CN112640075A - Component sorting apparatus - Google Patents
Component sorting apparatus Download PDFInfo
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- CN112640075A CN112640075A CN201980055053.4A CN201980055053A CN112640075A CN 112640075 A CN112640075 A CN 112640075A CN 201980055053 A CN201980055053 A CN 201980055053A CN 112640075 A CN112640075 A CN 112640075A
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- 238000012360 testing method Methods 0.000 claims abstract description 98
- 230000002950 deficient Effects 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000032258 transport Effects 0.000 description 30
- 238000012546 transfer Methods 0.000 description 27
- 238000007689 inspection Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000003825 pressing Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 208000010727 head pressing Diseases 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a component sorting apparatus, and more particularly, to a component sorting apparatus that automatically sorts components such as semiconductor chips according to sorting criteria. The invention discloses an element classification device, comprising: a loading section (100) that loads a tray (30), the tray (30) loading components (10) to be inspected; a DC test part (170) which receives the element (10) to be inspected from the loading part (100) to execute a DC test; an X-Y table (410) for moving a board (20) in an X-Y direction, wherein the board (20) is used for loading the components (10) to be inspected which are tested to be good quality by the DC testing part (170) at the empty position for leading out the components (10) to be classified; an unloading unit (300) for loading the components (10) to be sorted, which are derived from the pallet (20), on a tray (30) corresponding to a predetermined sorting standard; and a first buffer tray part (610) which is provided to move the tray (30) to a loading position above the DC test part (170) and an avoidance position horizontally spaced from the loading position, so as to temporarily load the tray (30) with the elements (10) which have been checked to be defective by the DC test result of the DC test part (170).
Description
Technical Field
The present invention relates to a component sorting apparatus, and more particularly, to a component sorting apparatus that automatically sorts components such as semiconductor chips according to sorting criteria.
Background
A semiconductor element (hereinafter, referred to as "element") is subjected to various inspections such as a reliability inspection for electrical characteristics, heat, or pressure after completion of a packaging process.
Among such inspections of semiconductor elements is a Burn-in Test (Burn-in Test) in which a plurality of elements are inserted into a Burn-in board, and the Burn-in board is stored in a Burn-in Test apparatus and subjected to heat or pressure for a predetermined period of time to determine whether or not a defect occurs in the element.
The component handler for burn-in test generally refers to a device that sorts (unloads) components from a board loaded with components subjected to burn-in test to each tray according to the inspection results of each component of good quality, poor quality, etc., while reinserting (loading) new components to be subjected to burn-in test at empty positions (sockets) of the board where the components are located.
On the other hand, the performance of the component handler as described above is evaluated by the number of classifications Per unit time (UPH: Units Per Hour), which depends on the time required to transport the components and boards between the respective members constituting the component handler.
Accordingly, in order to improve the performance of UPH, i.e., a component processor, it is necessary to improve the structure and arrangement of each constituent element.
As described above, Korean patent No. 10-1133188 (patent document 1), Korean patent No. 10-1177319 (patent document 2), Korean patent laid-open No. 10-2016-.
On the other hand, with the market scale expansion of standardized devices such as SDRAM (synchronous dynamic random access memory) and NAND flash memory in recent years, mass production is being expanded.
Then, in mass production, the demand for inspecting components is also increased, and therefore it is necessary to provide a plurality of component sorting devices for sorting components according to the inspection results as a subsequent process.
Disclosure of Invention
(problem to be solved)
The invention aims to provide a component sorting device, which is used for supplying components for a burn-in test and components for sorting and finishing the burn-in test, and optimizes the arrangement of a loading part for loading the components to be checked, a DC testing part for executing the DC test, an unloading part for loading the components led out from a melting plate on a tray, and the like, thereby minimizing the occupied space and effectively executing the component sorting process.
(means for solving the problems)
The present invention has been made to achieve the above object, and provides a component sorting apparatus including: a loading section 100 that loads a tray 30, the tray 30 loading components 10 to be inspected; a DC test part 170 receiving the component 10 to be inspected from the loading part 100 to perform a DC test; an X-Y table 410 for moving a board 20 in an X-Y direction, the board 20 being an empty position at which the component 10 to be sorted is led out, the component 10 to be inspected being tested as a good product by the DC test section 170 being loaded on the board; an unloading unit 300 for loading the components 10 to be sorted, which are derived from the boards 20, on the trays 30 corresponding to predetermined sorting criteria; the first buffer tray part 610 is provided to move the tray 30 to a loading position above the DC test part 170 and an avoidance position horizontally spaced from the loading position, so that the elements 10 that have been inspected to be defective by the DC test result of the DC test part 170 are temporarily loaded on the tray 30.
