JPH1164437A - Ic-heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a heating efficiency and hence reducing the heating time of an IC and miniaturizing a device by providing an air nozzle for spraying a hot wind to the IC at the stopping position of the IC being carried and a means for controlling the temperature of the hot wind. SOLUTION: An IC3 being supplied to an IC supply part 6a is heated to a set temperature by a hot wind being sprayed from an air nozzle 33 in addition to conviction in a constant temperature bath 1 and heat conduction from a carrier 2 during carrying to a supply exit part 6b. In this case, both of a hot wind heater 32 and a temperature sensor are controlled by a control means so that a hot wind at a set temperature blows out of the air nozzle 33. In this case, the larger the flow rate of hot wind being blown out of the air nozzle 33 is, the larger a heating effect becomes. However, since the IC3 in the carrier 2 may be blown off, the flow rate per air nozzle is appropriately 5 NL/min-10 NL/min. Further, the interval between the outlet of the air nozzle 33 and the surface to be heated of the IC3 being stored in the carrier 2 is set to 3-5 mm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC heating apparatus, and more particularly, to an IC heating apparatus installed in an auto-handler having a function of measuring an electrical characteristic of an IC at a high temperature and heating the IC to a set temperature.

[0002]

2. Description of the Related Art Conventionally, this type of IC heating apparatus has
Two systems, a constant temperature bath system and a heat plate system, are known.

[0003] An IC heating apparatus using a thermostatic oven will be described with reference to Figs. FIG. 7 is a plan view of the heating device, and FIG.
FIG. 8 is a partial sectional view of FIG. In the figure, reference numeral 1 denotes a constant temperature bath as a heating means. The constant temperature bath 1 is transported in the apparatus and heats the IC 3 housed in a carrier 2 as a transport means. The constant temperature bath 1 includes a heater 4 and a temperature sensor 5 and covers a carrier transport unit 6 that transports the carrier 2 and a measuring unit 7 that measures the electrical characteristics of the IC 3 transported by the carrier transport unit 6. Further, the heater 4 and the temperature sensor 5 are connected to a temperature controller 8, and the temperature in the thermostat 1 is controlled to a set temperature by the operation of the temperature controller 8. Reference numeral 9 denotes a fan that recirculates the air in the thermostatic bath 1 and makes the temperature distribution in the bath uniform.

[0004] Reference numeral 10 denotes an IC 3 transferred from the previous process.
Is a suction hand that transfers the measured ICs 3 to the next step while transferring them into the thermostat 1. Specifically, the suction hand 10 supplies the IC 3 to the carrier 2 transported to the IC supply unit 6a of the carrier transport unit 6, and supplies the carrier 2 transported from the IC accommodation unit 6e of the carrier transport unit 6.
The upper IC 3 is transferred to the next process outside the thermostat 1. Reference numeral 11 denotes a pair of left and right shutters provided on one wall of the constant temperature bath 1. The shutter 11 opens and closes as the suction hand 10 enters and exits the constant temperature bath 1 to reduce the temperature in the constant temperature bath 1. Preventing.

[0005] Reference numeral 12 denotes a pair of left and right belts extending between the measuring section 7 and the suction hand 10.
Is stretched between pulleys 13, and the pulleys 13 are further connected to a rotating shaft of a motor 14. When the motor 14 is driven, the carrier 2 located at the IC supply unit 6a is sequentially transported to the supply outlet 6b on the belt 12 on the left side in the figure, and the carrier 2 located at the accommodation inlet 6d is moved to the right side in the figure. The belt 12 is sequentially conveyed to the IC housing section 6e. Reference numeral 15 denotes a side plate that surrounds the carrier transport unit 6 and prevents the carrier 2 from shifting during the transport.

[0006] Reference numerals 16 and 16a denote cylinders. The cylinders 16 and 16a move the carrier 2 from the supply outlet 6b side to the measurement inlet 6 by their piston rods.
It is pushed out from the c side or the IC housing section 6e side to the IC supply section 6a side. Reference numeral 17 denotes a suction hand that transfers the IC 3 adsorbed at the measurement inlet 6c to the measurement unit 7 and returns the IC 3 tested by the measurement unit 7 to the empty carrier 2 waiting at the measurement inlet 6c. is there.

Next, the operation of the above device will be described. IC3
Is mounted on the carrier 2 by the suction hand 10, and the carrier 2 is pushed by the cylinder 16a to
The sheet is conveyed to the supply section 6a, and the supply outlet section 6b
Transported to Also, the IC 3 stored in the carrier 2
Is heated to a set temperature by convection in the bath and heat conduction from the carrier 2 during the transfer.

