JP7369639B2 - How to determine abnormality in electronic component transport equipment - Google Patents

Description

The present invention relates to a method for determining abnormality in an electronic component transport device.

2. Description of the Related Art Electronic component transport devices are known that transport electronic components in order to test the electrical characteristics of electronic components such as ICs (Integrated Circuits) and semiconductor devices. For example, in the electronic component transport device disclosed in Patent Document 1, the electronic component is pressed with a specified force during an electrical characteristic test.

In general, in electronic component conveying equipment, compressed air is supplied to an air cylinder to press the electronic component into the socket, and an air pressure control device that controls air pressure according to a set value is used to supply compressed air to the air cylinder. It was also known to supply compressed air to

Further, generally, electronic component conveying devices supply compressed air to an air cylinder to press electronic components into sockets. It has also been known to pressurize electronic components using an air cylinder or a compliance cylinder using an air pressure control device that controls air pressure according to a set value.

Japanese Patent Application Publication No. 2003-161758

However, in the electronic component transfer device of Patent Document 1, even if an air leak occurs in the pneumatic control device or piping connected to the cylinder, the air leak cannot be detected by the pneumatic control device alone, so the electronic components are There was a problem in that it was difficult to detect whether or not the pressure was being applied appropriately depending on the value.

A method for determining an abnormality in an electronic component transport device is a method for determining an abnormality in an electronic component transport device that includes an inspection hand having a cylinder that communicates with a pneumatic control device and a pressing portion that is driven by the cylinder and presses an electronic component. and when the pneumatic control device pressurizes the cylinder with a pressure of a first pressure value while bringing the pressing part into contact with an inspection part, and pressurizes the cylinder with a pressure of the first pressure value, the inspection is performed. The output of a motor that drives the hand is set as a first output value, and while the pressing part is in contact with the inspection part, the pneumatic pressure control device applies a pressure of a second pressure value different from the first pressure value to the cylinder. When pressurizing the cylinder with a pressure of the second pressure value, the output of the motor that drives the inspection hand is set as a second output value, and the difference between the first output value and the second output value is It is characterized in that if it is less than a predetermined value, it is determined to be abnormal.

A method for determining an abnormality in an electronic component transport device is a method for determining an abnormality in an electronic component transport device that includes an inspection hand having a cylinder that communicates with a pneumatic control device and a pressing portion that is driven by the cylinder and presses an electronic component. and when the pneumatic control device pressurizes the cylinder with a pressure of a first pressure value while bringing the pressing part into contact with an inspection part, and pressurizes the cylinder with a pressure of the first pressure value, the inspection is performed. The current input to the motor that drives the hand is set as a first current value, and while the pressing part is in contact with the inspection part, the pneumatic pressure control device controls the pressure at a second pressure value different from the first pressure value. When pressurizing the cylinder and pressurizing the cylinder with the pressure of the second pressure value, the current input to the motor that drives the inspection hand is a second current value, and the first current value and the second It is characterized in that if the difference from the current value is less than a predetermined value, it is determined to be abnormal.

FIG. 1 is a schematic perspective view of the electronic component inspection device according to the first embodiment, seen from the front side. FIG. 2 is a schematic plan view showing the operating state of the electronic component inspection device. FIG. 3 is a schematic side view showing the configuration of an apparatus for moving a second device transport head. FIG. 3 is a schematic side sectional view showing the configuration of a second device transport head. FIG. 2 is an electrical block diagram showing the configuration of a control device. 1 is a flowchart of a method for determining abnormality in an electronic component transport device. 2 is a flowchart for determining cycle abnormality of the electronic component transport device. FIG. 6 is a diagram for explaining changes in the drive current of the first cylinder and the second motor, and the position of the gripping part during normal operation. FIG. 7 is a diagram for explaining the relationship between the drive current of the second motor and the output of the second motor in normal operation. FIG. 6 is a diagram for explaining changes in the drive current of the first cylinder and the second motor, and the position of the gripping portion during an abnormality. FIG. 7 is a diagram for explaining the relationship between the drive current of the second motor and the output of the second motor when an abnormality occurs. FIG. 3 is a schematic diagram for explaining a setting screen for abnormality determination.

First Embodiment As shown in FIG. 1, three mutually orthogonal axes are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, the direction parallel to the X axis is defined as the X direction. The direction parallel to the Y axis is defined as the Y direction. The direction parallel to the Z axis is defined as the Z direction. The direction in which each arrow points is defined as "positive", and the opposite direction is defined as "negative".

"Horizontal" is not limited to completely horizontal, but also includes a state slightly tilted with respect to the horizontal, as long as transportation of electronic components is not obstructed. "Vertical" is not limited to completely vertical, but also includes a state slightly inclined with respect to the vertical, as long as the transportation of electronic components is not obstructed. The angle of inclination in the slightly inclined state is less than 5°.

The upper side in FIG. 1, that is, the positive side in the Z direction, is sometimes referred to as "upper" or "upper", and the lower side, that is, the negative side in the Z direction, is sometimes referred to as "lower" or "lower".

An electronic component inspection apparatus 1 having an electronic component transport device 2 is an apparatus that inspects and tests the electrical characteristics of electronic components such as IC (Integrated Circuit) devices, which are, for example, BGA (Ball Grid Array) packages. Inspection of electrical characteristics is called electrical special inspection. As shown in FIG. 1, an electronic component inspection device 1 includes an electronic component transport device 2 inside. The electronic component transport device 2 is a device that transports electronic components.

The electronic component transport device 2 is covered with a cover 3. The electronic component inspection apparatus 1 includes a control section 4 in the negative Y direction and the negative X direction. The control unit 4 controls the operation of the electronic component inspection apparatus 1. A speaker 5 is arranged near the control section 4. In the electronic component inspection apparatus 1, a monitor 6, an operation panel 7, and a mouse stand 8 are arranged in the negative Y direction and the positive X direction. Various information is displayed on the display screen 6a of the monitor 6. The monitor 6 has a display screen 6a configured of, for example, a liquid crystal screen, and is arranged at the upper front side of the electronic component inspection apparatus 1. A mouse stand 8 on which a mouse is placed is provided on the right side of the tray removal area 12 in FIG. The operator operates the mouse on the mouse stand 8 and the operation panel 7 to set operating conditions, etc. of the electronic component inspection apparatus 1, and input instructions. The operation panel 7 is an interface for instructing the electronic component inspection apparatus 1 to perform desired operations.

The electronic component inspection apparatus 1 includes a signal lamp 9 in the negative Y direction and the negative X direction. The signal lamp 9 and the speaker 5 notify the operating status of the electronic component inspection apparatus 1 and the like. The signal lamp 9 notifies the operating status of the electronic component inspection apparatus 1 by a combination of emitted colors. The signal lamp 9 is arranged at the upper part of the electronic component inspection apparatus 1.

The electronic component inspection apparatus 1 is provided with a tray supply area 11 and a tray removal area 12 on the negative Y direction side. The operator supplies the tray on which electronic components are arranged to the tray supply area 11. The electronic component inspection apparatus 1 takes in a tray from the tray supply area 11 and performs an electrical characteristic inspection. The electronic component inspection apparatus 1 discharges the tray on which the electronic components that have undergone the electrical characteristic inspection are arranged to the tray removal area 12.

