TWI373626B - - Google Patents

Description

I3-73626 IX. INSTRUCTION DESCRIPTION OF THE INVENTION: Technical Field of the Invention The present invention relates to an electronic component test cymbal disk electronic component test method which makes semiconductor integrated circuit components respect various electronic components (hereinafter also representatively The contact portion of the IC component) and the test head are electrically contacted to 'retest the 1C component. [Prior Art] An electronic component testing device called a processor is used in the process of manufacturing an electronic component such as a 1C device, in order to test the performance or function of a 1C device in a packaged state. In the processor, from the tray accommodating a plurality of IC components, 1 (the component is supplied to the contact arm' by which the contact arm presses the component against the test head, and 1 (the contact pin of the component is input to the terminal and the contact pin of the socket Electrical contact, after the electronic component test device body (hereinafter also referred to as a tester) performs the test of the IC component 1 at this state, at the end of the test, each H cow is discharged from the test head by the contact arm, and is adapted to The result of the tray is tested, and the classification of the good or the type of the product is performed (for example, refer to Patent Document i). Coupling = Processor 'The IC component is executed in a state of applying a high or low temperature heat to the IC element: force In the test, the IC element before the test is heated or cooled in advance by using a heating plate or the like before the contact arm is supplied. Further, during the period from the heating plate to the contact arm by burying the heater or the like in the buffer for carrying the 1C element Also maintained in thermal stress. f tIc applied by several pieces

2247-9582-PF 6 It is difficult to keep only the heaters that are buried in the buffer table. The two I's actually carry and wait for the buffer table. The component becomes cold or hot, and when the IC component is actually tested, there is a case where the thermal stress applied to the component is not maintained. Patent Document 1: International Publication No. 03/〇75〇23 Manual [Summary of the Invention] [Problems to be Solved by the Invention] The problem to be solved in this month is to provide an electronic component testing device and an electronic component testing method. The test is performed to maintain the state of applying the desired thermal stress to the electronic component under test. [Means for Solving the Problem] (1) In order to achieve the object, according to a first aspect of the present invention, an electronic component testing device is provided for electrically connecting an input/output terminal of a tested electronic component to a contact portion of a testing society (4) And performing the test of the electronic component to be tested, comprising: contacting the arm, moving the electronic component to be tested and pressing on the contact portion; and carrying the test system to carry the tested electronic device The element and the first temperature adjustment means heat or cool the test electric + element force σ carried by the conveyance system from above. The invention is not particularly limited, and the first temperature adjustment means is to be measured. When the tested electronic component is moved to the handling system, it is preferable to heat or cool the electronic component to be tested before the test, in the waiting position of the electronic component to be tested before the test. Although not particularly limited, the ith temperature adjustment means has a direction

2247-9582-PF 7 1373626 The air supply means for blowing warm air or cold air of the electronic component to be tested is preferred. The invention is not particularly limited, and includes a second temperature adjustment means for thermally or cooling the electronic component to be tested in a state in which the contact arm is held from below. (2) In order to achieve the object, according to a second aspect of the present invention, there is provided an electronic component testing apparatus for electrically contacting a contact portion of an input/output terminal of a tested electronic component and a terminal of the test 4 to perform the test. The electronic component test includes: a contact arm that moves the tested electronic component 'and presses the contact portion; and a second temperature adjustment means that is in a state of holding the contact from below The electronic component to be tested is heated or cooled. The invention is not particularly limited, and the second temperature adjusting means can be moved outside and outside the operating range of the contact arm.

In the invention, the second temperature adjustment means preferably includes a blowing means for supplying warm air or cold air to the electronic component to be tested, and a cover member covering the periphery of the electronic component to be tested. The invention is not particularly limited, and includes a plurality of contact arms; and when one of the contact arms moves the electronic component to be tested to the contact portion and is pressed again, the second temperature adjustment means is the other one. It is preferable that the electronic component to be tested in a state in which the contact arm is held is heated or cooled. (3) In order to achieve the object, according to a third aspect of the present invention, there is provided an electronic component testing method for electrically contacting a contact portion of an input/output terminal of a S-type electronic component to be tested with a test head The test of the test _ _ 牛 includes the supply step of supplying the contact arm to the contact

2247-9582-PF 8 test electronic component. The component is pressed in the connection (4) = step screw, the contact arm contacts the tested electronic element with "P", and then the tested 70 step is performed, and the contact arm is 70 The test is carried out; and in the supply step, the electronic component to be tested is carried out from the upper part of the Ministry of Education, although the invention is not particularly characterized: the test electronic component is heated or cooled. Xionghe is specially limited, and the tested electronic components are anchored in the poor...β (4) ϋ ϋ ϋ ϋ ' ' ' 在 在 在 在 在 在 在 在 在 在 在 在 在 在 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置The invention is not particularly limited to ππ although it is not particularly limited. The tested electronic component is preferably heated or cooled to the front of the test. According to the fourth aspect of the present invention, the branch contact is provided with a plurality of contacts that can be moved independently of each other to make the tested electronic The wheel-out contact of the component is electrically contacted. The test head is connected to the m-head w. Then the test component of the tested electronic component is re-ordered. (4) Method 'In the case of the connection (4), the dust is in the contact portion. The broken test electronic component of the shape L held by the contact arm of the piece can be heated or cooled. In the invention, although the state around the member to be held by the other contact arm is not particularly limited, it is preferable to blow warm air or cold air to the electronic component to be tested. . [Effect of the Invention] (1) In the present invention, the electric power to be tested is supplied to the electronic component to be tested by the i-th temperature adjustment means, and the electric power to be tested, which is carried by the transport system, is heated or cooled. The arm can prevent the tested electronic components from being cold-bited until the test is performed to maintain the desired thermal stress on the electronic component under test.

