KR102401058B1 - Sorting Apparatus for Semiconductor Device - Google Patents

Abstract

The present invention relates to a device handler, and more particularly, to a device handler for loading or unloading devices such as semiconductor chips on a burn-in board. The present invention, a loading unit on which the tray on which the first elements are loaded is loaded; an X-Y table for moving the burn-in board on which the first element is loaded in an empty position from which the second element is drawn out in the X-Y direction; a buffer unit in which the second element retrieved from the X-Y table is temporarily loaded; Disclosed is a device handler including an unloading unit in which a second device of good quality among the second devices loaded in the buffer unit is loaded on a tray.

Description

Device Handler {Sorting Apparatus for Semiconductor Device}

The present invention relates to a device handler, and more particularly, to a device handler for loading or unloading devices such as semiconductor chips on a burn-in board.

Semiconductor devices (hereinafter referred to as 'devices') undergo various tests such as electrical characteristics and reliability tests for heat and pressure after the packaging process is completed.

Among the tests for such semiconductor devices, there is a burn-in test. In the burn-in test, a number of devices are inserted into a burn-in board, the burn-in board is placed in a burn-in test device, and heat or pressure is applied for a certain period of time. This is a test to determine if a defect occurs in the back element.

The device handler for burn-in test sorts (unloads) devices into each tray according to the classification criteria given according to the inspection results for each device, such as good and defective products, from the burn-in board that normally loads the devices that have completed the burn-in test. It refers to a device that inserts (loads) a new device to perform burn-in test again in an empty spot (socket) of the burn-in board where it is located.

On the other hand, the performance of the device handler as described above is evaluated by the number of sorts per unit time (UPH: Units Per Hour), and the UPH depends on the time it takes for device transfer and burn-in board transfer between each component constituting the device handler. is decided

Therefore, in order to increase the UPH, which is the performance of the device handler, it is necessary to improve the structure and arrangement of each component.

As a device handler for increasing the UPH as described above, there are Korean Patent Registration Nos. 10-1133188 and 10-1177319, and the like.

However, in the conventional device handler, the type of device to be sorted, that is, the standard may be different. In this case, in the case of the loading part and the unloading part, if a tray corresponding to the standard is loaded, the DC test part, the socket press on the burn-in board, the moving buffer, etc. There is a problem in that the replacement work is cumbersome because the members in the device conforming to the device standard must be replaced one by one by the user's manual operation.

In particular, there is a problem that the operator may be injured due to a malfunction because the user must approach the inside of the device in which the heavy object is installed and work.

Meanwhile, among the devices to be tested, there is a so-called BGA device (BGA device) in which a plurality of balls are installed on a bottom surface instead of a lead protruding to the side as a terminal for coupling with an external terminal.

In addition, the inspection of the BGA device is generally performed by being inserted into a socket in which a plurality of contact pins, so-called pogo pins, are installed to correspond to the respective balls.

A test socket for such a BGA device is disclosed in Registered Utility Model No. 20-0463425.

In particular, the registered utility model No. 20-0463425 additionally includes an adapter installed on the test socket to guide the BGA device when loading, so that the alignment state between the contact pin and the ball terminal is always kept constant and the connection state is maintained. Since it can be kept constant, there is an effect that an accurate inspection of the device is made.

However, the adapter structure disclosed in Utility Model Registration No. 20-0463425 must have a lateral spacing between the side of the device and the adapter for stable loading of the device. Due to this lateral spacing, the alignment state between the contact pin and the ball terminal is There is a problem with blurring.

In addition, when the device is unloaded from the test socket, the device is caught on the adapter to stop the operation of the device, thereby reducing the efficiency of the inspection operation.

It is an object of the present invention to provide a device handler for stably loading or unloading devices such as semiconductor chips on a burn-in board.

The present invention has been created in order to achieve the object of the present invention as described above, the present invention, the first element is loaded with a loading unit on which the tray is loaded; an X-Y table for moving the burn-in board on which the first element is loaded in an empty position from which the second element is drawn out in the X-Y direction; a buffer unit in which the second element retrieved from the X-Y table is temporarily loaded; Disclosed is a device handler including an unloading unit in which a second device of good quality among the second devices loaded in the buffer unit is loaded on a tray.

The device handler according to the present invention has the advantage of stably and quickly loading or unloading the device.

In particular, it is desirable to minimize the error between the adapter member coupled to the socket press and the device for precise seating when loading the device into the test socket installed on the burn-in board, etc., but when the error between the adapter member and the device is minimized, There was a problem that interfered with device unloading, such as taking during loading.

Accordingly, in the device handler according to the present invention, stable loading or unloading of devices is possible and rapid device loading or unloading is possible by using an adapter member used for loading devices and an adapter member used for device unloading differently. There are possible advantages to this.

The device handler according to the present invention automatically adjusts the DC test unit, the socket press on the X-Y table, and the buffer unit according to the specifications of the device when the standard of the device to be sorted changes, that is, when a tray containing a device of a different standard is loaded. There is an advantage that the processing speed can be remarkably increased by shortening the replacement time of the DC test unit and the like by including the replacement kit replacement unit.

1 is a conceptual diagram showing an example of a device handler according to the present invention.
FIG. 2 is a plan view showing the configuration of the element handler of FIG. 1 .
FIG. 3 is a cross-sectional view showing the configuration of first and second transfer buffers of the device handler of FIG. 1 .
FIG. 4 is a layout view showing the movement process of the XY table and the burn-in board in the device handler of FIG. 1 .
5 is a conceptual diagram showing an exchange process of the burn-in board between the XY table and the burn-in board exchange buffer unit in the device handler of FIG. 1;
Figure 5a is a state before the first exchange of the burn-in board between the XY table and the burn-in board exchange buffer unit,
Figure 5b is a state after exchanging the burn-in board between the XY table and the burn-in board exchange buffer unit,
5c and 5d are diagrams showing an exchange process of the burn-in board between the XY table and the burn-in board exchange buffer unit.
6 is a conceptual diagram showing an exchange process of a burn-in board between a burn-in board exchange buffer unit and a board loader in the device handler of FIG. 1;
Figure 6a is a state before exchanging the burn-in board between the burn-in board exchange buffer unit and the board loader,
Figure 6b is an intermediate state in which the burn-in board is drawn into the rack of the board loader between the burn-in board exchange buffer unit and the board loader;
Figure 6c shows a state in which the burn-in board is drawn into the rack of the board loader between the burn-in board exchange buffer unit and the board loader;
6d is an intermediate state in which the burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader;
6E is a conceptual diagram showing a state in which the burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader.
7 is a side view showing the configuration of the board loader.
8A is a side cross-sectional view showing a burn-in board exchange buffer unit and a board loader having a modified configuration in the element handler of FIG. 1 .
Fig. 8b is a side view showing the board loader of Fig. 8a;
9 is a conceptual diagram illustrating a modified example of the device inspection apparatus of FIG. 2 .
FIG. 10 is a conceptual diagram illustrating an exchange process in the case where the exchange kit is a test unit in the device inspection apparatus of FIG. 2 .
11 is a partial plan view showing an exchange process of the exchange kit of FIG.
12 is a plan view showing a device handler according to a first modified embodiment of the present invention.
13 is a plan view illustrating a modified example of the element handler of FIG. 12 .
14 is a plan view showing a device handler according to a second modified embodiment of the present invention.
15A and 15B are partial plan views illustrating a transfer process of a first transfer tool and a second transfer tool among the element handlers of FIG. 14 .

Hereinafter, a device handler according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 and 2 , the device handler according to an embodiment of the present invention includes a plurality of loading units 100 , unloading units 200 , sorting units 300 , and a plurality of devices for transporting the devices 10 . It is configured to include the transfer tools (510, 520, 530, 540, 550, 560, 570).

