JP4851361B2 - Electronic circuit component mounting device - Google Patents

Description

The present invention relates to a position accuracy of attachment to the circuit board of the electronic circuit components, in particular, an electronic circuit component mounting apparatus having a unit for accuracy inspection.

  Conventionally, various means have been taken in order to mount electronic circuit components with high accuracy at a component mounting location set on a circuit board. For example, as described in Patent Document 1 below, an electronic circuit component sucked by a suction nozzle is imaged by a component camera, and an electronic circuit component holding position error by the suction nozzle is detected and formed on a circuit board. The reference mark camera is imaged with a reference mark camera, the holding position error of the circuit board by the board holding device is obtained, the position error of the electrode provided at the component mounting location is estimated based on the holding position error, and the The electronic circuit component is mounted while correcting the position error together with the holding position error of the electronic circuit component by the suction nozzle. In this way, in order to improve the mounting position accuracy of the electronic circuit component, it is necessary that the accurate relative position between the component camera and the reference mark camera is known. When rotating and mounting together with the suction nozzle after imaging, or when the inclination of the suction nozzle in the up-and-down direction cannot be ignored, the rotation axis of the suction nozzle (the suction nozzle normally follows this rotation axis when mounting electronic circuit components) And the relative position of the component camera and the reference mark camera must be known.

Therefore, in the electronic circuit component mounting apparatus described in Patent Document 1, using the calibration table and the calibration gauge, the rotation axis of the suction nozzle, the center of the component camera (the center of the imaging surface), and the center of the reference mark camera ( The relative position error of the three is obtained with respect to the center of the imaging surface. Each of the calibration table and the calibration gauge is provided with a plurality of reference marks, and the calibration gauge is received in a receiving recess provided in the calibration table. At the time of acquiring the relative position errors of the three parties, a calibration gauge is attracted to the suction nozzle and imaged by the component camera, and after the imaging, it is accommodated in the accommodation recess of the calibration table and imaged by the reference mark camera. The calibration gauge imaging by the reference mark camera is performed four times by changing the rotation position of the calibration gauge by 90 degrees, and the calibration table is based on the image data by the component camera imaging and the image data by the reference mark camera imaging. The rotation axis of the suction nozzle with respect to the center of the nozzle (the rotation axis at the height at which the suction nozzle mounts the calibration gauge on the calibration table), the positional deviations of the imaging center of the component camera and the imaging center of the reference mark camera are acquired. As a result, the relative position error of the three of the rotation axis of the suction nozzle, the imaging center of the component camera, and the imaging center of the reference mark camera is acquired. Based on these relative position errors, the nozzle rotation axis and the component camera are acquired. The holding position error of the electronic circuit component is acquired by the suction nozzle while the relative position error is removed, and the holding position error of the circuit board is acquired by the substrate holding device while removing the positional deviation of the reference mark camera. Thus, the mounting position accuracy of the electronic circuit component is improved.
JP 2002-217597 A

The present invention has been made against the background described above, and in the electronic circuit component mounting apparatus, the detection accuracy of the relative position error of the rotation axis of the component holding head, the component camera or the head side reference portion, and the reference mark camera is improved. It is an object to make it possible to improve .

The above-described problems include an electronic circuit component mounting device, (α) a substrate holding device that holds a circuit board, (β) a component holding head that holds an electronic circuit component and is rotatable around a rotation axis, and (γ A head rotating device that rotates the component holding head around the rotation axis; (δ) a head moving device that moves the component holding head and the head rotating device; and (ε) the component holding head by the head moving device. A reference mark camera that images a circuit board reference mark that is moved along with the circuit board and is held by the circuit board holding device, and (ζ) a component camera that images an electronic circuit component held by the component holding head. And (η) control the component holding head, head rotating device, head moving device, reference mark camera and component camera to mount electronic circuit components on the circuit board. And (θ) an inspection chip having a size corresponding to the electronic circuit component, and (ι) a mounting portion on which the inspection chip can be mounted and an inspection chip different from the substrate reference mark An inspection table provided with a reference mark; and (κ) an error detection control unit provided in the control device, wherein (A) the reference mark camera images the inspection reference mark, and based on the imaging result First error acquisition for acquiring a relative position error between the reference mark camera and the inspection reference mark, and (B) (i) holding the inspection chip on the component holding head, and the inspection chip on the component camera And (ii) placing the inspection chip after the imaging on the chip mounting portion and causing the reference mark camera to image the inspection chip and the inspection reference mark, and (iii) at least the imaging Based on the results before (C) (iv) In the inspection of the component holding head, a second error acquisition for acquiring a relative position error between a head side reference portion provided on the component camera or the component holding head side and the reference mark for inspection. Holding the chip for inspection, placing the inspection chip on the mounting portion, causing the reference mark camera to image the inspection chip and the inspection reference mark, and (v) holding the component after the imaging The inspection chip of the mounting portion is held on the head and rotated by a predetermined angle, and then placed on the mounting portion again to place the inspection chip and the inspection reference mark on the reference mark. First, let the camera capture the image one or more times, and (vi) acquire the relative position error between the rotation axis of the component holding head and the inspection reference mark from the imaging results of (iv) and (v). 3 error acquisition and the above An error detection control unit for acquiring a relative position error of a rotation axis of the component holding head with reference to the inspection reference mark, the reference mark camera, and a head side reference unit provided on the component camera or the component holding head side is solved by shall include and.

Imaging of the inspection chip and the inspection reference mark in (ii), (iv) and (v) is preferably performed at the same time. However, the images are separately captured because of the wide field of view of the reference mark camera. You may make it do.
The head side reference unit may cause a relative position error between the component holding head and the component camera, for example, when the electronic circuit component is imaged by the component camera while the component holding head is moving. When the component holding head is large, the component holding head is held on the movable member that is moved by the head moving device, and the image is captured by the component camera. The relative position error between the component holding head and the component camera is not affected by the relative position error. A position error can be acquired.
In the second error acquisition, the deviation between the component camera or the head side reference unit and the inspection chip may be corrected between the imaging by the component camera and the imaging by the reference mark camera, and the correction should not be made. Also good. In the former case, since the inspection chip mounted on the mounting portion indicates the position of the component camera or the head side reference portion, the component camera with respect to the inspection reference mark is obtained from only the imaging result of (ii). Alternatively, the relative position error of the head side reference portion can be detected. In the latter case, on the basis of the imaging results of (i) and (ii), the relative position error between the reference mark camera and the component camera or the head side reference unit is obtained through the mediation of the inspection chip, and the reference The relative position error between the mark camera and the inspection reference mark can be directly acquired, and the relative position error with respect to the inspection reference mark of the component camera or the head side reference portion can be acquired from the two relative position errors. “(Iii) Based on at least the imaging result” in the second error acquisition may be based on only the imaging result of (ii) or based on the imaging result of (i) and (ii). included.
Further, even if the first error acquisition is performed in parallel with at least one of the second error acquisition and the third error acquisition, the second error acquisition and the third error acquisition are performed independently. Also good. In the former case, for example, at least once (may be every time) based on the imaging result of the inspection chip and the inspection reference mark by at least one of the second error acquisition and the third error acquisition by the reference mark camera. The relative position error with respect to the reference mark for inspection of the mark camera is acquired.
Furthermore, the second error acquisition and the third error acquisition may be executed in parallel. For example, during execution of the third error acquisition, at least one of the inspection chips held by the component holding head is imaged by the component camera. In this case, the second error acquisition is used as part of the third error acquisition.
As is apparent from the above description, the error detection control unit finally determines the relative position of the rotation axis of the component holding head, the reference mark camera, and the component camera or the head side reference unit with reference to the inspection reference mark. Any error detection unit may be used, and even though it may appear to be different error detection means, it is substantially the same as the inspection control unit that performs the first error acquisition, the second error acquisition, and the third error acquisition ( All of which are equivalent to the technical scope of the present invention.
Note that imaging and relative position error acquisition in the first error acquisition, the second error acquisition, and the third error acquisition are performed a plurality of times, the acquired relative position errors are statistically processed, and the axes of the plurality of component holding heads Of course, the final relative position error of the reference mark camera and the reference mark for inspection between the component camera or the head side reference portion may be acquired.

As in this electronic circuit component mounting apparatus, if all the relative position errors of the rotation axis of the component holding head, the component camera or the head side reference unit, and the reference mark camera are detected with reference to the reference mark for inspection, the reference mark camera The influence of the positioning error can be eliminated as much as possible, and an effect of improving the relative position error detection accuracy can be obtained. Instead of the inspection reference mark, the relative position error is detected based on the rotation axis of the component holding head, the component camera or the head side reference unit, and the reference mark camera, for example, the position of the component camera. However, it is possible to obtain higher detection accuracy than that.

Aspects of the Invention

The following invention which is considered claimable (hereinafter referred to as "claimable invention". Claimable invention, the lower is the invention der Ru present applied invention claimed Some aspects of the concept invention, the superordinate concept of the invention of the present application, or an invention of another concept) may be exemplified and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

In each of the following paragraphs, a combination of a part of the matters described in (1) and the matters described in (6) corresponds to claim 1, and the matters described in (7) A combination of a part and the matter described in the item (11) is added to the claim 2, and a part obtained by adding another part of the item described in the item (1) to the claim 1 or 2 is added to the claim 3. The item described in the item (3) is added to the claim 3 in the item 4 and the item described in the item (2) is added to the item 3 or 4 in the item 5 A device according to any one of claims 3 to 5 is obtained by adding the matter described in (4) and a part of the matter described in the explanation related to (4) to claim 6 and in the device according to claim 6. The detection conditions specified by the matters described in the description of the item (4) are defined in claim 7, and any of the claims 3 to 7 ( The items to which the matters described in the item 5) are added correspond to the items 8 respectively.