Status of 2247-95S2-PF 9 1373626. In particular, in the present invention, since the upper surface of the electronic component to be tested 7G is not heated or cooled by the first temperature adjusting means, the electronic component to be tested can be efficiently cooled or heated. In the present invention, the electronic component to be tested which is in the waiting position is heated or cooled by the first temperature adjustment means, and when the tested electronic component is carried out, the test before the test can be suppressed. The tested electrical components are cooled or become hot. (2) In the present invention, the electronic component to be tested in a state in which the contact arm is gripped from below by the second temperature adjusting means is heated or cooled, thereby suppressing the electronic component to be tested from being stored in the contact portion of the other contact arm. It gets cold or hot during the taking period. According to the present invention, the second temperature adjusting means can be moved inside and outside the operating range of the contact arm, and the space saving of the electronic component testing device can be realized. For example, the second temperature adjustment means may be disposed to overlap the positioning means for positioning the electronic component to be tested held by the contact arm to the contact portion relatively. In the present invention, the electronic component to be tested can be collectively heated or cooled by the 帛2 temperature adjustment means by covering the circumference of the electronic component to be tested by the cover member. (3) In the present invention, by supplying the electronic component to be tested from above, or cooling, to supply the electronic component to be tested to the contact arm, the electronic component to be tested can be cooled or heated. By performing the test, the state in which the desired thermal stress is applied to the electronic component to be tested can be maintained.

2247-9582-PF 1373626 In particular, in the present invention, since the electronic component to be tested is heated or cooled on the upper side of the input/output terminal, the electronic component to be tested can be cooled or changed with high efficiency. heat. In the current month, by heating or cooling the electronic component to be tested before the test of the waiting position, when the tested electronic component is removed, the electronic component to be tested before the test is cooled or the waiting test may be cooled or Getting hot. (4) In the present invention, since the electronic component to be tested in a state in which the other contact arm is held is heated or cooled during the period in which one of the contact arms is accessed to the contact portion, it can be suppressed in one side. The electronic component under test held by the other contact arm in the access of the contact arm becomes cold or becomes hot. In the present invention, since the electronic component to be tested is heated or cooled in a state of covering the periphery of the electronic component to be tested, the electronic component to be tested can be collectively heated or cooled. [Embodiment] # Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 1 is a plan view showing an i-th embodiment of the electronic component testing apparatus of the present invention, wherein Fig. 2 is a cross-sectional view taken along line π _ π of Fig. i, and Fig. 3 is a view showing a second figure. Schematic diagram of the processing elements of the electronic component testing device and the processing method of the customized tray. In the electronic component testing apparatus according to the first embodiment of the present invention, a state in which a temperature stress of a high temperature or a low temperature is applied to an Ic 7C member is tested (checked) whether the ic element is properly operated, and the components are classified according to the test result. The apparatus, as shown in FIGS. 1 to 3, includes a processor 1A, 2247-9582-PF 11 1373626, a test head 5, and a tester 7', and the test head 5 and the tester 7 are connected via a cable 8. The processor 10 is composed of a storage unit 1 〇 , a transport unit 2 〇 , and a test unit 30 〇 . The storage unit 100' stores a plurality of customized trays KST' that have received the IC components to be tested in the future, and stores a plurality of customized trays KST that accommodate the ic components that have been tested in response to the test results. The transport unit 200 takes out the Ic element before the test from the storage φ unit 100, and supplies the test unit 3 〇 0 after applying a predetermined thermal stress to the 1C element. Further, in the test portion 3, the contact arms 321, 331 press the 1C element against the socket 6 of the test head 5, and the tester 7 performs the test of the ic element via the test head 5 and the electric head 8. The IC components that have been tested in the test unit 3 are transported out from the test unit 3 by the transport unit 2, and are sorted to the custom pallet kst in response to the respective test results, and stored in the storage area. Department 1〇〇. <Storage Unit 1〇〇&gt;

, &amp; ^ ^ * Figure 1V - W line cross-section, Figure 5 Figure 7 = 4 V-V line cross-section, Figure 6 shows the first... No electronic component test device Moved along the νπι line of Fig. 4: Fig. 7 of the thousand-face diagram, νϋ, deep section view, the memory diagram of the electronic component test device shown in Fig. 8 shows the first figure Figure - Interpretation of the perspective view, Figure 9 is a perspective view. In the custom tray storage unit 100 of the electronic component testing device, as shown in the third 12th, first tray transfer arm diagram and FIG. 4, 130, setting board 14〇, including the loading and unloading unit, the second tray transfer unit arm

2247-9582-PF 12 1373626 150 and the array storage unit ι6〇β, as shown in FIG. 3, the handling of the custom tray KST between the access port no and the array storage unit 16〇 is carried out by the loading and unloading unit 120. The first tray transfer arm 130 is transported, and the transport between the array memory unit 160 and each of the window portions 17A is performed by the second tray transfer arm 150 and the setting plate 140. As shown in Figs. 4 and 5, the carry-in/out unit 1.20 is composed of a support device 121, a first lifting device 122, and a slide device 123.

