JP2004247768A - Device for mounting electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for mounting electronic components capable of shortening a cycle time in mounting a plurality of kinds of electronic components on a substrate. <P>SOLUTION: The device for mounting electronic parts is provided with component supply units 4, 5 and 6 for supplying the plurality of the kinds of the electronic components S, part attachment units 9, 10 for suctioning the electronic components from the component supply unit of interest and also attaching the suctioned electronic components to a substrate, and XY conveyer units 7, 8 for transporting the part attachment unit of interest between suction and attachment positions. The component attachment units 9, 10 are provided with attachment heads 31 on which a plurality of suction nozzles 41 are mounted as corresponding to the plural kinds of the electronic components, and a replacement mechanism 33, 34, 36 for selectively replacing at least one of the plurality of suction nozzles. The replacement mechanism is structured to allow replacement of the suction nozzles 41 when the component attachment units 9, 10 are on the way of transportation of the XY conveyer units 7, 8. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a multifunctional electronic component mounting apparatus that mounts various supplied electronic components on a substrate.

  An electronic component mounting apparatus of this type is known, for example, from Patent Document 1. The electronic component mounting apparatus includes a suction nozzle for sucking an electronic component, a mounting head on which the suction nozzle is mounted, an elevating device for raising and lowering the suction nozzle, and moving the mounting head in an X-axis direction and a Y-axis direction in a horizontal plane. An XY stage is provided. Further, the electronic component mounting device includes a nozzle stocker, and a plurality of types of suction nozzles are stocked in the nozzle stocker so as to match various electronic components handled by the device. In this case, one suction nozzle is mounted on the mounting head, and in the nozzle stocker, the suction nozzle can be appropriately replaced to correspond to the electronic component.

  FIG. 11 schematically illustrates the operation of the electronic component mounting apparatus configured as described above. In the figure, the electronic component sucked at the point “A” of the component supply unit 101 is mounted on the “A” point of the board 102, and the electronic component sucked at the point “B” of the component supply unit 101 is The case where the camera is attached to the point “a” is shown. In this case, first, the mounting head 104 is moved from the home position to a position immediately above the point "A" by the XY stage 103, and then the suction nozzle is moved down by the lifting device 105 to suck the electronic component at the point "A". After the electronic component is sucked, the suction nozzle is raised by the lifting device 105, and the mounting head 104 is moved from the “A” point to a position immediately above the “A” point by the XY stage 103. Then, the suction nozzle is lowered again, and the electronic component is mounted at the point "A".

  Next, returning to the point "B", the electronic component sucked at the point "B" is mounted on the point "A" of the substrate 102. At this time, the electronic component at the point "B" can be handled by the same suction nozzle. In such a case, the mounting of the electronic component is performed in a similar procedure. However, when the electronic component at the point “B” cannot be handled by the same suction nozzle, the mounting head 104 is once exposed to the nozzle stocker 106, the suction nozzle is replaced, and then the mounting head 104 is moved to the point “B”. And the same mounting operation as described above is performed.

  On the other hand, Patent Document 2 (rotary type electronic component mounting apparatus) describes a mounting head on which a plurality of suction nozzles are mounted. A plurality of suction nozzles arranged at equal intervals in the circumferential direction are respectively attached to the mounting head so as to be able to protrude and retract, and revolvably around the vertical axis as a whole. Each of the suction nozzles is urged in a protruding direction by a coil spring, and an engagement piece for holding the suction nozzle at a retracted position is provided above each of the suction nozzles. The engaging piece is rotatable between a position engaging with the suction nozzle and a position preventing (releasing) the engagement, and is urged in the engaging direction by a spring.

That is, when each suction nozzle is retracted against the coil spring, the engaging piece is engaged and held at the retracted position. Conversely, when the engaging piece is disengaged, the coil It is projected by a spring to be in a projected state. Therefore, when replacing the suction nozzle, it is necessary to lower the mounting head to bring the suction nozzle into contact with the flat abutment table, to immerse all the suction nozzles once, and then to raise the mounting head. The engagement between the suction nozzle to be engaged and the corresponding engagement piece is prevented by an arm extending from the apparatus main body.
JP-A-4-35095 JP-A-5-226888

  However, in such a conventional electronic component mounting apparatus, as the number of types of electronic components mounted on one board increases, the frequency of replacement of the suction nozzle increases. That is, the frequency of the mounting head 104 passing through the nozzle stocker 106 and exchanging the suction nozzle in the nozzle stocker 106 increases. In particular, the replacement operation of the suction nozzle involves a movement of the mounting head 104 between the detachment of the suction nozzle and the mounting of a new suction nozzle. There was a problem that the time was long.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus capable of shortening a tact time in mounting a plurality of types of electronic components on a substrate.

  Therefore, a first aspect of the present invention provides a component supply unit that supplies a plurality of types of electronic components, a component mounting unit that sucks electronic components from the component supply unit and mounts the sucked electronic components on a substrate, And an XY transport unit for moving the electronic component between a suction position and a mounting position, wherein the component mounting unit includes a mounting head having a plurality of suction nozzles corresponding to a plurality of types of electronic components. A replacement mechanism for selectively replacing at least one of the plurality of suction nozzles, wherein the replacement mechanism replaces the suction nozzle during movement of the component suction unit by the XY transport unit. It is characterized in that it is configured to be possible.

  According to a second invention, in the first invention, a plurality of the mounting heads are mounted on the component mounting section.

  In a third aspect based on the first or second aspect, in the replacement of the suction nozzle by the replacement mechanism, the suction nozzle that is already selected is pulled up, and the suction nozzle that is newly selected is projected downward. It is characterized by being performed.

