KR20090053303A - Tray supplying and collecting apparatus for test handler and tray transferring method using the same - Google Patents

Abstract

The present invention relates to a tray supply recovery device for a test handler, comprising: a loading stacking unit for storing a tray on which a test target semiconductor device is loaded, a loading seat for supplying the tray to a loading area and recovering an empty tray from the loading area; An empty tray stacking unit for storing empty trays, an unloading seat for supplying the empty trays to the unloading area, and recovering the tray on which the tested semiconductor device is loaded from the unloading area, and the loaded semiconductor device And an unloading stacking unit for storing the trays, and first and second conveying units for holding and conveying the trays independently.

According to the present invention, since the first and second transfer parts can hold the trays and transfer them independently, the trays can be prepared for the collection and recovery operations of the trays, and at the same time, the preparation and supply operations for the other trays can be performed. Improve the test handler's unit per hour (UPH) by increasing the feed and withdraw rate.

Test handler, tray, supply, recovery and transfer method

Description

Tray supplying and collecting apparatus for test handler and tray transferring method using the same}

The present invention relates to a tray feed recovery device for a test handler and a tray transfer method using the same, and more particularly, the tray preparation and supply operation of other trays can be performed simultaneously with the preparation and recovery operations of the tray. The present invention relates to a tray supply recovery device for a test handler capable of increasing a supply and recovery speed of a tray and a tray transport method using the same.

In general, in a subsequent process of manufacturing a semiconductor device, a plurality of semiconductor chips cut from a wafer and separated separately are attached to an auxiliary substrate, and then the semiconductor device completed by wrapping the outside with a molding material is located inside the chamber. They are then tested for electrical performance in a range of temperatures ranging from high to low temperatures.

This test process is performed by a test handler including a tray feed recovery device and a test unit.

The tray supply recovery device supplies a customer tray loaded with a semiconductor device under test to a loading area, and recovers a customer tray on which the tested semiconductor device is seated from an unloading area.

The test unit includes a tester for performing an electrical performance test on the semiconductor device under test. The test unit transfers the test target semiconductor device, which is loaded on the customer tray and supplied to the loading area, into an empty test tray, and the test target semiconductor device loaded on the test tray is transferred to the tester for testing.

When the test is completed, the test unit classifies the tested semiconductor device according to the test result and transfers the loaded semiconductor device to an empty customer tray located in the unloading area of the test tray.

Thereafter, the customer tray loaded with the tested semiconductor device is recovered from the unloading area by the tray supply recovery device as described above.

As shown in FIG. 1, a conventional tray supply and recovery device for performing such an operation includes a loading stacking unit 10 and a customer tray CT1 in which a customer tray CT1 on which a test target semiconductor device is loaded is stored. ) A loading seat 20 for supplying the loading area LA to the loading area LA, an unloading seat 30 for recovering the empty customer tray CT2 from the unloading area UA, and a customer tray The unloading stacking unit 40 in which CT3) is classified and stored according to the grade of the tested semiconductor device loaded therein, the empty tray stacking unit 50 in which the empty customer tray CT2 is stored, and each of the above-described components. It is composed of a transfer unit 60 for moving between the elements and conveying the customer tray (CT).

Here, the transfer unit 60, as shown in Figure 2, a pair of grippers (61a, 61b) for holding the customer tray (CT), the transfer body 62 is connected so that the gripper 61 can be lifted, A material for elevating the gripper 61 including a first guide portion 63 for guiding the elevating of the gripper 61, the motors 64a-1 and 64b-1 and the ball screws 64a-2 and 64b-2. One drive unit 64, a second guide unit 65 for reciprocating the transfer body 62, and the motor 66-1 and the ball screw 66-2 including the reciprocating the transfer body 62 It consists of the 2nd drive part 66 which conveys.