The burn-in board 20 refers to a board on which the first elements 10 are loaded so that a burn-in test can be performed in a burn-in test device (not shown), and the element ( 10) each has sockets into which they are inserted.

The burn-in board 20 is mounted on the X-Y table 410 installed in the device handler, so that the second devices 10 that have completed the burn-in test are unloaded and the first devices 10 are loaded.

The X-Y table 410 loads the burn-in board 20 into which the second elements 10 are inserted and simultaneously unloads the burn-in board 20 into which the first elements 10 are inserted. As one configuration, as shown in FIGS. 1, 2 and 4 , the burn-in board 20 for exchanging the element 10 is supplied or the burn-in board 20 after the exchange of the element 10 is discharged. In order to do so, a burn-in board exchange device (not shown) is included.

In addition, in the X-Y table 410 , the first elements 10 may be inserted into the empty positions of the burn-in board 20 by the first transfer tool 530 , or the second elements 10 may be withdrawn from the burn-in board 20 . It is driven by an X-Y table driving unit (not shown) so as to move the burn-in board 20 .

The X-Y table driving unit includes a second transfer tool 540 and a first transfer tool so that the second transfer tool 540 and the first transfer tool 530 easily take out or load the elements 10 from the burn-in board 20 . Various configurations such as X-Y movement or X-Y-θ movement of the X-Y table 410 loaded with the burn-in board 20 in conjunction with the 530 are possible.

That is, the X-Y table driver interlocks with the second transfer tool 540 to withdraw the second elements 10 from the burn-in board 20 , and interworks with the first transfer tool 530 for the first element 10 . Move the X-Y table 410 so as to insert them into the vacant seat of the burn-in board 20, and when the insertion of the first elements 10 into the burn-in board 20 is completed, move the X-Y table 410 to the burn-in board replacement position. It can be configured to

On the other hand, the X-Y table 410 is installed on the main body 40 constituting the element handler according to the present invention, and the main body 40 includes the second transfer tool 540 and the first transfer tool 530 to the element 10 . It may include a top plate 42 formed with an opening 41 for taking out or loading the burn-in board 20 .

In addition, a socket press 45 for pressing the socket installed on the burn-in board 20 is installed on the upper side of the X-Y table 410 for the convenience of taking out and loading elements from the burn-in board 20 .

The socket press 45 enables the elements inserted into the socket of the burn-in board 20 to be pulled out or to be loaded, and various configurations are possible depending on the socket structure of the burn-in board 20 .

The loading unit 100 is a configuration for loading the trays 30 (hereinafter referred to as 'loading trays') on which a plurality of first elements 10 to be loaded on the burn-in board 20 are loaded, and various configurations are possible. Do.

In addition, the unloading unit 200 is configured to load and unload good elements (hereinafter referred to as 'good products') among the second elements 10 on the tray 30 (hereinafter referred to as 'unloading tray'). As such, various configurations are possible.

As shown in FIG. 2 , the loading unit 100 and the unloading unit 200 include a pair of guide rails 110 and 210 for guiding the tray 30 to be moved, respectively, and the tray 30 . It is generally configured to include a driving unit (not shown) for moving the .

In addition, the loading unit 100 and the unloading unit 200 can be arranged in various ways depending on the design conditions, but as shown in FIGS. 1 and 2 , the test unit 170 , the unloading unit 200 , and sorting The unit 300, the first transfer buffer 600, the second transfer buffer 700, etc. are generally arranged parallel to each other so as to be installed therebetween, but is not necessarily limited thereto.

Meanwhile, after the first elements 10 are withdrawn from the tray 30 in the loading unit 100, the empty trays 30 are unloaded so that the second elements 10 can be loaded by a tray transfer unit (not shown). may be transmitted to the unit 200 .

At this time, since the element 10 may remain in the tray 30 , the elements 10 remaining in the tray 30 are removed before the tray 30 is transferred from the loading unit 100 to the unloading unit 200 . In order to remove the tray 30, a tray rotating unit 150 for removing the remaining elements 10 by rotating the tray 30 may be additionally installed.

As shown in FIGS. 1 and 2, the tray rotating unit 150 is installed on the transport path of the tray 30 between the loading unit 100 and the unloading unit 200, and the loading unit ( It is configured to receive the tray 30 from 100 , rotate the tray 30 , and then transfer the tray 30 to the unloading unit 200 .

At this time, on one side of the tray rotating part 150 , in addition to the sorting part 300 , the empty tray 30 is supplied to the sorting part 300 , the unloading part 200 , or the empty tray 30 from the loading part 100 . An empty tray unit (not shown) that can be temporarily loaded may be additionally installed.

Meanwhile, the device handler according to the present invention supplies the first devices 10 from the loading units 100 before loading on the burn-in board 20 in order to load only the first device 10 of good quality on the burn-in board 20 . A test unit 170 for pre-testing electrical characteristics such as DC characteristics of the receiving device 10 may be additionally installed.

The test unit 170 is installed between the loading unit 100 and the first transfer buffer 600, and various configurations are possible, such as consisting of a plurality of sockets to which the first elements 10 can be electrically connected. , preferably the same number of sockets in the horizontal direction as the number of the tray 30 in the horizontal direction can be installed.

The test result for each first element 10 of the test unit 170 is used as data for sorting by the sorting unit 300 to be described later.

On the other hand, the device handler according to the present invention classifies the second defective elements 10 that need to be classified among the first defective elements 10 and the second elements 10 determined to be defective as a result of the test by the test unit 170. It may include a sorting unit 300 for loading.

The sorting unit 300 can be configured in various ways according to its arrangement and classification criteria, and the device 10 according to each classification criterion (Good, Bad 1 (Contact Reject), Bad 2 (DC Failure), etc.) It includes an appropriate number of trays 30 -sorting trays - on which is loaded, and has a configuration similar to that of the loading unit 100 described above, or is fixed to the body 40 as shown in FIGS. 1 and 2 . It may be disposed between the loading unit 100 and the unloading unit 200 in a state of being in the same state.

In addition, the sorting unit 300 is similar to the configuration of the loading unit 100 and the unloading unit 200, in addition to the fixed installation configuration as shown in FIGS. 1 and 2, respectively, the tray 30 can be moved. It may be configured to include a pair of guide rails for guiding and a driving unit (not shown) for moving the tray 30 .

The transfer tool includes a burn-in board 20, a loading unit 100, a test unit 170, an unloading unit 200, a sorting unit 300, a first moving buffer 600, a second moving buffer (to be described later) ( 700), and various configurations are possible according to the arrangement of each configuration as a configuration for transferring the elements 10 between them.

For example, the transfer tool includes a third transfer tool 510 for transferring the elements 10 between the loading unit 100 and the test unit 170 , the test unit 170 and the first transfer buffer 600 . A fourth transfer tool 520 for transferring the elements 10 therebetween, a fifth transfer tool 550 for transferring the elements 10 between the second transfer buffer 700 and the unloading unit 200, and the It may include one or more sorting tools 560 and 570 for transferring the elements 10 between the first transfer buffer 600 and the second transfer buffer 700 and the sorting unit 300 .

In addition, the transfer tools 510 , 520 , 530 , 540 , 550 , 560 , and 570 are elements loaded on the tray 30 of the loading unit 100 between the first transfer buffer 600 and the burn-in board 20 ( The second element 10 from the burn-in board 20 between the first transfer tool 530 and the burn-in board 20 and the second transfer buffer 700 to receive the 10) and insert it into the empty seat of the burn-in board 20 . ) may be configured to include a second transfer tool 540 for transferring them.

Meanwhile, the arrangement of the elements 10 loaded on the burn-in board 20 is different from the arrangement of the elements 10 loaded on the tray 30 such as the loading unit 100 , and the arrangement on the burn-in board 20 is relative. as many

Therefore, the first transfer tool 530 and the second transfer tool 540 for transferring or withdrawing the element 10 to the burn-in board 20 are configured to transfer a relatively large number of elements 10 compared to the other transfer tools. This is preferable. For example, the first transfer tool 530 and the second transfer tool 540 may be 12 × 2, and the remaining transfer tools may be 8 × 1, 8 × 2, or the like.

