KR20050112213A - Socket structure of vertical handler for semiconductor device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device socket mounting structure of a vertical handler, comprising: a semiconductor device socket for allowing predetermined data to be written / inspected to a semiconductor device, and a side surface of the socket for opening and closing the semiconductor device socket. A socket opening / locking lever, a pair of supports vertically formed opposite to the element recording / inspection portion of the vertical handler, a rotary link having one end connected to a lower end between the supports, and rotating about a link axis of rotation; A connecting rod formed at an upper end of the connecting rod and a connecting link connected to the connecting rod to push or pull the socket opening / locking lever according to the rotation of the rotary link, and stably according to the present invention. The open / lock lever can be pushed and pulled so that certain data is recorded and More conveniently in the device record / inspection operation of the data such that the inspection and, thus providing stable operation.

Description

SOCKET STRUCTURE OF VERTICAL HANDLER FOR SEMICONDUCTOR DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device socket mounting structure of a vertical handler, and more particularly, to device recording / receiving predetermined data is written to a semiconductor device of a DIP (Dual Inline Package) type and the recorded data is inspected. The operation of the inspection unit relates to a mounting structure of a semiconductor device socket that can be more convenient and stable operation.

In general, the memory or non-memory semiconductor devices produced in the production line are tested to determine whether they are good or defective before shipment.

The handler which is a device for testing such a semiconductor device is roughly classified into a horizontal handler and a vertical handler. The horizontal handler is a tray for testing a metal material having an upper or lower surface of a semiconductor device contained in a tray of synthetic resin. Or by loading horizontally in the shuttle to perform the test in a horizontally aligned test unit while transferring the test tray or shuttle in a horizontal state between processes.

On the other hand, when the vertical handler is loaded with semiconductor devices to be tested in an elongated tube in a stack form, the vertical handlers are sequentially stacked on the feeding part of the handler, and the semiconductor devices in the tube loaded on the feeding part are inclined downward to form a chute ( guides the semiconductor element to fall by its own weight and is inserted into the semiconductor element socket of the test unit so that predetermined data is recorded and tested, and the recorded and tested semiconductor element is selected and stored in the predetermined chip storage unit. Device.

However, the operation of the element recording / inspection portion of the conventional vertical handler cannot secure the operation of the device socket opening / closing lever for opening / closing the DIP type semiconductor device socket.

In addition, as a result of not fully opening and closing the semiconductor device socket, there is a problem that damage to the semiconductor device in the process of inserting or removing the device in the DIP-type semiconductor device socket.

The present invention has been made to solve the above problems, to provide a structure for stably operating the opening and closing lever of the semiconductor device socket to ensure that the operation of inserting the DIP type semiconductor device into the semiconductor device socket reliably. It aims to do it.

The semiconductor element socket mounting structure of the vertical handler according to the present invention for achieving the above object is a semiconductor element socket for allowing predetermined data to be recorded / inspected on the semiconductor element, and a socket for opening and closing the semiconductor element socket, A socket open / lock lever protruding from one side of the socket, a pair of supports formed perpendicular to and opposite to the element recording / inspection portion of the vertical handler, and one end connected to the lower end between the supports to rotate about a link axis of rotation; And a rotary link, a connecting rod formed at an upper end of the rotary link, and a driven link connected to the connecting rod to push or pull the socket opening / locking lever according to the rotation of the rotary link.

Hereinafter will be described a specific embodiment according to the present invention. However, the detailed description thereof will be omitted for techniques that are already well known and known.

1 is a perspective view of a vertical handler according to the present invention.

Referring to FIG. 1, the vertical handler of the present invention includes a tube feeding part 100 for stacking up and down a plurality of tubes in which a plurality of semiconductor devices are stacked in a row, so that semiconductor devices are continuously discharged, and the tubes The device feeding unit 200 and the semiconductor device for stably supplying the semiconductor devices continuously discharged from the feeding unit 100 are supplied one by one, and whether the recorded data is normally recorded and whether the recorded data is normal or not. In order to inspect the device, a plurality of socket-formed device recording / inspection unit 400 and semiconductor device are transported from the device feeding unit 200 to the device recording / inspection unit 400, and the device recording / inspection unit ( The device transfer part 300 for discharging the semiconductor device recorded / inspected at 400 and the semiconductor device discharged from the device recording / inspection part 400 are good. Or an element discharge unit 500 for storing in a plurality of loading structures depending on whether there is a defective product, and an element storage unit 600 for storing semiconductor elements discharged from the element discharge unit 500 in a predetermined loading tube. And, the inclination adjustment unit 700 for adjusting the inclination angle of the handler base for smooth discharge of the semiconductor device of the device feeding unit 200 is included.