The support device 121 can support a plurality of custom pallets KST, and can be moved in the left-hand direction by an actuator (not shown) when the custom pallet KST is transferred between the lifter and the i 122 (Fig. 4) The arrow direction) slides and retreats. The support device 12 is provided in an entrance/exit 110 (hereinafter simply referred to as an access port 11A) that the operator can uniquely access to the storage unit. The operator can input and carry out the order tray kst only through the access port 110. In this way, in the present embodiment, it is possible to prevent human error by limiting one of the loading trays for the custom tray of the storage unit 1 (for example, the operator sets the custom tray KST in the phase). The left-handed, 祁', storage 窈), or the automation of handling outside the processor 10. Further, in the present invention, the number of the access ports 110 is not limited to one, and for example, it is also possible to break the λ hit m, and the knives are slid into the dedicated access ports for exclusive use and unloading. ' , , 10 ν judgment factory, small, consists of components, Ζ axis direction track d 22 d / 〇 Z Z axis direction set · · Lifting member 122b, is in the z-axis ancient A station, * 1rt and oyster The axial direction rail 122a is disposed such that the first lifting device 1 22, #粒i &quot;, + &gt; is reduced by accepting the customized tray, A wind Γ IT, which is input to the access opening 110 from the support device 121, Via the opening

2247-9582-PF

[51 13 1373626 The custom tray coffee is carried into the storage unit (10) and the inner tray KST is delivered to the slide unit 123. The integrator is configured as shown in Fig. 5 and Fig. 6, and the two γ-axis squares * red, * are from the lower member 1 under the lifting device m = 2 Γ, along the ¥ The axial direction is set to slide in the direction of the first and the sliding member axis. As set, it can be set along. Interval and configured as the first! The hoistway direction track 123a is separated by a door. Also, ^ lifting device 122 can pass these tracks! Further, between the 23a, the swaying member 123b can be separated from the ## &amp;#盘KST in the form of a lamination, and a gap is formed in order to maintain the interference of the plurality of custom-made pallets c 2 descending members 122b: P123ce sliding device 123 The staples received from the first lifting device 122 are moved in the γ-axis direction and then transferred to the first tray transfer arm 130'. The disk transfer arm 130 is as shown in FIGS. 4 and 5, The member comprises: a 'axis-axis direction track 13 is disposed in the entire area of the upper portion of the magazine 100 along the X-axis direction; and the x-axis direction track 132 is disposed on the X-axis direction track 131 so as to be movable up and down; 133, which is arranged to be movable up and down on the x-axis direction guide 132; and an open-close type gripping claw 134 which is disposed on the lower side of the holding head 133 and which can hold a plurality of custom trays KST at the same time. The direction rail 131 is shared by the first tray transfer arm 13A and the second tray transfer arm 〇5.

When the first tray transfer arm 130 receives the customized tray kst from the slide device 23, after the holding head 133 is raised along the y-axis direction rail 132, the y-axis direction rail 132 is along the y-axis direction on the y-axis direction rail 131. After moving, the customized tray Kst is handed over to the 2nd liter 2247-9582-PF drop 163 in the array storage unit 1 60. The structure of the IS register is shown in Fig. 4 and Fig. 7, and the trays KST. are stored in the following state: the movable storage/16 is stored in a stacked state, and a plurality of predetermined axis directions are slid 162, which is a storage device. The 161 is held to permit the transfer of the customized tray KST between the tray transfer arm 161 along the 130, 150 and the storage and second lifting device 163. In the array memory cover 1Rn and the plurality of reservoirs 161 shown in FIG. 4 and FIG. 4, the array is stored in an array of 3, and in the present embodiment, a total of 36 fragments β 161 are arranged to be 4丨1 continuously. Implement it. Therefore, in the present embodiment, by selecting the test of the 1c component, the preparation time can be reduced, and the number of classifications of the test results can be increased (the number of types in the array needle is as shown in FIG. 3). At the beginning of the test, 2 columns of memory cells (10), 16 storage states 161 located in the row ~ 4 columns and 4 rows (in the case of q country Λ ^ capacity has been measured, the memory represented by the UL number), assigned : 广 丨 丨 件 件 件 件 件 件 件 件 件 件 件 件 件 件 件 件 件 件 件 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订 订The custom pallet KST of the component, the storage of the pair Π 4 registers 161 (after the symbol ET in Fig. 3, the door is not loaded with the empty custom pallet KST of the 1C component. However, the test is based on The test result will be Ic in the 1 column and 1 row, ... 2:: = the first batch of IC components, the second in the 1 column and 4 rows of memory m's health of the tested κ component. The difference between the good and bad products of the tested Ic components

2247-9582-PF

[15 1373626 Others are classified into high-speed, medium-speed, and low-speed, even in the case of good products, or are classified into several types, such as those who need to be retested, even in defective products. As shown in Fig. 8, each of the accumulators 161 includes a frame-shaped tray support frame 161a and an elevator 161b which is accessed from the lower portion of the tray support frame i61a and can be lifted up and down. In the tray support frame 161a, a plurality of subscriptions will be made.

The pallets kst are stacked, and only the stacked custom pallets KST are moved up and down by the elevator i6ib. In addition, since the array storage unit single sheet 1 w V/-η-t 1 D1 has the same configuration, in the present invention, the storage of the customized tray KST before or after the storage test is appropriately set as needed. The number of devices or the number of storages that store empty trays. By the way, in the custom-made tray KST of the present embodiment, as shown in FIG. 9, the trays for arranging a plurality of recesses for arranging the contents of the trays are arranged, and the 1C components before the test are accommodated. The custom tray, the custom tray that has been tested for the IC TG parts, and the custom trays that are empty of the unloaded parts are all trays of the same shape. For each of the ::: storage unit 160, as shown in FIG. 4, the slide device 162 includes: 2 sub-meters: m each. The sliding device 162 is as shown in Fig. 7, the sliding member H2b is disposed in the x-axis direction of the tether system; and the sliding in the axial direction is 2; the rail 162a is disposed so as to be along the Υ^ direction track 162a and the above As shown in the figure, the γ-axis-one-figure lifting device 〖, 123a, as shown in the figure, is arranged such that the second juice-reducing member 163b can pass through the trajectory 162a.

