JP6840866B2 - Work work equipment - Google Patents

Description

The present invention relates to a work work apparatus, and more particularly to a work work apparatus including a mounting member on which a work having a three-dimensional shape is mounted.

Conventionally, a work work device including a mounting member on which a work having a three-dimensional shape is mounted is known. The work working apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2016-127187.

Japanese Unexamined Patent Publication No. 2016-127187 describes a chip component mounting device including a work having a side surface as a mounting surface on which a chip component (component) is mounted, and a stage arranged on a base and holding the work. Work equipment) is disclosed. The chip component mounting device includes a dispenser (head) for applying the conductive paste to the work, and a suction nozzle (head) for mounting the chip component on the work to which the conductive paste is applied.

In the chip component mounting apparatus described in Japanese Patent Application Laid-Open No. 2016-127187, the dispenser and the suction nozzle are tilted in accordance with the horizontal tilt of the side surface to be the mounting surface of the work, thereby making the work piece conductive to the side surface. Work is being done to apply the paste and mount the chip components.

Japanese Unexamined Patent Publication No. 2016-127187

However, in the chip component mounting apparatus described in JP-A-2016-127187, when the conductive paste is applied to the end of the side surface of the work on the stage side and the chip component is mounted, the stage and work for holding the work are performed. There is a disadvantage that the dispenser and the suction nozzle may interfere with the stage when the position (mounting or coating position) is close. Here, in order to avoid interference between the dispenser and the suction nozzle with respect to the stage, it is conceivable to provide a gap between the work and the stage for holding the work. However, since the height position of the work from the stage is raised by the amount of the gap, for example, when the work is moved together with the stage by moving the suction nozzle while the stage is sucked and held by the suction nozzle. It is considered that there is a disadvantage that the dispenser and other suction nozzles may interfere with the work. Therefore, it is considered that there is a problem that the working position in the work is limited and the height of the work on the stage is limited.

The present invention has been made to solve the above-mentioned problems, and one object of the present invention is the working position of a part in a work having a three-dimensional shape and the height of the work on a mounting member. It is to provide a work work apparatus which can suppress the limitation.

The work work apparatus according to the first aspect of the present invention transfers a work to a mounting member on which a work having a three-dimensional shape is mounted, a holding unit that holds the work via the mounting member, and a holding unit. It is provided with a head unit having a head for mounting and performing at least one of the operations of applying a liquid agent to the work or mounting a component, and when the work is transferred to the holding unit by the head, it is placed on a mounting member. When the work is placed and the work is transferred to the holding unit and then the work is performed on the work by the head, the work and the mounting member are relatively movable in a direction in which they are separated from each other. , The work or the mounting member is configured to move relatively in the direction in which the distance between the work and the mounting member increases due to the holding of the mounting member of the holding unit after the work is transferred to the holding unit. The mounting member includes a slide portion that moves in the first moving direction by being held by the holding unit, and the distance between the work and the mounting member is increased with the movement of the slide portion in the first moving direction. The mounting member further includes an urging member that urges the slide portion in the second moving direction opposite to the first moving direction, and the distance between the work and the mounting member. Is configured to become smaller as the sliding portion moves in the second moving direction due to the urging of the urging member .

In the work work apparatus according to the first aspect of the present invention, as described above, when the work is transferred, the work is placed on the mounting member, so that the work and the work can be transferred. Since the mounting member is not separated from each other, it is possible to suppress interference between the mounting member and a head other than the head on which the work is transferred. Further, when the work is performed by the head on the work, the work position and the mounting member can be separated from each other by separating the work from the mounting member, so that the end portion of the work on the mounting member side can be separated. It is possible to suppress the interference between the head and the mounting member due to the work. As a result, it is possible to prevent the work position of the work and the height of the work on the mounting member from being limited. As a result, the work can be performed in a wide range of the work, and the degree of freedom in the shape (height) of the work to be worked can be improved.
Further, the distance between the work and the mounting member can be increased by utilizing the holding of the mounting member by the holding unit without providing an additional member for increasing the distance between the work and the mounting member. , It is possible to suppress an increase in the size of the work work apparatus and an increase in the number of parts.
Further, since the distance between the work and the mounting member can be increased by the amount of movement of the slide portion in the first moving direction, a necessary distance can be easily provided between the work and the mounting member.
Further, in the state where the slide portion is moved in the first moving direction, the urging member can automatically move the slide portion in the second moving direction. As a result, the complexity of the configuration of the mounting member can be further suppressed as compared with the case where the slide portion is moved in the first moving direction and the second moving direction by using the sensor and the motor. Note that "the distance between the work and the mounting member becomes smaller" means not only a state in which the gap between the work and the mounting portion is reduced, but also a state in which the work and the mounting portion are in contact (the distance is 0). It is a broad concept including state).

The work work apparatus according to the second aspect of the present invention transfers a work to a mounting member on which a work having a three-dimensional shape is mounted, a holding unit that holds the work via the mounting member, and a holding unit. It is provided with a head unit having a head for mounting and performing at least one of the operations of applying a liquid agent to the work or mounting a component, and when the work is transferred to the holding unit by the head, it is placed on a mounting member. When the work is placed and the work is transferred to the holding unit and then the work is performed on the work by the head, the work and the mounting member are relatively movable in a direction in which they are separated from each other. , The work or the mounting member is configured to move relatively in the direction in which the distance between the work and the mounting member increases due to the holding of the mounting member of the holding unit after the work is transferred to the holding unit. The mounting member includes a slide portion that moves in the first moving direction by being held by the holding unit, and the distance between the work and the mounting member is increased with the movement of the slide portion in the first moving direction. The mounting member has a slide portion integrally, and further includes a mounting member main body on which the work is mounted and a fixing portion on which the work is mounted, and the work and the mounting member are mounted. As for the distance from the mounting member, the gap between the work and the mounting member main body increases as the mounting member main body moves in the first moving direction as the slide portion moves in the first moving direction. It is configured to be larger.
In the work work apparatus according to the second aspect of the present invention, by configuring as described above, the mounting member main body of the mounting member, not the work, is moved in the first moving direction, so that the work is moved first. It is possible to suppress the displacement of the work on the mounting member as compared with the case of moving in the direction.
In the work apparatus according to the first aspect, preferably, the mounting member has a slide portion integrally, and further includes a mounting member main body on which the work is mounted and a fixing portion on which the work is mounted. The distance between the work and the mounting member is such that as the sliding portion moves in the first moving direction and the mounting member main body moves in the first moving direction, there is a gap between the work and the mounting member main body. It is configured to increase as it increases.

The work work apparatus according to the third aspect of the present invention transfers a work to a mounting member on which a work having a three-dimensional shape is mounted, a holding unit that holds the work via the mounting member, and a holding unit. It is provided with a head unit having a head for mounting and performing at least one of the operations of applying a liquid agent to the work or mounting a component, and when the work is transferred to the holding unit by the head, it is placed on a mounting member. When the work is placed and the work is transferred to the holding unit and then the work is performed on the work by the head, the work and the mounting member are relatively movable in a direction in which they are separated from each other. , The work or the mounting member is configured to move relatively in the direction in which the distance between the work and the mounting member increases due to the holding of the mounting member of the holding unit after the work is transferred to the holding unit. The mounting member includes a slide portion that moves in the first moving direction by being held by the holding unit, and the distance between the work and the mounting member is increased with the movement of the slide portion in the first moving direction. The mounting member further includes a fixing portion integrally having a mounting member main body on which the work is mounted, and the slide portion is mounted with the work and mounted on the work. The distance from the member increases as the work moves in the first movement direction as the slide portion moves in the first movement direction, and the gap between the work and the mounting member main body increases. It is configured.
In the work work apparatus according to the third aspect of the present invention, since the work is moved in the first moving direction instead of the mounting member main body of the mounting member by the configuration as described above, the mounting member is mounted. Unlike the case where the placing member main body is moved in the first moving direction, the mounting member does not move with the movement of the slide portion, so that the mounting member can be prevented from tilting.
In the work device according to the first aspect, preferably, the mounting member further includes a fixing portion having a mounting member main body on which the work is mounted, and the slide portion is attached with the work. The distance between the work and the mounting member is increased by increasing the gap between the work and the mounting member main body as the work moves in the first moving direction as the slide portion moves in the first moving direction. It is configured to be.