When the schematic configuration as described above is described in more detail, the tube feeding unit 100 is loaded with a tube by a predetermined guide structure, and a plurality of semiconductor elements are stored in a line in the tube. The semiconductor elements inserted into one tube are continuously discharged in a row. After the semiconductor elements are completely discharged, the lowermost tube is dropped by a predetermined sensor, and the uppermost upper tube of the lowermost tube is lowered one layer. In addition, the semiconductor elements loaded in the tube are discharged again.

In addition, the device feeding unit 200 is a semiconductor device that is continuously discharged from the tube feeding unit 100 is intermittent by a predetermined stopper structure so that one semiconductor device at one clock (a predetermined unit in which a handler is operated). Allow the bay to glide along the chute. Since only one semiconductor slides at a time by the device feeding unit 200, the jam phenomenon of the semiconductor device may be effectively suppressed.

On the other hand, since the outer dimensions of the semiconductor package according to the number of pins or manufacturers vary, the lower end of the device feeding unit 200 is formed with a fine adjustment device 240 for the adjustment according to, the top of the fine adjustment device disc The support of is formed so that the slid semiconductor device is waiting in the stationary state.

In addition, the element transfer unit 300 is sucked by the vacuum suction force of the air to the semiconductor element is stopped by the support of the microadjustment apparatus by the vacuum suction force, so that the semiconductor element adsorbed by the operation of up, down, left and right is the element recording / inspection unit ( To be transferred to an empty socket.

In addition, the device recording / testing unit 400 includes a plurality of sockets and a predetermined push structure, and the semiconductor element is loaded into a socket that is opened and closed by the predetermined push structure so that the lead of the semiconductor element contacts the socket. Allows data to be recorded and examined while connected to the pin. Here, according to the replacement of the socket, a semiconductor device packaged by a plastic leaded chip carrier (PLCC), a dual in-line package (DIP), a small out-line package (SOP), or the like may be loaded.

In addition, the device discharge unit 500 is a semiconductor device discharged by the device transfer unit 300 from the device recording / inspection unit 400 after completing the recording and inspection, the capacity of the loading tube and the normal / defective of the semiconductor device It slides on the unloading guide rail depending on whether it can be supplied to the plurality of device storage units 600 installed below.

In addition, the device storage unit 600 has a plurality of insertion grooves are formed to couple the plurality of loading tubes, the semiconductor element unloaded from the device discharge unit 500 to the loading tube coupled to the insertion groove Save it. Here, the device storage unit 600 is formed with a second position sensor for detecting whether the loading tube is coupled, the device conveying unit 300 by determining the defect groove portion is coupled to the loading tube of the plurality of insertion grooves To allow the semiconductor element to be discharged at an appropriate position.

In addition, the inclination adjustment unit 700 is fixed by adjusting the inclination angle of the base plate of the vertical handler within the range of 25 to 45 degrees, thereby eliminating the phenomenon of the device according to the weight and contact area of the semiconductor element, the tube The semiconductor device falling along the chute of the device feeding unit 200 from the feeding unit 100 can be smoothly supplied.

2 is a block diagram illustrating an operating state of the vertical handler according to the present invention.

Referring to Figure 2, the block configuration of the vertical handler according to the present invention, the internal configuration of the vertical handler is controlled by the microcontroller 10 and the microcontroller 10 to control the vertical handler as a whole A program unit 20 for allowing predetermined data to be input or tested, and a motor driver for controlling the element transfer unit 300 and the element discharge unit 500 to be controlled by the microcontroller 10 so as to operate properly. 30 and a personal computer 80 for transmitting the data to be recorded to the program unit 20 and determining whether the recorded data is normal are included as main components.

In more detail, the program unit 20 includes a program input unit 21 for storing predetermined data in the semiconductor device, and a test unit 22 for checking whether the input data is normally written.

