JP2021009863A - Working machine and component mounting method - Google Patents

Abstract

To properly hold a component with a component holder.SOLUTION: A working machine includes one component holder with multiple suction portion, and a work head that can be attached and detached without using a tool, and performs mounting work of a component held by the suction portion selected from the multiple suction portion of the one component holder provided by the work head.SELECTED DRAWING: Figure 8

Description

The present invention relates to a working machine for mounting a component held by a component holder, and a component mounting method.

The following patent document describes a technique relating to a working machine that holds a part by a part holder and mounts the part.

Japanese Unexamined Patent Publication No. 10-100026 JP-A-2002-127068

An object of the present specification is to properly hold a part by a part holder.

In order to solve the above problems, the present specification includes one component holder having a plurality of suction portions, and a work head that can be attached to and detached from the component holder without using a tool. Disclosed is a working machine for mounting a component held by a suction portion selected from a plurality of suction portions of the one component holder provided.

In order to solve the above problems, the present specification includes a substrate holding device for holding a substrate, a plurality of types of component holders for holding components, and an arbitrary component holder from the plurality of types of component holders. In a work machine provided with a work head that is selected and automatically held, when the work head selects and holds a component holder having a plurality of suction portions from the plurality of types of component holders. Disclosed is a method of mounting a component on a substrate held by the substrate holding device, in which a component held without using one or more suction portions of the component holders having a plurality of suction portions is mounted.

In the present disclosure, one component holder has a plurality of suction portions, and the component holder can be attached and detached without using a tool for the work head. Then, the mounting work of the component held by the suction portion selected from the plurality of suction portions is executed. In addition, the mounting operation of the held component is executed without using one or more of the suction portions among the plurality of suction portions. This makes it possible for the component holder to properly hold the component.

It is a perspective view which shows the electronic component mounting apparatus. It is a perspective view which shows the suction nozzle. It is a block diagram which shows the control device. It is a perspective view which shows the multi-suction nozzle. It is sectional drawing in the AA line of FIG. It is a perspective view which shows the multi-suction nozzle in a state which holds a large part. It is a perspective view which shows the multi-suction nozzle in a state which holds a small part. It is a perspective view which shows the multi-suction nozzle in a state which holds a medium-sized part.

Hereinafter, examples of the present invention will be described in detail as embodiments for carrying out the present invention with reference to the drawings.

FIG. 1 shows the electronic component mounting device 10. The electronic component mounting device 10 has one system base 12 and two electronic component mounting machines (hereinafter, may be abbreviated as “mounting machine”) 14 adjacent to the system base 12. There is. The direction in which the mounting machines 14 are lined up is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

Each mounting machine 14 mainly includes a mounting machine main body 20, a transport device 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 27, and a mark camera (FIG. 3). (See) 28, a parts camera 29, a nozzle station 30, and a control device (see FIG. 3) 31. The mounting machine main body 20 is composed of a frame 32 and a beam 34 mounted on the frame 32.

The conveyor device 22 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are arranged on the frame 32 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40, 42 conveys the circuit board supported by the respective conveyor devices 40, 42 by the electromagnetic motor (see FIG. 3) 46 in the X-axis direction. Further, the circuit board is fixedly held by the board holding device (see FIG. 3) 48 at a predetermined position.

The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see FIG. 3) 52 that slides the slider 50 in the X-axis direction, and an electromagnetic motor (see FIG. 3) 54 that slides the slider 50 in the Y-axis direction. A mounting head 26 is attached to the slider 50, and the mounting head 26 is moved to an arbitrary position on the frame 32 by the operation of the two electromagnetic motors 52 and 54.