(Effect of the invention)
The component sorting apparatus of the present invention is a component inspection apparatus for supplying and sorting components before and after inspection such as burn-in test, in which a loading section loads components to be inspected, an unloading section loads components which are inspected as good quality products on a board to load and unload trays, the trays of the loading section and the trays of the unloading section are arranged in parallel to each other in a conveying direction, and the supply and discharge of the trays to and from the apparatus are performed adjacent to the unloading section, thereby having an advantage that the supply and discharge of the trays are automated and the occupied space is significantly reduced.
In addition, the component sorting apparatus according to the present invention has an advantage that the arrangement of a loading unit for loading components to be inspected, a DC test unit for performing a DC test, an unloading unit for loading components led out from a board onto a tray, and the like is optimized, thereby minimizing the occupied space and effectively performing a component sorting process.
In addition, the component sorting apparatus of the present invention further includes a module exchanging portion for automatically exchanging a test socket, a tray, and the like of the DC test portion used in the apparatus according to a change in external form specifications of the component, such as a plane size, and further has an advantage that the apparatus is convenient to use.
In particular, the device for sorting components of the present invention is configured to optimize the module exchanging part on the upper side of the device, thereby minimizing the occupied space and effectively performing the process of sorting components.
For example, the module exchanging part has an advantage that a loading part for loading a test socket, a tray, etc. of the DC test part is positioned at an upper side, and particularly, shares at least a portion with a carrying rail of a carrying tool to optimize a configuration, thereby effectively performing a sorting process of components while minimizing a space occupied.
Drawings
Fig. 1 is a plan configuration view showing a component sorting apparatus of the present invention.
Fig. 2 is a front view showing an arrangement example of a transfer tool used in a process of transferring components among the loading section, the DC test section, the first buffer tray section, the pallet, and the unloading section in the component sorting apparatus of fig. 1.
Fig. 3 is a side view showing the arrangement of the first tray conveying section, the conveying tool, and the second tray conveying section in the component sorting apparatus of fig. 1.
Detailed Description
Hereinafter, the component sorting apparatus of the present invention will be described with reference to the drawings.
As shown in fig. 1 to 3, the component sorting apparatus of the first embodiment of the present invention includes: a loading section 100 that loads a tray 30, the tray 30 loading components 10 to be inspected; a DC test part 170 receiving the component 10 to be inspected from the loading part 100 to perform a DC test; an X-Y table 410 for moving a board 20 in an X-Y direction, wherein the board 20 is loaded with the component 10 to be inspected which is tested as a high-quality product by a DC testing part 170 at an empty position where the component 10 to be classified is derived; an unloading unit 300 for loading the components 10 to be sorted, which are derived from the boards 20, on the trays 30 corresponding to predetermined sorting criteria; the first buffer tray part 610 is provided so that the tray 30 can be moved to a loading position above the DC test part 170 and an avoiding position spaced from the loading position, and the elements 10 that have been inspected to be defective by the DC test result of the DC test part 170 are temporarily loaded.
The burn-in board 20 refers to a board on which the components 10 are loaded to pass a burn-in test of a burn-in test apparatus (not shown), and has sockets into which the components 10 are respectively inserted to perform a test of an electrical characteristic, a signal characteristic, at a high temperature.
The burn-in board 20 is mounted on an X-Y table 410 provided in the component sorting apparatus, and the components 10 are loaded while unloading the components 10 subjected to the burn-in test.
With the X-Y table 410, in order to load the board 20 with the components 10 inserted therein and simultaneously unload the board 20 with the components 10 inserted therein, the board 20 is taken as one of the structures, as shown in fig. 1, including a board exchanging device (not shown) to receive the board 20 to be subjected to the component 10 exchange or to discharge the board 20 subjected to the component 10 exchange.
Then, the X-Y table 410 is configured to be driven by an X-Y table driving part (not shown) to move the board 20, and the component 10 is inserted into an empty position of the board 20 by the first transporting tool 530 or the component 10 is led out from the board 20 by the second transporting tool 520.