(1) a board holding device for holding a circuit board;
  A component holding head that holds electronic circuit components and is rotatable around a rotation axis;
  A head rotating device for rotating the component holding head around the rotation axis;
  A head moving device that moves the component holding head and the head rotating device; and
  A reference mark camera that images the board reference mark, which is a reference mark of a circuit board that is moved together with the component holding head by the head moving device and is held by the board holding device;
  A component camera for imaging an electronic circuit component held by the component holding head;
  A control device for controlling the component holding head, the head rotating device, the head moving device, the reference mark camera, and the component camera to mount the electronic circuit component on the circuit board;
  An inspection chip having a size corresponding to the electronic circuit component;
  An inspection table provided with an inspection reference mark different from the mounting portion on which the inspection chip can be placed and the substrate reference mark;
  A mounting position accuracy inspection control unit provided in the control device, (a) causing the component holding head to hold the inspection chip, causing the component camera to image, and based on the imaging result Obtaining an inspection chip holding position error by the component holding head, and (b) causing the reference mark camera to image the inspection reference mark, and based on the imaging result, the reference mark camera and the inspection reference mark, And (c) the position error of the inspection chip held by the component holding head and the relative position error between the reference mark camera and the inspection reference mark obtained in (a) and (b). Correcting and placing the inspection chip on the mounting portion, causing the reference mark camera to image the placed inspection chip, and obtaining the placement position error of the inspection chip; And Cormorant mounting position accuracy inspection control unit
  An electronic circuit component mounting apparatus including:
  Acquisition of the holding position error of the inspection chip by the component holding head is performed with reference to the reference portion of the component camera, for example, the center of the imaging surface, or with reference to the head side reference portion provided on the component holding head side. Is also possible. In the latter case, a head-side reference portion is provided at a position where the component holding head is held and moved by the head moving device at a position that can be imaged by the component camera, and the electronic circuit component held by the component holding head At the time of imaging by the component camera, the head side reference portion is also imaged, and the relative position error of the electronic circuit component with respect to the head side reference portion is acquired from the imaging result. In this way, it is possible to eliminate the influence of the relative position error between the component camera and the component holding head during imaging.
  The inspection table may be provided with a chip housing part that positions and holds the inspection chip substantially separately from the mounting part, or the mounting part may also serve as the chip housing part.
  The placement position error of the placed inspection chip is desirably obtained with reference to the inspection reference mark, but may be obtained with reference to the reference mark camera. In the former case, it is desirable that the placed inspection chip and the inspection reference mark be imaged simultaneously by the reference mark camera, but the image should be captured separately due to the wide field of view of the reference mark camera. May be. Further, the mounting position error can be acquired based on any one of the rotation axis of the component holding head, the component camera, or the head side reference unit.
  The inspection chip is preferably a dedicated inspection chip manufactured with high accuracy, but it is also possible to use an electronic circuit component as the inspection chip.
  As described in Patent Document 1, the relative position error of the nozzle rotation axis, the reference mark camera, and the component camera is acquired, and the relative position error is removed to acquire the holding position error of the electronic circuit component or the circuit board. However, an error may occur in the mounting position of the electronic circuit component with respect to the circuit board. The cause of this mounting position error is thought to be due to thermal deformation or aging of the mechanical components of the electronic circuit component mounting device, or changes in control characteristics due to temperature changes or aging of the electrical control unit. It is difficult to specify clearly. However, if this mounting position error is ignored, it has become difficult to satisfy recent demands for miniaturization of printed circuit boards and improvements in the mounting density of electronic circuit components on circuit boards.
  On the other hand, in the electronic circuit component mounting apparatus of this section, the mounting position accuracy inspection control unit uses the accuracy inspection unit including the inspection chip and the inspection table to mount the electronic circuit component on the actual circuit board. A pseudo mounting operation simulating the operation is performed by the component holding head, the head rotating device, the head moving device, the reference mark camera, and the component camera, and the mounting position error of the inspection chip on the mounting portion is acquired. This mounting position error represents the mounting position accuracy of the electronic circuit component mounting device (excluding changes in positioning error at each position of the component holding head moved by the head moving device), so it is easy to check the mounting position accuracy. Based on the inspection result, various measures can be taken to improve the mounting position accuracy. Moreover, since the mounting position accuracy can be inspected without using the circuit board holding device, the component holding head, the head rotating device, the head moving device, the reference mark camera, and the component camera can be inspected when the circuit board is carried in and out. The mounting position accuracy inspection can be performed using the idle time.
(2) The control device stores a rotation axis of the component holding head, a head side reference portion provided on the component camera or the component holding head side, and a relative position error acquired in advance of the reference mark camera. The electronic circuit component according to (1), including a position error storage unit, wherein the mounting position accuracy inspection control unit executes a mounting position accuracy inspection while correcting a relative position error stored in the position error storage unit. Mounting device.
  In the electronic circuit component mounting apparatus according to this section, the mounting position accuracy inspection control unit places the inspection chip on the mounting unit while correcting the relative position error stored in the position error storage unit, thereby mounting position accuracy. Since the inspection is performed, there is an advantage that the accuracy of the mounting operation of the electronic circuit component on the circuit board after the relative position error is corrected can be inspected.
  If the mounting position error acquired by the mounting position accuracy inspection control unit is within the setting range, the electronic circuit component mounting apparatus is determined to be acceptable with respect to the mounting position accuracy, and is rejected if it exceeds the setting range. It may be used for pass / fail determination, or may be used as one of the mounting position correction data when the electronic circuit component is mounted thereafter. Further, when the mounting position accuracy is unacceptable, an error detection control unit described later can be operated to acquire a relative position error such as the rotation axis of the component holding head. .
  The position error storage unit may store the relative position error detected by some means, for example, a dedicated relative position error detection device provided separately from the electronic circuit component mounting device. . However, if the relative position error detected by the control of the error detection control unit, which will be described later, is stored, a dedicated relative position error detection device becomes unnecessary, and the equipment cost can be reduced.
(3) Further, (d) the inspection chip mounted on the mounting portion in (c) is held by the component holding head, and the component holding head is rotated by a predetermined angle, and then the mounting portion is again formed. And (1) or (2) including performing one or more times by causing the reference mark camera to pick up an image of the placed inspection chip again and acquiring the placement position error. The electronic circuit component mounting apparatus described.
  In the electronic circuit component mounting apparatus of this section, it is possible to perform a mounting position accuracy inspection caused by a relative position error of the rotation axis of the component holding head.
(4) Any of the items (1) to (3), wherein the control device includes an automatic accuracy inspection start unit that automatically operates the mounting position accuracy inspection control unit when a predetermined condition is satisfied. The electronic circuit component mounting apparatus described in 1.
  Examples of the “predetermined condition” include starting of an electronic circuit component mounting device, suspension of operation for a set time or more, continuous operation time for a set time or more, execution of a continuous electronic circuit component mounting operation for a set amount or more, circuit Satisfaction such as suspension of board transport device set time or longer, completion of assembly of one circuit board, completion of assembly of electronic circuit component mounting device, or elapsed time since previous maintenance executionElectronic circuit component mounting deviceConditions that can be automatically detected in the computer, a computer of an inspection device that inspects the printed circuit board produced, and a host computer that controls the computer of the electronic circuit component mounting device, etc. An external instruction from an external computer can be employed.
  Even if the operator is not conscious, since the mounting position accuracy of the electronic circuit component mounting apparatus is inspected, it is possible to obtain an electronic circuit component mounting apparatus that is easy to use and can avoid the occurrence of defective products.
  However, the mounting position accuracy inspection can be executed in accordance with an instruction from the operator such as an execution command input from the manual input device.
(5) The holding position of the circuit board by the board holding apparatus acquired from the holding position error of the electronic circuit part by the part holding head and the imaging result of the board reference mark by the reference mark camera. Along with the error, the mounting position error acquired by the mounting position accuracy inspection control unit is used as mounting position correction data when the mounting operation of the electronic circuit component to the circuit board is performed (1) to (4) The electronic circuit component mounting apparatus according to any one of items 1) to 3).
  Electrons in this sectioncircuitIn the component mounting apparatus, in addition to the electronic circuit component and circuit board holding position errors that are normally expected to occur, the mounting position error caused by the cause on the electronic circuit component mounting apparatus side is corrected, and the electronic circuit Since components can be mounted on the circuit board, mounting position accuracy can be increased.
  In particular, in a mode in which this item is subordinate to item (2), the rotation axis of the component holding head, the component camera or the head side reference unit, and the relative position error acquired in advance of the reference mark camera are corrected. Since the mounting position error that occurs is acquired and the mounting position error is used as correction data for the mounting position, particularly high mounting position accuracy can be obtained. Not only the holding position error of the electronic circuit component by the component holding head and the holding position error of the circuit board by the board holding device, but also the rotation axis of the component holding head, the component camera or the head side reference portion, and the reference mark camera are acquired in advance. If the electronic circuit component is mounted on the circuit board after the relative position error is corrected, the mounting position error should not occur, but may actually occur. Although the cause of the mounting position error may be investigated and deleted, it is also possible to correct the error that actually occurs regardless of the cause, and that is actually acceptable.
(6) Further, an error detection control unit provided in the control device, (A) causing the reference mark camera to image the inspection reference mark, and the reference mark camera and the inspection reference based on the imaging result (B) (i) holding the inspection chip on the component holding head, causing the component camera to image the inspection chip, and (ii) acquiring the relative error with respect to the mark. The inspection chip after imaging is placed on the chip mounting portion, the inspection chip and the inspection reference mark are imaged by the reference mark camera, and (iii) at least the component based on the imaging result A second error acquisition for acquiring a relative position error between a head side reference portion provided on the camera or the component holding head side and the inspection reference mark; and (C) (iv) the inspection chip on the component holding head. Keep The inspection chip is placed on the mounting portion, the inspection chip and the inspection reference mark are imaged by the reference mark camera, and (v) after the imaging, the component holding head After holding the inspection chip of the description section and rotating it by a predetermined angle, the inspection chip and the reference mark for inspection are again placed on the reference mark camera by placing the inspection chip on the previous description section again. The third error acquisition is performed such that imaging is performed at least once, and (vi) the relative position error between the rotation axis of the component holding head and the reference mark for inspection is acquired from the imaging results of (iv) and (v). And the relative position error of the rotation axis of the component holding head with respect to the inspection reference mark, the reference mark camera, and the head side reference portion provided on the component camera or the component holding head side. get Including a difference detection control unit (1) through (5) the electronic circuit component mounting apparatus according to any one of Items.
(7) a board holding device for holding a circuit board;
  A plurality of component holding heads that hold electronic circuit components and are rotatable about respective rotation axes;
  A head rotating device for rotating the component holding heads around respective rotation axes of the component holding heads;
  A head moving device that moves the component holding head and the head rotating device; and
  A reference mark camera that images the board reference mark, which is a reference mark of a circuit board that is moved together with the component holding head by the head moving device and is held by the board holding device;
  A component camera for imaging electronic circuit components respectively held by the plurality of component holding heads;
  A control device for controlling the component holding head, the head rotating device, the head moving device, the reference mark camera, and the component camera to mount the electronic circuit component on the circuit board;
  A plurality of types of inspection chips including a maximum chip and a minimum chip each having a size corresponding to a plurality of types of electronic circuit components of different sizes;
  An inspection table provided with one or more mounting parts on which the plurality of types of inspection chips can be mounted and an inspection reference mark different from the substrate reference mark;
  A mounting position accuracy inspection control unit provided in the control device, wherein (a) one of the plurality of component holding heads holds the inspection chip, and the component camera images the inspection chip; Obtaining a holding position error of the inspection chip by the component holding head based on the imaging result; and (b) causing the reference mark camera to image the inspection reference mark, and based on the imaging result, the reference mark camera and Acquiring a relative position error with respect to the inspection reference mark; and (c) the holding position error of the inspection chip by the one component holding head acquired in (a) and (b) and the reference mark camera and the inspection mark. The inspection chip is placed on the mounting portion by correcting the relative position error with respect to the reference mark, and the placement position of the inspection chip is picked up by the reference mark camera. Obtaining a difference, and (d) performing a mounting position accuracy inspection including performing (a) to (c) on each of the plurality of component holding heads and the plurality of inspection chips. The mounting position accuracy inspection control unit to be executed
  An electronic circuit component mounting apparatus including:
  This section applies the invention of the above (1) to an electronic circuit component mounting apparatus including a plurality of component holding heads rotated around respective rotation axes.As described in paragraph (1)Much of the explanation given regarding the electronic circuit component mounting apparatus also applies to this section.
  The plurality of component holding heads may be of the same type, the same type of inspection chip used for inspection, may be different from each other, and the type of inspection chip used for inspection may be different. .
  Even if a plurality of component holding heads are of different types, different types of inspection chips are not always used for inspection, but for example, the types of chips that can be held differ depending on the type of component holding head. The same type of inspection chip may not be used due to reasons such as the types of chips that can be held being limited by the interval between adjacent component holding heads, and including multiple types of inspection chips Is effective in conducting the inspection.
(8) Further, (e) the inspection chip mounted on the mounting portion in (c) is held by the component holding head, and the component holding head is rotated by a predetermined angle and then the mounting portion again. And placing the inspection chip placed on the reference mark camera again to obtain a placement position error at least once, and in (d), the (a The electronic circuit component mounting device according to item (7), wherein steps (c) and (e) are performed for each of the plurality of component holding heads and the plurality of inspection chips.
  In this section, the invention of (3) is applied to an electronic circuit component mounting apparatus including a plurality of component holding heads that are rotated about respective rotation axes.
(9) The control device includes a rotation position of each of the plurality of component holding heads, a head side reference portion provided on the component camera or the component holding head side, and a relative position error acquired in advance of the reference mark camera. The mounting position accuracy inspection control unit executes a mounting position accuracy inspection while correcting the relative position error stored in the position error storage unit. The electronic circuit component mounting apparatus described in the item).
  In this item, the invention of item (2) is applied to an electronic circuit component mounting apparatus including a plurality of component holding heads which are rotated around respective rotation axes.
(10) Each of the plurality of component holding heads sucks and holds an electronic circuit component by a suction nozzle, and a single nozzle head having a single suction nozzle on the rotation axis, and around a center line A circuit component mounting apparatus according to any one of (7) to (9), further including a multi-nozzle head including a plurality of suction nozzles around the center line of the rotating member that rotates in a straight line.
  In the multi-nozzle head, even if a plurality of suction nozzles are rotated with respect to the rotating member, and each nozzle is rotated around the center line, the rotating member is rotated around the center line. In addition, each of the plurality of suction nozzles may be substantially rotated around the center line by being moved along a plane orthogonal to the center line. In the latter case, there is one physical rotation axis, but it is assumed that a substantial rotation axis exists for each suction nozzle. The portion mainly composed of each of the plurality of suction nozzles is regarded as a component holding head that can rotate around each rotation axis.
  The center line of the rotating member of the multi-nozzle head may be a vertical line or a line inclined with respect to the vertical line.
(11) Further, an error detection control unit provided in the control device, wherein (A) the reference mark camera images the inspection reference mark, and the reference mark camera and the inspection reference are based on the imaging result. (B) (i) one of the plurality of component holding heads holds one of the plurality of inspection chips, and the inspection chip is attached to the first error acquisition position for acquiring a relative position error with respect to the mark. (Ii) causing the component camera to image, and (ii) placing the inspection chip after the imaging on the chip mounting portion, causing the reference mark camera to image the inspection chip and the inspection reference mark, Second error acquisition for acquiring a relative position error between a head side reference portion provided on the component camera or the component holding head side and the inspection reference mark based on at least the imaging result; (C) (iv The plurality of parts One of the plurality of inspection chips is held by one of the holding heads, the inspection chip is placed on the mounting portion, and the inspection chip and the inspection reference mark are placed on the reference mark camera. (V) After the imaging, the inspection chip of the mounting section is held on the one component holding head, rotated by a predetermined angle, and then placed on the mounting section again. The inspection mark and the inspection reference mark are imaged again by the reference mark camera at least once, and (vi) from the imaging results of (iv) and (v), the one component holding head A third error acquisition for acquiring a relative position error between the rotation axis and the inspection reference mark is performed, and the third error acquisition is performed for each of the plurality of component holding heads. Holding the plurality of parts as a reference Tsu each axis of rotation of de, the reference mark camera, and the component camera or the error detection controller for obtaining a relative position error of the head-side reference portion (7)TermOr the electronic circuit component mounting device according to any one of (10) to (10).
  In this item, the invention of item (6) is applied to an electronic circuit component mounting apparatus including a plurality of component holding heads which are rotated around respective rotation axes.
(21) A plurality of types of inspection chips including a maximum chip and a minimum chip each having a size corresponding to a plurality of types of electronic circuit components having different sizes;
  One or more mounting portions on which the plurality of types of inspection chips can be mounted, and an inspection table provided with inspection reference marks;
  A unit for inspecting the accuracy of an electronic circuit component mounting apparatus including:
  The electronic circuit component mounting apparatus described in the items (7) to (11) is a specific application example of the accuracy inspection unit.
  The mounting unit may be a plurality of dedicated mounting units provided corresponding to each type of a plurality of types of inspection chips, and one mounting unit common to at least two of the plurality of types of testing chips. It may be a plurality of placement units including one or more, or one common placement unit common to all inspection chips.
  Further, the inspection chip may be two inspection chips including only the largest chip and the smallest chip, or three or more kinds of inspection chips.
  This precision inspection unit can easily and reliably inspect the mounting position accuracy and rotate each of multiple component holding heads in an electronic circuit component mounting device that mounts a wide range of electronic circuit components from small to large. It is possible to easily and accurately detect relative position errors of components such as an axis, a reference mark camera, a component camera, and a head side reference section.
(22) The accuracy inspection unit according to item (21), wherein the inspection table includes a plurality of chip storage portions for storing and positioning a plurality of types of inspection chips.
  It is also possible to make the “one or more mounting portions” also serve as a chip accommodating portion. However, it is often convenient to provide a dedicated chip accommodating portion for each inspection chip. In the case where the mounting portion is common to two or more types of inspection chips, it is necessary to provide a dedicated chip housing portion for the two or more types of inspection chips.
  Note that the above-mentioned “chip housing portion approximately positions and accommodates the inspection chip” means that if the component holding head is moved to a position where it should be opposed to the suctioned portion of the inspection chip, the inspection chip will not work. It is positioned and accommodated within an error range that is guaranteed to be held without any loss.
(23) The plurality of types of inspection chips include a figure display chip in which a figure of an electronic circuit component having a relatively large size is formed, and a square chip having an outer shape corresponding to an electronic circuit component having a relatively small size. The unit for accuracy inspection according to (21) or (22).
  According to the accuracy inspection unit of this section, the mounting position of the electronic circuit component mounting device is obtained by imaging the shape of the electronic circuit component and the outer shape of the square chip and performing the same image processing as when mounting the actual electronic circuit component. It is possible to perform an accuracy inspection and to detect a relative position error of a component of the electronic circuit component mounting apparatus. Further, as in the embodiments described later, even when the image of the electronic circuit component itself is not imaged and the separately provided detection target is imaged and the position of the inspection chip is detected, the inspection is performed. It is possible to make the user recognize that the chip for use can be used for detecting the mounting position of the electronic circuit component of the kind represented by the shape.
(24) The accuracy according to any one of (21) to (23), wherein the placement unit includes one or more placement units on which the plurality of types of inspection chips can be alternatively placed. Inspection unit.
  One mounting unit is sufficient, or a plurality of mounting units are provided in a state where at least a part of each of the mounting units overlaps, and the accuracy inspection unit can be configured compactly.
(25) The above-mentioned mounting portion is provided in a state surrounding the suction hole that is opened in the mounting portion and sucks air, and is used for the inspection based on the suction of air from the suction hole. The accuracy inspection unit according to any one of (21) to (24), further comprising an adsorption surface for adsorbing the chip.
  If the inspection chip is attracted to the suction surface, the inspection chip is not displaced on the mounting portion, and it is avoided that the inspection accuracy is lowered due to the displacement of the inspection chip. Moreover, delivery can be performed between the component holding head and the mounting portion while avoiding the displacement of the inspection chip.
(26) The suction hole includes a small hole opened adjacent to the placement portion and a large hole larger than the small hole, and the maximum chip is placed on the placement portion. In the state where both the small hole and the large hole are blocked, the small hole is blocked but the large hole is not blocked in the state where the minimum chip is mounted, and the accuracy is The accuracy inspection unit according to any one of items (21) to (25), wherein the inspection unit includes an opening / closing device that opens and closes the large hole. (27) The opening / closing device includes a closing member attached to and detached from the opening of the large hole.TermThe unit for accuracy inspection described in 1.
(28) The mounting portion includes an annular protrusion formed in a state surrounding the large hole and the small hole, and a top surface forming the adsorption surface for adsorbing the largest chip, and the small portion inside the annular protrusion is provided. The accuracy inspection unit according to item (26) or (27), wherein the periphery of the opening of the hole forms the suction surface of the smallest chip.
  When the largest chip is placed on the suction surface, it is avoided that it hits the upper surface of the inspection table and is placed out of the holding state by the component holding head. For example, when the maximum tip is sucked by the suction nozzle, if the tip is held by the suction nozzle in an inclined state because of the flatness (right angle accuracy) of the nozzle tip, etc. If the protrusion is not provided, when the largest chip is lowered toward the inspection table, the lowermost part first hits the upper surface of the inspection table and moves with respect to the suction nozzle. On the other hand, if the largest chip is placed on the annular protrusion, it is preferable that the edge located below the other part hits the upper surface of the inspection table due to the inclination, and the largest chip is placed with a deviation. This avoids a decrease in inspection accuracy.
(29) The accuracy inspection unit according to any one of (21) to (28), wherein the inspection reference mark is common to the plurality of types of inspection chips.
  The inspection reference mark can be a dedicated mark for each of a plurality of types of inspection chips, or a common mark for at least two of the plurality of types of inspection chips. However, as in this section, if the mark is common to all of the plurality of types of inspection chips, there is only one reference for detection of relative position error and mounting position accuracy inspection, and the relative position of the plurality of inspection reference marks. The problem of error is eliminated, and an effect that the control program is simple can be obtained. (30) The inspection reference mark is provided at a position close to the minimum chip in a state where the minimum chip is mounted on the mounting portion, and the inspection reference mark is mounted on the mounting portion. The accuracy inspection unit according to any one of (21) to (29), which is visible through the maximum chip.
  For example, the inspection reference mark can be made common to the largest chip and the smallest chip while the inspection reference mark is provided at a position close to the smallest chip, and the inspection unit can be configured compactly.
(31) The accuracy inspection unit according to (30), wherein the maximum chip has a see-through window at a position corresponding to the inspection reference mark in a state where the maximum chip is mounted on the mounting portion.
  The see-through window may be a transparent part surrounded by an opaque part or a through-hole formed in the largest chip. The edges of these transparent parts and through holes can be used as detected parts for detecting the position of the maximum chip. In that case, the mounting position error of the maximum chip is used as a reference for the inspection reference mark. Easy to get.
(32) Any of the items (21) to (31), including an optical property reference gauge having an optical property reference surface formed on the back surface, wherein the inspection table includes a gauge accommodating recess for accommodating the optical property reference gauge The unit for accuracy inspection described in 1.
  The optical characteristic reference gauge may be a monochrome reference gauge having no color or a color reference gauge having color. In the latter case, it is desirable to include three types of optical characteristic reference gauges corresponding to the three primary colors. The latter is suitable when the image pickup apparatus for picking up an electronic circuit component is a color camera.
  The optical characteristic reference gauge is used, for example, for adjusting the optical characteristics of the component camera. When adjusting the optical characteristics of a monochrome component camera using a monochrome reference gauge, whether the component camera captures the monochrome reference gauge held by the component holding head and whether the amount of reflected light is within the set range. Based on this, for example, it is possible to adjust the shutter speed, the intensity of illumination light, and the gain of the camera so that a predetermined amount of light is obtained for imaging of the imaging target, and the edge of the detected portion can be accurately acquired. The gain of the camera is adjusted by changing the ratio when converting the amount of incident light into voltage.
  For the color component camera, the three types of optical characteristic reference gauges are sequentially held by the component holding head and imaged by the component camera. The amount of light obtained for each reference gauge is represented by multiple levels of gradation (for example, 256 gradations), and based on whether light of a set gradation is obtained for each reference gauge, for example, shutter speed, Alternatively, the intensity of illumination light, the spectral distribution, and the gain of the camera can be adjusted so that the image of the imaging target can be accurately captured by the color camera.
                                                                                

  Several embodiments of the claimable invention will now be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  FIG. 1 schematically shows an electronic circuit component mounting system including an electronic circuit component mounting apparatus having an accuracy testing unit as one embodiment of the claimable invention. As shown in FIG. 1, the electronic circuit component mounting system includes a substrate transfer device 10, a feeder-type component supply device 12 and a tray-type component supply device 14, each of which is a kind of component supply device, an electronic circuit component mounting device 18, and a nozzle. A head storage device 20 and a control device 22 (see FIG. 8) are included.

  The board transfer device 10 is provided on a bed 30 as a system main body, transfers the circuit board 32 in one horizontal direction, and loads it into the board holding device 16 of the electronic circuit component mounting device 18, and carries it out of the board holding device 16. To do. The substrate transport direction is the X-axis direction, and the direction perpendicular to the X-axis direction is a Y-axis direction in a horizontal plane that is parallel to the component mounting surface that is the surface of the circuit board 32 held by the substrate holding device 16. To do. The substrate transport device 10 is a device that transports the circuit board 32 by, for example, a belt conveyor. Each of the guide members 34 and 36 (see FIG. 1) and the pair of side frames provided on the pair of side frames, respectively. Including a provided conveyor belt and belt circulator. One of the pair of side frames is a fixed side frame provided with a fixed position, and the other is a movable side frame provided so as to be able to approach and separate from the fixed side frame. By being moved by the apparatus, the distance between the guide members 34 and 36 is adjusted to a distance corresponding to the width of the circuit board 32. The guide member 34 provided on the fixed side frame is referred to as a fixed guide member 34, and the guide member 36 provided on the movable side frame is referred to as a movable guide member 36.