As shown in FIG. 2, for convenience of explanation, a case where an IC device 13 as an electronic component is used will be described as a representative case. The IC device 13 has a flat plate shape. A plurality of hemispherical terminals are arranged on the lower surface of the IC device 13.

Examples of the IC device 13 include an LSI (Large Scale Integration), a CMOS (Complementary Metal Oxide Semiconductor), a CCD (Charge Coupled Device), and a module in which a plurality of modules are packaged. IC, crystal device, pressure sensor, inertial sensor, Examples include acceleration sensors, gyro sensors, and fingerprint sensors.

The electronic component transport device 2 includes a tray supply area 11 , a device supply area 14 , an inspection area 15 , a device collection area 16 , and a tray removal area 12 . Each of these areas is separated by a wall. The IC device 13 sequentially passes through each of the areas from the tray supply area 11 to the tray removal area 12 in the direction of the first arrow 17, and is inspected in an inspection area 15 along the way. The electronic component inspection apparatus 1 includes an electronic component conveyance apparatus 2 having a conveyance section 18 that conveys the IC device 13 through each area, an inspection section 19 that performs inspection within the inspection area 15, and an industrial computer. The controller 4 is equipped with a control section 4.

In the electronic component inspection apparatus 1, the side where the tray supply area 11 and the tray removal area 12 are arranged is the front side, and the side where the inspection area 15 is arranged is used as the back side.

The electronic component inspection apparatus 1 is used with a so-called "change kit" which is exchanged for each type of IC device 13 installed in advance. The change kit includes, for example, a temperature adjustment section 21, a device supply section 22, and a device collection section 23. Apart from the change kit, items that are replaced for each type of IC device 13 include, for example, the tray 24, the collection tray 25, and the inspection section 19.

The tray supply area 11 is a material supply section to which a tray 24 on which a plurality of untested IC devices 13 are arranged is supplied. In the tray supply area 11, a plurality of trays 24 are stacked and mounted. Each tray 24 has a plurality of recesses arranged in a matrix. One IC device 13 is housed in each recess.

In the device supply area 14, the plurality of IC devices 13 on the trays 24 conveyed from the tray supply area 11 are conveyed to the device supply section 22, respectively. The IC device 13 is transported from the device supply area 14 to the inspection area 15 by the device supply section 22 . A first tray transport mechanism 26 and a second tray transport mechanism 27 that transport the trays 24 one by one in the horizontal direction are provided so as to straddle the tray supply area 11 and the device supply area 14 . The first tray transport mechanism 26 is a part of the transport section 18 . The first tray transport mechanism 26 moves the tray 24 on which the IC device 13 is mounted to the positive side in the Y direction, that is, in the direction of the second arrow 28 in FIG. Thereby, the IC device 13 is sent to the device supply area 14. Further, the second tray transport mechanism 27 moves the empty tray 24 to the negative side in the Y direction, that is, in the direction of the third arrow 29 in FIG. The second tray transport mechanism 27 moves the empty tray 24 from the device supply area 14 to the tray supply area 11.

The device supply area 14 is provided with a temperature adjustment section 21 , a first device transport head 31 , a tray transport mechanism 32 , and a device supply section 22 . The temperature adjustment unit 21 is also called a soak plate (English notation: soak plate, Chinese notation: soak plate). The device supply section 22 moves so as to straddle the device supply area 14 and the inspection area 15.

A plurality of IC devices 13 are placed on the temperature adjustment section 21 . The temperature adjustment unit 21 can heat or cool the mounted IC devices 13 all at once. The temperature adjustment section 21 heats or cools the IC device 13 in advance and adjusts the temperature to a temperature suitable for electrical special inspection.

In this embodiment, for example, two temperature adjustment units 21 are arranged in the Y direction. Then, the IC devices 13 on the tray 24 carried in from the tray supply area 11 by the first tray carrying mechanism 26 are carried to one of the temperature adjustment sections 21 .

The first device transport head 31 includes a mechanism for holding the IC device 13 . The first device transport head 31 moves the IC device 13 in the X direction, Y direction, and Z direction within the device supply area 14 . The first device transport head 31 is part of the transport section 18 . The first device transport head 31 transports the IC device 13 between the tray 24 carried in from the tray supply area 11 and the temperature adjustment section 21 . The first device transport head 31 transports the IC device 13 between the temperature adjustment section 21 and the device supply section 22 . In FIG. 2, the movement of the first device transport head 31 in the X direction is indicated by a fourth arrow 33, and the movement of the first device transport head 31 in the Y direction is indicated by a fifth arrow 34.

The IC device 13 whose temperature has been adjusted by the temperature adjustment section 21 is placed in the device supply section 22 . The device supply section 22 transports the IC device 13 to the vicinity of the inspection section 19 . The device supply section 22 is referred to as a "supply shuttle plate" or a "supply shuttle." The device supply section 22 is also part of the transport section 18 . The device supply section 22 has a recess in which the IC device 13 is housed and placed.

The device supply unit 22 reciprocates between the device supply area 14 and the inspection area 15 in the X direction, that is, in the direction of the sixth arrow 35. Thereby, the device supply section 22 transports the IC device 13 from the device supply area 14 to the vicinity of the inspection section 19 in the inspection area 15 . After the IC device 13 is removed in the inspection area 15 by the second device transport head 36 serving as an inspection hand, the device supply unit 22 returns to the device supply area 14 again.

Two device supply units 22 are arranged in the Y direction. The device supply section 22 on the positive side in the Y direction is referred to as a first device supply section 22a. The device supply section 22 on the negative side in the Y direction is referred to as a second device supply section 22b. Then, the IC devices 13 on the temperature adjustment section 21 are transported by the first device transport head 31 within the device supply area 14 to the first device supply section 22a or the second device supply section 22b. The device supply section 22 can heat or cool the IC device 13 placed on the device supply section 22 . The IC device 13 whose temperature has been adjusted by the temperature adjustment section 21 is transported to the vicinity of the inspection section 19 in the inspection area 15 while maintaining the temperature adjustment state. Further, the device supply section 22 and the temperature adjustment section 21 are electrically grounded to the chassis.

The tray transport mechanism 32 is a mechanism that transports the empty tray 24 from which all the IC devices 13 have been removed within the device supply area 14 in the positive direction of the X direction, that is, in the direction of the seventh arrow 32a. After being transported in the direction of the seventh arrow 32a, the empty tray 24 is returned from the device supply area 14 to the tray supply area 11 by the second tray transport mechanism 27.

The inspection area 15 is an area where the IC device 13 is inspected. The inspection area 15 is provided with an inspection section 19 for inspecting the IC device 13 and a second device transport head 36 .

The second device transport head 36 is a part of the transport section 18 and is capable of heating or cooling the IC device 13 held therein. The second device transport head 36 transports the IC device 13 while maintaining the temperature adjustment state within the inspection area 15 .

The second device transport head 36 is supported so as to be movable back and forth in the Y direction and the Z direction within the inspection area 15, and is part of a mechanism called an "index arm." The second device transport head 36 lifts the IC device 13, transports it from the device supply section 22 onto the inspection section 19, and places it thereon.