The X-Y table driving unit is linked with the second conveyor 520 and the first conveyor 530, and the X-Y table 410 on which the board 20 is mounted moves in an X-Y or X-Y- θ manner, so that the second conveyor 520 and the first conveyor 530 can easily carry out or mount the components 10 from the board 20, and may have various configurations.
That is, the X-Y table driving unit is configured to move the X-Y table 410, to guide the component 10 out of the board 20 in conjunction with the second conveyor 520, and to insert the component 10 into the empty position of the board 20 in conjunction with the first conveyor 530, and to move the X-Y table 410 to the board replacement position when the insertion of the component 10 into the board 20 is completed.
On the other hand, the X-Y table 410 is provided at the main body 40 constituting the component sorting apparatus of the present invention, and the main body 40 may include an upper plate (not shown) formed with an opening portion (not shown) for the second and first conveyers 520 and 530 to lead out the component 10 or load the component 10 from the board 20.
Then, a socket pressing member 45 is provided on the upper side of the X-Y table 410, and the socket pressing member 45 presses a socket provided on the board 20, so that components are guided out of and loaded on the board 20.
The socket pressing member 45 may lead out a component of the socket inserted into the chain plate 20 or a loadable component, and may have various structures according to the socket structure of the chain plate 20.
On the other hand, the socket pressing member 45 is different depending on the outer shape of the element 10, and is preferably provided so as to be manually or automatically replaceable.
Then, a vision device (not shown) for aligning the position of the board 20 may be provided at an upper portion of the socket pressing member 45 to guide and discharge the components 10 by the first and second conveyers 530 and 520.
The loading portion 100 may have various structures as a structure for loading the tray 30, in which the tray 30 is loaded with the plurality of elements 10 to be loaded on the apron 20.
On the other hand, the loading section 100 may be provided with a 2D scanner 960, and the 2D scanner 960 is provided at an upper portion of the tray 30 in the conveying direction to perform inspection of the tray cover, the tray 30 itself, the components 10 mounted on the tray 30, and the like, identification of the QR code, and the like.
The loading section 100 is generally configured to include a guide section that guides each tray 30 to be movable in the Y-axis direction and a drive section (not shown) for moving the tray 30, as in patent documents 1 to 3.
Here, when the lead-out position of the element 10 with respect to the pallet 20 and the arrangement direction of the unloading unit 300 are X-axes, a direction horizontally perpendicular to the X-axes is defined as a Y-axis.
The unloading section 300 may have various configurations as a configuration for loading the components 10 to be sorted, which are derived from the boards 20, on the trays 30 corresponding to the sorting criteria set in advance.
As an example, as shown in fig. 1, the unloading part 300 may include: one or more high-quality product tray parts 320 for placing the tray 30 loaded with the components 10 to be classified as high-quality products; one or more DC tray parts 310 for placing the tray 30 loaded with the component 10 whose inspection result of the DC test part 170 is inspected as being unqualified; one or more tray reject sections 330 are provided for placing the trays 30 on which the components 10 to be sorted into the respective sorting levels are loaded, in the pallet 20, in accordance with the number of the sorting levels other than the high-quality products.
The fine product tray part 320 is a structure for placing the tray 30 on which the components 10 to be classified into fine products are loaded, and may have various structures similar to the loading part 100.
The DC tray section 310 may have various structures, similar to the loading section 100, as the structure of the tray 30 on which the components 10 that have been inspected to be defective by the DC test section 170 are placed.
The reject tray part 330, as a structure for placing the tray 30 on which the components 10 to be classified into the respective classification levels are loaded in the apron 20 corresponding to the number of classification levels other than the quality goods, may have various structures similarly to the loading part 100, or the like.
Here, the number of the reject tray part 330 may be determined according to the number of the classification levels.
On the other hand, the premium tray portion 320, the DC tray portion 310, and the reject tray portion 330 may have various configurations including a guide portion that guides the tray 30 to be movable in the Y-axis direction, respectively, and a driving portion that moves the tray 30 along the guide portion, and the like.
On the other hand, as shown in fig. 1, the empty tray 30 after the loading unit 100 has led out the components 10 from the tray 30 can be transferred to the unloading unit 300 or the like by a first tray transfer unit 671 (see fig. 3) provided on the rear side of the apparatus.
