KR20080104927A - Sorting handler for burn-in test - Google Patents

Abstract

The sorting handler for the burn-in test is provided to minimize the latency time of the insert picker and to increase the throughput per unit time and to simplify the overall structure of equipment. The sorting handler for the burn-in test comprises the loading unit(30) for accepting the semiconductor packages, the unloader(40) for classifying and accepting the semiconductor packages according to the test result, the insert picker mounted on the empty space of the burn-in board(52) for picking up semiconductor packages to be newly tested, the removing working position (RP) for completed burn-in semiconductor packages, the insert work location which mounts the semiconductor package to be newly tested by the insert picker on the empty space on the burn-in board.

Description

Sorting Handler for Burn-in Test}

1 is a plan view schematically showing the configuration of a sorting handler for a burn-in test according to a first embodiment of the present invention

Figures 2a and 2b is a cross-sectional view of the main portion showing an embodiment of the clamping latch operating unit configured in the removing operation position and the insert operation position of the sorting handler of Figure 1

3A and 3B are cross-sectional views of main parts of another embodiment of a clamping latch operating unit configured at a removing working position and an insert working position of the sorting handler of FIG.

Figure 4 is a plan view schematically showing the configuration of the burn-in test sorting handler according to a second embodiment of the present invention

5 is a plan view schematically showing the configuration of a burn-in test sorting handler according to a third embodiment of the present invention.

6 is a plan view schematically showing the configuration of a burn-in test sorting handler according to a fourth embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10, 110, 210: main body 20, 120, 220: rack

30, 130, 230: loading part 40, 140, 240: unloading part

41, 141, 241: unloading part 42, 142, 242: burn-in reject part

43, 143, 243: burn-in reject section 44, 144, 244: DC reject section

50, 150, 250: X-axis guide frame 51, 151: Loading picker

52, 152: Insert picker 53, 153: Remove picker

54: reject unloading picker 154: unloading picker

61, 161, 261: DC test unit 62, 162, 262: DC reject buffer unit

63: burn-in reject buffer section 163: unloading buffer section

80: clamp latch operation unit 81: operating member

251, 255: 1st and 2nd loading picker 252, 256: 1st and 1st insert picker

253, 257: 1st and 2nd move picker B: burn-in board

L: Clamp Latch T: Tray

RP: Removing Work Position IP: Insert Work Position

RIP1, RIP2: 1st, 2nd moving / insert working position

The present invention relates to a sorting handler for a burn-in test. More particularly, the semiconductor package is mounted on a burn-in board prior to shipping and subjected to a heat resistance test at a high temperature, and then the tested semiconductor packages are separated from the burn-in board. The present invention relates to a sorting handler for burn-in test that automatically sorts and stores a tray in a tray according to a test result and mounts a new semiconductor package to a burn-in board.

In general, semiconductor packages have been tested for electrical performance by a test apparatus after production is completed, so that only the products classified as good results can be shipped to ensure the reliability of the product.

One of the tests of the semiconductor package is to carry out a burn-in test in order to minimize the occurrence of defects due to high temperature in the actual use environment. In the burn-in test, the semiconductor packages to be tested in the burn-in test sorting handler are mounted on a burn-in board, and then the burn-in board is returned to a burn-in tester to perform a heat resistance test at a high temperature. The burn-in board is returned to the burn-in test sorting handler and sorted and stored in the shipping tray for each test result.

In this burn-in test process, the burn-in test sorting handler separates the semiconductor package tested by the burn-in tester from the burn-in board, sorts it into the shipping tray for each test result, and mounts a new semiconductor package to be tested on the burn-in board. Do it automatically.

A typical conventional burn-in tester sorting handler uses an insert picker from a tray of a loading section while a pick picker takes a tested semiconductor package from a burn-in board and returns it to the tray of the unloading section. After the package was picked up and returned to the DC test socket, a simple DC test was performed, and then the sorting operation was performed by filling the semiconductor package where the DC test was completed into an empty space on the burn-in board.

However, in the conventional burn-in tester sorting handler, since the remove picker and the insert picker move along the same path, the insert picker is newly tested while the remove picker performs the operation of drawing out the tested semiconductor packages of the burn-in board. The insert picker moved onto the burn-in board and mounted the semiconductor packages to be tested until the remove picker was completely out of the interfering position.

As a result, the time required to remove the tested semiconductor package from the burn-in board and to fill the empty semiconductor package to be tested, that is, the index time is increased, thereby decreasing the unit per hour (UPH). There is a problem.

In addition, while the insert picker waits, another picker having a shorter working cycle than the insert picker, for example, a loading picker which pulls out a semiconductor package to be newly tested from a tray and mounts it in a DC test socket, may not perform an operation. Since bottlenecks that must wait together occur, the work efficiency is lowered, and the problem of further lowering the throughput per unit time (UPH) occurs.

The present invention is to solve the above problems, an object of the present invention is to reduce the index time without complicating the overall structure of the equipment, to minimize the waiting time of the insert picker to increase the throughput per unit time (UPH) It provides a sorting handler for burn-in testing that can be done.

According to an aspect of the present invention for achieving the above object, a main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; An insert picker installed on the upper part of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested and mounting them in an empty position of the burn-in board; A remove picker installed to move in the X-axis direction parallel to the insert picker at a position spaced a predetermined distance from the insert picker in a Y-axis direction, and to carry out and transport the burned-in tested semiconductor packages from the burn-in board; A removing work position disposed on the main body under the moving path of the remove picker and performing a work of drawing out the burn-in-tested semiconductor package on the burn-in board by the remove picker; The main body is spaced apart in the Y-axis direction from the removing operation position in a lower side of the insert picker on a moving path, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. A sorting handler for the burn-in test is provided, including the insert work position to be made.

According to another aspect of the invention, the main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit configured to perform an electrical performance test by connecting a semiconductor package to be tested returned from the loading unit; A DC reject buffer unit which temporarily receives semiconductor packages which are determined to be defective by the DC test unit; A loading picker installed on the main body to move in the X-axis direction and picking up the semiconductor package from the loading unit and mounting the semiconductor package to the DC test unit; An insert picker installed at an upper portion of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested by the DC test unit and mounting them in an empty position of the burn-in board; A remove picker installed to move in the X-axis direction parallel to the insert picker at a position spaced a predetermined distance from the insert picker in a Y-axis direction, for removing the burn-in test-completed semiconductor packages from the burn-in board and conveying them to the unloading unit; A burn-in reject buffer unit for temporarily receiving semiconductor packages, which are determined to be defective, among the semiconductor packages separated from the burn-in board by the remove picker; A reject unloading picker which transfers the semiconductor packages of the DC reject buffer unit and the burn-in reject buffer unit to the unloading unit and stores the semiconductor packages in a tray for receiving defective products; A removing work position disposed on the main body under the moving path of the remove picker and performing a work of drawing out the burn-in-tested semiconductor package on the burn-in board by the remove picker; The main body is spaced apart in the Y-axis direction from the removing operation position in a lower side of the insert picker on a moving path, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. A sorting handler for burn-in testing is provided that includes the insert work location to be made.

