不受限於本實施例。 The driving mechanism is provided with at least one movable tool that can be displaced and actuated, and the movable device is provided with a first transmission component; further, the driving mechanism uses a driving source to drive the moving tool to displace, that is, the driving source drives the moving tool to move along the drive axis A to drive the displacement. The source can be a pressure cylinder, a motor or a motor and a transmission group; the moving tool can be a block, a wedge block or a cam, the first transmission part can be an oblique guide groove, a wedge surface, a cam surface or a roller, etc., and the drive axis A can be The linear axis or the rotational axis is not limited to this embodiment.

於本實施例,驅動機構之驅動源呈一為X方向之驅動軸線A配置,包含馬達111及驅動傳動組,驅動傳動組為螺桿螺座組112,螺桿螺座組112之螺座裝配一移動具113,移動具113之內部開設一為斜向導槽114之第一傳動部件;另於移動具113之頂面配置至少一呈驅動軸線A配置之第一滑軌組115,而輔助作線性位移。 In this embodiment, the drive source of the drive mechanism is arranged in a drive axis A in the X direction, including a motor 111 and a drive transmission group, the drive transmission group is a screw base set 112, and the screw base of the screw base set 112 is assembled to move. In the tool 113, a first transmission part which is an oblique guide groove 114 is provided inside the moving tool 113; and at least one first sliding rail group 115 arranged on the driving axis A is arranged on the top surface of the moving tool 113 to assist in the linear displacement .

調焦機構設置一具第二傳動部件之承載具,第二傳動部件以供驅動機構之第一傳動部件驅動,使承載具位移作動;更進一步,該承載具與該移動具113平行配置;第二傳動部件可為滾輪或斜向導槽等,例如第一傳動部件為斜向導槽,第二傳動部件為滾輪;反之,第一傳動部件為滾輪,第二傳動部件為斜向導槽;於本實施例,承載具121於第一面1211設有一為滾輪122之第二傳動部件,滾輪122嵌置於移動具113之斜向導槽114。 The focusing mechanism is provided with a carrier with a second transmission component, and the second transmission component is driven by the first transmission component of the driving mechanism to make the carrier move; further, the carrier is arranged in parallel with the moving tool 113; The two transmission parts can be rollers or oblique guide grooves, for example, the first transmission part is an oblique guide groove, and the second transmission part is a roller; otherwise, the first transmission part is a roller, and the second transmission part is an oblique guide groove; in this implementation For example, the carrier 121 is provided with a second transmission member on the first surface 1211 of the roller 122 , and the roller 122 is embedded in the oblique guide groove 114 of the moving tool 113 .

更進一步,承載具121之一方設有固定架123,固定架123、承載具121與移動具113平行配置,固定架123與承載具121之間設有第二滑軌組124,以輔助承載具121作線性位移;於本實施例,承載具121於第一面1211之前方設置固定架123,固定架123開設有通孔1231供穿置承載具121之滾輪122;然固定架123之形狀或尺寸亦可迴避滾輪122之位置,則不需開設通孔,不受限本實施例。 Furthermore, one side of the carrier 121 is provided with a fixing frame 123 , the fixing frame 123 , the carrier 121 and the moving tool 113 are arranged in parallel, and a second slide rail group 124 is arranged between the fixing frame 123 and the carrier 121 to assist the carrier 121 is linearly displaced; in this embodiment, the carrier 121 is provided with a fixing frame 123 in front of the first surface 1211, and the fixing frame 123 is provided with a through hole 1231 for passing the roller 122 of the carrier 121; however, the shape of the fixing frame 123 may be The size can also avoid the position of the roller 122, so there is no need to open a through hole, which is not limited to this embodiment.

