WO2008032396A1

WO2008032396A1 - Test tray and electronic component testing apparatus provided with same

Info

Publication number: WO2008032396A1
Application number: PCT/JP2006/318360
Authority: WO
Inventors: Mitsunori Aizawa; Akihiko Ito
Original assignee: Advantest Corporation
Priority date: 2006-09-15
Filing date: 2006-09-15
Publication date: 2008-03-20
Also published as: TWI423370B; CN101512356A; TW200820367A

Abstract

A test tray (TST) is provided with a plurality of inserts (82) wherein IC devices can be stored, and a frame member (81) for movably holding the inserts (82). Each insert (82) is arranged to the frame member (81), in a direction substantially orthogonally intersecting with the main surface of the test tray (TST). The inserts (82) are arranged to be stacked on the frame member (81), along a direction substantially orthogonally intersecting with the main surface of the test tray (TST).

Description

Specification

Test tray and electronic component testing apparatus including the same

Technical field

[0001] The present invention relates to an IC device by electrically contacting input / output terminals of various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) to a contact portion of a test head. For electronic component testing equipment used for testing! The present invention relates to a test tray that is transported in an electronic component test apparatus in a state in which a plurality of IC devices are accommodated, and an electronic component test apparatus including the test tray.

Background art

In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.

[0003] A handler constituting an electronic component testing apparatus includes a loader unit, a chamber unit, and an unloader unit.

[0004] The handler loader unit is a tray (hereinafter referred to as a customer tray) that accommodates pre-test IC devices or IC devices that have been tested (hereinafter referred to as customer trays) that is circulated and transported in the electronic component test apparatus. The IC device is transferred to the test tray, and the test tray is loaded into the chamber.

[0005] Next, after applying high or low temperature heat stress to the IC device in the chamber portion of the handler, the IC device is pressed against the test head, and the input / output terminals of each IC device are electrically connected to the contact portion of the test head. The electronic component testing device body (hereinafter referred to as a tester) performs the test.

[0006] Next, the test tray loaded with the IC device for which the test has been completed is carried out from the chamber part to the unloader part, and the IC device is mounted on the customer tray according to the test result in the unloader part. Good products are classified into defective products and categories! /

[0007] In order to further improve the throughput of electronic component test equipment, a large number of simultaneous measurements (the number of IC devices that can be tested simultaneously in electronic component test equipment) is desired. Increases to 256, 512, and 1024 are required. [0008] As described above, the test of the IC device is executed with the test tray mounted on the test tray. Therefore, the number of IC devices that can be mounted on the test tray per sheet as the number of simultaneous measurements increases. Need to be increased.

However, if only the number of test trays that can be mounted is increased in accordance with the increase in the number of simultaneous measurements, the test tray simply expands in a plane. For this reason, the loader, chamber, and unloader must be large enough to allow the test tray to pass through in the case of the drum and the drum. As a result, the overall size of the electronic component testing apparatus is increased. The

Disclosure of the invention

[0010] It is an object of the present invention to provide a test tray that can be reduced in size and an electronic component test apparatus including the test tray.

In order to achieve the above object, according to the present invention, the electronic device under test includes a plurality of inserts that can accommodate the electronic device under test and a frame member that holds the insert, and tests the electronic device under test. A test tray that is transported in a state in which a plurality of the electronic devices to be tested are accommodated in an electronic component test apparatus used for the test, wherein the insert is a test tray with respect to the frame member. A test tray is provided that is positioned in a direction substantially perpendicular to the main surface of the tray (see claim 1).

In the present invention, the insert is arranged in a direction substantially perpendicular to the main surface of the test tray with respect to the frame member. Thereby, since the insert and the frame member can be stacked three-dimensionally and the insert and the frame member can be overlapped, the test tray can be reduced.

[0013] Although not particularly limited in the above invention, the frame member and the insert are arranged so as to be displaced from each other along a direction substantially orthogonal to the main surface of the test tray. Is preferred.

[0014] Although not particularly limited in the above invention, a part or all of the insert protrudes along a direction substantially perpendicular to the main surface of the test tray with respect to the frame member! /, Prefer to be.