According to still another aspect of the present invention, there is provided an apparatus comprising: a main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit configured to perform an electrical performance test by connecting a semiconductor package to be tested returned from the loading unit; A DC reject buffer unit which temporarily receives semiconductor packages which are determined to be defective by the DC test unit; A burn-in buffer unit to temporarily receive semiconductor packages separated from the burn-in board; It is installed to move in the X-axis direction on the upper portion of the main body, and the pickup picks up the semiconductor package from the loading unit mounted in the DC test unit or the pick-up DC defective semiconductor package from the DC reject buffer unit to return to the unloading unit Wow; An insert picker installed at an upper portion of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested by the DC test unit and mounting them in an empty position of the burn-in board; A remove picker installed to move in the X-axis direction parallel to the insert picker at a position spaced a predetermined distance from the insert picker in a Y-axis direction, for removing the burn-in test-completed semiconductor packages from the burn-in board and conveying them to the unloading unit; An unloading picker which transfers the semiconductor package of the burn-in buffer unit to the unloading unit and sorts and stores the semiconductor package according to a test result; A removing work position disposed on the main body under the moving path of the remove picker and performing a work of drawing out the burn-in-tested semiconductor package on the burn-in board by the remove picker; The main body is spaced apart in the Y-axis direction from the removing operation position in a lower side of the insert picker on a moving path, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. A sorting handler for burn-in testing is provided that includes the insert work location to be made.

According to still another aspect of the present invention, there is provided an apparatus comprising: a main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board taken out of the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit connected to the semiconductor package to be tested transferred from the loading unit to perform an electrical performance test, the DC test unit being installed to reciprocate at a predetermined distance in the Y-axis direction; A DC reject buffer unit for temporarily receiving semiconductor packages that are determined to be defective as a result of a DC test in the DC test unit, and installed to reciprocate at a predetermined distance in the Y-axis direction; An X-axis guide frame installed to cross the upper portion of the main body in the X-axis direction; Installed on the first and second surfaces of the X-axis guide frame to move independently in the X-axis direction, the semiconductor package is picked up from the loading unit and mounted on the DC test unit, or the DC reject buffer unit is defective in DC. First and second loading pickers which pick up the semiconductor package and transfer the semiconductor package to the unloading unit; The first and second surfaces of the X-axis guide frame are installed to move independently in the X-axis direction, respectively, the first to pick up the semiconductor packages to be newly tested in the DC test unit to be mounted in the empty place of the burn-in board, 2 insert picker; First and second move pickers installed on the second and first surfaces of the X-axis guide frame to move independently in the X-axis direction, respectively, to carry out the burn-in-tested semiconductor packages to the unloading unit. Wow; The first and second insert pickers and the first and second remove pickers are disposed on the lower side of the moving path, respectively, and the burn-in-tested semiconductor packages on the burn-in board are drawn out by the first and second remove pickers. And a sorting handler for burn-in testing including a first and second moving / inserting work positions in which a work of newly mounting a semiconductor package to be newly tested by the first and second insert pickers in an empty position on the burn-in board is alternately provided. .

According to the present invention, the burn-in test sorting handler has a removal work position for drawing out the semiconductor package and an insert work position for inserting the semiconductor package at a predetermined distance away from the Y-axis direction, so that the remove picker is removed from the burn-in board. Immediately after removing the burn-in-tested semiconductor package, the insert picker can insert a new semiconductor package into an empty spot on the burn-in board. Therefore, the time taken to separate the semiconductor package from the burn-in board and insert a new semiconductor package, that is, the index time can be reduced, the bottleneck can be eliminated by minimizing the wait time of the insert picker, and the output per unit time (UPH) can be reduced. There is an advantage that can be increased.

Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments of the sorting handler for the burn-in test according to the present invention.

First, the configuration and operation of the burn-in test sorting handler according to the first embodiment of the present invention will be described with reference to FIG. 1.

As shown in FIG. 1, a rack 20 on which a plurality of burn-in boards B are stacked is installed on one side of the main body 10 of the sorting handler according to the present invention. The rack 20 is loaded with a burn-in board B for storing the burn-in-tested semiconductor packages or a blank burn-in board for filling the semiconductor packages to be newly tested.

In addition, the burn-in board B drawn out from the rack 20 is moved to a position for the semiconductor package withdrawal and / or insertion at the lower part of the base of the main body 10, and the burn-in board B is moved at any position. A burn-in board stage (not shown) is installed to move it into position. In addition, although not shown in the drawing, the burn-in board B is drawn out from the rack 20 at the lower portion of the main body 10 and conveyed onto the burn-in board stage (not shown), and the burn-in board stage is not shown. The burn-in board conveying robot (not shown) which conveys the burn-in board B of the upper box to the rack 20 is comprised.

In addition, one side of the main body 10 is provided with a loading unit 30 loaded with trays containing the semiconductor package to be newly tested. In the loading unit 30, the tray T is configured to move along the Y-axis direction from the front of the main body 10 to the rear by a linear motion device not shown in the figure.

In addition, an unloading unit 40 having trays in which semiconductor packages are classified and stored for each burn-in test result is installed on the opposite side of the loading unit 30. The unloading part 40 includes a good quality unloading part 41 in which semiconductor packages determined to be good as a result of a burn-in test are received, and a burn-in reject part 42 in which semiconductor packages determined as defective or re-inspected goods are received as a result of a burn-in test. And 43, and a DC reject portion 44 that houses a semiconductor package that is determined to be defective as a result of the DC test.

In the unloading part 40, the trays T store the semiconductor packages while moving along the Y-axis direction from the rear of the main body 10 to the front by linear motion devices (not shown).

In addition, the upper side of the rear portion of the main body 10, the tray conveying device 35 for transferring the empty tray after all the semiconductor package is loaded in the loading unit 30 to the unloading unit 40 X axis It is installed to move along the direction.

Meanwhile, an X-axis guide frame 50 is installed in the middle portion of the main body 10 so as to extend in the X-axis direction, and the loading picker 51 and the insert picker 52 are inserted into the X-axis guide frame 50. picker), a pick picker 53 (removal picker), and a reject unloading picker 54 are installed to reciprocate horizontally along the X-axis direction by linear motion devices (not shown), respectively. Here, the loading picker 51, the insert picker 52 and the reject unloading picker 54 are installed to move along the front surface of the X-axis guide frame 50, and the remove picker 53 is X It is installed to move along the rear surface of the shaft guide frame 50. Therefore, a predetermined distance is formed between the insert picker 52 and the remove picker 53 in the Y-axis direction. Each of the pickers is provided with ten adsorption nozzles for vacuum adsorption of ten semiconductor packages at a time, but the number may vary as necessary.

