KR102568389B1 - Bonding apparatus - Google Patents

Abstract

The present invention discloses a bonding device. In the present invention, a plurality of transfer units for transferring a plurality of circuit boards, a plurality of heads for mounting chips on each of the circuit boards supplied from each transfer unit, and arranged to correspond to each of the head units, wherein the chips are A plurality of middle stages on which the chip is temporarily seated, a wafer seating section in which a wafer on which the chip is seated is placed, and a chip that picks up the chip from the wafer seated in the wafer seating section and supplies the chip to one of the middle stages. A pick-up unit is included, and each of the middle stages linearly moves between the chip pickers from a predetermined position.

Description

Bonding apparatus {Bonding apparatus}

The present invention relates to a device, and more particularly to a bonding device.

In general, a bonding device is a device that separates a chip from a wafer and mounts it on a circuit board (or lead frame). In this bonding device, it is common to mount a chip on one circuit board. In this case, the chip may include a semiconductor chip and a small electronic component. To implement this operation, the bonding device may include a device for separating a chip from a wafer, a device for transferring a chip, and the like. At this time, in order for the bonding device to mount one chip on the circuit board as described above and then mount another chip or mount the chip in another place, the above operation must be repeatedly performed. In this case, a lot of time and process sequences are required to mount all the necessary chips on the circuit board through the bonding device.

Korean Patent Publication No. 1999-0045650 related to such a bonding device (Title of Invention: Semiconductor Chip Bonding Method and Device, Applicants: Toshiba Corporation, Nishimuro Taijo) has been specifically disclosed.

Korean Patent Publication No. 1999-0045650

Embodiments of the present invention seek to provide a bonding device.

In one aspect of the present invention, a plurality of transfer units for transferring a plurality of circuit boards, a plurality of heads for mounting chips on each of the circuit boards supplied from each transfer unit, and disposed to correspond to each of the head units, A plurality of middle stages on which the chip is temporarily seated, a wafer seating portion in which a wafer on which the chip is seated is placed, and the chip is picked up from the wafer seated on the wafer seating portion to transfer the chip to one of the middle stages. A bonding device may include a chip pickup unit for supplying the chip, and each of the middle stages performs a linear movement between the chip pickup units from a predetermined position.

In addition, a pre-heating unit disposed in each transfer unit may be further included.

The device may further include a heating unit disposed in each transfer unit and heating a portion of each circuit board on which the chip is mounted among the respective circuit boards.

The plurality of heads may include a first head, a second head, a third head, and a fourth head that are arranged to be spaced apart from each other, and the first to fourth heads may include the fourth head. Alternatively, one of the third head units may operate, and either the second head unit or the first head unit may operate.

Also, the other one of the fourth head unit and the third head unit may operate, and the other one of the second head unit and the first head unit may operate.

In addition, a vision unit for photographing at least one of the circuit board and the chip may be further included.

In addition, the plurality of heads are disposed to be spaced apart from each other, and at least one head disposed at an outermost part among the plurality of heads may be linearly movable in one direction.

Another aspect of the present invention is a plurality of transfer units for transferring a plurality of circuit boards, a plurality of heads for mounting chips on each of the circuit boards supplied from each transfer unit, and arranged to correspond to each of the head units, A plurality of middle stages on which the chip is temporarily seated, a wafer seating portion in which a wafer on which the chip is seated is placed, and the chip is picked up from the wafer seated on the wafer seating portion and transferred to one of the plurality of middle stages. It includes a chip pickup unit for supplying chips, the plurality of heads are disposed to be spaced apart from each other, and at least one or more heads disposed at the outermost part of the plurality of heads can provide a bonding device capable of linear movement in one direction. there is.

In embodiments of the present invention, it is possible to transfer a plurality of chips and mount them on a circuit board.

In practical examples of the present invention, it is possible to transfer chips of different types and mount them on a circuit board.

Embodiments of the present invention can reduce work order and work time, it is possible to increase work efficiency.

1 is a plan view showing a bonding device according to an embodiment of the present invention.
FIG. 2 is a plan view showing parts of a loading part, a preheating part, and a conveying part of the bonding device shown in FIG. 1 .
3 is a plan view showing a head portion and an unloading portion of the bonding device shown in FIG. 1;
FIG. 4 is a plan view showing a portion of a bonding device for separating chips from the wafer shown in FIG. 1 .
5 is a plan view showing a bonding device according to another embodiment of the present invention.

The present invention will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims. Meanwhile, terms used in this specification are for describing the embodiments and are not intended to limit the present invention. In this specification, singular forms also include plural forms unless specifically stated otherwise in a phrase. As used herein, "comprises" and/or "comprising" means that a stated component, step, operation, and/or element is present in the presence of one or more other components, steps, operations, and/or elements. or do not rule out additions. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. Terms are only used to distinguish one component from another.

1 is a plan view showing a bonding device according to an embodiment of the present invention. FIG. 2 is a plan view showing parts of a loading part, a preheating part, and a conveying part of the bonding device shown in FIG. 1 . 3 is a plan view showing a head portion and an unloading portion of the bonding device shown in FIG. 1; FIG. 4 is a plan view showing a portion of a bonding device for separating chips from the wafer shown in FIG. 1 .

