JP6355097B2 - Mounting system, calibration method and program - Google Patents

Description

  The present technology relates to a technology such as a mounting system.

  Conventionally, a printing device that prints solder on a substrate, an inspection device that inspects the printed state of solder, a mounting device that mounts electronic components on the substrate, an inspection device that inspects the mounting state of electronic components, and a reflow process on the substrate A production system in which reflow furnaces to be applied and the like are arranged on a production line is known.

  A mounting apparatus for mounting an electronic component on a substrate generally includes a transport unit that transports the substrate, a supply unit that supplies the electronic component, and a suction nozzle that takes out the electronic component from the supply unit and mounts it on the substrate. A mounting head and a moving mechanism for moving the mounting head in the horizontal direction are provided.

  In recent years, a technique in which a plurality of different types of mounting heads are configured to be detachable from the mounting apparatus main body has been known (for example, Patent Document 1, paragraphs [0055] and [0099] below). ]. In this case, when the type of the board to be produced is changed, the currently mounted mounting head can be replaced with any other type of mounting head.

  Here, since the mounting device needs to mount the electronic component at an accurate position on the substrate by the suction nozzle, it is necessary to accurately recognize the position of the suction nozzle in the mounting device. Therefore, when the mounting head is replaced with another mounting head, it is necessary to perform processing for accurately recognizing the position of the suction nozzle in the mounting head.

  In the method of detecting the position of the suction nozzle anew in the mounting device every time the mounting head is replaced, there is a problem that it takes time to start production. Therefore, in the technique described in Patent Document 1, calibration data such as the relative position of the suction nozzle is stored in a memory provided in the mounting head, and the calibration data is stored in the memory when the mounting head is replaced. (See paragraphs [0101], [0102], [0121], etc.).

JP 2005-286171 A

  However, in the technique of Patent Document 1, when a mounting head that has not been attached to the mounting apparatus is newly used in the mounting apparatus, the mounting head is actually used with respect to the mounting apparatus. It is necessary to acquire the calibration data by attaching and detecting the position of the suction nozzle. In this case, it takes about 30 to 60 minutes.

  In view of the circumstances as described above, the purpose of the present technology is to quickly mount a mounting head that has not been attached to the mounting apparatus in the mounting apparatus even when the mounting head is newly used in the mounting apparatus. It is to provide a technique such as a mounting system capable of completing calibration.

A mounting system according to the present technology includes a calibration device disposed outside a production line for producing a substrate, and a mounting device disposed on the production line.
The calibration apparatus has a control unit.
The control unit of the calibration device measures a relative position in the horizontal direction of the plurality of nozzles with respect to the reference point in a mounting head having a reference point and a plurality of nozzles.
The mounting apparatus includes a mounting apparatus main body and a control unit.
The mounting head is attached to the mounting head device body.
The control unit of the mounting apparatus measures the horizontal position of the reference point in the mounting apparatus body in a state where the mounting head is attached to the mounting apparatus body, and the reference point in the mounting apparatus body Based on the position information and the relative position information, the horizontal positions of the plurality of nozzles in the mounting apparatus main body are recognized.

  Here, the nozzle includes an adsorption nozzle that adsorbs an electronic component and mounts the electronic component on a substrate, and a jig nozzle that simulates the shape of the adsorption nozzle.

  In the present technology, a part of processing necessary for calibration can be performed in advance in a calibration device arranged outside (offline) the production line. Therefore, when performing calibration in the mounting apparatus, the calibration can be completed in a short time. In particular, in the present technology, even when a mounting head that has not been attached to the mounting apparatus is newly used in the mounting apparatus, calibration can be completed in the mounting apparatus in a short time.

  In the mounting system, the control unit of the calibration device lowers the plurality of nozzles by a predetermined distance in the height direction, and measures the positions in the horizontal direction at the tip portions of the plurality of nozzles, respectively. The relative position may be measured.

  Thus, by measuring the relative position in the horizontal direction when the nozzle is lowered, the mounting apparatus accurately recognizes the position of the nozzle in the horizontal plane when the electronic component is mounted by lowering the nozzle. be able to.

  In the mounting system, the control unit of the calibration device may perform a process of lowering the plurality of nozzles by a predetermined distance and measuring the positions in the horizontal direction at the tip portions of the plurality of nozzles. The relative position may be measured at each descending distance by repeating the nozzle descending distance a plurality of times.

  Accordingly, it is possible to cope with a case where the nozzle descending distance when mounting the electronic component is different depending on the combination of the mounting apparatus and the mounting head.

In the mounting system, the mounting apparatus may include a moving mechanism for moving the mounting head in the height direction.
In this case, the control unit of the mounting apparatus has the same descending distance when mounting the electronic component on the substrate by the plurality of nozzles as the distance by which the plurality of nozzles are lowered in the calibration apparatus. As described above, the height of the mounting head may be adjusted by controlling the moving mechanism.

In the mounting system, the calibration device may further include an imaging unit.
The imaging unit of the calibration device is arranged at a position below the mounting head in the height direction, and images the reference point and the plurality of nozzles from below.
In this case, the control unit of the calibration apparatus may measure the relative position by causing the imaging unit to image the reference point and the plurality of nozzles.

In the mounting system, the calibration device may include a first imaging unit, a second imaging unit, and a moving mechanism.
The first imaging unit of the calibration device images the jig component placed at a predetermined position in the calibration device from above.
The second imaging unit of the calibration device images the jig part, which is fixed to the mounting head and is sucked by the nozzle, from below.
The movement mechanism of the calibration device integrally moves the mounting head, the first imaging unit, and the second imaging unit in the horizontal direction.
In this case, the control unit of the calibration device acquires an image by causing the first imaging unit to capture an image of the jig component placed at a predetermined position in the calibration device, and obtains the acquired image. The position of the jig component is recognized based on the position, the mounting head is moved in the horizontal direction by a predetermined distance by the moving mechanism, the jig component is sucked by the nozzle, and the jig component sucked by the nozzle is moved. The distance by which the mounting head is moved by calculating the amount of displacement of the chucking position of the jig component with respect to the nozzle based on the acquired image by acquiring an image from the lower side by the second imaging unit. And measuring the relative position by executing the process of measuring the position of the nozzle in the horizontal direction on each of the plurality of nozzles based on the displacement amount of the suction position. It may be.

In the mounting system, the mounting apparatus may further include an imaging unit.
The imaging unit of the mounting apparatus is disposed at a lower position of the mounting head in the height direction, and images the reference point from the lower side.
In this case, the control unit of the mounting apparatus may measure the position of the reference point by causing the imaging unit to image the reference point.

In the mounting system, the reference point may be set at a position of a specific nozzle among the plurality of nozzles in the mounting head.
In this case, the mounting apparatus may further include a first imaging unit, a second imaging unit, and a moving mechanism.
The first imaging unit of the mounting apparatus images the jig component placed at a predetermined position in the mounting apparatus from above.
The second imaging unit of the mounting apparatus images the jig component fixed to the mounting head and sucked by the nozzle from the lower side.
The movement mechanism of the mounting apparatus integrally moves the mounting head, the first imaging unit, and the second imaging unit in the horizontal direction.
In this case, the control unit of the mounting apparatus acquires an image by causing the first imaging unit to image the jig component placed at a predetermined position in the mounting apparatus from the upper side, and based on the acquired image The position of the jig component is recognized, the mounting head is moved in the horizontal direction by a predetermined distance by the moving mechanism, the jig component is adsorbed by the specific nozzle, and the jig adsorbed by the specific nozzle is absorbed. The component part is imaged from the lower side by the second imaging unit to acquire an image, and the amount of displacement of the chucking position of the jig component with respect to the specific nozzle is calculated based on the acquired image, and the mounting head The position of the reference point may be recognized based on the distance moved and the amount of displacement of the suction position.

In the calibration method according to the present technology, the calibration device arranged outside the production line for producing the substrate has a horizontal position of the plurality of nozzles with respect to the reference point in a mounting head having the reference point and the plurality of nozzles. Measure relative position in direction.
Then, the mounting device arranged on the production line measures the position of the reference point in the mounting device body in the horizontal direction with the mounting head attached to the mounting device body of the mounting device. The positions of the plurality of nozzles in the mounting apparatus body in the horizontal direction are recognized based on the position information of the reference point in the mounting apparatus body and the information on the relative position.

The program related to this technology is
To the calibration device arranged outside the production line for producing substrates,
Measuring a relative position in a horizontal direction of the plurality of nozzles with respect to the reference point in a mounting head having a reference point and a plurality of nozzles;
In the mounting device arranged on the production line,
With the mounting head attached to the mounting apparatus body of the mounting apparatus, measure the position of the reference point in the horizontal direction in the mounting apparatus body, and information on the position of the reference point in the mounting apparatus body And a step of recognizing the positions of the plurality of nozzles in the horizontal direction in the mounting apparatus main body based on the relative position information.