The loading picker 51, the insert picker 52, the remove picker 53, and the reject unloading picker 54 have a variable pitch in which the pitches of the respective adsorption nozzles can be changed to the pitch of the tray and the pitch of the burn-in board. Picker.

In addition, a DC test unit 61 is installed below the X-axis guide frame 50, that is, the semiconductor packages conveyed from the loading unit 30 are DC-tested under the moving path of the loading picker 51. do. The DC test unit 61 preferably has the same number of DC test sockets as the number of semiconductor packages (10 in this embodiment) that the loading pickers 51 can carry at a time, but is not limited thereto. It doesn't.

In addition, the burn-in reject buffer unit 63 temporarily storing the semiconductor packages determined as defective among the semiconductor packages extracted from the burn-in board B below the movement path of the reject unloading picker 54 is provided. Is installed.

Here, the burn-in reject buffer unit 63 is configured to move by a predetermined distance in the Y-axis direction to receive the semiconductor packages from the remove picker 53. The burn-in reject buffer portion 63 is formed at a position higher than a predetermined height upward from the base of the main body 10 so as not to interfere with the movement of the trays T of the unloading portion 40.

In addition, a DC reject buffer part 62 is provided at the front side of the movement path of the insert picker 52 to temporarily receive semiconductor packages that are determined to be defective by the DC test part 61. The DC reject buffer unit 62 is configured to be moved by a predetermined distance in the Y-axis direction so as to receive the semiconductor package from the insert picker 52.

The burn-in reject buffer section 63 and the DC reject buffer section 62 preferably have the same number of columns (10 in this embodiment) as the number of semiconductor packages that can be conveyed at one time by the picker, but not necessarily It is not limited.

Meanwhile, a removal work position RP in which the burn-in test completed semiconductor package on the burn-in board B is drawn out by the remove picker 53 at the lower side of the X-axis guide frame 50 of the main body 10. Is placed, and the semiconductor package to be newly tested by the insert picker 52 is mounted at an empty position on the burn-in board at a position spaced a predetermined distance away from the removing operation position RP in the Y-axis direction. The working position IP is arranged.

The removing working position RP is disposed below the moving path of the remove picker 53, and the insert working position IP is disposed below the moving path of the insert picker 52.

As shown in Figure 2a and 2b, the burn-in board (B) is provided with a clamping latch (L) for pressing and fixing the respective semiconductor packages on the burn-in board (B) from the upper side, the removal work position At the RP and the insert work position IP, the clamping latch actuates the clamping latch L when the remove picker 53 and the insert picker 52 remove and insert the semiconductor package from the burn-in board B. The unit 80 is configured to move in the Y direction synchronously with the burn-in board B and to move to the removing working position RP and the insert working position IP.

The clamping latch operating unit 80 presses the clamping latch L while the operating member 81 moves up and down to release the fixed state of the semiconductor package by the clamping latch L.

Of course, the clamping operation unit for operating the clamping latch L does not move between the removing working position RP and the insert working position IP, as shown in FIGS. 3A and 3B. The first clamping latch operating unit 80a and the second clamping latch operating unit 80b are fixedly installed in the moving working position RP and the insert working position IP, respectively, and according to the position of the burn-in board B, The clamping latch L may be operated by selectively operating the two clamping latch operating units 80a and 80b.

The burn-in test sorting handler according to the first embodiment configured as described above operates as follows.

Burn-in tester (Burn-in Tester) after the burn-in test (B) is loaded in the rack 20, the sorting handler is activated, the burn-in board carrier robot (not shown) burn-in from the rack 20 One of the boards B is withdrawn and seated on a burn-in board stage (not shown).

In the unloading part 40, the empty trays T move forward from the rear to the lower side of the X-axis guide frame 50, and in the loading part 30, one tray T is moved from the front to the rear. Move to the lower side of the loading picker (51).

Subsequently, while the loading picker 51 moves along the X-axis guide frame 50, the test target semiconductor package stored in the tray T of the loading unit 30 is vacuum-adsorbed and then transferred to the DC test unit 61. To the DC test socket. While the DC test of the semiconductor packages is performed in the DC test unit 61, the loading picker 51 returns to the loading unit 30 to absorb the new semiconductor package and return it to the DC test unit 61.

The insert picker 52 moves to the upper side of the DC test unit 61 to vacuum-absorb the semiconductor packages on which the DC test is completed, and moves to the insert work position IP to stand by.

Meanwhile, while the loading picker 51 and the insert picker 52 perform the work as described above, the remove picker 53 moves to the removing work position RP along the X-axis guide frame 50. Sort it. Then, the clamping latch operating unit 80 (see FIG. 2A) is operated to release the clamping latch L on the burn-in board B, and at the same time, the remove picker 53 descends to burn-in board B. Burn-in of the tested semiconductor packages are picked up and raised.

When the remove picker 53 removes the semiconductor package of the burn-in board B as described above, the burn-in board stage (not shown) moves the burn-in board B by a predetermined pitch in the Y-axis direction to burn the board B. The empty space from which the semiconductor packages are removed is positioned below the insert working position IP. At this time, the clamping latch operating unit 80 (see FIG. 2B) moves synchronously with the burn-in board B in a state in which the clamping latch L of the burn-in board B is released, that is, in an open state. do.

Subsequently, the insert picker 52 waiting on the upper side of the insert work position IP descends, fills up the new semiconductor packages in the empty positions of the burn-in board B, ascends, and then moves back to the DC test unit 61. . The burn-in board stage (not shown) moves the burn-in board so that the next semiconductor packages to be withdrawn are aligned at the removing operation position RP.

Meanwhile, the remove picker 53, which absorbs the burned-in test semiconductor packages from the burn-in board B, moves to the unloading unit 40 to store the semiconductor packages, which are determined to be good, in the tray of the good unloading unit 41. Let's do it.

At this time, if any of the semiconductor packages picked up by the remove picker 53 is determined to be a defective product, the burn-in reject buffer unit 63 moves in the Y-axis direction to move the movement path of the remove picker 53. Aligned to the lower side, the remove picker 53 puts only the semiconductor package, which is determined as a burn-in test failure, to the burn-in reject buffer unit 63.

In addition, while the insert picker 52 performs the operation of transporting the semiconductor packages from the DC test unit 61 to the insert work position IP, the defective DC pick-up of the semiconductor packages picked up by the insert picker 52 is defective. If there is a determination, the DC reject buffer 62 moves in the Y-axis direction and is aligned below the insert picker 52, and the insert picker 52 only the semiconductor package determined as DC defective is the DC reject buffer. Lower to part 62. Then, when returning to the initial position of the DC reject buffer unit 62, the insert picker 52 inserts the ones determined as good or good as a result of the DC test at the insert work position IP into the empty positions of the burn-in board B. .