1 to 4, the bonding device 100 includes a loading unit 110, an unloading unit 120, a transfer unit 130, a cleaner 140, a preheating unit 150, and a heating unit 160. , the first head unit 171, the second head unit 172, the third head unit 173, the fourth head unit 174, the middle stage 180, the chip pickup unit 185, the wafer seating unit ( 186), a wafer aligner 187, a wafer transfer unit 189, and a vision unit (not shown).

The loading unit 110 may be externally supplied with the circuit boards P1 , P2 , P3 , and P4 . At this time, the loading unit 110 may supply the circuit boards P1 , P2 , P3 , and P4 to the transfer unit 130 in various ways. As an embodiment, the loading unit 110 may have the circuit boards P1, P2, P3, and P4 seated thereon, and the transport unit 130 may load and move the mounted circuit boards P1, P2, P3, and P4. . At this time, the loading unit 110 may be coupled to a portion of the transfer unit 130 so as to be separable, or a portion of the transfer unit 130 may be moved onto the loading unit 110 . As another embodiment, the loading unit 110 may also include a robot arm that transfers the mounted circuit boards P1 , P2 , P3 , and P4 to the transfer unit 130 . As another embodiment, the loading unit 110 includes a separate conveyor, roller, etc., on which the circuit boards P1, P2, P3, and P4 are seated, and which transfers the circuit boards P1, P2, P3, and P4. possible. In this case, the loading unit 110 may transport the circuit boards P1 , P2 , P3 , and P4 by operating a conveyor or roller, etc. disposed on a separate stage. At this time, the loading unit 110 is not limited to the above, and all the circuit boards P1, P2, P3, and P4 are seated and supplying the circuit boards P1, P2, P3, and P4 to the transfer unit 130. form may be included.

In the unloading unit 120, after the chip D is mounted on the circuit boards P1, P2, P3, and P4 transferred to the transfer unit 130, the circuit boards P1, P2, P3, and P4 are transported to the transfer unit 130. can be transmitted from At this time, the unloading unit 120 is formed similarly to the loading unit 110 described above, and can recover the circuit boards P1 , P2 , P3 , and P4 from the transfer unit 130 . The unloading unit 120 may carry the circuit boards P1, P2, P3, and P4 on which the chip D is mounted to the outside. At this time, as a method of carrying out, it is possible to automatically carry out the circuit boards P1, P2, P3, and P4 through a robot arm or the like, or manually carry them out to the outside by a person or the like.

Two transfer units 130 as described above may be provided. For example, the transfer unit 130 may include a first transfer unit 131 and a second transfer unit 132 arranged to be spaced apart from each other. At this time, the first transfer unit 131 may transfer the first circuit board P1 and the second circuit board P2 in the first direction, and the second transfer unit 132 may transfer the third circuit board P3 and the second circuit board P3. 4 The circuit board P4 may be transferred in the first direction. At this time, since the first transfer unit 131 and the second transfer unit 132 are the same or similar to each other, hereinafter, the first transfer unit 131 will be described in detail for convenience of description.

The first transfer unit 131 includes a first seating unit 131a on which the first circuit board P1 or the second circuit board P2 is seated and a first rail disposed so that the first seating unit 131a can perform a linear movement. It may include part 131b. At this time, a separate linear motor is disposed between the first seating portion 131a and the first rail portion 131b, and the linear motor can linearly move the first seating portion 131a.

The cleaner 140 may be disposed to be spaced apart from the transfer unit 130 . At this time, the cleaner 140 may include a cleaner support part 141 and a cleaner head part 142 disposed on the cleaner support part 141 to be capable of linear movement. At this time, the cleaner head unit 142 may remove foreign substances on the outer surfaces of the circuit boards P1 , P2 , P3 , and P4 by sucking air or supplying gas to the circuit boards P1 , P2 , P3 , and P4 .

The preheating unit 150 may be disposed to face the cleaner 140 . At this time, the preliminary heating unit 150 is disposed on the lower surface of the circuit boards P1 , P2 , P3 , and P4 to apply heat to the circuit boards P1 , P2 , P3 , and P4 . In particular, the preliminary heating unit 150 supplies hot gas to the circuit boards P1, P2, P3, and P4 or irradiates the circuit boards P1, P2, P3, and P4 with light to the circuit boards P1, P2, and P3. , P4) can be heated. In another embodiment, the preliminary heating unit 150 may include a heater to heat the circuit boards P1, P2, P3, and P4. At this time, the pre-heating unit 150 includes a first pre-heating unit 151 disposed to correspond to the first transfer unit 131 and a second pre-heating unit 152 disposed to correspond to the second transfer unit 132. can do.

The heating unit 160 may be disposed to be spaced apart from the preheating unit 150 . In this case, the heating unit 160 may independently heat each circuit board P1 , P2 , P3 , and P4 when the chip D is mounted on each circuit board P1 , P2 , P3 , and P4 . In this case, the heating unit 160 may locally heat portions of the circuit boards P1 , P2 , P3 , and P4 on which the chips D are mounted on the respective circuit boards P1 , P2 , P3 , and P4 .

