KR101177319B1 - Sorting Apparatus for Semiconductor Device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element sorting apparatus, and more particularly, to an element sorting apparatus and a method for automatically classifying an element such as a semiconductor chip according to classification criteria. The present invention provides an X-Y table for loading a burn-in board into which second elements are inserted; Move the XY table to withdraw the second elements from the burn-in board in conjunction with a second transfer tool and insert the first elements into the vacant positions of the burn-in board in conjunction with the first transfer tool; An XY table driving unit for moving the XY table to a burn-in board exchange position when insertion of one element is completed; A board loader for loading and loading the burn-in boards in which the second elements are inserted, and sequentially loading the burn-in boards in which the first elements are inserted, and transferring the burn-in boards to the burn-in test unit; Disclosed is a device sorting apparatus comprising a burn-in board exchange buffer unit for exchanging a burn-in board into which a first device of the X-Y table is inserted into a burn-in board into which a second device of the board loader is inserted.

Description

Device sorting device {Sorting Apparatus for Semiconductor Device}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element sorting apparatus, and more particularly, to an element sorting apparatus for automatically classifying an element such as a semiconductor chip according to classification criteria.

Semiconductor devices (hereinafter referred to as 'devices') undergo various tests such as electrical properties, heat or pressure reliability tests after the packaging process is completed.

Among these tests, the burn-in test is a burn-in test, in which a plurality of devices are inserted into a burn-in board, and the burn-in board is placed in a burn-in test apparatus to apply heat or pressure for a predetermined time. It is a test to determine if a defect occurs in the back device.

 The device sorting device for burn-in test generally classifies (unloads) the device into each tray according to the classification criteria given according to the inspection result for each device such as good or bad from the burn-in board that has loaded the device that has undergone the burn-in test. It is a device that inserts (loads) a new device to perform burn-in test again in an empty place (socket) of burn-in board where the device is located.

On the other hand, the performance of the device sorting device as described above is evaluated as the number of sorts per unit (UPH), UPH is the time required for the transfer of the device, the burn-in board transfer between the components constituting the device sorting device It is decided according to.

Therefore, it is necessary to improve the structure and arrangement of each component in order to increase the UPH, which is the performance of the device sorting device.

An object of the present invention is to provide a device sorting device that can significantly improve the processing speed of the device sorting device by reducing the exchange time of the burn-in board between the board loader and the X-Y table.

Another object of the present invention is to install the elevator unit for the take-out of the rack and the exchange of the burn-in board with the XY table between the pair of rack loading parts on which the racks loaded with the burn-in board is loaded to take out the rack in advance and the board loader and XY table The present invention provides a device sorting device capable of significantly improving the processing speed of a device sorting device by shortening a burn-in board replacement time.

Another object of the present invention is to install the burn-in board exchange buffer portion for exchanging burn-in board between the board loader and the XY table and to move the burn-in board exchange buffer portion up, down, left and right to take out the burn-in board from the rack loaded on the board loader The present invention provides a device sorting device capable of significantly improving the processing speed of a device sorting device by shortening a burn-in board replacement time with a loader and an XY table.

The present invention has been made to achieve the object of the present invention as described above, the present invention includes an X-Y table for loading the burn-in board is inserted into the second element; Move the XY table to withdraw the second elements from the burn-in board in conjunction with a second transfer tool and insert the first elements into the vacant positions of the burn-in board in conjunction with the first transfer tool; An XY table driving unit for moving the XY table to a burn-in board exchange position when insertion of one element is completed; A board loader for loading and loading the burn-in boards in which the second elements are inserted, and sequentially loading the burn-in boards in which the first elements are inserted, and transferring the burn-in boards to the burn-in test unit; Disclosed is a device sorting apparatus comprising a burn-in board exchange buffer unit for exchanging a burn-in board into which a first device of the X-Y table is inserted into a burn-in board into which a second device of the board loader is inserted.

The XY table moves a burn-in board seated on the burn-in board seating part in at least one of an upper side and a lower side between the pair of burn-in board seating seats on which the burn-in board seats up and down, and the pair of burn-in board seating seats. The burn-in board lifting unit may be configured, and the burn-in board exchange buffer unit may include a pair of burn-in board buffers in which burn-in boards are seated up and down corresponding to the burn-in board seating portion of the XY table.

The burn-in board on which the second elements are loaded is withdrawn from the board loader and transferred to the burn-in board seating portion located above the XY table via the burn-in board buffer portion located above the burn-in board exchange buffer portion. The loaded burn-in board may be configured to be delivered to the burn-in board buffer part located under the burn-in board exchange buffer part via the burn-in board seating part located at the lower side of the XY table and discharged to the board loader.

The burn-in board is transported by one or more sub-fingers between the burn-in board exchange buffer unit and the board loader, and the sub-fingers correspond to a plurality of sub-fingers between the burn-in board exchange buffer unit and the board loader. The burn-in board may be configured to be transported in three sub-movement sections.

The board loader includes a pair of rack loading parts arranged in the Y-axis direction of the X-Y table so that a rack including a plurality of burn-in boards is stacked in a plurality of stages; It is installed between the pair of rack loading portion may be configured to include an elevator unit for pulling out the rack from the rack loading portion to move the rack.

The board loader may include a pair of rack take-out units corresponding to the pair of rack loading units to withdraw the racks loaded on each of the rack loading units.

The present invention also provides a loading unit for loading a tray loaded with the first elements; A second transfer tool for drawing out second elements from the burn-in board; A first transfer tool for inserting the first elements loaded in the tray of the loading unit into an empty position of the burn-in board; An unloading unit which receives the second elements drawn out from the burn-in board by the second transfer tool, loads them into a tray, and unloads them; In conjunction with the first transfer tool and the second transfer tool, the XY table loaded with the burn-in board is moved in the XY direction, and when the insertion of the first elements into the burn-in board is completed, the burn-in board exchange position XY table driving unit for moving to; A board loader including a plurality of rack loading parts on which a rack on which burn-in boards are stacked is mounted; The burn-in board is installed to exchange the burn-in board between the board loader and the XY table driving unit, and the burn-in board with the second element inserted therefrom is removed from the rack loaded on the board loader. Disclosed is a device sorting apparatus comprising a burn-in board exchange buffer unit inserted into a rack loaded on the board loader.