A calibration method according to another aspect of the present technology includes measuring a relative position in a horizontal direction of the plurality of nozzles with respect to the reference point in a mounting head having the reference point and the plurality of nozzles.
With the mounting head attached to the mounting apparatus body of the mounting apparatus arranged on the production line for producing the substrate, the horizontal position of the reference point in the mounting apparatus body is measured, Based on the position information of the reference point in the mounting apparatus body and the information on the relative position, the positions of the plurality of nozzles in the mounting apparatus body in the horizontal direction are recognized.

In a calibration method according to still another aspect of the present technology, a mounting head having a reference point and a plurality of nozzles is attached to a mounting apparatus body of a mounting apparatus arranged on a production line for producing a substrate. And measuring the position of the reference point in the horizontal direction in the mounting apparatus main body.
Based on the information on the position of the reference point in the mounting apparatus main body and the information on the relative position in the horizontal direction of the plurality of nozzles with respect to the reference point, the horizontal direction of the plurality of nozzles in the mounting apparatus main body is determined. The position of is recognized.

  As described above, according to the present technology, even when a mounting head that has not been attached to the mounting apparatus is newly used in the mounting apparatus, calibration can be performed in the mounting apparatus in a short time. Techniques such as a mounting system that can be completed can be provided.

It is a figure which shows an example of the production line for producing a board | substrate. It is a front view which shows a mounting apparatus. It is a side view of a mounting apparatus. It is a top view of a mounting apparatus. It is a block diagram which shows the structure of a mounting apparatus. It is a figure which shows a mode when a mounting head is replaced | exchanged. It is a schematic diagram which shows a calibration apparatus. It is a block diagram which shows the structure of a calibration apparatus. It is the figure which looked at the adsorption nozzle from the front-end | tip part side. It is a flowchart which shows the process of a calibration apparatus. It is a figure which shows an example when an adsorption nozzle is imaged from the front-end | tip part side. It is a figure which shows an example of the relative position in the horizontal direction of a reference | standard point and a some suction nozzle. It is a flowchart which shows the process of a mounting apparatus. It is a figure which shows an example of the image of the front-end | tip part of the reference | standard nozzle imaged with the component camera. It is a figure which shows a mode when converting the relative position of a suction nozzle into the relative position which suits NC coordinate. It is a figure which shows a mode when the relative position from the center position of the board | substrate camera in NC coordinate is calculated. It is a comparison figure with a comparative example and this technique. It is a figure which shows the mounting head used in other embodiment. It is a figure which shows the calibration apparatus which concerns on other embodiment. It is a figure which shows jig components. It is a flowchart which shows the process of the calibration apparatus which concerns on other embodiment. It is a figure which shows an example when a jig | tool component is imaged from the lower side with a components recognition camera. It is a figure which shows an example of the position of each suction nozzle with respect to the center position of a camera part. It is a flowchart which shows the process of the mounting apparatus which concerns on other embodiment. It is a figure which shows an example when a reference | standard point is provided in positions other than an adsorption nozzle. It is a figure for demonstrating the mounting precision of the electronic component by the mounting apparatus which concerns on a comparative example, and is a figure which shows distribution of deviation | shift amount with the target position on a board | substrate, and the mounting position of an actual electronic component. It is a figure for demonstrating the mounting precision of the electronic component by the mounting apparatus which concerns on a comparative example, and is a figure which shows distribution of deviation | shift amount with the target position on a board | substrate, and the mounting position of an actual electronic component. It is a figure for demonstrating the mounting precision of the electronic component by the mounting apparatus which concerns on this technique, and is a figure which shows distribution of the deviation | shift amount of the target position on a board | substrate, and the actual mounting position of an electronic component.

<First Embodiment>
[Production line]
Hereinafter, embodiments according to the present technology will be described with reference to the drawings.
FIG. 1 is a diagram illustrating an example of a production line for producing a substrate 1. As shown in FIG. 1, on the production line, the screen printing apparatus 101, the print inspection apparatus 102, the mounting apparatus 103, the mounting inspection apparatus 104, the reflow furnace 105, the cleaning and A drying device 106 and a final inspection device 107 are arranged.

  The screen printing apparatus 101 prints cream solder on the substrate 1 disposed on the lower side of the screen by sliding a squeegee on a screen having openings formed at positions corresponding to the print pattern.

  The print inspection apparatus 102 receives the substrate 1 from the screen printing apparatus 101, analyzes the substrate 1 two-dimensionally or three-dimensionally, and inspects the printed state of the solder. The print inspection apparatus 102 delivers the board 1 determined to be in a good print state to the mounting apparatus 103.

  The mounting apparatus 103 receives the substrate 1 from the print inspection apparatus 102 and mounts the electronic component 2 on the substrate 1. The configuration of the mounting apparatus 103 will be described in detail later.

  The mounting inspection device 104 receives the substrate 1 from the mounting device 103, analyzes the substrate 1 two-dimensionally or three-dimensionally, and inspects the mounting state of the electronic component 2.

  The reflow furnace 105 receives the substrate 1 from the mounting inspection apparatus 104, melts the solder by reflowing the substrate 1, and connects the wiring provided on the substrate 1 and the electronic component 2 through the solder. The cleaning / drying device 106 cleans excess components such as flux adhering to the surface of the substrate 1 after the reflow process, and dries the cleaned substrate 1.

  The final inspection device 107 receives the substrate 1 from the cleaning / drying device 106, analyzes the substrate 1 two-dimensionally or three-dimensionally, and finally inspects the substrate 1.

  Here, as shown in FIG. 1, a calibration apparatus 108 is arranged outside the production line. That is, the calibration device 108 is prepared offline separately from the production line for producing the substrate. The mounting system 100 according to the present technology includes the mounting device 103 described above and the calibration device 108.

[Overall Configuration of Mounting Device 103 and Configuration of Each Part]
First, the mounting apparatus 103 will be described. FIG. 2 is a front view showing the mounting apparatus 103. FIG. 3 is a side view of the mounting apparatus 103, and FIG. 4 is a top view of the mounting apparatus 103. FIG. 5 is a block diagram illustrating a configuration of the mounting apparatus 103. FIG. 6 is a diagram illustrating a state when the mounting head 30 is replaced.

  As shown in these drawings, the mounting apparatus 103 includes a mounting apparatus main body 103a to which the mounting head 30 can be detachably attached. The mounting apparatus main body 103a includes a frame structure 10 and a head moving mechanism 40 that is provided on the frame structure 10 and moves the mounting head 30 in the XYZ directions. Further, the mounting apparatus main body 103 a is provided on both sides in the front-rear direction (Y-axis direction) of the mounting apparatus 103 and has a tape cassette mounting portion 28 on which a plurality of tape cassettes 26 are mounted.

  The mounting apparatus 103 is provided in the mounting apparatus 103 along the X-axis direction, and includes a transport unit 15 that transports the substrate 1 in the X-axis direction, and the substrate 1 transported to the mounting position by the transport unit 15. And a backup unit 20 that supports the device from below.

  In addition, the mounting apparatus 103 includes a downward-facing board camera 18 (first imaging unit) provided in the head moving mechanism 40. Further, the mounting apparatus 103 includes an upward component camera 19 (imaging unit) disposed between the tape cassette 26 and the transport unit 15 disposed on the front side and between the tape cassette 26 and the transport unit 15 on the rear side. ).

  With reference to FIG. 5, the mounting apparatus 103 further includes a control unit 3, a storage unit 4, a communication unit 5, an air compressor 9, and the like.

  The frame structure 10 (see FIGS. 2 to 4) spans a base 11 provided at the bottom, four vertical frames 12 fixed to the base 11, and an upper portion of the vertical frame 12 along the X-axis direction. Two horizontal frames 13.

  The transport unit 15 (see FIGS. 3 and 4) includes two guides 16 disposed along the X-axis direction and a conveyor belt 17 provided on the inner surface side of the two guides 16. The transport unit 15 can carry the substrate 1 and position it at a predetermined position by driving the conveyor belt 17, or can discharge the substrate 1 on which the electronic component 2 has been mounted.

  The guide 16 is formed so that the upper end portion is bent inward, and the upper end portion of the guide 16 supports the substrate 1 from above when the substrate 1 is moved upward by the backup unit 20. Can do.

  The backup unit 20 (see FIG. 3) includes a backup plate 21, a plurality of support pins 22 erected on the backup plate 21, and a plate lifting mechanism 23 that lifts and lowers the backup plate 21.