The heating unit 160 as described above includes the first heating unit 161 corresponding to the first mounting position of the first circuit board P1 and the second heating unit corresponding to the second mounting position of the second circuit board P2. unit 162, the third heating unit 163 corresponding to the third mounting position of the third circuit board P3 and the fourth heating unit 164 corresponding to the fourth mounting position of the fourth circuit board P4 can include In this case, each of the first heating unit 161 to the fourth heating unit 164 may be provided in plurality. In this case, the plurality of first heating units 161 may be disposed to be spaced apart from each other, and the plurality of second heating units 162 may be disposed to be separated from each other. Also, the plurality of third heating units 163 may be disposed to be spaced apart from each other, and the plurality of fourth heating units 164 may be disposed to be separated from each other. In this case, the position of each heating part 160 may be disposed at a part where the chip D is mounted.

The first head unit 171 to the fourth head unit 174 may be driven independently of each other. In this case, the first head part 171 to the fourth head part 174 may mount the chip D on each of the circuit boards P1 , P2 , P3 , and P4 . In this case, since the first head part 171 and the fourth head part 174 are identical or similar to each other, the first head part 171 will be described in detail.

The first head unit 171 picks up the chip D and mounts the first head 171a on the circuit boards P1, P2, P3, and P4 and the second head 171a is different from the first direction. The first head support 171b may be disposed to be linearly movable in a direction (eg, a longitudinal direction of the first head support 171b or a direction perpendicular to the first direction). The first head 171a may absorb the chip D and mount it on the first circuit board P1. At this time, the first head 171a may adsorb the chip D by vacuum or the like. As an example, the first head support 171b may include a linear motion guide to guide the linear motion of the first head 171a. As another embodiment, the first head support 171b may include a rail arranged to guide the linear motion of the first head 171a. At this time, the first head support portion 171b is not limited to the above, and may include all structures and devices in which the first head 171a is disposed to be linear and guides the linear motion of the first head 171a. there is. The first head support part 171b as described above also includes a separate first head driving part 171c which linearly moves the first head 171a between the first head 171a and the first head support part 171b. possible. In this case, the first head driving unit 171c may be formed in various shapes. For example, the first head driver 171c may include a ball screw connected to the first head 171a and a motor disposed on the first head support 171b and connected to the ball screw. As another embodiment, the first head driver 171c may include a linear motor disposed between the first head 171a and the first head support 171b and connected to the first head 171a. As another embodiment, the first head driving unit 171c may include a cylinder disposed on the first head support unit 171b and connected to the first head 171a. At this time, the first head driving unit 171c is not limited to the above, and may include any structure that is connected to the first head 171a and linearly moves the first head 171a. Hereinafter, for convenience of explanation, a case in which the first head driving unit 171c includes a linear motor will be described in detail.

The first head part 171 and the fourth head part 174 as described above may be linearly movable in the first direction. For example, the first head part 171 and the fourth head part 174 may linearly move in a direction (or first direction) perpendicular to the longitudinal direction of the first head support part 171b. That is, the first head part 171 and the fourth head part 174 may linearly move in the direction in which the first circuit board P1 to the fourth circuit board P4 are transferred. In this case, the first head part 171 and the fourth head part 174 may linearly move in opposite directions.

The middle stage 180 may temporarily seat the chip D. At this time, a plurality of middle stages 180 may be provided. For example, two middle stages 180 may be provided, and as another embodiment, four middle stages 180 may be provided. Hereinafter, for convenience of description, a case in which the middle stage 180 includes the first middle stage 181, the second middle stage 182, the third middle stage 183, and the fourth middle stage 184 is centered on the case. to be explained in detail. At this time, since the first middle stage 181 to the fourth middle stage 184 are identical or similar to each other, the first middle stage 181 will be described in detail.

In the first middle stage 181 , the chip D picked up by the chip pickup unit 185 may be seated and temporarily stored. At this time, the first middle stage 181 may linearly move in various directions. For example, the first middle stage 181 may linearly move in the first direction and the second direction, respectively. In this case, the first middle stage 181 may linearly move from a preset position to a position where the first chip pickup unit 185-1 is disposed. In particular, the first middle stage 181 may linearly move in a space between the wafer W and the chip pickup unit 185 . The first middle stage 181 may be formed in a plate shape, and a chip seating portion such as a groove may be disposed so that the chip D is seated. In this case, the first middle stage 181 may be disposed to correspond to the first head unit 171 and may be disposed between the first head unit 171 and the chip pickup unit 185 .

The middle stage 180 as described above may be seated on the stage driving units 196 and 197 and perform linear motion. In this case, the plurality of middle stages 180 may be disposed in the stage driving units 196 and 197 in which each middle stage 180 independently linearly moves. In this case, the stage driving units 196 and 197 may be formed in various forms such as a linear motor, a ball screw, and a form including a motor. The plurality of stage driving units 196 and 197 may include a first stage driving unit 196 and a second stage driving unit 197 disposed to face each other. At this time, the first stage driving unit 196 may be connected to the first middle stage 181 and the second middle stage 182, and the second stage driving unit 197 may be connected to the third middle stage 183 and the fourth middle stage. (184) can be connected.