Meanwhile, the reject unloading picker 54 moves along the X-axis guide frame 50 to unload the defective semiconductor package of the burn-in reject buffer 63 and the DC reject buffer 62. The burn-in rejects 42 and 43 of the 40 or the trays of the DC-rejector 44 are transported and accommodated. At this time, except for a special case, the probability that a defective semiconductor package is generated in one burn-in board is It is about 5%, and the probability of DC test failure among the semiconductor packages to be filled on one burn-in board is about 3%. Withdraw the burn-in-tested semiconductor package from one burn-in board and fill the new semiconductor package. During the operation, the probability that the defective semiconductor packages are completely filled in the burn-in reject buffer 63 and the DC reject buffer 62 is minimal.

Therefore, the reject unloading picker 54 waits after the replacement of the semiconductor package for one burn-in board B is completed, and then stores the burn-in board B after the replacement is completed in the rack 20. During the rack changing time of taking out the new burn-in board B and returning it to the working position, it is desirable to be programmed to perform the operation of conveying the defective semiconductor packages.

Of course, even if the operation sequence of the reject unloading picker 54 is programmed in this way, for example, when all the burn-in test defective semiconductor packages are filled in the burn-in reject buffer unit 63, the burn-in board B is used. Even during the semiconductor package replacement operation, the reject unloading picker 54 will be controlled to perform the operation of conveying the defective semiconductor package.

On the other hand, during the operation of replacing the semiconductor package on the burn-in board (B), if all the semiconductor packages are pulled out from one tray (T) of the loading unit 30, the empty tray (T) to the rear of the main body 10 Move. And the tray conveyance apparatus 35 picks up the said empty tray T, conveys it to the back of any one of the unloading parts 40, for example, the goods unloading part 41, and the goods unloading part 41 ) To recycle the tested semiconductor package to a tray.

As described above, in the sorting handler of the present invention, the loading picker 51 is the loading unit 30 from the DC test unit 61, and the insert picker 52 is inserted from the DC test unit 61. ), The remove picker 53 is a non-loading part 41 from the removing operation position RP, and the reject unloading picker 54 is a burn-in reject buffer 63 and a DC reject buffer part. A new semiconductor package is removed from the burn-in board (B) by removing the burn-in-tested semiconductor package from the burn-in board (B) while repeatedly moving in sequence from the 62 to the burn-in reject sections 42 and 43 and the DC reject section 44, respectively. Fill in the empty place on the burn-in board (B).

When performing this process, if the remove picker 53 withdraws the burn-in board (B) at the removing operation position (RP), the burn-in board (B) moves in the Y-axis direction, the insert picker (52) Waits at the insert work position (IP) and descends to fill the semiconductor package in the empty space of the burn-in board (B). Accordingly, the sorting handler of the present invention has an index time compared to the conventional one because the insert picker 52 can insert the semiconductor package into the burn-in board even if the remove picker 53 does not completely leave the removing work position RP. ) Can greatly benefit.

Figure 4 shows a second embodiment of the burn-in test sorting handler according to the present invention. The sorting handler of this embodiment has a basic configuration substantially similar to the sorting handler of the first embodiment described above. However, in the sorting handler of the second embodiment, the DC reject unit 144 constituting the unloading unit 140 is configured on one side of the loading unit 130, and the other parts of the unloading unit 140 are good products. The loading unit 141 and the two burn-in reject units 142 and 143 are configured on the opposite side of the loading unit 130 as in the first embodiment. Reference numeral 110 is a main body, 120 is a rack.

In addition, the loading picker 151 and the insert picker 152 are alternately disposed on one front and rear surfaces of the X-axis guide frame 150, respectively, and the other front and rear surfaces of the other X-axis guide frame 150. The remove picker 153 and the unloading picker 154 are arranged. Unlike the reject unloading picker 154 (see FIG. 1) of the first embodiment described above, the unloading picker 154 does not carry only a defective semiconductor package and returns all good and defective goods withdrawn from the burn-in board B. The unloading unit 141 and the two burn-in reject units 142 and 143 are carried out.

In addition, the DC test unit 161 is disposed below the moving path of the loading picker 151, and the DC reject buffer unit 162 is disposed behind the DC test unit 161. The unloading buffer unit 163 is disposed below the movement path of the remove picker 153.

The DC test unit 161 is configured to be movable in the Y-axis direction to a position below the movement path of the insert picker 152. In addition, the DC reject buffer unit 162 is also configured to be movable in the Y-axis direction.

The DC reject buffer unit 162 is composed of two columns, one column of which is a supplementary package accommodating unit for accommodating semiconductor packages which are determined to be a good result of a DC test among the semiconductor packages initially tested by the DC test unit 161. 162a, and the other row is composed of a DC reject accommodating portion 162b in which semiconductor packages determined as defective by the DC test are accommodated.

In addition, the unloading buffer unit 163 accommodates all good and defective semiconductor packages separated from the burn-in board B by the remove picker 153, and is located at a position below the moving path of the remove picker 153. The unloading picker 154 is configured to reciprocate in the Y-axis direction to a position below the movement path.

Meanwhile, the removing work position RP for removing the semiconductor package from the burner pick-up board 153 is disposed under the moving path of the remove picker 153, and the insert picker 152 is burn-in board. The insert work position IP for inserting the semiconductor package into (B) is disposed below the movement path of the insert picker 152. That is, the sorting handler of the second embodiment also has the distance between the remove picker 153 and the insert picker 152 in the Y-axis direction, in the same manner as in the sorting handler of the first embodiment. Spaced apart by.

The sorting handler of the second embodiment thus configured operates as follows.

The loading picker 151 transfers the test target semiconductor packages of the loading unit 130 to the DC test unit 161 while moving along the X-axis guide frame 150, and then moves to the loading unit 130 again. Carry out new semiconductor packages. When the DC test is completed in the DC test unit 161, the DC test unit 161 moves in the Y-axis direction and is aligned with the movement path of the insert picker 152, and the insert picker 152 is the DC test unit ( The semiconductor packages of 161 are picked up, moved to the insert work position IP, and wait.

While the loading picker 151 and the insert picker 152 are working, the remove picker 153 moves to the upper side of the removing work position RP, aligns it, and descends from this position to remove the working position. The burn-in test of the burn-in board B aligned with (RP) is picked up and raised.

Subsequently, the burn-in board stage (not shown) moves a predetermined pitch in the Y-axis direction so that the semiconductor package of the burn-in board B is taken out and the empty seat is moved below the insert work position IP. At this time, the insert picker 152 is lowered to fill the empty semiconductor of the burn-in board (B) the new semiconductor package is completed the DC test.