The burn-in board exchange buffer unit may include an exchange buffer driving unit for driving the vertical and horizontal movement of the burn-in board exchange buffer unit so as to withdraw the burn-in board from the rack loaded in each rack loading portion.

The exchange buffer driving unit includes a first drive unit for driving a shanghai movement of the burn-in board exchange buffer unit based on the top and bottom of the rack loaded on the board loader, and the burn-in board exchange buffer based on a horizontal direction in which the rack is arranged on the board loader. It may include a second driving unit for driving the horizontal movement of the part.

The present invention also discloses a board loader module of the device sorting apparatus, wherein the burn-in board exchange buffer unit, the exchange buffer driver, and the exchange buffer driver comprise one module.

The device sorting apparatus according to the present invention exchanges the burn-in board from the board loader when the device is taken out and loaded into the burn-in board on the XY table, and after the drawing and loading of the device into the burn-in board on the XY table, the XY table and the burn-in board The burn-in board replacement buffer unit is further provided to replace the burn-in board, thereby reducing the replacement time of the burn-in board, thereby increasing the processing speed significantly.

In addition, the device sorting apparatus according to the present invention is installed by the elevator unit for the draw out of the rack and the exchange of the burn-in board with the XY table between the pair of rack loading parts on which the racks with the burn-in boards are loaded to take out the rack in advance And it is possible to reduce the burn-in board replacement time with the XY table to significantly improve the processing speed of the element sorting apparatus.

In addition, the device sorting apparatus according to the present invention installs a burn-in board exchange buffer portion for exchanging burn-in boards between the board loader and the XY table, and moves the burn-in board exchange buffer portion up, down, left, and right to take out the burn-in board from the rack loaded on the board loader. By reducing the burn-in board replacement time with the board loader and the XY table, the processing speed of the element sorting device can be remarkably improved.

1 is a conceptual diagram illustrating an example of a device sorting apparatus according to the present invention.
FIG. 2 is a plan view illustrating a configuration of the device sorting apparatus of FIG. 1.
FIG. 3 is a cross-sectional view illustrating the configuration of first and second moving buffers of the device sorting apparatus of FIG. 1.
FIG. 4 is a layout view illustrating a process of moving an XY table and a burn-in board in the device sorting apparatus of FIG. 1.
FIG. 5 is a conceptual diagram illustrating a process of exchanging a burn-in board between an XY table and a burn-in board exchange buffer unit in the device sorting apparatus of FIG. 1.
5A shows a state before the burn-in board is first exchanged between the XY table and the burn-in board replacement buffer section.
5B shows a state after the burn-in board is exchanged between the XY table and the burn-in board replacement buffer section.
5C and 5D are views illustrating a process of exchanging the burn-in board between the XY table and the burn-in board exchange buffer unit.
FIG. 6 is a conceptual diagram illustrating a process of exchanging a burn-in board between a burn-in board exchange buffer unit and a board loader in the device sorting apparatus of FIG. 1.
Figure 6a is a state before replacing the burn-in board between the burn-in board replacement buffer unit and the board loader,
Figure 6b is a middle state that the burn-in board is introduced into the rack of the board loader between the burn-in board exchange buffer unit and the board loader,
6C is a view illustrating a state where a burn-in board is inserted into a rack of a board loader between a burn-in board exchange buffer unit and a board loader.
Figure 6d is a middle state that the burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader,
6E is a conceptual diagram illustrating a state where a burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader.
7 is a side view showing the configuration of the board loader.
8A is a side cross-sectional view illustrating a burn-in board exchange buffer unit and a board loader having a modified configuration in the device sorting apparatus of FIG. 1.
8B is a side view illustrating the board loader of FIG. 8A.

Hereinafter, a device sorting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a conceptual diagram illustrating an example of a device sorting apparatus according to the present invention, FIG. 2 is a plan view showing a configuration of the device sorting apparatus of FIG. 1, and FIG. 3 is a first moving buffer and a first moving buffer of the device sorting apparatus of FIG. 1. 2 is a cross-sectional view showing the configuration of the moving buffer, Figure 4 is a layout showing the movement process of the XY table and the burn-in board in the device sorting apparatus of FIG.

Device sorting apparatus according to an embodiment of the present invention, as shown in Figures 1 and 2, a plurality of for transporting the loading unit 100, unloading unit 200, sorting unit 300 and the elements 10 It comprises two transfer tools (510, 520, 530, 540, 550, 560).

The burn-in board 20 refers to a board on which the first devices 10 are loaded so as to undergo a burn-in test in a burn-in test apparatus (not shown). 10) each have sockets into which they are inserted.

The burn-in board 20 is mounted on the X-Y table 410 installed in the device sorting apparatus, and the second devices 10 that have been burn-in tested are unloaded and the first devices 10 are loaded.

The XY table 410 loads the burn-in board 20 into which the second elements 10 are inserted and simultaneously unloads the burn-in board 20 into which the first elements 10 are inserted. As a configuration, as shown in FIGS. 1, 2, and 4, the burn-in board 20 to be replaced with the element 10 is supplied or the burn-in board 20 after the replacement of the element 10 is discharged. Burn-in board exchanger (not shown).

In the XY table 410, the first elements 10 may be inserted into the empty positions of the burn-in board 20 by the first transfer tool 530, or the second elements 10 may be withdrawn from the burn-in board 20. It is configured to be driven by the XY table driver (not shown) to move the burn-in board (20).