The work work apparatus according to the fourth aspect of the present invention transfers a work to a mounting member on which a work having a three-dimensional shape is mounted, a holding unit that holds the work via the mounting member, and a holding unit. It is provided with a head unit having a head for mounting and performing at least one of the operations of applying a liquid agent to the work or mounting a component, and when the work is transferred to the holding unit by the head, it is placed on a mounting member. When the work is placed and the work is transferred to the holding unit and then the work is performed on the work by the head, the work and the mounting member are relatively movable in the direction in which they are separated from each other. , The work or the mounting member is configured to move relatively in the direction in which the distance between the work and the mounting member increases due to the holding of the mounting member of the holding unit after the work is transferred to the holding unit. The mounting member includes a slide portion that moves in the first moving direction by being held by the holding unit, and the distance between the work and the mounting member is increased with the movement of the slide portion in the first moving direction. The holding unit includes a holding portion for holding the work via a mounting member and a tilting moving portion for tilting the holding portion around a tilt axis orthogonal to the vertical direction. In a state where the portion holds the work and the holding portion is tilted by the inclined moving portion, the distance between the work and the mounting member is increased by holding the holding portion of the holding unit.
In the work work apparatus according to the fourth aspect of the present invention, by configuring as described above, it is possible to increase the distance between the work and the mounting member even when the work is tilted by the tilting moving portion. Therefore, even when the mounting member is tilted by the tilting moving portion and the component is mounted on the end portion of the side surface portion of the work on the mounting member side, interference between the head and the mounting member can be suppressed.
In the work device according to the first aspect, preferably, the holding unit has a holding portion that holds the work via a mounting member and a tilting moving portion that tilts the holding portion around a tilt axis orthogonal to the vertical direction. Including, the holding portion holds the work, and in a state where the holding portion is tilted by the tilting moving portion, the space between the work and the mounting member is increased by holding the holding portion of the holding unit.

In the work apparatus according to the fourth aspect , preferably, the head unit has a plurality of mounting heads as heads to be mounted on the work by sucking parts, and a predetermined mounting head among the plurality of mounting heads is mounted. In the state where the placing member is sucked and transferred to the holding unit, the work is placed so as to come into contact with the placing member. With this configuration, in the state where the work is transferred to the holding unit, the works are not arranged at positions separated from the mounting member but are in contact with each other, so that the work is between the work and the mounting member. It is possible to more reliably suppress the generation of gaps. As a result, interference between the work and the mounting head other than the predetermined mounting head can be reliably suppressed.

In the work work apparatus according to the fourth aspect , preferably, the slide portion has an inclined portion that inclines toward the holding portion side of the holding unit toward the first moving direction, and the holding portion of the holding unit is the sliding portion. By abutting and holding the inclined portion, the sliding portion moves in the first moving direction along the inclination of the inclined portion, and the mounting member main body or the work is configured to move in the first moving direction. .. With this configuration, it is possible to realize the movement of the mounting member main body or the work in the first moving direction by utilizing the simple configuration of the inclined portion provided on the slide portion. Can be further suppressed from becoming complicated.

In the work work apparatus according to the second or third aspect , preferably, a height measuring unit for measuring the height position of the surface of the mounting member main body on the work side or the surface of the work is further provided. With this configuration, it is possible to determine whether the height position of the surface of the mounting member main body on the work side or the surface of the work is lower or higher than the reference height position. By holding, it is possible to reliably recognize whether or not the mounting member main body and the work have moved relatively in the separation direction.

According to the present invention, as described above, there is provided a work work apparatus capable of suppressing the limitation of the work position of a part in a work having a three-dimensional shape and the height of the work on a mounting member. it can.

It is a top view which showed the whole structure of the component mounting apparatus according to 1st and 2nd Embodiment of this invention. It is a side view which showed the whole structure of the component mounting apparatus according to 1st and 2nd Embodiment of this invention. It is a perspective view which showed the holding unit of the component mounting apparatus according to 1st and 2nd Embodiment of this invention. It is a block diagram which showed the control apparatus and the control structure of the component mounting apparatus according to 1st and 2nd Embodiment of this invention. It is a perspective view which showed the transport member of the component mounting apparatus according to 1st and 2nd Embodiment of this invention. It is a perspective view which showed the state which the 3D substrate is arranged on the mounting member of the component mounting apparatus according to 1st and 2nd Embodiment of this invention. FIG. 7A is a schematic view showing a state in which an electronic component is mounted on an end portion of a side surface portion of a three-dimensional substrate on the mounting member side in a comparative example. FIG. 7B is a schematic view showing a state in which the three-dimensional substrate in the comparative example is transferred. FIG. 8A is a schematic view showing a state in which an electronic component is mounted on an end portion of a side surface portion of a three-dimensional substrate on the mounting member side in the first embodiment. FIG. 8B is a schematic view showing a state in which the three-dimensional substrate according to the first embodiment is transferred. It is a perspective view which showed the state which arranged the three-dimensional substrate on the mounting member of the component mounting apparatus according to 1st Embodiment of this invention. It is an exploded perspective view of the mounting member of the component mounting apparatus and the three-dimensional substrate according to the first embodiment of the present invention. FIG. 11A is a cross-sectional view showing a non-holding state in which the mounting member is not held by the holding portion of the holding unit. FIG. 11B is a cross-sectional view showing a holding state in which the mounting member is held by the holding portion of the holding unit. It is a flowchart of the 3D substrate transfer processing flow executed in the control device of the component mounting apparatus according to 1st Embodiment of this invention. FIG. 13A is a schematic view showing a mounting head and a mounting member when the mounting member is transferred. FIG. 13B is a schematic view showing the mounting member when the mounting member is held by the holding unit. FIG. 13C is a schematic view showing a laser measuring unit that measures the height position of the mounted body while the holding unit holds the mounting member. FIG. 5 is a schematic view showing a state in which an electronic component is mounted on an end portion of the three-dimensional substrate on the mounting member side in a state where the three-dimensional substrate is tilted by the tilting mechanism portion in the component mounting device according to the first embodiment of the present invention. It is a perspective view which showed the state which arranged the 3D substrate on the mounting member of the component mounting apparatus according to 2nd Embodiment of this invention. It is an exploded perspective view of the mounting member and the three-dimensional substrate of the component mounting apparatus according to the second embodiment of the present invention. FIG. 17A is a cross-sectional view showing a non-holding state in which the mounting member is not held by the holding portion of the holding unit. FIG. 17B is a cross-sectional view showing a holding state in which the mounting member is held by the holding portion of the holding unit. It is a flowchart of the 3D substrate transfer processing flow executed in the control apparatus of the component mounting apparatus according to 2nd Embodiment of this invention. FIG. 19A is a schematic view showing a mounting head and a mounting member when the mounting member is transferred. FIG. 19B is a schematic view showing the mounting member when the mounting member is held by the holding unit. FIG. 19C is a schematic view showing a laser measuring unit that measures the height position of the mounted body while the holding unit holds the mounting member. FIG. 20A is a cross-sectional view showing a state in which a three-dimensional substrate is arranged on a mounting member of a first modification according to the first to second embodiments of the present invention. FIG. 20B is a cross-sectional view showing a state in which the mounting member and the three-dimensional substrate of the first modification according to the first to second embodiments of the present invention are separated from each other. It is a schematic diagram which showed the partial structure of the component mounting apparatus of the 2nd modification according to 1st to 2nd Embodiment of this invention.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

[First Embodiment]
The component mounting device 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 13. Here, the transport direction of the transport member 71 on which the three-dimensional substrate P is placed and the opposite direction are defined as the X direction, and the direction orthogonal to the X direction in the horizontal direction is defined as the Y direction. Further, the direction orthogonal to the X direction and the Y direction is defined as the Z direction. The component mounting device 1 is an example of a "work work device" within the scope of the claims. Further, the three-dimensional substrate P is an example of a "work" within the scope of claims.

(Configuration of component mounting device)
The configuration of the component mounting device 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3.

As shown in FIGS. 1 and 2, the component mounting device 1 is a component mounting device 1 that mounts electronic components E such as ICs, transistors, capacitors, and resistors on a three-dimensional substrate P. The electronic component E is an example of a "component" within the scope of the claims.

The component mounting device 1 includes a transport unit 2, a head unit 3, a tape feeder 4, a head horizontal movement mechanism unit 5, a holding unit 6, a component imaging unit 7, a mark imaging unit 8, and a laser measuring unit 9. And a control device 10. The laser measuring unit 9 is an example of the "height measuring unit" in the claims.

