TW200820367A - Test tray and electronic component testing apparatus provided with the same - Google Patents

Abstract

A test tray (TST) is provided with a plurality of inserts (82) wherein IC devices can be stored, and a frame member (81) for movably holding the inserts (82). Each insert (82) is arranged to the frame member (81), in a direction substantially orthogonally intersecting with the main surface of the test tray (TST). The inserts (82) are arranged to be stacked on the frame member (81), along a direction substantially orthogonally intersecting with the main surface of the test tray (TST).

Description

。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 An electronic component testing device that contacts a contact portion of a test head and tests an ic component, a test tray that is transported in an electronic component testing device in a state in which a plurality of IC components are accommodated, and an electronic component testing device having the same [Prior Art] In the process of electronic components such as 1C components, A tests the performance or function of the 1C component in the sealed state, and uses the electronic component test device in the processor that constitutes the electronic component test device, such as the secret device. Pack 4 loading section, room section and unloading section. - the loading portion of the processor is used to receive the IC component before the test or the pallet of the finished 1C component (hereinafter referred to as the custom component in the electronic component test package; 稷 1 is called the test tray), And put the tray (with 1 I elbow 4 / then use the tray to move into the chamber. Then, after applying high temperature or thermal stress to the ic component in the chamber of the processor, the κ component is in the test head, and - : The input terminal is electrically contacted with the _ n , , and the output of the device (the following contact, and then the electronic component test body (hereinafter also referred to as the tester) is tested. Then, the test test room will be loaded Moved to the unloading section, and in the unloading section, 'and the test trays, and the parts were replaced in response to the test.

2247—9117-PF 200820367 The result of custom pallets, which are classified into good or defective products. In the electronic component test device, in order to improve productivity, it is desirable to simultaneously measure the number of ic components that can be simultaneously tested in the electronic component test device. For example, it is required to simultaneously increase the number of measurements to 25M solid, 512, ), as shown in the above, the test tray for the test tray can be mounted as described above, and the size of the single-processor and the loading tray can be large when the number of mountable trays is matched. Since the test system of the 1C component is still loaded in the test execution, the number of 1C components to be loaded also needs to be increased in conjunction with the increase in the number of simultaneous measurements. With the increase of the 4 Ϊ measurement, only the test tray for the test tray is enlarged to expand on the plane. Therefore, the y, the chamber, and the unloading portion need to be expanded to the test tray, and as a result, the electronic component testing device as a whole becomes [invention]] • The object of the present invention is to provide a test tray with variable j underpass and An electronic component testing device having the tray. In order to achieve the object, Blessing A, right according to the present invention, provides a test tray (refer to the scope of claim 1), which includes a plurality of inserts that can accommodate the electronic component under test, and a test tray for transporting the plurality of electronic components to be tested, in a state in which the plurality of electronic components to be tested are used, for the frame member for holding the insert only for the purpose of testing the electronic component to be tested, The insert is located in a direction substantially orthogonal to the main surface of the test tray for the frame member. 2247-9117-PF 6 200820367 In the present invention, the insert member is disposed in an orthogonal direction to the frame member: the main faces of the test tray are substantially stacked because the insert and the insert and the frame member stereo tray can be made Zoom out. The components are so heavy that the test can be used, although it is not particularly preferred in the invention that the two defective members of the test tray and the insert are offset from each other. The orthogonal direction of the shell is configured such that although the frame member is not particularly limited in the invention, the portion of the insert or the direction of the insert is substantially orthogonal to the phase of the pure test. Test tray: the insert is preferably along the member (refer to the patent scope parent: configured to be stacked on the frame to be specifically defined, but the frame member and the insert are 4 pairs of trays The main surface is substantially superposed to overlap. In the second direction, although the record is "Ming Wei Te (4), but the restoration of the main surface of the test tray is tied to the real part, without the frame member involved: Ping and 1 soil C reference 肀凊 patent Fanjue 3rd money in the silk material (4), 妓 this) frame body '#, constitute the (four) component phase; and the frame body; the insert and _ _ wood On the main surface of the tray, the quality is 4 ', along the zero for the test, which is close to the test tray: side: the second brother of the second brother, along the test.