3A to 3D, the empty customer tray CT2 of the loading area LA is collected and stored in the empty tray stacking unit 50, stored in the loading stacking unit 10, and the semiconductor device under test is loaded. The operation of the conventional tray supply and recovery device described above will be described by taking the loaded customer tray CT1 into the loading area LA as an example.

First, as shown in FIG. 3A, one of the pair of grippers 61 is transferred to the loading stacking unit 10 and lowered to hold the customer tray CT1 on which the semiconductor device under test is loaded. . And, as shown in Figure 3b, the transport body 62 is avoided from the lifting path of the loading seat 20 so that the loading seat 20 can be lowered to recover the empty customer tray (CT2).

Thereafter, as illustrated in FIG. 3C, one of the pair of grippers 61 grips and transfers the empty customer tray CT2 of the loading seat 20 to the pair of grippers 61. The customer tray CT1 on which the test target semiconductor device is held by any one 61a is mounted on the loading seat 20.

Thereafter, as shown in FIG. 3D, the transfer body 62 is loaded and mounted so that the loading seat 20 may be raised to supply the customer tray CT1 loaded with the semiconductor device under test to the loading area LA. It is avoided from the lifting path of the part 20, and the loading seat part 20 raises. The gripper 61 holding the empty customer tray CT2 stores the empty customer tray CT2 in the empty tray stacking unit 50.

In the conventional tray feed recovery device operating in this way, the pair of grippers 61 are provided on one transfer body 62 to move the other grippers 61b together for the movement of any one gripper 61a. There are disadvantages that must be made.

Therefore, since the pair of grippers 61 move between all the components and transfer the customer tray CT, there is a problem that the operation and the speed of supplying and retrieving the customer tray CT are slow because there is no choice but to perform the operations in order. .

In addition, the transfer body 62 is provided to have a width wide enough to be provided with a pair of grippers 61, the transfer body having a large width during the lifting and lowering of the loading and unloading seating portion (20, 30) The distance that 62 must be moved to completely escape from the lifting path is long, and the time taken for the avoidance movement of the transfer body 62 is long.

As described above, the conventional tray supply recovery device reduces the transfer efficiency of the customer tray CT by the pair of grippers 61 to supply the customer tray CT to the loading and unloading areas LA and UA. Recovery rate is slow.

Therefore, the speed at which the semiconductor device to be tested is transferred to the tester and the speed at which the tested semiconductor device is collected from the tester are slow, resulting in a poor throughput per unit (UPH) of the test handler.

In order to solve the above problems, the present invention, while performing the recovery preparation and recovery operation of the tray, at the same time can perform the preparation and supply operation of the other trays required to increase the tray supply and recovery speed test Provided is a tray feed recovery device for a handler and a tray transport method using the same.

In order to solve the above problems, the tray supply recovery apparatus for a test handler of the present invention, a loading stacking unit for storing a tray on which the semiconductor device under test is loaded, the tray is supplied to the loading area and the empty tray is loaded. A loading seat for recovering from an area, an empty tray stacking unit for storing an empty tray, an unloading seat for supplying an empty tray to an unloading area and recovering the tray on which the tested semiconductor device is loaded from the unloading area; And an unloading stacking unit for storing the tray on which the tested semiconductor device is loaded, and a first and a second transporting unit for holding and transferring the trays, respectively.

The tray feed recovery device for the test handler may be configured to, when the first transfer unit transfers the empty tray positioned in the loading seat to the empty tray stacking unit, the second transport unit loads the tray stored in the loading stacking unit. It may be provided to be transported to the seat.

The tray supply and recovery device for the test handler may include the second transfer unit when the first transfer unit is located in the unloading seat and transfers the tray on which the tested semiconductor device is loaded to the unloading load unit. It may be provided to transport the empty tray stored in the loading portion to the unloading seating portion.

The tray supply and recovery device for the test handler may further include a check unit configured to check whether the semiconductor device remains in the empty tray transferred from the loading seat, wherein the first transfer unit includes the empty tray located at the loading seat. When transferring to the confirmation unit, the second transfer unit may be provided to transport the tray stored in the loading stacking portion to the loading seating portion.