In the case of configuring the transfer tools as described above, use of a transfer tool for transferring a small number of elements 10 at positions requiring a relatively small number of transfers except for positions requiring transfer of a relatively large number of elements 10 This makes it possible to reduce the manufacturing cost of the device and at the same time improve the size and stability of the device.

Meanwhile, the first transfer tool 530 and the second transfer tool 540 may be configured to move integrally with each other in consideration that the loading and unloading of the elements 10 on the burn-in board 20 are alternately performed.

Since the third transfer tool 510 and the fourth transfer tool 520 also transfer the element 10 with the test unit 170 interposed therebetween, they may be configured to move integrally with each other.

In addition, the number of pickers in the horizontal direction of the first transfer tool 530 and the second transfer tool 540 is determined in the first transfer buffer 600 and the second transfer buffer 700 in consideration of the efficiency of the element 10 . (10) may be configured to be the same as the number of elements accommodating grooves (not shown) in the horizontal direction for loading.

The sorting tools 560 and 570 may be configured in various configurations, such as one or a plurality of sorting tools.

In particular, sorting tools 560 and 570 are shown in FIGS. 1, 2 and 9 in order to quickly sort the elements 10 to be classified as defective in the first and second transfer buffers 600 and 700. As shown, between the first sorting tool 560 for transferring the elements 10 between the first transfer buffer 600 and the sorting unit 300 , and the second transfer buffer 700 and the sorting unit 300 . The second sorting tool 570 for transferring the elements 10 may be configured.

The first sorting tool 560, while moving between the first moving buffer 600 and the sorting unit 300, was defective in the DC test unit 170 among the devices 10 contained in the first moving buffer 600. The element 10 can be transported while moving in the sorting tool moving area, such as loading the inspected element 10 on a tray designated as DC defective among the trays arranged in the sorting unit 300 .

On the other hand, the first sorting tool 560 is configured to move to the DC test unit 170 in addition to between the first transfer buffer 600 and the sorting unit 300, so that the DC test unit 170 is defective. The inspected device 10 may be directly loaded on a tray designated as DC defective among the trays disposed in the sorting unit 300 .

At this time, in consideration of the movement interference with the fourth transfer tool 520, the DC test unit 170 horizontally moves the element 10 inspected for failure to the lower side in the drawing, so that the first sorting tool 560 is 4 It is possible to transfer the element 10 without movement interference with the transfer tool 520 .

The second sorting tool 570 is a non-defective device among the devices 10 contained in the second transfer buffer 700 for transferring the elements 10 between the second transfer buffer 700 and the sorting unit 300 . Depending on the classification grade except for , the element 10 may be transported while moving in the sorting tool moving area, such as loading the element 10 on one or more trays installed in the sorting unit 300 .

As described above, when the sorting tools 560 and 570 are composed of the first sorting tool 560 and the second sorting tool 570, device classification can be performed more quickly.

On the other hand, when the element 10 is directly loaded on the tray of the sorting part 300 by the first sorting tool 560 and the second sorting tool 570 , any one of the trays of the sorting part 300 is When all elements of the corresponding classification grade are loaded on the tray, a case may occur in which element transfer of the first sorting tool 560 and the second sorting tool 570 is impossible.

Accordingly, the sorting unit 300 is provided with a buffer tray for temporary loading among the trays when all the elements of the corresponding classification grade are loaded in any one tray of the trays of the sorting unit 300, or a different classification grade. After temporarily loading the devices on the tray of , the tray loaded with all devices of the classification class may be configured to be replaced with a new tray, and then the temporarily loaded devices may be reloaded.

Meanwhile, the transfer tools may include one or more pickers each having a suction head for adsorbing the element 10 by vacuum pressure at their ends, and a picker transfer device for moving the pickers in the X-Z, Y-Z or X-Y-Z directions. .

In particular, the transfer tools may have pickers arranged in a line, or may be arranged in a double line such as 12×2.

Meanwhile, the device handler according to the present invention loads the first devices 10 from the loading unit 100 onto the burn-in board 20 or withdraws the second devices 10 from the burn-in board 20 to the unloading unit 200 . The first element 10 and the first element 10 and the second element are respectively installed between the loading unit 100 and the burn-in board 20 and between the burn-in board 20 and the unloading unit 200 so as to improve the loading and unloading speed. The two devices 10 may include first transfer buffers 600 and second transfer buffers 700 that are temporarily loaded and transferred.

The first transfer buffer 600 and the second transfer buffer 700 are movably installed on the main body 40 to exchange elements with the burn-in board 20 at an element exchange position ③, the loading unit 100 or unloading By moving the element exchange position ① for exchanging the element 200 with the element and the sorting position ② for exchanging the element 300 with the sorting unit 300, the element 10 can be exchanged smoothly without interruption, thereby significantly reducing the sorting operation speed. can be improved

The first transfer buffer 600 includes a loading position (element exchange position) ① for receiving and loading the first elements 10 from the test unit 170 by the second transfer tool 540, and a first defective element ( 10) to the sorting tray 30 of the sorting unit 300 by the sorting tools 560 and 570, the sorting position ②, and the remaining first elements 10 from which the first defective elements 10 are removed will be described later. It is configured to move to the loading position (element exchange position) ③ loaded on the burn-in board 20 of the X-Y table 410 by the third transfer tool 510.

As shown in FIG. 3 , the first moving buffers 600 include an element accommodating part 610 on which the elements 10 are loaded, and the element accommodating part 610 movably supporting the main body 40 . It is configured to include a guide member 620 and a moving device (not shown) for moving the element accommodating part 610 through the guide member 620 .

The element accommodating part 610 has the number of elements 10 in the tray 30 in the horizontal direction of the element accommodating groove for loading the element 10 so that a larger number of elements 10 can be loaded at the loading position ③. ) is better than the number of elements accommodating grooves in the horizontal direction for loading.

Here, the element accommodating part 610 is a configuration for loading the elements 10, and the elements 10 are directly loaded, or the size of the element accommodating groove may vary depending on the type of element 10 to be sorted. It may include a separate accommodating member 610a formed therein.

As shown in FIGS. 1 and 2 , the first transfer buffers 600 are preferably composed of three so that the process can be simultaneously performed at each position (①, ②, and ③). In this case, the guide member 620 is configured not to interfere with other guide members 620 during movement.

That is, as shown in FIG. 3 , the first moving buffers 600 are supported by a first guide member 621 and are horizontally moved by a first element accommodating part 611 and a second guide member 622 . It may be configured to include a second element accommodating part 612 supported and horizontally moved, and a third element accommodating part 613 supported by the third guide member 623 and horizontally moved.

The first to third guide members 621, 622, and 623 are configured to guide the respective element accommodating parts 611, 612, 613 to be horizontally moved, and various configurations are possible, as shown in FIG. As shown, the first guide member 621 is installed on the upper portion of the support member 640 installed in the main body 40 , that is, the second guide member 622 is the middle portion of the support member 640 , that is, the middle portion. is installed, and the third guide member 623 may be installed on the lower side of the support member 640 , that is, at the lower end or on the upper plate 42 of the main body 40 . Here, the first to third guide members 621 , 622 , and 623 may be configured in pairs to stably support the element accommodating part 620 .

On the other hand, the moving device 630 for horizontally moving the first to third guide members 621, 622, 623 can have various configurations according to the driving method, and the first to third guide members 621, 622, 623 It may include first to third moving devices 631, 632, and 633 for horizontally moving them, respectively. At this time, the first to third moving devices 631 , 632 , and 633 are a motor generating rotational force, respectively, and a belt coupled to the first to third guide members 621 , 622 , 623 , particularly a timing belt and a pulley It can be configured by a combination of

The operation of the first transfer buffer 600 having the above configuration will be described in detail as follows.