  When the substrate 1 is transported to the mounting position by the transport unit 15, the backup plate 21 is moved upward by the plate lifting mechanism 23. Thereby, the board | substrate 1 is pinched | interposed between the backup part 20 and the upper end part of the guide 16, and the board | substrate 1 is fixed to a predetermined position. In this state, the electronic component 2 is mounted on the substrate 1.

  A plurality of tape cassettes 26 are mounted on the tape cassette mounting portion 28 (see FIGS. 2 and 4) along the X-axis direction. The tape cassette 26 is detachable from the tape cassette mounting portion 28, and stores a carrier tape (not shown) therein. Each of the tape cassettes 26 includes a reel around which the carrier tape is wound, and a feed mechanism that feeds the carrier tape by step feed.

  Inside the carrier tape, for example, electronic components 2 of the same type such as resistors, capacitors, inductors, and IC chips (ICs: Integrated Circuit) are housed. A supply window 27 is formed on the top surface of the tape cassette 26 on the front end side, and the electronic component 2 is supplied to the mounting head 30 through the supply window 27.

  The head moving mechanism 40 (see FIGS. 2 and 3) includes a Y-axis moving mechanism 41, an X-axis moving mechanism 44, and a Z-axis moving mechanism for moving the mounting head 30 in the Y-axis direction, the X-axis direction, and the Z-axis direction, respectively. 51.

  The Y-axis moving mechanism 41 includes a Y-axis frame 42 spanned along the Y-axis direction with respect to the two horizontal frames 13 of the frame structure 10, and a Y-axis movement at a position below the Y-axis frame 42. And a Y-axis moving body 43 attached to the frame 42 so as to be movable in the Y-axis direction. The Y-axis moving mechanism 41 has a Y-axis driving unit for driving the Y-axis moving body 43 along the Y-axis direction.

  The X-axis moving mechanism 44 has a shape that is long in the X-axis direction. The X-axis frame 45 is attached to the side surface of the Y-axis moving body 43, and the X-axis frame 45 An X-axis moving body 46 attached to be movable in the X-axis direction. The X-axis moving mechanism 44 has an X-axis drive unit for driving the X-axis moving body 46 along the X-axis direction. Two rails 47 are provided in parallel on the side surface of the X-axis frame 45 along the X-axis direction, and a slide member 48 that can slide on the rail 47 is provided on the rail 47. . The X-axis moving body 46 is attached to the position of the side surface of the X-axis frame 45 via the rail 47 and the slide member 48.

  The Z-axis moving mechanism 51 has a head support 52 that is attached to the side surface of the X-axis moving body 46 so as to be movable in the Z-axis direction (height direction) with respect to the X-axis moving body 46. Further, the Z-axis moving mechanism 51 has a Z-axis drive unit for driving the head support unit 52 along the Z-axis direction.

  Two rails 53 are provided in parallel along the Z-axis direction on the side surface of the X-axis moving body 46, and a slide member 54 that can slide on the rail 53 is provided on the rail 53. Yes. The head support 52 is attached to the position of the side surface of the X-axis moving body 46 via the rail 53 and the slide member 54.

  The head support portion 52 can detachably support the mounting head 30.

  Examples of the X-axis drive unit, the Y-axis drive unit, and the Z-axis drive unit include a ball screw drive mechanism, a belt drive mechanism, and a linear motor drive mechanism. The head moving mechanism 40 moves the mounting head 30 in the XY direction (horizontal direction) by driving the X-axis driving unit and the Y-axis driving unit, and moves the mounting head 30 in the Z-axis direction by driving the Z-axis driving unit. Move it in the height direction.

  The mounting head 30 (see FIGS. 2 to 4) mounts the electronic component 2 supplied from the tape cassette 26 on the substrate 1 by sucking it with the suction nozzle 33 b. The mounting head 30 is configured to be detachable from the head support portion 52.

  The mounting head 30 includes a head housing 31, a base shaft 32 provided on the head housing 31 so as to be inclined with respect to the Z-axis direction, and a head portion 33 that is rotatably attached to the base shaft 32. Have. Further, the mounting head 30 has an attaching / detaching portion 34 (see FIG. 6) provided at the position of the side surface of the head housing 31. Further, the mounting head 30 includes a head storage unit 36, a turret drive unit 37, and a nozzle drive unit 38 (see FIG. 5).

  The head portion 33 includes a turret 33a that is rotatably attached to the base shaft 32, and a plurality of suction nozzles 33b that are attached to the turret 33a at equal intervals along the circumferential direction of the turret 33a. The turret 33a is provided with nozzle attachment portions at equal intervals along the circumferential direction, and the suction nozzles 33b are attached to the nozzle attachment portions, respectively.

  The turret 33a is rotatable with the base shaft 32 disposed obliquely in the oblique direction as the center axis of rotation. The turret 33 a is rotated about the base shaft 32 by the drive of the turret driving unit 37.

  The suction nozzle 33b is attached to the turret 33a so that the axis of the suction nozzle 33b is inclined with respect to the central axis of rotation of the turret 33a. The suction nozzle 33b is supported to be movable along the axial direction with respect to the turret 33a, and the suction nozzle 33b is supported to be rotatable with respect to the turret 33a. The suction nozzle 33b is moved along the axial direction (vertical direction) at a predetermined timing or rotated around the axis at a predetermined timing by driving the nozzle driving unit 38.

  Among the plurality of suction nozzles 33b, the suction nozzle 33b located at the lowest position has its axis line oriented in the Z-axis direction (height direction). Hereinafter, the position of the suction nozzle 33b whose axis is directed in the Z-axis direction is referred to as an operation position. By moving the suction nozzle 33b located at this operation position in the vertical direction, the electronic component 2 is sucked or the electronic component 2 is mounted on the substrate 1. The suction nozzle 33b located at the operation position is sequentially switched by the rotation of the turret 33a.

  The suction nozzle 33b is connected to the air compressor 9 (see FIG. 5). The suction nozzle 33b can suck and desorb the electronic component 2 in accordance with the switching of the negative pressure and the positive pressure of the air compressor 9.

  The head storage unit 36 is a nonvolatile memory, and the head storage unit 36 stores ID information individually set for the mounting head 30, information indicating the type of the mounting head 30, and the like. Further, the head storage unit 36 stores information on the relative position in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point, which is measured by the calibration device 108.

  Referring to FIG. 6, the mounting / demounting section 34 of the mounting head 30 includes a power supply connector 34a and a communication connector 34b. On the other hand, the head support part 52 includes a connector 52a connected to a power supply connector 34a provided in the attaching / detaching part 34 and a connector 52b connected to a communication connector 34b provided in the attaching / detaching part 34. Have. When the mounting head 30 is mounted on the head support portion 52, these connectors 34a, 34b, 52a, 52b are connected. As a result, power is supplied to the mounting head 30 and the mounting apparatus 103 and the mounting head 30 can communicate with each other.

  A first engaging portion 34c is provided in the lower portion of the mounting / demounting portion 34 of the mounting head 30, and correspondingly, a lower portion of the head support portion 52 is engaged with the first engaging portion 34c. Two engaging portions 52c are provided. When the mounting head 30 is replaced, the mounting head 30 is rotated with the first engagement portion 34c as the central axis of rotation.

  A lock mechanism 52 d for fixing the mounting head 30 to the head support portion 52 is provided on the upper portion of the head support portion 52. The lock mechanism 52d includes a pivotable lever 52e and a convex first lock portion 52f that moves up and down in accordance with the movement of the pivoted lever 52e. A concave second lock portion 34 d that engages with the first lock portion 52 f of the head support portion 52 is provided on the upper portion of the mounting / removal portion 34 of the mounting head 30.

  When the lever 52e is rotated downward, the first lock portion 52f is moved downward, the first lock portion 52f engages with the second lock portion 34d, and the locked state is established. Become. On the other hand, when the lever 52e is rotated upward, the first lock portion 52f is moved upward, and the locked state is released.

  The substrate camera 18 (see FIG. 3) is disposed below the X-axis moving body 46 in the head moving mechanism 40. The substrate camera 18 is moved in the XY direction together with the mounting head 30 as the mounting head 30 is moved in the XY direction (horizontal direction) by the head moving mechanism 40.

  The substrate camera 18 is arranged so that its optical axis faces the Z-axis direction, and images the alignment marks provided at arbitrary two or more positions on the substrate 1 from above. The control unit 3 of the mounting apparatus 103 recognizes the position of the substrate 1 in the mounting apparatus 103 based on the image of the alignment mark acquired by imaging.

  The component camera 19 (see FIGS. 3 and 4) is arranged so that its optical axis faces the Z-axis direction, and images the electronic component 2 sucked by the suction nozzle 33b located at the operation position from the lower side. The control unit 3 of the mounting apparatus 103 determines the suction state of the electronic component 2 (the angle of the electronic component 2 around the Z axis, suction failure, etc.) based on the image acquired by the component camera 19.