In more detail, the microcontroller 10 may include a program control unit 11 for controlling the program input unit 21, a test control unit 12 for controlling the test unit 22, and a physical of the handler. An apparatus control unit 13 is included to allow the operation to be controlled.

In more detail, the motor driver 30 may include a motor controller for driving the device transfer part 300 and the device discharge part 500 properly by a control signal from the device controller 13. 31a) and 31b, drivers 32a and 32b for driving the motor, and a transfer unit 33 for including the motor to perform a predetermined linear operation.

On the other hand, the components controlled by the device control unit 13 includes a pressure device 40 including at least a pump for the composition of the vacuum state, and a sensor unit including a plurality of sensors to ensure the position of the semiconductor element 50 and a stopper controller for operating the element feeding unit 200 is further included.

On the other hand, the input unit 14, which is placed on the upper surface of the vertical handler for the user to input a signal for the on / off or operation control of the handler, and the display unit formed with the input unit 14 to display the status of the handler ( 15) is further formed.

3 is an enlarged perspective view of an element feeding unit in the vertical handler according to the present invention.

Referring to FIG. 3, the device feeding part 200 is formed on a chute 210 which is formed to be inclined downward based on a traveling direction of a semiconductor device, and is formed on a spaced upper side of the chute 210. Of the first stopper 215, a second stopper 220 formed below the first stopper 215, and a stopper of the first stopper 215. It is formed on the side of the chute 210 in the upper right side and is formed at the bottom of the element exhausting sensor 225 and the element feeding unit 200 to detect the presence of the semiconductor element to finely adjust the vertical position of the semiconductor element Fine adjustment device 240 for maintaining the position of the semiconductor device for a predetermined time to be transferred by the device transfer unit 300, fine adjustment lever 245 for adjusting the fine control device 240, The fine adjustment device 240 And at least a first position sensor 230 for checking whether or not the semiconductor device is positioned between the chute 210. However, according to the size of the semiconductor device, the device position sensor 225 may allow the sensor to be formed at another location where the semiconductor devices may overlap in order to suppress the jam phenomenon.

The first stopper 215 and the second stopper 220 are linearly moved up and down by a predetermined push means such as a solenoid or a piston by air pressure. In addition, the lower end of the stopper (215, 220) is in contact with the upper surface of the chute 210 or the upper surface of the semiconductor element is operated as a locking step that the progress of the semiconductor element placed on the lower side of the stopper (215, 220) is interrupted Do not let the device go down.

On the other hand, the element exhaust sensor 225 may be changed in the installation position in order to properly detect the exhaustion of the semiconductor element according to the size of the semiconductor element sliding along the chute 210.

In more detail, in order to maintain the number of semiconductor elements stored in the chute 210 of the element feeding unit 200 at a constant level, when the size of the semiconductor element is large, the element exhausting sensor 225 is approximately above. So that the appropriate number of semiconductor elements can be supplied to the element feeding unit 200. When the size of the semiconductor element is small, the element exhausting sensor 225 is placed on the lower side so that the appropriate number of semiconductor elements can be provided. It is preferable to be supplied to the element feeding unit 200.

On the other hand, the fine adjustment device 240 is formed at the lower end of the element feeding unit 200, by rotating the adjustment screw 245 coupled through approximately the center of the mounting groove surface of the fine adjustment device 240 The vertical position of the semiconductor device placed on the disk-shaped support attached to one end of the adjustment screw 245 can be finely adjusted. Here, after positioning the adjusting screw to the desired position and tightening the nut formed on the adjusting screw and fixed to the other side surface of the seating groove surface of the fine adjustment device 240.

Hereinafter, the operation of the device feeding unit 200 will be described.

The stoppers 215 and 220 prevent the semiconductor device from falling down by linear motion in the vertical direction.

In addition, the element exhausting sensor 225 is a sensor formed on the sidewall of the chute 210 above the first stopper 215, and a semiconductor element formed on both sides of the chute 210 and supplied from one tube is provided. When all are exhausted, this is detected by the tube feeding part 100 so that the lowermost tube is removed and replaced with the upper right tube.

In addition, the first position sensor 230 is formed between the lower end of the chute 230 and the micro-adjustment device 240 to detect a state in which the semiconductor device is hanging so that the semiconductor devices can be properly supplied one by one. When the semiconductor device is not detected by the first position sensor 230, the semiconductor device may be supplied by sequentially opening the first stopper and the second stopper by a control signal of a device controller.