The tray supply recovery device for the test handler may include the first transfer unit when the second transfer unit is located in the unloading seat and transfers the tray on which the tested semiconductor device is loaded to the unloading load unit. The empty tray can be provided to be transported to the unloading seating portion to be seated.

Meanwhile, in the tray transfer method of the present invention, when the first transfer unit transfers the empty tray located in the loading seat to the empty tray stacking unit, the second transfer unit transfers the tray stored in the loading stacking unit to the loading seat. Steps.

The tray conveying method may include: an empty tray stored in the empty tray stacking unit when the first transporting unit transfers a tray loaded with the tested semiconductor device to the unloading stacking unit to the unloading stacking unit; It may further comprise the step of transporting to the unloading seating portion.

The tray conveying method may further include the step of transferring the tray stored in the loading stacking unit to the loading seating unit when the first conveying unit transports the empty tray located in the loading seating unit to the checking unit. It may include.

In addition, the tray transfer method, when the second transfer unit is located in the unloading seating portion and transfer the tray loaded with the tested semiconductor element to the unloading loading portion, the first transfer portion is confirmed by the confirmation unit The method may further include transferring the completed empty tray to the unloading seat and seating the seat.

According to the tray feed recovery device for the test handler of the present invention and the tray transfer method using the same, the first and second transfer units can hold the trays and transfer them independently, thereby simultaneously performing recovery preparation and recovery operations of the trays. It is possible to carry out feed preparation and feed operations of other trays as required.

In addition, when the loading and unloading seats are lifted, the first and second transport parts are independently transferred to avoid the lifting path of the loading and unloading seats, thereby reducing the time required for avoiding the first and second transport parts. Can be.

Therefore, it is possible to improve the hourly output of the test handler by simultaneously performing the recovery preparation and supply preparation operations of the tray and quickly avoiding it in the lifting path of the loading and unloading seat.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

The tray feed recovery device for a test handler according to the present invention is provided in a test handler including a test unit. The tray supply recovery device transfers the customer tray (hereinafter simply referred to as "tray") on which the semiconductor device under test is loaded to the loading area, and recovers the tray on which the test completed semiconductor device is loaded from the unloading area.

The test unit transfers the test target semiconductor device loaded on the tray to an empty test tray, loads the test target semiconductor device, and performs an electrical performance test on the test target semiconductor device loaded on the test tray. When the test is completed, the tested semiconductor device is moved back to the tray. Thereafter, the tray on which the tested semiconductor element is loaded is recovered from the unloading area by the supply recovery device as described above.

Hereinafter, with reference to the accompanying Figures 4 and 5, the configuration and effect of the tray supply recovery device for a test handler according to a preferred embodiment of the present invention will be described in detail. The tray supply recovery device includes a loading stacking unit 100, a loading seating unit 200, an empty tray stacking unit 300, an unloading seating unit 400, an unloading stacking unit 500, a checking unit 600, and First and second transfer parts 700a and 700b are included.

The loading stacking unit 100 is where the tray CT1 on which the test target semiconductor device is loaded is stored. The loading stacking unit 100 may be provided in plural numbers. In this case, each of the loading stacking units 100 stores a tray CT1 on which the same test target semiconductor device is loaded.

The loading seating part 200 may be provided as a plurality of places where the tray CT1 on which the test target semiconductor device of the loading mounting part 100 is mounted is supplied to the loading area LA.

In addition, the loading seating part 200 is provided to move up and down, when the tray CT1 on which the test target semiconductor device is loaded by the first and second transfer parts 700a and 700b is seated. This is transferred to the loading area LA. In addition, when all the trays CT1 on which the semiconductor device under test is loaded become empty trays CT2, the trays CT1 are lowered to recover the empty trays CT2 from the loading area LA.

