JP2000162268A - Method of applying temperature of electronic component and electronic component tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly supply temperature applying fluids to a plurality of respective electronic components, to prevent a deviated temperature and to shorten temperature raising and lowering times, by supplying in parallel the fluids to the components from supply ports of the fluids. SOLUTION: When a temperature is applied, warm air or cold air is supplied from a temperature applying unit 13. When the warm or cold air is fed along a ceiling surface of a test chamber 102, its part is blown directly to an IC to be tested through a first vent hole 112 formed at a Z-axis driver 110 and a second vent hole 122 formed at a matching plate 120. The other warm or cold air is detoured along a right sidewall to the chamber 102 and is returned to a suction port 135 of a temperature applying] unit 103 through a gap between the plate 102 and a test tray TST. That is, a handler can blow cold air blown out from a supply port 134 of the unit 130 perpendicularly as well as parallel to a plurality of ICs to be tested mounted in a planner state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component test apparatus for testing various electronic components (hereinafter, also simply referred to as ICs) such as semiconductor integrated circuit devices, and more particularly, to improving the temperature rise / fall performance of electronic components. The present invention relates to an electronic component temperature application method and an electronic component test apparatus.

[0002]

2. Description of the Related Art In an electronic component test apparatus called a handler, a large number of ICs stored in a tray are conveyed into a test apparatus, and each IC is tested under high or low temperature thermal stress. Press against the terminal (contact) of the socket connected to the head, and test the test equipment (tester, te
ster) to perform the test. When the test is completed, each IC is unloaded from the test process and is reloaded on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

Conventional handlers include a tray (hereinafter, also referred to as a customer tray) for accommodating an IC before a test or an IC that has been tested, and a tray (hereinafter, a test tray) circulated through the handler. In this type of handler, the IC is replaced between the customer tray and the test tray before and after the test, and the IC is connected to the terminal of the socket. In the test process of contacting and testing, IC
Is pressed against the test head while mounted on the test tray.

In such a handler, application of thermal stress to the IC is performed by transporting the above-described test tray into a thermostat (hereinafter also referred to as a chamber). However, in a test specification in which a high-temperature thermal stress is applied, a heater is applied. Is heated into the chamber, and a low-temperature gas such as liquid nitrogen is sent into the chamber in a test specification for applying a low-temperature thermal stress.

FIG. 6 is a cross-sectional view showing the inside of a chamber 102 of a conventional electronic component testing apparatus. A test tray TST on which a plurality of ICs are mounted is transported immediately above a test head 5, and a Z provided above the test head 5 is mounted. By lowering the pressing portion 111 of the shaft driving device 110, each IC is pressed against the terminal 51 of the socket. A match plate 120 is mounted between the Z-axis driving device 110 and the test tray TST to cope with a change in the pressing portion 111 accompanying a change in the type of the test tray TST.
The IC is a match plate 120 according to the sequence of the IC.
Z-axis driving device 11 via a pusher 121 provided in
0 is pressed.

[0006]

By the way, in an electronic component testing apparatus of the type shown in FIG.
The Z-axis driving device 110 for pressing the IC mounted on the ST against the terminal 51 of the socket is suitable for being disposed above the test head 5, so that hot air or cold air is supplied into the chamber 102. The unit 130 containing the heater 131, the liquid nitrogen nozzle 132, and the blower fan 133 is generally provided in an extra space such as a corner of the chamber 102.

[0007] For example, as shown in this figure, the unit 130 is arranged at the upper corner of the chamber 102 and hot air or cold air is circulated by the blower fan 133 to thereby allow the IC mounted on the test tray TST to reach a predetermined position. Raise or lower the temperature.

However, in the conventional electronic component testing apparatus, the flow of warm air or cool air in the chamber 102 is unidirectional as shown by the white arrow in FIG. Although it is easy to reach the predetermined temperature, there is a problem that the temperature of the IC located on the left side is difficult to raise or lower.

In particular, when a large number of ICs of about 64 are mounted on one test tray in order to increase the throughput of the handler, the heat capacity increases by that much, making it difficult to raise or lower the temperature. Temperature drift occurs in the interior.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and a method for applying a temperature to an electronic component capable of uniformly applying a temperature to a large number of electronic components in a short time. And an electronic component test apparatus.