4 is a partially enlarged view of a device transfer unit in the vertical handler according to the present invention.

Referring to FIG. 4, the element transfer part 300 includes an adsorption member 310 for adsorbing a semiconductor element by vacuum air pressure, and an X-axis moving part 320 in which the adsorption member 310 is coupled to one side. And a guide rail 330 formed at a lower side of the X axis moving part 320 to allow the X axis moving part 320 to operate in left and right directions (X axis direction), and the guide rail 330. It is formed opposite to both ends of the Y-axis moving unit 340 for operating the guide rail 330 including the X-axis moving unit 320 up and down (Y-axis direction) is included.

In more detail, due to the mutual operation of the X-axis moving part 320 moving left and right along the guide rail and the Y-axis moving part moving up and down along the Y-axis guide groove, coupled to one side of the X-axis moving part 320. The absorbing member 310 can be moved to the upper side of the semiconductor to be transferred.

Then, the semiconductor element adsorbed by the push operation by the air pressure of the adsorption member 310 is transferred from the element feeding unit 200 to the empty socket of the element recording / inspection unit 400, or the element recording / inspection unit 400 ) Is transferred to the element discharge unit 500.

Here, the element transfer unit 300 is a kind of conventional XY robot arm including a timing belt and a step motor, and the operation of the element transfer unit 300 is controlled by the motor driver 30 shown in FIG. 2. .

5 is a view for explaining the operation of the device recording / inspection unit in the vertical handler according to the present invention.

Referring to FIG. 5, the device writing / inspection unit 400 includes a plurality of sockets 405a to 405h and a predetermined push structure so that the semiconductor device is loaded in a socket that is opened and closed by the predetermined push structure. Allows data to be written and inspected with the leads connected to the contact pins of the socket.

FIG. 5 illustrates a case in which eight DIP sockets 405a to 405h are formed in the device recording / inspection unit 400. However, the present invention is not limited thereto and according to replacement of the sockets, a PLCC (Plastic Leaded Chip Carrier) and an SOP are shown. A semiconductor device packaged by a small out-line package method may be loaded. In addition, the number of sockets is not limited to eight, and the number can be changed as many as possible.

6 is a view for explaining the operation of the device discharge unit and the device storage unit in the vertical handler according to the present invention.

Referring to FIG. 6, the device discharge part 500 is a place where the device device 600 is properly discharged so that the semiconductor device in which recording / inspection is completed may be stored in the device storage part 600. And an unloading guide rail 530 formed to coincide with the loading tube coupled to the groove.

In addition, the device storage unit 600 includes a tube insertion groove 610 into which a plurality of loading tubes are inserted to allow the recording / inspection-complete semiconductor device to be stored, and a loading tube inserted into the tube insertion groove 610. A fastening member 615 for fixing the position and a second position sensor formed in the loading tube insertion groove 610 to detect whether the loading tube is inserted into the loading tube insertion groove 610 are included.

The operation of storing the semiconductor device by the device discharge part 500 and the device storage part 600 in the loading tube will be described.

The device discharge part 500 finishes recording and inspection, and the semiconductor device discharged by the device transfer part 300 from the device recording / inspection part 400 is determined by whether the capacity of the loading tube and the normal / defective status of the semiconductor device are normal. Accordingly, the sliding guide rail 530 slides on the unloading guide rail 530 to be supplied to the plurality of device storage units 600 installed below.

In addition, the device storage unit 600 has a plurality of loading tube insertion grooves 610 are formed to couple a plurality of loading tubes, the semiconductor tube is unloaded from the device discharge unit 500 is inserted into the loading tube Stored in a loading tube coupled to the groove 610. Here, the second position sensor for detecting the coupling of the loading tube is formed in the loading tube insertion groove 610 of the device storage unit 600, the defect groove portion of the plurality of insertion grooves coupled to the loading tube is formed. By judging, the device transfer part 300 can discharge the semiconductor device at an appropriate position.

More specifically, by detecting whether the loading tube is connected to the insertion groove 610 by the second position sensor of the loading tube insertion groove 610, the device control unit (13 of FIG. 2) of the vertical handler is a plurality of words It is determined which rail of the loading guide rail to discharge the semiconductor device.

