CN111989579A - Component handler - Google Patents

Component handler Download PDF

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Publication number
CN111989579A
CN111989579A CN201980026273.4A CN201980026273A CN111989579A CN 111989579 A CN111989579 A CN 111989579A CN 201980026273 A CN201980026273 A CN 201980026273A CN 111989579 A CN111989579 A CN 111989579A
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CN
China
Prior art keywords
component
tray
test
components
cover member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980026273.4A
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Chinese (zh)
Inventor
柳弘俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Slaughter Co ltd
JT Corp
Original Assignee
Slaughter Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Slaughter Co ltd filed Critical Slaughter Co ltd
Priority to CN202310316705.3A priority Critical patent/CN116359699A/en
Publication of CN111989579A publication Critical patent/CN111989579A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2642Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868Complete testing stations; systems; procedures; software aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a component handler, comprising: an X-Y table (110) for moving a test board (20) carrying a plurality of components (10) in an X-Y direction; a pair of buffer bag parts (210, 220) which are configured on two sides by taking a picking and placing position (P) set on the upper side of the X-Y workbench (110) as a center and temporarily load the components (10); a pair of tray sections (310, 320) including one or more normal trays (30), the one or more normal trays (30) being respectively provided adjacent to the pair of buffer bag sections (210, 220) and carrying a plurality of elements (10); a sorting tray part (330) for sorting the elements (10) which are loaded on the test board (20) and have been inspected, and for sorting the elements (10) which are endowed with a sorting grade except for high quality and loading the elements on the tray (30); wherein the test board (20) is provided with a plurality of test sockets (21) arranged in an m × n arrangement; the test socket (21) comprises: a main body portion (910) which is coupled to the test board (20) and fixes or releases the component (10) mounted on the component mounting portion by pressing the socket pressing member (45); a cover member (920) hinge-coupled to the main body portion (910) and opening or closing the component mounting portion to the outside by a hinge rotation; a cover member opening section (590) that opens the cover member (920) from the main body section (910) to pick up or place the component (10) at the component mounting section of the test socket (21); and a cover member closing section (580) that closes the cover member (920) with respect to the main body section (910) after picking up or placing the component (10) with respect to the component mounting section of the test socket (21).

Description

Component handler
Technical Field
The present invention relates to a component handler, and more particularly, to a component handler which picks up a component from a first part and loads the component to a second part or picks up the component from the first part and loads another component to an empty position.
Background
A semiconductor element (hereinafter, referred to as "element") is subjected to various inspections such as a reliability inspection for electrical characteristics, heat, or pressure after completion of a packaging process.
As such an inspection of semiconductor devices, there is a Burn-in Test (Burn-in Test) in which a plurality of devices are inserted into a Burn-in board, the Burn-in board is housed in a Burn-in Test apparatus, and heat or pressure is applied for a predetermined period of time, and then whether or not a defect occurs in the device is discriminated.
The burn-in test component handler generally refers to a component handler that sorts (unloads) components from a burn-in board loaded with components subjected to a burn-in test to each tray according to inspection results of each component of good quality, defective products, and the like, while reinserting (loading) new components to be subjected to a burn-in test in empty positions (sockets) of the burn-in board where the components are located.
On the other hand, the performance of the component handler described above is evaluated by the number of component parts Per unit time (UPH: Units Per Hour), and UPH depends on the time required for carrying the components and the burn-in board between the respective members constituting the component handler.
Accordingly, in order to improve the performance of the UPH, i.e., the component handler, it is necessary to improve the functions, the structures, the arrangements, and the like of the respective members.
As described above, there are korean patent laid-open No. 10-1133188 (patent document 1), korean patent laid-open No. 10-1177319 (patent document 2), korean patent laid-open No. 10-2016-48628 (patent document 3), and the like as component processors for providing UPH.
On the other hand, the market scale of a standardized device such as an SDRAM (synchronous dynamic random access memory) and a NAND flash memory has recently been expanded, and mass production has been increasingly expanded.
Then, in mass production of components, the inspection demand for the components is also increasing, and therefore it is necessary to provide a plurality of component handlers for sorting the components according to the inspection results as a subsequent process.
Accordingly, in the component handler, since a floor area of the apparatus varies according to a logistics supply structure inside the apparatus such as a tray, a board, and the like, the tray, the supply structure of the board, and the like of the apparatus are very important elements in the configuration of the apparatus.