  The substrate holding device 16 is provided with a fixed position, and although not shown, for example, the substrate holding device 16 includes a substrate support device that supports the circuit board 32 from below and a clamp device that clamps the edge of the circuit board 32, and the circuit board 32. Is held in a horizontal position. Although the illustration of the clamp device is omitted, for example, a holding unit provided on each of the pair of guide members 34 and 36 of the substrate transport device 10 and a pair of side frames are provided, and the circuit board 32 is connected to the conveyor belt. The upper surface of the circuit board 32 is the height of the downward pressing surface facing the circuit board 32 of the pressing portion in a state of being clamped by the clamping device. It is determined by the length and is constant regardless of the type of the circuit board 20.

  In the electronic circuit component mounting system, as shown in FIG. 1, the feeder-type component supply device 12 and the tray-type component supply device 14 are provided on both sides of the bed 30 separated from the substrate transfer device 10 in the Y-axis direction. Each is provided. The feeder-type component supply device 12 includes, for example, a plurality of feeders that are provided on the fixed guide member 34 side and are a kind of component supply tool. Each of the plurality of feeders is provided in a state in which the respective component supply units are arranged in the X-axis direction, and a large number of electronic circuit components are respectively fed by the feeding device, and are sequentially positioned and supplied to the component supply unit one by one. The tray-type component supply device 14 is a device that stores and supplies electronic circuit components in a tray having a large number of receiving recesses, and is provided, for example, on the movable guide member 36 side.

  As shown in FIGS. 1 to 4, the electronic circuit component mounting device 18 includes the substrate holding device 16, the multi-nozzle head 40, the single nozzle head 42, the head holding device 44, the head moving device 46, and the head lifting / lowering device. A device 48, a head rotating device 50, a reference mark imaging system 52, and two sets of component imaging systems 53 are included. As shown in FIG. 1, the head moving device 46 includes an X-axis direction moving device 54 and a Y-axis direction moving device 56. The X-axis direction moving device 54 includes an X-axis slide 60 and an X-axis slide moving device 62 (see FIG. 8) as movable members. The X-axis slide moving device 62 includes an X-axis moving motor 64 (see FIG. 8) as a driving source and a feed screw mechanism 66 (see FIG. 8) including a ball screw and a nut. The Y-axis direction moving device 56 is provided on the X-axis slide 60, and includes a Y-axis slide 70 and a Y-axis slide moving device 72 (see FIG. 8) as movable members. Similar to the X-axis slide moving device 62, the Y-axis slide moving device 72 includes a Y-axis moving motor 74 (see FIG. 8) and a feed screw mechanism 76 (see FIG. 8) as drive sources. The X-axis moving motor 64 and the Y-axis moving motor 74 are constituted by, for example, a servo motor with an encoder which is a kind of electric motor. The servo motor is an electric rotary motor capable of accurately controlling the rotation angle, and a step motor may be used instead of the servo motor. A linear motor may be used.

  As shown in FIG. 2, the Y axis slide 70 is provided with the head holding device 44, the head elevating device 48, the head rotating device 50, and the reference mark imaging system 52. Is moved to an arbitrary position on the horizontal plane. The head holding device 44, the multi-nozzle head 40, the single nozzle head 42, and the like are configured in the same manner as the circuit component mounting device described in JP-A-2006-261325, and will be described briefly.

  As shown in FIG. 2, the head holding device 44 includes a shaft-shaped member 80 that is a main body of the device and a head holding portion 82 that is integrally provided at the lower end of the shaft-shaped member 80. The shaft member 80 is a spline shaft member having a circular cross-sectional shape and a spline 84 provided on the outer peripheral surface. The head holding portion 82 has a circular cross-sectional shape and a larger diameter than the shaft-shaped member 80.

  The head rotating device 50 includes a rotating body 86 as a rotating member held rotatably on a Y-axis slide 70 around a vertical axis, and a rotating body driving device 88 as a rotating member driving device. The rotating body driving device 88 uses a rotation motor 90 (see FIG. 8) as a driving source, and the rotation is transmitted to the rotating body 86 by a rotation transmitting device including a gear 92 fixed to the rotating body 86. Rotated around the axis. The motor 90 for rotation is comprised by the servomotor with an encoder, for example. The rotating body 86 has a cylindrical shape, and a spline 84 of the shaft-like member 80 is fitted to a spline 94 provided on the inner peripheral surface thereof so as to be relatively movable in the axial direction but not relatively rotatable. The shaft-shaped member 80 is rotated by an arbitrary angle in both forward and reverse directions around its own vertical axis, and the head holding portion 82 is rotated. The axis of the shaft-shaped member 80 is the rotation axis of the head holding device 44. The splines 84 and 94 are ball splines, and are fitted with high accuracy through the balls.

As shown in FIG. 2, the head elevating device 48 includes an elevating member 100 that can be raised and lowered on the Y-axis slide 70, an elevating motor 102 (see FIG. 8) as a drive source, and a Y-axis slide 70. A feed screw mechanism 10 including a ball screw 104 as a screw shaft provided so as not to be relatively movable in the axial direction and rotatable about a vertical axis, and a nut 106 fixed to the elevating member 100.
8 and so on. The raising / lowering motor 102 is comprised by the servomotor with an encoder, for example. The upper part of the shaft-like member 80 is held by the elevating member 100 so as to be relatively rotatable and incapable of relative movement in the axial direction. When the ball screw 104 is rotated by the elevating motor 102, the elevating member 100 is moved up and down. The head holding device 44 is moved up and down.

  As shown in FIG. 2, the shaft-shaped member 80 is provided with a passage 110 on its axis and an annular passage 112 on the outside thereof. The annular passage 112 is a negative pressure source such as a negative pressure pump. 120. Supply of negative pressure from the negative pressure source 120 to the annular passage 112 is permitted or blocked by the opening / closing device 122. Hereinafter, the annular passage 112 is referred to as a negative pressure supply passage 112.

  As shown in FIG. 2, the passage 110 is connected to a positive pressure source 124 such as a compressor and the negative pressure source 120. Supply of positive pressure and supply of negative pressure to the passage 110 are switched by the switching device 126, and positive pressure and negative pressure are alternatively supplied. A state in which the passage 110 is opened to the atmosphere by the switching device 126 is also obtained. Hereinafter, the passage 110 is referred to as a positive pressure / negative pressure supply passage 110.

  As shown in FIG. 2, the head holding portion 82 has a flat surface perpendicular to the axis thereof, and includes a horizontal and downward suction surface 130. The head holding portion 82 is formed with an annular negative pressure chamber recess 132 that opens to the suction surface 130 and has an axis thereof as a center line, and communicates with the negative pressure supply passage 112 through a passage 134. A lower end portion of the positive pressure / negative pressure supply passage 110 is opened to the suction surface 130.

  Both the multi-nozzle head 40 and the single-nozzle head 42 are attracted and held by a negative pressure by the head holding device 44, and are moved up and down and rotated. The head lifting device 48 is a moving device that moves the component holding head in a direction parallel to the center line of the component holding head when the electronic circuit component is sucked and mounted. As shown in FIG. 2, the single nozzle head 42 includes a head body 138 and a held portion 140. The head main body 138 includes a nozzle holding portion (not shown), and holds one suction nozzle 144 as a component holder that sucks the electronic circuit component 142 by negative pressure. The nozzle holding unit and the suction nozzle 144 constitute a component suction head 145 that is a component holding head. The single nozzle head 42 includes one component suction head 145, and the nozzle holder can selectively hold a plurality of types of suction nozzles 144 having different suction tube diameters, and a plurality of types having different sizes. However, it is mainly used for mounting large-sized electronic circuit parts and odd-shaped parts.

  The held portion 140 of the single nozzle head 42 has a disk shape with a circular cross-sectional shape, and includes an adsorbed surface 146 that is perpendicular to the axis thereof and that is a flat surface as shown in FIG. In the single nozzle head 42, the suction surface 146 is brought into close contact with the suction surface 130, the negative pressure chamber recess 132 is closed to form a head suction negative pressure chamber 148, and the head suction head is connected to the negative pressure supply passage 112. The single nozzle head 42 is attracted and held by the head holding device 44 by the negative pressure supplied to the negative pressure chamber 148.

  The single nozzle head 42 is moved up and down as the head holding device 44 is moved up and down by a head lifting device 48 and a head rotating device 50, and is moved closer to and away from the component supply devices 12 and 14 and the substrate holding device 16. The electronic circuit component is received and attached to the circuit board 32. The axis of the shaft-like member 80 of the head holding device 44 that holds the single nozzle head 42 becomes the rotation axis of the suction nozzle 144. In a state where the single nozzle head 42 is held by the head holding device 44, the positive pressure / negative pressure supply passage 110 is communicated with the head main body 138, and negative pressure is supplied to the suction nozzle 144 when the electronic circuit component is sucked. When the circuit component is mounted on the circuit board 32, the supply of the negative pressure is cut off and the positive pressure is supplied, so that the electronic circuit component is quickly opened.

  As shown in FIG. 3, the multi-nozzle head 40 is a valve provided for each of the head main body 150, the held portion 152, the plurality of nozzle holding portions 153, the plurality of suction nozzles 154 that are component holders, and the nozzle holding portion 153. A device 156 and a nozzle selection device 157 are provided. Each of the plurality of suction nozzles 154 is held by a nozzle holding portion 153, and is separated from the head main body 150 by an appropriate interval on a circumference around the center line thereof. Is provided. The multi-nozzle head 40 having a plurality of suction nozzles 154 has a short distance between adjacent suction nozzles 154, and the suction nozzle 154 has a small diameter of the suction pipe, and sucks and mounts relatively small electronic circuit components. It is said. The held portion 152 includes a suction surface 158 that is perpendicular to the axis of the holding surface and has a flat surface. Like the single nozzle head 42, the suction surface 158 is brought into close contact with the suction surface 130 so that negative pressure for head suction is obtained. The chamber 148 is formed, and the multi-nozzle head 40 is sucked and held by the head holding device 44 by the negative pressure supplied from the negative pressure supply passage 112 to the head suction negative pressure chamber 148.

  The multi-nozzle head 40 is lifted and lowered by the head lifting and lowering device 48 while being held by the head holding device 44, and the nozzle selecting device 157 is operated by the nozzle lifting and lowering device 159 along with the lifting and lowering. As shown in FIGS. 2 and 3, the nozzle lifting device 159 includes a driving member 160 and a turning device 161 that turns the driving member 160 to an arbitrary position around the rotation axis of the head holding device 44. The swivel device 161 includes a rotating body 151 and a rotating body rotating device 155 attached to the rotating body 86 of the head rotating device 50 so as to be relatively rotatable around the rotation axis of the head holding device 44. The rotating body rotating device 155 includes a turning motor 163, gears 165, 167, and the driving member 160 is an outer peripheral portion of the lower surface of the rotating body 151, and extends vertically downward from a portion removed from the multi-nozzle head 40. And rotated by the rotation of the rotating body 151. The extending end portion of the driving member 160 is protruded toward the multi-nozzle head 40 side, and a driving portion 169 is provided.

  When the multi-nozzle head 40 is lowered, the drive unit 169 turns to a position corresponding to the lever 171 of the nozzle selection device 157 provided for the suction nozzle 154 that sucks and mounts electronic circuit components among the plurality of suction nozzles 154. The drive unit 169 is engaged with the lever 171, and the lever 171 is rotated against the urging force of the compression coil spring 168 as an elastic member which is a kind of urging means to lower the suction nozzle 154. Let Further, when the multi-nozzle head 40 is raised, the driving member 160 allows the lever 171 to rotate in the direction of raising the suction nozzle 154 by the bias of the spring 168. When the multi-nozzle head 40 is moved up and down by the head lifting / lowering device 48, the suction nozzle 154 that sucks and mounts electronic circuit components among the plurality of suction nozzles 154 selectively lifts and lowers the other suction nozzles 154. The electronic circuit components are taken out from the component supply devices 12 and 14 and mounted on the circuit board 32.

  In the state where the multi-nozzle head 40 is held by the head holding device 44, the positive / negative pressure supply passage 110 and the negative pressure supply passage 112 are respectively communicated with the passages in the multi-nozzle head 40, and the valve device 156. With this switching, a negative pressure is supplied to the suction nozzle 154 when the electronic circuit component is sucked, and a negative pressure is cut off and a positive pressure is supplied when the electronic circuit component is attached. The switching of the valve device 156 is performed by the driving member 160 of the nozzle lifting device 159 as the multi-nozzle head 40 is lifted and lowered. Further, a reset device 162 is provided, and the plurality of valve devices 156 are reset all at once, and returned to a state in which neither negative pressure nor positive pressure is supplied to the suction nozzle 154. These valve device 156, nozzle selection device 157, nozzle lifting device 159 and reset device 162 are also described in the aforementioned Japanese Patent Laid-Open No. 2006-261325, and detailed description thereof will be omitted.

  The multi-nozzle head 40 held by the head holding device 44 is rotated by the head rotating device 50. In the present multi-nozzle head 40, the suction nozzle 154 is held by the head body 150 as a rotating member so as not to rotate around its own center line, and is physically swiveled around the center line of the head body 150. However, the head main body 150 is rotated around its center line, and the head moving device 46 is in a direction parallel to a horizontal plane that is a plane orthogonal to the center line, and is in the X-axis direction and the Y-axis direction. By being moved in the axial direction, each of the plurality of suction nozzles 154 is substantially rotated around their center line. Although the physical rotation axis is one center line of the head body 150, it can be considered that a substantial rotation axis exists for each suction nozzle 154, and each of the plurality of suction nozzles 154 holds the nozzle. The multi-nozzle head 40 includes a plurality of component suction heads 164. The component suction head 164, which is a component holding head, is configured together with the portion 153 and the portion of the head body 150 where the nozzle holding portion 153 is provided. In addition, the head moving device 46 cooperates with the head rotating device 44 to constitute a head rotating device that rotates the component suction head 164 around its rotation axis.

  As shown in FIGS. 3 and 4, a head-side reference mark 166 is provided on the lower surface of the drive unit 169 of the drive member 160 to constitute a head-side reference unit. The head side reference mark 166 has a circular shape, for example. The head-side reference mark 166 is provided, for example, by printing, sticking a sticker, or the like, but in any case, the light reflectance of the head-side reference mark 166 and the portion other than the head-side reference mark 166 of the drive member 160 is reflected. Are greatly different from each other so that the image of the head side reference mark 166 is clearly formed. For example, the reflectance varies depending on the selection of color, brightness, material, and the like.

  As schematically shown in FIG. 1, the nozzle head storage device 20 includes a plurality of head storage portions 170, and although not shown, a plurality of types of multi-nozzle heads 40 and a plurality of types of single nozzle heads 42 are stored. Has been. The multi-nozzle head 40 is different in type by, for example, different types and numbers of suction nozzles 154 to be held. The type of the suction nozzle 154 is made different, for example, by making the diameter of the suction tube 172 of the suction nozzle 154 different. Similarly, the type of the single nozzle head 42 is made different by changing the diameter of the suction tube 174 of the suction nozzle 144 to be held. The nozzle head storage device 20 is described in the above-mentioned Japanese Patent Application Laid-Open No. 2006-261325, and detailed illustration and description thereof are omitted. However, each of the plurality of head storage portions 170 includes a storage hole and a positioning pin as a positioning portion. The recessed portions as the positioned portions provided in each of the multi-nozzle head 40 and the single nozzle head 42 are fitted to the positioning pins, whereby the phases of the heads 40 and 42 are determined, and the held portion 140 and the head body The nozzle heads 40 and 42 are accommodated in a state where the center position is determined by fitting the lower part of 150 into the accommodation hole.

  Further, as schematically shown in FIG. 1, the reference mark imaging system 52 is provided on a Y-axis slide 70 of the head moving device 46 and is moved to an arbitrary position in the horizontal plane by the head moving device 46 together with the head holding device 44. Moved. The reference mark imaging system 52 includes a reference mark camera 180 as an imaging device and an illumination device (not shown), and images a plurality of, for example, two reference marks 182 (see FIG. 1) provided on the circuit board 32. .

  Further, as shown in FIG. 1, each of the two sets of component imaging systems 53 includes a portion between the feeder-type component supply device 12 and the substrate transfer device 10, and the tray-type component supply device 14 and the substrate transfer device 10. The parts are provided so as to be movable in the direction parallel to the board conveyance direction, and are moved by the component camera moving device 186, respectively. Each of these component camera moving devices 1864 includes a slide 188 as a movable member and a slide moving device 190 (see FIG. 8). The slide moving device 190 includes a component camera moving motor 192 (see FIG. 8), which is a driving source provided on the bed 30, and a ball that is rotatable about an axis parallel to the substrate transport direction and immovable in the axial direction. A screw and a feed screw mechanism 194 (see FIG. 8) including a nut fixed to the slide 188, and the slide 188 is guided by a guide rail 196 (see FIG. 1) as a guide member. Accordingly, the component imaging system 53 provided on the slide 188 is moved to an arbitrary position in a direction parallel to the board conveyance direction. The component imaging system 53 includes a component camera 198 as an imaging device and an illumination device (not shown).

