KR20110136940A - The method of moving a semiconductor device in a testhandler - Google Patents

Abstract

PURPOSE: A semiconductor device transfer method in a test handler is provided to sufficiently utilize an pick and place apparatus with a temporary loading element as a medium, thereby improving loading speed by reducing the overall moving distance of the pick and place apparatus. CONSTITUTION: A buffer loading element(41) and a temporary loading element(42) are included between a customer tray(C.T) and a carrier board(C.B). An alignment table(43) is placed between the buffer loading element, temporary loading element, and carrier board. The buffer loading element and temporary loading element is arranged side by side in left and right directions. 22×8 semiconductor devices are loaded in a 22×8 array form in the customer tray. 16×16 semiconductor devices are loaded in a 16×16 array form in the carrier board.

Description

Method of moving semiconductor device in test handler {THE METHOD OF MOVING A SEMICONDUCTOR DEVICE IN A TESTHANDLER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device movement technique in a test handler that operates when testing a semiconductor device.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process to be tested by the tester, and classifies the semiconductor devices according to the test results and loads them into a customer tray. It is already published through a number of public documents such as 0553992 (name of the test handler).

In general, the produced semiconductor device is supplied to the test handler while loaded in the customer tray, and the semiconductor device supplied to the test handler is loaded into the carrier board in the loading position and then loaded on the carrier board in the test position. The carrier board is then unloaded into the customer tray when the carrier board is in the unloading position. In this case, the carrier board is a loading element for loading a plurality of semiconductor devices in order to support a plurality of semiconductor devices to be tested at one time. Such a carrier board has a new concept of a newly proposed test tray and a recent concept. There is a test board.

In most cases, since the customer tray is intended to store and store semiconductor devices, the gap between semiconductor devices is configured so that the semiconductor devices can be loaded with a narrow gap, and the carrier board has a gap between the semiconductor devices for proper testing of semiconductor devices. It is configured to allow the semiconductor elements to be loaded so as to secure a suitable extent.

Therefore, when moving the semiconductor devices from the customer tray to the carrier board, it is necessary to adjust the spacing between the semiconductor elements. For this purpose, the test handler is provided with a pick and place device for adjusting and moving the spacing between the semiconductor elements.

The pick-and-place device grasps the semiconductor device from the customer tray, and then adjusts the gap between the semiconductor devices during the movement to load the semiconductor device on the carrier board. Regarding the technology of moving and loading a semiconductor device from a customer tray to a carrier board using such a pick and place device, Korean Patent No. 941672 discloses two technologies.

One of them is the technology referred to through the corresponding Patent Publication No. 1 and the description (hereinafter referred to as 'first background technology'), and the other is the technology referred to through the Fig. 2 and description (hereinafter referred to as 'second background technology'). Is).

In addition, there is also a technology (hereinafter referred to as 'third background technology') introduced through the prior application No. 10-2010-27577 filed by the applicant.

According to the first background art, as shown in FIG. 1, the pick and place device 110 holds 2 × 8 semiconductor elements from the customer tray C.T and moves them to the test tray T.T. At this time, the pick-and-place device 110 is configured to load the semiconductor device held at a position corresponding to the socket-off prior to moving and holding the held semiconductor devices to the test tray TT. After loading it into the loading buffer), only the remaining semiconductor elements are loaded into the test tray (TT).

For reference, the loading buffer 140 may include a first stacking portion 140a for stacking semiconductor devices to be excluded from movement due to the socket-off, and a second stack for aligning the semiconductor devices held by the pick and place device 110. It has a loading part 140b.

The socket-off above means that the test sockets in electrical contact with the semiconductor devices are installed on the test board of the tester in the same matrix form and number as the semiconductor devices loaded on the test trays. If the test by the test socket is determined to be meaningless, the tester stops the test by the test socket, and the test handler does not supply the semiconductor device to the test socket.

In addition, according to the second background technology, as shown in FIG. 2, the first pick-and-place device 210 (defined in the technical description as 'first loader hand') from the customer tray CT to 4 ×. After holding eight semiconductor elements, they are moved and loaded into a movable loading table 230 capable of reciprocating in the front-rear direction, and the second pick-and-place device 220 (defined as 'second loader hand' in the technical description) is a startup type. 16 × 2 semiconductor devices are gripped from the loading table 230 and then loaded into the test tray TT. At this time, the first pick-and-place device 210 is configured to load the semiconductor device held at a position corresponding to the socket-off buffer buffer element 240 prior to moving the loaded semiconductor device to the movable loading table 230. Is defined as a 'buffer'), and then only the remaining semiconductor elements are loaded into the mobile loading table 230.

According to the third background art, a buffer loading element for excluding a socket-off semiconductor element from moving and stacking the semiconductor element to a carrier board is provided in the movable loading table.

On the other hand, a customer tray for storing and storing semiconductor devices has a structure in which 20 x 8 semiconductor devices can be loaded in a 20 x 8 matrix form.

