KR101432212B1 - The method of moving a semiconductor device in a testhandler - Google Patents

Abstract

The present invention relates to a method of moving a semiconductor device in a test handler.
According to the present invention, provision of a temporary temporary loading element improves the operation rate of the pick-and-place apparatus and ultimately has an increased effect of improving the loading speed.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of moving a semiconductor device in a test handler,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a semiconductor device transfer technique in a test handler that operates when testing semiconductor devices.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process so that the semiconductor device can be tested by a tester. The test handler classifies the semiconductor devices according to the test results and loads them on a customer tray. 0553992 (entitled " Test Handler "), and the like.

Generally, the produced semiconductor device is supplied to the test handler while being loaded on the customer tray. The semiconductor device supplied to the test handler is loaded onto the carrier board at the loading position, then loaded on the carrier board at the testing position And the carrier board is unloaded to the customer tray when it is positioned at the unloading position. Here, the carrier board is a loading element that can load a plurality of semiconductor elements to support a plurality of semiconductor elements to be tested at one time. In such a carrier board, a conventional concept test tray and a new concept There is a test board.

In most cases, since the customer tray is intended to store semiconductor devices, the semiconductor devices are configured so that the intervals between the semiconductor devices can be narrowed. The semiconductor devices can be stacked so as to secure an appropriate extent to the following.

Therefore, it is necessary to adjust the spacing between the semiconductor elements when the semiconductor elements are moved from the customer tray to the carrier board. To this end, the test handler is provided with a pick and place apparatus for adjusting the distance between the semiconductor elements and moving them.

The pick-and-place apparatus grasps a semiconductor element from a customer tray, and adjusts a gap between the semiconductor elements while moving to load the carrier on the carrier board. Two techniques are introduced in Korean Registered Patent No. 941672 in connection with a technique for transferring semiconductor devices from a customer tray to a carrier board using such pick and place apparatuses.

One of them is the technology mentioned in the patent publication drawing 1 and the description (hereinafter referred to as 'first background technology') and the other is the technology mentioned in the drawing 2 and the description (hereinafter referred to as 'second background technology' ).

There is also a technique (hereinafter referred to as a "third background technology") introduced through Application No. 10-2010-27577 filed by the present applicant.

According to the first background art, as shown in FIG. 1, the pick and place apparatus 110 grips 2 × 8 semiconductor elements from a customer tray (T) and transports them to a test tray (T.T). At this time, the pick and place apparatus 110 transfers the semiconductor elements held at the position corresponding to the socket off to the buffer loading element 140 (in the description of the related art, Loading buffer ') and then loading only the remaining semiconductor elements with the test tray TT.

For reference, the loading buffer 140 includes a first stacking portion 140a for stacking semiconductor elements to be excluded due to the socket off, and a second stacking portion 140b for aligning the semiconductor elements held by the pick and place device 110 And has a loading section 140b.

In the above description, the test socket in electrical contact with the semiconductor element is provided on the test board of the tester in the same matrix form and number as the semiconductor elements to be loaded in the test tray. However, When the test by the test socket is judged to be useless, the tester stops the test by the test socket, and the test handler does not supply the semiconductor device to the test socket.

According to the second background technique, as shown in FIG. 2, the first pick-and-place device 210 (defined as 'first loader hand' The second pick-and-place device 220 (defined as 'second loader hand' in the description of the related art) is mounted on a movable type loading table 230 capable of reciprocating in the forward and backward directions after gripping the eight semiconductor elements, 16 x 2 semiconductor elements are gripped from the loading table 230 and then transported to the test tray TT. At this time, the first pick-and-place device 210 transfers the semiconductor devices held at the position corresponding to the socket off to the buffer loading element 240 Buffer ") and then loads only the remaining semiconductor elements into the starter loading table 230.

According to the third background art, a buffer loading element is provided in the starter loading table for removing the socket-off semiconductor elements from being moved and loaded on the carrier board.

On the other hand, a customer tray for storing semiconductor devices generally has a structure capable of stacking 20 × 8 semiconductor elements in a 20 × 8 matrix.

However, as the size of the semiconductor device becomes smaller or larger, the number of semiconductor devices that can be loaded on the customer tray and the shape of the matrix to be loaded are arbitrarily changed.

In the beginning, as in the first background art, the pick-and-place apparatus grasped and moved 2 x 8 semiconductor elements. However, in order to reduce the moving speed of the semiconductor devices as the processing capacity of the test handler increases, In some cases, the pick and place apparatus can be configured to hold and move 4 x 8 semiconductor elements.