2247-9582*PF

[S] 16 1J/J626. The sliding member 62b holds and lifts the dream fan 51 and forms a notch portion in the array memory unit 160 in order to avoid interference with the lifting mechanism of the 162c 163, the second difference, and the d for each of the erroneous devices m As shown in Fig. 4, Fig. 163, the 1 m lifting device is arranged along the z-axis side, and the track m # lifting member 163b is attached to the Z-axis direction rail 13 along the z-axis side. The i5V is set to be lifted and lowered. The lifting mechanism #16 flap can be raised and lowered between the tray transfer arms. ^The operating range of the lower sliding device (6)

When the customized tray kst stored in the storage ΐΓ=σ11° is stored in the array 160, the second lifting device 163 rises from the sliding device 1 to the storage 161 and has moved to the array storage: the first tray transfer arm 13. After the custom tray KST is delivered to the health "J tray KST is stored in the storage, the second lifting device is lowered, and the reservoir 161 is returned to the sliding device 162 to return to the original position. I set 162 face to be customized The tray KST is supplied from the array storage unit 丨 to the window m, and is moved by the sliding device 162 and early; the 6 liter drop device 163 is raised, and the storage 161 is moved from the sliding device = lowering device 1' the second lifting device 163 is raised again, and the second = 疋 150 takes out the customized tray kst from the stalk 161. After the = tray KST, the second lifting device 163 is lowered, and then the two-1 is handed over to the sliding device 162' sliding device 162. Go to the original location.

2247-9582-PF 1373626

As shown in Fig. 4, the second tray transfer arm i5 is constituted by the following members: the Z-axis direction rail 151 is disposed on the X-axis direction lane 131 of the first tray transfer arm 〇3〇 so as to be oriented toward the χ-axis direction. Sliding; the two gripping heads 152' are arranged to be movable up and down in the y-axis direction rail 151; and the opening and closing gripping claws 173 are provided on the lower side of the gripping head 152, and can be held by one. Ding tray KST. Further, in the present invention, two gripping heads! 52 can also be moved independently of each other in the direction of the x-axis. Further, in the present invention, it is also possible to hold the plurality of custom pallets KST while holding the gripping claws 153. The second tray transfer arm j 5 receives the customized tray mi from the reservoir 161 held by the second lift unit f 163 by the one grip head i 52, and the other grip head 152 The custom pallet kst that is empty or filled with the IC component is accepted from the lowered setting board 140, and the new custom pallet is handed over to the setting board 140 by the one gripping head 152. A plurality of (in this example, nine) f-parts m' are connected to the main base n of the processor 10 via the respective window portions 170 to connect the storage portion 1 to the transport portion. Each of the lower portions of the respective window portions 170 is provided with a setting plate 14A that can be raised and lowered while maintaining the state of the customized tray KST. Seesaw 140 from the first? | M ^

The tray transfer # 1 50 accepts the custom tray KST and then the upper tray, and then passes through the window portion 1 7 n 丁 e the tray kst is located in the transport unit 2〇〇. In the present embodiment, for example, 斟1歹J, as for the second and second window portions 17〇 on the left side of Fig. 3, deducts % IA_~ before sending the IC element KST before the valley test (in Fig. 3) In the middle of the symbol, I tray, cc, sub-indicator LD), on the left side of Figure 3, 4, 5, 6 and 9 window parts 1 7n

, A p 170, the private meter used to test the IC component containment and classification, &lt; Α π I tray KST (in the 3rd figure, the symbol is 讥

2247-9582-PF

[S3 18 !373626 shows). When the new custom tray KST is stored in the array storage unit 16A, the worker inserts the custom-made tray m into the access port 110, and uses the loading/unloading unit 12. The order tray KST is carried into the array storage unit (10) and stored in the storage unit 161.

Next, in the case where the pre-housing test 1 (the custom-made tray m of the component is supplied to the transport unit 200, the storage device η moved by the slide device 162] 2 the second elevating device 163 is raised', and the second tray transfer arm 150 From the storage of $16!, the customized tray KST is accepted and delivered to the setting board 14A. Then, the setting board &quot;0 is moved toward the window portion 17. The custom pallet portion 200 is customized. The order of the window portion 17G will be set. All the untested on the tray KST! = When the transport unit 200 is supplied, the setting plate 14 is lowered from the window portion m, and the opening == the delivery arm 150 receives the customized tray from the setting plate 140. The line 2 = the disk KST is handed over to Array memory ... 6. Located in the first (仃 储存 161. ^ 二 方 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = And the second tray transfer arm 15. From the setting plate 14. The tray kst' and the custom tray m is handed over to 163 Ji ^, the brother 2 lifting device I. Components: tray;:: 'for the pallet KST The window portion 17A is supplied from the storage H 161 located in the ninth row to the empty custom tray ks via the second ::sub...setting plate 140 And # 150