In addition, according to the terminal structure of the BGA or other device, if a device mounting error occurs on the burn-in board, the cause of the failure or the inspection error also acts, and therefore it is very important that the device is positioned at a correct position when mounted on a test board such as a burn-in board.
In addition, according to the kind of component inspection, the test socket provided at the test board for inspecting components is a cover member 920 hinge-coupled to cover after the components are loaded, in which case the opening and closing of the cover member has a great influence on UPH (performance of the component handler).
Disclosure of Invention
(problem to be solved)
An object of the present invention is to provide a device handler which can load devices to a test socket of a test board quickly and accurately when performing loading/unloading of the devices with respect to the test board in consideration of the above-mentioned point.
(means for solving the problems)
The present invention has been made to achieve the above-mentioned object, and discloses an element processor including: an X-Y table 110 for moving a test board 20 loaded with a plurality of components 10 in an X-Y direction; a pair of buffer bag parts 210, 220 which are disposed on both sides with a pick-and-place position P set on the upper side of the X-Y table 110 as the center and temporarily load the components 10; a pair of tray parts 310, 320 including one or more conventional trays 30, the one or more conventional trays 30 being respectively disposed adjacent to the pair of buffer pocket parts 210, 220 in correspondence thereto and loading a plurality of elements 10; a sorting tray part 330 for sorting the components 10, which are not only good quality but also provided with a sorting grade, among the components 10 loaded on the test board 20 and inspected, and loading the components on the tray 30; wherein the test board 20 is provided with a plurality of test sockets 21 arranged in an m × n arrangement; the test socket 21 includes: a main body portion 910 which is bonded to test board 20 and fixes or releases component 10 mounted on the component mounting portion by pressing of socket pressing member 45; a cover member 920 hinge-coupled to the body portion 910 and opening or closing the component mounting portion to the outside by a hinge rotation; a cover member opening portion 590 which opens the cover member 920 from the body portion 910 to pick up or place the component 10 at the component mounting portion of the test socket 21; the cover member closing part 580 closes the cover member 920 with respect to the main body part 910 after picking up or placing the component 10 with respect to the component mounting part of the test socket 21.
(Effect of the invention)
The component handler of the present invention performs a component pick-and-place operation by an opening process of opening a cover member with respect to a main body portion constituting a test socket, a pick-and-place process of picking and/or placing a component after the opening process, and a closing process of closing the cover member with respect to the main body portion after the pick-and-place process when the test socket provided at a test board has the cover member that is hingably rotatable, thereby having an advantage of being able to greatly increase the number of unit classifications (UPH: Units Per Hour) Per time.
Drawings
Fig. 1 is a plan configuration diagram showing an example of the element processor of the present invention.
Fig. 2 is a plan configuration diagram showing another example of the element processor of the present invention.
Fig. 3 is an overview showing the opening of the cover member, the pick-and-place of the component, and the closing process of the cover member in the component handler of fig. 1 and 2.
Fig. 4 is an enlarged conceptual view illustrating an operation process of the test socket in the conceptual view of fig. 3.
Fig. 5, 2(a) to 2(c) are sectional views showing the errors of the plane size of the components on the test board, the buffer bag and the conventional tray in fig. 1 or 2, respectively, compared to the mounting groove.
Detailed Description
Hereinafter, the element processor of the present invention will be described with reference to the drawings.
As shown in fig. 1 and 2, the element processor of the present invention includes: an X-Y table 110 for moving a test board 20 loaded with a plurality of components 10 in an X-Y direction; a pair of buffer bag portions 210, 220 which are disposed on both sides with a pick-and-place position P set on the upper side of the X-Y table 110 as the center and temporarily load the components 10; a pair of tray parts 310, 320 which are respectively adjacently disposed corresponding to the pair of buffer bag parts 210, 220 and include one or more conventional trays 30 on which a plurality of elements 10 are loaded; the sorting tray section 330 sorts the components 10, which are loaded on the test board 20 and inspected, into the sorting grades except for the high quality, and loads the sorted components 10 on the tray 30.
The test board 20 may be a burn-in board for burn-in test or the like as a board provided with the test sockets 21 to test the components 10.
