KR100851242B1 - Plazma cleaning apparatus for a semiconductor panel - Google Patents

Abstract

A plasma cleaning apparatus for semiconductor panel is provided to minimize an occupied area of equipment by arranging a plurality of cleaning chambers at upper and lower sides. A plurality of plasma cleaning chambers(100) are vertically arranged in parallel to each other. An unloading unit(200) moves magazines including cleaning targets to the plasma cleaning chambers. A plurality of first pushers(250) are installed at the unloading unit to discharge the cleaning targets of the magazines to the plasma cleaning chambers. A rotary transfer unit(300) receives the empty magazines from the unloading unit, rotates horizontally the empty magazines at 180 degrees, and moves the empty magazines to the backside of the plasma cleaning chambers. A loading unit(400) receives the empty magazines from the rotary unit and moves the empty magazines to the backside of each plasma cleaning chambers. A second pusher(500) loads the cleaning targets into the empty magazines of the loading unit.

Description

Plasma cleaning apparatus for a semiconductor panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma cleaning apparatus for cleaning a semiconductor component (a thing to be cleaned or a PCB substrate) through a plasma discharge during a semiconductor manufacturing process. Particularly, the plasma cleaning process of a semiconductor component housed in a magazine is continuously performed. The present invention relates to a plasma cleaning device for semiconductors that improves operating efficiency.

In general, a plasma cleaning apparatus used in a semiconductor manufacturing process is a device for cleaning a semiconductor component such as a to-be-cleaned object or a PCB substrate through a plasma discharge, and is installed in each semiconductor manufacturing process to be referred to as a semiconductor component (hereinafter referred to as 'cleaned object'). Is cleaned.

That is, the object to be cleaned undergoes manufacturing processes such as stripping-die bonding-wire bonding-package molding-marking, etc., and the surface is contaminated by the physical and chemical treatments of each process. A separate cleaning process is required to clean the contaminated surface.

In particular, since the cleaning method using plasma not only cleans the object to be cleaned but also cleans the surface of the object to be cleaned made of copper during die bonding and wire bonding, the surface of the object to be cleaned does not have to be plated with silver or gold, thus producing a semiconductor. It has been widely used recently because of its ability to contribute to the simplification of the process.

As shown in FIG. 1, a conventional plasma cleaning apparatus 1 includes a chamber 10 that can be sealed, and a cassette 60 in which a plurality of objects L are stored into the chamber 10. 20 and an air inhalation device 30 for suctioning and discharging air in the chamber 10 to be sealed in a state in which the cassette 20 mounted with the magazine 60 is accommodated, so that the inside of the chamber 10 is vacuumed. ), A gas supply device 40 for introducing a gas such as argon, xenon, helium and neon into the vacuum chamber 10, and a gas supplied into the chamber 10 through the gas supply device 40. It is configured to include a current generating device 50 for flowing a current to generate a plasma.

As shown in FIG. 2, the cassette 20 includes an upper frame 21 forming an upper surface and a lower frame on which a plurality of magazines 60 are seated in a state located at a bottom of the upper frame 21. 22 and between the upper frame 21 and the lower frame 22 and mounted on opposite sides of each magazine 60 seated on the lower frame 22 to induce plasma discharge. It consists of a side electrode plate 23.

Here, in each magazine 60, a plurality of objects to be cleaned L are mounted at predetermined intervals along a height direction thereof, and both sides of the magazine 60 may be a drawer-type storage of each object to be cleaned L. FIG. Guide jaws 61 are fixed along the height direction. The guide jaws 61 are fixed to be spaced apart from each other at uniform intervals so that the plasma flows smoothly through the gaps between the guide jaws 61 spaced apart so that each of the objects to be cleaned L can be effectively cleaned. To do this.

The plasma cleaning device 1 for semiconductors having such a configuration is provided in the cassette 20 after injecting gas through the gas supply device 40 by vacuuming the inside of the cleaning device through the air suction device 30. By applying a current to the electrode plate to ionize or activate the gas supplied therein, the activated gas is separated into electrons and cations so that the inside of the chamber 10 is in a plasma state, and the object to be cleaned in the magazine by the action of this plasma. (L) is cleaned.

In the conventional plasma cleaning apparatus 1 as described above, the operator mounts the magazine 60 containing the object to be cleaned L in the cassette 20 and then inserts it into the chamber 10 again, after the cleaning process is completed. Since the cassette 20 needs to be removed from the chamber 10 and replaced with a new cassette 20, the cleaning operation cannot be continuously performed, and the efficiency of the cleaning process and the productivity of the object to be cleaned (L) are greatly reduced. there was.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and the plasma cleaning apparatus for semiconductors enables the cleaning operation of the object to be cleaned to be continuously processed from the introduction of the magazine to the withdrawal of the magazine, thereby improving the cleaning treatment efficiency and the productivity of the object to be cleaned. The purpose is to provide.