The empty tray stacking unit 300 is a place where the empty tray CT2 is transferred and stored from the loading seating unit 200 or the checking unit 600.

The unloading seating unit 400 is a place where the empty tray CT2 in which the tested semiconductor devices are classified and loaded according to a predetermined grade is positioned. In this case, the semiconductor devices are classified and loaded into the plurality of empty trays CT2 positioned in each unloading seating unit 400 according to the grade according to the test result.

The unloading seating unit 400 is provided to be elevated like the loading seating unit 200, and the empty tray CT2 is seated by the first and second transfer units 700a and 700b in a lowered state. Ascends and supplies it to the unloading area UA. When all of the tested semiconductor devices are loaded into the empty tray CT2, the tray is lowered to recover the tray CT3 on which the tested semiconductor devices are loaded from the unloading area UA.

The unloading loading part 500 is a tray CT3 on which the test completed pendulum body element of the lowered unloading seating part 400 is loaded is transferred and stored by the first and second transfer parts 700a and 700b. . The unloading stacking unit 230 is provided in plural numbers, and each of the trays CT3 on which the test-complete semiconductor devices of the same grade are loaded is stored separately.

The identification unit 600 determines whether the semiconductor device remains in the empty tray CT2 recovered from the loading area LA. The checker 600 inverts the recovered empty tray CT2 and when the semiconductor device remains, the remaining semiconductor device is discharged to the lower side, and the lower side collects the semiconductor device discharged as described above (not shown). Is provided.

The first and second transfer units 700a and 700b respectively hold the trays CT and independently transfer them to thereby carry the trays CT between the respective components as described above. To this end, the first and second transfer parts 700a and 700b may include the first and second grippers 710a and 710b, the first and second transfer bodies 720a and 720b, and the first and second transfer parts 700a and 700b. 1st and 2nd guide parts 730a and 730b, 1st and 2nd lifting drive parts 740a and 740b, a support plate (SP), a center guide part (MGP; Main Guiding Part), and 1st and 2nd The drive unit 750a, 750b is included, respectively.

The first and second grippers 710a and 710b are provided to hold or separate the tray CT from above, and are provided in the first and second transfer bodies 720a and 720b so as to be liftable. The first and second transfer bodies 720a and 720b are provided on the support plate SP so as to be able to reciprocate horizontally.

The first and second guide portions 730a and 730b are provided in the first and second transfer bodies 720a and 720b, respectively, to guide the lifting of the first and second grippers 710a and 710b. The first and second lift driving units 740a and 740b include motors 740a-1 and 740b-1, pulleys 740a-2 and 740b-2, and belts 740a-3 and 740b-3. The first and second grippers 710a and 710b are respectively elevated.

The support plate SP is fixedly installed on the body of the test handler installed on the bottom surface, and the center guide part MGP is horizontally reciprocated conveyance of the first and second transfer bodies 720a and 720b with respect to the support plate SP. To guide. The first and second driving units 750a and 750b include motors 750a-1 and 750b-1, pulleys 750a-2 and 750b-2, and belts 750a-3 and 750b-3. The first and second transfer bodies 720a and 720b are horizontally transferred, respectively.

In a preferred embodiment of the present invention, the first and second lift driving units 740a and 740b and the first and second driving units 750a and 750b are motors 740a-1, 740b-1, 750a-1 and 750b, respectively. -1), the pulleys (740a-2, 740b-2, 750a-2, 750b-2) and the belt (740a-3, 740b-3, 750a-3, 750b-3), but the configuration is the first If the second gripper 710a, 710b can be raised or lowered or the first and second transfer bodies 720a, 720b can be transported, the present invention is not limited thereto.

As described above, the tray feed recovery device according to the present invention is provided in each of the first and second transfer bodies 720a and 720b in which the first and second grippers 710a and 710b can be independently horizontally transferred. Different tray (CT) transfer operation can be carried out at the same time, it can also be transferred in the opposite direction can be quickly avoided in the lifting path of the loading and unloading seating portion (200, 400).