As an example, the test board 20 is a burn-in board having test sockets 21 formed with socket mounting portions (not shown) into which the components 10 are respectively inserted, so as to be able to perform a test for electrical characteristics, signal characteristics, and the like at a high temperature.
On the other hand, a socket pressing member 45 is provided on an X-Y table 110 described later, and the socket pressing member 45 opens the socket 21 when the test socket 21 is loaded and led out of the component 20.
The test board 20 may unload the tested components 10 mounted on the X-Y stage 110 of the component handler or may load the components 10 to be tested according to an operation mode, i.e., a loading-only operation mode, an unloading-only operation mode, a loading/unloading operation mode, etc.
In particular, as shown in fig. 3 and 4, the test socket 21 may include: a main body portion 910 which is bonded to test board 20 and fixes or releases component 10 mounted on the component mounting portion by pressing of socket pressing member 45; the cover member 920 is hinge-coupled to the body portion 910 and rotates to open or close the component mounting portion to the outside through the hinge.
Main body portion 910 may have various configurations as a structure that is coupled to test board 20 and fixes or releases component 10 mounted on a component mounting portion by pressing socket pressing member 45.
In particular, the body portion 910 is provided with terminal connecting portions for electrically connecting with terminal portions (not shown) provided on the test board 20, component fixing portions for fixing or releasing the components 10 mounted on the component mounting portions by pressing of the socket pressing members 45, and the like, and may have various structures according to the structures of the terminal connecting portions, the component fixing portions, and the like.
The cover member 920 may have various structures according to a coupling structure as a structure hinge-coupled to the body portion 910 and rotated by a hinge to open or close the component mounting portion to the outside.
As an example, the cover member 920 may be provided with a locking portion 921, and the locking portion 921 is hinge-coupled to the main body portion 910 on one side with reference to a horizontal direction, and is maintained in a coupled state with the main body portion 910 in a state of closing the component mounting portion on the other side.
In particular, the cover member 920 is a hinge portion that is coupled to the main body portion 910 by an elastic member (not shown) that applies elastic force in a direction to open the cover member 920 with respect to the main body portion 910 so as to be openable by an operation of a cover member opening portion 590, which will be described later.
At this time, the cover member 920 is preferably rotated by 90 ° or more with respect to the upper surface of the body portion 910 so as not to interfere with the operation of the socket pressing member 45 and the movement of the first and second main conveyers 510 and 520, which will be described later.
The X-Y table 110 may have various structures as a structure for moving the test board 20 loaded with the plurality of components 10 in the X-Y direction.
Then, the X-Y table 110 includes a burn-in board exchanging device (not shown) to receive the test boards 20 from the outside or to discharge the test boards 20 to the outside.
Then, the X-Y table 110 is structured as follows: test board 20 is moved by driving of an X-Y table driving part (not shown), and thus components 10 can be inserted into empty positions of test sockets 21 of test board 20 or components 10 can be led out from test board 20 by first main conveyor 510 and/or second main conveyor 520.
The X-Y stage driving unit may have various configurations to operate with the first main transport tool 510 and the second main transport tool 520, and perform X-Y movement or X-Y- θ movement of the X-Y stage 110 on which the test board 20 is loaded according to an operation mode (loading operation mode, unloading operation mode, loading/unloading operation mode) so that the first main transport tool 510 and the second main transport tool 520 can easily take out the components 10 or the loaded components 10 from the test board 20.
For example, in the case of the loading/unloading operation mode, the X-Y table driving part may be configured to move the X-Y table 110 to guide out the components 10 from the test plate 20 in cooperation with the first main carriage 510 and simultaneously insert the components 10 into the empty positions of the test plate 20 in cooperation with the second main carriage 520, and may move the X-Y table 110 to the plate exchange position when the insertion of the components 10 into the test plate 20 is completed.
On the other hand, the X-Y table 110 is provided at a main body constituting the component handler of the present invention, and the main body may include an upper plate 1, and the upper plate 1 is formed with an opening 1a for the first and second main conveyers 510 and 520 to take out the components 10 from the test board 20 or load the components 10.
Then, socket pressing member 45 is provided on the upper side of X-Y table 110, and socket pressing member 45 presses socket 21 provided on test board 20, so as to lead out and load components from test board 20.
The socket pressurizing member 45 enables the elements inserted in the socket of test board 20 to be led out or loaded, and may have various structures according to the structure of the socket of test board 20.