[0015] Although not particularly limited in the above invention, the insert is a main part of the test tray. It is preferably arranged so as to be stacked on the frame member along a direction substantially perpendicular to the plane (see claim 2).

[0016] Although not particularly limited in the above invention, the frame member and the insert are arranged so as to overlap each other along a second direction substantially parallel to the main surface of the test tray. And prefer to be.

[0017] Although not particularly limited in the above invention, the plurality of inserts are adjacent to each other along the direction substantially parallel to the main surface of the test tray without the frame member interposed therebetween. It is preferable to arrange them (see claim 3).

[0018] Although not particularly limited in the above invention, the frame member includes: a frame main body that forms an outer periphery of the frame member; and a crosspiece spanned in the frame main body, and the insert Includes a first hole into which a part relatively approaching the test tray from the frame member side along a direction substantially orthogonal to the main surface of the test tray, and a main hole of the test tray. The insert side force along a direction substantially perpendicular to the surface, and a second hole into which a component relatively approaching the test tray is inserted, and the first hole is It is arranged so as to open between the frame main body and the crosspiece or between the crosspieces, and the second hole is arranged so as not to interfere with the first hole. Preferred (see claim 4).

[0019] Although not particularly limited in the above invention, it further includes an attachment member that attaches the insert to the frame member at a corner portion of the insert and holds the insert movably on the frame member, and a plurality of adjacent members. The inserts are preferably held together on the frame member by a single attachment member (see claim 5).

[0020] By holding a plurality of inserts together on a frame member with one mounting member, the number of mounting members can be reduced, and the test tray can be further reduced in size.

[0021] Although not particularly limited in the above invention, the insert of the test tray is moved relative to the frame member along a direction substantially orthogonal to the main surface of the test tray. From the state in which the insert is allowed to move with respect to the frame member or positioned in a direction substantially parallel to the main surface, It is preferable to be able to switch to a state in which it has been placed or a state in which it can be idle (see claim 6).

In order to achieve the above object, according to the present invention, there is provided a test tray having a plurality of inserts that house the electronic device under test and a frame member that holds the insert, and the electronic device under test In order to perform the test, an electronic component testing apparatus that carries the test tray into a test unit in a state where the electronic component to be tested is accommodated in the test tray, and the insert is inserted into the frame member in the test tray. On the other hand, an electronic component test apparatus is provided that is positioned in a direction substantially perpendicular to the main surface of the test tray (see claim 7).

In the present invention, in the test tray, the insert is disposed in a direction substantially orthogonal to the main surface of the test tray with respect to the frame member. Accordingly, the test tray can be reduced by stacking the insert and the frame member in a three-dimensional manner and overlapping the insert and the frame member. For this reason, it is possible to suppress an increase in the size of the electronic component testing apparatus that accompanies the large number of simultaneous measurements.

[0024] Although not particularly limited in the above invention, the test tray includes a first test tray in which the plurality of inserts are arranged adjacent to each other without the frame member interposed therebetween. One test tray is preferably stacked on the frame member along a direction substantially perpendicular to the main surface of the test tray (see claim 8).

[0025] Although not particularly limited in the above invention, the test tray includes the first test tray in which the plurality of inserts are disposed adjacent to each other without the frame member interposed therebetween. A second test tray in which the frame member is interposed between the inserts, and the inserts of the first and second test trays both have a predetermined distance relative to the frame member. It is preferably held by the frame member so as to protrude (see claim 9).

[0026] In both the first test tray and the second test tray, both test trays can be transported by the same transport device by aligning the protruding amount of the insert with respect to the frame member. It can be handled by the electronic component testing apparatus. Brief Description of Drawings

FIG. 1 is a schematic cross-sectional view showing an electronic component test apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 3 is a conceptual diagram showing tray handling in the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 4 is an exploded perspective view showing an IC stock force used in the electronic component testing apparatus according to the first embodiment of the present invention.