The first transfer buffers 600 are loaded at the loading position ①, in the loading process, that is, the first devices 10 from the test unit 170 are loaded into the device accommodating unit 610 . At this time, since the first devices 10 loaded into the device accommodating unit 610 include the first defective devices 10 determined to be defective by the test unit 170 , it is necessary to select them.

Accordingly, the first transfer buffers 600 move from the loading position ① to the sorting position ② in order to sort the first defective elements 10 after the loading of the elements 10 is completed.

When the first transfer buffer 600 is positioned at the sorting position ②, the first defective elements 10 are transferred from the element accommodating unit 610 to the sorting unit 300 by the first sorting process, that is, the transfer tool. At this time, each of the first defective elements 10 is loaded on the tray 30 of the sorting unit 300 according to the failure criteria.

Here, in the sorting position ②, in the place where the first defective elements 10 of the element accommodating unit 610 have been removed, the element determined as a good product as a result of the test by the test unit 170 (hereinafter referred to as 'first normal element') ( 10) may be filled with the first normal elements 10 from a preloaded first fixed buffer (not shown) - the buffering process.

On the other hand, the first fixed buffer is installed in the main body 40, and as a result of the test, the first normal elements 10 are loaded in advance, and when emptied for the first time or during operation, the first transfer buffer 600 is located at the sorting position ② The first normal devices 10 may be loaded in the device accommodating part 610 of the first transfer buffer 600 .

When all of the first sorting process in the first transfer buffer 600 is completed, it moves from the sorting position ② to the loading position ③. In addition, a loading process is performed in which the first normal elements 10 loaded in the first transfer buffer 600 are loaded onto the burn-in board 20 by a transfer tool.

Then, when the element accommodating part 610 of the first transfer buffer 600 is all empty, the loading process is performed again by moving from the loading position ③ to the loading position ① so that the first elements 10 can be loaded.

The second transfer buffer 700 has a configuration similar to that of the first transfer buffer 600, and receives the second elements 10 from the burn-in board 20 and loads them by the second transfer tool 540 at a loading position ( element exchange position) ③, the sorting position ② in which the second defective elements 10 are transferred to the tray 30-sorting tray- of the sorting unit 300 by the transfer tool, and the second defective elements 10 are removed It is configured to move repeatedly to the unloading position (element exchange position) ① in which the remaining second elements 10 are loaded onto the tray 30-unloading tray- by the fifth transfer tool 550 .

The second transfer buffer 700 having the above configuration has a configuration similar to that of the first transfer buffer 700, and as shown in FIG. 3 , the element accommodating part 710 in which the elements 10 are loaded; A guide member 720 for movably supporting the element accommodating part 710 on the main body 40, and a moving device 730 for horizontally moving the element accommodating part 710 through the guide member 720. do.

The element accommodating part 710 has a horizontal number of element accommodating grooves for loading the element 10 so that a greater number of elements 10 can be loaded at the loading position ③. ), it is better to have more than the number of element accommodating grooves in the horizontal direction for loading.

Here, the element accommodating part 710 is a configuration for loading the elements 10, and the elements 10 are directly loaded, or the size of the element accommodating groove may vary depending on the type of element 10 to be sorted. It may be composed of a separate accommodating member 610a formed therein.

As shown in FIGS. 1 to 2, the second transfer buffer 700 is preferably composed of three so that the process can be performed at each position (①, ②, and ③). At this time, the guide member 720 is configured not to interfere with other guide members 720 during movement.

* That is, as shown in FIG. 3 , the second transfer buffers 700 are supported by the first guide member 721 and are horizontally moved by the first element accommodating part 711 and the second guide member 722 . It may be configured to include a second element accommodating part 712 that is supported and horizontally moved, and a third element accommodating part 713 that is supported by the third guide member 723 and moves horizontally.

The first to third guide members 721, 722, and 723 are configured to guide the respective buffers 711, 712, and 713 to be horizontally moved, and various configurations are possible, as shown in FIG. , the first guide member 721 is installed on the upper part, that is, the upper end of the supporting member 740 installed in the body 40, and the second guide member 722 is the supporting member 740 of the first guide member 721. It is installed in the middle part, that is, the middle part, and the third guide member 723 may be installed in the lower part, that is, the lower part of the support member 740 , or on the upper plate 42 of the main body 40 . Here, the first to third guide members 721 , 722 , and 723 may be configured in pairs to stably support the element accommodating part 720 .

On the other hand, the moving device 730 for horizontally moving the first to third guide members 721, 722, 723 can have various configurations depending on the driving method, and the first to third guide members 721, 722, 723 It may include first to third moving devices (731, 732, 733) for horizontally moving, respectively. At this time, the first to third moving devices 731 , 732 , and 733 are a motor generating a rotational force, respectively, and a belt coupled to the first to third guide members 721 , 722 , 723 , in particular a timing belt and a pulley It can be configured by a combination of

The second transfer buffer 700 having the above configuration operates in a similar manner to the first transfer buffer 600, and in the loading position ③, the second elements 10 from the burn-in board 20 are placed in the element accommodating part ( 710), a second sorting process of transferring the second defective elements 10 to the sorting unit 300 at the sorting position ②, and unloading the remaining second elements 10 at the unloading position ① An unloading process of transferring to the tray 30 of the unit 200 is performed.

In the loading process, the same number of elements as the number of elements 10 loaded in the first transfer buffer 600, for example, elements arranged such as 12×2 are transferred at once.

In the second sorting process, the second defective elements 10 are transferred from the element accommodating unit 710 to the sorting unit 300 by the transfer tool. At this time, each of the second defective elements 10 is loaded on the tray 30 of the sorting unit 300 according to the failure criteria.

Here, in the sorting position ②, in the place where the second defective elements are removed from the element accommodating part 710, the second normal elements 10 are loaded from the second fixed buffer (not shown) in which the second normal elements 10 are pre-loaded. Can be filled-buffering process.

On the other hand, the second fixed buffer is installed in the main body 40, the second normal elements 10 are loaded in advance, and when emptied for the first time or during operation, the second transfer buffer 700 is located in the sorting position ② The second normal devices 10 may be loaded in the device accommodating part 710 of the buffer 700 .

5 is a conceptual diagram showing the exchange process of the burn-in board between the X-Y table and the burn-in board exchange buffer unit in the device handler of FIG. , FIG. 5B is a view showing the state after replacing the burn-in board between the X-Y table and the burn-in board exchange buffer part, and FIG. 6 is the process of replacing the burn-in board between the burn-in board exchange buffer part and the board loader in the element handler of FIG. As conceptual views showing, FIG. 6a is a state before the burn-in board is exchanged between the burn-in board exchange buffer unit and the board loader, and FIG. 6b is a burn-in board between the burn-in board exchange buffer unit and the board loader that is drawn into the rack of the board loader. 6c shows a state in which the burn-in board is inserted into the board loader rack between the burn-in board exchange buffer unit and the board loader, and FIG. 6d shows the burn-in board between the burn-in board exchange buffer unit and the board loader rack of the board loader 6E is a conceptual diagram showing the state in which the burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader, and FIG. 7 is a side view showing the configuration of the board loader.

On the other hand, when the exchange of the first element 10 and the second element 10 in the burn-in board 20 on the X-Y table 410 is completed, the X-Y table 410 is the board loader 800 and the second element 10 . Replace it with a new loaded burn-in board (20).

However, when the burn-in board 20 on the X-Y table 410 is replaced, the loading and unloading of the device 10 stops because the loading of the first device 10 and the unloading of the second device 10 are stopped. The burn-in board 20 on 410 is delayed by the replacement time.