In order to achieve the above object, the semiconductor plasma cleaning apparatus of the present invention comprises a plurality of plasma cleaning chambers arranged side by side vertically; An unloading unit which sequentially moves the loaded objects to the front of each plasma cleaning chamber while the object to be cleaned is moved at a predetermined interval while moving from the bottom to the top according to the cleaning progress situation; A plurality of first pushers installed in the unloading unit so as to correspond to the plasma cleaning chambers, each of the first pushers for discharging the objects to be mounted in the magazine moved by the unloading unit to the plasma cleaning chamber; A rotation transfer unit which receives the empty magazine from which all objects to be cleaned are supplied from the unloading unit, rotates horizontally by 180 degrees, and then transfers it to the rear of the plasma cleaning chamber; A load unit which receives the empty magazine from the rotary transfer unit and sequentially moves the supplied empty magazines to the rear of each plasma cleaning chamber while moving from top to bottom according to the cleaning progress situation; And a second pusher for pushing and cleaning the cleaned objects to be loaded into the empty magazine of the rod part.

According to the plasma cleaning apparatus for semiconductors according to the present invention configured as described above, a plurality of cleaning chambers in which plasma cleaning is performed is arranged up and down at the center, and an unloading unit is arranged at the front to supply the object to be cleaned of the magazine to each cleaning chamber. In the rear side, a rod unit for sequentially mounting the cleaned objects in each of the cleaned cleaning chambers in the empty magazine received from the unloading unit is alternated between the upper cleaning chamber and the lower cleaning chamber. Since it is made continuously while going, there is an effect that can greatly improve the productivity.

In addition, the semiconductor plasma cleaning apparatus according to the present invention can minimize the space occupied by the equipment because the plurality of cleaning chambers are arranged up and down, the operator puts an empty magazine in the unloading unit and collects the magazine discharged through the loading unit Just because you have the effect is greatly improved workability.

The features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It must be interpreted to mean meanings and concepts.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.

3 and 4, the semiconductor plasma cleaning apparatus of the present invention includes a plurality of plasma cleaning chambers 100 arranged vertically, and magazines on which a substance to be cleaned is mounted to each plasma cleaning chamber 100. The unloading unit 200 for sequential movement, the first pusher 250 installed in the unloading unit 200, and the first pusher 250 for discharging the objects to be mounted in the magazine to the plasma cleaning chamber 100, and the objects to be cleaned are all The discharge magazine is supplied from the unloading unit 200 and rotates 180 ° horizontally, and then rotates to the rear of the plasma cleaning chamber 100. The transfer unit 300 and the empty magazine supplied from the rotation transfer unit 300. The rod unit 400 to sequentially move the particles to the rear of the plasma cleaning chamber 100 and the second pusher 500 to push and clean the cleaned objects into the empty magazine of the rod unit 400. It is composed.

<Plasma cleaning chamber>

In the present embodiment, the plasma cleaning chamber 100 is illustrated and described by way of example, in which a pair is provided at a predetermined interval vertically.

Each plasma cleaning chamber 100 has the same configuration, and the bottom plate 110 on which the object to be transported through the rod unit 400 is seated, and the bottom plate 110 may be selectively matched with the bottom plate 110. The upper plate 120 is installed to be movable up and down on the vertical portion of the plate 110 and has a predetermined inner space so that plasma can be generated in a state in which the plate 110 is aligned with the bottom plate 110.

In addition, the upper part of the bottom plate 110 supports both sides of the object to be cleaned to enter the cleaning chamber 100 through the unloading unit 200, so that the object to be cleaned is separated from the bottom plate 110. The pair of seating members 111 are fixed. The reason for separating the object to be cleaned to the bottom of the cleaning chamber 100 as described above is to prevent the object from being cleaned smoothly because the contact with the plasma gas is limited by being adhered to the bottom plate 110. to be.

On the other hand, although not shown, the upper plate 120 is connected to the gas supply pipe for supplying a plasma gas, such as argon, xenon, helium and neon through the upper plate 120 to the cleaning chamber 100, the lower plate is vacuumed inside the chamber An air exhaust hole is formed in connection with the air intake device to bring it into a state. In addition, the cleaning chamber 100 is provided with a current generator for generating a plasma by flowing a current to the gas supplied into the chamber through the gas supply pipe 114.

5 to 7, the bottom plate 110 of each cleaning chamber 100 is self-heated by a heating air circulating therein and cooled by a cooling air to heat the object to be cleaned to an appropriate temperature. Heating unit 115 is provided.

An air circulation pipe 112 for circulating the heating or cooling air toward the heating unit 115 is connected to the bottom of the bottom plate 110. The air circulation pipe 112 is divided into an inlet pipe 112a and an outlet pipe 112b, respectively.