The chip pickup unit 185 may pick up the chip D of the wafer W and supply it to one of the first middle stage 181 to the fourth middle stage 184 . At this time, the chip pickup unit 185 includes the first chip pickup unit 185-1 and the third middle stage 183 that supply chips D to the first middle stage 181 and the second middle stage 182. A second chip pickup unit 185 - 2 supplying chips D to the fourth middle stage 184 may be included. In this case, since the first chip pickup unit 185-1 and the second chip pickup unit 185-2 are identical or similar to each other, the first chip pickup unit 185-1 will be described in detail below.

The first chip pickup unit 185-1 may pick up the chip D from the wafer W. At this time, the first chip pickup unit 185-1 includes a first chip pickup head 185-1a that picks up chips D and a first chip pickup head that linearly moves the first chip pickup head 185-1a. It is disposed on the support part 185-1b and the first chip pick-up head support part 185-1b to linearly move the first chip pick-up head 185-1a in at least one of the first direction and the second direction. 1 may include a first chip pickup head driver (not shown) that lifts and lowers the chip pickup head 185-1a. At this time, the first chip pickup head 185-1a may fix the chip D through vacuum or the like.

The wafer W may be seated on the wafer seating portion 186 . At this time, when the chip D is separated from the wafer W, the wafer W is fixed to the wafer seating portion 186, or the chip D can be easily separated by applying a certain force to the wafer W. there is.

The wafer aligner 187 may mechanically align the wafers W drawn from the wafer cassette 188 on which the wafers W are loaded. At this time, the wafer aligner 187 is formed in the form of a rail, is disposed on the movement path of the wafer (W), and may guide the movement of the wafer (W).

The wafer transfer unit 189 may transfer the wafer W seated on the ring-shaped wafer loading unit (not shown) on which the wafer W is loaded to the wafer seating unit 186 . At this time, the wafer transfer unit 189 may be formed in the shape of a gripper or the like and connected to the wafer loading unit. In this case, the wafer transfer unit 189 can be selectively combined with the wafer loading unit by varying its length.

The vision unit may capture at least one of the postures of the circuit boards P1, P2, P3, and P4 and the postures of the chip D. In this case, the vision unit may include a circuit board pre-line vision unit 191, a bond vision unit 192, a lower vision unit 193, a middle vision unit 194, and a wafer vision unit 195. The vision unit may include a camera for photographing at least one of the circuit boards P1 , P2 , P3 , and P4 and the chip D. The vision unit may be provided in singular or plural numbers. In this case, when the vision unit is provided with a single number or a plurality, the vision unit may linearly move in at least one of the first direction and the second direction.

The circuit board pre-line vision unit 191 may capture the posture of each circuit board P1, P2, P3, and P4. As an embodiment, one circuit board pre-real line vision unit 191 may be provided. In this case, the circuit board pre-line vision unit 191 may move along the movement path of each circuit board P1 , P2 , P3 , and P4 so as to be disposed on the movement path of each circuit board P1 , P2 , P3 , and P4 . . For example, when the first circuit board P1 and the second circuit board P2 are moved, the circuit board pre-line vision unit 191 moves the first circuit board P1 and the second circuit board P2. It can be placed on the movement path. In addition, when the third circuit board P3 and the fourth circuit board P4 are moved, the circuit board pre-line vision unit 191 is the movement path of the third circuit board P3 and the fourth circuit board P4. can be placed on top. At this time, the circuit board pre-line vision unit 191 may linearly move in the second direction to move in the posture. As another embodiment, a plurality of circuit board pre-line vision units 191 may be provided, and each circuit board pre-line vision unit 191 corresponds to the first circuit board P1 and the third circuit board P3. can be arranged so that At this time, each circuit board pre-line vision unit 191 may capture the PDU cell marks disposed on the first circuit board P1 and the third circuit board P3. In particular, each circuit board pre-line vision unit 191 may be disposed on a path along which the first circuit board P1 and the third circuit board P3 respectively move. Hereinafter, for convenience of description, a case in which one circuit board pre-line vision unit 191 is provided will be described in detail.

The bond vision unit 192 may be disposed on the head unit 170 . In this case, the bond vision unit 192 may capture a state in which the chip D is bonded to each circuit board P1 , P2 , P3 , and P4 or each circuit board P1 , P2 , P3 , and P4 . In this case, the bond vision unit 192 includes a first bond vision unit 192a, a second bond vision unit 192b, a third bond vision unit 192c, and a fourth bond unit disposed to correspond to each head unit 170. A vision unit 192d may be included.

The lower vision unit 193 is disposed on the path on which the chip D moves and can take a picture of the posture (eg, degree of twist) of the chip D attached to each head (not shown). A plurality of lower vision units 193 may be provided. At this time, two lower vision units 193 may be provided, and the two lower vision units 193 include the first lower vision unit 193a and the third head disposed on the movement path of the second head 172a. A second lower vision unit 193b disposed on the movement path of 173a may be included. At this time, the first lower vision unit 193a and the second lower vision unit 193b may be arranged so that their positions are fixed.