At this time, the tray 30 may have the components 10 left thereon, and a tray rotating part 150 may be further provided to rotate the tray 30 to remove the remaining components 10 in order to remove the components 10 left on the tray 30 before the tray 30 is transferred from the loading part 100 to the unloading part 300.
As shown in fig. 1, the tray rotating unit 150 is provided on the first tray conveying path TT1 of the tray 30 between the loading unit 100 and the unloading unit 300, receives the tray 30 from the loading unit 100 by the first tray conveying unit 671, rotates the tray 30, and then transfers the tray 30 to the unloading unit 300.
Further, the first tray loading unit 161 can be placed on the first tray transport path TT1 of the tray 30 between the loading unit 100 and the unloading unit 300, and the empty tray 30 on which the unloaded component 10 is temporarily loaded can be loaded.
The first tray loading unit 161 may be any configuration as long as it is configured to temporarily load the empty tray 30 on which no component 10 is loaded on the first tray transport path TT1 of the tray 30 between the loading unit 100 and the unloading unit 300.
The DC test part 170 may have various structures as a structure that is disposed between the loading part 100 and the socket pressing member 45 to receive the component 10 to be inspected from the loading part 100 and perform a DC test.
The DC test section 170 may have various configurations, such as a plurality of sockets for electrically connectable devices 10, and preferably, the same number of sockets as the number of sockets in the horizontal direction of the tray 30 may be provided in the horizontal direction.
The test results of the DC test section 170 for the respective elements 10 are flexibly used as data for sorting in the DC tray section 310 described later.
Here, the third transfer tool 510 transfers the components from the tray 30 of the loading unit 100 to the DC test unit 170.
On the other hand, in the case where the external form specification (such as the size) of the element 10 as the processing object is changed, the test socket constituting the DC test section 170 needs to be replaced.
Before that, it is preferable that the test socket of the DC test section 170 is provided so as to be automatically replaceable with another kind of test socket loaded in a replacement component loading section (not shown).
Here, in order to smoothly replace the test socket of the DC test section 170, the test socket of the DC test section 170 is preferably provided to be movable in the Y-axis direction.
The first buffer tray part 610 may have various configurations as a configuration in which the tray 30 is movable to a loading position above the DC test part 170 and an avoidance position spaced from the loading position, and the elements 10 that fail the DC test result of the DC test part 170 are temporarily loaded.
For example, the first buffer tray part 610 may be configured to allow the tray 30 to move in the X-axis direction, as in the loading part 100.
Then, the position directly above the DC test unit 170 is defined as a loading position, and the front and rear can be defined as avoidance positions in the X-axis direction with reference to the position directly above the DC test unit 170.
In order to smoothly transfer the components 10 that have been checked as being defective by the DC test result of the DC test section 170, 2 or more trays 30 may be transported, and the moving path may be arranged vertically for interference during movement.
That is, it is preferable that the first buffer tray part 610 has 2 or more movement sections which are vertically provided, and the movement section is a section in which the tray 30 moves back and forth in the Y-axis direction between the loading position and the movement section DC of the DC transfer tool 550.
On the other hand, the process of transferring the components 10 between the DC test section 170 and the first buffer tray section 610 may be performed in various ways for smoothly operating the processor.
For example, when all the DC test results are judged to be good products after the components are transferred to the DC test section 170 by the first transfer tool 510, the DC test results are directly transferred to the board 40 by the second transfer tool 520.
On the other hand, if there are some components 10 that have been checked as being defective by the DC test result, all the components 10 loaded by the DC test section 170 are discharged by the first transfer tool 510 and then loaded on the trays 30 of the first buffer tray section 610.
Then, when all the trays 30 of the first buffer tray part 610 are loaded with the components 10, the trays 30 are moved to the transfer path DC of the DC transfer means 550. At this time, when the tray 30 moves to the transfer path DC of the DC transfer tool 550, the other trays 30 receive the components 10 that have been checked as being defective by the DC test result.
On the other hand, in the tray 30 moved to the transfer path DC of the DC transfer tool 550, which will be described later, all the components 10 that have been checked as being defective in the DC test result are transferred to the DC tray portion 302 by the DC transfer tool 550, except for the components 10 that have been determined as being good, and only the good components 10 are left in the tray 30.
On the other hand, the components 10 checked as being defective are moved again to the loading position by the tray 30 which is completely removed, and then transferred to the chain mat 40 by the second conveyance means 520.