FIG. 5 is an exploded perspective view showing a customer tray used in the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a test tray according to the first embodiment of the present invention.

FIG. 7 is an enlarged perspective view of a test tray according to the first embodiment of the present invention.

[FIG. 8A] FIG. 8A is a cross-sectional view taken along line VIII-VIII in FIG. 7, showing a state before the IC device is pressed against the contact portion of the test head.

[FIG. 8B] FIG. 8B is a cross-sectional view taken along the line VIII-VIII in FIG. 7, showing a state in which the IC device is pressed against the contact portion of the test head.

FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG.

FIG. 10A is an enlarged cross-sectional view of a portion X in FIG. 8, and shows a state in which the insert is at the lowest position with respect to the frame member.

FIG. 10B is an enlarged cross-sectional view of a portion X in FIG. 8, and shows a state where the insert is relatively raised with respect to the frame member.

FIG. 11 is a cross-sectional view showing a first test tray and a tray transfer device in a second embodiment of the present invention.

FIG. 12 is a cross-sectional view showing a second test tray and a tray transfer device in a second embodiment of the present invention.

Explanation of symbols

[0028] 1 ... Handler

12 ... Tray conveyor 12a ... Rotating roller

12b ... Shahu

100 ... Chamber part

121 ... pusher

122 ... Guide pin

5 ... Test head

50 ... Socket

52 ··· Guide pins

TST ... Test tray

81 .. Frame members

811 ... Frame body

812

813 ... Mounting hole

814 ... space

82 ... Insert

821 ... Container

822 ... Projection

822a ... flat

822b ... Tapered part

823 ... 1st hole

824 ... 2nd hole

83 ... Mounting member

831 ... Holding part

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0030] [First embodiment]

Before describing the test tray according to the present embodiment, an electronic component test apparatus using the test tray will be described. FIG. 1 shows an electronic component test according to the first embodiment of the present invention. FIG. 2 is a perspective view showing the electronic component testing apparatus according to the first embodiment of the present invention, and FIG. 3 is a tray take-up in the electronic component testing apparatus according to the first embodiment of the present invention. It is a conceptual diagram which shows a rotation.

FIG. 3 is a view for understanding a tray handling method in the electronic component testing apparatus according to the present embodiment. In practice, members arranged in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.

[0032] The electronic device test apparatus according to the present embodiment tests (inspects) whether or not the IC device operates properly in a state where a high temperature or low temperature stress is applied to the IC device, and the test result is It is a device that classifies IC devices based on it, and consists of handler 1, test head 5 and tester 6. The IC device test using this electronic component test equipment is performed by replacing the IC device from the customer tray KST to the test tray TST.

For this reason, as shown in FIGS. 1 to 3, the handler 1 in this embodiment includes a storage unit 200 that stores a pre-test IC device and a customer tray KST loaded with a post-test IC device, A loader unit 300 that reloads IC devices sent from the storage unit 200 onto the test tray TST and sends them to the chamber unit 100, and a chamber unit 100 that includes the test head 5 and tests IC devices in a state mounted on the test tray TST. The unloader unit 400 is configured to unload the tested IC devices from the chamber unit 100 and transfer them to the customer tray KST while sorting them.

The socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1. The IC device electrically connected to the socket 50 is electrically connected to the tester 6. Then, the IC device is tested by the test signal from the tester 6. As shown in FIG. 1, a space is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in this space, and a through hole formed in the main frame of the handler 1 It is possible to make electrical contact between the IC device and the socket 50 on the test head 5 via the connector. This test head 5 is replaced with another test head having a socket suitable for the shape and the number of pins of the IC device of the type when the IC device type is changed. [0035] Hereinafter, each part of the handler 1 will be described in detail.

[0036] <Storage unit 200>

4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the first embodiment of the present invention, and FIG. 5 is a customer tray used in the electronic component testing apparatus according to the first embodiment of the present invention. It is a perspective view shown.

[0037] The storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores tested IC devices classified according to the test results. ing.

[0038] As shown in FIG. 4, these stockers 201 and 202 can be moved up and down by a frame-like tray support frame 203 and a lower force of the tray support frame 203 also entering and facing upward. Elevator 204. A plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.