The XY table driving unit includes a second transfer tool 540 and a first transfer tool to facilitate the second transfer tool 540 and the first transfer tool 530 to withdraw or load the elements 10 from the burn-in board 20. Various configurations such as XY movement or XY-θ movement of the XY table 410 loaded with the burn-in board 20 in conjunction with 530 may be possible.

That is, the XY table driving unit withdraws the second elements 10 from the burn-in board 20 in cooperation with the second transfer tool 540 and the first element 10 in conjunction with the first transfer tool 530. Move the XY table 410 to insert the vacant position into the empty position of the burn-in board 20. When the insertion of the first elements 10 into the burn-in board 20 is completed, move the XY table 410 to the burn-in board replacement position. It can be configured to.

Meanwhile, the XY table 410 is installed in the main body 40 constituting the element sorting apparatus according to the present invention, and the main body 40 includes the second transfer tool 540 and the first transfer tool 530. ) May include a top plate 42 having an opening 41 for extracting or loading the bundles from the burn-in board 20.

The loading unit 100 is a configuration for loading the tray 30 (hereinafter referred to as a 'loading tray') on which the plurality of first elements 10 to be loaded on the burn-in board 20 may be loaded. Do.

In addition, the unloading unit 200 is configured to load and unload good elements (hereinafter referred to as 'good quality') among the second elements 10 in the tray 30 (hereinafter referred to as 'unloading tray'). As such, various configurations are possible.

As shown in FIG. 2, the loading unit 100 and the unloading unit 200 each have a pair of guide rails 110 and 210 for guiding the tray 30 to be moved, and the tray 30. It is generally configured to include a drive unit (not shown) for moving the.

In addition, the loading unit 100 and the unloading unit 200 may be variously arranged according to design conditions, as shown in FIGS. 1 and 2, the test unit 170, the unloading unit 200, and sorting. The unit 300, the first moving buffer 600, the second moving buffer 700, and the like are generally disposed in parallel with each other so as to be interposed therebetween, but are not limited thereto.

Meanwhile, after the first device 10 is withdrawn from the tray 30 in the loading unit 100, the empty trays 30 are unloaded so that the second devices 10 may be loaded by a tray transfer unit (not shown). It may be delivered to the unit 200.

In this case, the element 10 may remain in the tray 30, so that the elements 10 remaining in the tray 30 before the tray 30 is transferred from the loading unit 100 to the unloading unit 200. In order to remove the tray 30 to rotate the tray 30 to remove the remaining element 10 may be additionally installed.

1 and 2, the tray rotating unit 150 is installed on the transfer path of the tray 30 between the loading unit 100 and the unloading unit 200, and the loading unit ( The tray 30 is received from the 100, and the tray 30 is rotated, and then the tray 30 is transferred to the unloading unit 200.

In this case, one side of the tray rotating unit 150 supplies the empty tray 30 to the sorting unit 300, the unloading unit 200, etc. in addition to the sorting unit 300, or supplies the empty tray 30 from the loading unit 100. A bin tray 160 that can be temporarily loaded may be additionally installed.

On the other hand, the device sorting apparatus according to the present invention is to load the first device 10 from the loading unit 100 before loading on the burn-in board 20 in order to load only the good first device 10 on the burn-in board 20 The test unit 170 may be additionally installed to test the electrical characteristics such as the DC characteristics of the device 10 in advance.

The test unit 170 is installed between the loading unit 100 and the first moving buffer 600, it is possible to configure a variety of configurations, such as consisting of a plurality of sockets that can be electrically connected to the first element (10) Preferably, the same number of sockets as the horizontal number of the trays 30 in the horizontal direction may be installed.

The test result of each of the first elements 10 of the test unit 170 is used as data for sorting in the sorting unit 300 to be described later.

Meanwhile, the device sorting apparatus according to the present invention classifies the first defective elements 10 and the second defective elements 10 that need to be classified among the second elements 10 that are determined to be inferior as a result of the test of the test unit 170. It may include a sorting unit 300 for loading.

The sorting unit 300 may be configured in various ways according to its arrangement and classification criteria, and according to each classification criteria (Good, Bad Reject 1, Bad 2, DC Failure, etc.) It includes a suitable number of trays 30 (sorting trays), which are loaded, and have a configuration similar to that of the loading unit 100 described above, or fixed to the main body 40, as shown in Figures 1 and 2 It may be disposed between the loading unit 100 and the unloading unit 200 in the state.

In addition, the sorting unit 300 is a fixed installation as shown in Figures 1 and 2, in addition to the configuration of the loading unit 100 and the unloading unit 200 similar to the configuration of the tray 30, respectively It may be configured to include a pair of guide rails to guide so as to guide, and a drive unit (not shown) for moving the tray (30).

The transfer tool includes a burn-in board 20 and a loading unit 100, a test unit 170, an unloading unit 200, a sorting unit 300, a first moving buffer 600, a second moving buffer (to be described later) As a configuration for transferring the elements 10 between the 700, various configurations are possible according to the arrangement of each configuration.

For example, the transfer tool may include a third transfer tool 510 for transferring the elements 10 between the loading unit 100 and the test unit 170, the test unit 170, and the first moving buffer 600. The fourth transfer tool 520 for transferring the elements 10 between, the fifth transfer tool 550 for transferring the elements 10 between the second moving buffer 700 and the unloading unit 200 and the It may include a first moving buffer 600, and a sorting tool 560 for transferring the elements 10 between the second moving buffer 700 and the sorting unit 300.

In addition, the transfer tool (510, 520, 530, 540, 550, 560) is a device 10 loaded on the tray 30 of the loading unit 100 between the first moving buffer 600 and the burn-in board (20) The second device 10 from the burn-in board 20 between the first transfer tool 530 and the burn-in board 20 and the second moving buffer 700 are inserted into the empty seat of the burn-in board 20 It may be configured to include a second transfer tool 540 for transferring.

The arrangement of the elements 10 loaded on the burn-in board 20 is different from the arrangement of the elements 10 loaded on the tray 30 such as the loading unit 100, and the arrangement on the burn-in board 20 is relative. There are many.