The pair of buffer bag portions 210 and 220 may have various configurations as a configuration in which the components 10 are temporarily loaded while being disposed on both sides with the pick-and-place position P set on the upper side of the X-Y table 110 as the center.
As an example, the buffer bag portions 210 and 220 may have a plurality of pockets 231, and the plurality of pockets 231 may temporarily place the components 10 corresponding to the number of pickers constituting the first and second main carriers 510 and 520.
Then, the buffer pockets 210 and 220 are preferably configured to move to a sorting position where the sorting tool 550 can pick up the components 10 of the sorting grades except for the high-quality components among the mounted components 10, so that the components can be loaded on the tray 30 of the sorting tray part 330 by the sorting tool 550 to be described later.
In this case, the buffer bag portions 210 and 220 may be configured such that all of the plurality of pockets 231 are moved to the sorting position, or only the block member 230 forming the pocket 231 to which the component 10 assigned to the sorting level is attached among the plurality of pockets 231 is moved to the sorting position.
On the other hand, the buffer pockets 210 and 220 serve as a temporary means before receiving the components 10 from the normal tray 30 to be transferred to the test board 20 or a tray temporarily loaded before receiving the components 10 from the test board 20 to be transferred to the normal tray 30, and the components 10 can be temporarily loaded according to an operation mode such as a loading-only operation mode, an unloading-only operation mode, a loading/unloading operation mode, and the like.
For reference, a process of loading the test plate 20 with the elements 10 to be tested from the conventional tray 30 may be defined as a loading-only operation mode, a process of loading the test-completed elements 10 from the test plate 20 to the conventional tray 30 may be defined as an unloading-only operation mode, and a process of loading the test plate 20 with the elements 10, while leading out the elements 10 from the first tray part 310 to the test plate 10, from the test plate 20 to the conventional tray 30 may be defined as a loading/unloading operation mode.
In the case of the component handler shown in fig. 1 and 2, the component handler of the present invention can selectively perform one of a load-only operation mode, an unload-only operation mode, and a load/unload operation mode as an operation mode. Here, the case of the element processor shown in fig. 2 is a configuration most suitable for the loading/unloading operation mode.
On the other hand, as shown in fig. 5(a) to 5(c), in the case where the buffer bag parts 210, 220 are temporarily loaded between the receipt of the components 10 from the conventional tray 30 for transfer to the test board 20, the errors Δ x2, Δ y2 of the planar size of the component mounting groove 231 formed in the buffer tray 230 compared with the planar size of the components 10 are preferably smaller than the errors Δ x1, Δ y1 of the planar size of the component mounting groove 31 in which the components 10 are mounted in the conventional tray 30 compared with the planar size of the components 10.
This is because it is important to mount the component 10 more accurately in the test socket 21 as the component 10 is miniaturized or the kinds and specifications of BGA and the like are diversified in recent years.
In particular, in the case of BGA, the trend today is to form fine pitches, so that it is necessary to accurately align the terminals of the component 10 with the test terminals in the test socket 21, and for this reason it is necessary to accurately load the component 10 on the test socket 21.
However, in the case of the conventional tray 30, since the planar size of the component 10 is larger than the dimensional deviations Δ x3 and Δ y3 of the component mounting portion 22 of the test socket 21, there is a problem that it is difficult to accurately align the terminals of the component 10 and the test terminals in the test socket 21.
Accordingly, the test socket 21 of the test board 20 is mounted by using the separate block member 230 having a different specification from the conventional tray 30, thereby reducing errors Δ x and Δ y of the planar dimensions of the component 10, and the component 10 can be more accurately mounted in the test socket 21.
On the other hand, the buffer bag parts 210 and 220 may include a first buffer bag part 210 and a second buffer bag part 220 facing each other about a pick-and-place position P set on the upper side of the X-Y table 110.
The pair of tray parts 310 and 320 may have various structures as a structure including one or more conventional trays 30 that are provided adjacent to each other corresponding to the pair of buffer bag parts 210 and 220, respectively, and on which the plurality of elements 10 are loaded.
As an example, the tray part 310, 320 may include: a first tray part 310 provided with one or more conventional trays 30, the one or more conventional trays 30 being disposed adjacent to the first buffer pocket part 210 and loading a plurality of elements 10; and a second tray part 320 provided with one or more conventional trays 30, the one or more conventional trays 30 being disposed adjacent to the second buffer pocket part 210 and loading a plurality of elements 10.