[0039] Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the numbers of the pre-test IC stocker 201 and the tested IC stocker 202 can be set as necessary. The number can be set as appropriate.

[0040] As shown in Fig. 5, customer tray KST is a force that 60 storage units 91 for accommodating IC devices are arranged in 10 rows x 6 columns. There are various variations of sequences.

In this embodiment, as shown in FIG. 2 and FIG. 3, one stock force STK-B is provided in the pre-test IC stocker 201, and next to the tested IC stocker 202. Five stockers STK-1, STK-2, ..., STK-4, STK-R are provided. Next to the stocker STR —R, there is one empty tray stocks STK—E, and next to it is the three stockers STK-5, STK-6 and STK— 7 is provided. Empty tray stock force STK—E is stacked with empty customer trays KST without any IC devices!

In the present embodiment, as described above, a total of eight stockers STK-1, STK-2,..., STK-7, and STK-R are provided for the tested IC stocker 202. According to the best Large It is configured so that IC devices can be sorted and stored in 8 categories! Speak. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.

[0043] <Loader unit 300>

As shown in FIGS. 2 and 3, the customer tray KST described above is installed in the two windows 330 of the loader section by means of a tray transfer arm 205 provided between the storage section 200 and the apparatus board 11. The lower force is also carried. In the loader unit 300, the IC device mounted on the customer tray KST is transferred by the device transfer device 310 to the precursor 320, where the mutual positional relationship of the IC devices is corrected. Thereafter, the IC device transferred to the precursor 320 is stopped again at the loader unit 300 by the transfer device 310 and loaded onto the test tray TST.

6 is an exploded perspective view showing the test tray according to the first embodiment of the present invention, FIG. 7 is an enlarged perspective view of the test tray according to the first embodiment of the present invention, and FIGS. 8A and 8B are FIG. 8A is a cross-sectional view taken along line Vm-VIII of Fig. 8A, showing the state before the IC device is pressed against the contact portion of the test head, and Fig. 8B is the state where the IC device is pressed against the contact portion of the test head. 9 is a sectional view taken along line IX-IX in FIG. 7, FIGS. 10A and 10B are enlarged sectional views of part X in FIG. 9, and FIG. 10A has the lowest insert relative to the frame member. FIG. 10B is a view showing a state in which the insert is relatively raised with respect to the frame member.

[0045] As shown in FIGS. 6 and 7, the test tray TST in the present embodiment has a frame member 81, a plurality of inserts 82 that can accommodate IC devices, and a frame member 81 that freely inserts each insert 82. A mounting member 83 that can be held and a force are also configured.

As shown in FIG. 6, the frame member 81 includes a frame main body 811 that forms a rectangular outer periphery of the frame member 81, and a rail that is spanned in a lattice shape inside the frame main body 811. The force is composed of 8-12. Mounting holes 813 penetrating the front and back surfaces of the frame member 81 are formed at the corners of the frame main body 811, the intersections of the frame main body 811 and the crosspieces 812, and the intersections of the crosspieces 812. A mounting member 83 is inserted into each mounting hole 813. Also The inserts 82 are respectively disposed below the space 814 surrounded by the frame body 811 and the crosspiece 812, or surrounded by the crosspieces 812. In FIG. 6, only one insert 82 is shown, but actually, in this embodiment, a total of 64 inserts 82 are attached to one test tray TST in an array of 8 rows and 8 columns. It has been.

[0047] As shown in FIG. 7, each insert 82 includes four accommodating portions 821 that can accommodate IC devices. In this embodiment, each insert 82 holds four IC devices with one insert 82. It is possible. Each accommodating portion 821 is configured by a through-hole penetrating the front and back surfaces of the insert 82. The peripheral edge of the lower opening of each housing portion 821 slightly protrudes inward to hold the IC device.

[0048] As shown in the figure, the four corners of the insert 82 are recessed in an arc shape on the inner side, leaving only the upper part, and as a result, there are protruding portions 822 that protrude outward by force. It is formed at the top of each corner of Insert 82.