2247-9117-PF 7 200820367 The main surface of the tray is substantially in the same direction, and is inserted into the part of the test tray relatively close to the insert side, and the first hole is disposed in the frame body and the frame Between the two or the frame, the second hole is arranged so as not to interfere with the hole, and the soil is better (see the fourth item of the patent application). Although the invention is not particularly limited, it further includes an ampoule member that mounts the insertion member to the frame member at a corner portion of the insert member and holds the insert member to the frame member in a swimming manner; The plurality of adjacent inserts are preferably::: the member is held together with the frame member (refer to the patent application scope 5). By holding the plurality of insert members in the frame member with a mounting member, the number of the mounting members can be reduced, and the test tray can be made smaller. Although the invention is not particularly limited to macro, ^ t . The hunting is performed by moving the insert member relative to the main surface of the test tray in a direction that is substantially positive and positive, and along the main surface of the test tray (7). Parallel direction, the insert from the frame member

At j red movement, sadness or positioning, sorrow, 'switching to the state of positioning or swimming (4) benefit range item 6). In order to achieve the object, in accordance with the present invention, an electronic component testing device is provided (refer to the national patent year No. 7: item), which includes a test carrier and the tray has a testable electronic body. The plurality of components of the component and the frame member for holding the insert are for receiving the electronic component to be tested in the test tray for testing the electronic component to be tested.

2247-9117-PF 200820367, the test tray is carried into the test portion, and in the test tray, the insert member is located on the main surface of the test tray: the parent direction. In the present invention, the insert member is arranged in a direction orthogonal to the test surface bead in the chapter of the test tray. Since I, the insert and the frame member are three-dimensionally stacked, and H 4 ' Reduce the test tray. Therefore, it can be done

The electronic component test device is stencilized. / ” U” with γ consumption in the invention is not specified, the money test (10) disk contains the f brother 1 test tray, which configures the multiple inserts adjacent, and no n Hai box components Preferably, the third test tray is stacked on the frame member in a direction perpendicular to the test tray, (refer to item 8 of the patent application). /... Although the invention is not particularly limited, the test tray includes: the first test tray' is configured to arrange the plurality of inserts adjacent to each other, and the second busy member "in, and the second test In the tray, the frame member is interposed between the adjacent inserts. The inserts of the first and second test trays are held by the frame member so as to relatively protrude the frame member at a predetermined distance. (Refer to item 9 of the patent application scope). In the first test tray and the second test tray, the same electronic component test device is used because the amount of protrusion of the insert member to the frame member is matched, and the two reduction trays can be transported by the same transport device. Can handle two test trays. 22 47-9117-PF 9 200820367 [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. [Second Embodiment] An electronic component test apparatus using the test tray will be described before the test tray in the form of a sigma. The first! FIG. 2 is a schematic cross-sectional view showing an electronic component testing apparatus according to a first embodiment of the present invention, and FIG. 2 is a perspective view showing an electronic component testing apparatus according to a first embodiment of the present invention. A schematic diagram of the processing of the tray of the electronic component testing device of the i-th embodiment. Further, Fig. 3 is a view for explaining a processing method of a tray used for measuring an electronic component according to an embodiment of the present invention, and actually shows a portion of a member arranged in the vertical direction in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to Fig. 2 . The electronic component testing apparatus according to the embodiment of the present invention tests (checks) whether the component Lu is properly operated in a state in which a temperature stress of a high temperature or a low temperature is applied to the 丨C component, and the device for classifying the IC component according to the test result is processed. The test head 5 and the tester 6 are constructed. The test of the 1C component of the electronic component testing device is carried out by replacing the IC component from the custom tray KST to the test tray TST. Therefore, in the processor i of the present embodiment, as shown in FIGS. 1 to 3, the following components are formed: the storage unit 2〇〇 stores the IC before loading the test or the IC after the test. The custom pallet kst of the assembly; the loading of the IC assembly from the storage unit 2〇 is replaced by the test j tray tst and sent to the chamber unit 100; Included with test head 5, = 2247-9117-PF 10 200820367 After being loaded on the test load section 4〇〇, pass the status of the TTS tray... After moving to the custom tray r:m Move out the test is finished (4) Components , in the classification cast in the thorn-7? P·