On the other hand, the tray parts 310, 320 may be provided with a 2D scanner (not shown) disposed on the upper portion of the conventional tray 30 for inspecting a tray cover, the conventional tray 30 itself, the components 10 loaded on the conventional tray 30, etc., recognizing a QR code, etc.
As for the tray parts 310, 320, as in patent documents 1 to 3, it is generally configured to include a guide part that guides the movement of the regular tray 30, and a drive part (not shown) for moving the regular tray 30.
However, the tray parts 310 and 320 may be such that one conventional tray 30 is exposed to the outside and the remaining pictures loaded in the main body (not shown) can be carried by a separate tray carrying device.
On the other hand, the component handler of the present invention may include a sorting tray part 330, and the sorting tray part 330 may sort the components 20, which are loaded from the test board 20 in case of the unloading-only operation mode and the loading/unloading operation mode among the operation modes, from the buffer bag parts 210, 220 located at the predetermined positions according to the inspection result, in order to set the trays 30 according to the sorting reference.
In particular, the sorting tray part 330 may be variously configured according to positions, such as the component handler shown in fig. 1, the component handler shown in fig. 2.
The sorting tray section 330 may have various structures as a structure in which the trays 30 are arranged according to a sorting standard (BIN #1, #2 according to a fail standard) or the like to sort and load the components 20 led out from the test board 20 according to the inspection result.
As an example, as shown in fig. 1, the sorting tray part 330 may be disposed between the first tray part 310 and the second tray part 320.
Specifically, the sorting tray unit 330 may be configured by a plurality of trays 30 arranged along the arrangement direction of the first tray unit 310 and the second tray unit 320 and the movement path of the first main conveyance tool 510 and the second main conveyance tool 520, which will be described later.
Here, the respective trays 30 are provided with their numbers according to the sorting standard (BIN #1, #2, etc. according to the nonconforming standard).
Then, the supply and discharge tray 30 for the sorting tray part 330 may perform conveyance by various methods, such as conveyance by a tray conveyance device (not shown) provided inside the main body or provided on the upper side.
On the other hand, the components 10 of the classification level except for the high quality among the components 10 mounted in the buffer pockets 210 and 220 are moved to the classification position where the classification tool 550 can pick up them, and are loaded on the tray 30 of the classification tray section 330 by the classification tool 550 to be described later; the component 10 located at the sorting position is picked up by the sorting tool 550 and conveyed to the tray 30 of the sorting tray section 330 according to the sorting grade.
At this time, the sorting tool 550 can move in various moving paths such as an X-axis direction, a Y-axis direction, an X-Y-axis direction, and the like according to the moving path of the component 10.
On the other hand, an empty tray portion 391 and a tray rotating portion 392 may be provided adjacent to the sorting tray portion 330, the empty tray portion 391 temporarily loads an empty tray 30, and the tray rotating portion 392 rotates the tray 30 to remove the remaining components 10.
As another example, as shown in fig. 2, the sorting tray part 330 may be disposed at one side of the first tray part 310 and the second tray part 320, and may be disposed at one side of the second tray part 320 as an example.
In particular, the sorting tray part 330 may be identical or similar to the tray parts 310, 330 described above.
That is, the sorting tray part 330 may be configured to include a guide part that guides the movement of the regular tray 30, and a driving part (not shown) for moving the regular tray 30, as in patent documents 1 to 3.
On the other hand, the components 10 of the classification level except for the high quality among the components 10 mounted in the buffer pockets 210 and 220 are moved to the classification position where the classification tool 550 can pick up them, and are loaded on the tray 30 of the classification tray section 330 by the classification tool 550 to be described later; the component 10 located at the sorting position is picked up by the sorting tool 550 and conveyed to the tray 30 of the sorting tray section 330 according to the sorting grade.
At this time, the sorting tool 550 can move in the X-axis direction unlike the element handler shown in fig. 1.
On the other hand, an empty tray part for temporarily loading the empty tray 30 may be provided at the outermost corner of the sorting tray part 330.
The empty tray section, as a structure of the tray 30 emptied by the temporary device, may be configured to include a guide section that guides the movement of the regular tray 30, and a drive section (not shown) for moving the regular tray 30, as in patent documents 1 to 3.