取像機構於承載具121裝配至少一取像器,以供取像物件,取像器由承載具121帶動位移而調整取像焦距;更進一步,取像器依作業需求,而搭配至少一取像部,以取像至少一物件;又取像機構可沿取像軸線B配置至少一取像部,更佳者,取像器可配置複數個取像部,複數個取像部取像複數個物件,又取像部可為菱鏡或全反射鏡;於本實施例,取像機構於承載具121之第二面1212裝配一為CCD之取像器131,並由承載具121帶動位移至不同取像高度,取像器131搭配沿取像軸線B配置複數個取像部,複數個取像部包含第一取像部1311及第二取像部1312,以分別取像不同物件(如電子元件及測試座)。 The image pickup mechanism is equipped with at least one image pickup device on the carrier 121 for capturing the image object, and the image pickup device is displaced by the carrier 121 to adjust the image pickup focal length; further, the image pickup device is matched with at least one pickup device according to operational requirements. The imaging part is used to capture images of at least one object; and the imaging mechanism can be configured with at least one imaging part along the imaging axis B, more preferably, the imager can be configured with a plurality of imaging parts, and the plurality of imaging parts can capture a plurality of images In this embodiment, the imaging mechanism is equipped with a CCD imager 131 on the second surface 1212 of the carrier 121, and the carrier 121 drives the displacement To different image capturing heights, the imager 131 is configured with a plurality of image capturing portions along the image capturing axis B, and the plurality of image capturing portions include a first image capturing portion 1311 and a second image capturing portion 1312, to capture images of different objects ( such as electronic components and test sockets).

然,取像機構之取像器依作業需求而裝配不同角度,取像機構之取像部依作業需求搭配取像器而裝配不同角度,易言之,只要使第一取像部1311及第二取像部1312取像物件即可。 However, the image finder of the image capturing mechanism is assembled at different angles according to the operation requirements, and the image capturing portion of the image capturing mechanism is assembled with the image finder at different angles according to the operation requirements. The second image capturing unit 1312 only needs to capture the image object.

請參閱圖3,本發明取像裝置10可裝配於機台21或移動平台15,例如取像裝置10裝配於機台21,而定點式取像物件,例如取像裝置10裝配於移動平台15,而於不同位置取像不同物件;於本實施例,取像裝置10以連結板14連結驅動機構之馬達111、調焦機構之固定架123、第一滑軌組115之滑軌及移動平台15,使移動平台15可經由連結板14帶動馬達111、承載具121及取像器131等作複數個方向位移調整擺置位置;另於機台21設置具探針之測試座22,以供測試電子元件23,測試座22之上方配置輸送器24,以供移載電子元件23。 Referring to FIG. 3 , the imaging device 10 of the present invention can be mounted on the machine table 21 or the mobile platform 15 , for example, the imaging device 10 is mounted on the machine table 21 , and the fixed-point imaging object, for example, the imaging device 10 is mounted on the mobile platform 15 , and image different objects at different positions; in this embodiment, the image capturing device 10 connects the motor 111 of the driving mechanism, the fixing frame 123 of the focusing mechanism, the sliding rails of the first sliding rail group 115 and the moving platform by the connecting plate 14 15, so that the moving platform 15 can drive the motor 111, the carrier 121 and the imager 131 through the connecting plate 14 to move in multiple directions to adjust the placement position; in addition, a test seat 22 with a probe is provided on the machine table 21 for For testing the electronic components 23 , a conveyor 24 is arranged above the test seat 22 for transferring the electronic components 23 .

請參閱圖1、4,於輸送器24將電子元件23移載至測試座22之上方時,取像裝置10之移動平台15以連結板14帶動驅動機構、調焦機構及取像機構同步沿驅動軸線A位移,令取像機構之第一取像部1311及第二取像部1312位於電子元件23與測試座22之間,且使取像器131位於第一取像高度L1,取像器131利用第一取像部1311沿取像軸線B向上取像電子元件23,並以第二取像部1312沿取像軸線B向下取像測試座22,取像器131將電子元件影像資料及測試座影像資料傳輸至一處理器(圖未示出),以供判別電子元件23之接點與測試座22之探針是否準確對位,使輸送器24精確將電子元件23移入測試座22而執行測試作業。 Please refer to FIGS. 1 and 4 , when the conveyor 24 transfers the electronic components 23 to the top of the test seat 22 , the moving platform 15 of the imaging device 10 drives the driving mechanism, the focusing mechanism and the imaging mechanism synchronously along the connecting plate 14 The drive axis A is displaced, so that the first image capturing part 1311 and the second image capturing part 1312 of the image capturing mechanism are located between the electronic component 23 and the test seat 22, and the imager 131 is located at the first image capturing height L1 to capture the image. The detector 131 uses the first image capturing part 1311 to take images of the electronic component 23 upward along the image capturing axis B, and uses the second image capturing part 1312 to take images of the test seat 22 downward along the image capturing axis B, and the imager 131 images the electronic components. The data and the test seat image data are transmitted to a processor (not shown in the figure) for judging whether the contacts of the electronic components 23 and the probes of the test seat 22 are accurately aligned, so that the conveyor 24 can accurately move the electronic components 23 into the test 22 to perform the test operation.