However, as semiconductor devices become smaller or larger, the number of semiconductor devices that can be loaded in a customer tray and the matrix form that are loaded also change arbitrarily.

In addition, although the pick-and-place device initially moved and grabbed 2 x 8 semiconductor elements as in the first background art, in order to reduce the moving speed of the semiconductor devices as the processing capacity of the test handler is increased, Similarly, the pick-and-place device may be configured to hold and move 4 x 8 semiconductor elements.

However, as shown in FIG. 3, a pick and place device (PP) configured to hold and move 4 × 8 semiconductor elements in a 4 × 8 matrix form and 22 × 8 semiconductor elements in a 22 × 8 matrix form can be loaded. When the customer tray CT is applied, the number of rows 22 of semiconductor elements loaded in the customer tray CT is not a multiple of the number of rows 4 of semiconductor elements held in the pick-and-place apparatus PP. Will not.

In this case, the pick-and-place device PP performs five movements to transfer 20 × 8 semiconductor elements from the customer tray to the test tray. Since only the remaining 2x8 is moved to), the full use of the pick and place apparatus PP is not achieved.

That is, if the number of rows of semiconductor elements loaded in the customer tray CT is not a multiple of the number of rows of semiconductor elements held in the pick and place device PP, the pick and place device PP may not be sufficiently utilized. This may cause a decrease in loading speed.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for moving a semiconductor device that can fully utilize a pick and place device even when the number of rows of semiconductor devices loaded in a customer tray is not a multiple of the number of rows of semiconductor devices held in the pick and place device.

The semiconductor device movement method in the test handler according to the first aspect of the present invention for achieving the above object, by the pick-and-place device, the number of holdings (hereinafter referred to as "N", N ≥ 2) A basic moving step of moving and stacking the elements from the first loading element to the second loading element; A remaining amount determining step of determining whether the number of semiconductor elements (hereinafter, referred to as the "number of residues") remaining in the first stacking element is repeatedly one or more and less than N while repeatedly performing the basic movement step; A temporary moving step of moving and stacking the remaining number from the first loading element to the temporary loading element by the pick-and-place apparatus when it is determined that the remaining number is one or more and less than N in the remaining amount determination step; A condition satisfaction determination step of determining whether a condition for moving and loading the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied; A replenishment moving step of moving and stacking the semiconductor elements loaded on the temporary loading element by the pick and place device to the second loading element when it is determined that the condition is satisfied in the condition satisfaction determination step; It includes.

The condition in the condition satisfaction determination step is that the sum of the number of semiconductor devices temporarily loaded in the temporary loading element (hereinafter referred to as the "temporary loading number") and the remaining number is N or more, or the temporary loading number of the total test quantity is the last. It is preferable that it is at least any one of a test quantity.

In addition, the semiconductor device movement method in the test handler according to the second aspect of the present invention for achieving the above object, by the pick-and-place device as a single number of grips (hereinafter referred to as "N", N ≥ 2) A basic movement step of moving and loading the semiconductor elements of the first loading element from the first loading element; A remaining amount determining step of determining whether the number of semiconductor elements remaining in the first stacking element (hereinafter, referred to as the remaining number) is one or more and less than N; If it is determined in the remaining amount determination step that the remaining number is one or more and less than N, it is determined whether the sum of the number of semiconductor elements temporarily loaded in the temporary loading element (hereinafter referred to as the temporary loading number) and the remaining number is less than N. A replenishment determination step of judging; A temporary movement step of temporarily moving and loading the remaining number from the first loading element to the temporary loading element by the pick-and-place apparatus when it is determined that the sum of the temporary loading number and the remaining number is less than N in the replenishment determination step; And when it is determined in the replenishment determining step that the sum of the number of temporary loads and the remaining number is N or more, the semiconductor device is gripped by the pick-and-place apparatus from the first loading element and the temporary loading element to the second loading element. A replenishment moving step of moving loading; It includes.

In addition, the method of moving the semiconductor device in the test handler according to the third aspect of the present invention for achieving the above object, the number of grips once from the first loading element by the pick and place device (hereinafter referred to as 'N pieces', A first basic movement step of holding and holding N? 2) semiconductor elements, and then moving and loading at least one semiconductor element held at a position corresponding to the socket-off to a buffer loading element; The remaining number (hereinafter referred to as 'L') except for the number of N semiconductor elements held in the first basic movement step, which are moved and loaded into the buffer loading element (hereinafter referred to as 'M', 0 ≤ M <N) (M + L = N, where L is a value that can vary depending on the number of socket-offs that can be changed each time a work is performed); Residual amount determination step of determining whether the number of semiconductor elements (hereinafter referred to as "remaining number") remaining in the first loading element is one or more and less than N while repeatedly performing the first basic movement step and the second basic movement step. ; A temporary moving step of moving and stacking the remaining number from the first loading element to the temporary loading element by the pick-and-place apparatus when it is determined that the remaining number is one or more and less than N in the remaining amount determination step; A condition satisfaction determination step of determining whether a condition for moving and loading the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied; A replenishment moving step of moving and stacking the semiconductor elements loaded on the temporary loading element by the pick and place device to the second loading element when it is determined that the condition is satisfied in the condition satisfaction determination step; It includes.