In addition, the heating unit 115 is composed of an upper ceramic plate 115a, a cover plate 115b, a heating plate 115c, and a lower ceramic plate 115d on which a seating member 111 is installed on a surface thereof. do.

An air route 116 is uniformly formed on the front surface of the heating plate 115c, and both ends 116a and 116b of the air route communicate with the air circulation pipe 112. To this end, the lower ceramic plate 115d is provided with a communication hole (not shown) for communicating both ends 116a and 116b of the air route with the air circulation pipe 112.

By the configuration as described above, if hot air is supplied through the inlet pipe (112a) before the start of cleaning, the supplied heating air is introduced into the heating plate (115c) through the communication hole of the lower ceramic plate (115d) and the air route The heating plate 115c is heated while circulating the heating plate 115c and then discharged to the outside through the discharge pipe 112b.

As such, when the heating plate 115c is heated, the upper ceramic plate 115a is heated, and the object to be cleaned placed on the upper ceramic plate 115a is also heated to an appropriate temperature, thereby maximizing the plasma cleaning effect.

On the other hand, when the temperature inside the cleaning chamber 100 rises more than necessary, when cooling air is introduced into the inlet pipe 112a of the air circulation pipe 112, the cooling air is heated through the air route 116 ( The heating plate 115c is cooled while circulating 115c.

In the cleaning chamber 100, the upper ceramic plate 115a and the lower ceramic plate 115d are made of a ceramic material, so that deformation does not occur even when frequent thermal changes, and the cleaning chamber including the heating plate 115c ( Since only the bottom plate 110 of the temperature rises 100, it is possible to minimize heat dissipation to the peripheral device of the cleaning chamber 100.

Meanwhile, in front of each plasma cleaning chamber 100, a first seating part 130 having a plurality of guiders 132 disposed in a lateral direction such that the objects to be discharged from the magazine by the first pusher 250 are sequentially seated. And a second seating part having a plurality of guiders 142 disposed in the left and right directions so that the cleaned objects to be discharged from the plasma cleaning chamber 100 are seated at the rear of each plasma cleaning chamber 100. 140 is provided.

The first and second seating parts 130 and 140 are provided with feeders 131 and 141 for moving the object to be rearward to the seating point for each guider 132 and 142.

As shown in FIG. 8, the feeder 131 of the first seating unit 130 has a rotation shaft 131a which simultaneously passes through each guider 132, and a driving motor that applies rotational force to the rotation shaft 131a. 131b) and each of the guiders 132 so that the objects to be entered into each guider 132 are placed and fed to the rear of the guider 132 by the rotary shaft 131a. The feeding belt 131c and the feeding roller 131d for pressing the upper part of the object to be cleaned placed above the feeding belt 131c downward.

The front of the feeder 131 is attached with a sensor 131e for detecting the approach of the object to be cleaned, when the sensor 131e detects the approach of the object, the driving motor 131a starts operation.

Meanwhile, the feeder 141 of the second seating part 140 has the same configuration as the feeder 131 of the first seating part 130.

And, as shown in Figure 9, the first to be mounted 130, the object to be cleaned on the first seat 130 is moved to the plasma cleaning chamber 100, or the object to be cleaned The object to be moved 150 is provided to move the side to the second seating part 140.

The retentive movement means includes an LM guide 151 for reciprocating a section from the first seating unit 130 to the plasma cleaning chamber 100, and a finger arm 152 for reciprocating along the LM guide 151. In addition, the finger arm 152 is installed to be selectively rotated up and down and is pushed to the plasma cleaning chamber 100 to clean the object to be seated on the first seating portion 130 in the down-rotated state It consists of the fingers 153 for moving the object to be washed by pushing the second mounting portion 140 side.

Unexplained symbol M is a magazine.

<Unloading Unit>

The unloading unit 200 is disposed in front of the cleaning chamber 100.

As shown in FIG. 10, the unloading unit 200 receives a magazine loaded from the outside at a predetermined interval from the outside, and transports it to a pickup position, and picks up the conveyor 210. Clamp 220 for picking up the magazine transported to the position, the clamp 220 is installed, the elevator 230 for vertically moving the picked up magazine to the first pusher 250 side, and the clamp 220 It consists of a horizontal transfer robot 240 for sequentially moving the elevator 230 to be located in front of each guider 132 of the first seating portion (130).

The unloading unit 200 moves through the elevator 230 from the bottom to the upper side according to the cleaning progress situation, and loads the magazines mounted at regular intervals through the horizontal transfer robot 240 to each plasma cleaning chamber 100. In order to move forward).

