JP2000127073A - Parts sucker, parts transport device and parts tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of negative pressure sources, and to improve the throughput of parts sucking operation by easily specifying a sucking part incomplete in sucking by negative pressure and sucking parts only by the sucking part by negative pressure to be surely transported. SOLUTION: This device includes at least two or more sucking pads 10a, 10b where the negative pressure is introduced to respectively suck an IC chip 8, a single ejector 18 for introducing negative pressure to two or more negative pressure introducing tubes 12a, 12b, valves 16a, 16b which are respectively disposed in the midway of each negative pressure introducing tube 12a, 12b and capable of intercepting introduction of negative pressure at need, pressure sensors 14a, 14b respectively installed in the midway of each negative pressure introducing tube 12a, 12b for detecting the internal pressure, and a control means 20 for deciding suction pads 10a, 10b where no IC chip 8 is sucked and outputting a driving signal for closing valves 16a, 16b corresponding to the suction pads 10a, 10b where no IC chip 8 is sucked.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component suction device, a component transfer device, and a component test device, and more particularly, to a component suction device for suctioning electronic components such as IC chips, and to sucking or holding the components. TECHNICAL FIELD The present invention relates to a component transport device for transporting a component, and a component testing device having the component transport device.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. In such a test apparatus, a component handling apparatus called a handler is used. In this handler, a large number of IC chips stored in a tray are suctioned by a component transfer device having a component suction device and transferred onto a test head of a test device, and each IC chip is brought into electrical contact with the test head.
Test the IC chip. Then, when the test is completed, each IC chip is carried out of the test head by a component transfer device having a component suction device, and is placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed. .

[0005] In this type of test apparatus, IC chips are exchanged between a customer tray and a test tray before and after a test. As a test device for performing a test by bringing an IC chip into contact with a test head, a device of a type in which an IC chip is pressed on a test head while mounted on a test tray is known. This type of test equipment mainly consists of DRAM, SRAM, EPROM, E
It is used for testing a memory IC chip such as an EPROM, and can test many IC chips at a time.

Further, after applying a thermal stress to the IC chips stored in the customer tray using a heat plate or the like, the IC chips are sucked several times at a time by a component suction device and carried to a socket of a test head, whereupon the IC chips are transferred. There is also known a device of a type in which a socket and a socket are electrically contacted. In a test process of a test apparatus of this type, an IC chip is pressed against a test head while being sucked by a component suction apparatus. This type of test apparatus is mainly used to test an IC chip having a built-in logic circuit or analog circuit.

[0005] In these test apparatuses or handlers, after the IC chip is adsorbed on the adsorption section of the component adsorption apparatus,
Alternatively, after releasing the IC chip from the suction section of the component suction device, it is necessary to move the component suction device.
It is necessary to check whether the IC chip is securely sucked or released by the suction section of the component suction device. Therefore, conventionally, a pressure sensor that detects the pressure of the negative pressure introduction passage that supplies a negative pressure to the suction unit of the component suction device is mounted in the middle of the negative pressure introduction passage, and the pressure sensor in the negative pressure introduction passage detected by the pressure sensor is installed. The suction or release of the IC chip is determined based on the pressure change. That is, when the pressure in the negative pressure introduction passage is maintained in a negative pressure state, it can be determined that the IC chip is being sucked by the suction portion, and when the pressure is not maintained in the negative pressure, the IC chip is not. It can be determined that the chip has not been sucked.

This method is an extremely effective method when a negative pressure source is connected to each of the negative pressure introduction passages corresponding to a single suction section, and the IC chip is surely sucked to the suction section. Can be detected.

[0007]

However, recently, a plurality of negative pressure introducing passages are connected to a single negative pressure generating source,
It has been proposed that a negative pressure is introduced into a plurality of adsorption sections from the same negative pressure generation source to reduce the amount of air used for generating the negative pressure and reduce the cost of the apparatus. As described above, in a component suction device that connects a plurality of negative pressure introduction passages to a single negative pressure generation source and can simultaneously suction a plurality of components, a negative pressure introduction passage is formed by a pressure sensor using the same method as in the related art. When the pressure inside is detected, it has the following problem.

That is, in such a conventional apparatus, since the reference pressure to be compared with the pressure detected by the pressure sensor is single, the IC chip may not be completely absorbed by only one of the specific suction parts. It cannot be distinguished from the case where the IC chip is not adsorbed to all the adsorption sections.
For this reason, in the conventional apparatus, even when the suction of the IC chip is incomplete at only one of the specific suction sections, it is determined that the suction at all the suction sections is incomplete, and the suction at all the suction sections is incomplete. It is necessary to redo the operation, and the wasted time is increased by that amount, and the throughput of the component suction operation may be deteriorated.

[0009] It should be noted that the IC is used only in any one of the specific suction parts.
If the suction device is moved while the suction of the chip is incomplete, the negative pressure leaks from the suction part where the suction is incomplete, and the negative pressure leaks due to acceleration due to the movement of the suction device. There is a possibility that the IC chip may fall off from all the suction parts connected to the introduction passage.

[0010] The present invention has been made in view of such circumstances, and aims to reduce the number of negative pressure generating sources, and to easily identify a suction portion in which suction by a negative pressure is incomplete.
A component suction device, a component transfer device, and a component suction device that perform suction of components only at a suction portion where suction by a negative pressure is sufficient, reliably transport components without dropping them, and improve throughput of component suction operations. An object of the present invention is to provide a component test apparatus.

[0011]

In order to achieve the above object, a component suction device according to the present invention comprises at least two or more suction portions to which components are suctioned by introducing a negative pressure, respectively.
At least two or more negative pressure introducing passages for introducing a negative pressure into each of the suction portions, a negative pressure source for introducing a negative pressure into the two or more negative pressure introducing passages, and A valve mounted and capable of shutting off the introduction of negative pressure from the negative pressure generation source to the suction section as necessary, and a valve mounted in the middle of each of the negative pressure introduction passages and the internal pressure of each of the negative pressure introduction passages And a drive signal for closing a valve corresponding to the suction part where the component is not sucked and outputting a drive signal for closing the valve corresponding to the suction part where the part is not sucked is determined according to the pressure sensor that detects the pressure and the detection pressure of each of the pressure sensors. Control means for performing the operation.