[0049] As shown in FIGS. 8A and 8B, the upper surface of the insert 16 has a first hole 823 into which the guide pin 122 of the pusher 121 that presses the IC device also in the upward direction during the test is inserted. is doing. The first hole 823 is disposed so as to open in the space 814 of the frame member 81.

[0050] On the other hand, a second hole 824 into which the guide pin 52 that projects also in the vicinity of the socket 50 against which the IC device is pressed during the test is opened on the lower surface of the insert 16. The second hole 824 is arranged so as not to interfere with the accommodating portion 821 and the first hole 823.

In FIG. 8A and FIG. 8B, in order to clarify the relationship among the pusher 121, the insert 82, and the socket 50, only one receiving portion 821 is shown for each insert 82. As described above, four receiving portions 821 are provided in each insert 82. Further, in the present invention, the number of accommodating portions provided in the insert is not particularly limited.

As shown in FIGS. 7 and 9, the attachment member 83 includes a cylindrical shaft portion 832 that can pass through the attachment hole 813 of the frame member 81, and a locking portion 833 provided at the tip of the shaft portion 832. And a disc-shaped holding portion 831 provided at the rear end of the shaft portion 832 and a force. [0053] The test tray TST described above is configured as follows. That is, as shown in FIGS. 7 and 9, first, a plurality of inserts 82 are respectively placed below the space 814 of the frame member 81; The shaft portion 832 is passed through the mounting hole 814 of the frame member 81 in the state where it is hung on. When the shaft portion 832 passes through the mounting hole 814, the locking portion 833 expands in diameter on the surface side of the frame member 81. Accordingly, the attachment member 83 is fixed to the frame member 81 and the insert 82 is held by the frame member 81.

At this time, as shown in FIG. 9, the insert 82 is three-dimensionally stacked on the frame member 81, and the frame portion 81 is not interposed between the inserts 82. Thus, in this embodiment, since the frame member 81 and the insert 82 are three-dimensionally overlapped, the test tray TST is reduced, and even if the number of simultaneous measurements is large, the electronic component test apparatus An increase in size can be suppressed.

Furthermore, in this embodiment, as shown in FIGS. 7 and 9, adjacent protrusions 822 of adjacent inserts 82 are collectively held by a frame member 81 by a single attachment member 83. That is, the attachment member 83 inserted into the attachment hole 813 provided at the intersection of the frame body 811 and the crosspiece 812 holds the two protruding portions 822 of the adjacent inserts 82 together. Further, the mounting member 83 inserted into the mounting hole 813 provided at the intersection of the bars 812 holds the four protruding portions 822 of the adjacent inserts 82 together. As a result, the number of attachment members 83 can be reduced, so that the test tray TST can be further reduced.

[0056] It should be noted that a male screw portion is formed at the tip of the shaft portion 832 of the mounting member 83 instead of the locking portion 833, and a female screw portion is formed in the mounting hole 813 of the frame member 81, and these are screwed together. By doing so, the attachment member 83 may be fixed to the frame member 81.

As shown in FIGS. 10A and 10B, in the present embodiment, each protrusion 822 formed at the corner of the insert 82 is composed of a flat portion 822a composed of a plane and an inclined surface. Taper section 822b. The flat portion 822a has a plane force substantially parallel to the upper surface of the holding portion 831 of the mounting member 83. On the other hand, the taper portion 822b is composed of an inclined surface that inclines and expands from the flat portion 822a. Then, as shown in FIG. 10A, in a state where the insert 82 is at its lowest position with respect to the frame member 81 due to its own weight, the holding portion 831 of the mounting member 83 contacts the flat portion 822a of the protruding portion 822. In addition, the insert 82 is positioned with respect to the frame member 81 in the horizontal direction by being restricted by the tapered portion 822b.

