KR100787253B1 - Burn-in Sorter - Google Patents

Abstract

The present invention relates to a burn-in sorter for sorting ICs for which burn-in tests have been completed.

Burn-in sorter of the present invention installs the burn-in board on the board table, set the reject area on one side of the burn-in board, set the reject and good area on the other side of the burn-in board, or install the burn-in board on the board table The reject area and the good area are respectively set on one side of the burn-in board, the good area and the reject area are set on the other side of the burn-in board, and the respective areas are installed at regular intervals from each other.

Burn-in, sorter, buffer, head

Description

Burn-in Sorter}

1 is a plan view showing a schematic configuration of a conventional burn-in sorter;

2 is an operation state of the tool installed on the upper portion of the main body shown in FIG.

3 is a plan view of the burn-in sorter according to the first embodiment of the present invention;

4 is a plan view of a burn-in sorter according to a second embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

110: main body 111: burn-in board

121: DC test buffer 122: DC tester / rod aligner

123: unloading buffer 124: unload aligner

131: tray loader 132: tray unloader

133: tray transfer 141: board loader

142: board unloader 143: board table

151: sorting unit 161: DC error / loading head

162: insertion / removal head 163: unloading / sorting head

The present invention relates to a burn-in sorter, and more particularly, to a burn-in sorter for classifying ICs in which burn-in tests have been completed.

Burn-in sorter checks DC (Direct Current) characteristics of manufactured IC (Integrated Circuit) to store good IC on burn-in board, and burn-in board after burn-in test is completed. It is a device for storing by classifying according to the test result by unloading by class. Korean Patent Publication No. 1998-0071613 (published: October 26, 1998) is known as a related art related to such burn-in sorter.

Referring to the configuration of the burn-in sorter described in Korean Patent Laid-Open Publication No. 1998-0071613 as follows.

FIG. 1 is a plan view showing a schematic configuration of a conventional burn-in sorter, and FIG. 2 is an operation state diagram of a tool installed on an upper portion of the main body shown in FIG. Conventional burn-in sorters have a board loader (2), an unloader (3), a DC reject section (4), a tray loading (tray) as shown in FIGS. loading section (5), DC test section (6), turn return device (turn return device) section (7), Y-table (8), empty pocket section ( 9), a tray unloading section 10 and a sorting section 11.

The board loader 2 and the unloader part 3 are installed on one side of the upper part of the main body 1 of the burn-in sorter, and the DC reject part 4 on the other side of the board loader 2 and the unloader part 3, respectively. And a tray loading section 5 are installed. In the other direction of the tray loading section 5, the DC test section 6, the turn return device section 7 and the wye table 8 are provided, respectively, and the turn return device section 7 and the other side of the wye table 8 are provided. An empty pocket part 9, a tray unloading part 10, and a sorting part 11 are respectively installed in the upper part, and a plurality of tools 12, 13, 14, and 15 are installed on the upper part of the main body 1. do.

The first and second transfer tools 12 and 13 of the plurality of tools 12, 13, 14, and 15 move in the X-axis direction, respectively, to perform DC test of the IC (not shown) on the tray loading section 5, respectively. In addition, the IC which is normal as a result of the test is transferred to the burn-in board (not shown) located in the Y table 8, and the IC in which a failure occurs is installed to the DC reject unit 4, respectively. In addition, the third tool 14 is installed so as to transfer four ICs which are burned in the X-axis direction and the burn-in test is completed to the empty pocket 9 and the tray unloader 10, respectively. 15 is configured to move in the X-axis direction and as a result of the burn-in test, to transfer the non-good IC from the empty pocket portion 9 to the sorting portion 11.

The conventional burn-in sorter configured as described above has a number of tools for transferring the IC having only the degrees of freedom in the X-axis direction, so that the rest of the DC reject portion (sorting portion), tray loading portion, DC test portion, and empty pocket except the Y-table The part and tray unloading part are installed in the form of X-axis direction, so that the Foot Print of the equipment is increased. In addition, the DC test buffer connected to the DC tester and the harness is moved to move the mechanism. There is a problem that the general configuration is complicated.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to provide a burn-in sorter capable of reducing the indexing time between a plurality of heads by determining a work area of a plurality of heads, thereby improving productivity.