請參閱圖1、5、6,於取像不同電子元件23A時,取像機構可搭配輸送器24作Z方向位移而調整電子元件23A之移載高度,以配合取像器131之取像焦距;然由於不同型式之測試座22A,其體積高度也不相同,在測試座22A固 設於機台21之條件下,取像器131對測試座22A之取像焦距也必須改變,以便清晰取像測試座22A。 Please refer to FIGS. 1 , 5 and 6 . When taking images of different electronic components 23A, the imaging mechanism can cooperate with the conveyor 24 to move in the Z direction to adjust the transfer height of the electronic components 23A to match the focal length of the imager 131 . ; However, due to the different types of test seat 22A, the volume height is not the same, in the test seat 22A solid Under the condition of being installed on the machine table 21 , the focal length of the imager 131 for taking the test seat 22A must also be changed, so as to clearly capture the image of the test seat 22A.

當機台21配置不同型式之測試座22A時,取像裝置10之馬達111經螺桿螺座組112之螺座而帶動該移動具113沿驅動軸線A位移,移動具113以斜向導槽114頂抵承載具121之滾輪122向下位移,滾輪122即傳動承載具121同步位移,承載具121利用第二滑軌組124沿取像軸線B作Z方向線性向下位移,以帶動取像器131、第一取像部1311及第二取像部1312同步向下位移,取像器131由第一取像高度L1調整位於第二取像高度L2,以調整第一取像部1311對電子元件23A之取像焦距,及調整第二取像部1312對測試座22A之取像焦距,使取像器131搭配第一取像部1311及第二取像部1312分別清晰取像電子元件23A及測試座22A,以利處理器(圖未示出)依清晰的電子元件影像資料及測試座影像資料而精準判別電子元件23A之接點與測試座22A之探針是否準確對位,使輸送器24精確將電子元件23A移入測試座22A而執行測試作業。 When the machine 21 is equipped with different types of test bases 22A, the motor 111 of the imaging device 10 drives the moving tool 113 to move along the driving axis A through the screw base of the screw base set 112 . The roller 122 of the bearing carrier 121 is displaced downward, the roller 122 is the transmission carrier 121 synchronously displaced, and the carrier 121 uses the second slide rail group 124 to linearly move downward along the imaging axis B in the Z direction to drive the imaging device 131 , the first image capturing part 1311 and the second image capturing part 1312 are displaced downward synchronously, and the imager 131 is adjusted from the first image capturing height L1 to the second image capturing height L2 to adjust the first image capturing part 1311 to the electronic components The imaging focal length of 23A, and adjusting the imaging focal length of the second imaging part 1312 to the test seat 22A, so that the imager 131 is matched with the first imaging part 1311 and the second imaging part 1312 to clearly capture the electronic components 23A and 23A respectively. The test seat 22A is used for the processor (not shown in the figure) to accurately determine whether the contact point of the electronic component 23A and the probe of the test seat 22A are accurately aligned according to the clear electronic component image data and the test seat image data, so that the conveyor 24 precisely moves the electronic component 23A into the test seat 22A to perform the test operation.

請參閱圖1~2、7、8,本發明第一實施例之測試設備,包含機台30、供料裝置40、收料裝置50、作業裝置60、本發明取像裝置10及中央控制裝置(圖未示出)。供料裝置40配置於機台30,並設有至少一供料容置器41,以供容置至少一待作業電子元件,於本實施例,供料裝置40由機台30之前段部朝向後段部輸送具複數個待測電子元件之供料容置器41;收料裝置50配置於機台30,並設有至少一收料容置器51,以供容置至少一已作業電子元件,於本實施例,收料裝置50由機台30之後段部朝向前段部輸送具複數個已測電子元件之收料容置器51;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 Please refer to FIGS. 1 to 2 , 7 and 8 , the testing equipment according to the first embodiment of the present invention includes a machine 30 , a feeding device 40 , a receiving device 50 , an operating device 60 , the imaging device 10 of the present invention, and a central control device (not shown). The feeding device 40 is disposed on the machine table 30 and is provided with at least one feeding container 41 for accommodating at least one electronic component to be processed. In this embodiment, the feeding device 40 faces from the front section of the machine table 30 . The rear section conveys a plurality of feeding containers 41 for electronic components to be tested; the receiving device 50 is arranged on the machine table 30, and is provided with at least one receiving container 51 for accommodating at least one electronic component that has been processed , in this embodiment, the receiving device 50 conveys the receiving container 51 with a plurality of tested electronic components from the rear section of the machine 30 to the front section; the central control device controls and integrates the actions of each device to perform automated operations .