The mounting head 26 mounts an electronic component on a circuit board. The mounting head 26 includes one mounting unit (not shown), and the suction nozzle 60 is mounted on the tip of the mounting unit. As shown in FIG. 2, the suction nozzle 60 is composed of a body cylinder 62, a flange portion 64, and a suction pipe 66. The body cylinder 62 has a cylindrical shape, and the flange portion 64 is fixed so as to project over the outer peripheral surface of the body cylinder 62. Further, the suction pipe 66 has a thin pipe shape and is connected to the body cylinder 62 in a state of extending downward from the lower end of the body cylinder 62. On the other hand, the mounting unit of the mounting head 26 is formed with a mounting surface having a shape corresponding to the flange portion 64, and a suction port for sucking air is opened on the mounting surface. Then, in a state where the flange portion 64 of the suction nozzle 60 is in close contact with the mounting surface of the mounting unit, air is sucked from the suction port, so that the suction nozzle 60 is a tool on the mounting surface of the mounting unit at the flange portion 64. It can be attached and detached with one touch without using. At this time, the suction nozzle 60 mounted on the mounting unit communicates with the positive / negative pressure supply device (see FIG. 3) 70 via the negative pressure air and positive pressure air passages. As a result, the suction nozzle 60 sucks and holds the electronic component by the negative pressure, and releases the held electronic component by the positive pressure. Further, the mounting unit is moved up and down by the unit lifting device (see FIG. 3) 71. As a result, the vertical position of the electronic component sucked and held by the suction nozzle 60 is changed.

The feeder 27 is a feeder type feeder, and has a plurality of tape feeders 72 as shown in FIG. The tape feeder 72 houses the taped parts in a wound state. The taped component is a taped electronic component. Then, the tape feeder 72 feeds the taped parts by the feeding device (see FIG. 3) 74. As a result, the feeder-type supply device 27 supplies the electronic components at the supply position by sending out the taped components.

The mark camera (see FIG. 3) 28 is fixed to the slider 50 of the moving device 24 in a downward direction, and moves to an arbitrary position by the operation of the moving device 24. As a result, the mark camera 28 images an arbitrary position of the frame 32. Further, the parts camera 29 is arranged on the upper surface of the frame 32 between the transport device 22 and the supply device 27 in a state of facing upward. As a result, the parts camera 29 images the parts and the like held by the suction nozzle 60.

The nozzle station 30 has a nozzle tray 76. The nozzle tray 76 is formed with a plurality of accommodating portions 78 for accommodating the suction nozzles. In the nozzle station 30, the suction nozzle 60 mounted on the mounting unit of the mounting head 26 and the suction nozzle housed in the accommodating portion 78 of the nozzle tray 76 are automatically replaced with one touch. The one-touch replacement of the suction nozzle means the replacement of the suction nozzle performed without using a tool or the like. Incidentally, the nozzle tray 76 has a suction nozzle having a nozzle diameter different from that of the suction nozzle 60, specifically, for example, a suction nozzle having a nozzle diameter larger than that of the suction nozzle 60 (hereinafter, referred to as “large diameter suction nozzle”). ), A suction nozzle having a nozzle diameter smaller than that of the suction nozzle 60 (hereinafter, referred to as “small diameter suction nozzle”), a nozzle having a plurality of suction portions, and the like are accommodated. Further, the suction nozzle 60 may be referred to as a medium-diameter suction nozzle 60 in order to distinguish it from a large-diameter suction nozzle and a small-diameter suction nozzle.

As shown in FIG. 3, the control device 31 includes a controller 100 and a plurality of drive circuits 102. The plurality of drive circuits 102 are connected to the electromagnetic motors 46, 52, 54, the substrate holding device 48, the positive / negative pressure supply device 70, the unit elevating device 71, and the feeding device 74. The controller 100 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 102. As a result, the operation of the transport device 22, the moving device 24, and the like is controlled by the controller 100. The controller 100 is also connected to the image processing device 106. The image processing device 106 is a device for processing the image pickup data captured by the mark camera 28 and the parts camera 29. As a result, the controller 100 acquires various information from the imaging data.

In the mounting machine 14, the circuit board held by the transport device 22 can be mounted by the mounting head 26 according to the above-described configuration. Specifically, according to the command of the controller 100, the circuit board is conveyed to the working position, and the circuit board is fixedly held by the board holding device 48 at that position. Next, the mark camera 28 moves above the circuit board according to the command of the controller 100 and images the circuit board. As a result, information on the holding position of the circuit board and the like can be obtained. Further, the tape feeder 72 sends out the taped component according to the command of the controller 100, and supplies the electronic component at the supply position.

Then, the mounting head 26 moves above the supply position of the electronic component according to the command of the controller 100, and the suction nozzle 60 sucks and holds the electronic component. Subsequently, the mounting head 26 moves above the parts camera 29, and the electronic component held by the suction nozzle is imaged by the parts camera 29. As a result, information on the holding posture of the parts and the like can be obtained. Then, the mounting head 26 moves above the circuit board and mounts the electronic component on the circuit board based on the holding position of the circuit board, the holding posture of the electronic component, and the like.