And tester 6 = (d) I Μ via the electric U shown in Figure 1 via electrical winding 7 and two::, 5 〇 electrically connected... test signal test two pieces Γ 're-_ from the tester 6 measured Handling crying, outside, as shown in Figure 1, the space is set = part of the second part, the ritual is exchangeably configured in this space; = and; the through hole formed by the main frame can be replaced by 5 The seat 50 is in electrical contact. The shape of the test head assembly, and the type %' of the test head assembly are replaced with other test heads having sockets suitable for the type of ic ', /, and the number of pins. Hereinafter, each unit of the processor 1 will be described. <Storage unit 200> η strong is an exploded perspective view of the IC memory used for measuring the electronic component according to the first embodiment of the present invention, and FIG. 5 is a view showing the 杏 1 apricot #卫..., ^ 〇m μ of the present invention. A perspective view of a custom pallet used in the general &amp; electronic component testing device. The test 2GG' includes: the pre-test Ic storage 201, which is a storage unit, a component; and the tested 1C storage 202, which stores the tested Ic components classified according to the test results. The storage 201, 202' is the fourth. The figure shows. It includes: a frame-shaped tray support frame 2°3; and a lifter 2. 4, which can be accessed from the lower portion of the tray support frame 203 and lifted up to the upper portion. In the tray support frame 2〇3, stack the number 2247-9117-PF 11 200820367 to order the tray KST, and use the elevator to order the tray KST. 204 only moves the stack up and down. Since the Ic memory 2〇1 before testing and the tested Ic storage cry 2°2 are the same, the pre-test 1C can be stored according to the need: 2〇1 and tested. The number of IC storages 202 is set to an appropriate number. The tray KST is shown in Fig. 5, although the 60 valleys 91 for accommodating the Ic components are arranged! The queue is 6 lines, but in reality, there are various arrangement changes depending on the type of the 1C component. In the present embodiment, as shown in Figs. 2 and 3, one memory STK_β is provided in the Ic memory 2〇1 before the test, and five of the tested K memory 202 are placed beside the test. Storage STK_ 1, STK-2, ···, STK-4, STK-R. One empty tray storage STK-E is placed beside the storage STK-R, and three of the tested IC storages 2〇2 STK-5, STK-6, STK-7 are placed next to it. . The empty pallet storage STK~E stacks the custom pallet KST that is completely empty of the IC components.

In this embodiment, as shown above, the tested ic storage 2 〇 2 sets a total of 8 storages STK - STK - 2, ..., STK - 7 and STK R to be classified into a maximum of 8 according to the results of the bin measurement And stored in a way. In other words, in addition to the difference between a good product and a defective product, even in a good product, it can be classified into a high speed, a medium speed, or a low speed, or even a defective product can be classified into a need to be retested. <Loading Unit 300> As described in FIGS. 2 and 3, the above-described customized tray KST is transferred from the 2247-9117-PF 12 by the tray transfer arm 2 〇5 provided between the storage unit 200 and the device substrate 11. 200820367 The lower side of the device substrate η is moved to the window portion 33 of the two loading portions. Next, at the loading unit 300, the component handling device 31 moves the ic component-degree loaded by the customized tray kst to the corrector (precise 〇 32 〇, where the positional relationship of the components is corrected. Then, the component handling device 31〇 is again transferred to the corrector 320 (the IC module is replaced by the test tray 3ST in the loading unit 3). Fig. 6 is a view showing the body of the test tray according to the first embodiment of the present invention. The enlarged perspective view of the test tray according to the first embodiment of the present invention is a cross-sectional view along the line of Fig. 7, 箆R Α闰# ^ from the heart of the 8 Α diagram The figure of the 1C component in the test head, the state of the (four) state, the figure 8 shows the state in which the IC component is pressed to the contact portion of the =, and the ninth figure is along the IX of the seventh figure - [= face diagram, (10) and (10) are enlarged cross-sectional views of the X portion of Fig. 9, the 10th figure shows the figure of the traitor 丄α state, and the figure (10) shows the state where the dry insertion Ρ member is at the lowest position. The table TST is not inserted into the frame member and is relatively raised. The tray TST of the embodiment is as shown in Fig. 6 and Fig. 7: It can accommodate 1 (the plurality of inserts 82 of the assembly, and the frame member 81 such as the β n n - the body 8U, which constitutes the frame member: the following members are formed, and the frame is erected in a lattice shape The body of the frame is at :::812, between the department, the frame, and the corner of the frame body 811 of the frame 812, and between the frame 812