  In the present embodiment, the reference mark camera 180 and the component camera 198 are each a CCD camera that obtains a two-dimensional image of a subject at once, and is a monochrome camera. However, the reference mark camera 180 has a small imaging surface, The size of the component camera 198 is large enough to image one small electronic circuit component such as a fiducial mark 182 or a square chip. The component camera 198 has a large imaging surface and is held by the head body 150 of the multi-nozzle head 40. The suction nozzle 154 and the head-side reference mark 166 can be simultaneously imaged at the same time. The head-side reference mark 166 is provided on the driving member 160 provided outside the multi-nozzle head 40 and close to the multi-nozzle head 40, and is imaged together with the single nozzle head 42 or the multi-nozzle head 40 by the component camera 198. Is possible. At least one of the reference mark camera 180 and the component camera 198 may be a line scan camera. In the present embodiment, the component camera 198 captures a front image of the object to be imaged.

  As shown in FIG. 1, an accuracy inspection unit 200 is provided on the fixed guide member 34 of the substrate transport apparatus 10. The accuracy testing unit 200 is used for testing the accuracy of the mounting position of the electronic circuit component on the circuit board 32 by the suction nozzles 144 and 154. The accuracy inspection unit 200 is capable of performing inspection using a plurality of types of inspection chips, for example, two types of inspection chips. In this electronic circuit component mounting system, electronic circuit components are mounted on a single circuit board 32 by at least one of a multi-nozzle head 40 and a single nozzle head 42. Since the two types of inspection chips having different sizes are used, inspection is performed for each of the suction nozzles 144 and 154 since the electronic circuit components can be selectively used according to the size of the mounted electronic circuit component.

  As shown in FIG. 5, the accuracy inspection unit 200 includes an inspection table 202, a figure display chip 204, a square chip 206, and a monochrome reference gauge 208 as an optical characteristic reference gauge. The figure display chip 204 is a kind of inspection chip, and generally has a square shape. The shape display chip 204 may be made of any material such as metal (for example, stainless steel), ceramics, and synthetic resin, but is preferably made of a material having a small coefficient of thermal expansion. In this embodiment, colorless transparent glass is used. It is made of. The figurative display chip 204 has a size corresponding to a large electronic circuit component, such as an electronic circuit component having leads, and is the largest chip. On one surface thereof, a relatively large electronic circuit component, for example, The shape 210 of the electronic circuit component in which a plurality of leads are extended from each of the four sides of the square-shaped main body is formed by appropriate means, for example, aluminum vapor deposition, and has a silver color. The shape 210 is formed concentrically with the shape display chip 204.

  Further, as shown in FIG. 5, a plurality of, for example, four see-through windows 212 are formed in the portion of the figure display chip 204 where the figure 210 is formed. Each of these see-through windows 212 forms a perfect circle and is formed by forming an opaque figure 210 leaving a part of it, and is a transparent part surrounded by an opaque part, and its circular edge is detected. Are formed at equal angular intervals on a circumference centered on the center of the figure display chip 204. The four see-through windows 212 are provided so that four sets of see-through windows 212, each of which is a set of two adjacent windows, are arranged in parallel with the four external sides of the figure display chip 204 that are perpendicular to each other. Yes.

  The square chip 206 is also a kind of inspection chip and has the outer shape and dimensions corresponding to the square chip which is a relatively small electronic circuit component mounted by the multi-nozzle head 40, and is the smallest chip. The square chip 206 is made of, for example, white ceramics.

  The monochrome reference gauge 208 is used to adjust the shutter speed of the component camera 198. As shown in FIG. 6, the gauge body 222 is accommodated in a recess 220 formed in the end surface of the gauge body 218. , And the back surface of the monochrome reference gauge 208 forms a lightness reference surface 224 which is an optical characteristic reference surface. The component camera 198 and the reference mark camera 180 are black and white cameras, the gauge body 222 is a monochrome reference gauge body, and the lightness reference plane 224 is colored in the middle gray of 256 gradations. Yes.

  The inspection table 202 may be any material such as metal, ceramics, and synthetic resin, but is preferably made of a material having a low coefficient of thermal expansion. It is black and is detachably fixed to the fixed guide member 34 by an appropriate fixing device such as a bolt 230. The inspection table 202 includes a shape display chip housing recess 232 as a shape display chip housing portion, a square chip housing recess 234 as a square chip housing portion, a gauge housing recess 236 as a gauge housing portion, and a shape display chip mounting portion 238. A square chip mounting portion 240 and a plurality of, for example, two inspection reference marks 242 are provided.

  As shown in FIGS. 5 and 6, the shape display chip housing recess 232 is sufficiently deeper than the thickness of the shape display chip 204 and has a size that allows the shape display chip 204 to be housed with a slight gap around it. This gap is a normal figure display chip receiving position, and if the suction nozzle 144 is moved to a position to be opposed to the suctioned portion of the figure display chip 204, here the center of the figure display chip 204, the figure display is performed. The size is within an error range in which it is guaranteed that the chip 204 can be sucked without any trouble. Further, the shape display chip housing recess 232 is sufficiently deep, for example, deeper than the thickness of the shape display chip 204, and once the shape display chip 204 is housed, it does not easily jump out. The figure display chip 204 is accommodated in the figure display chip accommodation recess 232 so that the surface on which the figure 210 is formed is on the lower side.

  As shown in FIGS. 5 and 6, the corner chip accommodating recess 234 has such a size that the corner chip 206 is accommodated with a slight gap around the periphery. Similar to the shape display chip accommodating recess 232, this gap is within an error range in which it is guaranteed that the corner chip 206 can be adsorbed without hindrance if the suction nozzle 154 is moved to the normal corner chip accommodating position. The square chip 206 is accommodated in the square chip housing recess 234 while being positioned substantially in the X-axis direction and the Y-axis direction. As shown in FIG. 6, the corner chip receiving recess 234 has the same height as the upper surface of the figure display chip 204 accommodated in the figure display chip accommodation recess 232 in the state where the corner chip 206 is accommodated. A sufficient depth that is greater than the thickness of the corner tip 206.

  As shown in FIGS. 5 and 6, the gauge housing recess 236 accommodates the monochrome reference gauge 208 in a state in which the monochrome reference gauge 208 is accommodated while being positioned substantially in the X-axis direction and the Y-axis direction. The height of the upper surface is the same depth as the upper surface of the figure display chip 204 accommodated in the figure display chip accommodation recess 232 and has a sufficient depth larger than the thickness of the monochrome reference gauge 208. The monochrome reference gauge 208 is housed in the gauge housing recess 236 with the brightness reference surface 224 of the gauge body 222 facing downward. As shown in FIG. 5, the gauge housing recess 236, the shape display chip housing recess 232, and the square chip housing recess 234 are arranged in a line in a direction parallel to the X axis direction on one side of the inspection table 202 in the Y axis direction. It is provided side by side.

  As shown in FIGS. 5 and 7, the figure display chip mounting portion 238 and the square chip placement section 240 are positioned adjacent to the shape display chip housing recess 232 of the inspection table 202 in the Y-axis direction. Is provided. As shown in FIG. 7, the height of the upper surface of the portion of the inspection table 202 provided with the figurative display chip mounting portion 238 is the same as the upper surface of the figurative display chip 204 accommodated in the accommodating recess 232. An extremely shallow annular recess 252 opening on the upper surface of the inspection table 202 is formed. As shown in FIG. 5, the outer peripheral surface of the recess 252 has a generally square shape whose cross-sectional shape is smaller than the shape display chip 204, and the inner peripheral surface has a cross-sectional shape that is longer than the length of the corner chip 206. A low protrusion having a circular shape with a large diameter and a circular cross-sectional shape is formed at the center of the recess 252, and a square chip suction surface 254 serving as a mounting surface is formed by the top surface of the protrusion. A figurative display chip suction surface 256 as a mounting surface is formed on the outer side so as to surround the recess 252. The square chip suction surface 254 has an area larger than the square chip 206, is slightly lower than the upper surface of the inspection table 202, and one end portion of the suction hole 258 formed in the inspection table 202 is opened at the center. It has been made. The square tip suction surface 254 is provided so as to surround the suction hole 258, and the other end of the suction hole 258 is connected to the negative pressure source 120 by a joint member 260 or the like. The portion of the inspection table 202 provided with the square chip suction surface 254 constitutes the square chip placement portion 240, and the portion provided with the figure display chip suction surface 256 constitutes the shape display chip placement portion 238. The square chip placement unit 240 is in the figure display chip placement part 238, and the corner chip 206 and the figure display chip 204 cannot be placed on the placement parts 240 and 238 at the same time. Is done.

  Further, the two inspection reference marks 242 are provided on the bottom surface of the recess 252 as shown in FIG. These inspection reference marks 242 have, for example, a circular shape, each having a diameter smaller than the diameter of the see-through window 212 formed on the figure display chip 204, and are provided on the reference mark substrate 244 by, for example, printing. . The thickness of the reference mark substrate 244 is the same as the height of the protrusion on which the square chip suction surface 254 is formed. The reference mark substrate 244 is thin, and a through hole is provided in a portion corresponding to the protrusion, and is fitted into the recess 252. Combined and fixed. Accordingly, the two inspection reference marks 242 are parallel to the X-axis direction in the recess 252 with the same distance as the interval between the two transparent windows 212 out of the four transparent windows 212. It is provided side by side in the direction. The reference mark substrate 244 is located below the figure display chip suction surface 256 and is a semitransparent thin plate. The fiducial mark substrate 244 is made of, for example, a flame-retardant glass fiber reinforced epoxy resin, and does not easily stretch. Each of the two inspection reference marks 242 is gold in this embodiment. The inspection table 202 is formed in a color having different optical characteristics with respect to the inspection reference mark 242 and the shape 210 of the shape display chip 204. In the state of being placed on top, a clear image of the outline of the perspective window 212 formed in the figure 210 is obtained by imaging. In addition, a clear image of the inspection reference mark 242 can be obtained.

  In the accuracy inspection unit 200, the center of the square chip suction surface 254 and the center of the suction hole 258 is the position of the square chip mounting portion 240, and a figure is displayed for two inspection reference marks 242. The position at which the same relative positional relationship as the center of the figure display chip 204 with respect to the centers of the two see-through windows 212 adjacent to each other on the chip 204 is obtained is the position of the figure display chip placement unit 238. Slightly out of position. Therefore, the inspection reference mark 242 is common to the shape display chip 204 and the square chip 206, but is provided at a position close to the square chip 206 in a state of being placed on the square chip placement unit 240. The figure display chip 204 has a transparent window 212 at a position corresponding to the inspection reference mark 242 in a state where it is placed on the figure display chip mounting portion 238, and the inspection reference mark is passed through the two transparent windows 212. 242 is visible.

  The inspection table 202 is provided so that the height can be adjusted. The height is adjusted by a height adjusting device (not shown) and the inspection table 202 is fixed to the fixed guide member 34. At this time, the height of the accuracy inspection unit 200 is the same as that of the component mounting surface of the circuit board 32 in which the shape display chip suction surface 256 is held by the substrate holding device 16 and electronic circuit components are mounted. It is adjusted to be the same as the height. Therefore, the height of the upper surface of the inspection reference mark 242 provided in the concave portion 252 slightly lower than the shape display chip suction surface 256, and the surface on which the shape 210 is formed are placed on the shape display chip suction surface 256. The height of the figure 210 of the figure display chip 210 in the placed state and the height of the square chip 206 placed on the square chip suction surface 254 are substantially the same as the component mounting surface of the circuit board 32, and the reference mark camera Imaging of the inspection reference mark 242, the shape 210, and the square chip 206 by 180 is performed with high accuracy in a state where the focal point is in the same manner as the imaging of the substrate reference mark 182.

  As shown in FIG. 8, the control device 22 is composed mainly of a control computer 310 including a CPU 300, a ROM 302, a RAM 304, and a bus 306 for connecting them, and the input / output unit 312 includes a reference mark camera 180. And an image processing computer 314 that processes image data obtained by the imaging of the component camera 198, an encoder 316 of a servo motor with an encoder (a plurality are shown as representative), a board carry-in sensor 318, and the like. It is connected. The substrate carry-in sensor 318 is provided in the substrate transfer device 10 and outputs different signals depending on whether the circuit board 32 is detected or not detected, and the output signal is changed from a substrate non-detection signal to a substrate detection signal. The loading of the substrate 32 is detected. The input / output unit 312 is also connected to various actuators such as the X-axis moving motor 64 and the alarm device 330 via the drive circuit 320. The alarm device 330 is a kind of notification device, and is, for example, a device that issues an alarm by sound or light. Further, a display screen 334 is connected to the input / output unit 312 via a control circuit 332, and constitutes a display device 336 together with the control circuit 332. The ROM 302 stores various programs, data, and the like, such as a mounting program, a main routine not shown, and a figure display chip use relative position error acquisition routine shown in the flowchart of FIG.

Next, the operation will be described.
In the electronic circuit component mounting system, the electronic circuit component is mounted on one circuit board 32 using at least one of the multi-nozzle head 40 and the single nozzle head 42. Which nozzle head 40 or 42 is used to mount the electronic circuit component is set by the mounting program, and the head holding device 44 holds the multi-nozzle head 40 or the single nozzle head 42 according to the setting. When the head holding device 44 is moved to the nozzle head storage device 20 to hold the multi-nozzle head 40 or the single nozzle head 42, the axis of the head holding device 44 is moved to a position that coincides with the center of the heads 40 and 42. However, since a positioning device is not provided between the head holding device 44 and the heads 40 and 42, the positional deviation occurs in a direction perpendicular to the center line of the heads 40 and 42. May occur. In addition, errors occur when the members and devices such as the heads 40 and 42 and the head holding device 44 are assembled.

  Therefore, after the head holding device 44 holds the heads 40, 42, before mounting electronic circuit components, the nozzle rotation axis, which is the rotation axis of the component suction heads 145, 164, using the inspection chips 204, 206, A relative position error between the reference mark camera 180 and the head side reference mark 166 is acquired. In this electronic circuit component mounting system, a component camera 198 is movably provided, and is moved to a position corresponding to a movement path from the component supply devices 12 and 14 of the heads 40 and 42 to the circuit board 32 to stop and wait. Since the moving heads 40 and 42 are imaged, the positioning accuracy between the heads 40 and 42 and the component camera 198 is low. Therefore, a head-side reference mark 166 is provided on the head holding device 44 side, is imaged together with the electronic circuit component, the position of the nozzle rotation axis is obtained with reference to the head-side reference mark 166, and the holding position error of the electronic circuit component is Calculated. Therefore, the relative position error is acquired for the head side reference mark 166 instead of the component camera 198.

Since it is the nozzle rotation axis that causes an error due to the attachment and detachment of the heads 40 and 42 to and from the head holding device 44, every time they are replaced, the nozzle rotation axis that is based on the inspection reference mark 242 is used. It is possible to obtain only the position error.
In addition, when electronic circuit components are mounted on one circuit board 32 by both the multi-nozzle head 40 and the single nozzle head 42, the nozzle heads 40, 42 are replaced on one circuit board 32, The relative position error is acquired every time, but with respect to the multi-nozzle head 40, the relative position error is acquired only for some of the suction nozzles 154, and the relative positions of the other suction nozzles 154 are calculated by calculation. The error may be estimated.
Even when the relative position error is acquired for the first time for a certain multi-nozzle head 40, that is, when the multi-nozzle head 40 is first held by the head holding device 44, if the device is manufactured with high accuracy, the entire suction is performed. It is not indispensable to acquire the relative position error for the nozzles 154, and it may be performed for only some of the suction nozzles 154, and the relative position error may be estimated for the other suction nozzles 154 based on the result. Whether or not to acquire the relative position error for all the suction nozzles 154 is determined based on the relationship between the required mounting position accuracy and the repeated position accuracy of holding the multi-nozzle head 40 by the head holding device 44.

In addition, when electronic circuit components are mounted on a single circuit board 32 by the same nozzle head and a predetermined number of electronic circuit components are continuously mounted on the same type of circuit board 32, the head holding is performed. In addition to holding the nozzle head by the apparatus 44, when a preset condition is satisfied, for example, when a predetermined number of electronic circuit components are mounted on the circuit board 32, or a set time has elapsed since the start of mounting. Sometimes the relative position error is acquired and used for mounting electronic circuit components. Whether or not these relative position error acquisition execution conditions are satisfied is determined by the control device 22, and a relative position error acquisition routine is executed when the conditions are satisfied.
When the mounting operation is continued without replacement of the heads 40 and 42, the relative position error is always acquired for all of the nozzle rotation axis, the reference mark camera 180, and the head side reference mark 166. Not essential. As for the relative position error that is likely to change, it is possible to obtain the relative position error more frequently than the relative position error that is less likely to occur.

  Further, in the electronic circuit component mounting system, the mounting position accuracy is automatically inspected when a predetermined condition is satisfied. For example, the mounting position accuracy is inspected when electronic circuit components are mounted on the set number of circuit boards 32. At this time, if the electronic circuit component is mounted on one circuit board 32 by only one of the multi-nozzle head 40 and the single nozzle head 42, the head holding device 44 is mounted on the nozzle head that is actually held. Inspection of position accuracy is performed. If electronic circuit components are mounted on one circuit board 32 by both the multi-nozzle head 40 and the single nozzle head 42, the inspection is performed when the nozzle heads 40 and 42 are respectively held by the head holding device 44. Is done. The inspection of the mounting position accuracy is also performed using the inspection chips 204 and 206.

  Both the acquired relative position error and the inspection result of the mounting position accuracy are used for mounting the electronic circuit component on the circuit board 32, and the error is removed so that the electronic circuit component is mounted with high accuracy. Therefore, if the assembly accuracy of the device is increased, the error can be reduced and the mounting position accuracy can be improved. However, while the device cost increases, the acquisition of the relative position error, the inspection of the mounting position accuracy, By the correction based on the mounting position accuracy can be improved without increasing the apparatus cost. Moreover, since these are performed automatically, high mounting position accuracy can be maintained while reducing the frequency and required time of maintenance.