  In a fourth aspect based on the fourth aspect, the mounting head is a nozzle holder in which the plurality of suction nozzles are arranged in a ring around a vertical axis, A motor for rotating the nozzle holder about the vertical axis.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the component suction unit further includes an elevating unit for elevating the mounting head, wherein the elevating unit is based on a lower surface of each electronic component. The mounting head is raised and lowered.

  In a sixth aspect based on the second aspect, the component supply section supplies the plurality of electronic components simultaneously and linearly and at equal intervals so as to be able to attract the plurality of electronic components, and the plurality of mounting heads include the plurality of electronic components. The plurality of mounting heads are arranged in parallel with the component, and the arrangement pitch of the plurality of mounting heads is an integral multiple of the arrangement pitch of the plurality of electronic components.

  In a seventh aspect based on the sixth aspect, each of the mounting heads comprises a nozzle holder in which the plurality of suction nozzles are arranged in a ring around a vertical axis, and rotates the nozzle holder about the vertical axis. A rotation diameter of the suction nozzle is greater than or equal to a pitch at which the plurality of electronic components are arranged.

  According to an eighth aspect of the present invention, there is provided a component supply unit that supplies an electronic component, a component mounting unit that sucks the electronic component from the component supply unit and mounts the sucked electronic component on a substrate, and a suction position. An XY transfer unit that moves between the mounting position and the mounting position, wherein the component mounting unit has a plurality of mounting heads, and at least one mounting head of the plurality of mounting heads is The suction nozzle is mounted so as to revolve around a vertical axis.

  According to the first aspect of the present invention, the frequency of attachment / detachment (replacement) of the suction nozzle, that is, the frequency of the mounting head passing through the nozzle stocker can be minimized, and the selection of the suction nozzle during the movement of the component suction unit. The replacement time can be reduced, so that the work time required for replacing the suction nozzle can be extremely shortened, and the tact time for mounting electronic components can be significantly reduced.

  According to the second aspect of the present invention, since a plurality of mounting heads are mounted on the component mounting section, the frequency of attaching and detaching (replacement) of the suction nozzle can be further reduced. Also, if the electronic component is attracted to as many (preferably all) of the mounting heads as possible in the component supply unit, the number of movements by the XY transport unit is extremely reduced as compared with the number of mounted electronic components. Accordingly, the takt time for mounting electronic components can be shortened as a whole.

  According to the third aspect of the present invention, the suction nozzle can be selectively replaced by up and down movement, which causes trouble such as interference of the suction nozzle with other components when moving the mounting head. In addition, the suction nozzle can be replaced (selected) easily and in a short time. In addition, the entire mounting head can be moved up and down by using a mechanism for moving the suction nozzle up and down.

  According to the invention of claim 4, since the mounting head alone can revolve the plurality of suction nozzles by the motor and the nozzle holder incorporated therein, the actual electronic component can be picked up when the electronic component is sucked. , It is possible to finely correct the position of the suction nozzle. Further, this revolution can be used for selective replacement of the suction nozzle.

  According to the fifth aspect of the present invention, since the electronic component is raised and lowered with reference to the lower surface of the electronic component, the level of the lower surface is always constant even for electronic components having different thicknesses, and the component recognition by the camera is performed. Can be performed accurately.

  According to the invention according to claim 6, a plurality of electronic components that can be sucked and a plurality of mounting heads that suck the electronic components face each other in parallel with each other and have the same arrangement pitch. A plurality of electronic components can be simultaneously sucked by the mounting head. In the simultaneous suction, the electronic components required on the substrate side and the electronic components on the component supply unit side need to be aligned. However, if the opportunity of simultaneous suction increases, the tact time can be shortened accordingly.

  According to the invention of claim 7, the one mounting head orbits its suction nozzle so that it is possible to select and suck one of the two electronic components. For this reason, the opportunity of the above-mentioned simultaneous adsorption can be further increased.

  According to the eighth aspect of the present invention, the frequency of attaching and detaching (replacement) of the suction nozzle can be reduced, and the position correction and the simultaneous suction of the electronic components at the time of sucking the electronic components can be performed. Tact time for component mounting can be shortened.

  Hereinafter, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. This electronic component mounting apparatus is a so-called multifunctional chip mounter, and is configured to be able to mount various electronic components such as surface mount components such as chip capacitors and chip resistors, and multi-lead components such as flat pack ICs. FIG. 1 is a plan view of the electronic component mounting apparatus. As shown in FIG. 1, the electronic component mounting apparatus 1 includes a machine base 2, a conveyor unit 3 extending in the front-rear direction at the center of the machine base 2, A first component supply unit 4 disposed at the left end (lower side of the drawing) of the machine base 2, a second component supply unit 5 and a third component supply unit 6 arranged side by side at the right end of the machine base 2; A first XY stage 7 provided on the left side of the machine base 2 and a second XY stage 8 provided on the right side of the machine base 2.

  The first XY stage 7 has a first head unit 9 for adsorbing and mounting the electronic component S, and the second XY stage 8 has a second head unit 10. A pair of left and right component recognition cameras 11 and 11 are disposed on the machine base 2 with the conveyor unit 3 interposed therebetween, and nozzle stockers 12 and 12 are disposed before and after the left component recognition camera 11, respectively. Have been. In this case, the component recognition camera 11 on the left corresponds to the first head unit 9, and the component recognition camera 11 on the right corresponds to the second head unit 10. These component recognition cameras 11 and 11 are for recognizing the electronic components S sucked by the respective head units 9 and 10. Whether the electronic components S are sucked or not is determined by the horizontal plane of the electronic components S prior to mounting. To correct angles and the like in the inside. Each nozzle stocker 12 stocks various kinds of suction nozzles 41 so that the suction nozzles (described below) 41 of the head units 9 and 10 can be replaced when the type of the substrate T changes. It is. The two nozzle stockers 12, 12 may be provided at line-symmetrical positions or point-symmetrical positions with the conveyor section 3 interposed therebetween. In such a case, the first and second head units 9, 10 may be provided. Nozzle replacement can be performed simultaneously.