Therefore, the first transfer tool 530 and the second transfer tool 540 for transferring or withdrawing the element 10 to the burn-in board 20 are configured to transfer a large number of elements 10 relative to the remaining transfer tools. This is preferred. For example, the first transfer tool 530 and the second transfer tool 540 may be 12 × 2, and the remaining transfer tools may be 8 × 1, 8 × 2, or the like.

When configuring the transfer tools as described above, except for the position where the transfer of a relatively large number of elements 10, the use of the transfer tool for transferring a small number of elements 10 in a position requiring a relatively small number of transfers This can reduce the manufacturing cost of the device and at the same time improve the size and stability of the device.

Meanwhile, the first transfer tool 530 and the second transfer tool 540 may be configured to move integrally with each other in consideration of alternate loading and withdrawal of the element 10 on the burn-in board 20.

Since the third transfer tool 510 and the fourth transfer tool 520 are also transferred to the device 10 with the test unit 170 therebetween, the third transfer tool 510 and the fourth transfer tool 520 may be configured to move integrally with each other.

In addition, the number of pickers of the first transfer tool 530 and the second transfer tool 540 in the horizontal direction may be determined by considering the efficiency of the device 10 in the first and second moving buffers 600 and 700. It may be configured to be equal to the number of transverse direction of the device receiving groove (not shown) for the loading of the (10).

The sorting tool 560 may be configured in various ways, including one or a plurality of elements. The sorting tool 560 transfers the elements 10 between the first moving buffer 600 and the sorting unit 300, and the second moving buffer 700. The second sorting tool 520 may transfer the elements 10 between the sorting units 300.

Meanwhile, the transfer tools may include a picker transfer device for moving one or more pickers and pickers in the XZ, YZ, or XYZ directions, each of which has an adsorption head for adsorbing the element 10 by vacuum pressure at an end thereof. .

In particular, the transfer tools may be arranged in a row, pickers arranged in a row, such as 12 × 2.

Meanwhile, the device sorting apparatus according to the present invention loads the first devices 10 from the loading unit 100 onto the burn-in board 20 or the second devices 10 from the burn-in board 20 to the unloading unit 200. When the withdrawal is installed between the loading unit 100 and the burn-in board 20, between the burn-in board 20 and the unloading unit 200 to improve the loading and withdrawal speed of the first element 10 and The second elements 10 may include first moving buffers 600 and second moving buffers 700 that are temporarily loaded and transferred.

The first moving buffer 600 and the second moving buffer 700 are installed on the main body 40 so as to be movable so as to replace the element and the burn-in board 20 and the element replacement position ③, the loading unit 100 or unloading The sorting operation speed is remarkably improved by moving the element replacement position ① for exchanging the element with the part 200 and the sorting position ② for exchanging the element with the sorting part 300 so that the exchange of the element 10 is made smoothly and seamlessly. Can be improved.

The first moving buffer 600 is a loading position (element replacement position) ① and the first defective element (1) to receive and load the first element 10 from the test unit 170 by the second transfer tool 540 10 is a sorting position (2) for transferring the sorting unit (2) to the sorting tray (30) of the sorting unit (300) by the sorting tool (560), and the first defective elements (10) having been removed. The transfer tool 510 is configured to move to a loading position (element replacement position) 3 that is loaded onto the burn-in board 20 of the XY table 410.

As shown in FIG. 3, the first movable buffers 600 are movable to support the main body 40 with the element accommodating part 610 and the element accommodating part 610 on which the elements 10 are loaded. It comprises a guide member 620 and a moving device (not shown) for moving the element accommodating portion 610 through the guide member 620.

The element accommodating part 610 has a number of elements 10 in the horizontal direction of the element accommodating groove for loading the element 10 so that a larger number of elements 10 can be loaded at the mounting position ③. ) Is more than the number of transverse directions of the element receiving groove for loading.

Here, the element accommodating part 610 is configured to stack the elements 10, and may be configured to directly load the elements 10 or may vary in size depending on the type of the element 10 to be sorted. They may include a separate receiving member (610a) formed.

As shown in FIGS. 1 and 2, the first moving buffers 600 are preferably configured in three so that the process may be simultaneously performed in each of the positions ①, ②, and ③. At this time, the guide member 620 is configured not to interfere with other guide member 620 during movement.

That is, as shown in FIG. 3, the first moving buffers 600 are supported by the first element accommodating part 611 and the second guide member 622 which are supported by the first guide member 621 and move horizontally. The second element accommodating part 612 supported and horizontally moved and the third element accommodating part 613 supported by the third guide member 623 and horizontally moved may be included.

The first to third guide members 621, 622, and 623 are configurations for guiding the respective element accommodating parts 611, 612, and 613 to be horizontally moved, and various configurations are possible, and are illustrated in FIG. 4. As described above, the first guide member 621 is installed on the upper portion, that is, the upper end of the supporting member 640 of the main body 40, and the second guide member 622 is the middle portion of the supporting member 640, that is, the middle portion. The third guide member 623 may be installed at the lower side of the support member 640, that is, at the lower end or on the upper plate 42 of the main body 40. The first to third guide members 621, 622, and 623 may be configured in pairs to stably support the element accommodating part 620.

Meanwhile, the moving device 630 for horizontally moving the first to third guide members 621, 622, and 623 may be configured in various ways according to a driving method, and the first to third guide members 621, 622, and 623 may be used. It may include first to third mobile devices (631, 632, 633) for horizontally moving them. In this case, the first to third moving devices 631, 632, and 633 are respectively a motor generating a rotational force and a belt, in particular, a timing belt and a pulley, coupled to the first to third guide members 621, 622, and 623. It can be configured by a combination of.

Referring to the operation of the first moving buffer 600 having the above configuration in detail as follows.

The first mobile buffers 600 are loaded at the loading position ①, that is, the first device 10 is loaded from the test unit 170 to the device receiving unit 610. In this case, the first devices 10 loaded into the device accommodating part 610 include the first defective devices 10 determined as defective in the test part 170.