2247-9582-PF 1373626 Further, when the custom tray kst stored in the array storage unit 160 is moved to the access cassette 110, the tray transfer arm 130 in the array storage unit (10) is used from the second lifting device i. 163 ascending storage 161 (4) KST 'The first tray transfer arm (10) is again transferred to the carry-in/out port 120, thereby moving the custom tray KST to the access port. <Transportation Department. 200> The 10th picture is along the first! Fig. χ - a sectional view of the χ line, and (4) is a sectional view showing the 帛 2 temperature adjusting device of the electronic component testing device shown in Fig. i. As shown in Fig. 1, the transport unit 200 includes a transport device 21, a teaching plate 220, and two transport systems 23A and 24B. As shown in Fig. 3, the transport unit 200 is taken out at a custom tray KST located in the window portion 170. The ic element before the test is applied with a predetermined thermal stress, and is supplied to the test unit 3A, and can be moved to the storage unit 1 while classifying the 1C element that has been tested. As shown in Fig. 1, the conveying device 210 is composed of the following members, and the supporting rails 21 are disposed on the main base u of the processor 1A along the γ-axis direction to provide two movable rails 212' to the two supporting rails 211. Supported to be movable along the x-axis direction; and two movable heads 213, 214 supported by the movable rail 212 so as to be movable independently of each other in the "direction". Each of the movable heads 213, 214 is mounted on the lower side of each of the movable heads 213, 214 The eight adsorption ports are movable in the z-axis direction by an actuator not shown in J. The conveying device has a window portion m including all of the storage portion 100, a heating plate 220, and a conveying system 23G. For example, in the present embodiment, the first movable head 213 serves as the first to fifth window portions 170 from the left side in FIG.

2247-9582-PF 20 丄 473626 conveyance between the first buffer table 231, and the second movable head 214 serves as the third figure from the left side of the sixth to nine window portions 17A and the second buffer table 241 Handling. The conveying device 210 simultaneously transports eight untested IC components from the custom tray KST located in the window portion 17 of the storage portion 〇 to the heating plate 220, and after applying a predetermined thermal stress to the heating plate 220. Further, the 1 (: το) is moved from the heating plate 220 to the buffering units 231 and 241 of any one of the transport systems 23A and 24〇. The heating plate 220 is provided with a heat source (not shown) in the lower portion, for example. The metal plate can apply high temperature thermal stress to the tested Ic element. On the upper surface of the heating plate 220, a plurality of recesses 221 for accommodating the 1C element are formed. Further, for example, the thermal stress applied to the 1C π member is not Then, in the case of a high temperature, the heat source can be placed on the buffer tables 23i and 241 without applying thermal stress to the IC element during the period of being accommodated in the i-th buffer stage 2 31 via the "addition" or the plate 2200. As shown in FIG. 1 and FIG. 1 , the first conveyance system 230 is composed of a first buffering operation 23 and an upper air supply device 232 and a first lower air supply device 233. The first buffer table 231 is provided. It is composed of the following members, a substantially flat moving member 23 la' The transporting device 21 is placed. The transported Ic element 2 and the Y-axis direction track 23 Id are provided on the main base u of the processor 1A along the Y-axis direction. The moving member 231a of the first buffer table 231 By moving the track 231 in the Y-axis direction (1 along the γ-axis direction, the carrier device area and the mobile device 310 of the test unit 300 can be moved.

2247-9582-PF ί S3 21 1373626 1 The movable area of the movable head 320 reciprocates. On the surface of the moving member 231a, 16 recessed portions 231b and 231c for accommodating the Ic element are formed. In the first embodiment, the untested Ic elements are accommodated in the eight loading recesses 231b arranged in the upper two rows and four rows in the first drawing, and the eight unloaded in the second row and the four rows arranged in the lower side in the first drawing. Use a recess. Contain the C component that has been tested. c. The first upper air blowing device 232 is fixed to the left end of the first buffer table 231 as shown in FIG. 10, and includes a cover member 232 &amp; having a size that can cover the eight loading recesses 23lb; and an air outlet. 23 Torr is provided at the bottom of the cover member 232a so that the warm air is blown downward. Each of the blowout ports 23A is disposed so as to correspond to the arrangement of the loading recesses 231b of the first buffer table 231, and is connected via the pipes 234 (see the center of the center). In the present embodiment, the first contact arm 321 places the tested 7L pieces on the first buffer table Β*, and the ^u carry-out recesses 231c are provided by the first upper side air blowing device 232. It is possible to prevent the 1e element from being cooled before the test is carried out by the 1C element when the 1C element is completed, and the moving 6w mountain cover is opposed to the loading recess 231b. At this time, since the first upper side air blowing means 232 does not draw out the junkian warm air to the upper and lower sides of the input and output terminals, the thermal stress applied can be efficiently performed. Keeping the first lower side air blowing device 233 of the IC 7L member as shown in the first G-figure and the first vertical direction in the J-th pound 1 map, between the two, including the first medium aligning device 340 Cover member 233a, and has a frostable | &amp; J cover contact arm 321

2247-9582-PF IS] 22 ^.73626 The size of the 1C element to be held; the air outlet 233b is provided at the bottom of the cover member 2333 so as to blow warm air upward; and the γ-axis direction rail 233c is processed The main base u of the device 1 is disposed along the γ-axis direction. The cover member 233a is moved in the γ-axis direction on the γ-axis direction rail 233c, and can be in the first! The upper portion of the alignment device 34 and the lower portion of the U-side air supply device 232 reciprocate. Each of the air outlets 2 is disposed so as to correspond to the IC components that are held by the contact arm 321 and is connected to the warm air supply device 234 via the respective packages. In the embodiment of the present invention, the second lower arm 331 is accessed by the first lower side air blower 233, and the first lower side air blower 233 is held by the first buffering operation a 9qi. The IC component is blown down to suppress the 1C component before the test is cooled. Second, by setting the first T side air blowing device 233 to the punching table 231 and the aligning device 34 〇 ^ the first contact arm 321 moves you to do not need to expand 233. The first right side air blower 1 can be installed. The transport system 24G is also the same as the first transport system 230. As shown in the figure, the 9th school and the 9th punch table are also shown. The second upper air blowing device 242 and the second lower air blowing device 243 are formed. 242 214 pregnant child I 2 buffer table 241 and first buffer table 231 - such as the moving member 241 and γ-like 'package = direction track ... axis side = set 210 action area and 叩 』 in the handling The motion area of the second movable head of the mobile device 310 of the Tongchuan unit 300 reciprocates. The second can

2247-9582-PF 23 1373626

The second upper air blower 242 and the jth upper air blower 232 include the cover member and the blowout σ'. The second contact arm 331 places the tested ICtl in the eight unloading recesses of the second buffer table 241. At the time of the second upper air blowing device 242, the warm air is blown to the IC components before the test for the eight persons. The second lower air blowing device 243 is also the same as the first lower air blowing device, including the cover member 2, the blowout port, and the γ-axis direction.