Therefore, if the exchange time of the burn-in board 20 on the X-Y table 410 is shortened, the processing speed of the device handler, the so-called UPH, can be improved by that much. The burn-in board 20 and the burn-in board 20 on which the second elements 10 are loaded are alternately temporarily stored, and the burn-in board 20 in which the first element 10 of the X-Y table 410 is inserted is stored in a plurality of It further includes a burn-in board exchange buffer unit 420 for exchanging the burn-in board 20 with the second element 10 of the board loader 800 on which the burn-in boards 20 are loaded.

The burn-in board exchange buffer unit 420 is installed between the board loader 800 and the X-Y table 410 to mediate the burn-in board 20, and various configurations are possible depending on the design and design.

The burn-in board exchange buffer unit 420 may be installed on one side of the outermost end of the body 40, in particular, one of the moving areas of the X-Y table 410 or inside the board loader 800 according to the configuration of the device.

On the other hand, in order to shorten the exchange time of the burn-in board 20, the X-Y table 410 and the burn-in board exchange buffer unit 420 include the burn-in board 20 on which the first elements 10 are loaded and the second element ( 10) It is preferable to exchange the burn-in board 20 loaded with them at the same time.

And for the simultaneous exchange of the burn-in board 20, the X-Y table 410 includes a pair of burn-in board seating parts 411 on which the burn-in board 20 is mounted, and a pair of burn-in board seating parts 411. It may be configured to include a burn-in board lifting unit 412 for moving the burn-in board 10 seated on the burn-in board mounting unit 411 in at least one direction of the upper side and the lower side therebetween.

At this time, the burn-in board exchange buffer part 420 includes a pair of burn-in board buffer parts 421 in which the burn-in board 20 is seated up and down corresponding to the burn-in board seating part 411 of the X-Y table 410 . can be configured.

The burn-in board buffer unit 421 may have any configuration as long as the burn-in board 20 can be loaded, and does not interfere with the movement of the first finger unit 441 and the second finger unit 442, which will be described later. It is preferably configured not to.

Meanwhile, the transfer of the burn-in board 20 between the X-Y table 410 and the burn-in board exchange buffer part 420 is performed by a first finger part 441 and a second finger part as shown in FIGS. 5A to 5D. 442, the configuration and installation position of the first finger portion 441 and the second finger portion 442 may be variously configured according to the design and design.

The exchange process of the burn-in board 20 between the X-Y table 410 having the above configuration and the burn-in board exchange buffer unit 420 may take various forms depending on each configuration, an example of which is shown in the accompanying drawings. It is described in detail with reference to the following.

Initially, the X-Y table 410 receives the burn-in board 20 on which the second elements 10 are loaded from the burn-in board exchange buffer unit 420 as shown in FIGS. 5A and 5B . At this time, when the X-Y table 410 and the burn-in board exchange buffer unit 420 have a configuration in which the burn-in board 20 can be disposed up and down, the X-Y table 410 on either the upper side or the lower side is the burn-in board exchange buffer unit. The burn-in board 20 may be supplied from 420 , and in particular, as shown in FIGS. 6D and 6E , it is preferable to receive the burn-in board 20 from the upper side.

In the X-Y table 410 supplied with the burn-in board 20 on which the second elements 10 are loaded, the second element 10 can be unloaded and the first element 10 can be loaded through the opening 41 . is driven in the X-Y direction.

When the X-Y table 410 is moved for unloading of the second device 10 and loading of the first device 10, the burn-in board exchange buffer unit 420 moves from the board loader 800 to the second device 10. They are supplied with the loaded burn-in board 20 .

And when the unloading of the second device 10 and the loading of the first device 10 are completed, the burn-in board 20 on which the first device 10 is loaded is shown in FIG. 5C , the second device 10 ) moves toward the burn-in board exchange buffer unit 420 in order to receive the other loaded burn-in board 20 .

At this time, as the X-Y table 410 moves toward the burn-in board exchange buffer part 420, the burn-in board 20 on the X-Y table 410 is connected to the burn-in board exchange buffer part 420 as shown in FIG. 5c. (20) It moves downward by the burn-in board lifting unit 412 for exchange.

On the other hand, the X-Y table 410 moved toward the burn-in board exchange buffer part 420 is supplied with the burn-in board 20 located above the burn-in board exchange buffer part 420, as shown in FIG. 5D, at this time The burn-in board 20 located below the X-Y table 410 is moved to the burn-in board buffer unit 421 located below the burn-in board exchange buffer unit 420 .

And it is preferable that the exchange of the burn-in board 20 between the X-Y table 410 and the burn-in board exchange buffer unit 420 is performed simultaneously in order to shorten the exchange time.

Meanwhile, as shown in FIGS. 1 and 2 , the device handler according to the present invention includes a board loader 800 installed on one side to continuously receive the burn-in board 20 .

The board loader 800 loads and loads the burn-in boards 20 in which the second elements 20 are inserted, and sequentially loads the burn-in boards 20 in which the first elements 10 are inserted to perform a burn-in test. Various configurations are possible as a configuration for transferring, that is, a configuration for continuously exchanging the X-Y table 410 and the burn-in board 20 .

On the other hand, when the first elements 10 are loaded on all of the burn-in boards 20 of any one of the racks 50 , the rack 50 on which the first elements 10 are loaded is the second element to be unloaded. (10) is replaced with another rack (50) is loaded.

However, since the X-Y table 410 and the like have to wait until the rack 50 in the board loader 800 is replaced and a new burn-in board 20 is supplied, there is a problem in that the processing speed of the element handler is lowered. .

Accordingly, the board loader 800 of the device handler according to the present invention can exchange the rack 50 without affecting the loading and unloading of the device 10 on the burn-in board 20 as shown in FIG. 7 . A pair of rack loading units 810 and a pair of rack loading units arranged in the Y-axis direction of the X-Y table 410 so that the rack 50 on which a plurality of burn-in boards 20 are loaded is loaded in a plurality of stages. It is installed between the units 810 and withdraws the rack 50 from the rack loading unit 810 and may be configured to include an elevator unit 820 for vertically moving the rack 50 .

The rack loading unit 810 may have any configuration as long as the rack 50 can be loaded.

In particular, it is preferable that the rack loading unit 810 is configured as a pair and installed on both sides of the elevator unit 820 with the elevator unit 820 as the center.

The elevator unit 820 withdraws the rack 50 from the rack loading unit 810 and moves it up and down while the X-Y table 410 and the burn-in board exchange buffer unit 420 are provided when the burn-in board exchange buffer unit 420 is provided. ) and the burn-in board 20 is configured to exchange.

On the other hand, the board loader 800 includes a pair of rack withdrawing units 830 corresponding to a pair of rack mounting units 810 and for withdrawing the racks 50 loaded on each of the rack mounting units 810 . .

The rack withdrawing unit 830 withdraws the rack 50 from the rack loading unit 810 to the support 821 of the elevator unit 820, or vice versa, from the elevator unit 820 to the rack loading unit 810. 50) is configured to load.

The exchange process of the burn-in board 20 between the burn-in board exchange buffer unit 420 and the board loader 800 having the above configuration may be made in various forms depending on each configuration, an example of which is shown in the accompanying drawings. It will be described in detail with reference to the following.

Initially, the burn-in board exchange buffer unit 420 receives the burn-in board 20 on which the second elements 10 are loaded from the board loader 800 as shown in FIGS. 6C and 6D . At this time, when the X-Y table 410 and the burn-in board exchange buffer part 420 have a configuration in which the burn-in board 20 can be disposed up and down, the burn-in board exchange buffer part 420 from either the upper side or the lower side is the board loader. It is possible to receive the burn-in board 20 from the 800, and in particular, it is preferable to receive the supply from the upper side in consideration of the board exchange between the X-Y table 410 and the burn-in board exchange buffer unit 420 .