The burn-in sorter of the present invention is provided with a board table installed in the main body to receive the burn-in board, a tray loader and an unloader respectively provided on both sides of the board table, and on one side of the tray loader. It consists of a board loader and unloader to be installed, and a sorting part installed on one side of the tray unloader, and a DC test and an unloading buffer are installed on both sides of the upper part of the board table. The DC test buffer and the DC fail / loading head are installed to move to the tray loader and sorting unit, and the unloading and sorting head to be moved to the unloading buffer and tray unloader and sorting unit. / sorting head) is installed, characterized in that the insert / remove head (insert / remove head) is installed to be moved to the DC test buffer and the unloading buffer.

Burn-in sorter of the present invention installs the burn-in board on the board table, set the reject area on one side of the burn-in board, set the reject and good area on the other side of the burn-in board, or install the burn-in board on the board table The reject area and the good area are respectively set on one side of the burn-in board, the good area and the reject area are set on the other side of the burn-in board, and the respective areas are installed at regular intervals from each other.

Hereinafter, each embodiment of the present invention will be described with reference to the accompanying drawings.

First Embodiment

Referring to the first embodiment of the present invention with reference to FIG. 3 as follows.

3 is a plan view of the burn-in sorter according to the first embodiment of the present invention. As shown in FIG. 3, the burn-in sorter of the present invention includes a board table 143 installed in the main body 110 to receive the burn-in board 111, a tray loader installed on both sides of the board table 143, and It comprises an unloader (131, 132), a board loader and unloader (141, 142) provided on one side of the tray loader 131, and a sorting unit (151) provided on one side of the tray unloader (132). In addition, DC test and unloading buffers 121 and 123 are installed at both upper sides of the board table 143, and the DC error / loading head is moved to the DC test buffer 121, the tray loader 131, and the sorting unit 151. 161 is installed, and the unloading / sorting head 163 is installed to move to the unloading buffer 123, the tray unloader 132, and the sorting unit 151, and the DC test buffer 121 and the unloading. The insertion / removal head 162 is installed and configured to move to the buffer 123.

Referring to the configuration and operation of the burn-in sorter according to the first embodiment of the present invention in more detail as follows.

Burn-in sorter includes DC test buffer 121, unloading buffer 123, tray loader 131, tray unloader 132, board loader 141, board unloader 142, board table 143, and sorting. The unit 151, the DC error / loading head 161, the insertion / removal head 162 and the unloading / sorting head 163 are installed in the main body 110 and configured.

The board table 143 is installed at the center of the main body 110 to receive the burn-in board 111, and a ball screw (not shown) to move the received burn-in board 111 in the X and Y-axis directions. ) Or a rotary mechanism (143b) to which a linear motor (143a) such as a linear motion guide (not shown) is applied, or a rotating motor (not shown) is provided to change the direction of the burn-in board 111. Is applied.

Tray loaders and unloaders 131 and 132 are respectively installed on both sides of the board table 143 for receiving the burn-in board 111 to linearly move or rotate the X- and Y-axis directions.

The tray loader 131 is installed at one side of the board table 143 to supply the tray 112 in which the IC to be DC-tested is stored, and the tray unloader 132 is installed at the other side of the board table 143 to burn-in test. The empty tray 112 is supplied to receive the IC determined to be good.

The tray transfer 133 is installed between the tray loader 131 and the tray unloader 132 to continuously supply the empty tray 131 to the tray unloader 132. The tray transfer 133, when all the ICs are removed from the tray 112 containing the IC to be DC-tested supplied by the tray loader 131, moves the empty tray 112 in the X-axis direction as shown by the arrow " b2 ". The feed is continuously supplied to the tray unloader 132.

The tray loader 131 and the tray unloader 132 are each racked to continuously supply the tray 112 containing the IC to be DC-tested and the empty tray 112 for accommodating the IC determined as good in burn-in testing. Lamination mechanisms (not shown) such as racks and linear transfer mechanisms (not shown) such as belts, ballscrews or LM guides are applied.