  In the electronic component mounting apparatus 1, a small electronic component S such as a surface mount component is supplied from the first component supply unit 4 and the second component supply unit 5, and a large electronic component S such as a multi-lead component is supplied to the third component supply unit. Supplied from the unit 6. The substrate T is supplied from the rear by the conveyor unit 3 and discharged to the front. For example, in mounting the electronic component S using the first XY stage 7, the first XY stage 7 allows the first head unit 9 to face any of the first, second, and third component supply units 4, 5, and 6, A desired electronic component S is sucked, and the first head unit 9 is further moved to a predetermined position on the substrate T, and is mounted on the substrate T. Note that the first XY stage 7 and the second XY stage 8 are operated alternately for each substrate T.

  The conveyor section 3 has a set table 14 at the center, a carry-in transport path 15 on the rear side, and a carry-out transport path 16 on the front side. The substrate T is supplied from the carry-in path 15 to the set table 14, and is immovably set at a predetermined height so that the electronic component S can be mounted on the set table 14. Then, the substrate T on which the mounting of the electronic component S is completed is discharged from the set table 14 via the unloading conveyance path 16. In this case, there is a substrate T in a supply standby state in the carry-in transport path 15 and a substrate T in a discharge standby state in the carry-out transport path 16 (not shown), and these substrates T are transported sequentially.

  Each of the first component supply unit 4 and the second component supply unit 5 has a large number of tape cassettes 18 arranged side by side. Each of the tape cassettes 18 accommodates electronic components S in a state of being loaded on a carrier tape (not shown), and the electronic components S are supplied one by one from the leading end of the tape cassette 18. The third component supply unit 6 has a number of shelves 20 and two trays 21 placed on each of the shelves, and the electronic components S are accommodated in the trays 21 in an aligned state. In this case, the electronic component S is drawn out to the vicinity of the conveyor unit 3 together with the shelf board 20 and the tray 21 by a transport device (not shown), and is sucked at this position.

  The first XY stage 7 and the second XY stage 8 are guided by a pair of guide rails 23 provided on both front and rear ends of the machine base 2 and move in the left-right direction (X-axis direction). Respectively. The X motion block 24 of the first XY stage 7 is screwed into a front ball screw 25, and the front ball screw 25 is rotated forward and reverse via a front motor 26, so that the X axis direction ( (Left / right direction). Similarly, the X motion block 24 of the second XY stage 8 is screwed into the ball screw 27 at the rear, and moves forward and backward in the X-axis direction by forward and reverse rotation of the ball screw 27 at the rear via the motor 28 at the rear. .

  On the other hand, both X-movement blocks 24 are exactly the same, and each incorporates a Y-movement unit 29. Each of the head units 9 and 10 is attached to each of the Y moving units 29. When the Y moving unit 29 operates, the head units 9 and 10 move forward and backward in the Y-axis direction (front-back direction). Thus, each head unit 9, 10 is movable in the X-axis direction and the Y-axis direction, that is, in the horizontal plane. The Y-movement unit 29 may have a structure including a screw mechanism using a ball screw or the like and a motor for rotating the screw mechanism, or may have a structure using a linear motor. Similarly, a linear motor can be used for the movement of the X motion block 24.

  Each of the head units 9 and 10 includes a support frame 30 attached to the Y motion unit 29, four mounting heads 31, 31, 31 and 31 attached to the support frame 30, and one board recognition camera 32. It has. The four mounting heads 31, 31, 31, 31 and one substrate recognition camera 32 are arranged side by side at equal intervals in the front-rear direction, and these are collectively mounted on the support frame 30. The board recognition camera 32 recognizes a reference mark on each board T, and the reference mark serves as a reference for the mounting position of the electronic component S. The position of the electronic component S sucked from the tape cassette 18 may be recognized using the board recognition camera 32 (details will be described later).

  As shown in FIG. 2, each mounting head 31 includes a nozzle holder 42 having five (only two shown) suction nozzles 41 mounted at equal intervals in the circumferential direction and capable of protruding and retracting downward, and a nozzle holder. The housing 43 includes a housing 43 provided so as to surround the suction nozzle 42, five engagement hooks 44 that engage with each suction nozzle 41, and a hook holder 45 that holds the five engagement hooks 44. The nozzle holder 42 includes a holder main body 46 and a spline shaft 47 extending upward from the holder main body 46, and the center of the holder main body 46 and the spline shaft 47 is provided with air connected to a vacuum suction device. A passage 48 is formed. The end of the air passage 48 is configured to communicate only with the protruding suction nozzle 41.

  On the other hand, a pulse motor PM having the nozzle holder 42 as a rotor and the housing 43 as a stator is formed between the nozzle holder 42 and the housing 43. Therefore, the nozzle holder 42 rotates by a predetermined angle with respect to the housing 43 according to the number of steps of the input pulse signal. Thus, the protruding suction nozzle 41 or the suction nozzle 41 to be protruded can be rotated to a desired position.

  Note that, instead of the pulse motor PM, a servomotor in which the suction nozzle 41 is similarly mounted on the rotor so as to be able to move up and down may be used.

  As described above, since the suction nozzle 41 is mounted in the nozzle holder 42 which is a rotor, the suction nozzle 41 is compared with a case where the spline shaft 47 is rotated by a motor provided at another portion of the head units 9 and 10 via a belt or the like. As a result, the nozzle holder 42, that is, the suction nozzle 41 can be rotated with high precision by an angle corresponding to a command to the pulse motor PM with little backlash or the like. Further, there is an advantage that the overall weight of the head units 9 and 10 is not increased and a compact structure is obtained, and this advantage increases as the number of heads 31 attached to the head units 9 and 10 increases.