  With reference to FIG. 5, the control part 3 is comprised by CPU (Central processing Unit), for example. The control unit 3 executes various calculations based on various programs stored in the storage unit 4 and controls each unit of the mounting apparatus 103 in an integrated manner. The processing of the control unit 3 will be described in detail later.

  The storage unit 4 includes a non-volatile memory that stores various programs necessary for the processing of the control unit 3 and a volatile memory that is used as a work area of the control unit 3. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

  The communication unit 5 transmits information to other devices in the mounting line such as a board inspection device, and receives information from other devices.

[Overall Configuration of Calibration Apparatus 108 and Configuration of Each Unit]
Next, the configuration of the calibration device 108 will be described.
FIG. 7 is a schematic diagram showing the calibration device 108. FIG. 8 is a block diagram illustrating a configuration of the calibration apparatus 108.

  As shown in FIG. 7, a head support 62 capable of detachably supporting the mounting head 30 and an upward camera 63 arranged on the lower side of the mounting head 30 are provided. Further, as illustrated in FIG. 8, the calibration apparatus 108 includes a control unit 6 and a storage unit 7.

  The head support 62 and the camera 63 are fixed to the frame structure 10 (not shown). The calibration apparatus main body is configured by the head support 62, the frame structure 10, and the like.

  The head support 62 has the same configuration as the head support 52 in the mounting apparatus 103 (see FIG. 6 and the like). The head support 62 is connected to a connector 62 a connected to a power supply connector 34 a provided in the attachment / detachment portion 34 of the mounting head 30 and a communication connector 34 b provided in the attachment / detachment portion 34 of the mounting head 30. Connector 62b. Power is supplied to the mounting head 30 via these connectors, and the calibration device 108 and the mounting head 30 can communicate with each other.

  The camera 63 is arranged such that its optical axis faces the Z-axis direction, and images the suction nozzle 33b from the tip side. FIG. 9 is a view of the suction nozzle 33b as seen from the tip side. As shown in FIG. 9, the suction nozzle 33 b has a suction portion 33 c that protrudes toward the tip side at a central position in the tip portion. The center of the suction part 33c is designed to coincide with the central axis of the suction nozzle 33b.

  In addition, two marks 70 that can be imaged by the camera 63 are provided at the tip of the suction nozzle 33b. The two marks 70 are provided on the suction nozzle 33b so that the center position between the two marks coincides with the position of the center axis of the suction nozzle 33b.

  Referring to FIG. 8, the control unit 6 of the calibration device 108 is configured by, for example, a CPU (Central Processing Unit). The control unit 6 executes various calculations based on various programs stored in the storage unit 7 and comprehensively controls each unit of the calibration device 108.

  The storage unit 7 includes a non-volatile memory that stores various programs necessary for the processing of the control unit 6 and a volatile memory that is used as a work area of the control unit 6. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

[Description of operation]
Next, processing in calibration of the calibration apparatus 108 and the mounting apparatus 103 will be described.
<< Processing of Calibration Device 108 >>
First, the processing of the calibration device 108 will be described. FIG. 10 is a flowchart showing processing of the calibration apparatus 108. First, the control unit 6 of the calibration device 108 selects a specific suction nozzle 33b as a reference nozzle from the plurality of suction nozzles 33b (step 101). As the reference nozzle, the suction nozzle 33b set in advance by the operator may be selected, or may be randomly selected by the control unit 6.

  Next, the control unit 6 of the calibration device 108 controls the turret driving unit 37 to rotate the turret 33a, and moves the suction nozzle 33b selected as the reference nozzle to the operation position (step 102). Next, the control unit 6 of the calibration device 108 controls the nozzle driving unit 38 to lower the reference nozzle by a predetermined distance (for example, 10 mm) (step 103). At this time, the distance by which the reference nozzle is lowered is the same distance as the distance by which the reference nozzle is lowered when the electronic component 2 is mounted on the substrate 1 (and when the electronic component 2 is sucked).

  Next, the control unit 6 of the calibration device 108 controls the camera 63 so that the reference nozzle is imaged from the tip side and acquires an image (step 104). When the image of the tip of the reference nozzle is acquired, the control unit 6 of the calibration device 108 controls the nozzle driving unit 38 to raise the reference nozzle.

  FIG. 11 shows an example of an image when the suction nozzle 33b is imaged from the tip side.

  As shown in FIG. 11, two marks 70 are included in the image. The control unit 6 of the calibration device 108 performs image processing on the acquired image, acquires the positions of the two marks 70, and calculates the position of the intermediate point between the two marks 70. Then, the control unit 6 of the calibration device 108 determines the position of the intermediate point between the two marks 70 as the reference point (0, 0) on the XY plane (step 105).

  At this time, the control unit 6 of the calibration apparatus 108 sets a straight line connecting the two marks 70 as the X-axis direction, and sets a direction passing through the reference point and perpendicular to the X-axis as the Y-axis direction. Thus, one coordinate is generated with the position of the reference nozzle descending as a reference point and the angle around the Z axis of the reference nozzle as a coordinate angle.

  FIG. 11 also shows coordinates (X ′ axis, Y ′ axis) based on the viewing angle of the camera, but these coordinates are not used.

  Next, the control unit 6 of the calibration device 108 controls the turret driving unit 37 to rotate the turret 33a, and switches the suction nozzle 33b located at the operation position from the reference nozzle to another suction nozzle 33b (step 106). . Then, the suction nozzle 33b newly positioned at the operation position is lowered by a predetermined distance (for example, 10 mm) (step 107). Then, the control unit controls the camera to capture an image of the suction nozzle 33b from the distal end side (step 108).

  Next, the control unit 6 of the calibration device 108 calculates the position of the intermediate point between the two marks 70 included in the acquired image, thereby obtaining position information in the horizontal direction when the suction nozzle 33b is lowered. (ΔX, ΔY) is acquired (step 109). Note that the coordinates used at this time are coordinates in which the position when the reference nozzle is lowered is a reference point and the angle of the reference nozzle around the Z axis is a coordinate angle.

  When the position information is acquired, the control unit 6 of the calibration device 108 determines whether or not the suction nozzle 33b whose position has not been measured still remains (step 110). When the suction nozzle 33b remains (YES in Step 110), the control unit returns to Step 106. When the positions of all the suction nozzles 33b in the horizontal direction are measured (NO in step 110), the control unit obtains measurement results, that is, information on the relative positions of the plurality of suction nozzles 33b in the horizontal direction with respect to the reference point. The data is stored in the head storage unit 36.

  FIG. 12 is a diagram illustrating an example of relative positions (ΔXb, ΔYb), (ΔXc, ΔYc), (ΔXd, ΔYd)... In the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point.

  Here, in this embodiment, when the processing accuracy of the head unit 33 and the suction nozzle 33b is completely accurate, the horizontal position (reference point) when the reference nozzle is lowered, The horizontal position when the suction nozzle 33b is lowered should be the same position. However, since the processing accuracy of the head unit 33 and the suction nozzle 33b varies somewhat, as shown in FIG. 12, the horizontal position (reference point) when the reference nozzle is lowered, The position in the horizontal direction when the suction nozzle 33b is lowered is not the same position, and a slight shift occurs.

<< Processing of Mounting Device 103 >>
Next, processing of the mounting apparatus 103 will be described. FIG. 13 is a flowchart showing processing of the mounting apparatus 103.

  The control unit 3 of the mounting apparatus 103 is shown in FIG. 13 when the mounting head 30 is attached to the mounting apparatus body 103a for the first time, or when the mounting head 30 is replaced and a new mounting head 30 is attached. Execute the process. Note that the mounting head 30 attached to the mounting apparatus 103 has already been processed by the calibration device 108, and the head storage unit 36 has a plurality of suction nozzles 33b relative to the reference point in the horizontal direction. The position is stored.

  When the mounting head 30 is attached to the mounting apparatus main body 103a, first, the control unit 3 of the mounting apparatus 103 controls the head moving mechanism 40 to move the mounting head 30 in the horizontal direction, and the mounting head 30 is moved to the component camera 19. Move upwards.

  Next, the control unit 3 of the mounting apparatus 103 controls the turret driving unit 37 to rotate the turret 33a and move the reference nozzle to the operation position (step 201). At this time, the angle of the reference nozzle around the Z axis with respect to the mounting head 30 is the same as the angle when the tip of the reference nozzle is imaged by the calibration device 108.