The transport unit 2 is a transport device that carries in, transports, and carries out a transport member 71 (see FIG. 5) in which a plurality of mounting members 80 on which the three-dimensional substrate P is mounted are arranged. Specifically, the conveyor unit 2 has a pair of conveyor units 21 arranged at positions separated from each other in the Y direction, and both ends of the conveyor member 71 are supported from below by the pair of conveyor units 21. While transporting the transport member 71 in the X direction. Further, the transport unit 2 transports the carried-in transport member 71 to the stop position ST and stops at the stop position ST.

The head unit 3 includes a plurality of (six) mounting heads 31 that hold the electronic component E and mount the held electronic component E on the three-dimensional substrate P, and is configured to be movable in a horizontal plane (in the XY plane). Has been done. In the component mounting device 1, a plurality of tape feeders 4 for supplying electronic components E to be mounted on the three-dimensional substrate P are arranged on both sides (Y1 side and Y2 side) in the Y direction. The mounting head 31 of the head unit 3 holds the electronic component E supplied from the tape feeder 4. The mounting head 31 is an example of a “head” within the scope of the claims.

As shown in FIG. 2, the plurality of mounting heads 31 are arranged in a row at equal intervals along the X direction. The plurality of mounting heads 31 have the same configuration. A suction nozzle 31a for holding the electronic component E is detachably attached to the tip of the mounting head 31. Further, the mounting head 31 is connected to a vacuum source (not shown) provided in the component mounting device 1. The mounting head 31 holds the electronic component E by attracting the electronic component E to the suction nozzle 31a by the negative pressure supplied from the vacuum source. Further, the mounting head 31 releases the holding (adsorption) of the electronic component E by stopping the supply of the negative pressure from the vacuum source. As a result, the electronic component E is mounted on the three-dimensional substrate P.

Further, the head unit 3 includes a plurality of Z-axis moving mechanism units 32 provided for each mounting head 31. The plurality of Z-axis moving mechanism units 32 each have the same configuration. The Z-axis moving mechanism unit 32 is configured to move the mounting head 31 in the vertical direction (Z direction) by the ball screw shaft mechanism.

As shown in FIGS. 1 and 2, the head horizontal movement mechanism unit 5 is configured to move the head unit 3 in a horizontal plane (in an XY plane) above the three-dimensional substrate P (conveying member 71). There is. Specifically, the head horizontal movement mechanism unit 5 includes an X-axis movement mechanism unit 51 and a pair of Y-axis movement mechanism units 52.

The head unit 3 is attached to the X-axis moving mechanism unit 51, and the head unit 3 is configured to move in the X direction by the ball screw shaft mechanism. The pair of Y-axis moving mechanism portions 52 are attached with the X-axis moving mechanism portion 51, and are configured to move the X-axis moving mechanism portion 51 and the head unit 3 in the Y direction by the ball screw axis mechanism. ..

The holding unit 6 is configured to hold the three-dimensional substrate P via the mounting member 80 (see FIG. 9) when the electronic component E is mounted on the three-dimensional substrate P by the head unit 3. Further, the holding unit 6 is configured to move, rotate, or incline the held three-dimensional substrate P along the Z direction (vertical direction).

Specifically, as shown in FIG. 3, the holding unit 6 includes an elevating mechanism portion 61, a tilting mechanism portion 62, a rotation mechanism portion 63, and a holding portion 64. In the holding unit 6, the holding portion 64 is attached to the rotating mechanism portion 63, the rotating mechanism portion 63 is attached to the tilting mechanism portion 62, and the tilting mechanism portion 62 is attached to the elevating mechanism portion 61. The tilting mechanism portion 62 is an example of a “tilting moving portion” within the scope of the claims.

The elevating mechanism portion 61 has a drive motor 61a, and the three-dimensional substrate P held by the holding portion 64 is moved along the vertical direction (Z direction) by the driving force of the drive motor 61a and the ball screw shaft mechanism. It is configured. The tilting mechanism portion 62 has a drive motor 62a, and is configured to rotate the three-dimensional substrate P held by the holding portion 64 around the rotation axis A1 extending in the horizontal direction by the driving force of the drive motor 62a. ing. As a result, the tilting mechanism portion 62 is configured to tilt the three-dimensional substrate P held by the holding portion 64. The rotation mechanism unit 63 has a drive motor 63a, and the driving force of the drive motor 63a rotates the three-dimensional substrate P held by the holding unit 64 around the rotation axis A2 extending in a direction substantially orthogonal to the rotation axis A1. It is configured as follows.

The holding portion 64 is configured to hold the three-dimensional substrate P via the mounting member 80. Specifically, the holding portion 64 has a plurality of (three) claw portions 64a, and is configured to hold and fix the mounting member 80 by the plurality of claw portions 64a.

As shown in FIG. 1, the component imaging unit 7 is a component recognition camera that captures an image of the electronic component E attracted to the mounting head 31 prior to the mounting work of the electronic component E. The mark imaging unit 8 is a mark recognition camera that captures a position recognition mark (not shown) attached to the three-dimensional substrate P prior to the mounting work of the electronic component E. The position recognition mark is a mark for recognizing the position of the three-dimensional substrate P.

The laser measuring unit 9 is configured to measure the height position of the three-dimensional substrate P and the height position of the mounting member 80. Specifically, the laser measuring unit 9 irradiates the three-dimensional substrate P or the mounting member 80 with laser light to irradiate the three-dimensional substrate P (see FIG. 13C) or the mounting member 80 (see FIG. 19C). ), The distance from the lower end position of the laser measuring unit 9 to the measurement position on the upper surface of the three-dimensional substrate P or the upper surface of the mounting member 80 is measured. Here, the height position is calculated based on the distance measured by the laser measuring unit 9 from the lower end position of the laser measuring unit 9 to the measuring position on the upper surface of the three-dimensional substrate P or the upper surface of the mounting member 80.

A plurality (two) of the laser measurement units 9 are attached to the back surface side (Y1 direction) of the head unit 3. Further, the plurality of laser measuring units 9 are arranged on the X1 side and the X2 side, respectively. The laser measuring unit 9 can move in the horizontal direction (X direction and Y direction) above the base together with the head unit 3.

As shown in FIG. 4, the control device 10 includes a memory 10b having a CPU 10a (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like, and controls the operation of the component mounting device 1. It is configured as follows. Specifically, the control device 10 includes a transport unit 2, a head unit 3, a tape feeder 4, an X-axis moving mechanism unit 51, a Y-axis moving mechanism unit 52, a holding unit 6, a component imaging unit 7, a mark imaging unit 8, and the like. The laser measuring unit 9 and the like are controlled according to a program stored in advance.

<Transport member>
In the component mounting device 1, as shown in FIG. 5, the three-dimensional substrate P is carried into the device and transported in a state of being mounted on the transport member 71. The transport member 71 includes a plurality of mounting members 80 and a transport body 72 mounted on the transport unit 2. A three-dimensional substrate P is mounted on each of the plurality of mounting members 80. A plurality of mounting members 80 are mounted on the transport body 72. In the component mounting device 1, by mounting a plurality of mounting members 80 on a single carrier 72, it is possible to carry a plurality of three-dimensional substrates P into the component mounting device 1 at a time. Further, the plurality of mounting members 80 are mounted separably from the transport body 72. In the component mounting device 1, it is possible to separate the single mounting member 80 from the transport body 72 of the transport member 71 and move the three-dimensional substrate P together with the separated mounting member 80.

That is, in the transport member 71, a single mounting member 80 is removed from the transport body 72 of the transport member 71 by attracting a portion of the mounting member 80 other than the three-dimensional substrate P by a plurality of (two) mounting heads 31. Be separated. Then, the separated mounting member 80 can be moved together with the head unit 3 by the X-axis moving mechanism section 51 and the Y-axis moving mechanism section 52 in a state of being attracted to the plurality of mounting heads 31. As a result, the separated three-dimensional substrate P moves from the stop position ST (see FIG. 1) of the transport member 71 to the transfer position L (see FIG. 1) at which the mounting member 80 is transferred to the holding unit 64 on the holding unit 6. It is possible to move.