The carrier 2 sent to the supply outlet 6b is
As shown in FIG. 8, after being pushed by the cylinder 16 and conveyed over the auxiliary plate 18 to the measurement inlet 6c, and further raised by the cylinder 19, only the IC 3 is sucked from above by the suction hand 17. . The IC 3 sucked by the suction hand 17 is transferred to the measuring unit 7 and tested by the measuring unit 7, then sucked again by the suction hand 17 and returned to the empty carrier 2 waiting at the measurement inlet 6c.

Carrier 2 containing measured IC 3
Is transported to the accommodation entrance 6d at the same time as the next carrier 2 is transported to the measurement entrance 6c, and is sequentially transported on the belt 12 to the IC accommodation part 6e. The IC 3 conveyed to the IC accommodating portion 6e is pushed by the cylinder 16a and returned to the front of the shutter 11, then is sucked again by the suction hand 10, and transferred to the next step.

On the other hand, an IC heating apparatus using a heat plate method will be described with reference to FIGS. 9 is a plan view of the heating device, and FIG. 10 is a sectional view of FIG. In this apparatus, a heat plate 21 serving as a heating means is provided below the carrier transport section 6, and as shown in FIG. 10, the heat plate 21 has a built-in heater 22 and a temperature sensor 23. The heater 22 and the temperature sensor 23 are connected to a temperature control unit 24, and the temperature of the heat plate 21 is controlled to a set temperature by the operation of the temperature control unit 24. Also,
Reference numeral 25 in FIG. 10 denotes a heat insulating block that covers the carrier transport unit 6 and the heat plate 21 from below and from the side. The heat insulating block 25 is formed of a heat insulating material such as silicon glass, and prevents heat radiation of the heat plate 21. ing.

In FIG. 9, reference numerals 26, 27, 28 and 29 are provided at the four corners of the carrier transport section 6, and connect the carrier 2 in the carrier transport section 6 to the IC supply section 6a, the supply exit section 6b, the measurement entrance section 6c, This is a cylinder that circulates and moves to the housing entrance 6d and the IC housing 6e.

In the case of this device, the IC 3 is the suction hand 1
0 while the carrier 2 is pushed by the cylinders 26, 27, 28 and 29 and slides on the heat plate 21 while the IC in the carrier 2 is moved.
3 is heated by heat conduction from the heat plate 21;
The temperature is raised to the set temperature. I conveyed to the measurement entrance 6c
C3 is transferred to the measuring unit 7 by the suction hand 17 and tested by the measuring unit 7, and then returned to the carrier 2 by the suction hand 17 again. The carrier 2 in which the measured ICs 3 are stored are sequentially transported on the heat plate 21 to the IC housing 6e. The IC 3 transported to the IC housing 6e
It is again sucked by the suction hand 10 and transferred to the next step.

[0013]

However, in the method according to the prior art, for example, in an IC having a thickness of about 30 mm in a 28 mm square mold package, a heating time of about 60 seconds is required, and if δt is temporarily reduced. Assuming that the IC operates in 2 seconds, the capacity of the IC required in the thermostat is 30 pieces, and a large-sized heating device is required. In recent years, two or four ICs may be processed in parallel in a recent auto handler.
Since a double capacity is required, the heating device also becomes large.

Further, in the IC heating device of the thermostatic bath system, the accuracy of heating the IC is enhanced by circulating a plurality of ICs in the circulating hot air. However, in order to maintain the temperature in the thermostatic bath 1 uniformly, the heated air must be convected uniformly over a wide area in the bath, and as a result, the air volume hitting the individual ICs 3 is limited, and the heating time of the ICs 3 is limited. In order to shorten the heating time of the IC 3, there is a problem that a large heat source is required and the heating device becomes large.

On the other hand, in the IC heating apparatus of the heat plate type, since the IC 3 is heated by heat transmission from the heat plate 21, the contact area with the heat plate 21 is reduced depending on the package shape of the IC 3, and the heating time is reduced. There is a problem that becomes longer.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to reduce the size of a heating device by improving the heating efficiency and shortening the IC heating time.

[0017]

SUMMARY OF THE INVENTION The present invention relates to an IC used in an auto-handler for automatically checking the electrical characteristics of an IC.
In the C heating device, a transport unit for intermittently transporting the IC to the measurement unit side, a heating unit for heating the IC being transported, and a stop position for the IC being transported. It is characterized by comprising an air nozzle to be blown and control means for controlling the temperature of the hot air.

Further, the IC transport paths are provided in parallel over a plurality of rows, and a plurality of the ICs provided in the paths are provided.
May be transported simultaneously.

On the other hand, as the heating means, a thermostatic bath in which the temperature in the bath can be freely controlled or a heat plate with a built-in heater is used. Further, in the transporting means, a carrier that is located in the thermostatic chamber or on the heat plate, houses the IC, and moves intermittently to the measurement unit side;
Alternatively, a turntable in which the IC is placed in the constant temperature bath and which rotates intermittently toward the measuring section is used.