In FIG. 2, the reciprocating movement of the second device transport head 36 in the Y direction is indicated by an eighth arrow 36c. The second device transport head 36 transports the IC device 13 from the first device supply section 22a to the test section 19 within the test region 15, and transports the IC device 13 from the second device supply section 22b to the test section 19. Responsible for Further, the second device transport head 36 is supported so as to be movable back and forth in the Y direction.

Two second device transport heads 36 are arranged in the Y direction. The second device transport head 36 on the positive side in the Y direction is referred to as a third device transport head 36a. The second device transport head 36 on the negative side in the Y direction is referred to as a fourth device transport head 36b. The third device transport head 36a is responsible for transporting the IC device 13 from the first device supply section 22a to the inspection section 19. The fourth device transport head 36b is responsible for transporting the IC device 13 from the second device supply section 22b to the inspection section 19. The third device transport head 36a is responsible for transporting the IC device 13 from the inspection section 19 to the first device collection section 23a. The fourth device transport head 36b is responsible for transporting the device from the inspection section 19 to the second device recovery section 23b.

The IC device 13 is placed on the test section 19 , and the test section 19 tests the electrical characteristics of the IC device 13 . The inspection section 19 is provided with a plurality of probe pins electrically connected to terminals of the IC device 13. Then, the terminal of the IC device 13 and the probe pin are electrically connected. The inspection unit 19 then inspects the IC device 13. The IC device 13 is tested based on a program stored in a test control section included in a tester electrically connected to the test section 19. The testing section 19 can also heat or cool the IC device 13 to adjust the temperature of the IC device 13 to a temperature suitable for testing.

The device collection area 16 is an area where a plurality of IC devices 13 that have been tested are collected. The device collection area 16 is provided with a collection tray 25, a fifth device transport head 37, and a third tray transport mechanism 38. A device recovery section 23 that moves across the inspection area 15 and device recovery area 16 is also provided. An empty tray 24 is also provided in the device collection area 16.

The IC device 13 that has been inspected is placed in the device collection section 23 . The device recovery section 23 transports the IC device 13 to the device recovery area 16. The device recovery section 23 is also referred to as a "recovery shuttle plate" or simply a "recovery shuttle." The device collection section 23 is also part of the transport section 18 .

The device recovery section 23 is supported so as to be movable back and forth between the inspection area 15 and the device recovery area 16 in the X direction, that is, in the direction of the ninth arrow 23c. Two device collection units 23 are arranged in the Y direction. The device collection section 23 on the positive side in the Y direction is the first device collection section 23a. The device collecting section 23 on the negative side in the Y direction is the second device collecting section 23b. The IC device 13 on the inspection section 19 is transported to the first device collection section 23a or the second device collection section 23b and placed thereon. The second device transport head 36 is responsible for transporting the IC device 13 from the testing section 19 to the first device collecting section 23a, and transporting the IC device 13 from the testing section 19 to the second device collecting section 23b. Further, the device collecting section 23 is electrically grounded to the chassis.

The IC device 13 inspected by the inspection section 19 is placed on the recovery tray 25 . The IC device 13 is fixed to the collection tray 25 so as not to move within the device collection area 16. Even in the device recovery area 16 where a relatively large number of various movable parts such as the fifth device transport head 37 are arranged, the inspected IC devices 13 are stably placed on the recovery tray 25. Three collection trays 25 are arranged along the X direction.

Four empty trays 24 are also arranged along the X direction. The inspected IC device 13 is placed on the empty tray 24. The IC devices 13 on the device collection section 23 are transported to either the collection tray 25 or the empty tray 24 and placed thereon. The IC devices 13 are classified according to their test results and collected.

The fifth device transport head 37 is supported within the device collection area 16 so as to be movable in the X direction and the Y direction. The fifth device transport head 37 has a portion that can also move in the Z direction. The fifth device transport head 37 is part of the transport section 18 . The fifth device transport head 37 transports the IC device 13 from the device collection section 23 to the collection tray 25 or empty tray 24 . In FIG. 2, the movement of the fifth device transport head 37 in the X direction is indicated by a tenth arrow 37a, and the movement of the fifth device transport head 37 in the Y direction is indicated by an eleventh arrow 37b.

The third tray transport mechanism 38 is a mechanism that transports the empty tray 24 carried in from the tray removal area 12 within the device collection area 16 in the X direction, that is, in the direction of the twelfth arrow 38a. After being transported, the empty tray 24 is placed at a position where the IC devices 13 are collected.

In the tray removal area 12, a tray 24 on which a plurality of inspected IC devices 13 are arranged is collected and removed. A large number of trays 24 are stacked in the tray removal area 12.

A fourth tray transport mechanism 39 and a fifth tray transport mechanism 41 are provided to transport the trays 24 one by one in the Y direction so as to straddle the device collection area 16 and the tray removal area 12. The fourth tray transport mechanism 39 is a part of the transport section 18, and reciprocates the tray 24 in the Y direction, that is, in the direction of the thirteenth arrow 39a. The fourth tray transport mechanism 39 transports the inspected IC devices 13 from the device collection area 16 to the tray removal area 12. The fifth tray transport mechanism 41 moves the empty tray 24 for collecting the IC devices 13 to the positive side in the Y direction, that is, in the direction of the fourteenth arrow 41a. The fifth tray transport mechanism 41 moves the empty tray 24 from the tray removal area 12 to the device recovery area 16.

The control section 4 includes a first tray transport mechanism 26, a second tray transport mechanism 27, a temperature adjustment section 21, a first device transport head 31, a device supply section 22, a tray transport mechanism 32, and an inspection section 19. , the operation of each part of the second device transport head 36, the device collection section 23, the fifth device transport head 37, the third tray transport mechanism 38, the fourth tray transport mechanism 39, and the fifth tray transport mechanism 41. Control. The control unit 4 includes a processor 42 and a memory 43. The processor 42 reads various information stored in the memory 43, such as a judgment program and an instruction/command program, and executes judgments and commands.

The control unit 4 may be built into the electronic component inspection device 1 or the electronic component transport device 2, or may be provided in an external device such as an external computer. For example, the external device may communicate with the electronic component testing device 1 via a cable or the like, communicate wirelessly, or be connected to the electronic component testing device 1 via a network.

In the electronic component inspection apparatus 1, the tray supply area 11 and the device supply area 14 are separated by a first partition wall 44. The device supply area 14 and the inspection area 15 are separated by a second partition wall 45 . The inspection area 15 and the device collection area 16 are separated by a third partition wall 46 . The device collection area 16 and the tray removal area 12 are separated by a fourth partition wall 47. The device supply area 14 and the device recovery area 16 are also separated by a fifth partition wall 48.

As shown in FIG. 3, the electronic component inspection apparatus 1 includes a base 49. As shown in FIG. A first rail 51 that is long in the direction of the sixth arrow 35 is arranged on the base 49 . The first device supply section 22a is arranged on the first rail 51. Force is transmitted from the fourth motor 52 to the first device supply section 22a via the first pulley 53 and the first belt 54. The first device supply section 22a moves along the first rail 51 due to the torque of the fourth motor 52. A first pocket 22c in which the IC device 13 is placed is arranged on the positive side surface in the Z direction of the first device supply section 22a.