[0059] On the other hand, when the insert 82 comes into contact with the socket 50 (see FIG. 8B) and the insert 82 is raised relative to the frame member 81 as shown in FIG. The protrusion 82 is separated from the holding portion 831 and the insert 82 is allowed to move relative to the frame member 81 in a space expanded by the tapered portion 822b. In the example shown in FIG. 10B, the insert 82 on the right side in the figure has moved slightly relative to the mounting member 83 in the left direction.

[0060] When the insert 82 returns to the lowest position with respect to the frame member 81 due to its own weight, the holding portion 831 of the mounting member 83 is guided by the tapered portion 822b of the protruding portion 82, and the holding portion 831 and The flat portion 822a comes into contact, and the insert 82 is positioned with respect to the frame member 81 in the horizontal direction.

Returning to FIG. 2 and FIG. 3, the loader unit 300 includes a device transfer device 310 that transfers IC devices from the customer tray KST to the test tray TST. The device transfer device 310 includes two rails 311 erected on the device substrate 11 along the Y-axis direction, a movable arm 312 that can reciprocate along the Y-axis direction on the rail 311, and this movable A movable head 313 supported by the arm 312 and movable in the X-axis direction along the movable arm 312.

[0062] A suction pad (not shown) is mounted downward on the movable head 313 of the device transport apparatus 310. The device transfer device 310 sucks the IC device from the customer tray KST using this suction pad, moves the IC device, and releases the suction pad suction at a predetermined position on the test tray TST. It is possible to transship IC devices from KST to test tray TST. For example, about eight such suction pads are attached to one movable head 313, and eight IC devices can be transferred from the customer tray KST to the test tray TST at a time.

[0063] When the IC device is accommodated in all inserts of the test tray TST, the tray transfer device 1 The test tray TST is carried into the chamber part 100 by 08.

[0064] On the other hand, when all the IC devices mounted on the customer tray KST are loaded onto the test tray TST, the empty customer tray KST is lowered from the window 330 by the lifting table, and the empty tray is transferred to the tray. Deliver to device 205. The tray transfer device 205 stores this empty tray in the empty tray stock force STK-E, and when the customer tray KST of the window 430 on the unloader section 400 side is filled with IC devices, the empty tray stock force STK-E The tray transfer arm 205 supplies an empty tray to the window 430.

[0065] <Chamber part 100>

The above-described test tray TST is loaded into the chamber section 100 after IC devices are loaded by the loader section 300, and each IC device is tested in a state of being mounted on the test tray TST.

[0066] As shown in FIGS. 2 and 3, the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature heat stress to the IC device loaded on the test tray TST, and a heat stress applied to the IC device. The test chamber 120 that makes the IC device in the state of contact with the test head 5, the unsoak chamber 130 that also removes thermal stress from the IC device force that has been tested, and the like are configured.

[0067] It is preferable that the unsoak chamber 130 is thermally insulated from the soak chamber 110 and the test chamber 120. In practice, the region between the soak chamber 110 and the test chamber 120 is maintained at a high temperature or a low temperature. The unsoak chamber 130 is thermally insulated from these chambers. For convenience, these are collectively referred to as the chamber portion 100.

[0068] The soak chamber 110 is disposed so as to protrude above the test chamber 120. As shown conceptually in FIG. 3, a vertical transfer device is provided inside the soak chamber 110, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 120 is empty. Waiting while being. During this standby period, a high or low temperature thermal stress of about 155 to 150 ° C. is applied to the IC device.

[0069] In the test chamber 120, a test head 5 is disposed at the center thereof. The test tray TST is carried above the test head 5, and the IC device is tested by bringing the IC device input / output terminals into electrical contact with the contact bin 51 of the test head 5 (see FIG. 8B). To be implemented.

[0070] The result of this test is, for example, an address determined by the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST. Stored in a storage device.