243C is provided in the vertical direction so as to be able to move between the second buffer table 241 and the second alignment device 35G, and to blow the warm air to the waiting 1C element that is sucked and held by the second contact arm 33. When the transport device 210 sucks and holds the IC component of the test life &amp; τ ρ + _ sub-column from the custom tray KST located in the window portion 储存7 of the storage portion 1,, the component is applied to the component by the heating plate 220. After the thermal stress of the crucible, the buffer trays 231 and 241 of any of the second or second transport systems 230 and 240 are moved to the upper side of the first figure, and the contact arm 321 is moved out. While the IC component has been tested, the upper air blowing devices 232 and 242 send warm air to the IC component before the test. The tested Ic components are placed on the contact arms 321, 331: slow: when the table is hungry, at 241, the contact arms 321, 331 adsorb and hold the 1C component of the test type. At this time, because of the other side When the contact arm M1 is inspected and the contact arms 321 and 331 are not accessible to the test head 5, the lower side air blowers 233 and 243 are blown to the IC components before the test in which the contact arms 321 and 331 are sucked and held. Warm air. When testing π, 'Using the contact arm 32 331 from the test department

2247-9582-PF 24 1373626 Tested! The C component is moved to the buffer tables 231 and 241, and the mobile device 310 further moves the 1C components from the balancing tables 231 and 241 to the custom pallet KST in response to the test result. In the present embodiment, the two transport systems 23A and 24B are installed in the transport unit 200, so that the IC unit can be alternately supplied to the test unit 3 and the test can be performed efficiently. Therefore, the electronic component test apparatus can be improved. Productivity. <Test Unit 300> As shown in Fig. 1, the test unit 300 includes a moving device 31 and an alignment device 34〇, 35〇, and can accurately position the test piece before the test using the image processing technology. After the socket 6 on the head 5, it will be at the socket 6. As shown in Fig. 2, a blank, a slave, a slave 12, is formed in the lower portion of the test unit 300, and the test head 5 is inserted into the space 12, and the test head 5 is -4 and the test head 5 is located. Below the test section 3〇〇. The opening 13 is formed in the main pedestal u of the processing unit 300 11 η μ + » 蚝 盗 10 . Also, eight sockets 6 are mounted on the test -. Hey. Each of the sockets 6 is not shown, and includes a plurality of contact pins arranged in a manner corresponding to 1 (the component is outputted into the cake.), and is attached to the test, 〇. The socket 6 above the head 〇P passes through the opening 13 Facing the interior of the processor 1. The mobile device 31 is set by w τ &gt; moving heads 320, 33. It is arranged along the X-axis direction; and 2 are movable, and have support on the 311. It can be processed along the X-axis square socket 6 and 2 sets of aligning equipment f ^ d surface to handle the internal range of the thief 10, 350.

2247-9582-PF 25

The JOZO heads 320 and 1 are lifted and lowered by a 2-axis direction actuator not specifically shown. Further, if the 笸1 m lane 311 implements the two movable heads 7H in the same manner as the support rails, for example, at the 0th support, they can move independently of each other. When the first movable head 320 is moved to the socket 6 and the "March 4 is in progress, the head 330 can be transferred to the second buffer table 20 仃 1C component, or moved and moved again. To the second alignment device 350 and perform the position correction of the JC element. The side of the 22 1 movable head 32°' corresponds to the 8 sockets on the test head 5 The first contact arm 32, the first contact #321, is constituted by a fixed side arm 321 &amp;, a lock and release mechanism 321b and a holding side arm 321c, and the fixed side 321a is fixed to the i-th movable as shown in FIG. On the lower surface of the head 32 ,, at the lower end of the fixed side arm π. via the locking and releasing mechanism 32lb, the connection holding arm Mb is locked and released 321b, although not specifically illustrated, pressurized air can be used to limit or The relative movement of the holding side arm 321c to the fixed side arm 3^ along the Η plane and the relative rotational movement centered on the Z axis are not limited. Further, the locking and releasing mechanism 321b also includes the fixed side arm. The center axis of 32u and the central axis of the holding side arm 321c are in the same core function. The holding side arm 321c is included at the lower end thereof. The adsorption pad of the IC element is adsorbed and held, and a heater and a temperature sensor (not shown) are embedded therein. The second contact arm 331 is also locked by the fixed side arm 331a like the first contact arm 321 . And the release mechanism 331b and the holding side arm 33ic. Further, the first contact arm 321 moves the 1C element between the Jth buffer table 231 and the 2247-9582-PF 26 1373626 test head 5, and the 2nd contact arm 33 冉 1 moves 1C το between the second line punching table 241 and the test head 5. The first alignment device 340 is as shown in the first figure _ „ The mirror 342 and the camera 343 can be placed in the position of the side arm 3 21 c or the alignment of the posture of the girl by activating the # &amp; t @ ° 田田进仃 and the alignment table 34, and the 1C can be untouched. Positioned at the socket 6 with high precision. The alignment table 3 41 utilizes the unturned b. - J uses the motor mechanism of the special drawing, and can move in the XY plane and rotate in the z-axis center. Further, in the state where the locking and releasing mechanism 32ib is in an unrestricted state, the holding portion 321c and the alignment table 341 abut, and the sub-side arm is in the state of aligning the table 341 while keeping the side arm 321c tracking its movement. , the product receives 7 moves m, keeping the position of the IC clamp held by the side arm 321c aligned. u Camera 343 is placed horizontally along the χγ plane, w wind. Further, for example, a CCD phase is formed, and the Ic element sucked and held by the imaging arm 321c can be held via the opening of the mirror 342 and the pq port of the alignment operation Δ34]. 'When the camera 343 on the temple side is not specifically shown, when the K-element is connected to the image processing device, the position and posture of the side arm-holding device are supported by the image processing device, and the socket 6 is counted. The position and orientation phase 7 and the ampoule are relatively consistent with the amount of alignment, and 341 performs the alignment of the position or posture of the Ic element according to the amount of alignment. The second alignment device 35G is also aligned with the second alignment table, the mirror, and the camera, and the image processing is used to position or position the K element. In addition, the 1st aligning device state will contact the β 321 to hold the 1 (: the position or posture of the component is aligned, and