The suction nozzle mounted on the mounting head 26 is replaced according to the size, shape, and the like of the electronic component mounted on the circuit board. Specifically, for example, a small-diameter suction nozzle is used when mounting a small-sized electronic component, and a large-diameter suction nozzle is used when mounting a large-sized electronic component. During the mounting work, the medium diameter suction nozzle 60 is used. Therefore, every time the size of the component to be mounted changes, the mounting head 26 needs to move to the nozzle station 30 to replace the suction nozzle. As described above, if the suction nozzle replacement work is executed every time the size of the component to be mounted changes, the cycle time may be delayed.

Further, in order to perform the mounting work of electronic components having different sizes without replacing the suction nozzle, the mounting work can be performed using a plurality of mounting machines 14. Specifically, for example, a mounting system is configured by three mounting machines 14, the first mounting machine 14 mounts a small-diameter suction nozzle on the mounting head 26, and the second mounting machine 14 mounts the mounting system. A medium-diameter suction nozzle 60 is mounted on the head 26, and a large-diameter suction nozzle is mounted on the mounting head 26 in the third mounting machine 14. Then, the first mounting machine 14 executes the mounting work of the electronic components of a small size, and the second mounting machine 14 executes the mounting work of the electronic components of an intermediate size, and the third mounting machine 14 executes the mounting work. The mounting machine 14 executes mounting work of a large-sized electronic component. As a result, it is possible to mount electronic components of different sizes without replacing the suction nozzle. However, it is necessary to configure the mounting system with three mounting machines 14, which may lead to an increase in occupied space and an increase in capital investment.

In view of this, the mounting machine 14 is provided with a suction nozzle (see FIG. 4) (hereinafter, referred to as “multi-suction nozzle”) 110 capable of holding electronic components of different sizes. As shown in FIGS. 4 and 5, the multi-suction nozzle 110 is composed of a nozzle body 112, a flange portion 114, and five suction pads 116, 118, 120, 122, 124. Note that FIG. 4 is a perspective view of the multi-suction nozzle 110, and FIG. 5 is a cross-sectional view taken along the line AA of FIG.

The nozzle body 112 is composed of a body cylinder 130 and four support arms 132, 134, 136, and 138. The fuselage cylinder 130 is generally in the shape of a quadrangular prism, and the fuselage cylinder 130 is formed with a main flow path 140 that opens at an upper end surface and a lower end surface. Further, the four support arms 132, 134, 136, 138 extend laterally from the four side surfaces of the fuselage cylinder 130 and then extend downward. The four support arms 132, 134, 136, and 138 extend downward to a position at the same height as the lower end surface of the fuselage cylinder 130. That is, the lower end surface of the fuselage cylinder 130 and the lower end surfaces of the four support arms 132, 134, 136, 138 are flush with each other. Further, the four support arms 132, 134, 136, 138 communicate with the main flow path 140 of the fuselage cylinder 130, and four support arms 132, 134, 136, 138 are opened at the lower end surfaces of the four support arms 132, 134, 136, 138. Sub-channels 150, 152, 154, 156 are formed. The inner diameters of the four sub-flow paths 150, 152, 154, 156 are the same, but the inner diameter of each of the sub-flow paths 150, 152, 154, 156 is 1/10 of the inner diameter of the main flow path 140. It is said to be a degree.

Further, the flange portion 114 has the same shape as the flange portion 64 of other types of suction nozzles such as the medium-diameter suction nozzle 60 so as to be compatible with the mounting to the mounting head 26. It is fixed to the upper end surface. A through hole 160 having the same inner diameter as the main flow path 140 of the body cylinder 130 is formed in the flange portion 114. Then, the through hole 160 of the flange portion 114 and the main flow path 140 of the body cylinder 130 are coaxially communicated with each other.

Further, the five suction pads 116, 118, 120, 122, 124 are made of an elastically deformable material and have the same dimensions. Each of the suction pads 116, 118, 120, 122, 124 has a hollow inside and is open to the upper end surface and the lower end surface. Each of the suction pads 116, 118, 120, 122, 124 has a trumpet shape in which the inner diameter becomes wider from the upper end portion to the lower end portion. The opening of each suction pad 116, 118, 120, 122, 124 to the upper end surface is substantially the same as the inner diameter of the main flow path 140, and is below each suction pad 116, 118, 120, 122, 124. The opening to the end face is approximately twice as large as the opening to the upper end face.