The condition in the condition satisfaction determination step is the number of semiconductor devices temporarily loaded in the temporary stacking elements (hereinafter referred to as "temporary stacking number"), the number of semiconductor devices loaded in the buffer stacking elements (hereinafter referred to as "buffer stacking number"). ) And the sum of the remaining number is at least L, the sum of the temporary load and the remaining number is at least L, the sum of the buffer load and the remaining number is at least L, and the temporary load count is the last test of the total test quantity. It is preferable that it is at least any one of quantity.

Method of moving a semiconductor device in the test handler according to the fourth aspect of the present invention for achieving the above object,

At least one semiconductor device held by a pick-and-place device at a position corresponding to the socket-off after holding a number of holding devices (hereinafter referred to as 'N', N ≥ 2) once from the first mounting element A first basic moving step of moving and loading the buffer into the buffer loading element;

The remaining number (hereinafter referred to as 'L') except for the number of N semiconductor elements held in the first basic movement step, which are moved and loaded into the buffer loading element (hereinafter referred to as 'M', 0 ≤ M <N) (M + L = N, where L is a value that can vary depending on the number of socket-offs that can be changed each time a work is performed); The sum of the number of semiconductor devices temporarily loaded in the temporary stacking elements (hereinafter referred to as "temporary stacking number") and the number of semiconductor devices loaded in the buffer stacking elements (hereinafter referred to as "buffer stacking number") is less than L or L Replenishment determination step of determining whether or not; And when it is determined in the replenishment determining step that the sum of the number of temporary loads and the number of buffer loads is L or more, the semiconductor device holds the L semiconductor elements from the buffer loading element and the temporary loading element by the pick-and-place apparatus and then moves to the second loading element. A replenishment moving step of moving loading; And if it is determined that the sum of the temporary load number and the buffer load number is less than L in the replenishment determination step, the first basic movement step and the second basic movement step are performed by a pick and place device.

If the number of the semiconductor elements remaining in the first loading element in the first basic movement step is less than one or less than N, further comprising a temporary movement step of moving the semiconductor element of the first loading element to the temporary loading element .

According to the present invention as described above, even if the number of rows of semiconductor devices loaded in the customer tray is not a multiple of the number of rows of semiconductor devices held in the pick and place device, the pick and place device can be fully utilized through the temporary loading element as a whole. Reducing the travel distance of the place device has an elevated effect that ultimately improves the loading speed.

1 is a reference diagram for explaining a first background art.
2 is a reference diagram for explaining a second background technology.
FIG. 3 is a reference view for explaining an example in which the number of rows of semiconductor elements loaded in the customer tray does not become a multiple of the number of rows of semiconductor elements held by the pick-and-place apparatus.
4 is a reference diagram for explaining a loading portion of a test handler to which a method of moving a semiconductor device in a test handler according to an embodiment of the present invention can be applied.
5 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a first embodiment of the present invention.
6 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a second embodiment of the present invention.
7 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a third embodiment of the present invention.
8 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a fourth embodiment of the present invention.
9 is a flowchart illustrating a method of moving a semiconductor device in a test handler according to a fifth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

<First Embodiment>

4 shows a configuration of a loading portion to which the semiconductor device movement method according to the first embodiment is applied. In the description, the term “loading” is defined as moving a semiconductor device of a customer tray C.T onto a carrier board C.B.

The loading portion includes a buffer stacking element 41 and a temporary stacking element 42 provided between the customer tray CT, which is the first stacking element, and the carrier board CB, which is the second stacking element. 41) and an alignment table 43 is further provided between the temporary loading element 42 and the carrier board CB. That is, the customer tray CT, the buffer stacking element 41 and the temporary stacking element 42, the alignment table 43, the carrier board (CB) are arranged in order from the front to the rear, the buffer stacking element 41 and the temporary The loading elements 42 are provided side by side in the lateral direction.

Here, the front, rear, left and right pitches of the buffer stacking element 41 and the temporary stacking element 42 are configured to be the same. If the front, rear, left, and right pitches of the buffer stacking element 41 and the temporary stacking element 42 are not the same, the pick-and-place device PP is the buffer stacking element 41 and the temporary stacking element 42 as described later. This is because when the semiconductor device is held, the loading speed may decrease due to the pitch conversion. The front, rear, left and right pitches of the buffer loading element 41 may be the same as the front, rear, left and right pitches of the customer tray CT or the same as the front, rear, left and right pitches of the carrier board CB, depending on the configuration of the equipment. Only one direction pitch of the tray CT or the carrier board CN may be the same, and the other direction may be designed differently.

The loading portion further has a pick and place device (P.P) for moving the semiconductor elements.