2247-9582-PF 27 1373626 2 The alignment device 350 aligns the position or posture of the iC element held by the second contact arm 331. The contact arms 321 and 331 suck and hold the Ic element before the test supplied to the test unit 300 by the buffer stages 231 and 241, and rise once. buffer

When the stages 231 and 241 are retracted from the lower side of the contact arm 32, the contact arms 321 and 331 are lowered again, and are brought into contact with the alignment stages 341 and 351. After the alignment of the position and posture of the IC device of the alignment devices 340, 350 is completed, the contact arm 32 331 moves the 1C component to the socket 6 of the test head 5, and the contact arm 321, 331胄1C component is pressed against the socket. 6, and make 1 (: the output of the component and the contact pin of the socket are electrically connected (4), and the tester 7 outputs the human test signal to the 1C component, and performs the test of the component. The test result is stored in the test stomach 7, and the transport device 21G of the transport unit 2 分类 classifies the C component according to the test result. The test arm 32 331 is used to move the tested IC component to the buffer work 纟 231, 24 In the following, the operation of the IC unit supplied from the transport device 210 to the first contact arm 32 will be described in the transport unit to the buffer table 231 with reference to the 12A to 121. The transport device 21 , -re

The first movable head 213 of Z10 places the L element before the test in the first buffer # a. In the case of the recessed portion 231b for loading 231, as shown in Fig. 12A, the movement-shifting member 231a slides 0 in the Y-axis direction rail 23id as shown in Fig. 12B, and when the eight recessed portions for carrying out are below the arm 321, ^, the younger i contact member 231a is stopped, and the first contact arm 321 is placed in the carry-out recess 23lc by the touch ##. Simultaneously,

2247-9582-PF 28

^IJUZO

The collected wind t is set 232 to the moving member 231a for the recessed portion 231b of the moving member 231a: Tc: The IC component warm air before the test. Therefore, when the #7L piece has been tested out, it is possible to suppress the 1C element before the test which is waiting for cooling. 1 : 31: When the first contact arm 321 rises as shown in the figure, the first moving member 231a is in the y-axis direction rail 231 (1), and the carrying recess 23 lb is located below the first contact arm 321 . As shown in Fig. 12D, the first contact arm 321 is lowered, and if it is sucked, the 1C element of the upper side rises as shown in the mth figure, and the Y-axis direction of the first lower side air blowing device 233 / σ When the first lower air blowing device 233 is located below the moving member arm 321 as shown in Fig. 12F, the first buffer table 231 moves the track 23ΐΓ&amp; and the first contact arm 321 Ascending, while sliding along the Y-axis direction, and retreating from below the second contact arm 321 . The movable member is moved to the operation area of the transport device 21〇. Moved to the transport device 21«, and received the JC element before the new test from the essay, 21 0. The first contact arm 321 is lowered as shown in the figure W, and the test before the test is held by the f 321 1 (: The component is inserted in the lower part! The inside of the wind is loaded with the cover member of the i 233. The lower part = the wind device is moved to the K element Therefore, the period of the contact arm 331 is accessed to the test head 5, and the first contact arm 321 waits for the deduction of the heating element by the first lower side air blowing device 233, and P | The JC components before the test became cold.

2247-9582-PF S S3 29 1373626 Next, as shown in Fig. 12H, the first lower side arm 321 upper and lower side air transport device 233 is allowed to slide in the γ-axis direction rail 23, as shown in the figure below. After the side air supply S 233 is retracted from the first alignment device 34, the first contact arm 321 is further lowered by 5%, and the position and posture of the ic element are aligned by the third 340.

