KR100568513B1 - Prober - Google Patents

Abstract

The semiconductor inspection apparatus includes a test head provided with pogo pins at a lower end thereof to apply a predetermined test signal, driving means for raising and lowering the test heads, and a pogo fixing part provided at the bottom of the test head and provided at the bottom thereof. A probe card provided with a probe needle at the bottom, a wafer chuck installed at a bottom of the probe card, and having a test wafer seated on an upper surface thereof, and a test head provided at the test head so that the pogo pins are in contact with the pogo fixing part. It includes a vacuum adsorber for maintaining the vacuum between the cards and a vacuum sensing means for detecting a leakage state between the test head and the probe card. In addition, the controller includes a main controller to stop the operation of the alignment stage drive system for movably supporting the driving means or the wafer chuck when an abnormal state occurs based on the signal of the vacuum sensing means.

Description

Semiconductor Inspection Device {PROBER}

1 is a view schematically showing the configuration of a conventional semiconductor inspection apparatus;

2A is a view illustrating a state in which a test head of a semiconductor inspection apparatus is raised according to an embodiment of the present disclosure;

2B is a view showing a state in which the test head of the semiconductor inspection apparatus is lowered according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: semiconductor inspection device 110: prober

130: test head 140: vacuum adsorber

150: tester 160: drive means

170: vacuum detection means 171: vacuum detection sensor

173: controller 175: indicator

177: alarm generator 190: main controller

210: stage driving system

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection apparatus, and more particularly, to a semiconductor inspection apparatus in which a test head and a probe card are contacted by a vacuum to detect a leak in the vacuum working space so that an abnormal state occurrence signal and an interlock function are performed. It is about.

In general, in the manufacture of semiconductor devices, a fabrication process of forming a pattern PATTERN on a wafer WAFER and an assembly process of assembling the wafer on which the pattern is formed into each unit chip may be performed.

Then, an electric die sorting process (hereinafter referred to as "EDS") is performed to inspect the electrical characteristics of each unit chip constituting the wafer between the above processes. The EDS process is performed to determine defective chips among the unit chips constituting the wafer.

In this case, the EDS process mainly uses an inspection apparatus that applies an electrical signal to the chips constituting the wafer and determines a defect by a signal checked from the applied electrical signal.

Such inspection mainly uses an inspection apparatus including a probe card having a probe needle for contacting the wafer and applying an electrical signal to inspect the electrical state of the chips constituting the wafer. The semiconductor device whose result of the test using the probe card is judged to be good is manufactured as a finished product by a post-process of packaging.

In the electrical property inspection of the semiconductor wafer, the probe needle of the probe card is usually brought into contact with the electrode pad of the semiconductor wafer, and the electrical property at that time is measured by energizing a measurement current through the probe needle.

1 is a view schematically showing the configuration of a conventional semiconductor inspection apparatus. As shown in the drawing, the semiconductor inspection apparatus 1 is largely composed of a prober 10, a test head 30, and a tester 50. do.

The prober 10 is provided on the upper side of the alignment stage 11 composed of the X-axis, Y-axis, and Z-axis moving mechanisms and the θ rotating mechanism, and a substrate to be inspected on the upper surface thereof (hereinafter referred to as a “wafer” 12) ”and a probe card 17 supported by a mounting ring 15 on the substrate fixing chuck 13 above.

In the wafer 12, a plurality of chips 12a are arranged in predetermined rows and columns, and electrode pads (not shown) that are electrically connected to each chip 12a are arranged.

The probe card 17 includes a plurality of pogo fixing parts 17a arranged corresponding to the wafer chip 12a, and each of the pogo fixing parts 17a has a plurality of probes corresponding to the electrode pads 12b. Needle 17b is provided.

The test head 30 transmits a test signal to the probe card 17, transmits a response signal of the probe card 17, and is installed to move up and down by the driving means 70.

The tester 50 commands a test signal to the test head 30, receives a response signal from the test head 30, and reads whether or not the chip 12a is defective.