作業裝置60配置於機台30,並設有作業機構及輸送機構,作業機構設有至少一作業器,供對電子元件執行預設作業,輸送機構設有至少一輸送器,以供輸送電子元件。於本實施例,作業機構之作業器為測試器,測試器具有電性連接之電路板611及測試座612,以供承置及測試電子元件;輸送機構設有一為第一拾取具62之第一輸送器,以於供料裝置40取出待測電子元件,並移載至一為第一載台63之第二輸送器,第一載台63將待測電子元件輸送至測試座612之上方;一位於測試座612上方之壓接器64於第一載台63取出待測電子元件;又作業裝置60更包含溫控機構,該溫控機構於輸送機構之壓接器64設置溫控件;該作業裝置於該作業機構之該作業器外部設置測試室65;於本實施例,作業裝置60於測試座612之外部設置測試室65,於冷測作業時,以流體輸送管651輸送乾燥空氣至測試室65,溫控機構於壓接器64設有溫控件66,以供溫控電子元件,使電子元件於模擬日後使用環境溫度下執行測試作業。 The operation device 60 is arranged on the machine table 30 and is provided with an operation mechanism and a conveying mechanism. The operation mechanism is provided with at least one operator for performing preset operations on the electronic components, and the conveying mechanism is provided with at least one conveyor for conveying the electronic components. . In this embodiment, the operating device of the operating mechanism is a tester, and the tester has an electrically connected circuit board 611 and a test seat 612 for holding and testing electronic components; the conveying mechanism is provided with a first pick-up tool 62 . A conveyor is used to take out the electronic components to be tested from the feeding device 40 and transfer them to a second conveyor which is the first stage 63 , and the first stage 63 transports the electronic components to be tested to the top of the test seat 612 A crimper 64 located above the test seat 612 takes out the electronic components to be tested on the first stage 63; and the operating device 60 further includes a temperature control mechanism, which is provided with a temperature control on the crimper 64 of the conveying mechanism ; The operating device is provided with a test chamber 65 outside the operating device of the operating mechanism; in this embodiment, the operating device 60 is provided with a test chamber 65 outside the test seat 612, during the cold test operation, the fluid conveying pipe 651 is used to transport dry The air is sent to the test chamber 65, and the temperature control mechanism is provided with a temperature control 66 on the crimper 64 for temperature control of the electronic components, so that the electronic components can perform the test operation under the simulated environment temperature for future use.

然依作業需求,於熱測作業時,測試室65內可配置鼓風機,以供吹送熱風,使測試室65之內部升溫,亦無不可。 However, according to the operation requirements, during the thermal measurement operation, a blower can be arranged in the test chamber 65 for blowing hot air to heat up the interior of the test chamber 65 .