  When the reference nozzle is moved to the operation position, the control unit 3 of the mounting apparatus 103 lowers the reference nozzle (step 202). At this time, the distance by which the reference nozzle is lowered is the same distance as the distance by which the reference nozzle is lowered in the measurement by the calibration device 108. Further, the height of the reference nozzle when the reference nozzle is lowered is the same as the height when the reference nozzle mounts the electronic component 2 on the substrate 1 (and when the electronic component 2 is sucked). . Note that the height of the entire mounting head 30 in the mounting apparatus 103 is adjusted by the Z-axis moving mechanism 51 so that such a relationship can be satisfied.

  When the reference nozzle is lowered, the control unit 3 of the mounting apparatus 103 causes the component camera 19 to image the tip of the reference nozzle from the lower side (step 203). FIG. 14 is a diagram illustrating an example of the image of the tip of the reference nozzle imaged by the component camera 19.

  Next, the control unit 3 of the mounting apparatus 103 calculates the position of the intermediate point between the two marks 70 included in the acquired image, thereby obtaining horizontal position information (X, Y) is acquired (step 204).

  At this time, the control unit 3 of the mounting apparatus 103 determines the inclination around the Z axis of the coordinate of the relative position in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point (step 205). In this case, the control unit 3 of the mounting apparatus 103 determines the straight line connecting the two marks 70 as the X-axis direction, and determines the direction passing through the position (X, Y) and perpendicular to the X-axis as the Y-axis direction. The inclination of the coordinates around the Z axis is determined.

  FIG. 14 also shows coordinates based on the viewing angle of the camera (X "axis, Y" axis). In the present embodiment, the X "axis and the Y" axis of the coordinates based on the viewing angle of the component camera 19 are the X coordinates in the NC coordinates (the coordinates in the mounting apparatus 103 used for mounting the electronic component 2). It matches the “axis, Y” axis.

  When the control unit 3 of the mounting apparatus 103 recognizes the coordinates of the relative positions in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point, the coordinates (X axis and Y axis in FIG. 14) and NC coordinates (X "axis). , Y "axis) and the angle difference around the Z axis is calculated (step 206).

  Next, the control unit 3 of the mounting apparatus 103 reads information on the horizontal relative positions of the plurality of suction nozzles 33 b with respect to the reference point from the head storage unit 36. Then, the control unit 3 rotates the coordinates of the relative position of the suction nozzle 33b with respect to the reference point around the Z axis based on the angular difference calculated in step 206, so that the relative position of the suction nozzle 33b matches the NC coordinate. The relative position is converted (step 207).

  In FIG. 15, the relative positions (ΔXb, ΔYb), (ΔXc, ΔYc), (ΔXd, ΔYd)... Of the suction nozzle 33b are set to the relative positions (ΔXb1, ΔYb1), (ΔXc1, The state of conversion to (ΔYc1), (ΔXd1, ΔYd1)... Is shown.

  Next, the control unit 3 of the mounting apparatus 103 sets the position (ΔXb1, ΔYb1), (ΔXc1, ΔYc1), (ΔXd1, ΔYd1),. On the other hand, the relative position between the center position of the substrate camera 18 and the reference point is added (step 208). Accordingly, the relative positions (ΔXb2, ΔYb2), (ΔXc2, ΔYc2), (ΔXd2, ΔYd2)... Of the suction nozzle with respect to the center position of the substrate camera 18 in the NC coordinates are calculated. FIG. 16 shows how the relative positions (ΔXb2, ΔYb2), (ΔXc2, ΔYc2), (ΔXd2, ΔYd2)... Of the suction nozzle with respect to the center position of the substrate camera 18 in the NC coordinates are calculated. ing.

[Action etc.]
FIG. 17 is a comparison diagram between the comparative example and the present embodiment. As shown in the upper side of FIG. 17, in the comparative example, after mounting head 30 is attached to mounting apparatus main body 103 a and mounting head 30 is set, relative to the center position of substrate camera 18 in the NC coordinates. It is necessary to calculate the positions of all the suction nozzles 33b. For this reason, in the comparative example, calibration takes time.

  On the other hand, in the present embodiment, in the calibration device 108, the horizontal relative positions of the plurality of suction nozzles 33b with respect to the reference point can be measured offline in advance. For this reason, when the mounting head 30 is attached to the mounting apparatus main body 103a, the position of the reference point in the mounting apparatus 103 is measured, and thereafter, basically, each of the suction nozzles 33b is basically relative to the reference point. If the relative positions are added, it is possible to measure at each position of the suction nozzle 33b.

  As described above, in the present embodiment, a part of the processing necessary for calibration can be performed in advance in the calibration device 108. Therefore, when calibration is performed in the mounting device 103, calibration is completed in a short time. Can be made. In particular, in the present technology, even when the mounting head 30 that has not been attached to the mounting apparatus 103 is newly used in the mounting apparatus 103, the mounting apparatus 103 completes the calibration in a short time. be able to.

  As a result of actual measurement of the time required for calibration in the mounting apparatus 103 by the present inventors, the time required for calibration was about 3 minutes.

  In this embodiment, since the relative position in the horizontal direction when the suction nozzle 33b is lowered is measured in the calibration device 108, the suction nozzle when the electronic component 2 is mounted by lowering the nozzle. The mounting apparatus 103 can accurately recognize the position of 33b in the horizontal direction.

  Here, when the mounting apparatus 103 is assembled and manufactured, in general, assembly of the mounting apparatus main body 103a → adjustment of the mounting apparatus main body 103a → adjustment of mounting of the mounting head 30 → calibration of the mounting head 30 → calibration of the mounting apparatus 103. This is done in the flow of On the other hand, in the present embodiment, since the mounting head 30 can be calibrated by the calibration device 108, when the mounting device 103 is assembled and manufactured, the assembly of the mounting device main body 103a → the mounting device main body 103a. In parallel with the process of adjustment → calibration of the mounting apparatus 103, the process of assembly of the mounting head 30 → adjustment of the mounting head 30 → calibration of the mounting head 30 can be performed. As described above, since the steps are separated and the steps can be performed simultaneously, the time for the step of manufacturing the mounting apparatus 103 can be shortened.

  Next, the mounting accuracy of the electronic component 2 by the mounting apparatus 103 according to the present embodiment will be described with reference to FIGS.

  26 and 27 are diagrams for explaining the mounting accuracy of the electronic component 2 by the mounting apparatus 103 according to the comparative example, and a deviation amount between the target position on the substrate 1 and the actual mounting position of the electronic component 2. FIG. FIG. 28 is a diagram for explaining the mounting accuracy of the electronic component 2 by the mounting apparatus 103 according to the present embodiment, and the distribution of the deviation amount between the target position on the substrate 1 and the actual mounting position of the electronic component 2. FIG.

  The data shown in FIG. 26 is obtained by executing all processing necessary for calibration of the mounting head 30 by the mounting apparatus 103 on the production line, and then mounting electronic components on the substrate by the mounting apparatus 103. Data. Specifically, first, the mounting head 30 was attached to the mounting apparatus main body 103a, and the relative position with respect to the center of the substrate camera 18 was determined for each of the plurality of suction nozzles 33b. After calibration is performed by such a method, the electronic component 2 is actually mounted on the target position by the suction nozzle 33b, and the difference between the target position and the actual mounting position of the electronic component 2 is obtained. . This difference distribution is shown in FIG. FIG. 26 also shows 3σ (σ: standard deviation), average value (AVE), and process capability index (Cpk) in the X-axis direction and the Y-axis direction.

  The data shown in FIG. 27 was acquired as follows. First, after obtaining the data shown in FIG. 26, the mounting head 30 was once detached from the mounting apparatus main body 103a, the mounting head 30 was attached to the mounting apparatus main body 103a again, and the mounting head 30 was calibrated. The mounting head 30 was calibrated at this time by simply using the relative position data of each suction nozzle 33b without executing processing for measuring the position of the reference point in the mounting apparatus 103. After calibration was performed by such a method, the electronic component was actually mounted on the target position by the suction nozzle 33b, and the difference between the target position and the actual mounting position of the electronic component was obtained. FIG. 27 also shows 3σ (σ: standard deviation), average value (AVE), and process capability index (Cpk) in the X-axis direction and the Y-axis direction, as in FIG.

  In the data shown in FIG. 28, after the calibration according to the present embodiment is performed in the mounting apparatus 103 (see FIG. 13), the electronic component 2 is actually mounted at the target position on the substrate 1 by the suction nozzle 33b. This is data obtained by obtaining the difference between the target position and the actual mounting position of the electronic component 2. FIG. 28 also shows 3σ (σ: standard deviation), average value (AVE), and process capability index (Cpk) in the X-axis direction and the Y-axis direction, as in FIGS. 26 and 27. .

