KR102603158B1 - Device handler - Google Patents

Abstract

The present invention relates to a device sorting device, and more specifically, to a device sorting device that automatically classifies devices such as semiconductor chips according to classification standards.
The present invention includes a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; an XY table 410 that moves the burn-in board 20 in the an unloading unit 300 in which the devices 10 to be classified, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the classification criteria according to preset classification criteria; The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position spaced horizontally from the loading position, so that the DC test result of the DC test unit 170 on the tray 30 is defective. Disclosed is a device sorting device that includes a first buffer tray unit 610 on which inspected devices 10 are temporarily loaded.

Description

Element sorting device {Device handler}

The present invention relates to a device sorting device, and more specifically, to a device sorting device that automatically classifies devices such as semiconductor chips according to classification standards.

Semiconductor devices (hereinafter referred to as 'devices') undergo various tests such as electrical characteristics, reliability tests for heat and pressure, etc. after completing the packaging process.

Among these tests for semiconductor devices, there is a burn-in test. The burn-in test involves inserting a number of devices into a burn-in board, storing the burn-in board in a burn-in test device, and applying heat or pressure for a certain period of time. This is a test to determine whether a defect occurs in the rear device.

The device sorting device for burn-in testing generally sorts (unloads) devices from the burn-in board loaded with devices that have completed the burn-in test into each tray according to the classification criteria assigned according to the inspection results for each device, such as good products or defective products, This refers to a device that inserts (loads) a new device to perform a burn-in test again into an empty spot (socket) on the burn-in board where the device was located.

Meanwhile, the performance of the device sorting device as described above is evaluated by the number of sorts per unit time (UPH: Units Per Hour), and UPH is the amount required to transfer devices and burn-in boards between each component that makes up the device sorting device. It is decided according to time.

Therefore, there is a need to improve the structure and arrangement of each component in order to increase the UPH, which is the performance of the device sorting device.

As an element sorting device for increasing UPH as described above, Korean Patent No. 10-1133188 (Patent Document 1), Korean Patent No. 10-1177319 (Patent Document 2), and Korean Patent Publication No. 10-2016-48628 ( Patent Document 3), etc.

Meanwhile, mass production is expanding as the market size of standardized devices such as SD RAM and, recently, NAND flash memory expands.

In addition, in the mass production of devices, the demand for device inspection also increases, so it is necessary to install a large number of device sorting devices to classify devices according to inspection results as a post-process.

The purpose of the present invention is to provide a device classification device for supplying devices for burn-in testing and sorting devices that have completed burn-in testing, from a loading section where devices to be inspected are loaded, a DC test section for performing DC tests, and a burn-in board. The aim is to provide an element sorting device that can efficiently perform the sorting process of elements while minimizing the footprint by optimizing the arrangement of the unloading unit, where drawn elements are loaded onto a tray.

The present invention was created to achieve the object of the present invention as described above, and the present invention includes a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; an XY table 410 that moves the burn-in board 20 in the an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria; The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position spaced horizontally from the loading position, so that the DC test unit 170 is placed on the tray 30. It includes a first buffer tray unit 610 on which devices 10 that are defective as a result of the test are temporarily loaded, and the loading unit 100 guides the tray 30 so that it can be moved in the Y-axis direction. It includes a guide part and a driving part for moving the tray 30, and the first buffer tray part 610 is configured to receive the empty tray 30 from the loading part 100. 100) and the unloading unit 300, wherein the first tray transfer unit 671, which transfers the tray 30, is configured to be movable in the Y-axis direction up to the first tray transfer line TT1 along which it is moved. The element sorting device is started.
The device sorting device includes one or more DC tray units 310 on which trays 30 are loaded with devices 10 that are tested as defective as a result of the inspection by the DC test unit 170; It moves between the first buffer tray unit 610 and the DC tray unit 310 and moves the device 10, which is tested as defective as a result of the DC test of the DC test unit 170, to the first buffer tray unit 610. And it may further include a DC transfer tool 550 that delivers the DC tray unit 310.
The first buffer tray unit 610 has a moving section in which the tray 30 moves in the Y-axis direction between the loading position and the moving section (DC) of the DC transfer tool 550, and has two moving sections in the Z-axis up and down direction. More than one can be set.
The device sorting device is installed to be reciprocatable in the A third transfer tool 510 delivered to (170); A plurality of devices installed to be reciprocatable in the A first transfer tool 530 for loading (10) onto the burn-in board 20; A second transfer tool installed between the extraction position of the elements 10 with respect to the burn-in board 20 and the unloading unit 300 to transfer the elements 10 to be classified as good products to the unloading unit 300. It includes (520), and based on the reciprocating movement line (G) along which the third transfer tool 510, the first transfer tool 530, and the second transfer tool 520 move, the first tray transfer line At a position opposite to (TT1), a second tray transfer line (TT2) is set along which the second tray transfer unit 672, which transfers the tray 30, is moved between the loading unit 100 and the unloading unit 300. It can be.