When the IC to be tested DC stored in the tray 112 is DC-tested and passed, a board loader and an unloader 141 and 142 are provided at one side of the tray loader 131 to load or unload the burn-in board 111 for accommodating the IC. Each is installed.

Board loaders and unloaders 141 and 142 installed at one side of the tray loader 131 are installed at the right side of the main body 110. The board loader 141 continuously transfers the burn-in board 111 in which the burn-in test is completed in the socket 111a in the plurality of sockets 111a and supplies it to the board table 143 in the direction of arrows "a1 and a2". do. Meanwhile, the board unloader 142 is configured to unload the burn-in board 111 in which the IC passed the DC test is received in the reverse direction of the arrow "a2".

The board loader 141 and the board unloader 142 are applied to load or unload the burn-in board 111 in which the IC passed in the burn-in test and the DC test are received. The board loader and unloader 141 and 142 are each configured as a rack (not shown) to stack the burn-in boards 111, and a linear transfer mechanism (not shown) such as a belt, a ball screw or an LM guide is applied.

The tray loader 131 is installed at one side of the board loader 141 and the unloader 142 having such a configuration. The tray loader 131 is connected and installed by the tray unloader 132 and the tray transfer 133, and a sorting unit 151 is installed at one side of the tray unloader 132.

The sorting unit 151 includes a plurality of empty trays 112 and at least one DC error tray 113 is installed. Although the sorting unit 151 illustrated in FIG. 3 illustrates an embodiment in which one DC error tray 113 is provided, at least one DC error tray 113 may be provided if necessary.

The sorting unit 151 including the plurality of empty trays 112 and the DC error tray 113 is installed in the main body 110 so that the sorting unit 151 can be moved in the direction of arrow "i", that is, in the Y-axis direction. To this end, the sorting unit 151 has a linear feed mechanism (not shown) such as a ball screw or an LM guide applied thereto to reciprocate the plurality of empty trays 112 and the DC error tray 113 in the Y-axis direction. Move to the working position.

The working positions of the empty tray 112 and the DC error tray 113 provided in the sorting unit 151 include the DC error / loading head 161 and the unloading / sorting head 163 moving in the X-axis direction to burn-in. The remaining ICs, which are not good ICs in the tested ICs, and the ICs in which DC errors have occurred in the DC tested ICs are shown in the empty tray 112 and the DC error tray 113, respectively.

In the burn-in test at the working positions of the empty tray 112 and the DC error tray 113, the IC which has been burned-in first to store the non-good IC (DC) and the DC error IC is stored in the unloading buffer 123. The IC to be stored and to be DC-tested is stored in the DC test buffer 121. The DC test and unloading buffers 121 and 123 which accommodate the burned-in IC and the IC to be DC-tested are installed on both sides of the upper portion of the board table 143, respectively.

The DC test buffer 121 installed at both upper sides of the board table 143 is fixedly installed at the upper front of the board table 143, and is located at the work position of the tray loader 131 by the DC error / loading head 161. If the IC to be tested is picked and transferred, it will be stored. Here, the working position of the tray loader 131 may pick the IC to be tested DC which is stored in the tray 112 loaded by the tray loader 131 by the DC error / loading head 161 moving in the X-axis direction. Indicates a location.

The tray 112 is transferred to the working position of the tray loader 131, and the DC error / loading head 161 picks up the IC to be tested DC contained in the tray 112 and transfers the DC test buffer 121 to the DC test buffer 121. Before the DC tester / rod aligner 122 aligns the IC, the DC tester / rod aligner 122 performs DC test of the IC while moving in the Y-axis direction as indicated by the arrow “e”. Here, the defective IC is stored in the DC error tray 113 by the DC error / loading head 161, and the good IC performs the burn-in test when the DC test buffer 121 is filled.

Then, the unloading buffer 123 is provided in a direction facing the DC test buffer 121 in the Y-axis direction. The unloading buffer 123 is fixedly installed at the upper rear of the board table 143 to receive burn-in tested ICs transferred by the insertion / removal head 162. The unload aligner 124 is first used to receive the IC carried by the insert / remove head 162. The unload aligner 124 is installed on the other side of the unloading buffer 123 and reciprocates in the Y-axis direction as shown by the arrow "d" so that the insertion / removal head 162 inserts the IC into the unloading buffer 123. Align it and insert it.