6A to 7D, a tray transfer method using the tray feed recovery device for a test handler according to an exemplary embodiment of the present invention will be described in detail.

Generally, the test unit (not shown) takes out the supplied test target semiconductor device from the tray CT1 in order and performs an electrical test. Therefore, the transfer of the trays CT1 and CT2 supplied or recovered to the loading area LA is relatively regular.

However, since the tested semiconductor devices are classified according to the grades of the test results and loaded into the empty tray CT2 of the unloading area UA, the semiconductor devices having a large number of grades or the semiconductor devices having a small number of grades are loaded. The number of times that the trays CT3 on which the test-complete semiconductor elements located in the plurality of unloading seats 400 are loaded depends on whether they are loaded. Therefore, the transfer of the trays CT2 and CT3 supplied or recovered to the unloading area UA is irregular.

Therefore, the movements of the loading and unloading seating portions 200 and 400 and the first and second conveying portions 700a and 700b for supplying and recovering the tray CT to the loading area LA and the unloading area UA are obtained. Is irregular. Therefore, the test handler is provided with a central controller (not shown) to provide a signal that the supply or recovery of the tray CT is necessary, and the first and second transfer parts 700a and 700b when the signal is received in consideration of the first position. Calculate the optimized transfer path of the second transfer unit 700a, 700b and give a transfer command.

As a result, there are many cases in which the first and second transfer units 700a and 700b transfer trays. In the following description, the tray transfer method using the tray feed recovery device of the present invention is used. In addition, compared with the case of using a conventional tray feed recovery device, the tray transfer time can be significantly shortened.

First, referring to FIGS. 6A to 6D, an empty tray CT2 located in the loading seat 200 is recovered, and a tray for supplying the tray CT1 on which the semiconductor device under test is loaded to the loading seat 200 is provided. Describe the transfer method.

First, when a signal is detected that the tray CT needs to be collected and supplied to the loading seat 200, the first and second transfer parts 700a and 700b may move up and down so that the loading seat 200 descends. To avoid. In this case, as shown in FIG. 6A, the first and second transfer parts 700a and 700b are preferably avoided to the left and right sides of the loading seating part 200 for subsequent operation.

Next, as shown in FIG. 6B, when the loading seating unit 200 descends, the first transporting unit 700a moves to the loading seating unit 200 and grips the empty tray CT2. In this case, the second transfer part 700b holds the tray CT1 stored in the loading stacking part 100 and on which the semiconductor device to be tested is loaded.

As illustrated in FIG. 6C, the first transfer part 700a transfers the held empty tray CT2 and stores the empty tray CT2 in the empty tray stacking unit 300. At this time, the second transfer part 700b transfers the tray CT1 on which the test target semiconductor device is held and is seated on the loading seat 200.

Thereafter, as illustrated in FIG. 6D, the second transfer part 700b is avoided from the lifting path of the loading seating part 200, and the loading seating part 200 is lifted up so that the tray CT1 on which the semiconductor device under test is loaded. Is supplied to the loading area LA. Of course, at this time, the first transfer unit 700a may be freely transferred for subsequent work.

The transfer of the tray shown in FIGS. 6A to 6D as described above is merely an example. Depending on the situation, the roles of the first transfer unit 700a and the second transfer unit 700b may be changed as appropriate.

In addition, when it is necessary to confirm whether the semiconductor device remains in the empty tray CT2 recovered from the loading area LA, the empty tray CT2 may be transferred to the confirming unit 600 instead of the unloading stacking unit 500. have. That is, after the second transfer part 700b seats the tray CT1 on which the semiconductor device to be tested is loaded on the loading seating part 200, it is avoided in the lifting path of the loading seating part 200 and the loading seating part 200. While rising, the first transfer unit 700a transfers the held empty tray CT2 to the confirmation unit 600.