When the position and posture of the 1C element of the first alignment device 340 are aligned, the first contact arm 321 rises and moves to the test head 5, the ic element is at the socket 6, and the IC device is executed by the tester 7. Test. When the test of the ic element is completed, the contact arm 321 is returned to the first buffer table 231'. As shown in Fig. 12B, the tested ic element is placed in the carry-out recess 231c of the moving member 231a. As described above, in the present embodiment, in the case where the ic element that has been tested is carried out, the warm air is sent to the c element before the test, and the IC element before the test is cooled. Further, in the present embodiment, during the period in which one of the contact arms 32, Μ is accessed to the test head 5, it can be suppressed by "heating the wind to the ic element held by the other contact arm 33". The components before the test are getting cold. Further, the embodiments described above are described in order to facilitate the understanding of the present invention, and are not intended to limit the present invention. Therefore, each element disclosed in the above-described embodiments includes all design changes or equivalents belonging to the technical scope of the present invention. In the above-described embodiment, the warm air is supplied from the air blowing devices 232, 233, 242, and 243. However, in the present invention, the case where the low temperature thermal stress is applied to the ic 2247-9582-PF 30 1373626 component is not particularly limited. The ic element can also be suppressed from heating by blowing air. In the above-described embodiment, 233, 242, and 243 send warm air to the IC element. However, in the present air device 232, means for heating or cooling the 1C element, the invention is not particularly Limit infrared radiation" 'to IC components

BRIEF DESCRIPTION OF THE DRAWINGS A first embodiment of the present invention is a cross-sectional view showing a plan view of an electronic component test package of the present invention, which is a cross-sectional view taken along line 第 of the i-th diagram. - Figure 3 is a schematic diagram showing the processing method of the electronic component test 70 and the customized tray shown in Fig. j. , '

1 Figure IV - Sectional view of the IV line. Figure 4 is a cross-sectional view of the V-V line. The electronic component test device shown in Fig. 1 is shown in Fig. 4 of the YU-W line. The electrons shown in the figure 1 are shown along the fifth figure along the sixth figure. Floor plan. Fig. 7 is an exploded perspective view showing the first unit along the eighth drawing. Storage element test device of the component test device Fig. 9 is a perspective view showing a custom pallet to which the electrons shown in Fig. 1 are put. Fig. 10 is a cross-sectional view taken along line X-X of Fig. 1 along the line of Fig. 11. The second part of the electronic component test device shown in Fig. 2

2247-9582-PF 31 1373626 Sectional view of the temperature adjustment device. ^ Figure 22A shows a section (1) of the operation of the ic ^ provided by the transport device in the electronic component test equipment shown in Fig. 1. The father gives the contact arm. Figure 12B shows the figure! The cross-sectional view (2) of the operation of the K-element device provided by the transport device to the buffer table is shown in the figure. The parent gives the contact arm. Fig. 12C shows a cross-sectional view (3) of the operation of the Ic element 1 = device supplied from the electron to the buffer table. The parental contact arm 12D diagram shows the cross-sectional view of the action of the Ic element supplied by the transport device in the electronic component buffer table shown in Fig. i (the piece is handed to the contact arm 12E) Indicates the sectional view (5) of the action supplied by the handling device as shown in Fig. j to the buffer operation a. The electronic 711• piece test device. The father gives the contact arm the 12th figure is shown in the figure. Figure 7 is a cross-sectional view showing the operation of the Ic device supplied by the transport device (6). The picture of the 12G of the contact arm is shown in Fig. The buffer table is the cross-sectional view of the operation of the Ic疋:嘁 device supplied by the handling device (7:^ 70 pieces of the parent to the contact arm. The 12H picture is shown in the figure j to the buffer table. Install the second test device, and the 1C piece is handed over to the contact arm.

Sectional view of the action of 2247-9582-PF 32 1373626 (8). Fig. 21 is a cross-sectional view (9) of the operation of the electronic component testing apparatus shown in Fig. 1 to the buffer table for transferring the 1C component supplied from the carrier to the contact arm. [Description of main component symbols] 1 Electronic component testing device 5 Test head 10 Processor 100 Storage unit 110 Access port 120 Carry-in unit 130 First tray transfer arm 140 Setting plate 150 Second tray transfer arm 160 Array storage unit 170 Window Unit 200 Transport unit 210 Transport device 230 First transport system 231 First buffer table 232 First upper air blower 233 First lower air blower

2247-9582-PF 33 τ S3 1373626

234 warm air supply device 240 second transport system 241 second buffer table 242 second upper air blower 243 second lower air blower 300 test unit 310 mobile device 321 first contact arm 331 second contact arm 340 first alignment Device 350 second alignment device KST custom tray

2247-9582-PF 34 [s]

Claims (1)

· No. 097113779, April 101, pp. 3, Amendment Replacement Page 10, Patent Application Range: An electronic component testing device for electrically contacting the ▲ terminal of the tested electronic component with the contact portion of the test head for execution The test of the tested electronic component includes: a plurality of contact arms 'moving the tested electronic component and pressing on the contact portion; and a temperature adjustment means 'the temperature adjustment means is independently set from the contact arm from below Heating or cooling the tested electronic component in a state in which the contact arm is held; the contact arm of the 畲-square causes the electronic component to be tested to move to the contact portion and press the contact portion, and the temperature adjustment means will be at The electronic component to be tested is held in a state of being held by the other of the contact arms. 2. The electronic component testing device of claim 1, wherein the temperature adjusting means is movable within and outside the range of motion of the contact arm. 3. The electronic component testing device of claim 1 is characterized in that: the eight-wind means 'sends warm air or cold air to the tested electronic component; and the 盍 component covers the periphery of the tested electronic component. . , 4·- an electronic piece test method, using a plurality of contact arms that can move independently of each other, so that the input and output terminals of the tested electronic component and the contact portion of the test head are in electrical contact, and then the tested electronic component The test, in the side of the contact arm, the tested electronic component in the 'month of the contact' by the temperature adjustment means independently set with the contact arm, from 2247-9582-PFI -20120403 35 1373626. No. 097113779, April 3, pp. 3, Amendment Replacement Page - · &gt; • The tested electronic component in the state in which the other contact arm is held is heated or cooled. 5. The electronic component testing method according to claim 4, wherein a state of heating around the electronic component to be tested in a state of being covered by the other of the contact arms is performed, and a warm air or a cold air is blown to the electronic component to be tested. . 2247-9582-PF1 -20120403 36