<Three-dimensional board>
As shown in FIG. 6, the three-dimensional substrate P has a three-dimensional shape as compared with the flat plate shape. The three-dimensional substrate P may have any shape as long as it has a three-dimensional shape as compared with the flat plate shape, and has a plurality of mounted surfaces on which the electronic component E is mounted by the mounting head 31. You may be doing it. Further, a plurality of (two) engaging holes 73 for attaching the three-dimensional substrate P to the mounting member 80 are provided on the Z2 side (lower side) surface portion of the three-dimensional substrate P.

<Mounting member>
Here, in the component mounting device of the comparative example shown in FIG. 7A, the three-dimensional substrate P is tilted by, for example, 90 degrees by the tilting mechanism portion of the holding unit, and is placed at the end of the three-dimensional substrate P on the mounting member side. When the electronic component E is mounted, the mounting head 31 and the mounting member interfere with each other. In order to avoid this interference, it is conceivable to arrange the spacer SP between the three-dimensional substrate P and the mounting member as in the component mounting device of the comparative example shown in FIG. 7B. However, since the height position of the three-dimensional substrate P from the mounting member becomes high, when the mounting member is attracted by the predetermined mounting head 31 in order to move the mounting member from the stop position to the transfer position, it is predetermined. There is a possibility that the mounting head 31 (or the mark imaging unit 8 or the like) other than the mounting head 31 of the above and the three-dimensional substrate P may interfere with each other. Therefore, in the component mounting device, the mounting head 31 and the mounting member do not interfere with each other when the electronic component E is mounted, and the mounting head 31 and the three-dimensional substrate P do not interfere with each other when the mounting member is transferred. You will need it.

Therefore, as shown in FIG. 8A, the component mounting device 1 of the first embodiment can avoid interference between the mounting head 31 and the mounting member 80 when the electronic component E is mounted, and is shown in FIG. As shown in 8 (B), the mounting member 80 is provided so as to avoid interference between the mounting head 31 and the three-dimensional substrate P when the mounting member 80 is transferred. Hereinafter, the mounting member 80 will be described with reference to FIGS. 9 to 13. Here, the mounting member 80 is a jig for holding the three-dimensional substrate P by the holding portion 64 of the holding unit 6.

The mounting member 80 is configured to be mounted so that the three-dimensional board P comes into contact with the mounting member 80 when the three-dimensional board P is transferred to the holding unit 6 by the mounting head 31. Further, the mounting member 80 is a three-dimensional substrate when the three-dimensional substrate P is transferred to the holding portion 64 of the holding unit 6 and then the mounting head 31 performs the mounting work of the electronic component E on the three-dimensional substrate P. The mounting member 80 is configured to be relatively movable in the direction in which the P and the mounting member 80 are separated from each other. Specifically, as shown in FIGS. 9 and 10, the mounting member 80 is the mounting member main body 81 and the mounting member 80. , The urging member 82 and the fixing portion 83 are included.

The mounting member main body 81 is configured so that the three-dimensional substrate P is mounted and the three-dimensional substrate P is relatively movable with respect to the three-dimensional substrate P. Specifically, the mounting member main body 81 has a mounting body 91 and a slide portion 92 integrally provided on the mounting body 91. The mounting body 91 is formed in a flat plate shape larger than the surface portion of the three-dimensional substrate P on the mounting member main body 81 side. The mounting body 91 is formed in a rectangular shape in a plan view. Further, the mounting body 91 is formed with an insertion hole 93 through which the fixing portion 83 is inserted at a substantially central portion. The insertion hole 93 penetrates the mounting body 91.

Here, the mounting member main body 81 is configured to move relative to the three-dimensional substrate P in a direction in which the distance between the three-dimensional substrate P and the mounting member 80 increases. That is, the mounting member main body 81 moves in the same first moving direction M1 as the moving direction of the slide portion 92 as the slide portion 92 moves in the first moving direction M1 by holding the holding unit 6. At this time, when the mounting member main body 81 moves in the first moving direction M1, the height position of the three-dimensional substrate P is maintained by being fixed to the fixing portion 83. The first moving direction M1 is a direction in which the three-dimensional substrate P and the mounting member 80 are separated from each other.

The slide portion 92 has a first projecting portion 92a projecting from a surface portion of the mounting body 91 opposite to the three-dimensional substrate P, and a first projecting portion 92a projecting from the tip end portion of the first projecting portion 92a to the side opposite to the insertion hole 93. It has two protruding portions 92b and an inclined portion 92c provided at the tip end portion of the second protruding portion 92b. The first protruding portion 92a is formed in the shape of a quadrangular prism extending in a direction along the first moving direction M1. The second protruding portion 92b is formed in a quadrangular column shape extending along the direction opposite to the insertion hole 93 side in the direction orthogonal to the first moving direction M1. The inclined portion 92c is inclined to the side opposite to the insertion hole 93 toward the first moving direction M1. Further, as shown in FIG. 11, since the inclined portion 92c is arranged at a position facing the holding portion 64, the inclined portion 92c is inclined toward the holding portion 64 side toward the first moving direction M1. As described above, the slide portion 92 is formed in an L shape.

As shown in FIG. 10, a plurality (three) of the slide portions 92 are arranged on the mounting body 91. The plurality of slide portions 92 are arranged at equal intervals along the circumferential direction of the insertion holes 93. Here, as shown in FIG. 11, the plurality of slide portions 92 are arranged at positions corresponding to the plurality of claw portions 64a provided in the holding portion 64 of the holding unit 6. The plurality of slide portions 92 face each of the plurality of claw portions 64a. The plurality of claw portions 64a each have the same configuration.

The urging member 82 is configured to urge the slide portion 92 in the second moving direction M2 in the direction opposite to the first moving direction M1. Specifically, as shown in FIG. 11A, one end of the urging member 82 is attached to the surface of the mounting body 91 opposite to the three-dimensional substrate P, and the other end is attached to the fixing portion 83. It is attached. As a result, the urging member 82 extends in the second moving direction M2 with reference to the other end portion attached to the fixed portion 83. Then, as shown in FIG. 11B, the urging member 82 is first moved by the mounting body 91 that moves in the first moving direction M1 as the slide portion 92 moves in the first moving direction M1. It is compressed in the direction M1. Here, the urging member 82 is composed of a coil spring. Further, the second moving direction M2 is a direction in which the three-dimensional substrate P and the mounting member 80 approach each other.

The fixing portion 83 is configured to fix the relative positional relationship of the three-dimensional substrate P mounted on the mounting member 80 with respect to the holding portion 64. Specifically, as shown in FIG. 10, the fixing portion 83 has a base portion 95 and a protruding portion 96.

The base portion 95 is formed in a cylindrical shape. The base portion 95 is formed larger than the urging member 82 in a plan view. Further, a slide portion 92 is inserted into the base portion 95, and a guide groove 95a for guiding the movement of the slide portion 92 in the first movement direction M1 and the second movement direction M2 is formed. The guide groove 95a is formed in a concave shape in which the outer peripheral portion of the base portion 95 is recessed inward in the radial direction. The guide groove 95a penetrates the base portion 95 in the first moving direction M1.

As shown in FIG. 11A, the protruding portion 96 protrudes from the base portion 95 in the second moving direction M2. The protrusion 96 is formed in a cylindrical shape (see FIG. 10) having a diameter that allows it to be inserted into the insertion hole 93 of the mounting body 91. The protruding portion 96 has an engaging portion 96a provided at an end portion on the second moving direction M2 side so that the three-dimensional substrate P can be detachably attached. The engaging portion 96a is configured to engage with the engaging hole 73 of the three-dimensional substrate P. Thereby, it is possible to prevent the relative positional relationship of the three-dimensional substrate P mounted on the mounting member 80 with respect to the holding portion 64 from being changed.

<Relative movement of the mounting member body with respect to the three-dimensional substrate>
Hereinafter, the relative movement of the mounting member main body 81 with respect to the three-dimensional substrate P will be described with reference to FIG.

As shown in FIG. 11A, in the non-holding state in which the mounting member 80 is not held by the holding portion 64 of the holding unit 6, the urging member 82 secondly moves with reference to the base portion 95 of the fixing portion 83. By extending in the direction M2, the slide portion 92 moves in the second moving direction M2 as the mounting body 91 of the mounting member main body 81 is pushed in the second moving direction M2. As described above, in the non-holding state, the distance between the three-dimensional substrate P and the mounting member 80 becomes smaller as the slide portion 92 moves in the second moving direction M2 due to the urging of the urging member 82. That is, the three-dimensional substrate P is placed in contact with the mounting member 80. At this time, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 does not change, and the relative positional relationship between the mounting body 91 and the holding portion 64 of the mounting member 80 is separated.