However, as shown in FIG. 3, a pick-and-place apparatus PP and 22 × 8 semiconductor elements configured to be able to grip and move in the form of 4 × 8 semiconductor elements 4 × 8 matrix and 22 × 8 semiconductor elements (22) of the semiconductor elements loaded in the customer tray (CT) is not a multiple of the number of rows (4) of semiconductor elements held in the pick-and-place apparatus (PP) .

In this case, the pick-and-place apparatus PP performs five transfer operations to transfer 20 × 8 semiconductor elements from the CT to the test tray, and then, in six transfer operations, the corresponding customer tray (CT ), Only the remaining 2x8 pieces are moved, so that the pick-and-place device (PP) can not be fully utilized.

In other words, when the number of rows of semiconductor elements mounted on the customer tray CT is not a multiple of the number of rows of semiconductor elements held in the pick-and-place apparatus PP, the pick and place apparatus PP can not be utilized sufficiently This causes a decrease in the loading speed.

An object of the present invention is to provide a method of moving a semiconductor device capable of sufficiently utilizing a pick and place apparatus even when the number of rows of semiconductor elements loaded in a customer tray does not become a multiple of the number of rows of semiconductor elements held in a pick and place apparatus.

According to a first aspect of the present invention, there is provided a method for moving a semiconductor device in a test handler, the method comprising the steps of: (a) A basic moving step of moving the elements from the first loading element to the second loading element; A remaining amount determining step of determining whether the number of semiconductor elements remaining in the first loading element (hereinafter, referred to as 'remaining number') is less than or equal to N, by repeating the basic shifting step; A temporary moving step of moving the remaining number from the first loading element to the temporary loading element by the pick and place apparatus when it is determined that the remaining number is one or more but less than N in the remaining amount determining step; Determining whether a condition for moving the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied; A step of moving the semiconductor elements loaded on the temporary loading element to the second loading element by the pick and place apparatus when it is determined that the condition is satisfied in the condition satisfaction judgment step; .

The conditions at the condition satisfaction determination step may be that the sum of the number of semiconductor devices temporarily suspended in the temporary loading element (hereinafter referred to as 'temporarily loaded number') and the remaining number is greater than or equal to N or that the temporary loading number And a test amount.

In order to achieve the above object, according to a second aspect of the present invention, there is provided a method of moving a semiconductor device in a test handler, wherein a pick and place apparatus is provided with a first number of grips (hereinafter referred to as "N" A basic moving step of shifting the semiconductor elements of the first loading element from the first loading element to the second loading element; A remaining amount determining step of determining whether the number of semiconductor elements remaining in the first loading element (hereinafter referred to as " remaining number ") is one or more and less than N; If it is determined that the remaining number is one or more and less than N in the remaining amount determining step, it is determined whether the sum of the number of semiconductor devices temporarily mounted on the temporary loading element (hereinafter referred to as 'temporarily loaded number') and the remaining number is less than N Determining a replenishment amount to be determined; A temporarily moving step of temporarily loading the remaining number from the first loading element to the temporary loading element by the pick and place apparatus when it is determined in the replenishment amount determining step that the sum of the temporary loading number and the remaining number is less than N; And if it is determined in the replenishment amount determination step that the sum of the temporary number and the remaining number is N or more, the pick and place apparatus grasps N semiconductor elements from the first loading element and the temporary loading element, A mobile loading replenishment phase; .

According to a third aspect of the present invention, there is provided a method of moving a semiconductor device in a test handler, wherein a pick and place apparatus applies a first number of grips (hereinafter referred to as &quot; N &quot; A first basic shifting step of gripping at least one semiconductor element held in a position corresponding to the socket offload to a buffer loading element after holding semiconductor elements of N &gt; = 2; (Hereinafter, referred to as "L") except for the number (hereinafter, referred to as "M", 0 ≦ M <N) of the N semiconductor devices held in the first basic shifting step , M + L = N, where L is a value that can vary depending on the number of socket offsets that can be changed at each job run) to a second loading element; Determining whether the number of semiconductor devices remaining in the first loading element (hereinafter referred to as &quot; remaining number &quot;) is one or more and less than N, by repeating the first basic shifting step and the second basic shifting step; ; A temporary moving step of moving the remaining number from the first loading element to the temporary loading element by the pick and place apparatus when it is determined that the remaining number is one or more but less than N in the remaining amount determining step; Determining whether a condition for moving the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied; A step of moving the semiconductor elements loaded on the temporary loading element to the second loading element by the pick and place apparatus when it is determined that the condition is satisfied in the condition satisfaction judgment step; .

The conditions in the condition satisfaction determination step include the number of semiconductor elements temporarily mounted on the temporary loading element (hereinafter referred to as 'temporarily loaded number'), the number of semiconductor elements loaded on the buffer loading element (hereinafter referred to as 'buffer loaded number' ) And the remaining number should be L or more, the sum of the number of temporary loading and the remaining number must be L or more, the total number of buffer loading and the remaining number must be L or more, And a water amount.