2247-9117-PF 13 200820367 Intersection points, each forming a mounting hole 813 through the front and back of the frame, member 81. in

Each mounting hole 813 is inserted into the F-playing QQ exhibition component 83. Further, the insert 8 is disposed on the lower side of the space 814 surrounded by the frame body 811 and the pivot bar 812, or between the boat and the busy bar 812. ^ Open ^. In addition, in Fig. 6, although only one insert 8 2 ' is illustrated, but the actual @ μ * . ^ 上 'in the present embodiment, a total of 64 inserts 82 arranged in 8 columns and 8 rows are mounted on - Test tray m. As shown in Fig. 7, each of the inserts 82 includes four threshing portions 821 that can accommodate the .ic components. In the present embodiment, four ic sets can be held by the inserts 82. Each of the accommodating portions 821 is formed by a through hole penetrating through the front and back surfaces of the insertion member 82. The periphery of the opening on the lower side of each of the accommodating portions 821 slightly protrudes inward to hold the IC unit. As shown in FIG. 7, the four corner portions of the insert member 82 are only left as a result of the upper portion being recessed into a circular arc shape, and the projecting portions M2 projecting outward are formed at the upper portions of the corner portions of the insert member 82, respectively. . Further, as shown in Figs. 8A and 8B, on the upper surface of the insert 82, the first hole 823' is inserted for insertion of the guide pin 122 of the pusher 121 of the Ic assembly from above during the test. This i-th hole 823 is configured to open toward the space 814 of the frame member. On the lower side of the insert 82, a second hole 824 for inserting the guide pin 52 projecting from the vicinity of the socket 50 pressed by the 1C assembly during the test is inserted. The second hole 824 is disposed so as not to interfere with the accommodating portion 821 or the i-th hole 823. In addition, in FIGS. 8A and 8B, in order to make the relationship between the push j j j , the insert 82 and the socket 5 变得 clear, only each of the inserts 2247-9117-PF 14 200820367 82 is illustrated. One housing portion 821, but actually, as shown above, four housing portions 821 are provided in each of the inserts 82. Further, in the present invention, the number of the accommodating portions provided in the insert is not particularly limited. As shown in FIGS. 7 and 9, the mounting member 83 is composed of the following members, and the cylindrical shaft portion 832 is inserted through the mounting hole 813 of the frame member 81; the locking portion 833 is provided on the shaft portion 832. The front end and the disc-shaped holding portion 831 are provided at the rear end of the shaft portion 832.