As shown in FIG. 11B, in the holding state in which the mounting member 80 is held by the holding portion 64 of the holding unit 6, the claw portion 64a of the holding portion 64 abuts on the inclined portion 92c of the slide portion 92 to hold the mounting member 80. By doing so, the slide portion 92 moves in the first movement direction M1 along the inclination of the inclined portion 92c. As the slide portion 92 moves in the first moving direction M1, the mounting body 91 also moves in the first moving direction M1. As a result, the urging member 82 is compressed in the first moving direction M1 with reference to the base portion 95 of the fixed portion 83. As described above, in the holding state, the distance between the three-dimensional substrate P and the mounting member 80 increases as the slide portion 92 moves in the first moving direction M1. At this time, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 does not change, and the relative positional relationship between the mounting body 91 of the mounting member 80 and the holding portion 64 becomes close.

(Flowchart of 3D substrate transfer processing flow)
The three-dimensional substrate transfer processing flow will be described below with reference to FIGS. 12 and 13. In the three-dimensional board transfer processing flow, the three-dimensional board P in a state of being mounted on the mounting member 80 is moved from the stop position ST to the transfer position L, and at the transfer position L, the three-dimensional board is transferred to the holding portion 64 of the holding unit 6. This is a process of holding P via the mounting member 80.

As shown in FIG. 12, in step S1, the control device 10 transports the transport member 71 to the stop position ST by the transport unit 2. In step S2, the control device 10 moves the head unit 3 to the stop position ST by the X-axis movement mechanism unit 51 and the Y-axis movement mechanism unit 52. In step S3, the control device 10 lowers the mounting head 31 by the Z-axis moving mechanism unit 32 to attract the mounting body 91 of the mounting member 80. That is, as shown in FIG. 13A, in a state where a predetermined mounting head 31 among the plurality of mounting heads 31 sucks the mounting body 91 of the mounting member 80 and transfers it to the holding unit 6, the three-dimensional substrate P Is mounted so as to come into contact with the mounting body 91 of the mounting member 80. As a result, it is possible to prevent the mounting heads 31 other than the predetermined mounting heads 31 from interfering with the three-dimensional substrate P.

As shown in FIG. 12, in step S4, the control device 10 is moved to the transfer position L by raising the mounting head 31 by the Z-axis movement mechanism unit 32, the X-axis movement mechanism unit 51, and the Y-axis movement mechanism unit 52. Let me. In step S5, the control device 10 lowers the mounting head 31 by the Z-axis moving mechanism unit 32 to release the suction of the mounting body 91 of the mounting member 80. In step S6, the control device 10 holds the mounting member 80 by the holding portion 64 of the holding unit 6. That is, as shown in FIG. 13B, after the mounting body 91 is released from being attracted by the mounting head 31, the holding portion 64 of the holding unit 6 moves in the direction indicated by the arrow and is mounted by the holding portion 64. In the holding state in which the placing member 80 is held, the mounting member 80 moves relative to the three-dimensional substrate P, and the three-dimensional substrate P and the mounting member 80 are in a non-contact state. At this time, the distance between the three-dimensional substrate P and the mounting body 91 of the mounting member 80 is such that the mounting body 91 of the mounting member main body 81 moves in the first moving direction M1 as the slide portion 92 moves in the first moving direction M1. As the movement to, the gap S between the three-dimensional substrate P and the mounting body 91 of the mounting member main body 81 increases, which increases the size.

In step S7, the control device 10 raises the mounting head 31 by the Z-axis moving mechanism unit 32. In step S8, the control device 10 measures the height position of the surface of the mounting body 91 of the mounting member 80 on the three-dimensional substrate P side by the two laser measuring units 9. That is, as shown in FIG. 13C, the control device 10 measures the height position of the surface of the mounting body 91 at an arbitrary first position on the three-dimensional substrate P side by one of the laser measuring units 9. Further, the control device 10 uses the other laser measuring unit 9 to set the height position of the surface of the mounting body 91 at the second position opposite to the first position via the three-dimensional substrate P on the three-dimensional substrate P side. measure. At this time, the control device 10 acquires the height position of the surface of the mounting body 91 on the three-dimensional substrate P side.

In step S9, the control device 10 determines whether or not the surface of the mounting body 91 on the three-dimensional substrate P side is arranged below the reference position. When the surface of the mounting body 91 on the three-dimensional substrate P side is not arranged below the reference position (see FIG. 13C), the control device 10 is mounted by the holding portion 64 of the holding unit 6. It is determined that the holding of the component mounting device 1 is not properly performed, and the work of the component mounting device 1 is stopped. When the surface of the mounting body 91 on the three-dimensional substrate P side is arranged below the reference position, the control device 10 ends the three-dimensional substrate transfer processing flow. It is preferable that the surface of the mounting body 91 on the three-dimensional substrate P side is located below the threshold value.

(Mounting of electronic components with the three-dimensional board tilted)
A case where the electronic component E is mounted on the portion of the side surface portion of the three-dimensional substrate P on the mounting member 80 side after performing such a three-dimensional substrate transfer processing flow will be described.

As shown in FIG. 14, the holding unit 64 holds the three-dimensional substrate P via the mounting member 80, and even when the three-dimensional substrate P is tilted by the tilting mechanism portion 62, the holding unit 6 is held. The holding portion 64 holds a state in which a gap S is provided between the three-dimensional substrate P and the mounting body 91 of the mounting member main body 81. As a result, it is possible to avoid interference between the mounting head 31 on which the electronic component E is mounted on the portion of the side surface portion of the three-dimensional substrate P on the mounting member 80 side and the mounting member main body 81.

(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, in the component mounting device 1, when the mounting member 80 is transferred to the holding unit 6 by the mounting head 31, the three-dimensional substrate P is mounted on the mounting member 80. To. Further, in the component mounting device 1, when the electronic component E is mounted on the three-dimensional board P by the mounting head 31 after the three-dimensional board P is transferred to the holding unit 6, the three-dimensional board P and the mounting member 80 are mounted. It is configured to be relatively movable in the direction in which and are separated from each other. As a result, when the three-dimensional substrate P is transferred, the three-dimensional substrate P is mounted on the mounting member 80, so that when the three-dimensional substrate P is transferred, the three-dimensional substrate P and the mounting member 80 are placed together. Since the height position of the three-dimensional board P with respect to the mounting body 91 of the mounting member main body 81 does not change, the mounting head 31 other than the mounting head 31 on which the three-dimensional board P is transferred interferes with the mounting member 80. Can be suppressed. Further, when the mounting work is performed on the three-dimensional board P by the mounting head 31, the three-dimensional board P and the mounting member 80 are separated from each other, so that the mounting position and the mounting member 80 can be separated from each other. It is possible to suppress the interference between the mounting head 31 and the mounting member 80 by performing the mounting work on the end portion of the three-dimensional substrate P on the mounting member 80 side. As a result, it is possible to suppress the limitation of the mounting position of the three-dimensional substrate P and the height of the three-dimensional substrate P on the mounting member 80. As a result, the three-dimensional substrate P can be mounted in a wide range, and the degree of freedom in the shape (height) of the three-dimensional substrate P can be improved.

Further, in the first embodiment, as described above, the mounting member 80 is mounted on the three-dimensional substrate P by holding the mounting member 80 of the holding unit 6 after the three-dimensional substrate P is transferred to the holding unit 6. It is configured to move relatively in the direction in which the distance from the placement member 80 increases. As a result, the distance between the three-dimensional substrate P and the mounting member 80 is utilized by utilizing the holding of the mounting member 80 by the holding unit 6 without providing a new configuration for increasing the distance between the three-dimensional substrate P and the mounting member 80. Therefore, it is possible to suppress an increase in the size of the configuration of the component mounting device 1 and an increase in the number of components.

Further, in the first embodiment, as described above, the mounting member 80 includes a slide portion 92 that moves in the first moving direction M1 by being held by the holding unit 6. The distance between the three-dimensional substrate P and the mounting member 80 is configured to increase as the slide portion 92 moves in the first moving direction M1. As a result, the distance between the three-dimensional substrate P and the mounting member 80 can be increased by the amount of movement of the slide portion 92 in the first moving direction M1, which is necessary between the three-dimensional substrate P and the mounting member 80. The interval can be easily provided.

