WO2008142754A1 - Electronic component testing device and electronic component testing method - Google Patents

Electronic component testing device and electronic component testing method Download PDF

Info

Publication number
WO2008142754A1
WO2008142754A1 PCT/JP2007/060212 JP2007060212W WO2008142754A1 WO 2008142754 A1 WO2008142754 A1 WO 2008142754A1 JP 2007060212 W JP2007060212 W JP 2007060212W WO 2008142754 A1 WO2008142754 A1 WO 2008142754A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component testing
blasting
contact arms
testing device
Prior art date
Application number
PCT/JP2007/060212
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroki Ikeda
Yoshinari Kogure
Tsuyoshi Yamashita
Hiroyuki Takahashi
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2007/060212 priority Critical patent/WO2008142754A1/en
Priority to JP2009515024A priority patent/JPWO2008142754A1/en
Priority to TW097113779A priority patent/TW200900711A/en
Publication of WO2008142754A1 publication Critical patent/WO2008142754A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An electronic component testing device comprises contact arms (321, 331) for transporting an IC device so that the IC device is pressed on a socket (6) of a test head (5), feeding systems (320, 330) for feeding the IC device to the contact arms (321, 331), upper side air blasting devices (232, 242) for blasting warm air from the upper side to the IC device fed by the feeding systems (320, 330), and lower side air blasting devices (233, 243) for blasting warm air from the lower side to the IC device held by the contact arms (321, 331).
PCT/JP2007/060212 2007-05-18 2007-05-18 Electronic component testing device and electronic component testing method WO2008142754A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/060212 WO2008142754A1 (en) 2007-05-18 2007-05-18 Electronic component testing device and electronic component testing method
JP2009515024A JPWO2008142754A1 (en) 2007-05-18 2007-05-18 Electronic component testing apparatus and electronic component testing method
TW097113779A TW200900711A (en) 2007-05-18 2008-04-16 Electronic component testing device and electronic component testing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060212 WO2008142754A1 (en) 2007-05-18 2007-05-18 Electronic component testing device and electronic component testing method

Publications (1)

Publication Number Publication Date
WO2008142754A1 true WO2008142754A1 (en) 2008-11-27

Family

ID=40031481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/060212 WO2008142754A1 (en) 2007-05-18 2007-05-18 Electronic component testing device and electronic component testing method

Country Status (3)

Country Link
JP (1) JPWO2008142754A1 (en)
TW (1) TW200900711A (en)
WO (1) WO2008142754A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769664B (en) * 2021-01-15 2022-07-01 鴻勁精密股份有限公司 Testing apparatus and testing equipment using the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401766B (en) * 2009-03-23 2013-07-11 Evertechno Co Ltd Test handler and method for transferring component thereof
TWI414798B (en) * 2010-05-21 2013-11-11 Hon Tech Inc Testing and classifying machine for testing electronic elements at high and lower temperature
JP2013024829A (en) * 2011-07-26 2013-02-04 Seiko Epson Corp Electronic component carrying device and electronic component carrying method
JP5942459B2 (en) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 Handler and parts inspection device
KR102270760B1 (en) * 2019-11-29 2021-06-30 에이엠티 주식회사 The test apparatus of the device having fine pitch
CN113326167B (en) * 2021-05-13 2022-07-08 山东英信计算机技术有限公司 Constant temperature adjustable tester and test method based on communication of substrate management controller
US11740283B2 (en) 2021-07-23 2023-08-29 Chroma Ate Inc. Multistory electronic device testing apparatus
TWI787919B (en) * 2021-07-23 2022-12-21 致茂電子股份有限公司 Multi-layer feeding and binning device and electronic device testing apparatus comprising the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127677A (en) * 1985-11-29 1987-06-09 Ando Electric Co Ltd Heating device for parts
JPS62121579U (en) * 1986-01-24 1987-08-01
JPH1164437A (en) * 1997-08-22 1999-03-05 Ando Electric Co Ltd Ic-heating device
JP2002148303A (en) * 2000-11-10 2002-05-22 Advantest Corp Holding device for electronic part test, electronic part testing device and electronic part test method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127677A (en) * 1985-11-29 1987-06-09 Ando Electric Co Ltd Heating device for parts
JPS62121579U (en) * 1986-01-24 1987-08-01
JPH1164437A (en) * 1997-08-22 1999-03-05 Ando Electric Co Ltd Ic-heating device
JP2002148303A (en) * 2000-11-10 2002-05-22 Advantest Corp Holding device for electronic part test, electronic part testing device and electronic part test method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769664B (en) * 2021-01-15 2022-07-01 鴻勁精密股份有限公司 Testing apparatus and testing equipment using the same

Also Published As

Publication number Publication date
TW200900711A (en) 2009-01-01
JPWO2008142754A1 (en) 2010-08-05
TWI373626B (en) 2012-10-01

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