The conveyor 210 is a conveyor main body 211 is installed to transport the magazine from the left to the right in the drawing, and the magazine is transported along the conveyor main body 211 is seated on the rear of the conveyor body 211 is seated An uploader 212 for raising the magazine to a pickup position, and a first magazine sensor 213 for detecting a magazine seated on the uploader 212 and sending a pickup signal to the clamp 220.

As shown in FIGS. 10 and 11, the clamp 220 includes a clamp block 221 fixed to an elevator 230, a clamping cylinder 222 installed below the clamp block 221, and the clamping cylinder. A pair of clampers 223 and 223 connected to both sides of the clamping cylinder 222, and the separation degree varies depending on the operation of the clamping cylinder 222, and are installed in a horizontal state between the clampers 223 and 223 through the clamping cylinder 222, and the clampers 223 and 223. The clamping by detecting whether the magazine has reached the normal clamping position through the position of the elastic pressing plate 224 and the elastic pressing plate 224 to elastically press the upper portion of the magazine located between, and the clamper (223, 223) The third magazine sensor 225 sends a clamping signal to the cylinder 222 side.

The elevator 230 is an LM guide installed to move vertically toward the first pusher 250, a vertical guide 231, a vertical screw rod 232 coupled to both ends of the vertical guide 231, the vertical screw rod The servo motor 233 may be configured to give the reverse rotational power to 232. The clamp block 221 is spirally fastened to the vertical screw rod 232. Accordingly, when the servo motor 233 is driven, the vertical screw rod 232 is rotated in one direction, and the clamp screw 221 spirally fastened to the vertical screw rod 232 rotates along the spiral of the vertical screw rod 232. Or descend.

The horizontal transfer robot 240 is an L guide installed at the rear of the elevator 230, the horizontal guide 241 is fixed to the rear of the elevator 230 to guide the horizontal transfer in the left and right direction of the elevator 230, and A horizontal screw rod 242 coupled to both ends of the horizontal guide 241, and the servo motor 243 to give the reverse rotation power to the horizontal screw rod 242.

In this embodiment, the horizontal transfer robot 240 is installed in the center of the elevator 230, the horizontal guide 241 is installed only at the lower end of the elevator 230 for the stable horizontal movement of the elevator (230).

<Rotation Transfer Unit>

The rotary transfer unit 300 includes a transfer conveyor 310 having a transfer section from the unload unit 200 to the load unit 400 behind the plasma cleaning chamber 100, and an empty magazine in which all the objects to be cleaned are discharged. Conveyor 320 and the turntable 330 is connected to the lower portion of the conveyor 320 to rotate the conveyor 320 180 ° horizontally.

The rotary transfer unit 300 receives an empty magazine from which all the objects to be cleaned are discharged from the unload unit 200, rotates 180 ° horizontally through the turntable 330, and then rotates the plasma cleaning chamber 100 through the transfer conveyor 310. ) To the rear.

The reason why the empty magazine is horizontally rotated by 180 ° is because of the separation-avoidance devices A installed at the front and rear ends of the magazine, respectively. The separation prevention device (A) is composed of a rotating member (A1) installed on the top of the magazine and the blocking bar (A2) connected to the rotating member (A1), the blocking bar (A2) of the lower end from the top of the magazine When installed so as to cross the user rotates the rotation member (A1), the blocking bar (A2) is rotated to block or open the corresponding end of the magazine according to the rotation direction.

Thus, as shown in Figure 12a, the magazine in the unloaded state is blocked in the front and the rear is opened by the separation of the object to prevent the unloading of the object to be cleaned, the cleaning is completed in the subsequent loading operation The empty magazine should be rotated horizontally to 180 ° as shown in FIG. 12C so that the object to be cleaned can be loaded smoothly into the empty magazine.

12A to 12C sequentially illustrate an operation process in which the turntable 330 is horizontally rotated 180 ° in an initial state.

<First pusher>

A plurality of first pushers 250 are installed in the unloading unit 200 so as to correspond to the plasma cleaning chambers 100.

As shown in FIG. 10, the first pusher 250 includes a push block 251 fixed to the elevator 230, a push cylinder 252 fixed to the push block 251, and the push cylinder 252. It consists of a pusher tip 253 installed at the rod end of the), and pushes the to-be-cleaned objects mounted in the magazine moved by the unloading unit 200 toward the plasma cleaning chamber 100 one by one.

<Road unit>

The rod unit 400 is disposed at the rear of the cleaning chamber 100.

The rod unit 400 includes a clamp 410 for picking up an empty magazine transferred from the rotation transfer unit 300, and the clamp 410 is installed to vertically move the picked up empty magazine toward the second pusher 500. An elevator 420, a horizontal transfer robot 430 which sequentially moves the elevator 420 so that the clamp 410 is located in front of each guider 142 of the second seating part 140, and a second pusher ( In the case where all of the cleaned objects to be cleaned inside the empty magazine by 500 are mounted, the conveyor 440 receives the magazine through the elevator 420 and discharges it to the outside.