The control means includes a first comparing means for determining whether an absolute value of a detected pressure of a specific pressure sensor is equal to or higher than a low level reference pressure, and an absolute value of a detected pressure of the same specific pressure sensor. Preferably has at least a second comparing means for determining whether or not the pressure is equal to or higher than the high-level reference pressure.

In a state where the control means does not output the drive signal for closing the valve, the second comparing means determines that the absolute value of the pressure detected by the specific pressure sensor is higher than the high level reference pressure. If it is determined, all suction units OK that output a confirmation signal indicating that a component is being suction-held by each suction unit
It is preferable to further include signal output means.

In a state where the control means does not output a drive signal for closing the valve, the first comparing means determines that the absolute value of the detected pressure of the specific pressure sensor is smaller than the low level reference pressure. If it is determined, a drive signal for closing the specific valve corresponding to the specific pressure sensor is output, and a confirmation signal indicating that the component is not suction-held at the specific suction unit corresponding to the specific pressure sensor. It is preferable to further include a specific suction unit NG signal output unit that outputs the signal.

The low-level reference pressure is higher than the absolute value of the detected pressure of the specific pressure sensor when the components are not suctioned to all the suction portions, and the components are only applied to the suction portion corresponding to the specific pressure sensor. It is preferable that the pressure is set to be lower than the absolute value of the detected pressure of the specific pressure sensor in the case of being sucked.

The high-level reference pressure is set as a pressure at which a component is held by suction without falling off from the suction portion when a negative pressure having an absolute value higher than the high-level reference pressure acts on the suction portion. Preferably.

It is preferable that the pressure sensor mounted in the middle of each of the negative pressure introducing passages is mounted closer to the suction pad than each of the valves.

The component conveying device according to the present invention includes any one of the component suction devices described above and a moving mechanism for moving the component sucked by the component suction device.

A component testing apparatus according to the present invention includes the component transport device and a test head for testing a component transported by the component transport device.

[0020]

In the component suction device, the component transfer device and the component test device according to the present invention, at least two or more negative pressure introducing passages for introducing a negative pressure to each suction portion are connected to a single negative pressure generating source. is there. For this reason, the number of negative pressure sources can be reduced, and the air consumption at the negative pressure sources and the cost of the apparatus can be reduced.

Further, the control means can determine the suction portion where the component is not sucked, according to the pressure detected by each pressure sensor provided for each negative pressure introduction passage, so that suction by the negative pressure is not caused. It is easy to specify the complete suction part. In order to determine the suction portion where the component is not sucked, for example, the first specific comparison unit that determines whether the absolute value of the pressure detected by the specific pressure sensor is equal to or higher than the low level reference pressure, This is performed by the second comparing unit that determines whether the absolute value of the pressure detected by the pressure sensor is equal to or higher than the high-level reference pressure.

When the second comparing means determines that the absolute value of the pressure detected by the specific pressure sensor is equal to or higher than the high-level reference pressure while the drive signal for closing the valve is not being output. Since it can be determined that a component is being held by suction in each suction section, in that case, the all suction section OK signal output means outputs a confirmation signal to that effect.

If the first comparing means determines that the absolute value of the pressure detected by the specific pressure sensor is smaller than the low-level reference pressure while the drive signal for closing the valve is not being output. And outputs a drive signal for closing a specific valve corresponding to the specific pressure sensor. Then, in that case, the specific suction unit NG signal output means
A confirmation signal is output to the effect that the component is not suction-held at the specific suction section corresponding to the specific pressure sensor.

In the component suction device according to the present invention, when a component is not suction-held at a specific suction unit corresponding to a specific pressure sensor, a signal for closing a specific valve corresponding to the specific suction unit. Is output. For this reason, no negative pressure is introduced into the suction unit that has determined that the component has not been suctioned. As a result, the absolute value of the negative pressure of the suction part where the suction by the negative pressure is sufficient increases, the component is sucked only by the suction part, and the part is reliably transported without dropping,
It is possible to improve the throughput of the component suction operation.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. FIG. 1A is a schematic diagram of a component conveying device according to an embodiment of the present invention, FIG. 1B is a conceptual diagram of the component suction device shown in FIG. 1A, and FIG. 2 is FIG.
3 is a flowchart showing an example of a control flow of the control device shown in FIG. 3, FIG. 3 is a flowchart continued from the flowchart shown in FIG. 2, FIG. 4 is a conceptual diagram showing a change in detected pressure of the pressure sensor, and FIG. FIG. 6 is a perspective view of an IC chip component test apparatus according to the embodiment, FIG. 6 is a schematic view for explaining a transport path of an IC chip to be tested by the test apparatus shown in FIG.
FIG. 7 is a schematic diagram schematically showing an IC chip component transport device for realizing the flow of IC chips in the test apparatus, and FIG. 8 is a schematic diagram showing a tray flow inside a chamber of the IC chip component test device. is there.

First Embodiment As shown in FIG. 1A, an IC chip component conveying device 2 according to the present embodiment includes an IC chip component sucking device 6 and an IC chip conveying device 6 for conveying the IC chip component sucking device 6. And a movable head 4. The IC chip component suction device 6 includes two first suction pads (suction portions) 10a for sucking and holding the IC chip 8 as a component to be sucked, and a second suction pad 10a.
It has a suction pad 10b. One end of a first negative pressure introducing tube 12a and one end of a second negative pressure introducing tube 12b constituting a negative pressure introducing passage are connected to the suction pads 10a and 10b, respectively.

Two negative pressure introducing tubes 12a and 12
The other end of b is connected to an ejector 18 as a single negative pressure source installed on the movable head 4. The movable head 4 may be provided with two or more suction pads, but in the present embodiment, for the sake of simplicity, two first and second suction pads 10a and 10b are mounted. It is explained as having been.

Electromagnetic valves 16a and 16b are mounted in the middle of each of the negative pressure introducing tubes 12a and 12b, so that kneading between the ejector 18 and the suction pad 10a or 10b is appropriately blocked, and the suction valve 10a or 10b is Is configured to be able to cancel the introduction of the negative pressure. In the middle of each of the negative pressure introducing tubes 12a and 12b, the suction pads 10a and 1
0b, a first pressure sensor 14a and a second pressure sensor 14b are mounted, and each negative pressure introduction tube 12a
And 12b can be detected.

First and second pressure sensors 14a and 1
The output signal of 4b is input to the control device 20, and based on the result, the control device 20 controls opening and closing of each of the electromagnetic valves 16a and 16b.