  Each suction nozzle 41 includes a nozzle body 49 and a hook receiving member 50 provided at an upper end portion of the nozzle body 49. The nozzle body 49 is detachably attached to the hook receiving member 50. A guide pin 51 extending from the hook holder 45 passes through the hook receiving member 50. A coil spring 52 is attached to the guide pin 51 so as to be wound, and the suction nozzle 41 is urged by the coil spring 52 in a projecting direction (downward). The guide pin 51 is fixedly attached to the holder main body 46, is inserted into a hole (not shown) formed in the hook holder 45, and comes into sliding contact with the hole as the holder main body 46 moves up and down. An engaging portion 50a protrudes outward from the upper end of the hook receiving member 50, and the engaging hook 44 is engaged with and disengaged from the engaging portion 50a. The engaging hook 44 is rotatably attached to the hook holder 45 and is urged in the engaging direction by an engaging spring 53 passed between the hook holder 45 and the hook.

  Therefore, when the suction nozzle 41 is moved upward against the coil spring 52, the engagement hook 44 is engaged with the hook receiving member 50 by the engagement spring 53, and the suction nozzle 41 is immersed in the nozzle holder 42. Become. In this state, when the engaging hook 44 is rotated against the engaging spring 53 to be disengaged from the hook receiving member 50, the suction nozzle 41 is moved downward by the coil spring 52, and the suction nozzle 41 is projected from the nozzle holder 42. Become. The hook holder 45 and the spline shaft 47 of the nozzle holder 42 are in spline engagement, and the hook holder 45 rotates with the rotation of the spline shaft 47 and is slidably engaged with the spline shaft 47 in the axial direction. I agree.

  Next, referring to FIG. 3, a description will be given of a selective replacement operation of the five suction nozzles 41 in the mounting head 31 configured as described above. In this replacement operation, the one suction nozzle 41 that has already protruded is immersed, and the selected one suction nozzle 41 is protruded. As shown in the figure, the support frame 30 is provided with an actuator unit 33 corresponding to the mounting head 31, and a holding arm 34 is provided above the actuator unit 33. The mounting head 31 is fixed to the support block 35 of the actuator unit 33 at a portion of the housing 43, and its upward movement is restricted by a holding arm 34 at a portion of the hook holder 45. The holding arm 34 has a bifurcated tip, and a roller 34a is attached to each of the tips. That is, the holding arm 34 is in contact with the hook holder 45 while allowing the rotation of the hook holder 45.

  A linear motor (not shown) is built in the actuator unit 33, and the mounting head 31 is moved up and down (Z-axis direction) by the actuator unit 33. The support block 35 is provided with an engagement prevention member 36 for rotating the engagement hook 44 and detaching the engagement hook 44 from the hook receiving member 50 (blocking the engagement). When the actuator unit 33 is driven to move up and down, the nozzle holder 42 moves up and down with respect to the hook holder 45 because the hook holder 45 is pressed from above by the pressing arm 34. That is, the mounting head device is constituted by the mounting head 31, the actuator unit 33, the holding arm 34 and the engagement preventing member 36, and the exchange mechanism is constituted by the actuator unit 33, the holding arm 34 and the engagement preventing member 36. I have.

  FIG. 3 shows an operation of immersing the suction nozzle 41 on the left side in the drawing and projecting the suction nozzle 41 on the right side in the drawing. Specifically, from the state where the left suction nozzle 41 is already selected (projected) and the other four suction nozzles 41 are immersed, the left suction nozzle 41 is immersed and the other four suction nozzles 41 are immersed. The operation of projecting one suction nozzle (the right suction nozzle 41) 41 to be selected from the suction nozzle 41 is shown.

  As shown in FIG. 7A, first, the nozzle holder 42 and the hook holder 45 are moved so that the suction nozzle 41 to be selected and the corresponding engagement hook 44 face the position of the engagement prevention member 36 described above. Rotate. Next, the actuator unit 33 is driven upward to bring the nozzle holder 42 closer to the hook holder 45. Then, the engagement hook 44 on the left side of the hook holder 45 on the hook holder 45 side rotates once clockwise on the hook receiving member 50 on the nozzle holder 42 side and crosses the engagement portion 5a, and then counterclockwise. When the actuator unit 33 is rotated and engaged, the actuator unit 33 is stopped. In this state, only the engagement hook 44 corresponding to the suction nozzle 41 to be selected is rotated by the engagement prevention member 36 so as to be separated from the hook receiving member 50 (see FIG. 2B). Next, the actuator unit 33 is driven downward to separate the nozzle holder 42 from the hook holder 45. In this state, the suction nozzle 41 to be selected descends while the engagement hook 44 is not engaged, and the other suction nozzles 41 are engaged with the engagement hook 44 and are prevented from descending. That is, only the right suction nozzle 41 is protruded by the urging force of the coil spring 52 (see FIG. 3C).

  In this manner, the suction nozzle 41 is selectively replaced by the cooperation of the mounting head 31, the actuator unit 33, the holding arm 34, and the engagement preventing member 36. Therefore, even when the head units 9, 10 are moving, the suction nozzle 41 is not moved. 41 can be exchanged. In this embodiment, five suction nozzles 41 are mounted on one mounting head 31. However, as long as the head units 9 and 10 have a plurality of mounting heads 31, at least one mounting head 31 is provided. The suction nozzle 41 to be mounted may have a single structure. Conversely, as long as a plurality of suction nozzles 41 are mounted on the mounting head 31, the number of mounting heads 31 of the head units 9 and 10 may be one.