The suction pad 116 is fixed to the lower end surface of the body cylinder 130, and the inside of the suction pad 116 communicates with the main flow path 140. Further, the suction pads 118, 120, 122, 124 are fixed to the lower end surfaces of the four support arms 132, 134, 136, 138, and the inside of the suction pads 118, 120, 122, 124 is a sub flow path 150. , 152, 154, 156. As described above, the lower end surface of the fuselage cylinder 130 and the lower end surfaces of the four support arms 132, 134, 136, 138 have the same height. Then, five suction pads 116, 118, 120, 122, 124 having the same dimensions are fixed to the lower end surfaces of the body cylinder 130 and the four support arms 132, 134, 136, 138. Therefore, the lower end surfaces of the five suction pads 116, 118, 120, 122, and 124 are also set to have the same height. Further, the suction pad 116 communicating with the main flow path 140 is described as the main suction pad 116, and the suction pads 118, 120, 122, 124 communicating with the sub flow paths 150, 152, 154, 156 are referred to as the sub suction pads 118. , 120, 122, 124 may be described.

The multi-suction nozzle 110 having such a structure is housed in the nozzle tray 76 of the nozzle station 30, and is automatically mounted on the mounting unit of the mounting head 26 in the same manner as the suction nozzle 60. That is, in a state where the flange portion 114 of the multi-suction nozzle 110 is in close contact with the mounting surface of the mounting unit of the mounting head 26, air is sucked from the suction port, so that the multi-suction nozzle 110 is mounted on the flange portion 114. It is automatically mounted on the mounting surface of the unit with one touch. At this time, in the multi-suction nozzle 110 mounted on the mounting unit, the through hole 160 of the flange portion 114 communicates with the positive / negative pressure supply device (see FIG. 3) 70 via the negative pressure air and positive pressure air passages. As a result, negative pressure and positive pressure are selectively supplied to the main flow path 140 of the multi-suction nozzle 110.

As described above, the multi-suction nozzle 110 mounted on the mounting head 26 is capable of holding electronic components having different sizes and shapes. Specifically, as shown in FIG. 6, when the large-sized component (hereinafter, referred to as “large component”) 170 is a component to be held, the entire lower end surface of the main suction pad 116 is covered. The entire lower end surfaces of the four sub-suction pads 118, 120, 122, and 124 are in close contact with the substantially central portion of the large component 170, and are in close contact with the four equal parts surrounding the substantially center of the large component 170. That is, the openings on the lower end surfaces of the main suction pad 116 and the four sub suction pads 118, 120, 122, 124 are sealed by the large component 170. Then, by supplying a negative pressure to the main flow path 140, the large component 170 is sucked and held by the main suction pad 116 and the four sub suction pads 118, 120, 122, 124. That is, all of the five suction pads 116, 118, 120, 122, 124 adhere to one component, and all of the five suction pads 116, 118, 120, 122, 124. One part is adsorbed and held by the thing. At this time, since the large component 170 is evenly held by the five suction pads 116, 118, 120, 122, 124, even a large-sized component is appropriately held by the multi-suction nozzle 110.

Further, as shown in FIG. 7, when the small size component (hereinafter referred to as “small component”) 176 is a component to be held, the entire lower end surface of the main suction pad 116 is the small component 176. However, the entire lower end surfaces of the four sub-suction pads 118, 120, 122, 124 do not adhere to the small component 176. That is, the opening on the lower end surface of the main suction pad 116 is sealed by the small component 176, but at least a part of the opening on the lower end surface of the four sub suction pads 118, 120, 122, 124 is released and communicates with the atmosphere. It will be in the state of. Then, by supplying a negative pressure to the main flow path 140, the small component 176 is sucked and held by the main suction pad 116. On the other hand, since at least a part of the opening on the lower end surface of the four sub-suction pads 118, 120, 122, 124 is released, negative pressure leaks from the four sub-suction pads 118, 120, 122, 124. To do. However, the inner diameter of the sub flow paths 150, 152, 154, 156 communicating with the sub suction pads 118, 120, 122, 124 is about 1/10 of the inner diameter of the main flow path 140. Therefore, the pressure loss due to the leakage of negative pressure from the sub suction pads 118, 120, 122, 124 is smaller than that when the main suction pad 116 communicates with the atmosphere, and the suction force by the main suction pad 116 does not decrease so much. .. As a result, the opening on the lower end surface of the main suction pad 116 is sealed by the small component 176, but at least a part of the opening on the lower end surface of the four sub suction pads 118, 120, 122, 124 is opened. Also, the small component 176 is properly held by the multi-suction nozzle 110. That is, even when the small component 176 is held by the main suction pad 116 without using the four sub suction pads 118, 120, 122, 124, the small component 176 is appropriately held by the multi-suction nozzle 110. Will be done.