The suction pads 10a and 10b are mounted on the lower ends of the drive rods 22a and 22b. Each of the drive rods 10a and 10b can be driven in the Z-axis direction (vertical direction) by air pressure cylinders 24a and 24b fixed to the movable head 4. The movable head 4 is fixed to the X-axis moving body 30 and
The axis moving body 30 is an X-axis rail 3 extending along the X-axis direction.
2 is held movably in the X-axis direction (substantially perpendicular to the paper surface of FIG. 1).

A screw shaft 34 extending along the X-axis rail 32 is screw-connected to the X-axis moving body 30, and the rotation of the screw shaft 34 causes the X-axis moving body 30 to move to the X-axis rail 32 and the guide shaft. It is movable along 36. The X-axis rail 32 itself is movable in the Y-axis direction along a Y-axis rail (not shown). That is, the drive rods 22 of the air pressure cylinders 24a and 24b fixed to the movable head 4
The suction pads 10a and 10b fixed to a and 22b are freely movable in the X-axis, Y-axis and Z-axis directions. FIG. 1B is a conceptual diagram of only the IC chip component suction device 6 in the IC chip component transport device 2 shown in FIG.

Next, the operation of the control device 20 shown in FIG. 1A will be described with reference to the flowcharts shown in FIGS. As shown in FIG. 2, when the control by the control device 20 shown in FIG. 1A starts, in step S1, the control device 20 shown in FIG.
To generate a negative pressure. Next, in step S2, the flags V1 and V2 stored in the memory in the control device 20 are initialized, and the values of those flags are set to 0.
To These flags V1 and V2 indicate whether the electromagnetic valves 16a and 16b are open, respectively.
When the value of the flag is 0, it means that the corresponding electromagnetic valve is open, and when the value of the flag is 1, it means that the corresponding electromagnetic valve is closed.

Next, in step S3 shown in FIG.
The pressure of the pressure sensor 14a is detected, and the detected pressure signal is set to P1. In step S4, the second pressure sensor 14b
Is detected, and the detected pressure signal is set to P2. Step S4 may be performed simultaneously with or before or after step S3.

Next, in step S5, the control means 20 shown in FIG. 1A determines that the absolute value of the pressure (negative pressure) P1 detected by the first pressure sensor 14a is equal to a predetermined low-level reference pressure PL ( It is determined whether or not the above is the case (first comparing means). In the following description, the first pressure sensor 14
First, the pressure P1 detected in step a is determined, and then the second
Although the determination is made on the pressure P2 detected by the pressure sensor 14b, the reverse may be performed. In that case, FIG.
And the symbols P1 and P2 in FIG.
May be reversed, and the first suction pad and the second suction pad may be reversed. Further, the pressure P1 detected by the first pressure sensor 14a is first determined, and then the second pressure sensor 14a is determined.
The control shown in FIGS. 2 and 3 for determining the pressure P2 detected at b, and conversely, the pressure P2 detected at the second pressure sensor 14b is first determined, and then the first pressure sensor 14a detects the pressure P2. The control for determining the performed pressure P1 may be performed simultaneously and in parallel.

In the following description, in order to first determine the pressure P1 detected by the first pressure sensor 14a, in step 5, the absolute value of the pressure P1 detected by the first pressure sensor 14a is set to a low level. When it is determined that the pressure is equal to or higher than the reference pressure PL, next, step S6 is performed. In step S6, it is detected whether the absolute value of the pressure P1 detected by the first pressure sensor 14a is equal to or higher than the high-level reference pressure PH (see FIG. 4) (second comparing means).

Here, the low level reference pressure PL shown in FIG.
The detection pressure P1a of the first pressure sensor 14a when the two suction pads 10a and 10b are not suctioned with the IC chip 8 in a state where the two electromagnetic valves 16a and 16b illustrated in FIG. 1 are open (see FIG. 4). ) And the absolute value P1b of the detected pressure of the first pressure sensor 14a when the IC chip 8 is sucked only on the suction pad 10a corresponding to the first pressure sensor 14a.
(See FIG. 4). In FIG.
The absolute value P1a of the negative pressure is lower than P1b because, when the IC chip 8 is not adsorbed on the two suction pads 10a and 10b (including incomplete suction), the negative pressure from the two suction pads 10a and 10b is negative. This is because the pressure leaks and the pressure detected by each of the pressure sensors 14a and 14b approaches the atmospheric pressure.

The high level reference pressure PH shown in FIG.
Is an absolute value P1c higher than the high-level reference pressure PH.
When the negative pressure of the pressure acts on the first suction pad 10a, the IC
The pressure is set as the pressure at which the chip 8 is sucked and held without dropping from the first suction pad 10a. The case where the absolute value of the negative pressure P1 detected by the first pressure sensor 14a shown in FIG. 1 is a value P1c higher than the high-level reference pressure PH shown in FIG. 1
This is a case where the IC chip 8 is completely sucked and held by the second suction pad 10b as well as by the second suction pad 10b. If the second
When the suction of the IC chip 8 by the suction pad 10b is incomplete, the negative pressure leaks therefrom, and the pressure in the first negative pressure introducing tube 12a communicating with the second negative pressure introducing tube 12b is detected. This is because the absolute value of the pressure detected by the first pressure sensor 14a does not reach P1c shown in FIG. 4 but stops at P1b.

If it is determined in step S6 shown in FIG. 2 that the absolute value of the pressure P1 detected by the first pressure sensor 14a is equal to or higher than the high-level reference pressure PH, the flow proceeds to step S7.
To confirm that the flag V1 is 0. As described above, the case where the flag V1 is 0 is a case where the first electromagnetic valve 16a is open.
Going to step S8, it is confirmed that the flag V2 is 0. The case where the flag V2 is 0 is the case where the second electromagnetic valve 16b is open as described above. If the determinations in steps S5 to S8 are all affirmative, the electromagnetic valves 16a and 16b shown in FIG. 1 are all open, and the absolute value of the detected pressure P1 of the first pressure sensor 14a is This is the case where P1c shown in FIG.
In this case, the negative pressure is not leaked to the two suction pads 10a and 10b, and the IC chip 8
Is completely adsorbed. Therefore, in that case, the process goes to step S9 shown in FIG.
Outputs a confirmation signal indicating that the IC chip 8 is completely sucked and held on each of the suction pads 10a and 10b (all suction section OK signal output).