[0011]

(1) In order to achieve the above object, according to a first aspect of the present invention, a plurality of electronic components mounted on a tray for applying a temperature in a chamber. In a method of applying a temperature of an electronic component for supplying a fluid,
A temperature application method for an electronic component is provided, wherein the temperature application fluid is supplied in parallel to the plurality of electronic components from a supply port of the temperature application fluid.

According to the present invention, the fluid for temperature application is supplied to the plurality of electronic components in parallel, so that the fluid for temperature application is evenly supplied to each electronic component. Can be prevented and the temperature rise / fall time can be shortened.

(2) To achieve the above object,
According to a second aspect of the present invention, in a method for applying a temperature to an electronic component, which supplies a fluid for applying a temperature to a plurality of electronic components mounted substantially flush with a tray in a chamber,
A temperature application method for an electronic component is provided, wherein the temperature application fluid is supplied from the supply port of the temperature application fluid to the plurality of electronic components almost directly.

According to the present invention, the fluid for temperature application is supplied to the plurality of electronic components mounted substantially flush with each other, so that the fluid for temperature application is uniformly supplied to each electronic component. As a result, the occurrence of uneven temperature can be prevented, and the temperature rise / fall time can be shortened.

(3-1) In order to achieve the above object, according to a third aspect of the present invention, there is provided a chamber having a supply port for a temperature application fluid for applying a temperature to an electronic component; A tray on which the electronic component is mounted and conveyed into the chamber; pressing means for pressing the electronic component mounted on the tray against a contact of a test head; and an interposition between the electronic component and the pressing means. And an interposed plate for transmitting the pressing force from the pressing unit to each of the electronic components, wherein the supply of the temperature application fluid is performed to each of the driving unit and the interposed plate. An electronic component test apparatus is provided, wherein a through-hole through which a temperature application fluid supplied from a mouth can pass is formed.

In the present invention, since the through holes through which the temperature application fluid can pass are formed in each of the driving means and the interposition plate, the temperature application fluid blown out from the supply port passes through each through hole. It will be sprayed on each electronic component. Therefore, the fluid for temperature application is evenly supplied to each electronic component, so that it is possible to prevent the occurrence of uneven temperature and shorten the time for temperature rise and fall.

(3-2) Although not particularly limited in the present invention, the first through holes formed in the driving means are provided with a plurality of first pressing portions for applying a pressing force to each of the electronic components. It is more preferable that they are formed evenly between them.

By uniformly forming the first through-hole in the driving means, the fluid for temperature application blown out from the supply port can be
It is more uniformly supplied to the electronic component, whereby the effect of suppressing the uneven temperature and the effect of shortening the time for raising and lowering the temperature become more remarkable.

(3-3) Although not particularly limited in the present invention, the second through holes formed in the interposition plate are provided with a plurality of second through holes for pressing each of the electronic components.
Are preferably formed evenly between the pressing portions.

By forming the second through-holes evenly in the interposed plate, the fluid for temperature application blown out from the supply port is more uniformly supplied to the electronic parts, thereby suppressing the temperature deviation and raising and lowering the temperature. The effect of shortening the heating time becomes more remarkable.

(3-4) Further, although not particularly limited in the present invention, the first through-hole and the second through-hole are formed at positions substantially overlapping in plan view. Is more preferred.

By forming the first through-hole and the second through-hole at positions substantially overlapping in plan view, the fluid for temperature application blown out from the supply port can be more evenly and evenly distributed to the electronic component. , Whereby the effect of suppressing the uneven temperature and the effect of shortening the time for raising and lowering the temperature become more remarkable.