Further, as shown in FIG. 8, when the component having a size between the large component 170 and the small component 176 (hereinafter referred to as “medium-sized component”) 178 is a component to be held, the main suction pad The entire lower end surfaces of the 116 and the two sub-suction pads 120 and 122 are in close contact with the medium-sized component 178, but the entire lower end surfaces of the remaining two sub-suction pads 118 and 124 are not in close contact with the medium-sized component 178. That is, the openings on the lower end surfaces of the main suction pad 116 and the two sub suction pads 120 and 122 are sealed by the medium-sized component 178, but at least one of the openings on the lower end surfaces of the remaining two sub suction pads 118 and 124. The part is released. Then, by supplying a negative pressure to the main flow path 140, the medium-sized component 178 is sucked and held by the main suction pad 116 and the two sub suction pads 120 and 122. At this time, the negative pressure leaks from the remaining two sub-adsorption pads 118 and 124, but as described above, the pressure loss due to the negative pressure leak is small. As a result, the openings on the lower end surfaces of the main suction pad 116 and the two sub suction pads 120 and 122 are sealed by the medium-sized component 178, but at least the openings on the lower end surfaces of the remaining two sub suction pads 118 and 124 are sealed. The medium-sized component 178 is properly held by the multi-suction nozzle 110 even in a partially released state. That is, even when the medium-sized component 178 is held by using the main suction pad 116 and the two sub-suction pads 120 and 122 without using the two sub-suction pads 118 and 124, the medium-sized component 178 is multi-suctioned. It is properly held by the nozzle 110.

In this way, in the multi-suction nozzle 110, electronic parts of different sizes can be appropriately held by holding the parts by the suction pads selected from the five suction pads 116, 118, 120, 122, 124. Can be retained. As a result, when the mounting work of electronic components having different sizes is executed in one mounting machine 14, it is possible to suppress the replacement work of the suction nozzle and prevent the delay of the cycle time. Further, even with a small number of mounting machines 14, it is possible to carry out mounting work of electronic parts of different sizes while suppressing replacement work of suction nozzles, so that the space occupied by the mounting machines 14 can be suppressed and capital investment can be made. It is possible to suppress it.

When the small component 176 or the medium component 178 is held by the multi-suction nozzle 110, the main suction pad 116 is sealed by the component, but at least one of the four sub suction pads 118, 120, 122, 124 is used. One or more things are in a released state. However, the inner diameter of the sub flow paths 150, 152, 154, 156 communicating with each of the sub suction pads 118, 120, 122, 124 is set to about 1/10 of the inner diameter of the main flow path 140 communicating with the main suction pad 116. ing. Therefore, the pressure loss due to the leakage of negative pressure from the sub suction pads 118, 120, 122, 124 is relatively small, and the suction force by the main suction pad 116 is reduced to the extent that the parts cannot be held. do not. As a result, if the main suction pad 116 is in close contact with the component, the component is suitable even when one or more of the four sub suction pads 118, 120, 122, 124 are released. Retention is guaranteed.

Further, the inner diameters of the suction pads 116, 118, 120, 122, 124 that are in close contact with the parts are increased as they are closer to the suction surface. That is, the suction area of each suction pad 116, 118, 120, 122, 124 is the main flow path 140 or the sub flow path 150, 152, 154, 156 communicating with each suction pad 116, 118, 120, 122, 124. It is larger than the cross-sectional area. As a result, by sucking and holding the component in a large area, the suction force can be increased and the component can be held appropriately.

By the way, in the above embodiment, the mounting machine 14 is an example of a working machine. The transport device 22 is an example of a substrate holding device. The mounting head 26 is an example of a working head. The positive / negative pressure supply device 70 is an example of a negative pressure source. The multi-suction nozzle 110 is an example of a component holder. The suction pads 116, 118, 120, 122, 124 are examples of suction portions. The main flow path 140 and the sub flow paths 150, 152, 154, 156 are examples of flow paths.