According to a fourth aspect of the present invention, there is provided a method of moving a semiconductor device in a test handler,

(Hereinafter, referred to as "N pieces", N ≧ 2) from the first loading element by the pick-and-place apparatus, and thereafter, the at least one semiconductor element held at the position corresponding to the socket- To a buffer loading element;

(Hereinafter, referred to as "L") except for the number (hereinafter, referred to as "M", 0 ≦ M <N) of the N semiconductor devices held in the first basic shifting step , M + L = N, where L is a value that can vary depending on the number of socket offsets that can be changed at each job run) to a second loading element; If the sum of the number of semiconductor devices temporarily mounted on the temporary loading element (hereinafter referred to as 'temporarily loaded number') and the number of semiconductor devices loaded on the buffer loading element (hereinafter referred to as 'buffer loaded number') is less than L or L A replenishment amount determining step of determining whether the number of replenishment amounts is equal to or greater And if it is determined that the sum of the number of temporary loading and the number of buffer loading is more than L in the replenishment amount determining step, the pick and place apparatus grasps the L semiconductor elements from the buffer loading element and the temporary loading element, A mobile loading replenishment phase; When the sum of the temporary number of loads and the number of buffered loads is less than L in the replenishment amount determining step, the pick-and-place apparatus performs the first basic shifting step and the second basic shifting step.

When the number of the semiconductor elements remaining in the first loading element in the first basic moving step is less than N, the temporary moving step of moving the semiconductor elements of the first loading element to the temporary loading element .

According to the present invention, even when the number of rows of semiconductor elements mounted on a customer tray does not become a multiple of the number of rows of semiconductor elements held in a pick-and-place apparatus, the pick and place apparatus can be fully utilized through a temporary loading element. The moving distance of the place device is reduced and the loading speed is ultimately improved.

1 is a reference diagram for explaining the first background art.
2 is a reference diagram for explaining the second background art.
FIG. 3 is a reference diagram for explaining an example in which the number of rows of semiconductor elements loaded in a customer tray does not become a multiple of the number of rows of semiconductor elements held in a pick-and-place apparatus.
4 is a reference view for explaining a loading portion of a test handler to which a semiconductor element moving method in a test handler according to an embodiment of the present invention can be applied.
5 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a first embodiment of the present invention.
6 is a flowchart of a method of moving a semiconductor device in a test handler according to a second embodiment of the present invention.
7 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a third embodiment of the present invention.
8 is a flowchart of a method of moving a semiconductor device in a test handler according to a fourth embodiment of the present invention.
9 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a fifth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

&Lt; Embodiment 1 >

FIG. 4 shows a configuration of a loading part to which the semiconductor element moving method according to the first embodiment is applied. The term &quot; loading &quot; in the description is defined as transferring a semiconductor element of a customer tray (C.T.) to a carrier board (C.B.).

The loading part has a buffer loading element 41 and a temporary loading element 42 provided between the customer tray CT as the first loading element and the carrier board CB as the second loading element and the buffer loading element 41 and an alignment table 43 between the temporary loading element 42 and the carrier board CB. That is, the customer tray CT, the buffer loading element 41 and the temporary loading element 42, the alignment table 43, and the carrier board CB are arranged from the front to the rear in this order, and the buffer loading element 41 and the temporary The loading elements 42 are provided side by side in the lateral direction.

Here, the buffer loading element 41 and the temporary loading element 42 are configured so that their front, rear, and lateral pitches are equal to each other. If the pick-and-place apparatus PP is provided with the buffer loading element 41 and the temporary loading element 42 as in the case described below, if the front-back and right-left pitches of the buffer loading element 41 and the temporary loading element 42 are not the same, The loading speed may decrease due to the pitch conversion. The front and back and left and right pitches of the buffer loading element 41 may be equal to the pitch of the front and rear of the customer tray CT or may be the same as the front and rear and right and left pitches of the carrier board CB depending on the configuration of the equipment, It may be possible to design the tray (CT) or the carrier board (CN) to have the same pitch in one direction and the other direction to be different.

The loading portion further has a pick and place apparatus (P.P.) for moving semiconductor elements.

In the customer tray (C.T), 22 × 8 semiconductor elements are loaded in a 22 × 8 matrix, and carrier boards (C.B) are loaded with 16 × 16 semiconductor elements in a 16 × 16 matrix.

The buffer loading element 41 and the temporary loading element 42 may each be loaded with 2 x 8 semiconductor elements. Of course, it is also possible to configure the buffer loading element 41 or the temporary loading element 42 so as to load 3 x 8 or 4 x 8 or more semiconductor elements.