The remove picker 153 withdrawing the burned-in tested semiconductor packages moves in the X-axis direction to align the unloading buffer unit 163, and lowers the burn-in tested semiconductor packages to unload the buffered unit ( 163). Subsequently, the unloading buffer unit 163 moves in the Y-axis direction to align with the lower side of the unloading picker 154, and the unloading picker 154 descends to pick up the semiconductor packages on the unloading buffer unit 163. Then rises. Then, while the unloading buffer unit 163 moves along the X-axis direction, the semiconductor packages determined to be good are stored in the tray of the good unloading unit 141, and the semiconductor packages determined to be defective are burn-in designated according to the bad grade. The trays of the reject sections 142 and 143 are accommodated.

On the other hand, when the insert picker 152 draws out and delivers the semiconductor packages from the DC test unit 161, the supplementary packages of the good quality semiconductor packages separated from the first DC test unit 161 are filled in the DC reject buffer unit 162. It is accommodated in the accommodating part 162a.

When the DC defective semiconductor package is generated in the DC test unit 161 during the operation of the insert picker 152, the insert picker 152 may include the DC reject accommodating part 162b of the DC reject buffer part 162. The defective semiconductor package is put down, and a new DC good quality semiconductor package is immediately picked up from the supplemental package accommodating part 162a and moved to the insert work position IP. In this configuration, when the DC failure occurs, the insert picker 152 can insert the semiconductor package in all the empty positions of the burn-in board B without inserting the semiconductor package with the empty position on the burn-in board B. This eliminates the need for a double DC test, which further improves work efficiency.

Meanwhile, the defective semiconductor packages stored in the DC reject receiving portion 162b of the DC reject buffer portion 162 may have a loading picker (a rack picking time or a loading picker during an idle time of the loading picker 151 during a semiconductor package replacement operation). 151 is conveyed to the DC rejecting unit 144 and stored in the tray.

5 shows a third embodiment of the burn-in test sorting handler according to the present invention. The sorting handler of this third embodiment is the same as the sorting handler of the second embodiment. The ejection unit 244 is disposed, and a non-defective article unloading unit 241 and two burn-in reject units 242 and 243 are disposed on one side opposite to the main body 210.

The first loading picker 251, the first insert picker 252, and the second remove picker 257 are installed on the front surface of the X-axis guide frame 250 to be movable in the X-axis direction. The second loading picker 255, the second insert picker 256, and the first remove picker 253 are installed on the rear surface of the guide frame 250 so as to be movable in the X-axis direction, respectively.

The DC test unit 261 is installed at the lower side of the X-axis guide frame 250 to move in the Y-axis direction to the lower position of the movement paths of the first and second loading pickers 251 and 255. In addition, the DC reject buffer unit 262 is installed at the rear of the DC test unit 261 to be movable in the Y-axis direction.

The DC reject buffer unit 262 is a supplementary package accommodating part 262a for accommodating initially produced DC good quality semiconductor packages and a DC reject accommodating part 262b for accommodating DC defective semiconductor packages as in the above-described second embodiment. It consists of two rows of).

First and second moving / insert working positions RIP1 and RIP2 are disposed below the movement paths of the first and second insert pickers 252 and 256 and the first and second move pickers 253 and 257, respectively.

The sorting handler of the third embodiment thus made operates as follows.

First, the second loading picker 255 transfers the test target semiconductor packages of the loading unit 230 to the DC test unit 261 while moving along the X-axis guide frame 250, and then the loading unit 230 again. Go to. At this time, the first loading picker 251 picks up the semiconductor packages from the loading unit 230 and moves to the DC test unit 261.

When the DC test is completed in the DC test unit 261, the second insert picker 256 picks up the semiconductor packages of the DC test unit 261. Then, the DC reject buffer unit 262 is moved in the Y-axis direction so that the supplementary package accommodating unit 262a is aligned with the lower side of the second insert picker 256. The second insert picker 256 accommodates the semiconductor packages, which are determined to be good, as a result of the DC test, in the supplementary package accommodating part 262a of the DC reject buffer part 262. The DC reject buffer 262 in which the good semiconductor package is accommodated in the supplementary package accommodating part 262a moves in the Y-axis direction and returns to the initial position.

Subsequently, the DC test unit 261 moves in the Y-axis direction and is aligned with the movement path of the first loading picker 251, and the first loading picker 251 inserts the semiconductor packages into the DC test unit 261. Then move to the loading unit 230 again.

When the DC test is completed in the DC test unit 261, the first insert picker 252 picks up the semiconductor package of the DC test unit 261 and moves to the first removing / insert working position RIP1. At this time, the DC test unit 261 moves in the Y-axis direction to receive a new semiconductor package from the second loading picker 255.

On the other hand, while the first insert picker 252 picks up the semiconductor package and waits above the first removing / insert working position RIP1, the first removing picker 253 performs the second removing / inserting operation. It descends on the position RIP2 and picks up the burned-in tested semiconductor packages of the burn-in board B aligned with the second removing / insert working position RIP2 and then rises.

Then, the burn-in board B moves one step in the Y-axis direction so that the vacant position from which the semiconductor package is taken out is at the first moving / insert working position RIP1. At this time, the first insert picker 252 is lowered to fill the semiconductor package in the empty place of the burn-in board (B), and moves to the DC test unit 261 position for the next operation. In the meantime, the first remove picker 253 conveys the semiconductor package to the good quality unloading unit 241 or the burn-in reject unit 242, 243 to be stored in the tray. As a result, a series of semiconductor package exchanging operations leading to the first loading picker 251, the first insert picker 252, and the first remove picker 253 are completed.

As described above, after the first insert picker 252 inserts the semiconductor package into the burn-in board B, the second insert picker 256 picks up the semiconductor package from the DC test unit 261 and performs a second removal / Moving to the insert work position RIP2 and waiting, the burn-in board stage (not shown) allows the semiconductor packages to be pulled out of the burn-in board to be aligned with the first removing / insert work position RIP1. The second remove picker 257 moves to the first removing / inserting work position RIP1 to draw out the semiconductor package.

When the second remove picker 257 withdraws the semiconductor package from the first removing / inserting work position RIP1, the burn-in board B moves one step in the Y-axis direction so that the empty space after the semiconductor package is withdrawn is removed. The second removing / insert work position RIP2 is aligned, and the second insert picker 256 fills the semiconductor package in the empty position of the burn-in board B. FIG.

As described above, the first and second loading pickers 251 and 255, the first and second insert pickers 252 and 256, and the first and second remove pickers 253 and 257 repeatedly move along a given path. The operation of drawing out and inserting the semiconductor package into the burn-in board B from the first and second moving / insert working positions RIP1 and RIP2 is alternately performed. In this process, the burn-in board B repeatedly moves the first and second moving / inserting work positions RIP1 and RIP2 so that the pickers draw and insert the semiconductor package with a minimum index time. do.