Further, the present invention is not limited to the above examples, and can be carried out in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the suction pads 116, 118, 120, 122, 124 are adopted as the suction parts for sucking the parts, but an opening for sucking air may be formed. Anyway, a suction tube, a suction surface, a suction port, etc. can be adopted as the suction part. For example, the shape may be similar to that of a general component suction nozzle as shown in FIG. Further, the material does not have to be a material that can be elastically deformed, and may be formed of a rigid body such as steel like a general component suction nozzle.

Further, in the above embodiment, the main flow path 140 communicates with the positive / negative pressure supply device 70 via the negative pressure air and positive pressure air passages, and the sub flow paths 150, 152, 154, and 156 are connected from the main flow path 140. Although it is branched, the main flow path 140 and the sub flow paths 150, 152, 154, 156 may communicate with the positive / negative pressure supply device 70 via the negative pressure air and positive pressure air passages. That is, the main flow path 140 and the sub flow paths 150, 152, 154, 156 may be any paths capable of sucking air from the suction pads 116, 118, 120, 122, 124.

Further, in the above embodiment, one component is held by using the suction pads selected from the five suction pads 116, 118, 120, 122, 124, but even if a plurality of parts are held. Good. That is, for example, by holding one component for each of the five suction pads 116, 118, 120, 122, 124, the multi-suction nozzle 110 may hold five components. Further, for example, each of the three suction pads out of the five suction pads 116, 118, 120, 122, 124 holds one component, so that the multi-suction nozzle 110 holds the three components. May be done. In such a case, the two suction pads are in an open state. The sizes and types of the three parts held by the multi-suction nozzle 110 may be different. In the mounting head provided with a plurality of suction nozzles, each suction nozzle holds one component and holds a plurality of components. Then, when the mounting work of the component on the substrate is executed by the mounting head in which all the suction nozzles hold the component, the component held from each suction nozzle is released. That is, in the operation of a mounting head having a plurality of suction nozzles, there are often no suction nozzles open to the atmosphere before the component mounting work, and each suction nozzle is used during the mounting work of the held component. Are sequentially released to the atmosphere. However, even in a mounting head provided with such a plurality of suction nozzles, as in the case of the multi-suction nozzles in the embodiment, when a component is sucked and the component is mounted on the substrate, a plurality of suction nozzles are provided. Since the same is true in the above, various aspects can be adopted. On the other hand, each of the three suction pads out of the five suction pads 116, 118, 120, 122, and 124 holds one component, so that the multi-suction nozzle 110 holds the three components. In this case, the two suction nozzles are open before the mounting work.

Further, in the above embodiment, the positive / negative pressure supply device 70 is adopted as the negative pressure source, but various devices are adopted as the negative pressure source as long as the negative pressure can be supplied, that is, the air can be sucked. can do.

14: Mounting machine (working machine) 22: Conveying device (board holding device) 26: Mounting head (working head) 70: Positive / negative pressure supply device (negative pressure source) 110: Multi-suction nozzle (parts holder) 116: Suction pad (Adsorption part) 118: Adsorption pad (adsorption part) 120: Adsorption pad (adsorption part) 122: Adsorption pad (adsorption part) 124: Adsorption pad (adsorption part) 140: Main flow path (flow path) 150: Sub flow path (Flow path) 152: Sub flow path (flow path) 154: Sub flow path (flow path) 156: Sub flow path (flow path)

Claims (4)

One component holder with multiple suction parts and
The component holder is provided with a work head that can be attached and detached without using a tool, and the component held by the suction portion selected from the plurality of suction portions of the one component holder provided by the work head is mounted. A work machine that performs work. Each of the plurality of suction portions
It communicates with one negative pressure source through the flow path,
The working machine according to claim 1, wherein the diameter of any of the plurality of flow paths communicating with the plurality of suction portions is different. The working machine according to claim 1 or 2, wherein the mounting work of one component held by all the suction parts among the plurality of suction parts is performed. It is provided with a board holding device for holding a board, a plurality of types of component holders for holding components, and a work head for automatically selecting and automatically holding any component holder from the plurality of types of component holders. In the work machine, when the work head selects and holds a component holder having a plurality of suction portions from the plurality of types of component holders, among the component holders having the plurality of suction portions. A method for mounting a component that is held without using one or more suction portions of the above on a board held by the board holding device.

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