The load unit 400 receives the empty magazine from the rotation transfer unit 300 through the clamp 410 and moves the empty magazines supplied from the lower side to the upper side through the elevator 420 according to the cleaning process. It sequentially moves to the rear of each plasma cleaning chamber 100 through 430.

The conveyor 440 is located at the rear of the conveyor body 441 and the conveyor body 441, the magazine transported by the elevator 420 is seated, the downloader for lowering the seated magazine to the conveyor body 441 ( 442 and a second magazine sensor 443 which senses that the magazine is seated in the downloader 442 and sends a falling signal to the downloader 442.

On the other hand, the clamp 410 is the same configuration as the clamp 220 of the unloading unit 200, so a detailed description thereof will be omitted.

<2nd pusher>

The second pusher 500 is mounted on the second seating unit 140 to clean the objects to be cleaned by pushing them into the empty magazine of the rod unit 400.

As shown in FIG. 13, the second pusher 500 includes a guide rail 510 installed in parallel with the second seating part 140, and a push bar reciprocating a predetermined section along the guide rail 510. 520, a push cylinder 530 that provides a reciprocating movement force to the push bar 520, and a second seat in a downwardly rotated state to be selectively installed in the push bar 520 so as to be selectively rotated up and down. It consists of a plurality of fingers (540) for mounting the object to be seated on the unit 140 by sequentially pushing to the empty magazine side of the load unit (400).

In this case, it is preferable that the fourth magazine sensor 145 is installed at the rod unit 400 side end of each guider 142 of the second seating part 140. The fourth magazine sensor 145 sends the detected empty magazine signal to the second pusher 500 to allow the corresponding finger 153 to perform the object to be cleaned. To this end, each finger 153 of the second pusher 500 senses an empty magazine signal transmitted from the fourth magazine sensor 145 and operates only the corresponding finger 153 to perform the mounting of the object to be cleaned. Each sensor 550 is installed 153 to be individually performed.

The plasma cleaning apparatus for semiconductors according to the present invention having such a configuration includes an unloading operation of sequentially supplying the object to be cleaned to the plurality of cleaning chambers 100 arranged up and down, and in each cleaning unit supplied with the object to be cleaned. The plasma cleaning operation is performed and the rod operations in which the cleaned objects are mounted in the empty magazine sequentially from each cleaning chamber 100 through the rod unit 400 are alternately performed for each cleaning chamber 100. .

<Unloading action>

First, when a worker enters the magazines on which the object to be cleaned is loaded into the conveyor body 211 of the unloading unit 200, the magazines are transferred to the uploader 212 by the conveyor body 211. The magazine sent up to the uploader 212 is seated in the uploader 212, in which case the first magazine sensor 213 installed in the uploader 212 detects whether the magazine is seated and is normally seated. 220, the pickup signal is sent.

When the clamp 220 receives a pickup signal from the first magazine sensor 213, the elevator 230 lowers the clamp 220 to pick up a magazine seated on the uploader 212. At this time, the elastic pressing plate 224 of the clamp 220 to protect the magazine by absorbing the shock generated by the collision of the clamp block 221 and the magazine when the clamp 220 is excessively lowered.

When the clamp 220 descends, the third magazine sensor 225 installed at one side of the clampers 223 and 223 senses whether the magazine has reached the normal clamping position through the position of the elastic pressure plate 224, and thus the magazine is in the normal clamping position. Only when it is determined that it has reached, the clamping signal is sent to the clamping cylinder 222 side. Accordingly, when the clamping cylinder 222 receiving the clamping signal is operated, the separation degree of the clampers 223 and 223 is reduced, and the magazine is clamped.

When the clamping of the magazine is completed, the elevator 230 ascends and moves the picked up magazine to the first pusher 250 located below. When the magazine is moved to the first pusher 250 side, the push cylinder 252 of the first pusher 250 is operated and the pusher tip 253 is mounted on the inside of the magazine. To the side. The operation of the first pusher 250 is sequentially performed whenever the horizontal transfer robot 240 of the unloading unit 200 sequentially moves the elevator 230 to the guiders 132 installed in the first seating unit 130. Is done. The object to be cleaned is moved to the first seating part 130 of the cleaning chamber 100 by the first pusher 250.

When the unloading operation of the object to be cleaned is completed, the elevator 230 moves up to move the magazine toward the cleaning chamber 100 located above. Then, the unloading operation of the object to be cleaned as described above is repeatedly performed on the cleaning chamber 100 located above.