Next, under the control of the device control unit, the device transfer unit 300 discharges the semiconductor device that has been recorded / inspected toward the unloading guide rail 530 to which the loading tube is coupled.

The semiconductor device discharged to the unloading guide rail 530 is dropped by its own weight and stored in a loading tube coupled to the lower side along the unloading guide rail 530.

When the vertical handler is driven, separation of the good and bad parts is performed by driving at least two or more load tubes in combination so that the semiconductor device, which has been recorded / inspected, can be separated and stored in the loading tube according to whether the product is defective or defective. Can be stored.

Meanwhile, the device control unit 13 of FIG. 2 may control the operation of the element transfer unit 300, and at the same time, determine the number of semiconductor elements loaded in the loading tube at each discharge operation of the element transfer unit 300. In addition, by comparing the total loading capacity of the loading tube and the number of discharged semiconductor elements, the operation of the semiconductor handler may be stopped when the semiconductor elements are full.

A semiconductor device socket mounting structure of the vertical handler according to the present invention will be described with reference to FIGS. 7 to 10.

7 is a perspective view of a portion of an element recording / inspection portion of a vertical handler according to the present invention, and FIG. 8 is an exploded perspective view of an element recording / inspection portion of a vertical handler according to the present invention.

The device write / check unit 400 of the vertical handler according to the present invention includes a DIP type semiconductor device socket 420 into which a semiconductor device is inserted, and a socket open / lock lever protruding from one side of the semiconductor device socket 420. 421, an upper connect substrate 431 including the semiconductor device socket, a lower connect substrate 432 connected to the upper connect substrate 431 to record and read predetermined data, and A pair of supports 435 perpendicular to and opposing the element recording / inspection section, a rotary link 440 rotating around a link rotation axis having one end connected to a lower end between the supports 435, and the rotary link The connecting rod 410 formed at the upper end of the 440 and the connecting rod 410 are connected to each other by pushing or pulling the socket opening / locking lever 421 according to the rotation of the rotary link 440. small Characterized in that it comprises a follower link (411) to the socket so as to be opened or locked.

Referring to the configuration of the present invention with reference to the configuration as described, the rotary link 440 is connected to the reciprocating cylinder 423 installed on the bottom of the vertical handler drive link (connected to the reciprocating cylinder 423) According to the operation of the 425 is rotated around the axis connected to the support 435, accordingly the rotary link 440 pushes and pulls the connecting rod 410.

According to the pushing and pulling operation of the connecting rod 410, the driven link 411 connected to the connecting rod 410 and the socket open / lock lever 421 pushes and pulls the socket open / lock lever 421. The DIP type semiconductor device socket 420 may be opened or closed. This allows predetermined data to be written / inspected in the semiconductor device.

In addition, the semiconductor device socket mounting structure may include a semiconductor device socket 420 and an operation region of the rotary link 440, the connecting rod 410, and the driven link 411, which are operation units for opening and closing the semiconductor device socket 420. The corresponding part is opened, and a protective cover 418 may be further formed to protect the remaining element writing / inspecting portion.

9 is a view for explaining the operation of the rotary link 440 in the semiconductor device socket mounting structure of the vertical handler according to the present invention.

Referring to FIG. 9, the lower end of the rotary link 440 is connected to the support 435 to enable the rotation of the rotary link 440, and also extends to the upper end of the rotary link 440 by a predetermined length. The drive link 425 is coupled between the link hinges, so that the rotary link 440 rotates according to the piston movement of the drive link 425.

More specifically, when the rotary link 440 is pulled downward by the drive link 425 coupled between the link hinge portion, the rotary link 440 is half the center of the rotation axis connected to the support 435 When rotated in a clockwise direction, on the contrary, the rotary link 440 is pushed upward by the reciprocating link 425, the rotary link 440 rotates in a clockwise direction about a rotation axis of the lower end connected to the support 435.

In the device installation structure of the vertical handler according to the present invention, the opening and closing process of the semiconductor device socket 420 according to the rotation of the rotary link 440 will be described in detail with reference to FIG. 10. Explain.