The middle vision unit 194 is disposed on the middle stage 180 and can capture the posture of the chip D on the middle stage 180 . As an embodiment, one middle vision unit 194 may be provided, and one middle vision unit 194 moves at least one of the first direction and the second direction to correspond to a posture corresponding to each middle stage 180. can move in a linear direction. As another embodiment, two middle vision units 194 may be provided, and one middle vision unit 194 is disposed on the upper surfaces of the first middle stage 181 and the second middle stage 182 so that the first middle A linear motion may be performed between the stage 181 and the second middle stage 182 . In addition, the other middle vision unit 194 can linearly move between the third middle stage 183 and the fourth middle stage 184 so as to be disposed on the upper surfaces of the third middle stage 183 and the fourth middle stage 184. can As another embodiment, four middle vision units 194 may be provided, and each middle vision unit 194 may be disposed to correspond to each of the first middle stage 181 to the fourth middle stage 184 . In this case, each middle vision unit 194 may be fixed in a posture corresponding to each middle stage 180 . Hereinafter, for convenience of description, a case in which two middle vision units 194 are provided will be described in detail.

The wafer vision unit 195 may be disposed on the upper surface of the wafer seating unit 186 to photograph the wafer W. At this time, based on the image of the wafer (W) photographed by the wafer vision unit 195, it is possible to determine whether or not the chip (D) on the wafer (W) is defective. Also, since the wafer vision unit 195 can capture the posture of the wafer (W), it can determine whether the posture of the wafer (W) is the same as a preset posture based on the image of the wafer (W).

Adjusting the posture of the circuit board (P1, P2, P3, P4) by measuring at least one of the posture of the chip (D) and the posture of the circuit board (P1, P2, P3, P4) photographed by the vision unit as described above. Alternatively, the position of the chip (D) can be adjusted. In this case, in order to adjust the posture of the circuit boards P1, P2, P3, and P4, the posture of the transfer unit 130 is adjusted or the posture of the circuit boards P1, P2, P3, and P4 seated on the transfer unit 130 is adjusted. can In addition, each head 171a, 172a, 173a, 174a may be adjusted to adjust the posture of the chip D, or the posture of each chip D on each middle stage 180 may be adjusted. In this case, the component on which at least one of the circuit boards P1, P2, P3, and P4 and the chip D is seated or adsorbed is the posture of at least one of the circuit boards P1, P2, P3, and P4 and the chip D. It may be provided with a separate posture adjustment unit for varying.

On the other hand, in the bonding device 100 as described above, after disposing a plurality of chips D on a plurality of circuit boards P1, P2, P3, and P4, the chip D is attached to each of the circuit boards P1, P2, P3, and P3. P4) can be bonded.

Specifically, when the bonding device 100 operates, the wafer W loaded on the wafer cassette 188 may be taken out through the wafer transfer unit 189 . At this time, the wafer (W) may be in a state of being adjusted through the wafer aligner 187, transferred from the wafer cassette 188 to the wafer seating unit 186, and loaded on the wafer seating unit 186.

In addition, the first circuit board P1 to the fourth circuit board P4 may be sequentially seated on the loading unit 110 and supplied to the first transfer unit 131 and the second transfer unit 132 . At this time, since the method of supplying the first circuit board P1 to the fourth circuit board P4 through the first transfer unit 131 or the second transfer unit 132 is similar, hereinafter, for convenience of description, the second circuit board is used. A method of transferring (P2) to the first transfer unit 131 will be described in detail.

The first transfer unit 131 may place the second circuit board P2 supplied to the first transfer unit 131 in the position of the first preliminary heating unit 151 . The circuit board pre-line vision unit 191 may capture the PDU cell mark of the second circuit board P2. The pose of the second circuit board P2 can be determined by comparing the captured PDU cell mark with a preset image, and the pose of the second circuit board P2 can be adjusted so that the captured PDU cell mark corresponds to the preset pose. .

As described above, when the second circuit board P2 is disposed on the upper surface of the first preliminary heating unit 151, the first preliminary heating unit 151 may heat the second circuit board P2. Thereafter, the first transfer unit 131 may place the second circuit board P2 at the second mounting position. At this time, the second mounting position may be a posture in which the second heating unit 162 is disposed.

As described above, after the second circuit board P2 is disposed at the second mounting position, the first circuit board P1 may also be disposed at the first mounting position through a process similar to that of the second circuit board P2. In this case, the first mounting position may be a posture in which the first heating unit 161 is disposed. In this case, a plurality of first seating parts 131a may be provided, and the first circuit board P1 or the second circuit board P2 may be seated on each first seating part 131a.

While the above process is in progress, the second transfer unit 132 may place the fourth circuit board P4 at the fourth mounting position and place the third circuit board P3 at the third mounting position. At this time, the movement of the fourth circuit board P4 may be performed simultaneously with the movement of the second circuit board P2, and the movement of the third circuit board P3 may be performed simultaneously with the movement of the first circuit board P1. It can be.