When it is determined in step S5 shown in FIG. 2 that the absolute pressure of the detected pressure P1 of the first pressure sensor 14a is smaller than the low level reference pressure PL shown in FIG. 4, the process goes to step S10. , The flag V1 is 0. If so, the process goes to step S11, where it is confirmed that the flag V2 is 0. In step S5, it is determined that the absolute pressure of the detected pressure P1 of the first pressure sensor 14a is smaller than the low level reference pressure PL shown in FIG. 4, and if steps S10 and S11 are affirmative, at least the first pressure It can be determined that the suction of the IC chip 8 by the suction pad 10a is incomplete. Therefore, in that case, step S12
Then, the control device 20 outputs a drive signal to the first electromagnetic valve 16a to close the first electromagnetic valve 16a shown in FIG. At the same time, the flag V1 is changed from 0 to 1.
Next, the process proceeds to step S13, and a confirmation signal indicating that the suction by the first suction pad 10a is incomplete is output (specific suction unit NG signal output). Steps S13 and S12 may be performed simultaneously or in reverse order.

Thereafter, the flow returns to step S3 and subsequent steps. At steps S3 and S4, the pressure sensors 12a and 12a after the first electromagnetic valve 16a shown in FIG.
The pressure of b is detected again. When the first electromagnetic valve 16a is closed, no negative pressure is introduced into the first suction pad 10a,
The pressure of the first suction pad 10a becomes the atmospheric pressure. If the IC chip 8 is incompletely
Is held by suction, the IC chip 8 is returned to the predetermined position. When the IC chip 8 is not held by suction on the first suction pad 10a, the state is kept as it is.

In this state, the absolute value of the detected pressure P1 of the first pressure sensor 14a is certainly smaller than the low level reference pressure PL shown in FIG. Therefore, in step S5 shown in FIG.
Then, since the flag V1 is 1, the process goes to step S14 shown in FIG. In step S14, with the first electromagnetic valve 16a shown in FIG.
It is determined whether the absolute value of the detected pressure P2 according to 4b is equal to or higher than the high-level reference pressure PH shown in FIG. In step S14, the pressure P2 detected by the second pressure sensor 14b
Is greater than or equal to the high-level reference pressure PH shown in FIG. 4, when the electromagnetic valve 16a shown in FIG. 1 is closed and the IC chip 8 is completely sucked onto the second suction pad 10b. There are cases. Therefore, in this case, as shown in FIG. 3, the process proceeds to step S15, and a confirmation signal (OK signal) indicating that the IC chip 8 is completely suction-held is output to the second suction pad 10b.

If the IC chip 8 is not completely sucked by the second suction pad 10b, the second pressure sensor 1
4b, the absolute value of the detected pressure P2 does not exceed the high-level reference pressure PH shown in FIG. Therefore, in this case, as shown in FIG. 3, the process proceeds from step S14 to step S16, and a confirmation signal (NG signal) indicating that the IC chip 8 is incompletely sucked is output to the second suction pad 10b. I do.

In step S6 shown in FIG. 2, the absolute value of the detected pressure P1 of the first pressure sensor 14a shown in FIG.
When it is determined that the high-level reference pressure PH shown in (1) has not been reached, the process proceeds to step S17, and the flag V1 is set to 0.
Is determined. If the flag V1 is 0, the process proceeds to step S18, and it is confirmed whether the flag V2 is 0. If the flag V2 is affirmative, the process proceeds to step S1.
Go to 9. The process goes from step S5 to step S6, and if it is determined to be affirmative in steps S17 and S18, the detection pressure of the first pressure sensor 14a is kept in a state where the first electromagnetic valve 16a and the second electromagnetic valve 16b are open. This is the case where the absolute value of P1 does not reach the high level reference pressure PH shown in FIG. 4 and is at the predetermined value P1b. In this case, the suction holding of the IC chip 8 by the second suction pad 10b shown in FIG. 1 is incomplete, and there is a high possibility that the negative pressure leaks therefrom. Therefore, in that case, in step S19 shown in FIG. 2, the second electromagnetic valve 16 shown in FIG.
b to close the second solenoid valve 1
The drive signal is output to 6b. At the same time, the flag V2 is switched from 0 to 1.

Thereafter, in step S20, an NG confirmation signal indicating that the suction holding of the IC chip 8 by the second suction pad 10b shown in FIG. 1 is incomplete is output. Step S19 and step S20 may be performed simultaneously or in reverse order.

After step S20, the process returns to step S3 and subsequent steps. In steps S3 and S4, each pressure sensor 1 after closing the first electromagnetic valve 16a shown in FIG.
Redetect the pressure at 2a and 12b. When the second electromagnetic valve 16b is closed, no negative pressure is introduced into the second suction pad 10b, and the pressure of the second suction pad 10b becomes atmospheric pressure. If the IC chip 8 is incompletely sucked and held on the second suction pad 10b, the IC chip 8 is returned to a predetermined position. If the IC chip 8 is not held by suction on the second suction pad 10b,
It is as it is.

When the second electromagnetic valve 16b is closed, the absolute value of the pressure P2 detected by the second pressure sensor 14b is
It is certainly smaller than the low level reference pressure PL shown in FIG.
When the second electromagnetic valve 16b is closed, the absolute value of the detection pressure P1 of the first pressure sensor 14a changes according to the degree of suction of the IC chip 8 to the first suction pad 10a. That is, when the IC chip 8 is completely suctioned to the first suction pad 10a, there is no leakage of negative pressure, and the process should go from step S6 to step S7 and go to step S8. In step S8, since the second electromagnetic valve 16b is in the closed state,
Go to step S21 shown in FIG. In step S21, an OK confirmation signal indicating that the suction holding of the IC chip 8 by the first suction pad 10a is complete is output.

When it is determined in step S6 that the absolute value of the detected pressure P1 of the first pressure sensor 14a is smaller than the high level reference pressure PH shown in FIG. 4 while the second electromagnetic valve 16b is closed. Has a first suction pad 10a
This is the case where the IC chip 8 is also incompletely adsorbed.
Therefore, in that case, the process proceeds from step S17 to step S18, and reaches step S22 shown in FIG.
An NG confirmation signal indicating that the suction holding of the IC chip 8 by the first suction pad 10a is incomplete is output.