本發明之取像裝置10配置於機台30,包含驅動機構、調焦機構及取像機構,各機構如上所述,於本實施例,取像裝置10之移動平台15驅動取像器131作驅動軸線A位移,令取像器131之第一取像部1311及第二取像部1312位於電子元件及測試座612之間,驅動機構以移動具113傳動承載具121及取像器131沿取像軸線B作線性位移,以調整取像器131之第一取像部1311及第二取像部1312對電子元件及測試座612之取像焦距,而清晰取像電子元件及測試座612,使處理器(圖未示出)精準判別電子元件之接點與測試座612之探針是否準確對位。於取像完畢,取像器131復位,壓接器64將待測電子元件移入測試座612執行 測試作業,於測試完畢,壓接器64將已測電子元件移出測試座612,第一載台63位移至壓接器64之下方承置已測電子元件,並移出測試室65,以供第一拾取具62於第一載台63取出已測電子元件,並依測試結果,將已測電子元件移載至收料裝置50收置分類。 The imaging device 10 of the present invention is disposed on the machine table 30 and includes a driving mechanism, a focusing mechanism and an imaging mechanism. Each mechanism is as described above. In this embodiment, the moving platform 15 of the imaging device 10 drives the imaging device 131 to operate. The drive axis A is displaced so that the first image pickup portion 1311 and the second image pickup portion 1312 of the image finder 131 are located between the electronic components and the test seat 612, and the driving mechanism uses the moving tool 113 to drive the carrier 121 and the image finder 131 along the The imaging axis B is linearly displaced to adjust the imaging focal lengths of the first imaging part 1311 and the second imaging part 1312 of the imaging device 131 for the electronic components and the test seat 612, and the electronic components and the test seat 612 are clearly captured. , so that the processor (not shown) can accurately determine whether the contacts of the electronic components and the probes of the test seat 612 are accurately aligned. After the image acquisition is completed, the imager 131 is reset, and the crimper 64 moves the electronic component to be tested into the test seat 612 for execution. After the test operation is completed, the crimper 64 moves the tested electronic components out of the test seat 612 , the first stage 63 is displaced to the underside of the crimper 64 to hold the tested electronic components, and is moved out of the test chamber 65 for the first stage 63 A pick-up tool 62 takes out the tested electronic components from the first stage 63, and according to the test results, transfers the tested electronic components to the receiving device 50 for storage and sorting.

請參閱圖1~2、9、10,本發明第二實施例之作業設備,其配置有相同第一實施例作業設備之機台30、供料裝置40、收料裝置50、本發明取像裝置10及中央控制裝置(圖未示出),因此不再贅述;本發明第二實施例與第一實施例之差異在於輸送裝置60更包含第三輸送器及第四輸送器,第三輸送器載出已測電子元件,第四輸送器於第三輸送器及收料裝置50間移載已測電子元件;於本實施例,輸送裝置60之第一拾取具62將待測電子元件移入第一載台63,第一載台63將待測電子元件載入測試室65,於測試完畢,一為第二載台67之第三輸送器載出已測電子元件,一為第二拾取具68之第四輸送器於第二載台67取出已測電子元件,並移載至收料裝置50收料。 Please refer to FIGS. 1-2, 9, and 10. The operation equipment of the second embodiment of the present invention is equipped with the same machine 30, feeding device 40, receiving device 50, and image capturing device of the present invention as the operation equipment of the first embodiment. The device 10 and the central control device (not shown in the figure) will not be described again; the difference between the second embodiment of the present invention and the first embodiment is that the conveying device 60 further includes a third conveyor and a fourth conveyor. The tested electronic components are carried out by the fourth conveyor, and the tested electronic components are transferred between the third conveyor and the receiving device 50 by the fourth conveyor; in this embodiment, the first pick 62 of the conveying device 60 moves the electronic components to be tested The first stage 63, the first stage 63 loads the electronic components to be tested into the test chamber 65, after the test is completed, one is the third conveyor of the second stage 67 to carry out the tested electronic components, and the other is the second pick-up The fourth conveyor with 68 takes out the tested electronic components from the second stage 67 and transfers them to the receiving device 50 for receiving.

請參閱圖1~2、11,本發明第三實施例之作業設備,其配置有相同第一實施例作業設備之機台30、供料裝置40、收料裝置50、本發明取像裝置10及中央控制裝置(圖未示出),因此不再贅述;本發明第三實施例與第一實施例之差異在於該第二輸送器以供該第一輸送器取放電子元件,並輸送電子元件至該作業器側方,該壓接器於該第二輸送器及該作業器移載電子元件;於本實施例,第一拾取具62將待測電子元件移入第一載台63,第一載台63將待測電子元件載入測試室65,且位於測試座612之側方,壓接器64A於第一載台63取出待測電子元件,並移入測試座612執行測試作業,於測試完畢,壓接器64A將已測 電子元件移入第二載台67,第二載台67將已測電子元件載出測試室65,以供第二拾取具68將第二載台67上之已測電子元件移載至收料裝置50收料。 Please refer to FIGS. 1-2 and 11 , the operation equipment of the third embodiment of the present invention is equipped with the same machine table 30 , the feeding device 40 , the receiving device 50 , and the imaging device 10 of the present invention as the operation equipment of the first embodiment. and the central control device (not shown in the figure), so it will not be repeated; the difference between the third embodiment of the present invention and the first embodiment is that the second conveyor is used for the first conveyor to pick and place electronic components, and to transport electronic components components to the side of the operator, the crimper transfers the electronic components on the second conveyor and the operator; in this embodiment, the first pick-up tool 62 moves the electronic components to be tested into the first stage 63, A carrier 63 loads the electronic components to be tested into the test chamber 65 and is located at the side of the test seat 612 . The crimper 64A takes out the electronic components to be tested from the first carrier 63 and moves them into the test seat 612 to perform the test operation. When the test is complete, the crimper 64A will be tested The electronic components are moved into the second stage 67 , and the second stage 67 carries the tested electronic components out of the test chamber 65 for the second picker 68 to transfer the tested electronic components on the second stage 67 to the receiving device 50 receipts.