As described above, when the first transfer unit 131 and the second transfer unit 132 dispose the first circuit board P1 to the fourth circuit board P4 at the first to fourth mounting positions, respectively, the second circuit board The board P2 and the fourth circuit board P4 may be disposed close to the unloading unit 120, and the first circuit board P1 and the third circuit board P3 may be disposed close to the loading unit 110. there is.

As described above, when the first circuit board P1 to the fourth circuit board P4 are disposed in the first to fourth mounting positions, respectively, the new circuit boards P1, P2, P3, and P4 are respectively first preliminary. It may be disposed in the heating unit 151 and the second pre-heating unit 152 .

Meanwhile, while the above operation is in progress, the chip D may be supplied from the wafer W to the first middle stage 181 to the fourth middle stage 184 . Since the methods in which the chip D is supplied to the first middle stage 181 to the fourth middle stage 184 are similar to each other, hereinafter, for convenience of description, the method in which the chip D is supplied to the fourth middle stage 184 We will explain in detail focusing on the contents.

Specifically, the second chip pickup unit 185-2 may pick up the chip D disposed on the wafer W. At this time, the second chip pickup head 185-2a may linearly move in the vertical direction to pick up the chip D. The fourth middle stage 184 may linearly move in at least one of the first direction and the second direction and may be disposed under the second chip pickup head 185-2a. At this time, it is possible to pick up only normal chips D by determining whether or not the chip D is defective based on the image taken through the wafer vision unit 195 . As described above, while the chip D is being supplied to the fourth middle stage 184 , the first chip pickup unit 185 - 1 may supply the chip D to the second middle stage 182 . At this time, the second middle stage 182 is disposed on the lower surface of the first chip pickup unit 185-1 so that the chip D supplied from the first chip pickup unit 185-1 can be seated.

When the above process is completed, the second chip pickup unit 185-2 and the first chip pickup unit 185-1 transfer the chip D to the third middle stage 183 and the first middle stage 181. each can be supplied. At this time, in the method of supplying the chip D to the third middle stage 183 and the first middle stage 181, respectively, the chip D described above is applied to the fourth middle stage 184 and the second middle stage 182. ) Since it is similar to the method supplied to, detailed description will be omitted.

As described above, when the chip D is supplied to the first middle stage 181 to the fourth middle stage 184, the first middle stage 181 to the fourth middle stage 184 return to their preset postures. can At this time, the middle vision unit 194 may capture the chips D disposed on the first middle stage 181 to the fourth middle stage 184 . The first middle stage 181 to the fourth middle stage 181 through the fourth middle stage 181 are performed by comparing the image of the chip D captured in this way with a preset image to determine the posture of the chip D (eg, the degree of twist of the chip D). By changing the posture of the stage 184, the posture of the chip D can correspond to a preset posture.

As described above, when the posture adjustment of the chip D is completed, the first head 171a to the fourth head 174a linearly move to the first middle stage 181 to the fourth middle stage 184, respectively. The chip D may be transferred to the first circuit board P1 to the fourth circuit board P4. At this time, the first head 171a to the fourth head 174a may move from a portion close to the unloading unit 120 to mount the chip D on each of the circuit boards P1, P2, P3, and P4. . For example, the fourth head 174a moves and the second head 172a moves so that the chip D can be mounted on the fourth circuit board P4 and the third circuit board P3. Then, the third head 173a moves, and the first head 171a moves, so that the chip D can be mounted on the fourth circuit board P4 and the third circuit board P3.

Thereafter, the fourth head 174a, the second head 172a, the third head 173a, and the first head 171a sequentially move the chip D to the second circuit board P2 and the first circuit board. It can be mounted on (P1). While this operation is in progress, the first chip pickup unit 185-1 and the second chip pickup unit 185-2 again transfer the chip D as described above to the first middle stage 181 to the fourth middle stage ( 184) can be settled.

In another embodiment, after the fourth head 174a mounts the chip D on the fourth circuit board P4, the third head 173a may mount the chip D on the fourth circuit board P4. there is. At this time, when the third head 173a mounts the chip D on the fourth circuit board P4, the second chip pickup unit 185-2 places the chip D on the fourth middle stage 184. It is also possible to do Thereafter, the fourth head 174a may mount the chip D on the second circuit board P2, and the second chip pickup unit 185-2 may mount the chip D on the third middle stage 183. can be placed The third head 173a may mount the chip D of the third middle stage 183 on the second circuit board P2.

After the above operation is performed, the second head 172a mounts the chip D on the third circuit board P3, and the first head 171a mounts the chip D on the third circuit board P3. can be mounted. Thereafter, the second head 172a and the first head 171a may mount the chip D on the first circuit board P1.

As another embodiment, the fourth head 174a and the third head 173a may operate simultaneously to mount the chip D on the fourth circuit board P4 or the second circuit board P2. It is also possible that the two heads 172a and the first head 171a operate simultaneously.

As another embodiment, one of the fourth head 174a or the third head 173a may move, and one of the second head 172a or the first head 171a may move. Also, the other one of the fourth head 174a or the third head 173a may move, and the other one of the second head 172a or the first head 171a may move. That is, the fourth head 174a, the second head 172a, the third head 173a, and the first head 171a are sequentially moved, or the third head 173a, the second head 172a, and the fourth head 173a The head 174a and the first head 171a may move sequentially. In another embodiment, the fourth head 174a, the first head 171a, the third head 173a, and the second head 172a are sequentially moved, or the third head 173a, the first head 171a, It is also possible that the fourth head 174a and the second head 172a move sequentially.