In the flowchart shown in FIG. 2, when the judgments in steps S7, S11 and S17 are negative, it is considered that some abnormality has occurred. In that case, the process returns to step S2. The flags V1 and V2 are initialized, and the control is performed again.

In the IC chip component suction device 6 and the IC chip component transport device 2 according to the present embodiment, two negative pressure introducing tubes 12a and 12b for introducing a negative pressure to each of the suction pads 10a and 10b are a single negative pressure introducing tube. It is connected to an ejector 18 which is a pressure generating source. For this reason, the number of ejectors 18 can be reduced, the amount of air consumed by the ejectors 18 and the cost of the device 2 or 6 can be reduced.

In the control device 20, each pressure sensor 14 provided for each of the negative pressure introducing tubes 12a and 12b is provided.
Since the suction pads 10a or 10b on which the IC chip 8 is not suctioned can be determined according to the detection pressures a and 14b, it is easy to specify the suction pads 10a or 10b that are not completely suctioned by the negative pressure. It is.

When the IC chip 8 is not suction-held on the specific suction pad 10a or 10b corresponding to the specific pressure sensor 14a or 14b, the specific valve 16a or 16b corresponding to the specific suction portion 10a or 10b is used. The signal for closing is output. Therefore, I
Suction pad 1 that determined that C chip 8 was not sucked
No negative pressure is introduced at 0a or 10b. As a result, the suction pad 10a where the suction by the negative pressure is sufficient
Alternatively, the absolute value of the negative pressure of 10b increases, and the IC chip 8 is sucked only by the suction pad 10a or 10b.
The IC chip 8 can be reliably transported by the transport device 2 without dropping, and the throughput of the component suction operation can be improved.

Second Embodiment In this embodiment, a description will be given of an IC chip component test apparatus using a large number of the IC chip component transport devices 2 according to the first embodiment.

The IC test apparatus 1 according to the present embodiment shown in FIG. 5 tests whether an IC chip as an electronic component to be tested operates properly under high or low temperature stress. (Inspection), and classifies IC chips according to the test results. The operation test under such a temperature stress is performed by replacing the IC chip under test from the customer tray on which a large number of IC chips under test are mounted to the IC tray conveyed in the IC test apparatus 1. Will be implemented.

For this reason, the IC test apparatus 1 of the present embodiment
As shown in FIG. 5 and FIG. 6, the IC storage unit 100 stores an IC chip to be tested from now on, and classifies and stores tested IC chips.
A loader unit 200 for sending the IC chip to be tested sent from the chamber 300 to the chamber 300, a chamber 300 including a test head, and an unloader unit 400 for classifying and extracting the tested IC chips tested in the chamber 300. Have been.

The IC storage unit 100 stores the pre-test IC stocker 101 for storing the IC chips to be tested before the test, and the tested ICs for storing the IC chips to be tested classified according to the test results. A stocker 102 is provided.

The pre-test IC stocker 101 includes:
While the customer trays storing the IC chips to be tested to be tested are stacked and held, the tested IC stocker 102 has a customer tray in which the IC chips to be tested are appropriately classified. Laminated and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 5 and 6, one stocker LD is provided in the pre-test stocker 101, one empty stocker EMP to be sent to the unloader unit 400 is provided next to the stocker LD, and the tested IC stocker 102 is provided. , UL5 are provided so that they can be sorted and stored in a maximum of five categories according to test results. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

Loader section 200 The above-mentioned customer tray is placed on the window 202 of the loader section 200 by a tray transfer arm (not shown) provided between the IC storage section 100 and the apparatus board 201.
01 is carried from below. Then, the loader unit 200
In the above, the IC chips under test loaded on the customer tray are once transferred to the pitch conversion stage 203 by the first transfer device 204 (see FIG. 7), where the mutual positions of the IC chips under test are corrected, and After changing the pitch, the IC chip under test transferred to the pitch
Position C in the chamber 300 using the transfer device 205 of FIG.
The IC tray 110 according to the present embodiment stopped at R1 (see FIGS. 6 and 8) is reloaded. At that time, the shutter at the entrance 303 of the chamber 300 shown in FIG. 5 is open.

The window 202 and the chamber 3 shown in FIGS.
00, the pitch conversion stage 203 provided on the device substrate 201 has a relatively deep concave portion,
The concave portion is a means for correcting the position and changing the pitch of the IC chip whose peripheral edge is surrounded by the inclined surface. When the IC chip to be tested sucked by the first transfer device 204 is dropped into the concave portion, the inclined portion is inclined. The drop position of the IC chip under test is corrected on the surface. Thereby, for example, the mutual positions of the four IC chips under test are accurately determined,
Even when the mounting pitch between the customer tray and the IC tray in the chamber is different, the IC chip under test whose position has been corrected and the pitch has been changed is sucked by the second transfer device 205 and reloaded onto the IC tray in the chamber. The IC chips to be tested can be reloaded with accuracy in the IC storage recess formed in the inner IC tray.

As shown in FIG. 7, the first transfer device 204 for transferring the IC chips to be tested from the customer tray to the pitch conversion stage 203 is provided on the device substrate 201.
And a rail 204a erected above the
4a, a movable arm 204b capable of reciprocating between the customer tray and the pitch conversion stage 203 (this direction is defined as a Y direction), supported by the movable arm 204b, and extending in the X direction along the movable arm 204b. And a movable head 204c that can move.

The movable head 2 of the first transfer device 204
The suction head 204d is mounted downward on the head 04c. The suction head 204d moves while sucking air to suck the IC chip under test from the customer tray, and the IC chip under test is pitch-converted. Drop it into the stage 203. Such a suction head 20
4d is mounted on the movable head 204c, for example, about four, so that four IC chips under test can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC chips to be tested from the IC chip 3 to the IC tray in the chamber 300 also has the same configuration, and as shown in FIGS. 5 and 7, a rail 205a provided on the upper portion of the device substrate 201. And this rail 205a
Arm 205b that can reciprocate between pitch conversion stage 203 and IC tray
And a movable head 2 supported by the movable arm 205b and capable of moving in the X direction along the movable arm 205b.
05c.

The movable head 2 of the second transport device 205
A suction head 205d is mounted downward on the head 05c. The suction head 205d moves while sucking air to suck the IC chip under test from the pitch conversion stage 203, and
The IC chip under test is transferred to the IC tray in the chamber via 3. For example, about four such suction heads 205d are mounted on the movable head 205c, and four IC chips to be tested can be transferred to the IC tray at a time.