The temperature of the hot air blown to the IC is set higher than the set value of the heating temperature for the IC, and a directional control valve is provided at a stage preceding the air nozzle, and the time for blowing the hot air to the IC during transport is set. May be controlled.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC heating apparatus according to the present invention will be described below with reference to the drawings. The same reference numerals are given to members having the same configuration as the above-described conventional device, and the description thereof is omitted.

FIGS. 1 and 2 show a first embodiment according to the present invention, and show a case where the present invention is applied to a heating apparatus using a thermostatic bath 1. FIG. 1 is a plan view of the heating device, and FIG. 2 is a partial cross-sectional view of FIG.

In FIG. 1, reference numeral 31 denotes a fixed plate extending along the belt 12 on the carrier 2 extending from the IC supply section 6a to the supply outlet section 6b.
I branched from the hot air heating unit 32 and stored in the carrier 2
A plurality of air nozzles 33 each opening toward the center of C3 are embedded at equal intervals. Also, reference numeral 3 in FIG.
Reference numeral 4 denotes a temperature sensor installed near the outlet of the air nozzle 33, and reference numeral 35 denotes a flow meter for measuring an amount of air supplied to the hot air heater 32.

The IC 3 supplied to the IC supply section 6a is transported by the hot air blown from the air nozzle 33 in addition to the convection in the constant temperature bath 1 and the heat conduction from the carrier 2 during the transportation to the supply outlet section 6b. Heated to the set temperature. In this case, both the hot air heater 32 and the temperature sensor 34 are controlled by the control means 36 so that hot air having the same temperature as the set temperature blows out from the air nozzle 33.

Here, the larger the flow rate of the warm air blown from the air nozzle 33, the greater the heating effect. However, since the IC 3 in the carrier 2 may be blown off, the air nozzle 1
The flow rate per book is 5 NL / min to 10 NL / min
Is appropriate. Further, as shown in FIG.
The distance between the outlet of the air nozzle 33 and the heated surface 3a of the IC 3 housed in the carrier 2 is set to 3 to 5 mm. This is because if the interval exceeds 5 mm, the flow rate decreases and the heating efficiency deteriorates, and if the interval is less than 3 mm, I
This is because C3 affects the flow rate of the air nozzle 33, and a difference occurs in the flow rate between the branched air nozzles 33, and the heating efficiency varies. The shape of the tip of the air nozzle 33 is parallel to the surface to be heated 3a so that warm air passes uniformly through the surface to be heated 3a.

In this apparatus, the IC 3 being conveyed toward the measuring section 14 is efficiently heated at each stop position. For example, when the IC 3 is heated from 25 ° C. to 125 ° C., the temperature rise time of the IC is about 2 / It is shortened to 3. As a result, the capacity of the IC 3 to be heated can be reduced to about ／ of the conventional one, so that the heating device can be downsized.

On the other hand, for an IC having a large heat capacity, a sufficient heating time is required. For such an IC, as shown in FIG. There is a method of increasing the capacity of the IC to be heated. In this apparatus, four carrier paths from the IC supply part 6a to the supply outlet part 6b in the carrier transport part 6 are provided in four rows from row A to row D, and each transport path is orthogonal to the belt 12. The fixing plate 31 extended in the direction of the air nozzle 3 faces the IC 3 accommodated in each carrier 2.
3 to supply outlet 6b from IC supply 6a
A plurality of rows are arranged toward.

In the apparatus shown in FIG.
Since the rows are provided, the number of IC supply units 6a is also four, and the time required to supply ICs to all the IC supply units 6a is four times as long as the apparatus shown in FIG. Further, in the apparatus shown in FIG. 3, the carrier transport section 6 has a structure in which the carrier 2 is transported in four rows at a time.
Is four times longer than that of the apparatus shown in FIG. 1, and the heating time of the IC can be secured four times.

Further, the heating mechanism according to the present invention can be applied to a transfer mechanism for an IC 3 using a turntable 40 as a transfer means as shown in FIG. The transport mechanism using the turntable 40 transports the IC3 by rotating the turntable 40 in which the IC3 is stored at equal intervals along the circumferential direction by the storage pitch of the IC3, and supplies the IC3 to the measuring unit 7. There is an advantage that the speed is high and can be realized with a simple mechanism.

However, since the IC 3 is housed in the outer periphery of the turntable 40, the diameter of the turntable 40 must be increased in order to increase the capacity of the IC, which is disadvantageous for realizing a compact device. It is. In the example of FIG. 4, on the hot air heating unit 40 a from when the IC 3 is supplied onto the turntable 40 to when the IC 3 is transported to the measuring unit 7,
By mounting the air nozzles 33 at the same intervals as the storage pitch of the ICs 3 via the fixing plate 31, the time required for raising the temperature of the ICs 3 is shortened, the capacity of the ICs 3 on the turntable 40 is reduced, and the turntable, which is a large-sized apparatus, is reduced. It complements 40 disadvantages.