During the unloading operation of the upper object to be cleaned, the lower cleaning chamber 100 is opened as shown in FIG. 3, and the feeder 131 of the first seating part 130 is mounted on the guider 132. It is operated to enter water into the open cleaning chamber (100). At this time, the feeding roller 131d of the feeder 131 is in close contact with the upper part of the object to be mounted on the guider 132 while rotating downward by the sensor 131e installed in front of the feeder 131. Therefore, the to-be-cleaned object is reliably conveyed to the cleaning chamber 100 side by the said feeding roller 131d in the state conveyed to the rear along the feeding belt 131c.

Meanwhile, the object to be cleaned is transferred to the cleaning chamber 100 by the feeder 131 and the object to be moved 150 is operated at the same time.

The EL guide 151 of the object to be cleaned 150 moves the finger arm 152 such that the fingers 153 are positioned at the front end of the object to be cleaned, and then moves the finger arm 152 to the rear to move the finger 153. ) Pushes the front end of the object to be cleaned so that it is mounted at the correct position inside the cleaning chamber 100. The fingers 153 are pivoted downward to push the front end of the object to be cleaned when the finger arm 152 is moved forward in the pivoted state.

<Cleaning operation>

When the object to be cleaned is mounted in the lower cleaning chamber 100 through the object to be cleaned 150, the cleaning chamber 100 is closed and plasma cleaning is performed.

On the other hand, while the plasma cleaning is performed in the lower cleaning chamber 100, the feeder 131 and the object to be moved 150 on the upper cleaning chamber 100 are operated while being pumped into the upper cleaning chamber 100. Mount the wash.

When the cleaning operation of the lower cleaning chamber 100 is completed, the cleaning chamber 100 is opened again and the cleaning object moving means 150 operates to clean the cleaned object inside the cleaning chamber 100. ) And slide it out. The cleaned object to be discharged out of the cleaning chamber 100 is seated on the guider 142 of the second seating part 140. The object to be cleaned is seated on the guider 142 and the feeder 141 is operated to clean it. The finished object to be cleaned is transferred to the rear end of the guider 142.

Meanwhile, while the object to be cleaned is discharged from the lower cleaning chamber 100 and seated on the second seating part 140, the upper cleaning chamber 100 performs plasma cleaning. At the same time, the empty magazine in which all the objects to be cleaned are discharged is conveyed to the conveyor 210 of the rotation transfer unit 300 by the unloading unit 200. As shown in FIG. 12A, when the empty magazine is placed on top of the conveyor 320, the turntable 330 is rotated 180 ° as shown in FIG. 12C, and the conveyor 320 is operated. Accordingly, the empty magazine is transferred from the conveyor 320 to the conveying conveyor 310 and collectively conveyed to the load unit 400 along the conveying conveyor 310.

When the empty magazine is transported to the load unit 400 side, the clamp 410 of the load unit 400 picks up the empty magazine and the elevator 420 and the horizontal transfer robot 430 operate to clean the empty magazine with a lower cleaning chamber ( 100 is sequentially transferred to the rear of each guider 142 of the second seating portion 140.

<Loading operation>

When the empty magazine is transported to the rear of the guider 142 of the second seating part 140, the fourth magazine sensor 145 installed at the end of the rod unit 400 side of the guider 142 detects the empty magazine and the empty magazine The signal is sent to the second pusher 500. The empty magazine signal is transmitted to the sensor 550 connected to the finger 153 of the second pusher 500. When the sensor 550 sends a start signal for mounting the object to the finger 540, the corresponding finger ( At the same time as the 153 moves downward, the second pusher 500 moves toward the rod unit 400 and pushes the objects to be cleaned one by one to be mounted in the empty magazine. The second pusher 500 and the corresponding finger 540 move back to the original position and wait for the next operation.

The loading operation of the rod unit 400 is sequentially repeated with respect to the objects to be seated on the second seating unit 140. When the loading operation of the lower side of the cleaning chamber 100 is completed, the loading unit 400 is completed. The magazine is raised for the loading operation of the upper cleaning chamber 100 and positioned behind the guider 142 of the second seating part 140 of the upper cleaning chamber 100.

Meanwhile, while the loading operation is performed on the lower side of the cleaning chamber 100 as described above, the cleaning operation is completed on the upper side of the cleaning chamber 100, and the cleaned objects are cleaned according to the movement of the object to be cleaned 150. It is discharged out of the cleaning chamber 100. The cleaned object to be discharged out of the cleaning chamber 100 is seated on the guider 142 of the second seating part 140. The cleaned object to be cleaned while being seated on the guider 142 and the feeder 141 is operated. Is collectively transferred to the rear end of the guider 142.

The objects to be transported to the rear end of the guider 142 are sequentially loaded into the magazine which is raised for the loading operation of the upper cleaning chamber 100. At this time, the loading operation is repeatedly performed on each of the objects to be cleaned in the same manner as the loading operation performed at the lower side of the cleaning chamber 100.