When the burn-in test has been inserted into the unloading buffer 123, the socket 111a of the burn-in board 111 in which the IC located in the unloading buffer 123 is stored becomes empty and a new burn-in test is placed in place of the socket 111a. It will contain the IC that will be used. To this end, first, the IC to be DC-tested in the tray loader 131 is transferred in the Y-axis direction as shown by the arrow "b" to position the tray 112 at the working position. The working position of the tray loader 131 indicates a position where the DC error / loading head 161 can pick the IC to be DC tested.

The DC error / loading head 161 is installed on the X-axis frame 160 and picked the IC to be tested DC contained in the tray 112 transported to the working position of the tray loader 131, and then the arrow “c1” is shown. It moves in the X-axis direction and transfers to the DC test buffer 121. When the IC is transferred to the DC test buffer 121, the DC tester / load aligner 122 performs the alignment and DC test, and the DC error / loading head 161 picks up the IC in which the error occurred in the DC test. After that, it moves in the direction of arrow “c2” and transfers to the DC error tray 113 accommodated in the sorting unit 151.

The IC determined as normal in the DC test is transferred to and inserted into the socket 111a of the burn-in board 111 accommodated in the board table 143 by the insertion / removing head 162. To this end, the insertion / removal head 162 is installed on a Y-axis frame (not shown), picking ICs from the DC test buffer 121, and moving in the Y-axis direction as shown by the arrow “f1” to work on the board table 143. Pick burn-in tested ICs stored in position.

The working position of the board table 143 indicates a position where the insertion / removal head 162 can remove or insert the IC into the socket 111a of the burn-in board 111 housed in the board table 143. When the burn-in tested IC is picked in this position, the insertion / removal head 162 moves in the Y-axis direction as shown by the arrow "f2" to transfer the picked-in burned test IC to the unloading buffer 123 and back again. The DC tested IC is inserted into the burn-in board 111.

The insertion / removal head 162 first picks and inserts a DC-tested IC from the DC test buffer 121, and then unloads the burn-in-tested IC after picking the burned-in IC from the burn-in board 111. Transfer to 123. When the burn-in-tested IC is transferred from the socket 111a of the burn-in board 111 to the unloading buffer 123, the IC to be newly burned-in test, that is, the IC determined as normal in the DC test is inserted.

When the IC determined to be normal in the DC test is inserted into the socket 111a of the burn-in board 111, and the burn-in tested IC stored in the burn-in board 111 is transferred to the unloading buffer 123, the unloading buffer ( IC transferred to 123) is classified by class.

An unloading / sorting head 163 is provided to classify burn-in tested ICs by grade. The unloading / sorting head 163 is installed on the X-axis frame 160 to be moved to the unloading buffer 123, the tray unloader 132, and the sorting unit 151, and burn-in test is performed on the unloading buffer 123. When the completed IC is stored, it moves in the X-axis direction as shown by arrows "g1 and g2" and transfers them to the tray unloader 132 and the sorting unit 151, respectively.

The burn-in tested IC transferred to the tray unloader 132 is an IC determined as a good product as a result of the burn-in test, and the IC transferred to the sorting unit 151 is an IC determined as the remaining IC except good goods. The non-good IC is classified and stored in the plurality of trays 112 stored in the sorting unit 151 by the unloading / sorting head 163 according to the grade.

In this way, the respective heads 161, 162, 163 are moved in the Z-axis direction to pick and transfer the IC elements by the DC error / loading head 161, the insertion / removal head 162, and the unloading / sorting head 163. In this case, the transfer time of the heads 161, 162, 163 is narrowed by narrowing the interval between the burn-in board 111 and the DC test buffer 121 or the unloading buffer 123 when the IC is transferred by the continuous operation of the heads 161, 162, 163. This reduces the index time.