Further, in the first embodiment, as described above, the mounting member 80 includes an urging member 82 that urges the slide portion 92 in the second moving direction M2 in the direction opposite to the first moving direction M1. .. The distance between the three-dimensional substrate P and the mounting member 80 is configured to decrease as the slide portion 92 moves in the second moving direction M2 due to the urging of the urging member 82. As a result, when the slide portion 92 is moved in the first movement direction M1, the urging member 82 can automatically move the slide portion 92 in the second movement direction M2. As a result, the complexity of the configuration of the mounting member 80 can be further suppressed as compared with the case where the slide portion 92 is moved in the first moving direction M1 and the second moving direction M2 by using the sensor and the motor.

Further, in the first embodiment, as described above, the mounting member 80 integrally has the slide portion 92, and the mounting member main body 81 on which the three-dimensional substrate P is mounted and the three-dimensional substrate P are mounted. It includes a fixing portion 83. The distance between the three-dimensional substrate P and the mounting member 80 is such that the mounting member main body 81 moves in the first moving direction M1 as the slide portion 92 moves in the first moving direction M1 and is mounted on the three-dimensional substrate P. It is configured to increase as the gap S between the placement member main body 81 and the placement member body 81 increases. As a result, since the mounting member main body 81 of the mounting member 80 is moved in the first moving direction M1 instead of the three-dimensional board P, the mounting member 80 is moved more than in the case of moving the three-dimensional board P in the first moving direction M1. The misalignment of the upper three-dimensional substrate P can be suppressed.

Further, in the first embodiment, as described above, the holding unit 6 tilts the holding portion 64 that holds the three-dimensional substrate P via the mounting member 80 and the holding portion 64 around the tilt axis that is orthogonal to the vertical direction. It includes a tilting mechanism portion 62 for making the tilting mechanism portion 62. In a state where the holding portion 64 holds the three-dimensional substrate P and the holding portion 64 is tilted by the tilting mechanism portion 62, the distance between the three-dimensional substrate P and the mounting member 80 is large due to the holding of the holding portion 64 of the holding unit 6. It is configured to be. As a result, even when the three-dimensional substrate P is tilted by the tilting mechanism portion 62, the distance between the three-dimensional substrate P and the mounting member 80 can be increased, so that the mounting member 80 is tilted by the tilting mechanism portion 62. Interference between the mounting head 31 and the mounting member 80 can be suppressed even when the component is mounted on the end portion of the side surface portion of the three-dimensional substrate P on the mounting member 80 side by tilting.

Further, in the first embodiment, as described above, the head unit 3 has a mounting head 31 that is mounted on the three-dimensional substrate P by adsorbing the electronic component E. Then, in a state where a predetermined mounting head 31 among the plurality of mounting heads 31 sucks the mounting member 80 and transfers it to the holding unit 6, the three-dimensional substrate P is mounted so as to be in contact with the mounting member 80. Has been done. As a result, in the state where the three-dimensional substrate P is transferred to the holding unit 6, the three-dimensional substrate P is not arranged at a position separated from the mounting member 80 but is in contact with each other. Therefore, the three-dimensional substrate P and the mounting member 80 are in contact with each other. It is possible to more reliably suppress the generation of a gap S between the two. As a result, the height position of the three-dimensional substrate P with respect to the mounting body 91 of the mounting member main body 81 does not change, so that interference between the mounting head 31 other than the predetermined mounting head 31 and the three-dimensional substrate P can be reliably suppressed. it can.

Further, in the first embodiment, as described above, the slide portion 92 has an inclined portion 92c that inclines toward the holding portion 64 side of the holding unit 6 toward the first moving direction M1. When the holding portion 64 of the holding unit 6 abuts and holds the inclined portion 92c of the slide portion 92, the slide portion 92 moves in the first moving direction M1 along the inclination of the inclined portion 92c, and the mounting member main body The 81 or the three-dimensional substrate P is configured to move in the first moving direction M1. As a result, it is possible to realize the movement of the mounting member main body 81 or the three-dimensional substrate P in the first moving direction M1 by utilizing the simple configuration of the inclined portion 92c provided on the slide portion 92, and thus the mounting member. It is possible to further suppress the complexity of the configuration of the 80.

Further, in the first embodiment, as described above, the component mounting device 1 includes a laser measuring unit 9 that measures the height position of the surface of the mounting member main body 81 on the three-dimensional substrate P side or the surface of the three-dimensional substrate P. ing. As a result, it is possible to determine whether the height position of the surface of the mounting member main body 81 on the three-dimensional substrate P side or the surface of the three-dimensional substrate P is lower or higher than the reference height position. By holding the number 6, it is possible to reliably recognize whether or not the mounting member main body 81 and the three-dimensional substrate P have moved relatively in the separation direction.

[Second Embodiment]
Next, the configuration of the component mounting device 201 according to the second embodiment of the present invention will be described with reference to FIGS. 15 to 19. In the second embodiment, unlike the first embodiment in which the mounting member 80 moves in the direction away from the three-dimensional substrate P, the example in which the three-dimensional substrate P moves in the direction away from the mounting body 291 of the mounting member 280. explain. In the second embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

<Mounting member>
As shown in FIGS. 15 and 16, the mounting member 280 includes a mounting member main body 281, an urging member 82, and a slide portion 283.

The mounting member main body 281 is configured to mount the three-dimensional substrate P. Specifically, the mounting member main body 281 has a mounting body 291 and a fixing portion 292 integrally provided on the mounting body 291.

The fixing portion 292 is configured so that the relative positional relationship of the mounting member 280 with respect to the holding portion 64 of the mounting body 291 does not change. Specifically, the fixing portion 292 has a base portion 295 and a receiving portion 296, as shown in FIG.

The base portion 295 is formed in a cylindrical shape. The base portion 295 is formed with an insertion hole 295a into which the slide portion 283 is inserted. The base portion 295 is formed larger than the urging member 82 in a plan view.

A plurality (three) of the receiving portions 296 protrude from the base portion 295 in the second moving direction M2. The plurality of receiving portions 296 are arranged at equal intervals in the circumferential direction of the insertion holes 295a of the base portion 295 with predetermined gaps. The slide portion 283 is inserted into the predetermined gap, and has a function of guiding the movement of the slide portion 283 in each of the first movement direction M1 and the second movement direction M2. Further, an insertion space into which the slide portion 283 is inserted is formed in the space surrounded by the plurality of receiving portions 296. The plurality of receiving portions 296 are formed in a fan shape when viewed from the bottom.

Here, the three-dimensional substrate P is configured to move relative to the mounting member main body 281 in a direction in which the distance between the three-dimensional substrate P and the mounting member 280 increases. That is, the three-dimensional substrate P moves in the same first moving direction M1 as the moving direction of the slide portion 283 as the slide portion 283 moves in the first moving direction M1 due to the holding of the holding unit 6. At this time, when the three-dimensional substrate P moves in the first moving direction M1, the height position of the mounting member main body 281 is maintained.

Specifically, as shown in FIG. 16, the slide portion 283 has a cylindrical core portion 283a and a quadrangular prism-shaped protruding portion 283b. An engaging portion 96a is provided on the end face portion of the core portion 283a on the three-dimensional substrate P side so that the three-dimensional substrate P can be detachably attached. The length of the core portion 283a in the first moving direction M1 is such that the engaging portion 96a can engage with the engaging hole 73 of the three-dimensional substrate P after passing through the insertion space, the insertion hole 295a, and the insertion hole 93. Has

The protruding portion 283b protrudes outward in the radial direction from the core portion 283a. Further, the protruding portion 283b has an inclined portion 283c provided at an end portion opposite to the core portion 283a. The inclined portion 283c is inclined toward the side opposite to the core portion 283a toward the first moving direction M1. That is, as shown in FIG. 17A, since the inclined portion 283c is arranged at a position facing the claw portion 64a of the holding portion 64, the inclined portion 283c is inclined toward the holding portion 64 side toward the first moving direction M1. doing.

As shown in FIG. 16, a plurality (three) of the projecting portions 283b are arranged on the core portion 283a. The plurality of projecting portions 283b are arranged at equal intervals along the circumferential direction of the core portion 283a. Here, as shown in FIG. 17, the plurality of projecting portions 283b are arranged at positions corresponding to the plurality of claw portions 64a provided on the holding portion 64 of the holding unit 6, respectively. The plurality of projecting portions 283b face each of the plurality of claw portions 64a.