  Incidentally, although not shown, a stopper is provided on the spline shaft 47 of the nozzle holder 42, and the hook holder 45 does not move further upward with respect to the nozzle holder 42 from the state shown in FIGS. 3A and 3C. The position of the mounting head 31 in FIG. 3 is a position when the suction nozzle 41 is selected (replaced), and when the electronic component S is suctioned and mounted, the entire mounting head 31 is further lowered. That is, in each of the mounting heads 31, the suction nozzles 41 are exchanged (selected) by the XY stages 7 and 8 at a position higher than a reference level when the electronic components S are moved for mounting on the substrate T after being sucked. Is performed.

  Therefore, the hook 44 does not engage with the engagement preventing member 36 except for the operation of replacing the suction nozzle 41, and the influence is also exerted when the nozzle holder 42 rotates about the vertical axis for the angular positioning of the member S. Not receive.

  On the other hand, the reference level L is set with reference to the lower surface of each electronic component S as shown in FIG. That is, even the electronic components S having different thicknesses are moved by the XY stages 7 and 8 after the lower surface thereof is raised to a position where the lower surface reaches the reference level L after being sucked. For this reason, even when approaching each component recognition camera 11, the position of the lower surface of the electronic component S is always constant, and the depth of focus of the component recognition camera 11 does not matter, and the component recognition camera 11 Can be captured in a clear image. Further, the camera 11 is installed at a height position lower than the height position of the upper surface of the substrate T by the reference level L, and the electronic component S shown in FIG. The lower surface of S is carried out at the same height level as that at the time of mounting, so that there is no horizontal displacement due to the difference in the height level of the suction nozzle 41 between recognition and mounting.

  Further, after the camera 11 recognizes the component S, the suction nozzle 41 interferes with a structure (a fixing member of the substrate T, etc.) in the apparatus or an electronic component S (pre-attached component) mounted earlier on the substrate T. It is raised by the actuator unit 33 to a height that can be avoided, and is lowered at the position where it should be mounted, and mounting is performed. In this case, since the actuator unit 33 is provided for each mounting head 31, the ascending position is adjusted for each mounting head 31. For this reason, the electronic components S sucked by the suction nozzles 41 of any of the mounting heads 31 do not collide with the pre-installed components S and the like. it can. Therefore, the downward stroke of the mounting head 31 during mounting can be shortened, and the time required for mounting can be shortened.

  Next, a basic operation of the electronic component mounting apparatus 1 will be described with reference to FIG. The figure shows an example in which the electronic component S is picked up from the second component supply unit 5 and mounted on the substrate T. In this case, the CPU (not shown) stores the position of each tape cassette 18, the type of the electronic component S of each tape cassette 18, the position of the substrate T, the various electronic components S mounted on the substrate T, and their positions (angle positions). The rotation of the XY stages 7, 8, the actuator unit 33, the nozzle holder 42 (the pulse motor PM), and the like are controlled based on the instructions of the CPU. The step of recognizing the electronic component S by the component recognition camera 11 is omitted. In FIG. 5, only one mounting head 31 and one suction nozzle 41 are shown, and the others are omitted.

  In the figure, the electronic component S sucked at the “A” point of the second component supply unit 5 is mounted on the “A” point of the board T set on the set table 14, and then the electronic component S of the second component supply unit 5 This shows a case where the electronic component S sucked at the point “B” is mounted at the point “A” of the substrate T. In this case, first, the mounting head 31 is moved from the home position to a position immediately above the point "A" by the XY stage (any one) 7 and 8, and then the mounting head 31 is lowered by the actuator unit 33 so that the point "A" Of the electronic component S. When the electronic component S is sucked, the mounting head 31 is raised (to the reference level L) by the actuator unit 33, and the mounting head 31 is moved from the "A" point to a position immediately above the "A" point by the XY stages 7 and 8. Move. During this time, the nozzle holder 42 (pulse motor PM) rotates so as to be at an angular position to be mounted. Then, the mounting head 31 is lowered again to mount the electronic component S at the point "A".

  Next, returning to the point "B", the electronic component S sucked at the point "B" is mounted on the point "A" on the substrate T. At this time, the electronic component S at the point "B" is attached to the same suction nozzle 41. If the electronic component S can be handled by the electronic component S, the electronic component S is mounted in the same procedure. However, when the electronic component S at the point "B" cannot be handled by the same suction nozzle 41, the nozzle holder 42 of the mounting head 31 is moved while the mounting head 31 moves from the point "A" to the point "B". By rotating the suction nozzle 41, the selection (replacement) operation of the suction nozzle 41 is performed. Then, when the mounting head 31 moves to the point "B", the new suction nozzle 41 performs the suction operation, and further moves to the point "A" to rotate and adjust the angle of the electronic component S as described above. To perform the mounting operation.

  In these operations, for the four mounting heads 31, the electronic components S are successively sucked in the respective component supply units 4, 5, and 6 (at the same time, if the conditions are satisfied as described later). Then, the head unit 9 or 10 moves to the substrate T and sequentially mounts the sucked electronic components S. At this time, the next suction after the mounting of the electronic component S is performed so that as many mounting heads 31 in the head units 9 and 10 can suck the electronic components S as possible (preferably, all the mounting heads 31 are suctioned). The nozzle 41 is replaced in each of the mounting heads 31 by the rotation of the pulse motor PM during the movement up to (the details will be described later).