[0071] Like the soak chamber 110, the unsoak chamber 130 is also arranged so as to protrude upward from the test chamber 120. As shown conceptually in FIG. 3, a vertical transfer device is provided. Yes. In the unsoak chamber 130, when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air, and then the heat-removed IC device is carried out to the unloader unit 400. On the other hand, when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater or the like to return to a temperature that does not cause dew condensation, and then the removed IC device is removed. Unloader unit 400

[0072] In the upper part of the soak chamber 110, an inlet for carrying the test tray TST from the apparatus substrate 11 is formed. Similarly, an outlet for carrying out the test tray TST on the apparatus substrate 11 is also formed in the upper part of the unsoak chamber 130. On the apparatus substrate 11, a tray transfer device 12 is provided for taking the test tray TST out and in and out of the chamber section 100 through these inlets and outlets. The tray conveying device 12 is composed of, for example, a rotating roller. The tray transfer device 12 returns the test tray TST force unloaded from the unsoak chamber 130 to the soak chamber 110 via the unloader unit 400 and the loader unit 300.

[0073] <Unloader unit 400>

The unloader unit 400 can transfer the tested IC device from the test tray TST carried out from the chamber unit 100 to the unloader unit 400 to the customer tray KST corresponding to the test result.

[0074] As shown in FIG. 2, on the device substrate 11 in the unloader unit 400, four customer trays KST carried from the storage unit 200 to the unloader unit 400 are arranged as desired on the upper surface of the device substrate 11. A window 430 is formed.

[0075] The unloader unit 400 transfers the tested IC device from the test tray TST to the customer tray K. Equipped with two device transfer devices 410 for transshipment to ST. Each device transfer device 410 includes two rails 411 installed on the device substrate 11 along the Y-axis direction, a movable arm 412 that can reciprocate on the rail 411 along the Y-axis direction, A movable head 413 supported by the movable arm 412 and movable in the X-axis direction along the movable arm 312 is constituted by a force.

[0076] About eight suction pads (not shown) are mounted downward on the movable head 413 of each device transport apparatus 410, and at the same time, eight IC devices are transferred from the test tray TST to the customer tray KST. It is possible.

[0077] Force not shown In the figure, below each window 430, there is an elevating table for elevating the customer tray KST. In this case, the customer tray is fully loaded with tested IC devices. The KST is lowered and the full tray is transferred to the tray transfer arm 205.

Incidentally, in the electronic component testing apparatus of the present embodiment, the maximum number of categories that can be sorted is eight, but the apparatus substrate 11 of the unloader unit 400 has only four window portions 430 formed therein. For this reason, the unloader unit 400 can only place a maximum of four customer trays KST and place them in force. Therefore, categories that can be sorted in real time are limited to four categories. Generally, non-defective products are classified into three categories: high-speed, medium-speed, and low-speed, and defective products are added to these, and four categories are sufficient. In some rare cases, categories that do not belong to these categories such as

[0079] As described above, when an IC device classified into a category other than the category assigned to the four customer trays KST arranged in the window 406 of the unloader unit 400 is generated, one IC is generated from the unloader unit 400. The customer tray KST is returned to the storage unit 200, and instead, the customer tray KST assigned with the newly generated category is transferred to the unloader unit 400 to store the IC device. However, in this case, the sorting operation must be interrupted, and there is a problem that throughput is reduced. For this reason, in the electronic component testing apparatus according to the present embodiment, a notch unit 420 is provided between the test tray TST of the unloader unit 400 and the window unit 430, and rarely a force is generated. Part 42 I am going to temporarily deposit at 0.

[0080] As described above, in the present embodiment, the frame member 81 and the insert 82 are three-dimensionally stacked in the test tray TST, and the insert 82 and the frame member 81 are overlapped. TST can be reduced. Therefore, it is possible to suppress an increase in the size of the electronic component testing apparatus that accompanies the large number of simultaneous measurements.

[0081] [Second Embodiment]

FIG. 11 is a cross-sectional view showing a first test tray and a tray transport apparatus according to the second embodiment of the present invention, and FIG. 12 is a cross-section showing a second test tray and a tray transport apparatus according to the second embodiment of the present invention. FIG.

As shown in FIG. 11, the first test tray TS1 in the present embodiment is a first test tray TS1 except that a part of the frame body 811 of the frame member 81 slightly protrudes downward. The test tray TST according to the embodiment has the same structure. In the first test tray TS1, the insert 82 protrudes relative to the lower end surface of the frame body 811 in the downward direction by a distance hi.