A second rail 56 is arranged on the base 49 in parallel to the first rail 51. A second device supply section 22b is arranged on the second rail 56. Force is transmitted from the fifth motor 57 to the second device supply section 22b via the second pulley 58 and the second belt 59. The torque of the fifth motor 57 moves the second device supply section 22b. A second pocket 22d in which the IC device 13 is placed is arranged on the positive side surface in the Z direction of the second device supply section 22b.

A gate-shaped support structure 62 is arranged on the base 49 so as to straddle the device supply section 22 . Support structure 62 supports second device transport head 36 . A third rail 63 is arranged on the support structure 62. The third rail 63 is long in the Y direction. A head moving section 64 is arranged on the third rail 63. The head moving section 64 moves along the third rail 63. Force is transmitted to the head moving unit 64 from a first motor 65 via a first ball screw 66 . The head moving section 64 is moved by the torque of the first motor 65.

The head moving section 64 is provided with a first elevating section 67 and a second elevating section 68 . The first elevating portion 67 includes a second motor 67a as a motor, a second ball screw 67b, a first elevating portion 67c, and a first rotating portion 67d. A second motor 67a is arranged on the head moving section 64. A second ball screw 67b is connected to the rotating shaft of the second motor 67a. The second ball screw 67b is long in the Z direction. The second ball screw 67b is slidably engaged with a female screw formed in the first elevating portion 67c. A first rotating section 67d is connected to the first lifting/lowering section 67c. A third device transport head 36a serving as an inspection hand is connected to the first rotating section 67d. The torque of the second motor 67a is transmitted to the second ball screw 67b, and the first elevating portion 67c moves up and down. The third device transport head 36a moves up and down together with the first up/down movement section 67c. As the second motor 67a rotates the second ball screw 67b, the third device transport head 36a moves up and down. The first rotating section 67d includes a motor inside. The first rotating section 67d rotates the third device transport head 36a around the Z direction.

The second elevating portion 68 includes a third motor 68a, a third ball screw 68b, a second elevating portion 68c, and a second rotating portion 68d. A third motor 68a is arranged on the head moving section 64. A third ball screw 68b is connected to the rotating shaft of the third motor 68a. The third ball screw 68b is long in the Z direction. The third ball screw 68b is slidably engaged with a female screw formed in the second elevating portion 68c. A second rotating section 68d is connected to the second lifting/lowering section 68c. A fourth device transport head 36b is connected to the second rotating section 68d. The torque of the third motor 68a is transmitted to the third ball screw 68b, and the second elevating portion 68c moves up and down. The fourth device transport head 36b moves up and down together with the second up/down movement section 68c. As the third motor 68a rotates the third ball screw 68b, the fourth device transport head 36b moves up and down. The second rotating section 68d includes a motor inside. The second rotating section 68d rotates the fourth device transport head 36b around the Z direction.

When the third device transport head 36a faces the inspection section 19, the fourth device transport head 36b faces the device supply section 22. When the third device transport head 36a faces the device supply section 22, the fourth device transport head 36b faces the inspection section 19. A stopper 55 is arranged on the inspection section 19. When the third device transport head 36a and the fourth device transport head 36b descend toward the inspection section 19, the third device transport head 36a and the fourth device transport head 36b come into contact with the stopper 55 and stop.

As shown in FIG. 4, the second device transfer head 36 has at least one hand unit 69. The hand unit 69 grips the IC device 13 on the device supply section 22 and transports it to the inspection section 19 . After testing the IC device 13, the hand unit 69 grips the IC device 13 on the inspection section 19 and transports it to the device collection section 23. Note that the number of hand units 69 arranged in one second device transport head 36 is not particularly limited.

The hand unit 69 includes a grip section 71 as a pressing section, a support section 72, a cylinder 73, and a detection section 74. The grip part 71 is a part that grips the IC device 13. The grip part 71 has a movable part 75, a heating part 76, and a suction part 77.

The movable part 75 has a cylindrical shape. The movable part 75 has an upper flange part 78 with an enlarged outer diameter on the upper side, and a lower flange part 79 with an enlarged outer diameter on the lower side. A rib 81 is formed on the outer periphery of the upper flange portion 78 and protrudes in a ring shape along the circumferential direction. The movable section 75 is driven by the cylinder 73 and presses the IC device 13 against the inspection section 19 .

A heating section 76 that heats the IC device 13 is fixed below the lower flange section 79 of the movable section 75 . The heating section 76 has a cylindrical shape. A heater 82 is built inside the heating section 76 . Heat is generated by the operation of the heater 82. This heat is conducted to the IC device 13 via the adsorption portion 77 . The heater 82 heats the IC device 13 to adjust the temperature to a temperature suitable for testing. In place of the heater 82, the grip portion 71 may include a cooling portion that cools the IC device 13.

A suction section 77 that suctions and holds the IC device 13 is fixed below the heating section 76 . The suction section 77 has a suction section main body 83 and a suction pad 84 . The suction part main body 83 is formed with a first recess 83a that opens on the lower surface of the suction part main body 83, and a second recess 83b that opens into the first recess 83a and is deeper than the first recess 83a. A suction pad 84 is fixed to the second recess 83b. A suction pad 84 is connected to one end of a flow path 85 formed inside the suction section main body 83 . The other end of the flow path 85 is connected to a pipe 86. The pipe 86 is connected to a pressure reducing pump via a first solenoid valve (not shown). The first solenoid valve switches the pressure in the pipe 86 between negative pressure and atmospheric pressure. When the pressure in the pipe 86 is negative, a suction force is generated in the suction pad 84, and the suction pad 84 suctions and holds the IC device 13. When the pressure in the pipe 86 is atmospheric pressure, the IC device 13 is released from the suction pad 84.

The support portion 72 supports the grip portion 71 so as to be movable between a first position and a second position below the first position. The support portion 72 includes a base portion 72a, a hollow support portion main body 72b located below the base portion 72a, and a connecting portion 72c located above the base portion 72a. The base portion 72a is connected to the first rotating portion 67d or the second rotating portion 68d via the connecting portion 72c. A through hole 88 communicating with the hollow portion 87 is formed in the support body 72b. The hollow portion 87 between the upper flange portion 78 and the lower flange portion 79 of the movable portion 75 is inserted into the through hole 88 . The support portion 72 has a flow path 89 formed to penetrate the base portion 72a and the support portion main body 72b all at once. One end of the flow path 89 communicates with the hollow portion 87 above the support body 72b, and the other end of the flow path 89 is connected to a compressed air generator via piping.

The hand unit 69 has a cylinder 73 that moves the grip 71 in the Z direction. The cylinder 73 moves the grip part 71 to the first position or the second position at a desired timing.

The cylinder 73 includes a pneumatic section 91 that moves the grip section 71 to the negative side in the Z direction by supplying compressed air, and an upper flange section 78 . The urging portion 92 serving as a spring urges the upper flange portion 78 of the cylinder 73 toward the positive side in the Z direction.

The pneumatic section 91 includes a diaphragm 93. The diaphragm 93 divides the hollow portion 87 into an upper hollow portion 87a and a lower hollow portion 87b. The upper hollow part 87a is connected to the flow path 89. The lower hollow portion 87b is connected to the through hole 88. The center of the diaphragm 93 is fixed to the upper flange portion 78. The outer peripheral side portion of the diaphragm 93 is fixed to the support body 72b.

