JP4347070B2 - Component mounting method and apparatus - Google Patents

Description

  The present invention relates to a component mounting method and apparatus for mounting components such as bare IC components on a mounting object such as a liquid crystal panel with high accuracy and efficiency.

  As a mounting device for mounting electronic components on a liquid crystal panel, the liquid crystal panel is held and the electronic component mounting site of the liquid crystal panel is recognized and positioned on the mounting stage, and the recognition mark provided on the liquid crystal panel is recognized by the recognition camera. Then, the liquid crystal panel is temporarily retracted and the electronic component held by the mounting head is recognized and positioned at the mounting position on the mounting stage, and the recognition mark provided on the electronic component is recognized by the recognition camera, and then the electronic component is It is known to temporarily retract and position the liquid crystal panel on the recognition / mounting stage, correct the position of the liquid crystal panel according to the recognition result, and then mount the electronic component on the liquid crystal panel. (For example, refer to Patent Document 1).

Further, as shown in FIG. 9, the conveying jig 2 holding and holding one or a plurality of liquid crystal panels 1 as the mounting object is conveyed in the X direction by the positioning means 3 and positioned at a predetermined position, and the mounting means 5 Then, the component is held by the component supply unit 4 disposed at a position away from the positioning position of the liquid crystal panel 1 in the Y direction, and the holding position of the component is roughly recognized by the recognition camera 6 at the mounting position. The position is corrected according to the recognition result, and then the recognition camera 6 is switched to a high magnification for fine recognition, and then the position is corrected again with high accuracy according to the fine recognition result, and then mounted at a predetermined position on the liquid crystal panel 1. Something configured to do so is also considered. The mounting means 5 includes an XY robot 7 that can move and position the movable head 8 in the X and Y directions, and a position adjustment mechanism 9 that adjusts the vertical position and the rotational position around the axis of the movable head 8. And a mounted mounting head 10. Moreover, the anisotropic conductive film is affixed on the component mounting location of the liquid crystal panel 1, and is temporarily fixed by mounting components thereon, and heat and load are applied in the subsequent main pressurizing step. This completes the implementation.
JP 2001-232527 A

  However, in the mounting apparatus disclosed in the above-mentioned Patent Document 1, in order to ensure high-precision mounting, the recognition mark of the liquid crystal panel that is positioned by a single recognition camera with the required accuracy disposed on the recognition / mounting stage is used. After recognizing and then retracting the liquid crystal panel, the electronic component is positioned at the mounting position to recognize the recognition mark, and further, the electronic component is retracted and positioned while correcting the position of the liquid crystal panel, and the electronic component is mounted. Since the mounting operation is performed on the recognition / mounting stage, there is a problem that the mounting tact is long and the mounting efficiency of the electronic component is poor. In addition, the recognition marks on the liquid crystal panel and the component are recognized once, and it is difficult to ensure that the recognition mark falls within the field of view of the high-accuracy recognition camera. There is a problem of being complicated and time consuming.

  In the mounting apparatus shown in FIG. 9, the magnification is switched by one recognition camera, and coarse recognition and correction and fine recognition and correction are performed to ensure high-precision mounting. Since the correction is performed, there is a problem that the tact loss is large and the mounting efficiency of the parts is poor.

  In view of the above-described conventional problems, an object of the present invention is to provide a component mounting method and apparatus capable of realizing high mounting efficiency while ensuring high-precision mounting.

The component mounting method of the present invention includes a step of holding a component of a component supply unit by a mounting head, a step of roughly recognizing a component position held at a coarse recognition position by a coarse recognition camera, and a position correction according to the coarse recognition result. A step of precisely recognizing the position of the component held at the fine recognition position with a fine recognition camera, a step of correcting the position according to the result of the fine recognition, and a step of mounting the position-corrected component on the mounting object on the mounting stage And a plurality of mounting heads share the component supply unit, the coarse recognition camera, the fine recognition camera, and the mounting stage, and simultaneously perform different process operations so that the mounting heads do not interfere with each other. It is performed in parallel, and components are sequentially mounted on each mounting head.