The alignment table 43 is configured to align 4 x 8 semiconductor elements. In general, the semiconductor devices held by the pick-and-place apparatus PP may be distorted due to the generation of an impact due to the gap adjustment. When the pick and place apparatus PP places the semiconductor elements on the alignment table 43 So that the posture of the semiconductor elements is aligned. Therefore, the pick-and-place apparatus PP passes through the alignment table 43 prior to transferring the semiconductor elements to the carrier board CB after adjusting the spacing of the semiconductor elements, and the technical details thereof are well known, .

The pick and place apparatus P.P is capable of gripping and moving 4 x 8 semiconductor elements and adjusting the gap between the semiconductor elements held.

Of course, the operation of the customer tray (CT), the replacement of the carrier board (CB), and the operation and control of the pick-and-place apparatus (PP)

Next, a method of moving a semiconductor device according to this example in a test handler having the configuration of a loading part as described above will be described with reference to the flow chart of FIG.

1. Basic Move <S501>

The pick and place apparatus PP moves the 4 x 8 semiconductor elements, which are once number of grips, from the customer tray CT to the carrier board CB.

2. Residual amount judgment <S502>

It is determined whether the number of semiconductor elements remaining in the customer tray (hereinafter referred to as 'remaining number') is less than 4 × 8. In this embodiment, when the 4 × 8 semiconductor elements are moved from the customer tray CT to the carrier board CB five times by the pick-and-place apparatus PP, the remaining number is 2 × 8 in the customer tray CT And therefore it will be judged that the remaining number is less than 4 × 8.

3. Temporary movement <S503>

If it is determined in step S502 that the remaining number is less than 4 x 8, the pick-and-place apparatus P.P moves the remaining number from the customer tray C.T to the temporary loading element 42. [

When the semiconductor device is removed from the customer tray CT in step S503, the test handler replaces the empty customer tray CT with a new customer tray CT, and step S501 is performed on the semiconductor elements of the new customer tray CT Subsequently, when the pick and place apparatus PP repeats step S501 five times for a new customer tray CT, the remaining number is judged to be 2 x 8 in step S502 for a new customer tray CT .

4. Judgment of condition satisfaction <S504>

It is judged whether the sum of the number of temporary semiconductor elements temporarily mounted on the temporary loading element 42 (hereinafter referred to as 'temporarily loaded number') and the remaining number remaining on the customer tray (CT) subject to the current operation is 4 × 8. That is, the condition in this embodiment is that the sum of the number of provisional loads and the number of residuals will be 4 x 8, that there are 2 x 8 in the temporary loading element 42, and 2 x 8 remaining number in the new customer tray (CT) The condition is satisfied at the point where it will remain.

5. Supplementary movement <S505>

If it is determined in step S504 that the condition is satisfied, the pick and place apparatus PP grasps the remaining number (2x8) from the new customer tray CT and then the temporary load count 2 x 8) are gripped and then transported to the carrier board CB to remove the remaining number from the customer tray (CT).

Of course, it is also implemented to move the semiconductor elements in the temporary loading element 42 to the carrier board C.B even if the temporary load count in the temporary load element 42 is the last test load.

The flow from step S502 to step S503 in this first embodiment can be effectively applied when there is no semiconductor element currently temporarily loaded in the temporary loading element 42. [

Of course, the condition is not satisfied in step S504, or it is repeated from step S501 from the customer tray (CT) that is newly replaced after step S505 is completed.

Modification of First Embodiment

Steps S504 and S505 in the first embodiment are implemented when it is determined in step S502 that the remaining number in the customer tray (C.T), which is the current operation target, is less than 4.times.8.

However, it may be implemented such that the semiconductor device loaded on the temporary loading element is preferentially taken into consideration when the existing customer tray (C.T.) is replaced with a new customer tray (C.T.).

That is, when the empty customer tray (CT) is replaced with a new customer tray (CT) in a state where 2 × 8 semiconductor elements are loaded on the temporary loading element (42) Will be loaded. In this state, the pick and place apparatus PP first grasps 2 占 8 semiconductor elements from a new customer tray CT, then grasps the remaining 2 占 8 semiconductor elements from the temporary loading element 42, ) To be loaded and loaded.

Therefore, the condition of the replenishment movement in this modified example is that the sum of the number of temporary loads and the number of residuals is 4 x 8 or more.

&Lt; Embodiment 2 >

The moving method of the semiconductor device according to the present embodiment also takes place in a test handler having the loading part of Fig.

1. Basic Move <S601>

The pick and place apparatus PP moves the 4 x 8 semiconductor elements, which are once number of grips, from the customer tray CT to the carrier board CB.

2. Residual amount judgment <S602>

Step S601 is repeated and it is determined whether the number of semiconductor elements remaining in the customer tray CT is less than 4 x 8 (hereinafter referred to as &quot; remaining number &quot;).