As shown in FIG. 10, a drive link 425, which is connected to the reciprocating cylinder 423 and performs a piston movement, is connected to the rotary link 440 through the link hinge portion. In addition, the rotary link 440 is rotated in accordance with the piston movement of the reciprocating link 425 around the lower link rotation axis.

In more detail, when the driving link 425 moves upward and the rotary link 440 rotates clockwise around the link axis of rotation, the connecting rod 410 connected to the upper end of the rotary link 440 is forward. And the driven link 411 connected to the connecting rod 410 pushes the device socket opening / closing lever 421 to the front so that the semiconductor device can be inserted into the semiconductor device socket 420. Becomes

On the contrary, when the driving link 425 moves downward and the rotary link 440 rotates counterclockwise around the link axis of rotation, the connecting rod 410 connected to the upper end of the rotary link 440 moves backward. And the lead of the semiconductor element and the socket inserted into the semiconductor element socket 420 is pulled by the driven link 411 connected to the connecting rod 410 by pulling the element socket opening and closing lever 421 backward. It is connected stably. As a result, predetermined data may be recorded / inspected in the semiconductor device.

On the other hand, the shape of the device recording / inspection unit as shown in Figure 7 to 10 is a DIP (Dual Inline Package) type semiconductor device socket, more wide open and close lever is formed on one side of the semiconductor device socket, pushing the opening and closing lever It can be applied to SMD (Surface Mount Device) type that can be inserted into the semiconductor device by pulling.

Meanwhile, in order to be applied to a PLCC (Plastic Leaded Chip Carrier) type semiconductor device socket or a SOIC (Small Outline IC) type semiconductor device socket as a specific embodiment of the present invention, the PLCC or SOIC type semiconductor It can be applied by replacing the upper connector substrate on which the device socket is mounted and forming a push means capable of pressing the upper surface of the semiconductor socket by the rotary link.

11 is a flowchart illustrating a method of operating a vertical handler according to the present invention.

Referring to FIG. 11, in order to operate the handler according to the present invention, first, a tube in which a semiconductor element to be recorded and inspected is stored is supplied to the tube feeding part 100 (S100). Here, when the handler is operated for the first time, it is assumed that the first stopper 215 and the second stopper 220 are in a stopped state in order to prevent the semiconductor element from continuously falling.

In addition, the element exhausting sensor 225 formed on the sidewall of the chute 210 above the first stopper 215 may determine whether all of the semiconductor elements supplied from one tube are exhausted (S150).

In this case, when there is no semiconductor element detected by the element exhausting sensor 225, it is determined that all of the semiconductor elements supplied from one tube are exhausted, and thus the lowermost tube is removed by the tube feeding unit 100. , To be replaced with a tube of the upper rectus (S200).

In addition, when there is a semiconductor element detected by the element exhausting sensor 225, the semiconductor element is moved along the chute by opening the first stopper 215 (S250).

Then, the first stopper 215 is blocked, and the second stopper 220 is opened so that the semiconductor elements are supplied one by one so as to fall to the support of the microadjusting device 240 at the lowermost end of the chute 210 (S300). .

In addition, the second stopper 220 is blocked to prepare another semiconductor supply (S350).

In step S400, whether the semiconductor device is positioned on the support of the fine adjustment device 240 is detected by the first position sensor 230.

When it is determined that the semiconductor element is supplied to the support of the microadjustment apparatus by the first position sensor, the element transfer unit 300 transfers the semiconductor element to the socket of the element recording / inspection unit 400 (S450). ).

Next, the device writing / inspecting unit 400 performs recording / inspection after the semiconductor device transferred by the device transferring unit 300 is inserted into the socket. In this case, the device writing / inspection unit 400 performs recording / inspection every time a semiconductor device is inserted into the socket, thereby delaying time compared to performing recording / inspection after the semiconductor device is inserted into a predetermined number of semiconductor sockets. Can be reduced.

More specifically, as shown in FIG. 5, each time a semiconductor element is inserted into the eight semiconductor element sockets 405a to 405h, recording / inspection is performed. At this time, although there is a time difference according to the data to be written, for example, the semiconductor element is first inserted into the socket 405a, and then the recording / inspection is performed, and the semiconductor elements are sequentially inserted into the remaining sockets 405b to 405h. After the recording / inspection is performed, after the semiconductor element is inserted into the last semiconductor socket 405h, the element transfer part immediately transfers the semiconductor element located at 405a after the recording / inspection has been completed. By being able to discharge to 500, the delay time according to the recording / inspection of the semiconductor element can be reduced.