  According to this configuration, each mounting head can ensure high-precision mounting by mounting parts with high accuracy through the precision recognition / correction process after the component holding process, coarse recognition / correction process, and By using multiple mounting heads to perform different process operations simultaneously in parallel so as not to interfere with each other, the same short mounting as one recognition / correction operation is performed while performing two recognition / correction operations as described above. Components can be mounted sequentially with tact, and high mounting efficiency can be realized. It should be noted that the fine recognition position and the mounting position may be the same position, and by doing so, it can be mounted without moving as it is after the fine recognition / correction, so that mounting with higher precision can be realized.

Further, the component mounting apparatus of the present invention holds the component in the component supply unit, the coarse recognition unit installed in the coarse recognition position, the fine recognition unit installed in the fine recognition position, and the component supply unit in the mounting head, A plurality of mounting means for performing correction by coarse recognition of the held component position and correction by fine recognition and mounting on a mounting target in the mounting stage, and the plurality of mounting means include the component supply unit, the coarse recognition means, and the The precision recognition means and the mounting stage are shared , the mounting heads are operated in parallel so as not to interfere with each other, and the components are sequentially mounted on each mounting head.

  According to this configuration, high-accuracy mounting can be ensured by performing position recognition by performing coarse recognition and fine recognition twice of components as described above, and the mounting head can be secured by a plurality of mounting means. By operating in parallel so that they do not interfere with each other, components can be mounted sequentially with the same short mounting tact as a single recognition / correction operation, and high mounting efficiency can be achieved. Since the means is shared by a plurality of mounting means, the equipment cost can be reduced as compared with the case where a plurality of component mounting apparatuses are arranged in parallel.

In addition, there are two parallel Y-direction movement tables arranged at intervals, and an X-direction movement table arranged in a direction orthogonal to these Y-direction movement tables, When the component supply unit, the coarse recognition unit, and the fine recognition unit are arranged along a straight line and are attached to the end portion of the X-direction moving table at an interval , a pair of mounting units is arranged between the pair of mounting units . It is possible to arrange components close to each other with a minimum interval necessary for operation, to realize a component mounting apparatus that achieves the above-described effects with a compact configuration, and to reduce the amount of movement of the mounting head in the direction orthogonal to the straight line. Therefore, high accuracy can be easily ensured.

  According to the component mounting method and apparatus of the present invention, high-precision mounting can be ensured by mounting a component through a fine recognition / correction step after the component holding step and coarse recognition / correction step. In addition, by using a plurality of mounting heads to simultaneously perform different process operations so as not to interfere with each other, the same short mounting tact as one recognition / correction operation is performed while performing two recognition / correction operations. Components can be mounted sequentially, and high mounting efficiency can be realized.

  Hereinafter, an embodiment of a component mounting method and apparatus according to the present invention will be described with reference to FIGS.

  In FIG. 1, reference numeral 11 denotes a component mounting apparatus, which mounts components such as bare IC components on the liquid crystal panel 1 which is a mounting object, as in the conventional component mounting apparatus described with reference to FIG. Here, the same components as those described in FIG. 9 are denoted by the same reference numerals in a simplified manner. Further, the positioning means 3 for positioning the liquid crystal panel 1 shown in FIG. Reference numeral 12 denotes a stage on which components are mounted while supporting the liquid crystal panel 1 positioned by the positioning means 3.

  In the component mounting apparatus 11, a coarse recognition camera 14 as a coarse recognition means having a large field of view and a high magnification fine recognition means on a straight line in the Y direction connecting the component supply position 13 and the stage 12 in the component supply unit 4. A precision recognition camera 15 is provided. The coarse recognition camera 14 and the fine recognition camera 15 are configured to be movable and positioned in the XY direction on the XY table 16 in order to recognize a plurality of recognition marks provided on the parts.