3. Determination of replenishment amount <S603>

If it is determined in step S602 that the remaining number is 1 or more and less than 4 占 8, it is determined whether or not the sum of the number of temporary loads and the remaining number is less than or equal to 4 占 8.

4. Temporary transfer <S604a>

If it is determined in step S603 that the sum of the number of provisional loads and the number of residuals is less than 4 x 8, the pick and place apparatus PP moves the remaining number from the customer tray CT to the temporary loading element 42.

5. Supplementary Movement <S604b>

If it is determined in step S603 that the sum of the number of provisional loads and the number of residuals is greater than or equal to 4 x 8, 4 &lt; 8 &gt; semiconductor elements from the customer tray (CT) and temporary loading element After gripping, move it to the carrier board (CB). For example, if it is determined in step S602 that the remaining number is 2x8 and that the sum of the number of provisional loads and the remaining number is 4x8 in step S603, the pick-and-place apparatus PP sends 2 The remaining number is removed from the customer tray (CT) by gripping the remaining 8 x 8 pieces from the temporary loading element 42 and then transferring the remaining 2 x 8 pieces from the temporary loading element 42 to the carrier board CB.

The customer tray (C.T.) with the remaining number removed is replaced with a new customer tray (C.T), and the above steps are repeated for a new customer tray (C.T).

The flow from step S602 to step S604a or step S604b in this second embodiment can be effectively applied when there is a semiconductor element temporarily loaded in the temporary provisional element 42. [

Of course, it is also implemented to move the semiconductor elements in the temporary loading element 42 to the carrier board CB, even if the temporary load count in the current temporary load element 42 among the entire test load is the final test load.

The above-described first and second embodiments can be appropriately applied at the initial operation of the test handler before the socket off occurs.

&Lt; Third Embodiment >

The moving method of the semiconductor device according to the present embodiment is also applied to a test handler having a loading part shown in FIG. 4 when a socket off occurs.

1. First Basic Move <S701>

After gripping the 4 x 8 semiconductor elements which are the number of grips once by the pick and place apparatus PP, at least one semiconductor element gripped at a position corresponding to the socket off is moved and loaded to the buffer loading element 41.

2. Second basic movement <S702>

The remaining number of semiconductor elements other than the semiconductor element (s) loaded on the buffer loading element 41 are loaded and carried on the carrier board C.B.

The number of semiconductor elements to be loaded into the buffer loading element 41 by the socket off in steps S701 and S702 and the number of semiconductor elements to be moved to the carrier board CB can be changed in accordance with the number of socket offs at each operation . For example, at any first point in time, two of the semiconductor elements to be moved by the pick and place apparatus PP are loaded into the buffer loading element 41, but at another arbitrary point in time, Only one semiconductor element among the semiconductor elements to be moved once by the place apparatus PP can be loaded into the buffer loading element 41. [ In some cases, all of the 4 × 8 quantities held by one pick and place apparatus (PP) may not correspond to the socket off.

3. Residual amount judgment <S703>

Steps S701 and S702 are repeated, and it is determined whether the remaining number is 1 or more and less than 4 占 8.

4. Temporary movement <S704>

If it is determined in step S703 that the remaining number is less than 4 x 8, the pick-and-place apparatus P.P moves the remaining number from the customer tray C.T to the temporary loading element 42. [

When the semiconductor element is removed from the customer tray CT in step S704, the test handler replaces the empty customer tray CT with a new customer tray CT, and steps S701 and S702 are performed for the semiconductor elements of the new customer tray CT. If the pick and place apparatus PP repeats steps S701 and S702 five times for a new customer tray CT in step S703 for a new customer tray CT, × 8.

5. Condition satisfaction judgment <S705>

The sum of the number of semiconductor chips mounted on the buffer loading element 41 (hereinafter referred to as the number of buffered chips) and the remaining number remaining in the customer tray CT as the current operation target is stored in the carrier board CB, (That is, the amount of water that has been excluded from the socket-off quantity).

For example, in the case where a pick and place apparatus capable of gripping and moving 3 x 8 semiconductor elements at a time is used, the number of temporary loads is 8, the number of buffered loads is 6, the number of remaining buffers is 8, If the positions of the carrier boards CB to be moved correspond to two positions corresponding to the socket offsets, the condition is satisfied because the sum of the number of temporarily loaded numbers, the number of loaded buffers, and the remaining number is 22 or more .

Of course, even in the case where a pick-and-place apparatus PP capable of gripping and moving 4 x 8 semiconductor elements at once is applied as in the present embodiment, even if the work is continuously repeated, Only the eight semiconductor elements can be temporarily mounted on the temporary loading element 42 by following the method of removing the semiconductor elements first, so that even in this case, the sum of the temporary loading number, the buffer loading number, Is satisfied.