By supplying compressed air from the flow path 89 to the upper hollow part 87a, the pressure in the upper hollow part 87a increases. As a result, the grip portion 71 moves toward the negative side in the Z direction against the urging force of the urging portion 92 .

The biasing portion 92 is composed of a coil spring disposed in the lower hollow portion 87b of the support portion main body 72b. The coil spring is in a compressed state between the inner lower surface 90 of the support body 72b and the rib 81 of the movable part 75. The grip portion 71 is urged toward the positive side in the Z direction by the urging portion 92 . When the pressure in the upper hollow portion 87a is atmospheric pressure, the grip portion 71 is positioned on the positive side in the Z direction by the urging force of the urging portion 92.

The cylinder 73 stably moves the grip part 71 with a simple configuration in which the air supply to the upper hollow part 87a is switched between compressed air and atmospheric pressure air.

The detection section 74 detects the inclination of the grip section 71 with respect to the horizontal direction, that is, the XY plane. The detection section 74 includes an optical sensor 94 fixed to the support section 72 and a shielding plate 95 fixed to the grip section 71. A plurality of optical sensors 94 and shielding plates 95 are arranged in pairs. In this embodiment, for example, the optical sensor 94 and the shielding plate 95 include one set on the positive side in the X direction, one set on the negative side in the X direction, one set on the positive side in the Y direction, and one set on the positive side in the Y direction with respect to the grip part 71. One set is arranged on the negative side. The inclination of the grip portion 71 is detected based on the shielding state of the optical sensor 94 by each set of shielding plates 95.

As shown in FIG. 5, the electronic component inspection apparatus 1 includes a control section 4. The control unit 4 includes a processor 42 and a memory 43. The processor 42 includes an operation control section 96. The operation control section 96 controls various motors and cylinders. The operation control unit 96 includes a CPU (Central Processing Unit) and the like. The memory 43 includes a storage section 97 . The storage unit 97 stores various parameters and programs.

The operation control section 96 is electrically connected to a first motor control section 98, a second motor control section 99, a third motor control section 101, a fourth motor control section 102, a fifth motor control section 103, and a pneumatic circuit inspection section 104. be done. In addition, the operation control unit 96 is electrically connected to a first pneumatic control device 105, a first electromagnetic valve 106, a second pneumatic pressure control device 107, and a second electromagnetic valve 108 as pneumatic pressure control devices.

The first motor control section 98 controls the first motor 65 to control the position of the head moving section 64 in the Y direction.

The second motor control section 99 is electrically connected to the second motor 67a via a second ammeter 109. The second motor control section 99 controls the second motor 67a to control the position of the third device transport head 36a in the Z direction. A second encoder 67e is installed on the rotation shaft of the second motor 67a. The second encoder 67e outputs the rotation angle of the rotating shaft to the second motor control section 99. The second motor control section 99 includes a servo amplifier. The second motor control section 99 controls the second motor 67a so that the third device transport head 36a is positioned at the target location. The second ammeter 109 is electrically connected to the pneumatic circuit testing section 104 . The second ammeter 109 detects the value of the current flowing through the second motor 67a and outputs it to the pneumatic circuit inspection section 104.

The third motor control section 101 is electrically connected to the third motor 68a via a third ammeter 111. The third motor control unit 101 controls the third motor 68a to control the position of the fourth device transport head 36b in the Z direction. A third encoder 68e is installed on the rotating shaft of the third motor 68a. The third encoder 68e outputs the rotation angle of the rotating shaft to the third motor control section 101. The third motor control section 101 includes a servo amplifier. The third motor control unit 101 controls the third motor 68a so that the fourth device transport head 36b is located at the target location. The third ammeter 111 is electrically connected to the pneumatic circuit testing section 104. The third ammeter 111 detects the value of the current flowing through the third motor 68a and outputs it to the pneumatic circuit inspection section 104.

The fourth motor control section 102 controls the fourth motor 52 to control the position of the first device supply section 22a in the X direction. The fifth motor control section 103 controls the fifth motor 57 to control the position of the second device supply section 22b in the X direction.

The electronic component inspection apparatus 1 includes a compressed air generator 112. The compressed air generator 112 compresses air and supplies compressed air. The compressed air generation device 112 is connected to the first air pressure control device 105 and the second air pressure control device 107 via the pressure air conditioning device 113 and piping. The compressed air generator 112 supplies compressed air to the first air pressure control device 105 and the second air pressure control device 107. The compressed air conditioner 113 adjusts the pressure, humidity, and oil content of the air. In addition, the electronic component inspection apparatus 1 includes a decompression pump 114. The decompression pump 114 supplies decompressed air at a pressure lower than atmospheric pressure to the first solenoid valve 106 and the second solenoid valve 108 .

The first air pressure control device 105 communicates with a first cylinder 73a as a cylinder. The first air pressure control device 105 controls the air pressure supplied to the first cylinder 73a. The first cylinder 73a is the cylinder 73 in the third device transfer head 36a. The second air pressure control device 107 controls the air pressure supplied to the second cylinder 73b. The second cylinder 73b is the cylinder 73 in the fourth device transfer head 36b. The first pneumatic control device 105 and the second pneumatic pressure control device 107 are electrically connected to the pneumatic circuit testing section 104 . The first pneumatic pressure control device 105 and the second pneumatic pressure control device 107 output information on the pressure supplied to the cylinder 73 to the pneumatic circuit inspection section 104. The first pneumatic pressure control device 105 and the second pneumatic pressure control device 107 are also referred to as electropneumatic regulators.

The first solenoid valve 106 switches the air pressure supplied to the first suction pad 84a to atmospheric pressure or reduced air pressure. The first suction pad 84a is the suction pad 84 in the third device transport head 36a. The second electromagnetic valve 108 switches the air pressure supplied to the second suction pad 84b to atmospheric pressure or reduced air pressure. The second suction pad 84b is the suction pad 84 in the fourth device transport head 36b.

The pneumatic circuit inspection unit 104 detects an abnormality in the pneumatic circuit from the pneumatic pressure supplied to the first cylinder 73a and the current value flowing to the second motor 67a. The pneumatic circuit inspection unit 104 detects an abnormality in the pneumatic circuit from the pneumatic pressure supplied to the second cylinder 73b and the current value flowing to the third motor 68a.

Next, a method for determining abnormality in the electronic component transport device 2 will be explained. Since the pneumatic circuit inspection unit 104 determines whether the third device transport head 36a and the fourth device transport head 36b are abnormal using the same method, the third device transport head 36a will be described, and the description of the fourth device transport head 36b will be omitted. do.

In FIG. 6, step S1 is a process of moving the gripping part 71 to the inspection part 19. Next, the process moves to step S2. Step S2 is a step of setting a first pressure value, which is the lowest pressurizing force, in the cylinder. In this step, after the second motor 67a brings the grip part 71 into contact with the stopper 55 of the inspection part 19, the cylinder is pressurized. The first cylinder 73a pressurizes the grip portion 71 while the third device transport head 36a does not hold the IC device 13. While the grip part 71 is in contact with the inspection part 19, the first air pressure control device 105 pressurizes the first cylinder 73a with a first pressure value. The first cylinder 73a is urged by the urging section 92. The first pressure value is a balanced pressure value that balances the pressure applied by the urging section 92. Next, the process moves to step S3.