Then, the tray 30 needs to be replaced according to the external form specification of the component 10, and it is preferably set to be automatically replaceable similarly to the replacement process of the DC test section 170 with another kind of tray loaded in the replacement part loading section 680 shown in fig. 5 to 7 described later.
As an example, the tray 30 of the first buffer tray part 610 is movable in the Y-axis direction, and is provided to be movable to the first tray transfer route TT1, and the tray 30 of another specification can be received by the first tray transfer part 671 from the loading part 100 or the first tray loading part 161.
On the other hand, with respect to the component 10, in order to smoothly convey the component 10, various structures may be provided, and a plurality of conveyance tools may constitute various configurations.
As an example, as shown in fig. 1 to 3, the conveyance may include: a third conveyance tool 510 configured to reciprocate in the X-axis direction between the loading unit 100 and the DC test unit 170 to transfer the plurality of components 10 from the loading unit 100 to the DC test unit 170; a first conveyance tool 530 which is provided to reciprocate in the X-axis direction between the component 10 loading position on the board 20 and the DC test section 170, and which is configured to load the plurality of components 10 inspected as good-quality products by the DC test section 170 onto the board 20; the second conveyance means 520 is provided between the position where the elements 10 of the pallet 20 are led out and the unloading section 300, and transfers the elements 10 to be classified into good quality products from the second buffer tray section 620 to the unloading section 300.
On the other hand, the arrangement of the components 10 mounted on the chain guard 20 is different from the arrangement of the components 10 mounted on the tray 30 such as the mounting portion 100, and the number of the components 10 arranged on the chain guard 20 is relatively large.
Accordingly, the first and second conveyers 530 and 520 that convey the components 10 or the lead-out components 10 to the pallet 20 are preferably configured to convey a relatively larger number of components 10 than the remaining conveyers. For example, the first conveyance 530 and the second conveyance 520 may be 5 × 2, and the remaining conveyance may be 5 × 1, etc.
In the case of configuring the conveyance tool as described above, in addition to the positions where a relatively large number of components 10 need to be conveyed, a conveyance tool for conveying a small number of components 10 can be used in the positions where a relatively small number of components 10 need to be conveyed, so that the size and stability of the apparatus can be improved while saving the manufacturing cost of the apparatus.
The number of pickers in the lateral direction of the first and second carriers 530 and 520 may be the same as the number of component receiving grooves (not shown) for loading the components 10 in the first buffer tray part 610 and the unloading part 300 in view of efficiency of the components 10.
On the other hand, it is preferable that the first and second carriers 530 and 520 have the same number of pickers in the horizontal direction in consideration of the fact that the first and second carriers 530 and 520 respectively correspond to the carrier elements 10.
On the other hand, it is general that the pitch between the components 10 on the board 20 and the pitch between the components 10 on the tray 30 are different (2 times) from each other, and for this reason, it is preferable that one of the first and second conveyers 530 and 520 and the third conveyer 510 may change the pitch between the components 10 picked up by the picker.
On the other hand, the third conveyance means 510, the first conveyance means 530, and the second conveyance means 520 move along the traverse route G.
Then, a sorting route S is set at a position spaced in the Y-axis direction from the reciprocating route G, the sorting conveyance tool 560 can be moved along the sorting route S, and the components 10 that have been checked as being defective by the DC test result of the DC test section 170 among the components 10 loaded on the tray 30 in the unloading section 300, and the components 10 received from the second conveyance tool 520 are loaded on the corresponding tray 30 among the good-quality tray section 320, the DC tray section 310, and the reject tray section 330 according to the sorting order.
The sorting conveyance 560 may have various structures as a structure provided to be movable along the sorting route S to check the DC test result of the DC test section 170 as a defective component 10 among the components 10 of the tray 30 loaded in the unloading section 300, and the components 10 received from the second conveyance 520 are loaded to the corresponding tray 30 among the premium tray section 320, the DC tray section 310, and the reject tray section 330 according to the sorting grade.
On the other hand, the sorting route S is defined as a path along which the sorting conveyance 560 moves along the sorting guide 591, and the sorting guide 591 is provided at a position spaced in the Y-axis direction from the traverse route G.
In particular, it is preferable that the sorting path S is provided near the second tray conveying unit 672 as a position spaced from the reciprocating path G in the Y-axis direction to realize smooth sorting and to minimize interference with other structures.