As described above, by operating the first head 171a to the fourth head 174a, it is possible to quickly mount the chip D on the first circuit board P1 to fourth circuit board P4.

As described above, while the first head 171a to the fourth head 174a transfer the chip D, the first lower vision unit 193a and the second lower vision unit 193b control the posture of the chip D. can be filmed At this time, by comparing the photographed position of the chip D with the actual position and changing the position (eg, rotation, elevation, etc.) of the first head 171a to the fourth head 174a, the chip D The posture of the user may be adjusted to correspond to a preset posture.

In the above case, since the first lower vision unit 193a is disposed on the path along which the second head 172a linearly moves, it may not exist on the path along which the first head 171a linearly moves. In this case, the first head portion 171 may linearly move in the first direction so that the first head 171a passes the upper surface of the first lower vision portion 193a. At this time, the first head 171a may pass through a part of the movement path of the second head 172a. In addition, since the second lower vision unit 193b is also disposed on the path along which the third head 173a linearly moves, the fourth head unit 174 is linearly moved in the first direction when the fourth head 174a moves. The fourth head 174a may pass through the upper surface of the second lower vision unit 193b. Therefore, it is possible to check the postures of the chips D attached to the two heads through one first lower vision unit 193a or one second lower vision unit 193b.

When the first head 171a to the fourth head 174a mount the chip D on the first circuit board P1 to the fourth circuit board P4, the bond vision unit 192 operates on the first circuit board ( By measuring the postures of P1) to fourth circuit boards P4, the postures of the first heads 171a to 4th heads 174a may be adjusted so that the chip D is mounted in the correct postures.

On the other hand, in the bonding device 100 as described above, it is possible to selectively mount the chip (D) on the first circuit board (P1) to the fourth circuit board (P4) according to the quality of the chip (D) other than the above case. do.

For example, when the wafer (W) is seated on the wafer cassette 188, information about the state of the chip (D) of the wafer (W) may be recorded in the wafer cassette (188) by inspecting the surface of the wafer (W). there is. Such recorded information may be input to the bonding device 100 when the wafer cassette 188 is supplied to the bonding device 100 . Based on this, the bonding device 100 may determine the position of the circuit board to be mounted according to the quality of the chip (D). Specifically, in the bonding device 100 , the high-quality chip D may be mounted only on the second circuit board P2 and the fourth circuit board P4 that are close to the unloading unit 120 . In addition, the bonding device 100 may mount the low-quality chip D only on the first circuit board P1 and the third circuit board P3 close to the loading unit 110 . In another embodiment, the bonding device 100 may mount the high-quality chip D on the first circuit board P1 and the second circuit board P2 disposed on the first transfer unit 131 . In addition, the bonding device 100 may mount the low-quality chip D on the third circuit board P3 and the fourth circuit board P4 disposed on the second transfer unit 132 . At this time, the bonding device 100 is not limited to the above, the high quality chip (D) is mounted only on some of the plurality of circuit boards (P1, P2, P3, P4), and the low quality chip (D) is mounted on a plurality of circuit boards (P1, P2, P3, P4). It is possible to control such that only the rest of the circuit boards P1, P2, P3, and P4 are mounted. Therefore, the bonding device 100 can supply a circuit board on which only high-quality chips D or only low-quality chips D are mounted according to the user's request and the use environment of the product.

In addition to the above case, the bonding device 100 may also mount chips D of different types on each of the circuit boards P1 , P2 , P3 , and P4 . For example, the first head 171a and the third head 173a mount A-type chips (D), and the second heads 172a and fourth heads 174a mount A-type chips (D) and It is possible to mount chips D of different B types. In this case, the wafer W including the A-type chip D and the wafer W including the B-type chip D may be supplied sequentially or simultaneously. In particular, in this case, a plurality of chip pick-up units 185, wafer seating units 186, wafer aligners 187, and wafer transfer units 189 may be provided, and a plurality of chip pickup units 185 and wafer seating units 186 may be provided. ), the wafer aligner 187 and the wafer transfer unit 189 may be arranged to be stacked on each other or to face each other.

Therefore, since the bonding device 100 can individually and independently mount the chips D on the plurality of circuit boards P1 , P2 , P3 , and P4 at the same time, work efficiency can be increased.

In addition, since the bonding device 100 can simultaneously mount various types of chips D in the same device, it is possible to mount the chips D in precise positions.

5 is a plan view showing a bonding device according to another embodiment of the present invention.

Referring to FIG. 5 , the bonding device 200 includes a loading unit 210, an unloading unit 220, a transfer unit 230, a cleaner 240, a preheating unit 250, a heating unit 260, and a head unit. 270, a middle stage 280, a chip pickup unit 285, a wafer seating unit 286, a wafer aligner 287, a wafer transfer unit 289, and a vision unit (not shown). At this time, the loading unit 210, the unloading unit 220, the transfer unit 230, the cleaner 240, the preheating unit 250, the heating unit 260, the head unit 270, and the wafer seating unit 286 Since the wafer aligner 287 and the wafer transfer unit 289 are the same as or similar to those described in FIGS. 1 to 4, detailed descriptions thereof will be omitted.