Therefore, the first moving buffers 600 are moved to the sorting position ② to sort the first defective elements 10 after the loading of the elements 10 at the loading position ① is completed.

When the first moving buffer 600 is located at the sorting position ②, the first defective element 10 is transferred from the element accommodating part 610 to the sorting part 300 by the first sorting process, that is, the transfer tool. At this time, each of the first defective elements 10 is loaded on the tray 30 of the sorting unit 300 according to the defect standard.

Where the first defective element 10 of the element accommodating portion 610 is removed at the sorting position ②, the element determined as a good result of the test of the test unit 170 (hereinafter referred to as 'first normal element') ( 10) are filled with the first normal elements 10 from the first fixed buffer 341 preloaded-buffering process.

On the other hand, the first fixed buffer 341 is installed in the main body 40, and as a result of the test, the first normal elements 10 are pre-loaded. The first normal devices 10 may be loaded in the device accommodating part 610 of the first moving buffer 600 positioned.

When all of the first sorting process is completed in the first moving buffer 600, it moves from the sorting position ② to the stacking position ③. The first normal elements 10 loaded on the first moving buffer 600 are loaded on the burn-in board 20 by a transfer tool.

When the device accommodating part 610 of the first moving buffer 600 is empty, the loading process is performed again by moving from the loading position ③ to the loading position ① so that the first elements 10 can be loaded.

The second moving buffer 700 has a configuration similar to that of the first moving buffer 600, and receives the second elements 10 from the burn-in board 20 to be loaded by the second transfer tool 540 ( Element replacement position) and the sorting position ② for transferring the second defective elements 10 to the tray 30 of the sorting unit 300 by the sorting tray transfer tool, and the second defective elements 10 are removed. It is configured to repeatedly move the remaining second element 10 to the unloading position (element replacement position) ① that is loaded on the tray 30-the unloading tray-by the fifth transfer tool 550.

The second mobile buffer 700 having the configuration as described above has a similar configuration to the first mobile buffer 700, and as shown in Figure 3, the element accommodating portion 710 on which the elements 10 are loaded, And a guide member 720 for movably supporting the element accommodating part 710 to the main body 40 and a moving device 730 for horizontally moving the element accommodating part 710 through the guide member 720. do.

The element accommodating part 710 has a horizontal number of element accommodating grooves for loading the element 10 so that a larger number of elements 10 can be loaded at the mounting position ③. It is better than the number of transverse direction of the element receiving groove for loading.

Here, the element accommodating part 710 is configured to load the elements 10, and may be configured to directly load the elements 10 or may vary in size depending on the type of the element 10 to be sorted. They may be formed of a separate receiving member (610a) formed.

As shown in FIGS. 1 and 2, the second moving buffer 700 may be configured in three so that the process may be performed at each position (①, ②, ③). At this time, the guide member 720 is configured not to interfere with other guide member 720 during movement.

In other words, as shown in FIG. 3, the second moving buffers 700 are supported by the first element accommodating part 711 and the second guide member 722 which are supported by the first guide member 721 and move horizontally. The second element accommodating part 712 supported and horizontally moved and the third element accommodating part 713 supported and horizontally moved by the third guide member 723 may be configured.

The first to third guide members 721, 722, and 723 are configurations for guiding the buffers 711, 712, and 713 to be horizontally moved. Various configurations are possible, as shown in FIG. 4. The first guide member 721 is installed on the upper portion, that is, the upper end of the supporting member 740 of the main body 40, and the second guide member 722 is the supporting member 740 of the first guide member 721. In the middle portion, that is, the middle of the installation, the third guide member 723 may be installed on the lower portion of the support member 740, that is, the lower end or the upper plate 42 of the main body 40. The first to third guide members 721, 722, and 723 may be configured in pairs to stably support the element accommodating part 720.

Meanwhile, the moving device 730 for horizontally moving the first to third guide members 721, 722, and 723 may be configured in various ways according to a driving method, and the first to third guide members 721, 722, and 723 may be used. The first to the third mobile devices (731, 732, 733) for horizontally moving them may be included. In this case, the first to third moving devices 731, 732, and 733 are respectively a motor generating a rotational force, and a belt, in particular, a timing belt and a pulley coupled to the first to third guide members 721, 722, and 723. It can be configured by a combination of.

The second moving buffer 700 having the configuration as described above operates in a similar manner to the first moving buffer 600, and the second element 10 from the burn-in board 20 at the loading position ③ has an element accommodating portion ( 710, a stacking process, a second sorting process of transferring the second defective elements 10 to the sorting unit 300 at the sorting position ②, and unloading the remaining second elements 10 at the unloading position ①. The unloading process of transferring to the tray 30 of the unit 200 is performed.

In the loading process, the same number of elements as the number of elements 10 loaded in the first moving buffer 600, for example, elements arranged such as 12 × 2 are transferred at a time.

In the second sorting process, the second defective elements 10 are transferred from the element accommodating part 710 to the sorting part 300 by a transfer tool. At this time, each of the second defective elements 10 is loaded on the tray 30 of the sorting unit 300 according to the defect standard.

Here, the second normal elements 10 are filled from the second fixed buffer 342 in which the second normal elements 10 are pre-loaded in the place where the second defective elements are removed from the element accommodating part 710 at the sorting position ②. -Buffering process.

On the other hand, the second fixed buffer 342 is installed in the main body 40, the second normal element 10 is pre-loaded, when the first or the second moving buffer 700 is empty in the sorting position ② when empty during operation The second normal devices 10 may be loaded in the device accommodating part 710 of the second moving buffer 700.