As described above, when all the cleaned objects are cleaned in the magazine through the upper cleaning chamber 100, the elevator 420 of the load unit 400 seats the magazine on the downloader 442, and the second magazine sensor ( When 443 detects the seating of the magazine, it sends a falling signal to the downloader 442 side. The downloader 442 that receives the falling signal from the second magazine sensor 443 is lowered and the magazine lowered together with the downloader 442 is discharged to the outside along the conveyor 441.

Plasma cleaning device for semiconductors of the present invention is repeatedly operated in a cycle as described above.

While the invention has been shown and described with respect to specific embodiments thereof, it will be understood that the invention can be variously modified and modified without departing from the spirit or scope of the invention as set forth in the following claims. It should be included in the scope of the invention.

1 is a cross-sectional view of a state of use of a conventional plasma cleaning apparatus.

2 is an assembled perspective view showing a cassette constituting a conventional plasma cleaning apparatus and a magazine mounted inside the cassette.

3 is a perspective view of the plasma cleaning apparatus of the present invention.

4 is a front view of FIG. 3.

5 is a bottom plate cross-sectional view of the cleaning chamber of the present invention.

Figure 6 is a bottom perspective view of the bottom plate of the cleaning chamber of the present invention.

7 is a plan view of the heating plate of the cleaning chamber of the present invention.

8 is a perspective view showing a configuration of a feeder provided in the first seating portion of the present invention.

9 is a perspective view of a first pusher constituting the present invention;

10 is a perspective view of a rod unit constituting the present invention.

Figure 11 is a side view of the clamp of the rod unit constituting the present invention.

12a to 12c are views showing the operating state of the rotational transfer unit constituting the present invention in order.

13 is a perspective view of a second pusher constituting the present invention;

<Explanation of symbols for main parts of the drawings>

100 cleaning chamber 110 bottom plate

111 ... seat member 112 ... air circulation pipe

112a ... inlet pipe 112b ... outlet pipe

115 ... heating unit 115a ... top ceramic plate

115b ... Cover Plate 115c ... Heating Plate

115d ... lower ceramic plate 130 ... first seat

131,141 Feeder 131a

131b ... drive motor 131c ... feeding belt

131d ... Feeding Roller 132,142 ... Guide

140 2nd seat 145 4th magazine sensor

150 ... Measures to be cleaned 151 ... LM Guide

152 ... Fingerarm 153,540 ... Finger

200 ... Unloading unit 210,411 ... Conveyor

211,441 ... Conveyor Body 212 ... Uploader

213 1st magazine sensor 220,410 ... clamp

221 ... clamp block 222 ... clamping cylinder

223 ... clamper 224 ... elastic pressure plate

225 ... 3rd magazine sensor 230,420 ... elevator

240,430 ... Horizontal transport robot 250 ... 1 pusher

252,530 Push cylinder 300 Rotary feed unit

310.Transport conveyor 320 ... Conveyor

330 turntable 400 load unit

442 Downloader 443 Second magazine sensor

500 ... 2nd pusher 510 ... Information rail

520 ... push bar

Claims (14)