That is, the burn-in board 20 on which the second elements 10 are loaded is drawn out from the board loader 800 and passes through the burn-in board buffer part 421 located above the burn-in board exchange buffer part 420 to the X-Y table. The burn-in board 20 is transferred to the burn-in board seating part 411 located on the upper side of the 410 , and the burn-in board 20 on which the first elements 10 are loaded is the burn-in board seating part 411 located on the lower side of the X-Y table 410 . ) and discharged to the board loader 800 .

Meanwhile, the burn-in board exchange buffer unit 420 exchanges the burn-in board 20 with the board loader 800 after completing the board exchange with the X-Y table 410 through the process shown in FIGS. 6A and 6B. .

The burn-in board exchange buffer part 420 is a board loader 800 for the burn-in board 20 received from the X-Y table 410, in particular, the burn-in board 20 seated on the burn-in board buffer part 421 located on the lower side. of the rack 50 is introduced into an empty seat. Here, the rack 50 is raised and lowered by the elevator unit 820 so that the burn-in board 20 can be drawn in or withdrawn. It is preferred that the board 20 is not filled.

The burn-in board exchange buffer unit 420 draws out a new burn-in board 20 on which the second element 10 is loaded from the rack 50 . Here, the burn-in board 20 is pulled out from the rack 50 and is seated on the burn-in board exchange buffer part 420, in particular, the burn-in board buffer part 421 located on the upper side.

The exchange process of the burn-in board 20 between the burn-in board exchange buffer unit 420 and the board loader 800 as described above, as shown in FIGS. 6A to 6D, the burn-in board 20 is the burn-in board exchange buffer It is carried by one or more sub-fingers 443 and 444 between the part 420 and the board loader 800 .

At this time, the sub-fingers 443 and 444 move the movement section between the burn-in board exchange buffer unit 420 and the board loader 800 in a plurality of sub-movement sections corresponding to the respective sub-fingers 443 and 444. 20) can be configured to transport.

8A is a side cross-sectional view showing the burn-in board exchange buffer unit and the board loader having a modified configuration in the element handler of FIG. 1, and FIG. 8B is a side view showing the board loader of FIG. 8A.

On the other hand, in the element handler according to the present invention, as shown in FIGS. 8A and 8B, the board loader 800 does not install the configuration of the elevator unit that moves the rack 50 up and down, and only the rack 50 is loaded on the rack. It is composed of only the unit 810, and the burn-in board exchange buffer unit 420 can be configured to move up, down, left, and right so that the burn-in board 20 can be withdrawn from the rack 50 loaded on each rack loading unit 810. there is.

That is, as shown in FIG. 8B , the board loader 800 is configured with a plurality of racks 50 , and in this embodiment, nine racks 50 , in which the rack loading units 810 can be loaded. can

In addition, the device handler according to the present invention may further include an exchange buffer driving unit 430 for vertical and horizontal movement of the burn-in board exchange buffer unit 420 as shown in FIGS. 8A and 8B .

The exchange buffer driving unit 430 moves the burn-in board exchange buffer unit 420 vertically and horizontally, that is, vertically and horizontally, so as to take out the burn-in board 20 from the rack 50 loaded on each rack loading unit 810 . Various configurations are possible as a configuration for driving the .

The exchange buffer driving unit 430 is, as an example, a first driving unit 432 for driving the vertical movement of the burn-in board exchange buffer unit 420 based on the top and bottom of the rack 50 loaded on the board loader 800, and It may be configured to include a second driving unit 431 for driving the horizontal movement of the burn-in board exchange buffer unit 420 based on the horizontal direction in which the rack 50 is arranged in the board loader 800 .

The first driving unit 432 and the second driving unit 431 are installed to support the burn-in board exchange buffer unit 420, as shown in FIGS. 8A and 8B, and are composed of a screw jack or a linear movement device. The burn-in board exchange buffer unit 420 is driven to move in the vertical and horizontal directions.

According to the configuration as described above, the device handler according to the present invention moves the burn-in board exchange buffer unit 420 up, down, left, and right to take out the burn-in board 20 while the rack 50 is fixed to remove the burn-in board 20. It is possible to significantly increase the processing speed of the element handler by reducing the retrieval time.

In addition, by configuring the burn-in board exchange buffer unit 420 to move up, down, left and right, it does not require the installation of an elevator unit in the configuration of the board loader 800, so that the configuration of the board loader 800 can be simplified and the board loader 800 ) by increasing the number of racks 50 loaded on the rack 50, the replacement cycle of the rack 50 can be lengthened to improve work efficiency.

Meanwhile, the burn-in board exchange buffer unit 420 and the exchange buffer driving unit 430 may be configured as one board loader module together with the board loader 800 .

On the other hand, the element handler having the above configuration, the type of element to be sorted, that is, the standard may be different. In this case, the loading unit 100 and the unloading unit 200 load the tray 30 corresponding to the standard. When the DC test unit 170, the socket press 45 on the burn-in board 20, the buffer units 600 and 700, etc., the members conforming to the corresponding device specifications in the device must be replaced one by one by the user's manual operation, so the replacement operation is cumbersome. There is a problem.

Accordingly, the device handler according to the present invention, as shown in FIGS. 1 and 9, when the standard of the element to be sorted is changed according to the standard of the element, the DC test unit 170, X-Y table 410, socket press ( 45), and may further include a kit exchange unit 900 for automatically exchanging at least some of the buffer units 600 and 700, and the like.

The kit exchange unit 900 includes a DC test unit 170, a socket press 45 on the X-Y table 410, and buffer units 600 and 700 according to the specifications of the device when the specifications of the element to be sorted are different. Various configurations are possible with a configuration for automatically exchanging at least some of the lights.

Here, the exchange kit to be exchanged may be a DC test unit 170 , a socket press on the X-Y table 410 , and buffer units 600 and 700 .

Here, in the case of the buffer units 600 and 700, the replacement kit may be the element accommodating units 610 and 710 constituting a part of the buffer unit, rather than the entire buffer unit, the first fixed buffer and the second fixed buffer.

The kit exchange unit 900 is, as shown in FIG. 10 , as a specific example, a body portion 901 provided with a buffer space 910 capable of temporarily storing an exchange kit to be exchanged, and installed on the main body 40 . It may include an exchange unit 930 for withdrawing the exchange kit, temporarily storing it in the buffer space 920, and exchanging it with a new exchange kit.

The main body portion 901, one or more new replacement kits to be exchanged are loaded, and any configuration is possible as long as an empty space for loading and unloading the replacement kit installed on the main body 40 is included.

And it is preferable that the body part 901 is installed to be movable up and down for the convenience of exchange of the exchange kit.

The exchange unit 930 withdraws the exchange kit installed in the main body 40, temporarily stores it in the buffer space 920, and exchanges it with a new exchange kit. Various configurations are available depending on the type, configuration, and exchange method of the exchange kit. It is possible.

At this time, it is preferable that one or more guide rails 902 for guiding the linear movement of the replacement kit are installed on the main body 40 for the convenience of replacement of the replacement kit.

In addition, in the case of the DC test unit 170 of the replacement kit, an electrical connection is required. As shown in FIGS. 10 and 11 , it is inserted in the moving direction of the DC test unit 170 and is electrically connected to the DC test unit 170 . An electrical connection 171 for the may be installed in the main body (40).

The electrical connection unit 171 is configured to be electrically connected to the DC test unit 170 so that a DC test by the DC test unit 170 is possible, and may include one or more terminal members.

In addition, in the case of the buffer units 600 and 700 of the exchange kit, various configurations are possible according to the configuration and location of the buffer units 600 and 700 .

The buffer units 600 and 700 may be installed in the main body 40 in various numbers and movable or fixed states at various positions in a configuration for temporarily loading elements.

As an example, the buffer units 600 and 700 may include a first transfer buffer 600 , a second transfer buffer 700 , and one or more fixed buffers, as shown in FIGS. 1 and 9 . .