5 is a conceptual view illustrating a process of exchanging burn-in boards between the XY table and the burn-in board exchange buffer unit in the device sorting apparatus of FIG. 1, and FIG. 5A is a state before exchanging the burn-in board between the XY table and the burn-in board exchange buffer unit. 5B is a view showing a state after the burn-in board is exchanged between the XY table and the burn-in board exchange buffer unit, and FIG. 6 is a view of the burn-in board between the burn-in board exchange buffer unit and the board loader in the device sorting apparatus of FIG. As a conceptual diagram showing the exchange process, Figure 6a is a state before the burn-in board exchange between the burn-in board exchange buffer unit and the board loader, Figure 6b is a burn-in board between the burn-in board exchange buffer unit and the board loader to the rack of the board loader 6C is a state where the burn-in board is inserted into the rack of the board loader between the burn-in board exchange buffer unit and the board loader, and FIG. 6D is a burn-in board exchange. Between the buffer part and the board loader, the burn-in board is drawn out from the rack of the board loader. FIG. 6E is a conceptual view showing the burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer part and the board loader. 7 is a side view showing the configuration of the board loader.

On the other hand, when the exchange of the first device 10 and the second device 10 in the burn-in board 20 on the XY table 410 is completed, the XY table 410 is connected to the board loader 800 and the second device 10. Replace with the new burn-in board 20 loaded.

However, when the burn-in board 20 on the XY table 410 is replaced, the loading of the first device 10 and the unloading of the second device 10 are stopped, so that the loading and unloading of the device 10 is performed by the XY table. The burn-in board 20 on 410 is delayed by the exchange time.

Therefore, if the replacement time of the burn-in board 20 on the XY table 410 can be shortened, the processing speed of the device sorting device, so-called UPH, can be improved according to the present invention. The burn-in board 20 in which the stacked burn-in board 20 and the second devices 10 are alternately stored is temporarily stored, and the burn-in board 20 in which the first device 10 of the XY table 410 is inserted is stored. It further includes a burn-in board exchange buffer unit 420 for exchanging with the burn-in board 20 in which the second element 10 of the board loader 800 in which the plurality of burn-in boards 20 are loaded is inserted.

The burn-in board exchange buffer unit 420 is installed between the board loader 800 and the X-Y table 410 to mediate the burn-in board 20, and various configurations are possible according to design and design.

The burn-in board exchange buffer unit 420 may be installed at the outermost side of the moving area of the main body 40, in particular, the X-Y table 410 or the board loader 800, depending on the configuration of the device.

Meanwhile, in order to shorten the exchange time of the burn-in board 20, the XY table 410 and the burn-in board exchange buffer unit 420 may include the burn-in board 20 and the second device on which the first elements 10 are loaded. 10) It is desirable to replace the burn-in board 20 loaded with them at the same time.

In addition, the XY table 410 has a pair of burn-in board seating portion 411 on which the burn-in board 20 is seated up and down and a pair of burn-in board seating portion 411 for simultaneous exchange of the burn-in board 20. It may be configured to include a burn-in board lifting portion 412 for moving the burn-in board 10 seated on the burn-in board seating portion 411 in at least one direction of the upper side and the lower side.

In this case, the burn-in board exchange buffer unit 420 includes a pair of burn-in board buffer units 421 in which the burn-in board 20 is seated up and down corresponding to the burn-in board seating portion 411 of the XY table 410. Can be configured.

The burn-in board buffer unit 421 may have any configuration as long as the burn-in board 20 can be stacked, and does not interfere with the movement of the first finger 441, the second finger 442, and the like. It is preferable to be configured so as not to.

Meanwhile, the transfer of the burn-in board 20 between the XY table 410 and the burn-in board exchange buffer unit 420 is performed by the first finger 441 and the second finger part as shown in FIGS. 5A to 5D. 442, the configuration and installation positions of the first and second finger portions 441 and 442 may be configured in various ways depending on the design and design.

The exchange process of the burn-in board 20 between the XY table 410 and the burn-in board exchange buffer unit 420 having the above configuration may be made in various forms according to each configuration, and an example thereof is attached to the accompanying drawings. When described in detail with reference to as follows.

Initially, the X-Y table 410 receives the burn-in board 20 loaded with the second elements 10 from the burn-in board exchange buffer unit 420, as shown in FIGS. 5A and 5B. In this case, when the XY table 410 and the burn-in board exchange buffer unit 420 have a configuration in which the burn-in board 20 may be arranged up and down, the XY table 410 may be the burn-in board exchange buffer unit at either the upper side or the lower side. The burn-in board 20 may be supplied from 420, and as shown in FIGS. 6D and 6E, it is preferable to be supplied from the upper side.

In the XY table 410 supplied with the burn-in board 20 in which the second devices 10 are loaded, the second device 10 may be unloaded and the first device 10 may be loaded through the opening 41. So that it is driven in the XY direction.

When the XY table 410 is moved for unloading the second device 10 and loading the first device 10, the burn-in board exchange buffer unit 420 moves from the board loader 800 to the second device 10. The burn-in board 20 loaded with these is supplied.

When the unloading of the second device 10 and the loading of the first device 10 are completed, the burn-in board 20 in which the first device 10 is loaded is shown in FIG. 5C, and the second device 10 is loaded. They move toward the burn-in board exchange buffer unit 420 to receive the other burn-in board 20 loaded thereon.

At this time, while the XY table 410 moves toward the burn-in board exchange buffer unit 420, the burn-in board 20 on the XY table 410 is burn-in board with the burn-in board exchange buffer unit 420, as shown in FIG. (20) It moves downward by the burn-in board lifting unit 412 for exchange.

Meanwhile, the XY table 410 moved toward the burn-in board exchange buffer unit 420 is supplied with the burn-in board 20 positioned above the burn-in board exchange buffer unit 420, as shown in FIG. The burn-in board 20 located under the XY table 410 is moved to the burn-in board buffer part 421 located under the burn-in board exchange buffer part 420.

The exchange of the burn-in board 20 between the X-Y table 410 and the burn-in board exchange buffer unit 420 is preferably performed simultaneously to shorten the exchange time.

Meanwhile, the device sorting apparatus according to the present invention includes a board loader 800 installed at one side to continuously receive the burn-in board 20, as shown in FIGS. 1 and 2.