On the other hand, when the sorting conveyance tool 560 directly conveys the component 10, which has been checked as defective by the DC test result of the DC test section 170 described above, from the first buffer tray section 610, the movement path of the sorting conveyance tool 560 becomes long, which causes a problem of significantly reducing the operation speed.
Further, the sorting guide unit 591 for guiding the movement of the sorting conveyance unit 560 is provided across the apparatus in the X-axis direction, and thus there are many problems in structure such as restriction of the installation of other structures.
Accordingly, it is preferable that the component sorting apparatus of the present invention further includes a DC transfer tool 550, and the DC transfer tool 550 is moved between the first buffer tray part 610 and the unloading part 300 (particularly, the DC tray part 310) to transfer the component 10, which is checked as being defective by the DC test result of the DC test part 170, to the first buffer tray part 610 and the unloading part 300 (particularly, the DC tray part 310).
The DC transfer tool 550 may have various structures as a structure that moves between the first buffer tray part 610 and the unloading part 300 (particularly, the DC tray part 310) and transfers the elements 10 that have been checked as being defective by the DC test result of the DC test part 170 to the first buffer tray part 610 and the unloading part 300 (particularly, the DC tray part 310).
In particular, with the DC conveyance 550, it is considered that the number of components 10 that are checked as being defective by the DC test result of the DC test section 170 is relatively small, and thus a relatively small number of pickers, for example, 2 pickers, may be included compared to other conveyers.
On the other hand, as shown in fig. 1 and 3, in consideration of the fact that the DC transport 550 moves longer than the movement section of the sorting transport 560, in order to ensure stable movement, the DC transport 550 may be set so that the main guide member 592 guiding the movement of the first transport 530, the second transport 520, and the third transport 510 is spaced from the movement path G of the first transport 530, the second transport 520, and the third transport 510 in the Y-axis direction, and may be further moved in a state of being coupled to the main guide member 592.
Then, the DC transport 550 may be disposed to DC-move along a moving section DC set at a distance in the Y-axis direction from the moving path G of the first, second, and third transports 530, 520, and 510.
On the other hand, the conveyers 510, 520, 530, 540, 550, 560 may include more than one picker each having a suction head pressing the suction element 10 by vacuum at an end and a picker transfer device for moving the picker in an X-Z, Y-Z or X-Y-Z direction.
In particular, the conveyance may line the pickers in a row or in multiple rows, such as 5 × 2, 4 × 2, etc.
On the other hand, as shown in fig. 1, the component sorting apparatus of the present invention includes a board loader 800, and the board loader 800 is disposed at one side to continuously receive the board 20.
The board loader 800 may have various configurations, such as a configuration for loading the boards 20 with the components 10 inserted therein and sequentially loading the boards 20 with the components 10 inserted therein and transferring the boards to the burn-in test, that is, a configuration for continuously exchanging the boards 20 with the X-Y table 410, and is configured by the board loader 800 disclosed in patent document 3.
On the other hand, the plate loader 800 is preferably provided adjacent to the loading portion 100.
In particular, when the plate loader 800 is provided adjacent to the loading unit 100, a direction perpendicular to the tray conveying direction in the loading unit 100 is referred to as a Y-axis direction, and the plate loader is coupled to the loading unit 100 in the X-axis direction.
At this time, the rack 50 on which the plate 20 is loaded can be introduced or discharged in the X-axis direction at the right side of the apparatus, particularly adjacent to the loading portion 100, by the coupling of the plate loader 800 as described above.
On the other hand, in order to recognize the tray 30 in a path for conveying the tray 30 from the loading portion 100, to inspect the upper surface of the component 10 loaded on the tray 30, or the like, that is, to perform a function according to a design requirement, a first vision portion 191 of a camera, a scanner, or the like may be provided.
Then, a second vision part 192, such as a camera, a scanner, or the like, may be provided to photograph the bottom surface of the component 10 picked up and carried by the third carrying tool 510 between the loading part 100 and the DC test part 170.
In addition, a third vision part 193, such as a camera, a scanner, or the like, may be provided to photograph the bottom surface of the component 10 picked up and carried by the first carrying tool 530 between the DC test part 170 and the component 10 loading position on the board 20.
On the other hand, a second tray transport route TT2 may be set at a position facing the first tray transport route TT1 with reference to the reciprocating route G along which the third transport tool 510, the first transport tool 530, and the second transport tool 520 move, and the second tray transport route TT2 is a route along which the second tray transport section 672 that transports the trays 30 between the loading section 100 and the unloading section 300 moves.