Through the continuous operation of the heads (161, 162, 163) with improved transfer time, burn-in tested ICs are classified by grade, and the IC elements to be burn-in tested are inserted into the burn-in board (111). When the IC to be burned-in is housed in the burn-in board 111, the board unloader 142 installed on one side of the tray loader 131 is unloaded, and the board loader 141 installed on one side of the tray loader 131 again. As a result, the burn-in board 111 in which the IC having completed the burn-in test is stored is transferred to the board table 143.

Meanwhile, the burn-in sorter according to the first embodiment of the present invention installs the X-axis frame 160 on the board table 143 installed in the center of the main body 110, and on one side of the X-axis frame 160. According to the DC test result, the IC product sets the first reject area R through which the defective or incompatible IC product is transferred, and the burned-in IC product on the other side of the X-axis frame 160 is classified by grade. In order to be conveyed, the second reject R and the good region G having the same directions are set.

The first reject region R formed at one side (front part) of the X-axis frame 160 has a DC error / loading head 161 performing DC tests on the IC product by the DC tester and the load aligner 122. In the case of performing a defective or inadequate operation, it means an area in which the IC product is moved to the DC error tray 113 in the X direction by the DC error / loading head 161 after the IC product is conveyed a certain distance.

The second reject region R is burn-in from the unloading buffer 123 with respect to the second reject region R and the good region G formed on the other side (rear) of the X-axis frame 160. Is moved to the unloading aligner 124 by the unloading / sorting head 163 according to the grade, and the IC product is moved in the same direction, that is, in the X direction, to the sorting unit 151. The good area (G) is a good area (G), when the burn-in test is completed IC product is moved to the unload aligner 124 to the tray unloader 132 by the unloading / sorting head 163 It means the area to be moved. That is, since the second reject region R and the good region G correspond to the region for determining the IC product having the burn-in test, the region is located on the same line.

Second Embodiment

Another embodiment of the burn-in sorter of the present invention will be described with reference to FIG. 4.

4 is a plan view of a burn-in sorter according to a second embodiment of the present invention. The burn-in sorter of the present invention includes a board table 143 installed on the main body 110 to receive the burn-in board 111, tray loaders and unloaders 131 and 132 installed on both sides of the board table 143, and trays. It consists of a board loader and unloader (141,142) is installed on one side of the loader 131, and the sorting unit 151 is installed on one side of the tray unloader 132,

The DC test buffer 121 is installed at one upper side of the board table 143, and the unloading buffer 123 is installed at the other upper side of the board table 143 to move in a predetermined direction. The DC error / loading head 161 is installed to be moved to the tray loader 131 and the sorting unit 151, and the unloading head 163a is installed to be moved to the unloading buffer 123 and the tray unloader 132. The sorting head 163b is installed to be moved to the unloading buffer 123 and the sorting unit 151, and the insertion / removing head 162 is installed to be moved to the DC test buffer and the unloading buffer 123. do.

In the second embodiment of the present invention, the unloading / sorting head 163 (shown in FIG. 3) of the first embodiment is divided into a sorting head 163a and an unloading head 163b, and an unloading buffer ( Since 123 is provided to be movable in the Y-axis direction as shown by the arrow "h", the configuration and operation of the second embodiment of the present invention will only describe the features of the second embodiment.

The unloading buffer 123 is installed on the other side of the upper part of the board table 143 to move in a predetermined direction. When the unloading buffer 123 is installed to move in the Y-axis direction, the insertion / removing head 162 moves in the Y-axis direction as shown by the arrow "f2" to transfer the burned-in tested IC to the unloading buffer 123. The unloading head 163b picks up the IC determined to be good at this position. When the sorting head 163a picks the IC, the unloading buffer 123 is moved in the same direction as the arrow "h". When the movement of the unloading buffer 123 is completed, the sorting head 163a picks the IC remaining in the unloading buffer 123.

If the unloading head 163b picks a good IC from among burn-in tested ICs stored in the unloading buffer 123, and the sorting head 163a picks a non-good IC, the unloading head 163b and the sorting head ( 163a respectively moves in the direction of arrows " g1, g2 " to transfer the good ICs to the tray unloader 132, and transfers the non-good ICs to the sorting unit 151 to classify the classes.