The board loader 800 loads and loads the burn-in boards 20 into which the second devices 20 are inserted, and sequentially loads the burn-in boards 20 into which the first devices 10 are inserted. Various configurations are possible as a configuration for continually exchanging the transport configuration, that is, the XY table 410 and the burn-in board 20.

Meanwhile, when the first devices 10 are loaded on all of the burn-in boards 20 of any one of the racks 50, the rack 50 in which the first devices 10 have been stacked is the second device to be unloaded. It is replaced with another rack 50 which is loading (10).

However, the XY table 410 and the like should wait until the rack 50 is replaced in the board loader 800 and is supplied with a new burn-in board 20. Therefore, the processing speed of the element sorting device is reduced. have.

Accordingly, as shown in FIG. 7, the board loader 800 of the device sorting apparatus according to the present invention may exchange the rack 50 without affecting the loading and unloading of the device 10 on the burn-in board 20. A pair of racks 810 and a pair of racks 810 are arranged in the Y-axis direction of the XY table 410 so that the racks 50 with the plurality of burn-in boards 20 are stacked in a plurality of stages. The elevator unit 820 may be installed between the stacking units 810 to draw the rack 50 from the rack stacking unit 810 to move the rack 50 up and down.

The rack loading unit 810 may be any configuration as long as the rack 50 can be loaded.

In particular, the rack loading portion 810 is configured in a pair is preferably installed on both sides of the elevator 820 around the elevator 820.

When the elevator unit 820 is provided with the XY table 410 and the burn-in board exchange buffer unit 420 while pulling the rack 50 up and down from the rack loading unit 810, the burn-in board exchange buffer unit 420 is provided. And burn-in board 20.

Meanwhile, the board loader 800 includes a pair of rack takeout units 830 corresponding to the pair of rack load units 810 to withdraw the racks 50 loaded on the rack load units 810, respectively. .

The rack take-out part 830 draws the rack 50 from the rack loading part 810 to the support part 821 of the elevator part 820, or, conversely, the rack (from the elevator part 820 to the rack loading part 810). 50) is configured to load.

The exchange process of the burn-in board 20 between the burn-in board exchange buffer unit 420 and the board loader 800 having the above configuration may be made in various forms according to each configuration, and an example thereof is attached to the accompanying drawings. Detailed description with reference to the following.

First, the burn-in board exchange buffer unit 420 receives the burn-in board 20 loaded with the second elements 10 from the board loader 800, as shown in FIGS. 6C and 6D. In this case, when the XY table 410 and the burn-in board exchange buffer unit 420 have a configuration in which the burn-in board 20 can be arranged up and down, the burn-in board exchange buffer unit 420 is either a board loader or a board loader. The burn-in board 20 may be supplied from the 800, and in particular, the burn-in board 20 may be supplied from the upper side in consideration of board exchange between the XY table 410 and the burn-in board exchange buffer unit 420.

That is, the burn-in board 20 in which the second elements 10 are loaded is drawn out from the board loader 800 and passes through the burn-in board buffer part 421 located above the burn-in board exchange buffer part 420. The burn-in board seating part 411 which is transmitted to the burn-in board seating part 411 positioned on the upper side of the 410, and the burn-in board seating part 20 which is loaded with the first elements 10 is located at the bottom of the XY table 410. It is discharged to the board loader 800 through).

Meanwhile, the burn-in board exchange buffer unit 420 exchanges the burn-in board 20 with the board loader 800 after the board exchange with the XY table 410 through a process as shown in FIGS. 6A and 6B. .

The burn-in board exchange buffer unit 420 has a burn-in board 20 received from the XY table 410, in particular, the burn-in board 20 seated on the burn-in board buffer unit 421 located at the lower side of the board loader 800 Retract into the empty seat of the rack 50. Here, the rack 50 is lifted up and down by the elevator unit 820 so that the burn-in board 20 can be pulled in or pulled out, and at least one of the uppermost or the lowermost side is burn-in for smooth exchange of the burn-in board 20. It is preferable that the board 20 is not filled.

The burn-in board exchange buffer unit 420 draws out a new burn-in board 20 in which the second element 10 is loaded from the rack 50. The burn-in board 20 is withdrawn from the rack 50 and is seated on the burn-in board exchange buffer portion 420, especially the burn-in board buffer portion 421 located on the upper side.

The exchange process of the burn-in board 20 between the burn-in board exchange buffer unit 420 and the board loader 800 as described above, as shown in Figure 6a to 6d, burn-in board 20 is a burn-in board exchange buffer It is carried by one or more subfingers 443, 444 between the part 420 and the board loader 800.

In this case, the sub-fingers 443 and 444 have a burn-in board in a plurality of sub-movement sections corresponding to each of the sub-fingers 443 and 444 in the movement section between the burn-in board exchange buffer unit 420 and the board loader 800. 20) can be configured to convey.

8A is a side cross-sectional view illustrating a burn-in board exchange buffer unit and a board loader having a modified configuration in the device sorting apparatus of FIG. 1, and FIG. 8B is a side view illustrating the board loader of FIG. 8A.

Meanwhile, in the device sorting apparatus according to the present invention, as shown in FIGS. 8A and 8B, the rack in which only the rack 50 is loaded without installing the elevator unit in which the board loader 800 moves the rack 50 up and down is installed. Composed of only the loading unit 810, so that the burn-in board exchange buffer unit 420 can be moved up, down, left and right so as to withdraw the burn-in board 20 from the rack 50 loaded in each rack loading unit 810. Can be.

That is, as shown in FIG. 8B, the board loader 800 may include a plurality of racks 50, in this embodiment, rack loading units 810 into which nine racks 50 may be stacked. Can be.

The device sorting apparatus according to the present invention may further include an exchange buffer driver 430 for vertical and horizontal movement of the burn-in board exchange buffer unit 420, as shown in FIGS. 8A and 8B.