Meanwhile, the defective semiconductor packages stored in the DC reject receiving portion 262b of the DC reject buffer portion 262 are loaded pickers 251 during the rack changing time or during the idle time of the loading picker 251 during the semiconductor package replacement operation. ) Is conveyed to the DC rejecting unit 244 and stored in the tray.

Figure 6 shows a fourth embodiment of the burn-in test sorting handler according to the present invention, the sorting handler of this fourth embodiment is the same as the sorting handler of the second embodiment DC reject unit 344 constituting the unloading unit 340 ) Is configured in the immediate vicinity of the loading unit 330, the other parts of the unloading unit 340, the good quality unloading unit 341 and the two burn-in rejects (342, 343) of the loading unit 330 It is configured on one side of the other side.

The loading picker 351, the insert picker 352, and the unloading picker 354 are installed on the front surface of the X-axis guide frame 350 so as to move in the X-axis direction. The rear picker 353 is installed on the rear surface to move in the X-axis direction.

The DC test unit 361 is disposed below the movement path of the loading picker 351, and the semiconductor packages extracted from the burn-in board B are temporarily stored below the movement path of the unloading picker 354. The unloading buffer part 363 is disposed. Here, the burn-in reject buffer 363 is configured to move by a predetermined distance in the Y-axis direction to receive the semiconductor packages from the remove picker 353.

In addition, a DC reject buffer part 362 is disposed immediately behind the DC test part 361, where the DC reject buffer part 362 is a DC article initially generated as in the above-described second embodiment. The supplementary package accommodating part 362a accommodating the semiconductor packages and the DC reject accommodating part 362b accommodating the DC defective semiconductor packages are formed in two rows.

The DC reject buffer part 362 is configured to reciprocate horizontally to a lower position of the insert picker 352 to receive the DC-tested semiconductor packages from the insert picker 352.

Meanwhile, the removal work position RP for removing the semiconductor package from the burn picker 353 to the burn-in board B is disposed below the movement path of the remove picker 353, and the insert picker 352 is burned-in. The insert work position IP for inserting the semiconductor package into the board B is disposed below the movement path of the insert picker 352.

The burn-in test sorting handler of the fourth embodiment configured as described above operates as follows.

When the loading picker 351 transfers the test target semiconductor packages of the loading unit 330 to the DC test unit 361, the DC test unit 361 performs a DC test. When the DC test is completed, the insert picker 352 waits on the upper side of the DC test unit 361, picks up the DC-tested semiconductor packages, moves to the insert work position IP, and waits at this position.

While the loading picker 351 and the insert picker 352 perform the above operation, the remove picker 353 moves and aligns to the upper side of the removing operation position RP, and descends from the position. The burn-in-tested semiconductor packages of the burn-in board B aligned with the removing operation position RP are picked up and raised.

Subsequently, the burn-in board stage (not shown) moves forward by a predetermined pitch in the Y-axis direction so that the semiconductor package of the burn-in board B is drawn out and the empty seat is positioned below the insert work position IP. At this time, the insert picker 352 descends and fills the empty semiconductor of the burn-in board B with the new semiconductor package that has been DC-tested.

Meanwhile, the remove picker 353 having the burn-in-tested semiconductor packages taken out is moved in the X-axis direction and moved in the Y-axis direction so that the unloading buffer unit aligns below the moving path of the remove picker 353. 363), the burn-in tested all semiconductor packages are put down and then moved back to the removal working position (RP). At this time, the unloading buffer part 363 moves in the Y-axis direction and returns to the lower side of the movement path of the unloading picker 354.

Then, the unloading picker 354 picks up the semiconductor packages on the unloading buffer part 363, stores the semiconductor packages determined as good in the tray of the good unloading part 341, and determines that the semiconductor package is defective. They are stored in the tray of the burn-in reject portion 342, 343 specified according to the failure grade.

Meanwhile, similarly to the second embodiment, when the insert picker 352 draws and transports the semiconductor packages from the DC test unit 361, the good semiconductor packages separated from the DC test unit 361 are DC rejected. It is stored in the supplementary package accommodating part 362a of the buffer part 362.

Then, when a DC defective semiconductor package occurs in the DC test unit 361 during the operation of the insert picker 352, the insert picker 352 causes the DC reject accommodating part 362b of the DC reject buffer part 362. The defective semiconductor package is put down, and a new DC good quality semiconductor package is immediately picked up from the supplemental package accommodating part 362a and moved to the insert working position IP.

The defective semiconductor packages stored in the DC reject accommodating part 362b of the DC reject buffer part 362 are transferred to the loading picker 351 during the rack changing time or during the idle time of the loading picker 351 during the semiconductor package replacement operation. By this, it is conveyed to the DC reject part 344, and is accommodated in a tray.

On the other hand, in the operation example of the sorting handler of the fourth embodiment described above, a defective semiconductor package is also stored in the unloading buffer unit 363 together with the good product, and then the unloading picker 354 is provided with all of the unloading buffer unit 363. The good and bad semiconductor packages are selectively stored in the good unloading unit 341 or the burn-in rejecting units 342 and 343 for each test result. That is, this operation example illustrates that the unloading picker 354 is responsible for classifying and storing the burn-in tested semiconductor packages in the good quality unloading unit 341 and the burn-in reject units 342 and 343.

However, the move picker 353 and the unloading picker 354 divide the burn-in-tested semiconductor packages into the good quality unloading part 341 and the burn-in rejecting parts 342 and 343. You may be able to. That is, the remove picker 353 accommodates only semiconductor packages that are determined to be defective in the unloading buffer part 363, and those that are determined to be good are stored directly in the tray of the good unloading part 341, and unloading. The picker 354 may be configured to store defective semiconductor packages stored in the unloading buffer unit 363 in the burn-in reject units 342 and 343 according to a defective grade.

As described above, according to the present invention, the burn-in test sorting handler has a removal work position for extracting the semiconductor package and an insert work position for inserting the semiconductor package at a predetermined distance away from the Y-axis direction. Immediately after removing the burn-in-tested semiconductor package from the burn-in board, the insert picker can insert a new semiconductor package into an empty spot on the burn-in board.

Accordingly, the time taken to separate the semiconductor package from the burn-in board and insert the new semiconductor package, that is, the index time can be reduced, and the waiting time of the insert picker can be minimized to eliminate the bottleneck. Therefore, there is an effect that can increase the production amount (UPH) per unit time.