As shown in FIG. 17A, the urging member 82 has one end attached to the base portion 295 of the fixed portion 292 and the other end attached to the protruding portion 283b of the slide portion 283. As a result, the urging member 82 extends in the second moving direction M2 with reference to the other end portion attached to the fixed portion 292. Then, as shown in FIG. 17B, the urging member 82 is compressed in the first moving direction M1 as the slide portion 283 moves in the first moving direction M1. The other configurations of the second embodiment are the same as those of the first embodiment.

<Relative movement of the mounting member body with respect to the three-dimensional substrate>
Hereinafter, the relative movement of the mounting member main body 281 with respect to the three-dimensional substrate P will be described with reference to FIG.

As shown in FIG. 17A, in the non-holding state in which the mounting member 280 is not held by the holding portion 64 of the holding unit 6, the urging member 82 secondly moves with reference to the base portion 295 of the fixing portion 292. By extending in the direction M2, the protruding portion 283b of the slide portion 283 is pushed in the second moving direction M2, and the three-dimensional substrate P moves in the second moving direction M2. As described above, in the non-holding state, the distance between the three-dimensional substrate P and the mounting member 280 becomes smaller as the slide portion 283 moves in the second moving direction M2 due to the urging of the urging member 82. That is, the three-dimensional substrate P is placed in contact with the mounting member 80. Further, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 does not change, and the relative positional relationship between the mounting body 291 of the mounting member 280 and the holding portion 64 is close to each other.

As shown in FIG. 17B, in the holding state in which the mounting member 280 is held by the holding portion 64 of the holding unit 6, the claw portion 64a of the holding portion 64 abuts on the inclined portion 283c of the slide portion 283 to hold the mounting member 280. By doing so, the slide portion 283 moves in the first movement direction M1 along the inclination of the inclined portion 283c. Here, the holding portion 64 suppresses the movement of the mounting member main body 281 in the first moving direction M1 by abutting the claw portions 64a on the surface portions of both end portions in the circumferential direction of the plurality of receiving portions 296. .. Then, as the slide portion 283 moves in the first moving direction M1, the three-dimensional substrate P also moves in the first moving direction M1. At this time, the urging member 82 is compressed in the first moving direction M1 with reference to the base portion 295 of the fixing portion 292. As described above, in the holding state, the distance between the three-dimensional substrate P and the mounting member 280 increases as the slide portion 283 moves in the first moving direction M1. That is, the relative positional relationship between the three-dimensional substrate P and the holding portion 64 becomes close, and the relative positional relationship between the mounting body 291 of the mounting member 280 and the holding portion 64 does not change.

(Flowchart of 3D substrate transfer processing flow)
The three-dimensional substrate transfer processing flow will be described below with reference to FIGS. 18 and 19.

As shown in FIG. 18, since steps S1 to S3 are the same processes as the three-dimensional substrate transfer processing flow of the first embodiment, the description thereof will be omitted. Here, in the process of step S3, as shown in FIG. 19A, a predetermined mounting head 31 among the plurality of mounting heads 31 sucks the mounting body 291 of the mounting member 280 and transfers it to the holding unit 6. In this state, the three-dimensional substrate P is placed so as to be in contact with the mounting body 291 of the mounting member 280. As a result, it is possible to prevent the mounting heads 31 other than the predetermined mounting heads 31 from interfering with the three-dimensional substrate P.

As shown in FIG. 18, steps S4 to S6 are the same as the three-dimensional substrate transfer processing flow of the first embodiment, and thus the description thereof will be omitted. Here, in the process of step S6, as shown in FIG. 19B, after the mounting body 291 is released from being attracted by the mounting head 31, the mounting member 280 is held by the holding portion 64 of the holding unit 6. In the state, the three-dimensional substrate P moves relative to the mounting member 280, and the three-dimensional substrate P and the mounting member 280 are in a non-contact state. At this time, the distance between the three-dimensional substrate P and the mounting body 291 of the mounting member 280 is increased as the three-dimensional substrate P moves in the first moving direction M1 as the slide portion 283 moves in the first moving direction M1. , The gap S between the three-dimensional substrate P and the mounting body 291 of the mounting member main body 281 becomes larger.

Since step S7 is the same process as the three-dimensional substrate transfer processing flow of the first embodiment, the description thereof will be omitted. In step S21, the control device 10 measures the height position of the surface of the three-dimensional substrate P on the side opposite to the mounting member 280 side by the laser measuring unit 9 (see FIG. 19C).

In step S22, the control device 10 determines whether or not the surface of the three-dimensional substrate P opposite to the mounting member 280 side is arranged above the reference position (see FIG. 19C). When the surface of the control device 10 opposite to the mounting member 280 side of the three-dimensional substrate P is not arranged above the reference position, it is appropriate to hold the mounting member 280 by the holding portion 64 of the holding unit 6. It is determined that this has not been done, and the work of the component mounting device 201 is stopped. When the surface of the three-dimensional substrate P opposite to the mounting member 280 side is arranged above the reference position, the control device 10 ends the three-dimensional substrate transfer processing flow.

(Effect of the second embodiment)
In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the mounting member 280 further includes a fixing portion 292 integrally having a mounting member main body 281 on which the three-dimensional substrate P is mounted. A three-dimensional substrate P is attached to the slide portion 283. The distance between the three-dimensional substrate P and the mounting member 280 is such that the three-dimensional substrate P moves in the first moving direction M1 as the slide portion 283 moves in the first moving direction M1, and the three-dimensional substrate P and the mounting member main body move. It is configured to increase as the gap S between the 281 and the 281 increases. As a result, the three-dimensional substrate P is moved in the first moving direction M1 instead of the mounting member main body 281. Therefore, unlike the case where the mounting member main body 281 is moved in the first moving direction M1, the mounting member 280 slides. Since it does not move with the movement of the portion 283, it is possible to prevent the mounting member 280 from tilting. The other effects of the second embodiment are the same as those of the first embodiment.

(Modification example)
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the claims.

For example, in the first and second embodiments, the holding portion 64 moves the slide portion 92 (283) in the first moving direction M1 to increase the distance between the three-dimensional substrate P and the mounting member 80 (280). Although an example is shown, the present invention is not limited to this. In the present invention, as shown in FIG. 20 as a first modification of the first and second embodiments, the holding portion 64 has a cylinder 301 that can move in the first moving direction M1 and the second moving direction M2. May be good. In this case, as shown in FIG. 20A, by moving the cylinder 301 in the first moving direction M1, the slide portion 392 moves in the first moving direction M1. Then, as shown in FIG. 20B, by moving the cylinder 301 in the second moving direction M2, the sliding portion 392 moves in the second moving direction M2 by the urging force of the urging member 82.

Further, in the first and second embodiments, the predetermined mounting head 31 attracts the mounting body 91 (291) of the mounting member 80 (280) to the mounting member 80 (280) up to the transfer position L. ) The above three-dimensional substrate P is moved, but the present invention is not limited to this. In the present invention, as shown in FIG. 21 as a second modification of the first and second embodiments, the transport unit 2 directly transports the mounting member 80 (280) and directly holds the holding unit 6 at the stop position ST. The unit 64 may hold the mounting member 80 (280).

Further, in the first and second embodiments, the component mounting device 1 (201) includes a head unit 3 having a mounting head 31 for mounting the electronic component E on the three-dimensional substrate P as a head. As shown, the present invention is not limited to this. In the present invention, the component mounting device may be a composite component mounting device including a head unit having not only a mounting head but also a dispense head for applying a liquid agent such as an adhesive as a head.

Further, in the first and second embodiments, the component mounting device 1 (201) is provided with the mounting member 80 (280), but the present invention is not limited to this. In the present invention, the coating device may include a mounting member.

Further, in the first and second embodiments, in the transport member 71, a plurality of (two) mounting heads 31 attract a portion of the mounting member 80 (280) other than the three-dimensional substrate P, thereby causing the transport member 71. Although an example of separating a single mounting member 80 (280) from the transport body 72 of the above is shown, the present invention is not limited to this. In the present invention, a single mounting member may be separated from the transport body of the transport member by one or three or more mounting heads.