Hereinafter, as another embodiment of the tray transfer method using the tray feed recovery device for the test handler of the present invention, referring to Figure 7a to 7d, the tray is placed on the unloading seating portion 400 and the test completed semiconductor device ( A tray transfer method for collecting the CT3) and supplying the empty tray CT2 to the unloading seat 400 will be described.

First, when a signal indicating that the tray CT is collected and supplied to the unloading seating unit 400 is detected, as shown in FIG. 7A, the first and second transfer parts 700a and 700b may correspond to the corresponding unloading seating unit. Evade in the elevation path to allow 400 to descend.

Subsequently, as shown in FIG. 7B, when the unloading seat 400 descends, the first feeder 700a moves to the corresponding unloading seat 400 so that the test-complete semiconductor device is loaded (CT3). Grip). At this time, the second transfer unit 700b grips the empty tray CT2 stored in the empty tray stacking unit 300.

As illustrated in FIG. 7C, the first transfer unit 700a transfers the tray CT3 on which the tested semiconductor device is held, and stores it in the corresponding unloading loading unit 500. At this time, the second transfer part 700b transfers the gripped empty tray CT2 to the unloading seating part 400.

Thereafter, as shown in FIG. 7D, the second transfer part 700b is avoided from the lifting path of the unloading seating part 400, and the unloading seating part 400 is raised to unload the empty tray CT2. (UA) supplies. In this case, the second transfer unit 700b may independently avoid the first transfer unit 700a at the time of avoidance, and in this case, the first transfer unit 700a may be freely transferred for subsequent work.

In the case of the transfer of the tray CT shown in FIGS. 7A to 7D as described above, the roles of the first transfer unit 700a and the second transfer unit 700b may be changed according to the situation. In addition, when the checking unit 600 needs to check whether the semiconductor element remains in the empty tray CT2 and to transfer the empty tray CT2 of the checking unit 600, the checking unit 600 sends the empty tray stacking unit 300. Instead of the stored empty tray CT2, the empty tray CT2 of the verification unit 600 may be seated on the unloading seating unit 400.

That is, when the unloading seating unit 400 descends, when the second transfer unit 700b grips the tray CT3 on which the tested semiconductor device is loaded, the first transfer unit 700a is empty of the check unit 600. When the tray CT3 is gripped and the tray CT3 loaded with the tested semiconductor device held by the second transfer part 700b is stored in the unloading loading part 500, the first transfer part 700a is gripped. One empty tray CT2 may be seated on the unloading seat 400.

As described above, in the tray transfer method using the tray feed recovery device for the test handler of the present invention, since the first and second transfer units 700a and 700b can be independently transferred, different tray transfers can be performed simultaneously. The supply and recovery speed of the tray CT can be improved.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims. will be.

1 is a schematic view showing a tray feed recovery device for a conventional test handler,

Figure 2 is a schematic diagram showing a transfer unit provided in the tray feed recovery device for a conventional test handler,

3A to 3D are schematic views showing an operation sequence of a tray supply recovery device for a conventional test handler recovering an empty tray seated on a loading seat, and supplying a tray loaded with a semiconductor device under test to a loading seat;

4 is a schematic view showing a tray supply recovery apparatus for a test handler according to a preferred embodiment of the present invention;

5 is a schematic view showing a first and a second transfer unit provided in a tray feed recovery device for a test handler according to an embodiment of the present invention;

6A to 6D illustrate an empty tray seated on a loading seat using a tray supply recovery device for a test handler according to a preferred embodiment of the present invention, and supplying a tray on which the semiconductor device under test is loaded to the loading seat. Schematic showing the tray transport method,

7A to 7D illustrate a tray loaded on an unloading seat and loaded with a tested semiconductor device by using a tray feed recovery device for a test handler according to a preferred embodiment of the present invention, and an empty tray on the unloading seat It is a schematic diagram showing the tray conveying method.