Claims (25)

A main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; An insert picker installed on the upper part of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested and mounting them in an empty position of the burn-in board; A remove picker installed to move in the X-axis direction parallel to the insert picker at a position spaced a predetermined distance from the insert picker in a Y-axis direction, and to carry out and transport the burned-in tested semiconductor packages from the burn-in board; A removing work position disposed on the main body under the moving path of the remove picker and performing a work of drawing out the burn-in-tested semiconductor package on the burn-in board by the remove picker; The main body is spaced apart in the Y-axis direction from the removing operation position in a lower side of the insert picker on a moving path, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. Burn-in test sorting handler configured with an insert working position. The electronic device of claim 1, further comprising: a DC test unit configured to perform an electrical performance test by connecting a semiconductor package to be tested returned from the loading unit; A loading picker which picks up a semiconductor package from the loading unit and mounts the semiconductor package to the DC test unit; And a DC reject buffer unit configured to temporarily receive semiconductor packages that are determined to be defective as a result of the DC test in the DC test unit. The burn-in test sorting handler according to claim 1, wherein the insert picker and the remove picker are respectively installed on both sides of one X-axis guide frame installed to cross the upper side of the main body in the X-axis direction. According to claim 2, wherein the insert picker and the remove picker are respectively installed on both sides of one X-axis guide frame which is installed to cross the upper side of the main body in the X-axis direction, the loading picker of the X-axis guide frame Burn-in test sorting handler, characterized in that installed on either side. The DC reject receiving unit of claim 2, wherein the DC reject buffer unit includes a supplementary package accommodating unit accommodating a plurality of semiconductor packages determined as a good DC test result, and a DC reject accommodating unit accommodating semiconductor packages determined as a poor DC test result. The burn-in test sorting handler comprising two rows, wherein the supplementary package accommodating part and the DC reject accommodating part are installed to be movable in the Y-axis direction. The semiconductor device of claim 1, further comprising: a burn-in reject buffer unit configured to temporarily receive semiconductor packages which are determined to be defective in a semiconductor package separated from the burn-in board by the remove picker; And a reject unloading picker which conveys the semiconductor package of the burn-in reject buffer unit to the unloading unit and stores the semiconductor package in the tray for receiving the defective product. The burn-in buffer unit of claim 1 or 2, further comprising: a burn-in buffer unit to temporarily receive semiconductor packages separated from the burn-in board by the remove picker; And a unloading picker which transfers the semiconductor package of the burn-in buffer unit to the unloading unit and stores the semiconductor package in a tray for each test result. According to claim 1, wherein each of the burn-in boards are provided with a clamping latch for releasably fixing the semiconductor package seated on the burn-in board, the clamping latches of the burn-in board at each of the removal work position and the insert work position Burn-in test sorting handler, characterized in that the first clamping latch operating unit and the second clamping latch operating unit is fixedly installed. 2. The clamping latch of claim 1, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing semiconductor packages mounted on the burn-in board, and the clamping latches of the burn-in board are operated at the removing work position or the insert work position. Burn-in test sorting handler, characterized in that the clamping latch operating unit is installed to reciprocate horizontally by a predetermined distance in the Y-axis direction synchronously with the burn-in board. A main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit configured to perform an electrical performance test by connecting a semiconductor package to be tested returned from the loading unit; A DC reject buffer unit which temporarily receives semiconductor packages which are determined to be defective by the DC test unit; A loading picker installed on the main body to move in the X-axis direction and picking up the semiconductor package from the loading unit and mounting the semiconductor package to the DC test unit; An insert picker installed at an upper portion of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested by the DC test unit and mounting them in an empty position of the burn-in board; A remove picker installed to move in the X-axis direction parallel to the insert picker at a position spaced a predetermined distance from the insert picker in a Y-axis direction, for removing the burn-in test-completed semiconductor packages from the burn-in board and conveying them to the unloading unit; A burn-in reject buffer unit for temporarily receiving semiconductor packages, which are determined to be defective, among the semiconductor packages separated from the burn-in board by the remove picker; A reject unloading picker which transfers the semiconductor packages of the DC reject buffer unit and the burn-in reject buffer unit to the unloading unit and stores the semiconductor packages in a tray for receiving defective products; A removal work position disposed on the main body under the moving path of the remove picker so that the burn-in-tested semiconductor package on the burn-in board is taken out by the remove picker; The main body is spaced a predetermined distance from the removing operation position in the Y-axis direction and disposed below the moving path of the insert picker, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. Burn-in test sorting handler configured with an insert working position. The apparatus of claim 10, wherein the loading picker, the insert picker, and the reject unloading picker are installed on a first surface of the X-axis guide frame which is installed to cross the upper side of the main body in the X-axis direction. Burn-in test sorting handler, characterized in that installed on the second surface opposite the first surface of the X-axis guide frame. The DC reject receiving unit of claim 10, wherein the DC reject buffer unit includes a replenishment package accommodating part for accommodating a plurality of semiconductor packages determined as a good DC test result, and a DC reject accommodating part for accommodating semiconductor packages determined as a poor DC test result. The burn-in test sorting handler comprising two rows, wherein the supplementary package accommodating part and the DC reject accommodating part are installed to be movable in the Y-axis direction. The clamping latch of claim 10, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing the semiconductor packages seated on the burn-in board, and the clamping latches of the burn-in board are disposed at each of the removal work position and the insert work position. Burn-in test sorting handler, characterized in that the first clamping latch operating unit and the second clamping latch operating unit to be fixed to be installed. The clamping latch of claim 10, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing the semiconductor packages seated on the burn-in board, and the clamping latches of the burn-in board are operated at the removing work position or the insert work position. Burn-in test sorting handler, characterized in that the clamping latch operating unit is installed to reciprocate horizontally by a predetermined distance in the Y-axis direction synchronously with the burn-in board. A main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A DC reject unit disposed next to the loading unit and having a tray in which semiconductor packages, which are determined to be defective, are received; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit configured to perform an electrical performance test by connecting a semiconductor package to be tested returned from the loading unit; A DC reject buffer unit which temporarily receives semiconductor packages which are determined to be defective by the DC test unit; A burn-in buffer unit to temporarily receive semiconductor packages separated from the burn-in board; It is installed to move in the X-axis direction on the upper portion of the main body, pick up the semiconductor package from the loading unit to be mounted on the DC test unit, or pick up the DC defective semiconductor package from the DC reject buffer unit and transfer it to the DC reject unit A loading picker; An insert picker installed at an upper portion of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested by the DC test unit and mounting them in an empty position of the burn-in board; A remove picker installed to move in the X-axis direction parallel to the insert picker at a position spaced a predetermined distance from the insert picker in a Y-axis direction, for removing the burn-in test-completed semiconductor packages from the burn-in board and conveying them to the unloading unit; An unloading picker which transfers the semiconductor package of the burn-in buffer unit to the unloading unit and sorts and stores the semiconductor package according to a test result; A removal work position disposed on the main body under the moving path of the remove picker so that the burn-in-tested semiconductor package on the burn-in board is taken out by the remove picker; The main body is spaced apart in the Y-axis direction from the removing operation position in a lower side of the insert picker on a moving path, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. Burn-in test sorting handler configured with an insert working position. The DC reject receiving unit according to claim 15, wherein the DC reject buffer unit includes a replenishment package accommodating part accommodating a plurality of semiconductor packages determined as a good DC test result, and a DC reject accommodating part accommodating semiconductor packages determined as a poor DC test result. The burn-in test sorting handler comprising two rows, wherein the supplementary package accommodating part and the DC reject accommodating part are installed to be movable in the Y-axis direction. 