  Hereinafter, the acquisition of the relative position error and the inspection of the mounting position accuracy of the component suction heads 145 and 164 of the single nozzle head 42 and the multi-nozzle head 40 and the reference mark camera 166 and the reference mark camera 180 will be described. In addition, since the various moving members and rotating members of the electronic circuit component mounting system are moved and rotated with high accuracy, feed errors, thermal expansion of constituent members, changes in electrical control characteristics due to temperature rise, etc. can be ignored. It will be explained as a thing. However, if the positioning error of the movable member due to a feed error or the like is so large that it cannot be ignored, it is desirable to consider and correct the positioning error.

  Hereinafter, first, based on the flowchart shown in FIG. 9, for the single nozzle head 42, the rotation axis of the suction nozzle 144 relative to the inspection reference mark 242, the relative position error of the reference mark camera 180 and the head-side reference mark 166. Explain the acquisition. The single nozzle head 42 is used for mounting relatively large electronic circuit components, and a figure display chip 204 is used as an inspection chip for obtaining a relative position error.

  The accuracy testing unit 200 is made with high accuracy and is firmly fixed, and its position is stored in the ROM 302 as a part of the eigenvalue of the electronic circuit component mounting system. The position is represented by coordinate values on the XY coordinate plane defined by the X axis and the Y axis for the electronic circuit component mounting system. For the accuracy inspection unit 200, the shape display chip accommodating recess 232 and the square chip accommodating recess 234. Each position of the gauge receiving recess 236, the shape display chip mounting position, and the square chip mounting position are each expressed and stored as coordinate values on the XY coordinate plane. The positions of the receiving recesses 232, 234, and 236 are the respective centers, and the positions of the received shape display chips 204 and the like are planned to be held by the suction nozzles 144 and 154. These positions stored in the ROM 302 are referred to as regular positions.

  In step 1 of the relative position error acquisition routine using the figure display chip shown in FIG. 9 (hereinafter abbreviated as S1. The same applies to other steps), the single nozzle head 42 is moved to the figure display chip by the head moving device 46. The suction nozzle 144 sucks the figure display chip 204 and removes it from the figure display chip storage recess 232 as it is moved to the normal position of the storage recess 232 and moved up and down. The movement position of the single nozzle head 42 is controlled with respect to the rotation axis of the suction nozzle 144, and is controlled with respect to the rotation axis of the head holding device 44. The figure display chip 204 is accommodated in the figure display chip accommodation recess 232 so that the surface on which the figure 210 is formed is on the lower side, and the suction nozzle 144 is the upper surface of the figure display chip 204, Adsorb the unformed surface.

  Next, S <b> 2 is executed, the single nozzle head 42 is moved to the component camera 198, and the figure display chip 204 is imaged by the component camera 198. The component camera 198 is positioned at a predetermined imaging position for inspection when acquiring the relative position error. The inspection imaging position is a position close to the accuracy inspection unit 200, and is set, for example, at a position adjacent to the accuracy inspection unit 200 in the Y-axis direction. The single nozzle head 42 is moved to a position where the rotation axis of the head holding device 44 is scheduled to coincide with the center of the imaging surface of the component camera 198, and the held figure display chip 204 is imaged and the head side The reference mark 166 is imaged simultaneously. At the time of imaging, the height of the lower surface of the figure display chip 204 and the lower surface of the head side reference mark 166 are made the same by raising and lowering the single nozzle head 42, and the figure 210 formed on the lower surface of the figure display chip 204 is also the head. The side reference mark 166 is also imaged with the component camera 198 in focus.

  After imaging, S3 is executed, and the positional deviation of the figure display chip 204 with respect to the head side reference mark 166 is acquired based on the image data of the figure display chip 204 and the head side reference mark 166 obtained by image processing. Based on the image data, the center positions of the four see-through windows 212 of the figure display chip 204 are obtained, and the average position thereof is set as the actual center position on the imaging surface of the figure display chip 204. The transparent see-through window 212 is provided in the silver figure 210, and a clear image of the edge of the see-through window 212 is obtained by imaging the figure 210, and its center position is obtained. Further, a target position that is a position that should be relative to the head-side reference mark 166 at the center of the figure display chip 204 is obtained based on the center position of the head-side reference mark 166. When the relative position error is acquired, the head side reference mark 166 is rotated by a preset error acquisition rotation position around the rotation axis of the head holding device 44, for example, the component supply device 12 by the suction nozzle 154 of the multi-nozzle head 40. 14 is located at the time of component removal, which is located when the electronic circuit component is taken out from 14. In the multi-nozzle head 40, the plurality of suction nozzles 154 are moved to a preset component suction position by the rotation of the head body 150, and the drive member 160 is located at a component extraction position that is a position corresponding to the component suction position. Since the nozzle selection device 157 is driven and the valve device 156 is switched, the position at the time of taking out the component is set as the rotation position at the time of error acquisition. The turning of the driving member 160 to the rotation position at the time of error acquisition is performed with high accuracy. Further, since the distance from the rotation axis of the head holding device 44 is assured with high accuracy, the head side reference mark 166 is regarded as having no error in their rotational position and distance. Therefore, based on these rotational positions and distances, the position that should be on the imaging surface at the center of the figure display chip 204 is calculated, and the displacement of the actual center position from the target center position is calculated. This actual displacement of the center position is a displacement based on the head-side reference mark 166.

  Next, S4 is executed, the single nozzle head 42 is moved to the figure display chip mounting portion 238 of the accuracy inspection unit 200, and the figure display chip 204 is placed on the figure display chip suction surface 256. The suction nozzle 144 sucks the surface of the figure display chip 204 opposite to the side on which the figure 210 is formed, and the figure display chip 204 is placed on the suction surface 256 on the surface on which the figure 210 is formed. Thus, the height of the shape 210 is the same as that of the suction surface 256. At the time of this placement, the figure display chip 204 is placed with the positional deviation acquired in S3 corrected. The movement position of the single nozzle head 42 is controlled as such. A negative pressure is supplied to the suction hole 258 at an appropriate time immediately before and after the figure display chip 204 contacts the suction surface 256, and the suction is performed after the figure display chip 204 is suctioned to the suction surface 256 and prevented from shifting. The supply of negative pressure to the nozzle 144 is cut off, and the figure display chip 204 is released. Therefore, the figure display chip 204 is sucked by the suction surface 256 without deviating from the state held by the suction nozzle 144. It is desirable that the positive pressure is instantaneously supplied when switching from the negative pressure to the atmospheric pressure so that the figure display chip 204 is released quickly. Since the square chip suction surface 254 is slightly lower than the shape display chip suction surface 256, there is a gap between the shape display chip 204 and the square chip suction surface 254, and the suction hole 258 passes through the gap. The supplied negative pressure is supplied to the recess 252, and the figure display chip 204 is sucked and fixed to the figure display chip suction surface 262.

  Next, S5 is executed, and the reference mark camera 180 is moved to the normal image display chip imaging position, and the mounted image display chip 204 is imaged. The movement position of the reference mark camera 180 is controlled with respect to the center of the imaging surface. When the figure display chip 204 is placed on the figure display chip suction surface 256, as shown in FIG. 10, the inspection reference mark 242 is located in two of the four see-through windows 212. However, since the reference mark camera 180 has a small imaging surface, the two fluoroscopic windows 212 are imaged one by one together with the inspection reference mark 242. Therefore, the figure display chip imaging position is the center position of the inspection reference mark 242, and two positions are set, and the reference mark camera 180 is sequentially moved to the two figure display chip imaging positions. The fluoroscopic window 212 and the inspection reference mark 242 are imaged.

  In S <b> 6, the positional deviation of the center of the imaging surface of the reference mark camera 180 with respect to the center of the inspection reference mark 242 is acquired based on the image processed image data. Two misalignments are acquired and stored in the RAM 304. In addition, for each of the two fluoroscopic windows 212, each positional deviation in the X-axis and Y-axis directions with respect to the center of the inspection reference mark 242 at the center is calculated and stored in the RAM 304, and the two sets of positional deviations are also calculated. Based on this, the positional deviation of the head side reference mark 166 relative to the inspection reference mark 242 is acquired. The positional deviation of the fluoroscopic window 212 with respect to the inspection reference mark 242 is stored by distinguishing which of the two inspection reference marks 242 is the positional deviation acquired. As described above, when the figure display chip 204 is placed at the figure display chip placement position, the positional deviation of the figure display chip 204 with respect to the head side reference mark 166 is corrected. The positional deviation with respect to the mark 242 represents the positional deviation of the head side reference mark 166 with respect to the inspection reference mark 242. The positional deviation of the figure display chip 204 with respect to the inspection reference mark 242 is calculated as the deviation of the actual center position of the figure display chip 204 from the position where the figure display chip 204 indicated by the inspection reference mark 242 should be.

  As shown in FIG. 11, there is a preset relationship between the position where the center of the figure display chip 204 should be and the center positions of the two inspection reference marks 242 as shown in FIG. There is a similar positional relationship between the actual center position of the figure display chip 204 and the central positions of the two fluoroscopic windows 212, and the positional relationship and the inspection reference for each of the two fluoroscopic windows 212. Based on the positional deviations Δx1, Δy1 and Δx2, Δy2 with respect to the mark 242, the positional deviation of the actual position of the center of the figure display chip 204 with respect to the desired position is calculated. The positional deviation is {(Δx1 + Δx2) / 2−b (Δy2−Δy1) / a, (Δy1 + Δy2) / 2}, and is provided in the RAM 304 as the positional deviation of the head side reference mark 166 with respect to the inspection reference mark 242. It is stored in the relative position error memory. Here, a is the distance between the two inspection reference marks 242 and b is the distance between the midpoint of the two inspection reference marks 242 and the position where the figure display chip 204 should be. In FIG. 11, for easy understanding, the displacement of the rotational position of the figure display chip 204 is exaggerated. However, since the rotational position displacement angle Δθ is actually extremely small, Is assumed that there is no misalignment of the center due to the rotational displacement angle Δθ of the figure display chip 204, and the displacement in the X-axis direction is obtained as the product of the distance b and the rotational displacement angle Δθ. The rotational position deviation angle Δθ is obtained by (Δy2−Δy1) / a, and the positional deviation b (Δy2−Δy1) / a in the X-axis direction due to the rotational position deviation angle Δθ is obtained.

  Next, S7 is executed, the count value n1 of the counter is incremented, and in S8, the single nozzle head 42 sucks the figure display chip 204. At this time, the single nozzle head 42 determines the position when the figure display chip 204 is placed on the figure display chip placement unit 238 in S4, that is, the normal figure display chip placement position based on the positional deviation acquired in S3. The figure display chip 204 is sucked by the suction nozzle 144 after being moved to the corrected position. At this time, after the suction nozzle 144 sucks the figure display chip 204, the supply of the negative pressure to the suction hole 258 is cut off, and the holding of the figure display chip 204 by the figure display chip suction surface 256 is released. Therefore, the figure display chip 204 is held by the suction nozzle 144 and lifted from the figure display chip suction surface 256 without deviating from the state of being placed on the figure display chip placement unit 238. In S9, the single nozzle head 42 is rotated, the suction nozzle 144 is rotated, and the held figure display chip 204 is rotated by a predetermined angle, here, 90 degrees. The head 42 places the figure display chip 204 on the suction surface 256, and the figure display chip 204 is sucked by the suction surface 256.

  Next, S11 is executed, and the reference mark camera 180 is sequentially moved to the two image display chip imaging positions, and images the fluoroscopic window 212 and the inspection reference mark 242, respectively. Due to the rotation of the figure display chip 204, the combination of the fluoroscopic window 212 to be imaged and the inspection reference mark 242 is changed. However, since the four fluoroscopic windows 212 are formed with high accuracy, it can be considered that the positional deviation with respect to the inspection reference mark 242 does not include manufacturing errors of the fluoroscopic windows 212. In S12, the positional deviation of the reference mark camera 180 is acquired for each of the two inspection reference marks 242 based on the image data, and the positional deviation of the fluoroscopic window 212 with respect to the inspection reference mark 242 is acquired. Is memorized. The suction nozzle 144 sucks the upper surface of the figure display chip 204, which is opposite to the side on which the figure 210 is formed. The figure 210 is on the lower surface of the figure display chip 204, and is shown by a two-dot chain line in FIG. As shown, when the figure display chip 204 is placed on the figure display chip suction surface 256, the height of the figure 210 becomes substantially the same as the height of the reference mark 242 for inspection, and the reference mark camera 180 is focused. The image is taken in the state. Further, the inspection table 202 is black, and when the figure display chip 204 is placed on the figure display chip suction surface 256, the inspection table 202 is transparent between the silver figure 210 and the gold inspection reference mark 242. The black see-through window 212 looks like an annulus, and the optical characteristics thereof are different from each other, and the contour image of the see-through window 212 and the inspection reference mark 242 can be clearly obtained.

  Next, S13 is executed, and it is determined whether or not the count value n1 is equal to or larger than the set value, or 3 in this case, and S7 to S13 are repeatedly executed until the determination result of S13 becomes YES. For this reason, a total of eight positional deviations of the reference mark camera 180 with respect to the inspection reference mark 242 are acquired by imaging four times at the rotation positions of the suction nozzle 144 of 0 degrees, 90 degrees, 180 degrees, and 270 degrees. For each of the inspection reference marks 242, four positional deviations of the fluoroscopic windows 212 are acquired.

  Then, S14 is executed, and an average value of eight positional deviations with respect to the inspection reference mark 242 of the reference mark camera 180 is obtained, and stored in the relative position error memory as a positional deviation with respect to the inspection reference mark 242 of the reference mark camera 180. It is done. Further, for each of the two inspection reference marks 242, an average value of four positional shifts of the fluoroscopic window 212 is obtained, and the two sets of average values Δxa 1, Δya 1 and Δxa 2, Δya 2, and two inspection reference marks Based on the relationship between the position of the center of the shape display chip 204 and the position where the center of the shape display chip 204 should be, the X-axis and Y-axis directions are calculated in the same manner as the calculation of the positional deviation of the shape display chip 204 with respect to the inspection reference mark 242 described in S6. Is calculated. This positional deviation is a positional deviation of the nozzle rotation axis with respect to the inspection reference mark 242 and is stored in the relative position error memory. Based on the image data of the figure display chip 204 obtained by imaging the figure display chip 204 placed on the figure display chip placement unit 238, the positional deviation of the head side reference mark 166 with respect to the inspection reference mark 242 is acquired. The positional deviation of the nozzle rotation axis with respect to the inspection reference mark 242 is acquired by imaging the figure display chip 204 including imaging. In this embodiment, the second error acquisition is considered as a part of the third error acquisition, and both errors are acquired. Can be considered to be performed in parallel.

  If the positional deviations of the nozzle rotation axis with respect to the inspection reference mark 242 and the reference mark camera 180 and the head-side reference mark 166 are obtained as described above, the head-side reference mark 166 and the nozzle rotation axis are based on them. The relative position error can be obtained, and in S14, the relative position error is also calculated and stored in the relative position error memory. In S14, the count value n1 is reset to zero. Then, S <b> 15 is executed, the suction nozzle 144 sucks the figure display chip 204, the single nozzle head 42 is moved to the normal figure display chip accommodation position, and the figure display chip 204 is returned to the figure display chip accommodation recess 232. When the suction nozzle 144 sucks the figure display chip 204, the suction nozzle 144 is moved and sucked to the same position as when the figure display chip 204 is sucked in S8. Then, after the shape display chip 204 is sucked, the suction nozzle 144 is rotated 90 degrees in the same direction as the rotation in S9, and the shape display chip 204 has a phase when taken out from the shape display chip housing recess 232. And returned to the shape display chip housing recess 232. The figurative display chip 204 is always accommodated in the figurative display chip accommodating recess 232 with a constant phase.

Next, the acquisition of the relative position errors of the rotation axis of the suction nozzle 154 with respect to the inspection reference mark 242 and the reference mark camera 180 and the head side reference mark 166 for the multi-nozzle head 40 will be described.
The multi-nozzle head 40 includes a plurality of suction nozzles 154. For this reason, the relative position error of each of the plurality of suction nozzles 154 with respect to the inspection reference mark 242 on the rotation axis is acquired. Is performed only for one suction nozzle 154. In addition, if the positional deviation is already acquired about the reference mark camera 180 and the head side reference mark 166 at the time of acquisition of the relative position error about the multi-nozzle head 40, the positional deviation acquisition may be omitted. For example, with respect to one circuit board 32, electronic circuit components are mounted by both the single nozzle head 42 and the multi-nozzle head 40, and each time the nozzle heads 40, 42 are moved by the head holding device 44, the relative position error is increased. If acquisition is performed, the reference mark camera 180 and only the nozzle head from which the relative position error is acquired first of the single nozzle head 42 and the multi-nozzle head 40 for the first circuit board 32. It is only necessary to acquire the positional deviation of the head side reference mark 166.

  Acquisition of the relative position error for the multi-nozzle head 40 is performed using the corner chip 206. In the relative position error acquisition routine shown in FIG. 12, first, in S31, the suction nozzle 154 is moved to the regular square chip storage position to suck the square chip 206. The order of acquiring the relative position error of the nozzle rotation axis of the plurality of suction nozzles 154 is set in advance, and the first suction nozzle 154 is moved to the component suction position by the rotation of the head body 150, and the first suction nozzle 154 The head main body 150 is moved by the head moving device 46 so that the substantial nozzle rotation axis, which is the center line of the nozzle 154, is located at the regular square tip receiving position, and the first suction nozzle 154 is lowered. The corner chip 206 is adsorbed. Further, the head side reference mark 166 is positioned at the rotation position at the time of error acquisition.