The chamber 300 according to the present embodiment has an IC at a position CR1.
It has a constant temperature function of applying a desired high or low temperature stress to the IC chips to be tested loaded on the tray, and contacts the IC chips to be tested under the thermal stress to the test head 302 in a constant temperature state. Part 3
02a (see FIG. 6).

In the IC test apparatus 1 of this embodiment, when a low-temperature stress is applied to the IC chip under test, the heat is removed by a hot plate 401 described later. , Heat is removed by natural heat radiation. However, if a separate heat removal tank or heat removal zone is provided and the high temperature is applied, the IC chip under test is cooled by blowing air to return to room temperature, and if the low temperature is applied, the IC chip under test is heated or cooled. The temperature may be returned to a temperature at which dew condensation does not occur by heating with a heater or the like.

The test head 302 having the contact portion 302a shown in FIG. 6 is provided below the center of the chamber 300, and the stationary position CR5 of the IC tray 110 is provided on both sides of the test head 302. Then, the IC chip under test placed on the IC tray carried to the position CR5 is directly carried onto the test head 302 by the third carrying device 304 shown in FIG.
The test is performed by bringing the IC chip under test into electrical contact with the contact portion 302a.

After the test, the IC chip under test is returned to the IC tray 101 without being returned to the test head 1.
02 is placed on the exit tray EXT1 that moves to and from the position CR5 on both sides of the chamber 02, and is carried out of the chamber 300. When a high temperature stress is applied, the heat is naturally removed after being carried out of the chamber 300.

FIG. 8 shows the flow of the IC tray 110 in the chamber 300 three-dimensionally. FIG.
As shown in FIG. 2, inside the chamber 300, two sets of ICs
The trays 110 circulate from the position CR1 to the position CR6, respectively, and return to the position CR1.

The I transported from the position CR1 to the position CR2
The C tray 110 is conveyed in a state of being stacked vertically in a number of stages, and waits until the IC tray at the position CR5 becomes empty, and then moves from the lowest position CR3 to a position substantially at the same level as the test head 302. It is transported to CR4. Mainly during this transportation, a high or low temperature stress is applied to the IC under test.

Further, the test head 30 is moved from the position CR4.
The wafer is conveyed toward the horizontal position CR5 toward the second side, where only the IC under test is sent to the contact portion 302a of the test head 302. The IC under test has a contact portion 302
a, the IC tray 110 is moved to the position CR.
After being transported from 5 to a horizontal position CR6, it is transported vertically upward and returns to the original position CR1.

As described above, since the IC tray 110 is circulated and conveyed only inside the chamber section 300, once the temperature is raised or lowered, the temperature of the IC tray itself is maintained as it is. The thermal efficiency at 300 will be improved.

The test head 30 of the present embodiment shown in FIG.
2, two contact portions 302a are provided at a constant pitch, and the suction heads of the contact arms are also provided at the same pitch. Further, the IC tray 110 accommodates 16 IC chips under test at a predetermined pitch.

The IC chips to be tested which are connected to the test head 302 at one time are, for example, IC chips to be tested arranged in one row × 16 columns.
C chip.

That is, in the first test, 1, 3, 5,
The eight IC chips under test arranged in rows 7, 9, 11, 13, and 15 are connected to the contact portions 302 of the test head 302.
a, and in the second test, the IC tray was moved by one row pitch, and 2, 4, 6, 8, 10,
The IC chips to be tested arranged in 12, 14, and 16 rows are similarly tested. For this reason, although not shown, a moving device for moving the IC tray 101 conveyed to the position CR5 on both sides of the test head 302 by a predetermined pitch in the longitudinal direction is provided.

Incidentally, the result of this test is stored in an address determined by, for example, the identification number given to the IC tray and the number of the IC chip to be tested allocated inside the IC tray.

In the IC test apparatus 1 of this embodiment, the IC under test is applied to the contact portion 302a of the test head 302.
In order to transfer the chip and perform the test, the third chip shown in FIG.
Is provided in the vicinity of the test head 302. The third transport device 304 includes a rail 304a provided along the IC tray stationary position CR5 and the extending direction (Y direction) of the test head 302, and the test head 302 and the IC tray stationary position by the rail 304a. A movable head 304b capable of reciprocating with the CR5 and a suction head provided downward on the movable head 304b are provided. The suction head is
It is configured to be able to move in the vertical direction by a drive device (not shown) (for example, a hydraulic cylinder). By moving the suction head up and down, the IC chip under test can be sucked and the IC chip under test can be pressed against the contact portion 302a (see FIG. 7).

In the third transfer device 304 of the present embodiment,
Two movable heads 304b are provided on one rail 304a, and the distance between them is the distance between the test head 302 and the IC.
It is set equal to the interval between the tray and the stationary position CR5. These two movable heads 304b are simultaneously driven by one driving source (for example, a ball screw device).
, While each suction head 304c
Are moved vertically by independent driving devices.

As described above, each suction head 3
04c is capable of adsorbing and holding eight IC chips under test at a time, and the interval between them is set equal to the interval between the contact portions 302a. This third transfer device 30
Details of the operation 4 are omitted.

Unloader section 400 The unloader section 400 is provided with an exit tray for dispensing the tested IC chips from the chamber 300. As shown in FIG. 6 and FIG. 7, the exit tray has a position EXT1 on each side of the test head 302 and a position EXT2 on the unloader unit 400.
Is configured to be able to reciprocate in the X direction. At positions EXT1 on both sides of the test head 302, I
In order to avoid the interference with the C tray, the IC card is protruded and retracted slightly above the stationary position CR5 of the IC tray and slightly below the suction head of the third transfer device 304.

Although the specific structure of the exit tray is not particularly limited, it can be constituted by a plate having a plurality of (in this case, eight) concave portions capable of accommodating the IC chip under test, like an IC tray.

This exit tray is connected to the test head 3
02 is provided on each side of each of the two chambers 02, and while one is moving to the position EXT1 of the chamber 300,
The other performs an almost symmetric operation such as moving to the position EXT2 of the unloader section 400.

A hot plate 401 is provided near the exit tray position EXT2. The hot plate 401 is for heating the IC chip under test to a temperature at which dew condensation does not occur when a low-temperature stress is applied to the IC chip under test. Plate 401 need not be used.