Further, in the first and second embodiments, for convenience of explanation, the processing operation of the control device 10 has been described by using a flow-driven flowchart in which the processing operations are sequentially performed along the processing flow. Not limited. In the present invention, the processing operation of the control device may be performed by event-driven (event-driven) processing that executes processing in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

Further, in the first and second embodiments, the three-dimensional substrate P is shown as an example of the "work" in the claims, but the present invention is not limited to this. In the present invention, the "work" in the claims may be an object to be mounted other than the three-dimensional substrate.

Further, in the first and second embodiments, the component mounting device 1 is shown as an example of the "work working device" in the claims, but the present invention is not limited to this. In the present invention, the "work work device" in the claims may be a work device to be mounted, which works on a three-dimensional object to be mounted on which electronic components are mounted by a mounting head.

Further, in the first and second embodiments, a plurality (two) of the laser measuring units 9 are attached to the back surface side (Y1 direction) of the head unit 3, but the present invention is limited to this. I can't. In the present invention, one or three or more laser measuring units may be attached to the back surface side (Y1 direction) of the head unit.

1,201 Parts mounting device (work work device)
3 Head unit 6 Holding unit 9 Laser measuring unit (height measuring unit)
31 Mounting head (head)
62 Tilt mechanism part (tilt movement part)
64 Holding part 80, 280 Mounting member 81, 281 Mounting member Main body 82 Biasing member 83, 292 Fixed part 92, 283 Sliding part 92c, 283c Inclined part M1 First moving direction M2 Second moving direction P Solid substrate (workpiece) )
S gap

Claims (10)

A mounting member on which a work having a three-dimensional shape is mounted, and
A holding unit that holds the work through the above-mentioned placing member,
A head unit having a head for transferring the work to the holding unit and performing at least one of applying a liquid agent or mounting a component on the work is provided.
When the work is transferred to the holding unit by the head, the work is placed on the above-mentioned placing member, and after the work is transferred to the holding unit, the head transfers the work to the work. When the work is performed, the work and the above-mentioned placing member are configured to be relatively movable in a direction in which they are separated from each other.
The work or the pre-described member is relative to the work or the pre-described member in a direction in which the distance between the work and the pre-described member increases due to the holding of the pre-described member of the holding unit after the work is transferred to the holding unit. Is configured to move
The above-mentioned placing member includes a slide portion that moves in the first moving direction by being held by the holding unit.
The distance between the work and the above-mentioned placing member is configured to increase as the sliding portion moves in the first moving direction.
The above-mentioned placing member further includes an urging member that urges the slide portion in a second moving direction opposite to the first moving direction.
A work work apparatus in which the distance between the work and the above-mentioned placing member becomes smaller as the slide portion moves in the second moving direction due to the urging of the urging member . A mounting member on which a work having a three-dimensional shape is mounted, and
A holding unit that holds the work through the above-mentioned placing member,
A head unit having a head for transferring the work to the holding unit and performing at least one of applying a liquid agent or mounting a component on the work is provided.
When the work is transferred to the holding unit by the head, the work is placed on the above-mentioned placing member, and after the work is transferred to the holding unit, the head transfers the work to the work. When the work is performed, the work and the above-mentioned placing member are configured to be relatively movable in a direction in which they are separated from each other.
The work or the pre-described member is relative to the work or the pre-described member in a direction in which the distance between the work and the pre-described member increases due to the holding of the pre-described member of the holding unit after the work is transferred to the holding unit. is configured to move, the
The above-mentioned placing member includes a slide portion that moves in the first moving direction by being held by the holding unit.
The distance between the work and the above-mentioned placing member is configured to increase as the sliding portion moves in the first moving direction.
The above-mentioned mounting member has the slide portion integrally, and further includes a mounting member main body on which the work is mounted and a fixing portion on which the work is mounted.
The distance between the work and the pre-described member is such that as the slide portion moves in the first movement direction and the pre-described member main body moves in the first movement direction, the distance between the work and the pre-described member is increased. A work work device that is configured to increase as the gap between the member and the main body increases. The above-mentioned mounting member has the slide portion integrally, and further includes a mounting member main body on which the work is mounted and a fixing portion on which the work is mounted.
The distance between the work and the pre-described member is such that as the slide portion moves in the first movement direction and the pre-described member main body moves in the first movement direction, the distance between the work and the pre-described member is increased. The work work apparatus according to claim 1 , which is configured to increase as the gap between the member and the main body increases. A mounting member on which a work having a three-dimensional shape is mounted, and
A holding unit that holds the work through the above-mentioned placing member,
A head unit having a head for transferring the work to the holding unit and performing at least one of applying a liquid agent or mounting a component on the work is provided.
When the work is transferred to the holding unit by the head, the work is placed on the above-mentioned placing member, and after the work is transferred to the holding unit, the head transfers the work to the work. When the work is performed, the work and the above-mentioned placing member are configured to be relatively movable in a direction in which they are separated from each other.
The work or the pre-described member is relative to the work or the pre-described member in a direction in which the distance between the work and the pre-described member increases due to the holding of the pre-described member of the holding unit after the work is transferred to the holding unit. Is configured to move
The above-mentioned placing member includes a slide portion that moves in the first moving direction by being held by the holding unit.
The distance between the work and the above-mentioned placing member is configured to increase as the sliding portion moves in the first moving direction.
The above-mentioned mounting member further includes a fixing portion integrally having a mounting member main body on which the work is mounted.
The work is attached to the slide portion.
The distance between the work and the pre-described member is such that the work and the pre-described member main body move as the work moves in the first movement direction as the slide portion moves in the first movement direction. A work work device that is configured to increase as the gap between them increases. The above-mentioned mounting member further includes a fixing portion integrally having a mounting member main body on which the work is mounted.
The work is attached to the slide portion.
The distance between the work and the pre-described member is such that the work and the pre-described member main body move as the work moves in the first movement direction as the slide portion moves in the first movement direction. The work work apparatus according to claim 1 , which is configured to increase as the gap between them increases. A mounting member on which a work having a three-dimensional shape is mounted, and
A holding unit that holds the work through the above-mentioned placing member,
A head unit having a head for transferring the work to the holding unit and performing at least one of applying a liquid agent or mounting a component on the work is provided.
When the work is transferred to the holding unit by the head, the work is placed on the above-mentioned placing member, and after the work is transferred to the holding unit, the head transfers the work to the work. When the work is performed, the work and the above-mentioned placing member are configured to be relatively movable in a direction in which they are separated from each other.
The work or the pre-described member is relative to the work or the pre-described member in a direction in which the distance between the work and the pre-described member increases due to the holding of the pre-described member of the holding unit after the work is transferred to the holding unit. Is configured to move
The above-mentioned placing member includes a slide portion that moves in the first moving direction by being held by the holding unit.
The distance between the work and the above-mentioned placing member is configured to increase as the sliding portion moves in the first moving direction.
The holding unit includes a holding portion that holds the work via the above-mentioned placing member, and a tilting moving portion that tilts the holding portion around a tilt axis that is orthogonal to the vertical direction.
In a state where the holding portion holds the work and the holding portion is tilted by the inclined moving portion, the distance between the work and the previously described member is increased by holding the holding portion of the holding unit. Work equipment that is configured in. The holding unit includes a holding portion that holds the work via the above-mentioned placing member, and a tilting moving portion that tilts the holding portion around a tilt axis that is orthogonal to the vertical direction.
In a state where the holding portion holds the work and the holding portion is tilted by the inclined moving portion, the distance between the work and the previously described member is increased by holding the holding portion of the holding unit. is configured, work work device according to claim 1. The head unit has a plurality of mounting heads as the heads to be mounted on the work by attracting the parts.
In a state where a predetermined mounting head among the plurality of mounting heads attracts the previously described mounting member and is transferred to the holding unit, the work is mounted so as to be in contact with the previously described mounting member. The work work apparatus according to claim 6 or 7. The slide portion has an inclined portion that inclines toward the holding portion side of the holding unit toward the first moving direction.
When the holding portion of the holding unit abuts and holds the inclined portion of the sliding portion, the sliding portion moves in the first moving direction along the inclination of the inclined portion, and the above-mentioned mounting member The work work apparatus according to any one of claims 6 to 8, wherein the main body or the work is configured to move in the first movement direction. The work work apparatus according to any one of claims 2 to 5, further comprising a height measuring unit for measuring the height position of the work-side surface of the above-mentioned placing member main body or the surface of the work.

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