On the other hand, the recording / inspection of the semiconductor element is performed by the program input unit (see 21 in FIG. 2) and the test unit (see 22 in FIG. 2) after the semiconductor element is inserted into the semiconductor element socket.

The semiconductor device, which has been recorded / inspected by the above step, should be classified according to whether the product is defective or defective and stored in a loading tube coupled to the insertion groove 610 of the device storage unit 600.

In order to store the device in the loading tube as described above, the loading tube should be coupled, and the coupling is detected by the second position sensor formed in the insertion groove 610 of the device storage unit 600 ( S550).

When it is determined that the loading tube is not coupled to the insertion groove 610 by the second position sensor, the warning lamp is operated (S600), and the operation of the handler is stopped (S650).

On the other hand, when it is determined that the loading tube is coupled by the second position sensor, the unloading guide rail of the element discharge part 500 connected to the insertion groove to which the loading tube is coupled according to whether the semiconductor device is good or bad. The device is separated / ejected toward 530 (S700).

In this case, at least two or more loading tubes are coupled to the insertion groove 610 of the device storage unit 600, so that the device may be separated / discharged according to whether the device is defective or defective.

By the above steps, the separated / discharged semiconductor device is stored in a predetermined loading tube according to the good or bad (S750).

On the other hand, when exhaustion of the semiconductor device is detected by the element exhaust sensor 225 during the operation of the vertical handler as described above, a predetermined signal is applied to the tube feeding unit 100 so that a new tube is replaced. do.

The semiconductor device socket installation structure of the vertical handler according to the present invention has another structure that can push and pull the opening / locking lever of the semiconductor device socket separately, thereby stably inserting the predetermined data after the semiconductor device is inserted into the semiconductor device socket. Can be recorded, checked.

In addition, the semiconductor device socket mounting structure of the vertical handler according to the present invention can stably open and close the semiconductor device socket, it is possible to prevent damage to the device generated when the device is inserted into or removed from the semiconductor device socket.

1 is a perspective view of a vertical handler according to the present invention.

2 is a block diagram illustrating an operating state of the vertical handler according to the present invention.

Figure 3 is an enlarged perspective view of the element feeding unit in the vertical handler according to the present invention.

4 is a partially enlarged view of a device transfer unit in the vertical handler according to the present invention.

5 is a view for explaining the operation of the device recording / inspection unit in the vertical handler according to the present invention.

6 is a view for explaining the operation of the element discharge unit and the element storage unit in the vertical handler according to the present invention.

7 is an enlarged view of a part of the device write / check unit of the vertical handler according to the present invention;

8 is an exploded perspective view of an element recording / inspection portion of a vertical handler according to the present invention;

9 is a view for explaining the operation of the rotary link in the semiconductor device socket mounting structure of the vertical handler according to the present invention.

10 is a side view of the element writing / inspecting portion of the vertical handler according to the present invention.

11 is a flowchart illustrating a method of driving a vertical handler according to the present invention.

<Description of Main Parts of Drawings>

100: tube feeding part 200: element feeding part

300: device transfer unit 400: device recording / inspection unit

410: connecting rod 411: driven link

420: semiconductor element socket 421: socket open / lock lever

435: support 440: rotating link

500: device discharge unit 600: device storage unit

700: inclination adjustment

Claims (3)

A semiconductor element socket for allowing predetermined data to be recorded / inspected in the semiconductor element; A socket opening / locking lever protruding from one side of the socket for opening and closing the semiconductor device socket; A pair of supports formed perpendicular to and opposed to the element recording / inspection portion of the vertical handler; One end is connected to the lower end between the support and the rotating link to rotate around the link axis of rotation, A connecting rod formed at an upper end of the rotary link; And a driven link connected to the connecting rod to push or pull the socket opening / locking lever in accordance with the rotation of the rotary link. The method of claim 1, The rotary link, The semiconductor device socket mounting structure of the vertical handler is connected to the drive link of the reciprocating cylinder, it is possible to rotate around the rotary link shaft connected to the support. The method of claim 1, And the semiconductor device socket has a socket structure for a semiconductor device of a DIP type.