When the unloading head 163b and the sorting head 163a are separately installed in the X-axis frame 160, DC testing and unloading may be performed to improve interference that may occur between the plurality of heads 161, 162, 163a and 163b. This is solved by setting the height of the tray 112 relatively high with respect to the height of the loading buffers 121 and 123. That is, the insertion / removal head 162 is set lower than the heads 161, 163a and 163b to improve the interference that may occur between the plurality of heads 161, 162, 163a and 163b.

Meanwhile, the burn-in sorter according to the second embodiment of the present invention installs the X-axis frame 160 on the board table 143, and the IC product on one side of the X-axis frame 160 according to the DC test result. The first reject (R) and the first good region (G) where suitable or nonconforming IC products are conveyed are set, and the burned-in IC products that are tested on the other side of the X-axis frame 160 are classified and transferred by grade. For this purpose, the second reject R and the second good region G having the same direction are set, and each of the second reject and the second good region has the same direction.

The first reject region R on one side of the X-axis frame 160 moves the DC error / loading head 161 to the DC tester and the load aligner 122 that the DC error / loading head 161 performs a DC test on the IC product. After that, after moving to the X-axis direction from the time of waiting for the transfer to the DC error tray, it means the area transferred to the DC error tray, and the first good area (G) is a DC test buffer of the good IC product by DC test buffer. It means the area stored in 121.

On the other hand, the second good region G formed on the other side (rear part) of the X-axis frame 160 is burned by the unloading buffer 123 from the unloading buffer 123 by the unloading head 163b after the burn-in test. The second reject area R is a sorting unit 151 by the sorting head 163a in order to classify IC products by the class from the unload aligner 124. Means the area to be supplied.

The good region G and the reject region R are formed at regular intervals from each other.

As described above, the burn-in sorter of the present invention has a plurality of heads by installing DC test buffers and unloading buffers on both sides of the board table, and inserting / removing heads to move between the DC test buffers and the unloading buffers. Indexing time can be reduced, which provides the advantage of improving machine productivity.

Claims (6)

delete delete In the burn-in sorter consisting of a board loader and an unloader installed on one side of the main body, a D.C test unit installed on the main body, a sorting unit provided on the other side of the main body, and a transfer unit for transferring IC products, The transfer part of the burn-in sorter is configured by installing a DC error / loading head and an unloading / sorting head on the X-axis frame, and installing an insertion / removal head on the Y-axis frame, And said DC error / loading head moves in the first reject region and said unloading / sorting head and insert / remove head move in the second reject region and the good region. In the burn-in sorter consisting of a board loader and an unloader installed on one side of the main body, a DC test unit installed on the main body, a sorting unit provided on the other side of the main body, and a transfer unit for transferring the IC product, The transfer part of the burn-in sorter installs a DC error / loading head and an unloading / sorting head in the X-axis frame, and comprises an insertion / removal head in the Y-axis frame, The DC error / loading head moves in the first reject region and the first good region, and the unloading / sorting head and the insert / remove head move in the second reject region and the second good region. Burn-in sorter. In the burn-in sorter consisting of a board loader and an unloader installed on one side of the main body, a D.C test unit installed on the main body, a sorting unit provided on the other side of the main body, and a transfer unit for transferring IC products, The transfer part of the burn-in sorter is configured by installing a DC error / loading head and an unloading / sorting head on the X-axis frame, and installing an insertion / removal head on the Y-axis frame, The DC error / loading head moves in the first reject region, the unloading / sorting head moves in the second reject region and the good region, and the insertion / removal head moves in the first reject region, the second reject Burn-in sorter characterized by moving in the project area and the good area. In the burn-in sorter consisting of a board loader and an unloader installed on one side of the main body, a D.C test unit installed on the main body, a sorting unit provided on the other side of the main body, and a transfer unit for transferring IC products, The transfer part of the burn-in sorter is configured by installing a DC error / loading head and an unloading / sorting head on the X-axis frame, and installing an insertion / removal head on the Y-axis frame, The DC error / loading head moves in the first reject region and the first good region, the unloading / sorting head moves in the second reject region and the second good region, and the insertion / removal head is the first A burn-in sorter characterized by moving in the reject region and the first reject region and in the second reject region and the second good region.

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