The device sorting device according to the present invention is a device inspection device for supplying and sorting devices before and after inspection, such as a burn-in test, in the tray transfer direction of the loading section where devices to be inspected are loaded, and devices inspected as good products on the burn-in board. The tray transfer directions of the unloading section, where trays are loaded and unloaded, are arranged parallel to each other, and the supply and discharge of trays to the device are performed adjacent to the unloading section, thereby automating the supply and discharge of trays and significantly reducing the footprint. There is an advantage to reducing it.

In addition, the device sorting device according to the present invention optimizes the arrangement of the loading section where devices to be inspected are loaded, the DC test section for performing DC testing, and the unloading section where devices pulled out from the burn-in board are loaded on the tray. It has the advantage of minimizing the footprint and efficiently performing the device sorting process.

In addition, the device sorting device according to the present invention is further equipped with a module replacement unit that automatically replaces the test sockets and trays of the DC test unit used inside the device according to changes in the external specifications of the device, such as plan size. This has a convenient advantage.

In particular, the device sorting device according to the present invention has the advantage of optimizing the arrangement by locating the module exchange part at the top of the device, minimizing the footprint, and efficiently performing the device sorting process.

For example, among the module exchange parts, the loading part where the test sockets and trays of the DC test part are loaded is located on the upper side, and in particular, by sharing at least a part of it with the transport rail of the transport tool, the arrangement is optimized to minimize the footprint and at the same time, the device There is an advantage in that the classification process can be performed efficiently.

1 is a plan layout diagram showing an element sorting device according to the present invention.
FIG. 2 is a front view showing an example of the arrangement of transfer tools used in the device transfer process between the loading unit, DC test unit, first buffer tray unit, burn-in board, and unloading unit of the device sorting device of FIG. 1. .
FIG. 3 is a side view showing the arrangement of the first tray transfer unit, transfer tools, and the second tray transfer unit in the device sorting device of FIG. 1.

Hereinafter, the device sorting device according to the present invention will be described with the accompanying drawings.

As shown in FIGS. 1 to 3, the device sorting device according to the first embodiment of the present invention includes a loading unit 100 on which a tray 30 loaded with devices 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; an X-Y table 410 that moves the burn-in board 20 in the an unloading unit 300 in which the devices 10 to be classified, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the classification criteria according to preset classification criteria; The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position away from the loading position, so that the elements 10 that are tested as defective as a result of the DC test of the DC test unit 170 are temporarily stored. It includes a first buffer tray unit 610 loaded with . .

The burn-in board 20 refers to a board on which elements 10 are loaded so that they can undergo a burn-in test in a burn-in test device (not shown), and the elements 10 can be tested for electrical and signal characteristics under high temperature. ) is provided with sockets into which each is inserted.

The burn-in board 20 is mounted on the X-Y table 410 installed in the device sorting device, and the devices 10 that have completed the burn-in test are unloaded and the devices 10 are loaded.

The X-Y table 410 is configured to load the burn-in board 20 into which the elements 10 are inserted and at the same time unload the burn-in board 20 into which the elements 10 are inserted. , as shown in FIG. 1, a burn-in board exchange device (not shown) is used to receive a burn-in board 20 for replacing the element 10 or to discharge the burn-in board 20 on which the element 10 has been replaced. ) includes.

And in the 10) is configured to move the burn-in board 20 by being driven by an X-Y table driving unit (not shown) so that the boards can be pulled out.

The X-Y table driving unit operates the second transfer tool 520 and the first transfer tool 530 to facilitate the removal or loading of the elements 10 from the burn-in board 20. Various configurations are possible, such as X-Y movement or X-Y-θ movement of the X-Y table 410 on which the burn-in board 20 is loaded in conjunction with the tool 530.