The test tray TST described above is configured as follows. As shown in FIGS. 7 and 9, first, the separation inserts 82 are placed on the lower side of the space 814 of the frame member 81. The protruding portion of the insert 82 is hung in the state of the holding portion 831, and the shaft portion 832. is inserted through the mounting hole 813 of the frame member 81. When the shaft portion 832 penetrates the attachment hole 813, the locking portion is expanded in diameter on the surface side of the frame member 81. Thus, the mounting member 83 is fixed to the frame member 81' and the insert 82 is held by the frame member 81. At this time, as shown in Fig. 9, the insert member 82 is stereoscopically stacked with respect to the frame member 81, and the frame member 81 is not interposed between the insert members 82. In this way, the frame member 81 and the insert 82 are three-dimensionally overlapped, and the number of the test trays TST is reduced. Even if the number of measurements is increased at the same time, the stone suppression electronic component test apparatus becomes large. Further, in the present embodiment, as shown in Fig. 7 or Fig. 9, the frame members 81 are used to hold the adjacent protruding portions 822 adjacent to each other. That is, the security device (4) 83, which is disposed at the intersection of the frame body 8 and the frame (4), holds the phase together: the two protrusions δ22β of the insert 82 are inserted into the frame bar 8; 2247 -9117-PF 15 200820367 The mounting member 83' of the 1L 813 is held together like a plurality of protrusions of the adjacent plugs 83. Therefore, since the number of the security members can be reduced, the test tray m can be made smaller. In addition, a male thread portion may be formed at the front end of the shaft portion 832 of the earthquake-preventing member 83, and a female screw portion may be formed in the frame member w, and the female thread portion ' is screwed by the frame member w: . The fixed piece 83 is fixed as shown in the figure 帛0Α and 帛1〇B, and the protruding portions m are formed at the corners of the shape of the present embodiment, each having a flat portion of the input and the inclined surface. The configuration (4) is made up of the pair of mounting members 83/8b. The flat portion is formed in a plane. On the other hand, the tapered portion 822b and the 'inclined surface configuration t 22b whose surfaces are parallel are inclined from the flat portion 822a, as shown in FIG. 10A, and the insert 82 is at the lowest position of the frame member 81. Located in the pair «31 ϋ " a 稷 ' ' and 令 丨 ^ ^ ^ ( ( ( ( ( ( ( ( ( ( ( ( 人 人 人 人 人 人 人 人 人 82 82 人 人 82 人 人 82 82 82 82 82 人 82 82 插入 插入 插入 插入 插入 插入 插入 插入 插入 插入The insert member 82 is opposite to the frame member 81. As the first protruding portion 822 is separated from the holding portion 831 of the mounting member 83, and (4) is enlarged, the insert member 82 is attached to the frame member. For example, the insert U on the right side of the figure is two-way. It moves slightly opposite to the left at 83. The female clothing component then 'inserts... uses its own weight to return to the lowest position of the frame.

2247-9117-PF 16 200820367 82/b, the holding portion 831 of the document member 83 is guided by the tapered portion b of the insert 82, and the holding portion 831 and the flat portion 822a are engaged, and the insert 82 is aligned in the horizontal direction. Member 81 is positioned. σ 2nd and 3rd, the loading unit 300 includes a component transporting device: I c, and the 仗5 托盘 pallet κςτ is replaced with a test tray tst. The carrier device 310 is composed of the following members: the two rails 3U are mounted on the device substrate 11 in the x-axis direction, and the movable arm 312 is reciprocally movable on the lane 311 along the x-axis direction; The movable head 313 is supported by the movable arm 312 and is movable along the movable arm 312 in the x-axis direction.

At the movable head 313 of the unit handling device 310, an absorbing pad (not shown) is attached downward. Moreover, the component transporting device 31 吸附 adsorbs the 1C component from the custom tray KST by using the adsorption cushion, and moves the IC component to release the adsorption of the adsorption pad at a predetermined position of the test tray TST, and the component can be removed from the customized tray. The KST is retrofitted to the test tray TST. This adsorption pad mounts, for example, about eight movable heads 313, and can simultaneously replace eight IC components from the custom tray KST to the test tray TST. When the ic unit is housed in all the inserts of the test tray TST, the test tray TST is carried into the chamber portion 10 0 by the tray transport device 08. On the other hand, when all the components of the customized tray KST are replaced by the test tray TST, the lifting table lowers the empty custom tray KST from the window portion 330, and hands the empty tray to the tray. Transfer arm 2〇5. The tray transfer arm 205 temporarily stores the empty tray in the empty tray storage unit stk 2247-9117-PF 17 200820367-E, and after the custom tray kst of the window portion 43 of the unloading portion 400 side is filled with the assembly, the tray transfer arm 205 An empty tray is supplied to the window portion 430 from the empty disk storage unit STK_E. <Room part 100> The test tray TST described above is loaded into the IC unit after the loading unit 300 is loaded into the unit 1 and tested in the 1C unit while being loaded on the test tray TST. As shown in Fig. 2 and Fig. 3, the following components are used, and the soak chamber 11 is used to apply the target high temperature or low temperature to the assembly of the eight test trays. Stress; the test chamber 12 is placed in contact with the test head 5 in the state of being heated by % stress; and the non-insulated chamber 13 is removed from the 1C assembly that has been tested in the test chamber 12 stress. In addition, the non-insulation chamber 130 is thermally and thermally insulated from the thermal insulation chamber 110 or the test chamber 120, and the area of the thermal insulation chamber J丨0 and the test chamber is maintained at a high temperature or a low temperature, although the non-insulation chamber 130 is maintained. These are thermally insulated, but these are collectively referred to as chambers. The greenhouse 110 is configured to protrude upward from the test chamber 12A. Moreover, as shown in the schematic diagram of m, 'the inner clock device is placed in the inside of the holding chamber no. ' Between the test chamber 12 〇 and the empty space, the plurality of test trays TST-face are vertically transported. Support - face waiting. Mainly during this waiting, the IG component is applied with a thermal stress of about -55 to 15 (high or low temperature of rc. In the test chamber 120, the test head is placed at the center thereof.