On the other hand, the empty tray part, the tray parts 310, 320, the sorting tray part 330 may use a common conventional tray 30, and a tray carrying device (not shown) carrying the tray may be provided at least one of the front and rear sides to carry the tray between the empty tray part, the tray parts 310, 320, the sorting tray part 330.
In addition, in the operation mode, when the loading/unloading operation mode is performed, the first tray part 310 may be constituted by a loading part that loads the tray 30 loaded with the components 10 to be inspected, and the second tray part 320 may be constituted by an unloading part that loads the tray 30 to be loaded with the components 10 classified as good quality among the components 10 loaded at the test board 20 and inspected.
At this time, a load buffer portion 311 temporarily loading the tray 30 to be transferred to the loading portion is disposed at one side of the first tray portion 310, and a load buffer portion 311 temporarily loading the tray 30 to be transferred to the unloading portion is disposed at one side of the second tray portion 320.
Further, a cover tray part 301 may be disposed at one side of the second tray part 320, and the cover tray part 301 may temporarily load the cover tray positioned at the uppermost side among the plurality of trays 30 at the start of loading.
Here, the cover tray may have various marks such as RFID, QR code, etc. as a cover positioned at the uppermost side among the plurality of trays 30 at the start of loading or a cover to be positioned at the uppermost side among the plurality of trays 30 stacked at the completion of unloading, to realize logistics automation.
On the other hand, the component handler shown in fig. 2 is connected to a distribution line for automatically supplying the component handler with the tray 30, and one or more trays are introduced or discharged to the outside in a distribution unit.
Here, in the case where the trays of the logistics unit need to be supplied or discharged with the front and the rear thereof being changed, a reversing part 610 may be provided at one side of the component handler shown in fig. 2, and the reversing part 610 reverses the front and the rear of the trays of the logistics unit by rotating.
Here, a carrying line 620 such as a conveyor belt for exchanging trays of the logistics unit may be provided between the turning part 610 and the component handler.
The turning part 610 may have various configurations as a structure provided at one side of the component handler to turn over the tray of the physical distribution unit by rotation, and a carrying route 611 for carrying the tray of the physical distribution unit after turning over may be set.
On the other hand, in order to carry the component 10, the component handler of the present invention comprises: one or more main conveyers 510, 520 that convey the components 10 while moving along the guide passage 591 between the buffer bag portions 210, 220 and the pick-and-place position P; one or more component conveying tools 530, 540 for conveying the components 10 between the tray parts 310, 320 and the front side positions of the buffer bag parts 210, 220; the one or more sorting tools 550 transport the component 10 between the sorting positions of the sorting tray 330 and the buffer bags 210 and 220.
The one or more main conveyers 510 and 520 may have various structures as a structure for conveying the components 10 while moving along the guide line 591 between the buffer bag portions 210 and 220 and the pick-and-place position P.
As an example, the main conveyance 510, 520 may include: a first main conveyance tool 510 for conveying the components 10 between the first buffer pocket 210 and the test board 20; the second main conveyance tool 520 conveys the components 10 between the second buffer pocket 220 and the test board 20.
The one or more sorting tools 550 may have various structures as a structure for conveying the components 10 between the sorting positions of the sorting tray part 330 and the buffer bags 210 and 220.
The component carriers 530 and 540 may have various structures for carrying the components 10 between the tray portions 310 and 320 and the positions on the front sides of the buffer bag portions 210 and 220.
As an example, the component delivery tools 530, 540 may include: a first component transfer tool 530 that transfers the component 10 between the first tray part 310 and the first buffer bag part 210; the second component transfer tool 520 transfers the component 10 between the second tray part 320 and the second buffer pocket part 220.
On the other hand, the carrying tools 510, 520, 530, 540, 550 are structures for carrying the components 10, and may have various structures according to the arrangement of the respective structures.
For example, the first main conveyance 510 may derive the components 10 from the test plate 20 or may load the components 10 to the test plate 20 according to the operation mode.
The second main vehicle 520 may derive the components 10 from the test plate 20 or may load the components 10 to the test plate 20 according to the operation mode.