In this case, the exchange kit may be the device receiving unit 610 of the first moving buffer 600 , the device receiving unit 710 of the second moving buffer 700 , and one or more fixed buffers.

And, the exchange of the element accommodating unit 610 of the first transfer buffer 600 and the element accommodating unit 710 of the second transfer buffer 700 is, as shown in FIG. 1, the first transfer buffer 600 Each of the element accommodating part 610 of the and the second moving buffer 700 is carried out along the linear movement direction of the element accommodating part 710, and one or more fixed buffers are exchanged (however, there are cases where an exchange buffer is not installed). ) may be formed at at least one of the ends of the first transfer buffer 600 and the second transfer buffer 600 .

In addition, exchange of the element accommodating part 610 of the first moving buffer 600, the element accommodating part 710 of the second moving buffer 700, and one or more fixed buffers (however, the calibration buffer may not be installed) is introduced along the linear movement direction of any one of the element accommodating part 610 of the first moving buffer 600 and the element accommodating part 710 of the second moving buffer 700, as shown in FIG. , discharged in the linear movement direction of the other one of the element accommodating part 610 of the first moving buffer 600 and the element accommodating part 710 of the second moving buffer 700 through a fixed buffer (if a fixed buffer is installed) can be

On the other hand, the kit exchange unit 900 is adjacent to the main body 40 at a position opposite to the sorting unit 300 based on the arrangement direction of the loading unit 100 and the unloading unit 200 and is movably installed. This is preferable.

As described above, the kit exchange unit 900 is adjacent to the main body 40 at a position opposite to the sorting unit 300 based on the arrangement direction of the loading unit 100 and the unloading unit 200 to be movable. When installed, the exchange of the exchange kit and the exchange by the operator become easier, and the device can be configured compactly.

On the other hand, as the types of elements are diversified, it is preferable that a plurality of exchange kits to be exchanged are installed. It may be additionally installed to be movable in a separated state.

The replacement kit loading unit 910, it is preferable that a plurality of replacement kits to be replaced are installed. It is possible to maximize the space use efficiency of the device while simplifying the configuration of the kit exchange unit 900 by being additionally installed.

That is, the kit exchange unit 900 and the replacement kit loading unit 910 move to the element handler only when replacement of the replacement kit is required to exchange the replacement kit, thereby simplifying the overall configuration and maximizing the space use efficiency of the device. there will be

Meanwhile, in the present invention, various modifications of the element handler shown in FIG. 1 are possible.

As an example, the element handler according to the first modification according to the present invention is installed in parallel to one side of the loading unit 100 as shown in FIG. 12 in the configuration of the element handler shown in FIG. 1 to burn-in board It may include an empty tray supply unit 80 for loading a plurality of empty trays 30 to be loaded on the 20 .

Here, the DC test unit 170 may not be included as shown in FIG. 12 or may be included as shown in FIG. 13 .

The device handler according to the first modified example according to the present invention has only a function of loading the device 10 on the burn-in board 20 , or withdraws the device 10 from the burn-in board 20 and puts it on the tray 30 . Only the loading function can be performed.

In order to perform these functions, the loading unit 100 and the unloading unit 200 both load the tray 30 in which the element 10 is loaded, or in an empty tray for loading the element 10 . and load (30).

On the other hand, when the element handler according to the first modification according to the present invention performs only the function of withdrawing the element 10 from the burn-in board 20 and loading it on the tray 30, it is sent to the sorting unit 300 according to the inspection result. can be classified.

In addition, the device handler according to the first modification according to the present invention can perform only device loading or device unloading on the test socket. This is preferable.

If a socket press combined with adapter members of different specifications is used according to device loading or unloading, precision device seating on the test socket is performed using an adapter member that minimizes errors with devices during device loading and device unloading. The error with the time element can be set sufficiently so that unloading is not disturbed.

Here, the socket press operates a test socket installed on a burn-in board, etc. to enable loading or unloading of elements, and various configurations are possible depending on the structure of the test socket.

In the socket press, an adapter member is installed to guide the device so that the device can be positioned at the correct position of the test socket, that is, a position in contact with the terminals (pogo pins, etc.) for electrical connection with the device terminals.

The adapter member may have various configurations, such as having an inclined surface when viewed from the top, in a configuration that allows the device to be seated on an accurate position on the test socket.

As another example, the element handler according to the second modified example according to the present invention, in the configuration of the element handler shown in FIG. 1, as shown in FIGS. 14, 15A and 15B, a socket press for loading (92) And it characterized in that it is provided with a socket press unit (90) comprising a socket press (91) for unloading.

Here, the DC test unit 170 may be installed as needed as an optional configuration.

The socket press unit 90, including the socket press 92 for loading and the socket press 91 for unloading, presses a test socket (not shown) during loading or unloading of the device to load or withdraw the device. As a helping configuration, various configurations are possible depending on the socket structure.

The loading socket press 92 is configured to be seated at the correct position of the test socket installed on the burn-in board 20 when the element is loaded. is installed

In particular, the adapter member has an opening 92a having a size substantially similar to the plane size of the device so as to be accurately seated on the test socket after the device is dropped.

The unloading socket press 91 is configured to be seated at the correct position of the test socket installed on the burn-in board 20 when the device is unloaded.

The socket press 91 for unloading is opened up and down to allow the element to be drawn out, and the size of the opening 91a is larger than the socket press 92 for loading described above so as not to interfere with the unloading of the element. This is preferable.

For reference, when the socket press is configured as a single device, if the opening of the adapter member in the socket press is small in order to load the device into an accurate position, there is a problem in that it prevents the device from being pulled out during unloading.

However, as described above, since the socket press unit 90 includes the socket press 92 for loading and the socket press 91 for unloading, the device is seated at a more accurate position when loading the device, and when unloading the device, the device is unloaded. It is possible to smoothly perform loading and unloading of devices without being disturbed.

On the other hand, the socket press 92 for loading and the socket press 91 for unloading are, as shown in FIG. 14 , the arrangement direction of the loading part 100 and the unloading part 200 , that is, perpendicular to the X-axis direction. It is preferably arranged in the Y-axis direction.

At this time, the first transfer tool 530 and the second transfer tool 540 are, as shown in FIGS. 14, 15A and 15B, the socket press 92 for loading and the socket press 91 for unloading. Correspondingly, it is preferable to be installed at intervals in the Y-axis direction.

On the other hand, the element handler according to the second modified example according to the present invention is installed in parallel to one side of the loading unit 100 similar to the configuration of the element handler according to the second modified example to be loaded on the burn-in board 20. An empty tray supply unit 80 may be included to load the empty trays 30 .

Since the above has only been described with respect to some of the preferred embodiments that can be implemented by the present invention, as noted, the scope of the present invention should not be construed as being limited to the above embodiments, and It will be said that the technical idea and the technical idea having its roots are all included in the scope of the present invention.