A pair of mounting means 5 (5A, 5B) are arranged in parallel at the upper part of both sides of the straight line in the Y direction connecting the component supply position 13, the coarse recognition camera 14, the fine recognition camera 15 and the stage 12. It is installed. These mounting means 5 are moved and positioned by a Y-direction moving table 17 that moves and positions in the Y direction between the stage 12 and the component supply unit 4, and moved and positioned by the Y-direction moving table 17, and are moved and positioned in the X direction. An X-direction moving table 18, a position adjusting mechanism 9 that is moved and positioned by the X-direction moving table 18, and a mounting head 10 are provided. As shown in FIG. 1, the two Y-direction moving tables 17 are arranged in parallel with each other at an interval.
Has been. An X-direction moving table 18 is disposed in a direction orthogonal to these Y-direction moving tables 17. The mounting head 10 is mounted on the end portion of the X-direction moving table 18 at the above-described interval (between the two Y-direction moving tables 17 and 17). The component supply unit 4, the coarse recognition camera 14, and the fine recognition camera 15 are arranged along a straight line at the intervals. The mounting heads 10 of the two mounting means 5A and 5B share the component supply unit 4, the coarse recognition camera 14, the fine recognition camera 15, and the mounting stage 12 to perform mounting work.

  The position adjusting mechanism 9 and the mounting head 10 are disposed at the end of the X direction moving table 18 facing the space between the pair of Y direction moving tables 17, 17. The exit / retreat operation between the position projected so as to be positioned on the straight line in the Y direction and the position where the position adjusting mechanism 9 and the mounting head 10 of both the mounting means 5 are retracted to a position where they do not interfere with each other. It is configured to be movable. Therefore, the protrusion amount and the movement amount of the X-direction movement table 18 from the Y-direction movement table 17 can be small, and even if the X-direction movement table 18 is supported by the Y-direction movement table 17 in a cantilever state, the position is easily high. Accuracy can be ensured.

  Next, the mounting operation with the above configuration will be described mainly with reference to the operation flow diagram of FIG. 2 and the operation explanatory diagrams of FIGS. First, as shown in FIG. 3, the mounting head 10 of the mounting means 5A is positioned at the component supply position 13 of the component supply unit 4 and the component is taken out (step # 1A). At that time, the X-direction moving table 18 of the mounting means 5A is caused to project and the mounting head 10 is positioned directly above the component supply position 13. The mounting head 10 of the mounting means 5B moves from the coarse recognition position to the fine recognition position by the fine recognition camera 15, performs fine recognition, and performs position correction based on the recognition result (step # 1B).

  Next, as shown in FIG. 4, the mounting head 10 of the mounting means 5A is moved toward the coarse recognition position by the coarse recognition camera 14 (step # 2A). At that time, the mounting means 5A avoids the possibility of interference of the mounting head 10 by moving the X-direction moving table 18 in the Y-direction while retracted. The mounting head 10 of the mounting means 5B mounts the position-corrected component on the liquid crystal panel 1 positioned on the stage 12 (step # 2B).

  Next, as shown in FIG. 5, the position of the component held by the mounting head 10 of the mounting means 5A is roughly recognized by the coarse recognition camera 14, and the position is corrected according to the recognition result (step # 3A). . At that time, the X-direction moving table 18 of the mounting means 5A is caused to project and the mounting head 10 is positioned directly above the coarse recognition camera 14. Further, the mounting head 10 of the mounting means 5B moves toward the component supply position 13 of the component supply unit 4 (step # 3B). At this time, the possibility of interference of the mounting head 10 is avoided by moving the mounting unit 5B in the Y direction with the X-direction moving table 18 retracted.

  Next, as shown in FIG. 6, the mounting head 10 of the mounting means 5A moves to the fine recognition position by the fine recognition camera 15, performs fine recognition, and corrects the position based on the recognition result (step # 4A). . The mounting head 10 of the mounting means 5B is positioned at the component supply position 13 of the component supply unit 4 and takes out the component (step # 4B). At that time, the X-direction moving table 18 of the mounting means 5B is caused to project and the mounting head 10 is positioned immediately above the component supply position 13.

  Next, as shown in FIG. 7, the mounting head 10 of the mounting means 5A mounts the position-corrected component on the liquid crystal panel 1 positioned on the stage 12 (step # 5A). Further, the mounting head 10 of the mounting means 5B is moved toward the coarse recognition position by the coarse recognition camera 14 (step # 5B). At that time, the mounting means 5B moves in the Y direction with the X-direction moving table 18 retracted, thereby avoiding the possibility of interference of the mounting head 10.