That is, the The X-Y table 410 is moved to insert into the empty space of (20), and when the insertion of the elements 10 into the burn-in board 20 is completed, the .

Meanwhile, the It may include a top plate (not shown) having an opening (not shown) for removing or loading the elements 10 from the burn-in board 20 .

Additionally, a socket press 45 is installed on the upper side of the

The socket press 45 enables the extraction or loading of elements inserted into the socket of the burn-in board 20, and various configurations are possible depending on the socket structure of the burn-in board 20.

Meanwhile, the socket press 45 needs to vary depending on the external specifications of the element 10, so it is preferable to install it so that manual or automatic replacement is possible.

And on the upper part of the socket press 45, there is a vision for aligning the position of the burn-in board 20 for extraction and discharge of the element 10 by the first transfer tool 530 and the second transfer tool 520. A device (not shown) may be installed.

The loading unit 100 is configured to load trays 30 on which a plurality of devices 10 to be loaded on the burn-in board 20 are loaded, and various configurations are possible.

Meanwhile, the loading unit 100 is installed at the upper part of the tray 30 in the transport direction and inspects the tray cover, the tray 30 itself, the elements 10 contained in the tray 30, etc., recognizes QR codes, etc. A 2D scanner 960 may be installed for.

As in Patent Documents 1 to 3, the loading unit 100 includes a guide unit that guides the tray 30 to move in the Y-axis direction and a drive unit (not shown) for moving the tray 30. It is generally comprised of:

Here, when the extraction position of the element 10 with respect to the burn-in board 20 and the arrangement direction of the unloading unit 300 are taken as the X-axis, the horizontal direction perpendicular to the X-axis is defined as the Y-axis.

The unloading unit 300 is a configuration for loading the elements 10 to be classified, taken out from the burn-in board 20, into the tray 30 corresponding to the classification criteria according to preset classification criteria, and has various configurations. possible.

For example, as shown in FIG. 1, the unloading unit 300 includes one or more good product tray units 310 on which trays 30 on which devices 10 to be classified as good products are loaded; One or more DC tray units 310 on which trays 30 are loaded with devices 10 that were tested as defective as a result of the inspection by the DC test unit 170; The burn-in board 20 may include one or more reject trays 330 on which a tray 30 is loaded with elements 10 to be classified into each classification grade corresponding to the number of classification grades other than good products. there is.

The non-defective tray unit 320 is a configuration where the tray 30 on which devices 10 to be classified as non-defective products are loaded, and can be configured in various ways, such as being configured similarly to the loading unit 100.

The DC tray unit 310 is a configuration in which the tray 30 is placed on which devices 10 that have been tested as defective as a result of the inspection by the DC test unit 170 are loaded, and is configured similarly to the loading unit 100. Various configurations are possible.

The reject tray unit 330 is a configuration in which a tray 30 is placed on which elements 10 to be classified into each classification grade correspond to the number of classification grades other than non-defective products on the burn-in board 20, and the loading Various configurations are possible, such as being configured similarly to the unit 100.

Here, the number of reject trays 330 may be determined according to the number of classification levels.

Meanwhile, the good product tray unit 320, DC tray unit 310, and reject tray unit 330 each include a guide unit that guides the tray 30 so that it can be moved in the Y-axis direction, and a tray 30. Various configurations are possible, such as including a driving part for moving along the guide part.

Meanwhile, after the elements 10 are extracted from the tray 30 in the loading unit 100, the empty trays 30 are transferred to the first tray transfer unit 671 installed at the rear side of the device, as shown in FIG. 1. It may be delivered to the unloading unit 300, etc. (see FIG. 3).
Specifically, the tray 30 of the first buffer tray unit 610 has a first tray transfer unit 671 that transfers the tray 30 between the loading unit 100 and the unloading unit 300. It can be installed to be able to move up to the first tray transfer line (TT1).

At this time, the elements 10 may remain in the tray 30, and the elements 10 remaining in the tray 30 may be removed before the tray 30 is transferred from the loading unit 100 to the unloading unit 300. In order to remove the remaining elements 10 by rotating the tray 30, a tray rotation unit 150 may be additionally installed.