Step S3 is a step of measuring the output of the second motor 67a and recording it as a first output value. In this step, when pressurizing the first cylinder 73a with a first pressure value, the output of the second motor 67a that is driven to maintain the position of the third device transport head 36a is set as the first output value. Here, the output of the motor is a value obtained by multiplying torque, rotational speed, and a predetermined coefficient, and is measured by a force sensor. In addition to the above, since the output of the motor correlates with the product of the current and voltage input to the motor, the current input to the motor may be measured instead of the output of the motor. In the following, the current input to the motor will be measured and used to determine abnormality. The current input to the second motor 67a that outputs the first output value is defined as the first current value. The pneumatic circuit inspection section 104 stores the first current value in the storage section 97. Next, the process moves to step S4.

Step S4 is a process of setting a second pressure value, which is a test pressurizing force, in the cylinder. In this step, the first air pressure control device 105 pressurizes the first cylinder 73a with a second pressure value different from the first pressure value while bringing the gripping part 71 into contact with the inspection part 19. The second pressure value is a test pressure value that is the pressure applied to the IC device 13 when testing the electrical characteristics of the IC device 13. Next, the process moves to step S5.

Step S5 is a step of measuring the output of the second motor 67a, setting it as a second output value, and comparing the first output value and the second output value. In this step, when pressurizing the first cylinder 73a with the second pressure value, the output of the second motor 67a that is driven to maintain the position of the third device transport head 36a is set as the second output value. The current input to the second motor 67a that outputs the second output value is defined as a second current value. The pneumatic circuit inspection section 104 stores the second current value in the storage section 97. The pneumatic circuit inspection unit 104 compares the first output value and the second output value. When the pneumatic circuit inspection unit 104 compares the first output value and the second output value, it compares the first current value and the second current value. Next, the process moves to step S6.

Step S6 is a step of determining the difference between the first output value and the second output value. If the difference between the first output value and the second output value is less than a predetermined value, it is determined that there is an abnormality. That is, if the difference between the first current value and the second current value is less than the predetermined value, it is determined that there is an abnormality and the process moves to step S11. On the other hand, if the difference between the first output value and the second output value is greater than or equal to the predetermined value, it is determined that the process is normal. That is, if the difference between the first current value and the second current value is greater than or equal to the predetermined value, it is determined that the process is normal and the process moves to step S7.

Step S7 is a process of moving to electrical special inspection. This step is a step in which the second device transport head 36 moves the IC device 13 from the first device supply section 22a and the second device supply section 22b to the inspection section 19 and performs an electrical characteristic inspection. When continuing the electric characteristic inspection, the process moves to step S8. When the electric characteristic inspection is finished, the process moves to step S9.

Step S8 is a step for determining period abnormality. In this step, the first output value and the second output value are compared at a predetermined timing. This is the step of determining abnormality. Next, the process moves to step S7.

Step S9 is a process for terminating the electric characteristic inspection. This process is a process of stopping the electronic component inspection apparatus 1.

Step S10 is a step of stopping the electronic component transport device. An operator operates the operation panel 7 to stop the electronic component transport device 2.

Step S11 is a step of displaying an error. This step is a step for displaying on the monitor 6 that an abnormality has occurred in the pneumatic circuit. Next, the process moves to step S10. Through the above steps, the step of determining whether there is an abnormality in the electronic component transport device 2 is completed.

Next, the cycle abnormality determination process in step S8 will be explained. In FIG. 7, step S21 is a step of determining whether it is abnormality determination timing. In this step, a determination is made at a predetermined timing as to whether or not the first cylinder 73a is abnormal. The predetermined timing is set based on, for example, the number of pieces to be inspected for electric characteristics, the time for performing electric characteristics inspection, and the like. If it is not the abnormality judgment timing, then the process moves to step S7. When it is the abnormality determination timing, the process moves to step S22.

Step S22 is a process of moving the grip part 71 to the inspection part 19. This process is the same as step S1. Next, the process moves to step S23.

Step S23 is a step of setting a second pressure value, which is a test pressurizing force, in the cylinder. This process is the same as step S4. Next, the process moves to step S24.

Step S24 is a step of measuring the output of the second motor 67a, setting it as a second output value, and comparing the first output value and the second output value. This process is the same as step S5. The value stored in step S3 is used as the first output value. That is, the first output value, which is the balanced pressure value, is acquired in step S3, and the balanced pressure value is stored. After comparing once the test pressure value which is the second output value and the balance pressure value which is the first output value in step S5, the test pressure value is acquired and the test pressure value and the stored balance pressure value are compared. compare. Next, the process moves to step S25.

Step S25 is a step of determining the difference between the first output value and the second output value. This process is the same as step S6. If the difference between the first current value and the second current value is less than the predetermined value, it is determined that there is an abnormality and the process moves to step S11. If the difference between the first output value and the second output value is greater than or equal to a predetermined value, it is determined to be normal. That is, if the difference between the first current value and the second current value is greater than or equal to the predetermined value, it is determined that the process is normal and the process moves to step S7. Through the above steps, the process of determining periodic abnormality of the electronic component transport device 2 is completed.

Next, changes in the drive currents of the first cylinder 73a, the second motor 67a, and the position of the grip portion 71 will be described using FIG. 8. The upper diagram in FIG. 8 shows the change in pressure in the first cylinder 73a. The middle diagram in FIG. 8 shows the transition of the drive current of the second motor 67a. The center of the vertical axis is 0 (A). The upper side shows the current flowing in the direction of raising the grip part 71. The lower side shows the current flowing in the direction of lowering the grip part 71. A larger current flows as the distance from the center increases. The lower diagram in FIG. 8 shows the transition of the position of the grip portion 71. In each figure, the horizontal axis indicates time, and time changes from left to right.

In step S1, the second motor control section 99 drives the second motor 67a to bring the grip section 71 closer to the inspection section 19. When the grip part 71 is away from the inspection part 19, it moves quickly, and when it approaches, it moves at a low speed. The second motor control section 99 monitors the current value flowing through the second motor 67a, and detects that the grip section 71 has contacted the inspection section 19 when the absolute value of the current value increases.

In step S2, the first air pressure control device 105 applies a first pressure value 115 to the first cylinder 73a. The force generated by the applied pressure is set to be balanced with the force of the urging section 92. In step S3, the second ammeter 109 detects the first current value 116, which is the current flowing through the second motor 67a. The first current value 116 is close to zero. The first current value 116 is stored in the storage section 97 by the pneumatic circuit inspection section 104 .

In step S4, the first air pressure control device 105 applies a second pressure value 117 to the first cylinder 73a. The second pressure value 117 is the pressure applied during the electrical special inspection in step S7. The first cylinder 73a presses the grip portion 71 downward.

In step S5, the second motor control section 99 operates the servo circuit to apply current to the second motor 67a so that the grip section 71 does not move. The force with which the first cylinder 73a presses the grip portion 71 and the force with which the second motor 67a pulls up the grip portion 71 are balanced. The second ammeter 109 detects a second current value 118, which is the current flowing through the second motor 67a, and outputs it to the pneumatic circuit inspection section 104. The pneumatic circuit inspection unit 104 compares the absolute value of the difference between the first current value 116 and the second current value 118 with a determination value 119 as a predetermined value. When there is no abnormality in the pneumatic circuit, the absolute value of the difference between the first current value 116 and the second current value 118 is larger than the determination value 119 in step S6, so that it is determined to be normal. Note that the determination value 119 is set in advance using data for normal cases and data for abnormal cases. The determination value 119 is set with consideration to data variations.