  When comparing FIG. 28 (this embodiment) and FIG. 27 (comparative example), it can be seen that the mounting accuracy of the electronic component is higher in FIG. 28 than in FIG. That is, it can be seen that the mounting accuracy of this embodiment is higher than that of the comparative example. Further, comparing FIG. 28 (this embodiment) and FIG. 26 (comparative example), it can be seen that FIG. 28 achieves the same mounting accuracy as FIG. In other words, in the present embodiment, all processing necessary for calibration of the mounting head 30 is executed by the mounting apparatus 103 on the production line, and the mounting head 30 is removed without using the suction nozzle 33b of the mounting head 30. A mounting accuracy equivalent to that when the component 2 is mounted on the substrate 1 can be realized.

Second Embodiment
Next, a second embodiment of the present technology will be described. In the second and subsequent embodiments, differences from the first embodiment will be mainly described.

[Configuration of Mounting Head 80]
FIG. 18 is a diagram showing a mounting head 80 used in the second embodiment. This mounting head 80 is different from the above-described first embodiment in that a component recognition camera 82 and a holding member 83 for holding the component recognition camera 82 are further provided with respect to the mounting head 80.

  The holding member 83 is disposed below the head housing 31. The component recognition camera 82 images from below the electronic component 2 (or a jig component 85 to be described later) sucked by the suction nozzle 33b located at a position opposite to the operation position among the plurality of suction nozzles 33b. It is placed in a possible position. Hereinafter, the position opposite to the operation position in the head unit 33 is referred to as a component recognition position.

  When the mounting head 30 is attached to the mounting apparatus 103, the control unit 3 of the mounting apparatus 103 determines whether the electronic component 2 is attracted (an angle about the Z axis of the electronic component 2; Adsorption failure, etc.) is determined.

[Configuration of Calibration Device 108]
FIG. 19 is a diagram showing a calibration device 109 according to the second embodiment. The calibration device 109 has the same configuration as a part of the mounting device 103 according to the first embodiment described above. That is, the calibration device 108 has a head movement including a Y-axis movement mechanism 41, an X-axis movement mechanism 44, and a Z-axis movement mechanism 51 for moving the mounting head 30 in the Y-axis direction, the X-axis direction, and the Z-axis direction, respectively. A mechanism 40 is provided. Since the configuration of the head moving mechanism 40 is the same as that of the mounting apparatus 103 according to the first embodiment described above, the description thereof is omitted.

  The calibration device 109 includes a downward camera unit 86 (first imaging unit) disposed below the X-axis moving body 46 in the head moving mechanism 40. The camera unit 86 has a configuration similar to that of the substrate camera 18 described above, and can capture a jig component 85 described later from above.

  The calibration device 109 has a mounting table 87 on which the jig component 85 is mounted. FIG. 20 is a view showing the jig component 85. The jig component 85 has a size that can be sucked by the suction nozzle 33b. The jig component 85 is made of a transparent member such as glass or acrylic resin, and four marks 85a of a thin film formed by vapor deposition are formed on the upper surface thereof.

  In the second embodiment, the mounting head 80, the component recognition camera 82, and the camera unit 86 are integrally movable in the horizontal direction by the head moving mechanism 40.

  Note that, unlike the calibration device 108 in the first embodiment, the calibration device 109 according to the second embodiment is not provided with the upward camera 63 arranged at the lower position of the mounting head 30. In the second embodiment, unlike the first embodiment, the calibration device 109 is provided with an air compressor (not shown) that provides a pressure for performing suction by the suction nozzle 33b.

[Processing of Calibration Device 108]
FIG. 21 is a flowchart showing processing of the calibration apparatus 109 according to the second embodiment.

  First, the control unit 6 of the calibration device 109 adjusts the height of the mounting head 80 by moving the mounting head 80 in the Z-axis direction by the head moving mechanism 40 (step 301). Thus, the lowering distance when the suction nozzle 33b sucks the jig component 85 is the same as the lowering distance when the electronic component 2 is mounted on the substrate 1 (and when the electronic component 2 is sucked). The height of the mounting head 30 is adjusted.

  Next, the control unit 6 of the calibration device 109 controls the head moving mechanism 40 to move the camera unit 86 above the jig part 85 placed at a predetermined position in the calibration device 109, and thereby the camera unit. The jig part 85 is imaged from above by 86 (step 302). Then, the control unit 6 of the calibration device 109 recognizes the position of the mark 85a included in the image, and based on the position of the mark 85a, the position of the jig component 85 in the calibration device 108 in the horizontal direction, The inclination of the jig component 85 around the Z axis is recognized (step 303).

  Next, the control unit 6 of the calibration device 109 controls the head moving mechanism 40 to move the suction nozzle 33b located at the operation position above the jig component 85 (step 303). At this time, the control unit 6 of the calibration device 109 moves the suction nozzle 33b by the relative distance between the suction nozzle 33b that sucks the electronic component 2 and the camera unit 86, which is set as a design value.

  Next, the control unit 6 of the calibration device 109 moves the suction nozzle 33b downward by the nozzle driving unit 38 and then controls the air compressor to suck the jig component 85 by the suction nozzle 33b (step 305). Thereafter, the suction nozzle 33b is raised.

  Next, the control unit 6 of the calibration device 109 rotates the turret 33 a to move the suction nozzle 33 b that sucks the jig component 85 to the component recognition position, and then lowers the jig component 85 by the component recognition camera 82. (Step 306).

  FIG. 22 is a diagram illustrating an example of an image when the jig component 85 is imaged from the lower side by the component recognition camera 82.

  Here, in the second embodiment, the camera unit 86 images the jig component 85 from the upper side, and the component recognition camera 82 images the jig component 85 from the lower side. However, since the jig component 85 is formed of a transparent member, the mark can be appropriately imaged regardless of which side the jig component 85 is imaged, and the influence of the thickness of the jig component 85 is also eliminated. be able to.

  After imaging the jig component 85 with the component recognition camera 82, the control unit 6 of the calibration device 109 calculates the center position of the jig component 85 based on the position of the mark 85a included in the image, and is acquired. Based on the image, the center position of the suction nozzle 33b is determined. Then, the control unit 6 of the calibration device 109 calculates a difference (a suction position shift amount) between the center position of the suction nozzle 33b and the center position of the jig component 85 (step 307).

  Then, the control unit 6 of the calibration device 109 sets the relative distance between the suction nozzle 33b that sucks the electronic component 2 and the camera unit 86 (see step 304) set as the design value, and the suction position calculated in step 307. The amount of deviation is added. Accordingly, the control unit 6 of the calibration device 109 can accurately calculate the position of the suction nozzle 33b with respect to the center position of the camera unit 86. At this time, the coordinate inclination of the camera unit 86 is applied to the component recognition camera 82.

  After calculating the position of the suction nozzle 33b relative to the position at the center of the camera unit 86, the control unit 6 of the calibration device 109 determines whether or not the suction nozzle 33b that has not been measured remains (step 308). When the suction nozzle 33b that has not been measured remains (YES in step 308), the control unit 6 of the calibration device 109 repeats the processing in steps 301 to 307.

  Thereby, the process which calculates the position of the suction nozzle 33b with respect to the center position of the camera part 86 is each performed by all the suction nozzles 33b. 23 shows an example of the position of each suction nozzle 33b with respect to the center position of the camera unit 86.

  When the measurement is completed for all the suction nozzles 33b (NO in Step 308), the control unit 6 of the calibration device 109 subtracts the measurement result of the reference nozzle from the measurement result obtained by each suction nozzle 33b. (Step 309). As a result, as shown in the lower diagram of FIG. 23, the relative positions in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point are calculated.

  Next, the control unit 6 of the calibration device 109 stores information on the relative positions in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point in the head storage unit 36 (step 310).

  In the calibration apparatus 108 according to the second embodiment, even when there is no upward camera provided on the lower side of the mounting head 30, information on the relative position in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point is obtained. Can be acquired appropriately.

[Mounting apparatus 103]
Next, the mounting apparatus 103 according to the second embodiment of the present technology will be described. The mounting apparatus 103 is different from the above-described first embodiment in that an upward camera disposed at a position below the mounting head 30 is not provided. Further, the mounting apparatus 103 according to the second embodiment is different from the above-described first embodiment in that a mounting portion for mounting the jig component 85 on which the jig component 85 is mounted is provided.

  The jig part 85 has a height of the mark 85a of the jig part 85 that is the same as the lowering height when the suction nozzle 33b mounts the electronic part 2 (and the lowering height when the electronic part 2 is sucked). It is placed on the mounting part.