As shown in FIG. 1, the tray rotation unit 150 is installed on the first tray transfer line TT1 of the tray 30 between the loading unit 100 and the unloading unit 300, and the first tray It is configured to receive the tray 30 from the loading unit 100 by the sending unit 671, rotate the tray 30, and then deliver the tray 30 to the unloading unit 300.

In addition, an empty tray 30 on which no element 10 is loaded can be temporarily loaded on the first tray transfer line TT1 of the tray 30 between the loading unit 100 and the unloading unit 300. The first tray loading unit 161 may be located.

The first tray loading unit 161 is an empty tray (on which the elements 10 are not loaded) on the first tray transfer line TT1 of the tray 30 between the loading unit 100 and the unloading unit 300. 30) Any configuration is possible as long as it can be temporarily loaded.

The DC test unit 170 is installed between the loading unit 100 and the socket press 45 and receives the elements 10 to be tested from the loading unit 100 to perform a DC test. Various configurations are possible. do.

The DC test unit 170 can have various configurations, such as consisting of a plurality of sockets to which the elements 10 can be electrically connected, and preferably has the same number of sockets in the horizontal direction as the horizontal number of the trays 30. of sockets can be installed.

The test results for each element 10 of the DC test unit 170 are used as data for sorting in the DC tray unit 310, which will be described later.

Here, the element transfer from the tray 30 of the loading unit 100 to the DC test unit 170 is performed by the third transfer tool 510.

Meanwhile, if the external specifications, such as the size of the device 10 to be handled, change, the test socket constituting the DC test unit 170 needs to be replaced.

Prior to this, the test socket of the DC test unit 170 is preferably installed so as to be automatically replaced with other types of test sockets loaded in the replacement parts loading unit (not shown).

Here, in order to smoothly replace the test socket of the DC test unit 170, it is preferable that the test socket of the DC test unit 170 be installed to be movable in the Y-axis direction.

The first buffer tray unit 610 is installed so that the tray 30 can be moved to a loading position on the upper side of the DC test unit 170 and an avoidance position away from the loading position, so that the DC test unit 170 can perform a DC test. Various configurations are possible as a configuration in which devices 10 that have been tested as defective are temporarily loaded.

For example, the first buffer tray unit 610, like the loading unit 100, may be installed so that the tray 30 can move in the Y-axis direction.

In addition, the part directly above the DC test unit 170 can be set as a loading position, and the front and rear in the Y-axis direction based on the part directly above the DC test unit 170 can be set as an avoidance position.

In addition, in order to smoothly transfer the elements 10 that are tested as defective as a result of the DC test in the DC test unit 170, two or more trays 30 may be configured to be transferred, and the movement path may be moved up and down to prevent interference during movement. It can be placed as .

That is, the first buffer tray unit 610 has a moving section in which the tray 30 reciprocates in the Y-axis direction between the loading position and the moving section (DC) of the DC transfer tool 550 in the Z-axis up and down direction. It is desirable to set two or more.

Meanwhile, the process of transferring the device 10 between the DC test unit 170 and the first buffer tray unit 610 can be performed in various ways for smooth operation of the handler.

As an example, if the device is transferred to the DC test unit 170 by the first transfer tool 510 and all DC test results are determined to be good products, it is transferred to the burn-in board 40 by the second transfer tool 520. It is delivered immediately.

Meanwhile, if there are some devices 10 that were tested as defective as a result of the DC test, all devices 10 loaded in the DC test unit 170 are pulled out by the first transfer tool 510 and placed in the first buffer tray. All are loaded onto the tray 30 of the unit 610.

And when all the elements 10 are loaded on the tray 30 of the first buffer tray unit 610, the tray 30 is moved onto the transfer path (DC) of the DC transfer tool 550. At this time, when the tray 30 is moved on the transfer path (DC) of the DC transfer tool 550, another tray 30 receives the element 10 that was inspected as defective as a result of the DC test.

Meanwhile, in the tray 30 moved on the transfer path (DC) of the DC transfer tool 550, which will be described later, the elements 10 that were inspected as defective as a result of the DC test, excluding the elements 10 determined to be good products, were transferred to the DC transfer tool 550. By 550, all of them are transferred to the DC tray unit 302, so that only good quality devices 10 remain in the tray 30.

Meanwhile, the tray 30 from which all elements 10 inspected as defective have been removed is moved back to the loading position and then transferred to the burn-in board 40 by the second transfer tool 520.