On the other hand, the arrangement of elements 10 loaded on test plate 20 is different from that of elements 10 loaded on conventional tray 30 such as tray sections 310 and 320, and the number of the elements loaded on test plate 20 is relatively large.
Therefore, the first and second main conveyers 510 and 520 for conveying the components 10 to the test board 20 or the lead-out components 10 are preferably configured to convey a relatively larger number of components 10 than the remaining conveyers. For example, the first and second main conveyers 510 and 520 may be 5 × 2, and the remaining conveyers may be 4 × 1, etc.
In the case where the conveyance tool is configured as described above, in addition to the position where a relatively large number of components 10 need to be conveyed, the conveyance tool for conveying a small number of components 10 can be used at the position where a relatively small number of components 10 need to be conveyed, and the size and stability of the apparatus can be improved while saving the manufacturing cost.
On the other hand, the first and second main conveyers 510 and 520 may be configured to be integrally movable with each other in consideration of alternately performing loading and discharging of the elements 10 on the test board 20 according to an operation mode.
The number of pickers in the lateral direction of the first and second main conveyers 510 and 520 may be the same as the number of component receiving grooves (not shown) in the buffer tray 230 for loading the components 10 in the lateral direction, in consideration of the efficiency of the components 10.
On the other hand, the first sub-carrier 530 and the second sub-carrier 540 are preferably configured such that the number of pickers in the lateral direction of the first main carrier 510 and the second main carrier 520 is the same, in consideration of the fact that the first main carrier 510 and the second main carrier 520 respectively carry the components 10.
On the other hand, generally, the pitch between the components 10 on the test board 20 and the pitch between the components 10 on the conventional tray 30 are different (2 times) from each other, and for this reason, one set of the "first and second main conveyers 510 and 520" and the "first and second component conveyers 530 and 540" is preferably configured to change the pitch between the components 10 picked up by the picker.
In another aspect, the transportation means 510, 520, 530, 540, 550 may respectively include: one or more pickers having a suction head at a distal end thereof, the suction head sucking the component 10 by vacuum pressure; and a pickup carrying device for moving the pickup in an X-Z, Y-Z or X-Y-Z direction.
In particular, the conveyers 510, 520, 530, 540, 550 may be arranged in a row for a picker, or may be arranged in a plurality of rows, such as 5 × 2, 4 × 2, etc.
On the other hand, as shown in fig. 1 and 2, the component handler of the present invention includes a board loader 800, the board loader 800 being provided at one side capable of continuously receiving test board 20.
The board loader 800 is a structure for receiving a test board 20 loaded with components 10 from the outside and transferring the test board 20 to the X-Y stage 110, and receiving the test board 20 loaded with the components 10 from the X-Y stage 110 and discharging the test board 20 to the outside, that is, as a structure for the X-Y stage 110 to continuously exchange the test boards 20, and may have various structures such as a structure constituted by the board loader 800 disclosed in patent document 3.
In particular, the board loader 800 may further include a mounting state inspecting part for inspecting a mounting state of the components 10 on the test board 20 before receiving the test board 20 on which the components 10 are completely loaded from the X-Y table 110 and discharging the test board 20 to the outside.
In particular, if the plate loader 800 is provided adjacent to the tray portions 310 and 320, it is preferable that the plate loader be coupled to the tray portions 310 and 320 in the X-axis direction when the direction perpendicular to the tray conveying direction of the loading portion 100 is the Y-axis.
At this time, holder 50 on which test plate 20 is loaded by the coupling of plate loader 800 as described above can be introduced or discharged in the X-axis direction on the right side of the apparatus, particularly adjacent to loading portion 100.
In addition, a 2D scanner (not shown) or the like for identifying a QR code or the like for the test board 20 may be provided between the board loader 800 and the loading part 100 or the board loader 800.
In particular, the 2D scanner is preferably disposed between the board loader 800 and the loading part 100 to identify a QR code or the like in the transfer process of the test board 20 from the board loader 800 to the X-Y table 110.
On the other hand, as described above, the test board 20 is provided with a plurality of test sockets 21 arranged in an array of m × n (m and n are natural numbers of 2 or more), and the test sockets 21 may include: a main body portion 910 which is bonded to test board 20 and fixes or releases component 10 mounted on the component mounting portion by pressing of socket pressing member 45; and a cover member 920 hinge-coupled to the body portion 910 and configured to open or close the component mounting portion to the outside by rotating the hinge.