In the customer tray C.T, 22 x 8 semiconductor elements are stacked in a 22 x 8 matrix form, and in the carrier board C.B, 16 x 16 semiconductor elements are stacked in a 16 x 16 matrix form.

2 × 8 semiconductor elements may be loaded in the buffer stacking element 41 and the temporary stacking element 42, respectively. Of course, depending on the implementation, both the buffer loading element 41 and the temporary loading element 42 may be configured to accommodate 3 × 8, 4 × 8 or more semiconductor elements.

The alignment table 43 is configured to align 4x8 semiconductor elements. In general, the semiconductor devices held by the pick-and-place device PP may be skewed due to the impact caused by the gap adjustment. The pick-and-place device PP places the semiconductor devices on the alignment table 43. After repositioning, the postures of the semiconductor devices are aligned. Therefore, the pick-and-place device PP passes through the alignment table 43 before adjusting the distance between the semiconductor devices and moving the stacking device onto the carrier board CB. Since the technical matters are well known, detailed description thereof will be omitted. .

The pick-and-place device (P.P) can hold and move 4 x 8 semiconductor elements, and is provided to adjust the distance between the held semiconductor elements.

Of course, the replacement of the customer tray (CT), the replacement of the carrier board (CB) and the judgment for the operation control and control of the pick and place device (PP), etc. are operated in a separate control device in real time operation control.

Subsequently, the method of moving the semiconductor device according to the present example in the test handler having the configuration of the loading portion as described above will be described with reference to the flowchart of FIG.

1. Basic Move <S501>

The pick and place device PP moves 4 × 8 semiconductor elements, which are the number of grips, from the customer tray CT to the carrier board CB.

2. Remaining judgment <S502>

After repeating step S501, it is determined whether the number of semiconductor elements remaining in the customer tray CT (hereinafter referred to as “remaining number”) is one or more and less than 4 × 8. In the present exemplary embodiment, when 4 × 8 semiconductor elements are moved five times from the customer tray CT to the carrier board CB by the pick and place device PP, the remaining number of the customer tray CT is 2 × 8. It will therefore be judged that the remaining number is less than 4x8.

3. Temporary move <S503>

If it is determined in step S502 that the remaining number is less than 4x8, the remaining number is moved and loaded from the customer tray C.T to the temporary stacking element 42 by the pick and place device P.P.

If the semiconductor device is removed from the customer tray CT by S503, the test handler replaces the empty customer tray CT with a new customer tray CT, and step S501 is performed for the semiconductor devices of the new customer tray CT. Subsequently, if the pick and place apparatus PP repeats step S501 five times for the new customer tray CT, the remaining number is determined to be 2 × 8 in step S502 for the new customer tray CT. Will be done.

4. Determination of Condition Satisfaction <S504>

It is determined whether the sum of the number of semiconductor devices temporarily loaded in the temporary loading element 42 (hereinafter referred to as the "temporary loading number") and the remaining number remaining in the customer tray CT which is the current work target is 4x8. In other words, in the present embodiment, the sum of the temporary loading number and the remaining number will be 4 × 8 pieces, and there will be 2 × 8 pieces in the temporary loading element 42 and 2 × 8 pieces in the new customer tray CT. At that point the condition is satisfied.

5. Replenishment move <S505>

If it is determined in step S504 that the condition is satisfied, the pick-and-place device PP grasps the remaining number (2 x 8 pieces) from the new customer tray CT and then loads the temporary stacking number loaded on the temporary stacking element 42 ( 2 × 8 pieces) are evenly gripped and moved to the carrier board CB to remove the remaining number from the customer tray CT.

Of course, even if the temporary load number in the temporary loading element 42 of the total test quantity is the last test quantity, the semiconductor elements in the temporary loading element 42 may be implemented to move and load the carrier board C.B.

In this first embodiment, the flow from step S502 to step S503 can be effectively applied when there is no semiconductor element currently temporarily loaded in the temporary loading element 42.

Of course, after the condition is not satisfied in step S504, or after step S505 is completed, step S501 is repeated from the newly replaced customer tray CT.

Modification of the first embodiment

In the first embodiment, steps S504 and S505 are implemented to be performed when it is determined in step S502 that the number remaining in the customer tray C.T, which is the current work target, is less than 4 × 8.

However, according to the implementation, when the existing customer tray C.T is replaced with a new customer tray C.T, the semiconductor device loaded in the temporary loading element may be considered to be moved and loaded.

That is, when the empty customer tray CT is replaced with a new customer tray CT while 2 × 8 semiconductor devices are loaded in the temporary stacking element 42, the 22 × 8 semiconductor devices are included in the new customer tray CT. Will be loaded. In this state, the pick-and-place device PP first holds 2 × 8 semiconductor devices from the new customer tray CT, and then holds the remaining 2 × 8 semiconductor devices from the temporary stacking element 42 and then the carrier board CB. To load it into

Therefore, the condition of the replenishment movement in such a modification is that the sum of the temporary load number and the remaining number is 4 × 8 or more.