  Next, as shown in FIG. 8, the mounting head 10 of the mounting means 5A moves toward the component supply position 13 of the component supply unit 4 (step # 6A). At that time, by moving the X-direction moving table 18 of the mounting means 5A in the retracted state, the possibility of interference of the mounting head 10 is avoided. Further, the position of the component held by the mounting head 10 of the mounting means 5B is roughly recognized by the coarse recognition camera 14, and position correction is performed according to the recognition result (step # 6B). At that time, the X-direction moving table 18 of the mounting means 5A is caused to project and the mounting head 10 is positioned directly above the coarse recognition camera 14.

  Thereafter, the mounting means 5A and 5B return to the operations of Steps # 1A and 1B, respectively, and the above operation is repeated, whereby the components are alternately mounted on the liquid crystal panel 1 by the mounting heads 10 of the mounting means 5A and 5B.

  Thus, it is possible to ensure high-accuracy mounting by performing position recognition by performing two recognitions of rough recognition and fine recognition of parts, and in parallel so that the mounting heads do not interfere with each other by a plurality of mounting means. By operating in this manner, it is possible to sequentially mount components with the same short mounting tact as in one recognition / correction operation, and high mounting efficiency can be realized.

  The component mounting method and apparatus according to the present invention can be mounted with high accuracy by performing two recognitions of coarse recognition and fine recognition and respective correction operations, and using a plurality of mounting heads so as not to interfere with each other. By performing the operations simultaneously in parallel, it can be mounted with the same short mounting tact as a single recognition / correction operation. Therefore, components that require high mounting accuracy such as mounting of bare IC components on liquid crystal panels are high. Useful for implementation with implementation efficiency.

It is a perspective view which shows schematic structure of the component mounting apparatus of one Embodiment of this invention. It is a flowchart of the mounting operation in the component mounting apparatus of the embodiment. It is a perspective view which shows the 1st operation state in the component mounting apparatus of the embodiment. It is a perspective view which shows the 2nd operation state in the component mounting apparatus of the embodiment. It is a perspective view which shows the 3rd operation state in the component mounting apparatus of the embodiment. It is a perspective view which shows the 4th operation state in the component mounting apparatus of the embodiment. It is a perspective view which shows the 5th operation state in the component mounting apparatus of the embodiment. It is a perspective view which shows the 6th operation state in the component mounting apparatus of the embodiment. It is a perspective view which shows schematic structure of the component mounting apparatus of a prior art example.

Explanation of symbols

1 LCD panel (object to be mounted)
DESCRIPTION OF SYMBOLS 3 Positioning means 4 Component supply part 10 Mounting head 11 Component mounting apparatus 14 Coarse recognition camera 15 Fine recognition camera 17 Y direction movement table 18 X direction movement table

Claims (3)

At the step of holding the component of the component supply unit by the mounting head, the step of roughly recognizing the component position held at the coarse recognition position by the coarse recognition camera, the step of correcting the position according to the coarse recognition result, and the fine recognition position A step of precisely recognizing the position of the held component with a fine recognition camera, a step of correcting the position according to the result of the precision recognition, and a step of mounting the position-corrected component on the mounting target on the mounting stage , and a plurality of The mounting head shares the component supply unit, the coarse recognition camera, the fine recognition camera, and the mounting stage, and performs the different process operations simultaneously and in parallel so that the mounting heads do not interfere with each other. A component mounting method characterized by sequentially mounting components at The component supply unit, the coarse recognition unit installed at the coarse recognition position, the fine recognition unit installed at the fine recognition position, the component is held by the component supply unit with the mounting head, and the correction by coarse recognition of the held component position A plurality of mounting means for performing correction by fine recognition and mounting on a mounting object in a mounting stage, and the plurality of mounting means share the component supply unit, the coarse recognition means, the fine recognition means, and the mounting stage. The component mounting apparatus, wherein the mounting heads are operated in parallel so as not to interfere with each other, and the components are sequentially mounted on the mounting heads. There are two parallel Y-direction movement tables arranged at intervals, and an X-direction movement table arranged in a direction orthogonal to these Y-direction movement tables, and the mounting head is arranged at the intervals. 3. The component mounting apparatus according to claim 2, wherein the component mounting device is mounted on an end portion of the X-direction moving table, and the component supply unit, the coarse recognition unit, and the fine recognition unit are arranged along a straight line. .

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