[Processing of mounting apparatus 103]
FIG. 24 is a flowchart showing processing of the mounting apparatus 103 according to the second embodiment.
First, the control unit 3 of the mounting apparatus 103 moves the mounting head 30 in the Z-axis direction by the head moving mechanism 40 to adjust the height of the mounting head 30 (step 401). Thus, the lowering distance when the suction nozzle 33b sucks the jig component 85 is the same as the lowering distance when the electronic component 2 is mounted on the substrate 1 (and when the electronic component 2 is sucked). The height of the mounting head 30 is adjusted.

  Next, the control unit 3 of the mounting apparatus 103 controls the head moving mechanism 40 to move the board camera 18 above the jig component 85 placed at a predetermined position in the mounting apparatus 103. The jig part 85 is imaged from above (step 402). Then, the control unit 3 of the mounting apparatus 103 recognizes the position of the mark 85a included in the image, and based on the position of the mark 85a, the position of the jig part 85 in the mounting apparatus 103 in the horizontal direction, and the jig part. The inclination of 85 around the Z axis is recognized (step 403).

  Next, the control unit 6 of the mounting apparatus 103 controls the head moving mechanism 40 to rotate the turret 33a while moving the mounting head 30 to position the reference nozzle at the operation position, and to move the reference nozzle to the jig component 85. (Step 404). At this time, the control unit 3 of the mounting apparatus 103 moves the reference nozzle by the relative distance between the reference nozzle and the substrate camera 18 set as a design value.

  Next, the control unit 3 of the mounting apparatus 103 moves the reference nozzle downward by the nozzle driving unit 38 and then controls the air compressor 9 to suck the electronic component 2 by the reference nozzle (step 405). Raise the reference nozzle.

  Next, the control unit 3 of the mounting apparatus 103 rotates the turret 33a to move the reference nozzle to the component recognition position, and then images the jig component 85 from the lower side by the component recognition camera 82 (step 406) ( (See FIG. 22).

  After imaging the jig component 85 by the component recognition camera 82, the control unit 3 of the mounting apparatus 103 calculates the center position of the jig component 85 based on the position of the mark 85a included in the image, and also acquires the acquired image. Based on this, the center position of the suction nozzle 33b is determined. Then, the control unit 3 of the mounting apparatus 103 calculates a difference between the center position of the reference nozzle and the center position of the jig component 85 (amount of displacement of the suction position) (Step 407).

  Then, the control unit 6 of the mounting apparatus 103 adds the suction position deviation amount calculated in Step 407 to the relative position between the reference nozzle and the substrate camera 18 set as a design value. Thereby, the control unit 3 of the mounting apparatus 103 can accurately calculate the position of the reference nozzle with respect to the center position of the substrate camera 18.

  Next, the control unit 3 of the mounting apparatus 103 measures the inclination of the NC coordinate of the board camera 18 by the component recognition camera 82, obtains the difference in inclination of the center position coordinates when the suction nozzles 33b are lowered, and calculates the relative position. The coordinates are rotated and converted into a relative position corresponding to the inclination of the NC coordinates (step 408).

  Then, the control unit 3 of the mounting apparatus 103 adds the relative position between the center position of the substrate camera 18 and the reference point to the position of each suction nozzle 33b after conversion into the relative position matching the inclination of the NC coordinate ( Step 409). Thereby, the relative position from the center position of the substrate camera 18 in the NC coordinates is calculated.

  In the mounting apparatus 103 according to the second embodiment, even when there is no upward camera provided on the lower side of the mounting head 30, it is based on information on the relative positions in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point. Thus, the position of each suction nozzle 33b can be acquired appropriately.

<Various modifications>
In the above-described embodiment, the configuration in which the mounting apparatus 103 (or the calibration apparatuses 108 and 109) can automatically adjust the height of the mounting head 30 by the head moving mechanism 40 has been described. On the other hand, the mounting device 103 (or the calibration devices 108 and 109) may be configured such that the height of the mounting head 30 can be manually adjusted when the mounting head 30 is attached to the mounting device main body 103a.

  Note that the height of the mounting apparatus 103 (or the calibration apparatuses 108 and 109) is not necessarily adjustable. When the mounting apparatus 103 is not provided with a height adjustment mechanism, when the electronic component 2 is mounted on the substrate 1 (or the electronic component 2 is sucked) due to the combination of the mounting head 30 and the mounting apparatus main body 103a. ) When the lowering distance of the suction nozzle 33b is different.

  Therefore, the control unit 6 of the calibration devices 108 and 109 lowers the suction nozzle 33b by performing a process of lowering the suction nozzle 33b by a predetermined distance and measuring the positions in the horizontal direction at the tip portions of the plurality of nozzles. It may be repeated several times at different distances. Thereby, the relative position in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point can be measured at each descending distance. In this case, the control unit 3 of the mounting apparatus 103 recognizes the position when the suction nozzle is lowered by using the data closest to the lowering distance of the suction nozzle 33b when the electronic component is mounted among the data at each lowering distance. .

  In each of the above-described embodiments, the case where the reference point is set at the position of the suction nozzle 33b has been described. On the other hand, the reference point may be set at a position other than the suction nozzle 33b. FIG. 25 shows an example in the case of being provided at a position other than the suction nozzle 33b. The upper drawing of FIG. 21 shows an example in which a mark 89 is attached near the end on the lower surface of the parallel type mounting head. The lower drawing of FIG. 21 shows a case where a mark 89 is attached at the center position on the lower surface of the rotary mounting head 30.

  In the example shown in the figure, the shape of the mark 89 is circular, but the shape of the mark 89 may be a rectangle or a star shape. In the example shown in the figure, the number of marks 89 is one, but may be two or more.

  In the present technology, a jig nozzle created by imitating the suction nozzle 33b may be used instead of the suction nozzle 33b. The jig nozzle is configured to be attachable to the attachment portion of the head portion 33 and is movable in the axial direction. The jig nozzle is used instead of the suction nozzle 33b when, for example, the center of the suction nozzle 33b is difficult to be recognized by the calibration device 108 and the mounting device 103 when the suction nozzle 33b is imaged from the tip side. .

  In each of the above-described embodiments, the case where the head storage unit 36 stores the information on the relative position in the horizontal direction of the plurality of suction nozzles 33b with respect to the reference point has been described. However, the location where the relative position information is stored is not limited to this, and may be stored in a transportable recording medium, or stored in another device (for example, a mounting device or a server device). Also good.

  In each of the above-described embodiments, the case where dedicated apparatuses are used as the calibration apparatuses 108 and 109 has been described. However, the mounting apparatus 103 prepared offline may be used as the calibration apparatuses 108 and 109.

  Here, the calibration devices 108 and 109 in the present technology being prepared off-line means that the calibration devices 108 and 109 are not provided in an operating production line where the substrate 1 is produced. is there. Therefore, in addition to providing the calibration devices 108 and 109 separately from the production line, for example, during an operation suspension period when the substrate production is not performed, or when the substrate type is changed, etc. The case where the mounting apparatus 103 in the production line during the idle time is used as the calibration apparatuses 108 and 109 is included.