110: XY table
210: loading unit 220: unloading unit
310: test unit 320: sorting unit
600: first transfer buffer 700: second transfer buffer
510, 520, 530, 540, 550, 560, 570: transfer tool
900: kit exchange part

Claims (14)

delete A loading function of loading devices that have not undergone the burn-in test (hereinafter, the first devices) on the burn-in board, and the devices that have passed the burn-in test (hereinafter, the second devices) are pulled out of the burn-in board and loaded onto a tray As a device handler performing at least one of the unloading functions,
an XY table for moving the burn-in board in the XY direction;
first and second tray loading units arranged in parallel to each other so as to be arranged between the XY tables to load trays;
a first buffer disposed between the first tray loading unit and the XY table to temporarily load devices;
a second buffer disposed between the second tray loading unit and the XY table to temporarily load devices;
a third transfer tool for transferring the device between the first tray loading unit and the first buffer;
a fifth transfer tool for transferring the device between the second buffer and the second tray loading unit;
a first transfer tool for transferring the device between the first buffer and the burn-in board seated on the XY table;
a second transfer tool for transferring the device between the second buffer and the burn-in board seated on the XY table;
When the standard of the element to be sorted is different, it includes a socket press installed on the XY table to press the socket of the burn-in board according to the standard of the element, and a kit exchange unit for automatically exchanging the first and second buffers,
The kit exchange unit includes a main body provided with a buffer space for temporarily storing an exchange kit, and an exchange unit for withdrawing an exchange kit to be exchanged, temporarily storing it in the buffer space, and exchanging it with a new exchange kit,
The exchange kit is an element handler, characterized in that at least one of the socket press, the first buffer, and the second buffer. 3. The method according to claim 2,
The first buffer and the second buffer,
The element handler, characterized in that the first tray loading unit and the second tray loading unit is installed to be movable in parallel with the tray movement direction. 4. The method according to claim 3,
It includes a sorting unit in which elements that need to be sorted are sorted and loaded,
The first buffer is between a position ① at which the first tray loading unit and the elements are delivered or delivered, a sorting position ② where the elements to be sorted are transferred to the sorting unit, and a position ③ where the elements are delivered or delivered to the burn-in board. is moved from
The second buffer is located between a position (3) for receiving or transferring elements from the burn-in board, a sorting position (2) for transferring the elements to be sorted to the sorting unit, and a position (1) for transferring or receiving elements to the second tray loading unit Element handler characterized in that it is moved in. 3. The method according to claim 2,
wherein the device handler performs only one of the loading function and the unloading function. 6. The method of claim 5,
When performing any one of the loading function and the unloading function, a sorting unit in which the elements that need to be sorted are sorted and loaded;
a first sorting tool for transferring elements between the first buffer and the sorting unit;
and a second sorting tool for transferring the elements between the second buffer and the sorting unit. A loading function of loading devices that have not undergone the burn-in test (hereinafter, the first devices) on the burn-in board, and the devices that have passed the burn-in test (hereinafter, the second devices) are pulled out of the burn-in board and loaded onto a tray As a device handler performing at least one of the unloading functions,
an XY table for moving the burn-in board in the XY direction;
first and second tray loading units arranged in parallel to each other so as to be arranged between the XY tables to load trays;
a first buffer disposed between the first tray loading unit and the XY table to temporarily load devices;
a second buffer disposed between the second tray loading unit and the XY table to temporarily load devices;
a third transfer tool for transferring the device between the first tray loading unit and the first buffer;
a fifth transfer tool for transferring the device between the second buffer and the second tray loading unit;
a first transfer tool for transferring the device between the first buffer and the burn-in board seated on the XY table;
a second transfer tool for transferring the device between the second buffer and the burn-in board seated on the XY table;
a sorting unit in which elements requiring classification are sorted and loaded;
a first sorting tool for transferring elements between the first buffer and the sorting unit;
a second sorting tool for transferring elements between the second buffer and the sorting unit;
a first sorting tool for transferring elements between the first buffer and the sorting unit and a second sorting tool for transferring elements between the second buffer and the sorting unit,
The sorting tool movement area to which the first sorting tool and the second sorting tool are moved is divided into two movement areas to which the first sorting tool and the second sorting tool respectively move;
The sorting unit further includes a sorting buffer unit in which one or more sorting buffers are movably installed in an arrangement direction of the sorting tool movement area,
and the sorting buffer is movably installed between a movable area in which the first sorting tool is movable and a movable area in which the second sorting tool is movable. 3. The method according to claim 2,
The element handler performs the loading function and the unloading function,
The first tray loading part is a loading part on which a tray on which first elements are loaded is loaded, and the second tray loading part unloads a second element of good quality among the second elements loaded on the second buffer on the tray. loading part,
and an empty tray supply unit (80) installed in parallel to one side of the loading unit to load a plurality of empty trays. 9. The method of claim 8,
a DC test unit installed between the loading unit and the first buffer to receive the first elements from the loading unit and perform a DC test;
and a sorting unit for classifying and loading first defective elements determined to be defective as a result of the test by the DC test unit among the first elements and second defective elements that need to be classified among the second elements. 8. The method of claim 7,
A device handler including a socket press installed on the XY table to press the socket of the burn-in board, and a kit exchange unit for automatically exchanging the first and second buffers according to the standard of the element to be sorted when the standard of the element to be sorted is different. 11. The method of claim 10,
The kit exchange unit includes a main body provided with a buffer space for temporarily storing an exchange kit, and an exchange unit for withdrawing an exchange kit to be exchanged, temporarily storing it in the buffer space, and exchanging it with a new exchange kit,
The exchange kit is an element handler, characterized in that at least one of the socket press, the first buffer, and the second buffer. A loading function of loading devices that have not undergone the burn-in test (hereinafter, the first devices) on the burn-in board, and the devices that have passed the burn-in test (hereinafter, the second devices) are pulled out of the burn-in board and loaded onto a tray As a device handler performing at least one of the unloading functions,
an XY table for moving the burn-in board in the XY direction;
first and second tray loading units arranged in parallel to each other so as to be arranged between the XY tables to load trays;
a first buffer disposed between the first tray loading unit and the XY table to temporarily load devices;
a second buffer disposed between the second tray loading unit and the XY table to temporarily load devices;
a third transfer tool for transferring the device between the first tray loading unit and the first buffer;
a fifth transfer tool for transferring the device between the second buffer and the second tray loading unit;
a first transfer tool for transferring the device between the first buffer and the burn-in board seated on the XY table;
a second transfer tool for transferring the device between the second buffer and the burn-in board seated on the XY table;
When the standard of the element to be sorted is different, it includes a socket press installed on the XY table to press the socket of the burn-in board according to the standard of the element, and a kit exchange unit for automatically exchanging the first and second buffers,
The element handler performs the loading function and the unloading function,
The first tray loading part is a loading part on which a tray on which first elements are loaded is loaded, and the second tray loading part unloads a second element of good quality among the second elements loaded on the second buffer on the tray. loading part,
The kit exchange unit,
Element handler characterized in that it is movably installed in the arrangement direction of the loading part and the unloading part, and exchange kits are respectively exchanged along the linear movement direction of the first buffer and the second buffer. A loading function of loading devices that have not undergone the burn-in test (hereinafter, the first devices) on the burn-in board, and the devices that have passed the burn-in test (hereinafter, the second devices) are pulled out of the burn-in board and loaded onto a tray As a device handler performing at least one of the unloading functions,
an XY table for moving the burn-in board in the XY direction;
first and second tray loading units arranged in parallel to each other so as to be arranged between the XY tables to load trays;
a first buffer disposed between the first tray loading unit and the XY table to temporarily load devices;
a second buffer disposed between the second tray loading unit and the XY table to temporarily load devices;
a third transfer tool for transferring the device between the first tray loading unit and the first buffer;
a fifth transfer tool for transferring the device between the second buffer and the second tray loading unit;
a first transfer tool for transferring the device between the first buffer and the burn-in board seated on the XY table;
a second transfer tool for transferring the device between the second buffer and the burn-in board seated on the XY table;
When the standard of the element to be sorted is different, it includes a socket press installed on the XY table to press the socket of the burn-in board according to the standard of the element, and a kit exchange unit for automatically exchanging the first and second buffers,
The element handler performs the loading function and the unloading function,
The first tray loading part is a loading part on which a tray on which first elements are loaded is loaded, and the second tray loading part unloads a second element of good quality among the second elements loaded on the second buffer on the tray. loading part,
The kit exchange unit,
It is installed movably in the arrangement direction of the loading part and the unloading part, and is introduced along the linear movement direction of any one of the first buffer and the second buffer, and the exchange kit is discharged and exchanged in the other linear movement direction. Characterized element handler. 12. The method according to claim 2 or 11,
The kit exchange unit,
A plurality of replacement kits are loaded separately from the main body, and an exchange kit loading part is installed to be movable to a corresponding position when the exchange kit is exchanged.

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