As shown in FIG. 9, the second motor drive current and the second motor output are approximately directly proportional. Therefore, comparing the absolute value of the difference between the first output value and the second output value of the second motor 67a with the output determination value means that the absolute value of the difference between the first current value 116 and the second current value 118 is It can be substituted by comparing with the judgment value 119. The determination value 119 is set corresponding to the output determination value of the second motor 67a. When the absolute value of the difference between the first current value 116 and the second current value 118 is greater than the judgment value 119, the absolute value of the difference between the first output value and the second output value of the second motor 67a is greater than the output judgment value. It can be determined that it is large.

Next, a description will be given of a case where there is an abnormality in the pneumatic circuit, such as when air is leaking between the first pneumatic control device 105 and the first cylinder 73a. As shown in FIG. 10, in step S4, the force with which the first cylinder 73a presses the grip part 71 becomes smaller due to air leakage, so the cylinder pressure 117a of the first cylinder 73a becomes lower than the second pressure value 117. Put it away. Therefore, in step S5, the second current value 118 becomes smaller than when there is no abnormality in the pneumatic circuit, and the position of the grip portion 71 is maintained at the small second current value 118. In step S6, since the absolute value of the difference between the first current value 116 and the second current value 118 is smaller than the determination value 119, it is determined that there is an abnormality.

As shown in FIG. 11, when the absolute value of the difference between the first current value 116 and the second current value 118 is smaller than the judgment value 119, the difference between the first output value and the second output value of the second motor 67a It can be determined that the absolute value is smaller than the output determination value. In this way, instead of determining the output value of the motor using the determination value, the current value can be determined using the determination value.

As shown in FIG. 12, a screen for setting abnormality determination is displayed on the monitor 6. The operator operates this screen to set the abnormality determination method. At the location where abnormality determination is selected between "OFF" and "ON", it is selected whether or not to perform abnormality determination. When determining an abnormality, select "ON". When no abnormality determination is to be made, select "OFF".

Several options are available for the abnormality determination mode. When "Initial Start" is selected and the electronic component transport apparatus 2 is started with the start mode set to "initialization start", abnormality determination is performed before transporting devices from the supply tray. When selecting “Initial Retest Start” and starting the electronic component transport device 2 with the start mode set to “Retest Initialization Start”, abnormality judgment is performed before transporting devices from the supply tray. .

When selecting "Socket Alarm", abnormality judgment is performed at the timing when "continuous failure alarm" or "defective rate alarm" occurs. The "consecutive failure alarm" indicates that a warning is issued when the results of the electrical inspection of the IC devices 13 are consecutively failed for a predetermined number of IC devices. The "defective rate alarm" indicates that a warning is issued when the ratio of the number of IC devices 13 that are defective to the number of IC devices 13 subjected to electrical special inspection reaches a predetermined number of defective devices.

When "Interval" is selected, abnormality determination is performed when the number of electric characteristic tests set in the abnormality determination cycle 121 is performed after initialization is started. Below the "Interval" label, there is provided a column for inputting the abnormality judgment cycle 121. Incidentally, the abnormality determination may be made when the time for conducting the electric characteristic test exceeds a predetermined time.

According to this method, by using the output of the second motor 67a for maintaining the position of the third device transport head 36a, it is possible to detect whether the IC device 13 is appropriately pressurized. Specifically, when the first cylinder 73a is operating normally, the first pressure value and the second pressure value are different, so the first output value of the second motor 67a is the reaction force that balances the pressure value. It is different from the second output value. On the other hand, when air leakage occurs in the first cylinder 73a etc., appropriate pressure is not applied, so when the first air pressure control device 105 applies the pressure of the second pressure value 117 to the first cylinder 73a The cylinder pressure of is less than the second pressure value 117. As a result, the difference between the first output value and the second output value becomes less than the predetermined value, and it can be determined that there is an abnormality. Therefore, it is possible to provide the electronic component transport device 2 that can detect the pressurized state of the IC device 13 during electrical characteristic testing.

According to this method, the output of the second motor 67a is detected based on the value of the current flowing through the coil of the second motor 67a. Since there is a strong correlation between the torque output by the second motor 67a and the value of the current flowing through the coil of the second motor 67a, the output of the second motor 67a can be compared using the value of the current flowing through the coil of the second motor 67a. By determining whether the difference between the first current value and the second current value is less than a predetermined value, it is determined whether the difference between the first output value and the second output value is less than the predetermined value. can. A force sensor is required to directly detect the output of the second motor 67a. Providing a force sensor also requires a drive circuit for the force sensor, which reduces the productivity of manufacturing the electronic component transport device 2. Since the value of the current flowing through the coil of the second motor 67a can be detected by the second ammeter 109, it is possible to suppress a decrease in the productivity of manufacturing the electronic component transport device 2.

According to this method, the first cylinder 73a is driven with the same pressure as the pressure applied to the IC device 13 when testing the electrical characteristics of the IC device 13. That is, the first cylinder 73a is tested under the same testing conditions as when testing the electrical characteristics of the IC device 13. Therefore, highly reliable inspection can be performed.

According to this method, the first pressure value is a value that balances the pressure applied by the urging section 92. At this time, even when the grip part 71 moves, the moving speed of the grip part 71 can be suppressed to a low level. Therefore, it is possible to suppress the impact received by the gripping part 71 and the inspection part 19 pushed by the gripping part 71, so that it is possible to prevent the gripping part 71 and the inspection part 19 from being damaged.

According to this method, the third device transport head 36a does not hold the IC device 13 when inspecting the first cylinder 73a. Therefore, since the IC device 13 does not come into contact with the inspection section 19, damage to the electrodes of the IC device 13 can be prevented.

According to this method, the first cylinder 73a pressurizes the grip 71 while the grip 71 is in contact with the stopper 55. Since the grip 71 does not move when the first cylinder 73a pressurizes the grip 71, it is possible to prevent the stopper 55 and the grip 71 from colliding and being damaged.

According to this method, the first cylinder 73a is inspected at a predetermined timing. The predetermined timing is set based on, for example, the number of pieces to be inspected for electric characteristics, the time for performing electric characteristics inspection, and the like. At this time, the states of the first air pressure control device 105, the first cylinder 73a, and the piping can be monitored at predetermined timing. Therefore, it is possible to reduce the number of IC devices 13 for which the electric characteristic test is not performed normally.

According to this method, a value that balances the pressure applied by the urging section 92 is detected, and a first pressure value that is the balanced pressure value is stored. The test pressure value and the balance pressure value are compared once to determine whether or not there is an abnormality. Next, when inspecting the first cylinder 73a, a second pressure value, which is an inspection pressure value, is obtained. Next, the test pressure value and the stored equilibrium pressure value are compared. At this time, since a new balanced pressure value is not acquired, the measurement time can be shortened.

Second Embodiment In the first embodiment, the first cylinder 73a pressurized the grip portion 71 while the third device transport head 36a did not hold the IC device 13. The present invention is not limited to this, and the first cylinder 73a may pressurize the grip portion 71 while the third device transport head 36a holds the IC device 13.