(4) As an electronic component test apparatus to which the temperature applying method of the present invention is applied and an electronic component test apparatus of the present invention, any apparatus having a chamber (a constant temperature bath) can be applied. All the electronic component testing devices are included, such as a device that performs a test, a device that performs a low-temperature test, a device that performs both of them, and a device that performs a room-temperature test.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view (a part of which is cut away for convenience) showing an embodiment of an electronic component test apparatus of the present invention, and FIG. 2 is an electronic component (hereinafter also simply referred to as IC or IC under test) in the test apparatus. FIG. 3 is an exploded perspective view showing a test tray used in the electronic component test apparatus shown in FIG. FIG. 2 shows an IC under test in the electronic component test apparatus of the present embodiment.
FIG. 5 is a diagram for understanding how to handle the components, and in actuality, there is a part in which members arranged in a vertical direction are shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

The electronic component testing apparatus of this embodiment includes a handler 1 for handling an IC under test, a test head 5 to which the IC under test is electrically contacted, and a test head 5
And a tester (not shown) that sends a test signal to the IC under test to determine whether the IC operates properly under high or low temperature stress applied to the IC under test. This is a device that performs a test (inspection) and classifies ICs according to the test results. The operation test under such a temperature stress is performed by a tray (customer tray KS) on which a large number of ICs to be tested are mounted.
T), the IC under test is mounted on a test tray TST (see FIG. 3) which is transported in the electronic component test apparatus 1.

For this reason, as shown in FIGS. 1 and 2, the electronic component test apparatus 1 according to the present embodiment stores ICs to be tested from now on, and classifies and stores tested ICs. A storage unit 200, a loader unit 300 for sending an IC under test sent from the IC storage unit 200 to the chamber unit 100, and a chamber unit 1 on which the test head 5 is mounted.
00 and an unloader unit 400 for classifying and extracting the tested ICs tested in the chamber unit 100.

The IC storage unit 200 stores the pre-test IC stocker 201 for storing the IC under test before the test, and the tested IC stocker 202 for storing the IC under test classified according to the test result.
Are provided.

The pre-test IC stocker 201 and the tested IC stocker 202, as shown in FIG. 1, have a frame-shaped tray support frame 203, which penetrates from the lower portion of the tray support frame 203 and moves upward and downward. Elevator 2 made possible
04 is provided. Tray support frame 203
, A plurality of customer trays KST are stacked and supported, and only the stacked customer trays KST are moved up and down by the elevator 204.

The pre-test IC stocker 201 includes:
While the customer trays KST in which the ICs to be tested are stored are stacked and held, the customer tray KST in which the ICs to be tested are appropriately classified is stored in the tested IC stocker 202. Laminated and held.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the pre-test IC stocker 201 and the tested IC stocker 2 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 1 and 2, two stockers STK-B are provided in the pre-test stocker 201, and an empty stocker STK-B sent to the unloader unit 400 is provided next to the two stockers STK-B.
E and two stockers STK-1, STK-2,..., STK-
8 are provided so as to be sorted and stored in a maximum of eight categories according to the test results. In other words, apart from good and bad products, among the good products, those with high operating speeds,
They are classified into medium-speed ones, low-speed ones, and failures that require retesting.

Loader section 300 The above-described customer tray KST is a tray transfer arm 2 provided between the IC storage section 200 and the apparatus substrate 105.
05 to the window 306 of the loader unit 300.
It is carried from the bottom of 05. Then, the loader unit 300
In, the IC under test loaded on the customer tray KST is once transferred to a preciser (position corrector) 305 by the XY transfer device 304, where the mutual positions of the ICs to be tested are corrected, and The IC under test transferred to the precisor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transfer device 304 again.

From the customer tray KST to the test tray T
As shown in FIG. 1, as an IC transfer device 304 for transferring the IC under test to the ST, two rails 301 provided on the upper part of the device substrate 105 and the two rails 301
A movable arm 302 capable of reciprocating between the test tray TST and the customer tray KST (this direction is defined as a Y direction), supported by the movable arm 302, and capable of moving in the X direction along the movable arm 302. And a movable head 303.

The movable head 3 of the XY transport device 304
03, a suction head is mounted downward, and the suction head moves while sucking air, thereby sucking the IC under test from the customer tray KST, and
Transfer C to the test tray TST. For example, about eight such suction heads are mounted on the movable head 303, and eight ICs to be tested are stored in the test tray T at a time.
Can be transshipped to ST.

The test tray TST that chamber section 100 described above is fed into the chamber portion 100 after the IC has been loaded in the loader unit 300, the IC under test is tested while mounted on the test tray TST .