Second Embodiment

A method of moving a semiconductor device according to the present embodiment is also performed in a test handler having a loading portion of FIG.

1. Basic Move <S601>

The pick and place device PP moves 4 × 8 semiconductor elements, which are the number of grips, from the customer tray CT to the carrier board CB.

2. Remaining judgment <S602>

After repeating step S601, it is determined whether the number of semiconductor elements remaining in the customer tray CT (hereinafter, referred to as “remaining number”) is one or more and less than 4 × 8.

3. Determination of replenishment amount <S603>

If it is determined in step S602 that the remaining number is one or more and less than 4 × 8, it is determined whether the sum of the temporary loading number and the remaining number is less than 4 × 8 or more.

4. Temporary move <S604a>

If it is determined in step S603 that the sum of the temporary stacking number and the remaining number is less than 4x8, the remaining number is transferred from the customer tray CT to the temporary stacking element 42 by the pick-and-place apparatus PP.

5. Replenishment move <S604b>

If it is determined in step S603 that the sum of the temporary stacking number and the remaining number is 4 × 8 or more, 4 × 8 semiconductor devices are removed from the customer tray CT and the temporary stacking element 42 by the pick-and-place device PP. After gripping, transfer it to the carrier board (CB). For example, if it is determined in step S602 that the remaining number is 2 × 8 and the sum of the temporary loading number and the remaining number is 4 × 8 in step S603, the pick-and-place device PP determines from the customer tray CT 2. The remaining number is removed from the customer tray CT by first gripping the x8 pieces and then grasping the remaining 2x8 pieces from the temporary stacking element 42 and then moving the stack onto the carrier board CB.

The customer tray C.T from which the remaining number is removed is replaced with a new customer tray C.T, and the above steps are repeated for the new customer tray C.T.

In this second embodiment, the flow from step S602 to step S604a or step S604b can be effectively applied when there is a semiconductor element currently temporarily loaded in the temporary loading element 42.

Of course, even if the temporary load number in the current temporary load element 42 of the total test quantity is the last test quantity, the semiconductor elements in the temporary load element 42 are loaded to the carrier board CB.

The above-described first and second embodiments can be suitably applied at the initial operation of the test handler before the socket off occurs.

Third Embodiment

The method of moving the semiconductor device according to the present embodiment is also performed in the test handler having the loading portion of FIG. 4 and is applied when a socket off occurs.

1.First basic move <S701>

After holding the 4x8 semiconductor elements, which are the number of holdings, by the pick-and-place apparatus PP, at least one semiconductor element held at a position corresponding to the socket-off is moved and loaded into the buffer stacking element 41.

2. Second basic move <S702>

The remaining number of semiconductor devices except for the semiconductor device (s) loaded on the buffer stacking element 41 is moved and loaded onto the carrier board C.B.

In steps S701 and S702, the number of semiconductor devices to be loaded into the buffer stacking element 41 by the socket-off and the number of semiconductor devices moved to the carrier board CB may be changed according to the number of socket-offs in each operation. . For example, two semiconductor elements of the semiconductor elements to be moved once by the pick-and-place apparatus PP are loaded into the buffer loading element 41 at an arbitrary first time point, but pick-and-play at another arbitrary second time point. Only one semiconductor element of the semiconductor elements to be moved once by the place apparatus PP can be loaded into the buffer loading element 41. In some cases, all of the 4 × 8 items held by one pick and place apparatus PP may not correspond to the socket-off.

3. Remaining judgment <S703>

While repeating steps S701 and S702, it is determined whether the remaining number is one or more and less than 4 × 8.

4. Temporary move <S704>

If it is determined in step S703 that the remaining number is less than 4x8, the remaining number is moved and loaded from the customer tray C.T to the temporary stacking element 42 by the pick and place device P.P.

When the semiconductor device is removed from the customer tray CT by S704, the test handler replaces the empty customer tray with a new customer tray CT, and steps S701 and S702 is subsequently performed, and if the pick and place apparatus PP repeatedly performs steps S701 and S702 for the new customer tray CT, the remaining number is 2 in step S703 for the new customer tray CT. It will be judged as x8.

5. Determination of Condition Satisfaction <S705>

The sum of the temporary stacking number, the number of semiconductor devices loaded on the buffer stacking element 41 (hereinafter referred to as the 'buffer stacking number'), and the remaining number remaining in the customer tray CT that is currently being worked on is the carrier board CB. It is determined whether or not the quantity of one movement to be moved to (the amount of socket-off is excluded).

For example, if a pick and place device that can hold and move 3 × 8 semiconductor elements at a time is applied, there are eight temporary stacks, six buffer stacks, and eight remaining stacks. If the positions corresponding to the socket-off are two groups in the positions of the carrier board CB to be moved, the sum of the temporary load number, the buffer load number, and the remaining number is 22 or more, which is a moving quantity, so the condition is satisfied. .