2247-9117-PF 18 200820367 The tray TST is moved over the test head 5, and the wheel-in and out terminals of the Jc component and the contact terminal 51 of the test head 5 (refer to FIG. 8B) are electrically contacted. Test of component c. This test result is memorized in the memory of the electronic component test apparatus based on, for example, the address determined by the identification number attached to the test tray TST and the number of the Ic component assigned inside the test tray TST. Thinking clothes

The non-insulation chamber 130 is also disposed in the same manner as the heat retention chamber 110, and is disposed above the test chamber 120. As shown in the schematic diagram of the brother 3, a vertical transport device is provided. However, in the non-insulation chamber 13 〇, in the case where the ic component has been applied with high temperature in the holding chamber 11 ', the Ic module is cooled by the air supply, and after returning to the room temperature, the heat-removed IC component is moved to the unloading section. 4〇〇. On the other hand, when the low temperature is applied to the 1C module, the 1C module is heated to a temperature at which condensation does not occur by heating air or a heater, and then the heat-removed 1C module is moved to the unloading. Department 4〇〇. An inlet for carrying the test tray from the device substrate u is formed in the upper portion of the heat insulating chamber 110. In the sample, a port for moving the test tray tst to the device substrate n is formed on the non-insulated upper portion. On the device substrate u, a tray «loading/12 ^ pallet handling device 12 for immediately taking the test tray TST from the chamber portion via the inlet or the port is provided, for example, by a rotating roller (four). Using the (6) general transport device 12, the test (5) tst., which is carried out from the non-insulation chamber 13A, is transported back to the heat preservation chamber (1). <Unloading unit 400> 2247-9117-PF 19 200820367