The hot plate 401 of this embodiment has a capacity of 2 columns × 16 rows, 32 times, corresponding to the fact that the suction head 404c of the fourth transfer device 404 described later can hold eight IC chips under test at a time. A plurality of IC chips to be tested can be accommodated. And the fourth transport device 4
The hot plate 401 is divided into four areas corresponding to the suction heads 404c of No. 04, and eight tested IC chips sucked and held from the exit tray at the position EXT2 are sequentially placed in those areas and heated for the longest. The eight IC chips to be tested are sucked by the suction head 404c as they are and transferred to the buffer unit 402.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table are provided. The lifting table of each buffer unit 402 moves between the same level position (Z direction) as the exit tray and the hot plate 401 at the position EXT2 and a level position above it, specifically, the level position of the device substrate 201. Move in the Z direction. The specific structure of the buffer section 402 is not particularly limited. For example, like the IC tray or the exit tray, the buffer section 402 may be formed of a plate having a plurality of recesses (eight in this case) capable of accommodating the IC chip under test. it can.

The pair of elevating tables constituting the buffer section 402 perform substantially symmetrical operations such that while one of the elevating tables is stationary at the ascending position, the other is stationary at the descending position.

The unloader section 400 ranging from the exit tray at the position EXT2 to the buffer section 402 has:
A fourth transfer device 404 (see FIG. 7) is provided.
As shown in FIGS. 5 and 7, the fourth transfer device 404 includes a rail 404 laid over the device substrate 201.
a movable arm 4 that can move in the Y direction between the position EXT2 and the buffer unit 402 by the rail 404a.
04b and supported by the movable arm 404b,
A suction head 404c capable of moving up and down in the Z direction with respect to the movable arm 404b. The suction head 404c moves in the Z direction and the Y direction while sucking air, so that the I-test is performed from the exit tray at the position EXT2.
The C chip is sucked, the IC chip under test is dropped on the hot plate 401, and the hot plate 40
The IC chip under test is sucked from 1 and the IC chip under test is dropped into the buffer unit 402. The eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight IC chips under test at a time.

Incidentally, the movable arm 404b and the suction head 404c are set at positions where they can pass through the level position between the raised position and the lowered position of the buffer unit 402, whereby one buffer unit 402 is moved to the raised position. Even if there is no interference, the other buffer unit 402
The IC chip under test can be transferred to the IC chip.

Further, a fifth transfer device 406 and a sixth transfer device 407 are provided in the unloader section 400, and the test pieces transferred to the buffer section 402 by the fifth and sixth transfer apparatuses 406 and 407 are provided. The IC chips to be tested are reloaded on the customer tray.

For this reason, the apparatus board 201 is provided with a window for arranging an empty customer tray carried from the empty stocker EMP (see FIG. 6) of the IC storage section 100 so as to face the upper surface of the apparatus board 201. 403 are opened for convenience.

The fifth transfer device 406 is shown in FIGS.
As shown in the figure, a rail 406a provided over the device substrate 201, a movable arm 406b capable of moving in the Y direction between the buffer 402 and the window 403 by the rail 406a, and supported by the movable arm 406b. A movable head 406c movable in the X direction with respect to the movable arm 406b, and a suction head 4 attached downward to the movable head 406c and capable of moving up and down in the Z direction.
06d. Then, the suction head 406
When d moves in the X, Y, and Z directions while sucking air, the IC chip under test is sucked from the buffer unit 402, and the IC chip under test is transferred to the customer tray of the corresponding category. Suction head 406d of the present embodiment
Are mounted on the movable head 406c, and can transfer two IC chips under test at a time.

The fifth transfer device 406 of this embodiment
The movable arm 406b is formed to be short so as to transfer the IC chip under test only to the customer tray set in the two rightmost windows 403. It is effective to set a customer tray of a category with a high category.

On the other hand, the sixth transfer device 406
As shown in FIGS. 5 and 7, two rails 407a, 407a provided on the upper portion of the device substrate 201, and the rails 407a, 407a can be moved in the Y direction between the buffer 402 and the window 403. Movable arm 407
b, a movable head 407c supported by the movable arm 407b and movable in the X direction with respect to the movable arm 407b, and a suction head 407d attached downward to the movable head 407c and movable vertically in the Z direction. . Then, the suction head 407d moves in the X, Y, and Z directions while sucking air, thereby sucking the IC chip to be tested from the buffer unit 402 and transferring the IC chip to the customer tray of the corresponding category. I do. Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two IC chips under test at a time.

While the above-described fifth transfer device 406 transfers the IC chip under test only to the customer tray set in the two rightmost windows 403, the sixth transfer device 407 has all the windows. The IC chip under test can be transferred to the customer tray set in the unit 403. Therefore, the IC under test in the category that frequently occurs
The chips are transferred to the fifth transfer device 406 and the sixth transfer device 40
7 and the IC chips under test in the category of low occurrence frequency can be classified only by the sixth transfer device 407.

[0095] These two transporting devices 406, 407
5 and 7, these suction heads 406d and 407d do not interfere with each other.
Reference numerals 06a and 407a are provided at different heights, and are configured so that there is almost no interference even when the two suction heads 406d and 407d operate simultaneously. In the present embodiment, the fifth transport device 406 is provided at a position lower than the sixth transport device 407.

Incidentally, although not shown, a lifting table for raising and lowering the customer tray is provided below the device substrate 201 in each window 403.
A customer tray filled with the tested IC chips to be tested is loaded and lowered, and the full tray is transferred to a tray transfer arm, and the corresponding stocker UL1 to UL of the IC storage unit 100 is transferred by the tray transfer arm.
5 (see FIG. 6). Further, the empty customer tray is delivered from the empty stocker EMP by the tray transfer arm to the empty window portion 403 where the customer tray has been paid out, and is set on the window portion 403 after being replaced on the elevating table.

One buffer unit 402 of this embodiment can store 16 IC chips under test, and stores the category of the IC chip under test stored at each IC chip storage position of the buffer unit 402. A memory is provided.

The category and the position of the IC chip under test deposited in the buffer unit 402 are stored for each IC chip under test, and the category and position of the category to which the IC chip deposited under the buffer unit 402 belongs are stored. The customer tray is called from the IC storage unit 100 (UL1 to UL5), and the third and sixth transfer devices 406 and 407 described above are called up.
Then, the tested IC chip is stored in the corresponding customer tray.