Of course, even in the case where the pick and place apparatus PP capable of holding and moving 4 x 8 semiconductor elements at a time is applied as in the present embodiment, the operation is continuously repeated and loaded on the buffer stacking element 41. Since only eight semiconductor devices can be temporarily loaded in the temporary stacking element 42 by following the method of removing the semiconductor devices first, even in this case, the sum of the temporary stacking number, the buffer stacking number and the remaining number is more than one moving quantity. It is necessary to determine whether it is satisfied.

Further, in this step, the condition is that the sum of the temporary load number and the remaining number is at least one moving amount, the sum of the buffer loading number and the remaining number is at least one moving amount, and the buffer loading element 41 of the total test quantities. Or the quantity in the temporary loading element 42 may be the last test quantity.

6. Replenishment move <S706>

If it is determined in step S705 that the condition is satisfied, the semiconductor devices loaded on the buffer stacking element 41 and the temporary stacking element 42 are gripped by the pick-and-place device PP from the new customer tray CT. The remaining number is removed from the customer tray CT by moving and loading the carrier board CB by one movement amount by holding.

Modification of the third embodiment

In the third embodiment, steps S704 and S706 are implemented to be performed when it is determined in step S703 that the remaining number in the customer tray C.T, which is the current work target, is less than 4 × 8.

However, according to the implementation, when the existing customer tray CT is replaced with a new customer tray CT, the semiconductor device loaded in the temporary loading element or the buffer loading element 41 is considered to be moved and loaded. It may be.

<Fourth Embodiment>

The method of moving the semiconductor device according to the present embodiment is also performed in the test handler having the loading portion of FIG. 4 and is applied when a socket off occurs.

1.First basic move <S801>

After holding the 4x8 semiconductor elements, which are the number of holdings, by the pick-and-place apparatus PP, at least one semiconductor element held at a position corresponding to the socket-off is moved and loaded into the buffer stacking element 41.

2. Second basic move <S802>

The remaining number of semiconductor elements except for the semiconductor element (s) stacked on the buffer stacking element 41 is transferred to the carrier board CB.

3. Remaining judgment <S803>

While repeating steps S801 and S802, it is determined whether there are more than one remaining number less than 4 x 8 remaining in the customer tray CT.

4. Determination of replenishment amount <S804>

If it is determined in step S803 that the remaining number is one or more and less than 4 × 8, it is determined whether the sum of the temporary loading number, the buffer loading number, and the remaining number is less than one moving amount. Of course, the determination may also include whether the sum of the temporary load number and the remaining number is more than one moving amount, and whether the sum of the buffer loading number and the remaining number is more than one moving amount.

5. Temporary move <S805a>

If it is determined in step S804 that the sum of the temporary load number, the buffer load number and the remaining number is less than one movement quantity, the remaining number is moved from the customer tray CT to the temporary loading element 42 by the pick-and-place apparatus PP. Load it.

6. Replenishment move <S805b>

If it is determined in step S804 that the sum of the temporary load number, the buffer load number, and the remaining number is more than one movement quantity, the remaining number is held by the pick and place device PP from the new customer tray CT, and then the buffer loading element ( 41) and the remaining number from the customer tray CT by removing the remaining number from the customer tray CT by moving and loading the semiconductor elements loaded on the temporary loading element 42 to the carrier board CB by one moving amount.

Meanwhile, in the above first to fourth embodiments, when the temporary movement or the supplementary movement is performed, the remaining number remaining in the customer tray CT is removed, and the semiconductor device is replaced with the new customer tray CT. Preferably, the move operation is implemented.

<Fifth Embodiment>

The method of moving the semiconductor device according to the present embodiment is also performed in the test handler having the loading portion of FIG. 4 and is applied when a socket off occurs.

1.First basic move <S901>

After holding the 4x8 semiconductor elements, which are the number of holdings, by the pick-and-place apparatus PP, at least one semiconductor element held at a position corresponding to the socket-off is moved and loaded into the buffer stacking element 41.

2. Second basic move <S902>

The remaining number of semiconductor elements except for the semiconductor element (s) stacked on the buffer stacking element 41 is transferred to the carrier board CB.

3. Remaining judgment <S903>

While repeating steps S701 and S702, it is determined whether there are more than one remaining number less than 4 × 8 pieces remaining in the customer tray CT.

4. Temporary move <S904>

If it is determined in step S904 that the remaining number is less than 4 x 8 pieces, the remaining number is transferred from the customer tray CT to the temporary stacking element 42 by the pick-and-place apparatus PP.

5. Determination of replenishment amount <S905>

The sum of the number of semiconductor devices temporarily loaded in the temporary stacking element 42 (hereinafter referred to as "temporary stacking number") and the number of semiconductor devices loaded in the buffer stacking element 41 (hereinafter referred to as "buffer stacking number"). It is determined whether or not the quantity of one movement to be moved to the carrier board CB (the amount of socket-off is excluded).