＊ Explanation of symbols for main part of drawing ＊

100: loading loading part 200: loading seat

300: empty tray loading part 400: unloading seat

500: unloading loading part 600: confirmation part

700a: first transfer unit 700b: second transfer unit

710a: first gripper 710b: second gripper

720a: first transfer body 720b: second transfer body

730a: first guide part 730b: second guide part

740a: first lift drive 740b: second lift drive

750a: first driving unit 750b: second driving unit

740a-1, 740b-1, 750a-1, 750b-1: motor

740a-2, 740b-2, 750a-2, 750b-2: pulley

740a-3, 740b-3, 750a-3, 750b-3: belt

CT: Tray

CT1: Tray on which the semiconductor device under test is loaded

CT2: empty tray

CT3: Tray loaded with tested semiconductor elements

SP: Support Plate

MGP: Center Guide Section

Claims (9)

In the tray supply recovery device provided in the test handler for testing the electrical integrity of the test target semiconductor device supplied to the loading area, and discharges the tested semiconductor device to the unloading area, A loading stacking unit configured to store a tray on which the semiconductor device under test is loaded; A loading seat for supplying the tray to the loading area and recovering the empty tray from the loading area; An empty tray stacking unit for storing empty trays; An unloading seating unit which supplies an empty tray to the unloading area and recovers a tray on which the tested semiconductor device is loaded from the unloading area; An unloading stacking unit configured to store a tray on which the tested semiconductor device is loaded; And First and second transfer parts for holding the trays and transferring them independently; Tray feed recovery device for a test handler comprising a. The method of claim 1, The first transfer unit, When transferring the empty tray located in the loading seat to the empty tray stacking portion, The second transfer unit, The tray feed recovery device for the test handler, characterized in that for transporting the tray stored in the loading stacking portion to the loading seating portion. The method of claim 1, The first transfer unit, When transferring the tray loaded with the semiconductor element tested and placed in the unloading seating portion to the unloading loading portion, The second transfer unit, The tray feed recovery device for the test handler, characterized in that for transferring the empty tray stored in the empty tray loading unit to the unloading seating portion. The method of claim 1, A confirmation unit for checking whether the semiconductor element remains in the empty tray transferred from the loading seating portion; The first transfer unit, When transferring the empty tray located in the loading seat to the confirmation unit, The second transfer unit, The tray feed recovery device for the test handler, characterized in that for transporting the tray stored in the loading stacking portion to the loading seating portion. The method of claim 4, wherein The second transfer unit, When transferring the tray loaded with the semiconductor element tested and placed in the unloading seating portion to the unloading loading portion, The first transfer unit, The tray feed recovery device for the test handler, characterized in that for transferring the empty tray confirmed in the confirmation unit to the unloading seating portion. The tray stored in the loading stacking unit provided in the test handler for testing the electrical quality of the semiconductor device is transferred to the loading seating unit, the empty tray located in the loading seating unit to the empty tray stacking or checking unit, the empty tray stacking In the method for transferring the empty tray stored in the portion to the unloading seating portion, and the tray located in the unloading seating portion to the unloading loading portion, When the first transfer unit transfers the empty tray located in the loading seat to the empty tray stacking unit, the second transport unit transports the tray stored in the loading stack to the loading seat; Tray conveying method comprising a. The method of claim 6, When the first transfer unit is located in the unloading seat and transfers the tray on which the tested semiconductor device is loaded to the unloading stack, the second transport unit unloads the empty tray stored in the empty tray stack. Transporting and seating the seat; The tray transport method further comprises. The method of claim 6, When the first transfer unit transfers the empty tray located in the loading seat to the check unit, the second transfer unit transports the tray stored in the loading stack to the loading seat; The tray transport method comprising a. The method of claim 6, When the second transfer unit is located in the unloading seat and transfers the tray on which the tested semiconductor device is loaded to the unloading stack, the unloading seat of the empty tray checked by the check unit is seated. Transporting the part to be seated; The tray transport method further comprises.

Images