The test head 30 is provided with a pogo block 31 having a plurality of pogo pins 31a disposed on the bottom thereof in contact with the pogo fixing portion 17a to provide a voltage or a signal to the probe card 17. The pogo pins 31a are disposed in a one-to-one correspondence with the pogo fixing portions 17a. In addition, the pogo block 31 is composed of a vacuum pump 41 and a vacuum adsorber 40 composed of a vacuum line 41 connected to the vacuum pump 41, so that the pogo pin 31a has the pogo pin ( A vacuum atmosphere is achieved between 17a). At this time, the pogo block 31 is provided with a ring-shaped sealing member 45 is installed while maintaining a predetermined interval to maintain the airtight.

In the conventional semiconductor inspection apparatus 1 configured as described above, first, when a driving signal is output by a control means (not shown), the driving means 70 is operated to lower the test head 30. The test head 30 descends to a predetermined position state and stops at a position where the pogo pin 31a and the pogo fixing portion 17a maintain a predetermined distance (for example, 3 mm) to form a standby state.

Next, when the vacuum pump 41 provided on the test head 15 is operated to apply a vacuum, the probe card 13 is sucked up by vacuum suction, and the pogo pin 31a is connected to the pogo fixing part 17a. The state of contact is achieved.

However, when a defective hole is generated in the probe card 17, the test head 15 and the probe card 17 are not correctly contacted, or the function of the sealing member 45 is insufficient, the test head 15 and the probe card 17. Between (13) there is a problem that the pogo pin (31a) and the pogo fixing portion (17a) contact failure occurs because the vacuum atmosphere is not properly formed. In such a case, damage to the pogo fixing portion 17a occurs, and the installation height of the probe card 17 is changed to cause a poor contact with the electrode pad 12a of the wafer 12, so that correct inspection cannot be performed.

Accordingly, the present invention has been made to solve the above-described problems, an object of the present invention is to provide a semiconductor inspection apparatus to detect the degree of vacuum acting between the test head and the probe card to inform the operator of the leak condition. have.

Another object of the present invention is to provide a semiconductor inspection apparatus capable of interlocking function to detect the degree of vacuum acting between the test head and the probe card to stop the test process when an abnormal condition occurs.

According to a first aspect of the present invention for achieving the above object, a test head provided with a pogo pin at its lower end to apply a predetermined test signal, drive means for moving the test head up and down, and the test head A probe card installed at a bottom thereof and provided with a pogo pinion on an upper surface thereof and a probe needle provided at a bottom thereof, a wafer chuck installed at a bottom of the probe card and mounted on an upper surface of the probe card, and provided at the test head to the pogo pin And a vacuum adsorber for maintaining a vacuum state between the bottom of the test head and the probe card so as to be in contact with the pogo fixing unit, and vacuum sensing means for detecting a leakage state between the test head and the probe card. A semiconductor inspection apparatus is provided.

The vacuum detecting means includes a vacuum sensor for measuring a degree of vacuum between the test head and the probe card, a controller for determining a leakage state based on a detection signal of the vacuum sensor, and an indicator indicating a measurement result of the vacuum sensor. It is preferable to include.

When the determination result of the controller is found to be an abnormal state, it is preferable to further include an alarm generator for informing the abnormal state.

Preferably, the indicator uses a character indicator indicating a sensing state of the vacuum sensor as a numerical value, and the alarm generator preferably uses any one of a character indicator indicating a light, a buzzer, or an abnormal state.

According to a second aspect of the present invention, a test head provided with a pogo pin at a lower end thereof to apply a predetermined test signal, driving means for raising and lowering the test head, and installed at a bottom of the test head, A probe card having a pogo fixing portion and a probe needle provided on a bottom surface thereof, a wafer chuck installed on a bottom of the probe card and seated with an inspected wafer on an upper surface thereof, and a stage for supporting the wafer chuck horizontally, vertically or rotatably; And a stage driving system for driving the stage, a vacuum absorber and the test head provided in the test head to maintain a vacuum state between the bottom surface of the test head and the probe card for contacting the pogo pin with the pogo pin. Vacuum detection means for detecting a leakage state between the probe card, the new vacuum detection means Values semiconductor inspection area, characterized in that it comprises a group of main control to stop the operation of the drive means or the stage drive system is provided when an abnormal state occurs on the basis of.