  Because of this operation, a plurality of mounting heads 31 are attached to the head units 9 and 10 that move in the X and Y directions. When the suction nozzles 41 of the mounting heads 31 are replaced, the head units 9 and 10 perform predetermined operations. If the suction nozzle 41 is moved to the nozzle stocker 12, there is a mounting head 31 that needs to replace the suction nozzle 41 but there is also a mounting head 31 that does not need to be replaced. When the units 9 and 10 are moved to the nozzle stocker 12, the units 9 and 10 also move to the nozzle stocker 12 together with the mounting head 31 that does not need to be replaced. When the number is small, such as one 31). If the nozzles are not replaced as they are, the advantage that there are many mounting heads 31 cannot be used (especially when the number of mounting heads 31 that require nozzle replacement is large). However, as in the present embodiment, the plurality of suction nozzles 41 are mounted on the plurality of mounting heads 31 in the single head units 9 and 10, respectively, and the plurality of suction nozzles 41 are moving while the head units 9 and 10 are moving. The number of cases in which the nozzle stocker 12 as described above is used is reduced, and the suction of the electronic component S is performed using all the mounting heads 31 provided in the head units 9 and 10. More cases can be done.

  The combination (type) of the various suction nozzles 41 attached to the respective mounting heads 31 in the head units 9 and 10 is arbitrary, but the combination of the suction nozzles 41 of all the mounting heads 31 may be the same. Further, the combination of the suction nozzles 41 may be different for each mounting head 31. In order to adsorb as many types of electronic components S as possible, and to make it possible to replace as many types of suction nozzles 41 as possible while the head units 9 and 10 are moving, different types of suction nozzles over a plurality of mounting heads 31 are used. 41 may be attached. If there are a large number of electronic components S that can be sucked by the same suction nozzle 41 on the substrate T to be mounted, such suction nozzles 41 are connected to as many mounting heads in the same head units 9 and 10 as possible. If the head units 9 and 10 are attached one by one, the electronic components S can be sucked and taken out at a time when the head units 9 and 10 are moved once, so that the mounting head 31 is not used when possible. In such a case, by arranging the tape cassettes 18 for supplying such electronic components S by the number of the mounting heads 31 to which the corresponding suction nozzles 41 are attached so that simultaneous suction is possible, Simultaneous suction or similar to the simultaneous suction, the moving distance of the head units 9 and 10 is short and the electronic components S can be continuously suctioned.

  Next, the position correction of the mounting head (suction nozzle 41) 31 when sucking the electronic component S will be described with reference to FIGS. For example, the tape cassette 18 sucks the electronic component S loaded in the groove of the carrier tape. In such a case, the CPU positions the suction nozzle 41 at a position where the center of the groove will face. For this reason, there is a possibility that a suction error may occur due to a slight deviation of the feed of the carrier tape, the position of the electronic component S in the groove, the shape of the electronic component S, and the like. Therefore, in the present embodiment, the position of the suction nozzle 41 can be corrected when the electronic component S is sucked. The position of the electronic component S to be picked up is recognized by feeding back the recognition result of the component recognition camera 11, but can also be performed by the board recognition camera 32 mounted on the support frame 30 or the like. .

  FIG. 6 shows a case where the electronic component S easily shifts in the front-rear direction with respect to the tape cassette 18 due to the shape of the electronic component S or the like. That is, if the size of the electronic component S in the tape feeding direction is short, a suction error is likely to occur if the suction nozzle 41 is shifted, so that the position of the suction nozzle 41 in this direction needs to be accurately corrected. As shown in FIG. 3B, when the electronic component S is displaced backward from the predetermined position, the mounting head (nozzle holder 42) 31 is slightly counterclockwise rotated from the state of FIG. , The position of the suction nozzle 41 is corrected. When the electronic component S is displaced forward from a predetermined position as shown in FIG. 3C, the mounting head 31 is slightly rotated clockwise from the state shown in FIG. Then, the position of the suction nozzle 41 is corrected.

  If only one mounting head 31 is attached to the head units 9 and 10, these correction operations can be corrected only by moving the XY stages 7 and 8, and are not particularly necessary. In the case where 31 is attached to the head units 9 and 10, it is useful because the number of cases where simultaneous suction is possible increases as described later.

  Similarly, FIG. 7 shows a case where the electronic component S easily shifts in the left-right direction with respect to the tape cassette 18 due to the shape of the electronic component S or the like. As shown in FIG. 6B, when the electronic component S is shifted to the left from the predetermined position, the mounting head (nozzle holder 42) 31 is slightly counterclockwise moved from the state of FIG. , The position of the suction nozzle 41 is corrected. When the electronic component S is displaced rightward from a predetermined position as shown in FIG. 3C, the mounting head 31 is rotated slightly clockwise from the state shown in FIG. Then, the position of the suction nozzle 41 is corrected.

  Even when only one suction nozzle 41 is attached to the mounting head 31, such a correction operation is performed if the suction nozzle 41 is mounted at a position (revolution position) apart from the rotation center of the mounting head 31. It is possible to do.

  As described above, since the position of the suction nozzle 41 is corrected by rotating the mounting head 31 by the pulse motor PM incorporated in the mounting head 31, the electronic component S can be suctioned at the central portion. In addition, it is possible to minimize the suction error of the electronic component S.

  Next, with reference to FIG. 8, a description will be given of a unique electronic component S suction method according to the present embodiment. As described above, each of the XY stages 7 and 8 has four mounting heads 31 mounted thereon. Therefore, the electronic components S can be simultaneously sucked from the component supply units 4, 5, and 6 using the plurality of mounting heads 31. Further, even if a plurality of electronic components S are not sucked at the same time, the electronic components S are sucked by all the mounting heads 31 in each of the component supply units 4, 5, and 6, and the electronic components S face the substrate T in this state. Also becomes possible.

  FIG. 8 shows a case where the electronic components S are simultaneously sucked from the second component supply unit (or the first component supply unit 4) 5 using two of the four mounting heads 31. Is shown. The tape cassettes 18 of the second component supply unit 5 are all formed to have the same width and are arranged without gaps. On the other hand, the mounting heads 31 are arranged at a pitch that is twice (dimension B) the arrangement pitch (dimension A) of each tape cassette 18. The revolving diameter of the suction head 31 is the same as the arrangement pitch (dimension A) of the tape cassette 18.