6. Replenishment move <S906>

If it is determined in step S905 that the temporary stacking number and the buffer stacking number are more than one moving quantity, the semiconductor elements loaded on the buffer stacking element 41 and the temporary stacking element 42 are moved once by the pick-and-place apparatus PP. Grip by the amount of the transfer to the carrier board (CB).

If the semiconductor device remains in the customer tray CT after step S906, the process returns to step S901. If there is no semiconductor device in the customer tray CT after step S906, the new customer tray CT is replaced. Perform work according to flows.

 Modification example of the fifth embodiment

In the fifth embodiment, it is described that the remaining amount determination <S903> and the temporary movement <S904> are performed after the first basic movement <S901> and the second basic movement <S902>.

However, according to the implementation, after the first basic movement and the second basic movement, the replenishment determination is made, and then the replenishment movement is performed according to the result. It is also possible to implement to determine whether to make the 1st basic movement and the 2nd basic movement or temporary movement. The order change may be implemented in various ways during the actual work execution, and may be equally applicable to the first to fourth embodiments described above.

That is, in the first to fifth embodiments, it is described that the remaining amount determination is performed before the refill amount determination. In this case, the order of the remaining amount judgment and the replenishment amount judgment may be changed in the method since the temporary movement may be performed according to the result of the remaining amount judgment.

As described above, the present invention has been described by dividing into the first to fifth embodiments, but the first to fifth embodiments may be implemented in one test handler.

For example, when there is no semiconductor device temporarily loaded in the temporary stacking element 42 during the initial operation without a socket-off occurring, the test handler operates according to the flow according to the first embodiment, and then the temporary stacking element 42 is operated. If there is a temporarily loaded semiconductor device in the test handler according to the flow according to the second embodiment. When the socket-off to which the test socket is turned off by the continuous operation of the tester occurs, according to the third and fourth embodiments, in the case where the buffer loading element 41 or the temporary loading element 42 is empty, the third When the test handler is operated by the flow according to the embodiment and the semiconductor device is loaded on the buffer loading element 41 or the temporary loading element 42, the test handler is operated by the flow according to the fourth embodiment, and the buffer loading element When the sum of the semiconductor elements loaded on the 41 and the temporary stacking element 42 is greater than one moving amount, the buffer stacking element 41 and the temporary stacking element 42 are emptied first for smooth operation of the test handler. Preferably, the test handler is operated in the flow according to the fifth embodiment.

<Example in a test handler having a loading part configuration like the second background>

This example applies when the loading portion further has a maneuverable loading table as in the second background art.

In the above-described first to fifth embodiments, the carrier board is applied as the second loading element which is the ultimate moving destination of the semiconductor elements, but in this example, the movable loading table is the second loading element and the carrier board is the third loading element. Is different. That is, in this example, the ultimate moving destination of the semiconductor devices is the carrier board which is the third loading element, but the moving destination of the semiconductor device by the first pick and place device which performs the operation described in the first to fifth embodiments described above. Becomes the actuated loading table which is the second loading element.

Therefore, in this example, the operation of moving the semiconductor element from the customer tray to the movable loading table in place of the operation according to the first to fifth embodiments described above for moving and loading the semiconductor element from the customer tray to the carrier board is the first pick and place. By the device. Of course, the semiconductor devices loaded on the actuated loading table are moved and loaded onto the carrier board as the third loading element by the second pick and place device.

<Example in test handler with loading part configuration like 3rd background art>

This example has a configuration in which the movable loading table is divided into a first portion in which semiconductor elements to be moved and loaded onto a carrier board and a second portion in which a semiconductor element at a position corresponding to a soke-off is loaded, as in the third background art. Applies in the case.

Even in this case, except that the mobile loading table is applied and the second part of the mobile loading table is used as the buffer loading element and the temporary loading element, the same flow moving method as in the first to fifth embodiments can be applied. Can be.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. And the scope of the present invention should be understood as the following claims and their equivalents.

Claims (7)