The chamber section 100 includes a test tray TST
A soak chamber 101 for preliminarily applying a desired high or low temperature thermal stress to the IC under test loaded in
In the soak chamber 101, a target thermal stress is further applied to the IC under test in a state where preliminary thermal stress is applied, and the IC under test is brought into contact with a test head. And an unsoak chamber 103 for removing a given thermal stress from the IC under test.

In the unsoak chamber 103, when a high temperature is applied in the soak chamber 101, the IC under test is cooled by blowing air to return to room temperature.
When a low temperature of, for example, about −30 ° C. is applied in step 1, the IC under test is heated with hot air or a heater to return the temperature to a temperature at which dew condensation does not occur. Then, the heat-removed test I
C is carried out to the unloader section 400.

As shown in FIG. 1, the soak chamber 101 and the unsoak chamber 103 of the chamber section 100 are
It is arranged to protrude above the test chamber 102. As shown conceptually in FIG. 2, the soak chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 becomes empty. While waiting. During this standby, high-temperature or low-temperature thermal stress is preliminarily applied to the IC under test.

On the other hand, in the test chamber 102, a test head 5 is arranged at the center thereof, a test tray TST is carried on the test head 5, and the terminals of the IC under test are electrically connected to the contact pins of the test head 5. The test is performed by contacting After the test, the test tray TST is heat-removed in the unsoak chamber 103, and the temperature of the IC is returned to room temperature.
It is discharged at 00.

FIG. 4 is a sectional view taken along the line IV-IV of FIG. 2 and shows the inside of the test chamber 102. The test tray TS conveyed immediately above the test head 5 is shown in FIG.
T is the position immediately above the test chamber 10
2. Match plate 120 provided in a state supported by
(Corresponding to the interposition plate of the present invention) through each contact 51 of the test head 5. The match plate 120 is a component that is appropriately replaced in accordance with the type of the IC under test in order to provide versatility to the Z-axis driving unit 110 described later. Although not shown in detail, the match plate 120 is mounted on the test tray TST. The shape and arrangement of the pusher 121 are determined according to the state, the type of the IC under test, and the like.

The reason why the pressing force is applied to the IC under test is as follows.
Z-axis driving device 110 provided above test head 5
(Corresponding to the driving means of the present invention), and the driving part thereof is partially omitted, but as the Z-axis driving device 110 moves up and down, the pressing part 111 moves up and down, whereby the IC under test is It is pressed against the contact 51.

In particular, in this embodiment, as shown in FIG. 5, a plurality of through-holes 122 (hereinafter referred to as second through-holes) are formed between the pushers 121 of the match plate 120, and further correspond to the upper portion thereof. A plurality of through holes 112 (hereinafter, referred to as first through holes) are also formed at positions of the Z-axis driving device 110. These first and second through holes 112,
The shape, quantity, or set position of 122 is not particularly limited. In this embodiment, as shown in FIG. 5, one second through hole 1 is surrounded by four pushers 121.
22 are formed such that the second through-holes 122 are located substantially evenly in the match plate 120 as a whole.

As shown in FIG. 4, a temperature applying unit 130 is provided at a corner of the upper surface of the test chamber 102 (or may extend over the soak chamber 101). , A heater 131 for applying a high temperature, a blowing nozzle 132 for liquid nitrogen for applying a low temperature, and a scroll fan 133 for supplying these hot or cold air into the chamber 102.
Are provided. In addition, the supply port 134 and the suction port 135 are formed in the unit 130 so that hot air or cold air flows down as indicated by the white arrow in FIG.

In the vicinity of the chamber 100, FIG.
As shown in (1), a device substrate 105 is inserted, and a test tray transport device 108 is provided on the device substrate 105. The test tray TST discharged from the unsoak chamber 103 by the test tray transport device 108 provided on the device substrate 105 is transferred to the unloader 400
Then, it is returned to the soak chamber 101 via the loader unit 300.

FIG. 3 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. The test tray TST includes a plurality of bars 1 on a rectangular frame 12.
3 are provided in parallel and at equal intervals, and a plurality of mounting pieces 14 are formed on both sides of these bars 13 and on sides 12a of the frame 12 facing the bars 13 so as to protrude at equal intervals. An insert storage portion 15 is formed between the bars 13, between the bars 13 and the side 12 a, and the two mounting pieces 14.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is mounted on the two mounting pieces 14 in a floating state using a fastener 17. For this purpose, mounting holes 21 for mounting the mounting pieces 14 are formed at both ends of the insert 16. Such an insert 16 may be, for example, one test tray TST
4x16 pieces (64 pieces) are attached.