The vacuum detecting means includes a vacuum sensor for measuring the degree of vacuum between the test head and the probe card, a controller for determining a vacuum leakage state based on a detection signal of the vacuum sensor, and a measurement result of the vacuum sensor. It is preferred to include an indicator.

When the determination result of the controller is found to be an abnormal state further includes an alarm generator for informing the abnormal state, wherein the indicator is a character display indicating the detection state of the vacuum sensor as a numerical value, the alarm generator is an indicator It is preferable to use any one of a letter display indicating a buzzer or an abnormal state in letters.

Next, the structure and operation of the semiconductor inspection apparatus according to an exemplary embodiment of the present invention will be described in more detail with reference to FIGS. 2A and 2B.

As shown in the drawing, the semiconductor inspection apparatus 100 includes a prober 110, a test head 130, a tester 150, a vacuum sensing unit 170, and a main controller 190.

The prober 110 is provided on the upper side of the alignment stage 111 composed of the X-axis, Y-axis, and Z-axis moving mechanisms and the θ rotating mechanism, and a substrate to be inspected on the upper surface thereof (hereinafter referred to as a “wafer” 112) &quot;, and a probe card 117 supported by the mounting ring 115 on the substrate fixing chuck 113.

In the wafer 112, a plurality of chips 112a are arranged in predetermined rows and columns, and electrode pads (not shown) that are electrically connected to each chip 112a are disposed.

The probe card 117 includes a plurality of pogo fixing portions 117a arranged to correspond to the wafer chip 112a, and each of the pogo fixing portions 117a includes a plurality of pogo fixing portions 117a corresponding to the electrode pads 112b. Probe needle 117b is provided.

The test head 130 transmits a test signal to the probe card 117 and transmits a response signal of the probe card 17. A pogo block 131 is provided at a lower end thereof, and the pogo block 131 is provided. Pogo pins (131a) in contact with the pogo fixing portion (117a) is provided. The pogo block 131 is composed of a vacuum pump 140 and a vacuum adsorber 140 composed of a vacuum line 141 connected to the vacuum pump 141 so that the pogo pin 131a is the pogo fixing part 117a. Make a vacuum at between. In this case, the pogo block 131 is provided with a ring-shaped sealing member 145 is maintained at a predetermined interval to enable airtightness. The test head 130 is installed to be moved up and down by the driving means 160. Here, the driving means 160 and the test head 130 is connected by the connector 161, the proximity sensor 163 is installed in the connector 161, the test head 130 is lowered to the pogo pin ( 131a and the declarative fixing unit 117a are configured to detect the contact state. In this case, the proximity sensor 163 detects the proximity of the prober body 114 made of a metal body.

The tester 150 commands a test signal to the test head 130, and receives a response signal from the test head 130 to read whether the chip 112a is defective.

The vacuum detecting unit 170 determines a leakage state based on a vacuum sensor 171 for measuring the degree of vacuum between the test head 130 and the probe card 117, and a detection signal of the vacuum sensor 171. The controller 173 and an indicator 175 indicating a measurement result of the vacuum sensor 171. Here, the indicator 175 is based on the numerical value indicating the vacuum pressure detected from the vacuum sensor 171.

When the determination result of the controller 171 is found to be an abnormal state, it is preferable to further configure an alarm generator 177 informing the abnormal state to take a quick action to the operator, the alarm generator 177 is displayed Etc., a buzzer or a character display that displays an error message in characters may be employed.

On the other hand, in addition to such a configuration, it is possible to stop the operation of the prober 110 or the test head 130 when the vacuum leak occurs to prevent any further process error occurs.