  After the suction, S32 is executed, the multi-nozzle head 40 is moved to the component camera 198 positioned at the inspection imaging position, and the square chip 206 and the head side reference mark 166 are imaged. Also in this case, by adjusting the vertical position of the multi-nozzle head 40, the square tip 206 and the head side reference mark 166 are both imaged in the focused state by the component camera 198. Next, S33 is executed, and the positional deviation of the square chip 206 with respect to the head side reference mark 166 is acquired based on the image data. This positional deviation is obtained as a deviation of the actual center of the corner chip 206 obtained from the image data on the imaging screen with respect to the position on the imaging screen of the center of the corner chip 206 obtained from the image of the head side reference mark 166. It is done. Based on the image data of the corner chip 206, the outlines of the four corners are obtained, and the center of the corner chip 206 is obtained. The relative positional relationship between the head side reference mark 166 positioned at the rotation position at the time of error acquisition and the rotation axis of the suction nozzle 154 positioned at the component suction position is set in advance. Based on the image data of the reference mark 166, the position where the center of the corner chip 206 should be calculated is calculated.

  Then, S <b> 34 is executed, the multi-nozzle head 40 is moved to the square chip placement unit 240, the positional deviation calculated in S <b> 33 is corrected, and the square chip 206 is placed on the square chip suction surface 254. The square chip 206 is adsorbed on the square chip adsorption surface 254 by the negative pressure supplied from the suction hole 206. The negative pressure supply timing is the same as in the case of suction of the shape display chip 204, and the square chip 206 is placed on the square chip suction surface 254 without being deviated from the suction state by the suction nozzle 154, and is sucked. The

  Next, S35 is executed, and the fiducial mark camera 180 is moved to the regular square chip placement position to image the square chip 206. The square chip 206 is small and does not cover the inspection reference mark 242 like the figure display chip 204, and as shown in FIG. 13, when it is placed on the square chip suction surface 254, two inspection reference marks are provided. 242 is outside the corner tip 206. Therefore, the reference mark camera 180 is also moved to the two inspection reference marks 242 and images them. The imaging position of the inspection reference mark 242 of the reference mark camera 180 is the center position of each of the two inspection reference marks 242 as in the image display chip imaging position. In S 36, the positional deviation of the center of the corner chip 206 with respect to the imaging center of the reference mark camera 180 is acquired based on the image processed image data and stored in the RAM 304. Further, each positional deviation of the reference mark camera 180 with respect to the two inspection reference marks 242 is acquired and stored in the RAM 304. Further, the position of the corner chip 206 with respect to the inspection reference mark 242 based on the average value of the two positional deviations of the reference mark camera 180 with respect to the inspection reference mark 242 and the position displacement of the corner chip 206 with respect to the reference mark camera 180. Misalignment is acquired. Since the square chip 206 is placed on the square chip suction surface 254 after correcting the positional deviation calculated in S33, the positional deviation of the square chip 206 with respect to the inspection reference mark 242 is used for the inspection of the head side reference mark 166. This is a positional deviation with respect to the reference mark 242. Therefore, the positional deviation of the square chip 206 with respect to the inspection reference mark 242 is stored in the relative position error memory as the positional deviation of the head side reference mark 166 with respect to the inspection reference mark 242.

  Next, S37 to S43 are executed, and when the suction nozzle 154 sucks the square chip 206 and is rotated in the same direction by 90 degrees, the square chip 206 is placed on the suction surface 254. , 180, and 270 degrees, the image is picked up by the reference mark camera 180, and the positional deviation with respect to the reference mark camera 180 is acquired and stored in the RAM 304. Two inspection reference marks 242 are also imaged by the reference mark camera 180, and a positional deviation is acquired and stored in the RAM 304. When the suction nozzle 154 sucks the square chip 206 in S38, the suction nozzle 154 sets the position when the square chip 206 is placed on the square chip placement part 240 in S34, that is, the regular square chip placement position, in S33. Is moved to a position corrected by the positional deviation acquired in step S2, and the corner chip 206 is sucked. The suction nozzle 154 is not rotated around its center line with respect to the head main body 150, and its physical rotation axis is the axis of the head holding device 44. Therefore, when the multi-nozzle head 40 is rotated to rotate the suction nozzle 154, the multi-nozzle head 40 is simultaneously moved in the X-axis and Y-axis directions, and the position of the center of the suction nozzle 154 does not change, as if it is itself. As if it were rotated about the axis of rotation. In S42, as in S36, the positional deviation of the head-side reference mark 166 with respect to the inspection reference mark 242 may be acquired.

  Then, S44 is executed, and the positional deviation of the rotation axis of the suction nozzle 154 with respect to the inspection reference mark 242 is based on the positional deviation of the square chip 204 obtained with respect to the reference mark camera 180 at each of the obtained four rotational positions. To be acquired. This positional deviation is obtained by removing the positional deviation of the reference mark camera 180 relative to the inspection reference mark 242 from the average value of the four positional deviations of the square tip 206 relative to the reference mark camera 180 and is associated with the suction nozzle 154 And stored in the relative position error memory. The suction nozzle 154 is specified by, for example, the mounting position of the multi-nozzle head 40 in the head main body 150. In S44, an average value of the eight positional deviations of the reference mark camera 180 with respect to the inspection reference mark 242 is calculated, and the positional deviation of the reference mark camera 180 with respect to the inspection reference mark 242 is stored in the RAM 304 and the nozzle rotation. It is used to calculate the misalignment of the axis. Further, the relative position error between the head side reference mark 242 and the nozzle rotation axis is calculated based on the positional deviation of the reference mark camera 180, the head side reference mark 242, and the nozzle reference axis 242 with respect to the inspection reference mark 242, and the suction nozzle 154 is calculated. And stored in the relative position error memory. Also, the count value n2 is reset. The imaging of the inspection reference mark 242 may be performed only at the time of the first imaging of the square chip 206 by the reference mark camera 180, and only one of the two inspection reference marks 242 is captured. Also good.

  Then, S45 is executed, the suction nozzle 154 sucks the square tip 206, the multi-nozzle head 40 is moved to the regular square tip accommodation position, and the square tip 206 is returned to the square tip accommodation recess 234. At this time, the suction nozzle 154 is moved to the same position as when the square tip 206 was sucked in S38, sucks the square tip 206, and after being sucked, is rotated 90 degrees in the same direction as the nozzle rotation in S39. The phase of the square chip 206 is returned to the phase at the time of taking out from the square chip accommodating recess 234 and is accommodated in the square chip accommodating recess 234. The corner chip 206 is always housed in the corner chip housing recess 234 with a constant phase. Next, S46 is executed, and it is determined whether or not the relative position errors of all the suction nozzles 154 held by the multi-nozzle head 40 with the inspection reference mark 242 on the nozzle rotation axis have been acquired. If acquisition of relative position errors has not been completed for all the suction nozzles 154, the determination result in S46 is NO, S47 is executed, and the suction nozzles 154 from which the relative position errors are acquired are updated.

  Next, S48 is executed, and the same control as the control performed in S31, S34 to S45 is performed for the next suction nozzle 154, and the positional deviation and nozzle rotation of the nozzle rotation axis of each suction nozzle 154 with respect to the inspection reference mark 242 are performed. A relative position error between the axis and the head side reference mark 166 is acquired. Acquisition of each positional deviation of the reference mark camera 180 and the head-side reference mark 166 with respect to the inspection reference mark 242 is performed for the first suction nozzle 154, and thus is omitted, and the head-side reference mark 166 and the inspection reference mark are omitted. When the square chip 206 is placed on the square chip placement unit 240, the suction nozzle 154 is moved to the regular square chip placement position. If a positional deviation or the like of the nozzle rotation axis or the like is obtained for all the suction nozzles 154, the determination result in S46 is YES and the execution of the routine ends.

When the electronic circuit component is mounted on the circuit board 32 by either the single nozzle head 42 or the multi-nozzle head 40, the mounting is performed while correcting the relative position error acquired using the inspection chips 204 and 206. Is called. The case where an electronic circuit component is mounted on the circuit board 32 by the single nozzle head 42 will be described as an example, based on the mounting routine shown in FIG.
When the electronic circuit component is mounted on the circuit board 32, each positional shift with respect to the reference mark camera 180, the head side reference mark 166, and the nozzle reference axis 242 of the nozzle rotation axis acquired by executing the relative position error acquisition routine. Is performed in a state in which is removed. That is, when the reference mark camera 180 images the substrate reference mark 182 of the circuit board 32, the actual image pickup center of the reference mark camera 180 is relative to the reference mark camera 180 relative to the position coordinates of the regular substrate reference mark 182. When the electronic circuit component is mounted on the circuit board 32 by being moved to a position corrected by the position error, the actual nozzle rotation axis indicates that the normal position coordinate of each component mounting position is the nozzle rotation axis. It is moved to the position corrected by the relative position error. Therefore, prior to the execution of the mounting routine of FIG. 14, each normal coordinate value included in the mounting program is changed to a target coordinate value corrected by the relative position error, and mounting is performed according to these target coordinate values. Further, the normal relative position between the head side reference mark 166 and the nozzle rotation axis is corrected by the relative position error of the actual head side reference mark 166 with respect to the actual nozzle rotation position error, so that the head side reference mark 166 and the head rotation are rotated. The actual relative position with respect to the axis is acquired and used when performing the mounting operation.

  The mounting routine is started after the circuit board 32 is loaded and held by the board holding device 16. First, the execution of S61 moves the reference mark camera 180 to the target position, and images the two substrate reference marks 182, respectively. Then, S62 is executed, and a position error is calculated for each of a plurality of component mounting positions set on the component mounting surface of the circuit board 32 based on the image data of the two board reference marks 182. This position error includes position errors in the X-axis and Y-axis directions, which are position errors in a direction parallel to the component mounting surface, and a rotational position error about a vertical axis perpendicular to the component mounting surface.

  Next, S63 is executed, and the single nozzle head 42 is moved to, for example, one of the plurality of feeders of the feeder-type component supply device 12, and the suction nozzle 144 sucks the electronic circuit component from the feeder. Take out. Then, S64 is executed, and the single nozzle head 42 is linearly moved from the position where the electronic circuit component is sucked to the component mounting position of the circuit board 32. The held electronic circuit component is imaged by the component camera 198 together with the head side reference mark 166. The head-side reference mark 166 is positioned at a component removal position corresponding to the component suction position of the suction nozzle 154 in the multi-nozzle head 40. The component camera 198 is moved to a position corresponding to the linear movement path of the single nozzle head 42 and is kept on standby.

  Next, S66 is executed, and the holding position error of the electronic circuit component by the suction nozzle 144 is calculated based on the image data of the electronic circuit component obtained by imaging. The holding position error includes a position error in the X-axis and Y-axis directions, which is a position error in a direction parallel to the moving direction of the electronic circuit component, and a rotational position error, which is a position error around the axis of the electronic circuit component. included. Each position error in the X-axis and Y-axis directions is obtained as a deviation of the reference position of the electronic circuit component, for example, the center with respect to the nozzle rotation axis. Therefore, based on the image of the head-side reference mark 166 imaged together with the electronic circuit component and the actual relative position between the head-side reference mark 166 and the head rotation axis, the actual position of the nozzle rotation axis on the imaging screen is Calculated. Further, the positional deviation of the electronic circuit component with respect to the actual position of the nozzle rotation axis is calculated. Further, the rotational position error is calculated as, for example, the inclination of one side of the electronic circuit component with respect to one side of the image of the electronic circuit component having no inclination on the imaging screen. The rotational position error of the component camera 198 is small and is considered negligible.

  In S67, the suction nozzle 144 is rotated to correct the rotational position error based on the holding position error of the electronic circuit component by the suction nozzle 144 and the position error of the component mounting position where the electronic circuit component is mounted. At the same time, the moving position of the suction nozzle 144 is corrected, and in S68, the electronic circuit component is mounted in a substantially normal position on the circuit board 32 in a substantially normal posture. In S69, it is determined whether or not all of the planned electronic circuit components are mounted on the circuit board 32. If the mounting is not completed, the determination result in S69 is NO and the routine returns to S63. The next electronic circuit component is mounted on the circuit board 32.

The mounting of the electronic circuit components to the circuit board 32 by the multi-nozzle head 40 is also performed for each of the reference mark camera 180, the head-side reference mark 166, and the nozzle rotation axis inspection reference mark 242 acquired by executing the relative position error acquisition routine. This is performed in a state where the positional deviation is removed. However, since the multi-nozzle head 40 is provided with a plurality of suction nozzles 154, the actual relative position between each of the suction nozzles 154 and the head-side reference mark 166 is obtained and used when performing the mounting operation. .
The mounting of electronic circuit components on the circuit board 32 by the multi-nozzle head 40 is also performed based on a mounting routine similar to the mounting routine shown in FIG. However, the multi-nozzle head 40 is provided with a plurality of suction nozzles 154. After the electronic circuit components are sucked by as many suction nozzles 154 as possible, the multi-nozzle head 40 is moved to the circuit board 32 and moved to the circuit board 32. Install it. Therefore, when the electronic circuit component is picked up by the suction nozzle 154 corresponding to S63, all of the planned suction nozzles 154 are sequentially moved to the component pickup position by the rotation of the multi-nozzle head 40 and the movement in the X-axis and Y-axis directions. It is made to oppose to the component supply part of the component supply apparatuses 12 and 14. FIG. Further, the head-side reference mark 166 is positioned at the part removal position.

  The electronic circuit components held by the plurality of suction nozzles 154 are all imaged together by the component camera 198, and the head side reference mark 166 is also imaged at the same time. A holding position error, which is a relative position error with respect to the actual nozzle rotation axis at the center of, is acquired. The rotational position error of the electronic circuit component is calculated as, for example, the inclination of one side of the electronic circuit component with respect to one side of the image of the electronic circuit component having no inclination on the imaging screen. The correction of the holding position error acquired in this way together with the position error of the component mounting position acquired based on the imaging of the board reference mark 182 is that the electronic circuit component is mounted by the single nozzle head 42. Same as the case.

  In the above description, the board reference mark 182 of the circuit board 32 is described as a so-called global mark common to all the mounting positions of the circuit board 32, but one of the plurality of component mounting positions of the circuit board 32 is described. The present invention can also be applied to so-called local marks dedicated to one or a part of them. In this case, the position error for each local mark is detected, the position error is removed together with the holding position error of the electronic circuit component by the suction nozzles 144 and 154, and mounting is performed. The position error of the reference mark camera 180 is used, or the mounting position error acquired by the mounting position accuracy inspection described below is used for correcting the mounting position of the electronic circuit component.

Next, the inspection of the mounting position accuracy will be described.
The inspection of the mounting position accuracy is also performed using the accuracy inspection unit 200. As described above, the inspection is performed when a preset condition is satisfied, for example, when the electronic circuit component is mounted on the set number of circuit boards 32. An example of the inspection execution condition establishment determination routine in that case is shown in FIG. In this routine, first, in S71, it is determined whether or not the circuit board 32 has been loaded. This determination is made based on the output signal of the board carry-in sensor 318, and if the carry-in of the circuit board 32 is not detected, the determination result in S71 is NO and the execution of the routine ends. If the output signal of the substrate carry-in sensor 318 changes from the substrate non-detection signal to the substrate detection signal, the determination result in S71 is YES, S72 is executed, the count value n3 is incremented by 1, and the loaded circuit board 32 is loaded. Can be counted. Then, S73 is executed, and it is determined whether or not the number of loaded circuit boards 32 exceeds the set number nA. If not, the determination result of S73 is NO and the execution of the routine ends. If the set number nA of circuit boards 32 are carried in, the determination result in S73 is YES, S74 is executed, and a mounting position accuracy inspection execution command is issued. If the mounting of the electronic circuit components currently being performed is performed by both the single nozzle head 42 and the multi-nozzle head 40, an inspection execution command is issued for both, and if either one is selected, either An inspection execution command is issued. Also, the counter n3 is reset.

The mounting position accuracy is inspected according to the inspection execution command. For the inspection of the mounting position accuracy, the chip receiving recesses 232 and 234 are component supply devices, the inspection chips 204 and 206 are electronic circuit components, the inspection reference mark 242 is a substrate reference mark 182, and the chip mounting portions 238 and 240 are circuits. Simulating the mounting operation of the electronic circuit component on the actual circuit board 32 by imitating the component mounting location of the substrate 32, the single nozzle head 42, the multi-nozzle head 40, the head rotating device 50, the head moving device. 46, by causing the reference mark camera 180, the component camera 198, and the like to obtain the mounting position error of the inspection chips 204, 206 on the mounting portions 238, 240, etc., with respect to the inspection reference mark 242. . First, the inspection of the mounting position accuracy of the electronic circuit component performed by the single nozzle head 42 will be described based on the mounting position accuracy inspection routine using the figure display chip shown in FIG.
Note that, when the mounting position accuracy inspection routine is executed, the reference mark camera 180, the head side reference mark 166, and the nozzle rotation axis obtained by executing the relative position error acquisition routine are inspected as in the execution of the mounting routine. This is performed in a state where each positional deviation with respect to the reference mark 242 is removed. However, the inspection reference mark 242 corresponds to the substrate reference mark 182, and the figure display chip mounting portion 238 and the square chip mounting portion 240 correspond to the mounting positions of the electronic circuit components.

  First, it is determined whether or not an inspection execution command has been issued after S80 is executed. If it has been issued, the determination result in S80 is YES and S81 is executed, and the single nozzle head 42 is moved to the shape display chip accommodation position. And the figure display chip 204 is sucked. At this time, the movement of the single nozzle head 42 is performed in consideration of the relative position error of the nozzle rotation axis obtained with the execution of the shape display chip use relative position error acquisition routine of FIG. Next, S82 is executed, the single nozzle head 42 is moved to the component camera 198, and the held figure display chip 204 is imaged. Also during the mounting position accuracy inspection, the component camera 198 is positioned at the inspection imaging position, as in the case of the relative position error acquisition. The head-side reference mark 166 is positioned at the component take-out position and is imaged together with the figure display chip 204. In S83, the holding position error of the figure display chip 204 by the suction nozzle 144 is determined based on the image processed image data. Calculated. At this time, the position of the actual nozzle rotation axis on the imaging surface is obtained based on the image of the head side reference mark 166 and the like, similar to the case where the electronic circuit component is mounted on the circuit board 32 by the single nozzle head 42. The relative position error of the figure display chip 204 with respect to the actual nozzle rotation axis position is acquired as the holding position error. Specifically, the center position of the figure display chip 204 is obtained based on the images of the four see-through windows 212, and the position error of the figure display chip 204 in the X-axis and Y-axis directions with respect to the actual nozzle rotation axis line. Calculated. Of the four fluoroscopic windows 212, a straight line passing through two predetermined centers is relative to a straight line passing through the centers of the two fluoroscopic windows 212 of the image of the figure display chip 204 having no inclination on the imaging surface. The inclination is obtained and the rotational position error of the figure display chip 204 is obtained.