The inserts 16 have the same shape and the same dimensions, and the IC under test is stored in each insert 16. IC housing 19 of insert 16
Is determined according to the shape of the IC under test to be accommodated.
In the example shown in FIG.

Here, the IC under test connected to the test head 5 at a time is, for example, four ICs in every four columns if the IC under test is arranged in 4 rows × 16 columns as shown in FIG. The ICs under test in the columns (16) are simultaneously tested. That is, in the first test, 16 test ICs arranged every four rows from the first row are connected to the contact pins of the test head 5, and the test is performed. In the second test, the test tray TST is set to 1 After moving by the number of columns, the 16 ICs to be tested arranged in every fourth column from the second column are similarly tested, and this test is repeated four times to test all the ICs to be tested (1).
6 simultaneous measurements). The result of this test is
For example, it is stored at an address determined by the identification number given to T and the number of the IC under test allocated inside the test tray TST.

[0049] Also in the unloader section 400 unloader section 400, X-Y transport device having the same structure as X-Y conveyor 304 provided in the loader section 300 40
4, 404 are provided, and the XY transfer devices 404, 4 are provided.
04, the tested ICs are transferred from the test tray TST carried out to the unloader section 400 to the customer tray KS.
Transferred to T.

As shown in FIG. 1, the unloader section 40
The pair of windows 406, 406 in which the customer tray KST carried to the unloader unit 400 faces the upper surface of the device substrate 105, is opened on the device substrate 105 of the No. 0.

Although not shown, a lifting table for raising and lowering the customer tray KST is provided below each window 406. Here, the tested ICs to be tested are reloaded. The fully loaded customer tray KST is placed and lowered, and the full tray is transferred to the tray transfer arm 205.

Incidentally, in the electronic component test apparatus 1 of this embodiment, although the maximum number of sortable categories is eight, only four customer trays KST can be arranged in the window 406 of the unloader section 400. Can not.
Therefore, the categories that can be sorted in real time are 4
Restricted to classification. Generally, a good product is a fast response element,
It is classified into three categories of medium-speed response element and low-speed response element, and four categories are added with defective products. However, for example, such as those requiring retest,
There may be categories that do not belong to these categories.

As described above, the window section 4 of the unloader section 400
When the IC under test is classified into a category other than the category assigned to the four customer trays KST arranged at 06, the unloader unit 400 outputs one IC.
Return the customer tray KST to the IC storage unit 200,
Instead, the customer tray KST for storing the IC under test of the newly generated category is provided in the unloader section 400.
, And store the IC under test. However,
If the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time.
There is a problem that the throughput is reduced. For this reason, in the electronic component test apparatus 1 of the present embodiment, the buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and the IC under test of a category that rarely occurs in the buffer unit 405. Is to be kept temporarily.

For example, 20 to 30
In addition to providing a capacity capable of storing about the number of ICs to be tested, the IC stored in each IC storage position of the buffer unit 405 is provided.
A memory for storing each category of C is provided, and the category and position of the IC under test temporarily stored in the buffer unit 405 are stored for each IC under test. Then, during the sorting operation or when the buffer unit 405 becomes full, the customer tray KST of the category to which the IC under test belonging to the buffer unit 405 belongs is stored in the IC storage unit 2.
00 and stored in the customer tray KST. At this time, the IC under test temporarily deposited in the buffer unit 405 may cover a plurality of categories. In such a case, when the customer tray KST is called, a plurality of customer trays KST are simultaneously loaded into the unloader unit 400.
Can be called to the window section 406 of FIG.

Next, the operation will be described. The customer tray on which the IC to be tested is mounted is sent from the pre-test stocker 201 to the window unit 306, and the XY transfer device 304
The test tray TST stopped on the loader unit 300 is replaced. This test tray TST is
Then, a predetermined temperature is applied in the soak chamber 101 and the test chamber 102 while being sent into the chamber 0 and sequentially fed by the vertical transfer device.