10:取像裝置 10: imaging device

111:馬達 111: Motor

112:螺桿螺座組 112: Screw screw seat group

113:移動具 113: Mobile

114:斜向導槽 114: Oblique guide groove

115:第一滑軌組 115: The first slide rail group

121:承載具 121: Carrier

122:滾輪 122: Roller

123:固定架 123:Fixed frame

1231:通孔 1231: Through hole

124:第二滑軌組 124: The second rail group

131:取像器 131: Viewfinder

1311:第一取像部 1311: The first imaging department

1312:第二取像部 1312: The second imaging department

A:驅動軸線 A: Drive axis

B:取像軸線 B: take the image axis

Claims (17)

一種取像裝置,包含: 驅動機構:設置至少一可位移作動之移動具,該移動具設有第一傳 動部件; 調焦機構:設置至少一承載具,該承載具設有第二傳動部件,該第 二傳動部件以供該驅動機構之該第一傳動部件驅動位移 ,使該承載具位移作動; 取像機構:於該承載具裝配至少一取像器,以供取像物件,該取像 器以供該承載具帶動位移而調整取像焦距。 An imaging device, comprising: Drive mechanism: set at least one movable tool that can be displaced and actuated, the moving tool is provided with a first transmission moving parts; Focusing mechanism: at least one carrier is provided, the carrier is provided with a second transmission component, the first Two transmission parts for the driving and displacement of the first transmission part of the driving mechanism , so that the carrier is displaced; Image capturing mechanism: at least one image capturing device is assembled on the carrier for capturing the image object, the image capturing A device is used for the carrier to drive the displacement to adjust the focal length of the image. 如請求項1所述之取像裝置,其中,該驅動機構以驅動源驅動該移動具位移。The imaging device according to claim 1, wherein the driving mechanism drives the moving tool to displace with a driving source. 如請求項1所述之取像裝置,其中,該驅動機構於該移動具設有至少一第一滑軌組。The imaging device according to claim 1, wherein the driving mechanism is provided with at least one first slide rail group on the moving device. 如請求項1所述之取像裝置,其中,該調焦機構之該承載具一方設有固定架,該固定架與該承載具之間設有第二滑軌組。The imaging device according to claim 1, wherein a fixing frame is provided on one side of the carrier of the focusing mechanism, and a second slide rail group is arranged between the fixing frame and the carrier. 如請求項1所述之取像裝置,其中,該取像機構之該取像器搭配至少一取像部,以供取像該物件。The image capturing device of claim 1, wherein the imager of the image capturing mechanism is equipped with at least one image capturing portion for capturing the object. 如請求項1所述之取像裝置,其中,該取像機構之該取像器搭配複數個取像部,以供取像複數個物件。The image capturing device of claim 1, wherein the imager of the image capturing mechanism is equipped with a plurality of image capturing parts for capturing images of a plurality of objects. 如請求項6所述之取像裝置,其中,該複數個取像部包含第一取像部及第二取像部,以供取像該複數個物件。The image capturing device of claim 6, wherein the plurality of image capturing parts comprise a first image capturing part and a second image capturing part for capturing images of the plurality of objects. 如請求項5至7中任一項所述之取像裝置,其中,該取像部為菱鏡或全反射鏡。The imaging device according to any one of claims 5 to 7, wherein the imaging part is a diamond mirror or a total reflection mirror. 如請求項1至7中任一項所述之取像裝置,其中,該移動具與該承載具平行配置。The imaging device according to any one of claims 1 to 7, wherein the moving means and the carrier are arranged in parallel. 如請求項1至7中任一項所述之取像裝置,其中,該移動具為塊體 、楔形塊或凸輪。 The imaging device according to any one of claims 1 to 7, wherein the moving tool is a block , wedge block or cam. 如請求項1至7中任一項所述之取像裝置,其中,該移動具之該第一傳動部件為斜向導槽、楔形面、凸輪面或滾輪,該第二傳動部件為滾輪或斜向導槽。The imaging device according to any one of claims 1 to 7, wherein the first transmission part of the moving tool is an oblique guide groove, a wedge surface, a cam surface or a roller, and the second transmission part is a roller or an oblique guide Guide slot. 如請求項1至7中任一項所述之取像裝置,更包含移動平台,該移動平台供作複數個方向位移,並裝配該驅動機構。