The second tray transport path TT2 is a path along which the second tray transport unit 672 that transports the tray 30 between the loading unit 100 and the unloading unit 300 moves, and is set at a position facing the first tray transport path TT1 with reference to the forward/backward movement path G.
On the other hand, a second tray loading section 162 may be provided on the second tray transport path TT2, and an empty tray 30 on which no component 10 is loaded may be temporarily loaded.
The second tray loading unit 162 may be any configuration as long as it can temporarily load the empty tray 30 on which no component 10 is loaded in the second tray transport path TT2 of the tray 30 between the loading unit 100 and the unloading unit 300.
The second tray transport path TT2 may be provided with a sorting buffer 350 for temporarily loading the trays 30, which are filled with the components 10 by the above-described sorting tray 330, between the loading unit 100 and the unloading unit 300.
In addition, a cover tray portion 169 may be set in the second tray transport route TT2, and the cover tray portion 169 temporarily loads a cover tray (not shown) disposed at the uppermost side of the plurality of trays 30 supplied from the outside in a bundle unit between the loading portion 100 and the unloading portion 300.
On the other hand, the second tray carrying route TT2 may be provided with a tray logistics section 168 for receiving externally a tray 30 of a binding unit filled with the components 10 loaded on the pallet 20 or discharging externally a tray 30 of a binding unit filled with the high-quality components 10 or a tray 30 of a binding unit filled with a plurality of components 10 assigned a predetermined classification level.
The above description is only a part of the preferred embodiments that can be realized by the present invention, and therefore it is well known that the scope of the present invention is not limited to the above-described embodiments, and the technical ideas of the present invention and the fundamental technical ideas thereof described above are all included in the scope of the present invention.
Claims (1)
1. A component sorting apparatus, comprising:
a loading section (100) that loads a tray (30), the tray (30) loading components (10) to be inspected;
a DC test part (170) which receives the element (10) to be inspected from the loading part (100) to execute a DC test;
an X-Y table (410) for moving a board (20) in an X-Y direction, wherein the board (20) is used for loading the components (10) to be inspected which are tested to be good quality by the DC testing part (170) at the empty position for leading out the components (10) to be classified;
an unloading unit (300) for loading the components (10) to be sorted, which are derived from the pallet (20), on a tray (30) corresponding to a predetermined sorting standard;
and a first buffer tray part (610) which is provided to move the tray (30) to a loading position above the DC test part (170) and an avoidance position horizontally spaced from the loading position, so as to temporarily load the tray (30) with the elements (10) which have been checked to be defective by the DC test result of the DC test part (170).
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KR10-2018-0072325 | 2018-06-22 | ||
KR1020180072325A KR102603158B1 (en) | 2018-06-22 | 2018-06-22 | Device handler |
PCT/KR2019/007608 WO2019245354A1 (en) | 2018-06-22 | 2019-06-24 | Device sorting apparatus |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20080104927A (en) * | 2007-05-29 | 2008-12-03 | 한미반도체 주식회사 | Sorting handler for burn-in test |
KR20160048628A (en) * | 2014-10-24 | 2016-05-04 | (주)제이티 | Sorting Apparatus for Semiconductor Device |
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KR100295774B1 (en) | 1999-04-08 | 2001-07-12 | 정문술 | sorting handler for burn-in test |
KR101103289B1 (en) * | 2010-04-19 | 2012-01-11 | 에이엠티 주식회사 | Burn in sorter and operation method using it |
KR20150083526A (en) * | 2014-01-10 | 2015-07-20 | 미래산업 주식회사 | Burn-in Sorter |
KR101670814B1 (en) | 2014-12-03 | 2016-10-31 | 주식회사 이노비즈 | IC Package sorter |
KR20160143202A (en) * | 2015-06-04 | 2016-12-14 | 한미반도체 주식회사 | Semiconductor package alignment method |
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Patent Citations (2)
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KR20080104927A (en) * | 2007-05-29 | 2008-12-03 | 한미반도체 주식회사 | Sorting handler for burn-in test |
KR20160048628A (en) * | 2014-10-24 | 2016-05-04 | (주)제이티 | Sorting Apparatus for Semiconductor Device |
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KR20200000253A (en) | 2020-01-02 |
KR102603158B1 (en) | 2023-11-16 |
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