In this case, it is necessary to open and close the cover member 920 at the test socket 21 when picking or placing the component 10 is performed.
Accordingly, the element handler of the present invention may comprise: a cover member opening portion 590 which opens the cover member 920 from the body portion 910 to pick up or place the component 10 at the component mounting portion of the test socket 21; the cover member closing part 580 closes the cover member 920 with respect to the main body part 910 after picking up or placing the component 10 with respect to the component mounting part of the test socket 21.
The cover member opening portion 590 may have various structures as a structure for opening the cover member 920 from the body portion 910 to pick up or place the component 10 at the component mounting portion of the test socket 21.
In particular, the cover member opening portion 590 may have various structures according to a coupling structure of the cover member 920 to the body portion 910.
As an example, the cover member opening portion 590 may open the cover member 920 coupled to the body portion 910 by at least one of movement in an X-axis direction, movement in a Y-axis direction, movement in a Z-axis direction, and θ rotation.
The cover member closing part 580 may have various structures as a structure for closing the cover member 920 with respect to the main body part 910 after picking up or placing the component 10 with respect to the component mounting part of the test socket 21.
In particular, the cover member closing part 580 may have various structures according to a coupling structure of the cover member 920 with respect to the body part 910.
As an example, the lid member closing unit 580 may open the lid member 920 coupled to the body portion 910 by at least one of movement in the X-axis direction, movement in the Y-axis direction, movement in the Z-axis direction, and θ rotation.
On the other hand, as shown in fig. 3 and 4, the picking and placing process of the component 10 for the test socket 21 is performed in the order of opening the cover member 920, picking and placing the component 10, and closing the cover member 920.
Accordingly, the cover opening portion 590 and the cover closing portion 580 are preferably disposed to face each other with a position where the component 10 is picked up and placed by the first main conveyance tool 510 and the second main conveyance tool 520 as a center, with reference to a movement path of the first main conveyance tool 510 and the second main conveyance tool 520 for picking up and placing the component 10.
In this case, the arrangement intervals of the lid open portion 590 and the lid closed portion 580 are preferably arranged to be spaced apart from each other by one or more test sockets 21 on the test board 20 when the test sockets 21 are located on the moving paths of the first main transport tool 510 and the second main transport tool 520.
With the above-described structure, in the case where the test socket 21 is provided with the cover member 920, there is an advantage that the picking and placing work of the component 10 can be performed quickly and the number of parts sorted Per unit time (UPH: Units Per Hour) can be increased greatly.
The above description is only a part of the preferred embodiments that can be realized by the present invention, and therefore it is well known that the scope of the present invention is not limited to the above-described embodiments, and the technical ideas of the present invention and the fundamental technical ideas thereof described above are all included in the scope of the present invention.

Claims (1)

1. A component handler, comprising:
an X-Y table (110) for moving a test board (20) carrying a plurality of components (10) in an X-Y direction;
a pair of buffer bag parts (210, 220) which are configured on two sides by taking a picking and placing position (P) set on the upper side of the X-Y workbench (110) as a center and temporarily load the components (10);
a pair of tray sections (310, 320) including one or more normal trays (30), the one or more normal trays (30) being respectively provided adjacent to the pair of buffer bag sections (210, 220) and loading a plurality of elements (10);
a sorting tray unit (330) for sorting the elements (10) which are loaded on the test board (20) and have been inspected, and for sorting the elements (10) which are given a sorting grade except for a high quality and loading the elements on the tray (30);
Wherein the test board (20) is provided with a plurality of test sockets (21) arranged in an m × n arrangement;
the test socket (21) comprises: a main body portion (910) which is bonded to the test board (20) and fixes or releases the component (10) mounted on the component mounting portion by pressing a socket pressing member (45); a cover member (920) hinge-coupled to the main body portion (910) and opening or closing the component mounting portion to the outside by a hinge rotation;
a cover member opening portion (590) that opens the cover member (920) from the main body portion (910) to pick up or place a component (10) at a component mounting portion of the test socket (21);
a cover member closing part (580) that closes the cover member (920) with respect to the main body part (910) after picking up or placing a component (10) with respect to a component mounting part of the test socket (21).
CN201980026273.4A 2018-04-16 2019-04-16 Component handler Pending CN111989579A (en)

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