In the IC chip component testing apparatus 1 of the present embodiment, the transport devices 204, 205, 30 for IC chips
At least one of 4, 404, 406, and 407 has the same configuration as the IC chip component transport device 2 shown in the first embodiment. However, these transfer devices 20
Some of 205, 304, 404, 406 and 407 have two or more absorption pads (suction heads). Therefore, in that case, a single ejector (negative pressure source) is connected to every two or more absorption pads.

Other Embodiments The present invention is not limited to the above-described embodiments, but can be variously modified within the scope of the present invention. For example, in the above-described embodiment, the pressure sensor 14
As a and 14b, analog output pressure sensors are used, and it is determined by a software program by the control means 20 whether or not the detected pressures thereof have reached predetermined low-level reference pressures and high-level reference pressures. I have. However, in the present invention, as these pressure sensors, a multi-point output pressure sensor that detects at least two points of pressure or a combination of two one-point output pressure sensors may be used. In these cases, whether or not the pressure in each of the negative pressure introduction tubes 12a and 12b has reached the predetermined low-level reference pressure and high-level reference pressure is determined not by the software program by the control means 20 but by the software program. , The pressure sensor itself.

In the above-described embodiment, the software program corresponding to the flowcharts shown in FIGS. 2 and 3 is executed by the control device 20 (computer) shown in FIG. However, in the present invention, the same control as in the above-described embodiment may be performed by a logic circuit corresponding to the flowcharts shown in FIGS.

Furthermore, the components to be handled by the component suction device, the component transport device and the component test device according to the present invention are not limited to IC chips, and may be other electronic components or components other than electronic components. good.

[0103]

As described above, according to the component suction device, the component transport device and the component test device according to the present invention, the number of negative pressure sources can be reduced, and the suction by the negative pressure does not occur. It is easy to identify the complete suction part,
The suction of the component is performed only at the suction portion where the suction by the negative pressure is sufficient, and the component is reliably transported without dropping, and the throughput of the component suction operation can be improved.

[Brief description of the drawings]

FIG. 1A is a schematic diagram of a component conveying device according to an embodiment of the present invention, and FIG. 1B is a conceptual diagram of the component suction device shown in FIG.

FIG. 2 is a flowchart illustrating an example of a control flow of the control device illustrated in FIG.

FIG. 3 is a flowchart that follows the flowchart shown in FIG. 2;

FIG. 4 is a conceptual diagram showing a change in detected pressure of a pressure sensor.

FIG. 5 is a perspective view of an IC chip component testing apparatus according to one embodiment of the present invention.

FIG. 6 is an IC tested by the test apparatus shown in FIG.
It is a schematic diagram for explaining a conveyance path of a chip.

FIG. 7 is a schematic diagram schematically showing an IC chip component transfer device for realizing the flow of IC chips in the test apparatus.

FIG. 8 is a schematic diagram showing the flow of a tray inside the chamber of the IC chip component test apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 IC chip component testing device 2 IC chip component transport device 4 Movable head 6 IC chip component suction device 8 IC chip 10 a First suction pad (suction unit) 10 b Second suction pad (suction unit) 12 a 1st negative pressure introducing tube (negative pressure introducing passage) 12b 2nd negative pressure introducing tube (negative pressure introducing passage) 14a 1st pressure sensor 14b 2nd pressure sensor 16a 1st electromagnetic valve 16b 2nd electromagnetic Valve 18: Ejector (negative pressure generating source) 20: Control device 200: Loader unit 300: Chamber 302: Test head 302a: Contact unit 400: Unloader unit

Claims (9)

[Claims] 1. At least two or more suction parts to which a negative pressure is introduced to suck a component, respectively, at least two or more negative pressure introduction passages for introducing a negative pressure to each of the suction parts, and two or more of the negative pressure introduction paths. A negative pressure generating source for introducing a negative pressure into the pressure introducing passage; and a negative pressure generating source mounted on each of the negative pressure introducing passages so that introduction of the negative pressure from the negative pressure generating source to the suction section can be shut off as necessary. And a pressure sensor that is mounted in the middle of each of the negative pressure introduction passages and detects the internal pressure of each of the negative pressure introduction passages. A controller for determining a part and outputting a drive signal for closing a valve corresponding to a suction part on which a part is not suctioned. 2. The control means according to claim 1, wherein said first comparing means determines whether or not the absolute value of the detected pressure of said specific pressure sensor is equal to or higher than a low level reference pressure. 2. The component suction device according to claim 1, further comprising: a second comparing unit configured to determine whether an absolute value is equal to or higher than a high level reference pressure. 3. 3. The control unit, in a state in which a drive signal for closing the valve is not output, wherein the second comparison unit determines that an absolute value of a detection pressure of a specific pressure sensor is equal to or higher than a high-level reference pressure. 3. The component suction device according to claim 2, further comprising: an all-suction-portion OK signal output unit that outputs a confirmation signal indicating that a component is suction-held at each suction portion when it is determined that there is a component. 4. The control unit, wherein in a state in which a drive signal for closing the valve is not output, the first comparison unit determines that an absolute value of a detection pressure of a specific pressure sensor is lower than a low level reference pressure. If it is determined to be small, a drive signal for closing the specific valve corresponding to the specific pressure sensor is output, indicating that the component is not suction-held at the specific suction unit corresponding to the specific pressure sensor. 4. The component suction device according to claim 2, further comprising a specific suction unit NG signal output unit that outputs a confirmation signal. 5. The low-level reference pressure is higher than the absolute value of the detection pressure of a specific pressure sensor when no components are sucked in all the suction units, and is applied only to the suction unit corresponding to the specific pressure sensor. The component suction device according to any one of claims 2 to 4, wherein the component suction device is set to be lower than the absolute value of the detection pressure of the specific pressure sensor when the component is suctioned. 6. The high-level reference pressure is a pressure at which, when a negative pressure having an absolute value higher than the high-level reference pressure acts on the suction unit, the component is sucked and held without dropping from the suction unit. The component suction device according to any one of claims 2 to 5, which is set. 7. The component suction device according to claim 1, wherein the pressure sensor mounted in the middle of each of the negative pressure introduction passages is mounted closer to a suction pad than each of the valves. 8. A component transport device comprising: the component suction device according to claim 1; and a moving mechanism for moving the component sucked by the component suction device. 9. A component test apparatus comprising: the component transport device according to claim 8; and a test head for testing a component transported by the component transport device.