16. The clamping latch of claim 15, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing the semiconductor packages seated on the burn-in board, and the clamping latches of the burn-in board are operated at each of the removal work position and the insert work position. Burn-in test sorting handler, characterized in that the first clamping latch operating unit and the second clamping latch operating unit is fixedly installed. 16. The clamping latch of claim 15, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing the semiconductor packages seated on the burn-in board, and the clamping latches of the burn-in board are operated at the removing work position or the insert work position. Burn-in test sorting handler, characterized in that the clamping latch operating unit is installed to reciprocate horizontally by a predetermined distance in the Y-axis direction synchronously with the burn-in board. A main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having trays containing semiconductor packages to be burn-in tested; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit connected to the semiconductor package to be tested transferred from the loading unit to perform an electrical performance test, the DC test unit being installed to reciprocate at a predetermined distance in the Y-axis direction; A DC reject buffer unit for temporarily receiving semiconductor packages determined to be defective as a result of a DC test in the DC test unit, and installed to reciprocate at a predetermined distance in the Y-axis direction; An X-axis guide frame installed to cross the upper portion of the main body in the X-axis direction; Installed on the first and second surfaces of the X-axis guide frame to move independently in the X-axis direction, the semiconductor package is picked up from the loading unit and mounted on the DC test unit, or the DC reject buffer unit is defective in DC. First and second loading pickers which pick up the semiconductor package and transfer the semiconductor package to the unloading unit; The first and second surfaces of the X-axis guide frame are installed to move independently in the X-axis direction, respectively, the first to pick up the semiconductor packages to be newly tested in the DC test unit to be mounted in the empty place of the burn-in board, 2 insert picker; First and second move pickers installed on the second and first surfaces of the X-axis guide frame to move independently in the X-axis direction, respectively, to carry out the burn-in-tested semiconductor packages to the unloading unit. Wow; The first and second insert pickers and the first and second remove pickers are disposed on the lower side of the moving path, respectively, and the burn-in-tested semiconductor packages on the burn-in board are drawn out by the first and second remove pickers. And first and second moving / inserting work positions in which the semiconductor packages to be newly tested by the first and second insert pickers are alternately mounted on empty positions on the burn-in board. The DC reject buffer unit of claim 19, wherein the DC reject buffer unit includes a replenishment package accommodating unit accommodating a plurality of semiconductor packages determined as a good DC test result, and a DC reject accommodating semiconductor packages determined as a DC test result defective. The burn-in test sorting handler comprising two rows of parts, wherein the supplementary package accommodating part and the DC reject accommodating part are installed to be movable in the Y-axis direction. 20. The clamping latch of claim 19, wherein each of the burn-in boards is provided with clamping latches for releasably fixing the semiconductor packages seated on the burn-in boards, and the clamping latches of the burn-in boards are respectively located at the first and second moving / insert working positions. Burn-in test sorting handler, characterized in that the first clamping latch operating unit and the second clamping latch operating unit for fixing the installed. 20. The clamping latch of claim 19, wherein each of the burn-in boards is provided with clamping latches for releasably fixing the semiconductor packages seated on the burn-in boards, and the clamping latches of the burn-in boards are disposed at the first and second moving / insert working positions. The sorting handler for burn-in test, characterized in that the clamping latch operating unit to be operated is installed to reciprocate horizontally by a predetermined distance in the Y-axis direction synchronously with the burn-in board. A main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed on the other side of the main body and having trays containing semiconductor packages to be burned-in; An unloading unit disposed at the other side of the main body and having trays for sorting and storing the burn-in tested semiconductor packages conveyed from the burn-in board by test results; A DC reject unit disposed next to the loading unit and having a tray in which semiconductor packages, which are determined to be defective, are received; A burn-in board stage for moving the burn-in board carried out from the rack to a desired position at the position where the semiconductor package is taken out and inserted; A DC test unit configured to perform an electrical performance test by connecting a semiconductor package to be tested returned from the loading unit; It consists of two rows of supplementary package accommodating part accommodating a plurality of semiconductor packages determined as good as a result of DC test, and a DC reject accommodating part accommodating semiconductor packages determined as defective as a result of DC test. A DC reject buffer unit installed to be movable in increments; A burn-in buffer unit to temporarily receive semiconductor packages separated from the burn-in board; It is installed to move in the X-axis direction on the upper portion of the main body, the semiconductor package is picked up from the loading unit and mounted on the DC test unit, the DC defective semiconductor package is picked up from the DC reject buffer unit and returned to the DC reject unit. A loading picker; An insert picker installed at the upper portion of the main body to move in the X-axis direction and picking up the semiconductor packages to be newly tested from the DC test unit and mounting them in an empty position of the burn-in board; It is installed to move in the X-axis direction in parallel with the insert picker at a position spaced apart from the insert picker in the Y-axis direction by a predetermined distance, and withdraw the burn-in tested semiconductor packages from the burn-in board selectively to the unloading unit or the burn-in buffer unit A return picker to return; An unloading picker which transfers the semiconductor package of the burn-in buffer unit to the unloading unit and sorts and stores the semiconductor package according to a test result; A removing work position disposed on the main body under the moving path of the remove picker and performing a work of drawing out the burn-in-tested semiconductor package on the burn-in board by the remove picker; The main body is spaced apart in the Y-axis direction from the removing operation position in a lower side of the insert picker on a moving path, and the semiconductor package to be newly tested by the insert picker is mounted at an empty position on the burn-in board. Burn-in test sorting handler configured with an insert working position. 24. The clamping latch of claim 23, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing the semiconductor packages seated on the burn-in board, and the clamping latches of the burn-in board are operated at each of the removal work position and the insert work position. Burn-in test sorting handler, characterized in that the first clamping latch operating unit and the second clamping latch operating unit is fixedly installed. 24. The clamping latch of claim 23, wherein each of the burn-in boards is provided with a clamping latch for releasably fixing the semiconductor packages seated on the burn-in board, and the clamping latches of the burn-in board are operated at the removing work position or the insert work position. Burn-in test sorting handler, characterized in that the clamping latch operating unit is installed to reciprocate horizontally by a predetermined distance in the Y-axis direction synchronously with the burn-in board.

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