The imaging device according to any one of claims 1 to 7, further comprising a moving platform, the moving platform is used for displacement in a plurality of directions, and is equipped with the driving mechanism. 一種作業設備,包含: 機台; 供料裝置:配置於該機台,並設有至少一供料容置器,以供容置至 少一待作業電子元件; 收料裝置:配置於該機台,並設有至少一收料容置器,以供容置至 少一已作業電子元件; 作業裝置:配置於該機台,並設有作業機構及輸送機構,該作業機 構設有至少一作業器,以供對電子元件執行預設作業,該輸送機構設有至少一輸送器,以供輸送電子元件; 至少一如請求項1所述之取像裝置:配置於該機台,以供取像該作業 器及電子元件; 中央控制裝置:以控制及整合各裝置作動而執行自動化作業。 A work equipment comprising: Machine; Feeding device: It is arranged on the machine and is provided with at least one feeding container for accommodating to One less electronic components to be operated; Receiving device: It is arranged on the machine and has at least one receiving container for accommodating to One less electronic component that has been operated; Working device: It is arranged on the machine, and is equipped with a working mechanism and a conveying mechanism. The mechanism is provided with at least one operator for performing preset operations on the electronic components, and the conveying mechanism is provided with at least one conveyor for transporting the electronic components; At least the image capturing device as described in claim 1: disposed on the machine for capturing images of the operation devices and electronic components; Central control device: to control and integrate the actions of various devices to perform automated operations. 如請求項13所述之作業設備,其中,該作業裝置之該輸送機構設 有第一輸送器、第二輸送器及壓接器,該第一輸送器以供取出該供料裝置之電子元件,該第二輸送器以供該第一輸送器取放電子元件 ,並輸送電子元件至該作業器上方,該壓接器配置於該作業器之上方,以供於該第二輸送器及該作業器移載電子元件。 The work equipment as claimed in claim 13, wherein the conveying mechanism of the work device is provided with There are a first conveyor, a second conveyor and a crimper, the first conveyor is used for taking out the electronic components of the feeding device, and the second conveyor is used for the first conveyor to take and place the electronic components , and convey electronic components to the top of the operator, and the crimper is arranged above the operator for transferring electronic components to the second conveyor and the operator. 如請求項13所述之作業設備,其中,該作業裝置之該輸送機構設 有第一輸送器、第二輸送器及壓接器,該第一輸送器以供取出該供料裝置之電子元件,該第二輸送器以供該第一輸送器取放電子元件 ,並輸送電子元件至該作業器側方,該壓接器於該第二輸送器及該作業器移載電子元件。 The work equipment as claimed in claim 13, wherein the conveying mechanism of the work device is provided with There are a first conveyor, a second conveyor and a crimper, the first conveyor is used for taking out the electronic components of the feeding device, and the second conveyor is used for the first conveyor to take and place the electronic components , and convey electronic components to the side of the operator, and the crimper transfers electronic components to the second conveyor and the operator. 如請求項13至15中任一項所述之作業設備,其中,該作業裝置更 包含溫控機構,該溫控機構於該壓接器設置至少一溫控件。 The work equipment as claimed in any one of claims 13 to 15, wherein the work device is more A temperature control mechanism is included, and the temperature control mechanism is provided with at least one temperature control device on the crimper. 如請求項16所述之作業設備,其中,該作業裝置更包含測試室, 該測試室罩置於該作業器外部。 The operation equipment of claim 16, wherein the operation device further comprises a test room, The test chamber hood is placed outside the operator.
TW110104733A 2021-02-08 2021-02-08 Image taking apparatus and handler using the same TWI769698B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110104733A TWI769698B (en) 2021-02-08 2021-02-08 Image taking apparatus and handler using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110104733A TWI769698B (en) 2021-02-08 2021-02-08 Image taking apparatus and handler using the same