This technique can also take the following composition.
(1). A mounting head having a reference point and a plurality of nozzles has a control unit for measuring the relative position of the plurality of nozzles in the horizontal direction with respect to the reference point, and is disposed outside a production line for producing a substrate. A calibration device;
A mounting apparatus main body to which the mounting head is attached, and a position of the reference point in the horizontal direction in the mounting apparatus main body is measured in a state in which the mounting head is attached to the mounting apparatus main body. A control unit for recognizing the positions of the plurality of nozzles in the mounting apparatus main body in the horizontal direction based on the information on the position of the reference point and the information on the relative position on the production line. A mounting system comprising: a mounting device disposed;
(2). The mounting system according to (1) above,
The controller of the calibration device lowers the plurality of nozzles by a predetermined distance in the height direction and measures the positions in the horizontal direction at the tip portions of the plurality of nozzles, thereby determining the relative positions. Mounting system to measure.
(3). The mounting system according to (2) above,
The control unit of the calibration device lowers the plurality of nozzles by a predetermined distance and measures the horizontal position at the tip of each of the plurality of nozzles. A mounting system that measures the relative position at each descending distance by repeating a plurality of different times.
(4). The mounting system according to (2) above,
The mounting apparatus has a moving mechanism for moving the mounting head in the height direction,
The controller of the mounting apparatus is configured such that the descending distance when the electronic component is mounted on the substrate by the plurality of nozzles is the same distance as the distance by which the plurality of nozzles are lowered in the calibration apparatus. A mounting system that controls the moving mechanism to adjust the height of the mounting head.
(5). The mounting system according to any one of (1) to (4) above,
The calibration device further includes an imaging unit that is disposed at a position below the mounting head in the height direction and images the reference point and the plurality of nozzles from below.
The control unit of the calibration apparatus measures the relative position by causing the imaging unit to image the reference point and the plurality of nozzles.
(6). The mounting system according to any one of (1) to (4) above,
The calibration device
A first imaging unit that images a jig component placed at a predetermined position in the calibration device from above;
A second imaging unit that images the jig component fixed to the mounting head and sucked by the nozzle from below;
A moving mechanism that integrally moves the mounting head, the first imaging unit, and the second imaging unit in a horizontal direction;
The control unit of the calibration device acquires an image by causing the first imaging unit to image a jig component placed at a predetermined position in the calibration device from above, and based on the acquired image, The position of the jig component is recognized, the mounting head is moved in the horizontal direction by a predetermined distance by the moving mechanism, the jig component is sucked by the nozzle, and the jig component sucked by the nozzle is moved to the second position. An image is taken by the imaging unit from the lower side, an image is obtained, a displacement amount of the suction position of the jig component with respect to the nozzle is calculated based on the obtained image, the distance the mounting head is moved, and the The relative position is measured by executing the process of measuring the position of the nozzle in the horizontal direction on the basis of the amount of displacement of the suction position with each of the plurality of nozzles. Stem.
(7). The mounting system according to any one of (1) to (6) above,
The mounting apparatus further includes an imaging unit that is disposed at a position below the mounting head in the height direction and images the reference point from below.
The control unit of the mounting apparatus measures the position of the reference point by causing the imaging unit to image the reference point.
(8). The mounting system according to any one of (1) to (6) above,
The reference point is set at a position of a specific nozzle among the plurality of nozzles in the mounting head,
The mounting apparatus is:
A first imaging unit that images a jig component placed at a predetermined position in the mounting apparatus from above;
A second imaging unit that images the jig component fixed to the mounting head and sucked by the nozzle from below;
A moving mechanism that moves the mounting head, the first imaging unit, and the second imaging unit integrally in a horizontal direction;
The control unit of the mounting apparatus acquires an image by causing the first imaging unit to capture an image of the jig component placed at a predetermined position in the mounting apparatus from the upper side, and based on the acquired image, the jig Recognizing the position of the component, the mounting head is moved in the horizontal direction by a predetermined distance by the moving mechanism, the jig component is sucked by the specific nozzle, and the jig component sucked by the specific nozzle is The second imaging unit captures an image from the lower side, acquires an image, calculates a shift amount of the chucking position of the jig component with respect to the specific nozzle based on the acquired image, and moves the mounting head A mounting system that recognizes the position of the reference point based on the distance and the amount of deviation of the suction position.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Electronic component 3 ... Control part 18 ... Board | substrate camera 19 ... Component camera 30 ... Mounting head 33b ... Adsorption nozzle 100 ... Mounting system 103 ... Mounting apparatus 108, 109 ... Calibration apparatus

Claims (11)

At the reference point and the mounting head to have a plurality of nozzles, a control unit for measuring the relative position in the horizontal direction of the plurality of nozzles relative to the reference point, disposed outside the production line for producing the substrate Calibration device,
A mounting apparatus main body to which the mounting head is attached, and a position of the reference point in the horizontal direction in the mounting apparatus main body is measured in a state in which the mounting head is attached to the mounting apparatus main body. A control unit for recognizing the positions of the plurality of nozzles in the mounting apparatus main body in the horizontal direction based on the information on the position of the reference point and the information on the relative position on the production line. ; and a deployed mounting apparatus,
The mounting system, wherein the mounting head is a mounting head that has not yet been attached to the mounting apparatus . The mounting system according to claim 1,
The controller of the calibration device lowers the plurality of nozzles by a predetermined distance in the height direction and measures the positions in the horizontal direction at the tip portions of the plurality of nozzles, thereby determining the relative positions. Mounting system to measure. The mounting system according to claim 2,
The control unit of the calibration device lowers the plurality of nozzles by a predetermined distance and measures the horizontal position at the tip of each of the plurality of nozzles. A mounting system that measures the relative position at each descending distance by repeating a plurality of different times. The mounting system according to claim 2,
The mounting apparatus has a moving mechanism for moving the mounting head in the height direction,
The controller of the mounting apparatus is configured such that the descending distance when the electronic component is mounted on the substrate by the plurality of nozzles is the same distance as the distance by which the plurality of nozzles are lowered in the calibration apparatus. A mounting system that controls the moving mechanism to adjust the height of the mounting head. The mounting system according to claim 1,
The calibration device further includes an imaging unit that is disposed at a position below the mounting head in the height direction and images the reference point and the plurality of nozzles from below.
The control unit of the calibration apparatus measures the relative position by causing the imaging unit to image the reference point and the plurality of nozzles. The mounting system according to claim 1,
The calibration device
A first imaging unit that images a jig component placed at a predetermined position in the calibration device from above;
A second imaging unit that images the jig component fixed to the mounting head and sucked by the nozzle from below;
A moving mechanism that integrally moves the mounting head, the first imaging unit, and the second imaging unit in a horizontal direction;
The control unit of the calibration device acquires an image by causing the first imaging unit to image a jig component placed at a predetermined position in the calibration device from above, and based on the acquired image, The position of the jig component is recognized, the mounting head is moved in the horizontal direction by a predetermined distance by the moving mechanism, the jig component is sucked by the nozzle, and the jig component sucked by the nozzle is moved to the second position. An image is taken by the imaging unit from the lower side, an image is obtained, a displacement amount of the suction position of the jig component with respect to the nozzle is calculated based on the obtained image, the distance the mounting head is moved, and the The relative position is measured by executing the process of measuring the position of the nozzle in the horizontal direction on the basis of the amount of displacement of the suction position with each of the plurality of nozzles. Stem. The mounting system according to claim 1,
The mounting apparatus further includes an imaging unit that is disposed at a position below the mounting head in the height direction and images the reference point from below.
The control unit of the mounting apparatus measures the position of the reference point by causing the imaging unit to image the reference point. The mounting system according to claim 1,
The reference point is set at a position of a specific nozzle among the plurality of nozzles in the mounting head,
The mounting apparatus is:
A first imaging unit that images a jig component placed at a predetermined position in the mounting apparatus from above;
A second imaging unit that images the jig component fixed to the mounting head and sucked by the nozzle from below;
A moving mechanism that moves the mounting head, the first imaging unit, and the second imaging unit integrally in a horizontal direction;
The control unit of the mounting apparatus acquires an image by causing the first imaging unit to capture an image of the jig component placed at a predetermined position in the mounting apparatus from the upper side, and based on the acquired image, the jig Recognizing the position of the component, the mounting head is moved in the horizontal direction by a predetermined distance by the moving mechanism, the jig component is sucked by the specific nozzle, and the jig component sucked by the specific nozzle is The second imaging unit captures an image from the lower side, acquires an image, calculates a shift amount of the chucking position of the jig component with respect to the specific nozzle based on the acquired image, and moves the mounting head A mounting system that recognizes the position of the reference point based on the distance and the amount of deviation of the suction position. Calibration apparatus disposed outside the production line for producing the substrate, in the mounting head to have a reference point and a plurality of nozzles, measuring the relative position in the horizontal direction of the plurality of nozzles relative to the reference point ,
The mounting device disposed on the production line measures the position in the horizontal direction of the reference point in the mounting device body, with the mounting head attached to the mounting device body of the mounting device, Based on the information on the position of the reference point in the mounting apparatus main body and the information on the relative position, the position in the horizontal direction of the plurality of nozzles in the mounting apparatus main body is recognized ,
The calibration method , wherein the mounting head is a mounting head that has not yet been attached to the mounting apparatus . To the calibration device arranged outside the production line for producing substrates,
At the reference point and the mounting head to have a plurality of nozzles, to execute the steps of measuring the relative position in the horizontal direction of the plurality of nozzles relative to the reference point,
In the mounting device arranged on the production line,
With the mounting head attached to the mounting apparatus body of the mounting apparatus, measure the position of the reference point in the horizontal direction in the mounting apparatus body, and information on the position of the reference point in the mounting apparatus body And recognizing the position of the plurality of nozzles in the horizontal direction in the mounting apparatus main body based on the relative position information ,
The mounting head is a program that is a mounting head that has not been attached to the mounting apparatus . A calibration device placed outside the production line for producing substrates
At the reference point and the mounting head to have a plurality of nozzles, measuring the relative position in the horizontal direction of the plurality of nozzles relative to the reference point,
A mounting device arranged on the production line is
With the mounting head attached to the mounting apparatus body of the mounting apparatus, measure the position of the reference point in the horizontal direction in the mounting apparatus body, and information on the position of the reference point in the mounting apparatus body , Based on the information of the relative position, to recognize the horizontal position of the plurality of nozzles in the mounting apparatus body ,
The calibration method , wherein the mounting head is a mounting head that has not yet been attached to the mounting apparatus .