In this embodiment, warm air or cold air is supplied from the temperature application unit 130 when the temperature is applied.
When the hot or cold air flows along the ceiling surface of the test chamber 102 as shown in FIG. 4, a part of the hot or cold air is formed in the first through hole 112 and the match plate 120 formed in the Z-axis driving device 110. It is directly blown to the IC under test through the second through hole 122 formed. The other hot or cold air flows around the right side wall of the test chamber 102 and returns to the suction port 135 of the unit 130 through the gap between the match plate 120 and the test tray TST.

That is, in the handler 1 of the present embodiment,
The hot or cold air blown out from the supply port 134 of the temperature application unit 130 can be blown directly and in parallel to a plurality of ICs to be tested mounted in a plane. The amount of heat applied becomes uniform, and the temperature rise and fall times of the plurality of ICs under test become equal. Thereby, even if, for example, 64 ICs to be tested are mounted, the occurrence of uneven temperature can be prevented, and as a result, the temperature rise / fall time can be shortened.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above embodiment, 64 test ICs are mounted on one test tray TST.
In the present invention, such a mounting number is not limited at all, and more or less than this is within the scope of the present invention.

[0060]

As described above, according to the present invention, the fluid for temperature application is uniformly supplied to each electronic component, so that the occurrence of uneven temperature can be prevented and the temperature rise / fall time can be shortened. can do.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention.

FIG. 2 is a conceptual diagram showing a method for handling electronic components in the electronic component test apparatus shown in FIG.

FIG. 3 is an exploded perspective view showing a test tray used in the electronic component test device shown in FIG.

FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2;

FIG. 5 is a plan view showing an embodiment of an interposition plate according to the present invention.

FIG. 6 is a cross-sectional view showing a conventional electronic component test apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Handler (electronic component test apparatus) 100 ... Chamber part 110 ... Z-axis drive device (drive means) 111 ... Press part (first press part) 112 ... First through hole 120 ... Match plate (intervening plate) 121: Pusher (second pressing portion) 122: Second through hole 130: Temperature applying unit 200: IC storage unit 300: Loader unit 400: Unloader unit 5: Test head 51: Contact TST: Test tray

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2G003 AA07 AB16 AC03 AD01 AD02 AD04 AH04 AH05 2G032 AB13 AE01 AE02 AJ04 AK01 AK02 AK03 AK15 5E322 BA01 BA03 BA05 BB03 CA01 EA02 EA03 EA11 FA01

Claims (6)

[Claims] 1. A method for applying a temperature application fluid to a plurality of electronic components mounted on a tray in a chamber, wherein the plurality of electronic components are supplied from a supply port of the temperature application fluid. A method for applying a temperature to an electronic component, comprising supplying the temperature applying fluid in parallel to the electronic component. 2. A method of applying a temperature to a plurality of electronic components mounted on a tray substantially flush with each other in a chamber, the method comprising: A method for applying a temperature to an electronic component, comprising supplying the fluid for applying a temperature substantially directly to a plurality of electronic components. 3. A chamber having a supply port for a temperature application fluid for applying a temperature to an electronic component, a tray on which the electronic component is mounted and conveyed into the chamber, and an electronic device mounted on the tray. A pressing means for pressing a component against a contact of a test head; and an interposition plate interposed between the electronic component and the pressing means for transmitting a pressing force from the pressing means to each of the electronic components. In the electronic component test apparatus, the drive means and the interposition plate each have a through hole through which a temperature application fluid supplied from a supply port of the temperature application fluid can pass. Electronic parts testing equipment. 4. A first through hole formed in said driving means,
A plurality of first components for applying a pressing force to each of the electronic components;
4. The electronic component test apparatus according to claim 3, wherein the test parts are formed evenly between the pressing parts. 5. The electronic device according to claim 1, wherein the second through holes formed in the interposition plate are formed evenly between a plurality of second pressing portions for pressing the electronic components. Item 5. An electronic component test apparatus according to item 3 or 4. 6. The electronic component test apparatus according to claim 4, wherein the first through hole and the second through hole are formed at positions substantially overlapping in a plan view. .