The vision unit may include a circuit board pre-line vision unit 291 , a bond vision unit 292 , a lower vision unit 293 , a middle vision unit 294 and a wafer vision unit 295 . At this time, the circuit board pre-line vision unit 291, the bond vision unit 292, the lower vision unit 293, the middle vision unit 294, and the wafer vision unit 295 are the same as those described in FIGS. 1 to 4. Since they are the same or similar, detailed descriptions will be omitted.

The middle stage 280 and the chip pick-up unit 285 may be provided in plurality as described in FIGS. 1 to 4 . At this time, the plurality of chip pickup units 285 may move the chip pickup heads (not shown) in at least one of the first direction and the second direction. At this time, the plurality of middle stages 280 may be arranged to be fixed to a preset position. In this case, each chip pickup unit 285 may include a chip pickup head driver (not shown) that moves each chip pickup head in at least one of the first direction and the second direction and moves it up and down. In this case, the chip pickup head driving unit may be formed in various forms, such as a form including a linear motor, a ball screw, and a motor.

In the above case, when the bonding device 200 operates, when chips are supplied to each middle stage 280, each chip pick-up unit 285 separates the chip D from each wafer (not shown) to each middle stage ( 280) can be supplied. Thereafter, a method of mounting the chip D on the circuit board P may be performed in the same or similar manner as described above.

Therefore, the bonding device 200 can transfer a plurality of chips D and mount them on the circuit board P.

The bonding device 200 can transfer chips D of different types and mount them on a circuit board P.

Bonding device 200 can shorten the work order and work time, it is possible to increase the work efficiency.

Although the present invention has been described with respect to the preferred embodiments mentioned above, various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the scope of the appended claims will include such modifications and variations as long as they fall within the gist of the present invention.

100,200: bonding device
110,210: loading unit
120,220: unloading unit
130,230: transfer unit
140,240: Cleaner
150,250: pre-heating unit
160,260: heating unit
170,270: head part
180,280: middle stage
185,285: chip pickup unit
186,286: wafer seating part
187,287: wafer aligner
188,288: wafer cassette
189,289: wafer transfer unit
191,291: circuit board pre-line vision unit
192,292: Bond vision department
193,293: lower vision unit
194,294: middle vision part
195,295: wafer vision unit

Claims (8)

A plurality of transfer units for transferring a plurality of circuit boards;
a plurality of head units for mounting chips on each of the circuit boards supplied from each transfer unit;
a plurality of middle stages arranged to correspond to each of the heads and on which the chips are temporarily seated;
a wafer seating portion in which a wafer on which the chip is seated is placed;
a chip pick-up unit which picks up the chip from the wafer seated on the wafer seating unit and supplies the chip to one of the plurality of middle stages;
a cleaner that is disposed to be spaced apart from each of the transfer units and removes foreign substances from the outer surface of each of the circuit boards;
a pre-heating unit disposed in each of the conveying units to face the cleaner and applying heat to each of the circuit boards; and
A heating unit disposed in each of the transfer units to be spaced apart from the preheating unit and heating each of the circuit board portions on which the chip is mounted, among the circuit boards,
Each of the middle stages performs a linear movement between the chip pickup units from a predetermined position. delete delete According to claim 1,
The plurality of head parts include a first head part, a second head part, a third head part, and a fourth head part arranged to be spaced apart from each other,
The bonding device wherein one of the fourth head part and the third head part operates, and one of the second head part and the first head part operates in the first to fourth head parts. According to claim 4,
A bonding device in which another one of the fourth head part or the third head part operates, and the other one of the second head part and the first head part operates. According to claim 1,
The bonding device further comprising a vision unit for photographing at least one of the circuit board and the chip. According to claim 1,
The plurality of head parts are disposed to be spaced apart from each other, and at least one or more heads disposed at an outermost part among the plurality of head parts are linearly movable in one direction. A plurality of transfer units for transferring a plurality of circuit boards;
a plurality of head units for mounting chips on each of the circuit boards supplied from each transfer unit;
a plurality of middle stages arranged to correspond to each of the heads and on which the chips are temporarily seated;
a wafer seating portion in which a wafer on which the chip is seated is disposed;
a chip pick-up unit which picks up the chip from the wafer seated on the wafer seating unit and supplies the chip to one of the plurality of middle stages;
a cleaner that is disposed to be spaced apart from each of the transfer units and removes foreign substances from the outer surface of each of the circuit boards;
a pre-heating unit disposed in each of the conveying units to face the cleaner and applying heat to each of the circuit boards; and
A heating unit disposed in each of the transfer units to be spaced apart from the preheating unit and heating each of the circuit board portions on which the chip is mounted, among the circuit boards,
The plurality of head parts are disposed to be spaced apart from each other, and at least one or more heads disposed at an outermost part among the plurality of head parts are linearly movable in one direction.

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