A basic moving step of moving and stacking the semiconductor devices by the pick-and-place apparatus from the first stacking element to the second stacking element by the number of grips (hereinafter referred to as 'N', N &gt; 2) once;
A remaining amount determining step of determining whether the number of semiconductor elements (hereinafter, referred to as the "number of residues") remaining in the first stacking element is repeatedly one or more and less than N while repeatedly performing the basic movement step;
A temporary moving step of moving and stacking the remaining number from the first loading element to the temporary loading element by the pick-and-place apparatus when it is determined that the remaining number is one or more and less than N in the remaining amount determination step;
A condition satisfaction determination step of determining whether a condition for moving and loading the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied;
A replenishment moving step of moving and stacking the semiconductor elements loaded on the temporary loading element by the pick and place device to the second loading element when it is determined that the condition is satisfied in the condition satisfaction determination step; Characterized in that it comprises
Method of moving a semiconductor device in a test handler. The method of claim 1,
The condition in the condition satisfaction determination step is that the sum of the number of semiconductor devices temporarily loaded in the temporary loading element (hereinafter referred to as the temporary loading number) and the remaining number is N or more, or the temporary loading number of the total test quantity is the last. At least one of the test quantity characterized in that
Method of moving a semiconductor device in a test handler. A basic moving step of moving and stacking the semiconductor devices by the pick-and-place apparatus from the first stacking element to the second stacking element by the number of grips (hereinafter referred to as 'N', N &gt; 2) once;
A remaining amount determining step of determining whether the number of semiconductor elements remaining in the first stacking element (hereinafter, referred to as the remaining number) is one or more and less than N;
If it is determined in the remaining amount determination step that the remaining number is one or more and less than N, it is determined whether the sum of the number of semiconductor elements temporarily loaded in the temporary loading element (hereinafter referred to as the temporary loading number) and the remaining number is less than N. A replenishment determination step of judging;
A temporary movement step of temporarily moving and loading the remaining number from the first loading element to the temporary loading element by the pick-and-place apparatus when it is determined that the sum of the temporary loading number and the remaining number is less than N in the replenishment determination step; And
If it is determined that the sum of the number of temporary loads and the remaining number is N or more in the replenishment determination step, the pick and place device holds the N semiconductor elements from the first and temporary load elements and moves to the second load element. A replenishment transfer step of loading; Characterized in that it comprises
Method of moving a semiconductor device in a test handler. At least one semiconductor device held by a pick-and-place device at a position corresponding to the socket-off after holding a number of holding devices (hereinafter referred to as 'N', N ≥ 2) once from the first mounting element A first basic moving step of moving and loading the buffer into the buffer loading element;
The remaining number (hereinafter referred to as 'L') except for the number of N semiconductor elements held in the first basic movement step, which are moved and loaded into the buffer loading element (hereinafter referred to as 'M', 0 ≤ M <N) (M + L = N, where L is a value that can vary depending on the number of socket-offs that can be changed each time a work is performed);
Residual amount determination step of determining whether the number of semiconductor elements (hereinafter referred to as "remaining number") remaining in the first loading element is one or more and less than N while repeatedly performing the first basic movement step and the second basic movement step. ;
A temporary moving step of moving and stacking the remaining number from the first loading element to the temporary loading element by the pick-and-place apparatus when it is determined that the remaining number is one or more and less than N in the remaining amount determination step;
A condition satisfaction determination step of determining whether a condition for moving and loading the semiconductor elements loaded on the temporary loading element to the second loading element is satisfied;
A replenishment moving step of moving and stacking the semiconductor elements loaded on the temporary loading element by the pick and place device to the second loading element when it is determined that the condition is satisfied in the condition satisfaction determination step; Characterized in that it comprises
Method of moving a semiconductor device in a test handler. The method of claim 4, wherein
The condition in the condition satisfaction determination step is the number of semiconductor devices temporarily loaded in the temporary stacking elements (hereinafter referred to as "temporary stacking number"), the number of semiconductor devices loaded in the buffer stacking elements (hereinafter referred to as "buffer stacking number"). ) And the sum of the remaining number is at least L, the sum of the temporary load and the remaining number is at least L, the sum of the buffer load and the remaining number is at least L, and the temporary load count is the last test of the total test quantity. Characterized in that at least one of the quantity
Method of moving a semiconductor device in a test handler. At least one semiconductor device held by a pick-and-place device at a position corresponding to the socket-off after holding a number of holding devices (hereinafter referred to as 'N', N ≥ 2) once from the first mounting element A first basic moving step of moving and loading the buffer into the buffer loading element;
The remaining number (hereinafter referred to as 'L') except for the number of N semiconductor elements held in the first basic movement step, which are moved and loaded into the buffer loading element (hereinafter referred to as 'M', 0 ≤ M <N) (M + L = N, where L is a value that can vary depending on the number of socket-offs that can be changed each time a work is performed);
The sum of the number of semiconductor devices temporarily loaded in the temporary stacking elements (hereinafter referred to as "temporary stacking number") and the number of semiconductor devices loaded in the buffer stacking elements (hereinafter referred to as "buffer stacking number") is less than L or L Replenishment determination step of determining whether or not; And
If it is determined in the replenishment determination step that the sum of the number of temporary loads and the number of buffer loads is equal to or greater than L, the pick and place device holds the L semiconductor elements from the buffer loading element and the temporary loading element and moves to the second loading element. A replenishment transfer step of loading; Including;
If it is determined that the sum of the temporary load number and the buffer load number is less than L in the replenishment determination step, the first basic movement step and the second basic movement step are performed by a pick and place device.
Method of moving a semiconductor device in a test handler. The method of claim 6,
If the number of semiconductor elements remaining in the first loading element in the first basic movement step is less than one or more than N, further comprising a temporary movement step of moving and loading the semiconductor element of the first loading element to the temporary loading element Characterized by
Method of moving a semiconductor device in a test handler.

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