FIGS. 5 and 6 show a case where the present invention is applied to a heating device using a heat plate 21. FIG.
FIG. 5 is a plan view of the heating device, and FIG. 6 is a partial sectional view of FIG.

In the case of this apparatus, the set temperature of the heat plate 21 is experimentally determined in advance so that the temperature of the IC 3 stored in the carrier 2 and the temperature of the IC 3 becomes the target temperature without blowing hot air from the air nozzle 33. Keep it. The temperature of the hot air blown by the air nozzle 33 is set to the target temperature of the IC 3.

In this apparatus, the IC 3 is constantly heated from below by the heat plate 21 until it is conveyed to the measuring section 7, and while being conveyed from the IC supply section 6a to the supply outlet section 6b, Since the heating is performed by the warm air blown from the upper surface at the stop position, the heating efficiency is further improved. As a result, since the capacity of the IC 3 to be heated is reduced as compared with the related art, the heating device can be downsized.

To further reduce the heating time of the IC, the temperature of the hot air blown from the air nozzle 33 to the IC 3 is set to be higher than the target temperature of the IC 3 by about 5 to 10 ° C. Is established,
There is also a method of controlling the blowing time of hot air. In this method, the temperature of the hot air, the blowing time, the blowing interval and the like are experimentally obtained in advance, and the blowing of the hot air is controlled based on the result. However, if there are several transport cycles of the carrier 2, it is necessary to change the hot air blowing condition for each of these patterns, which complicates the control. That is, this method can be said to be particularly effective in a transport mechanism in which the carrier 2 is transported in a constant cycle.

[0035]

As described above, according to the present invention, I
The heating time of the IC is shortened as compared with the conventional heating using only a constant temperature bath or a heat plate because the hot air is blown from a short distance to the C to efficiently heat it.
And the heating device can be reduced in size, and the effect that the heating device can be reduced in size can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment according to the present invention.

FIG. 2 is a partial cross-sectional view of the heating device of FIG.

FIG. 3 is a plan view showing a second embodiment according to the present invention.

FIG. 4 is a plan view showing a third embodiment according to the present invention.

FIG. 5 is a plan view showing a fourth embodiment according to the present invention.

6 is a partial cross-sectional view of the heating device of FIG.

FIG. 7 is a plan view of a heating device of a thermostatic oven system according to the related art.

FIG. 8 is a partial sectional view of the heating device of FIG. 7;

FIG. 9 is a plan view of a heat plate type heating device according to the related art.

FIG. 10 is a partial sectional view of the heating device of FIG. 9;

[Explanation of symbols]

 Reference Signs List 1 constant temperature bath (heating means) 2 carrier (transporting means) 3 IC 7 measuring unit 21 heat plate (heating means) 22 heater 36 control means 33 air nozzle 40 turntable (transporting means)

Claims (6)

[Claims] 1. An IC heating device used in an auto-handler for automatically measuring an electric characteristic of an IC, comprising: a conveying unit for intermittently conveying the IC to a measuring unit; and a heating unit for heating the IC during the conveyance. An IC heating device, comprising: means, an air nozzle at a stop position of the IC being transported, for blowing hot air to the IC, and control means for controlling the temperature of the hot air. 2. The IC heating apparatus according to claim 1, wherein a plurality of transfer routes for the ICs are provided in parallel over a plurality of rows, and a plurality of the ICs arranged in the route are transferred simultaneously. 3. The heating means is a constant temperature bath whose temperature inside the bath is freely controllable, and the transfer means accommodates the IC in the constant temperature bath and intermittently moves to the measuring unit side. 3. The IC heating device according to claim 1, wherein the carrier moves to a predetermined position. 4. The heating means is a constant temperature bath whose temperature inside the bath is freely controllable, and the transport means is inside the constant temperature bath, on which the IC is mounted, and is intermittently connected to the measuring section. The IC heating device according to claim 1 or 2, wherein the IC heating device is a turntable that rotates. 5. The heating means is a heat plate having a built-in heater, and the transport means houses the IC,
The IC heating device according to claim 1, wherein the carrier is a carrier that moves intermittently on the heat plate toward the measurement unit. 6. A temperature of the hot air blown to the IC is set higher than a set value of a heating temperature for the IC, and a directional control valve is provided at a front stage of the air nozzle to supply the hot air to the IC during transportation. 6. The IC according to claim 1, wherein the spraying time is controlled.
Heating equipment.