In addition, the tray 30 needs to be replaced according to the external specifications of the element 10. Similar to the replacement process of the DC test unit 170, the replacement parts loading unit 680 shown in FIGS. 5 to 7, which will be described later, is replaced. It is desirable to install it so that automatic replacement with other types of trays is possible.

For example, the tray 30 of the first buffer tray unit 610 is movable in the Y-axis direction and is installed to be movable up to the first tray transfer line TT1 described above, so that the first tray transfer unit 671 Trays 30 of different standards can be delivered from the loading unit 100 or the first tray loading unit 161.

Meanwhile, the elements 10 have various structures for smooth transfer of the elements 10, and a plurality of transfer tools can be arranged in various ways.

As an example, as shown in FIGS. 1 to 3, the transfer tools are installed to be movable in the A third transfer tool 510 that transfers the elements 10 to the DC test unit 170; A plurality of elements 10 are installed to be reciprocatable in the a first transfer tool 530 for loading them onto the burn-in board 20; It is installed between the extraction position of the device 10 with respect to the burn-in board 20 and the unloading unit 300 to transfer the devices 10 to be classified as good products from the second buffer tray unit 620 to the unloading unit 300. It may include a second transfer tool 520 for transferring.

Meanwhile, the arrangement of the elements 10 loaded on the burn-in board 20 is different from the arrangement of the elements 10 loaded on the tray 30 such as the loading unit 100, and the arrangement on the burn-in board 20 This is relatively high.

Therefore, the first transfer tool 530 and the second transfer tool 520, which transfer or withdraw the elements 10 from the burn-in board 20, are designed to transfer a relatively large number of elements 10 compared to the remaining transfer tools. It is desirable to be configured. For example, the first transfer tool 530 and the second transfer tool 520 may be 5×2, and the remaining transfer tools may be 5×1.

When the transfer tools are configured as described above, the transfer tool is used to transfer a small number of elements 10 in locations that require a relatively small number of transfers, except for positions that require transfer of a relatively large number of elements 10. This makes it possible to reduce the manufacturing cost of the device and improve the size and stability of the device.

The horizontal number of pickers of the first transfer tool 530 and the second transfer tool 520 is determined by considering the efficiency of the device 10 and the device 100 in the first buffer tray 610 and the unloading unit 300. (10) may be configured to be equal to the horizontal number of element receiving grooves (not shown) for loading.

Meanwhile, considering that the first transfer tool 530 and the second transfer tool 520 transport the elements 10 in correspondence with the first transfer tool 530 and the second transfer tool 520, respectively. The number of pickers of the first transfer tool 530 and the second transfer tool 520 in the horizontal direction is preferably configured to be the same.

Meanwhile, it is common for the pitch between the elements 10 on the burn-in board 20 and the pitch between the elements 10 on the tray 30 to be different (double, etc.). For this, the “first transfer” It is preferable that one of the tool 530, the second transfer tool 520, and the third transfer tool 510 is configured so that the pitch between the elements 10 picked up by the pickers is variable.

Meanwhile, the third transfer tool 510, first transfer tool 530, and second transfer tool 520 are moved along the reciprocating movement line (G).

And a sorting line (S) is set at a position spaced apart from the reciprocating movement line (G) in the Y-axis direction, and a DC test unit among the elements 10 loaded on the tray 30 in the unloading unit 300 The device 10, which was inspected as defective as a result of the DC test of (170), and the device 10 received from the second transfer tool 520 were transferred to the good product tray 320, DC tray 310, and Lee according to the classification level. Among the tray units 330, the sorting transfer tool 560 for loading onto the corresponding tray 30 is installed to be movable along the sorting line (S).

The sorting transfer tool 560 is installed to be movable along the sorting line (S) and is used to measure the DC of the DC test unit 170 among the elements 10 loaded on the tray 30 in the unloading unit 300. The device 10, which was tested as defective as a result of the test, and the device 10 received from the second transfer tool 520 are placed in a good product tray 320, a DC tray 310, and a reject tray 330 according to the classification level. ), various configurations are possible as a configuration for loading on the corresponding tray 30.

Meanwhile, the sorting line (S) is defined as the movement path of the sorting transfer tool 560 along the sorting guide member 591 installed at a position spaced apart from the reciprocating movement line (G) in the Y-axis direction.