The unloading unit 400 is a test 牦 τ τ τ τ τ τ τ τ 测试 测试 τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ Custom pallet KST. As shown in Fig. 2, four window portions 430 are formed on the device substrate u in the unloading portion, and the book tray KST placed in the unloading portion 400 from the storage portion is placed on the upper surface of the device substrate n. The unloading unit 400 includes two unit conveying devices 41A that replace the tested 1C components from the test tray m to the order tray (10). Each component handling device 41. It is composed of the following members: two rails 4u are mounted on the y-axis direction frame (4) on the device substrate n; the movable arm 412 is reciprocally movable on the rail 411 along the γ-axis direction; and the movable head 413 is It is supported by the movable arm 412 and is movable along the movable arm 412 in the z-axis direction. In the movable head 413 of each unit conveying device 410, about eight suction pads (not shown) are attached downward, and eight 1C modules can be simultaneously loaded from the test tray TST to the custom tray KST. Although the illustration is omitted on the lower side of each window portion 430, the elevating table for ordering the custom tray KST is placed, and the custom tray KST filled with the tested 1C assembly is lowered again, and This full-load tray is delivered to the tray transport arm 205. By the way, in the electronic component test apparatus of the present embodiment, the number of types of cutters can be up to eight types, but the number of the device substrates U at the time of unloading is only four. Form the window. Therefore, there are only four custom pallets KST in the unloading section. Therefore, the types that can be sorted in real time are limited to four types. 2247-9117-pf 20 200820367 - Although the classification of good products into three types of high speed, medium speed, and low speed, plus 4 kinds of defective products is enough, but there are infrequent occurrences, for example, need to Tests and the like do not fall into the above categories. In the case of the clerk, the clerk is classified into one of the types other than the four custom pallets KST that are assigned to the window portion 43° (4) of the unloading unit 4 (the condition of the component = ', and one from the unloading unit 400) The customized tray KST is sent back to the storage unit 2, and instead, the customized tray kst assigned to the newly generated type is transferred to the unloading port P400, and the IC component is stored. However, in this case, the classification must be classified. In the middle of the operation, there is a problem of the productivity: the electronic component testing device of the present invention is configured such that the buffer portion 420 is disposed between the test tray TST (four) portion 43A of the unloading portion 4〇〇, and The 1C component of the type that does not occur frequently is temporarily stored in the buffer portion 420. As shown in the above, in the present embodiment, the frame member 81 and the insert 82 are stereoscopically stacked in the test tray TST because the insert and the frame are made. Since the member 81 is overlapped, the test tray TST can be reduced. Therefore, it is possible to suppress an increase in the size of the electronic component test apparatus due to the increase in the number of simultaneous measurement. [Second Embodiment] Fig. 11 shows the second aspect of the present invention. The first test for the first embodiment of the two-disc and tray transport Fig. 12 is a cross-sectional view showing a second test tray and a tray transporting device according to a second embodiment of the present invention. The first test tray TS1 of the present embodiment is as shown in Fig. 11 The portion of the frame body 811 of the busy member 81 has a structure similar to that of the test tray TST of the first embodiment except that the portion of the frame body 811 of the busy member 81 is slightly protruded downward in the downward direction 2247-9117-PF 21 200820367 2. Here, the first test tray TS2, the insert The lower end surface of the frame body 81J is relatively protruded by a distance hi from the lower end surface of the frame body 81J. As shown in Fig. 12, the second test tray TS2 is a test tray using the insert 85, and the frame member 84 is located at the insert. Between 85. In the second test, the tray TS2, the insert 85 also protrudes from the lower end surface of the frame body toward the lower direction by a distance h2. The distance ^ and the distance h2 are substantially the same or similar (hi and h2). As shown in the description of the first embodiment, the test tray is returned from the unloading unit to the loading unit 3 by the pallet transporting device i 12. The pallet handling device 12, as shown in Fig. 12 and Fig. 12 As shown in the figure, with ··Rotating wheel 1 2&amp;&gt; is in contact with the lower surface of the test trays TS1 and TSk frame bodies 811 and 841; and the shaft 12b' supports the rotating roller 12a, and the rotating roller 12a is rotated by the power of a motor (not shown) connected by (m)m. Thereby, the test trays TS1 and TS2 are transported. In the present embodiment, the inserts 82 and 85 are the same as the frame bodies 8ΐ, 84ΐ^(four)μ(four)hl'h2#, so the inserts 82 and 85 do not interfere with the shaft 1 2 b. Thus, the same tray handling device 12 can be used to carry the test trays 1S1 and TS2 of different types, which can be different from the use of the existing inserts 85. Further, the embodiments described above are for the purpose of facilitating the understanding of the present invention and are not intended to limit the present invention. Therefore, all of the elements of the above-described embodiments, including the design changes or equivalents of the technical scope of the present invention, are also included.

2247-9117-PF 22 200820367 [Brief Description of the Drawings] FIG. 2 is a cross-sectional view showing the electronic component test clothes of the first embodiment of the present invention. Brother 2 is a three-dimensional diagram of the electronic component test of the first embodiment of the first embodiment. Element Measuring Device Measuring Device Measurement Fig. 3 is a view showing the processing of the electronic fitting correction disk according to the first embodiment of the present invention...