  Then, S84 is executed, and the reference mark camera 180 is moved to a predetermined one of the two inspection reference marks 262 to take an image. At this time, as described above, the reference mark camera 180 moves the position of the normal inspection reference mark 242 to the target position corrected so that the positional deviation of the reference mark camera 180 with respect to the inspection reference mark 242 is removed. Be made. After the positional deviation of the inspection reference mark 262 with respect to the imaging center of the reference mark camera 180 is obtained in S85, the positional error is corrected in S86 and the figure display chip 204 is placed on the figure display chip placement unit 238. As described above, the target position of the figure display chip mounting part 238 is obtained by correcting the normal position of the figure display chip mounting part 238 in advance by the relative position error of the actual nozzle rotation axis with respect to the inspection reference mark 242. The single nozzle head 42 is rotated to correct the rotational position error of the electronic circuit component, and the target position of the figure display chip mounting portion 238 is the electron by the suction nozzle 154 acquired in S83. Of the circuit component holding position errors, the position errors in the X-axis and Y-axis directions, the position error in the X-axis and Y-axis directions of the inspection reference mark 262 acquired in S85 with respect to the reference mark camera 180, and the rotational position error The correction is made so that the positional deviation of the electronic circuit parts caused by the correction is removed, and the nozzle rotation axis moves to the corrected position. Sera is, the placement of the figurative display chip 204 is performed.

  Next, S87 is executed, and the reference mark camera 180 images the figure display chip 204. The reference mark camera 180 is sequentially moved to the two inspection reference marks 242, and images the inspection reference marks 242 together with the fluoroscopic window 212. In S88, the figure display chip is based on the image data obtained by the imaging. A placement position error 204 is acquired. For each of the two fluoroscopic windows 212, positional deviations in the X-axis and Y-axis directions with respect to the inspection reference mark 242 are acquired. Based on these two positional deviations, the figure display chip described above with reference to FIG. Similarly to the acquisition of the positional deviation with respect to the inspection reference mark 242 of 204, the positional deviation of the figure display chip 204 in the X-axis and Y-axis directions is obtained. Further, the rotational position deviation angle Δθ used when calculating the positional deviation in the X-axis and Y-axis directions is the rotational position error of the figure display chip 204 and is obtained by calculation.

  Then, S89 is executed, and the suction nozzle 144 is moved to suck the figure display chip 204. This movement position is the same position as the movement position of the suction nozzle 144 when the position error is corrected in S86 and the figure display chip 204 is placed on the figure display chip placement unit 238. When the suction nozzle 144 sucks the figure display chip 204 and is lifted and taken out from the figure display chip mounting portion 238, S90 is executed, and the suction nozzle 144 is rotated by a predetermined angle, for example, 180 degrees, and the figure is displayed. The display chip 204 is rotated 180 degrees. After the rotation, S91 is executed, and the suction nozzle 144 places the figure display chip 204 on the figure display chip suction surface 256. Then, S92 is executed, and the reference mark camera 180 images the figure display chip 204. This imaging is performed in the same manner as the imaging in S87. In S93, the mounting position errors in the X-axis and Y-axis directions of the figure display chip 204 are acquired and stored in the relative position error memory in the same manner as S88.

  Then, S94 is executed, and the positional deviation of the nozzle rotation axis is obtained based on the two sets of positional deviations in the X-axis and Y-axis directions of the figure display chip 204 obtained in S88 and S93. The placement position error or the like may be stored in a placement position error memory provided separately from the relative position error memory. The average value of the two sets of misalignment is the misalignment of the nozzle rotation axis, but this misalignment should not exist. Further, the figure display chip 204 is returned to the figure display chip housing recess 232 by executing S95. At this time, the suction nozzle 144 is moved to the same position as when the shape display chip 204 is sucked in S89, sucks and lifts the shape display chip 204, and rotates 180 degrees in the same direction as the nozzle rotation in S90. Thus, the phase is returned to the same phase as when the figure display chip 204 is taken out from the figure display chip receiving recess 232. Then, the suction nozzle 144 is moved to the same position as when the figurative display chip 204 is taken out of the figurative display chip accommodating recess 232 in S 81, and accommodates the figurative display chip 204 in the figurative display chip accommodating recess 232.

  Next, S96 is executed, and whether the positional deviation of the figure display chip 204 in the X-axis and Y-axis directions, the rotational positional deviation obtained in S88, and the positional deviation of the nozzle rotational axis obtained in S94 are within allowable ranges. It is determined whether or not. Originally, all of these should be substantially 0, and if both are within the allowable range, the determination result in S96 is YES and S97 is executed, and these positional deviations are stored in the relative position error memory. . You may memorize | store in the mounting position error memory provided separately from the relative position error memory. If there is even one misalignment that deviates from the allowable range, the determination result in S96 is NO, S98 is executed, and the warning device 330 notifies the worker. Further, the contents of the abnormality are displayed on the display screen 334, and the operator estimates and removes the cause of the abnormality based on the display. In S97 and S98, the mounting position accuracy inspection execution command is reset.

The mounting position error and the like acquired based on the above mounting position accuracy inspection and stored in the relative position error memory are used when the electronic circuit component is mounted on the circuit board 32. The positional error and rotational position error of the figure display chip 204 acquired in S88 in the X-axis and Y-axis directions are changed from the time of suction of the large electronic circuit component in S67 of the mounting routine of FIG. When mounting without using, it is used as one of correction values for the position in the X-axis and Y-axis directions and the rotational position. Further, the positional error of the nozzle rotation axis acquired in S94 is calculated based on the above-mentioned shape display chip 204 when calculating a correction value for mounting a large electronic circuit component by changing its rotational posture from the time of suction. Used together with position error and rotational position error in the X-axis and Y-axis directions. Accordingly, as a result of the mounting position accuracy inspection, the electronic circuit component is mounted on the circuit board 32 with high accuracy by correcting the position error regardless of the cause of occurrence of the obtained mounting position error or the like.
Note that only the positional error of the nozzle rotation axis acquired in S94 or only the positional error of the figure display chip 204 in the X-axis and Y-axis directions is used as one of the correction values for the positions in the X-axis and Y-axis directions. It is also possible to do so. In that case, the mounting position accuracy inspection routine of the figure display chip use mounting position inspection of FIG. 16 is performed only for the position of the nozzle rotation axis or only the position of the figure display chip 204 in the X-axis and Y-axis directions. It is also possible to change to

Next, the inspection of the mounting position accuracy for the multi-nozzle head 40 will be described.
This inspection is performed individually for each of the plurality of suction nozzles 154 by using the square tip 206 and executing the square tip use mounting position accuracy inspection routine shown in FIG. In S110, it is determined whether or not an inspection execution command has been issued. If it has been issued, the determination result in S110 is YES, S111 is executed, and the suction nozzle 154 to be inspected is positioned at the corner chip accommodation position. And the corner chip 206 is sucked. The movement of the suction nozzle 154 to the component suction position is performed by correcting the relative position error of the nozzle rotation axis acquired with respect to the inspection reference mark 242 obtained by executing the square tip use relative position error acquisition routine of FIG. In addition, the head side reference mark 166 is positioned together with the driving member 160 at the position when the component is taken out.

  The suction nozzle 154 that sucks the corner chip 206 is moved to the component camera 198 positioned at the imaging position at the time of inspection, and the corner chip 206 and the head side reference mark 166 are imaged by executing S112. And S113 is performed and the holding position error of the square chip | tip 206 by the suction nozzle 154 is acquired. At this time, the position of the actual nozzle rotation axis on the imaging surface is obtained based on the image of the head side reference mark 166 and the like, similar to the case where the electronic circuit component is mounted on the circuit board 32 by the multi-nozzle head 40. The relative position error of the corner chip 206 with respect to the actual nozzle rotation axis position is acquired as the holding position error. Further, the inclination of the side of the corner chip 206 with respect to the side of the image of the corner chip 206 having no inclination on the imaging surface is acquired as the rotational position error of the corner chip 206.

  Next, S114 and S115 are executed in the same manner as S84 and S85 of the figure display chip use mounting position accuracy inspection routine, and the positional deviation of the inspection reference mark 242 is acquired. In S116, the target position of the square chip mounting portion 249 is corrected by the holding position error and the positional deviation acquired in S113 and S115, as in S86 of the shape display chip use mounting position accuracy inspection routine, and the square chip is corrected. 206 is placed on the square chip suction surface 254. Next, in S117, the reference mark camera 180 is moved to the regular square chip placement position, and the placed square chip 206 is imaged. At this time, the fiducial mark camera 180 images a predetermined one of the two inspection fiducial marks 262 by moving the fiducial mark 262 to the one regular position. Based on the respective imaging data of the inspection reference mark 262, the positional deviation with respect to the imaging center of the reference mark camera 180 is calculated for each of the center of the corner chip 206 and the center of the inspection reference mark 262. The positional deviation in the X-axis and Y-axis directions with respect to the inspection reference mark 262 of the chip 206 is calculated. Further, based on the image data of the corner chip 206 and the image data of the corner chip 206 having no inclination, the rotational position deviation of the corner chip 206 is acquired. These positional deviations are the mounting position errors of the corner chip 206 and are stored in the relative position error memory.

  Then, S119 to S123 are executed, and the suction nozzle 154 is the same as the position when the square tip 206 is placed on the square tip placement portion 240 in S116, as in S89 of the figure display tip use mounting position accuracy inspection routine. After being moved to the position, the square chip 206 is sucked and lifted from the square chip suction surface 254 and rotated 180 degrees, and then the square chip 206 is mounted on the square chip suction surface 254 again, and the same as in S117. An image is taken by the mark camera 180. The reference mark camera 180 also captures the inspection reference mark 262, and based on the image data of the corner chip 206 and the inspection reference mark 262, the positional deviation of the corner chip 206 with respect to the inspection reference mark 262 in the X-axis and Y-axis directions is acquired. Is done. In S124, the average value of the positional deviations in the X-axis and Y-axis directions acquired in S118 and S123, respectively, is calculated. This average value is the positional deviation of the nozzle rotation axis, and is stored in the relative position error memory.

  Then, S125 is executed, and the square chip 206 is returned to the square chip housing recess 234. At this time, the suction nozzle 154 is moved to the same position as when the corner chip 206 is sucked in S119, sucks and lifts the corner chip 206, and is rotated by 180 degrees. The phase is returned to the same phase as in the removal from the recess 234. The suction nozzle 154 is moved to the same position as that at the time of taking out the square chip 206 from the square chip housing recess 234 in S111, and houses the square chip 206 in the square chip housing recess 234. Thereafter, in S126, it is determined whether or not the mounting position accuracy inspection has been completed for all the suction nozzles 154. If not completed yet, the determination result in S126 is NO, S127 is executed, the suction nozzle 154 to be inspected is updated, and S111 to S126 are executed for the suction nozzle 154.

  If the mounting position accuracy is inspected for all the suction nozzles 154, the determination result in S126 is YES and S128 is executed, and the placement position errors and the like acquired for the plurality of suction nozzles 154 are within an allowable range. It is determined whether or not there is. If the placement position error and the like acquired for all the suction nozzles 154, such as the positional deviation in the X-axis and Y-axis directions, the rotational position error, and the positional deviation of the nozzle rotation axis are all within the allowable range, S128 The determination result is YES, S129 is executed, and the acquired placement position error and the like are stored in the relative position error memory. If there is even one suction nozzle 154 whose positional deviation exceeds the allowable range, the determination result in S128 is NO and S130 is executed, and an alarm is issued to the operator by the alarm device 330 and the display device 336. Occurrence is displayed. In S129 and S130, the mounting position accuracy inspection execution command is also reset.

The placement position error and the like stored in S129 are used when the electronic circuit component is mounted by the multi-nozzle head 40 in the same manner as when the electronic circuit component is mounted by the single nozzle head 42. Accordingly, as a result of the mounting position accuracy inspection, the electronic circuit component is mounted on the circuit board 32 with high accuracy by correcting the position error regardless of the cause of occurrence of the obtained mounting position error or the like.
Only the positional error of the nozzle rotation axis or only the positional error of the square chip 206 in the X-axis and Y-axis directions is used as one of the correction values of the position in the X-axis and Y-axis directions when the electronic circuit component is mounted. In this case, the square tip use mounting position accuracy inspection routine shown in FIG. 17 is performed with respect to only the position of the nozzle rotation axis, or only the position of the square tip 206 in the X-axis and Y-axis directions. As in the case of the single nozzle head 42, it is possible to change to the one to be inspected.
In addition, in the present embodiment, the mounting position accuracy inspection is performed for all the suction nozzles 154 held in the multi-nozzle head 40, but some of the suction nozzles 154 held, for example, The mounting position accuracy inspection may be typically performed for two suction nozzles 154 that are separated from each other in the diametrical direction, or every three or more set number of suction nozzles 154, or may be performed only for one suction nozzle 154. Good. In that case, the suction nozzle 154 to be inspected may be changed for each mounting position accuracy inspection.

  By causing the component camera 198 to image the monochrome reference gauge 208, the amount of light entering the component camera 198 is inspected during imaging, and the shutter speed of the component camera 198 is adjusted. The inspection is performed, for example, in a state where the single nozzle head 42 is held by the head holding device 44. The single nozzle head 42 is moved to the gauge housing recess 236 to hold the monochrome reference gauge 208 and then moved to the component camera 198 to image the lightness reference plane 224 of the monochrome reference gauge 208. It is moved to the recess 236 to accommodate the monochrome reference gauge 208. The component camera 198 acquires the light amount of the image forming light that forms the image of the lightness reference surface 224, and determines whether or not the light amount within the range set for the lightness reference surface 224 colored in gray is obtained. . If the amount of light is less than the amount of the setting range, the shutter speed is slowed down, and if it is large, the shutter speed is fastened.

  As is apparent from the above description, in this embodiment, the portion of the control device 22 that executes S81 to S94 and S111 to S124 constitutes a mounting position accuracy inspection control unit, and the relative position error memory is a position error storage unit. The parts that execute S80 and S110 constitute an automatic accuracy inspection start part, and the part that uses the positional deviation of the nozzle rotation axis acquired by acquiring the relative position error is relative to the acquisition of the nozzle rotation axis in S66. The position error acquisition result use part is configured as a nozzle rotation axis acquisition unit, and the mounting position error is corrected by using the mounting position error and the nozzle rotation axis position error together with the holding position error in S67. A mounting position correcting unit that is a use unit is configured, and a portion that executes S1 to S14, S31 to S44, and S48 configures an error detection control unit. In addition, the portion of the control device 22 that executes S96 and S128 constitutes a mounting position accuracy pass / fail determination unit that is a mounting position accuracy test result use unit, and the portion that executes S98 and S130 is a mounting position accuracy test result notification unit. It constitutes a pass notification section.

Another embodiment of the accuracy inspection unit will be described with reference to FIGS.
The inspection table 402 of the accuracy inspection unit 400 of this embodiment is dark, for example, black, and as shown in FIGS. 18 and 19, the small suction hole 406 and the large suction hole 408 are adjacent to each other, and the inspection table 402 Opened on the top surface of the air, and sucks air. The diameter of the small suction hole 406 is smaller than the width of the square tip 410, and the diameter of the large suction hole 408 is larger than that of the small suction hole 406. Further, the small suction hole 406 and the large suction hole 408 are the small suction hole 406 and the large suction hole 408 when the figure display chip 412 is placed in a state where the center thereof coincides with the center of the small suction hole 406. However, when the corner chip 410 is placed in a state where the center thereof coincides with the center of the small suction hole 406, the small suction hole 406 is blocked by the corner chip 410. The large suction hole 408 is formed so as to have a relative positional relationship that is not blocked.

  The accuracy testing unit 400 includes a plug 420 as a closing member that closes the large-diameter opening 414 of the large suction hole 408. The embedding plug 420 has a stepped shape and is accommodated in an embedding accommodating recess 422 which is a closing member accommodating portion as shown in FIG. The embedding recess 422 is a bottomed hole opened on the upper surface of the examination table 402, has a stepped shape, and is opposite to the large suction hole 408 with respect to the small suction hole 406, It is formed at the same distance as the large suction hole 408 and away from it. The embedding recess 422 has the same shape and size as the opening 414 of the large suction hole 408, and the embedding 420 is lightly inserted into both the opening 414 and the embedding recess 422 with a gap. , Having dimensions that allow it to be detached.

  Further, as shown in FIGS. 18 and 19, the inspection table 402 is provided with an annular protrusion 430 so as to surround the large suction hole 408, the small suction hole 406, and the embedding receptacle 422. The annular protrusion 430 has a circular cross-sectional shape and is provided around the center of the small suction hole 406, and the top surface thereof forms an annular shape display chip suction surface 432 that sucks the shape display chip 412. The periphery of the small suction hole 406 inside the annular protrusion 430 on the upper surface of the inspection table 402 forms a square chip suction surface 434 that sucks the square chip 410. The portion of the inspection table 402 where the shape display chip suction surface 432 is formed constitutes the shape display chip placement portion 436, and the portion where the small suction hole 406 is provided constitutes the square tip placement portion 438, and the shape display chip. Both the mounting position and the corner chip mounting position are positions at the center of the small suction hole 406.