The condition in this step is that the sum of the number of temporary loads and the number of residuals is equal to or larger than one movement amount, the sum of the number of buffer loads and the remaining number is equal to or larger than one movement amount, Or that the quantity in the temporary loading element 42 is the last test quantity, and so on.

6. Supplementary Movement <S706>

If it is determined in step S705 that the conditions are satisfied, the pick and place apparatus PP grasps the remaining number from the new customer tray CT and then stores the semiconductor elements loaded on the buffer loading element 41 and the temporary loading element 42 And removes the remaining number from the customer tray (CT) by moving the carrier board (CB) by one movement amount by gripping.

Modification of Third Embodiment

In the third embodiment, steps S704 and S706 are implemented when it is determined in step S703 that the remaining number in the customer tray (C.T) to be the current job is less than 4.times.8.

However, according to the implementation, when the existing customer tray (CT) is replaced with a new customer tray (CT), the temporary loading element or the semiconductor element loaded in the buffer loading element It is possible.

<Fourth Embodiment>

The moving method of the semiconductor device according to the present embodiment is also applied to a test handler having a loading part shown in FIG. 4 when a socket off occurs.

1. First basic movement <S801>

After gripping the 4 x 8 semiconductor elements which are the number of grips once by the pick and place apparatus PP, at least one semiconductor element gripped at a position corresponding to the socket off is moved and loaded to the buffer loading element 41.

2. Second basic movement <S802>

The remaining number of semiconductor elements except for the semiconductor element (s) mounted on the buffer loading element 41 are loaded on the carrier board CB.

3. Residual amount judgment <S803>

Steps S801 and S802 are repeated and it is determined whether the remaining number in the customer tray (CT) is one or more and less than 4x8.

4. Determination of replenishment amount <S804>

If it is determined in step S803 that the remaining number is one or more but less than 4x8, it is determined whether the sum of the temporary number of loads, the number of buffered loads, and the remaining number is less than or equal to one movement amount. Of course, the determination may include determining whether the sum of the temporary number of loads and the remaining number is greater than or equal to one movement amount, whether the sum of the buffer loading number and the remaining number is greater than or equal to one movement amount, and the like.

5. Temporary transfer <S805a>

If it is determined in step S804 that the sum of the temporary number of loads, the number of buffered loads, and the remaining number is less than the one-time movement amount, the pick-and-place apparatus PP moves the remaining number from the customer tray CT to the temporary loading element 42 Load.

6. Supplementary movement <S805b>

If it is determined in step S804 that the sum of the temporary loading number, the buffer loading number, and the remaining number is greater than or equal to the one moving amount, the pick and place apparatus PP grasps the remaining number from the new customer tray CT, 41 and the temporary loading element 42, thereby removing the remaining number from the customer tray CT by moving the carrier board CB by one movement amount.

On the other hand, in the first to fourth embodiments, when the temporary movement or the supplementary movement is performed, the remaining number remaining in the customer tray (CT) is removed, and a new customer tray (CT) It is desirable to be implemented such that a moving operation is performed.

<Fifth Embodiment>

The moving method of the semiconductor device according to the present embodiment is also applied to a test handler having a loading part shown in FIG. 4 when a socket off occurs.

1. First Basic Move <S901>

After gripping the 4 x 8 semiconductor elements which are the number of grips once by the pick and place apparatus PP, at least one semiconductor element gripped at a position corresponding to the socket off is moved and loaded to the buffer loading element 41.

2. Second basic movement <S902>

The remaining number of semiconductor elements except for the semiconductor element (s) mounted on the buffer loading element 41 are loaded on the carrier board CB.

3. Residual amount judgment <S903>

Steps S701 and S702 are repeated, and it is determined whether the remaining number in the customer tray (CT) is 1 or more and less than 4 占 8.

4. Temporary transfer <S904>

If it is determined in step S904 that the remaining number is less than 4 x 8, the pick-and-place apparatus PP moves the remaining number from the customer tray CT to the temporary loading element 42.

5. Determination of replenishment amount <S905>

The sum of the number of the semiconductor elements temporarily mounted on the temporary loading element 42 (hereinafter referred to as the 'temporarily loaded number') and the number of the semiconductor elements loaded on the buffer loading element 41 Is greater than or equal to the amount of one movement amount to be transferred to the carrier board (CB) (the amount of water which is excluded from the socket-off amount).

6. Supplementary Movement <S906>

If it is determined in step S905 that the number of temporary storage and the number of buffered storage are equal to or larger than the amount of one movement, the semiconductor devices loaded on the buffer loading element 41 and the temporary loading element 42 are moved by the pick and place apparatus PP once Carry it to the carrier board (CB) and carry it.