In particular, the sorting line (S) is located at a distance from the reciprocating movement line (G) in the Y-axis direction and is preferably installed near the second tray transfer unit 672 to ensure smooth sorting and minimize installation interference with other components.

On the other hand, when the sorting transfer tool 560 directly transfers the device 10 that was inspected as defective as a result of the DC test of the DC test unit 170 described above from the first buffer tray unit 610, the sorting transfer tool 560 There is a problem in that the movement path is long and the work speed is significantly reduced.

In addition, since the sorting guide member 591 that guides the movement of the sorting transfer tool 560 is installed across the device in the X-axis direction, there are many problems in the device configuration, such as limiting the installation of other components.

Accordingly, the device sorting device according to the present invention moves between the first buffer tray unit 610 and the unloading unit 300, especially the DC tray unit 310, and the DC test result of the DC test unit 170 is defective. It is preferable to further include a DC transfer tool 550 that transfers the inspected element 10 to the first buffer tray unit 610 and the unloading unit 300, especially the DC tray unit 310.

The DC transfer tool 550 moves between the first buffer tray unit 610 and the unloading unit 300, especially the DC tray unit 310, and inspects the DC test result of the DC test unit 170 as defective. Various configurations are possible for delivering the device 10 to the first buffer tray unit 610 and the unloading unit 300, especially the DC tray unit 310.

In particular, the DC transfer tool 550 uses a small number of pickers, for example, two pickers, compared to other transfer tools, considering that the number of devices 10 tested as defective as a result of the DC test of the DC test unit 170 is relatively small. Can contain pickers.

Meanwhile, in order to ensure stable movement considering that the DC transfer tool 550 moves longer than the movement section of the sorting transfer tool 560, as shown in FIGS. 1 and 3, the first transfer tool 530 ), the first transfer tool 530, the second transfer tool 520, and the third transfer tool ( It can be installed to be movable while being coupled to the main guide member 592 and spaced apart from the movement path (G) of the 510) and the Y-axis direction.

And the DC transfer tool 550 has a movement section ( DC) can be installed movably.

Meanwhile, the transfer tools 510, 520, 530, 540, 550, and 560 each have at least one picker equipped with an adsorption head at the end that adsorbs the element 10 by vacuum pressure, and the picker moves in the X-Z, Y-Z, or X-Y-Z direction. It may be configured to include a picker transfer device for moving to.

In particular, the pickers of the transfer tools may be arranged in a row or in a double row, such as 5×2 or 4×2.

Meanwhile, as shown in FIG. 1, the device sorting device according to the present invention includes a board loader 800 installed on one side to continuously receive burn-in boards 20.

The board loader 800 is configured to load the burn-in boards 20 into which the elements 10 are inserted and sequentially load the burn-in boards 20 into which the elements 10 are inserted and transfer them to the burn-in test. That is, it is a configuration for continuously exchanging the

Meanwhile, the board loader 800 is preferably installed adjacent to the loading unit 100.

In particular, when the board loader 800 is installed adjacent to the loading unit 100, when the direction perpendicular to the tray transfer direction in the loading unit 100 is called the Y-axis, it moves in the X-axis direction with respect to the loading unit 100. Combination is preferred.

At this time, by combining the board loader 800 as described above, the rack 50 loaded with the burn-in boards 20 can be introduced or discharged into the X-axis direction on the right side of the device, especially adjacent to the loading unit 100. there is.

Meanwhile, in order to perform functions required according to the design, such as recognizing the tray 30 among the transfer lines of the tray 30 in the loading unit 100 and inspecting the top surface of the device 10 loaded on the tray 30, a camera, A first vision unit 191 such as a scanner may be installed.

And a second vision unit 192 such as a camera or scanner that photographs the bottom of the element 10 that is picked up and transferred by the third transfer tool 510 between the loading unit 100 and the DC test unit 170. can be installed.

In addition, a camera installed between the DC test unit 170 and the device 10 loading position on the burn-in board 20 to photograph the bottom of the device 10 picked up and transported by the first transfer tool 530, A third vision unit 193 such as a scanner may be installed.