  A reference mark substrate 440 is provided adjacent to the outside of the annular protrusion 430. As shown in FIG. 20, the reference mark substrate 440 is thinner than the annular protrusion 430 and is provided on the upper surface of the inspection table 402 by appropriate means such as adhesion. Two inspection reference marks 442 are formed on the reference mark substrate 440. The reference mark substrate 440 has a dark color, for example, black, like the inspection table 402. These inspection reference marks 442 have a circular shape and are white, and are parallel to the X-axis direction at the same interval as two adjacent ones of the four see-through windows 444 of the figure display chip 412. Are arranged side by side in such a direction that the same positional relationship as the position of the two see-through windows 444 adjacent to the figure display chip 412 with respect to the center of the figure display chip 412 can be obtained with respect to the figure display chip placement position. Is provided.

  The square chip 410 and the figurative display chip 412 are formed in the same manner as the square chip 206 and the figurative display chip 204, and are accommodated in the square chip accommodating recess 446 and the figurative display chip accommodating recess 448 provided in the examination table 402, respectively. However, the corner chip 410 is white. The corner chip 410 is not provided with a reference mark, and the outline of the corner chip 410 is acquired based on image data obtained by imaging, and the center position and the like are acquired. The figure display chip 412 is white, but the figure 450 and the four see-through windows 444 are colorless and transparent.

This accuracy inspection unit 400 is used in the same manner as the accuracy inspection unit 200, and the relative position error and the inspection of the mounting position accuracy are performed in the same manner, and thus the description thereof is omitted.
In the accuracy inspection unit 400, the relative position error is not acquired and the mounting position accuracy is not inspected, and in a state of waiting for the execution thereof, the figurative display chip 412 and the like are accommodated in the accommodating recess 448 and the like, The plug 420 is fitted into the plug receiving recess 422 or the opening 414 of the large suction hole 408, and the large-diameter head is supported from below by the upward shoulder surface of the opening 414 to be received in the plug receiving recess 422. Alternatively, the opening 414 is closed. The plug 420 is sucked and held by the suction nozzle 154 of the multi-nozzle head 40, and is stored in the plug storage recess 422 or fitted in the opening 414.

  For example, the inspection of the mounting position accuracy of the suction nozzle 144 of the single nozzle head 42 is performed using the figure display chip 412. At this time, as shown in FIG. 22, the plug 420 is accommodated in the embedding recess 422 and the large suction hole 408 is opened. As shown in FIGS. It is placed on the annular protrusion 430. Therefore, air is sucked by both the small suction hole 406 and the large suction hole 408, the flow resistance is small, and the figure display chip 412 is efficiently sucked by the figure display chip suction surface 432 having a large area. In addition, as shown in FIG. 21, the two inspection reference marks 442 are positioned in the two see-through windows 444 and are imaged together with the see-through windows 444 by the reference mark camera.

  Inspection of the accuracy and position accuracy of the suction nozzle 154 of the multi-nozzle head 40 is performed using the square chip 410. At this time, if the plug 420 is housed in the plug housing recess 422, the suction nozzle 154 is moved to the plug housing recess 422 to suck the plug 420 and remove it from the plug housing section 422. Then, the suction nozzle 154 is moved to the opening 414 of the large suction hole 408 and the plug 420 is inserted, the opening of the large suction hole 408 is closed, and supply of negative pressure from the large suction hole 408 is blocked. Therefore, as shown in FIGS. 23 and 24, the square chip 410 sucked by the suction nozzle 154 is placed on the square chip suction surface 434 surrounding the small suction hole 406, but concentrated only by the small suction hole 406. Thus, air is sucked and the corner chip 410 is efficiently adsorbed.

  Since the attachment / detachment of the plug 420 is performed by the suction nozzle 154, if the inspection of the suction nozzle 144 is performed after the inspection of the suction nozzle 154, the plug 420 is suctioned after the inspection of the suction nozzle 154 is completed. The large suction hole 408 is taken out from the large suction hole 408 by the nozzle 154 and accommodated in the embedding recess 422, and the large suction hole 408 is opened. Next, if the inspection or acquisition of the relative position error is not performed, the plug 420 may be kept fitted in the opening 414 of the large suction hole 408. Or after completion | finish of the test | inspection about the suction nozzle 154, the embedding plug 420 may be always accommodated in the embedding accommodation recessed part 422, and you may make it return.

  In the accuracy testing unit, the housing portion for housing the inspection chip has a bottom surface 502 slightly larger than the shape display chip 204 as in the shape display chip housing recess 500 illustrated as an example of the shape display chip 204 in FIG. It is desirable that the inner side surface be a tapered surface 506 that is inclined outward in the direction away from the center line of the shape display chip housing recess 500 toward the opening 504 side. In this way, when the figure display chip 204 taken out from the figure display chip accommodating recess 500 is returned to the figure display chip accommodating recess 500, the center of the figure display chip 204 held by the component holding head and the figure display chip are displayed. Even if the center of the housing recess 500 is displaced, the figure display chip 204 is guided by the inclination of the tapered surface 506 and moves toward the center of the housing recess 500, and at the bottom of the shape display chip housing recess 500, Accumulation of errors due to repeated insertion / removal of the figure display chip 204 with respect to the accommodation recess 500 is avoided.

  The reference mark camera may have a large field of view and can simultaneously image the inspection chip and the inspection reference mark at once. In this case, the relative position error is acquired based on image data of the inspection chip or the like acquired at the same time.

  The component camera may be provided with a fixed position. For example, when the position of the component camera is fixed at a central position in a direction parallel to the substrate conveyance direction of the electronic circuit component supply device, and the component holding head is repeatedly moved from the electronic circuit component supply device to the substrate holding device, The sum of the movement distances should be as short as possible.

  Further, the nozzle head is stored in the slur head storage device with high accuracy of the center position by the positioning portion and the positioned portion, and the center position of both when the head holding device holds the nozzle head is accurately determined. If the reproducibility is obtained at the holding position, it is not essential to obtain the position error of the nozzle rotation axis every time the head holding device holds the single nozzle head or the multi-nozzle head. it can.

  Further, a reference mark may be provided on the corner chip, and the center position of the corner chip or the like may be acquired based on the image data of the corner chip reference mark obtained by imaging. The square chip reference mark is formed so as to have different optical characteristics with respect to a portion where the reference mark of the square chip is formed, for example, by an appropriate means such as aluminum vapor deposition on one surface thereof, and is, for example, circular. The center is formed so as to coincide with the center of the corner chip 206.

  In the electronic circuit component mounting apparatus according to the present invention, one type of inspection chip may be used for inspection of mounting position accuracy.

It is a top view which shows roughly the electronic circuit component mounting system provided with the unit for an accuracy inspection which is an Example of claimable invention, and an electronic circuit component mounting apparatus. It is a side view (partial cross section) which shows the state in which the head holding device hold | maintained the single nozzle head in the said electronic circuit component mounting apparatus. It is a side view (partial cross section) which shows the state in which the head holding device hold | maintained the multi-nozzle head in the said electronic circuit component mounting apparatus. It is a bottom view which shows the head side reference mark provided in the said head holding | maintenance apparatus. It is a top view which shows the said unit for an accuracy inspection. It is a front sectional view showing the unit for accuracy inspection. It is side surface sectional drawing which shows the said unit for an accuracy test | inspection. It is a block diagram which shows notionally the structure of the control apparatus of the said electronic circuit component mounting system. It is a flowchart which shows the shape display chip use relative position error acquisition routine memorize | stored in ROM of the computer which comprises the main body of the said control apparatus. It is a top view which shows the state in which the figure display chip was mounted in the figure display chip mounting part in the said accuracy test unit. It is a figure explaining acquisition of position shift to a reference mark for inspection of a head side reference mark by use of the above-mentioned figure display chip. It is a flowchart which shows the square chip use relative position error acquisition routine memorize | stored in ROM of the said computer. It is a top view which shows the state in which the square chip was mounted in the square chip mounting part in the said unit for an accuracy test | inspection. It is a flowchart which shows the mounting routine memorize | stored in ROM of the said computer. It is a flowchart which shows the test execution condition satisfaction determination routine memorize | stored in ROM of the said computer. It is a flowchart which shows the mounting | wearing position accuracy inspection routine using a figure display chip memorize | stored in ROM of the said computer. It is a flowchart which shows the square chip use mounting position accuracy inspection routine memorize | stored in ROM of the said computer. It is a top view which shows the unit for precision inspection which is another Example of claimable invention. FIG. 19 is a front view showing the accuracy inspection unit shown in FIG. 18 in cross section at a portion where a small suction hole and a large suction hole are provided. FIG. 19 is a side view showing the accuracy inspection unit shown in FIG. 18 in a cross-section at a portion where a figure display chip and an annular protrusion are provided. It is a top view which shows the state in which the figure display chip was mounted in the figure display chip mounting part in the unit for an accuracy inspection shown in FIG. FIG. 19 is a front sectional view showing a state in which the figure display chip is placed on the figure display chip placement unit in the accuracy inspection unit shown in FIG. 18. It is a top view which shows the state by which the square chip was mounted in the square chip mounting part in the unit for an accuracy inspection shown in FIG. It is front sectional drawing which shows the state in which the square chip was mounted in the square chip mounting part in the unit for an accuracy inspection shown in FIG. It is front sectional drawing which shows another example of the chip | tip accommodating part for a test | inspection of the unit for a precision test | inspection roughly.

Explanation of symbols

  16: Substrate holding device 18: Mounting device 22: Control device 32: Circuit board 40: Multi-nozzle head 42: Single nozzle head 44: Head holding device 46: Head moving device 144: Adsorption nozzle 145: Component adsorption head 154: Adsorption nozzle 164: Component adsorption head 166: Head side reference mark 180: Reference mark camera 182: Board reference mark 198: Component camera 200: Accuracy inspection unit 202: Inspection table 204: Shape display chip 206: Square chip 208: Monochrome reference gauge 210 : Shape 212: Perspective window 224: Lightness reference plane 232: Shape display chip housing recess 234: Square chip housing recess 236: Gauge housing recess 238: Shape display chip mounting section 240: Square chip mounting 242: Reference mark for inspection 254: Square chip suction surface 256: Shape display chip suction surface 258: Suction hole 400: Accuracy inspection unit 402: Inspection table 406: Small suction hole 408: Large suction hole 410: Square chip 412: Shape display chip 420: Plug 422: Plug receiving recess 430: Annular projection 432: Shape display chip suction surface 434: Square chip suction surface 436: Shape display chip placement portion 438: Square tip placement portion 442: Reference mark 444 : Transparent window 446: Square chip receiving recess 448: Shape display chip receiving recess 450: Shape 500: Shape display chip receiving recess

Claims (8)

A substrate holding device for holding a circuit board;
A component holding head that holds electronic circuit components and is rotatable around a rotation axis;
A head rotating device for rotating the component holding head around the rotation axis;
A head moving device that moves the component holding head and the head rotating device; and
A reference mark camera that images the board reference mark, which is a reference mark of a circuit board that is moved together with the component holding head by the head moving device and is held by the board holding device;
A component camera for imaging an electronic circuit component held by the component holding head;
A control device for controlling the component holding head, the head rotating device, the head moving device, the reference mark camera, and the component camera to mount the electronic circuit component on the circuit board;
An inspection chip having a size corresponding to the electronic circuit component;
An inspection table provided with an inspection reference mark different from the mounting portion on which the inspection chip can be placed and the substrate reference mark;
An error detection control unit provided in the control device, wherein (A) the reference mark camera images the inspection reference mark, and the relative position between the reference mark camera and the inspection reference mark based on the imaging result (B) (i) holding the inspection chip on the component holding head, causing the component camera to image the inspection chip, and (ii) for inspection after the imaging A chip is placed on the chip placement unit, and the inspection chip and the inspection reference mark are imaged by the reference mark camera. (Iii) At least based on the imaging result, the component camera or the component holding A second error acquisition for acquiring a relative position error between the head side reference portion provided on the head side and the inspection reference mark; and (C) (iv) holding the inspection chip on the component holding head; Inspection The inspection chip is placed on the mounting portion and the inspection chip and the inspection reference mark are imaged by the reference mark camera. (V) After the imaging, the component holding head The inspection chip is held and rotated by a predetermined angle, and then the inspection chip and the inspection reference mark are imaged again by placing the inspection chip and the inspection reference mark on the mounting portion again. And (vi) performing a third error acquisition for acquiring a relative position error between the rotation axis of the component holding head and the inspection reference mark from the imaging results of (iv) and (v). , Error detection for acquiring a relative position error of a rotation axis of the component holding head with reference to the inspection reference mark, the reference mark camera, and a head side reference portion provided on the component camera or the component holding head side Control unit Electronic circuit component mounting apparatus which comprises a. A substrate holding device for holding a circuit board;
A plurality of component holding heads that hold electronic circuit components and are rotatable about respective rotation axes;
A head rotating device for rotating the component holding heads around respective rotation axes of the component holding heads;
A head moving device that moves the component holding head and the head rotating device; and
A reference mark camera that images the board reference mark, which is a reference mark of a circuit board that is moved together with the component holding head by the head moving device and is held by the board holding device;
A component camera for imaging electronic circuit components respectively held by the plurality of component holding heads;
A control device for controlling the component holding head, the head rotating device, the head moving device, the reference mark camera, and the component camera to mount the electronic circuit component on the circuit board;
A plurality of types of inspection chips including a maximum chip and a minimum chip each having a size corresponding to a plurality of types of electronic circuit components of different sizes;
An inspection table provided with one or more mounting parts on which the plurality of types of inspection chips can be mounted and an inspection reference mark different from the substrate reference mark;
An error detection control unit provided in the control device, wherein (A) the reference mark camera images the inspection reference mark, and the relative position between the reference mark camera and the inspection reference mark based on the imaging result (B) (i) One of the plurality of component holding heads holds one of the plurality of inspection chips, and the component camera images the inspection chip. (Ii) placing the inspection chip after imaging on the chip mounting portion and causing the reference mark camera to image the inspection chip and the inspection reference mark, and (iii) at least the imaging result And (C) (iv) the plurality of components, based on a second error acquisition for acquiring a relative position error between a head side reference portion provided on the component camera or the component holding head side and the inspection reference mark. One of the holding heads Holding one of the plurality of inspection chips, placing the inspection chip on the mounting portion, and causing the reference mark camera to image the inspection chip and the inspection reference mark; ) After the imaging, the inspection chip of the mounting section is held by the one component holding head and rotated by a predetermined angle, and then placed on the mounting section again and the inspection chip Causing the reference mark camera to image the inspection reference mark one or more times, and (vi) from the imaging results of (iv) and (v), the rotation axis of the one component holding head and the inspection The third error acquisition for acquiring a relative position error with respect to the reference mark for use is performed, and the third error acquisition is performed for each of the plurality of component holding heads, and the plurality of the reference marks using the inspection reference mark as a reference. Each rotation axis of the component holding head The reference mark camera, and electronic component mounting apparatus characterized by comprising said component camera or the error detection controller for obtaining a relative position error of the head-side reference section. The control device further includes (a) holding the inspection chip on the component holding head, causing the component camera to image the inspection chip, and holding the inspection chip by the component holding head based on the imaging result. Obtaining a position error; and (b) causing the reference mark camera to image the inspection reference mark, and acquiring a relative position error between the reference mark camera and the inspection reference mark based on the imaging result; (c) Correct the inspection chip holding position error and the relative position error between the reference mark camera and the inspection reference mark obtained by the component holding head obtained in (a) and (b), and place the inspection chip as described above. And a mounting position accuracy inspection control unit that causes the reference mark camera to take an image of the mounted inspection chip and acquire a mounting position error of the inspection chip. Electronic circuit component mounting apparatus according to Motomeko 1 or 2. The mounting position accuracy inspection control unit further holds (d) the inspection chip mounted on the mounting unit in (c) by the component holding head, and rotates the component holding head by a predetermined angle. was placed again mounting unit after, by imaging on the placed again the reference mark camera testing chip, to claim 3 comprising and performing one or more times to get the placement position error The electronic circuit component mounting apparatus described. Position error storage in which the control device stores a rotation axis of the component holding head, a head side reference section provided on the component camera or the component holding head side, and a relative position error acquired in advance of the reference mark camera. 5. The electronic circuit component mounting apparatus according to claim 3 , wherein the mounting position accuracy inspection control unit executes a mounting position accuracy inspection while correcting a relative position error stored in the position error storage unit. . Wherein the controller, see contains an automatic precision inspection start unit for operating automatically the mounting position accuracy inspection control unit when a predetermined condition is satisfied, and the predetermined condition is, (1) At least one of an in-device detectable condition, which is a condition that can be automatically detected in the electronic circuit component mounting device, and (2) an external instruction input from an external computer different from the computer constituting the control device. An electronic circuit component mounting apparatus according to any one of claims 3 to 5, further comprising: The in-device detectable condition is the start of the electronic circuit component mounting device, the operation suspension for the set time or more, the continuous operation time for the set time or more, the execution of the continuous electronic circuit component mounting work for the set amount or more, the setting of the circuit board transfer device The electronic circuit component mounting apparatus according to claim 6, comprising at least one of a pause of time or more, completion of assembly of one circuit board, completion of assembly of the electronic circuit component mounting apparatus, or elapsed time from the previous maintenance execution. The control device, together with the holding position error of the electronic circuit component by the component holding head, and the holding position error of the circuit board by the substrate holding device acquired from the imaging result of the board reference mark by the reference mark camera, described has been placed position error obtained by the mounting position accuracy inspection control unit, in any one of claims 3 to 7 for use as correction data of the mounting position when the mounting operation performed on the circuit board of the electronic circuit component Electronic circuit component mounting device.

Images