Publications (2)

Publication Number Publication Date
TWI769698B true TWI769698B (en) 2022-07-01
TW202232058A TW202232058A (en) 2022-08-16

Family

ID=83439408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110104733A TWI769698B (en) 2021-02-08 2021-02-08 Image taking apparatus and handler using the same

Country Status (1)

Country Link
TW (1) TWI769698B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI867720B (en) * 2023-08-29 2024-12-21 鴻勁精密股份有限公司 Pressing mechanism, testing device, and processing machine
TWI867719B (en) * 2023-08-29 2024-12-21 鴻勁精密股份有限公司 Testing device and processing machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394100A (en) * 1993-05-06 1995-02-28 Karl Suss America, Incorporated Probe system with automatic control of contact pressure and probe alignment
TWI385389B (en) * 2009-09-17 2013-02-11 Hon Tech Inc A conveyor for correcting the position of the electronic components
TWI535645B (en) * 2012-10-24 2016-06-01 Advantest Corp Electronic components handling devices, electronic components testing equipment and electronic components of the test method
JP2019102640A (en) * 2017-12-01 2019-06-24 東京エレクトロン株式会社 Needle tip position adjustment method of probe needle and inspection equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394100A (en) * 1993-05-06 1995-02-28 Karl Suss America, Incorporated Probe system with automatic control of contact pressure and probe alignment
TWI385389B (en) * 2009-09-17 2013-02-11 Hon Tech Inc A conveyor for correcting the position of the electronic components
TWI535645B (en) * 2012-10-24 2016-06-01 Advantest Corp Electronic components handling devices, electronic components testing equipment and electronic components of the test method
JP2019102640A (en) * 2017-12-01 2019-06-24 東京エレクトロン株式会社 Needle tip position adjustment method of probe needle and inspection equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI867720B (en) * 2023-08-29 2024-12-21 鴻勁精密股份有限公司 Pressing mechanism, testing device, and processing machine
TWI867719B (en) * 2023-08-29 2024-12-21 鴻勁精密股份有限公司 Testing device and processing machine

Also Published As

Publication number Publication date
TW202232058A (en) 2022-08-16

Similar Documents

Publication Publication Date Title
CN211718140U (en) Automatic change check out test set
TWI769698B (en) Image taking apparatus and handler using the same
JP2014085230A (en) Electronic component handling device, electronic component testing device, and method for testing electronic component
TW201430356A (en) Electronic component operation unit, operation method and operation apparatus applied thereof
KR100805873B1 (en) Automatic indentation inspection device of LCD panel
CN116840251A (en) Detect dust collecting equipment
TWI769664B (en) Testing apparatus and testing equipment using the same
CN114354648B (en) Coating detection equipment and coating detection method
TW201423120A (en) Electronic component operation unit, operation method and operation apparatus applied thereof
KR101977305B1 (en) Themal testing apparatus for flatpanel display
CN220542805U (en) Detect dust collecting equipment
TWI545329B (en) An electronic component operating device, a working method, and a working device for its application
JP2006329714A (en) Lens inspection apparatus
TWI467197B (en) An electronic component operating unit for an image capturing device, and a working device for its application
CN114967035B (en) Imaging device and operating equipment thereof
TW200928385A (en) Carrying device for precisely aligning electronic elements
TWI853486B (en) Appearance inspection apparatus and processing machine
TWI811770B (en) Transmission mechanism, testing equipment, detecting method, and handler using the same
TWI846500B (en) Electronic component appearance examination device and processing machine
TWI867719B (en) Testing device and processing machine
TWI769847B (en) Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same
TWI849765B (en) Transportation device and processing machine
TWI741856B (en) Operating assembly and operating apparatus using the same
CN115728561A (en) Conveying mechanism, testing device, detecting method and operating machine applying same
US8780341B2 (en) Inspecting system for lens module