If there is not enough semiconductor elements in the customer tray CT after step S906, the process returns to step S901. If there is no semiconductor element in the customer tray CT after step S906, And performs work according to one flow.

 Modification of the fifth embodiment

In the above fifth embodiment, it has been described that the residual amount determination <S903> is performed after the first basic movement <S901> and the second basic movement <S902>, and the temporary movement <S904> is performed.

However, according to the embodiment, after performing the first basic movement and the second basic movement, the supplementary amount is determined, and the supplementary movement is performed according to the result. After the supplementary movement, after returning to the customer tray, the remaining amount is determined, It is also possible to implement one basic movement and a second basic movement, or decide to make a temporary movement. These sequential changes can be variously implemented in the course of actual work execution and are equally applicable to the first to fourth embodiments described above.

In other words, in the first to fifth embodiments, it is described that the remaining amount determination is performed before the determination of the replenishment amount, but the determination of the replenishment amount is performed before the determination of the remaining amount, and the remaining amount is determined after the replenishment amount is shifted in accordance with the replenishment amount determination result , The temporary movement may be performed according to the result of the remaining amount determination, so that the order of the remaining amount determination and the determination of the replenishment amount may be changed in the method.

As described above, the first to fifth embodiments have been described to explain the present invention. However, the first to fifth embodiments can be implemented in one test handler.

For example, if there is no semiconductor element temporarily loaded in the temporary loading element 42 during the initial operation in which the socket off has not occurred, the test handler operates according to the flow according to the first embodiment, The test handler is operated according to the flow according to the second embodiment. When the buffer-loading element 41 or the temporary loading element 42 is in the empty state, the third and fourth embodiments follow the third and fourth embodiments when the socket-off in which the test socket is turned off by the continued operation of the tester occurs. When the test handler is operated in the flow according to the embodiment and the semiconductor element is loaded in the buffer loading element 41 or the temporary loading element 42, the test handler operates in accordance with the flow according to the fourth embodiment, The buffer loading element 41 and the temporary loading element 42 are first emptied for smooth operation of the test handler when the sum of the semiconductor elements loaded on the temporary loading element 41 and the temporary loading element 42 exceeds the amount of one movement The test handler is operated with the flow according to the fifth embodiment.

&Lt; Example in test handler having configuration of loading part such as second background >

This example applies when the loading portion has more maneuverable loading tables as in the second background art.

In the first to fifth embodiments described above, although the carrier board is applied as the second loading element which is the ultimate moving destination of the semiconductor elements, in this example the starting loading table is the second loading element and the carrier board is the third loading element . That is, although the ultimate movement destination of the semiconductor devices in this example is the carrier board which is the third loading element, the movement destination of the semiconductor device by the first pick and place apparatus performing the operations described in the first to fifth embodiments Lt; / RTI &gt; is a starting type loading table which is the second loading element.

Therefore, in this example, the operation of moving the semiconductor elements from the customer tray to the starting type loading table is replaced with the first pick and place operation, replacing the operations according to the first to fifth embodiments in which the semiconductor elements are moved from the customer tray to the carrier board. Device. Of course, the semiconductor devices loaded on the starter-type loading table are transported by the second pick-and-place device to the carrier board, which is the third loading element.

&Lt; Example in test handler having configuration of loading part such as the third background art >

This example has a configuration in which the starter-type loading table is divided into a first portion in which semiconductor elements to be loaded and a second portion in which semiconductor elements in a position corresponding to the soak off are stacked, as in the third background art .

In this case, only the actuation-type loading table is applied, and the second portion of the starting-type loading table is used as the buffer loading element and the temporary loading element. However, the same flow moving method as in the first to fifth embodiments is applied .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. And the scope of the present invention should be understood as the following claims and their equivalents.

Claims (7)