  Therefore, when the suction nozzles 41, 41 of the two adjacent mounting heads 31, 31 are revolved so as to be closest to each other, the dimension between the two suction nozzles 41, 41 becomes the dimension A, and the two adjacent tapes The electronic components S can be simultaneously sucked from the cassettes 18 and 18 (see FIGS. 7A and 7B). When the suction nozzles 41, 41 of the adjacent mounting heads 31, 31 are revolved to the left position or the right position, respectively, toward the tape cassette 18, the dimension between the suction nozzles 41, B becomes B dimension. (= 2A), and the electronic components S can be simultaneously sucked from the two tape cassettes 18 on both sides of one tape cassette 18 (see FIGS. 7A and 7C). Further, when the suction nozzles 41, 41 of the adjacent mounting heads 31, 31 are revolved so as to be most separated, the dimension between the suction nozzles 41, 41 becomes a C dimension (= 3A), and the two tape cassettes The electronic components S can be simultaneously sucked from the two tape cassettes 18 on both sides of the tape cassette 18 (see FIGS. 3A and 3C).

  Even if the revolving diameter of the mounting head 31 is not the same as the arrangement pitch (dimension A) of the tape cassette 18, if the revolving diameter is larger than the arrangement pitch (dimension A), each head 31 is rotated. The suction nozzle 41 can be moved to the revolving position where the suction nozzle 41 can be simultaneously sucked from the tape cassette 18.

  As described above, not only can the electronic component S be simultaneously suctioned simply by using the plurality of mounting heads 31, but also the suction nozzle 41 revolves around the axis of the mounting head and the position of the suction nozzle 41 can be changed as appropriate to obtain the tape. A cassette (electronic component S) 18 can also be selected. Therefore, since the electronic components S to be simultaneously sucked can be appropriately selected, not all of them can be mounted by simultaneous suction in relation to the substrate T, but the frequency of simultaneous suction can be increased. For this reason, the frequency of simultaneous suction increases for a split substrate in which a plurality of the same substrates T are consecutively arranged, which is particularly useful.

  Next, another embodiment of the simultaneous adsorption will be described with reference to FIG. In this suction mode, the electronic components S are sucked from the four tape cassettes 18, 18, 18, 18 by using two suction nozzles 41, 41 positioned in the radial direction in each mounting head 31. In this case, although not specifically shown, a pair of engagement preventing members 36 is provided for each mounting head 31, and one of them is configured to face the engaging hook 44 of the mounting head 31 so as to be able to advance and retreat. In addition, the air passage 48 is also configured to communicate with the protruding suction nozzles 41. That is, the electronic components S are simultaneously sucked using the mounting head 31 with the two suction nozzles 41 protruding.

  FIG. 4B shows a case where two suction nozzles 41, 41 which are 180 ° shifted from each other in each mounting head 31, are used. First, a total of four suction nozzles of adjacent mounting heads 31, 31 are used. The orbits 41, 41, 41, 41 are revolved so as to be aligned in parallel with the four tape cassettes 18, 18, 18, 18. In this state, the dimension between the suction nozzles 41, 41, 41, 41 becomes the dimension A, and then the electronic components S are simultaneously sucked from the four tape cassettes 18, 18, 18, 18 of circles 1 to 4.

  On the other hand, FIGS. 3C and 3D use two suction nozzles 41, 41 that are shifted from each other by 90 degrees in each mounting head 31. First, one of the mounting heads 31 is used. Is revolved to the left position, and the electronic components S are simultaneously sucked from the two tape cassettes 18 and 18 of circle 1 and circle 3. Next, the other suction nozzle 41 of each mounting head 31 is revolved to the right position, and the electronic components S are simultaneously sucked from the two tape cassettes 18 and 18 of circle 2 and circle 4. In this case, when the electronic component S is sucked by the one suction nozzle 41, the other suction nozzle 41 is released so as not to interfere with the tape cassette 18, so that the simultaneous suction is performed twice. .

  By the way, as shown in FIG. 3, even when the suction nozzle 41 is immersed, its tip slightly projects from the nozzle holder 42. Therefore, if the air passage 48 is configured to communicate with a desired suction nozzle 41, the electronic component S does not fall off even if the suction nozzle 41 is immersed while the electronic component S is being sucked. That is, in FIG. 9B, in a state where the suction nozzle 41 at the left position of each mounting head 31 is projected and the suction nozzle 41 at the right position is immersed, first, the two tape cassettes 18 of circle 1 and circle 3, At the same time, the electronic components S are sucked from the mounting head 31, and then the suction nozzle 41 at the left position of each mounting head 31 is immersed and the suction nozzle 41 at the right position is protruded, so that the two tape cassettes 18 When the electronic components S are simultaneously sucked from the electronic component S 18, the electronic components S can be simultaneously sucked in two times, and when the electronic components S are sucked by one suction nozzle 41, the other suction nozzle 41 is taped. This allows the cassette 18 to escape so as not to interfere with it.

  As described above, if the electronic components S are suctioned in a plurality of times as well as the simultaneous suction of the electronic components S, the number of times that the head units 9 and 10 reciprocate between the tape cassette 18 and the substrate T is remarkably increased. And the takt time in mounting the electronic component S can be shortened accordingly.

  Next, a second embodiment of the mounting head 31 will be described with reference to FIG. Reference numeral 35 denotes a support block for the actuator unit 33, and the first pulse motor M1 is attached to the support block 35. The first pulse motor M1 includes a housing 61 as a stator and a rotating arm 62 as a rotor, and the rotating arm 62 is rotated around a vertical axis. The lower part of the rotating arm 62 is formed in a forked shape, and a nozzle holder 63 is supported at both ends of the rotating arm 62 so as to be rotatable about a horizontal axis 64.