On the other hand, the second test tray TS2 is a test tray using a conventional insert 85 as shown in FIG. 12, and a frame member 84 is interposed between the inserts 85. Also in the second test tray TS2, the insert 85 protrudes relative to the lower end surface of the frame main body 841 in the downward direction by a distance h2. The distance hi and the distance h2 are substantially the same or approximated (hl ^ h2).

As described in the first embodiment, the test tray is returned from the unloader unit 400 to the loader unit 300 by the tray transport device 12. As shown in FIGS. 11 and 12, the tray transfer device 12 includes a rotary roller 12a that contacts the lower surface of the frame bodies 811 and 841 of the test trays TS1 and TS2, and a shaft that supports the rotary roller 12a. 12b, and the test trays TS1 and TS2 are conveyed by rotating the rotating roller 12a by the power of a motor (not shown) or the like connected to the shaft 12b.

In this embodiment, since the protrusion distances hl and h2 of the inserts 82 and 85 with respect to the lower surfaces of the frame bodies 811 and 841 are aligned, the inserts 82 and 85 do not interfere with the shaft 12b. Therefore, different types of test trays TS1 and TS2 can be It can be transported and the existing insert 85 can be easily used.

The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

Claims

The scope of the claims

[1] A plurality of inserts that can accommodate the electronic device under test and a frame member that holds the insert, and in the electronic device test apparatus used for testing the electronic device under test, A test tray transported in a state of containing the electronic device under test,

The insert is located in a direction substantially perpendicular to the main surface of the test tray with respect to the frame member.

[2] The test tray according to claim 1, wherein the insert is disposed so as to be stacked on the frame member along a direction substantially orthogonal to a main surface of the test tray.

[3] The plurality of inserts are arranged adjacent to each other in a direction substantially parallel to the main surface of the test tray without the frame member interposed therebetween. 2. Test tray as described.

[4] The frame member is:

A frame body constituting an outer periphery of the frame member;

A crosspiece spanned in the frame body,

The insert is

A first hole into which a part relatively approaching the test tray is inserted from the frame member side along a direction substantially orthogonal to the main surface of the test tray;

The insert side force has a second hole into which a component relatively approaching the test tray is inserted along a direction substantially orthogonal to the main surface of the test tray. Are arranged so as to open between the frame body and the crosspieces or between the crosspieces,

The test tray according to claim 1, wherein the second hole is disposed so as not to interfere with the first hole.

[5] It further includes an attachment member that attaches the insert to the frame member at a corner portion of the insert, and holds the insert movably on the frame member; The test tray according to any one of claims 1 to 4, wherein the plurality of adjacent inserts are held together on the frame member by one mounting member.

[6] By moving the insert relative to the frame member along a direction substantially orthogonal to the main surface of the test tray,

The insert can be switched from a freely movable state or a positioned state relative to the frame member along a direction substantially parallel to the main surface of the test tray to a positioned state or a freely movable state. The test tray according to any one of claims 1 to 5, which is possible.

[7] A test tray having a plurality of inserts that house the electronic devices under test and a frame member that holds the inserts, and for testing the electronic devices under test, An electronic component testing apparatus that carries the test tray into a test unit while being accommodated in a test tray,

In the test tray, the insert is located in a direction substantially perpendicular to the main surface of the test tray with respect to the frame member.

[8] The test tray includes a first test tray in which the plurality of inserts are arranged adjacent to each other without the frame member interposed therebetween,

8. The electronic component test apparatus according to claim 7, wherein the first test tray is stacked on the frame member along a direction substantially orthogonal to a main surface of the test tray.

[9] The test tray is

A first test tray in which the plurality of inserts are arranged adjacent to each other without the frame member interposed therebetween;

A second test tray in which the frame member is interposed between the adjacent inserts,

8. The electronic component testing apparatus according to claim 7, wherein the inserts of the first and second test trays are held by the frame member so that both of the inserts protrude a predetermined distance relative to the frame member.