A basic shifting step of shifting the number of semiconductor elements by a pick-and-place apparatus from a first loading element to a second loading element by a number of one-time holding (hereinafter referred to as "N", N ≧ 2)
A remaining amount determining step of determining whether the number of semiconductor elements remaining in the first loading element (hereinafter, referred to as 'remaining number') is less than or equal to N, by repeating the basic shifting step;
A temporary moving step of moving the remaining number from the first loading element to the temporary loading element by the pick and place apparatus when it is determined that the remaining number is one or more but less than N in the remaining amount determining step;
Determining whether a condition for moving the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied;
A step of moving the semiconductor elements loaded on the temporary loading element to the second loading element by the pick and place apparatus when it is determined that the condition is satisfied in the condition satisfaction judgment step; &Lt; RTI ID = 0.0 &gt;
A method of moving a semiconductor device in a test handler. The method according to claim 1,
The conditions at the condition satisfaction determination step may be that the sum of the number of semiconductor devices temporarily suspended in the temporary loading element (hereinafter referred to as 'temporarily loaded number') and the remaining number is greater than or equal to N or that the temporary loading number And a test amount.
A method of moving a semiconductor device in a test handler. A basic shifting step of shifting the number of semiconductor elements by a pick-and-place apparatus from a first loading element to a second loading element by a number of one-time holding (hereinafter referred to as "N", N ≧ 2)
A remaining amount determining step of determining whether the number of semiconductor elements remaining in the first loading element (hereinafter referred to as &quot; remaining number &quot;) is one or more and less than N;
If it is determined that the remaining number is one or more and less than N in the remaining amount determining step, it is determined whether the sum of the number of semiconductor devices temporarily mounted on the temporary loading element (hereinafter referred to as 'temporarily loaded number') and the remaining number is less than N Determining a replenishment amount to be determined;
A temporarily moving step of temporarily loading the remaining number from the first loading element to the temporary loading element by the pick and place apparatus when it is determined in the replenishment amount determining step that the sum of the temporary loading number and the remaining number is less than N; And
If it is determined in the replenishment amount determination step that the sum of the temporary number and the remaining number is N or more, the pick and place apparatus grasps the N semiconductor elements from the first loading element and the temporary loading element and then moves to the second loading element A replenishing transfer stage to be loaded; &Lt; RTI ID = 0.0 &gt;
A method of moving a semiconductor device in a test handler. (Hereinafter, referred to as "N pieces", N ≧ 2) from the first loading element by the pick-and-place apparatus, and thereafter, the at least one semiconductor element held at the position corresponding to the socket- To a buffer loading element;
(Hereinafter, referred to as "L") except for the number (hereinafter, referred to as "M", 0 ≦ M <N) of the N semiconductor devices held in the first basic shifting step , M + L = N, where L is a value that can vary depending on the number of socket offsets that can be changed at each job run) to a second loading element;
Determining whether the number of semiconductor devices remaining in the first loading element (hereinafter referred to as &quot; remaining number &quot;) is one or more and less than N, by repeating the first basic shifting step and the second basic shifting step; ;
A temporary moving step of moving the remaining number from the first loading element to the temporary loading element by the pick and place apparatus when it is determined that the remaining number is one or more but less than N in the remaining amount determining step;
Determining whether a condition for moving the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied;
A step of moving the semiconductor elements loaded on the temporary loading element to the second loading element by the pick and place apparatus when it is determined that the condition is satisfied in the condition satisfaction judgment step; &Lt; RTI ID = 0.0 &gt;
A method of moving a semiconductor device in a test handler. 5. The method of claim 4,
The conditions in the condition satisfaction determination step include the number of semiconductor elements temporarily mounted on the temporary loading element (hereinafter referred to as 'temporarily loaded number'), the number of semiconductor elements loaded on the buffer loading element (hereinafter referred to as 'buffer loaded number' ) And the remaining number should be L or more, the sum of the number of temporary loading and the remaining number must be L or more, the total number of buffer loading and the remaining number must be L or more, And a water amount.
A method of moving a semiconductor device in a test handler. (Hereinafter, referred to as "N pieces", N ≧ 2) from the first loading element by the pick-and-place apparatus, and thereafter, the at least one semiconductor element held at the position corresponding to the socket- To a buffer loading element;
(Hereinafter, referred to as "L") except for the number (hereinafter, referred to as "M", 0 ≦ M <N) of the N semiconductor devices held in the first basic shifting step , M + L = N, where L is a value that can vary depending on the number of socket offsets that can be changed at each job run) to a second loading element;
If the sum of the number of semiconductor devices temporarily mounted on the temporary loading element (hereinafter referred to as 'temporarily loaded number') and the number of semiconductor devices loaded on the buffer loading element (hereinafter referred to as 'buffer loaded number') is less than L or L A replenishment amount determining step of determining whether the number of replenishment amounts is equal to or greater And
If it is determined in the replenishment amount determination step that the sum of the number of temporarily loaded stacks and the number of buffer loaded stacks is L or more, the pick and place apparatus grasps the L semiconductor elements from the buffer loading element and the temporary loading element and then moves to the second loading element A replenishing transfer stage to be loaded; / RTI &gt;
And if it is determined that the sum of the number of temporary storage and the number of buffered storage is less than L in the replenishment amount determination step, the first basic moving step and the second basic moving step are performed by the pick and place apparatus
A method of moving a semiconductor device in a test handler. The method according to claim 6,
And when the number of semiconductor elements remaining in the first loading element in the first basic moving step is less than N, the temporary moving step of moving the semiconductor elements of the first loading element to the temporary loading element Characterized by
A method of moving a semiconductor device in a test handler.

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