  A plurality of suction nozzles 65 are mounted on the peripheral surface of the nozzle holder 63 so as to protrude in the radial direction. Between one end of the horizontal shaft 64 of the nozzle holder 63 and the lower end of the rotary arm 62 that rotatably supports the horizontal shaft, one end of the horizontal shaft 64 is used as a rotor. A second pulse motor M2 having a lower end as a stator is configured. Therefore, the nozzle holder 63 is rotated by a predetermined rotation angle around the horizontal axis 64 according to the number of pulses input to the second pulse motor M2. For this reason, it is possible to selectively replace the suction nozzle 65 of the mounting head 31 independently without being driven from the outside of the mounting head 31.

  In addition, a vacuum path 67 is formed in the rotating arm 62, and only the selected suction nozzle 65 facing vertically downward communicates to enable vacuum suction of the electronic component S. In the first embodiment, the selection of the suction nozzle 65 and the angle positioning of the electronic component can be performed by one motor, but in the second embodiment, a motor is required for each operation. Therefore, when the weight of the motor is heavy, the first embodiment is more advantageous.

  As described above, according to the present embodiment, even when the mounting head (head units 9 and 10) 31 is moved by the XY stages 7 and 8, the suction nozzle 41 can be selectively replaced. Therefore, the time for nozzle replacement can be omitted. Therefore, the tact time in mounting the electronic component S can be shortened as much as possible, and the tact time in the multifunctional electronic component mounting apparatus 1 can be extremely shortened.

  Although the embodiments of the present invention have been described above, various alternatives, modifications or variations are possible for those skilled in the art based on the above description, and the present invention is not limited to the above-described various embodiments without departing from the spirit thereof. It is intended to cover alternatives, modifications or variations.

It is a top view of the electronic parts mounting device concerning one embodiment of the present invention. It is a partially broken side view of the mounting head according to the embodiment. It is a side view around a mounting head which shows the selection operation of a suction nozzle. It is a side view which shows the reference level of the electronic component which adsorbed. It is a schematic diagram which shows the component mounting operation | movement of the electronic component mounting apparatus of embodiment. FIG. 9 is a plan view illustrating a position correction operation of the suction nozzle with respect to the electronic component in the front-rear direction. FIG. 9 is a plan view illustrating a position correction operation of the suction nozzle with respect to the electronic component in the left-right direction. FIG. 4 is a plan view showing a pattern when electronic components are simultaneously sucked. FIG. 9 is a plan view showing another pattern when electronic components are simultaneously sucked. It is sectional drawing of the mounting head which concerns on 2nd Embodiment. It is a schematic diagram which shows the component mounting operation of the conventional electronic component mounting apparatus.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Machine stand 3 Conveyor part 4 1st component supply part 5 2nd component supply part 6 3rd component supply part 7 1st XY stage 8 2nd XY stage 9 1st head unit 10 2nd head unit 18 Tape cassette 30 Support Frame 31 Mounting Head 33 Actuator Unit 34 Pressing Arm 36 Engagement Prevention Member 41 Suction Nozzle 42 Nozzle Holder 44 Engagement Hook 45 Hook Holder 47 Spline Shaft S Electronic Component T Substrate PM PM Pulse Motor

Claims (8)

A component supply unit that supplies a plurality of types of electronic components, a component mounting unit that sucks the electronic components from the component supply unit and mounts the sucked electronic components on a board, and a component mounting unit that moves the component mounting unit between the suction position and the mounting position. And an XY transfer unit that moves between
The component mounting unit includes a mounting head mounted with a plurality of suction nozzles corresponding to a plurality of types of electronic components, and a replacement mechanism for selectively replacing at least one of the plurality of suction nozzles,
The replacement mechanism is configured to be capable of replacing the suction nozzle while the component suction unit is being moved by the XY transport unit.   2. The electronic component mounting apparatus according to claim 1, wherein a plurality of the mounting heads are mounted on the component mounting unit.   3. The replacement of the suction nozzle by the replacement mechanism is performed by pulling up a previously selected suction nozzle upward and projecting a newly selected suction nozzle downward. An electronic component mounting device according to claim 1. The mounting head is a nozzle holder in which the plurality of suction nozzles are arranged in a ring around a vertical axis,
4. The electronic component mounting device according to claim 1, further comprising: a motor that rotates the nozzle holder about the vertical axis. 5. The component suction unit further includes elevating means for elevating the mounting head,
The electronic component mounting apparatus according to any one of claims 1 to 4, wherein the lifting unit raises and lowers the mounting head with reference to a lower surface of each electronic component. The component supply unit supplies a plurality of electronic components simultaneously in a straight line and at regular intervals so as to be able to be sucked,
The plurality of mounting heads are disposed in parallel with the plurality of electronic components,
The electronic component mounting apparatus according to claim 2, wherein an arrangement pitch of the plurality of mounting heads is an integral multiple of an arrangement pitch of the plurality of electronic components. Each of the mounting heads, a nozzle holder in which the plurality of suction nozzles are arranged in a ring around a vertical axis,
A motor that rotates the nozzle holder about the vertical axis,
7. The electronic component mounting apparatus according to claim 6, wherein a revolving diameter of the suction nozzle is equal to or larger than an arrangement pitch of the plurality of electronic components. A component supply unit that supplies the electronic component, a component mounting unit that sucks the electronic component from the component supply unit and mounts the sucked electronic component on the board, and moves the component mounting unit between the suction position and the mounting position. And an XY transport unit to be moved.
The component mounting section has a plurality of mounting heads,
An electronic component mounting apparatus, wherein at least one of the plurality of mounting heads has a suction nozzle mounted so as to revolve around a vertical axis.

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