The exchange buffer driver 430 has a burn-in board exchange buffer unit 420 vertically and horizontally ie vertically and horizontally so that the burn-in board 20 can be withdrawn from the rack 50 loaded in each rack loading unit 810. Various configurations are possible as the configuration for driving the.

As an example, the exchange buffer driving unit 430 may include a first driving unit 432 for driving a shanghai movement of the burn-in board exchange buffer unit 420 based on the top and bottom of the rack 50 loaded in the board loader 800, and The board loader 800 may include a second driving unit 431 for driving the horizontal movement of the burn-in board exchange buffer unit 420 based on the horizontal direction in which the rack 50 is disposed.

As shown in FIGS. 8A and 8B, the first driving unit 432 and the second driving unit 431 are installed to support the burn-in board exchange buffer unit 420 and include a screw jack or a linear moving device. The burn-in board replacement buffer unit 420 is driven to move in the vertical direction and the horizontal direction.

The device sorting apparatus according to the present invention by the configuration as described above by moving the burn-in board exchange buffer unit 420 up, down, left and right in a fixed state of the rack 50, the burn-in board 20 by drawing the burn-in board 20 By reducing the withdrawal time can significantly increase the processing speed of the device sorting device.

In addition, by configuring the burn-in board exchange buffer unit 420 to move up, down, left, and right, it is possible to simplify the configuration of the board loader 800 without requiring the installation of the elevator unit in the configuration of the board loader 800 and the board loader 800 By increasing the number of racks (50) to be loaded) the replacement cycle of the rack 50 can be increased to improve the work efficiency.

Meanwhile, the burn-in board exchange buffer unit 420 and the exchange buffer driver 430 may be configured as one board loader module together with the board loader 800.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

110: XY table
210: loading unit 220: unloading unit
310: test unit 320: sorting unit
600: first moving buffer 700: second moving buffer
510, 520, 530, 540, 550, 560: transfer tool

Claims (10)

An XY table for loading the burn-in board into which the second elements are inserted;
Move the XY table to withdraw the second elements from the burn-in board in conjunction with a second transfer tool and insert the first elements into the vacant positions of the burn-in board in conjunction with the first transfer tool; An XY table driving unit for moving the XY table to a burn-in board exchange position when insertion of one element is completed;
A board loader for loading and loading the burn-in boards in which the second elements are inserted, and sequentially loading the burn-in boards in which the first elements are inserted, and transferring the burn-in boards to the burn-in test unit;
And a burn-in board exchange buffer unit for exchanging the burn-in board in which the first element of the XY table is inserted with the burn-in board in which the second element of the board loader is inserted. The method according to claim 1,
The XY table moves a burn-in board seated on the burn-in board seating part in at least one of an upper side and a lower side between the pair of burn-in board seating seats on which the burn-in board seats up and down, and the pair of burn-in board seating seats. Including burn-in board lift,
And the burn-in board exchange buffer unit includes a pair of burn-in board buffers in which the burn-in boards are seated up and down corresponding to the burn-in board seats of the XY table. The method according to claim 1 or 2,
The burn-in board on which the second elements are loaded is withdrawn from the board loader and transferred to the burn-in board seating portion located above the XY table via the burn-in board buffer portion located above the burn-in board exchange buffer portion.
The burn-in board on which the first elements are loaded is transferred to the burn-in board buffer unit located below the burn-in board exchange buffer unit via the burn-in board seating unit located at the lower side of the XY table and discharged to the board loader. Sorting device. The method according to claim 1,
The burn-in board is transported by one or more sub-fingers between the burn-in board exchange buffer unit and the board loader,
And the sub-fingers transfer the burn-in board in a plurality of sub-movement sections corresponding to each sub-finger between the burn-in board exchange buffer unit and the board loader. The method according to claim 1,
The board loader
A pair of rack loading parts arranged in the Y-axis direction of the XY table, in which a rack having a plurality of burn-in boards is stacked in a plurality of stages;
And an elevator unit installed between the pair of rack loading parts to lift the rack out of the rack loading part and move the rack up and down. The method according to claim 5,
And the board loader includes a pair of rack takeout units corresponding to the pair of rack load units to withdraw the racks loaded on the rack load units. A loading unit in which a tray loaded with the first elements is loaded;
A second transfer tool for drawing out second elements from the burn-in board;
A first transfer tool for inserting the first elements loaded in the tray of the loading unit into an empty position of the burn-in board;
An unloading unit which receives the second elements drawn out from the burn-in board by the second transfer tool, loads them into a tray, and unloads them;
An XY table for loading the burn-in board into which the second elements are inserted;
An XY table which moves the XY table in the XY direction in conjunction with the first transfer tool and the second transfer tool and moves the XY table to the burn-in board exchange position when insertion of the first elements into the burn-in board is completed. A drive unit;
A board loader including a plurality of rack loading parts on which a rack on which burn-in boards are stacked is mounted;
The burn-in board is installed to exchange the burn-in board between the board loader and the XY table driver, and the burn-in board in which the second device is inserted is removed from the rack loaded in the board loader. Device sorting apparatus comprising a burn-in board exchange buffer for inserting the empty space of the rack mounted on the board loader. The method of claim 7,
And an exchange buffer driver for driving the vertical and horizontal movement of the burn-in board exchange buffer unit so that the burn-in board exchange buffer unit can withdraw the burn-in board from the racks loaded in the rack loading units. . The method according to claim 8,
The exchange buffer driving unit includes a first drive unit for driving a shanghai movement of the burn-in board exchange buffer unit based on the top and bottom of the rack loaded on the board loader, and the burn-in board exchange buffer based on a horizontal direction in which the rack is arranged on the board loader. Device sorting apparatus comprising a second driving unit for driving the horizontal movement of the unit. A board loader module of an element sorting apparatus according to any one of claims 8 to 9, wherein the burn-in board exchange buffer unit, the exchange buffer driver and the exchange buffer driver comprise one module.

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