According to this method, the third device transport head 36a holds the IC device 13 when inspecting the first cylinder 73a. Therefore, after the first cylinder 73a is inspected, the electric characteristics inspection of the IC device 13 can be performed. Therefore, it is possible to inspect the first cylinder 73a and the electrical characteristics of the IC device 13 with high productivity.

Third Embodiment In the first embodiment, the first pressure value was a balanced pressure value that balanced the pressure applied by the urging section 92. The second pressure value was the pressure applied to the IC device 13 when testing the electrical characteristics of the IC device 13. The first pressure value is not limited to this, and the first pressure value may be the pressure applied to the IC device 13 when testing the electrical characteristics of the IC device 13. The second pressure value may be a balanced pressure value that balances the pressure applied by the urging section 92. Further, the order of step S2 and step S4 may be alternated. Also in this case, the same effects as in the first embodiment can be obtained.

Fourth Embodiment When it is determined that there is an abnormality in step S6, the first output value and the second output value may be newly acquired and the first output value and the second output value may be compared. Furthermore, when it is determined that there is an abnormality, the first current value and the second output value may be newly acquired and the first current value and the second current value may be compared. That is, steps S2 to S6 may be performed again. Since the probability of making erroneous measurements twice in a row is low, it can be reliably determined that an abnormality has occurred in the first air pressure control device 105, the first cylinder 73a, and the piping.

Fifth Embodiment If determined to be normal in step S6, the first air pressure control device 105 may pressurize the first cylinder 73a with a third pressure value closer to the first pressure value than the second pressure value. . When pressurizing the first cylinder 73a with a third pressure value, the output of the second motor 67a that is driven to maintain the position of the third device transfer head 36a is set as a third output value. The first output value and the third output value are compared, and if the difference between the first output value and the third output value is less than a predetermined value, it may be determined that there is an abnormality.

The difference between the first pressure value and the third pressure value is smaller than the difference between the first pressure value and the second pressure value. Therefore, the difference between the first output value and the third output value is smaller than the difference between the first output value and the second output value. At this time as well, since it is determined whether the difference between the first output value and the third output value is less than a predetermined value, a slight abnormality is detected. Therefore, it is possible to reliably determine whether or not there is an abnormality.

DESCRIPTION OF SYMBOLS 1...Electronic component inspection device, 2...Electronic component transfer device, 13...IC device as an electronic component, 19...Inspection section, 36...Second device transfer head as an inspection hand, 36a...Third device transfer as an inspection hand Head, 55...stopper, 67a...second motor as a motor, 71...grip part as a pressing part, 73a...first cylinder as a cylinder, 92...biasing part as a spring, 105...first as a pneumatic control device 1 pneumatic pressure control device, 115...first pressure value, 116...first current value, 117...second pressure value, 118...second current value, 119...judgment value as a predetermined value.

Claims (11)

A method for determining an abnormality in an electronic component transport device, comprising an inspection hand having a cylinder communicating with a pneumatic control device, and a pressing part driven by the cylinder to press an electronic component, the method comprising:
The pneumatic control device pressurizes the cylinder with a first pressure value while bringing the pressing part into contact with the inspection part,
When pressurizing the cylinder with a pressure of the first pressure value, an output of a motor that drives the inspection hand is set as a first output value,
While the pressing part is in contact with the inspection part, the pneumatic pressure control device pressurizes the cylinder with a second pressure value different from the first pressure value,
When pressurizing the cylinder with the pressure of the second pressure value, the output of the motor that drives the inspection hand is set as a second output value,
A method for determining an abnormality in an electronic component conveying device, characterized in that if a difference between the first output value and the second output value is less than a predetermined value, it is determined to be abnormal. A method for determining an abnormality in an electronic component transport device, comprising an inspection hand having a cylinder communicating with a pneumatic control device, and a pressing part driven by the cylinder to press an electronic component, the method comprising:
The pneumatic control device pressurizes the cylinder with a first pressure value while bringing the pressing part into contact with the inspection part,
When pressurizing the cylinder with a pressure of the first pressure value, a current input to a motor that drives the inspection hand is a first current value,
While the pressing part is in contact with the inspection part, the pneumatic pressure control device pressurizes the cylinder with a second pressure value different from the first pressure value,
When pressurizing the cylinder with the pressure of the second pressure value, a current input to the motor that drives the inspection hand is set as a second current value,
A method for determining an abnormality in an electronic component transport device, characterized in that if a difference between the first current value and the second current value is less than a predetermined value, it is determined to be abnormal. A method for determining abnormality in an electronic component transport device according to claim 1 or 2, comprising:
One of the first pressure value and the second pressure value is a test pressure value that is a pressure applied to the electronic component when testing the electrical characteristics of the electronic component. A method for determining abnormalities in electronic component transport equipment. A method for determining abnormality in an electronic component transport device according to claim 3, comprising:
the cylinder is biased by a spring;
The other pressure value of the first pressure value and the second pressure value is a balance pressure value that is a value that balances the pressure urged by the spring. Judgment method. A method for determining abnormality in an electronic component transport device according to any one of claims 1 to 4, comprising:
A method for determining an abnormality in an electronic component transport device, characterized in that the cylinder presses the pressing portion in a state where the inspection hand does not hold the electronic component. A method for determining abnormality in an electronic component transport device according to any one of claims 1 to 4, comprising:
A method for determining an abnormality in an electronic component transport device, characterized in that the cylinder presses the pressing portion while the inspection hand holds the electronic component. A method for determining abnormality in an electronic component transport device according to any one of claims 1 to 6, comprising:
A method for determining an abnormality in an electronic component transport device, characterized in that the cylinder is pressurized after the motor brings the pressing part into contact with a stopper of the inspection part. A method for determining abnormality in an electronic component transport device according to claim 4, comprising:
obtaining the balanced pressure value and storing the balanced pressure value;
After comparing the test pressure value and the balance pressure value,
A method for determining an abnormality in an electronic component transport device, characterized in that the test pressure value is obtained and the test pressure value is compared with the stored balanced pressure value. A method for determining abnormality in an electronic component transport device according to claim 1 , comprising:
If it is determined to be normal, the pneumatic pressure control device pressurizes the cylinder with a third pressure value closer to the first pressure value than the second pressure value,
When pressurizing the cylinder with the third pressure value, the output of the motor that drives the inspection hand is set as a third output value,
A method for determining an abnormality in an electronic component transport device, characterized in that if a difference between the first output value and the third output value is less than a predetermined value, it is determined to be abnormal. A method for determining abnormality in an electronic component transport device according to claim 1, comprising:
When it is determined that there is an abnormality, the first output value and the second output value are newly acquired, and if the difference between the newly acquired first output value and the second output value is less than a predetermined value, , a method for determining an abnormality in an electronic component transfer device, characterized in that it is determined to be abnormal. A method for determining abnormality in an electronic component transport device according to claim 2, comprising:
When it is determined that there is an abnormality, the first current value and the second current value are newly acquired, and if the difference between the newly acquired first current value and the second current value is less than a predetermined value, , a method for determining an abnormality in an electronic component transfer device, characterized in that it is determined to be abnormal.

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