Meanwhile, based on the reciprocating movement line (G) along which the third transfer tool 510, first transfer tool 530, and second transfer tool 520 move, the line opposite to the first tray transfer line (TT1) At this location, a second tray transfer line TT2 may be set along which the second tray transfer unit 672, which transfers the tray 30, is moved between the loading unit 100 and the unloading unit 300.

The second tray transfer line (TT2) is located at a position opposite to the first tray transfer line (TT1) with respect to the reciprocating movement line (G), and transports the tray between the loading unit 100 and the unloading unit 300. The second tray transfer unit 672 that transfers (30) is set as a moving path.

Meanwhile, on the second tray transfer line TT2, a second tray loading unit 162 may be located where empty trays 30 on which devices 10 are not loaded can be temporarily loaded.

The second tray loading unit 162 is an empty tray (on which the device 10 is not loaded) on the second tray transfer line TT2 of the tray 30 between the loading unit 100 and the unloading unit 300. 30) Any configuration is possible as long as it can be temporarily loaded.

In addition, the second tray transfer line TT2 temporarily stores the tray 30 filled with the elements 10 in the sorting tray 330 described above between the loading unit 100 and the unloading unit 300. The sorting buffer unit 350 to be loaded can be set.

In addition, the second tray transfer line TT2 is a cover tray (not shown) disposed on the uppermost side of the plurality of trays 30 supplied in bundles from the outside between the loading unit 100 and the unloading unit 300. A cover tray unit 169 on which (poetry) is temporarily loaded may be set.

Meanwhile, the second tray transfer line TT2 receives trays 30 in bundles filled with elements 10 loaded on the burn-in board 20 from the outside, or trays 30 in bundles filled with elements 10 of good quality. A tray distribution unit 168 may be set up to discharge to the outside the trays 30 and the trays 30 in bundles filled with devices 10 assigned a preset classification level.

Since the above is only a description of some of the preferred embodiments that can be implemented by the present invention, as is well known, the scope of the present invention should not be construed as limited to the above embodiments, and the scope of the present invention described above Both the technical idea and the technical idea underlying it will be said to be included in the scope of the present invention.

10: element 20: burn-in board 30: tray
100: loading part 300: unloading part

Claims (5)

delete a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded;
a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test;
an XY table 410 that moves the burn-in board 20 in the
an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria;
The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position spaced horizontally from the loading position, so that the DC test of the DC test unit 170 is performed on the tray 30. It includes a first buffer tray unit 610 on which devices 10 tested as defective are temporarily loaded,
The loading unit 100 includes a guide unit that guides the tray 30 to move in the Y-axis direction, and a drive unit for moving the tray 30,
The first buffer tray unit 610 transfers the tray 30 between the loading unit 100 and the unloading unit 300 so that empty trays 30 can be supplied from the loading unit 100. An element sorting device, characterized in that the first tray transfer unit 671 is configured to move in the Y-axis direction up to the first tray transfer line TT1 along which the first tray transfer unit 671 is moved. In claim 2,
One or more DC tray units 310 on which trays 30 are loaded with devices 10 that were tested as defective as a result of the inspection by the DC test unit 170;
It moves between the first buffer tray unit 610 and the DC tray unit 310 and moves the device 10, which is tested as defective as a result of the DC test of the DC test unit 170, to the first buffer tray unit 610. And a device sorting device further comprising a DC transfer tool 550 that transfers the DC tray unit 310. In claim 3,
The first buffer tray unit 610 has a moving section in which the tray 30 moves in the Y-axis direction between the loading position and the moving section (DC) of the DC transfer tool 550, and has two moving sections in the Z-axis up and down direction. An element sorting device characterized in that it is set to more than one device. In claim 2,
It is installed to be reciprocatable in the A third transfer tool 510;
A plurality of devices installed to be reciprocatable in the A first transfer tool 530 for loading (10) onto the burn-in board 20;
A second transfer tool installed between the extraction position of the elements 10 with respect to the burn-in board 20 and the unloading unit 300 to transfer the elements 10 to be classified as good products to the unloading unit 300. Contains (520),
A position opposite to the first tray transfer line (TT1) based on the reciprocating movement line (G) along which the third transfer tool 510, first transfer tool 530, and second transfer tool 520 move. Element sorting, characterized in that a second tray transfer line (TT2) is set along which the second tray transfer unit 672, which transfers the tray 30, is moved between the loading unit 100 and the unloading unit 300. Device.

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