A plurality of plasma cleaning chambers arranged vertically side by side; An unloading unit which sequentially moves the loaded objects to the front of each plasma cleaning chamber while the object to be cleaned is moved at a predetermined interval while moving from the bottom to the top according to the cleaning progress situation; A plurality of first pushers installed in the unloading unit so as to correspond to the plasma cleaning chambers, each of the first pushers for discharging the objects to be mounted in the magazine moved by the unloading unit to the plasma cleaning chamber; A rotation transfer unit which receives the empty magazine from which all the objects to be cleaned are supplied from the unloading unit, rotates horizontally by 180 °, and then transfers the rear side of the plasma cleaning chamber; A load unit which receives the empty magazine from the rotation transfer unit and sequentially moves the supplied empty magazines to the rear of each plasma cleaning chamber while moving from the bottom to the upper side according to the cleaning progress situation; And And a second pusher for pushing and cleaning the cleaned objects to be loaded into the empty magazine of the load unit. The method of claim 1, In front of each plasma cleaning chamber is provided with a first seating portion having a plurality of guiders disposed in the left and right directions so that the objects to be discharged from the magazine by the first pusher in turn Behind each plasma cleaning chamber is provided with a second seating portion having a plurality of guiders disposed in the left and right directions so that the cleaned objects to be discharged from the plasma cleaning chamber is seated, The first and second seats are provided with feeders for rearwardly moving the object to the seating point for each guider, The first seating unit may include a to-be-cleaned object moving means for moving the to-be-washed object seated on the first seating part to the plasma cleaning chamber side or to move the cleaned object to the second seating part side. A plasma cleaning device for semiconductors. The method of claim 2 The feeder A rotating shaft passing through each guider at the same time; A drive motor for imparting rotational force to the rotating shaft; A feeding belt which is installed for each guider so that the objects to be entered into each guider are placed, and feeds the objects to be entered to the rear of the guider by receiving rotational force from the rotation shaft; And And a feeding roller configured to press the upper portion of the object to be cleaned placed above the feeding belt downward. The method of claim 2, The means for moving the object to be cleaned An LM guide reciprocating a section from the first seat to the plasma cleaning chamber; A finger arm reciprocating along the LM guide; And The finger arm is installed to be selectively rotated up and down, and in the down-rotated state, the objects to be cleaned seated on the first seating part are pushed toward the plasma cleaning chamber side or the surfaces to be cleaned are pushed to the second seating part side. Plasma cleaning device for a semiconductor, characterized in that consisting of moving fingers. The method of claim 2, The unload unit Conveyor for receiving the magazines mounted at a predetermined interval from the outside to be transported to the pickup position; A clamp for picking up a magazine transferred to a pickup position through the conveyor; An elevator to which the clamp is installed to vertically move the picked up magazine to each first pusher; And And a horizontal transfer robot for sequentially moving the elevator such that the clamp is positioned in front of each guider of the first seat. The method of claim 5, The conveyor Conveyor body; An uploader positioned at the rear of the conveyor body to seat a magazine transported along the conveyor body and to raise the seated magazine to a pickup position; And And a first magazine sensor for detecting a magazine seated on the uploader and sending a pickup signal to the clamp side. The method of claim 2, The load unit Clamp for picking up the empty magazine transferred from the rotation transfer unit; The clamp is installed, the elevator for moving the picked up empty magazine vertically to the second pusher side; A horizontal transfer robot that sequentially moves the elevator such that the clamp is positioned in front of each guider of the second seat; And And a conveyor for receiving the magazine through the elevator and discharging it to the outside when all of the cleansed objects cleaned in the empty magazine by the second pusher are mounted. The method of claim 7, wherein Conveyor Conveyor body; A downloader positioned at the rear of the conveyor body to seat a magazine transported by an elevator and to lower the seated magazine to the conveyor body; And And a second magazine sensor which senses that the magazine is seated on the downloader and sends a down signal to the downloader side. The method according to claim 5 or 7, The clamp is A clamp block fixed to the elevator; A clamping cylinder installed under the clamp block; A pair of clampers connected to both sides of the clamping cylinder and varying in degree of separation according to an operation of a clamping cylinder; An elastic pressure plate installed in a horizontal state between the clampers through the clamping cylinder to elastically press the upper portion of the magazine positioned between the clampers; And Plasma cleaning device for semiconductors comprising a third magazine sensor installed on one side of the clamper to detect whether the magazine has reached the normal clamping position through the position of the elastic pressure plate to send a clamping signal to the clamping cylinder. The method of claim 1, The rotational transfer unit A conveying conveyor having a conveying section from the unloading unit to the load unit behind the plasma cleaning chamber; And A plasma cleaning apparatus for semiconductors, comprising: a conveyor on which empty magazines discharged from all objects to be cleaned are seated, and a turntable connected to a lower portion of the conveyor to rotate the conveyor 180 ° horizontally. The method of claim 2, The second pusher A guide rail installed in parallel with the second seating portion; A push bar reciprocating a predetermined section along the guide rail; A push cylinder for imparting a reciprocating movement force to the push bar; And The push bar may be selectively mounted up and down, and configured to include a plurality of fingers for sequentially mounting the objects to be mounted on the second seat in the downwardly rotated state to the empty magazine side of the rod unit. Plasma cleaning device for semiconductors. The method of claim 2, The fourth magazine sensor is installed at the rod unit side end of each guider of the second seating unit to detect the empty magazine and send the detected empty magazine signal to the second pusher so that the corresponding finger performs the mounting operation of the object to be cleaned. A plasma cleaning device for semiconductors. The method of claim 1, The cleaning chamber is installed on the bottom plate on which the object to be transported through the rod unit is seated, and the upper and lower portions of the bottom plate so as to be selectively matched with the bottom plate. The upper plate having a predetermined internal space so as to be generated, and is fixed to the upper portion of the bottom plate to support both sides of the to-be-cleaned object entering the cleaning chamber through the unloading unit in a state in which the to-be-cleaned object is separated from the bottom plate It has a pair of mounting members for seating, The bottom plate is a plasma cleaning device for semiconductors, characterized in that a heating unit for heating the object to be heated to a proper temperature by self-heating by a heating air circulating inside and cooling by a cooling air. The method of claim 13, The heating unit is composed of a stacking of the upper ceramic plate and the cover plate and the heating plate and the lower ceramic plate is fixed to the mounting member, Surface of the heating plate is a plasma cleaning device for semiconductors, characterized in that the air route for circulating the heating air or cooling air supplied from the outside is uniformly formed over the entire surface.

Images