Fig. 4 is a view showing the decomposition domain ff1 of the electronic cradle (4) of the ninth embodiment of the present invention. Fig. 5 is an exploded perspective view showing a custom tray used in the electronic test apparatus according to the first embodiment of the present invention. Fig. 6 is a perspective view showing the first embodiment of the present invention. Fig. 7 of the trial tray shows a first enlarged perspective view of the present invention. Fig. 8A of the test disk of the embodiment is a diagram of a state in which the 1C: member is pressed before the contact portion of the test head, along the line of the line of Fig. 7 . The δ Β diagram is a cross-sectional view along the line of the Li Yi Shan line of Fig. 7 A diagram in which the 1 Å component is pressed against the contact portion of the test head. Fig. 9 is a cross-sectional view taken along line κ _ κ of Fig. 7. ♦ The enlarged cross-sectional view of the ninth part of Fig. 9 is a view showing a state in which the insert member is at the lowest position. Fig. 10 is an enlarged cross-sectional view showing the X portion of Fig. 9, which is a view showing a state in which the frame member is relatively raised. 2247-9117-pf 23 200820367 Fig. 11 is a cross-sectional view showing a first test tray and a tray transport device according to a second embodiment of the present invention. Fig. 1 is a cross-sectional view showing a second test tray and a tray conveying device according to a second embodiment of the present invention. [Description of component symbols] 1 Processor 12 Pallet conveying device 12a Rotating roller 12b Axis 100 Chamber 121 Push rod 122 Guide pin 5 Test head 50 Socket 52 Guide pin TST test tray 81 Frame member 811 Frame body 812 Frame strip 813 Mounting hole 814 space 8 2 insert 821 accommodating portion 2247-9117-PF 24 200820367 822 protruding portion 822a flat portion 822b tapered portion 823 first hole 824 second hole 83 mounting member 831 holding portion

2247-9117-PF 25

Claims (1)

200820367 X. Patent application scope: 1 · A test tray for 4, including a plurality of inserts capable of accommodating the electronic component to be tested, and a frame member for holding the insert, used for testing the electronic component to be tested The electric device is electrically conveyed in a state in which the plurality of electronic components to be tested are accommodated, and the insert member is substantially orthogonal to the main surface of the test tray for the frame member. direction. Phoenix 2 2. A test tray as claimed in the scope of claim 1 of the invention, wherein the insert is arranged to be stacked on the frame member in a direction substantially orthogonal to the main surface of the test tray. 3. The test tray of claim 2 or 2, wherein the plurality of inserts are disposed adjacent to each other along a direction substantially parallel to a main surface of the test tray, without the frame member intervention. 4. The test tray of claim </ RTI> wherein the frame member has: _ a frame body that forms an outer circumference of the frame member; and a frame strip erected within the frame body; the insert member has: 1 hole' is inserted in a direction substantially orthogonal to the main surface of the test tray, and a part that is relatively close to the test tray from the side of the frame member; and a hole 2 of the hole is attached to the test tray The main surface is substantially orthogonal to the part that is relatively close to the test tray from the side of the insert, &quot; 2247-9117-PF 26 200820367 The first hole is configured to be in the frame body and the frame Between or between the frame strips, the second hole is disposed so as not to interfere with the ith hole. 5. The test tray of claim 1, wherein the test tray further includes a mounting member that mounts the insert to the frame member at a corner of the insert and holds the insert in a swimgable manner A frame member; a plurality of adjacent inserts are held together with the frame member by a mounting member. 6. The test tray of claim 1, wherein the insert member moves relative to the frame member by a direction substantially orthogonal to a main surface of the test tray. In a direction in which the main surface of the test tray is substantially parallel, the insert is switched from a state in which the frame member can swim or a state in which the frame member is in a state of being positioned or a state in which it can be moved. 7. An electronic piece testing device comprising a measuring tray having a plurality of inserts for receiving the electronic component to be tested and a frame member for holding the insert, in order to test the electronic component to be tested The test electronic component is housed in the test tray, and the test tray is carried into the test portion, wherein the test tray, the insert member is located on the main surface of the test tray f ± orthogonal direction. ...the electronic component testing device of claim 7, wherein the test (4) includes a first test tray, and the plurality of inserts 4 are arranged adjacent to each other without the frame member intervening; 2247-9117- PF 27 200820367 弟] and 4 trays are stacked on the frame member along the square sides of the pair of β 仏 〜 〜 广 或 or the main surface of the tray. 9. The electric power of the test tray according to item 7 of the patent application includes: the other type of display/intermediate parts are arranged adjacent to each other, and the first test tray is inserted into the plural type without the frame member. And the second measuring tray 4, wherein the frame member is interposed between the adjacent inserts, and the inserts of the first and second test trays are held by the frame member in pairs Relatively protruding the established distance. 2247-9117-PF 28