Referring to the configuration, first, if it is determined whether the degree of vacuum is normal through the controller 173 of the vacuum sensing means 170, the determination result is applied to the entire facility associated with the prober 110 and the test head 130. The signal is transmitted to the main controller 190 containing the related command so that when the abnormal state occurs, the main controller 190 generates a stop signal to the prober 110 or the test head 130 to prevent further processing. That is, the main controller 190 transmits a stop signal to the stage driving system 210 to stop the operation of the alignment stage 111, and transmits a signal to the driving means 160 to perform the lowering operation of the test head 130. Stop it.

As described above, the present invention makes it possible to measure the degree of vacuum acting between the test head and the probe card so that the abnormal state of the vacuum can be easily identified, thereby improving the electrical contact between the test head and the probe card, as well as the probe needle and the wafer. There is an advantage of improving contact with the pad.

In addition, by continuously checking the vacuum degree between the test head and the probe card to perform the interlock function when an abnormal condition occurs, there is an advantage of eliminating the problem of the process error occurs.

As described above, in the detailed description of the present invention, specific embodiments have been described. However, various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

Claims (10)

A test head provided with a pogo pin at a lower end thereof to apply a predetermined test signal; Driving means for raising and lowering the test head; A probe card installed at a bottom of the test head and having a pogo fixing portion at an upper surface thereof and a probe needle at a lower surface thereof; A wafer chuck installed at the bottom of the probe card, the wafer being inspected seated on an upper surface thereof; A vacuum absorber provided in the test head to maintain the vacuum state between the bottom surface of the test head and the probe card for contacting the pogo pin with the pogo pin; And And a vacuum detecting means for detecting a leakage state between the test head and the probe card. The vacuum sensor according to claim 1, wherein the vacuum detecting means comprises: a vacuum sensor for measuring the degree of vacuum between the test head and the probe card, a controller for determining a leakage state based on a detection signal of the vacuum sensor, and the vacuum sensor And a display device for indicating a measurement result of the semiconductor inspection device. 3. The semiconductor inspection apparatus according to claim 2, further comprising an alarm generator for notifying an abnormal state when the determination result of the controller is found to be an abnormal state. 3. The semiconductor inspection apparatus according to claim 2, wherein the indicator is a character display indicating a detected state of the vacuum sensor in numerical value. 4. The semiconductor inspection apparatus according to claim 3, wherein the alarm generator is any one of a text indicator indicating a light, a buzzer or an abnormal state in text. A test head provided with a pogo pin at the bottom thereof to apply a predetermined test signal; Driving means for driving the test head up and down; A probe card installed at a bottom of the test head and having a pogo fixing portion at an upper surface thereof and a probe needle at a lower surface thereof; A wafer chuck installed at the bottom of the probe card, the wafer being inspected seated on an upper surface thereof; A stage for supporting the wafer chuck so as to be horizontal, vertical or rotatable; A stage driving system for driving the stage; A vacuum absorber provided in the test head to maintain the vacuum state between the bottom surface of the test head and the probe card for contacting the pogo pin with the pogo pin; And Vacuum detecting means for detecting a leakage state between the test head and the probe card; And a main controller which stops the operation of the driving means or the stage driving system when an abnormal state occurs based on the signal of the vacuum sensing means. The method of claim 6, wherein the vacuum detecting means comprises a vacuum sensor for measuring the degree of vacuum between the test head and the probe card, a controller for determining a vacuum leakage state based on the detection signal of the vacuum sensor, and the vacuum detection And an indicator for indicating a measurement result of the sensor. 7. The semiconductor inspection apparatus according to claim 6, further comprising an alarm generator for notifying the abnormal state when the determination result of the controller is found to be an abnormal state. 7. The semiconductor inspection apparatus according to claim 6, wherein the indicator is a character display indicating a detected state of the vacuum sensor in numerical value. 10. The semiconductor inspection apparatus according to claim 8, wherein the alarm generator is any one of a text indicator indicating a light, a buzzer, or an abnormal state in text.

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